HSMD-C670中文资料

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ATT7022中文资料

2、引脚描述引脚标识 1 RESET 2 SIG
3,4 6,7 9,10 5 11 13,14 16,17 19,20 24 26 27
V1P/V1N V3P/V3N V5P/V5N REFCAP REFOUT V2P/V2N V4P/V4N V6P/V6N TEST SEL CF1
28
CF2
35 36 37 38 40
RESET 1 SIG V1P V1N
2 3 4
33 VDD 32 NC 31 NC 30 NC
REFCAP 5 V3P 6 V3N AGND V5P
7 8 9
ATT7022
29 NC 28 CF2 27 CF1 26 SEL 25
NC
V5N 10 REFOUT 11
12 13 14 15 16 17 18 19 20 21 22
24 TEST 23 GND
A V C C
V V 2 2 P N
A V V G 4 4 N P N D
A V C C
V 6 P
V 6 N
N C
N C
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珠海炬力集成电路设计有限公司
Actions Semiconductor Co., Ltd.
时间
复位
运行
复位
片内电源监控特性 §2.2 模数转换 ATT7022 片内集成了 6 路 16 位的 ADC，采用双端差分信号输入。最大输入电压是 1.5v，即可以输入最大的正弦信号有效值是 1v。建议将电压通道 Un 对应到 ADC 的输入选在 0.5v 左右，而电流通道 Ib 时的 ADC 输入选在 0.1v 左右。 ADC 内部结构图：
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7N70中文资料

7N70L-TF3-T (1)Packing Type (2)Package Type (3)Lead Plating (1) T: Tube (2) TF3: TO-220F (3) L: Lead Free Plating , Blank: Pb/Sn
Copyright © 2005 Unisonic Technologies Co., Ltd
Power MOSFET
RATINGS UNIT 700 V ±30 V TC = 25°C 7.0 A Continuous Drain Current ID TC = 100°C 4.7 A Drain Current Pulsed (Note 1) IDM 28 A Avalanche Energy, Single Pulsed (Note 2) EAS 530 mJ Avalanche Energy, Repetitive, Limited by TJMAX EAR 14.2 mJ Peak Diode Recovery dv/dt (Note 3) dv/dt 4.5 V/ns Power Dissipation (TC = 25°C) PD 142 W Junction Temperature TJ +150 Storage Temperature TSTG -55 ~ +150 Note Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied.

ADM706中文资料

元器件交易网
ADM705–ADM708–SPECIFICATIONS (V
Parameter VCC Operating Voltage Range Supply Current Reset Threshold Reset Threshold Hysteresis Reset Pulsewidth RESET Output Voltage Min 1.0 190 4.5 4.25 160 VCC – 1.5 4.65 4.40 40 200 Typ Max 5.5 250 4.75 4.50 280 0.4 0.3 0.3 RESET Output Voltage Watchdog Timeout Period (tWD) WDI Pulsewidth (tWP) WDI Input Threshold Logic Low Logic High WDI Input Current WDO Output Voltage MR Pull-Up Current MR Pulsewidth MR Input Threshold MR to Reset Output Delay PFI Input Threshold PFI Input Current PFO Output Voltage
元器件交易网
a
FEATURES Guaranteed RESET Valid with VCC = 1 V 190 ␮A Quiescent Current Precision Supply-Voltage Monitor 4.65 V (ADM705/ADM707) 4.40 V (ADM706/ADM708) 200 ms Reset Pulsewidth Debounced TTL/CMOS Manual Reset Input ( MR) Independent Watchdog Timer—1.6 sec Timeout (ADM705/ADM706) Active High Reset Output (ADM707/ADM708) Voltage Monitor for Power-Fail or Low Battery Warning Superior Upgrade for MAX705–MAX708 Also Available in MicroSOIC Packages APPLICATIONS Microprocessor Systems Computers Controllers Intelligent Instruments Critical ␮ P Monitoring Automotive Systems Critical ␮ P Power Monitoring GENERAL DESCRIPTION

HSD669A中文资料

• Maximum TemperaturesStorage Temperature............................................................................................ -55 ~ +150 °C Junction Temperature.....................................................................................+150 °C Maximum • Maximum Power DissipationTotal Power Dissipation (Ta=25°C)....................................................................................... 1 W Total Power Dissipation (Tc=25°C)..................................................................................... 20 W • Maximum Voltages and CurrentsBVCBO Collector to Base Voltage..................................................................................... 180 V BVCEO Collector to Emitter Voltage.................................................................................. 160 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current (DC) .................................................................................................. 1.5 A IC Collector Current (Pulse) ................................................................................................. 3 A Electrical Characteristics (Ta=25°C)Symbol Min.Typ.Max.Unit Test ConditionsBVCBO180--V IC=1mA, IE=0BVCEO160--V IC=10mA, IB=0BVEBO5--V IE=1mA, IC=0ICBO--10uA VCB=160V, IE=0*VCE(sat)--1V IC=500mA, IB=50mAVBE(on)-- 1.5V IC=150mA, VCE=5V*hFE1100-320IC=150mA, VCE=5V*hFE230--IC=500mA, VCE=5VfT-140-MHz IC=150mA , VCE=5VCob-14-pF VCB=10V, f=1MHz, IE=0*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE1Rank C DRange100-200180-320Page No. : 2/3 Characteristics CurvePage No. : 3/3TO-126ML Dimension*: TypicalInches MillimetersInches MillimetersDIM Min.Max.Min.Max.DIM Min.Max.Min.Max.A 0.13560.1457 3.44 3.70I-*0.1795-*4.56B 0.01700.02720.430.69J 0.02680.03310.680.84C 0.03440.04440.87 1.12K 0.55120.590614.0015.00D 0.05010.0601 1.27 1.52L 0.29030.30037.377.62E 0.11310.1231 2.87 3.12M 0.13780.1478 3.50 3.75F 0.07370.0837 1.87 2.12N 0.15250.1625 3.874.12G 0.02940.04940.74 1.25O0.07400.0842 1.88 2.14H0.04620.0562 1.17 1.42Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.2.Controlling dimension: millimeters.3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.Material:• Lead: 42 Alloy; solder plating• Mold Compound: Epoxy resin family, flammability solid burning class: L94V-0Important Notice:• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.• HSMC reserves the right to make changes to its products without notice.• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.Head Office And Factory:• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931。

翟中和细胞生物学(2012版)配套习题

1。

翟中和王喜忠丁明孝主编细胞生物学高教出版社2000，2。

韩贻仁细胞生物学高教出版社1987；以上两书的课后习题或思考题，我根据2003年和2004年北大细胞生物学讲课内容作了挑选和改编。

3。

以前在OKHERE上的生物版主也就是我的前任------------"心象椰子的人"（他在我就任前就已辞辞职，但是他的贴仍然给我和其他人很多帮助，不过，很快我就知道他为何要件决辞职了，因为一年后，我也做了同样的选择首发的北大一个ftp的细胞生物学库，该细胞生物学库是按题型而非章分类的，我把它的内容按翟中和王喜忠丁明孝主编细胞生物学高教出版社2000重新作了分类。

4。

英文习题与解答来自的NCBI一本网书，我把它的内容按翟中和王喜忠丁明孝主编细胞生物学高教出版社2000重新作了分类，很遗憾，该书的名字作者与出版社，我已记录了，但是一下没找到，我尽快找到，仅快找到将其补上，非常感谢该书作者和出版社！5。

我在OKHERE当生物斑竹时有关网友提出与讨论的问题，很多我也参加了。

6。

有关的生物化学，分子生物学，细胞生物学试题。

对以上各种资料的作者和首发者，我均非常感谢！而且整理和编辑，我也化了不少时间，而且最后排版时我还化了100元RMB。

因此，本题集不准许用于商业用途！转载应说明出处，谢谢！------------------------------------------------------------------------------------------第一章：绪论1、填空题：1、细胞生物学是细胞整体、超微结构和分子水平上研究及其规律的科学。

、2、名词解释：1、细胞学说（cell theory）3、选择题：1、现今世界上最有影响的学术期刊是。

a：Natuneb: Cellc: PNASd: Science2、自然界最小的细胞是（a）病毒（b）支原体（c）血小板（d）细菌4、是非题：1、现代细胞生物学的基本特征是把细胞的生命活动和亚细胞的分子结构变化联系起来。

HSC277中文资料

HSC277Silicon Epitaxial Planar Diode for UHF/VHF tuner Band SwitchADE-208-413 (Z)Rev. 0Dec. 1995 Features• Low forward resistance. (r f = 0.7max)• U l tra small F l at P a ckage (UFP) is suitable for surface mount design.Ordering InformationType No.Cathode Mark Package CodeHSC277Laser UFPOutlineAbsolute Maximum Ratings (Ta = 25°C)Item Symbol Value Unit35VReverse voltage VRJunction temperature Tj125°CPower dissipation Pd150mWOperation temperature Topr–20 to +60°CStorage temperature Tstg–45 to +125°CHSC2772Electrical Characteristics (Ta = 25°C)ItemSymbol Min Typ Max Unit Test Condition Reverse voltage V R 35——V I R = 10µA Reverse current I R ——50µA V R = 25V Forward voltage V F —— 1.0V I F = 10mA Capacitance C —— 1.2pF V R = 6V, f = 1MHz Forward resistancer f——0.7ΩI F = 2mA, f = 100MHzFig.1 Forward current Vs. Forward voltageHSC277Fig.2 Reverse current Vs. Reverse voltageFig.3 Capacitance Vs. Reverse voltage3HSC277Fig.4 Forward resistance Vs. Forward current 4HSC277 Package Dimensions5Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。

FPGA可编程逻辑器件芯片XC7VX690T-2FF1158C中文规格书

7Series FPGAs Data Sheet: OverviewDS180 (v2.6.1) September 8, 2020Product SpecificationStacked Silicon Interconnect (SSI) TechnologyThere are many challenges associated with creating high capacity FPGAs that Xilinx addresses with the SSI technology. SSI technology enables multiple super logic regions (SLRs) to be combined on a passive interposer layer, using proven manufacturing and assembly techniques from industry leaders, to create a single FPGA with more than ten thousand inter-SLR connections, providing ultra-high bandwidth connectivity with low latency and low power consumption. There are two types of SLRs used in Virtex-7 FPGAs: a logic intensive SLR used in the Virtex-7 T devices and a DSP/blockRAM/transceiver-rich SLR used in the Virtex-7 XT and HT devices. SSI technology enables the production of highercapability FPGAs than traditional manufacturing methods, enabling the highest capacity and highest performance FPGAs ever created to reach production more quickly and with less risk than would otherwise be possible. Thousands of super long line (SLL) routing resources and ultra-high performance clock lines that cross between the SLRs ensure that designs span seamlessly across these high-density programmable logic devices.CLBs, Slices, and LUTsSome key features of the CLB architecture include:•Real 6-input look-up tables (LUTs)•Memory capability within the LUT •Register and shift register functionalityThe LUTs in 7 series FPGAs can be configured as either one 6-input LUT (64-bit ROMs) with one output, or as two 5-input LUTs (32-bit ROMs) with separate outputs but common addresses or logic inputs. Each LUT output can optionally be registered in a flip-flop. Four such LUTs and their eight flip-flops as well as multiplexers and arithmetic carry logic form a slice, and two slices form a configurable logic block (CLB). Four of the eight flip-flops per slice (one per LUT) can optionally be configured as latches.Between 25–50% of all slices can also use their LUTs as distributed 64-bit RAM or as 32-bit shift registers (SRL32) or as two SRL16s. Modern synthesis tools take advantage of these highly efficient logic, arithmetic, and memory features.Clock ManagementSome of the key highlights of the clock management architecture include:•High-speed buffers and routing for low-skew clock distribution •Frequency synthesis and phase shifting •Low-jitter clock generation and jitter filteringEach 7series FPGA has up to 24 clock management tiles (CMTs), each consisting of one mixed-mode clock manager (MMCM)and one phase-locked loop (PLL).Table 11:Virtex-7 HT FPGA Device-Package Combinations and Maximum I/Os Package (1)FLG1155FLG1931FLG1932Size (mm)35 x 3545 x 4545 x 45Ball Pitch1.0 1.0 1.0DeviceGTH GTZ I/O GTH GTZ I/O GTH GTZ I/O HP (2)HP (2)HP (2)XC7VH580T248400488600XC7VH870T 7216300Notes:1.All packages listed are Pb-free with exemption 15. Some packages are available in Pb option.2.HP = High-performance I/O with support for I/O voltage from 1.2V to 1.8V.7Series FPGAs Data Sheet: OverviewMixed-Mode Clock Manager and Phase-Locked LoopThe MMCM and PLL share many characteristics. Both can serve as a frequency synthesizer for a wide range of frequencies and as a jitter filter for incoming clocks. At the center of both components is a voltage-controlled oscillator (VCO), which speeds up and slows down depending on the input voltage it receives from the phase frequency detector (PFD).There are three sets of programmable frequency dividers: D, M, and O. The pre-divider D (programmable by configuration and afterwards via DRP) reduces the input frequency and feeds one input of the traditional PLL phase/frequency comparator. The feedback divider M (programmable by configuration and afterwards via DRP) acts as a multiplier because it divides the VCO output frequency before feeding the other input of the phase comparator. D and M must be chosen appropriately to keep the VCO within its specified frequency range. The VCO has eight equally-spaced output phases (0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315°). Each can be selected to drive one of the output dividers (six for the PLL, O0 to O5, and seven for the MMCM, O0 to O6), each programmable by configuration to divide by any integer from 1 to 128. The MMCM and PLL have three input-jitter filter options: low bandwidth, high bandwidth, or optimized mode. Low-bandwidth mode has the best jitter attenuation but not the smallest phase offset. High-bandwidth mode has the best phase offset, but not the best jitter attenuation. Optimized mode allows the tools to find the best setting.MMCM Additional Programmable FeaturesThe MMCM can have a fractional counter in either the feedback path (acting as a multiplier) or in one output path. Fractional counters allow non-integer increments of 1/8 and can thus increase frequency synthesis capabilities by a factor of 8.The MMCM can also provide fixed or dynamic phase shift in small increments that depend on the VCO frequency. At 1600MHz, the phase-shift timing increment is 11.2ps.Clock DistributionEach 7series FPGA provides six different types of clock lines (BUFG, BUFR, BUFIO, BUFH, BUFMR, and the high-performance clock) to address the different clocking requirements of high fanout, short propagation delay, and extremely low skew.Global Clock LinesIn each 7series FPGA (except XC7S6 and XC7S15), 32 global clock lines have the highest fanout and can reach every flip-flop clock, clock enable, and set/reset, as well as many logic inputs. There are 12 global clock lines within any clock region driven by the horizontal clock buffers (BUFH). Each BUFH can be independently enabled/disabled, allowing for clocks to be turned off within a region, thereby offering fine-grain control over which clock regions consume power. Global clock lines can be driven by global clock buffers, which can also perform glitchless clock multiplexing and clock enable functions. Global clocks are often driven from the CMT, which can completely eliminate the basic clock distribution delay.Regional ClocksRegional clocks can drive all clock destinations in their region. A region is defined as an area that is 50 I/O and 50 CLB high and half the chip wide. 7series FPGAs have between two and twenty-four regions. There are four regional clock tracks in every region. Each regional clock buffer can be driven from any of four clock-capable input pins, and its frequency can optionally be divided by any integer from 1 to 8.I/O ClocksI/O clocks are especially fast and serve only I/O logic and serializer/deserializer (SerDes) circuits, as described in theI/O Logic section. The 7series devices have a direct connection from the MMCM to the I/O for low-jitter, high-performance interfaces.DS180 (v2.6.1) September 8, 2020Product Specification。

Winding_CN_AC338乌斯特电清

术语，缩写系统描述安全规范结构和功能试车维护故障诊断停止操作和贮藏包装和运输布置备件
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感谢您选择 USTER® QUANTUM 2 清纱器，该清纱器能满足您对高品质和高性能的需求！, . 这种新一代清纱器具有四个很重要的优点:
生产率: 高效率保质保量精确清纱。 . 精确度: 使用世界上最先进传感器技术和微电子技术进行高效检测和清纱！可靠性: 在仅有的 2 个组件：检测头和控制箱中，采用了经充分筛选的、低故障率的并具有高使用寿命的元器件。
清纱功能1cmn通道28cms通道28cml通道28细节t通道28清除花色纱nsl竹节功能30启动时的支数偏差c通道31生产中连续的支数偏差cc通道31pc通道31捻结时损失的包覆层纱线cy通道31在浅色纱线中的深色异纤fd通道32在深色纱线中的浅色异纤fl通道32植物纤维veg过滤器34丙纶丝pp通道35机器监控

HT-IDE3000 Holtek C语言编程指南(中文)

语言的程序结构 C
......................................................................................2
语句 ......................................................................................................2
注释 ......................................................................................................2
标识符..........................................................................................................3
逻辑运算符 ..........................................................................................8
位运算符 ..............................................................................................8
常量 ....................................................................................................28
HT-IDE3000 Holtek C 语言编程指南 Ver 1.1

HSMS-C670中文资料

1-212HSurface Mount Chip LEDs Technical DataHSMX-C650HSMX-C670HSMF-C655Features• Small Size• Industry Standard Footprint • Low Profile• Tinted, Diffused Optics • Compatible with IR Solder Process• Five Colors and Bicolor Available• Available in 8 mm Tape on 7" (178 mm) Diameter Reelstinted diffused optics. The bicolor package is untinted,diffused.The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. They are compatible with IR reflow soldering processes.Device Selection GuideDHHigh Bicolor Footprint AlGaAs EfficiencyHER-(mm)Red Red Orange Yellow Green Green3.20 x 1.60HSMH-C650HSMS-C650HSMD-C650HSMY-C650HSMG-C6502.00 x 1.25HSMH-C670HSMS-C670HSMD-C670HSMY-C670HSMG-C6703.20 x 2.70HSMF-C6555964-9360EApplications• Push-Button Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel IndicatorDescriptionThese single and bicolor LEDs are designed in an industry standard package for ease of handling and use. Five different LED colors are available in two compact, low profile, single color packages. The 3.2 x 1.6 mm is an excellent all around package,and the small 2.0 x 1.25 mm package is designed for applica-tions where space is limited.The single color LEDs have[1210]HSMX-C650 Series[1206]HSMX-C670 Series[805]CATHODE MARK0.40(0.016)CATHODE MARK0.501.60(0.063)POLARITY2.70(0.106)1.40(0.055)R 0.25(0.010)GREENRED1-213Absolute Maximum Ratings at T A = 25°CHSMX-C650Parameter HSMF-C655HSMX-C670Units DC Forward Current[1]2520mA Power Dissipation6550mW Reverse Voltage (I R = 100 µA)55VLED Junction Temperature9595°C Operating Temperature Range-25 to +80-25 to +80°C Storage Temperature Range-30 to +85-30 to +85°C Soldering Temperature See SMT reflow soldering profile, Figure 6Notes:1. Derate linearly as shown in Figure 4 for temperatures above 25°C.Optical Characteristics at T= 25°C1. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern which may not be aligned with themechanical axis of the lamp package.2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.4. Chip LEDs are supplied in 8 mm embossed tape on 178 mm (7 in.) diameter reels, with 3000 devices per reel. Minimum orderquantity and order incremenets are in quantity of reels only.1-2141-215Electrical Characteristics at T= 25°CFigure 1. Relative Intensity vs. Wavelength.R E L A T I V E I N T E N S I T Y1.00.51-216Figure 2. Forward Current vs. Forward Voltage.302010V – FORWARD VOLTAGE – V FI – F O R W A R D C U R R E N T – m AF 25155Figure 3. Relative Luminous Intensity vs. DC ForwardCurrent.Figure 4. Maximum DC Current vs. Ambient Temperature.Figure 5. Intensity vs. Angle.T – AMBIENT TEMPERATURE – °C A0510152025303540I – F O R W A R D C U R R E N T – m AF9080°N O R M A L I Z E D I N T E N S I T YI – DC FORWARD CURRENT – mA DC0.20.40.60.81.01.21.41.6R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )1-217Figure 6. Recommended SMT Reflow Soldering Profile.Figure 7. Recommended Solder Patterns.Figure 8. Reeling Orientation.Figure 9. Reel Dimensions.(0.043)HSMF-C655 SERIESHSMX-C670 SERIESHSMX-C650 SERIES230°C MAX.10 SEC. MAX.4°C/SEC. MAX.OVER 2 MIN.TIMET E M P E R A T U R E4°C/SEC. MAX.140-160°C.-3°C/SEC. MAX.NOTE:ALL DIMENSIONS IN MILLIMETERS (INCHES).1-218Figure 11. Tape Leader and Trailer Dimensions.Figure 10. Tape Dimensions.。

HSMB-CXXX中文资料

HSMB-C190, HSMB-C170, HSMB-C110, HSMB-C150, HSMB-C191Device Selection GuideFootprint (mm) SiC Blue Parts Per Reel 2.00 x 1.25 HSMB-C170 40001.60 x 0.80 HSMB-C190/C191 40003.20 x 1.00[1] HSMB-C110 30003.20 x 1.60 HSMB-C1503000Note:1.Right-angle package.CAUTION: HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.HSMB-CxxxSurface Mount Chip LEDsData SheetFeatures• Small Size• Industry Standard Footprint • Compatible with IR Solder • Diffused Optics• Operating Temperature Range of –30°C to +85°C • Right Angle Package Available • SiC Blue Color•Available in 8 mm Tape on 7" (178 mm) Diameter ReelsApplications• Keypad Backlighting• Push-Button Backlighting • LCD Backlighting • Symbol Backlighting •Front Panel IndicatorDescriptionThese Blue chip LEDs are designed in an industry standard package for ease of handling and use. Blue color chip LED is a new product that offers color differentiation for backlighting applications.The HSMB-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMB-C170 has the widely used 2.0 x 1.25 mm footprint. The HSMB-C190 and HSMB-C191 have the industry standard 1.6 x 0.8 mm footprint, and their low profiles (0.8 mm for HSMB-C190 and 0.6 mm for HSMB-C191) and wide view-ing angles make these LEDs exceptional for backlighting applications.The HSMB-C110 is a right-angle package with the univer-sally accepted dimensions of 3.2 x 1.0 x 1.5 mm. T his part is ideal for LCD backlighting and sidelighting applications.All packages are compatible with IR reflow solder pro-cesses. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium.Package DimensionsHSMB-C190HSMB-C170HSMB-C110HSMB-C150TERMINALTERMINAL0.50 ± 0.2TERMINALTERMINALHSMB-C110HSMB-C191NOTE:1. ALL DIMENSIONS IN MILLIMETERS (INCHES).2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.Absolute Maximum Ratings at T A =25°CParameter HSMB-C190/C170/C110/C150/C191 Units DC Forward Current [1] 20 mA Peak Pulsing Current [2] 100 mA Power Dissipation 92 mW Reverse Voltage (I R = 100 µA) 5 V Maximum LED Junction Temperature 95 °C Operating Temperature Range -30 to +85 °C Storage Temperature Range -40 to +85 °CSoldering Temperature See reflow soldering profile (Figure 7 & 8)N otes:1. Derate linearly as shown in Figure 4 for temperature above 25°C.2. Pulse condition of 1/10 duty and 0.1 msec. width.TERMINALLight Intensity (Iv) Bin Limits [1]Intensity (mcd) Intensity (mcd) Bin ID Min. Max. Bin ID Min. Max. A 0.11 0.18 N 28.50 45.00 B 0.18 0.29 P 45.00 71.50 C 0.29 0.45 Q 71.50 112.50 D 0.45 0.72 R 112.50 180.00 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00M 18.00 28.50 Optical Characteristics at T A =25°CLuminousPeakDominant Viewing Intensity [1]Wavelength Wavelength Angle 2θ1/2 Part No.ColorI v (mcd) @ 20 mA λpeak (nm) λd (nm) (degrees)[2]Min. Typ. Typ. Typ. Typ. C190/C170/ C150/C191 HSMB-C110 SiC Blue1.806.5428466130N otes:1. The luminous intensity, I v , is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package.2. u 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.Electrical Characteristics at T A =25°CReverseForward Voltage Breakdown Thermal Capacitance C V F (Volts) V R (Volts) Resistance (pF) @ V F = 0 V, Part No. @ I F = 20 mA @ I R = 100 µAR θJ-P (°C/W) f = 1 MHz Typ. Max. Min. Typ. Typ. HSMB-C190/C170/C150/C191 3.8 4.6 5 300 67HSMB-C110 3.8 4.6530067Note:1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently avail-able bins.Tolerance: ±1 nmNote:1. Bin categories are established for class-ification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins.Blue Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0V F Tolerance: ±0.1 VTolerance: ±15%Figure 1. Relative Intensity vs. Wavelength.Figure 3. Relative Luminous Intensity vs. Forward Current.Figure 4. Maximum Forward Current vs. Ambient Temperature.Figure 5. Relative Intensity vs. Angle for HSMB-C110.Figure 2. Forward Current vs. Forward Voltage.21001010.13.0 3.2 3.6 3.84.0V F – FORWARD VOLTAGE – V I F – F O R W A R D C U R R E N T – m A3.4051525I F – FORWARD CURRENT – mA0.41.01.2R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )HSMB-C190 fig 3200.60.20.81002502060801005I F M A X . – M A X I M U M F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °C40HSMB-C190 fig 4151020380100058068020R E L A T I V E I N T E N S I T Y –%WAVELENGTH – nm480HSMB-C190 fig 1604080R EL AT I V E I N T E N S I T Y – %ANGLEHSMB-C190 fig 5bR E L A T I V E I N T E N S I T Y – %ANGLEFigure 6. Relative Intensity vs. Angle for HSMB-C170, HSMB-C190, HSMB-C150, and HSMB-C191.Figure 9. Recommended Soldering Pattern for HSMB-C170.Figure 10. Recommended Soldering Pattern for HSMB-C190 and C191.Figure 11. Recommended Soldering Pattern for HSMB-C110.Figure 8. Recommended Pb-free Reflow Soldering Profile.Note:1. All dimensions in millimeters (inches).(0.035)HSMB-C190 fig 80.8(0.028)HSMB-C190 fig 9HSMB-C190 fig 6R E L A T I V E I N T E N S I T Y – %1000ANGLE806050702010304090-70-50-3002030507090-90-20-80-60-40-1010406080Figure 7. Recommended reflow soldering profile.(Acc. to J-STD-020C)TIMET E M P E R A T U R E(0.059)(0.059)(0.079)HSSM-C110 fig 87T E M P E R A T U R ENote:1. All dimensions in millimeters (inches).Figure 13. Reeling Orientation.Figure 12. Recommended Soldering Pattern for HSMB-C150.(0.059)(0.059)(0.079)HSMX-C190 fig 8Figure 16. Tape Leader and Trailer Dimensions.Notes:1. All dimensions in millimeters (inches).2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.fig 14ENDSTARTSEALED WITH COVER TAPE.SEALED WITH COVER TAPE.OF CARRIER AND/ORCOVER TAPE.For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0417EN AV02-0613EN - July 27, 2007Reflow Soldering:For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components.Storage Condition: 5 to 30°C @ 60%RH max.Baking is required before mounting, if:1. Humidity Indicator Card is > 10% when read at 23 ± 5°C.2. Device expose to factory conditions <30°C/60%RH more than 672 hours.Recommended baking condition: 60±5°C for 20 hours.。

北美h6600中文使用手册

本中文译本仅供参考，如有歧义，以原英文版本为准。

目录第一章系统简介 (3)概述 (3)技术参数 (4)第二章控制放大器的安装与接线 (5)控制放大器的固定 (5)控制放大器接线 (5)驱动电机或伺服阀的接线 (5)探测器的接线 (5)液压锁定装置( 电磁阀’C’ ) 或电机制动器的接线 (6)警报器的接线 (6)外接测量仪表的接线 (6)远程安装带材置偏仪的接线 (6)纠偏辊置中或位置反馈传感器的接线 (6)电源连接 (6)AC接线端子 (7)DC接线端子 (8)电源 (9)伺服阀调零（仅电液伺服控制式纠偏系统适用） (9)第三章初始设定 (10)探测器的选择和标定 (10)H3109探测器的标定过程举例 (10)纠偏方向确认 (11)第四章系统的操作和运行模式 (12)自动控制模式 (12)手动控制模式 (12)纠偏辊置中控制模式 (12)H6600显示屏 (13)H6600按键说明 (15)H6600内部控制功能 (15)保险丝盒 (15)开关及其调节旋钮 (15)发光二极管 (16)优化系统功能的操作 (16)调节PID控制回路 (16)调节北美伺服阀的颤幅 (17)手动及自动控制速度的调节 (17)零点（纠偏基准点）的调节 (17)带材置偏仪的调节 (17)在带材一边同时安装两个探测器时的设定 (18)第五章探测器的标定 (19)探测器的选择和标定 (19)H3109,H3176,H3144,H3177,H3111和H3300探测器的标定 (19)H3167-300探测器的标定 (20)H3118,H3119,H3134,H3135,H3166,H3700或其它输出为1电压信号的传感器/探测器的选定 (20)H6600内部电压表功能的使用 (21)第六章系统功能设置菜单说明 (22)系统设置 (22)H6600系统设置菜单 (22)第七章H6600系统工作原理 (29)H6600系统的组成 (29)H6600电子控制器 (29)探测器 (29)带材置偏控制仪 (30)H6600一般工作方式 (30)H6600的控制原理 (31)PID控制回路 (32)纠偏辊架位置反馈回路 (32)纠偏辊置中控制回路 (32)探测器自动搜索定位控制回路 (33)错边卷取控制回路 (33)第八章故障诊断 (34)探测器故障诊断 (34)H6600控制放大器的故障诊断 (36)伺服阀和其它执行元件的故障诊断 (38)H6600 I/0 控制板 (40)保险丝的更换 (41)继电器的更换 (42)H6600的缺省设定 (42)第九章探测器自搜索定位控制电路（选购项目） (44)接线说明 (44)电源连接 (45)电机驱动器的接线与设置 (45)自搜索AC接线端子（TS402端子条上的A17-A23号端子）功能说明 (45)自搜索DC接线端子（TS401端子条上的D17-D22号端子）功能说明 (46)初始设定 (46)操作 (47)指示灯和继电器 (47)自搜索故障诊断 (47)第十章带材错边卷取控制电路（选购项目） (48)电气接线说明 (48)电源连接 (49)编码器的接线 (49)AC交流接线端子（TS402端子上的A20-A23端子）功能说明 (49)DC交流接线端子（TS401端子上的D23-D25端子）功能说明 (50)初始设定 (50)错边卷取故障诊断 (51)2第一章系统简介1—1 概述以微处理器为核心的H6600系列电子控制放大器适用于多种形式的纠偏场合，如带材对边纠偏、对中纠偏及其它主/从动纠偏系统等。

DH-60中文资料

`DESCRIPTIONThe FCI Model DH-60Series air duct detector housing is intended for use on air handling ducts to sample air flow in the duct and allow for the detection of smoke and combus-tion particles.The housing is available in a 4-wire detector configuration,and accepts either the CPD-7051D ionization detector or the PSD-7155D photoelectric detector.Air sampling is accomplished via sampling and return tubes which extend into the ducts.The DH-604-wire detector can operate over a wide range of AC or DC power sources;24V AC,24VDC,120V AC or 240V AC.It is equipped with alarm relay auxiliary contacts which may be used directly for control applications,and has an integral,normally-energized trouble relay to supervise power and smoke detector head removal.A transparent inspection port permits viewing of the detec-tor alarm indicator over a wide viewing angle and inspection of the conditions of cleanliness inside the detector mounting area.The housing can be installed on either rectangular or round ducts ranging from 8inches to 12feet in width.The sampling tube must extend over the entire width of the duct,and the unit is equipped with a 4.25inch exhaust tube.Optional accessories include remote test stations and an-nunciators.CONSTRUCTION The duct detector housing is of rugged plastic with a clearpolycarbonate cover.The housing is capable of mounting oneither rectangular or round ducts without adapter brackets.Terminals are suitable for 14-18AWG wiring.APPROV ALSUL (Std 268A)S1064CSFM ApprovedNYC MEA MEA 134-95-E V ol.IIIDH-60SERIESFOUR-WIRE DUCTSMOKE DETECTOR HOUSINGFEATURES•Accommodates Ionizationor Photoelectric Detector Heads •4-wire Configuration•Field Selectable Single Station AC Operation:24VAC,120VAC or 240VAC•Air Velocity Ranging from 500to 4000FPM•Mounts on Round or RectangularDucts from 8inches to Twelve Feet Wide •Clear Polycarbonate Cover for Visual Inspection •Non-Polarized •Remote Indication,Relay Test andReset Options •Two (2)Heavy Duty (10Amp.)Relay Contacts9020-0369Rev.HGENERAL SPECIFICATIONSOperating temperature 32to 100o F (0to 37o C)Humidity10to 93%RH Air velocity range 300to 4000FPMDimensions 14.5inches L x 5inches W x 2.5inches D (37x 13x 6.4cm)Weight5.5lbs.(3.2kg)Specifications are provided for information only,are not intended to be used for installation purposes,and are believed to be accurate.However,no responsibility is assumed byGamewell-FCI for their use.Specifications subject to change without notice.©2006All Rights Reserved.An ISO 9001Certified CompanyGAMEWELL-FCI12Clintonville Road,Northford,CT 06472-Tel:(203)484-7161-Fax:(203)484-7118TESTINGFunctional testing can be performed by one of the following methods:•Hold a magnet in the slot marked “Test”on the housing until the LED lights.Confirm that the system control unit (if used)alarms properly and performs all auxiliary functions.Reset:Place a magnet in the slot marked “Reset”ORDERING INFORMATIONPart No.Model DescriptionShipping Weight (lbs)119-A0400DH-60Duct Housing,4-wire,less detector head. 5.5110-38020CPD-7051D Ionization Detector head 2.0112-30080PSD-7155D Photoelectric Detector head2.0138-02006RAI-4Remote Alarm Indicator red LED lights on alarm. 1.0138-02806RCM-505Remote Alarm Indicator/Keyswitch as above except with added remote test and reset keyswitch 1.0138-02906RCM-606Remote Power/Alarm Indicator/Keyswitch -as above except has added green “POWER”LED which is lit during normal conditions.1.0252-8GJ2B FST-212-inch Sampling Tube (For ducts less than 1ft.)0.6252-8GK2B FST-324-inch Sampling Tube (For ducts between 1and 2ft.) 1.0252-8GL2B FST-448-inch Sampling Tube (For ducts between 3and 4ft.) 1.2252-8GM2B FST-672-inch Sampling Tube (For ducts between 4and 6ft.) 2.0252-8GN2B FST-896-inch Sampling Tube (For ducts between 6and 8ft.) 3.0252-8GP2B FST-10120-inch Sampling Tube (For ducts between 8and 10ft.)3.52of 29020-0369Rev.HELECTRICAL SPECIFICATIONSContact ratingsAlarm initiating contacts:Form A2A @30V AC/VDC (resistive)Auxiliary alarm contacts:Form C (2sets)10A @30VDC (resistive)10A @277V AC (resistive)1/8HP @120V AC 1/4HP @240V ACSupervisory contacts:Form B0.3A @30VDC (resistive)0.3A @30V AC (resistive)Power requirements20.4-26.4V AC 102-132V AC 204-264V AC 20-29VDC (Using no accessories)Max.standby current .070A .030A .020A .020A Max.alarm current .160A .040A .025A .060A (Using max.accessories)Max.alarm current.220A.050A.035A.090A•Using the RCM-505or RCM-606remote test unit -Insert the key and turn clockwise to the “TEST”position and hold until the LED lights.Reset:Turn the key counterclockwise to the “Reset”position and hold.The LED will extin-guish.Turn the key to the normal position and remove.。

湖南三德科技热值分析系列产品说明书

官方微信官方网站目录SDAC6000(u)量热仪SDACM4000量热仪SDACM3100量热仪SDC712量热仪SDC715量热仪01-05热值分析系列020*********-11元素分析系列SDCHN536碳氢氮元素分析仪SDCH536红外碳氢仪SDH536红外测氢仪SDS350红外定硫仪SDS820自动定硫仪SDS720自动定硫仪SDS-V 定硫仪SDFCl3000自动氟氯分析仪SDFCl1000(a)氟氯分析仪070707080909101111SDTGA8000(a)工业分析仪SDTGA6000工业分析仪SDTGA6000A 工业分析仪SDTGA6000V 工业分析仪SDTGA5000a 工业分析仪SDTGA520(a)水分测试仪SDTGA500光波水分测试仪SDIMF200智能马弗炉SDMF300马弗炉SDIDB413智能干燥箱SDDH315通氮鼓风干燥箱SDDH323鼓风干燥箱SDDH313鼓风干燥箱SDDH306鼓风干燥箱12-22成分分析系列1314151516171819202121222222SDAF105（a /b ）灰熔融性测试仪SDAF4000灰熔融性测试仪SDHG60a 哈氏可磨性指数测定仪23-26物理特性分析系列242526S DUC3150（D ）联合制样机S DHD150t 锤式破碎缩分机S DHC锤式破碎机S DJC颚式破碎机S DRC对辊破碎机S DHCW400×260湿煤破碎机S DPP制样粉碎机S DMD16自动机械缩分器S DNS300环保振筛机S DNS200a标准振筛机S DRD二分器采制样辅助工具30-38样品制备系列313232333334343535353637-38激光盘料仪系列SDLM200便携式激光盘料仪SDLM1250固定式激光盘料仪39-41404142-43公司简介44发展历程45运维服务2829S DVD25风透式快速除湿干燥系统S DVD3mm 风透干燥机27-29风透式低温快速除湿干燥系列热值分析系列适用范围符合标准GB/T213-2008GB/T384-1981 GB/T30727-2014ASTM D5865-2007ISO 1928-2009 JC/T1005-2006《煤的发热量测定方法》《石油产品热值测定法》《固体生物质燃料发热量测定方法》《煤与焦炭总热值的标准试验方法》《固体矿物燃料-氧弹式量热计测定总值并计算净热值》《水泥黑生料发热量测定方法》三德科技是中国第一台自动量热仪(1996年)的发明者，先后自主研发出6代量热仪，缔造了2个“国家重点新产品”。

VDX-6740-基础配置文档

博科VDX交换机快速配置手册一、登录交换机1.1串口线连接Windows平台：传输速率：9600bit/sec数据位：8校验位：None停止位：1流控制：None1.2登录交换机➢用户级别VDX Switch > enable ------只能使用？、ping 和show命令VDX Switch # ------查看交换机详细信息➢全局配置模式VDX Switch # configure terminalVDX Switch (config) # ------配置模式二、升级交换机固件1、给交换机配一个管理地址：VDX Switch # conf tVDX Switch # interface Management 1/0VDX Switch # ip address 10.77.77.76/242、使用FTP服务器升级固件VDX switch# firmware download interactivefirmware download interactiveServer name or IP address: 10.31.2.25File name:/users/home40/Builds/NOS_v5.0.0Protocol (ftp, scp, sftp): ftpUser:fvtPassword:**********Do manual download [y/n]:nSystem sanity check passed.Do you want to continue? [y/n]:y使用USB升级固件VDX Switch # usb onVDX Switch # usb dirVDX Switch # firmware download usb directory nos6.0.0 coldboot Performing system sanity check...This command will cause a cold/disruptive reboot and will require that existing telnet, secure telnet or SSH sessions be restarted.Do you want to continue? [y/n]:yChecking conditions for downloading to 6.0.0System settings check passed (0).检查升级后的版本VDX Switch # show version三、调整时区+设置本地时间VDX Switch # clock timezone Asia/Shanghai (修改时区)VDX Switch # clock set 2015-05-21T16:10:00（设置本地时间）VDX Switch # show clockrbridge-id 1: 2015-05-21 15:56:10 Asia/Shanghai四、设置timeoutVDX Switch (config)# line vty exec-timeout 5 （设置超时时间为5分钟）VDX Switch (config-line-vty)# do show running-config line vtyline vtyexec-timeout 5!五、添加/移除license添加license：VDX Switch # license add licStr “*B H**********#“ （添加license）移除license：VDX Switch # license remove licStr “FCOE_BASE“ （移除license）六、设置登录密码VDX Switch(config)# username admin role admin password password enable true七、修改设备名称VDX Switch # conf tVDX Switch (config)# switch-attributes 1 host-name VDX6740 chassis-name VDX6740八、关闭telnet：Switch（config）# telnet server shutdown在VCS模式中关闭telnet：Switch（config）#rbridge-id 3Switch (config-rbridge-id-3)# telnet server shutdown启用telnet：Switch （config）# no telnet server shutdown九、组建VCS逻辑机箱同一个VCS 中每台VDX具有不同的RB-id和相同的VCSID：VDX Switch # vcs rbridge-id 1 vcsid 12 logical-chassis enableVDX Switch # show fabric islports all十、修改principle switchVDX switch# configureVDX switch(config)# rbridge-id 5VDX switch(config-rbridge-id-5)# logical-chassis principal-priority 1VDX switch(config-rbridge-id-5)# endVDX switch# logical-chassis principal-switchover十一、创建VLANVDX Switch (config)# interface vlan 10VDX Switch (config)# interface TenGigabitEthernet 1/0/1-4VDX Switch (conf-if-te-1/0/1-4)# switchportVDX Switch (conf-if-te-1/0/1-4)# switchport mode accessVDX Switch（conf-if-te-1/0/1-4)# switchport access vlan 10十二、给VLAN配置IP地址VDX Switch (config)# rb 1VDX Switch (config-rbridge-id-1)# interface ve 10VDX Switch (config-rbridge-Ve-30)# ip address 172.168.2.19/24 VDX Switch (config-rbridge-Ve-30)# no shutdown十三、配置生成树协议（STP/RSTP）VDX Switch (config)# protocol spanning-tree stp/rstpVDX Switch (config-stp)# bridge-priority 4096十四、配置多生成树(MSTP)VDX Switch (config)# protocol spanning-tree mstpVDX Switch (config-mstp)# instance 10 vlan 10-19VDX Switch (config-mstp)# instance 20 vlan 20-29VDX Switch (config-mstp)# instance 10 priority 4096VDX Switch (config)# interface TenGigabitEthernet 1/0/1-4VDX Switch (conf-if-te-1/0/1-4)# switchport mode trunkVDX Switch (conf-if-te-1/0/1-4)# switchport trunk allowed vlan allVDX Switch (conf-if-te-1/0/1-4)# int te 2/0/1-4VDX Switch (conf-if-te-2/0/1-4)# switchport mode trunkVDX Switch (conf-if-te-2/0/1-4)# switchport trunk allowed vlan all十五、配置vLAGVDX Switch (config)# interface Port-channel 10VDX Switch (config-Port-channel-10)# vlag ignore-splitVDX Switch (config-Port-channel-10)# switchportVDX Switch (config-Port-channel-10)# switchport mode trunkVDX Switch (config-Port-channel-10)# switchport trunk allowed vlan allVDX Switch (config-Port-channel-10)# no shutdownVDX Switch_1 (config)# int te 1/0/1VDX Switch (conf-if-te-1/0/1)# channel-group 10 mode active type standard VDX Switch_2 (conf-if-te-1/0/1)# int te 2/0/1VDX Switch （conf-if-te-2/0/1)# channel-group 10 mode active type standard 十六、配置静态路由静态路由不是全局参数，需要进入到每台设备上配置：VDX SWITCH (config)# rb 1VDX SWITCH (config-rbridge-id-1)# ip route x.x.x.x/x x.x.x.xVDX SWITCH (config)# rb 2VDX SWITCH (config-rbridge-id-2)# ip route x.x.x.x/x x.x.x.x十七、配置OSPFOSPF不是全局参数，需要进入到每台设备上配置：VDX SWITCH (conf)# rb 1VDX SWITCH (config-rbridge-id-1)# router ospfVDX SWITCH (config-router-ospf-vrf-default-vrf)# area 0VDX SWITCH (config-rbridge-id-1)# int ve 30VDX SWITCH (config-rbridge-Ve-30)# ip ospf area 0VDX SWITCH (config)# rb 2VDX SWITCH (config-rbridge-id-2)# router ospfVDX SWITCH (config-router-ospf-vrf-default-vrf)# area 0VDX SWITCH (config-router-ospf-vrf-default-vrf)# int ve 30 VDX SWITCH (config-rbridge-Ve-30)# ip ospf area 0十八、配置VRRP/VRRP-ERB1:VDX SWITCH (config)#rbridge 1VDX SWITCH (config)#protocol vrrp-extendedVDX SWITCH (config)#interface ve 30VDX SWITCH (config)#vrrp-extended-group 30VDX SWITCH (config)#priority 125VDX SWITCH (config)#advertise-backup enableVDX SWITCH (config)#preempt-mode enableVDX SWITCH (config)# short-path-forwarding revert-priority 90VDX SWITCH (config)#vritual-ip 172.168.2.100VDX SWITCH (config)#track ten 1/0/6 priority 20VDX SWITCH (config)#enableRB2:VDX SWITCH (config)#rbridge 2VDX SWITCH (config)#protocol vrrp-extendedVDX SWITCH (config)#interface ve 30VDX SWITCH (config)#vrrp-extended-group 30VDX SWITCH (config)#priority 120VDX SWITCH (config)#advertise-backup enableVDX SWITCH (config)#preempt-mode enableVDX SWITCH (config)# short-path-forwarding revert-priority 90 VDX SWITCH (config)#vritual-ip 172.168.2.100VDX SWITCH (config)#track ten 2/0/6 priority 10VDX SWITCH (config)#enable十九、配置FlexportVDX SWITCH (config)# hardwareVDX SWITCH (config-hardware)# flexport 2/0/45VDX SWITCH (config-flexport-2/0/45)# flexport 2/0/46VDX SWITCH (config-flexport-2/0/46)# flexport 2/0/47VDX SWITCH (config-flexport-2/0/47)# flexport 2/0/48VDX SWITCH (config-hardware)# flexport 2/0/45VDX SWITCH (config-flexport-2/0/45)# type fibre-channel VDX SWITCH (config-flexport-2/0/45)# flexport 2/0/46 VDX SWITCH (config-flexport-2/0/46)# type fibre-channel VDX SWITCH (config-flexport-2/0/46)# flexport 2/0/47 VDX SWITCH (config-flexport-2/0/47)# type fibre-channel VDX SWITCH (config-flexport-2/0/47)# flexport 2/0/48 VDX SWITCH (config-flexport-2/0/48)# type fibre-channel 二十、QSFP breakout 配置VDX SWITCH (config)#interface fortygigabitethernet 1/0/49 VDX SWITCH (conf-if-fo-1/0/49)# shutdownVDX SWITCH (conf-if-fo-1/0/49)#exitVDX SWITCH (config)#hardwareVDX SWITCH (config-hardware)#connector 1/0/49VDX SWITCH (conf-if-fo-1/0/49)#sfp breakoutVDX SWITCH (conf-if-fo-1/0/49)#do reload二十一、设置syslog服务器VDX SWITCH (config)# logging syslog-server x.x.x.x二十、收集supportsave存放到到FTP服务器：VDX SWITCH (config)# copy support-interactiveServer Name or IP Address: 172.168.2.25Protocol (ftp, scp): ftpUser: adminPassword: *****Directory:/home/admin/supportVCS support [y/n]? (y): y存放到到USB：switch# usb onUSB storage enabledswitch# usb dirfirmwarekey\ 0B 2010 Aug 15 15:13 support\ 106MB 2010 Aug 24 05:36 support1034\ 105MB 2010 Aug 23 06:11 config\ 0B 2010 Aug 15 15:13firmware\ 380MB 2010 Aug 15 15:13 Available space on usbstorage 74%switch# copy support usb directory support。

EE-SX671;EE-SX674;EE-SX670A;EE-SX670P;EE-SX671A;中文规格书,Datasheet资料

T-shaped, slot center 10 mm F-shaped
Dark-ON/Light-ON Incident light (selectable) *3
EE-SX675
EE-SX675P
Dark-ON/Light-ON Incident light (selectable) *3 R-shaped Dark-ON/Light-ON Incident light (selectable) *3
EE-SX670 EE-SX671 EE-SX673 EE-SX674 Connector EE-SX675 EE-SX670A EE-SX671A EE-SX673A EE-SX674A models EE-SX470 EE-SX471 EE-SX473 EE-SX474 NPN Pre-wired EE-SX670EE-SX671EE-SX673EE-SX674EE-SX675models models WR WR WR WR WR Models with EE-SX670EE-SX671EE-SX673EE-SX674EE-SX675connectors CJ1-R CJ1-R CJ1-R CJ1-R CJ1-R EE-SX670P EE-SX671P EE-SX673P EE-SX674P Connector EE-SX670R EE-SX675P EE-SX671R EE-SX673R EE-SX674R models EE-SX470P EE-SX471P EE-SX473P EE-SX474P PNP Pre-wired EE-SX670PEE-SX671PEE-SX673PEE-SX674PEE-SX675Pmodels models WR WR WR WR WR Models with EE-SX670PEE-SX671PEE-SX673PEE-SX674PEE-SX675PItem connectors CJ1-R CJ1-R CJ1-R CJ1-R CJ1-R Sensing distance 5 mm (slot width) Sensing object Opaque: 2 × 0.8 mm min. Differential distance 0.025 mm Light source GaAs infrared LED with a peak wavelength of 940 nm Indicator *1 Light indicator (red) (turns ON when light is interrupted for models with A or R suffix) Supply voltage 5 to 24 VDC ±10%, ripple (p-p): 10% max. Current consumption 35 mA max. (NPN models), 30 mA max. (PNP models) NPN open collector: 5 to 24 VDC, 100 mA max. 100 mA load current with a residual voltage of 0.8 V max. 40 mA load current with a residual voltage of 0.4 V max. Control output OFF current: 0.5 mA max. PNP open collector: 5 to 24 VDC, 50 mA max. 50 mA load current with a residual voltage of 1.3 V max. OFF current: 0.5 mA max. Response frequency *2 1 kHz min. (3 kHz average) Ambient illumination 1,000 lx max. with fluorescent light on the surface of the receiver. Ambient temperature range Operating: −25 to +55°C, Storage: −30 to +80°C (with no icing or condensation) Ambient humidity range Operating: 5% to 85%, Storage: 5% to 95% (with no icing or condensation) Destruction: 20 to 2,000 Hz (peak acceleration: 100 m/s2) Vibration resistance 1.5-mm double amplitude for 2 h (4-min periods) each in X, Y, and Z directions Shock resistance Destruction: 500 m/s2 for 3 times each in X, Y, and Z directions Degree of protection IEC60529 IP50 Connector Models (direct soldering possible), Pre-wired Models (Standard cable length: 1 m), Connecting method Models with Connectors (Standard cable length: 0.1 m) Connector models Approx. 3.1 g Approx. 3 g Approx. 2.4 g Approx. 2.3 g Approx. 3 g Approx. 2.7 g Wei- Pre-wired models Approx. 18.9 g Approx. 17.3 g Approx. 17.8 g Approx. 16.8 g Approx. 17.1 g Approx. 18.3 g ght Models with Approx. 6.3 g Approx. 4.7 g Approx. 5.2 g Approx. 4.2 g Approx. 4.5 g Approx. 5.7 g connectors Case Polybutylene phthalate (PBT) Materi- Cover Polycarbonate al Emitter/receiver *1. The indicator is a GaP red LED (peak wavelength: 690 nm). *2. The response frequency was measured by detecting the rotating disk shown at the right.

FPGA可编程逻辑器件芯片XC7VX690T-2FFG1927中文规格书

FPGA可编程逻辑器件芯⽚XC7VX690T-2FFG1927中⽂规格书with exemption 15 where there is lead in the C4 bumps that are used to complete a viable electrical connection between the semiconductor die and the package substrate. The FFV, FBV, and SBV flip-chip packages marked with the Pb-free character are RoHS 6 of 6compliant (without the use of exemption 15). The CPG, CSG, FTG, and FGG non-flip chip packages are RoHS 6 of 6 compliant.All of the 7series devices supported in a particular package are pinout compatible. See Pin Compatibility between Packages, page33. Pins that are available in a device but are not available in a smaller device with a compatible package are listed as No Connects. Each device is split into I/O banks to allow for flexibility in the choice of I/O standards (see the 7Series FPGAs SelectIO Resources User Guide (UG471). Table1-12 provides definitions for all pin types.7series device’s flip-chip assembly materials are manufactured using ultra-low alpha (ULA) materials defined as <0.002cph/cm2 or materials that emit less than 0.002 alpha-particles per square centimeter per hour.Device/Package Combinations and Maximum I/OsTable1-1 shows the maximum number of user I/Os possible in the 7series FPGAs BGApackages.Table 1-1:7Series FPGAs Package SpecificationsPackages(1)DescriptionPackage SpecificationsPackage Type Pitch(mm)Size(mm)Maximum I/Os(2)CPGA196Wire-bondchip-scale BGA0.58x8100FTB196/FTGB196BGA 1.015 x 15100 CP236/CPG236BGA0.510x10106 CPG238BGA0.510x10110CSA225/CSGA225BGA0.813x13100 CS324/CSG324BGA0.815 x 15210 CSGA324BGA0.815 x 15210 CS325/CSG325BGA0.815 x 15150FT256/FTG256Wire-bond fine-pitch BGA 1.017 x 17170FG484/FGG484BGA 1.023 x 23285 FGGA484BGA 1.023 x 23338 FG676/FGG676BGA 1.027 x 27300 FGGA676BGA 1.027 x 27400Kintex-7 device/package combination.Table 1-9:Available I/O Pin/Device/Package Combinations for Kintex-7 FPGAsKintex-7 Devices User I/OPinsKintex-7 FPGA Packages: HR and HP I/O BanksFBG484FBV484FBG676FBV676FBG900FBV900FFG676FFV676FFG900FFV900FFG901FFV901FFG1156FFV1156RF676RF900 HP HR HP HR HP HR HP HR HP HR HP HR HP HR HP HR HP HRXC7K70T User I/O100185100200––––––––––––––Differential9617696192––––––––––––––XC7K160T User I/O100185150250––150250––––––––––Differential96176144240––144240––––––––––XC7K325T User I/O––150250150350150250150350––––––––Differential––144240144336144240144336––––––––XC7K355T User I/O––––––––––0300––––––Differential––––––––––0288––––––XC7K410T User I/O––150250150350150250150350––––––––Differential––144240144336144240144336––––––––XC7K420T User I/O––––––––––03800400––––Differential––––––––––03660384––––XC7K480T User I/O––––––––––03800400––––Differential––––––––––03660384––––XA7K160T User I/O––––––150250––––––––––Differential––––––144240––––––––––XQ7K325T User I/O––––––––––––––150250150350 Differential––––––––––––––144240144336XQ7K410T User I/O––––––––––––––150250150350 Differential––––––––––––––144240144336I/Os for each Virtex-7 device/package combination. When applicable, it also lists the number of user I/Os in the 3.3V-capable high-range (HR) banks and the number of1.8V-capable high-performance (HP) banks.Table 1-10:Available I/O Pin/Device/Package Combinations for Virtex-7T FPGAsVirtex-7TDevices User I/O PinsVirtex-7T FPGA Packages: HR and HP I/O BanksFFG1157FFG1761FLG1925FHG1761RF1157RF1761 HP HR HP HR HP HR HP HR HP HR HP HRXC7V585T User I/O6000750100––––Differential576072096––––XC7V2000T User I/O––120008500––Differential––115208160––XQ7V585T User I/O––––6000750100 Differential––––576072096The physical XY locations for each IDELAYCTRL start at X0Y0 in the bottom left-most bank. The locations then increment by onestarting with the lowest bank number in each column in the vertical Y direction and by one for each column in the horizontal X direction. IDELAYCTRLs are located in each of the HROWs.This section visually describes the die level bank numbering.Spartan-7 devices on page36 through page39.Artix-7 devices on page40 through page45.Kintex-7 devices on page46 through page52.Virtex-7T devices (XC7V585T and XC7V2000T) on page53 through page55.Virtex-7XT devices (XC7VX330T, XC7VX415T,XC7VX485T, XC7VX550T, XC7VX690T, XC7VX980T, and XC7VX1140T) on page56 through page66.。

循环温控模块

产品优势产品特性优良的加热性能精确的运行时间XL：可使用低型板和高型板全天候全自动操作PCR 扩增过程中可进行移液操作循环温控模块ODTC ®- 在线温控模块适用于96孔或384孔PCR 板全自动水平移动盖板超导热性VCM ®模块所需空间小，重量轻SiLA 通信标准可选配测试工具® -全自动应用循环温控模块世界首台专门为自动化工作站整合设计的循环温控模块开盖状态，带有 Bio-Rad PCR 板的ODTC ®96产品介绍设计初衷当今世界的基因工作流程对分子生物实验的全自动过程有很高的要求，尤其是在人类基因工程或临床诊断方面对工作量和精确度都有很高的要求。

同时，鉴于实验室空间有限，我们需要一些解决方案以最大程度地将现有的液体处理工作站所需空间最小化。

世界首台专用设计的在线循环温控模块INHECO 公司的ODTC ®是一款既可以应用于全自动PCR 扩增技术又可以满足分子生物学常规加热和制冷快速转换要求的完美仪器。

ODTC ®适用于几乎所有液体工作站，允许对 ODTC ®内的多孔板类耗材直接进行移液操作。

支持从各角度抓取PCR板，支持持续高通量工作。

ODTC ®盖板可水平开启，无论温控模块工作与否均可单独操作。

这种独特的设计可以"解放双手", 实现多步骤工作流程的全自动化。

打开盖板对加热性能几乎没有影响，在循环加热或孵育过程中仍可进行移液操作。

创新卓越的加热技术独特的3D vapor chamber mount (VCM ®)使ODTC ®的加热性能得以完美实现。

这项技术（专利申请中）基于热管原理。

起源于1D 热管以及笔记本电脑芯片和处理器制冷所使用的2D 平面蒸汽室, VCM ®作为首个3D 热管被应用于PCR 扩增所需的超导循环温控模块，其内部热传导的速度几乎接近于声音的传播速度。

CT107D产品概要介绍

CT107D
文档版本:V1.0
单片机综合训练平台简介
CT107D 是北京国信长天科技有限公司为“2011年全国电子专业人才设计与技能大赛- 单片机设计与开发项目”设计的一款竞赛专用平台。

平台兼容STC 、Atmel 等公司 51 系列单片机及部分Atmel 公司A VR 单片机。

板载资源：
特点：
1. 外部直流、USB 双电源供电；
2. 所有IO 引脚全部引出，方便扩展；
3. 传感器资源丰富；
4. 板载USB-ISP 功能，通过USB 接口下载程序。

STC89C52RC 处理器主要性能指标：
1. 32个IO 口；
2. 4.5V-5.5V 供电；
3. 8K bytes FLASH ；
4. 256 bytes RAM ；
5. 三个定时器，两个外部中断源；
6. 中断唤醒省电模式。

⏹ MCU ：AT89S52单片机或其它同类兼容芯片
⏹ 4*4键盘矩阵 ⏹ 8个LED 指示灯 ⏹ 8位8段共阳数码管
⏹ 红色共阳8*8LED 点阵 ⏹ LCM1602接口
⏹ LCM12864接口（选配）
⏹ AD 、DA 转换芯片PCF8591
⏹ EEPROM 芯片AT24C02 ⏹ 74HC138译码器 ⏹ USB 转串口、并口模块
⏹ 继电器模块
⏹ 蜂鸣器模块 ⏹ 红外一体头1838 ⏹ 红外发射管 ⏹ HALL 器件 ⏹ DS1302时钟芯片 ⏹ 数字温度传感器18B20 ⏹ 光敏器件 ⏹ 超声波收发模块 ⏹ 8255 IO 扩展芯片 ⏹ LM386音频放大模块 ⏹ LM324放大模块 ⏹ 直流电机接口 ⏹ 步进电机接口 ⏹ NE555信号发生模块。

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1-212
H
Surface Mount Chip LEDs Technical Data
HSMX-C650HSMX-C670HSMF-C655
Features
• Small Size
• Industry Standard Footprint • Low Profile
• Tinted, Diffused Optics • Compatible with IR Solder Process
• Five Colors and Bicolor Available
• Available in 8 mm Tape on 7" (178 mm) Diameter Reels
tinted diffused optics. The bicolor package is untinted,diffused.
The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. They are compatible with IR reflow soldering processes.
Device Selection Guide
DH
High Bicolor Footprint AlGaAs Efficiency
HER-(mm)Red Red Orange Yellow Green Green
3.20 x 1.60HSMH-C650HSMS-C650HSMD-C650HSMY-C650HSMG-C6502.00 x 1.25HSMH-C670
HSMS-C670
HSMD-C670
HSMY-C670
HSMG-C670
3.20 x 2.70
HSMF-C655
5964-9360E
Applications
• Push-Button Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel Indicator
Description
These single and bicolor LEDs are designed in an industry standard package for ease of handling and use. Five different LED colors are available in two compact, low profile, single color packages. The 3.2 x 1.6 mm is an excellent all around package,and the small 2.0 x 1.25 mm package is designed for applica-tions where space is limited.The single color LEDs have
[1210]
HSMX-C650 Series
[1206]
HSMX-C670 Series
[805]
CATHODE MARK
0.40
(0.016)
CATHODE MARK
0.50
1.60
(0.063)
POLARITY
2.70
(0.106)
1.40
(0.055)
R 0.25
(0.010)
GREEN
RED
1-213
Absolute Maximum Ratings at T A = 25°C
HSMX-C650
Parameter HSMF-C655HSMX-C670Units DC Forward Current[1]2520mA Power Dissipation6550mW Reverse Voltage (I R = 100 µA)55V
LED Junction Temperature9595°C Operating Temperature Range-25 to +80-25 to +80°C Storage Temperature Range-30 to +85-30 to +85°C Soldering Temperature See SMT reflow soldering profile, Figure 6
Notes:
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.
Optical Characteristics at T
= 25°C
1. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern which may not be aligned with the
mechanical axis of the lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4. Chip LEDs are supplied in 8 mm embossed tape on 178 mm (7 in.) diameter reels, with 3000 devices per reel. Minimum order
quantity and order incremenets are in quantity of reels only.
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Electrical Characteristics at T
= 25°C
Figure 1. Relative Intensity vs. Wavelength.
R E L A T I V E I N T E N S I T Y
1.0
0.5
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Figure 2. Forward Current vs. Forward Voltage.
3020
10
V – FORWARD VOLTAGE – V F
I – F O R W A R D C U R R E N T – m A
F 25155
Figure 3. Relative Luminous Intensity vs. DC Forward
Current.
Figure 4. Maximum DC Current vs. Ambient Temperature.
Figure 5. Intensity vs. Angle.
T – AMBIENT TEMPERATURE – °C A
05101520253035
40I – F O R W A R D C U R R E N T – m A
F
9080°
N O R M A L I Z E D I N T E N S I T Y
I – DC FORWARD CURRENT – mA DC
0.20.40.60.81.01.21.41.6R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )
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Figure 6. Recommended SMT Reflow Soldering Profile.
Figure 7. Recommended Solder Patterns.
Figure 8. Reeling Orientation.
Figure 9. Reel Dimensions.
(0.043)
HSMF-C655 SERIES
HSMX-C670 SERIES
HSMX-C650 SERIES
230°C MAX.
10 SEC. MAX.4°C/SEC. MAX.OVER 2 MIN.
TIME
T E M P E R A T U R E
4°C/SEC. MAX.
140-160°C
.
-3°C/SEC. MAX.
NOTE:
ALL DIMENSIONS IN MILLIMETERS (INCHES).
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Figure 11. Tape Leader and Trailer Dimensions.
Figure 10. Tape Dimensions.。