COB工艺流程介绍

Introduction of CCM Assembly Process
Date : 2018/10/31
COB介绍
手机摄像头定义
pact Camara Module ---紧凑摄像模组
2.Cmos Camara Module ---CMOS 摄像模组
3.Cellphone Camara Module ---手机摄像模组
手机摄像头封装工艺类型
1.PLCC/CLCC（Plastic/Ceramic Leaded Chip Carrier ）
2.CSP（Chip-Scale Package芯片尺寸封装）
3.COB（Chip On Board）
4.FC（FLIP CHIP芯片倒装）
封装工艺对比
VCM 对焦马达Lens
镜头组
Bracket
托架
IR-Cut Filter
红外线截止玻璃
Sensor
芯片PCB
电路板
Connector
连接器
Structure of CCM
Assembly Process Flow
Bracket
托架
RFPC
軟硬複合板
GA
玻璃鍵合
Glue Dispensing
膠塗佈
DA
芯片鍵合
托架鍵合機+烤箱
Bracket Mount+Oven
WB
金線鍵合
鏡頭鍵合機+烤箱
LHA+Oven
Machine Configuration 玻璃鍵合機
+
紫外線照射機
Glass Attach+UV machine
托架鍵合機+烤箱Bracket Mount+Oven 鏡頭鍵合機+烤箱Lens/Holder Attach+Oven
芯片鍵合機
Die Attach 快速固化Snap Cure 緩衝機Buffer 金線鍵合Wire Bond 緩衝機Buffer
Die Attach (DA) + Snap Cure
Die attach is the process of attaching the silicon chip on the substrate.
Key Parameter
Quality Requirement Bond Force
Die Placement Bond Time Die tilt
Curing Time
Die Rotation Curing Temperature Die Shear RFPC
軟硬複合板Glue Dispensing 膠塗佈DA 芯片鍵合
Die Attach (DA) + Snap Cure
Dispensing System RW Wafer
Die Attach (DA) + Snap Cure Datacon 2200evo for example
Die Attach (DA) + Snap Cure
Die Shear
Dage-4000 Series
Snap Cure System
Curing profile
Wire Bond(WB)
Make electrical signal connection by welding gold wire from sensor
aluminum pad to the substrate golden finger.
Key Parameter Quality Requirement
Bond Force Wire Pull Bond Time Ball Shear Temperature No Crater WB 金線鍵合
Gold wire 金線
Key parameter
Wire diameter
0.8 mil
Purity
4N : 99.99%(Bondability)
2N : 99%(Shaping)
Elongation
0.5 ~ 3 %
Breaking Load 15~19 g
Capillary 銲針
Wire Bond(WB)
Substrate
Ball Formation
1st Bond
Wire Path Trajectory
2nd Bond
Substrate
Glass Attach (GA) + UV Cure
Dispense GA glue on bracket, then attach blue glass on it and finally
fix it by fully curing GA glue by UV machine or oven.
Key Parameter Quality Requirement Bond Force Glass Placement
Bond Time Glass tilt Curing Time
Glass Rotation
Curing Temperature Glass Shear
Bracket 托架GA 玻璃鍵合
Dispense GA glue 玻璃鍵合膠塗佈
Bracket Mount + Oven Cure
•
Dispense adhesive on post-wire bond semi-finished product, then mount bracket on it and finally fix it by fully curing adhesive by oven.
Key Parameter Quality Requirement Bond Force Bracket Placement
Bond Time
Bracket tilt
Curing Time Bracket Rotation Post-Wire Bond semi-finished product
金線鍵合後半成品Bracket Mount 托架鍵合機
Dispense Adhesive
接合膠塗佈
Lens Holder Attach (LHA) + Oven Cure
Key Parameter Quality Requirement
Bond Force Holder Shift Bond Time
Holder tilt
Curing Time Holder Rotation 托架鍵合機+烤箱Bracket Mount+Oven 鏡頭鍵合機+烤箱LHA+Oven
鏡頭鍵合膠塗佈Dispense LHA glue
Material Package Type
Precision Requireme
nt
Uplook Camera
DA Wafer Ring High ×GA Medium ×BM JEDEC Tray
High ○LHA
High
○
Comparison of PNP processes
•
PNP : Pick and Place
EOL 介绍
1.EOL介绍
EOL：End Of Line，后段生产线。

前段COB为模组半成品/成品封装车间，EOL
为后段成品功能调试、外观检验、辅料贴附打包等站的生产车间。

EOL 生产作用：
1、将前段COB车间组装好的半成品模组，通过调焦、点胶、OTP、功能、外观、贴辅料等站位生加工生产，确保模组功能和外观满足客户要求，并按要求打包
包装出货入库
2、通过车间制程将不良或有不良隐患的模组拦截在厂内不流出，确保优秀品质产品出给客户
3、按计划排产要求及时完成生产出货任务(由ME/PE/品质团队协助制造完成生
产任务)
EOL生产注意事项：每站位均需严格按环境参表及BOM表等文件资料，选择对应的生产环境及生产物料，作业方案按SOP定义生产。

2.流程介绍。