TLYE53TF中文资料
更快更强 全面解析联想小y无线网络设置
更快更强全面解析联想小y无线网络设置Windows 7 简单、快速、魅力十足。
利于更好地查找及处理文件，例如Jump List 和改进的任务栏预览，可帮助您加速完成日常任务。
Windows 7 经过精心设计，具备更快更可靠的性能，因此您的电脑会按照您希望的方式工作。
同时，家庭组、WindowsMedia Center 及Windows触控等一系列强大功能使新事物成为可能。
抛开windows7的热门话题，我们来看看小y和windows7结合在无线连接方面的表现测试环境：联想et880手机windows mobile6.0操作系统联想昭阳E43L windows7专业版操作系统联想y450-tsi windows7旗舰版操作系统tp-link541G无线路由器一·小y与tp-link541G无线路由器我住的地方开始没装宽带，于是在一家经常吃饭的饭店里接了无线宽带过来，饭店距离我住的地方大概150米，穿一堵墙，使用tp-link无线路由器。
老板家的宽带是2M的，我下载的峰值210Kb/s,基本保持在190Kb/s,可以说比较稳定，基本没有影响。
无线路由器设置：1.拿出无线路由器的说明书按照上面的步骤设置两台笔记本的IP地址。
2.登陆WEB管理界面打开IE浏览器输入说明书中提供的地址（比如TP-LINK的管理界面就是192.168.1.1）3.点击设置向导，这是会问你是何种方式上网，家庭一般都是ADSL虚拟拨号，然后把平时上网的账号口令输入就OK。
4.完成设置5.保障无线网络安全的详细设置/aikerlee/blog/item/b63b853277db15f11b4cff63.html小y端操作：1.首先，在windows7中系统界面右下角的网络连接的图标变成了，鼠标点一下就会系统自动搜索到的各种无线网络信号。
2.点选你需要连接的网络信号，点“连接”按钮，系统就会为你建立连接，如果是需要经常使用的无线网络信号，那么你可以在点“连接”前勾选“自动连接”，下次再开机，系统会自动识别网络信号并连接。
稳压管大全)
3.3V简易开关电源稳压器(1A)
LM1575T-5.0
5V简易开关电源稳压器(1A)
LM1575T-12
12V简易开关电源稳压器(1A)
LM1575T-15
15V简易开关电源稳压器(1A)
LM1575T-ADJ
简易开关电源稳压器(1A可调1.23 to 37)
LM1575HVT-3.3
LM2575HVT-ADJ
简易开关电源稳压器(1A可调1.23 to 37)
LM2576T-3.3
3.3V简易开关电源稳压器(3A)
LM2576T-5.0
5.0V简易开关电源稳压器(3A)
LM2576T-12
12V简易开关电源稳压器(3A)
LM2576T-15
15V简易开关电源稳压器(3A)
LM2576T-ADJ
79L08
-8V稳压器(100ma)
KA1L0380RB
Power Switch
KA5L0380R
Power Switch
KA78R05
Low Dropout Voltage Regulator(1A)
PQ05RD11
ASO保护功能低功耗稳压器(1A)[四端稳压]
PQ05RD21
ASO保护功能低功耗稳压器(2A)[四端稳压]
型号(规格)
功能简介
兼容型号
CA3130
高输入阻抗运算放大器
Intersil[DATA]
CA3140
高输入阻抗运算放大器
CD4573
四可编程运算放大器
MC14573
ICL7650
斩波稳零放大器
LF347(NS[DATA])
带宽四运算放大器
TF维修手册中文_说明书
镀锌
4
BZ1203
活络接头
1/2”
镀锌
5
BZ1204
三通
1/2”
镀锌
6
BZ1205
8-Q11F-6.4
1/2”
TF-1600-1-1300A
TF-1600-1-1300B
TF-1600-1-1300
序号
图号
名称
规格
备注
1
1301
过纸辊
2
1303
蒸汽箱
3
BZ1301
8-Q11F-6.4
1/2”
GB9877.2
21
BZ0715
胀套
Z2-55*85
GB5867
22
BZ0716
轴承
22209
GB288
23
BZ0717
密封圈
B-60*80*8
GB9877.2
24
BZ0718
轴承
NU209
GB283
25
BZ0719
密封圈
B-60*80*8
GB9877.2
26
BZ0720
汽缸
MAL-CA-25*75-SDB
28
0146
上齿轮
29
BZ0112
万向联轴节
罗曼19
30
BZ0113
O型密封圈
185*3.55
GB3452.1
31
BZ0114
涨套
Z3-100*145
GB5867
32
BZ0115
涨套
Z3-70*110
GB5867
33
BZ0116
轴承
6212
s34ml01g200tf100 手册
s34ml01g200tf100 手册对于s34ml01g200tf100，这是一款存储器产品的型号。
下面是关于s34ml01g200tf100的手册的多角度全面完整的回答。
1. 产品概述，s34ml01g200tf100是一款容量为1GB的闪存存储器。
它采用了先进的技术，具有高速、可靠、耐用的特点。
手册中会介绍该产品的主要特性、技术规格和工作原理等信息。
2. 产品规格，手册中会详细列出s34ml01g200tf100的技术规格，包括存储容量、尺寸、电气特性、工作温度范围等。
这些规格信息对于用户在设计和应用中的选择和使用非常重要。
3. 功能特性，手册会介绍s34ml01g200tf100的功能特性，包括读写速度、数据保持能力、擦除次数、可靠性等。
这些特性对于用户评估该产品是否符合其需求非常关键。
4. 应用场景，手册中可能会提供一些关于s34ml01g200tf100的典型应用场景，例如嵌入式系统、消费电子产品、工业控制等。
这些案例可以帮助用户更好地了解该产品的适用范围和优势。
5. 使用指南，手册中可能会提供关于如何正确使用和操作s34ml01g200tf100的指南，包括电路连接、编程方法、数据传输等。
这些指南可以帮助用户快速上手并正确使用该产品。
6. 故障排除，手册中可能会提供一些常见故障和解决方法，以帮助用户在使用过程中遇到问题时进行排除和修复。
7. 其他补充信息，手册中可能还包含一些其他相关的信息，例如产品的认证、环境保护指南、技术支持联系方式等。
总结而言，s34ml01g200tf100的手册将提供关于该产品的概述、规格、特性、应用、使用指南、故障排除等方面的详细信息，以帮助用户更好地了解和使用该产品。
TNETX3150资料
2
EA0 EA1 EA2 VCC EA3 EA4 EA5 EA6 EA7 EA8 GND EA9 EA10 EA11 EA12 EA13 EA14 VCC EA15 EA16 EA17 EA18 EA19 EA20 GND DWE DRAS DD0 DD1 VCC(5V) DD2 DD3 DD4 DD5 DD6 DD7
元器件交易网
TNETX15AE ADDRESS-LOOKUP DEVICE
SPWS041A – AUGUST 1997 – REVISED OCTOBER 1997
D D D D D D D D
Provides up to 8K-Address Matching System Provides Glueless External-Address Match (EAM) Interface to the TNETX3150/TNETX3150A/TNETX3100 Uses Standard Off-the-Shelf 15-ns SRAMs EEPROM Interface for Auto-Configuration, No CPU Needed Automatic Aging Through User-Selectable Aging (AGE) Threshold Fabricated in 3.3-V Low-Voltage Technology Requires 3.3-V and 5-V Power Supplies 5-V Tolerant I/Os
D D D D D D D D
Provides Direct Input/Output (DIO) Interface for Management Access and Control (MAC) of the Address-Lookup Table Address Lookups, Adds, and Deletes Are Automatically Performed in Hardware User-Selectable Interrupts Simplify the Management Operations Secure Addresses From Changing Ports MII Data I/O (MDIO) PHY Management Interface Management Access to Statistic Registers JTAG Compliant Packaged in 144-Terminal Plastic Quad Flatpack
Richtek技术有限公司产品说明书
RT8511B®DS8511B-05 February 20151©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Ordering InformationNote :Richtek products are :❝ RoHS compliant and compatible with the current require-ments of IPC/JEDEC J-STD-020.❝ Suitable for use in SnPb or Pb-free soldering processes.Marking InformationPin Configurations(TOP VIEW)WDFN-8L 2x243V Asynchronous Boost WLED DriverGeneral DescriptionThe RT8511B is an LED driver IC that can support up to 10 WLED in series. It is composed of a current mode boost converter integrated with a 43V/2.2A power switch running at a fixed 500kHz frequency and covering a wide VIN range from 2.7V to 24V.The white LED current is set with an external resistor, and the feedback voltage is regulated to 200mV (typ.). During operation, the LED current can be controlled by the PWM input signal in which the duty cycle determines the feedback reference voltage.For brightness dimming, the RT8511B is able to maintain steady control of the LED current. Therefore, no audible noises are generated on the output capacitor. The RT8511B also has programmable over voltage pin to prevent the output from exceeding absolute maximum ratings during open LED conditions. The RT8511B is available in WDFN-8L 2x2 package.Features●Wide Input Voltage Range : 2.7V to 24V●High Output Voltage : up to 43V●Direct PWM Dimming Control and Frequency from 100Hz to 8kHz●Internal Soft-Start and Compensation ●200mV Reference Voltage●PWM Dimming with Internal Filter●Programmable Over Voltage Protection ●Over Temperature Protection ●Current Limit Protection ●Thin 8-Lead WDFN Package●RoHS Compliant and Halogen FreeApplications●UMPC and Notebook Computer Backlight ●GPS, Portable DVD BacklightEN PWM VIN LX0F : Product CodeW : Date CodeG : Green (Halogen Free and Pb Free)RT8511BRT8511B2DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Typical Application CircuitFigure 1. Typical Application Circuit of Normal OperationFigure 2. Typical Application Circuit of Low Voltage OperationVSET SETRT8511B3DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Function Block DiagramRT8511B4DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Electrical CharacteristicsRecommended Operating Conditions (Note 4)●Supply Input Voltage, V IN ------------------------------------------------------------------------------------------------2.7V to 24V ●Junction T emperature Range --------------------------------------------------------------------------------------------−40°C to 125°C ●Ambient T emperature Range --------------------------------------------------------------------------------------------−40°C to 85°CAbsolute Maximum Ratings (Note 1)●VIN, EN, PWM, DIMC to GND------------------------------------------------------------------------------------------−0.3V to 26.5V ●FB, OVP to GND ----------------------------------------------------------------------------------------------------------−0.3V to 48V ●LX to GND ------------------------------------------------------------------------------------------------------------------−0.3V to 48V < 500ns ----------------------------------------------------------------------------------------------------------------------−1V to 48V ● Power Dissipation, P D @ T A = 25°CWDFN-8L 2x2--------------------------------------------------------------------------------------------------------------0.833W ●Package Thermal Resistance (Note 2)WDFN-8L 2x2, θJA ---------------------------------------------------------------------------------------------------------120°C/W WDFN-8L 2x2, θJC ---------------------------------------------------------------------------------------------------------8.2°C/W ●Lead Temperature (Soldering, 10 sec.)-------------------------------------------------------------------------------260°C ●Junction T emperature -----------------------------------------------------------------------------------------------------150°C●Storage T emperature Range --------------------------------------------------------------------------------------------–65°C to 150°C ●ESD Susceptibility (Note 3)HBM (Human Body Model)----------------------------------------------------------------------------------------------2kV MM (Machine Model)-----------------------------------------------------------------------------------------------------200VRT8511B5DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Note 1. Stresses beyond those listed “Absolute Maximum Ratings ” may cause permanent damage to the device. These arestress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.Note 2. θJA is measured at T A = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC ismeasured at the exposed pad of the package.Note 3. Devices are ESD sensitive. Handling precaution is recommended.Note 4. The device is not guaranteed to function outside its operating conditions.RT8511B6DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.LED Current vs. PWM Duty Cycle1020304050600102030405060708090100PWM Duty Cycle (%)L E D C u r r e n t (m A)Typical Operating CharacteristicsFB Reference Voltage vs. Input Voltage198.0198.3198.6198.9199.2199.54812162024Input Voltage (V)F B R e f e r e n c e V o l t a g e (m V)Frequency vs. Input Voltage3504004505005506004812162024Input Voltage (V)F r e q u e n c y (k H z ) Efficiency vs. Input Voltage6065707580859095100479121417192224Input Voltage (V)E f f i c i e n c y (%)FB Reference Voltage vs. Temperature-205305580105Temperature (°C)Current Limit vs. Input Voltage1.01.41.82.22.63.02.55.25810.7513.516.251921.7524.5Input Voltage (V)C u r r e n t L i m i t (A )RT8511B7DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Application InformationThe RT8511B is a current mode boost converter which operates at a fixed frequency of 500kHz. It is capable of driving up to 10 white LEDs in series and integrates functions such as soft-start, compensation, and internal analog dimming control. The protection block also provides over-voltage, over-temperature, and current- limit protection features.LED Current SettingThe loop structure of the boost converter keeps the FB pin voltage equal to the reference voltage V FB . Therefore,by connecting the resistor, R SET between the FB pin and GND, the LED current will be determined by the current through R SET . The LED current can be calculated by the following equation :FBLED SET VI = R Brightness ControlFor the brightness dimming control of the RT8511B, the IC provides typically 200mV reference voltage when the PWM pin is constantly pulled high. However, the PWM pin allows a PWM signal to adjust the reference voltage by changing the PWM duty cycle to achieve LED brightness dimming control. The relationship between the duty cycle and the FB voltage can be calculated according to the following equation :V FB = 200mV x Dutywhere 200mV is the typical internal reference voltage and Duty is the duty cycle of the PWM signal.As shown in Figure 3, the duty cycle of the PWM signal is used to modify the internal 200mV reference voltage.With an on-chip output clamping amplifier and a serial resistor, the PWM dimming signal is easily low-pass filtered to an analog dimming signal with one external capacitor, C DIMC , for noise-free PWM dimming. Dimming frequency can be sufficiently adjusted from 100Hz to 8kHz.However, the LED current cannot be 100% proportional to the duty cycle. Referring to T able 1, the minimum dimming duty can be as low as 1% for the frequency range from 100Hz to 8kHz. It should be noted that the accuracy of 1% duty is not guaranteed.Figure 3. Block Diagram of Programmable FB Voltage Table 1. Minimum Duty for Dimming FrequencyBecause the voltage of DIMC and FB is small to 2mV andeasily affected by LX switching noise.ToControllerThe FB pin voltage will be decreased by lower PWM duty ratio . That will achieve LED current diming function for different brightness. But LED current is more accurate when higher PWM duty. The Table 2. shows typical variation value comparison between different PWM duty and condition is V IN = 3.7V, LED array = 6S2P , R SET =5Ω.Table 2. LED Current Variation vs PWM DutyIt also should be noted that when the input voltage is too close to the output voltage [(V OUT −V IN ) < 6V] , excessive audible noise may occur. Additionally, for accurate brightness dimming control, the input voltage should be kept lower than the LEDs' turn on voltage. When operating in the light load, excessive output ripple may occur.RT8511B8DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Mode2Mode3Figure 4. Power On SequenceMode1Mode3Figure 5. Power Off SequenceV INV OUTENV INV OUTENPWMV INV OUTENPWMV INV V INV OUTENPWMDelayMode1V INV ENSoft-StartThe RT8511B provides a built-in soft-start function to limit the inrush current, while allowing for an increased PWM frequency for dimming.Current Limiting ProtectionThe RT8511B can limit the peak current to achieve over current protection. The IC senses the inductor current through the LX pin in the charging period. When the value exceeds the current limiting threshold, the internal N-MOSFET will be turned off. In the off period, the inductor current will descend. The internal MOSFET is turned on by the oscillator during the beginning of the next cycle.Power SequenceIn order to assure that the normal soft-start function is in place for suppressing the inrush current, the input voltage and enable voltage should be ready before PWM pulls high. Figure 4 and Figure 5 show the power on and power off sequences.RT8511B9DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.OUT, OVP OVP R2V = V 1+R1⎛⎫⨯ ⎪⎝⎭where R1 and R2 make up the voltage divider connected to the OVP pin.Over Temperature ProtectionThe RT8511B has an Over T emperature Protection (OTP)function to prevent overheating caused by excessive power dissipation from overheating the device. The OTP will shut down switching operation if the junction temperature exceeds 160°C. The boost converter will start switching again when the junction temperature is cooled down by approximately 30°C.Inductor SelectionThe inductance depends on the maximum input current.As a general rule, the inductor ripple current range is 20%to 40% of the maximum input current. If 40% is selected as an example, the inductor ripple current can be calculated according to the following equation :OUT OUTIN(MAX)(MIN)IN(MIN)RIPPLE IN(MAX)V I I =V I = 0.4I η⨯⨯⨯where η is the efficiency of the boost converter, I IN(MAX) is the maximum input current, I OUT is the total current from all LED strings, and I RIPPLE is the inductor ripple current.The input peak current can be calculated by maximum input current plus half of inductor ripple current shown as following equation :I PEAK = 1.2 x I IN(MAX)Note that the saturated current of the inductor must be greater than I PEAK . The inductance can eventually be determined according to the following equation :Over Voltage ProtectionThe RT8511B equips Over Voltage Protection (OVP)function. When the voltage at the OVP pin reaches a threshold of approximately 1.2V , the MOSFET drive output will turn off. The MOSFET drive output will turn on again once the voltage at the OVP pin drops below the threshold.Thus, the output voltage can be clamped at a certain voltage level, as shown in the following equation :()())2IN OUT IN 2OUT OUT OSCV (V V L =0.4V I f η⨯⨯-⨯⨯⨯where f OSC is the switching frequency. For better efficiency,it is suggested to choose an inductor with small series resistance.Diode SelectionThe Schottky diode is a good choice for an asynchronous boost converter due to its small forward voltage. However,when selecting a Schottky diode, important parameters such as power dissipation, reverse voltage rating, and pulsating peak current must all be taken into consideration. A suitable Schottky diode's reverse voltage rating must be greater than the maximum output voltage,and its average current rating must exceed the average output current.Capacitor SelectionTwo 1μF ceramic input capacitors and two 1μF ceramic output capacitors are recommended for driving 10 WLEDs in series. For better voltage filtering, ceramic capacitors with low ESR are recommended. Note that the X5R and X7R types are suitable because of their wide voltage and temperature ranges.Thermal ConsiderationsFor continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula :P D(MAX) = (T J(MAX) − T A ) / θJAwhere T J(MAX) is the maximum junction temperature, T A is the ambient temperature, and θJA is the junction to ambient thermal resistance.For recommended operating condition specifications, the maximum junction temperature is 125°C. The junction to ambient thermal resistance, θJA , is layout dependent. For WDFN-8L 2x2 package, the thermal resistance, θJA , is 120°C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at T A = 25°C can be calculated by the following formulas :RT8511B10DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Figure 7. PCB Layout GuideLayout ConsiderationFor high frequency switching power supplies, the PCBlayout is important to obtain good regulation, high efficiency and stability. The following descriptions are the suggestions for better PCB layout.❝Input and output capacitors should be placed close to the IC and connected to the ground plane to reduce noise coupling.❝The GND and Exposed Pad should be connected to a strong ground plane for heat sinking and noise protection.❝The components L, D, C IN and C OUT must be placed as close as possible to reduce current loop. Keep the main current traces as possible as short and wide.❝The LX node of the DC/DC converter experiences is with high frequency voltage swings. It should be kept in a small area.❝The component R SET should be placed as close as possible to the IC and kept away from noisy devices.Figure 6. Derating Curve of Maximum Power DissipationP D(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for WDFN-8L 2X2 packageThe maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance, θJA . The derating curves in Figure 6 allow the designer to see the effect of rising ambient temperature on the maximum power dissipation.0.00.20.40.60.81.0255075100125Ambient Temperature (°C)M a x i m u m P o w e r D i s s i p a t i o n (W )IN as closed as possible to V I N pin for good filtering.directly from the output schottky diode to ground rather than across the WLEDs.The inductor should be placed as close as possible to theswitch pin to minimize the noise coupling into other circuits.LX node copper area should be minimized for reducing EMILocate R SET closeW-Type 8L DFN 2x2 PackageRichtek Technology Corporation14F, No. 8, Tai Yuen 1st Street, Chupei CityHsinchu, Taiwan, R.O.C.Tel: (8863)5526789Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.DS8511B-05 February 11。
TLGU53T中文资料
TOSHIBA InGaA ℓP LEDTLGU53T,TLGU53C,TLGU53D,TLPGU53T,TLPGU53C,TLPGU53DPanel Circuit Indicator· 3 mm package (T1-3/4) · InGaA ℓP technology · All plastic mold typeTLGU53T, TLPGU53T : Transparent lens TLGU53C, TLPGU53C : Colored, transparent lens TLGU53D, TLPGU53D : Colored, diffused lens · Colors: green, pure green · High intensity light emission · Excellent low current light output· Fast response time, capable of pulse operation· Applications: message signbord, safety equipment, indicatorLine-upProduct NameColorMaterialTLGU53T Green TLGU53C Green TLGU53D GreenTLPGU53T Pure green TLPGU53C Pure green TLPGU53D Pure greenP InGaA lMaximum Ratings (Ta = 25°C)Product NameForward CurrentI F (mA)Reverse VoltageV R (V)Power DissipationP D (mW)Operating Temperature T opr (°C)Storage Temperature T stg (°C)TLGU53T 30 4 72 TLGU53C 30 4 72 TLGU53D 30 4 72TLPGU53T 30 4 72 TLPGU53C 30 4 72 TLPGU53D 30472-40~100-40~120Unit: mmJEDEC ― JEITA―TOSHIBA 4-4E1A Weight: 0.14 gElectrical and Optical Characteristics (Ta = 25°C)Typ. Emission Wavelength Luminous IntensityI VForward VoltageV FReverse CurrentI RProduct Namel d l P Dl I F Min Typ.I F Typ.Max I F Max V R TLGU53T 571(574) 17 20 47.6170 20 2.1 2.4 20 50 4 TLGU53C 571(574) 17 20 47.6150 20 2.1 2.4 20 50 4 TLGU53D 571(574) 17 20 27.280 20 2.1 2.4 20 50 4 TLPGU53T 558(562) 14 20 27.280 20 2.1 2.4 20 50 4 TLPGU53C 558(562) 14 20 27.270 20 2.1 2.4 20 50 4 TLPGU53D 558 (562) 14 20 15.340 20 2.1 2.4 20 50 4 Unit nmmAmcdmAVmAm A V PrecautionsPlease be careful of the following:· Soldering temperature: 260°C max, soldering time: 3 s max(soldering portion of lead: up to 2 mm from the body of the device)· If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to the resin. Soldering should be performed after lead forming.· This visible LED lamp also emits some IR light.If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V)I F – V FF o r w a r d c ur r e n t I F (m A )Forward current I F(mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C)I V – TcR e l a t i v e l u m i n o u s i n t e n s i t y I VWavelength l (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )400120300204010206080 100Radiation patternTa = 25°C30°0°60° 90° 90°30°60° 1.00.80.6 0.4 0.2 0 80° 70° 50° 40°20°10°70°80°50°40°20°10°20 -20 80 50.131010.30.50 40 60 100540620560580 600R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d c u r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C)I V – TcR e l a t i v e l u m i n o u s i n t e n s i t y I VWavelength l (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )400120300204010206080 100Radiation patternTa = 25°C20 -20 80 50.131010.30.50 40 60 100540620560580 600 30°0°60° 90° 90°30°60° 1.00.80.6 0.4 0.2 0 80° 70° 50° 40°20°10°70°80°50°40°20°10°R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d c u rr e n t I F (m A )Forward current I F(mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C)I V – TcR e l a t i v e l u m i n o u s i n t e n s i t y I VWavelength l (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )400120300204010206080 100Radiation patternTa = 25°C30°0°60° 90° 90°30°60° 1.00.80.6 0.4 0.2 0 80° 70° 50° 40°20°10°70°80°50°40°20°10°20 -20 80 50.131010.30.50 40 60 100540620560580 600R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d c u r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C)I V – TcR e l a t i v e l u m i n o u s i n t e n s i t y I VWavelength l (nm)Relative luminous intensity – WavelengthRadiation patternAmbient temperature Ta (°C)I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )Ta = 25°C400120300204010206080 10020 -20 80 50.131010.30.50 40 60100520600540560 580 30°0°60° 90° 90°30°60° 1.00.80.6 0.4 0.2 0 80° 70° 50° 40°20°10°70°80°50°40°20°10°R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d c u r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C)I V – TcR e l a t i v e l u m i n o u s i n t e n s i t y I VWavelength l (nm)Relative luminous intensity – WavelengthRadiation patternAmbient temperature Ta (°C)I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )Ta = 25°C400120300204010206080 10020 -20 80 50.131010.30.50 40 60100520600540560 580 30°0°60° 90° 90°30°60° 1.00.80.6 0.4 0.2 0 80° 70° 50° 40°20°10°70°80°50°40°20°10°R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d c u r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C)I V– TcR e l a t i v e l u m i n o us i n t e n s i t y I VWavelength l (nm)Relative luminous intensity – WavelengthRadiation patternAmbient temperature Ta (°C)I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )Ta = 25°C400120300204010206080 100 1011003530 50 20 -20 80 50.131010.30.50 40 60 100520600540560 580 30°0°60° 90° 90°30°60° 1.00.80.6 0.4 0.2 0 80° 70° 50° 40°20°10°70°80°50° 40°20°10°· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice.000707EACRESTRICTIONS ON PRODUCT USE。
易尔32HG家族无线微控制器参考手册说明书
SLWRB4545AReference Manual BRD4543BThe EZR32HG family of Wireless MCUs deliver a high perform-ance, low energy wireless solution integrated into a small form factor package.By combining a high performance sub-GHz RF transceiver with an energy efficient 32-bit MCU, the family provides designers the ultimate in flexibility with a family of pin-compatible devices that scale from 32/64 kB of flash and support Silicon Labs EZRadio or EZRadioPRO transceivers. The ultra-low power operating modes and fast wake-up times of the Silicon Labs energy friendly 32-bit MCUs, combined with the low transmit and receive power consumption of the sub-GHz radio, result in a solution optimized for battery powered applications.To develop and/or evaluate the EZR32 Happy Gecko the EZR32HG Radio Board can be connected to the Wireless Starter Kit Mainboard to get access to display, buttonsand additional features from Expansion Boards.Rev. 1.0Introduction 1. IntroductionThe EZR32 Happy Gecko Radio Boards provide a development platform (together with the Wireless Starter Kit Mainboard) for the Silicon Labs EZR32 Happy Gecko Wireless Microcontrollers and serve as reference designs for the matching network of the RF inter-face.The BRD4543B is designed to the operate in the US FCC 902-928 MHz band, the RF matching network is optimized to operate in the 915 MHz band with 20 dBm output power.To develop and/or evaluate the EZR32 Happy Gecko the BRD4543B Radio Board can be connected to the Wireless Starter Kit Main-board to get access to display, buttons and additional features from Expansion Boards and also to evaluate the performance of the RF interface.2. Radio Board Connector Pin AssociationsThe figure below shows the pin mapping on the connector to the radio pins and their function on the Wireless Starter Kit Mainboard.GND F9 / NC3v3NC / P36P200Upper RowNC / P38NC / P40NC / P42NC / P44DEBUG.TMS_SWDIO / PF1 / F0DISP_ENABLE / PA1 / F14UIF_BUTTON0 / PC9 / F12UIF_LED0 / PF4 / F10NC / F8DEBUG.RESET / RESETn / F4NC / F2DISP_MOSI / PE10 / F16VCOM.TX_MOSI / PD4 / F6PTI.DATA / RF_GPIO0 / F20DISP_EXTCOMIN / PF3 / F18USB_VBUS5VBoard ID SCLGNDBoard ID SDAUSB_VREGF7 / PD5 / VCOM.RX_MISOF5 / PC8 / VCOM_ENABLEF3 / NCF1 / PF0 / DEBUG.TCK_SWCLKP45 / NCP43 / NCP41 / NCP39 / NCP37 / NCF11 / PF2 / UIF_LED1F13 / PC10 / UIF_BUTTON1F15 / PE12 / DISP_SCLKF17 / PA0 / DISP_SCSF19 / RF_GPIO1 / PTI.SYNCF21 / NCGNDVMCU_INUIF_LED1 / PF2 / P0P201Lower RowUIF_LED0 / PF4 / P2UIF_BUTTON0 / PC9 / P4UIF_BUTTON1 / PC10 / P6GND VRF_INP35 / P7 / PE13P5 / PE12 / DISP_SCLK P3 / PE11P1 / PE10 / DISP_MOSI P33 / RF_GPIO3 P31 / RF_GPIO1 / PTI.SYNC P29 / NCP27 / NC P25 / PC14 * P23 / NC P21 / PF1 / DEBUG.TMS_SWDIO P19 / PC8 / VCOM_ENABLEP17 / NCP15 / PA1 / DISP_ENABLE P13 / PD6P11 / PD5 / VCOM.RX_MISO P9 / PD4 / VOM.TX_MOSI NC / P34RF_GPIO2 / P32PTI.DATA / RF_GPIO0 / P30NC / P28PC15 * / P26NC / P24DISP_EXTCOMIN / PF3 / P22DEBUG.TCK_SWCLK / PF0 / P20NC / P18NC / P16DISP_SCS / PA0 / P14PD7 / P12NC / P10PB11 / P8 * Connection is not enabled by default on the Radio Board.To enable 0 Ohm resistors should be mounted. See the schematic of the Radio Board.Figure 2.1. BRD4543B Radio Board Connector Pin MappingRadio Board Connector Pin Associations3. Radio Board Block DescriptionThe block diagram of the EZR32HG Radio Board is shown in the figure below. For the exact part numbers of the applied components refer to the BRD4543B BOM.Figure 3.1. EZR32HG Radio Board Block Diagram3.1 Wireless MCUThe BRD4543B EZR32 Happy Gecko Radio Board incorporates an EZR32HG320F64R68G Wireless Microcontroller featuring 32-bit Cortex-M0+ core, 64 kB of flash memory and 8 kB of RAM. For additional information on the EZR32HG320F64R68G, refer to the EZR32HG320 Data Sheet.The EZR32HG320F64R68G is built using the Si4468, a high-performance, low-current transciever that is part of Silicon Labs' EZRadio-PRO family. The Si4468 contains an integrated +20 dBm power amplifier that is capable of transmitting from –20 to +20 dBm. For a complete feature set and in-depth information on the transciever, refer to the "Si4463/61/60-C High-Performance, Low-Current Trans-ceiver" Data Sheet.3.2 USBThe BRD4543B Radio Board incorporates a micro USB connector. The 3.3V USB regulator output is are routed back to the WSTK through the Radio Board Connector so the Radio Board can supply power to the Wireless Starter Kit Mainboard.For additional information on EZR32HG USB, refer to the EZR32HG320 Data Sheet.3.3 RF Crystal Oscillator (RFXO)The BRD4543B Radio Board has a 30 MHz crystal mounted. For more details on crystal or TCXO selection for the RF part of the EZR32 devices refer to "AN785: Crystal Selection Guide for the Si4x6x RF ICs".3.4 LF Crystal Oscillator (LFXO)The BRD4543B Radio Board has a 32.768 kHz crystal mounted. For safe startup two capacitors are also connected to the LFXTAL_N and LFXTAL_H pins. For details regarding the crystal configuration, the reader is referred to Application Note "AN0016: EFM32 Oscilla-tor Design Consideration".| Smart. Connected. Energy-friendly.Rev. 1.0 | 33.5 HF Crystal Oscillator (HFXO)The BRD4543B Radio Board has a 24 MHz crystal mounted. For safe startup two capacitors are also connected to the HFXTAL_N and HFXTAL_H pins. For details regarding the crystal configuration, the reader is referred to Application Note "AN0016: EFM32 Oscillator Design Consideration".3.6 RF Matching NetworkThe BRD4543B Radio Board includes a Class E type matching network with a so-called Switched matching configuration where the TX and RX sides are connected together with an additional RF switch, to be able to use one antenna both for transmitting and receiveing. The component values were optimized for the 915 MHz band RF performace and current consumption with 20 dBm output power.For more details on the matching network used on the BRD4543B see Chapter 4.1 Matching Network.3.7 SMA ConnectorTo be able to perform conducted measurements or mount external antenna for radiated measurements, range tests etc., Silicon Labs added an SMA connector to the Radio Board. The connector allows an external 50 Ohm cable or antenna to be connected during de-sign verification or testing.3.8 Radio Board ConnectorsTwo dual-row, 0.05” pitch polarized connectors make up the EZR32HG Radio Board interface to the Wireless Starter Kit Mainboard. For more information on the pin mapping between the EZR32HG320F64R68G and the Radio Board Connector refer to Chapter 2. Radio Board Connector Pin Associations.4. RF SectionThe BRD4543B Radio Board includes a Class E type TX matching network with the targeted output power of 20 dBm at 915 MHz.The main advantage of the Class E matching types is their very high efficiency. They are proposed for applications where the current consumption is most critical, e.g., the typical total EZRadioPRO chip current with Class E type matching is ~75-90 mA at ~20 dBm (using the 20dBm PA output and assuming 3.3 V supply voltage).The main disadvantage of the Class E type matches is the high supply voltage dependency (the power variation is proportional to the square of the supply voltage change: i.e. the decrease in power can be ~6 dB in the 1.8–3.8 V range) and the inaccurate nonlinear power steps. Also their current consumption and the peak voltage on the TX pin are sensitive to the termination impedance variation, and they usually require slightly higher order filtering and thus higher bill of materials cost.The matching network is constructed with a so-called Switched configuration where the TX and RX sides are connected together with an additional RF switch, to be able to use one antenna both for transmitting and receiveing. Careful design procedure was followed to ensure that the RX input circuitry does not load down the TX output path while in TX mode and that the TX output circuitry does not degrade receive performance while in RX mode.For detailed explanation of the Class E type TX matching and the Switched configuration matching procedure the reader is referred to "AN648: Si4063/Si4463/64/67/68 TX Matching". For detailed description of the RX matching the reader is referred to "AN643: Si446x/ Si4362 RX LNA Matching".4.1 Matching NetworkThe matching network structure used on the BRD4543B Radio Board is shown in the figure below.Filter1Figure 4.1. RF Section of the Schematic of the BRD4543B EZR32 Happy Gecko Radio BoardThe component values were optimized for the 915 MHz band RF performace and current consumption with 20 dBm output power. The resulting component values with part numbers are listed in the table below.| Smart. Connected. Energy-friendly.Rev. 1.0 | 5Table 4.1. Bill of Materials for the BRD4543B RF Matching NetworkThe Application Note "AN648: Si4063/Si4463/64/67/68 TX Matching" contains component values for reference matching networks which were developed for the EZRadioPRO Pico Boards. For the WSTK radio boards some fine-tuning of the component values may be necessary due to different parasitic effects (bonding wire, layout etc.). For optimized RF performance the component values listed in the table above may differ from the ones listed in the referred Application Note.For the reader’s specific application and board layout the adjustment of the final matching values might be necessary. The above com-ponent values should be used as starting points and the values modified slightly to zero-in on the best filter response and impedance match to 50 ohm. To minimize the differences due to different layout parasitics Silicon Labs recommends copying the layout of the RF section of the radio board as is. If that is not possible, refer to "AN629: Si4460/61/63/64/67/68 RF ICs Layout Design Guide" for layout design recommendations. | Smart. Connected. Energy-friendly.Rev. 1.0 | 65. Mechanical DetailsThe BRD4543B EZR32 Happy Gecko Radio Board is illustrated in the figures below.2.7 mmFigure 5.1. BRD4543B Top View5 mm ConnectorConnector Figure 5.2. BRD4543B Bottom ViewMechanical DetailsRev. 1.0 | 7EMC compliance 6. EMC complianceThe BRD4543B EZR32 Happy Gecko Radio Board is dedicated for operation in the US FCC 902-928 MHz band. The relevant FCC 15.247 regulation specifies the maximum allowed level of the fundamental power and spurious emissions.In this document the compliance of the Radio Board fundamental and harmonic emissions will be investigated with 915 MHz fundamen-tal frequency (harmonics are measured up to the 10th one).6.1 FCC 15.247 Emission Limits for the 902-928 MHz BandBased on FCC 15.247 the allowed maximum fundamental power for the 902-928 MHz band is 1 W (+30 dBm) for radiated measure-ments.Note: Further in this document EIRP (Effective Isotropic Radiated Power) will be used for the comparison of the radiated limits and measurement results. The 1 W radiated limit is equivalent to +30 dBm EIRP.Outside the allowed frequency bands FCC 15.247 specifies the maximum allowed spurious emission level to be 20 dB below the power of the fundamental, based on either a conducted or radiated measurement. In addition, radiated emissions which fall in the restricted bands defined in FCC 15.205(a) must also comply with the radiated emission limits specified in FCC 15.209(a). Above 960 MHz this is defined as 500 uW (-41.2 dBm EIRP).In case of operating at 915 MHz the harmonics falling into restricted bands are the 3rd, 4th, 5th, 8th, 9th and 10th harmonics.Note: The FCC restricted band limits are radiated limits only. Besides that, Silicon Labs applies those to the conducted spectrum i.e. it is assumed that in case of a custom board an antenna is used which has 0 dB gain at the fundamental and the harmonic frequencies. In that theoretical case, based on the conducted measurement, the compliance with the radiated limits can be estimated.7. RF Performance7.1 Measurement setupThe BRD4543B EZR32 Happy Gecko Radio Board was attached to a Wireless Starter Kit Mainboard (BRD4001 (Rev. A02) ) and its transceiver was operated in continuous carrier transmission mode. The output power of the radio was set to 20 dBm (PA_PWR_LVL = 0x7F, PA_BIAS_CLKDUTY = 0x00 at VRF=3.3 V).7.2 Conducted Power MeasurementsIn case of the conducted measurements the output power was measured by connecting the EZR32HG Radio Board directly to a Spec-trum Analyzer (P/N: MS2692A) through its on-board SMA connector. At 20 dBm output power and 3.3 V supply voltage the measured typical current consumption of the RF section of the board is 90 mA.A typical output spectrum is shown in the figure below.Figure 7.1. Typical Output Spectrum of the BRD4543B Radio BoardAs it can be observed the unwanted emissions are under -50 dBm so the conducted performance is compliant with the -20 dBc limit specified by FCC 15.247 and also with the -41.2 dBm limit in the restricted bands.Note: In practice comercially available whip antennas usually have ~0-2 dB gain at the fundamental and < 0 dB gain at the harmonic frequencies so if the conducted levels are compliant with the emission limits with small margin it is likely that the margin on the harmon-ics radiated by an external whip antenna will be higher. Unfortunately in most cases, the PCB radiation (from traces or and/or compo-nents) is stronger so using shielding, applying larger duty cycle correction (if allowed) or reduction of the fundamental power could be necessary.7.3 Radiated Power MeasurementsFor radiated measurements an external whip antenna (P/N: ANT-916-CW-HWR-SMA) was used. The power supply for the board were two AA batteries (3 V). The batteries were connected to the Wireless Starter Kit Mainboard through its External Power Supply connec-tor with minimal wire length to minimize the wire radiation.The DUT was rotated in 360 degree with horizontal and vertical reference antenna polarizations in the XY, XZ and YZ cuts. The meas-urement axes are as shown in the figure below.Figure 7.2. DUT: Radio Board with Wireless Starter Kit Mainboard (Illustration)The measured radiated powers are shown in the table below.Table 7.1. Maximums of the Measured Radiated Powers of the BRD4543BAs it can be observed the fundamental and all of the harmonics comply with the FCC 15.247 limits with large margin.One may notice that the radiated harmonic levels, in general, are higher compared to the levels expected based on the conducted measurement. Investigations showed that this increase is due to the PCB radiations (components and PCB traces).Note: The radiated measurement results presented in this document were recorded in an unlicensed antenna chamber. Also the radi-ated power levels may change depending on the actual application (PCB size, used antenna etc.) therefore the absolute levels and margins of the final application is recommended to be verified in a licensed EMC testhouse!EMC Compliance Recommendations 8. EMC Compliance Recommendations8.1 Recommendations for FCC ComplianceAs it was shown in the previous chapters the conducted performance of the BRD4543B EZR32 Happy Gecko Radio Board is compliant with the fundamental and harmonic emission limits of the FCC 15.247 regulation in the 915 MHz band with 20 dBm output power. For radiated compliance mounting a shielding can is required due to PCB radiation. With the mounted shielding can all of the harmionics are under the limits with large margins.Document Revision History 9. Document Revision HistoryTable 9.1. Document Revision HistoryBoard Revisions 10. Board RevisionsTable 10.1. BRD4543B Radio Board RevisionsTable of Contents1. Introduction (1)2. Radio Board Connector Pin Associations (2)3. Radio Board Block Description (3)3.1 Wireless MCU (3)3.2 USB (3)3.3 RF Crystal Oscillator (RFXO) (3)3.4 LF Crystal Oscillator (LFXO) (3)3.5 HF Crystal Oscillator (HFXO) (4)3.6 RF Matching Network (4)3.7 SMA Connector (4)3.8 Radio Board Connectors (4)4. RF Section (5)4.1 Matching Network (5)5. Mechanical Details (7)6. EMC compliance (8)6.1 FCC 15.247 Emission Limits for the 902-928 MHz Band (8)7. RF Performance (9)7.1 Measurement setup (9)7.2 Conducted Power Measurements (9)7.3 Radiated Power Measurements (11)8. EMC Compliance Recommendations (13)8.1 Recommendations for FCC Compliance (13)9. Document Revision History (14)10. Board Revisions (15)Table of Contents (16)DisclaimerSilicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USASimp li city StudioOne-click access to MCU tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux!/simplicityMCU Portfolio /mcuSW/HW/simplicityQuality /qualitySupport and CommunitySLWRB4545A。
戴尔 Inspiron 535s 537s 545s 546s 服务手册.pdf_170059425
Dell™ Inspiron™ 535s/537s/545s/546s 服务手册型号：DCSLE 和 DCSLF 注、小心和警告如果您购买的是 Dell™ n Series 计算机，则本说明文件中有关 Microsoft ® Windows ® 操作系统的任何参考内容均不适用。
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2009 年 3 月 修订版 A 00技术概览开始之前主机盖支架前挡板内存PCI 卡和 PCI Express 卡驱动器风扇 I/O 前面板 处理器 系统板 电源设备 电池 系统设置程序注：“注”表示可以帮助您更好地使用计算机的重要信息。
小心：“小心”表示如果不遵循说明，就有可能损坏硬件或导致数据丢失。
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返回目录页面开始之前Dell™ Inspiron™ 535s/537s/545s/546s 服务手册技术规格建议使用的工具关闭计算机安全说明本章介绍了卸下和安装计算机中安装的组件的步骤。
除非另有说明，否则将假设在执行每个过程时均满足以下条件：l您已经执行了关闭计算机和安全说明中的步骤。
l您已经阅读了计算机附带的安全信息。
l 可以按照与执行拆卸步骤相反的顺序来装回组件或安装单独购买的组件。
技术规格有关计算机技术规格的信息，请参阅计算机附带的《安装指南》或参阅 Dell 支持Web 站点： 。
易 Wi-Fi 扩展器 RE580D 产品说明书
191001121910011262AC 1900RE580DCOPYRIGHT & TRADEMARKSSpecifications are subject to change without notice. is a registered trademark of TP-LINK TECHNOLOGIES CO., LTD. Other brands and product names are trademarks or registered trademarks of their respective holders.No part of the specifications may be reproduced in any form or by any means or used to make any derivative such as translation, transformation, or adaptation without permission from TP-LINK TECHNOLOGIES CO., LTD. Copyright ©2015 TP-LINK TECHNOLOGIES CO., LTD.All rights reserved.FCC STATEMENTThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:●Reorient or relocate the receiving antenna.●Increase the separation between the equipment and receiver.●Connect the equipment into an outlet on a circuit different from that towhich the receiver is connected.●Consult the dealer or an experienced radio/ TV technician for help. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:1)This device may not cause harmful interference.2)This device must accept any interference received, includinginterference that may cause undesired operation.Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.Note: The manufacturer is not responsible for any radio or tv interference caused by unauthorized modifications to this equipment. Such modifications could void the user’s authority to operate the equipment.FCC RF Radiation Exposure StatementThis equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter. “To comply with FCC RF exposure compliance requirements, this grant is applicable to only Mobile Configurations. The antennas used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.”CE Mark WarningThis is a class B product. In a domestic environment, this product may cause radio interference, in which case the user may be required to take adequate measures.National RestrictionsThis device is intended for home and office use in all EU countries (and other countries following the EU directive 1999/5/EC) without any limitationCountry Restriction Reason/remarkBulgaria None General authorization required foroutdoor use and public serviceFrance Outdoor use limited to10 mW e.i.r.p. withinthe band 2454-2483.5MHz Military Radiolocation use. Refarming of the 2.4 GHz band has been ongoing in recent years to allow current relaxed regulation. Full implementation planned 2012Italy None If used outside of own premises,general authorization is required Luxembourg None General authorization required fornetwork and service supply(not forspectrum)Norway Implemented This subsection does not apply forthe geographical area within a radiusof 20 km from the centre of Ny-ÅlesundRussian Federation None Only for indoor applications Note: Please don’t use the product outdoors in France.5150-5250 MHzCountry Restriction Reason/remarkBulgaria Not implemented PlannedCroatia License requiredItaly General authorization required if used outside own premisesLuxembourg None General authorization required fornetwork and service supply (not forspectrum)Russian Federation No infoNote: Operations in the 5.15-5.25GHz band are restricted to indoor usage only.Canadian Compliance StatementThis device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:1)This device may not cause interference, and2)This device must accept any interference, including interference thatmay cause undesired operation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :1)l'appareil nedoit pas produire de brouillage, et2)l'utilisateur de l'appareil doit accepter tout brouillage radioélectriquesubi, même si le brouillage est susceptible d'en compromettre le fonctionnement.Industry Canada StatementComplies with the Canadian ICES-003 Class B specifications.Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.CAN ICES-3 (B)/NMB-3(B)Radiation Exposure Statement:This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.Déclaration d'exposition aux radiations:Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.Korea Warning Statements당해무선설비는운용중전파혼신가능성이있음.NCC Notice & BSMI Notice注意！依據低功率電波輻射性電機管理辦法第十二條經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性或功能。
5364中文资料
SMOKE DETECTOR WITH INTERCONNECTThe A5364CA is a low-current, CMOS circuit providing all of the required features for an ionization-type smoke detector. A networking capability allows as many as 125 units to be interconnected so that if any unit senses smoke, all units will sound an alarm. In addition,special features are incorporated to facilitate alignment and test of the finished smoke detector. This device is designed to comply with Underwriters Laboratories Specification UL217.The internal oscillator and timing circuitry keeps standby power to a minimum by powering down the device for 1.66 seconds and sensing smoke for only 10 ms. Every 24 on/off cycles, a check is made for low battery condition. By substituting other types of sensors, or a switch for the ionization detector, this very-low power device can be used in numerous other battery-operated safety/security applications.The A5364CA is supplied in a low-cost, 16-pin dual in-line plastic package. It is rated for continuous operation over the temperaturerange of 0°C to +50°C. Similar devices. with an internal timer to allow for a period of reduced sensitivity (“hush”), are available as the A5368CA.Always order by complete part number: A5364CA .Data Sheet 26110.7AFEATURESI Interconnect Up to 125 Detectors I Piezoelectric Horn DriverI Guard Outputs for Detector Input I Pulse Testing for Low Battery I Power-ON ResetI Internal Reverse Battery ProtectionI Built-In Hysteresis Reduces False Triggering ITemporal Horn Pattern53645364SMOKE DETECTOR WITHINTERCONNECT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000Copyright © 1998, 1999 Allegro MicroSystems, Inc.9 VGUARD GUARD +V581110712691415165364SMOKE DETECTOR WITH INTERCONNECTTestLimitsCharacteristic Pin Test Conditions Min.Typ.Max.Units Supply Voltage Range 6Operating6.09.012V Detector Input Current 150 to 40% RH, V IN = 0 to 9.0 V ——±1.0pA Input Offset Voltage14-15Active Guard ——±100mV 16-15Active Guard ——±100mV 15-13Detect Comparator ——±50mV Hysteresis13No Alarm to Alarm 90130170mV Common Mode Range14-15Guard Amplifier 2.0—V DD - 0.5V 13-15Smoke Comparator 0.5—V DD - 2.0V Active Guard Impedance14to V SS —10—k Ω16to V SS —500—k Ω Oscillator Period12No Alarm 1.34 1.67 2.00s Alarm324048ms Oscillator Pulse Width 48.01012ms Low Voltage Threshold 6T A = 0 to 50°C7.2—7.8V Sensitivity Adj. Voltage 13V 13/V DD , pin 13 open circuit 48.55051.5% Horn Output Voltage10-11I OUT = 16 mA, V DD = 9.0 V —0.10.5V I OUT = 16 mA, V DD = 7.2 V ——0.9V I OUT = -16 mA, V DD = 9.0 V 8.58.8—V I OUT = -16 mA, V DD = 7.2 V6.3——V Horn Output ON Time10-11Alarm (see figure, time “A”)450500550ms Low Battery8.01012ms Horn Output OFF Time10-11Alarm (see figure, time “B”)450500550ms Alarm (see figure, time “C”)135015001650ms Low Battery324048s LED Output ON Current 5V DD = 7.2 V, V OUT = 1.0 V 10——mA LED Output ON Time 5No Local Alarm; Not Latched 8.01012ms LED Output OFF Time5No Alarm, In Standby324048sELECTRICAL CHARACTERISTICS at T A = +25°C, V DD = 9.0 V, V SS = 0 V, C 12 = 0.1 µF,R 7 = 8.2 M Ω (unless otherwise noted).Continued next page . . .NOTE 1:Negative current is defined as coming out of (sourcing) the specified device pin.NOTE 2:Alarm (Smoke) Condition is defined as V 15 < V 13; No Alarm (No Smoke) Condition as V 15 > V 13.5364SMOKE DETECTOR WITH INTERCONNECT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000I/O Current2No Alarm, V I/O = V DD - 2.0 V 25—60µA Alarm, V I/O = V DD - 2.0 V-7.5——mA I/O Alarm Voltage 2External “Alarm” In 3.0——V I/O Delay 2“Alarm” Out— 3.0—s Supply Current6V DD = 9.0 V, No Alarm, No Loads — 5.09.0µA V DD = 12 V, No Alarm, No Loads——12µATestLimitsCharacteristic Pin Test Conditions Min.Typ.Max.Units ELECTRICAL CHARACTERISTICS (continued)CIRCUIT DESCRIPTIONThe A5364CA is a low-current CMOS circuit providing all of the required features for an ionization-type smoke detector.Oscillator. An internal oscillator operates with a period of 1.67 seconds during no-smoke conditions. Every 1.67 seconds,internal power is applied to the entire circuit and a check is made for smoke. Every 24clock cycles (40 seconds), the LED is pulsed and a check is made for low battery by comparing V DD to an internal reference.Because very-low currents are used in the device, the oscillator capacitor at pin 12should be a low-leakage type (PTFE, polysty-rene, or polypropylene).Detector Circuitry. When smoke isdetected, the resistor divider network that sets the sensitivity (smoke trip point) is altered to increase the sensitivity set voltage (pin 13) by typically 130 mV with no external connec-tions to pins 3 or 13. This provides hysteresis and reduces false triggering. An active guard is provided on both pins adjacent to the detector input (pin 15). The voltage at pins 14 and 16 will be within 100 mV of the input.This will keep surface leakage currents to a minimum and provide a method of measuring the input voltage without loading the ionization chamber. The active guard amplifier is not power strobed and thus provides constant protection from surface leakage currents. The detector input has internal diode protection against static damage.Alarm Circuitry. If smoke is detected, the oscillator period changes to 40 ms and the horn is enabled. The horn output is typically 0.5 s ON, 0.5 s OFF, 0.5 s ON, 0.5 s OFF, 0.5 s ON, 1.5 s OFF (temporal horn pattern). During the OFF time, smoke is checked and will inhibit further alarm output if smoke is not sensed. During smoke conditions the low battery alarm is inhibited and the LED is driven at a 1 Hz rate.Sensitivity Adjust. The detector sensitivity to smoke is set inter-nally by a voltage divider connected between V DD and V SS . Thesensitivity can be externally adjusted to the individual characteristics of the ionization chamber by connecting a resistor between pin 13 and V DD , or between pin 13 and V SS .Low Battery. The low battery threshold is set internally by a voltage divider connected between V DD and V SS . The threshold can be in-creased by connecting a resistor between pin 3 and V DD . The threshold can be decreased by connecting a resistor between pin 3 and V SS . The battery voltage level is checked every 40 seconds during the 10 mA,10 ms LED pulse. If an LED is not used, it should be replaced with an equivalent resistor (typically 500 Ω to 1000 Ω) such that the battery loading remains at 10 mA.NOTE 1:Negative current is defined as coming out of (sourcing) the specified device pin.NOTE 2:Alarm (Smoke) Condition is defined as V 15 < V 13; No Alarm (No Smoke) Condition as V 15 > V 13.5364SMOKE DETECTOR WITH INTERCONNECTV12OSC. CAPINTERNAL CLOCKLED SMOKE COMPARATORSMOKE CHAMBERHORNDwg. WC-003-3I/OI/O. A connection is provided at pin 2 to allow multiple smoke detectors to becommoned. If any single unit detects smoke (I/O is driven high), all connected units will sound their associated horns after a nominal 3second delay. The LED is suppressed when an alarm is signaled from an interconnected unit.Testing. On power up, all internal counters are reset. Internal test circuitry allows for low battery check by holding pins 8 and 12low during power up, then reducing V DD and monitoring HORN 1 (pin 10). All functional tests can be accelerated by driving pin 12with a 2 kHz square wave. The 10 ms strobe period must be maintained for proper opera-tion of the comparator circuitry.313TIMING DIAGRAM IN TYPICAL APPLICATION5364SMOKE DETECTOR WITHINTERCONNECT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000I/O OPERATIONINTERNAL CLOCKHORNV2 IN I/OV2 OUT I/OINTERNAL CLOCKDwg. WC-004-2HORN5364SMOKE DETECTOR WITH INTERCONNECTDimensions in Inches(controlling dimensions)Dimensions in Millimeters(for reference only)NOTES:1.Lead thickness is measured at seating plane or below.2.Lead spacing tolerance is non-cumulative.3.Exact body and lead configuration at vendor’s option within limits shown.Dwg. MA-001-16A in1618Dwg. MA-001-16A mm16185364SMOKE DETECTOR WITHINTERCONNECT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000The products described here are manufactured under one or more U.S. patents or U.S. patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, ormanufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi-bility for its use; nor for any infringement of patents or other rights of third parties which may result from its use.SAFETY & SECURITY ICsPart Number FunctionA3054KU/SU Multiplexed two-wire Hall-effect sensorA5348CA Ionization-type smoke detector with interconnect, timer, and reverse-battery protection A5349CA Ionization-type smoke detector with interconnect and timer for ac line operation A5350CA Ionization-type smoke detector with interconnect and reverse-battery protection A5354CA Ionization-type smoke detector with interconnect and reverse-battery protection A5358CA Photoelectric-type smoke detector with interconnect and timerA5364CA Ionization-type smoke detector with interconnect, reverse-battery protection,and temporal horn patternA5368CAIonization-type smoke detector with interconnect, timer, reverse-battery protection,and temporal horn pattern。
英飞凌tricore用户手册 第5章 程序管理单元
通过重叠 RAM 控制寄存器 OVRCON 控制 OVRAM 的 OLDA 功能和 ECC 保护。位保护允许 OLDA 和 ECC 功 能的独立控制。只有在管理员模式 SV 下才能执行对这个寄存器的写访问，在用户模式或者 SV 下可以执行读访 问。OVRCON 寄存器通过应用（等级 3）复位清零。 如果检测到 ECC 错误，SCU 控制触发一个 NMI 陷阱。 寄存器被定义如下：
5-6
V1.0, 2011-12
TC1728
程序存储器单元（PMU）
5．3
仿真存储器接口
在仿真设备中，提供一个可通过程序存储器或者 OLDA 重叠用于校准的仿真存储器（EMEM）。它的基地址是 A/8FF0 0000H。对于 Flash 和 OVRAM 访问，缓存（段 8H）和非缓存（段 AH）访问都可通过 PMU 用于访问 EMEM。 图 5-1 中显示的仿真存储器接口是 64 位宽度的存储器接口，它控制 CPU 对仿真设备中的仿真存储器进行的访 问。支持所有宽度的写访问（字节、半字、字、双字）。不支持 CPU 控制的载人－修改—保存访问（以 LDMST 指令）。 在 TC1728 生产设备中，EMEM 接口总是被禁止。来自仿真存储器区域的 CPU 读访问引起 DSE 陷阱和 LMB 总线错误。如果仿真存储器区域读访问通过 SPB 主机初始化（例如，PCP），将额外产生 SPB 错误中断。默认 地，任何主机对仿真存储器的写访问在生产设备中导致一个 LMB 总线错误陷阱。 在仿真设备中，如果 EMEM 不能处理 CPU 访问（例如，CPU 访问 EMEM 中的一个存储器跟踪器件时）， PMU 报告一个 LMB 总线错误陷阱。在这种情况下，PMU 中止 EMEM 访问。 和内部 8KB OVRAM 相似，EMEM 也可用于内部程序 Flash 和虚拟 OLDA 存储器中的专用重叠块，以将 （DMI 中的）Flash/OLDA 地址重定向到仿真存储器。外部存储器也被支持重定向到 EMEM 中的块。
微芯片频率技术TFS 153E筛选器规格说明书
Measurement conditionAmbient temperature: 25 °CInput power level: 0 dBmTerminating impedance: *Input: 330 Ω || -13,5 pFOutput: 380 Ω || -15,2 pFCharacteristicsRemark:The reference level for the relative attenuation a rel of the TFS 153E is the minimum of the pass band attenuation a min. The minimum of the pass band attenuation a min is defined as the insertion loss a e. The centre frequency f c is the arithmetic mean value of the upper and lower frequencies at the 3 dB filter attenuation level relative to the insertion loss a e. The temperature coefficient of frequency Tc f is valid for both the reference frequency f c and the frequency response of the filter in the operating temperature range. The frequency shift of the filter in the operating temperature range is not included in the production tolerance scheme.D a t a typ. value tolerance / limit Insertion loss a e21,1 dB max. 25 dB (reference level)Nominal frequency f N - 153,5 MHzCentre frequency f C 153,5 MHz ± 0,1 MHzPassband PB - f C ±2,5015 MHzPass band ripple (p-p) 0,3 dB max. 0,7 dBBandwidth BW0,7 dB 5,30 dB min. 5,03 MHz3 dB 5,65 dB min. 5,60 MHz 15 dB 6,21 dB max. 6,30 MHz 45 dB 6,68 dB max. 9,70 MHz Relative attenuation a relf C …f C ± 2,5015 MHz 0,3 dB max. 0,7 dBf C ± 2,5015 MHz …f C ± 2,800 MHz 2,5 dB max. 3,0 dBf C - 144,500 MHz …f C - 4,825 MHz 60 dB min. 45 dBf C ± 3,150 MHz …f C ± 3,350 MHz 17 dB min. 15 dBf C ± 3,350 MHz …f C ± 3,750 MHz 30 dB min. 25 dBf C ± 3,750 MHz …f C ± 4,825 MHz 55 dB min. 40 dBf C + 4,825 MHz …f C + 428,500 MHz 55 dB min. 45 dB Absolute group delay within PB 2,5 µs max. 2,7 µsGroup delay ripple within PB (p-p) 60 max. 120 nsOperating temperature range OTR - - 25 °C ... + 80°CStorage temperature range - - 40 °C ... + 85°C Frequency inversion temperature 20 °C - Temperature coefficient of frequency TC f ** -0,036 ppm/K2 -*) The terminating impedances depend on parasitics and q-values of matching elements and the board used, and are to be understood as reference values only. Should there be additional questions do not hesitate to ask for an application note or contact our design team.**) f c(Hz) = Tc f(ppm/K2) x (T - T A)2 x f CAT (MHz)Generated:Checked / Approved:Microchip Frequency Technology GmbHPotsdamer Straße 18D 14 513 TELTOW / GermanyMicrochip Frequency Technology GmbH Potsdamer Straße 18 D 14 513 TELTOW / GermanyConstruction and pin connection(All dimensions in mm)50 Ω Test circuit1 Input RF Return2 Ground3 Ground4 Ground5 Output6 Output RF Return7 Ground8 Ground9 Ground 10 InputDate code: Year + week V 2007 W 2008 X 2009 ...Microchip Frequency Technology GmbH Potsdamer Straße 18 D 14 513 TELTOW / Germany Stability characteristics, reliabilityAfter the following tests the filter shall meet the whole specification:1. Shock: 500g, 1 ms, half sine wave, 3 shocks each plane; DIN IEC 68 T2 - 272. Vibration: 10 Hz to 500 Hz, 0,35 mm or 5 g respectively, 1 octave per min, 10 cycles per plan, 3 plans; DIN IEC 68 T2 - 63. Change of temperature: -55 °C to 125°C / 30 min. each / 10 cycles DIN IEC 68 part 2 – 14 Test N4. Resistance tosolder heat (reflow): reflow possible: three times max.; for temperature conditions refer to the attached "Air reflow temperature conditions" on page 4;5. ESD ANSI/ESD S20.20-1999, class 1A for HBMThis filter is RoHS compliant (2002/95/EG, 2005/618/EG)PackingTape & Reel: IEC 286 – 3, with exception of value for N and minimum bending radius; tape type II, embossed carrier tape with top cover tape on the upper side; max. pieces of filters per reel:<MAXPIECESPERREEL>reel of empty components at start:min. 300 mm reel of empty components at start including leader: min. 500 mm trailer: min. 300 mmS oWDo P oEC tP 2P 1D1B oAoP ull Off DirectionT ype P IN MarkerDate CodetK oThe minimum bending radius is 45 mm.Air reflow temperature conditionsTape (all dimensions in mm) W : 44,00 ± 0,3 Po : 4,00 ± 0,1 Do : 1,50 +0,1/-0 E : 1,75 ± 0,1 F : 20,20 ± 0,15 P2 : 2,00 ± 0,15 P1 : 16,00 ± 0,1 D1(min) : 2,00 Ao : 9,30 ± 0,1 Bo : 24,90 ± 0,1 So : 40,40 ± 0,1 Ct : 38,0 ± 0,1 Reel (all dimensions in mm) A : 330 W1 : 44,4 +2/-0 W2(max) : 50,4 N(min) : 100 C : 13,0 +0,5/-0,2Microchip Frequency Technology GmbH Potsdamer Straße 18D 14 513 TELTOW / GermanyHistoryVersion Reason of changes Name Date1.0 - development specification Pfeiffer 03.01.2007 1.1 - add of terminating impedances and typical values Pfeiffer 18.01.2007- filter characteristics correctedMicrochip Frequency Technology GmbHPotsdamer Straße 18D 14 513 TELTOW / Germany。
普通51单片机驱动3.5寸TFT的应用实例与源代码
普通51单片机驱动3.5寸TFT的应用实例与源代码！前市场流行的3.5寸屏基本上都是只内置了驱动器，而不带控制器，这样给用户的使用造成了一些难度。
基本上很多朋友在用彩屏时选择一些带LCD控制器的ARM7或ARM9去开发，对于不会ARM开发的朋友来说，只使用普通MCU，这样可以选择的3.5寸TFT模块，就很难找到了。
本文就是基于市场上一款比较使用的3.5寸TFT模块编写的，用户只需要帮该TFT模块当作普通的单色液晶的开发思路来使用，就可以很容易去编程。
一、硬件选择1、 MCU：AT89S512、开发编译环境：Keil C513、 3.5寸TFT模块型号：MzT35C1二、TFT模块基本性能：1、基本参数模块结构：内置控制器屏幕大小： 3.5英寸屏幕分辩率：320*240屏幕颜色数：65536色（16位真彩色）工作电压： 3.3V/5V可选总线结构： Intel8080总线宽度： 8Bit背光形式：LED；可指令控制，0-127可调连接方式：排针插座触摸屏：标准配置不带触摸屏；模组留有触摸屏芯片焊盘和触摸屏接口2、接口引脚说明3、操作时序（8位并行Intel 8080总线）MzT35C1模块支持intel8080总线，总线的最高速度可达20MHz（当然总线的速度能否达到最高接口速度，还与用户的总线布线、线长等有关），也就是说，如果控制MCU速度足够快的话，是可以支持视频的显示的。
注意：MzT35C1模块的总线接口是8位的，也就意味着对显存的数据操作时，需要连续进行两次操作方可完成，先传高字节再传低字节；但对于寄存器的操作（写入寄存器地址，即A0为低时的写入操作）8位的操作方可。
三、MzT35C1与51硬件接口连接图本例程使用GPIO来模拟总线时序。
上图的模块供电为5V的模块，而模块的端口电平为3.3V的，所以在所有的51端口与模块间的连接串入了一个100欧的电阻，有关MCS51的其它电路不在图中画出，请用户具体参考其它的开发板文档进行了解。
MEMORY存储芯片MT45W1MW16PDGA-85 WT中文规格书
Table 139: I DD1 Measurement – Loop Pattern 1Notes: 1.DQS_t, DQS_c are V DDQ when not toggling.8Gb: x4, x8, x16 DDR4 SDRAM Current Specifications – Patterns and Test Conditionsrefresh mode. If this condition is met, no additional REFRESH commands are re-quired upon self refresh exit. In the case that this condition is not met, either one ex-tra REF1x command or two extra REF2x commands must be issued upon self refresh exit. These extra REFRESH commands are not counted toward the computation of the average refresh interval (t REFI).•In the fixed 4x refresh rate mode or the enable-OTF 1x/4x refresh rate mode, it is rec-ommended there be a multiple-of-four number of REF4x commands before entry in-to self refresh after the last self refresh exit, REF1x command, or MRS command that set the refresh mode. If this condition is met, no additional refresh commands are re-quired upon self refresh exit. When this condition is not met, either one extra REF1x command or four extra REF4x commands must be issued upon self refresh exit. These extra REFRESH commands are not counted toward the computation of the average refresh interval (t REFI).There are no special restrictions on the fixed 1x refresh rate mode.This section does not change the requirement regarding postponed REFRESH com-mands. The requirement for the additional REFRESH command(s) described above is independent of the requirement for the postponed REFRESH commands.8Gb: x4, x8, x16 DDR4 SDRAM Fine Granularity Refresh ModeTable 4: State Diagram Command DefinitionsNote: 1.See the Command Truth Table for more details.8Gb: x4, x8, x16 DDR4 SDRAM State Diagram。
Trinity 5-TIER 32 X 12 X 60 BAMBOO SHELVING 产品说明书
TRINITY 5-TIER 32" X 12" X 60" BAMBOO SHELVING-BRONZE ANTHRACITEModel# TBFPRA-3611Your TRINITY 5-Tier 32" x 12" x 60" Bamboo Shelving should include the following parts. Please inspect box contents to ensure you have received all components.If you are missing any parts, need assistance with assembly or have questions, please contact TRINITY CustomerService:*******************************************.Partscanalsoberequestedonlineat (Help & More, Contact Us).You will need no additional tools for assembly.A B C D FIXED SHELF (3)TOP SIDE FRAME (2)BOTTOM SIDEFRAME (2)ADJUSTABLE SHELF (2)SCREW (12)PARTS LISTADJUSTABLE SHELF REST (8)FEETLEVELER (4)HEX KEY (1)G E F H © 2018 TRINITY -800.985.55061STEP 2Screw FEET LEVELER (F) into legbottom of BOTTOM SIDE FRAME (B).Turn clockwise to screw in place.F (4)B (2)Connect TOP SIDE FRAME (A) withBOTTOM SIDE FRAME (B) on theiropen ends. Make sure the threadedinserts for the Adjustable Shelves areon the same side for TOP & BOTTOMSIDE FRAME (A & B).STEP 1B B (2)A (2)BA© 2018 TRINITY -800.985.55062FLay SIDE FRAMES (A + B assembled inStep 2) on its side. Make sure the facewith threaded inserts for theAdjustable Shelves faces INSIDE as youassembles the FIXED SHELVES (C).Place FIXED SHELVES (C) on their sidesand connect them to SIDE FRAMES (A+ B) at the top, middle & bottom barpositions. Tighten SCREWS (E) withHEX KEY (H). Stand the unit upright. STEP 3 E (12)H (1) C (3) D (2)G (8)D C C C DE © 2018 TRINITY -800.985.55063H STEP 4Hand screw ADJUSTABLE SHELF RESTS (G) intodesired level position on SIDE FRAME (A + B).Place ADJUSTABLE SHELF (D) onto ADJUSTABLESHELF RESTS (G), make sure shelf side notchesrest on ADJUSTABLE SHELF RESTS (G).G© 2018 TRINITY -800.985.55064PRODUCT EXTRA SHELF OPTIONSThere are extra screw holes in this product for more ADJUSTABLE SHELVES. You will need 1ADJUSTABLE SHELF (PRA-03-046-3012) and 4 ADJUSTABLE SHELF RESTS (ZBK-01-031-0620) to add one extra shelf to the product.Extra ADJUSTABLE SHELF PACK (PRA-03-067-3012) is available for purchase. Please visit our website or contact our Customer Service (see last page of the manual) to place your order. (4) ADJUSTABLESHELF RESTZBK-01-031-0620(1) ADJUSTABLE SHELFPRA-03-046-3012+ADJUSTABLESHELF PACKPRA-03-067-3012© 2018 TRINITY -800.985.55065SERVICE PARTS LIST –TBFPRA-3611Part Number DescriptionPart Number Description 1)ZBK-01-002-0635Screw5)XBK-98-006-2525Feet leveler 2)ZBK-01-031-0620Adjustable Shelf Rest6)PRA-14-024-1229Top Side Frame 3)PRA-14-025-1231Bottom Side Frame7)PRA-03-046-3012Adjustable Shelf 4)XXX-97-001-0001Hex Key 8)PRA-03-045-3012Fixed Shelf TRINITY Customer Service provides the following replacement parts:65173428WARNINGS1.Read and understand all instructions.Failure to follow all instructions may result in injuryand/or damage.2.The warnings, cautions, and instructions discussed in this manual cannot cover allpossible conditions or situations that may occur.The user must always be aware of their environment and ensure that they use the product in a safe and responsible manner.3.Do NOT modify the product in any way.Unauthorized modification may impair thefunction and/or safety of the product, and may affect the life of the product.4.Check for damaged parts.Before using this product, carefully check that all parts are ingood condition, and that the product will operate properly and perform its intendedfunction. Check for damaged parts and any other conditions that may affect the operation of this product. Replace damaged or worn parts, and never use this product with a damaged part.5.Do NOT overload the product.Weight capacity per shelf (evenly distributed)75 lb6.Do NOT allow children to climb or play around the product.CARE AND MAINTENANCE•Bamboo can be maintained with mineral oil for best results.•Avoid harsh, abrasive cleaners, and other corrosive chemicals.•The product is designed for indoor use. Wipe dry and keep out of direct sunlight.6© 2018 TRINITY -800.985.5506Thank you for purchasing a TRINITY 5-Tier 32" x 12" x 60" Bamboo Shelving. In order to register your product and receive streamlined customer service, please fill out the following Product Registration Form and (1) fax the form to 310.347.4134 (2) complete the Product Registration Form online at or(3)**************************************************.Includeacopyof your original receipt with your submission.First Name: Last Name:Address:City: State: Zip Code:Email Address: Phone:Product Model #: TBFPRA-3611 Purchase Date: / /Location of Purchase:Please rate the importance of each feature (1=least important; 10=most important)Quality Price Size/Capacity Appearance OtherHow did you hear about our product?Magazine Ad Catalog Salesperson Word of MouthInternet Store Display OtherMarital Status:Single MarriedHousehold Income:Below $50,000 $50,000-$150,000 $150,000+Education:High School College Graduate SchoolPrimary Residence:Own RentComments/Suggestions:© 2018 TRINITY -800.985.550678© 2018 TRINITY -800.985.55061 YEAR LIMITED WARRANTYTRINITY 5-Tier 32" x 12" x 60" Bamboo ShelvingModel # TBFPRA-3611Trinity International Industries (“Trinity”) warrants to the original consumer purchaser (“Purchaser”) of the TRINITY 5-Tier 32" x 12" x 60" Bamboo Shelving (“Product”) that each Product shall be free from defects in workmanship and materials for a period of 1 year from the date of original purchase. Trinity’s obligation under this warranty shall be limited to repair or replacement of, or adequate compensation for the Product which shall not be greater than the amount of the purchase price of the Product, at the option of Trinity, during the warranty period. All replaced parts and Products become the property of Trinity and must be returned to Trinity.This warranty excludes normal wear and tear of the Product and its parts or components, and damage arising from any of the following: negligent use or misuse of the Product, use contrary to this User’s Manual, or alteration by anyone other than Trinity. The warranty period of 1 year shall not be extended or renewed by the repair or replacement of, or compensation for, the Product. Any warranty implied by applicable law is limited in duration to one year from the date of purchase and is subject to the same conditions and limitations as is provided for our express warranty.Except as set forth herein, and to the extent of applicable there are no warranties on this Product either express or implied, and Trinity disclaims all warranties including, but not limited to, any implied warranties of merchantability, infringement or fitness for a particular purpose. No warranty or guarantee given by any person, firm, or corporation with respect to this product shall be binding on Trinity.If your Product is defective or otherwise requires service or parts, please call TRINITY Customer Service toll-free at (800) 985-5506, between 5:00 a.m. and 5:00 p.m., PST. Please tell us which model you purchased, the date of the purchase, and the problem with your Product. A copy of your original purchase receipt must accompany your service request.LIMITATION OF REMEDIES AND LIABILITYTrinity (and its employees, officers, members, managers, affiliates an assigns) shall not be liable for any incidental, consequential, special, indirect, remote, special or punitive damages for breach of any warranty, express or implied, including, but not limited to, lost profits, lost savings, loss of anticipated benefits and attorneys’ fees, which arise out of the purchase, use or inability to use the Product, whether arising out of contract, negligence, strict tort, product liability, or any other legal theory on which a claim is based. As noted above, to the extent damages are allowed by our express warranty or by applicable law, those damages may not exceed the purchase price paid for the Product. Without limiting the foregoing Purchaser assumes all risk and liability for loss, damage or injury to Purchaser and Purchaser’s property and to others and their property arising out of the use, misuse, or inability to use this Product. This limited warranty shall not extend to anyone other than the original purchaser of this product, is nontransferable and states your exclusive remedy.Some states do not allow the exclusion or limitation of incidental, consequential, special, or punitive damages, so the above limitation or exclusion may not apply to you. The above warranty gives you specific legal rights, and you may have other rights which vary from state to state.© 2018 TRINITY -800.985.55069CONTACT USQUESTIONS? NEED PARTS?WE ARE HERE TO HELP!Please feel free to contact us. There are no questions too small, orany problems too big. We’re committed to providing our customerswith the highest level of service.TRINITY Customer ServiceTEL: 800.985.5506FAX: 310.347.4134EMAIL:*****************************Monday through Friday5:00 AM –5:00 PM (PST)。
清华同方TF录音笔说明书
清华同方ＴF－录音笔说明书————————————————————————————————作者: ————————————————————————————————日期：一．功能特征及使用须知-－－---－-－---－---－-二外观视图及功能名称--------－－－-－------－---三开机/关机-－---－－－----－－-－－--－－--四音乐播放--－－－－-－－-----－－--－－-－-五语音模式----－----－-----－-----5.1 录音方式--－---－--－------－-----5.2 麦克风咪录音(内置咪和外置咪）-－-－-－------－---－－--－-5．3 录音声控设置---－－-－－---－-－-－--－--－5.4录音监听设置-－---－－----－--－--－-－--5.5线路录音(Line)/电话录音------－-－--－－---－-----5.6一键录音-----------－---－－---－-5.6播放语音（录音)文件------------－-－----－--六删除录音/音乐文件-－-----－--－--------七系统设置-－－---－-－－-------－----－-7.1 录音时间----－------－--------－---7．2 定时工具-－-－－--－----－-----------7.3 录音类型（品质)---－------------－--－---－７.4 录音来源--－－－－-----－－-－--－------7.5 声控设置-－--－－－-－---------－－---－7.６监听设置---－---－-－-－－--－---－－－-－7.7背光时间－------－-----－-－--------７．8语言选择----－---－－－－－－－-------－-7.9 关机设定-－--－－---－－---－-－－－-－--－7.9．1省电模式----－－--－－--－--－------－-7.９.２睡眠模式------－----------－－-－---7.10对比调节－---------－-------－－－－--７．11储存状况--－---－-－－----------－---7.1２固件版本-－-－--－---－----------－－－7.13退出--－------－－----－-－--－－--八连接电脑---------------－--－-－-－-九疑难解答------－--------－-－-十规格参数---－－－---－－---－-------－-一．功能特征及使用须知本机是全新一代数码录音设备。
托立尼（Toshiba）TFT-LCD监视器说明书：LCD-Monitor Chassis：LPU1
LCD-MonitorChassis: LPU16YS LPU17NSLPU19YS / LPU19NS LPU20YS LPU22YSModel: B1630N B1730NWB1930N / B1930NW B2030N B2230NSERVICEManualRefer to the service manual in the GSPN (see the rear cover) for the more information.1. Precautions2. Product specification s3. Disassembly and Reassemble4. Troubleshooting5. Exploded View & Part List6. Wiring DiagramContents1. Precautions1-1. Safety Precautions .........................................................................................................1-1 1-2. Servicing Precautions .....................................................................................................1-2 1-3. Static Electricity Precautions ..........................................................................................1-2 1-4. Installation Precautions ..................................................................................................1-3 2. Product specification s2-1. Feature & Specifications.................................................................................................2-1 2-2. Spec Comparison to the Old Models ..............................................................................2-3 2-3. Accessories ....................................................................................................................2-5 3. Disassembly and Assembly3-1. Disassembly ...................................................................................................................3-1 4. Troubleshooting4-1. Troubleshooting ..............................................................................................................4-1 4-2. When the Power Does Not Turn On ...............................................................................4-2 4-3. When the screen is blank ...............................................................................................4-4 4-4. Error Examples and Actions ...........................................................................................4-8 4-5. Adjustment ......................................................................................................................4-9 5. Exploded View & Part List5-1. Exploded View ................................................................................................................5-1 5-2. Parts List (B1630N) ........................................................................................................5-2 5-3. Parts List (B1730NW) .....................................................................................................5-7 5-4. Parts List (B1930N) ......................................................................................................5-10 5-5. Parts List (B1930NW) ...................................................................................................5-15 5-6. Parts List (B2030N) ......................................................................................................5-20 5-7. Parts List (B2230N) ......................................................................................................5-23 6. Wiring Diagram6-1. Wiring Diagram - Main Board .........................................................................................6-1 6-2. Wiring Diagram - IP Board ..............................................................................................6-4 6-3. Connector Functions ......................................................................................................6-5 6-4. Cables ............................................................................................................................6-5This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.© 2009 Samsung Electronics Co.,Ltd. All rights reserved.Printed in KoreaP/N: BN82-00841A-001-11. Precautions1. Precautions1-1. Safety PrecautionsFollow these safety, servicing and ESD precautions to prevent damage and to protect against potential hazards such as electrical shock.1-1-1. WarningsFor continued safety, do not attempt to modify the circuit board.1. Disconnect the AC power and DC power jack before servicing.2. 1-1-2. Servicing the LCD MonitorWhen servicing the LCD Monitor, Disconnect the AC line cord from the AC outlet.1. It is essential that service technicians have an accurate voltage meter available at all times. Check the calibration of2. this meter periodically.1-1-3. Fire and Shock HazardBefore returning the monitor to the user, perform the following safety checks:Inspect each lead dress to make certain that the leads are not pinched or that hardware is not lodged between the 1. chassis and other metal parts in the monitor.Inspect all protective devices such as nonmetallic control knobs, insulating materials, cabinet backs, adjustment and 2. compartment covers or shields, isolation resistorcapacitor networks, mechanical insulators, etc.Leakage Current Hot Check (Figure 1-1):3. WARNING : Do not use an isolation transformer during this test.Use a leakage current tester or a metering system that complies with American National Standards Institute (ANSIWith the unit completely reassembled, plug the AC line cord directly into a 120V AC outlet. With the unit’s AC switch 4. first in the ON position and then OFF, measure the current between a known earth ground (metal water pipe, conduit, etc.) and all exposed metal parts, including: metal cabinets, screwheads and control shafts. The current measured should not exceed 0.5 milliamp.Reverse the power-plug prongs in the AC outlet and repeat the test.1-1-4. Product Safety NoticesSome electrical and mechanical parts have special safetyrelated characteristics which are often not evident from visual shock, fire and/or other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.Figure 1-1. Leakage Current Test Circuit1. Precautions1-2. Servicing PrecautionsWARNING:An electrolytic capacitor installed with the wrong polarity might explode.Caution: Before servicing units covered by this service manual, read and follow the Safety Precautions section of this manual.Note: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions, always follow the safety precautions.1-2-1 General Servicing Precautions1.Always unplug the unit’s AC power cord from the AC power source and disconnect the DC Power Jack before attempting to:(a) remove or reinstall any component or assembly, (b) disconnect PCB plugs or connectors, (c) connect a testcomponent in parallel with an electrolytic capacitor.2.Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring is sometimes clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that 3.the area around the serviced part has not been damaged.4.Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels, input terminals and earphone jacks).5.Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON.Connect an insulation resistance meter (500 V) to theblades of the AC plug.The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be greater than 1 megohm.6.Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead;always remove the instrument’s ground lead last.1-3. Static Electricity PrecautionsSome semiconductor (solid state) devices can be easily damaged by static electricity. Such components are commonly called Electrostatically Sensitive Devices (ESD). Examples of typical ESD are integrated circuits and some field-effect transistors. The following techniques will reduce the incidence of component damage caused by static electricity.1.Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. To avoid a shock hazard, be sure to remove the wrist strap before applying power to the monitor.2.After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of an electrostatic charge.3.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESDs.4.Use only a grounded-tip soldering iron to solder or desolder ESDs.5.Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ESDs.Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs 6.are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.Immediately before removing the protective material from the leads of a replacement ESD, touch the protective7.material to the chassis or circuit assembly into which the device will be installed.Caution: Be sure no power is applied to the chassis or circuit and observe all other safety precautions.Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, 8.or lifting your foot from a carpeted floor can generate enough static electricity to damage an ESD.1-21. Precautions 1-4. Installation Precautions1.For safety reasons, more than two people are required for carrying the product.2.Keep the power cord away from any heat emitting devices, as a melted covering may cause fire or electric shock.3.Do not place the product in areas with poor ventilation such as a bookshelf or closet. The increased internaltemperature may cause fire.4.Bend the external antenna cable when connecting it to the product. This is a measure to protect it from being exposed to moisture. Otherwise, it may cause a fire or electric shock.Make sure to turn the power off and unplug the power cord from the outlet before repositioning the product. Also check 5.the antenna cable or the external connectors if they are fully unplugged. Damage to the cord may cause fire or electric shock.6.Keep the antenna far away from any high-voltage cables and install it firmly. Contact with the highvoltage cable or the antenna falling over may cause fire or electric shock.7.When installing the product, leave enough space (10cm) between the product and the wall for ventilation purposes.A rise in temperature within the product may cause fire.1-31. Precautions Memo1-42. Product specifications 2. Product specifications2-1. Feature & Specifications2-12. Product specifications2-22. Product specifications 2-2. Spec Comparison to the Old Models1360 x 7682-32. Product specifications*Color Effect- Grey scale: Images are displayed in a grey tone on the screen.- Green: Images are displayed in a green tone on the screen.- Aqua: Images are displayed in a blue tone on the screen.- Sepia: Images are displayed in a brown tone on the screen.Image Size : If the resolution is not wide resolution, this option allows the screen size to be selected as normal or wide.*MagicAngle- Lean Back Mode1: Select when viewing from a slightly lower angle.- Lean Back Mode2: Select when viewing from the bottom.- Standing Mode: Select when viewing from the top.- Side Mode: Select when viewing from the left or right.- Custom: W hen <Custom> is selected, settings for <Lean Back Mode 1> is applied by default.User can set suitable picture quality as needed.*MagicEco- 100%: the power consumption is 100% of Default Setting.- 75%: the power consumption is 75% of Default Setting.- 50%: the power consumption is 50% of Default Setting.2. Product specifications 2-3. Accessories2. Product specifications Memo3. Disassembly and Assembly 3. Disassembly and AssemblyA s this monitor has parts that are sensitive to static electricity, be careful when handling them.3-1. Disassembly1. Turn the monitor off before beginning the disassembly process.2. When disassembling the monitor, do not use any metal tools except for the provided jig.3. Disassemble the monitor carefully as directed in the following procedures.3. Disassembly and AssemblyLAMPWIRELVDSFUNCTION3. Disassembly and Assembly IP-BOARDMAIN-BOARD3. Disassembly and Assembly Memo4. Troubleshooting4. Troubleshooting4-1. TroubleshootingSet custom mode as follows before beginning a repair.1. B1630N/B1930N B1730NW/B1930NW B2030NB2230NResolution:1360x768V-frequency:60HzH-frequency:47.7kHzResolution:1440x900V-frequency:75Hz H-frequency:70.6kHzResolution:1600x900V-frequency:60Hz H-frequency:60kHzResolution:1920 x 1080V-frequency:60Hz H-frequency:67.5kHzIf the screen is blank, check whether the power cord is connected correctly.2. The circuits to check:3. • When the raster does not appear: The Function PCB, Main PCB, I/P PBA • When 5V is generated but a blank screen is displayed: Main PCB • When 5V is not generated: I/P PBA4. factory mode.4. Troubleshooting4-2. When the Power Does Not Turn OnIC601IC602Yes4. Troubleshooting 4-2-1. Circuit diagrams when the power does not turn on1234-3. When the screen is blankCN400IC400X4004-3-1. When a blank screen is displayed2314B1730NW / B1930NW / B2030N / B2230NB1630N / B1930N4-3-2. Waveforms when no screen is displayed 1344-4. Error Examples and Actions4-5. Adjustment4-5-1. Service Adjustment Conditions1.Precautions before a Service Adjustment1) Check whether the devices for the service adjustment are operating normally.2) Secure a space that is sufficiently wide for disassembling the monitor.3) Prepare a soft mat on which the monitor will be disassembled.2.Entering Service ModeEntering:Menu Brightness 0Contrast 0Hold down the Enter button for five (5) seconds.Exiting:Power OFF Power ON3.Basic Service Items to Perform after Replacing a Board1) Check the PC color adjustment status.2) Input DDC (input both of Analog and Digital).3) Check whether the appropriate MCU code for the model is input.4) Hard power the monitor off after entering service mode and performing a reset.4.DDC EDIT Data Input1) Use when updating the AD board code.2) D ownload the WinDDC program, DDC Input program, and Hex and DDC files appropriate to the model through theQuality Control department of Samsung Electronics. Install the jig and input the data, as shown in the figure.4-5-2. Service Function SpecificationsChecking the Code Version1. Check the MCU code version and checksum after entering SVC Mode.2. E ntering SVC Mode- Adjust the Brightness and Contrast values to 0. - Hold down the Enter button for five (5) seconds. - The SVC Function OSD is displayed.- T o exit the SVC Function, turn the power off.3. S afe Mode - W hen the input signal is higher than the supported frequency of the product, safe mode gives users some time (one minute) to change the video card settings to the Recommended Mode settings.Service Mode (Moving around)1. Press the - button to move to other items.2. Press the - button to change the setting to On or Off.When replacing the panelAfter replacing the panel, move to the Panel item and hold down the Menu button for five (5) seconds. The Ch. No is incremented by 1 and then both the On Time and Cycle are set to 0.This number is incremented by 1.12345Use the DDC Manager MTI-2050 version or later.1) Click the Open [F5] icon.2) Select a port.3) Open a DDC file.4) Select a date and click the OK [Save] button.5) Click the Next [OK] button.66) Enter the serial number and then press the Enter button※When inputting digital data after inputting analog data, repeat steps 2 to 5.1) Check the following options after open the “Easywriter” - Option: Setup ISP tool1- LPT Port Offset: 378- ISP Jig type Selection: SAMSUNG- Auto detect- Confirm Change4. Troubleshooting2) Click the Load File button.23) Select an MCU code file, and then click the Open[O] button.4. Troubleshooting 4) Click the Auto button.45) When programming and verification are complete, hard power the monitor off and then on again.4. Troubleshooting Memo5. Exploded View & Part List5. Exploded View & Part List5-1. LS20PUYKF/EN - Exploded ViewT 0003M 0215M 0014M 0174M 0107M 0013S T DM 00275. Exploded View & Part List5-1-1. LS20PUYKF/EN - Parts List5. Exploded View & Part List 5-2. LS20PUYKF/EN - Parts ListService Bom (SA: SERVICE AVAILABLE, SNA: SERVICE NOT AVAILABLE)5. Exploded View & Part List5. Exploded View & Part List5. Exploded View & Part List5. Exploded View & Part List5. Exploded View & Part List5-1. LS20PUYKF/EN - Exploded ViewT 0003M 0215M 0014M 0174M 0107M 0013S T DM 00275. Exploded View & Part List5-1-1. LS20PUYKF/EN - Parts List5. Exploded View & Part List 5-2. LS20PUYKF/EN - Parts ListService Bom (SA: SERVICE AVAILABLE, SNA: SERVICE NOT AVAILABLE)5. Exploded View & Part List5. Exploded View & Part List5. Exploded View & Part List6. Wiring Diagram 6. Wiring Diagram6-1. Wiring Diagram - Main Board6. Wiring Diagram6. Wiring Diagram6. Wiring Diagram6-2. Wiring Diagram - IP BoardLVDS Connector RGB Connector (Connect to PC)Function Connector (Connect to IP-Board)6. Wiring Diagram 6-3. Connector Functions6-4. CablesBN96-02854W(B1730NW / B1930NW / B2030NBN96-07252U (B1930N)BN96-07252X (B2230N)。
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TOSHIBA InGaAℓP LEDTLRE53T(F),TLRME53T(F),TLSE53T(F),TLOE53T(F),TLYE53T(F), TLPYE53T(F),TLGE53T(F),TLFGE53T(F),TLPGE53T(F)Panel Circuit Indicators•Lead(Pb)-free products (lead: Sn-Ag-Cu)•3mm package•InGaAℓP technology•All plastic mold•Transparent lens•Lineup: 6 colors (red, orange, yellow, pure yellow, green and pure green)•High intensity light emission•Excellent low current light output•Applications: message boards, security devices and dashboarddisplaysLineupUnit: mmJEDEC ―JEITA ―TOSHIBA 4-4E1A Weight: 0.14 g(Typ.)Product Name Color Material TLRE53T(F) RedTLRME53T(F) RedTLSE53T(F) RedTLOE53T(F) OrangeTLYE53T(F) Yellow TLPYE53T(F) PureYellow TLGE53T(F) Green TLFGE53T(F) Green TLPGE53T(F) PureGreenP InGaA lAbsolute Maximum Ratings (Ta = 25°C)Product Name Forward CurrentI F (mA)Reverse VoltageV R (V)Power DissipationP D (mW)OperatingTemperatureT opr (°C)StorageTemperatureT stg (°C)TLRE53T(F) 50 4 120TLRME53T(F) 50 4 120TLSE53T(F) 50 4 120TLOE53T(F) 50 4 120TLYE53T(F) 50 4 120TLPYE53T(F) 50 4 120TLGE53T(F) 50 4 120TLFGE53T(F) 50 4 120TLPGE53T(F) 50 4 120−40~100 −40~120Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability testreport and estimated failure rate, etc).Electrical and Optical Characteristics (Ta = 25°C)Typ. Emission Wavelength Luminous IntensityI VForward VoltageV FReverse CurrentI RProduct NameλdλPΔλI F Min Typ.I F Typ.Max I F Max V R TLRE53T(F) 630 (644) 20 20 153 400 20 1.9 2.4 20 50 4TLRME53T(F) 626 (636) 23 20 272 600 20 1.9 2.4 20 50 4TLSE53T(F) 613 (623) 20 20 272 800 20 1.9 2.4 20 50 4TLOE53T(F) 605 (612) 20 20 272 100020 2.0 2.4 20 50 4TLYE53T(F) 587 (590) 17 20 272 800 20 2.0 2.4 20 50 4TLPYE53T(F) 580 (583) 14 20 153 450 20 2.0 2.4 20 50 4TLGE53T(F) 571 (574) 17 20 153 400 20 2.0 2.4 20 50 4TLFGE53T(F) 565 (568) 15 20 85 200 20 2.0 2.4 20 50 4TLPGE53T (F) 558 (562) 14 20 47.6130 20 2.1 2.4 20 50 4 Unit nmmAmcdmAVmAμA V PrecautionsPlease be careful of the following:•Soldering temperature: 260°C max, soldering time: 3 s max(soldering portion of lead: up to 1.6 mm from the body of the device)•If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress to the resin. Soldering should be performed after lead forming.•This visible LED lamp also emits some IR light.If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.R e la t i v e l u m i n o u si n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d c ur r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n ou s i n t e n si t y I V (m c d )Case temperature Tc (°C) I V – TcR e l a t i v e l um i n o u s i nt e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e fo r w a r d c u r r e n t I F (m A )Radiation pattern20 −20 800.1310.30.5 0 4060 060040802012020406080 100R e la t i v e l u m i n o u si n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d cu r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i no u s i n t e n si t y I V (m c d )Case temperature Tc (°C) I V – TcR e l a t i v e l um i n o u s in t e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e fo r w a r d c u r r e n t I F (m A )Radiation pattern60040802012020406080 100 20 −20 800.1310.30.5 0 4060 510R e l at i v e l u m i n o u si n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d cu r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i no u s i n t e n si t y I V (m c d )Case temperature Tc (°C) I V – TcR e l a t i v e l um i n o u s in t e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e fo r w a r d c u r r e n t I F (m A )Radiation pattern60040802012020406080100 20 −20 800.1310.30.5 0 4060R e l at i v e l u m i n o u si n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d cu r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n ou s i n t e ns i t y I V (m c d )Case temperature Tc (°C) I V – TcR e l a t i v e l u mi n o u s i nt e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e f or w a r d c u r r e n t I F (m A )Radiation pattern60040802012020406080100 20 −20 800.1310.30.5 0 4060R e l at i v e l u m i n o u si n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d cu r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n ou s i n t e ns i t y I V (m c d )Case temperature Tc (°C) I V – TcR e l a t i v e l u mi n o u s i nt e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e f or w a r d c u r r e n t I F (m A )Radiation pattern60040802012020406080100 20 −20 800.1310.30.5 0 4060100R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V)I F – V FF o r w a r d c u r r e n t I F (m A )Forward current I F (mA)I V– I FL u mi n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C)I V – TcR e l a t iv e l u m i n o u s i n t e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )Radiation pattern60040802012020406080 100 20 −20 805 0.131010.30.5 0 4060 100R e l at i v e l u m i n o u si n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d cu r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n ou s i n t e n si t y I V (m c d )Case temperature Tc (°C) I V – TcR e l a t i v e l um i n o u s in t e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e fo r w a r d c u r r e n t I F (m A )Radiation pattern6004080201202040608010020 −20 800.1310.30.5 0 4060 5 10100R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V) IF – V FF or w a r d c u r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i no u s i n t e n s i t y I V (m c d )Case temperature Tc (°C) I V – TcR e l a t iv e l u m i n o u s i n t e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )Radiation pattern60040802012020406080 100 560520640540580 600 620 20 −20805 0.131010.30.5 0 4060 100TLPGE53T(F)R e l a t i v e l u m i n o u si n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d c ur r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n ou s i n t e ns i t y I V (m c d )Case temperature Tc (°C) I V – TcR e l a t i v e l u m in o u s i nt e n s i t y I VWavelength λ (nm)Relative luminous intensity – WavelengthAmbient temperature Ta (°C)I F – TaA l l o w a b l e fo r w a r d c u r r e n t I F (m A )Radiation pattern30°0°60° 90° 90°30° 60° 1.00.80.6 0.4 0.2 0 80° 70° 50° 40°20°10°70° 80° 50° 40° 20°10°60040802012020406080100 20 −20 800.1310.30.5 0 4060 5 10RESTRICTIONS ON PRODUCT USE20070701-EN •The information contained herein is subject to change without notice.•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.•GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically.• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.。