CAM-F93中文资料

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UP93中文说明书

8-1 原因和主要故障的处理・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・63 8-2 原因和故障显示的处理・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・63
3-1 使用前检查・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・4 3-2 使用注意事项・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・4 3-3 订货信息・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・5
7．功能的补充说明・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・62
7-1 自动返回功能・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・62 7-2 输出软启动功能・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・62 7-3 事件报警方式・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・62
4．安装和接线・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・6

富士X20用户手册

正常现象。当长时间拍摄或观看图像时，请使用 AC 电源适配器。
2 照相机使用的是 AA 碱性
电池、锂电池或可充电镍氢（镍金属氢化物）电池
* 有关您可使用的电池的详细信息，请参阅相机的用户手册。
■ 使用电池的注意事项
• 请勿加热电池或将电池扔进火中。 • 请勿将电池触碰金属物体，如项链或发夹。 • 请勿将电池浸入水中，弄湿电池或将电池存放在潮湿场所。 • 请勿拆卸或改装电池，包括电池的外壳。 • 请勿让电池受到强烈冲击。 • 请勿使用有泄漏、变形、变色现象的电池。 • 请勿将电池存放在高温或潮湿的地方。 • 请将电池存放在婴儿和儿童够不着的地方。 • 确认电池按照极性标志（C 和 D）正确安装。 • 请勿混用新旧电池。请勿混用已充电电池和未充电的电池。 • 请勿混用不同型号或品牌的电
配件
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表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/ T11363-2006 标准规定的限量要求以下。备注 ○： ×：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T11363-2006 标准规定的限量要求。 “X （铅）属欧盟 RoHS 指令的豁免范围之列。“X (Pb)” exempted from the application of EU RoHS. ” / is
关于标识
下述标识表示误操作或忽略标识的警告信息可能造成的严重后果。该标识表示若忽略该信息，将会造成死亡或严重伤害。该标识表示若忽略该信息，将会造成人身伤害或物质损失。
请勿在浴室中使用相机。
禁止拆卸。
警告注意
请勿触摸内部部件。
下述图标表示必须遵守的信息性质。三角标志表示此信息需要注意 “重要” 。（）圆形标志加一斜线表示禁止行为 “禁止” 。（）实心圆形加一惊叹号表示用户必须执行的操作 “必（须操作” 。）

贴片F系列三极管参数

Base I I N C N N X K N N D N N N N N B N N N N N N N N X N N N N N N N N N N N B P X P ZB X ZB
Package SCD80 URD SOT323 SOT23 SC59 SC59 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT323 SC59 SC59 SOT23 SC59 SC59 SC59 SC59 SOT23 SC59 SC59 SOT23 SC59 SC59 SC59 SC59 SC59 SOT23 SOT89 SOT89 SOT23 SOT23
Leaded Equivalent/Data uhf varicap 2.5-22pf npn RF fT 8GHz 35V RF pin sw diode npn dtr R1 2k2 40V 100mA npn dtr R1 4k7 40V 100mA fT 12GHz npn RF 4V 12mA 35V RF pin sw diode BF495 RF npn fT 150MHz hfe30-60 dual series HP3820 pin sw diode BF184 BF494 BF184 BF494 BF184 BF494 RF npn fT150MHz hfe60-120 BF495 dual cc HP3820 pin sw diode BF184 BF494 pnp dtr 1k + 1k 50V 500mA pnp dtr 2k2 + 2k2 50V 500mA pnp dtr 4k7+ 4k7 50V 500mA pnp dtr 4k7+ 4k7 50V 500mA pnp dtr 10k + 10k 50V 500mA fT 12GHz npn 6V 20mA npn dtr 1k + 1k 50V 500mA npn dtr 2k2 + 2k2 50V 500mA npn dtr 4k7 + 4k7 50V 500mA npn dtr 4k7 + 4k7 50V 500mA npn dtr 10k + 10k 50V 500mA pnp dtr 2k2 + 10k 50V 100mA pnp dtr 2k2 + 10k 50V 100mA npn dtr 2k2 + 10k 50V 100mA pnp dtr R1 2k2 40V 100mA pnp dtr R1 4k7 40V 100mA pnp dtr R110k 40V 100mA 0.5-3GHz cc pin dual anode npn RF 1.5GHz 300mA BFQ69 npn RF Ft 5.5GHz 100mA microproc -ve reset gen 2.700V BFW92 microproc -ve reset gen 2.800V

GSC93BC66中文资料

GSC93BC46/56/66
Page: 1/8
元器件交易网 Figure 2. Block Diagram
ISSUED DATE :2006/06/14 REVISED DATE :
Notes
1. The ORG pin is used to select between x8 and x16. When the pin is connected to Vcc, x16 mode is selected. Otherwise, the ORG pin should be grounded in order to select x8 mode.
Pin Name CS SK DI DO Gnd Vcc ORG NC
Function Chip Select Serial Data Clock Serial Data Input Serial Data Output Ground Power Supply Internal Organization No Connect
1.8V< VCC <2.7V
-0.6 VCCx0.7
-
VCCx0.3 VCC+1
V
VOL1(1) 2.7V< VCC <5.5V; IOL=2.1mA
-
VOH1(1)
IOH=-0.4mA 2.4
-
0.4 -
V
VOL2(1) 1.8V< VCC <2.7V; IOL=0.15mA -
VOH2(1)
IOH=-100uA VCC-2
100 100 400
-
-
ns
CS Hold Time
tCSH
Relative To SK

VEXCEL UltraCAM大幅面数码航摄像机

VEXCEL UltraCAM大幅面数码航摄像机于2003年5月份在美国摄影测量与遥感大会上推出UltraCAM-D(UCD)大幅片数码相机，是所有数码航摄相机中销售最多的一个品牌，也是目前性价比最高的一款数码航摄相机。

2006年底Vexcel公司在已经取得了惊人成功的UltraCAM-D（UCD）相机基础上，推出了又一力作UltraCAM-X(UCX)大幅片数码相机。

超值的经济特性：无需胶片，无需冲洗，无需扫描，更多的航摄飞行天数，高模块化设计，可经济快速的升级到最新配置，持续保护您的投资。

UltraCAM 拍摄的影像完全兼容目前世界上流行的几乎所有数字摄影测量工作站（DPW）如：VirtuoZo（中国）、JX4（中国）、Inpho （德国）、DiAP（美国）、Istar（法国）等，可保留原工作流程，直接生产4D产品。

更高的影像解析度：无颗粒噪声，12 bit 的数字影像，影像匹配精度比传统胶片提高2.5倍，具有优异的立体效果。

更高的几何精度：无由胶片处理所带来的几何精度损失，由多CCD阵列合成的整张影像，是严格精确的单个坐标系统和唯一投影中心的影像，与其它相机相比具有更稳健的几何关系，其独创合成技术获得多国专利保护。

更高的自动化特性：高达0.75秒／每景的影像输出，为DEM、DTM的自动生成、多光线匹配、多目视觉、超级空中三角测量和地面目标的自动提取提供了无额外成本的高重叠度影像。

高效的操作流程：空中快速浏览，基于影像内容的自动曝光控制，宽范围的滤镜，可选择的在机上、野外、办公室内的数据处理。

影像产品参数（Image Product specification）1、影像幅面相当于胶片的23cm×15cm2、与航片比较优于航片15um扫描效果3、影像格式TIFF , JPEG , Tiled TIFF相机技术参数（Sensor Unit SU）1、全色波段影像尺寸11500×7500 像素2、全色波段像素大小9um3、实际物理幅面103.5mm×67.5mm4、全色波段镜头焦距100mm5、全色波段镜头光圈F=1/5.66、全色波段视场（旁向/航向）55度/37度7、彩色（多光谱）4个通道，RBG和彩红外8、彩色波段影像尺寸4008×2672 像素9、彩色影像像素大小9um10、彩色镜头焦距28mm11、彩色镜头光圈F=1/4.012、彩色镜头视场（旁向/航向）65度/46度13、快门速度1/500—1/6014、像移补偿（FMC）TDI 控制最大50个像素15、暴光速度（可调）0.75秒/每景（最快）16、模数转换14bits17、Radiometric 分辨率大于12bits18、相机尺寸,重量45cm×45cm×60cm, 大约30kg19、影象的几何精度小于2um存储和处理单元（SCU）1、机载设备容量大于1.5TB2、无压缩影象容量2775片3、尺寸,重量40cm×45cm×65cm, 大约50kg操作方式（Operational Specification）1、相机的安装兼容当前传统相机的安装方式2、数据的传输（2775张从SCU到移动存储箱）大约1小时3、飞行控制系统兼容IGI’s CCNS 和相似系统4、外部姿态（定位）支持兼容IGI’sAero-control,Applanix’Pos和相似系统UCX详细技术参数:影像产品规格1、影像幅面：相当于扫描分辨率为15um，影像幅面为23cm×15cm的航摄影像2、影像数据格式：色深为8位、12位和16位，线性、条带或块方式存储的JPEG、TIFF文件3、2级影像存储格式：高分辨率全色影像，低分辨率多波段彩色影像4、3级彩色影像：高分辨率红、绿、蓝、近红外通道，以位面或像素方式存储数码相机的技术参数（SX传感器单元）1、全色影像尺寸：14,430×9,420像素2、全色物理像元尺寸：7.2um3、影像数据量：435M4、焦平面的物理尺寸：104mm×68.4mm5、全色镜头焦距：100mm6、镜头光圈：F=1/5.67、旁向视场角（航向）：55°（37 °）8、彩色（多光谱性能）：4通道RGB和NIR9、彩色影像尺寸：4992×3328像素10、彩色像元物理尺寸：7.2um11、彩色镜头系统焦距：33mm12、彩色镜头光圈：F=1/4.013、彩色影像的旁向视场角（航向）：55°（37°）14、可选快门速度：1/500-1/3215、像移补偿（FMC）：TDI控制16、最大像移补偿性能：50像素17、航高为500m（300m）时像元地面分辨率(GSD)：3.6cm（2.2cm）18、每秒拍摄像幅数（最小影像间隔）：1.35秒每幅19、彩色通道的辐射分辨率：14位20、数模转换位数：>12位21、相机单元的物理尺寸：45cm×45cm×60cm22、重量：约45kg23、满负荷耗电量：150W飞行数据存储单元DX和数据处理单元CX1、飞行时存储容量：每个DX单元约1.7T，不限制DX单元的个数2、飞行时采集未压缩影像的数量：每个DX单元约3900幅，不限制DX单元的个数3、飞行时切换DX单元的过程：小于1分钟4、DX和CX的配置情况：CX单元配置14个奔腾-M的CPU，DX配置28块硬盘5、数据冗余：镜像方式存储影像数据6、办公室的数据传输：可插拔DX存储单元；可移动工作站7、物理尺寸：50cm×36cm×65cm8、CX和2个DX的重量：<65kg9、CX的重量：约35kg10、单个DX的重量：约15kg11、满负荷运行的功率：700W操作参数1、重叠度为70%/20%，地面分辨率20cm的数据采集周期：每个DX单元8.5小时2、原始影像的后处理：可用于UltraMap服务器、移动服务器、室内计算机网络、便携机、CX 等环境的OPC软件3、飞机至办公室的数据传输：运送DX，或通过移动服务器将数据传输至高容量存储介质4、相机的安装：通过适配环可安装到当前所有胶片相机的基座上（PAV-30，Z/I TAS，GSM3000）5、飞行计划支持：与商业系统兼容（CCNS-4，Trackair，Vega等）6、外部定向支持：与差分GPS、IMU系统兼容（IGI's Aero-Control，Applanix' POS-AV）7、摄影测量产品：TIFF输出，可与客户摄影测量软件兼容8、影像几何精度：≤2um。

MAX1993中文资料

Pin Configurations
AGND SHDN VCC PGND 20 VDD 19 18 17 16 DL BST LX DH V+ SKIP 15 14 13 7 N.C. 8 N.C. 9 FB 10 OUT 11 CSP 12 CSN
Applications
Notebook Computers Core/IO Supplies as Low as 0.7V 1.8V and 2.5V Supplies DDR Memory Termination (MAX1993) Active Termination Buses (MAX1993) CPU/Chipset/GPU with Dynamic Voltage Cores (MAX1993)
TOP VIEW
24 TON N.C. LSAT PGOOD ILIM REF 1 2 3 4 5 6
OVP/UVP
23
22
21
MAX1992
24-PIN THIN QFN 4mm x 4mm
Quick-PWM is a trademark of Maxim Integrateபைடு நூலகம் Products, Inc.
元器件交易网
Quick-PWM Step-Down Controllers with Inductor Saturation Protection and Dynamic Output Voltages MAX1992/MAX1993
ABSOLUTE MAXIMUM RATINGS (Note 1)
Features
MAX1992/MAX1993
Ordering Information
PART MAX1992ETG MAX1993ETG TEMP RANGE -40°C to +85°C -40°C to +85°C PIN-PACKAGE 24 Thin QFN 4mm × 4mm 24 Thin QFN 4mm × 4mm

M93C56DW中文资料

1/31August 2004M93C86, M93C76, M93C66M93C56, M93C4616Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit (8-bit or 16-bit wide)MICROWIRE® Serial Access EEPROMFEATURES SUMMARYs Industry Standard MICROWIRE Bus sSingle Supply Voltage:– 4.5 to 5.5V for M93Cx6– 2.5 to 5.5V for M93Cx6-W – 1.8 to 5.5V for M93Cx6-Rs Dual Organization: by Word (x16) or Byte (x8) s Programming Instructions that work on: Byte, Word or Entire Memorys Self-timed Programming Cycle with Auto-Erases sSpeed:–1MHz Clock Rate, 10ms Write Time(Current product, identified by process identification letter F or M)–2MHz Clock Rate, 5ms Write Time (NewProduct, identified by process identification letter W or G or S) s Sequential Read Operations Enhanced ESD/Latch-Up Behaviour s More than 1 Million Erase/Write Cycles sMore than 40 Year Data RetentionTable 1. Product ListReferencePart Number ReferencePart Number M93C86M93C86M93C56M93C56M93C86-W M93C56-W M93C86-R M93C56-R M93C76M93C76M93C46M93C46M93C76-W M93C46-W M93C76-R M93C46-RM93C66M93C66M93C66-W M93C66-RM93C86, M93C76, M93C66, M93C56, M93C46TABLE OF CONTENTSFEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Table 1.Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Figure 1.Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Figure 2.Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Table 2.Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Table 3.Memory Size versus Organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Table 4.Instruction Set for the M93Cx6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Figure 3.DIP, SO, TSSOP and MLP Connections (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . .5MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 POWER-ON DATA PROTECTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..5INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Table 5.Instruction Set for the M93C46 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Table 6.Instruction Set for the M93C56 and M93C66 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Table 7.Instruction Set for the M93C76 and M93C86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Erase/Write Enable and Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Figure 4.READ, WRITE, EWEN, EWDS Sequences. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Erase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Figure 5.ERASE, ERAL Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Erase All. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Write All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Figure 6.WRAL Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10READY/BUSY STATUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 COMMON I/O OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11CLOCK PULSE COUNTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Figure 7.Write Sequence with One Clock Glitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Table 8.Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Table 9.Operating Conditions (M93Cx6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Table 10.Operating Conditions (M93Cx6-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Table 11.Operating Conditions (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Table 12.AC Measurement Conditions (M93Cx6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Table 13.AC Measurement Conditions (M93Cx6-W and M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . .14 Figure 8.AC Testing Input Output Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .142/31M93C86, M93C76, M93C66, M93C56, M93C46Table 14.Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Table 15.DC Characteristics (M93Cx6, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Table 16.DC Characteristics (M93Cx6, Device Grade 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Table 17.DC Characteristics (M93Cx6-W, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Table 18.DC Characteristics (M93Cx6-W, Device Grade 7 or 3). . . . . . . . . . . . . . . . . . . . . . . . . .17 Table 19.DC Characteristics (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Table 20.AC Characteristics (M93Cx6, Device Grade 6, 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . .18 Table 21.AC Characteristics (M93Cx6-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Table 22.AC Characteristics (M93Cx6-W, Device Grade 7 or 3). . . . . . . . . . . . . . . . . . . . . . . . . .20 Table 23.AC Characteristics (M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Figure 9.Synchronous Timing (Start and Op-Code Input). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Figure 10.Synchronous Timing (Read or Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Figure 11.Synchronous Timing (Read or Write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23Figure 12.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . .23 Table 24.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data. . . . . . . . . .23 Figure 13.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . .24 Table 25.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data 24Figure 14.UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline 25Table 26.UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data.25Figure 15.TSSOP8 3x3mm²– 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline 26Table 27.TSSOP8 3x3mm²– 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data 26Figure 16.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . .27 Table 28.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data. . . . . . . . . . . .27PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Table 29.Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Table 30.How to Identify Current and New Products by the Process Identification Letter. . . . . . .29REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Table 31.Document Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .303/31M93C86, M93C76, M93C66, M93C56, M93C464/31SUMMARY DESCRIPTIONThese electrically erasable programmable memo-ry (EEPROM) devices are accessed through a Se-rial Data Input (D) and Serial Data Output (Q)using the MICROWIRE bus protocol.Table 2. Signal NamesThe memory array organization may be divided into either bytes (x8) or words (x16) which may be selected by a signal applied on Organization Se-lect (ORG). The bit, byte and word sizes of the memories are as shown in Table 3..Table 3. Memory Size versus OrganizationThe M93Cx6 is accessed by a set of instructions,as summarized in Table 4., and in more detail in Table 5. to Table 7.).Table 4. Instruction Set for the M93Cx6A Read Data from Memory (READ) instruction loads the address of the first byte or word to be read in an internal address register. The data at this address is then clocked out serially. The ad-dress register is automatically incremented after the data is output and, if Chip Select Input (S) is held High, the M93Cx6 can output a sequential stream of data bytes or words. In this way, the memory can be read as a data stream from eight to 16384 bits long (in the case of the M93C86), or continuously (the address counter automatically rolls over to 00h when the highest address is reached).Programming is internally self-timed (the external clock signal on Serial Clock (C) may be stopped or left running after the start of a Write cycle) and does not require an Erase cycle prior to the Write instruction. The Write instruction writes 8 or 16 bits at a time into one of the byte or word locations of the M93Cx6. After the start of the programming cy-cle, a Busy/Ready signal is available on Serial Data Output (Q) when Chip Select Input (S) is driv-en High.S Chip Select Input D Serial Data Input Q Serial Data Output C Serial Clock ORG Organisation Select V CC Supply Voltage V SSGroundDevice Number of Bits Number of 8-bit Bytes Number of 16-bit Words M93C861638420481024M93C7681921024512M93C664096512256M93C562048256128M93C46102412864Instruction Description Data READ Read Data from Memory Byte or Word WRITEWrite Data to Memory Byte or WordEWEN Erase/Write Enable EWDS Erase/Write Disable ERASE Erase Byte or Word Byte or WordERAL Erase All Memory WRALWrite All Memory with same DataM93C86, M93C76, M93C66, M93C56, M93C46An internal Power-on Data Protection mechanism in the M93Cx6 inhibits the device when the supply is too low.Figure 3. DIP, SO, TSSOP and MLPNote: 1.See PACKAGE MECHANICAL section for package di-mensions, and how to identify pin-1.2.DU = Don’t Use.The DU (Don’t Use) pin does not contribute to the normal operation of the device. It is reserved for use by STMicroelectronics during test sequences. The pin may be left unconnected or may be con-nected to V CC or V SS. Direct connection of DU to V SS is recommended for the lowest stand-by pow-er consumption.MEMORY ORGANIZATIONThe M93Cx6 memory is organized either as bytes (x8) or as words (x16). If Organization Select (ORG) is left unconnected (or connected to V CC) the x16 organization is selected; when Organiza-tion Select (ORG) is connected to Ground (V SS) the x8 organization is selected. When the M93Cx6 is in stand-by mode, Organization Select (ORG) should be set either to V SS or V CC for minimum power consumption. Any voltage between V SS and V CC applied to Organization Select (ORG) may increase the stand-by current.POWER-ON DATA PROTECTIONTo prevent data corruption and inadvertent write operations during power-up, a Power-On Reset (POR) circuit resets all internal programming cir-cuitry, and sets the device in the Write Disable mode.–At Power-up and Power-down, the device must not be selected (that is, Chip Select Input (S) must be driven Low) until the supplyvoltage reaches the operating value V CCspecified in Table 9. to Table 11..–When V CC reaches its valid level, the device is properly reset (in the Write Disable mode) and is ready to decode and execute incominginstructions.For the M93Cx6 devices (5V range) the POR threshold voltage is around 3V. For the M93Cx6-W (3V range) and M93Cx6-R (2V range) the POR threshold voltage is around 1.5V.5/31M93C86, M93C76, M93C66, M93C56, M93C466/31INSTRUCTIONSThe instruction set of the M93Cx6 devices con-tains seven instructions, as summarized in Table 5. to Table 7.. Each instruction consists of the fol-lowing parts, as shown in Figure 4.:s Each instruction is preceded by a rising edgeon Chip Select Input (S) with Serial Clock (C) being held Low.s A start bit, which is the first ‘1’ read on SerialData Input (D) during the rising edge of Serial Clock (C).s Two op-code bits, read on Serial Data Input(D) during the rising edge of Serial Clock (C). (Some instructions also use the first two bits of the address to define the op-code).sThe address bits of the byte or word that is to be accessed. For the M93C46, the address is made up of 6 bits for the x16 organization or 7 bits for the x8 organization (see Table 5.). For the M93C56 and M93C66, the address is made up of 8 bits for the x16 organization or 9 bits for the x8 organization (see Table 6.). For the M93C76 and M93C86, the address is made up of 10 bits for the x16 organization or 11 bits for the x8 organization (see Table 7.).The M93Cx6 devices are fabricated in CMOS technology and are therefore able to run as slow as 0Hz (static input signals) or as fast as the max-imum ratings specified in Table 20. to Table 23..Table 5. Instruction Set for the M93C46Note: 1.X = Don ’t Care bit.Instruc tionDescriptionStart bit Op-Codex8 Origination (ORG = 0)x16 Origination (ORG = 1)Address 1DataRequiredClock CyclesAddress 1DataRequired Clock CyclesREAD Read Data from Memory 110A6-A0Q7-Q0A5-A0Q15-Q0WRITE Write Data to Memory101A6-A0D7-D018A5-A0D15-D025EWEN Erase/Write Enable 10011X XXXX 1011 XXXX 9EWDS Erase/Write Disable 10000X XXXX 1000 XXXX 9ERASE Erase Byte or Word 111A6-A010A5-A09ERAL Erase All Memory 10010X XXXX 1010 XXXX 9WRALWrite All Memory with same Data10001X XXXXD7-D01801 XXXXD15-D0257/31M93C86, M93C76, M93C66, M93C56, M93C46Table 6. Instruction Set for the M93C56 and M93C66Note: 1.X = Don ’t Care bit.2.Address bit A8 is not decoded by the M93C56.3.Address bit A7 is not decoded by the M93C56.Table 7. Instruction Set for the M93C76 and M93C86Note: 1.X = Don ’t Care bit.2.Address bit A10 is not decoded by the M93C76.3.Address bit A9 is not decoded by the M93C76.Instruc tionDescriptionStart bit Op-Codex8 Origination (ORG = 0)x16 Origination (ORG = 1)Address 1,2DataRequiredClock CyclesAddress 1,3DataRequired Clock CyclesREAD Read Data from Memory 110A8-A0Q7-Q0A7-A0Q15-Q0WRITE Write Data to Memory101A8-A0D7-D020A7-A0D15-D027EWEN Erase/Write Enable 100 1 1XXXXXXX 1211XX XXXX 11EWDS Erase/Write Disable 1000 0XXX XXXX 1200XX XXXX 11ERASE Erase Byte or Word 111A8-A012A7-A011ERAL Erase All Memory 100 1 0XXX XXXX 1210XX XXXX 11WRALWrite All Memory with same Data1000 1XXX XXXXD7-D02001XX XXXXD15-D027Instruc tionDescriptionStart bit Op-Codex8 Origination (ORG = 0)x16 Origination (ORG = 1)Address1,2DataRequiredClock CyclesAddress 1,3DataRequiredClock CyclesREAD Read Data from Memory 110A10-A0Q7-Q0A9-A0Q15-Q0WRITE Write Data to Memory101A10-A0D7-D022A9-A0D15-D029EWEN Erase/Write Enable 10011X XXXX XXXX 1411 XXXX XXXX 13EWDS Erase/Write Disable 10000X XXXX XXXX 1400 XXXX XXXX 13ERASE Erase Byte or Word 111A10-A014A9-A013ERAL Erase All Memory 10010X XXXX XXXX 1410 XXXX XXXX 13WRALWrite All Memory with same Data10001X XXXX XXXXD7-D02201 XXXX XXXXD15-D029M93C86, M93C76, M93C66, M93C56, M93C468/31ReadThe Read Data from Memory (READ) instruction outputs data on Serial Data Output (Q). When the instruction is received, the op-code and address are decoded, and the data from the memory is transferred to an output shift register. A dummy 0bit is output first, followed by the 8-bit byte or 16-bit word, with the most significant bit first. Output data changes are triggered by the rising edge of Serial Clock (C). The M93Cx6 automatically incre-ments the internal address register and clocks out the next byte (or word) as long as the Chip Select Input (S) is held High. In this case, the dummy 0 bit is not output between bytes (or words) and a con-tinuous stream of data can be read.Erase/Write Enable and DisableThe Erase/Write Enable (EWEN) instruction en-ables the future execution of erase or write instruc-tions, and the Erase/Write Disable (EWDS)instruction disables it. When power is first applied,the M93Cx6 initializes itself so that erase and write instructions are disabled. After an Erase/Write En-able (EWEN) instruction has been executed, eras-ing and writing remains enabled until an Erase/Write Disable (EWDS) instruction is executed, or until V CC falls below the power-on reset threshold voltage. To protect the memory contents from ac-cidental corruption, it is advisable to issue the Erase/Write Disable (EWDS) instruction after ev-ery write cycle. The Read Data from Memory (READ) instruction is not affected by the Erase/Write Enable (EWEN) or Erase/Write Disable (EWDS) instructions.M93C86, M93C76, M93C66, M93C56, M93C46EraseThe Erase Byte or Word (ERASE) instruction sets the bits of the addressed memory byte (or word) to 1. Once the address has been correctly decoded, the falling edge of the Chip Select Input (S) starts the self-timed Erase cycle. The completion of the cycle can be detected by monitoring the Ready/READY/BUSY STA-TUS section.WriteFor the Write Data to Memory (WRITE) instruction, 8 or 16 data bits follow the op-code and address bits. These form the byte or word that is to be writ-ten. As with the other bits, Serial Data Input (D) is sampled on the rising edge of Serial Clock (C).After the last data bit has been sampled, the Chip Select Input (S) must be taken Low before the next rising edge of Serial Clock (C). If Chip Select Input (S) is brought Low before or after this specific time frame, the self-timed programming cycle will not be started, and the addressed location will not be programmed. The completion of the cycle can be described later in this document.Once the Write cycle has been started, it is inter-nally self-timed (the external clock signal on Serial Clock (C) may be stopped or left running after the start of a Write cycle). The cycle is automatically preceded by an Erase cycle, so it is unnecessary to execute an explicit erase instruction before a Write Data to Memory (WRITE) instruction.9/31M93C86, M93C76, M93C66, M93C56, M93C4610/31Erase AllThe Erase All Memory (ERAL) instruction erases the whole memory (all memory bits are set to 1).The format of the instruction requires that a dum-my address be provided. The Erase cycle is con-ducted in the same way as the Erase instruction (ERASE). The completion of the cycle can be de-scribed in the READY/BUSY STATUS section.Write AllAs with the Erase All Memory (ERAL) instruction,the format of the Write All Memory with same Data (WRAL) instruction requires that a dummy ad-dress be provided. As with the Write Data to Mem-ory (WRITE) instruction, the format of the Write All Memory with same Data (WRAL) instruction re-quires that an 8-bit data byte, or 16-bit data word,be provided. This value is written to all the ad-dresses of the memory device. The completion of the cycle can be detected by monitoring theNote:For the meanings of Xn and Dn, please see Table 5., Table 6. and Table 7..READY/BUSY STATUSWhile the Write or Erase cycle is underway, for a WRITE, ERASE, WRAL or ERAL instruction, the Busy signal (Q=0) is returned whenever Chip Se-lect Input (S) is driven High. (Please note, though, that there is an initial delay, of t SLSH, before this status information becomes available). In this state, the M93Cx6 ignores any data on the bus. When the Write cycle is completed, and Chip Se-lect Input (S) is driven High, the Ready signal (Q=1) indicates that the M93Cx6 is ready to re-ceive the next instruction. Serial Data Output (Q) remains set to 1 until the Chip Select Input (S) is brought Low or until a new start bit is decoded. COMMON I/O OPERATIONSerial Data Output (Q) and Serial Data Input (D) can be connected together, through a current lim-iting resistor, to form a common, single-wire data bus. Some precautions must be taken when oper-ating the memory in this way, mostly to prevent a short circuit current from flowing when the last ad-dress bit (A0) clashes with the first data bit on Se-rial Data Output (Q). Please see the application note AN394 for details. CLOCK PULSE COUNTERIn a noisy environment, the number of pulses re-ceived on Serial Clock (C) may be greater than the number delivered by the master (the microcontrol-ler). This can lead to a misalignment of the instruc-tion of one or more bits (as shown in Figure 7.) and may lead to the writing of erroneous data at an er-roneous address.To combat this problem, the M93Cx6 has an on-chip counter that counts the clock pulses from the start bit until the falling edge of the Chip Select In-put (S). If the number of clock pulses received is not the number expected, the WRITE, ERASE, ERAL or WRAL instruction is aborted, and the contents of the memory are not modified.The number of clock cycles expected for each in-struction, and for each member of the M93Cx6 family, are summarized in Table 5. to Table 7.. For example, a Write Data to Memory (WRITE) in-struction on the M93C56 (or M93C66) expects 20 clock cycles (for the x8 organization) from the start bit to the falling edge of Chip Select Input (S). That is:1 Start bit+ 2 Op-code bits+ 9 Address bits+ 8 Data bitsMAXIMUM RATINGStressing the device above the rating listed in the Absolute Maximum Ratings" table may cause per-manent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not im-plied. Exposure to Absolute Maximum Rating con-ditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality docu-ments.Table 8. Absolute Maximum RatingsNote: pliant with JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK ® 7191395 specification, andthe European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU 2.JEDEC Std JESD22-A114A (C1=100pF, R1=1500 Ω, R2=500 Ω)Symbol ParameterMin.Max.Unit T STG Storage Temperature–65150°C T LEAD Lead T emperature during Soldering See note 1°C V OUT Output range (Q = V OH or Hi-Z)–0.50V CC +0.5V V IN Input range –0.50V CC +1V V CC Supply Voltage–0.50 6.5V V ESDElectrostatic Discharge Voltage (Human Body model) 2–40004000VDC AND AC PARAMETERSThis section summarizes the operating and mea-surement conditions, and the DC and AC charac-teristics of the device. The parameters in the DC and AC Characteristic tables that follow are de-rived from tests performed under the Measure-ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parame-ters.Table 9. Operating Conditions (M93Cx6)Table 10. Operating Conditions (M93Cx6-W)Table 11. Operating Conditions (M93Cx6-R)Symbol ParameterMin.Max.Unit V CCSupply Voltage4.55.5V T AAmbient Operating Temperature (Device Grade 6)–4085°C Ambient Operating Temperature (Device Grade 7)–40105°C Ambient Operating Temperature (Device Grade 3)–40125°CSymbol ParameterMin.Max.Unit V CCSupply Voltage2.5 5.5V T AAmbient Operating Temperature (Device Grade 6)–4085°C Ambient Operating Temperature (Device Grade 7)–40105°C Ambient Operating Temperature (Device Grade 3)–40125°CSymbol ParameterMin.Max.Unit V CC Supply Voltage1.8 5.5V T AAmbient Operating Temperature (Device Grade 6)–4085°CTable 12. AC Measurement Conditions (M93Cx6)Note: 1.Output Hi-Z is defined as the point where data out is no longer driven.Table 13. AC Measurement Conditions (M93Cx6-W and M93Cx6-R)Note: 1.Output Hi-Z is defined as the point where data out is no longer driven.Table 14. CapacitanceNote:Sampled only, not 100% tested, at T A =25°C and a frequency of 1MHz.Symbol Parameter Min.Max.Unit C LLoad Capacitance 100pFInput Rise and Fall Times 50ns Input Pulse Voltages0.4V to 2.4V V Input Timing Reference Voltages 1.0V and 2.0V V Output Timing Reference Voltages0.8V and 2.0VVSymbol Parameter Min.Max.Unit C LLoad Capacitance 100pFInput Rise and Fall Times 50ns Input Pulse Voltages0.2V CC to 0.8V CC V Input Timing Reference Voltages 0.3V CC to 0.7V CC V Output Timing Reference Voltages0.3V CC to 0.7V CCVSymbol ParameterTest Condition MinMax Unit C OUT OutputCapacitance V OUT = 0V 5pF C INInputCapacitanceV IN = 0V5pFNote: 1.Current product: identified by Process Identification letter F or M.2.New product: identified by Process Identification letter W or G or S.Table 16. DC Characteristics (M93Cx6, Device Grade 7 or 3)Note: 1.Current product: identified by Process Identification letter F or M.2.New product: identified by Process Identification letter W or G or S.I LI Input Leakage Current 0V ≤ V IN ≤ V CC±2.5 µA I LOOutput Leakage Current0V ≤ V OUT ≤ V CC , Q in Hi-Z ±2.5 µA I CCSupply CurrentV CC = 5V, S = V IH , f = 1 MHz, CurrentProduct 11.5 mA V CC = 5V, S = V IH , f = 2 MHz, NewProduct 22 mA I CC1Supply Current (Stand-by)V CC = 5V , S = V SS , C = V SS ,ORG = V SS or V CC , Current Product 150µAV CC = 5V , S = V SS , C = V SS , ORG = V SS or V CC , New Product 215 µAV IL Input Low Voltage V CC = 5V ± 10%–0.450.8 V V IH Input High Voltage V CC = 5V ± 10%2V CC + 1 V V OL Output Low Voltage V CC = 5V, I OL = 2.1mA 0.4 V V OHOutput High VoltageV CC = 5V , I OH = –400µA2.4VSymbol ParameterTest Condition Min.Max.Unit I LI Input Leakage Current 0V ≤ V IN ≤ V CC±2.5 µA I LOOutput Leakage Current0V ≤ V OUT ≤ V CC , Q in Hi-Z ±2.5µAI CCSupply CurrentV CC = 5V, S = V IH , f = 1 MHz, CurrentProduct 11.5 mA V CC = 5V, S = V IH , f = 2 MHz, NewProduct 22 mA I CC1Supply Current (Stand-by)V CC = 5V , S = V SS , C = V SS ,ORG = V SS or V CC , Current Product 150 µA V CC = 5V , S = V SS , C = V SS , ORG = V SS or V CC , New Product 215 µA V IL Input Low Voltage V CC = 5V ± 10%–0.450.8 V V IH Input High Voltage V CC = 5V ± 10%2V CC + 1 V V OL Output Low Voltage V CC = 5V, I OL = 2.1mA 0.4 V V OHOutput High VoltageV CC = 5V , I OH = –400µA2.4V。

PA93资料

2 Full temperature range 15 10 75 200 4 50 1011 4 ±Vs Ŧ 15 VCM = ±90V 100KHz BW, RS = 1KΩ, CC = 10pF 80 98 1 500 2000
SPECIFICATIONS
Max
10 50 25
Units
mV µV/°C µV/V µV/kHz pA pA/V pA Ω pF V dB µV RMS
3 */
1*&;0%3*7& 1" 7 065
$0.165&3 '0$64 $0.."/% 70-5"(& 3 $- Biblioteka PA93U元器件交易网
P r o d u c t I n n o v a t i o nF r o m
PA93
Test Conditions1 Min
94
Parameter
GAIN OPEN LOOP @ 15Hz GAIN BANDWIDTH PRODUCT @ 1MHz POWER BANDWIDTH PHASE MARGIN OUTPUT VOLTAGE SWING (Note 3) CURRENT, continuous SLEW RATE, A V = 100 CAPACITIVE LOAD, A V = +1 SETTLING TIME to 0.1% RESISTANCE, no load POWER SUPPLY VOLTAGE (Note 5) CURRENT, quiescent THERMAL RESISTANCE, AC, junction to case (Note 4) RESISTANCE, DC, junction to case RESISTANCE, junction to air TEMPERATURE RANGE, case

1MF26-L560-00C-200(3m)中文数据手册「EasyDatasheet」

为镉.除非3M另有书面说明,该信息代表3M公司所知及所信基于由第三方供应商提供给3M信息.
在上面符号数值参考不应被解释为关于产品生命或一个产品担防护延伸表示.下面产品防护修规定.在该事件任何产品被证明不符合3M公司监管信息附录,然后3M全部责任以及购买者唯一补救是根据以下规定产品防护修.
RIA-2217B-c
外编织
•坚固MDR色带接触式
•坚固指旋螺丝固定 •EMI屏蔽电缆组件 •查看监管信息,附录（RIA）
化学合规信息
更新日期：2007年12月13日,
Hale Waihona Puke 体力电环境连接器触点电镀：
擦拭面产品：30 [ 0.76 m ]闵金
侵：100
[ 2.55 m ]镍
外壳选项：
颜色：米色（MDR）,黑色（SDR）
材料：超模苯压乙选烯项（：A聚B氯S）乙烯（PVC）和丙烯腈 - 丁二烯 -
TS-2121-C Sheet 3 of 3
芯片中文手册,看全文,戳
法规信息附录
3M公司电子解决方案事业部/互连
欧洲
附录E1：欧盟RoHS
指令2002/95/EC,在电子电气设备中某些有害物质,如修订欧盟委员会决议2005/618/EC中限制使用.
本产品符合RoHS 2005/95/EC. "符合RoHS 2005/95/EC"意味着该产品或部分（"产品"）不包含任何超出欧盟指令2002/95/EC最大浓度值物质, 修订委员会决议2005/618/EC,除非该物质是在一个应用程序,是在欧盟RoHS指令豁免.除非3M另有书面说明, 该信息代表3M公司所知及所信基于由第三方供应商提供给3M信息.
电缆：颜色：米色
外壳材料：聚氯乙烯（PVC）可燃性：AWM VW-1 标志：3M标志

模具各零部件名称中英文对照

Mold & die components 模具单元Mold changing systems 换模系统Mold core 模芯Mold heaters/chillers 模具加热器/冷却器 Mold polishing/texturing 模具打磨/磨纹 Mold repair 模具维修Molds 模具Pressing dies 压模Quick die change systems 速换模系统Quick mold change systems 快速换模系统三、模具塑料模具mould of plastics注塑模具injection mould冲压模具die模架mould base定模座板Top clamping plateTop plateFixed clamp plate水口推板stripper plateA板A plateB板B plate支承板 support plate方铁 spacer plate底针板 ejector plate面针板 ejector retainer plate回针 Return pin导柱 Guide pin有托导套 Shoulder Guide bush直导套 Straight Guide bush动模座板Bottom clamp plateMoving clamp plate基准线datum line基准面datum plan型芯固定板core-retainer plate凸模固定板punch-retainer plate顶针ejector pin单腔模具single cavity mould多腔模具multi-cavity mould多浇口multi-gating浇口gate缺料starving排气breathing光泽gloss合模力mould clamping force锁模力mould locking force挤出extrusion开裂crack循环时间cycle time老化aging螺杆screw麻点pit嵌件insert活动镶件movable insert起垩chalking浇注系统feed system主流道 sprue分流道runner浇口gate直浇口direct gate , sprue gate轮辐浇口spoke gate , spider gate点浇口pin-point gate测浇口edge gate潜伏浇口submarine gate , tunnel gate 料穴cold-slug well浇口套sprue bush流道板runner plate排飞槽vent分型线（面）parting line定模stationary mould，Fixed mould动模movable mould, movable half上模upper mould， upper half下模lower mould， lower half型腔cavity凹模cavity plate，cavity block拼块split定位销dowel定位销孔dowel hole型芯core斜销angle pin, finger cam滑块slide滑块导板slide guide strip楔紧块heel block, wedge lock拉料杆sprue puller定位环locating ring冷却通cooling channel脱模斜度draft滑动型芯slide core螺纹型芯threaded core热流道模具hot-runner mould绝热流道模insulated runner mould熔合纹weld line （flow line）三板式模具three plate mould脱模ejection换模腔模具 interchangeable cavity mould脱模剂release agent注射能力shot capacity注射速率injection rate注射压力injection pressure差色剂colorant保压时间holdup time闭模时间closing time定型装置sizing system阴模female mould，cavity block阳模male mould电加工设备Electron Discharge Machining数控加工中心CNC machine center万能铁床Universal milling machine卧式刨床Horizontal planer车床Engine lathe平面磨床Surface grinding machine去磁机Demagnetization machine万能摇臂钻床Universal radial movable driller 立式钻床Vertical driller超声波清洗机Ultrasonic clearing machine compre sion molding压缩成型flash mold溢流式模具plsitive mold挤压式模具split mold分割式模具cavity型控母模core模心公模taper锥拔leather cloak仿皮革shiver饰纹flow mark流痕welding mark溶合痕post screw insert螺纹套筒埋值self tapping screw自攻螺丝striper plate脱料板piston活塞cylinder汽缸套chip细碎物handle mold手持式模具（移转成型用模具）encapsulation molding低压封装成型（射出成型用模具）two plate两极式（模具）well type蓄料井insulated runner绝缘浇道方式hot runner热浇道runner plat浇道模块valve gate阀门浇口band heater环带状的电热器spindle阀针spear head刨尖头slag well冷料井cold slag冷料渣air vent排气道welding line熔合痕eject pin顶出针knock pin顶出销return pin回位销反顶针sleave套筒stripper plate脱料板insert core放置入子runner stripper plate浇道脱料板guide pin导销eject rod (bar)（成型机）顶业捧subzero深冷处理three plate三极式模具runner system浇道系统stress crack应力电裂orientation定向sprue gate射料浇口，直浇口nozzle射嘴sprue lock pin料头钩销(拉料杆) slag well冷料井side gate侧浇口edge gate侧缘浇口tab gate搭接浇口film gate薄膜浇口flash gate闸门浇口slit gate缝隙浇口fan gate扇形浇口dish gate因盘形浇口diaphragm gate隔膜浇口ring gate环形浇口subarine gate潜入式浇口tunnel gate隧道式浇口pin gate针点浇口Runner less无浇道(sprue less)无射料管方式long nozzle延长喷嘴方式sprue浇口;溶渣根据中文词汇查所关心的技术问题，解决实际工作中的难题例如，在汉语词汇中看到——高速冲孔废料上跳（かす上り、scrap jump ）词汇，到网上一搜，中图分类号TG382.6，文章编码：1671-3508-2008-10-07-517，“高速冲压中防止冲孔废料上跳的方法”一文会告诉你引起高速冲孔废料上跳的原因，不外乎有油膜粘连、真空吸附、刃口磨损、磁性未退四个主要方面，解决这些问题有三个方向的思路可以考虑，具体手段有“毛糙面”法、“斜刀口”法、“硅胶顶出”法、“凹模刃口倒退拔”法，等等。

UltraCam系列航空摄影测量相机介绍

UltraCam 数码航摄仪系列产品蓝皮书
北京四维空间数码科技有限公司
-1-
目录
Microsoft Vexcel 简介 ............................................................................................ 错误!未定义书签。
概述.................................................................................................................................................... 39 UltraMap 技术特点 ........................................................................................................................... 40
UltraCamXp WA (wide-angle) 广角大幅面数码航摄仪 .................................................................. 20
概述.................................................................................................................................................... 20 UltraCamXp WA ............................................................................................................................... 21 特性.................................................................................................................................................... 21 UltraCamXp WA 技术参数............................................................................................................... 21 UltraCamXp WA 影像产品展示....................................................................................................... 24

MAX931-MAX934中文资料

MAX931-MAX934
______________Ordering Information
PART MAX931CPA MAX931CSA MAX931CUA MAX931EPA MAX931ESA TEMP. RANGE 0°C to +70°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C PIN-PACKAGE 8 Plastic DIP 8 SO 8 µMAX 8 Plastic DIP 8 SO
INTERNAL COMPARATORS INTERNAL 2% PER HYSTERESIS REFERENCE PACKAGE PACKAGE
____________________________Features
o Ultra-Low 4µA Max Quiescent Current Over Extended Temp. Range (MAX931) o Power Supplies: Single +2.5V to +11V Dual ±1.25V to ±5.5V o Input Voltage Range Includes Negative Supply o Internal 1.182V ±2% Bandgap Reference o Adjustable Hysteresis o TTL-/CMOS-Compatible Outputs o 12µs Propagation Delay (10mV Overdrive) o No Switching Crowbar Current o 40mA Continuous Source Current o Available in Space-Saving µMAX Package

F1_Layout与masktooling简介

LAYOUT与MASK TOOLING简介作者：何松华一、概述在半导体集成电路的制造过程中，要进行多次光刻。

光刻时需将硅片上的光刻胶做出与掩模版上完全对应的几何图形，以实现选择性扩散或金属膜布线的目的。

为此，必须先制备一组光刻掩模版。

要制备掩模版，必须先有版图和制版文件。

LAYOUT就是版图设计。

MASK TOOLING就是制版文件。

半导体集成电路制造之前的准备：电路设计---→布图布线---→FRAME和制版文件制作---→制版---→Wafer Start电路设计和布图布线都由设计公司完成。

制版由掩模厂完成。

我们LAYOUT部门做的是向掩模厂提供FRAME和制版文件。

二、FRAME介绍1．什么是FRAMEFRAME就是将光刻对位标记、IN/OFF-LINE MONITOR、PCM测试模块、SPICE MODEL测试模块、可靠性测试模块、DESIGN RULE CHECK测试模块等图形结合芯片的尺寸，按一定的要求组合起来的总图。

FRAME通常不包括芯片的图形，只是将芯片在FRAME中的位置留空，由制版厂将FRAME 和芯片的图形组合起来。

2．FRAME的组成2．1光刻对位标记光刻对位标记是光刻对位用的。

后面的层次曝光显影后留下的光刻胶图形对前一面层次刻蚀后留下的台阶，若偏差超出工艺要求，则需重新涂胶再对位。

对位标记有对位游标、9-DOT、BOX-IN-BOX、SEARCH-MARK、LSA、FIA等。

这些图形在FRAME 中按一定的要求摆放。

2．1．1对位游标一般在FRAME的左上和右下各有一组。

用于人工读取对位偏差。

利用游标卡尺的原理，读出后一层（如P）对前一层（如TB）的偏差值。

版图上的图形是偏差为零的情况，因此当实际有偏差时，就可通过看第几根对准算出偏差值。

例如，标尺精度为0.05um，若第三根图形对齐，则偏差值为：3x0.05um=0.15um2．1．2 9-DOT一般在FRAME的右上角。

Kungfu（功夫）3D飞控使用手册-RC-Helifreak-Swiss

Kungfu（功夫）3D飞控使用手册感谢您购买本产品！Kungfu 3D飞控是一款非常优秀的3D飞控，配合配套的3D动力系统，可以实现多轴翻滚，倒飞，自旋等特技动作，操作手感灵活，3D动作流畅，将给您带来前所未有的飞行体验！警告和免责声明Kungfu 3D飞控适用用多旋翼3D飞行，3D模式下的多旋翼非常危险，任何微小的使用错误都将可能带来严重后果，使用本产品前，请通读本使用手册，正式使用时，请严格遵守本手册的相关注意事项，并注意周围环境是否安全，任何因超出本册规定的使用规定而造成的直接或间接伤害，木蛙科技概不负责，特此声明！产品简介一、飞行模式1. 3D 手动模式油门的上半段为正飞油门，对应电机正转（相对方向），油门的下半段为倒飞油门，对应电机反转（相对方向），3D 手动模式下，松杆后飞行器姿态不会自动回到平衡位置，该模式可完成倒飞，翻滚，自旋等多种倒飞动作（需飞手熟练掌握这些特技飞行技巧）。

2. 3D 自平衡模式油门的上半段为正飞油门，对应电机正转（相对方向），油门的下半段为倒飞油门，对应电机反转（相对方向），3D 自平衡模式下，俯仰/横滚操控杆回到中点后，飞行器将自动回到平衡位置，打杆依然可以完成倒飞，翻滚，自旋等多种倒飞动作（需飞手熟练掌握这些飞行技巧）3.2D手动模式即手动模式，油门全行程都为正飞油门，松杆后飞行器不会自动回到水平姿态，需手动修正保持姿态水平，该模式用于适应3D手感，是3D飞行前的必备练习模式。

4.2D自平衡模式（一键救机模式）油门全行程都为正飞油门，松杆后飞行器会自动回到水平姿态，自动保持姿态平稳。

任何飞行模式下，切换到该飞行模式后，飞行器将会迅速回到正飞状态，且保持姿态平衡。

该模式可作为一键救机模式，以避免3D飞行过程中分不清姿态引起的坠机事故。

5.2D无头自平衡模式（无头救机模式）和自平衡模式相比，在切换到该模式后，飞行器将会迅速回到正飞状态，并保持姿态平衡，而且处于无头模式，此时飞行器的机头方向为起飞时记录的机头方向，以避免在空中分不清头尾引起的坠机事故。

LM93CIMT资料

LM93Hardware Monitor with Integrated Fan Control for Server Management1.0General DescriptionThe LM93,hardware monitor,has a two wire digital interface compatible with SMBus ing an 8-bit Σ∆ADC,the LM93measures the temperature of two remote diode con-nected transistors as well as its own die and 16power supply voltages.To set fan speed,the LM93has two PWM outputs that are each controlled by up to four temperature zones.The fan-control algorithm is lookup table based.The LM93includes a digital filter that can be invoked to smooth temperature read-ings for better control of fan speed.The LM93has four tachometer inputs to measure fan speed.Limit and status registers for all measured values are included.The LM93builds upon the functionality of previous mother-board management ASICs and uses some of the LM85’s features (i.e.smart tachometer mode).It also adds measure-ment and control support for dynamic Vccp monitoring and PROCHOT.It is designed to monitor a dual processor Xeon class motherboard with a minimum of external components.2.0Featuresn 8-bit Σ∆ADCn Monitors 16power suppliesn Monitors 2remote thermal diodes n Internal ambient temperature sensingn Programmable autonomous fan control based on temperature readings with fan boost support n Fan control based on 13-step lookup table n Temperature reading digital filtern 1.0˚C digital temperature sensor resolution n 0.5˚C temperature resolution for fan control n 2PWM fan speed control outputs n 4fan tachometer inputsnDual processor thermal throttling (PROCHOT)monitoringn Dual dynamic VID monitoring (6VIDs per processor)n 8general purpose I/Os:—4can be configured as fan tachometer inputs—2can be configured to connect to THERMTRIP from a processor—2are standard GPIOs that could be used to monitor IERR signaln 2general purpose inputs that can be used to monitor SCSI termination signalsn Limit register comparisons of all monitored values n 2-wire,SMBus 2.0compliant,serial digital interface —Supports byte/block read and write—Configurable slave address (tri-level pin selects 1of 3possible addresses)n 2.5V reference voltage output n 56-pin TSSOP package n XOR-tree test mode3.0Key Specificationsn Voltage Measurement Accuracy ±2%FS (max)n Resolution8-bits,1˚C n Temperature Sensor Accuracy ±3˚C (max)nTemperature Range:—LM93Operational0˚C to +85˚C —Remote Temp Accuracy 0˚C to +125˚C n Power Supply Voltage +3.0V to +3.6Vn Power Supply Current 0.9mA4.0Applicationsn Serversn Workstationsn Multi-Microprocessor based equipment5.0Ordering InformationOrder Number NS Package Number Transport media LM93CIMT MTD5634units in railLM93CIMTXMTD561000units in tape-and-reelI 2C is a registered trademark of the Philips Corporation.April 2004LM93Hardware Monitor with Integrated Fan Control for Server Management©2004National Semiconductor Corporation 6.0Block Diagram20068201L M 93 27.0ApplicationBaseboard management of a Dual processor server.Two LM93s may be required to manage a quad processor base-board.The block diagram of LM93hardware is illustrated below.The hardware implementation is a single chip ASIC solution.2Way Xeon Server Management20068205LM93 3Table of Contents1.0General Description .....................................................................................................................................12.0Features .......................................................................................................................................................13.0Key Specifications ........................................................................................................................................14.0Applications ..................................................................................................................................................15.0Ordering Information ....................................................................................................................................16.0Block Diagram ..............................................................................................................................................27.0Application ....................................................................................................................................................38.0Connection Diagram ....................................................................................................................................79.0Pin Descriptions ...........................................................................................................................................810.0Server Terminology ..................................................................................................................................1011.0Recommended Implementation ................................................................................................................1112.0Functional Description ..............................................................................................................................1212.1MONITORING CYCLE TIME ................................................................................................................1212.2Σ∆A/D INHERENT AVERAGING ..........................................................................................................1212.3TEMPERATURE MONITORING ...........................................................................................................1212.3.1Temperature Data Format ...............................................................................................................1212.3.2Thermal Diode Fault Status .............................................................................................................1212.4VOLTAGE MONITORING ......................................................................................................................1212.5RECOMMENDED EXTERNAL SCALING RESISTORS FOR +12V POWER RAILS ..........................1312.6RECOMMENDED EXTERNAL SCALING CIRCUIT FOR −12V POWER INPUT ................................1312.7DYNAMIC Vccp MONITORING USING VID .........................................................................................1512.8V REF OUTPUT .......................................................................................................................................1512.9PROCHOT BACKGROUND INFORMATION ........................................................................................1512.10PROCHOT MONITORING ..................................................................................................................1612.11PROCHOT OUTPUT CONTROL ........................................................................................................1612.12FAN SPEED MEASUREMENT ...........................................................................................................1712.13SMART FAN SPEED MEASUREMENT .............................................................................................1713.0Inputs/Outputs ..........................................................................................................................................1713.1ALERT OUTPUT ...................................................................................................................................1713.2RESET INPUT/OUTPUT .......................................................................................................................1713.3PWM1AND PWM2OUTPUTS .............................................................................................................1713.4SCSI_TERMx INPUTS ..........................................................................................................................1713.5VRD1_HOT AND VRD2_HOT INPUTS ................................................................................................1813.6GPIO PINS ............................................................................................................................................1813.7FAN TACH INPUTS ...............................................................................................................................1814.0SMBus Interface .......................................................................................................................................1814.1SMBUS ADDRESSING .........................................................................................................................1814.2DIGITAL NOISE EFFECT ON SMBUS COMMUNICATION .................................................................1814.3GENERAL SMBUS TIMING ..................................................................................................................1814.4SMBUS ERROR SAFETY FEATURES ................................................................................................1914.5SERIAL INTERFACE PROTOCOLS .....................................................................................................1914.5.1Address Incrementing ......................................................................................................................1914.5.2Block Command Code Summary ....................................................................................................2014.5.3Write Operations .............................................................................................................................2014.5.3.1Write Byte ...................................................................................................................................2014.5.3.2Write Word .................................................................................................................................2014.5.3.3SMBus Write Block to Any Address ...........................................................................................2114.5.3.4I 2C ™Block Write .......................................................................................................................2114.5.4Read Operations ..............................................................................................................................2214.5.4.1Read Byte ..................................................................................................................................2214.5.4.2Read Word .................................................................................................................................2214.5.4.3SMBus Block-Write Block-Read Process Call ...........................................................................2214.5.4.4Simulated SMBus Block-Write Block-Read Process Call ..........................................................2414.5.4.5SMBus Fixed Address Block Reads ..........................................................................................2414.5.4.6I 2C Block Reads .........................................................................................................................2514.6READING AND WRITING 16-BIT REGISTERS ...................................................................................2515.0Using The LM93.......................................................................................................................................2615.1POWER ON ..........................................................................................................................................2615.2RESETS ................................................................................................................................................2615.3ADDRESS SELECTION ........................................................................................................................2615.4DEVICE SETUP ....................................................................................................................................2615.5ROUND ROBIN VOLTAGE/TEMPERATURE CONVERSION CYCLE . (26)L M 934LM93Table of Contents(Continued)15.6ERROR STATUS REGISTERS (27)15.6.1ASF Mode (27)15.7MASKING,ERROR STATUS AND ALERT (27)15.8LAYOUT AND GROUNDING (27)15.9THERMAL DIODE APPLICATION (27)15.9.1Accuracy Effects of Diode Non-Ideality Factor (28)15.9.2PCB Layout for Minimizing Noise (28)15.10FAN CONTROL (28)15.10.1Automatic Fan Control Algorithm (28)15.10.2Fan Control Temperature Resolution (30)15.10.3Zone1-4to PWM1-2Binding (31)15.10.4Fan Control Duty Cycles (31)15.10.5Alternate PWM Frequencies (31)15.10.6Fan Control Priorities (31)15.10.7PWM to100%Conditions (31)15.10.8VRDx_HOT Ramp-Up/Ramp-Down (32)15.10.9PROCHOT Ramp-Up/Ramp-Down (32)15.10.10Manual PWM Override (32)15.10.11Fan Spin-Up Control (32)15.11XOR TREE TEST (33)16.0Registers (34)16.1REGISTER WARNINGS (34)16.2REGISTER SUMMARY TABLE (34)16.3FACTORY REGISTERS00h–3Fh (40)16.3.1Register00h XOR Test (40)16.3.2Register01h SMBus Test (40)16.3.3Register3Eh Manufacturer ID (40)16.3.4Register3Fh Version/Stepping (40)16.4BMC ERROR STATUS REGISTERS40h–47h (41)16.4.1Register40h B_Error Status1 (41)16.4.2Register41h B_Error Status2 (42)16.4.3Register42h B_Error Status3 (42)16.4.4Register43h B_Error Status4 (43)16.4.5Register44h B_P1_PROCHOT Error Status (43)16.4.6Register45h B_P2_PROCHOT Error Status (44)16.4.7Register46h B_GPI Error Status (44)16.4.8Register47h B_Fan Error Status (45)16.5HOST ERROR STATUS REGISTERS (45)16.5.1Register48h H_Error Status1 (45)16.5.2Register49h H_Error Status2 (46)16.5.3Register4Ah H_Error Status3 (47)16.5.4Register4Bh H_Error Status4 (48)16.5.5Register4Ch H_P1_PROCHOT Error Status (49)16.5.6Register4Dh B_P2_PROCHOT Error Status (50)16.5.7Register4Eh H_GPI Error Status (51)16.5.8Register4Fh H_Fan Error Status (52)16.6VALUE REGISTERS (52)16.6.1Registers50–53h Unfiltered Temperature Value Registers (52)16.6.2Registers54–55h Filtered Temperature Value Registers (52)16.6.3Register56–65h A/D Channel Voltage Registers (53)16.6.4Register67h Current P1_PROCHOT (53)16.6.5Register68h Average P1_PROCHOT (54)16.6.6Register69h Current P2_PROCHOT (54)16.6.7Register6Ah Average P2_PROCHOT (54)16.6.8Register6Bh GPI State (55)16.6.9Register6Ch P1_VID (55)16.6.10Register6Dh P2_VID (55)16.6.11Register6E–75h Fan Tachometer Readings (56)16.7LIMIT REGISTERS (57)16.7.1Registers78–7Fh Temperature Limit Registers (57)16.7.2Registers80–83h Fan Boost Temperature Registers (57)5Table of Contents(Continued)16.7.3Registers 90–AFh Voltage Limit Registers ...................................................................................5816.7.4Register B0–B1h PROCHOT User Limit Registers ......................................................................5916.7.5Register B2–B3h Dynamic Vccp Limit Offset Registers ...............................................................6016.7.6Register B4–BBh Fan Tach Limit Registers .................................................................................6116.8SETUP REGISTERS .............................................................................................................................6216.8.1Register BCh Special Function Control 1(Voltage Hysteresis and Fan Control Filter Enable)...6216.8.2Register BDh Special Function Control 2(Smart Tach Mode Enable and Fan Control Temperature Resolution Control).....................................................................................................................................6316.8.3Register BEh GPI/VID Level Control ............................................................................................6316.8.4Register BFh PWM Ramp Control ................................................................................................6416.8.5Register C0h Fan Boost Hysteresis (Zones 1/2)..........................................................................6416.8.6Register C1h Fan Boost Hysteresis (Zones 3/4)..........................................................................6516.8.7Register C2h Zones 1/2Spike Smoothing Control .......................................................................6516.8.8Register C3h Zones 1/2MinPWM and Hysteresis .......................................................................6616.8.9Register C4h Zones 3/4MinPWM and Hysteresis .......................................................................6616.8.10Register C5h GPO ......................................................................................................................6716.8.11Register C6h PROCHOT Override ..............................................................................................6816.8.12Register C7h PROCHOT Time Interval ......................................................................................6916.8.13Register C8h PWM1Control 1...................................................................................................7016.8.14Register C9h PWM1Control 2...................................................................................................7116.8.15Register CAh PWM1Control 3...................................................................................................7216.8.16Register CBh Special Function PWM1Control 4.......................................................................7216.8.17Register CCh PWM2Control 1...................................................................................................7316.8.18Register CDh PWM2Control 2...................................................................................................7416.8.19Register CEh PWM2Control 3...................................................................................................7516.8.20Register CFh Special Function PWM2Control 4.......................................................................7516.8.21Register D0h–D3h Zone 1to 4Base Temperatures ..................................................................7616.8.22Register D4h–DFh Lookup Table Steps —Zone 1/2and Zone 3/4Offset Temperature ...........7616.8.23Register E0h Special Function TACH to PWM Binding ..............................................................7716.8.24Register E2h LM93Status Control .............................................................................................7816.8.25Register E3h LM93Configuration ...............................................................................................7916.9SLEEP STATE CONTROL AND MASK REGISTERS ..........................................................................8016.9.1Register E4h Sleep State Control ................................................................................................8016.9.2Register E5h S1GPI Mask ...........................................................................................................8116.9.3Register E6h S1Tach Mask .........................................................................................................8116.9.4Register E7h S3GPI Mask ...........................................................................................................8216.9.5Register E8h S3Tach Mask .........................................................................................................8216.9.6Register E9h S3Temperature/Voltage Mask ................................................................................8216.9.7Register EAh S4/5GPI Mask .......................................................................................................8316.9.8Register EBh S4/5Temperature/Voltage Mask ............................................................................8316.10OTHER MASK REGISTERS ...............................................................................................................8416.10.1Register ECh GPI Error Mask .....................................................................................................8416.10.2Register EDh Miscellaneous Error Mask ....................................................................................8416.10.3Register EEh Special Function Zone 1Adjustment Offset .........................................................8516.10.4Register EFh Special Function Zone 2Adjustment Offset .........................................................8517.0Absolute Maximum Ratings .....................................................................................................................8618.0Operating Ratings ...................................................................................................................................8619.0Data Sheet Version History ......................................................................................................................9120.0Physical Dimensions .. (92)L M 93 6LM93 8.0Connection Diagram56Pin TSSOP Array20068202NS Package MTD56Top ViewNS Order Numbers:LM93CIMT(34units per rail),orLM93CIMTX(1000units per tape-and-reel)79.0Pin DescriptionsSymbol Pin #Type FunctionGPIO_0/TACH11Digital I/O (Open-Drain)Can be configured as fan tach input or a general purpose open-drain digital I/O.GPIO_1/TACH22Digital I/O (Open-Drain)Can be configured as fan tach input or a general purpose open-drain digital I/O.GPIO_2/TACH33Digital I/O (Open-Drain)Can be configured as fan tach input or a general purpose open-drain digital I/O.GPIO_3/TACH44Digital I/O (Open-Drain)Can be configured as fan tach input or a general purpose open-drain digital I/O..GPIO_4/P1_THERMTRIP 5Digital I/O (Open-Drain)A general purpose open-drain digital I/O.Can be configured to monitor a CPU’s THERMTRIP signal to mask other errors.GPIO_5/P2_THERMTRIP 6Digital I/O (Open-Drain)A general purpose open-drain digital I/O.Can be configured to monitor a CPU’s THERMTRIP signal to mask other errors.GPIO_67Digital I/O (Open-Drain)Can be used to detect the state of CPU1IERR or a general purpose open-drain digital I/OGPIO_78Digital I/O (Open-Drain)Can be used to detect the state of CPU2IERR or a general purpose open-drain digital I/O VRD1_HOT 9Digital Input CPU1voltage regulator HOT VRD2_HOT 10Digital Input CPU2voltage regulator HOTSCSI_TERM111Digital Input SCSI Channel 1termination fuse.Could also be used as a general purpose input to trigger an error event.SCSI_TERM212Digital Input SCSI Channel 2termination fuse.Could also be used as a general purpose input to trigger an error event.SMBDAT 13Digital I/O (Open-Drain)Bidirectional System Management Bus Data.Output configured as 5V tolerant open-drain.SMBus 2.0compliant.SMBCLK 14Digital Input System Management Bus Clock.Driven by an open-drain output,and is 5V tolerant.SMBus 2.0Compliant.ALERT/XtestOut15Digital Output (Open-Drain)Open-drain ALERT output used in an interrupt driven system to signal that an error event has occurred.Masked error events do not activate the ALERT output.When in XOR tree test mode,functions as XOR Tree output.RESET 16Digital I/O (Open-Drain)Open-drain reset output when power is first applied to the ed as a reset for devices powered by 3.3V stand-by.After reset,this pin becomes a reset input.See section 6.2for more information.AGND 17GROUND Input Analog GroundV REF18Analog Output 2.5V used for external ADC reference,or as a V REF reference voltageREMOTE1−19Remote Thermal Diode_1-Input (CPU 1THERMDC)This is the negative input (current sink)from the CPU1thermal diode.Connected to THERMDC pin of Pentium processor or the emitter of a diode connected MMBT3904NPN transistor.Serves as the negative input into the A/D for thermal diode voltage measurements.A 100pF capacitor is optional and can be connected between REMOTE1−and REMOTE1+.REMOTE1+20Remote Thermal Diode_1+I/O (CPU1THERMDA)This is a positive connection to the CPU1thermal diode.Serves as the positive input into the A/D for thermal diode voltagemeasurements.It also serves as a current source output thatforward biases the thermal diode.Connected to THERMDA pin of Pentium processor or the base of a diode connected MMBT3904NPN transistor.A 100pF capacitor is optional and can be connected between REMOTE1−and REMOTE1+.L M 93 89.0Pin Descriptions(Continued)Symbol Pin#Type FunctionREMOTE2−21Remote ThermalDiode_2-Input(CPU2THERMDC)This is the negative input(current sink)from the CPU2thermal diode.Connected to THERMDC pin of Pentium processor or the emitter of a diode connected MMBT3904NPN transistor.Serves as the negative input into the A/D for thermal diode voltage measurements.A100pF capacitor is optional and can be connected between REMOTE2−and REMOTE2+.REMOTE2+22Remote ThermalDiode_2+I/O(CPU2THERMDA)This is a positive connection to the CPU2thermal diode.Serves as the positive input into the A/D for thermal diode voltage measurements.It also serves as a current source output that forward biases the thermal diode.Connected to THERMDA pin of Pentium processor or the base of a diode connected MMBT3904 NPN transistor.A100pF capacitor is optional and can be connected between REMOTE2−and REMOTE2+.AD_IN123Analog Input(+12V1)Analog Input for+12V Rail1monitoring,for CPU1voltage regulator.External attenuation resistors required such that12V is attenuatedto0.927V.AD_IN224Analog Input(+12V2)Analog Input for+12V Rail2monitoring,for CPU2voltage regulator.External attenuation resistors required such that12V is attenuatedto0.927V.AD_IN325Analog Input(+12V3)Analog Input for+12V Rail3,for Memory/3GIO slots.Externalattenuation resistors required such that12V is attenuated to0.927V.AD_IN426Analog Input(FSB_Vtt)Analog input for1.2V monitoringAD_IN527Analog Input(3GIO/PXH/MCH_Core)Analog input for1.5V monitoring.AD_IN628Analog Input(ICH_Core)Analog input for1.5V monitoring.AD_IN7(P1_Vccp)29Analog Input(CPU1_Vccp)Analog input for+Vccp(processor voltage)monitoring.AD_IN8(P2_Vccp)30Analog Input(CPU2_Vccp)Analog input for+Vccp(processor voltage)monitoring.AD_IN931Analog Input(+3.3V)Analog input for+3.3V monitoring.AD_IN1032Analog Input(+5V)Analog input for+5V monitoring silver box supply monitoring.AD_IN1133Analog Input(SCSI_Core)Analog input for+2.5V monitoring.AD_IN1234Analog Input(Mem_Core)Analog input for+1.969V monitoring.AD_IN1335Analog Input(Mem_Vtt)Analog input for+0.984V monitoring.AD_IN1436Analog Input(Gbit_Core)Analog input for+0.984V S/B monitoring.AD_IN1537Analog Input(-12V)Analog input for-12V monitoring.External resistors required to scaleto positive level.Full scale reading at1.236V.Address Select383level analog input This input selects the lower two bits of the LM93SMBus slaveaddress.LM9399.0Pin Descriptions(Continued)Symbol Pin #TypeFunctionAD_IN1639POWER (V DD )+3.3V standby powerV DD power input for LM93.Generally this is connected to +3.3V standby power.The LM93can be powered by +3.3V if monitoring in low power states is not required,but power should be applied to this input before any other pins.This pin also serves as the analog input to monitor the 3.3Vstand-by (SB)voltage.It is necessary to bypass this pin with a 0.1µF in parallel with 100pF.A bulk capacitance of 10µF should be in the near vicinity.The 100pF should be closest to the power pin.GND 40GROUNDDigital Ground.Digital ground and analog ground need to be tied together at the chip then both taken to a low noise system ground.A voltage difference between analog and digital ground may cause erroneous results.PWM141Digital Output (Open-Drain)Fan control output 1.PWM242Digital Output (Open-Drain)Fan control output 2P1_VID043Digital Input Voltage Identification signal from the processor.P1_VID144Digital Input Voltage Identification signal from the processor.P1_VID245Digital Input Voltage Identification signal from the processor.P1_VID346Digital Input Voltage Identification signal from the processor.P1_VID447Digital Input Voltage Identification signal from the processor.P1_VID548Digital Input Voltage Identification signal from the processor.P1_PROCHOT 49Digital I/O (Open-Drain)Connected to CPU1PROCHOT (processor hot)signal through a bidirectional level shifter.P2_PROCHOT 50Digital I/O (Open-Drain)Connected to CPU2PROCHOT (processor hot)signal through a bi-directional level shifter.P2_VID051Digital Input Voltage Identification signal from the processor.P2_VID152Digital Input Voltage Identification signal from the processor.P2_VID253Digital Input Voltage Identification signal from the processor.P2_VID354Digital Input Voltage Identification signal from the processor.P2_VID455Digital Input Voltage Identification signal from the processor.P2_VID556Digital InputVoltage Identification signal from the processor.The overscore indicates the signal is active low (“Not”).10.0Server TerminologyA/D Analog to Digital Converter ACPI Advanced Configuration and Power InterfaceALERTSMBus signal to bus master that an event occurred that has been flagged for attention.ASF Alert Standard Format BMC Baseboard Micro-Controller BW BandwidthDIMM Dual inline memory module DP Dual-processorECC Error checking and correcting FRU Field replaceable unit FSBFront side busFW Firmware Gb Gigabit GB Gigabyte Gbe Gigabit Ethernet GPIO General purpose I/O HW HardwareI 2C Inter integrated circuit (bus)LAN Local area networkLVDS Low-Voltage Differential Signaling Mb Megabit MB Megabyte MP Multi-processorMTBFMean time between failuresL M 9310。

网口工业面阵相机

修改记录文档版本0120151126新增部分网口相机网口工业面阵相机11产品说明12主要特性13相机技术指标131mvca00330gmgc相机参数指标132mvca00330gmgc响应曲线133mvca01320gm相机参数指标134mvca01320gm响应曲线135mvca01330gmgc相机参数指标136mvca01330gmgc响应曲线137mvca03010gmgc相机参数指标138mvca03010gmgc响应曲线139mvca05020gm相机参数指标1310mvca05020gm响应曲线1311mvca06010gmgc相机参数指标1312mvca06010gmgc响应曲线14相机机械尺寸及接口141相机机械尺寸142接口介绍10143电源和io接口定义10144安装配套10客户端安装1221安装步骤1222关闭防火墙14221防火墙关闭设置14相机安装与操作1531安装步骤1532网络设置15321相机网络参数设置15322本地网络配置1633设置与操作18主要功能描述21网口工业面阵相机41设备管理21411修改设备名称2142图像格式与帧率22421相机数据格式22422帧率24423设置感兴趣区域2443全局曝光和卷帘式曝光25431全局曝光25432卷帘式曝光

i
网口工业面阵相机用户手册
前
言
本节内容的目的是确保用户通过本手册能够正确使用产品或服务，以避免操作中的危险或财产损失。在使用此产品之前，请认真阅读产品手册并妥善保存以备日后参考。
概述
本手册适用于以下型号。产品型号 MV-CA003-30GM MV-CA003-30GC MV-CA013-20GM MV-CA013-20GC MV-CA013-30GM MV-CA013-30GC MV-CE013-50GM MV-CE013-50GC MV-CA030-10GM MV-CA030-10GC MV-CA050-20GM MV-CA050-20GC MV-CA060-10GC MV-CA060-10GM 说明黑白相机彩色相机黑白相机彩色相机黑白相机彩色相机黑白相机彩色相机黑白相机彩色相机黑白相机彩色相机彩色相机黑白相机

M52393FP资料

1MITSUBISHI ICs (AV COMMON)M52393P/FP EDTV2 IDENTIFICATION SIGNAL DETECTOR2MITSUBISHI ICs (AV COMMON)M52393P/FPEDTV2 IDENTIFICATION SIGNAL DETECTOR3TEST CONDITIONSSymbol ParameterSupply voltageSwitch condition 1234567910111416 1-11-2 357 9-19-2 1011-111-212 14-114-214-3I CC1 Circuit current1G G 5 ON a a ON ON a ON a ON V15Clamp voltage G G 5 ON a a ON ON a ON a ON G114dB Amp gain G G 5 ON aa ON ON a ON a ON TRP1TRAP gain1G G 5ON a a ON ON a ON a ON TRP2TRAP gain2G G 5 ON a a ON ON a ON a ON TRP3TRAP gain3G G 5 ON aa ON ON a ON a ON TRP4TRAP gain4G G 5ON a a ON ON a ON a ON SSD Sync sepa. delayG G 5ON a a ON ON a ON a ON SSM Sync sepa. delay at 30%G G 5 ON a a ON ON a ON a ON VSD V sepa. delay G G 5 ON aa ON ON a ON a ON VC1CLAMP1 voltage G G 5ON a a ON ON a ON a ON VC2CLAMP2 voltageG G 5 ON aa ON ON a ON a ON LDI1Driving capacity at Hi 1 0.40.40.42.5 2.5 5 ON a a ON ON a ON a ON LDI2Driving capacity at Hi 2 0.40.40.42.5 2.5 5 ON a a ON ONb ON a ON HDI1Driving capacity at Lo 1 0.40.40.40.5 2.5 5ON a a ON ON a ON a ON HDI2Driving capacity at Lo 2 0.40.40.40.5 2.5 5 ON aa ON ON c ON a ON V2COMP . 1 voltage G G 5 ON aa ON ON a ON a ON V4COMP . 2 voltage G G 5ON a a ON ON a ON a ON V6COMP . 3 voltageG G 5 ON aaON ON aONaONMITSUBISHI ICs (AV COMMON)M52393P/FP EDTV2 IDENTIFICATION SIGNAL DETECTOR4EDTV2 IDENTIFICATION SIGNAL DETECTOR5EDTV2 IDENTIFICATION SIGNAL DETECTOR6EDTV2 IDENTIFICATION SIGNAL DETECTOR7METHOD OF DETECTIONA line part (refer to Fig.1)An EDTV2 ID is inserted into the line 22 (line 285), therefore the IC detects during 3lines (including before and after 2 lines of the line 22). A ﬁeld contains the ID signal in its appropriate lines, whitch results in an EDTV2 signal.In a case the ID signal is detected a couple of times during three lines, a signal is regarded as a standard signal not an EDTV2considering the correlation between 2 or 3 lines (pin 7 is grounded).On the other hand, the line correlation is off by opening the pin 7. In this case, the signal is regerded as an EDTV2 even though the ID signal is detected a couple of times during the three lines.A ﬁeld part (refer to Fig.2)In a case the ID signal is detected in 8 consecutive ﬁelds, a signal is regarded as an EDTV2 one and the pin 9 outputs high. However it can not be detected consecutivelly, a signal is not an EDTV2 one and the pin 9 is low. Detecting timing is varied in following 2 modes.A ﬁeld modeThe pin 10 is opened (2.5V). The detection is performed once a ﬁeld. It takes more than 133ms (4 frames) for the distinction.A frame modeThe pin 10 is grounded (0V). The detection is performed once a frame; once a Odd ﬁeld or once a Even ﬁeld. It takes more than 267ms (8 frames) for the distinction.Note: The alternatvie of Odd or Even ﬁeld is difﬁcult because of no ﬁeld distinction.EDTV2 IDENTIFICATION SIGNAL DETECTOR8EDTV2 IDENTIFICATION SIGNAL DETECTOR9EDTV2 IDENTIFICATION SIGNAL DETECTOR10EDTV2 IDENTIFICATION SIGNAL DETECTOREDTV2 IDENTIFICATION SIGNAL DETECTOREDTV2 IDENTIFICATION SIGNAL DETECTOREDTV2 IDENTIFICATION SIGNAL DETECTOREDTV2 IDENTIFICATION SIGNAL DETECTOREDTV2 IDENTIFICATION SIGNAL DETECTOR。

手机插件.wps

3G Unrestrictor让只能连接wifi才能2.3.1-1 兼容工作的程序，使用3g/edge/gprs。

60 Second Lock Screen 时间有限待1.0 兼容更新Action Menu 一款复制粘贴菜单强化插件，集成了iPhone上多个应用程序1.2.5 兼容的功能，例如历史记录（History），搜索（Lookup）和Twitter 历史记录Action Menu Plus Pack Action Menu增强组件，增加快速网络搜索、黏贴历史、生成、发布twitter等1.2.3 兼容功能ActionBoard 时间有限待更新 1.2.0-1 兼容Activator 可以通过手势来模拟一些操作，如home键，锁屏键等等。

也可以1.5.7 兼容将手势设置为某个程序的开启AdBlocker 非常有效的网页广告*****AdBlocker ios版 1.30 兼容afc2add afc2add和afc2 是IOS系统的1.01 兼容服务补丁，都是USB兼容补丁Airplane SBSettings SBSETTINGS按2.1 兼容钮，随时进入飞行模式ios4 4.1兼容Airserver 它可以让您mac-ios，ios-mac之间流化播放视频、音乐（mac端需要客户端），还可让您ios与ios设备之1.0 兼容间使用，可以让您播放视频、照片（幻灯片）、音乐！Alarming 无论您设置了多高的音量，闹钟到时间后，它会自动帮你把声音调节到最大，您关闭闹钟后音量会自1.2 兼容己恢复AllMail批量将收件箱邮件标记为已1.2-1 兼容读、未读或者密码加密等等..AndroidLock XT 模仿android滑动轨 2.4 兼容迹解锁的方式。

既可以炫机，又增加了手机安全性。

Any Attach 时间有限待更新 1.0-3 兼容APN Editing 编辑APN 1.0 兼容App Switcher Brightness 在后台控制条处添加屏幕亮度控制条，跟音量控1.2 兼容制条在一页（最左侧）App Switcher Rotator 当您旋转屏幕时1.3 兼容打开后台后台程序图标也会跟着旋转AppBackup 它可以备份您机器上的2.0.2-1 兼容app（ipa），兼容5.0.1Ap pCake 类似于installoue，从.在线获取破解ipa，在线下载破解ipa，在1.1 兼容线安装AppLinks ipa安装后都会随机生成代码，安装此工具可以创建软件链接到。

F18 大黄蜂战斗机中文手册 GPS制导

AGM-84H SLAM-ER/AGM-154 JSOW/GBU-29/30/31 JDAM GPS 制导武器这三个系列的武器都使用最新的全球定位系统制导系统，同时也具有非常类似的HUD/SMS显示和控制。

AGM-84H SLAM-ER 是最初基于捕鲸叉反舰导弹的防区外攻击导弹的升级版本。

“ER”代表扩大的反应，这就意味着它比最初的SLAM型号具有更大的射程和准确性。

AGM-154 联合防区外武器（JSOW）被定于代替美国空军的GBU-15 和AGM-130 页就是美国海军的Walleye。

它是一种固定使用1000磅GP战斗部或集束子弹头的滑翔类武器。

GBU29/30/31联合直接攻击弹（JDAM）一个可使用1000和2000磅GP战斗部或2000磅渗透战斗部的武器家族。

JDAM被用于铺路石系列激光制导炸弹系列的补充武器，并总有一天将完全取代这个系列的武器。

GPS 制导武器HUD 符号这些武器的各个类型都使用相同基础的HUD符号：×上升操作线(仅在SLAM-ER)：上升操作线提供到达选择的发射投放高度的提示。

×方位操作提示：方位操作提示提供一个相对于指定目标的最佳发射点的操作。

×在域提示：指出选择的武器发射符合的所有条件，和下面在GPS制导武器SMS MDI页面中描述的相同。

×武器选择/状态指示：在这个位置显示选择的武器类型。

×到达发射点的时间(TTLP)：TTLP指出到达选择的武器的理想发射点的时间。

如果计算的TTLP 超过99 秒，那么显示将限制在99 秒直到TTLP 变得小于99 秒。

×到发射点距离(LP)：以海浪表示的到达理想发射点的距离。

GPS 制导武器SMS（挂载）MDI 页面符号这些武器的各个挂载页面选项基于捕鲸叉挂载页面格式，彼此之间非常类似。

60×程序选择(PROG)：这个选项按次序在各个可用的程序之间轮流。

XP143 Specification-Chinese

φ0 .7 φ1 .0 φ1 .3 φ1 .8 φ2 .5 φ3 .7
φ5 .0
对应于吸嘴尺寸φ0.37～φ2.5mm ３）吸嘴配置的限制
对应于吸嘴尺寸φ3.7～φ5.0mm
吸嘴 N o .4
吸嘴 N o .1 吸嘴 N o .10
吸嘴 N o .7
对于中型对应吸嘴φ3.7，φ5.0，安装位置有限制。（安装位置:吸嘴No.1,4,7,10）
５．选项
5.1 选项 ____________________________________________ 13
６．机器外观
6.1 外观图 __________________________________________ 14 Spec1（前后MFU-X10E类型） ___________________________ 14
学习MSA影像处理后可以以强有力的图形匹配对所有的特殊元件方便地进行影像处理
查找线
＜创建模板例＞
MSA的影像处理程序不是直接参考物理像素，而是根据虚拟影像画面，可以在任意的位置、角度进行影像处理以达到高解析度以及高精度。
-2-
XP143-020505RS
1. 概要
1.2.3 高生产率
１）由于采用了独特的“ON-THE-VISION”系统和旋转工作头，实现了以周期时间0.165秒进行贴装。此外，不像原来的多吸嘴机型那样要以同时吸取作为前提条件，减少了因电路板的种类和元件种类的不同而产生的运转率的变动。可以保持高的生产量。
1.2.6 与需求相对应的规格选择
在供料平台上，可以选择可以脱卸的MFU-X10E类型或者固定类型。更进一步，可以选择Side1，Side2的双供料平台的规格，或者是仅仅Side1的单供料平台的规格。可以从以下6种类型中选择类型。