品质系统常见英文缩写简介

品质系统常见英文缩写简介

2. IQC : incoming quality control 进料品

质管制

4. AQL: acceptable quality level 允收标

准

6. CQA: customer quality assurance 客户品质保证 8. MA : major defeat 主要缺点

10. SMT: surface mounting technology 表面粘贴技术

11. SMD: surface mounting device 表面粘贴设备

12. ECN: engineering change notice 工程变更通知

14. PCB: printed circuit board 印刷电路板

7. MI: minor defeat 次要缺点

9. CR: critical defeat 关键缺点

16. BOM: bill of material 材料清单

SMC: surface mounting component 表面粘贴元件

13. DCN: design change notice 设计变更通知

15. PCBA: printed circuit board assembly 装配印刷电路板

17. BIOS: basically input and output system 基本输入输出系统

38. The good and not good segregation:良品和不良品区分 39. OBW: on board writer 熸录 BIOS

91. Internal notification:内部联络单

114. CSD: Customer Service Department 客户服务部1. QC :quality control 品质管制 3. OQC: output quality control 出货品质管制 5.PQC: process quality control 制程品质管制也称 19. ISO: international standard organization 国际标准化组织 22 . Icicles :锡尖 21. Polarity :电性 23 . Non-wetting :空焊 24. Short circuit:短路 26 .Wrong component : 错件 27. Excess component:多件

29. Excessive solder:锡多 30. Solder residue:锡渣 31. Solder ball:锡球 33 .Sideward :侧立 34. Component damage:零件破损

20. DRAM:内存条

25. Missing component : 缺件

28. Insufficient solder : 锡少 32. Tombstone :墓碑

35. Gold finger :金手指

37. SIP : standard inspection process 标准检验流程

40. Simple random sampling:简单随机抽样 43. CIP: Continuous improvement program 46. SQE: Supplier quality engineering 49. QTS: Quality tracking system 品质追查系统 41. Histogram:直方图 44. SPC: Statistical process control 47. Sampling sample:抽样计划 42. Standard deviation :标准差

45. Sub-contractors:分包商

48. Loader:治具

50. Debug:调试 51. Spare parts 备用品

52 . Inventory report for : 库存表 53. Manpower/Tact estimation 工时预算 54. Calibration :校验

55. S/N: serial number 序号 56. Corrugated pad:波纹垫 59 . Vericode :检验码 60 . Sum of square :平方和 63. Preventive maintenance :预防性维护 66. Probe:探针 67. Host probe :主探针 70. Frame :屏面 71 . Lint-free gloves :静电手套 74. Related department :相关部门 77. Wrong direction 极性反 57. Takeout tray : 内包装盒 58 .Outer box :外包装箱

61 . .Range :全距

62. Conductive bag:保护袋

64 .Base unit :基体 65. F ixture:制具

68 .Golden card : 样本卡 69 .Diagnostics program: 诊断程序

72 .Wrist wrap : 静电手环 73 . T arget value :目标值

75. Lifted solder 浮焊 76.plug hole 孔塞

ponent damage or broken 零件破损

79.Unmeleted solder 熔锡不良 80.flux residue 松香未拭 82.mixed parts 机种混装 83. Poor solder mask 绿漆不良 84. oxidize 零件氧化 85.stand off height 浮高

86. IC reverse IC 反向 87.supervisor 课长 88. Forman 组长 89. Wl=work instruction 作业指导 非擦 除状态 92. QP: Quality policy 品质政策 93.QT: Quality target 品质目标 94. Trend:推移图 95.Pareto:柏拉图

96. UCL: Upper cont ⑹ I imit 管制上限 Rolled throughout yield 直通率 101. DPU: Defects per unit 单位不良97. L CL:Lower control limit 管制下限 100. PPM: Parts per million 不良率

102. Resistor:电阻 98. CL: Center line 中心线 103.Capacitor:电容

104. Resistor array :排阻 105. Capacitor array:排容 106. DIODE:二极管 107.SOT:三极管

108. Crystal:震荡器 109. Fuse:保险丝 110.Bead:电感 111.Connector:联结器

112. ADM: Administration Department 行政单位 113. CE: Component Engineering 零件工程

115. ID: Industrial Design 工业设计 IPQC : in process quality control . 18. MIL-STD-105E:美国陆军标准，也称单次抽样计划

36. SOP: standard operation process 标准操作流程 81.wrong label or upside down label 贴反