Indecomposable modules and Gelfand rings

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INTEGRA IT-8000 (North America) 产品说明说明书

INTEGRA IT-8000 (North America) 产品说明说明书

—TECHNICAL DATA SHEET DS0122US rev 2INTEGRA™ IT -8000 (North America)DESCRIPTIONPart of the INTEGRA™ family, the IT-8000 is an embedded Internet of Things (IoT), BTL-listed BACnet® Building Controller (B-BC) that connects to Cylon’s BACnet field controllers. The IT-8000 is also capable ofconnection to and network management of a variety of diverse devices and subsystems using various protocols including, but not limited to, Modbus™ and LonWorks™.When connected to an Ethernet or wireless LAN, the IT-8000 uses Internet connectivity and web-serving capability to provide integrated control,supervision, network management, scheduling, data logging, alarming, and rich graphical displays through a standard Web browser.APPLICATIONWith simple configuration, tool-less installation, enhanced integration and high-powered performance, the INTEGRA™ IT -8000 controller provides ultimate flexibility in connecting and controlling buildings worldwide. ▪ Remote connectivity allows control, monitoring, and management of field controllers▪ Scalable hardware and software make it suitable for installation in small building to large campus applications▪ The INTEGRA-Supervisor software can connect multiple IT-8000 controllers and their data to provide aggregated information, such as; archiving, master scheduling, real-time data, history, and alarms, to create a single, unified application.The licensing model for the INTEGRA™ IT -8000 controller is scalable and features standard drivers along with optional I/O and field bus expansion modules for ultimate flexibility and expandability. The INTEGRA™ IT -8000 controller operates with Niagara Framework® for optimum performance.TI AM3352: 1000MHz ARM® Cortex™-A81GB DDR3 SDRAM and 4GB flash storage using a removable micro-SD cardWi-Fi Client or Wireless Access Point• **********************• IEEE802.11n IEEE802.11n HT20/HT40 @ 5GHz • Configurable radio (Off, WAP, or Client) WPAPSK / WPA2PSKPorts and Connections• Two 10/100MB Ethernet ports• Two on-board isolated RS-485 ports for connecting BACnet MS/TP and Modbus RTU devices • One USB Type A Connector supports stations back-up and restoreSecure boot, Battery-less, Real timeclockExpansion I/O Modules• IT8-EIO-16 (8 UI, 4 DO-R, 4 AO) •IT8-EIO-34 (16UI, 10 DO-R, 8AO)Expandable Option Modules• IT8-NPB-LON – LonWorks LON FTT10A module • IT8-NPB-2X-485 – Dual port RS-485 module • IT8-NPB-232 – Single port RS-232 moduleINTEGRA-ProPack ServiceCylon Service for quick database import that automatically creates BACnet network, devices and points without the need for discoveryINTEGRA-ProPack| IMPORT OF NETWORK DATA FROM CXproᴴᴰTO AUTOMATICALLY CREATE BACNETNETWORK, DEVICES AND POINTSThe IT-8000 uses Cylon’s INTEGRA-ProPack service to reduce deployment time whenconnecting to the Cylon’s BACnet field controllers. The INTEGRA-ProPack is a databaseimport tool that automatically creates the BACnet network, devices and points in the IT-8000.This service helps to reduce programming time when deploying a new project to the IT-8000. The INTEGRA-ProPack quickly and easily exports network data from CXproᴴᴰ andimports it into the IT-8000, without the need to discover controllers and points. SPECIFICATIONSCONNECTIONNote:Use Copper or Copper Clad Aluminum 70 °C conductors only.Terminals PCB mounted plug terminal connections Conductor Area Max: AWG 12 (3.31 mm2)Min: AWG 22 (0.355 mm2) MAXIMUM EXPANSION MODULES SUPPORTEDIT8-NPB-LON 4IT8-NPB-232 4IT8-NPB-2X-485 2I/O CONFIGURATIONIT-8000 Maximum CombinationsEXPANSION EXPANSION EXPANSION EXPANSIONRS-232 or LON RS-232 or LON RS-232 or LON RS-232 or LON(2) RS-485RS-232 or LON RS-232 or LON RS-232 or LON(2) RS-485(2) RS-485RS-232 or LON(2) RS-485(2) RS-485Expansion I/O UnitsIT8-EIO-16 •8 Universal inputs: Type 3 (10k) thermistors, 0 … 100K ohm,0 … 10 V DC, 0 … 20 mA with external resistor• 4 Relay outputs (Form A contacts, 24 V AC @ .5 amp rated)• 4 Analog outputs (0 … 10 V DC)•Powered from IT8-EIO-34IT8-EIO-34 •16 Universal inputs: Type 3 (10k) thermistors, 0 .. 100K ohm,0 … 10 V DC, 0 … 20 mA with external resistor•10 Relay outputs (Form A contacts, 24VAC @ .5 amp rated)•8 Analog outputs (0 … 10 V DC)•Powered from a 24 V AC/DC source•Can power up to 4 IT8-EIO-16 modulesMaximum Expansion •16 x IT8-EIO-16 or•8 x IT8-EIO-34COMMON EXPANSION I/O CONFIGURATIONS2 Panels4 Panels 8 PanelsENVIRONMENTNote: This equipment is intended for field installation within an enclosure.TemperatureStorageTemperature-40 ︒F … 185 ︒F [-40 ︒C … 85 ︒C]Ambient Humidity 5% … 95% RH non-condensingShipping & Vibration ASTM D4169, Assurance Level IIMTTF 10 years +AGENCY CERTIFICATIONSUL 916CE EN 61326-1FCC Part 15 Subpart B, Class B | FCC Part 15 Subpart CC-UL Listed to Canadian Standards Association (CSA)C22.2 No. 205-M1983 “Signal Equipment”1999/5/EC R&TTE DirectiveCCC | SRRC | RSS | RoHS1 2 3 4DIMENSIONS AND WIRINGNote : Compatible with (DIN43880) enclosures Suitable for mounting to a panel or to an EN50022 standard 35mm railIT-8000IT-8000 controller. Allow at least 1.5” (38mm) clearance around all sidesand minimum 3” (76mm) at bottom for Wi -Fi antennaExpansion module. Up to four (4) may be used. See “Expansion Modules” and “I/O Configuration”Distances between center tabs from one unit to another unitIT8-EIO-16IT8-EIO-341 2 31 2 3SYSTEM ARCHITECTUREORDERING INFORMATIONIT-8000 US WLAN Wi-Fi BUNDLESIT-8005-USWIFI Includes core license for 5 devices or 250 points. Made up of IT-8000-WIFI + IT8-005-COR + IT8-005-SM0.IT-8010-USWIFI Includes core license for 10 devices or 500 points. Made up of IT-8000-WIFI + IT8-010-COR + IT8-010-SM0.IT-8025-USWIFI Includes core license for 25 devices or 1250 points. Made up of IT-8000-WIFI + IT8-025-COR + IT8-025-SM0.IT-8100-USWIFI Includes core license for 100 devices or 5000 points. Made up of IT-8000-WIFI + IT8-100-COR + IT8-100-SM0.IT-8200-USWIFI Includes core license for 200 devices or 10000 points. Made up of IT-8000-WIFI + IT8-200-COR + IT8-200-SM0.IT-8000 WW (Worldwide) WLAN Wi-Fi BUNDLESIT-8005-WWWIFI Includes core license for 5 devices or 250 points. Made up of IT-8000-WIFI + IT8-005-COR + IT8-005-SM0.IT-8010-WWWIFI Includes core license for 10 devices or 500 points. Made up of IT-8000-WIFI + IT8-010-COR + IT8-010-SM0.IT-8025-WWWIFI Includes core license for 25 devices or 1250 points. Made up of IT-8000-WIFI + IT8-025-COR + IT8-025-SM0.IT-8100-WWWIFI Includes core license for 100 devices or 5000 points. Made up of IT-8000-WIFI + IT8-100-COR + IT8-100-SM0.IT-8200-WWWIFI Includes core license for 200 devices or 10000 points. Made up of IT-8000-WIFI + IT8-200-COR + IT8-200-SM0.IT-8000 UNBUNDLEDIT-8000-USWIFI 2 isolated RS-485 ports, configurable for 9.6 to 115.2 kbps. Support for 2 RS-485 protocols (BACnet MS/TP, LON, Modbus RTU). Two RJ-45 10/100 MB Ethernet with TCP/IP support for FOX, BACnet/IP, and Modbus TCP. Wi-Fi connectivity 802.11 a/b/g/n (US WLANCountry Code). Web Interface, embedded Workbench, integrated power supply and USB backup and restore.IT-8000-WWWIFI 2 isolated RS-485 ports, configurable for 9.6 to 115.2 kbps. Support for 2 RS-485 protocols (BACnet MS/TP, LON, Modbus RTU). Two RJ-45 10/100 MB Ethernet with TCP/IP support for FOX, BACnet/IP, and Modbus TCP. Wi-Fi connectivity 802.11 a/b/g/n (WorldwideWLAN Code). Web Interface, embedded Workbench, integrated power supply and USB backup and restore.IT-8000-NOWIFI 2 isolated RS-485 ports, configurable for 9.6 to 115.2 kbps. Support for 2 RS-485 protocols (BACnet MS/TP, LON, Modbus RTU). Two RJ-45 10/100 MB Ethernet with TCP/IP support for FOX, BACnet/IP, and Modbus TCP. NO Wi-Fi CONNECTIVITY. Web Interface,embedded Workbench, integrated power supply and USB backup and restore. Allow a minimum of two weeks for shipment.IT-8000 EXPANSION I/OIT8-EIO-16 IT-8000 16 Point Expansion IO Module. Powered by IT8-RIO-34 or external 15VDC power supply.Features 8UI, 4DO and 4AO. Requires IT-8000 and Niagara4 version 4.3 or higher.IT8-EIO-34 IT-8000 34 Point Expansion IO Module. Powered by an external 24VAC/DC power supply.Features 16UI, 10DO and 8AO. Requires IT-8000 and Niagara4 version 4.3 or higher.IT8-NPB-2X-485 IT-8000 add-on dual port RS-485 moduleIT8-NPB-232 IT-8000 add-on single port RS-232 moduleIT8-NPB-LON IT-8000 add-on single port LON FTT10A moduleIT8-WPM IT-8000 wall plug module. 100-240 VAC, 50/60 Hz.Connect to the 2.5 mm barrel plug, 24 V input to the IT-8000 and includes, US, EU, UK and AU plugs IT8-WIFI-EXT IT-8000 extension cable and bracket for WLAN antennaIT8-005-COR Adds support for up to 5 devices or 250 points. Requires IT-8000 & IT8-005-SM0IT8-010-COR Adds support for up to 10 devices or 500 points. Requires IT-8000 & IT8-010-SM0IT8-025-COR Adds support for up to 25 devices or 1,250 points. Requires IT-8000 & IT8-025-SM0IT8-100-COR Adds support for up to 100 devices or 5,000 points. Requires IT-8000 & IT8-100-SM0IT8-200-COR Adds support for up to 200 devices or 10,000 points. Requires IT-8000 & IT8-200-SM0IT8-010-DCP Adds support for an additional 10 devices or 500 points to the core (IT8-XXX-COR).Purchased at time of initial order with core software.IT8-025-DCP Adds support for an additional 25 devices or 1,250 points to the core (IT8-XXX-COR).Purchased at time of initial order with core software.IT8-050-DCP Adds support for an additional 50 devices or 2,500 points to the core (IT8-XXX-COR).IT8-010-DCU Adds support for an additional 10 devices or 500 points to the core (IT8-XXX-COR).Purchased any time after initial core software purchase.IT8-025-DCU Adds support for an additional 25 devices or 1,250 points to the core (IT8-XXX-COR).Purchased any time after initial core software purchase.IT8-050-DCU Adds support for an additional 50 devices or 2,500 points to the core (IT8-XXX-COR).Purchased any time after initial core software purchase.IT8-005-SM0 18-month software maintenance agreement.IT8-005-SM1 1-year software maintenance agreement for core software IT8-005-COR.IT8-005-SM3 3-year software maintenance agreement for core software IT8-005-COR.IT8-005-SM5 5-year software maintenance agreement for core software IT8-005-COR.IT8-010-SM0 18-month software maintenance agreement. Must be purchased in conjunction with initial core software IT8-010-COR.Optional 3 or 5-year maintenance may be substituted.IT8-010-SM1 1-year software maintenance agreement for core software IT8-010-COR.IT8-010-SM3 3-year software maintenance agreement for core software IT8-010-COR.IT8-010-SM5 5-year software maintenance agreement for core software IT8-010-COR.IT8-025-SM0 18-month software maintenance agreement. Must be purchased in conjunction with initial core software IT8-025-COR.Optional 3 or 5-year maintenance may be substituted.IT8-025-SM1 1-year software maintenance agreement for core software IT8-025-COR.IT8-025-SM3 3-year software maintenance agreement for core software IT8-025-COR.IT8-025-SM5 5-year software maintenance agreement for core software IT8-025-COR.IT8-100-SM0 18-month software maintenance agreement. Must be purchased in conjunction with initial core software IT8-100-COR.Optional 3 or 5-year maintenance may be substituted.IT8-100-SM1 1-year software maintenance agreement for core software IT8-100-COR.IT8-100-SM3 3-year software maintenance agreement for core software IT8-100-COR.IT8-100-SM5 5-year software maintenance agreement for core software IT8-100-COR.IT8-200-SM0 18-month software maintenance agreement. Must be purchased in conjunction with initial core software IT8-200-COR.Optional 3 or 5-year maintenance may be substituted.IT8-200-SM1 1-year software maintenance agreement for core software IT8-200-COR.IT8-200-SM3 3-year software maintenance agreement for core software IT8-200-COR.IT8-200-SM5 5-year software maintenance agreement for core software IT8-200-COR.IT8-FIPS Provides FIPS 140-2 Level 1 conformance using the integrated FIPS certified BouncyCastle module for IT-8000. Requires IT-8000 version 4.6 and later.IT8-OS-AX Enables IT-8000 to run Niagara AX operating system instead of N4.IT-8000 DRIVERSIT8-DR-AC Andover Controls AC256 over RS-232 or RS-485. (Beta version only)IT8-DR-AINF Andover Controls Infinity.IT8-DR-APHP American Auto-Matrix PHP over RS-232 or RS-485. Manufactured by 3rd party. Limited support.IT8-DR-APUP American Auto-Matrix PUP over RS-232 or RS-485. Manufactured by 3rd party. Limited support.IT8-DR-CCN Carrier Comfort Network.IT8-DR-FLEX Flex over RS-232 or RS-485.IT8-DR-GLOB IR controlled AV equipment via an RS-232 connection to a Global Cache FC module.Requires IT8-OS-AX. Supported in AX version 3.8U1 only.IT8-DR-HELV Helvar Lighting Control. Requires IT8-OS-AX. Supported in AX version 3.8U1 only.IT8-DR-HORT European Hortsmann meters. Requires IT8-OS-AX. Supported in AX version 3.8U1 only.IT8-DR-JOS Josam Grease Trap Sensor. Requires IT8-OS-AX. Supported in AX version 3.8U1 only.IT8-DR-LANGOVN Lang Oven over RS-232 or RS-485. Requires IT8-OS-AX. Supported in AX version 3.8U1 only.IT8-DR-MCQUAY McQuay to OPM driver.IT8-DR-MFID Micros Fidelio IP driver.IT8-DR-VDRT Veeder-Root over RS-232 or RS-485. Requires IT8-OS-AX. Supported in AX version 3.8U1 only.Cylon, UniPuts, Auto-Matrix, ASPECT, ASPECT-Enterprise, ASPECT-Studio, Auto-Flow, INTEGRA, Smart building solutions, flexible building solutions, Solution Integrator and V-STAT are either trademarks or registered trademarks of are registered trademarks of ABB Cylon Controls. BACnet is a registered trademark of ASHRAE; BTL is a registered trademark of the BACnet Manufacturers Association; Niagara AX Framework is a registered trademark of Tridium, Inc.; All other trademarks are property of their respective owners.。

BarTender 2022版本Starter Professional版本对比说明书

BarTender 2022版本Starter Professional版本对比说明书

--Starter ProfessionalBusiness label design and printing Easy-to-use design tools and basic printing management••Dynamic business printing Data entry forms, Intelligent Templates™, database connectivity, encoding and manual printing•Unlimited users Enable multiple users to print labels from any networked PC••Number of printers BarTender is licensed by printer Up to 3printers1+ printers----Starter ProfessionalStandard Maintenance and Support Upgrade to the latest BarTender version free, and get live technical support by phone and chatduring business hours with a guaranteed 24 hour response time. Access to online resources, plustechnical supportIncludes1 yearIncludes1 year----Starter ProfessionalEasy WYSIWYG template design Design tools make it easy to create and print professional labels and documents••Global support Intuitive, easy-to-use user interface, translated to more than 20 languages••Comprehensive help system A complete how-to library, accessible both through BarTender and on the web••Quick start A collection of configurable, industry-focused, ready-to-use BarTender templates••New Document Wizard An easy-to-follow wizard that ensures proper document settings for quality and printingperformance••Fonts Versatile support for OpenType, TrueType, Symbol Font characters and native printer-basedfonts••Text formatting Familiar, MS Word-like tools for creating and formating text••Transformed text Add flair to your text objects with a variety of effects, such as fading, inflating, slanting, and more••Shapes and lines Choose from over 50 shapes and 100 line style combinations••Dynamic text and object wrapping Create dynamic text that wraps inside and around shapes, objects, document borders and more••Unmatched barcode support Choose from over 100 1D and 2D symbologies based on over a dozen standards••Human readable barcode Highly configurable human readable text and character formatting options••GS1 Application Identifier Data Source Wizard Construct GS1-compliant barcodes in seconds••Graphics and images Import more than 70 graphic formats, including AI, PNG, JPG, BMP, TIF, EPS and GIF••Symbols Choose from a wide variety of included symbols and industry-based symbol fonts••Tables and grids Create tables and grids to organize text, barcodes, images and other objects••White-on-black printing Switch objects from black-on-white to white-on-black printing with a single click••Front and back template design Create two-sided, “duplex” printing with separate designs for the front and back of yourtemplate••Amazon Transparency support Create Amazon Transparency product serialization codes that help identify individual units andproactively prevent counterfeits••Embedded revision logging Capture a revision trail directly in the document — when it was saved, who saved it and includeadditional comments•Full color support Design commercial quality labels using PANTONE and data-sourced colors•----Starter Professional Suppression Ignore the content of a data source under certain conditions••Label templates Design and automation tools that leverage data to reduce the number of label files you manage•Conditional printing Create data-driven automation rules that specify when different objects, layers or templates inyour document will visibly print or become hidden•Template selector Conditionally print one specific template when multiple templates are available in a document•Layers Template objects may be stacked, hidden and reordered when created on uniquely identifiablelayers•Automatic face detection and cropping Automated image capture creates perfectly cropped photos for ID badges and card printing•Scriptable object properties Modify the look and feel of template objects by using Visual Basic (VB) scripts•----Starter Professional Date and time Dynamically source dates and times from Windows or clock-enabled printers••Data validation and processing Specify data validation rules and automatically correct data or issue warnings••Concatenate data Create text and barcode objects that combine information from multiple data sources••Basic database connectivity Import variable data from Excel or a RFC 4180 standard CSV files into your template••Simple serialization Increase or decrease your serial string data by increments of one (1)••Named database connections Name commonly used database connections to quickly add them to new document designs••Database filters Print select database records using convenient query and filter options#•Database sourced tables Easily create tables using data from a database or external file#•Dynamic data preview See how your document handles real dynamic data during the design process#•Dynamic graphics and images Automatically source images for printing based on selected database records or queries#•Embedded database tables Create your own database tables that travel with your BarTender document designs•Enhanced database connectivity Connect document designs to over 20 data sources such as SAP, Oracle, MS SQL, Azure SQL, XML,Excel, text files and more to print dynamically•Advanced serialization Create serial numbers that support alphanumeric, hexadecimal and custom sequencing patterns•Create a database Build your own database from scratch using intuitive tools included with BarTender•Write back to databases Write back to SQL-based databases to keep track of printed records, serial numbers and muchmore•Visual Basic (VB) scripting Create scripts for custom data processing•Global database field Centralize a data field and share it between BarTender documents•----Starter Professional Database record selection Select or query the correct database records at print time using helpful form controls•Powerful form controls Make data input and selection easy by leveraging over 15 highly configurable form controls•Keyboard and mouse input Use keyboard and mouse commands to select or enter data into forms at print time•Scanner input Use a barcode scanner to input information to data entry forms at print time•Weighing scale input Populate the weight of an item at print time by connecting your weighing scale to BarTender•Image capture Capture images at print time for ID cards or event badge printing•Data validation Reduce user input errors by introducing data validation and error checking•----Starter Professional Drivers by Seagull™More than 7,000 printers and output devices supported to enable high-performance printing••Print optimizations Improve print speed by taking full advantage of printer-based features such as serialization,barcodes, real-time clock, static data and graphic caching••Windows printer drivers Print to any printer that has a Windows-based driver••Printer configuration and diagnostics Perform printer management functions in BarTender, bypassing the printer front panel••On-demand and batch printing Print labels and documents on-demand or batch together using one or more BarTendertemplates••Print preview Review your dynamic print jobs before printing••Image exporting Export entire template images or specific objects in 35+ formats••RFID, smartcard and magnetic stripe encoding Encode RFID tags, smartcards and magnetic stripe cards as easily as adding barcodes to yourtemplate design•Native PDF generation Generate PDFs without installing third-party PDF drivers•----Starter Professional Status monitoring Reports information back to Windows regarding printer/print job status and error conditions••Email alerts Automatically notify IT managers or other operational team members if labeling problems occur••----# Basic databases only (Excel or RFC 4180 standard CSV file)BarTender Release 11.3 R5 and later versions。

bib参考文献编译

bib参考文献编译

bib参考文献编译English Answer:What is Bib (short for bibliography) reference compilation?Bib reference compilation is the process of compiling a list of sources that have been used in a research paper or other academic work. This list is typically placed at the end of the paper and includes information such as the author's name, the title of the work, the publication date, and the publisher. Bib reference compilation is an important part of the research process because it allows readers to identify the sources that the author has used and to verify the accuracy of the author's claims.How do I compile a Bib reference?There are a number of different ways to compile a Bib reference. One common method is to use a citationmanagement software program such as Zotero or Mendeley. These programs can help you to organize your sources, generate citations, and create bibliographies. Another method is to compile your references manually using a word processing program. If you are compiling your references manually, be sure to follow the specific style guidelines that are required by your instructor or publisher.What are the different types of Bib references?There are a number of different types of Bib references, including:Books: Books are typically cited using the following format:> Author's Last Name, First Name. (Year of Publication). _Title of Book_. Publisher.Journal Articles: Journal articles are typically cited using the following format:> Author's Last Name, First Name. (Year of Publication). Title of Article. _Title of Journal_, _Volume Number_(_Issue Number_), _Page Numbers_.Websites: Websites are typically cited using the following format:> Author's Last Name, First Name. (Year of Publication). Title of Article. Title of Website. URL.Why is it important to compile a Bib reference?There are a number of reasons why it is important to compile a Bib reference. First, it allows readers toidentify the sources that the author has used. This is important for two reasons. First, it allows readers toverify the accuracy of the author's claims. Second, it allows readers to learn more about the topic of the paperby exploring the sources that the author has used.Second, compiling a Bib reference helps to avoid plagiarism. Plagiarism is the act of using someone else'swork without giving them credit. When you compile a Bib reference, you are giving credit to the authors of the sources that you have used. This helps to avoid plagiarism and ensures that you are giving proper credit to the people whose work you have used.Third, compiling a Bib reference helps to make your paper more professional. A well-compiled Bib reference shows that you have taken the time to research your topic and that you are familiar with the relevant literature. This can make your paper more persuasive and can help you to get a better grade.Conclusion.Bib reference compilation is an important part of the research process. It allows readers to identify the sources that the author has used, to verify the accuracy of the author's claims, and to learn more about the topic of the paper. Compiling a Bib reference also helps to avoid plagiarism and makes your paper more professional.中文回答:什么是Bib(书目)参考文献汇编?Bib参考文献汇编就是将一篇研究论文或其他学术作品中使用过的资料来源汇编成一个列表的过程。

SystemVerilog 快速语法参考

SystemVerilog 快速语法参考

Extended Literal Values • integer literals and logic literals • unsized literal with a preceding apostrophe (’), e.g., ’0, ’1, ’X, ’x, ’Z, ’z // sets all bits to this value • real literals: fixed-point format or exponent format • time literals: s, ms, us, ns, ps, fs, step • string literals enclosed in quotes: \v for vertical tab, \f for form feed, \a for bell, \x02 for hex number

• • •
• •


• • • • • • • • Nhomakorabeaextended tasks and functions • C-like void functions • pass by reference • default arguments • argument binding by name • optional arguments • import/export function for DPI classes: object-oriented mechanism (abstraction, encapsulation, safe pointers) automatic testbench support with random constraints interprocess communication synchronization • semaphores • mailboxes • event extension, event variables, and event sequencing clarification and extension of the scheduling semantics cycle-based functionality: clocking blocks and cycle-based attributes • cycle-based signal drives and samples • synchronous samples • race-free program context assertion mechanism • property and sequence declarations • assertions and coverage statements with action blocks extended hierarchy support • packages for declaration encapsulation with import for controlled access • compilation-unit scope nested modules and extern modules for separation compilation support • extension of port declarations to support interfaces, events, and variables • $root to provide unambiguous access using hierarchical references interfaces to encapsulate communication and facilitate communicationoriented design functional coverage DPI for clean, efficient interoperation with other languages (C provided) assertion API coverage API data read API Verilog procedure interface (VPI) extension for SystemVerilog constructs concurrent assertion formal semantics

HP USB-C Dock G5 数据手册说明书

HP USB-C Dock G5 数据手册说明书

HP USB-C Dock G5Universal docking for today's laptopsConnect your USB-C®-enabled laptop to your displays, accessories, and wired network with the versatile, elegant, and space-saving HP USB-C® Dock G5.Compatibility without constraintsDesigned with universal compatibility in mind, this dock works with both HP and non-HP USB-C®- and Thunderbolt™-enabled laptops.Clear the clutterAvoid a messy desk by using a simple one-cord setup that plugs in multiple devices.*Product image may differ from actual product 1Easily manage your environment Help secure and remotely manage your laptop with this dock that has advanced network manageability features.Single-cable solution Add your accessories and up to three displays to the dock. Then simply connect it to your laptop through a single USB-C® cable to access your devices and charge your PC.Small footprint Reclaim your desk with a compact dock that takes up only 5 x 5 inches of space.Efficient rmware updates Save time with dock rmware updates pushed to your laptop, even when they are not connected.134Product number5TW10AASupported platforms Compatible with HP laptops, MacBook® computers, and other laptops. UPC number(ABB) 193905208531; (ABU) 193905208586Port and connectors Front:1 USB-C® port with data and power out (15W)1 USB-C® cable to connect to host system Side:2 USB 3.0 charging ports1 combo audio jack Back:2 USB 3.0 charging ports2 DisplayPort™ ports1 RJ45 port1 HDMI 2.0 port1 standard lock slotSecurity management 1 Lock slot (side, lock is sold separately)Power supply Power to system: Up to 100W via USB-C® Power to host (USB-C PD): 5V , 9V, 10V, 12V, 15V, 20V all at 5A MAX Technical notes External monitor support: 2 plus host notebook's screenSupport service included HP 3 years Advanced Exchange Bundled Support Denmark Sweden Norway Finland. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit /go/cpc. HP Services are governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP Product.Product color BlackSupported operating systems Windows 10; Windows 11; macOS; Chrome OS™System Requirements, Minimum USB Type-C® (USB Power Delivery, Alt Mode DisplayPort™) Warranty One-year limited warranty.What's in the box HP USB-C® Dock G5 AC AdapterAC Power cord Product notices WarrantyQuick Start guideCountry of origin Made in China Dimensions (W x D x H)12.2 x 12.2 x 4.5 cm Weight0.75 kg Package dimensions (W x D x H)19.2 x 15.6 x 16.5 cm Package weight 1.49 kgMaster carton dimensions (W x D x H)48.3 x 39.2 x 17.5 cm Master carton weight8.94 kg 2Messaging FootnotesFor USB-C® functionality, host PC must support the DisplayPort™ Alt mode protocol through its USB-C® port. Thunderbolt™-enabled notebooks will function at USB-C® speeds. Charging and port replication is supported on notebooks that have implemented USB-C® industry speci cations. Power button to turn on or wake the system, on HP notebooks. HP does not provide Ethernet and audio drivers on Mac PCs. Based on HP internal testing on select non-HP notebook models compatible with USB-C® industry standards. Certain Alt mode features are not supported, such as power button. Visit the HP Support page to determine your HP notebook's wattage and port speci cations. Visit the support page of your non-HP notebook to determine its wattage and port speci cations. Capable of supporting all three display outputs at the same time. Internet connection required and sold separately. Managed PC must be running Windows 10. HP includes a one-year limited warranty with online support available 24x7. Consult the HP Customer Support Center for details, or go to /go/orderdocuments. Internet access required and not included.© Copyright 2023 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services.Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.November 202312345。

1734系列数字电流输入模块说明书

1734系列数字电流输入模块说明书

22 Select POINT I/O ModulesDigital DC Input ModulesDigital DC Output Modules1734 Digital DC Input Modules Technical Specifications1734-IB21734-IB41734-IB4D 1734-IB81734-IV21734-IV41734-IV8Sinking Input Modules Sourcing Input ModulesNumber of inputs 2448248Diagnostics——Yes————Voltage, on-state input, nom 24V DC Voltage, on-state input, min 10V DC Voltage, on-state input, max 28.8V DCInput delay time, on to off 0.5 ms hardware + (0…65 ms selectable)(1)Current, on-state input, min 2 mA Current, on-state input, max 5 mA Current, off-state input, max 1.5 mAPOINTBus current (mA)75 mA max @ 5V DC 50 mA max @ 5V DC 75 mA max @ 5V DC Power dissipation, max 0.7 W @ 28.8V DC1.0 W @ 28.8V DC0.6 W max @ 28.8V DC 1.6 W @ 28.8V DC 0.7 W @ 28.8V DC 1.0 W @ 28.8V DC 1.6 W @ 28.8V DC Thermal dissipation, max 2.4 BTU/hr @ 28.8V DC 3.4 BTU/hr @ 28.8V DC1.9 BTU/hr @ 28.8V DC5.5 BTU/hr @ 28.8V DC2.4 BTU/hr @ 28.8V DC3.4 BTU/hr @ 28.8V DC5.5 BTU/hr @ 28.8V DCTerminal base unit1734-TB, 1734-TBS, 1734-TOP , or 1734-TOPS(1)Input ON-to-OFF delay time is the time from a valid input signal to recognition by the module.1734 Digital DC Output Modules Technical Specifications1734-OB2(1)1734-OB2E1734-OB2EP1734-OB4(1)1734-OB4E1734-OB8(1)1734-OB8E1734-OV2E1734-OV4E1734-OV8ESourcing Output ModulesSinking Output Modules Number of outputs 2448248Diagnostics —YesYes—Yes—Yes YesYesYesElectronically protected Yes Voltage, on-state output, nom 24V DCVoltage, on-state output, min10V DCAllen-Bradley 1734-OB8Select POINT I/O Modules 23Digital Contact ModulesVoltage, on-state output, max28.8V DCOutput current rating, max 2.0 A per module, 1.0A per channel4.0 A per module, 2.0 A per channel3.0 A per module, 1.0 A per channel2.0 A max per module, 1.0 A per output3.0 A per module, 1.0 A per output 3.0 A per module, 1.0 A per channelPOINTBus current (mA) 75Power dissipation, max ************3.4 W @ 28.8V DC************************0.8 W max @ 28.8V DC 1.2 W max @ 28.8V DC 2.0 W max @ 28.8V DC Thermal dissipation, max2.7BTU/********DC 11.6 BTU/hr @ 28.8V DC4.1BTU/********DC 6.8BTU/********DC2.7 BTU/hr @ 28.8V DC 4.1 BTU/hr @ 28.8V DC 6.8BTU/hr @ 28.8V DCTerminal base unit1734-TB, 1734-TBS, 1734-TOP , or 1734-TOPS (1)Non-diagnostic, standard output modules.1734 Digital DC Output Modules Technical Specifications1734-OB2(1)1734-OB2E1734-OB2EP1734-OB4(1)1734-OB4E1734-OB8(1)1734-OB8E1734-OV2E1734-OV4E1734-OV8E1734 Digital Contact Modules Technical Specifications1734-OW21734-OW4 1734-OX2Number of outputs2 N.O. relays4 N.O. relays2 Form C (N.O./N.C.) relays, isolated Output delay time, on to off, max 26 ms (1)10 ms (1)Contact resistance, initial 30 m ΩLeakage current, off-state output, max1.2 mA and bleed resistor through snubber circuit @ 240V AC 1.2 mA and bleed resistor through snubber circuit @ 240V AC POINTBus current (mA) 80 100Power dissipation, max 0.5 W Thermal dissipation, max 1.7 BTU/hrTerminal base unit1734-TB, 1734-TBS, 1734-TOP , or 1734-TOPS(1)Time from valid output off signal to relay deenergization by module.Mounting Requirements 63 Approximate Mounting DimensionsPOINT I/O with 1734-PDN Mounting DimensionsIMPORTANT When mounting the 1734-IB8S, 1734-OB8S, and 1734-IE4S modules, ensure that there is 2in. of clearance space above thePOINT rail.Allen-Bradley 1734-OB8。

PNY Quadro P1000 显卡说明书

PNY Quadro P1000 显卡说明书

1 VGA/DVI/HDMI support via adapter/connector/bracket |2 Windows 7, 8, 8.1 and Linux |3 Product is based on a published Khronos Specification, and is expected to pass the Khronos Conformance Testing Process when available. Current conformance status can be found at /conformance |4 GPU supports DX 12.0 API, Hardware Feature Level 12_1© 2021 NVIDIA Corporation and PNY. All rights reserved. NVIDIA, the NVIDIA logo, Quadro, nView, CUDA, and NVIDIA Pascal are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. The PNY logotype is a registered trademark of PNY Technologies. OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. All other trademarks and copyrights are the property of their respective owners. J U N21Full Professional Performance and Features in a Small Form Factor . The Quadro P1000 combines a 640 CUDA core Pascal GPU, 4 GB GDDR5 on-board memory and advanced display technologies in a low-profile form factor to deliver amazing graphics performance for demanding professional applications. Support for four 4K displays (4096x2160 @ 60Hz) with HDR color gives you an expansive visual workspace to see your ideas come to life in stunning detail.Quadro cards are certified with a broad range of sophisticated professional applications, tested by leading workstation manufacturers, and backed by a global team of support specialists. This gives you the peace of mind to focus on doing your best work. Whether you’re developing revolutionary products or telling spectacularly vivid visual stories, Quadro gives you the performance to do it brilliantly. THE PNY ADVANTAGE PNY provides unsurpassed service and commitment to its professional graphics customers. In addition, PNY delivers a complete solution that includes the appropriate adapters, cables, brackets, driver software installation disc, and documentation to ensure a quick and successful install.FEATURES >Four mini DisplayPort 1.4 Connectors 1 >DisplayPort with Audio >NVIDIA nView ® Desktop Management Software >HDCP 2.2 Support >NVIDIA Mosaic 2 >NVIDIA Iray and MentalRay Support PACKAGE CONTENTS >NVIDIA ® Quadro ® P1000 Professional Graphics Board >Aattached full-height (ATX) bracket >Unattached low-profile (SFF) bracket >Four mDP to DP adapters >Printed Quick Start Guide >Printed Support Guide WARRANTY AND SUPPORT >3-Year Warranty >Pre- and Post-Sales Technical Support >Dedicated Field Application Engineers >Direct Tech Support Hot Lines PNY PART NUMBER VCQP1000V2-PB SPECIFICATIONS GPU Memory 4 GB GDDR5Memory Interface 128-bit Memory Bandwidth Up to 80 GB/s NVIDIA CUDA ® Cores 640 System Interface PCI Express 3.0 x16Max Power Consumption 47 W Thermal Solution Active Form Factor2.713” H x 6.061” L, Single Slot, Low Profile Display Connectors4x mDP 1.4 Max Simultaneous Displays4 direct, 4 DP 1.4 Multi-Stream Display Resolution4x 4096x2160 @ 60Hz 4x 5120x2880 @ 60Hz Graphics APIs Shader Model 5.1, OpenGL 4.53, DirectX 12.04, Vulkan 1.03Compute APIsCUDA, DirectCompute, OpenCL ™ UNMATCHED POWER.UNMATCHED CREATIVE FREEDOM. NVIDIA ® QUADRO ®P1000。

Enhanced Help for R Users说明书

Enhanced Help for R Users说明书

Package‘ehelp’January7,2023Title Enhanced Help to Enable``Docstring''-Comments in Users FunctionsVersion1.2.1Author Marcelo Ponce[aut,cre]Maintainer Marcelo Ponce<*******************>Description By overloading the R help()function,this package allows users to use``doc-string''style comments within their own defined functions.The package also provides addi-tional functions to mimic the R basic example()function and the prototyping of packages.URL https:///mponce0/eHelpBugReports https:///mponce0/eHelp/issuesLicense GPL(>=2)Encoding UTF-8RoxygenNote7.1.0Suggests testthat(>=2.1.0),knitr,rmarkdown,crayonVignetteBuilder knitrNeedsCompilation noRepository CRANDate/Publication2023-01-0623:30:09UTCR topics documented:eexample (2)help (2)simulatePackage (3)Index412helpeexample function that allows to execute the examples from user defined func-tionsDescriptionfunction that allows to execute the examples from user defined functionsUsageeexample(...,skip.donts=FALSE)Arguments...function name of a user defined fnskip.donts boolean argument to specify whether dontest or dontrun examples should be skiped or nothelp Wrapper Help FunctionDescriptionThis function is a wrapper around the R’s system help()function.It allows the user to include docstring styles documentation and displayed it as help or information to the users using the help() command.Usagehelp(topic,package=NULL,lib.loc=NULL,verbose=getOption("verbose"),try.all.packages=getOption("help.try.all.packages"),help_type=getOption("help_type"))Argumentstopic topic/or/function name to search forpackage package where to searchlib.loc location of R librariesverbose for diplaying thefilenametry.all.packagesattempt to go trough all installed packageshelp_type format of the displayed help(text,html,or pdf)simulatePackage3DetailsParameters are the same as in utils::help,see help(help,package=’utils’)for further details.Examplescompute3Dveloc<-function(x,y,z,t){# @fnName compute3Dveloc# this function computes the velocity of an object in a3D space# @param x vector of positions in the x-axis# @param y vector of positions in the y-axis# @param z vector of positions in the z-axis# @param t time vector corresponding to the position vector#number of elements in vectorsn<-length(t)#compute delta_tdelta_t<-t[2:n]-t[1:n-1]#compute delta_xdelta_x<-x[2:n]-x[1:n-1]#compute delta_ydelta_y<-y[2:n]-y[1:n-1]#compute delta_zdelta_z<-z[2:n]-z[1:n-1]#do actual computation of velocity...veloc3D<-list(delta_x/delta_t,delta_y/delta_t,delta_z/delta_t)#return valuereturn(veloc3D)}help(compute3Dveloc)simulatePackage function that allows to load the functions from a package in prepara-tion for CRAN,as if it is being loaded by loading all the fns defined inthe R sub-directory of the package,ie."myPckg/R"Descriptionfunction that allows to load the functions from a package in preparation for CRAN,as if it is being loaded by loading all the fns defined in the R sub-directory of the package,ie."myPckg/R"UsagesimulatePackage(pkgLocation=NULL)ArgumentspkgLocation path to the base loaction of the package,under which is expected to found the R sub-directoryIndexeexample,2help,2simulatePackage,34。

拓扑林特林(Triptorelin)激素释放剂抗原模拟剂说明书

拓扑林特林(Triptorelin)激素释放剂抗原模拟剂说明书

218.0 Submucous leiomyoma of uterus
218.1 218.2 218.9 259.1 185
Intramural leiomyoma of uterus Subserous leiomyoma of uterus Leiomyoma of uterus, unspecified Precocious sexual development and puberty, not elsewhere classified Malignant neoplasm of prostate
Trelstar Depot® (triptorelin)
Last Review Date: 03/25/2014 Date of Origin: 11/28/2011
Prior Auth Available:
√ Post-service edit:
Dates Reviewed: 12/13/2011, 03/2012, 06/19/2012, 09/06/2012, 12/06/2012, 03/07/2013, 06/06/2013, 09/05/2013, 12/05/2013, 03/25/2014 √ Medical Necessity Criteria Number: IC-0131
V. Dosage/Administration: Indication Prostate Cancer All other indications
Dose 3.75 mg intramuscularly (IM) once every 4 weeks, 11.25 mg IM once every 12 weeks, or 22.5 mg IM once every 24 weeks 3.75mg every 4 weeks

sliceadmiral

sliceadmiral

sliceadmiralSliceadmiral: A Comprehensive Guide to Efficient Slicing OperationsIntroductionThe process of slicing plays a crucial role in various industries, especially in manufacturing and 3D printing. It involves dividing a digital model into multiple layers or slices that can be printed or manufactured individually. Sliceadmiral is a cutting-edge software that enables users to optimize and streamline their slicing operations, ultimately leading to enhanced productivity and superior output quality. In this document, we will explore the key features, benefits, and applications of Sliceadmiral, as well as provide a step-by-step guide to help you harness the full potential of this powerful tool.I. Understanding SliceadmiralA. Overview- Brief description of Sliceadmiral's functionalities and capabilities.B. System Requirements- Minimum hardware and software requirements to run Sliceadmiral smoothly.C. Installation Process- Step-by-step guide on how to install Sliceadmiral on your device.II. Key FeaturesA. Advanced Slicing Algorithms- An in-depth explanation of the advanced algorithms used by Sliceadmiral to optimize slicing operations.B. Customizable Slicing Settings- How to tailor slicing settings to specific requirements, such as layer thickness, print speed, and infill density.C. Automated Support Generation- Overview of Sliceadmiral's automated support generation feature that enhances the stability of complex prints.D. Preview and Simulation- How to utilize the preview and simulation functions in Sliceadmiral to visualize the printing process and identify potential issues.E. Multi-material Slicing- Details on the ability of Sliceadmiral to handle multi-material slicing, allowing for the creation of intricate and versatile prints.III. Benefits of SliceadmiralA. Time Efficiency- Explanation of how Sliceadmiral's algorithms optimize slicing operations, reducing printing time.B. Material Optimization- How Sliceadmiral minimizes material wastage through efficient infill patterns and support generation.C. Print Quality Enhancement- Discussion of how Sliceadmiral improves print quality through precise slicing and customizable settings.D. Cost Savings- Overview of how Sliceadmiral's optimization features lead to lower operating costs in terms of time, material, and maintenance.IV. Applications of SliceadmiralA. Manufacturing Industry- How Sliceadmiral revolutionizes manufacturing processes, enabling the creation of intricate and functional parts.B. Healthcare Sector- Discussion of how Sliceadmiral is used in medical applications, such as creating anatomical models and prosthetics.C. Architecture and Design- Explanation of how Sliceadmiral assists architects and designers in bringing their creative visions to life through precise slicing.D. Education and Research- How Sliceadmiral is utilized in educational institutions and research facilities for experimentation and prototype development.V. Getting Started with SliceadmiralA. Importing and Preparing Models- Step-by-step guide on importing digital models into Sliceadmiral and preparing them for the slicing process.B. Customizing Slicing Settings- How to adjust various settings in Sliceadmiral to achieve desired print characteristics.C. Previewing and Analyzing Slices- Instructions on how to utilize the preview and analysis features to ensure accurate and optimized slicing.D. Exporting Slice Files- Guide on exporting the sliced models into formats suitable for 3D printers or manufacturing machines.VI. Troubleshooting and SupportA. Common Issues and Solutions- Identification of common problems encountered during slicing and their corresponding solutions.B. Support Resources- Overview of available support resources, including forums, tutorials, and customer support channels.ConclusionSliceadmiral is a cutting-edge software that revolutionizes the slicing process in various industries. By optimizing slicing operations, Sliceadmiral enhances productivity, saves time and materials, and improves the overall quality of prints. This comprehensive guide has provided an overview ofSliceadmiral's capabilities, benefits, and applications, as well as a step-by-step guide to help users maximize their utilization of the software. With Sliceadmiral, manufacturers, designers, researchers, and educators can elevate their slicing operations to new levels of efficiency and creativity.。

Netskope数据安全说明书

Netskope数据安全说明书

Data SheetKey Benefits and CapabilitiesFind cloud services in use and assess risk Netskope can discover 50,000+ cloud apps and Netskope Cloud Confidence Index (CCI) provides risk-ratings for cloud apps to help devise appropriate security policies.Protect data across thousands of cloud servicesProvides a single-pane-of-glass view andenforcement across SaaS and IaaS activity. A single easy-to-use policy interface to create security policies across cloud services, apps, and digital assets.Stop data exfiltration from managed to unmanaged cloud applicationsPrevent users on corporate cloud services (Outlook in Microsoft 365, Box, etc.), who download sensitive data, from uploading that data to unmanaged or personal cloud apps.Protect against cloud threatsStop malware and advanced threats from infected users spreading through yourorganization. Directly block malware whether it’s delivered from collaboration tools ordownloaded from a cloud storage service to a sync client.Granular control of personal devices accessing managed cloud servicesEnforce granular control of unmanaged devices that have single-sign-on (SSO) access tomanaged cloud services, like Box and Microsoft 365. Discover, create, and enforce granular security controls.Confidently Adopt the CloudThe cloud is transforming your organization. It’s changing howwork happens as everything is more intuitive, connected, open, and collaborative. This creates new challenges in protecting SaaS and IaaS that legacy security solutions can’t address.Why is Netskope the best choice?With Netskope CASB, a core component of Netskope Intelligent Security Service (SSE), you can confidently adopt cloud applications and services – without sacrificing security. Manage the unintentional or unapproved movement of sensitive data between cloud app instances and in the context of app risk and user risk with Netskope’s industry leading cloud security solution.Safely enable users anywhere•Eliminate blind spots: With Patented Netskope Cloud XD™, get deeperunderstanding to quickly target and control activities across thousands of cloud (SaaS and IaaS) services and millions of websites.•Secure managed and unmanaged cloud services: Secure managed cloud services like Microsoft 365, G Suite and AWS, while safely enabling unmanaged, business-led cloud services without the need for blocking.•Guard sensitive data with award-winning DLP: Netskope DLP and introspection enables the protection of sensitive content that matches DLP profiles. Includes pre-defined DLP profiles for regulatory compliance.•Stop elusive cloud threats and malware: Protect against malware, advanced threats, and cloud-enabled threats with anti-malware, sandboxing, ML analysis, and more.“Easy to use and Powerful CASB solution.”– Infosec Engineer, IT Services Firm, Gartner Peer Insights, SSE, CASB, Oct. 5, 2021Data in Motion Protection (Inline CASB)Protection (API CASB)Management (SSPM)Protection (API CASB)ManagementNetskope, a global cybersecurity leader, is redefining cloud, data, and network security to help organizations apply Zero Trust principles to protect data. The Netskope Intelligent Security Service Edge (SSE) platform is fast, easy to use, and secures people, devices, and data anywhere they go. Learn how Netskope helps customers be ready for anything, visit .©2022 Netskope, Inc. All rights reserved. Netskope is a registered trademark and Netskope Active, Netskope Cloud XD, Netskope Discovery, Cloud Confidence Index, and SkopeSights are trademarks of Netskope, Inc. All other trademarks are trademarks of their respective owners. 06/22 DS-550-1YOUR NEEDS THE NETSKOPE SOLUTIONCloud app risk scoringNetskope’s Cloud Confidence Index (CCI) can automatically audit your traffic to discover your overall risk profile across thousands of applications used within your environment. Each application is given a risk-score to help you determine the level of overall risk present and to help mitigate threats to your organization.Advanced data loss protectionAdvanced data loss protection (DLP) capabilities enhanced by contextual awareness of content being used in the cloud and machine learning enhancements to simplify and expedite data scanning and classification. Real-time notifications and coaching to users conducting risky activities or moving sensitive data, improve user behavior. Ensure sensitive documents and data do not leak outside the organization.Granular visibility and controlInline visibility for thousands of apps (managed and unmanaged) in use, including users, file names, activity, and other contextual data. Define targeted security policies based on user, app, instance, risk, activity, data, device type and more.Global scale and performanceNetskope NewEdge is the world’s largest, highest-performing security private cloud and powers the real-time, inline security services of the Netskope Intelligent SSE.. Netskope solutions like CASB, NG SWG, SSPM, CSPM, ZTNA, DLP, and ATP run on NewEdge to provide maximum performance and efficacy worldwide.Flexible deployment options for any use caseCASB deployment options support any use case, from an API-only deployment mode to several real-time options including forward and reverse proxy, with the ability to deploy 100% in the cloud or in a hybrid deployment. With combined API and inline CASB deployments, benefit from API enriched policy.The Netskope DifferenceFast everywhere, data-centric, and cloud-smart.Using patented technology called Netskope Cloud XD™, the Netskope Security Cloud eliminates blind spots by going deeper than any other security provider to quickly target and control activities across thousands of cloud (SaaS and IaaS) services and millions of websites. With full control from one cloud, our customers benefit from 360-degree data protection that guards data everywhere and advanced threat protection, including targeted RBI for risky websites that stops elusive attacks.A I -P o w e r e dZero Trust EngineData ProtectionThreat ProtectionCloud Risk ManagementInternet of Things。

MP1484 3A、18V、340KHz同步rectified步态降压转换器说明书

MP1484 3A、18V、340KHz同步rectified步态降压转换器说明书

3A, 18V, 340KHz Synchronous Rectified Step-Down ConverterDESCRIPTIONThe MP1484 is a monolithic synchronous buck regulator. The device integrates top and bottom 85m Ω MOSFETS that provide 3A of continuous load current over a wide operating input voltage of 4.75V to 18V. Current mode control provides fast transient response and cycle-by-cycle current limit.An adjustable soft-start prevents inrush current at turn-on and in shutdown mode, the supply current drops below 1µA.The MP1484 is PIN compatible to the MP1482 2A/18V/Synchronous Step-Down Converter.FEATURES• 3A Continuous Output Current• Wide 4.75V to 18V Operating Input Range • Integrated 85m Ω Power MOSFET Switches • Output Adjustable from 0.925V to 15V • Up to 95% Efficiency • Programmable Soft-Start• Stable with Low ESR Ceramic Output Capacitors • Fixed 340KHz Frequency• Cycle-by-Cycle Over Current Protection • Input Under Voltage Lockout• Thermally Enhanced 8-Pin SOIC PackageAPPLICATIONS• FPGA, ASIC, DSP Power Supplies • LCD TV • Green Electronics/Appliances • Notebook Computers“MPS” and “The Future of Analog IC Technology” are Registered Trademarks of Monolithic Power Systems, Inc.TYPICAL APPLICATION10095908580757065605550E F F I C I E N C Y (%)0.11.010LOAD CURRENT (A)Efficiency vs Load CurrentPACKAGE REFERENCE* For Tape & Reel, add suffix –Z (e.g. MP1484EN -Z)For Lead Free, add suffix –LF (e.g. MP1484EN - LF-Z)ABSOLUTE MAXIMUM RATINGS (1)Supply Voltage V IN .......................–0.3V to +24V Switch Voltage V SW .................–1V to V IN + 0.3V Boost Voltage V BS ..........V SW – 0.3V to V SW + 6V All Other Pins.................................–0.3V to +6V Junction Temperature...............................150°C Lead Temperature....................................260°C Storage Temperature .............–65°C to +150°CRecommended Operating Conditions (2)Input Voltage V IN ............................4.75V to 18V Output Voltage V OUT ....................0.925V to 15V Ambient Operating Temp..............–20°C to +85°CThermal Resistance (3)θJA θJCSOIC8N(Exposed Pad)..........50......10...°C/WNotes:1) Exceeding these ratings may damage the device. 2) The device is not guaranteed to function outside of itsoperating conditions.3) Measured on approximately 1” square of 1 oz copper.ELECTRICAL CHARACTERISTICSV IN = 12V, T A= +25°C, unless otherwise noted.Parameter Symbol Condition Min Typ Max UnitsShutdown Supply Current V EN = 0V0.3 3.0 µA Supply Current V EN = 2.0V, V FB = 1.0V1.31.5mAFeedback VoltageV FB4.75V ≤ V IN ≤ 18V0.900 0.925 0.950 V Feedback Overvoltage Threshold 1.1 V Error Amplifier Voltage Gain (4) A EA 400 V/V Error Amplifier Transconductance G EA∆I C = ±10µA 820 µA/V High-Side/Low-Side Switch On-Resistance (4)85 m Ω High-Side Switch Leakage Current V EN = 0V, V SW = 0V 0 10 µA Upper Switch Current Limit Minimum Duty Cycle 3.8 5.3 A Lower Switch Current LimitFrom Drain to Source0.9 A COMP to Current Sense Transconductance G CS5.2A/VOscillation FrequencyF osc1300 340 380 KHzShort Circuit Oscillation Frequency F osc2 V FB = 0V 110 KHz Maximum Duty Cycle D MAX V FB = 1.0V 90 %Minimum On Time (4)T ON 220 ns EN Shutdown Threshold Voltage V EN Rising 1.1 1.5 2.0 V EN Shutdown Threshold Voltage Hysterisis220 mVELECTRICAL CHARACTERISTICS (continued) V IN = 12V, T A = +25°C, unless otherwise noted.Parameter Symbol Condition Min Typ Max UnitsEN Lockout Threshold Voltage2.2 2.5 2.7 V EN Lockout Hysterisis210 mV Input Under Voltage Lockout ThresholdV IN Rising3.804.054.40VInput Under Voltage Lockout Threshold Hysteresis 210 mVSoft-Start Current V SS = 0V 6 µA Soft-Start PeriodC SS = 0.1µF 15 ms Thermal Shutdown (4)160 °CNote:4) Guaranteed by design, not tested.PIN FUNCTIONSPin #Name Description1 BSHigh-Side Gate Drive Boost Input. BS supplies the drive for the high-side N-Channel MOSFETswitch. Connect a 0.01µF or greater capacitor from SW to BS to power the high side switch. 2 INPower Input. IN supplies the power to the IC, as well as the step-down converter switches.Drive IN with a 4.75V to 18V power source. See Input Capacitor .3 SW Power Switching Output. SW is the switching node that supplies power to the output. Connectthe output LC filter from SW to the output load. Note that a capacitor is required from SW toBS to power the high-side switch.4 GND Ground (Connect the exposed pad to Pin 4).5 FB Feedback Input. FB senses the output voltage and regulates it. Drive FB with a resistivevoltage divider connected to it from the output voltage. The feedback threshold is 0.925V. SeeSetting the Output Voltage .6 COMP Compensation Node. COMP is used to compensate the regulation control loop. Connect aseries RC network from COMP to GND. In some cases, an additional capacitor from COMP toGND is required. See Compensation Components.7 ENEnable Input. EN is a digital input that turns the regulator on or off. Drive EN high to turn onthe regulator; low to turn it off. Attach to IN with a 100k Ω pull up resistor for automatic startup.8 SS Soft-Start Control Input. SS controls the soft-start period. Connect a capacitor from SS to GNDto set the soft-start period. A 0.1µF capacitor sets the soft-start period to 15ms. To disable thesoft-start feature, leave SS unconnected.MP1484TYPICAL PERFORMANCE CHARACTERISTICSC1 = 4.7µF, C2 = 2 x 10µF, L= 10µH, C SS= 0.1µF, T A = +25°C, unless otherwise noted.MP1484OPERATIONFUNCTIONAL DESCRIPTIONThe MP1484 regulates input voltages from 4.75V to 18V down to an output voltage as low as 0.925V, and supplies up to 3A of load current.The MP1484 uses current-mode control to regulate the output voltage. The output voltage is measured at FB through a resistive voltage divider and amplified through the internal transconductance error amplifier. The voltage at the COMP pin is compared to the switch current (measured internally) to control the output voltage.The converter uses internal N-Channel MOSFET switches to step-down the input voltage to the regulated output voltage. Since the high side MOSFET requires a gate voltage greater than the input voltage, a boost capacitor connected between SW and BS is needed to drive the high side gate. The boost capacitor is charged from the internal 5V rail when SW is low. When the FB pin voltage exceeds 20% of the nominal regulation value of 0.925V, the over voltage comparator is tripped and the COMP pin and the SS pin are discharged to GND, forcing the high-side switch off.ENCOMPSSFBGNDSWBSINFigure 1—Functional Block DiagramAPPLICATIONS INFORMATIONCOMPONENT SELECTIONSetting the Output VoltageThe output voltage is set using a resistive voltage divider connected from the output voltage to FB. The voltage divider divides the output voltage down to the feedback voltage by the ratio:2R 1R 2R V V OUTFB +=Thus the output voltage is:2R 2R 1R 925.0V OUT +×= R2 can be as high as 100k Ω, but a typical value is 10k Ω. Using the typical value for R2, R1 is determined by:)925.0V (81.101R OUT −×= (k Ω)For example, for a 3.3V output voltage, R2 is 10k Ω, and R1 is 26.1k Ω. Table 1 lists recommended resistance values of R1 and R2 for standard output voltages.Table 1—Recommended Resistance ValuesVOUT R1 R2 1.8V 9.53k Ω 10k Ω 2.5V 16.9k Ω 10k Ω 3.3V 26.1k Ω 10k Ω 5V 44.2k Ω 10k Ω 12V 121k Ω 10k ΩInductorThe inductor is required to supply constant current to the load while being driven by the switched input voltage. A larger value inductor will result in less ripple current that will in turn result in lower output ripple voltage. However, the larger value inductor will have a larger physical size, higher series resistance, and/or lower saturation current. A good rule for determining inductance is to allow the peak-to-peak ripple current to be approximately 30% of the maximum switch current limit. Also, make sure that the peak inductor current is below the maximum switch current limit.The inductance value can be calculated by:⎟⎟⎠⎞⎜⎜⎝⎛−×∆×=IN OUT L S OUTV V 1I f V L Where V OUT is the output voltage, V IN is the input voltage, f S is the switching frequency, and ∆I L is the peak-to-peak inductor ripple current. Choose an inductor that will not saturate under the maximum inductor peak current, calculated by:⎟⎟⎠⎞⎜⎜⎝⎛−×××+=IN OUT S OUT LOAD LP V V 1L f 2V I I Where I LOAD is the load current.The choice of which style inductor to use mainly depends on the price vs. size requirements and any EMI constraints.Optional Schottky DiodeDuring the transition between the high-side switch and low-side switch, the body diode of the low-side power MOSFET conducts the inductor current. The forward voltage of this body diode is high. An optional Schottky diode may be paralleled between the SW pin and GND pin to improve overall efficiency. Table 2 lists example Schottky diodes and their Manufacturers.Table 2—Diode Selection GuidePart NumberVoltage/CurrentRatingVendorB130 30V, 1A Diodes, Inc. SK1330V, 1ADiodes, Inc. MBRS130 30V, 1AInternationalRectifierInput CapacitorThe input current to the step-down converter is discontinuous, therefore a capacitor is required to supply the AC current while maintaining the DC input voltage. Use low ESR capacitors for the best performance. Ceramic capacitors are preferred, but tantalum or low-ESR electrolytic capacitors will also suffice.Choose X5R or X7R dielectrics when using ceramic capacitors.Since the input capacitor (C1) absorbs the input switching current, it requires an adequate ripple current rating. The RMS current in the input capacitor can be estimated by:⎟⎟⎠⎞⎜⎜⎝⎛×−×=IN OUT IN OUT LOAD 1C V V1V V I I The worst-case condition occurs at V IN = 2V OUT , where I C1 = I LOAD /2. For simplification, use an input capacitor with a RMS current rating greater than half of the maximum load current. The input capacitor can be electrolytic, tantalum or ceramic. When using electrolytic or tantalum capacitors, a small, high quality ceramic capacitor, i.e. 0.1µF, should be placed as close to the IC as possible. When using ceramic capacitors, make sure that they have enough capacitance to provide sufficient charge to prevent excessive voltage ripple at input. The input voltage ripple for low ESR capacitors can be estimated by:⎟⎟⎠⎞⎜⎜⎝⎛−×××=∆IN OUT IN OUT S LOAD IN V V 1V V f 1C I V Where C1 is the input capacitance value.Output CapacitorThe output capacitor (C2) is required to maintain the DC output voltage. Ceramic, tantalum, or low ESR electrolytic capacitors are recommended. Under typical application conditions , a minimum ceramic capacitor value of 20 µF is recommended on the output. Low ESR capacitors are preferred to keep the output voltage ripple low. The output voltage ripple can be estimated by:⎟⎟⎠⎞⎜⎜⎝⎛××+×⎟⎟⎠⎞⎜⎜⎝⎛−××=∆2C f 81R V V 1L f V V S ESR IN OUT S OUT OUTWhere C2 is the output capacitance value and R ESR is the equivalent series resistance (ESR) value of the output capacitor.When using ceramic capacitors, the impedance at the switching frequency is dominated by the capacitance which is the main cause for the output voltage ripple. For simplification, the output voltage ripple can be estimated by:⎟⎟⎠⎞⎜⎜⎝⎛−××××=IN OUT 2SOUTOUT V V 12C L f 8V ∆V When using tantalum or electrolytic capacitors,the ESR dominates the impedance at the switching frequency. For simplification, the output ripple can be approximated to:ESR IN OUT S OUT OUT R V V 1L f V ∆V ×⎟⎟⎠⎞⎜⎜⎝⎛−××=The characteristics of the output capacitor also affect the stability of the regulation system. The MP1484 can be optimized for a wide range of capacitance and ESR values.Compensation ComponentsMP1484 employs current mode control for easy compensation and fast transient response. The system stability and transient response are controlled through the COMP pin. COMP is the output of the internal transconductance error amplifier. A series capacitor-resistor combination sets a pole-zero combination to govern the characteristics of the control system. The DC gain of the voltage feedback loop is given by:OUTFB EA CS LOAD VDC V V A G R A ×××=Where V FB is the feedback voltage (0.925V),A VEA is the error amplifier voltage gain, G CS is the current sense transconductance and R LOAD is the load resistor value.The system has two poles of importance. One is due to the compensation capacitor (C3) and the output resistor of the error amplifier, and the other is due to the output capacitor and the load resistor. These poles are located at:VEA EA1P A 3C 2G f ××π=LOAD2P R 2C 21f ××π=Where G EA is the error amplifier transconductance.The system has one zero of importance, due to the compensation capacitor (C3) and the compensation resistor (R3). This zero is located at:3R 3C 21f 1Z ××π=The system may have another zero of importance, if the output capacitor has a large capacitance and/or a high ESR value. The zero, due to the ESR and capacitance of the output capacitor, is located at:ESRESR R 2C 21f ××π=In this case, a third pole set by thecompensation capacitor (C6) and the compensation resistor (R3) is used to compensate the effect of the ESR zero on the loop gain. This pole is located at:3R 6C 21f 3P ××π=The goal of compensation design is to shape the converter transfer function to get a desired loop gain. The system crossover frequency where the feedback loop has the unity gain is important. Lower crossover frequencies result in slower line and load transient responses, while higher crossover frequencies could cause system instability. A good standard is to set the crossover frequency below one-tenth of the switching frequency.To optimize the compensation components, the following procedure can be used.1. Choose the compensation resistor (R3) to set the desired crossover frequency. Determine R3 by the following equation:FBOUTCS EA S FB OUT CS EA C V V G G f 1.02C 2V V G G f 2C 23R ×××××π<××××π=Where f C is the desired crossover frequency which is typically below one tenth of the switching frequency.2. Choose the compensation capacitor (C3) to achieve the desired phase margin. For applications with typical inductor values, setting the compensation zero (f Z1) below one-forth of the crossover frequency provides sufficient phase margin.Determine C3 by the following equation:Cf 3R 243C ××π>Where R3 is the compensation resistor.3. Determine if the second compensation capacitor (C6) is required. It is required if the ESR zero of the output capacitor is located at less than half of the switching frequency, or the following relationship is valid:2f R 2C 21S ESR <××πIf this is the case, then add the secondcompensation capacitor (C6) to set the pole f P3 at the location of the ESR zero. Determine C6 by the equation:3R R 2C 6C ESR×=External Bootstrap DiodeAn external bootstrap diode may enhance the efficiency of the regulator, the applicable conditions of external BS diode are:z V OUT is 5V or 3.3V; andzDuty cycle is high: D=INOUTV V >65% In these cases, an external BS diode is recommended from the output of the voltage regulator to BS pin, as shown in Fig.2Diode to Enhance EfficiencyThe recommended external BS diode is IN4148, and the BS cap is 0.1~1µF.TYPICAL APPLICATION CIRCUITFigure 3—MP1484 with 3.3V Output, 2X10µF Ceramic Output CapacitorPCB LAYOUT GUIDEPCB layout is very important to achieve stable operation. It is highly recommended to duplicate EVB layout for optimum performance.If change is necessary, please follow these guidelines and take Figure4 for reference. 1) Keep the path of switching current short and minimize the loop area formed by Input cap, high-side MOSFET and low-side MOSFET.2) Bypass ceramic capacitors are suggestedto be put close to the Vin Pin.3) Ensure all feedback connections are shortand direct. Place the feedback resistors and compensation components as close to the chip as possible.4) Rout SW away from sensitive analog areassuch as FB.5) Connect IN, SW, and especially GNDrespectively to a large copper area to cool the chip to improve thermal performance and long-term reliability.INPUT 4.75V to 23VOUTPUTC5Figure 4—MP1484 Typical Application Circuit and PCB Layout GuideMP1484。

HP Scanjet 5590数字平板扫描器说明说明书

HP Scanjet 5590数字平板扫描器说明说明书

HP Scanjet 5590digital flatbed scannerThe HP Scanjet 5590 scanner is designed for home office/small office users who want to digitise multi-page paper documents.Key requirements are fast, automatic processing of two-sided documents and the versatility to scan transparent materials.Get more done with automatic two-sided, multi-page scanning.•Load up to 50 pages in automatic document feeder (ADF) and set them scanning.•Automatic processing of double-sided documents for streamlined workflow.•High unattendedness – digitise multi-page documents while you get on with more profitable business.•Be productive from day one – easy, reliable operation with intuitive controls.•OCR software converts printed paperwork into editable documents.Do the job faster and return to work sooner with high speed document processing.•Scan up to 8 pages per minute* (or 4 images per minute) using the duplex ADF.•No waiting around – view preview scans in about seven seconds.•Store, organise and access digitised documents using bundled NewSoft Presto! PageManager software.•Rapid access to all key tools via front panel one-touch buttons – including scan-to-PDF.•One-touch scan-to-email automatically attaches your scan to an email.•‘Copy centre’ productivity enables quick and easy desktop copying through your printer.Digitise images from slides and negatives with included transparent materials adapter (TMA).•Complete out-of-the-box scanning solution – capture high quality scans from 35 mm slides and negatives.•Easy plug-in connection – no need to remove the standard scanner lid.•TMA can also be used as a light box for viewing/selecting slides. Scan multiple images at once – TMA holds 3 x 35 mmmounted slides or strip of 4 negatives.•Scan at up to 2400 x 2400 dpi resolution, 48-bit colour.•Included standalone TWAIN driver allows software installation flexibility.* 200 dpi, 1-bit black & white. /ukFor more information, please call your local HP sales office or representative: Austria:0800 242 242, Algeria:(0)61 56 45 43, Bahrain: 800 728, Belgium: (078) 15 20 30 (0.0496 EUR/min), Bulgaria:(+359) 2960 1940,Croatia:(+385 1) 60 60 200, Czech Republic: (00 420 2) 261 108 108 (Prague),Denmark: 48 12 10 00, Egypt: 532 5222, Estonia: (+372) 6813 823,Finland:(+358) 0205350 or 0205 350, France: (1) 69 82 6060,Germany:0180 532 6222 (12 Cent/min), Greece: (01) 678 96 00, Hungary: (+36) 1 382-1111, Iceland: (354) 570 1000,Ireland:+ 353 1 6158200,Israel:(972) 9 8304848, Italy: (02) 92121, Kazakhstan:+7 (3272) 980 824, Latvia: (371) 800 80 12, Lithuania:8 800 10000 or 8 5 2103333, Luxembourg: (+352) 263 160 34,Middle East: 00971 4 883 4427, Morocco (African Region):+212 22 40 47 47,Netherlands: (020) 5476666, Norway:22 735600,Poland: infolinia: 0-800 122 622, Portugal:(808) 206 001, Romania:(+401) 205 3300, Russia: +7 (095) 797 35 00, Saudi Arabia:800 124 4646,Serbia/Montenegro: +381 11 201 99 00, Slovakia:+421-2-50222111, Slovenia: +3861 2307 420, South Africa: 0800 118 883,Spain:(91) 634 88 00, Sweden: (08) 444 2000, Switzerland:0848 88 44 66, Tunisia:71 891 222, Turkey: +90 (216) 579 71 71, UAE: 8004910,UK: 08705 474747,Ukraine:+380 44 490 61 20.©2004 Hewlett-Packard Development Company, L.P . The information contained herein is subject to change without notice. The only warranties for HP Products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.Published in EMEA 07/045982-4670EEETechnical specificationsScanner type FlatbedInput modes Front-panel “scan”, “copy”, “e-mail”, “share-to-web”, “save-document-to-disc”; HP Photo & Imaging software; user application via TWAIN Preview speed 7 secScan speed10 x 15 cm colour photo into Microsoft Word : < 28 secs OCR a full page of text into Microsoft Word: < 48 secs Black-and-white drawing into Microsoft Word: < 31 secsScan speed: tests performed on a 1.7 GHz HP Vectra PC with 256 MB of RAM and Windows 2000Automatic document feeder Capacity: plain paper: Standard, 50 sheetsSpeed: up to 8 ppm; simplex mode, black and white, 200 dpi, 1-bit Scan resolutionOptical: 2400 dpiHardware: 2400 x 2400 dpiEnhanced: 12 dpi to 999999 enhanced dpi Bit depth 48-bitScaling10 to 2000% in 1% increments Maximum document size 216 x 297 mmInterface and connectivity Hi-Speed USB – compatible with USB 2.0 specificationsOperating systems compatibility Microsoft Windows 98, 98 SE, Me, 2000, XP (Professional and Home Editions); Mac OS X (10.1.5, 10.2 or higher)Minimum system requirementsWindows: USB-compatible PC with Microsoft Windows [98, 98 SE, Me, 2000, XP (Professional and Home Editions)]; Pentium II Celeron or compatible CPU; Internet Explorer 5.01 SP2 or later; 64 MB RAM; 175 MB disk space, plus 50 MB for full-colour scanning; SVGA monitor (800 x 600, 16-bit colour); CD-ROM drive; USB port; HP Memories Disc Creator software requires CD-Writer and 700 MB additional disk spaceMacintosh: USB-compatible Macintosh computer with Mac OS X (10.1.5, 10.2 or higher); 128 MB RAM; 240 MB disk space; SVGA monitor (800 x 600, 16-bit colour); CD-ROM drive; USB port; HP Memories Disc Creator software requires CD-Writer and 700 MB additional disk spaceSoftware includedCD-ROM with software for Microsoft Windows and Macintosh: HP Photo & Imaging software with HP Memories Disc Creator & HP Instant Share , Integrated I.R.I.S. Readiris OCR, NewSoft Presto! PageManager 7, HP Commercial Scanjet 5590 TWAIN (Windows only)Dimensions (w x d x h)488 x 340 x 162 mmWeightNet weight: 5.73 kg, maximum shipping weight: 8.1 kgMultiple file formats PC: Bitmap (BMP), TIFF, GIF, PDF, HTML, JPEG, FlashPix(FPX), TIFF compressed, DCX, PCX, RTF Mac: PICT, TIFF, JPEG, TIFF compressed, GIF, PDF, TEXT, HTML, FlashPix(FPX)Operating environment Operating temperature: 5 to 40°C, storage temperature: -40 to 70°C Operating humidity: 5 to 90% RH, storage humidity: 5 to 90% RHPower requirements 100 to 240 VAC (±10%), 50/60 Hz (±3%), consumption: 36 watts maximum Energy StarYesRegulatory compliance information/safety Safety UL listed, EU LVD & EN 60950 compliant, European Third Party approval, Certified by Czech Republic (EZU),Russia (GOST), Poland (PCBC)Electromagnetic compatibility EU (EMC Directive)Warranty1 year hardware warranty plus telephone support through HP Customer Care Centres; 5 day standard unit exchange (1 year);24-hour electronic support available free at the following site: /supportOrdering informationL1910AHP Scanjet 5590 digital flatbed scanner, USB cable –compatible with USB 2.0specifications, power cable, power supply (where applicable), automatic document feeder (ADF), ADF cleaning cloth, transparent materials adapter (TMA), TMA instruction sheet, user’smanual, setup poster, warranty sheet, CD-ROM(s) with software for Microsoft Windows and MacintoshService & support1 year standard hardware warranty upgradeable to a 3 year expressexchange warranty with anHP Care Pack。

ESRI API使用指南说明书

ESRI API使用指南说明书

By Andy Gup and Julie PowellHow Was the API Consumed Before ES ModulesWere Available?The API has always been available as Asynchronous ModuleDefinition (AMD) modules, and it continues to be available as AMDmodules for developers who prefer this format. If your app refer-ences Esri’s content delivery network (CDN) to access the API viahttps:///<API version number>, you are using theAMD version.Understanding AMD and ES ModulesWith both AMD and ES modules, API functionality is divided intological subsets and packaged as modules. AMD modules use arequire() method and a third-party script loader to load modulesand their dependencies.ES modules are an official, standardized module system thatworks natively with all modern browsers through import state-ments. ES modules do not require a separate script loader. An ex-ample showing the differences between the two coding patternsis shown in Listing 1.Should You Migrate to ES Modules?If you aren’t integrating with a framework or creating custom buildsof the API, there is no need to migrate to the new ES modules.The AMD modules will continue to be available alongside the ESmodules for the foreseeable future. Both formats have the samecapabilities because they are built from the same code base.AMD modules are hosted on the CDN and therefore offer thesebenefits when accessing the API in this manner, as opposed to cre-ating custom builds:•Fast download and highly optimized caching for API modules•No installation or configuration required•It is easy to update applications to the next API versionIf you are integrating with a framework or creating local builds,you should consider using ES modules. This will simplify yourimplementation as ES modules do not require a separate scriptloader or additional configuration. When using AMD, you typicallyeither use a webpack plugin to integrate the API into your webpackbuild or use esri-loader with framework tools or other bundlers.Note that you will still want to use AMD modules when creatinglocal builds if your app uses Dojo1 or RequireJS. Simplify Integrating Frameworks and Build Tools with the ArcGIS API for JavaScriptIf you use the ArcGIS API for JavaScript with a third-party framework such as Angularor React or create custom builds of the API, this process just got easier. The releaseof version 4.18 in December introduced a new option for consuming the ES modules,which work natively in the browser, are built to the latest ECMA standards, and allowseamless integration with modern frameworks and build tools.Listing 1Copy Assets You will need to copy the API assets (which includes styles, images, fonts, pre-built API web worker JS files, and localization files) from the @arcgis/core/assets folder to your build folder. A simple way to accomplish this is to configure a Node Package Manager (NPM) script that runs during your build process. For example, use npm to install ncp and configure a script in package.json to copy the folder. See the React example in Listing 3.Developer's SectionConfigure CSS The final step is to set up the CSS. Choose a theme and then con-figure your code to copy the theme files from @arcgis/core/assets/esri/themes/ into your project. Listing 4 provides a React example. Now you can run your build and the API’s ES modules will be bun-dled along with all your other imports.Refactor Code, If Necessary If you previously used AMD with esri-loader or arcgis-webpack-plugin and want to migrate to ES modules, review the “Build with ES modules” help topic in the JavaScript API Guide for the code changes required.Documentation and Examples For an introduction on developer tooling and your choices when it comes to consuming the API, please visit the JavaScript API Guide and see the Developer Tooling pages. You can find examples thatintegrate ES modules with frameworks and build tools in the jsapi-resources GitHub repository (https://bit.ly/2VNpmEO). This in-cludes integration with Angular, React, Ember, Node, Vue, Rollup,and Webpack.Road Map for ES Module MigrationAt version 4.18, ES modules were released as beta. The productionrelease is planned for early 2021. If you try the modules while theyare in beta and they meet your app’s requirements, you can usethem in your app. The modules have been broadly tested but theyare still considered provisional as they could change based yonfeedback or an improved design.ES modules are covered by Esri Technical Support while they arein beta so you can obtain support as needed. If you have feedbackon the modules, associated documentation, or sample code, youcan submit your comments or questions to the early access reposi-About the AuthorsAndy Gup is a senior product engineer on the ArcGIS API forJavaScript team, who works on third party JavaScript frameworksand mobile apps. He has been with Esri for more than 15 years.Julie Powell is product manager for the ArcGIS API for JavaScript.She has more than 18 years of experience working with softwaredevelopment, delivering solutions for both enterprise and con-sumer markets. Powell has worked on a wide range of projectsand consulting endeavors, including serving as a technical leadfor web mapping solutions for strategic customers. She interfaceswith a wide user community to maintain awareness and insight intoGIS community needs and contributes feedback to developmentteams to help ensure users can be successful in building state-of-the-art, purposeful solutions using ArcGIS software.Get Started Using ES ModulesWhether you are creating a new application or integrating the APIin an existing application, the first step is to install the API usingnpm with the following command:npm install @arcgis/core Then use import statements to load individual modules. Notethat the ES modules package naming convention uses /core ratherthan /esri, which is used by the AMD CDN modules, as shown inListing 2.↑ Listing 2↑ Listing 3↑ Listing 4。

Silicon Labs 芯片评估板 套件说明书

Silicon Labs 芯片评估板 套件说明书

EVALUATION BOARD/KIT IMPORTANT NOTICESilicon Laboratories Inc. and its affiliated companies ("Silicon Labs") provides the enclosed evaluation board/kit to the user ("User") under the following conditions:This evaluation board/kit ("EVB/Kit") is intended for use for ENGINEERING DEVELOPMENT, TESTING, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not a finished end-product fit for general consumer use. ANY OTHER USE, RESALE, OR REDISTRIBUTION FOR ANY OTHER PURPOSE IS STRICTLY PROHIBITED. This EVB/Kit is not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. As such, persons handling this EVB/Kit must have electronics training and observe good engineering practice standards. As a prototype not available for commercial reasons, this EVB/Kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.Should this EVB/Kit not meet the specifications indicated in the User's Guide, the EVB/Kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SILICON LABS TO USER, IS USER'S SOLE REMEDY , AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY , INCLUDING ANY WARRANTY OF MERCHANTABILITY , NONINFRINGEMENT, DESIGN, WORKMANSHIP , OR FITNESS FOR ANY PARTICULAR PUR-POSE.User assumes all responsibility and liability for proper and safe handling of the EVB/Kit. Further, User indemnifies Silicon Labs from all claims arising from User's handling or use of the EVB/Kit. Due to the open construction of the EVB/Kit, it is User's responsibility to take any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CON-SEQUENTIAL DAMAGES.Neither Silicon Labs nor User is obligated to perform any activities or conduct any business as a consequence of using the EVB/Kit, and neither party is entitled to any form of exclusivity with respect to the EVB/Kit.Silicon Labs assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the EVB/Kit. This notice contains important safety information about temperatures and voltages. For additional environmental and/or safety information, please contact a Silicon Labs application engineer or visit /support/quality.No license is granted under any patent right or other intellectual property right of Silicon Labs covering or relating to any machine, process, or combination in which the EVB/Kit or any of its components might be or are used.User's use of this EVB/Kit is conditioned upon acceptance of the foregoing conditions. If User is unwilling to accept these conditions, User may request a refund and return the EVB/Kit to Silicon Labs in its original condition, unopened, with the original packaging and all documentation to:Mailing Address:400 W. Cesar Chavez Austin, TX 78701Copyright © 2012 by Silicon Laboratories Rev. 0.2 7/12P R E C I S I O N 32™ M C U D E V E L O P M E N T K I T Q U I C K -S T A R T G U I D E F O R K I T S F E A T U R I N G T H E U N I F I E D D E V E L O P M E N T P L A T F O R M (U D P )T h e P r e c i s i o n 32™ M C U D e v e l o p m e n t K i t s a r e a v a i l a b l e i n a l o w c o s t D e v e l o p m e n t K i t a n d a f u l l y f e a t u r e d E n h a n c e d D e v e l o p m e n t K i t . K i t c o n t e n t s a r e d e s c r i b e d b e l o w . A l l d e v e l o p m e n t k i t s c o m e w i t h a n M C U c a r d , U S B D e b u g A d a p t e r , a n d a l l n e c e s s a r y c a b l e s a n d p o w e r s u p p l i e s n e e d e d t o e v a l u a t e h a r d w a r e a n d d e v e l o p c o d e . T h e E n h a n c e d D e v e l o p m e n t K i t s a d d i t i o n a l l y c o n t a i n a U D PM o t h e r b o a r d a n d o n e o r m o r e I /O c a r d s t o e n h a n c e t h e u s e r e x p e r i e n c e .D e v e l o p m e n t K i t•U D P M C U c a r d•S i l i c o n L a b o r a t o r i e s U S B D e b u g A d a p t e r •S u p p o r t i n g C a b l e s a n d P o w e r S u p p l i esE n h a n c e d D e v e l o p m e n t K i t•U D P M C U c a r d•U D P M o t h e r b o a r d •U D P I /O c a r d (s )•S i l i c o n L a b o r a t o r i e s U S B D e b u g A d a p t e r •S u p p o r t i n g C a b l e s a n d P o w e r S u p p l i e sA. Install SoftwareB. Hardware Setup (Steps 1, 4, and 5 Only Apply to Enhanced Development Kits)C. Documentation12Click the large Download Button to initiate the Precision32 web install.Navigate to the Precision32 software download website.3Start the Installer and allow it to run in the background. Advance to Step 4 while the Precision32 Development Suite andAppBuilder are being installed./32bit-software1Connect the USB Debug Adapter ribbon cable to the MCU card.2Connect the USB Debug Adapter to thePC using the standard USB cable.I/O cardMCU card45If Enhanced DK, apply power to the UDP Motherboard using 1 of 4 power options,Power Options1: 9 V Universal Adapter (J20)2: Standard USB (J16) 3: Mini USB (J1)4: 6 V Battery Pack (J11)then set power switch (S3) to the ON Position.If Development Kit, apply power to the MCU Card using 1 of 2 power options.Power Options1: Mini USB – For USB MCUs2: 9 V Universal Adapter – For Non-USB MCUsIf Enhanced DK, update the motherboardfirmware using the UDP MotherboardFirmware Update Utility./udpMCU card321412Note: If Enhanced DK, the MCU Card is powered from the motherboard.36If Enhanced DK, connect the MCU card and I/O card to the UDP Motherboard.1Download the User’s Guide for EachBoard in the Development Kit.Where to Find DocumentationData Sheet:/32bit-mcu →Choose Product Family →Documentation tab Reference Manual:/32bit-mcu →Choose Product Family →Documentation tab Hardware User's Guide:/32bit-mcu →Design Resources →Unified Development Platform OR /udp Application Notes:/32bit-mcu →Design Resources →Application Notes Software Development Kit Documentation:C:\Silabs\32bit\si32-{revision}\Documentation\si32Hal.chm Quality Documents:/qualityE . U s i n g t h e P r e c i s i o n 32 D e v e l o p m e n t S u i t eT h e P r e c i s i o n 32 D e v e l o p m e n t S u i t e i s a c o m p l e t e d e v e l o p m e n t s y s t e m f o r S i l i c o n L a b s 32-b i t M C U s . T h e D e v e l o p m e n t S u i t e c o n s i s t s o f t h r e e p a r t s : t h e U n i f i e d D e v e l o p m e n t P l a t f o r m (U D P ) h a r d w a r e , t h e S o f t w a r e D e v e l o p m e n t K i t (S D K ), a n d t h e P C d e v e l o p m e n t t o o l s i n c l u d i n g A p p B u i l d e r a n d t h e I n t e g r a t e d D e v e l o p m e n t E n v i r o n m e n t (I D E ). S e e t h e a p p l i c a t i o n n o t e s l i s t e d b e l o wf o r c o m p l e t e d e t a i l s .t h e p r o g r a m . T h e L E D b l i n k . P a u s e p r o g r a R u nl i n e s o f c o d e a n d s e l e c t T o g B r e a k p o i n t t o a d d a b r e a k p o T h e n p r e s s R u n t o r u n t o b r e a k p o i c o d e .S t e p I n t o o r S t e p O v e r V i e w o r m o d i f y P e r i p h e r a R e g i s t e r s , o r M e m o i a b l e , r i g h t -c l i a n d s e l e c t A d d W a t c h E x p r e t o a d d i t t o t h e E x p r e s s i o n s w A p p B u i l d e r I D E•A N 675: P r e c i s i o n 32 D e v e l o p m e n t S u i t e O v e r v i e w•A N 667: G e t t i n g S t a r t e d w i t h t h e S i l i c o n L a b s P r e c i s i o n 32 I D E•A N 670: G e t t i n g S t a r t e d w i t h t h e S i l i c o n L a b s P r e c i s i o n 32 A p p B u i l d e r•A N 678: P r e c i s i o n 32 s i 32F l a s h U t i l i t y C o m m a n d -L i n e P r o g r a m m e r U s e r 's G u i d e•A N 719: P r e c i s i o n 32 I D E a n d A p p B u i l d e r D e t a i l e d T u t o r i a l a n d W a l k t h r o u g hW h e r e t o F i n d S u p p o r tM C U K n o w l e d g e B a s e :w w w .s i l a b s .c o m →S u p p o r t →K n o w l e d g e B a s eV i d e o T r a i n i n g M o d u l e s :w w w .s i l a b s .c o m →S u p p o r t →T r a i n i n g a n d R e s o u r c e sC o n t a c t a n A p p l i c a t i o n s E n g i n e e r :w w w .s i l a b s .c o m →S u p p o r t →C o n t a c t T e c h n i c a l S u p p o r tD . U s i n g t h e P r e c i s i o n 32 I DE f o r t h eF i r s t T i m e2R e g i s t e r t h e I D E u s i n g t h e s t e p s l i s t e d o n t h e W e l c o m e p a g e .1O p e n t h e P r e c i s i o n 32 I D E a n d s e l e c t t h e p r o j e c t w o r k s p a c e .313456S e l e c t j u s t t h e s i m x x x x x _B l i n k y c h e c k b o x ,e n s u r e C o p y p r o j e c t s i n t o w o r k s p a c e i s s e l e c t e d , a n d p r e s s F i n i s h .S e l e c t t h e I m p o r t S I 32 S D Ke x a m p l e (s ) l i n k i n t h e Q u i c k s t a r t w i n d o w .S e l e c t t h e s i m x x x x x _B l i n k yp r o j e c t i n t h e P r o j e c t E x p l o r e r a n d p r e s s B u i l d ‘B l i n k y ’ [D e b u g ] i n t h e Q u i c k s t a r t w i n d o w .S t a r t a D e b u g s e s s i o n b yc l i c k i n g D e b u g ‘B l i n k y ’ [D e b u g ] i n t h e Q u i c k s t a r t w i nd o w .。

IND308 高速 weighing controller 商品说明书

IND308 高速 weighing controller 商品说明书

IND308 Weighing ControllerHigh-speed and stable weighing & packingIND308 comes with a brand-new powerf u l hardware platform, characterized by ou tstandi ng wei gh i ng da ta ac qu isition performance and advanced intelli g ent control al gor ithms, can si gnific antly improve packi ng speed, acc ura cy, and stability.Stable and reliable industrial design24 V DC powered, with low power cons ump tion and hi gh er interference i mmun ity; with an all-metal hou si ng and excellent protection level. Photoelectric isolated discrete i npu t /ou t pu t points with hi gh speed allow for rapid and reliable responses to control re qu irements.Various interfaces and flexible configurationIND308 s uppor ts display in Chinese and Eng lish, with c u stomized poweri ng-on screens and convenient operations. I/O port f un ctions incl ud i ng 8 d i g ital i npu ts and 12 di g ital ou t pu ts can be assi gn ed for different f un ctions. The serial port s uppor ts the M odbu s RTU protocol. The newly con figur ed network interface can achieve parameter back up and r ecovery f un ctions.Abundant packing control modesIND308 s uppor ts PLC control, havehopper, no hoppe r, bu lk gra i n, dua l scale and decrement modes. Intelli g ent self-learni ng mod e is adaptable toc hang es in the on-site packi ng environ-ment, , which ens ur es rapid adj u stment of system to a precise state.IND308 weighing controllerIND308 is a specialized wei gh i ng d isplay controller developed by METTLER TOLEDO for t arg et-wei gh t packi ng app lications.IND308 wei gh i ng controller is characterized by its hi gh speed, hi gh efficie ncy, complete f un ctions, reliability and stability, which f u lly embodies the leadi ng produ ct technol og y and ex qu isite man u -fact ur i ng pro cess of METTLER TOLEDO.IND308 can be widely u sed in vari ou s i ndu stries, s u ch as gra in, chemical i ndu stry, feed, filling, etc.IND308 weighing controllerTechnical indexesProduct features• Built-in various control modes for packing scales• Application of target value packing control with three-speed control• Supports Modbus RTU protocal• Supports parameter backup and recovery • 8 photoelectric isolated digital inputs • 12 photoelectric isolated digital outputs • 24V DC power supply, with low power consumption and higher interference immunityTechnical indexesFunction featuresMounting hole dimension figureMounting hole dimensions:149mm x 70mmDimensions:Exterior dimensions:184mm x 118mm x 127mmAddress: No.111 West Taihu Road, Xinbei District, Changzhou City, Jiangsu Province Postal code:213125Fax**************Address: 589 Guiping Road, Shanghai Postal code:200233Fax*************E-mail:*********For more information.Mettler-Toledo has always been committed to improving its product functions. For this reason, the technical specifications of the product will also be changed. No separate notification is provided when the above situation occurs. Mettler-Toledo has always been committed to improving its product functions. For this reason, the technical specifications of the productwill also be changed. No separate notification is provided when the above situation occurs.Printed in P. R. China 2021/61: IND308 mounting hole dimension;2: Reserved space for wiring.EnclosurePanel-mounted, with stainless steel front panel for IP65 rating Operating environment -10°C - +40°C; humidity: 10% - 95%, non-condensing Power supply 24 V DC power supply, maximum power consumption of 6 W Keypad and display 3.5" Mono TFT display, with 21 membrane touch keysW eighing processing AD conversion rate: 960 times/second; maximum display division: 100,000d; maximum verification division: 6,000eCommunication interface 1 RS485 serial port, supporting Modbus RTU protocol Control interface 8 inputs and 12 outputs (photoelectric isolated)Data statisticsStorage of 20 recipes; each recipes shows total weight in up to 10 digits and total packages in up to 6 digitsW orking modeFunction descriptionPLC modeThree preset output (fast, middle and slo w , three speed feed); output signal a f ter weighing is completedSet over -tolerance judgment; control sever valve; support judgment for weighing hopper door ready, and control feedingApplied with PLC to achieve various weighing control processes, can also realize simple multi-speed packaging process independentlyBulk grain modeSupport discharging control, feeding control and the last package control during feedingCumulative weight control of discharging (the last two packages are automatically separated for adjustment)With upper hopper low and lower hopper high signal judgment (for feeding and loosing control separately)Have hopper modeStandard packaging function; bag clamping and bag loosing judgment; with bag flapping and bag dropping functions; the number of flapping and flapping interval duration can be set Packaging function under ton bag function is availableNo hopper modeT are automatically a f ter bag clamping; can support the judgment of bag clamping in place Platform rising a f ter reaching the set weight; flapping function for powderDual scale modeThe dual scale linkage control can be realized through the interlock of the discrete input and / output points of 2 instruments, achieving higher efficiency。

211126682_在线固相萃取-二维液相色谱法同时测定儿童配方奶粉中维生素A、D、E

211126682_在线固相萃取-二维液相色谱法同时测定儿童配方奶粉中维生素A、D、E

黄燕,林灵超,蒋婷婷,等. 在线固相萃取-二维液相色谱法同时测定儿童配方奶粉中维生素A 、D 、E[J]. 食品工业科技,2023,44(9):317−323. doi: 10.13386/j.issn1002-0306.2022060239HUANG Yan, LIN Lingchao, JIANG Tingting, et al. Simultaneous Determination of Vitamins A, D and E in Children's Formula Milk Powder by Combining Online Solid Phase Extraction and Two-Dimensional Liquid Chromatography[J]. Science and Technology of Food Industry, 2023, 44(9): 317−323. (in Chinese with English abstract). doi: 10.13386/j.issn1002-0306.2022060239· 分析检测 ·在线固相萃取-二维液相色谱法同时测定儿童配方奶粉中维生素A 、D 、E黄 燕,林灵超,蒋婷婷,周雅雯,周小靖*(浙江福立分析仪器股份有限公司,浙江台州 317500)摘 要:建立在线固相萃取(SPE )-二维液相色谱法同时测定儿童配方奶粉中脂溶性维生素A 、D 2、D 3和α-、β-、γ-、δ-维生素E 含量的方法。

样品经皂化后直接进样,以聚合物为填料的PLRP-S 色谱柱为在线固相萃取柱净化皂化液,采用SPE 泵反向洗脱目标组分,并通过引入在线稀释将目标组分聚焦在第一维色谱柱柱头。

以NuovaSil TM PFP (4.6 mm×150 mm ,3 μm )为第一维色谱柱,甲醇-0.1%甲酸水溶液为流动相进行梯度洗脱,分离维生素A 和E 的4 种异构体。

nestjs常见的面试考点

nestjs常见的面试考点

nestjs常见的面试考点English Answers:Core Concepts.What is NestJS and its key features?Explain the architecture of NestJS, including modules, controllers, services, and entities.Describe the dependency injection mechanism used by NestJS.How does NestJS handle HTTP requests and responses?What are the different ways to implement data access in NestJS?Architectural Patterns.Explain how to implement the Repository pattern in NestJS.Describe the use of the Unit of Work pattern in NestJS.How can you apply the CQRS (Command QueryResponsibility Segregation) pattern in NestJS?Security.How does NestJS handle user authentication and authorization?Describe the different types of authorizationstrategies available in NestJS.Explain how to use JWT tokens for authentication in NestJS.Testing.What are the common testing techniques used in NestJS?How to unit test controllers and services in NestJS?Describe the use of integration testing in NestJS.Best Practices.Explain the best practices for code organization and structuring in NestJS.Discuss the use of class decorators and method decorators in NestJS.Describe the importance of using dependency injection in NestJS.Advanced Topics.How to implement custom middleware in NestJS?Describe the use of GraphQL with NestJS.Explain how to use microservices with NestJS.中文回答:核心概念。

vue3暴露elementplus方法

vue3暴露elementplus方法

Vue 3 是一款流行的 JavaScript 框架,它提供了一种简单、灵活、高效的方式来构建现代化的用户界面。

Element Plus 是一款基于 Vue 2.0 的组件库,为开发人员提供了丰富、易用的 UI 组件。

由于 Vue 3 和 Vue 2.0 在一些方面有所不同,使用 Element Plus 在 Vue 3 中可能会遇到一些问题。

本文将为大家介绍如何在 Vue 3 中暴露 Element Plus 方法,以便开发人员能够顺利使用 Element Plus 的各种组件和功能。

1. 了解 Vue 3 对插件的要求在 Vue 3 中,插件的编写与 Vue 2.0 有所不同。

Vue 3 要求插件必须以新的形式进行导出,以确保其与新版框架的兼容性。

在使用Element Plus 时,我们需要根据 Vue 3 的要求来对其进行相应的修改和暴露。

2. Element Plus 在 Vue 3 中的兼容性由于 Element Plus 是基于 Vue 2.0 的,因此在 Vue 3 中使用Element Plus 会出现一些兼容性问题,比如组件注册、方法调用等方面的差异。

为了解决这些问题,我们需要对 Element Plus 进行适当的修改,以便能够在 Vue 3 中正常使用。

3. 修改 Element Plus 的导出方式在 Vue 3 中,插件的导出方式需要进行相应的调整。

对于 Element Plus,我们可以通过修改其导出方式来使其与 Vue 3 兼容。

一种常见的做法是使用 `e` 方法来注册 Element Plus,并将其导出为一个单独的模块,以便在 Vue 3 中引入和使用。

4. 代码示例下面是一个简单的示例,演示了如何在 Vue 3 中暴露 Element Plus方法:```javascript// m本人n.jsimport { createApp } from 'vue'import ElementPlus from 'element-plus'import 'element-plus/lib/theme-chalk/index.css'const app = createApp(App)e(ElementPlus)app.mount('#app')```在上面的代码中,我们首先通过 `import` 关键字引入了 Element Plus,然后通过 `e` 方法将其注册为 Vue 3 的插件。

戴尔 PowerConnect 27xx 系列交换机启用 Web 管理模式.pdf_17009080

戴尔 PowerConnect 27xx 系列交换机启用 Web 管理模式.pdf_17009080

w w w.d e l l.c o m | s u p p o r t.d e l l.c o mEnabling Web-Managed Mode forDell TM PowerConnect TM 2708, 2716, and 2724NOTE: The PowerConnect 27xx switches are shipped as unmanaged switches. If you want to takeadvantage of the management features of this switch, follow the procedures below.NOTE: When changing between the unmanaged and Web-managed modes, the switch is resetto thefactory default settings.NOTE: For more information on the management capabilities of the switch, see theDell PowerConnect27xx Systems User's Guide .NOTE: All PowerConnect 27xx series switches have the same default IP address. It is advisableto change the IP address of each switch that has been set up as a Web-managed switch.Enabling Web-Managed ModeAfter powering up your switch according to the instructions in the User’s Guide, press theManaged Mode button once. The switch changes to Web-managed mode and the Managed Mode LED will be illuminated green.NOTE: The Managed Mode button is a toggle button located on the front panel and is recessed to prevent accidental mode changes.NOTE: The Managed Mode LED is not illuminated when the switch is in unmanaged mode.When changing to the Web-managed mode, the switch is configured with a default IP address (192.168.2.1) and a default user login (User Name: admin and no password). In this mode, you can configure the switch using a Web interface.NOTE: To access the device through the Web interface, see "Initial Configuration" in Dell PowerConnect 27xx Systems User's GuideLogging In And Changing Switch IP Address and PasswordY ou can update the switch IP Address either:•Manually, or•By enabling DHCP AddressingNOTE: To update the IP address, see "Viewing System IP Address" in Dell PowerConnect 27xx Systems User's Guide .NOTE: For security reasons, we recommend that you follow the steps in the User’s Guide for changing the password.March 2005w w w .d e l l .c o m | s u p p o r t .d e l l .c o mManaged Mode Default ConfigurationTable 1 shows the default configuration of Unmanaged and Managed modes.____________________Information in this document is subject to change without notice.©2005Dell Inc.All rights reserved. Printed in China.Reproduction in any manner whatsoever without the written permission of Dell Inc. is strictly forbidden.Trademarks used in this text: Dell and the DELL logo are trademarks of Dell Inc.Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products. Dell Inc. disclaims any proprietary interest in trademarks and trade names other than its own.Table 1.Default ConfigurationUnmanaged ModeManaged Mode Managed Mode LED Off GreenIPNone Default IP , Net mask,No Gateway, DHCP disabled User Database None User Name ’admin’ and Password emptyConfiguration DbN/AHas default values until you change them; Resets each time you press the Managed Mode buttonw w w.d e l l.c o m | s u p p o r t.d e l l.c o m为 Dell TM PowerConnect TM 2708、2716和 2724 启用Web 管理模式注:PowerConnect 27xx 交换机交付为未管理的交换机。

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a rX iv:mat h /5168v2[mat h.RA]7M ar27INDECOMPOSABLE MODULES AND GELF AND RINGS FRANC ¸OIS COUCHOT Abstract.It is proved that a commutative ring is clean if and only if it is Gelfand with a totally disconnected maximal spectrum.It is shown that each indecomposable module over a commutative ring R satisfies a finite condition if and only if R P is an artinian valuation ring for each maximal prime ideal P .Commutative rings for which each indecomposable module has a local endomorphism ring are studied.These rings are clean and elementary divisor rings.It is shown that each commutative ring R with a Hausdorffand totally disconnected maximal spectrum is local-global.Moreover,if R is arithmetic then R is an elementary divisor ring.In this paper R is a commutative ring with unity and modules are unitary.In [12,Proposition 2]Goodearl and Warfield proved that each zero-dimensional ring R satisfies the second condition of our Theorem 1.1,and this condition plays a crucial role in their paper.In Section 1,we show that a ring R enjoys this condition if and only if it is clean,if and only if it is Gelfand with a totally disconnected maximal spectrum.So we get a generalization of results obtained by Anderson and Camillo in [1]and by Samei in [21].We deduce that every commutative ring R with a Hausdorffand totally disconnected maximum prime spectrum is local-global,and moreover,R is an elementary divisor ring if,in addition,R is arithmetic.One can see in [8]that local-global rings have very interesting properties.In Section 3we give a characterization of commutative rings for which each indecomposable module satisfies a finite condition:finitely generated,finitely co-generated,cyclic,cocyclic,artinian,noetherian or of finite length.We deduce that a commutative ring is Von Neumann regular if and only if each indecomposable module is simple.This last result was already proved in [5].We study commuta-tive rings for which each indecomposable module has a local endomorphism ring.These rings are clean and elementary divisor rings.It remains to find valuation rings satisfying this property to give a complete characterization of these rings.We also give characterizations of Gelfand rings and clean rings by using properties of in-decomposable modules.Similar results are obtained in Section 4,for commutative rings for which each prime ideal contains only one minimal prime ideal.We denote respectively Spec R ,Max R and Min R,the space of prime ideals,maximal ideals,and minimal prime ideals of R ,with the Zariski topology.If A a subset of R ,then we denoteV (A )={P ∈Spec R |A ⊆P },D (A )={P ∈Spec R |A ⊆P },V M (A )=V (A )∩Max R and D M (A )=D (A )∩Max R.2FRANC¸OIS COUCHOT1.Local-global Gelfand ringsAs in[19]we say that a commutative ring R is Gelfand if each prime ideal is contained in only one maximal ideal.In this case,we putµ:Spec R→Max R the map defined byµ(J)is the maximal ideal containing J for each prime ideal J. Thenµis continuous and Max R is Hausdorffby[7,Theorem1.2].In[12],Goodearl and Warfield proved that every zero-Krull-dimensional com-mutative ring satisfies the second condition of the following theorem.This property is used to show cancellation,n-root and isomorphic refinement theorems forfinitely generated modules over algebras over a commutative ring which is Von Neumann regular modulo its Jacobson radical.So,the following theorem allows us to extend these results to each ring with a Hausdorffand totally disconnected maximal spec-trum.As in[20]we say that a ring R is clean if each element of R is the sum of a unit with an idempotent.In[20,Proposition1.8and Theorem2.1]Nichol-son proved that commutative clean rings are exactly the exchange rings defined by Warfield in[24].In[21]Samei proved that the conditions(1),(3)and(4)are equivalent when R is semiprimitive and in[1]Anderson and Camillo showed that each clean ring is Gelfand.We can also see[18,Theorem3].If P is a prime ideal we denote by0P the kernel of the natural map R→R P.Theorem1.1.Let R be a ring.The following conditions are equivalent:(1)R is a Gelfand ring and Max R is totally disconnected.(2)Each R-algebra S satisfies this condition:let f1,...,f k be polynomialsover S in noncommuting variables x1,...,x m,y1,...,y n.Let a1,...,a m∈S.Assume that∀P∈Max R there exists b1,...,b n∈S P such thatf i(a1,...,a m,b1,...,b n)=0∀i,1≤i≤k.Then there exist d1,...,d n∈Ssuch that f i(a1,...,a m,d1,...,d n)=0∀i,1≤i≤k.(3)R is a clean ring.(4)R is Gelfand and∀P∈Max R,0P is generated by a set of idempotents.Proof.(1)⇒(2).By[11,Theorem16.17]Max R has a base of clopen subsets. Sinceµis continuous,each clopen subset of Max R is of the form D M(e)for some idempotent e.So we can do the same proof as in[12,Proposition2]where we replace Spec R with Max R.(2)⇒(3).Let a∈R.We consider the following equations:x2=x and y(a−x)=1.Since each local ring is clean,these equations have a solution in R P for each maximal ideal P.We conclude that there is also a solution in R and that R is clean.(3)⇒(1).Let P,P′∈Max R,P=P′.Then there exist a∈P and a′∈P′such that a+a′=1.We have a=u+e where u is a unit and e is an idempotent. Since a∈P and u/∈P we get that e/∈P.We have a′=1−a=−u+(1−e). So1−e/∈P′.Consequently P and P′have disjoint clopen neighbourhoods. Since Max R is quasi-compact,we deduce that this space is compact and totally disconnected.The equality e(1−e)=0implies that P∩P′contains no prime ideal. Hence R is Gelfand.(1)⇒(4).Let P be a maximal ideal and a∈0P.Then there exists s∈R\P such that sa=0.Since Max R is totally disconnected there is a clopen subset U such that U⊆D M(s).Because ofµis continuous,there exists an idempotent e such that P∈D(e)=µ←(U)⊆µ←(D M(s))⊆D(s).Then e∈Rs,ea=0, a=a(1−e)and1−e∈0P.INDECOMPOSABLE MODULES AND GELFAND RINGS3(4)⇒(1).Let P,P′∈Max R,P=P′.Since R is Gelfand,by[7,Theorem 1.2]there exist a∈0P\P′.Then there exists an idempotent e∈0P\P′.Clearly 1−e/∈P.Consequently P and P′have disjoint clopen neighbourhoods.We say that R is local-global if each polynomial over R infinitely many inde-terminates which admits unit values locally,admits unit values.Recall that most of the results of[12]about commutative rings which are Von Neumann regular modulo their Jacobson radicals,have been extended to local-global rings by Estes and Guralnick in[8].We have the following corollary:Corollary1.2.Let R be a ring such that Max R is Hausdorffand totally discon-nected.Then R is local-global.Proof.Let J be the Jacobson radical of R.Then R is local-global if and only if R/J is local-global.So we may assume that R is semiprimitive.From the remark that follows[7,Theorem1.2]and from Theorem1.1we deduce that R is clean. Let f be a polynomial over R infinitely many indeterminates X1,...,X n,which admits unit values locally.Then,we apply theorem1.1by taking S=R to the polynomial Y f(X1,...,X n)−1. Remark1.3.If R is the ring of algebraic integers,then R is local-global by[6] and semi-primitive.But this ring is not Gelfand.2.Arithmetic Gelfand ringsWe say that a module is uniserial if its set of submodules is totally ordered by inclusion,we say that a ring R is a valuation ring if it is uniserial as R-module and we say that R is arithmetic if R P is a valuation ring for each maximal ideal P.Recall that R is a B´e zout ring if eachfinitely generated ideal is principal and R is an elementary divisor ring if eachfinitely presented module is a direct sum of cyclic submodules.Theorem2.1.Let R be an arithmetic local-global ring.Then R is an elementary divisor ring.Moreover,for each a,b∈R,there exist d,a′,b′,c∈R such that a=a′d,b=b′d and a′+cb′is a unit of R.Proof.Since everyfinitely generated ideal is locally principal R is B´e zout by[8, Corollary2.7].Let a,b∈R.Then there exist a′,b′,d∈R such that a=a′d,b=b′d and Ra+Rb=Rd.Consider the following polynomial a′+b′T.If P is a maximal ideal,then we have aR P=dR P or bR P=dR P.So,either a′is a unit of R P and a′+b′r is a unit of R P for each r∈P R P,or b′is a unit of R P and a′+b′(1−a′/b′)is a unit of R P.We conclude that the last assertion holds.Now,let a,b,c∈R such that Ra+Rb+Rc=R.We set Rb+Rc=Rd.Let b′,c′,s and q such that b=b′d,c=c′d and b′+c′q and a+sd are units.Then(b′+c′q)(a+sd)=(b′+c′q)a+s(b+qc) is a unit.We conclude by[10,Theorem6].We deduce the following corollary which is a generalization of[4,Theorem III.6] and[9,Theorem5.5].Corollary2.2.Let R be an arithmetic ring with a Hausdorffand totally discon-nected maximal spectrum.Then R is an elementary divisor ring.Moreover,for each a,b∈R,there exist d,a′,b′,c∈R such that a=a′d,b=b′d and a′+cb′is a unit of R.4FRANC¸OIS COUCHOTCorollary2.3.Let R be an arithmetic Gelfand ring such that Min R is compact. Then R is an elementary divisor ring.Moreover,for each a,b∈R,there exist d,a′,b′,c∈R such that a=a′d,b=b′d and a′+cb′is a unit of R.Proof Letµ′be the restriction ofµto Min R.Since R is arithmetic each prime ideal contains only one minimal prime ideal.Thenµ′is bijective and it is an homeomorphism because Min R is compact.One can apply corollary2.2since Min R is totally disconnected. Remark2.4.In[9]there is an example of a Gelfand B´e zout ring R which is not an elementary divisor ring.Consequently Min R is not compact.3.Indecomposable modules and maximal idealsIn the two next propositions we give a characterization of Gelfand rings and clean rings by using properties of indecomposable modules.Proposition3.1.Let R be a ring.The following conditions are equivalent:(1)For each R-algebra S and for each left S-module M for which End S(M)islocal,Supp M contains only one maximal ideal.(2)R is a Gelfand ring.(3)∀P∈Max R the natural map R→R P is surjective.When these conditions are satisfied,M=M P for each left S-module M for which End S(M)is local,where P is the unique maximal ideal of Supp M and where S is an algebra over R.Proof.Assume that R is Gelfand.Let S be an R-algebra and let M be a left S-module such that End S(M)is local.Let P be the prime ideal which is the inverse image of the maximal ideal of End S(M)by the canonical map R→End S(M)and let Q=µ(P).Since M is an R P-module,0Q⊆ann R(M).So,Supp M⊆V(0Q) and Q is the only maximal ideal belonging to V(0Q)since R is Gelfand.Conversely,if P is a prime ideal then R P=End R(R P).It follows that P is contained in only one maximal ideal.By[7,Theorem1.2]R is Gelfand if and only if,∀P∈Max R,P is the only maximal ideal containing0P.This is equivalent to R/0P is local,∀P∈Max R.It is obvious that R P=R/0P if R/0P is local.(When R is semi-primitive we can see [3,Proposition1.6.1]).Recall that the diagonal map M→ΠP′∈Max(R)M P′is monic.Since R is Gelfand, we have M P=M/0P M where P is the only maximal ideal of Supp M.Hence M=M P. Proposition3.2.Let R be a ring.The following conditions are equivalent:(1)For each R-algebra S and for each indecomposable left S-module M,Supp Mcontains only one maximal ideal.(2)R is clean.When these conditions are satisfied,M=M P for each indecomposable left S-module M,where P is the unique maximal ideal of Supp M and S is an R-algebra.Proof.(2)⇒(1).By Theorem1.1Max R is totally disconnected.So,if P and P′are two different maximal ideals such that P∈Supp M then there exists an idempotent e∈P\P′becauseµis continuous.Since(1−e)/∈P and M P=0,we have(1−e)M=0.We deduce that eM=0and M P′=0.INDECOMPOSABLE MODULES AND GELFAND RINGS5(1)⇒(2).R is Gelfand by Proposition3.1.Let A be an ideal such that V(A) is the inverse image of a connected component of Max R byµ.Then V(A)is connected too,whence R/A is indecomposable.So there is only one maximal ideal in V(A).Since each connected component contains only one point,Max R is totally disconnected.This lemma is needed to prove the main results of this section.Lemma3.3.Let R be a local ring which is not a valuation ring.Then there exists an indecomposable non-finitely generated R-module whose endomorphism ring is not local.Proof.Since R is not a valuation ring there exist a,b∈R such that neither divides the other.By taking a suitable quotient ring,we may assume that Ra∩Rb= 0and P a=P b=0.Let F be a free module generated by{e n|n∈N},let K be the submodule generated by{ae n−be n+1|n∈N}and let M=F/K.Clearly M/P M∼=F/P F.We will show that M is indecomposable and S:=End R(M) is not local.Let us observe that M is defined as in proof of[13,Theorem2.3]. But,since R is not necessarily artinian,we do a different proof to show that M is indecomposable.We shall prove that S contains no trivial idempotents.Let s∈S. Then s is induced by an endomorphism˜s of F which satisfies˜s(K)⊆K.For each n∈N there exists afinite family(αp,n)of elements of R such that:(1)˜s(e n)= p∈Nαp,n e pSince˜s(K)⊆K,∀n∈N,∃afinite family(βp,n)of elements of R such that: (2)˜s(ae n−be n+1)= p∈Nβp,n(ae p−be p+1)From1and2if follows that:p∈N(aαp,n−bαp,n+1)e p=aβ0,n e0+ p∈N∗(aβp,n−bβp−1,n)e pSince P a=P b=Ra∩Rb=0we deduce thatα0,n+1≡0[P],αp,n≡βp,n[P]andαp,n+1≡βp−1,n[P]It follows that(3)(i)αp,n≡αp+1,n+1[P],∀p,n∈N,and(ii)αp,p+k+1≡0[P],∀p,k∈NNow we assume that s is idempotent.Let x n=e n+K,∀n∈N.Let¯s be the endomorphism of M/P M induced by s.If L is an R-module and x an element of L,we put¯x=x+P L.From s2(x0)=s(x o)we get the following equality: (4) n∈N( p∈Nαn,pαp,0)x n= n∈Nαn,0x nThen¯α0,0= p∈N¯α0,p¯αp,0=¯α20,0,since¯α0,p=0by3(ii),∀p>0.So,we have ¯α0,0=0or¯α0,0=1.If¯α0,0=1then we replace s with1M−s.So we may assume that¯α0,0=0.By3(i)¯αn,n=0,∀n∈N.By using4and3(ii)we get that¯αn,0=n−1p=0¯αn,p¯αp,0+¯αn,n¯αn,06FRANC¸OIS COUCHOTHence,if¯αp,0=0,∀p<n then¯αn,0=0too.By induction we obtain that¯αn,0=0,∀n∈N.We deduce that(5)αp,n∈P,∀p,n∈NLet A=Im s,B=Ker s and let A′and B′be the inverse image of A and B by the natural map F→M.If x∈A′then˜s(x)=x+y for some y∈K.By5and P a=P b=0it follows that˜s(y)=0and˜s2(x)=˜s(x).If x∈B′then˜s(x)∈K. So˜s2(x)=0.We deduce that(˜s2)2=˜s2.Let C=Im˜s2.Then C is projective and C=P C by5.By[2,Proposition2.7]C=0.So s=0(or1M−s=0).It remains to prove that S is not local.Let f,g∈S defined in the following way:f(x n)=x n+1and g(x n)=x n−x n+1,∀n∈N.We easily check that x0/∈Im f∪Im g.So f and g are not units of S and f+g=1M is a unit.Hence S is not local.A module is cocyclic(respectivelyfinitely cogenerated)if it is a submodule of the injective hull of a simple module(respectively of afinite direct sum of injective hulls of simple modules).Now we give a characterization of commutative rings for which each indecom-posable module satisfies afinite condition.Theorem3.4.Let R be a ring.The following conditions are equivalent:(1)Each indecomposable R-module is offinite length.(2)Each indecomposable R-module is noetherian.(3)Each indecomposable R-module isfinitely generated.(4)Each indecomposable R-module is artinian.(5)Each indecomposable R-module isfinitely cogenerated.(6)Each indecomposable R-module is cyclic.(7)Each indecomposable R-module is cocyclic.(8)For each maximal ideal P,R P is an artinian valuation ring.(9)R is an arithmetic ring of Krull-dimension0and its Jacobson ideal J isT-nilpotent.Proof.The following implications are obvious:(1)⇒(2)⇒(3),(1)⇒(4)⇒(5),(6)⇒(3)and(7)⇒(5).(8)⇒(1),(6)and(7).R has Krull dimension0.Hence R is clean.So,if M is an indecomposable module,by proposition3.2there is only one maximal ideal P such that M P=0.Moreover M∼=M P.We conclude by[13,Theorem4.3].(3)⇒(8).Let P be a maximal ideal and E the injective hull of R/P.Then each submodule of E is indecomposable.It follows that E is a noetherian module. By[23,Proposition3]E is a module offinite length,and by[23,Theorem3]R P is artinian.We conclude by[13,Theorem2.3]or Lemma3.3.(5)⇒(8).Let P be a maximal ideal.Then each factor of R P modulo an ideal of R P isfinitely cogenerated.It follows that R P is artinian.We conclude as above.(8)⇒(9).Let x1,...,x n,...be a sequence of elements of J.Then for each maximal ideal P∃s P/∈P and a positive integer n P such that s P x1...x n P=0.There is afinite family of open sets D(s n P1),...,D(s n Pm)that cover Spec R.Weset n=max{n P1,...,n P m}.Then x1...x n=0.(9)⇒(8).∀P∈Max R,R P is a valuation ring and P R P is a nilideal.Then for every r∈P there exists s∈R\P such that sr is nilpotent.So we get that P R P=JR P,whence P R P is T-nilpotent.We easily prove that R P is artinian.INDECOMPOSABLE MODULES AND GELFAND RINGS7 From this theorem it is easy to deduce the two following corollaries.Another proof of the second corollary is given in[5,Theorem2.13].Corollary3.5.Let n be a positive integer,R a ring and J its Jacobson radical. Then the following conditions are equivalent:(1)Each indecomposable module has a length≤n.(2)For each maximal ideal P,R P is a valuation ring and(P R P)n=0.(3)R is an arithmetic ring of Krull-dimension0and J n=0.Corollary3.6.A ring R is Von Neumann regular if and only if every indecom-posable module is simple.The next theorem gives a partial characterization of commutative rings for which each indecomposable module has a local endomorphism ring.Theorem3.7.Let R be a ring for which End R(M)is local for each indecomposable module M.Then R is a clean elementary divisor ring.Proof.Let P be a prime ideal.Then R/P=End R(R/P)is local.Hence R is Gelfand.We prove that Max R is totally disconnected as in proof of proposition3.2. If P is a maximal ideal,each indecomposable R P-module M is also indecomposable over R and End R(M)=End R P(M).By Lemma3.3R P is a valuation ring. Example3.8.If R is a ring satisfying the equivalent conditions of Theorem3.4, then each indecomposable R-module has a local endomorphism ring.But,by[15, Corollary2p.52]and[22,Corollary3.4],each complete discrete rank one valuation ring enjoys this property too.So,we consider a complete discrete rank one valuation ring D,Q its ring of fractions and R the subring of Q N defined as in[20,Example 1.7]:x=(x n)n∈N∈R if∃p∈N and s∈D such that x n=s,∀n>p.Since D is local,R is clean and semi-primitive by[18,Theorem2].We put1=(δn,n)n∈N and∀p∈N,e p=(δp,n)n∈N whereδn,p is the Kronecker symbol.Let J be the maximal ideal of D.If P is a maximal ideal of R,then either e p∈P,∀p∈N, whence P=J1+⊕p∈N R e p and R P∼=R/⊕p∈N R e p∼=D,or∃p∈N such that e p/∈P,whence P=R(1−e p)and R P∼=R/P∼=Q.Thus R is arithmetic and each indecomposable R-module has a local endormorphism ring.Observe that each indecomposable R-module is uniseriel and linearly compact and its endomorphism ring is commutative.4.Indecomposable modules and minimal prime idealsIn this section we study rings R for which each prime ideal contains only one minimal prime ideal.In this case,if P∈Spec R,letλ(P)be the only minimal prime ideal contained in P.We shall see thatλis continuous if and only if Min R is compact.(See[16,Theorem2]when R is semi-prime).But,sinceλis surjective, the set of minimal primes can be endowed with the quotient topology induced by the Zariski topology of Spec R.We denote this topologic space by QMin R.Then we have the following:Proposition4.1.Let R be a ring such that each prime ideal contains a unique minimal prime ideal and N its nilradical.Then QMin R is compact.Moreover, QMin R and Min R are homeomorphic if and only if Min R is compact.The following lemma is needed to prove this proposition.This lemma is a ge-neralization of[14,Lemma2.8].We do a similar proof.8FRANC¸OIS COUCHOTLemma4.2.Let R be a ring,N its nilradical and a∈R\N.Let P be a prime ideal such that P/(N:a)is minimal in R/(N:a).Then P is a minimal prime ideal.Proof.First we show that a+(N:a)is a non-zerodivisor in R/(N:a)and consequently a/∈P.Let b∈R such that ab∈(N:a).Then a2b∈N.We easily deduce that ab∈N,whence b∈(N:a).Let r∈P.Then there exist a positive integer n and s∈R\P such that sr n∈(N:a).It follows that asr n∈N.Since as/∈P we deduce that P R P is a nilideal,whence P is a minimal prime.Proof of proposition4.1.Let A and B be two distinct minimal prime ideals. Since each maximal ideal contains only one minimal prime ideal,we have A+B=R. Therefore there exist a∈A and b∈B such that a+b=1.Thus a/∈B and a/∈N. But a is a nilpotent element of R A.Hence(N:a) A.In the same way we show that B∈D((N:b)).We have(N:a)∩(N:b)=(N:Ra+Rb)=N. So D((N:a))∩D((N:b))=∅.By Lemma4.2,D((N:a))and D((N:b))are the inverse images of disjoint open subsets of QMin R byλ.We conclude that this space is Hausdorff.Since Spec R is quasi-compact,it follows that QMin R is compact.Letλ′be the restriction ofλto Min R.It is obvious that(λ′)−1is continuous if and only if Min R is compact. Remark4.3.If we consider the set of D-components of Spec R,defined in[17], endowed with the quotient topology,we get a topologic space X.Then X is homeo-morphic to Max R(respectively QMin R)if R is Gelfand(respectively every prime ideal contains only one minimal prime).But X is not generally Hausdorff:see[17, Propositions6.2and6.3].Now we can show the two following propositions which are similar to Proposi-tions3.1and3.2.The proofs are similar too.Proposition4.4.Let R be a ring.The following conditions are equivalent:(1)For each R-algebra S and for each left S-module M for which End S(M)is local,there exists only one minimal prime ideal A such that Supp M⊆V(A).(2)Every prime ideal contains only one minimal prime ideal.Proof.(2)⇒(1).Let S be an R-algebra and let M be a left S-module such that End S(M)is local.Let P be the prime ideal which is the inverse image of the maximal ideal of End S(M)by the canonical map R→End S(M),A=λ(P)and0P the kernel of the natural map R→R P.Since M is an R P-module,0P⊆ann R(M). It is obvious that0P⊆A.On the other hand,AR P is the nilradical of R P.It follows that rad(0P)=A.Hence we get that Supp M⊆V(ann R(M))⊆V(0P)=V(A). If B is another minimal prime,it is obvious that V(A)∩V(B)=∅.(1)⇒(2).If P is a prime ideal then R P=End R(R P).It follows that P contains only one minimal prime ideal. Proposition4.5.Let R be a ring.The following conditions are equivalent:(1)For each R-algebra S and for each indecomposable left S-module M,thereis only one minimal prime ideal A such that Supp M⊆V(A).INDECOMPOSABLE MODULES AND GELFAND RINGS9(2)Each prime ideal contains a unique minimal prime ideal and QMin R istotally disconnected.Proof.(1)⇒(2).By proposition4.4each prime ideal contains a unique minimal prime ideal.Let P∈QMin R and C its connected component.There exists an ideal A such that V(A)=λ←(C).Then V(A)is connected.It follows that R/A is indecomposable.So V(A)=V(P)and C={P}.(2)⇒(1).Let S be an R-algebra and M be an indecomposable left S-module. 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