JESD22-A104-C

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jedec标准列表

jedec标准列表

JESD22-A100E:2020 Cycled Temperature-Humidity-Bias with Surface Condensation Life Test (循环温度-湿度-偏差与表面凝结寿命测试)JESD22-A101D.01:2021 Steady-State Temperature-Humidity Bias Life Test(稳态温度-湿度偏差寿命测试)JESD22-A102E:2015(R2021) Accelerated Moisture Resistance - Unbiased Autoclave (加速的耐湿性-无偏高压灭菌器)JESD22-A103E.01:2021 High Temperature Storage Life(高温储存寿命)JESD22-A104F :2020 Temperature Cycling(温度循环)JESD22-A105D:2020 Power and Temperature Cycling(功率和温度循环)JESD22-A106B.01:2016 Thermal Shock(热冲击)JESD22-A107C:2013 Salt Atmosphere(盐雾)JESD22-A108F:2017 Temperature, Bias, And Operating Life(温度,偏置和使用寿命) JESD22-A109B:2011 HERMETICITY(气密性)JESD22-A110E.01:2020 Highly Accelerated Temperature and Humidity Stress Test (HAST) -高加速温度和湿度应力测试(HAST)JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices(通过小型表面安装固态器件的全身焊锡浸入确定底部侧板连接能力的评估程序)。

海思消费类芯片可靠性测试技术总体规范V2

海思消费类芯片可靠性测试技术总体规范V2

海思消费类芯片可靠性测试技术总体规范V2.0海思消费类芯片可靠性测试技术总体规范V2.0是针对芯片可靠性测试的总体规范要求,包括电路可靠性和封装可靠性。

该规范适用于量产芯片验证测试阶段的通用测试需求,并能够覆盖芯片绝大多数的可靠性验证需求。

本规范描述的测试组合可能不涵盖特定芯片的所有使用环境,但可以满足绝大多数芯片的通用验证需求。

该规范规定了芯片研发或新工艺升级时,芯片规模量产前对可靠性相关测试需求的通用验收基准。

这些测试或测试组合能够激发半导体器件电路、封装相关的薄弱环节或问题,通过失效率判断是否满足量产出口标准。

在芯片可靠性测试中,可靠性是一个含义广泛的概念。

以塑封芯片为例,狭义的“可靠性”一般指芯片级可靠性,包括电路相关的可靠性(如ESD、Latch-up、HTOL)和封装相关的可靠性(如PC、TCT、HTSL、HAST等)。

但是芯片在应用场景中往往不是“独立作战”,而是以产品方案(如PCB板上的一个元器件)作为最终应用。

因此广义的“可靠性”还包括产品级的可靠性,例如上电温循试验就是用来评估芯片各内部模块及其软件在极端温度条件下运行的稳定性。

产品级的可靠性根据特定产品的应用场景来确定测试项和测试组合,并没有一个通用的规范。

本规范重点讲述芯片级可靠性要求。

本规范引用了JESD47I标准,该标准是可靠性测试总体标准。

在芯片可靠性测试中,测试组合通常以特定的温度、湿度、电压加速的方式来激发问题。

本规范还新增了封装可靠性测试总体流程图和测试前后的要求,并将《可靠性测试总体执行标准(工业级)》.xlsx作为本规范的附件。

海思消费类芯片可靠性测试技术总体规范V2.0本规范旨在规范海思消费类芯片的可靠性测试技术,确保其性能和质量符合要求。

以下是通用芯片级可靠性测试要求的详细介绍。

2.通用芯片级可靠性测试要求2.1电路可靠性测试电路可靠性测试是对芯片在不同应力条件下的可靠性进行评估的过程。

在测试过程中,需要按照以下要求进行测试:HTOL:在高温条件下进行测试,温度不低于125℃,Vcc不低于Vccmax。

高低温试验标准

高低温试验标准

高低温试验是一种常见的环境试验,用于评估产品在不同温度条件下的性能和可靠性。

这种试验通常包括高温试验、低温试验以及温度循环试验。

以下是一些可能用于高低温试验的标准:
1. **高温试验标准:**
- **IEC 60068-2-2:** 环境试验的一般准则-第2-2部分:试验B: 高温
- **MIL-STD-810:** 美国国防部发布的关于环境工程考虑的军用标准,其中包括高温试验。

2. **低温试验标准:**
- **IEC 60068-2-1:** 环境试验的一般准则-第2-1部分:试验A: 低温
- **MIL-STD-810:** 该标准也包括了有关低温试验的相关内容。

3. **温度循环试验标准:**
- **IEC 60068-2-14:** 环境试验的一般准则-第2-14部分:试验N: 温度循环
- **JESD22-A104:** 由电子行业标准制定联盟(JEDEC)发布,用于集成电路和半导体器件的温度循环测试。

这些标准通常会规定测试设备、试验条件、试验持续时间等方面的要求。

具体使用哪个标准取决于产品所属的行业和应用领域。

例如,电子设备、汽车零部件、航空航天器件等领域都可能有相应的高低温试验标准。

在进行高低温试验之前,建议查阅相关的标准文档以确保正确执行试验并获得准确的结果。

LCFC联宝电子可靠性试验条件

LCFC联宝电子可靠性试验条件

3.測試需在預處理后, 168hrs,
JESD22-A113
JESD22-A103 or MIL-STD202 Method 108
JESD22-A119
電感,耐壓變化需在+/-10%內.
180
Pass/Fail
外觀皆OK
電感,耐壓變化需在+/-10%內.
45
Pass/Fail
外觀皆OK
電感,耐壓變化需在+/-10%內.
103
電感,耐壓變化需在+/-10%內.
45
Pass/Fail
外觀皆OK
電感,耐壓變化需在+/-10%內.
45
Pass/Fail
外觀皆OK
電感,耐壓變化需在+/-10%內.
10
Pass/Fail
外觀皆OK
峰值加速度100G, 7 機械衝擊試驗 脈衝持續時間 6ms
半正玄衝擊
8
耐焊接溫度試驗
DIP系列: 260+/-5℃, 10+/-1秒 , 1 次, 或紅外線回流爐: 250+-5C (零件溫度), 30 秒, 3 次
MIL-STD-202G
電感,耐壓變化需在+/-10%內.
Method 213 or
10
Pass/Fail
JESD22B-104
Байду номын сангаас
外觀皆OK
MIL-STD-202G
電感,耐壓變化需在+/-10%內.
Method 210F or 10
Pass/Fail
JESD22-B106
外觀皆OK
MIL-STD-202,
45
Pass/Fail

JESD22-A104F中文版

JESD22-A104F中文版

JESD22-A104F中文版JESD22-A104F中文版》是一份介绍性的文档,旨在介绍其目的和背景。

该文档的目的是提供有关JESD22-A104F测试标准的信息和指导,帮助读者了解该标准的重要性和应用场景。

JESD22-A104F是一项针对集成电路封装和组装过程中热应力测试的标准,其目的是评估芯片在温度变化和热应力下的可靠性。

在研发和生产集成电路时,温度变化和热应力可能对芯片的性能和可靠性产生负面影响。

JESD22-A104F标准定义了测试方法和程序,以确保芯片在不同温度条件下的稳定性和可靠性。

该标准包含了测试样品的准备、测试设备的选择和设置、测试程序的执行等方面的指导。

通过了解JESD22-A104F标准的内容和背景,读者可以更好地理解该标准的应用价值和意义,并在实际生产和测试过程中正确使用和解释该标准。

根据JESD22-A104F标准进行测试可以提高集成电路的质量和可靠性,从而降低故障率和提高产品性能。

请注意,本文档的内容仅供参考,并不代表法律意见或建议。

在实际应用中,读者应根据具体情况和需求,结合其他相关标准和指南,制定适用的测试方案和流程。

概述《JESD22-A104F中文版》中所描述的测试方法和步骤。

以下是一些适用于《JESD22-A104F中文版》的应用领域的例子:电子产品制造业:《JESD22-A104F中文版》可应用于电子产品的制造和测试过程中,为确保产品的可靠性和稳定性提供指导。

通信行业:在通信设备的制造和测试过程中,可以使用《JESD22-A104F中文版》的标准来评估和验证相关的可靠性要求。

汽车工业:《JESD22-A104F中文版》可以用于汽车电子部件的测试和验证,以确保其在恶劣环境条件下的可靠性和耐久性。

航空航天领域:飞机和航天器的电子设备和组件需要经受极端环境的考验,使用《JESD22-A104F中文版》的标准可以帮助评估它们的可靠性。

医疗器械制造:对于医疗器械的制造商来说,了解《JESD22-A104F中文版》的应用可以帮助他们确保产品的稳定性和可靠性。

JEDEC工业标准

JEDEC工业标准

JEDEC工业标准环境应力试验[JDa1]JESD22-A100-B Cycled Temperature-Humidity-Bias Life Test 上电温湿度循环寿命试验, (Revision of JESD22-A100-A) April 2000 [Text-jd001][JDa2]JESD22-A101-B Steady State Temperature Humidity Bias Life Test 上电温湿度稳态寿命试验, (Revision of JESD22-A101-A) April 1997 [Text-jd002][JDa3]JESD22-A102-C Accelerated Moisture Resistance -Unbiased Autoclave高加速蒸煮试验, (Revision of JESD22-A102-B) December 2000 [Text-jd003][JDa4]JESD22-A103-A Test Method A103-A High Temperature Storage Life高温储存寿命试验, (Revision of Test Method A103 Previously Published in JESD22-B) July 1989[Text-jd004][JDa5]JESD22-A103-B High Temperature Storage Life高温储存寿命试验, (Revision of JESD22-A103-A) August 2001 [Text-jd005][JDa6]JESD22-A104-B Temperature Cycling温度循环, (Revision of JESD22-A104-A) July 2000 (参见更新版本A104C) [Text-jd006][JDa7]EIA/JESD22-A105-B Test Method A105-B Power and Temperature Cycling上电和温度循环, (Revision of Test Method A105-A) February 1996 [Text-jd007][JDa8]JESD22-A106-A Test Method A106-A Thermal Shock热冲击, (Revision of Test Method A106-Previously Published in JESD22-B) April 1995 [Text-jd008][JDa9]JESD22-A107-A Salt Atmosphere盐雾试验, (Revision of Test Method A107-Previously Published in JESD22-B) December 1989 [Text-jd009][JDa10]JESD22-A108-B Temperature, Bias, and Operating Life高温环境条件下的工作寿命试验, (Revision of JESD22-A108-A) December 2000[JDa11]JESD22-A110-B Test Method A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)高加速寿命试验, (Revision of Test MethodA110-A) February 1999 [Text-jd010][JDa12]JESD22-A113-B Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing非密封表贴器件在可靠性试验以前的预处理, (Revision of TestMethod A113-A) March 1999 [Text-jd011][JDa13]JESD22-A118 Accelerated Moisture Resistance - Unbiased HAST不上电的高加速湿气渗透试验, December 2000 [Text-jd012][JDa14]JESD22-B106-B Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices插接器件的抗焊接温度试验, (Revision of Test Method B106-A) February 1999 [Text-jd013][JDa15]EIA/JESD47 Stress-Test-Driven Qualification of Integrated Circuits集成电路施加应力的产品验收试验, July 1995 [Text-jd031][JDa1]JESD22-A104C Temperature Cycling, (Revision of JESD22-A104-B) May 2005 [Text-jd040]电应力和电测试试验[JDb1]JESD22-A114-B Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)人体模型条件下的静电放电敏感度试验, (Revision of JESD22-A114-A)June 2000 [Text-jd014][JDb2]EIA/JESD22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)机器模型条件下的静电放电敏感度试验, (Revision of EIA/JESD22-A115)October 1997 [Text-jd015][JDb3]JESD22-A117 Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test EEPROM的擦涂和数据保存试验, January 2000 [Text-jd016][JDb4]EIA/JESD78 IC Latch-Up Test集成电路器件闩锁试验, March 1997 [Text-jd017] [JDb5]JESD22-C101-A Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components微电子器件在电荷感应模型条件下的抗静电放电试验, (Revision of JESD22-C101) June2000 [Text-jd018]机械应力试验[JDc1]JESD-22-B103-A Test Method B103-A Vibration, Variable Frequency振动和扫频试验(Revision of Test Method B103 Previously Published in JESD22-B) July1989 [Text-jd019][JDc2]JESD22-B104-A Test Method B104-A Mechanical Shock机械冲击(Revision of Test Method B104, Previously Published in JEDEC Standard No.22-B) September 1990[Text-jd020][JDc3]EIA/JESD22-B116 Wire Bond Shear Test Method焊线邦定的剪切试验方法, July 1998 [Text-jd021][JDc4]JESD22-B117 BGA Ball Shear BGA焊球的剪切试验, July 2000 [Text-jd022][JDc5]JESD22B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products, March 2006[Text-jd038][JDc6]JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003 [Text-jd039]综合试验与测试[JDd1]JEDEC Standard No.22-A109 Test Method A109 Hermeticity密封性试验, July 1988 [Text-jd023][JDd2]JESD22-A120 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits集成电路器件中使用的有机材料水分扩散和水溶性测定试验方法, June 2001 [Text-jd024][JDd3]JESD22-B100-A Physical Dimensions物理尺寸的测量, (Revision of Test Method B100-Previously Published in JESD22-B) April 1990 [Text-jd025][JDd4]JESD22-B101 Test Method B101 External Visual外观检查, (Previously published in JESD22-B) September 1987 [Text-jd026][JDd5]EIA/JESD22-B102-C Solderability Test Method可焊性试验方法, September 1998 [Text-jd027][JDd6]EIA/JESD22-B105-B Test Method B105-B Lead Integrity器件管脚的完整性试验, (Revision of Test Method B105-A) January 1999 [Text-jd028][JDd7]EIA/JESD22-B107-A Test Method B107-A Marking Permanency图标的耐久性试验, (Revision of Test Method B107-Previously Published in JESD22-B) September 1995 [Text-jd029][JDd8]JESD22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices表贴半导体器件的共面性试验, November 1991 [Text-jd030]其它[JDe1]JEP113-B Symbol and Labels for Moisture-Sensitive Devices湿度敏感器件的符号和标识, (Revision of JEP113-A) May 1999 [Text-jd032][JDe2]EIA/JEP122 Failure Mechanisms and Models for Silicon Semiconductors Devices硅半导体器件的失效机理和模型, February 1996 [Text-jd033][JDe3]IPC/JEDEC J-STD-020A Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, April 1999 [Text-jd034][JDe4]IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices湿度/回流焊敏感标贴器件的处理、包装、运输和使用的标准, May 1999 [Text-jd035][JDe5]EIA/JEP103-A Suggested Product-Documentation Classifications and Disclaimers, (Revision of JEP103) July 1996 [Text-jd036][JDe6]IPC/JEDEC J-STD-020D.1 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, Supersedes IPC/JEDEC J-STD-020D August 2007, March2008 [Text-jd037]。

关于JESD的标准族统一编号

关于JESD的标准族统一编号

JEDEC工业标准环境应力试验[JDa1]JESD22-A100-B Cycled Temperature-Humidity-Bias Life Test 上电温湿度循环寿命试验, (Revision of JESD22-A100-A) April 2000 [Text-jd001][JDa2]JESD22-A101-B Steady State Temperature Humidity Bias Life Test 上电温湿度稳态寿命试验, (Revision of JESD22-A101-A) April 1997 [Text-jd002][JDa3]JESD22-A102-C Accelerated Moisture Resistance -Unbiased Autoclave高加速蒸煮试验, (Revision of JESD22-A102-B) December 2000 [Text-jd003][JDa4]JESD22-A103-A Test Method A103-A High Temperature Storage Life高温储存寿命试验, (Revision of Test Method A103 Previously Published in JESD22-B) July 1989 [Text-jd004] [JDa5]JESD22-A103-B High Temperature Storage Life高温储存寿命试验, (Revision of JESD22-A103-A) August 2001 [Text-jd005][JDa6]JESD22-A104-B Temperature Cycling温度循环, (Revision of JESD22-A104-A) July 2000 (参见更新版本A104C) [Text-jd006][JDa7]EIA/JESD22-A105-B Test Method A105-B Power and Temperature Cycling上电和温度循环, (Revision of Test Method A105-A) February 1996 [Text-jd007][JDa8]JESD22-A106-A Test Method A106-A Thermal Shock热冲击, (Revision of Test Method A106-Previously Published in JESD22-B) April 1995 [Text-jd008][JDa9]JESD22-A107-A Salt Atmosphere盐雾试验, (Revision of Test Method A107-Previously Published in JESD22-B) December 1989 [Text-jd009][JDa10]JESD22-A108-B Temperature, Bias, and Operating Life高温环境条件下的工作寿命试验, (Revision of JESD22-A108-A) December 2000[JDa11]JESD22-A110-B Test Method A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)高加速寿命试验, (Revision of Test Method A110-A) February 1999[Text-jd010][JDa12]JESD22-A113-B Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing非密封表贴器件在可靠性试验以前的预处理, (Revision of Test Method A113-A)March 1999 [Text-jd011][JDa13]JESD22-A118 Accelerated Moisture Resistance - Unbiased HAST不上电的高加速湿气渗透试验, December 2000 [Text-jd012][JDa14]JESD22-B106-B Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices插接器件的抗焊接温度试验, (Revision of Test MethodB106-A) February 1999 [Text-jd013][JDa15]EIA/JESD47 Stress-Test-Driven Qualification of Integrated Circuits集成电路施加应力的产品验收试验, July 1995 [Text-jd031][JDa16]JESD22-A104C Temperature Cycling, (Revision of JESD22-A104-B) May 2005 [Text-jd040]电应力和电测试试验[JDb1]JESD22-A114-B Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)人体模型条件下的静电放电敏感度试验, (Revision of JESD22-A114-A) June 2000 [Text-jd014][JDb2]EIA/JESD22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)机器模型条件下的静电放电敏感度试验, (Revision of EIA/JESD22-A115) October1997 [Text-jd015][JDb3]JESD22-A117 Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test EEPROM的擦涂和数据保存试验, January 2000[Text-jd016][JDb4]EIA/JESD78 IC Latch-Up Test集成电路器件闩锁试验, March 1997 [Text-jd017][JDb5]JESD22-C101-A Field-Induced Charged-Device Model Test Method forElectrostatic-Discharge-Withstand Thresholds of Microelectronic Components微电子器件在电荷感应模型条件下的抗静电放电试验, (Revision of JESD22-C101) June2000 [Text-jd018]机械应力试验[JDc1]JESD-22-B103-A Test Method B103-A Vibration, Variable Frequency振动和扫频试验(Revision of Test Method B103 Previously Published in JESD22-B) July 1989 [Text-jd019] [JDc2]JESD22-B104-A Test Method B104-A Mechanical Shock机械冲击(Revision of Test Method B104, Previously Published in JEDEC Standard No.22-B) September 1990[Text-jd020][JDc3]EIA/JESD22-B116 Wire Bond Shear Test Method焊线邦定的剪切试验方法, July 1998 [Text-jd021][JDc4]JESD22-B117 BGA Ball Shear BGA焊球的剪切试验, July 2000 [Text-jd022][JDc5]JESD22B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products, March 2006 [Text-jd038] [JDc6]JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003 [Text-jd039]综合试验与测试[JDd1]JEDEC Standard No.22-A109 Test Method A109 Hermeticity密封性试验, July 1988 [Text-jd023][JDd2]JESD22-A120 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits集成电路器件中使用的有机材料水分扩散和水溶性测定试验方法, June 2001 [Text-jd024][JDd3]JESD22-B100-A Physical Dimensions物理尺寸的测量, (Revision of Test Method B100-Previously Published in JESD22-B) April 1990 [Text-jd025][JDd4]JESD22-B101 Test Method B101 External Visual外观检查, (Previously published in JESD22-B) September 1987 [Text-jd026][JDd5]EIA/JESD22-B102-C Solderability Test Method可焊性试验方法, September 1998 [Text-jd027][JDd6]EIA/JESD22-B105-B Test Method B105-B Lead Integrity器件管脚的完整性试验, (Revision of Test Method B105-A) January 1999 [Text-jd028][JDd7]EIA/JESD22-B107-A Test Method B107-A Marking Permanency图标的耐久性试验, (Revision of Test Method B107-Previously Published in JESD22-B) September 1995[Text-jd029][JDd8]JESD22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices表贴半导体器件的共面性试验, November 1991 [Text-jd030]其它[JDe1]JEP113-B Symbol and Labels for Moisture-Sensitive Devices湿度敏感器件的符号和标识, (Revision of JEP113-A) May 1999 [Text-jd032][JDe2]EIA/JEP122 Failure Mechanisms and Models for Silicon Semiconductors Devices硅半导体器件的失效机理和模型, February 1996 [Text-jd033][JDe3]IPC/JEDEC J-STD-020A Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, April 1999 [Text-jd034][JDe4]IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices湿度/回流焊敏感标贴器件的处理、包装、运输和使用的标准, May 1999 [Text-jd035][JDe5]EIA/JEP103-A Suggested Product-Documentation Classifications and Disclaimers, (Revision of JEP103) July 1996 [Text-jd036][JDe6]IPC/JEDEC J-STD-020D.1 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, Supersedes IPC/JEDEC J-STD-020D August 2007, March 2008 [Text-jd037]。

德清华英电子SAW带通滤波器说明书

德清华英电子SAW带通滤波器说明书

DEQING HUAYING ELECTRONICS CO.,LTD.APPROVAL SHEETSAW BANDPASS FILTERPART NO.: NDFG010-1580SAProduct Type:Customer:SAW FilterPart NO.:Customer Part NO.:NDFG010-1580SAVer. Ctrl.:Issued Date:SFG010-1580SA -160315-v1.0PREPARED BY CHECKED BY APPROVED BY Part No. : NDFG010-1580SAPages : 10Data : 2016-3-15Revision : SFG010-1580SA -160315-v1.0Add (Deqing): 188 Zhiyuan North Rd.Wukang Town Deqing County Zhejiang Province 313200,P.R.ChinaPhone : +86-572-8281127Fax : +86-572-8281298E-mail : *******************Website : Revision Date Description Remark SFG010-1580SA -160315-v1.0 2016-3-15 First draftMarkingTop View, Laser MarkingStability CharacteristicsItem No. Test Item STD Reference Test Conditions per lotPreconditioning JESD22-A113 1) Temperature Cycling, 5 cycles -40℃to85℃2) Bake, 24 hrs @125±5℃;3) Reflow, 3 reflow cycles using profiles perIPC/JEDEC J-STD-020, SnPb or Pb-freeprofile based on device end use process4) Drying, Room ambient temperature2111 TemperatureCycling JESD22-A104 -40℃/ +85℃,40min dwell,<1 min transfertime,500cycles232 High TemperatureStorage JESD22-A103 85℃,240hr233 Low TemperatureStorage JESD22-A119 -40℃, 240hr234 High Temp. HighHumidity Storage JESD22-A106B 85°C , 85%RH, 240hr235 High TemperatureOperating JESD22-A102C +121℃100%RH 96hr236 Human Body ModeESD JESD22-A114 Measure to get the ESD limits level or marginbeyond specification57 Drop Test IEC 68-2-32 100㎝3times Steel floor JIG(110g~150g) 68 Solder ability JESD22-B102 Characterization per JESD22-B102 59 Vibration, VariableFrequency JESD22-B103 20 Hz to 2 kHz (log variation) in > 4 minutes,4X in each orientation, 50g peak acceleration2310 Mechanical Shock JESD22-B104 Y1 plane only, 5 pulses, 0.5 ms duration, 1500g peak acceleration2311 Solder HeatResistance IEC 68-2-21 Ue3 ±250V,C=100pF,R=1.5kΩ,1times1112 Static marginal test JESD22-A114F C=100pF,R=1.5kΩ,1times ( demand ofcustomer )1113 Power capacityMargin Limits / Power margin tests beyond input powerspecification:CW signal,85℃,highest in-band frequency,2hours dwell time for each step, repeat the testsuntil DUT abnormal12Requirements: The SAW filer shall remain within the electrical specifications after tests.。

JESD22简介+目录列表

JESD22简介+目录列表

JESD22标准定义及意义详细如下JESD22-A101orJESD22-A110.3. A101稳态温湿度偏置寿命JESD22-A101-BPublished:Apr-1997STEADY-STATETEMPERATUREHUMIDITYBIASLIFETEST: Thisstandardestablishesadefinedmethodandconditionsf orperformingatemperaturehumiditylifetestwithbiasapplied.Thetestisusedtoevaluatethereliabilityofnonhermeticpackagedsolidstatedevicesinhumidenvironments.Itemployshightem peratureandhumidityconditionstoacceleratethepenetrati onofmoisturethroughexternalprotectivematerialoralongi nterfacesbetweentheexternalprotectivecoatingandcondu ctorsorotherfeatureswhichpassthroughit.Thisrevisionen hancestheabilitytoperformthistestonadevicewhichcanno tbebiasedtoachieveverylowpowerdissipation.JESD22-A101-B发布:1997 年8 月稳态温湿度偏置寿命试验本标准建立了一个定义的方法,用于进行一个施加偏置电压的温湿度寿命试验。

本试验用于评估非气密封装固态器件在潮湿环境下的可靠性。

试验采用高温和高湿条件以加速水汽对外部保护材料或沿着外部保护材料和外部保护涂层,贯通其的导体或其他部件的穿透作用。

JESD22-A104D temperatuer cycling

JESD22-A104D temperatuer cycling
2.4 maximum sample temperature: (Ts(max)): The maximum temperature experienced by the sample(s) as measured by thermocouples, per 3.3.
2.5 minimum sample temperature: (Ts(min)): The minimum temperature experienced by the sample(s) as measured by thermocouples, per 3.3.
This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact:
JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South

JESD22简介+目录列表

JESD22简介+目录列表

JESD22标准定义及意义详细如下JESD22-A101orJESD22-A110.3. A101稳态温湿度偏置寿命JESD22-A101-BPublished:Apr-1997STEADY-STATETEMPERATUREHUMIDITYBIASLIFETEST: Thisstandardestablishesadefinedmethodandconditionsf orperformingatemperaturehumiditylifetestwithbiasapplied.Thetestisusedtoevaluatethereliabilityofnonhermeticpackagedsolidstatedevicesinhumidenvironments.Itemployshightem peratureandhumidityconditionstoacceleratethepenetrati onofmoisturethroughexternalprotectivematerialoralongi nterfacesbetweentheexternalprotectivecoatingandcondu ctorsorotherfeatureswhichpassthroughit.Thisrevisionen hancestheabilitytoperformthistestonadevicewhichcanno tbebiasedtoachieveverylowpowerdissipation.JESD22-A101-B发布:1997 年8 月稳态温湿度偏置寿命试验本标准建立了一个定义的方法,用于进行一个施加偏置电压的温湿度寿命试验。

本试验用于评估非气密封装固态器件在潮湿环境下的可靠性。

试验采用高温和高湿条件以加速水汽对外部保护材料或沿着外部保护材料和外部保护涂层,贯通其的导体或其他部件的穿透作用。

JEDEC工业标准

JEDEC工业标准

JEDEC工业标准环境应力试验[JDa1]JESD22-A100-B Cycled Temperature-Humidity-Bias Life Test 上电温湿度循环寿命试验, (Revision of JESD22-A100-A) April 2000 [Text-jd001][JDa2]JESD22-A101-B Steady State Temperature Humidity Bias Life Test 上电温湿度稳态寿命试验, (Revision of JESD22-A101-A) April 1997 [Text-jd002][JDa3]JESD22-A102-C Accelerated Moisture Resistance -Unbiased Autoclave高加速蒸煮试验, (Revision of JESD22-A102-B) December 2000 [Text-jd003][JDa4]JESD22-A103-A Test Method A103-A High Temperature Storage Life高温储存寿命试验, (Revision of Test Method A103 Previously Published in JESD22-B) July 1989 [Text-jd004] [JDa5]JESD22-A103-B High Temperature Storage Life高温储存寿命试验, (Revision of JESD22-A103-A) August 2001 [Text-jd005][JDa6]JESD22-A104-B Temperature Cycling温度循环, (Revision of JESD22-A104-A) July 2000 (参见更新版本A104C) [Text-jd006][JDa7]EIA/JESD22-A105-B Test Method A105-B Power and Temperature Cycling上电和温度循环, (Revision of Test Method A105-A) February 1996 [Text-jd007][JDa8]JESD22-A106-A Test Method A106-A Thermal Shock热冲击, (Revision of Test Method A106-Previously Published in JESD22-B) April 1995 [Text-jd008][JDa9]JESD22-A107-A Salt Atmosphere盐雾试验, (Revision of Test Method A107-Previously Published in JESD22-B) December 1989 [Text-jd009][JDa10]JESD22-A108-B Temperature, Bias, and Operating Life高温环境条件下的工作寿命试验, (Revision of JESD22-A108-A) December 2000[JDa11]JESD22-A110-B Test Method A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)高加速寿命试验, (Revision of Test Method A110-A) February 1999 [Text-jd010] [JDa12]JESD22-A113-B Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing非密封表贴器件在可靠性试验以前的预处理, (Revision of Test Method A113-A)March 1999 [Text-jd011][JDa13]JESD22-A118 Accelerated Moisture Resistance - Unbiased HAST不上电的高加速湿气渗透试验, December 2000 [Text-jd012][JDa14]JESD22-B106-B Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices插接器件的抗焊接温度试验, (Revision of Test Method B106-A) February1999 [Text-jd013][JDa15]EIA/JESD47 Stress-Test-Driven Qualification of Integrated Circuits集成电路施加应力的产品验收试验, July 1995 [Text-jd031][JDa1]JESD22-A104C Temperature Cycling, (Revision of JESD22-A104-B) May 2005 [Text-jd040]电应力和电测试试验[JDb1]JESD22-A114-B Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)人体模型条件下的静电放电敏感度试验, (Revision of JESD22-A114-A) June 2000 [Text-jd014] [JDb2]EIA/JESD22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)机器模型条件下的静电放电敏感度试验, (Revision of EIA/JESD22-A115) October 1997 [Text-jd015][JDb3]JESD22-A117 Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test EEPROM的擦涂和数据保存试验, January 2000 [Text-jd016][JDb4]EIA/JESD78 IC Latch-Up Test集成电路器件闩锁试验, March 1997 [Text-jd017][JDb5]JESD22-C101-A Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components微电子器件在电荷感应模型条件下的抗静电放电试验, (Revision of JESD22-C101) June 2000 [Text-jd018]机械应力试验[JDc1]JESD-22-B103-A Test Method B103-A Vibration, Variable Frequency振动和扫频试验 (Revision of Test Method B103 Previously Published in JESD22-B) July 1989 [Text-jd019] [JDc2]JESD22-B104-A Test Method B104-A Mechanical Shock机械冲击 (Revision of Test Method B104, Previously Published in JEDEC Standard No.22-B) September 1990 [Text-jd020][JDc3]EIA/JESD22-B116 Wire Bond Shear Test Method焊线邦定的剪切试验方法, July 1998 [Text-jd021][JDc4]JESD22-B117 BGA Ball Shear BGA焊球的剪切试验, July 2000 [Text-jd022][JDc5]JESD22B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products, March 2006 [Text-jd038] [JDc6]JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003 [Text-jd039]综合试验与测试[JDd1]JEDEC Standard No.22-A109 Test Method A109 Hermeticity密封性试验, July 1988 [Text-jd023][JDd2]JESD22-A120 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits集成电路器件中使用的有机材料水分扩散和水溶性测定试验方法, June 2001 [Text-jd024][JDd3]JESD22-B100-A Physical Dimensions物理尺寸的测量, (Revision of Test Method B100-Previously Published in JESD22-B) April 1990 [Text-jd025][JDd4]JESD22-B101 Test Method B101 External Visual外观检查, (Previously published in JESD22-B) September 1987 [Text-jd026][JDd5]EIA/JESD22-B102-C Solderability Test Method可焊性试验方法, September 1998 [Text-jd027] [JDd6]EIA/JESD22-B105-B Test Method B105-B Lead Integrity器件管脚的完整性试验, (Revision of Test Method B105-A) January 1999 [Text-jd028][JDd7]EIA/JESD22-B107-A Test Method B107-A Marking Permanency图标的耐久性试验, (Revision of Test Method B107-Previously Published in JESD22-B) September 1995 [Text-jd029] [JDd8]JESD22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices表贴半导体器件的共面性试验, November 1991 [Text-jd030]其它[JDe1]JEP113-B Symbol and Labels for Moisture-Sensitive Devices湿度敏感器件的符号和标识, (Revision of JEP113-A) May 1999 [Text-jd032][JDe2]EIA/JEP122 Failure Mechanisms and Models for Silicon Semiconductors Devices硅半导体器件的失效机理和模型, February 1996 [Text-jd033][JDe3]IPC/JEDEC J-STD-020A Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别,April 1999 [Text-jd034][JDe4]IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices湿度/回流焊敏感标贴器件的处理、包装、运输和使用的标准, May 1999 [Text-jd035][JDe5]EIA/JEP103-A Suggested Product-Documentation Classifications and Disclaimers, (Revision of JEP103) July 1996 [Text-jd036][JDe6]IPC/JEDEC J-STD-020D.1 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别,Supersedes IPC/JEDEC J-STD-020D August 2007, March 2008 [Text-jd037]。

JEDEC工业标准

JEDEC工业标准

J E D E C工业标准(共2页) -本页仅作为预览文档封面,使用时请删除本页-JEDEC工业标准环境应力试验[JDa1]JESD22-A100-B Cycled Temperature-Humidity-Bias Life Test 上电温湿度循环寿命试验, (Revision of JESD22-A100-A) April 2000 [Text-jd001][JDa2]JESD22-A101-B Steady State Temperature Humidity Bias Life Test 上电温湿度稳态寿命试验, (Revision of JESD22-A101-A) April 1997 [Text-jd002][JDa3]JESD22-A102-C Accelerated Moisture Resistance -Unbiased Autoclave高加速蒸煮试验, (Revision of JESD22-A102-B) December 2000 [Text-jd003][JDa4]JESD22-A103-A Test Method A103-A High Temperature Storage Life高温储存寿命试验, (Revision of Test Method A103 Previously Published in JESD22-B) July 1989[Text-jd004][JDa5]JESD22-A103-B High Temperature Storage Life高温储存寿命试验, (Revision of JESD22-A103-A) August 2001 [Text-jd005][JDa6]JESD22-A104-B Temperature Cycling温度循环, (Revision of JESD22-A104-A) July 2000 (参见更新版本A104C) [Text-jd006][JDa7]EIA/JESD22-A105-B Test Method A105-B Power and Temperature Cycling上电和温度循环, (Revision of Test Method A105-A) February 1996 [Text-jd007][JDa8]JESD22-A106-A Test Method A106-A Thermal Shock热冲击, (Revision of Test Method A106-Previously Published in JESD22-B) April 1995 [Text-jd008][JDa9]JESD22-A107-A Salt Atmosphere盐雾试验, (Revision of Test Method A107-Previously Published in JESD22-B) December 1989 [Text-jd009][JDa10]JESD22-A108-B Temperature, Bias, and Operating Life高温环境条件下的工作寿命试验, (Revision of JESD22-A108-A) December 2000[JDa11]JESD22-A110-B Test Method A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)高加速寿命试验, (Revision of Test Method A110-A) February1999 [Text-jd010][JDa12]JESD22-A113-B Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing非密封表贴器件在可靠性试验以前的预处理, (Revision of TestMethod A113-A) March 1999 [Text-jd011][JDa13]JESD22-A118Accelerated Moisture Resistance - Unbiased HAST不上电的高加速湿气渗透试验, December 2000 [Text-jd012][JDa14]JESD22-B106-B Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices插接器件的抗焊接温度试验, (Revision of Test MethodB106-A) February 1999 [Text-jd013][JDa15]EIA/JESD47Stress-Test-Driven Qualification of Integrated Circuits集成电路施加应力的产品验收试验, July 1995 [Text-jd031][JDa1]JESD22-A104C Temperature Cycling, (Revision of JESD22-A104-B) May 2005 [Text-jd040]电应力和电测试试验[JDb1]JESD22-A114-B Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)人体模型条件下的静电放电敏感度试验, (Revision of JESD22-A114-A) June 2000 [Text-jd014][JDb2]EIA/JESD22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)机器模型条件下的静电放电敏感度试验, (Revision of EIA/JESD22-A115)October 1997 [Text-jd015][JDb3]JESD22-A117Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test EEPROM的擦涂和数据保存试验, January 2000[Text-jd016][JDb4]EIA/JESD78IC Latch-Up Test集成电路器件闩锁试验, March 1997 [Text-jd017][JDb5]JESD22-C101-A Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components微电子器件在电荷感应模型条件下的抗静电放电试验, (Revision of JESD22-C101) June 2000 [Text-jd018]机械应力试验[JDc1]JESD-22-B103-A Test Method B103-A Vibration, Variable Frequency振动和扫频试验(Revision of Test Method B103 Previously Published in JESD22-B) July1989 [Text-jd019][JDc2]JESD22-B104-A Test Method B104-A Mechanical Shock机械冲击(Revision of Test Method B104, Previously Published in JEDEC Standard September 1990 [Text-jd020] [JDc3]EIA/JESD22-B116Wire Bond Shear Test Method焊线邦定的剪切试验方法, July 1998 [Text-jd021][JDc4]JESD22-B117BGA Ball Shear BGA焊球的剪切试验, July 2000 [Text-jd022][JDc5]JESD22B113Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products, March 2006[Text-jd038][JDc6]JESD22-B111Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003 [Text-jd039]综合试验与测试[JDd1]JEDEC Standard Test Method A109 Hermeticity密封性试验, July 1988 [Text-jd023] [JDd2]JESD22-A120Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits集成电路器件中使用的有机材料水分扩散和水溶性测定试验方法, June 2001 [Text-jd024][JDd3]JESD22-B100-A Physical Dimensions物理尺寸的测量, (Revision of Test Method B100-Previously Published in JESD22-B) April 1990 [Text-jd025][JDd4]JESD22-B101Test Method B101 External Visual外观检查, (Previously published in JESD22-B) September 1987 [Text-jd026][JDd5]EIA/JESD22-B102-C Solderability Test Method可焊性试验方法, September 1998 [Text-jd027][JDd6]EIA/JESD22-B105-B Test Method B105-B Lead Integrity器件管脚的完整性试验, (Revision of Test Method B105-A) January 1999 [Text-jd028][JDd7]EIA/JESD22-B107-A Test Method B107-A Marking Permanency图标的耐久性试验, (Revision of Test Method B107-Previously Published in JESD22-B) September 1995 [Text-jd029][JDd8]JESD22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices表贴半导体器件的共面性试验, November 1991 [Text-jd030]其它[JDe1]JEP113-B Symbol and Labels for Moisture-Sensitive Devices湿度敏感器件的符号和标识, (Revision of JEP113-A) May 1999 [Text-jd032][JDe2]EIA/JEP122Failure Mechanisms and Models for Silicon Semiconductors Devices硅半导体器件的失效机理和模型, February 1996 [Text-jd033][JDe3]IPC/JEDEC J-STD-020A Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, April 1999 [Text-jd034][JDe4]IPC/JEDEC J-STD-033Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices湿度/回流焊敏感标贴器件的处理、包装、运输和使用的标准, May 1999 [Text-jd035][JDe5]EIA/JEP103-A Suggested Product-Documentation Classifications and Disclaimers, (Revision of JEP103) July 1996 [Text-jd036][JDe6]IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, Supersedes IPC/JEDEC J-STD-020D August 2007, March 2008 [Text-jd037]。

芯片可靠性测试要求及标准解析

芯片可靠性测试要求及标准解析

芯片可靠性测试要求及标准解析芯片可靠性测试要求都有哪些?华碧实验室通过本文,将为大家简要解析芯片可靠性测试的要求及标准。

加速测试大多数半导体器件的寿命在正常使用下可超过很多年。

但我们不能等到若干年后再研究器件;我们必须增加施加的应力。

施加的应力可增强或加快潜在的故障机制,帮助找出根本原因,并帮助TI 采取措施防止故障模式。

在半导体器件中,常见的一些加速因子为温度、湿度、电压和电流。

在大多数情况下,加速测试不改变故障的物理特性,但会改变观察时间。

加速条件和正常使用条件之间的变化称为“降额”。

高加速测试是基于JEDEC 的资质认证测试的关键部分。

以下测试反映了基于JEDEC 规范JEP47 的高加速条件。

如果产品通过这些测试,则表示器件能用于大多数使用情况。

温度循环根据JED22-A104 标准,温度循环(TC) 让部件经受极端高温和低温之间的转换。

进行该测试时,将部件反复暴露于这些条件下经过预定的循环次数。

高温工作寿命(HTOL)HTOL 用于确定高温工作条件下的器件可靠性。

该测试通常根据JESD22-A108 标准长时间进行。

温湿度偏压高加速应力测试(BHAST)根据JESD22-A110 标准,THB 和BHAST 让器件经受高温高湿条件,同时处于偏压之下,其目标是让器件加速腐蚀。

THB 和BHAST 用途相同,但BHAST 条件和测试过程让可靠性团队的测试速度比THB 快得多。

热压器/无偏压HAST热压器和无偏压HAST 用于确定高温高湿条件下的器件可靠性。

与THB 和BHAST 一样,它用于加速腐蚀。

不过,与这些测试不同,不会对部件施加偏压。

高温贮存HTS(也称为“烘烤”或HTSL)用于确定器件在高温下的长期可靠性。

与HTOL 不同,器件在测试期间不处于运行条件下。

静电放电(ESD)静电荷是静置时的非平衡电荷。

通常情况下,它是由绝缘体表面相互摩擦或分离产生;一个表面获得电子,而另一个表面失去电子。

JESD22标准

JESD22标准

C:\Users\ ATC6100\ Desktop\ JEDEC标准\ JESD22-A100D.pdfC:\Users\ATC6100\ Desktop\JESD22-A101D.pdfC:\Users\ATC6100\Desktop\JEDEC标准\JESD22-A102E.pdf C:\Users\ ATC6100\ Desktop\JESD22-1D标准解读.docxC:\Users\ATC6100\Desktop\JESD22-A103E.pdfC:\Users\ATC6100\Desktop\JESD22-A104E.pdfC:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-A105C_0.pdfC:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-A106B-01.pdfC:\Users\ATC6100\Desktop\JEDEC标准\JESD22-A107C.pdfC:\Users\ATC6100\Desktop\JEDEC标准\JESD22-A108D.pdfC:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-A109B.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-A110E.pdf C:\Users\ATC6100\Desktop\JEDEC标准\JESD22-A111B.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\J-STD-020E.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-A113H.pdf C:\Users\ATC6100\Desktop\C:\Users\ATC6100\Desktop\JEDEC标准\JESD22-A117D.pdf C:\Users\ATC6100\Desktop\JEDEC标准\JESD22-A118B.pdf C:\Users\ATC6100\Desktop\JEDEC标准\JESD22-A119A.pdf C:\Users\ATC6100\Desktop\JESD22-A120B.pdfC:\Users\ATC6100\Desktop\JEDEC标准\JESD22-A121A_R.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-A122A.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-B100B.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-B101C.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-A120B.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-B103B-01.pdf C:\Users\ATC6100\Desktop\JESD22-B110B.pdf C:\Users\ATC6100\Desktop\JESD22-B105E.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-B106E.pdf C:\Users\ATC6100\Desktop\JESD22\JEDEC标准\JESD22-B107D_R.pdf C:\Users\ATC6100\Desktop\JEDEC标准\JESD22-B108B.pdfC:\Users\ ATC6100\ Desktop\ JEDEC标准\JESD22-B109B.pdf C:\Users\ ATC6100\ Desktop\JESD22-B110B.pdfC:\Users\ ATC6100\ Desktop\ JEDEC标准\ JESD22-B111A.pdf C:\Users\ ATC6100\ Desktop\ JEDEC标准\JESD22-B112B.pdfC:\Users\ATC6100\Desktop\ JEDEC标准\JESD22-B113A.pdfC:\Users\ATC6100\Desktop\JEDEC标准\JESD22-B114A.pdfC:\Users\ATC6100\Desktop\C:\Users\ATC6100\Desktop\JESD22-B117B.pdfC:\Users\ ATC6100\ Desktop\C:\Users\ ATC6100\ Desktop\C:\Users\ ATC6100\ Desktop\。

JESD22标准目录

JESD22标准目录

JESD22标准目录以下是JESD22标准列表,其中包括标准编号、现行版本、标准状态和标准项目。

标准编号:A100现行版本:D Jul 2013标准状态:现行标准项目:循环温湿度偏置寿命标准编号:A101现行版本:C Mar 2009标准状态:现行标准项目:稳态温湿度偏置寿命标准编号:A102现行版本:D Nov 2010标准状态:现行标准项目:加速水汽抵抗性-无偏置高压蒸煮标准编号:A103现行版本:D Dec 2010 标准状态:现行标准项目:高温贮存寿命标准编号:A104现行版本:D Mar 2009 标准状态:现行标准项目:温度循环标准编号:A105现行版本:C Jan 2004标准状态:现行标准项目:上电温循标准编号:A106现行版本:B Jun 2004标准状态:现行标准项目:热冲击标准编号:A107现行版本:C Apr 2013标准状态:现行标准项目:盐雾标准编号:A108现行版本:D Nov 2010标准状态:现行标准项目:温度,偏置电压,以及工作寿命标准编号:A109现行版本:B Nov 2011标准状态:现行,指向军标标准项目:密封标准编号:A110现行版本:D Nov 2010标准状态:现行标准项目:高加速温湿度应力试验(HAST)(有偏置电压未饱和高压蒸汽)标准编号:A111现行版本:A Nov 2010标准状态:被替代标准项目:安装在单面板底面的小型表贴固态器件耐浸焊能力的评价流程标准编号:A112现行版本:/标准状态:现行标准项目:塑封表贴器件水汽诱发的应力敏感性(被J-STD-020替代)标准编号:A113现行版本:XXX 2008标准状态:现行标准项目:塑封表贴器件可靠性试验前的预处理标准编号:A114现行版本:F Dec 2008标准状态:现行标准项目:静电放电敏感性试验(ESD)人体模型(HBM)标准编号:A115现行版本:C Nov 2010标准状态:现行标准项目:静电放电敏感性试验(ESD)机器模型(MM)标准编号:A117现行版本:C Oct 2011标准状态:现行标准项目:电可擦除可编程只读存储器(EEPROM)编程/擦除耐久性以及数据保持试验标准编号:A118现行版本:A Mar 2011标准状态:现行标准项目:加速水汽抵抗性——无偏压HAST(无偏置电压未饱和高压蒸汽)标准编号:A119现行版本:Nov 2004标准状态:现行标准项目:低温贮存寿命标准编号:A120现行版本:A XXX 2008标准状态:现行标准项目:用于集成电路的有机材料的水汽扩散率以及水溶解度试验方法标准编号:A121现行版本:A Jul 2008标准状态:现行标准项目:锡及锡合金表面镀层晶须生长的测试方法标准编号:A122现行版本:Aug 2007标准状态:现行标准项目:功率循环标准编号:B100现行版本:B Jun 2003 标准状态:现行标准项目:物理尺寸标准编号:B101现行版本:B Aug 2009 标准状态:现行标准项目:外部目检标准编号:B102现行版本:E Oct 2007 标准状态:现行标准项目:可焊性标准编号:B103现行版本:B Jun 2002 标准状态:现行标准项目:振动,变频标准编号:B104现行版本:C Nov 2004 标准状态:现行标准项目:机械冲击。

元器件dpa检测的标准

元器件dpa检测的标准

元器件DPA检测的常用标准有:
1. MIL-STD-1580:由美国国防部发布,主要适用于军用电子元器件的DPA检测。

该标准规定了元器件DPA检测的流程、方法和标准,包括元器件的外观检测、尺寸检测、材料分析、金属结构分析和内部结构分析等方面。

2. MIL-STD-883:由美国国防部发布,主要适用于半导体器件的DPA检测。

该标准规定了半导体器件DPA检测的流程、方法和标准,包括元器件的外观检测、尺寸检测、材料分析、金属结构分析和内部结构分析等方面。

3. JEDEC JESD22-A104:由JEDEC Solid State Technology Association发布,主要适用于半导体器件的DPA检测。

该标准规定了半导体器件DPA检测的流程、方法和标准,包括元器件的外观检测、尺寸检测、材料分析、金属结构分析和内部结构分析等方面。

4. IPC-9702:由IPC(Association Connecting Electronics Industries)发布,主要适用于电子元器件的DPA检测。

该标准规定了电子元器件DPA检测的流程、方法和标准,包括元器件的外观检测、尺寸检测、材料分析、金属结构分析和内部结构分析等方面。

5. NASA-STD-8739.1:由美国国家航空和宇宙航行局(NASA)发布,主要适用于航空航天电子元器件的DPA检测。

该标准规
定了航空航天电子元器件DPA检测的流程、方法和标准,包括元器件的外观检测、尺寸检测、材料分析、金属结构分析和内部结构分析等方面。

以上内容仅供参考,如需更具体全面的信息,建议查阅上述标准的官方文件或相关文献。

pcb高低温测试标准

pcb高低温测试标准

pcb高低温测试标准PCB高低温测试是用于评估PCB(Printed Circuit Board)在高温和低温环境下的性能和可靠性的一种测试方法。

本文将讨论PCB高低温测试的一般标准和相关参考内容。

1. IPC (Association Connecting Electronics Industries) 标准:IPC是电子行业的标准制定组织,它为PCB高低温测试制定了一些行业标准。

以下是一些相关标准:- IPC-TM-650 测试方法手册: 这本手册提供了一系列的测试方法和指导,帮助评估PCB在高低温环境下的性能。

- IPC-9701 元器件可靠性测试指南: 这个指南详细介绍了如何进行元器件的高低温测试,包括测试方法和参数的选择。

2. MIL-STD (Military Standard) 标准:军工行业对于PCB的可靠性要求非常高,因此MIL-STD标准是PCB高低温测试的重要参考标准。

以下是一些相关标准:- MIL-STD-810 环境工程考核:这个标准提供了一系列的环境条件和测试方法,包括温度、湿度、气压等,可以用于评估PCB在极端环境下的可靠性。

- MIL-STD-202 测试方法标准:这个标准详细描述了包括高低温环境下的各种测试方法和参数。

可以作为PCB高低温测试的参考。

3. JEDEC (Joint Electron Device Engineering Council) 标准:JEDEC是电子器件工程委员会,它为PCB高低温测试提供了一些行业标准。

以下是一些相关标准:- JEDEC JESD22-A104 低温测试方法:这个标准提供了低温测试的方法和参数,包括测试设备、测试时间、温度梯度等。

- JEDEC JESD22-A108 高温测试方法:这个标准提供了高温测试的方法和参数,包括测试设备、测试时间、温度梯度等。

4. ISO (International Organization for Standardization) 标准:ISO是国际标准化组织,它为PCB高低温测试制定了一些国际标准。

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JEDEC STANDARD
Tempeevision of JESD22-A104-B) MAY 2005
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
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2 Terms and definitions
2.1 Load
The sample(s) and associated fixtures (trays, racks, etc.) in the chamber during the test.
2.2 Working zone
The volume in the chamber(s) in which the temperature of the load is controlled within the specified conditions.
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2.3 Sample temperature: Ts
The temperature of the samples during temperature cycling, as measured by thermocouples, or equivalent temperature measurement apparatus, affixed to, or imbedded in, their bodies. The thermocouple, or equivalent temperature measurement apparatus, attachment method used should ensure that the entire mass of the sample(s) is reaching the temperature extremes and the soak requirements.
1 Scope
This specification applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing. In single chamber cycling, the load is placed in a stationary chamber, and is heated or cooled by introducing hot or cold air into the chamber. In dual chamber cycling, the load is placed on a moving platform that shuttles between stationary chambers maintained at fixed temperatures. In triple chamber temperature cycling there are three chambers and the load is moved between them.
Test Method A104C (Revision of Test Method A104-B)
JEDEC Standard No. 22-A104C Page 2
2 Terms and definitions (cont’d) 2.4 Maximum sample temperature: Ts(max) The maximum temperature experienced by the sample(s) as measured by thermocouples, per 2.3. 2.5 Minimum sample temperature: Ts(min) The minimum temperature experienced by the sample(s) as measured by thermocouples, per 2.3. 2.6 Load transfer time The time it takes to physically transfer the load from one temperature chamber and introduce it into the other. Load transfer applies to dual and triple chamber cycling. 2.7 Maximum load The largest load that can be placed in the chamber and still meet the specified temperature cycling requirements as verified by thermocouples, per 2.3. 2.8 Nominal ΔT The difference between nominal Ts(max) and nominal Ts(min) for the Temperature Cycling Test Condition; see Table 1. 2.9 Soak time The total time the sample temperature is within a specified range of each nominal Ts(max) and nominal Ts(min). This range is defined as the time Ts is at –5 °C to +10/+15 °C (dependent on the Test Condition tolerance) of Ts(max)nominal for the upper end of the cycle and the time Ts is +5 °C to –10 °C of Ts(min) nominal for the lower end of the cycle. 2.10 Soak temperature The temperature range that is –5 °C to +10/+15 °C (dependent on the Test Condition tolerance) of Ts(max)nominal and +5 °C to –10 °C of Ts(min) nominal. 2.11 Cycle time Time between one high temperature extreme to the next, or from one low temperature extreme to the next, for a given sample; see Figure 1.
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