ST2N6520中文资料
2N3700HR中文资料(ST)中文数据手册「EasyDatasheet - 矽搜」
包
UB UB UB UB UB LCC-3 LCC-3 LCC-3 TO-18 TO-18 TO-18
辐射水平
100拉德HDR -
100拉德ESCC 100拉德SW -
芯片中文手册,看全文,戳
3
TO-18
1 2
LCC-3
在UB销4被连接到金属盖
1 2 3
3
4 1
2
UB
图 1.内部示意图
2N3700HR
高可靠性80 V,1 NPN晶体管
特征
数据表
- 生产数据
BVCEO
80 V
集成电路(MAX)
1A
HFE在10 V - 150毫安
100
密封包
食管鳞状细胞癌和JANS合格 高达100拉德(Si)低剂量率
[300]
20
0.5 V
IC =150毫安
IB =15毫安
- 1.1 V
IC =0.1毫安 IC =10毫安 IC =150毫安 IC =150毫安 Tamb = 150 °C IC =500毫安
VCE = 10 V 25
- 200
VCE = 10 V 45
-
VCE = 10 V 100
-
300
VCE = 10 V 40
2N3700UB0x SOC3700RHRx SOC3700SW SOC3700HRB 2N3700RHRx
2N3700SW 2N3700HR
资格 系统
JANSR JANS ESCC ESCC ESCC ESCC ESCC ESCC ESCC ESCC ESCC
博朗IRT6520中文说明书
ThermoScan
更換電池
本耳溫槍附送兩粒1.5伏 AA(LR 06)電池。為保持最佳性能, 我們建議使用金霸王®/金頂® 鹼性電池。
1 顯示幕出現電池標誌時,請更換電池。 2 打開電池蓋取出舊電池, 換上新電池,並確保電池的正負極方
向正確。
3 蓋緊電池蓋。
請只棄置已用完的電池。 為保護環境,請遵照國家或 當地法規,將舊電池 棄置於合適的回收點。
校正
本耳溫槍在製造時已校正過; 若確實遵照本使用說明操作本產品, 無需再作定期校 正。若你懷疑測量值的準確性, 請聯絡售後服務熱線。 製造日期請參見電池糟的產品編號。 LOT後第一、二、三碼表示該年份的製造日, 第四、五碼 表示製造年份, 最後的字母是製造商的代號。 舉例:LOT11614K代表產品於2014年第116日製造。
百靈耳溫槍是為提供準確、安全和快速的耳道測溫而精心研製的。本耳溫槍的測溫頭 設計能避免測溫頭插入耳道過深,以避免損傷耳膜。然而, 無論是哪一種耳溫槍, 都需要正確的操作技巧才能夠測得準確的溫度。因此, 請仔細閱讀本說明書。百靈 ThermoScan®耳溫槍用於間歇性測量和觀察不同年齡人士的體溫,且僅供家庭使用。 使用百靈耳溫槍並不能代替醫生的診斷。
如何使用百靈ThermoScan® 耳溫槍
1
從保護盒上取出耳溫槍。
2 按下電源按鈕 。
耳溫槍進行自我檢查,顯示幕顯示各項內容,然後顯示最後一次體溫讀數5秒。
1. Guyton A C, Textbook of medical physiology, W.B. Saunders, Philadelphia, 1996, p 919 2. Guyton A C, Textbook of medical physiology, W.B. Saunders, Philadelphia, 1996, p 754-5 3. Netter H F, Atlas of Human Anatomy, Novartis Medical Education, East Hanover, NJ, 1997, pp 63, 95.
2N6520TA资料
2N6520PNP Epitaxial Silicon TransistorAbsolute Maximum Ratings T a =25°C unless otherwise notedElectrical Characteristics T a =25°C unless otherwise noted* Pulse Test: Pulse Width ≤300µs, Duty Cycle ≤2%Symbol ParameterValue Units V CBO Collector-Base Voltage -350V V CEO Collector-Emitter Voltage -350V V EBO Emitter-Base Voltage -5V I C Collector Current -500mA I B Base Current-250mA P C Collector Power Dissipation 0.625W Derate above 255mW/°C T J Junction Temperature 50°C T STGStorage Temperature-55 ~ 150°CSymbol ParameterTest ConditionMin.Max.Units BV CBO Collector-Base Breakdown Voltage I C = -100µA, I E =0-350V BV CEO * Collector-Emitter Breakdown Voltage I C = -1mA, I B =0-350V BV EBO Emitter-Base Breakdown Voltage I E = -10µA, I C =0-5V I CBO Collector Cut-off Current V CB = -250V, I E =0-50nA I EBO Emitter Cut-off Current V EB = -4V, I C =0-50nAh FE* DC Current GainV CE = -10V, I C = -1mA V CE = -10V, I C = -10mA V CE = -10V, I C = -30mA V CE = -10V, I C = -50mA V CE = -10V, I C = -100mA 2030302015200200V CE (sat)Collector-Emitter Saturation VoltageI C = -10mA, I B = -1mA I C = -20mA, I B = -2mA I C = -30mA, I B = -3mA I C = -50mA, I B = -5mA -0.30-0.35-0.50-1V V V V V BE (sat)Base-Emitter Saturation VoltageI C = -10mA, I B = -1mA I C = -20mA, I B = -2mA I C = -30mA, I B = -3mA -0.75-0.85-0.90V V V V BE (on)Base-Emitter On VoltageV CE = -10V, I C = -100mA-2V f T * Current Gain Bandwidth Product V CE = -20V, I C = -10mA, f=20MHz 40200MHz C ob Output Capacitance V CB = -20V, I E =0, f=1MHz 6pF C EB Emitter-Base Capacitance V EB = -0.5V, I C =0, f=1MHz 100pF t ON Turn On Time V BE (off)= -2V, V CC = -100V I C = -50mA, I B1= -10mA 200ns t OFFTurn Off TimeV CC = -100V, I C = -50mA I B1=I B2= -10mA3.5ns2N6520High Voltage Transistor•Collector-Emitter Voltage: V CEO = -350V •Collector Dissipation: P C (max)=625mW •Complement to 2N65171. Emitter2. Base3. CollectorTO-9212N6520TRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsDatasheet Identification Product Status DefinitionAdvance InformationFormative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.PreliminaryFirst ProductionThis datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.Obsolete Not In ProductionThis datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.FACT™FACT Quiet series™FAST ®FASTr™FRFET™GlobalOptoisolator™GTO™HiSeC™I 2C™ImpliedDisconnect™ISOPLANAR™LittleFET™MicroFET™MicroPak™MICROWIRE™MSX™MSXPro™OCX™OCXPro™OPTOLOGIC ®OPTOPLANAR™PACMAN™POP™Power247™PowerTrench ®QFET™QS™QT Optoelectronics™Quiet Series™RapidConfigure™RapidConnect™SILENT SWITCHER ®SMART START™SPM™Stealth™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™TinyLogic™TruTranslation™UHC™UltraFET ®VCX™ACEx™ActiveArray™Bottomless™CoolFET™CROSSVOLT ™DOME™EcoSPARK™E 2CMOS™EnSigna™Across the board. Around the world.™The Power Franchise™Programmable Active Droop™。
s-n25 接触器 参数
s-n25 接触器参数
S-N25 接触器是一种常用的电气元件,用于控制电路的开关和断开。
它具有许多参数,如电流、电压、功率等,这些参数决定了接触器的工作性能和适用范围。
我们来看一下S-N25 接触器的电流参数。
该接触器的额定工作电流为25安培,意味着在额定电流范围内,接触器能够稳定地工作。
当电流超过额定值时,接触器可能会产生过热、焊接或烧毁等故障,因此在选择接触器时需要根据实际电流需求进行合理匹配。
接下来是电压参数。
S-N25 接触器的额定工作电压为220伏特,这意味着它适用于工作电压为220V的电路。
如果电压超过额定值,接触器的绝缘性能可能会受到损害,从而导致电弧、击穿等安全问题。
因此,在使用接触器时,要确保电压不超过其额定工作电压。
功率参数也是我们需要关注的。
S-N25 接触器的额定功率为5千瓦,这意味着它可以承受5千瓦的负载。
如果负载功率超过额定值,接触器可能无法正常工作,甚至会发生故障。
因此,在选择接触器时,要根据实际负载功率进行合理匹配。
除了这些基本参数外,S-N25 接触器还具有一些其他特性,如动作时间、机械寿命等。
动作时间是指接触器从闭合到断开或从断开到闭合的时间,这对于一些对时间要求较高的应用非常重要。
机械寿命是指接触器能够正常工作的次数,这对于需要频繁开关的电路来
说非常重要。
总结起来,S-N25 接触器是一种重要的电气元件,其参数包括电流、电压、功率等。
在选择和使用接触器时,我们需要根据实际需求,合理匹配参数,以确保电路的稳定运行和安全性。
ST202中文资料
1/10June 2001s SUPPLY VOLTAGE RANGE: 4.5 TO 5.5V s SUPPLY CURRENT NO LOAD (TYP): 1.5mA sTRASMITTER OUTPUT VOLTAGE SWING (TYP): ± 9Vs TRANSITION SLEW RATE (TYP .): 12V/µs sRECEIVER PROPAGATION DELAY (TYP .): 0.1µss COMPATIBLE WITH MAX202s RECEIVER INPUT VOLTAGE RANGE: ± 30V s DATA RATE (TYP .): 400Kbp/ssOPERATING TEMPERATURE RANGE: -40 TO 85 °C, 0 TO 70°CDESCRIPTIONThe ST202 is a 2 driver, 2 receiver device following EIA/TIA-232 and V.28 communication standard. It is particularly suitable for applications where ± 12V is not available. The ST202 uses a single 5V power supply and only four external capacitors (0.1µF). Typical application are in:Portable Computers, Low Power Modems,Interfaces Translation, Battery Powered RS-232Networks.ORDERING CODESType Temperature Range PackageCommentsST202CN 0 to 70 °C DIP-1625parts per tube / 40tube per box ST202BN -40 to 85 °C DIP-1625parts per tube / 40tube per box ST202CD 0 to 70 °C SO-16 (Tube)50parts per tube / 20tube per box ST202BD -40 to 85 °C SO-16 (Tube)50parts per tube / 20tube per boxST202CDR 0 to 70 °C SO-16 (Tape & Reel)2500 parts per reel ST202BDR -40 to 85 °C SO-16 (Tape & Reel)2500 parts per reelST202CW 0 to 70 °C SO-16 Large (Tube)49parts per tube / 25tube per box ST202BW -40 to 85 °C SO-16 Large (Tube)49parts per tube / 25tube per boxST202CWR 0 to 70 °C SO-16 Large (Tape & Reel)1000 parts per reel ST202BWR -40 to 85 °C SO-16 Large (Tape & Reel)1000 parts per reel ST202CTR 0 to 70 °C TSSOP16 (Tape & Reel)2500 parts per reel ST202BTR-40 to 85 °CTSSOP16 (Tape & Reel)2500 parts per reelST2025V POWERED MULTI-CHANNEL RS-232 DRIVERS AND RECEIVERSST2022/10PIN CONFIGURATIONPIN DESCRIPTIONABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition is not implied.PlN N°SYMBOL NAME AND FUNCTION1C 1+Positive Terminal for the first Charge Pump Capacitor 2V+Doubled Voltage Terminal3C 1-Negative Terminal for the first Charge Pump Capacitor 4C 2+Positive Terminal for the second Charge Pump Capacitor 5C 2-Negative Terminal for the second Charge Pump Capacitor 6V-Inverted Voltage Terminal7T2OUT Second Transmitter Output Voltage 8R2IN Second Receiver Input Voltage 9R2OUT Second Receiver Output Voltage 10T2IN Second Transmitter Input Voltage 11T1IN First Transmitter Input Voltage 12R1OUT First Receiver Output Voltage 13R1IN First Receiver Input Voltage 14T1OUT First Transmitter Output Voltage 15GND Ground16V CCSupply VoltageSymbol ParameterValue Unit V CC Supply Voltage -0.3 to 6V V+Extra Positive Voltage(V CC -0.3) to 13.2V V-Extra Negative Voltage0.3 to -13.2V T IN Transmitter Input Voltage Range -0.3 to (V CC + 0.3)V R IN Receiver Input Voltage Range ± 30V T OUT Transmitter Output Voltage Range ± 15V R OUT Receiver Output Voltage Range -0.3 to (V CC + 0.3)VT SCTOUTShort Circuit Duration on T OUTinfiniteST2023/10ELECTRICAL CHARACTERISTICS(C 1 - C 4 = 0.1µF, V CC = 5V ± 10%, T A = -40 to 85°C, unless otherwise specified. Typical values are referred to T A = 25°C)TRANSMITTER ELECTRICAL CHARACTERISTICS(C 1 - C 4 = 0.1µF, V CC = 5V ± 10%, T A = -40 to 85°C, unless otherwise specified. Typical values are referred to T A = 25°C)Note 1: Measured from 3V to -3V or from -3V to 3V.Note2: One trasmitter output is loaded with R L = 3K Ω to 7K Ω, C L = 50 to 1000pFRECEIVER ELECTRICAL CHARACTERISTICS(C 1 - C 4 = 0.1µF, V CC = 5V ± 10%, T A = -40 to 85°C, unless otherwise specified. Typical values are referred to T A = 25°C)Note 1: RS-232 IN to TTL-CMOS OUT (from 50% to 50%)SymbolParameterTest ConditionsMin.Typ.Max.Unit I SUPPLY V CC Power Supply CurrentNo Load1.54mASymbol ParameterTest ConditionsMin.Typ.Max.Unit V TOUT Output Voltage Swing All Transmitter outputs are loaded with 3K Ω to GND ± 5± 9V I TIL Logic Pull-Up Current T IN = 0V540µA V TIL Input Logic Threshold Low 0.81.4V V TIH Input Logic Threshold High 1.42V SR TTransition Slew RateT A = 25°C,V CC = 5VR L = 3 to 7K Ω,C L = 50 to 2500pF(Note1)61230V/µsD R Data Rate(Note 2)200400Kbits/s R TOUT Transmitter Output ResistanceV CC = V+ = V- = 0V V OUT = ± 2V300ΩI SC Transmitter Output Short Circuit Currentone T XOUT to GND± 7± 22mA t dTPropagation Delay TimeTTL-CMOS IN to RS-232 OUT C L = 150pF (50% to 50%)1.33.5µsSymbol ParameterTest ConditionsMin.Typ.Max.Unit V RIN Receiver Input Voltage Operating Range-3030V R RIN RS-232 Input ResistanceT A = 25°C357K ΩV RILRS-232 Input Threshold Low0.81.3V V RIH RS-232 Input ThresholdHigh1.82.4V V RIHYS RS-232 Input Hysteresis V CC = 5V0.20.51V V ROL TTL/CMOS Output VoltageLowI OUT = 3.2mA (to V CC )0.20.4V V ROH TTL/CMOS Output VoltageHighI OUT = 1mA (to GND) 3.5V CC -0.2V I SCR Receiver Output ShortCircuit Current to GND to V CC2101030mA mA t dRPropagation Delay TimeC L = 150pF (Note 1)0.10.5µsST2024/10APPLICATION CIRCUITS (note 1, note 2)Note 1: C 1-4 capacitors can even be 1µF ones.Note 2: C 1-4 can be common or biased capacitors.CAPACITANCE VALUE (µF)C1C2.C3C4C50.10.10.10.10.1ST2025/10TYPICAL PERFORMANCE CHARACTERISTICS (unless otherwise specified T j = 25°C) Figure 1 : Driver Voltage Transfer CharacteristicsFigure 2 : Drive Short Circuit Output Current vs Temperature Figure 3 : Receiver Threshold vs Supply Voltage Figure 4 : Driver Output Capability Current vs Output VoltageFigure 5 : Driver Short Circuit Supply Current vs TemperatureFigure 6 : Receiver Threshold vs TemperatureInformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics© 2000 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - MoroccoSingapore - Spain - Sweden - Switzerland - United Kingdom© 10/10。
小度写范文博朗IRT6520中文说明书家用版模板
博朗IRT6520中文说明书家用版博朗irt6500/6520/6020中文说明书产品描述1——耳套(20个/盒)2——位置探测器3——测温头4——exactemp指示灯5——更换耳套按钮6——显示屏年龄选择及记忆功能按钮8——电源键9——测温键10——电池盖11——保护盒博朗耳温计适用于所有年龄人群的体温测量和监控。
仅供家庭使用。
注意事项:若出现未明原因的焦躁、呕吐、腹泻、脱水、食欲不振或活动不适、痉挛、肌肉疼痛、发抖、脖颈酸痛、排尿疼痛等症状,不管背景指示灯亮起何种颜色、被测温者是否发烧,均请咨询医生。
若耳温计显示温度升高(irt6520型号的背景指示灯变黄或变红),请咨询医生。
本产品工作环境的温度范围为:10-40℃(50-104℉)。
切勿将本产品暴露于极限温度(50℃/122℉),切勿置于过湿环境中(>95%rh)。
本产品必须与博朗耳温计配套的耳套(lf40)使用。
儿童在服用抗生素、止痛剂或退烧药的情况下,不应仅靠体温计读数来判定其病症严重程度。
耳温计指示的温度升高可能是病情严重的信号,尤其是出现在年老衰弱、免疫力低下者或婴幼儿身上时。
当出现温度升高或当您对下列人员进行测温时,请立即接受专业咨询。
①出生3个月以下的婴儿(若温度超过37.4℃或99.4℉,请立即咨询医生);②60岁以上的病人;③糖尿病患者或免疫力低下人群;④卧床病人;⑤器官移植者;⑥发烧的症状在老年病人身上较难甚至无法发现。
本产品包含小零件,或被儿童吞食引发窒息危险。
请将本产品置于儿童接触不到的地方。
博朗耳温计使用方法1、摘掉防护盖、按电源键内部自测时,显示屏显示全部过程。
最后一次测得的温度将在显示屏显示5秒钟。
3、如果有需要,耳套指示灯将闪烁。
为获得精确读数,请确保每次测量前换上新的或干净的耳套。
将耳温计探测头插入盒子中断耳套后拔出,新的耳套便戴在探测头上。
请注意:博朗耳温计戴上耳套才能工作。
4、利用agesmart年龄选择功能按钮选择年龄,如下图所示。
博朗IRT6520中文说明书家用版
博朗IRT6520中文说明书家用版尊敬的用户:欢迎您选择博朗 IRT6520 体温计,为了让您能更好地使用这款产品,为您和您的家人的健康提供准确的测量数据,我们为您准备了这份详细的中文说明书。
一、产品概述博朗 IRT6520 体温计是一款专为家庭使用设计的高性能电子体温计。
它采用了先进的红外测温技术,能够快速、准确地测量人体体温,为您的健康保驾护航。
二、产品特点1、快速测量只需将体温计对准额头,按下测量按钮,几秒钟内即可获得准确的体温读数。
2、高精度测量采用先进的传感器和算法,确保测量结果的准确性和可靠性。
3、多功能显示清晰的液晶显示屏,不仅显示体温数值,还能指示测量状态和电池电量。
4、记忆功能可存储最近一次的测量结果,方便您对比体温变化。
5、易于操作简洁的按键设计,操作方便,老人和小孩也能轻松使用。
三、产品组成1、体温计主体2、保护盖3、电池(已安装)4、使用说明书四、使用方法1、准备工作在使用前,请确保体温计电量充足。
如果电池电量不足,显示屏上的电池图标会闪烁。
2、测量体温(1)按下电源按钮,启动体温计。
(2)将体温计探头距离额头 3 5 厘米,确保探头与额头之间没有头发或其他障碍物遮挡。
(3)按下测量按钮,体温计会发出“哔哔”声,表示正在测量。
几秒钟后,测量完成,显示屏上会显示体温数值。
3、读取测量结果测量完成后,显示屏上会显示体温数值。
如果体温正常,显示屏会显示绿色;如果体温偏高,显示屏会显示红色。
4、存储测量结果体温计会自动存储最近一次的测量结果。
如果您需要查看之前的测量结果,只需连续按下测量按钮两次即可。
五、注意事项1、测量环境请在稳定的环境温度下进行测量,避免在温度变化较大的场所(如空调出风口、阳光直射处等)使用。
2、测量部位建议测量额头中央部位,以获得准确的测量结果。
3、测量距离请保持体温计探头与额头之间的距离在 3 5 厘米,过近或过远都会影响测量结果。
4、清洁与保养使用后,请用干净的软布轻轻擦拭体温计探头,避免使用湿布或浸泡在水中清洗。
ST意法半导体TDA7265数据手册
ST意法半导体TDA7265数据手册一、产品概述ST意法半导体TDA7265是一款高性能的音频功率放大器,适用于汽车音响、家用音响及各类音频设备。
本数据手册旨在为您提供TDA7265的详细技术参数、性能特点及应用指南,帮助您更好地了解和使用这款产品。
二、主要特性1. 高输出功率:最大输出功率可达60W(4Ω负载),满足大多数音频设备的功率需求。
2. 低失真度:在最大输出功率下,失真度小于0.1%,音质清晰,还原度高。
3. 宽电压范围:工作电压范围为8V32V,适应不同电压环境。
4. 短路保护:具备短路保护功能,有效防止因输出端短路导致的损坏。
5. 热保护:内置热保护电路,防止因过热导致的性能下降或损坏。
6. 封装形式:采用TO220封装,便于安装和散热。
三、引脚功能1. 引脚1(GND):接地端,与电源负极相连。
2. 引脚2(IN+):同相输入端,接收音频信号。
3. 引脚3(IN):反相输入端,接收音频信号。
4. 引脚4(VCC):电源输入端,接正电源。
5. 引脚5(OUT):功率输出端,连接扬声器。
四、典型应用电路[在此处插入TDA7265典型应用电路图]五、电气参数1. 静态功耗:在无信号输入的情况下,TDA7265的静态功耗极低,有助于延长设备的使用寿命和降低能耗。
2. 频率响应:TDA7265的频率响应范围宽,从20Hz到20kHz,能够覆盖人耳听觉范围,确保音质表现。
3. 输入阻抗:具有较高的输入阻抗,通常情况下不会对前级电路产生影响。
4. 输出阻抗:低输出阻抗,有利于驱动各种类型的扬声器。
六、安装与散热1. 安装:TDA7265采用TO220封装,安装时应确保引脚与电路板孔位对应,并使用适当的螺丝和绝缘材料固定。
2. 散热:为了确保TDA7265长时间稳定工作,建议在器件底部安装散热片。
散热片的尺寸和材质应根据实际应用环境选择,以实现最佳散热效果。
七、使用注意事项1. 电源去耦:为了减少电源噪声,建议在TDA7265的电源输入端(引脚4)和接地端(引脚1)之间并联一个100nF的陶瓷电容和一个10μF的电解电容。
常用稳压管参数
经常使用稳压二极管的参数规格-稳压二极管参数大
全之老阳三干创作
时间:二O二一年七月二十九日
[ 来源:不详 | 作者:佚名 | 时间:2008-3-27 1:17:23 | 浏览:今日:1 本周:24 本月:59 总数:118 ]
经常使用的稳压二极管经常使用的国产稳压二极管有2CW系列和2DW系列,经常使用的国产稳压二极管稳压二极管参数见表4-16和表4-17.
经常使用的进口稳压二极管有1N41××系列、1N46××系列、1N47××系列、
1N52××系列、1N59××系列、1N6××系列、1N700系列、1N900系列、MTZ系列、MTZJ系列、RLZ系列、RLZJ系列及HZ系列、RD 系列、05Z系列、PTZ系列、DTZ系列、,经常使用的进口稳压二极管参数见表4-18~表4-22.
时间:二O二一年七月二十九日。
NS4205 3W双声道D类音频功放用户手册说明书
Nsiway
4
NS4205
3W双声道D类音频功放
1 功能说明
NS4205 是一款无需滤波器、D 类双声道音频功放。NS4205 采用先进的技术,在全带宽范围内极大 地降低了 EMI 干扰,最大限度地减少对其他部件的影响。NS4205 无需滤波器的 PWM 调制结构及反馈电 阻内置方式减少了外部元件、PCB 面积和系统成本。NS4205 内置过流保护、过热保护及欠压保护功能, 有效地保护芯片在异常工作状况下不被损坏。并且利用扩频技术充分优化全新电路设计,高达 90%的效 率更加适合便携式音频产品。
9 NS4205 应用说明............................................................................................................................................ 12
NS4205
3W双声道D类音频功放
NS4205 用户手册 V1.1
深圳市纳芯威科技有限公司 2012 年 02 月
Nsiway
1
日期
版本
作者
修改历史
NS4205
3W双声道D类音频功放
修改说明
Nsiway
2
NS4205
双声道D类音频功放
目录
1 功能说明 ........................................................................................................................................................... 5
STMicroelectronics STN202XXXUXXX TVS 电压负荷压缩器说明书
STN202XXXUXXXTVS Diode array ESD suppressorProduct features• Low leakage current • Low clamping voltage• Solid-state silicon-avalanche technology • Meets moisture sensitivity level (MSL) 3•Molding compound flammability rating: UL 94V-0•Termination finish::Tin platingApplications• Power lines • DC Fast charging• Microprocessors based equipment • Notebooks, desktops, and servers • Cellular handsets and accessories •Portable electronics and peripheralsEnvironmental compliance and general specifications•IEC61000-4-2 (ESD)•Up to ±30 kV (air)•Up to ±30 kV (contact)•IEC61000-4-5 (Lightning) Up to 240 A (8/20 µs)Pb HALOGENHFFREEST N20 2 075 U 173FamilyPackage (N20- DFN2x2)Number of channels (2)Operating voltage (075- 7.5 V) Ordering part numberBi/Uni directional (U- Uni)Capacitance (173- 1700 pF)Pin out/functional diagram2Technical Data 11135Effective May 2021STN202XXXUXXX TVS Diode array ESD suppressor/electronicsParameterSymbolValueUnitSTN202075U173STN202120U952STN202150U952STN202240U752Peak pulse power dissipation on 8/20 μs waveform P pp 5000450045006000W ESD per IEC 61000-4-2 (Air)ESD per IEC 61000-4-2 (Contact)V ESD +/-30 +/-30+/-30 +/-30+/-30 +/-30+/-30 +/-30kVLead soldering temperature T L +260 (10 seconds)+260 (10 seconds)+260 (10 seconds)+260 (10 seconds)°C Operating junction temperature range T J -55 to +125-55 to +125-55 to +125-55 to +125°C Storage temperature rangeT STG-55 to +150-55 to +150-55 to +150-55 to +150°CElectrical characteristics (+25 °C)STN202075U173ParameterTest conditionMinimumTypicalMaximumSymbol (Units)Reverse working voltage ---7.5V RWM (V)Reverse breakdown voltage I T = 1 mA 8910V BR (V)Reverse leakage current V RWM = 7.5 V --1I R (μA)Clamping voltageI PP = 50 A, t p = 8/20 μs -1315.5V C (V)I PP = 100 A, t p = 8/20 μs -15.518.5V C (V)I PP = 240 A, t p = 8/20 μs-2125V C (V)Junction capacitanceV RWM = 0 V, f = 1 MHz160017002200C J (pF)STN202120U952ParameterTest condition Minimum Typical Maximum Symbol (Units)Reverse working voltage ---12V RWM (V)Reverse breakdown voltage I T = 1 mA 1314.516V BR (V)Reverse leakage current V RWM = 12 V --1I R (μA)Clamping voltageI PP = 50 A, t p = 8/20 μs --22V C (V)I PP = 100 A, t p = 8/20 μs --25V C (V)I PP = 180 A, t p = 8/20 μs--32V C (V)Junction capacitanceV RWM = 0 V, f = 1 MHz9009501200C J (pF)STN202150U952ParameterTest condition Minimum Typical Maximum Symbol (Units)Reverse working voltage ---15V RWM (V)Reverse breakdown voltage I T = 1 mA 1617.519V BR (V)Reverse leakage current V RWM = 15 V --1I R (μA)Clamping voltageI PP = 50 A, t p = 8/20 μs -2225V C (V)I PP = 100 A, t p = 8/20 μs -2527V C (V)I PP = 150 A, t p = 8/20 μs-2935V C (V)Junction capacitanceV RWM = 0 V, f = 1 MHz-9501200C J (pF)Absolute maximum ratings(+25 °C, RH=45%-75%, unless otherwise noted)3Technical Data 11135Effective May 2021STN202XXXUXXXTVS Diode array ESD suppressor /electronics STN202240U752ParameterTest condition Minimum Typical Maximum Symbol (Units)Reverse working voltage ---24V RWM (V)Reverse breakdown voltage I T = 1 mA 262730V BR (V)Reverse leakage current V RWM = 24 V --1I R (μA)Clamping voltageI PP = 50 A, t p = 8/20 μs -4550V C (V)I PP = 120 A, t p = 8/20 μs-5260V C (V)Junction capacitanceV RWM = 0 V, f = 1 MHz-750-C J (pF)Mechanical parameters, pad layout- mmDimension Minimum Typical MaximumA 0.510.550.60A10.000.020.05A3 0.15 REFb 0.250.300.35D 1.90 2.00 2.10E 1.90 2.00 2.10D20.85 1.00 1.10E2 1.35 1.50 1.60e 1.20 1.30 1.40H 0.200.250.30K 0.200.300.40L 0.350.400.45R0.15--Part markingLand pattern(STN202075U173)(STN202150U952)(STN202120U952)4Technical Data 11135Effective May 2021STN202XXXUXXX TVS Diode array ESD suppressor/electronicsPackaging information (mm)Drawing not to scale.Supplied in tape and reel packaging, 3,000 parts per 7” diameter reel (EIA-481 compliant)5Technical Data 11135Effective May 2021STN202XXXUXXXTVS Diode array ESD suppressor/electronics Pulse derating curve ESD waveformRatings and V-I characteristic curves(+25 °C unless otherwise noted)V- I curve characteristics (Uni-directional)Pulse waveform (8/20 µs)EatonElectronics Division 1000 Eaton Boulevard Cleveland, OH 44122United States/electronics © 2021 EatonAll Rights Reserved Printed in USAPublication No. 11135May 2021STN202XXXUXXX TVS Diode array ESD suppressorTechnical Data 11135Effective May 2021Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express writtenapproval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.Solder reflow profileT e m p e r a t u r eT LT PEaton is a registered trademark.All other trademarks are property of their respective owners.Follow us on social media to get the latest product and support information.Reference J-STD-020Profile featureStandard SnPb solderLead (Pb) free solderPreheat and soak • Temperature min. (T smin )100 °C 150 °C • Temperature max. (T smax )150 °C 200 °C • Time (T smin to T smax ) (t s )60-120 seconds 60-120 seconds Ramp up rate T L to T p 3 °C/ second max. 3 °C/ second max.Liquidous temperature (T l ) Time (t L ) maintained above T L183 °C60-150 seconds 217 °C60-150 seconds Peak package body temperature (T P )*Table 1Table 2Time (t p )* within 5 °C of the specified classification temperature (T c )20 seconds*30 seconds*Ramp-down rate (T p to T L ) 6 °C/ second max. 6 °C/ second max.Time 25 °C to peak temperature6 minutes max.8 minutes max.* Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum.Table 1 - Standard SnPb solder (T c )Package thicknessVolume mm3 <350Volume mm3 ≥350<2.5 mm 235 °C 220 °C ≥2.5 mm220 °C220 °CTable 2 - Lead (Pb) free solder (T c )Package thicknessVolume mm 3 <350Volume mm 3350 - 2000Volume mm 3 >2000<1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm250 °C245 °C245 °C。
2N65中文资料
Resistance (Normailized) RDS(ON), Drain-to-Source On (Ω)
VDS, Drain-to-Source Voltage (V)
司 VGS, Gate-to-Source Voltage (V)
Fig3: Normalized On-Resistance Vs.Temperature
■Electronic Characteristics(TC=25℃)
PARAMETER
SYMBOL
TEST CONDITION
2N65 Series
N-Channel MOSFET
MIN
TYP
MAX
UNIT
Drain-source Breakdown Voltage
BVDSS
VGS=0V, ID=250μA
1.4
MAX 2.84
Thermal Resistance Junction-ambient
(Notes):
① (Repetitiv:e rating: Pulse width limited by maximum junction temperature)
)
② (Starting T =25 ℃ , V DD =50V, L=56mH, R G =25Ω, I AS =2A )
650
V
Breakdown Voltage Temperature Coefficient
ΔBVDSS/ΔTj
ID=250uA Referenced to 25℃
0.6
V/℃
Gate Threshold Voltage
VGS(TH)
VGS=VDS ID=250μA
6520并网机组操作使用说明书
6520并网机组操作使用说明书前言本使用说明书是为用户提供安装、使用、保养、操作方法以及相关注意事项的通用性手册。
利用本手册需结合柴油机、交流发电机、高压负荷开关、机组控制器厂家提供的使用维护手册参照使用,以确保发电机组能长期地高效率运作。
操作与维护应由经过专业训练的人员进行,机组使用前应仔细阅读本手册,在对柴油发电机组有正确认识了解后方可操作使用。
随着产品的不断改进,本手册所涉及的内容也会相应增补与修改,请用户注意。
1 安全1.1. 安全警告本机组在设计和制造过程中充分考虑了安全因素和对人身健康的影响。
使用者在使用前必须认真阅读以下内容,并在操作过程中严格地遵守本手册规定的制度,以避免事故发生。
因不可能预计所有使用之环境,因此本手册所列举之事项亦非万全,请用户结合本单位实际在使用过程中适当增减规定条款。
凡因违章引起的安全事故和人身健康损伤,本公司概不负责。
发动机启动前所有的保护装置、特别是冷却风扇保护罩必须正确牢固安装。
在运转前所有的电器应检查是否联结牢固。
应保证所有地线接地良好可靠。
所有可以锁定的门和盖板在运转前应固定。
型零件或危及生命的电气设备,因此操作者必须经过适当的培训不要独自操作设备,以防万一发生意外时有人帮助处理。
如对设备内部进行清洁或修理,请将蓄电池负极线拆下并贴上警示标记,以防发动机意外启动,引起人身伤害。
1.2. 保护罩机组设有对运转零件保护的保护罩。
开机时在机组旁工作的人员必须小心注意各活动机械部分可能对人身产生的危险。
在风扇或其他保护罩拆开的情况下,切勿试图开机。
机组运转时,切勿试图将手伸入机组运转部位。
机组工作时,要穿上工作服,防止宽松衣服、手、长头发等绞入转动部位,防止油、水、气和机身烫伤人体。
不要在冷却液未完全冷却时拧开散热器盖。
待冷却液冷却后,先拧松盖子,让里面的气体先行释放,然后才能把盖拧开。
机组运行时,应将所有罩、盖与门板装妥以免发生事故。
1.3. 化学品在机组上使用的燃料、机油、冷却液体、润滑剂及蓄电池的电解液都是工业上常用的,然而使用处理不当亦会产生对人体的伤害。
2SC5200中文资料(ST)中文数据手册「EasyDatasheet - 矽搜」
高功率NPN外延平面双极型晶体管
特征
■ 高击穿电压V ■ 典型˚F T = 30兆赫
申请书
■ 音频功放
CEO = 230 V
描写
本设备采用新型位-LA(双极型晶体管线性放大器) 技术制造的NPN晶体管.由此产生的晶体管显示出良好的 增益线性特性.
内部示意图
2SC5200
参数
集电极基极电压(I 集电极 - 发射极电压(I 发射极基极电压(I
集电极电流
E = 0) B = 0)
C = 0)
集电极电流峰值
总功耗在T
储存温度
C = 25 °C
工作结温
表 3中 .
符
RthJC
热数据
参数 热阻结案件最大
2SC5200
Value 230 230 5 15 30 150 -55至150 150
Value 0.83
Unit V V V A A W °C °C
Unit °C/W
Doc ID 16310 Rev 1
芯片中文手册,看全文,戳
2SC5200
2
电气特性
Tcase = 25°C除非另有说明
表 4.
电气特性
符
参数
集电极截止电流
ICBO
(IE = 0)
发射极截止电流
I EBO
VCC = 60 V I C = 5A IB1= -I B2 = 0.5 A
IC = 1 A VCE = 5 V VCB = 10 V F = 1兆赫 ≤ 1.5%
Min. Typ. Max. Unit 5 µA
5 µA
230
V
V
3V 1.5 V 55 80 120 35
STTH25M06 高速恢复电源电路芯片说明书
STTH25M06B-TR STTH25M06FPDPAKTO220FPAC Features•Ultrafast recovery, soft recovery•Low power losses at high switching frequency operations•Low leakage current•High junction temperature•High overcurrent capability•ECOPACK2 compliantApplications•PFC•Boost diode•LLC clamping diodeDescriptionThe STTH25M06 is an ultrafast recovery power rectifier especially suited for boost or LLC clamping circuits working at high switching frequencies in heavy duty applications such as air conditioning equipment or telecom power supplies. Designed with the latest ST’s ultrafast technology, this 600 V 25 A diode in DPAK and TO-220FPAC has a robust behavior against electrostatic discharge and high overcurrent capability.600 V, 25 A ultrafast high voltage diodeSTTH25M06DatasheetSTTH25M06Characteristics 1CharacteristicsTable 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)Table 2. Thermal resistance parameterFor more information, please refer to the following application note :•AN5088 : Rectifiers thermal management, handling and mounting recommendationsTable 3. Static electrical characteristics1.Pulse test: t p = 5 ms, δ < 2%2.Pulse test: t p = 380 µs, δ < 2%To evaluate the conduction losses, use the following equation:P = 1.04 x I F(AV) + 0.0385 x I F2(RMS)For more information, please refer to the following application notes related to the power losses :•AN604: Calculation of conduction losses in a power rectifier•AN4058: Calculation of turn-off power losses generated by an ultrafast diodeSTTH25M06Characteristics Table 4. Dynamic electrical characteristicsSTTH25M06Characteristics (curves) 1.1Characteristics (curves)STTH25M06 Characteristics (curves)Figure 13. Relative variation of non-repetitive peak surgeforward current versus pulse duration (sinusoidalwaveform)1.01.52.02.53.0 3.54.00.11.010.0I FSM (t p ) / I FSM (10ms)t p (ms)Figure 14. Relative variation of non-repetitive peak surge forward current versus initial junction temperature(sinusoidal waveform)I FSM (T j ) / I FSM (25 °C)T j (°C)0.0 0.20.40.60.81.01.22550 75 100 125 150 175STTH25M06Characteristics (curves)2Package informationIn order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: . ECOPACK is an ST trademark.2.1DPAK package information•Epoxy meets UL 94,V0•Cooling method: by conduction (C)Figure 15. DPAK package outlineNote:This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.STTH25M06Package informationSTTH25M06DPAK package information Table 5. DPAK package mechanical dataFigure 16. DPAK recommended footprint (dimensions in mm)The device must be positioned within0.05AB2.2TO-220FPAC package information•Epoxy meets UL 94,V0•Cooling method: by conduction (C)•Recommended torque value: 0.55 N·m•Maximum torque value: 0.70 N·mFigure 17.TO-220FPAC package outlineSTTH25M06TO-220FPAC package informationTO-220FPAC package information Table 6. TO-220FPAC package mechanical dataOrdering information 3Ordering informationTable 7. Ordering informationRevision historyTable 8. Document revision historyIMPORTANT NOTICE – PLEASE READ CAREFULLYSTMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.No license, express or implied, to any intellectual property right is granted by ST herein.Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to /trademarks. All other product or service names are the property of their respective owners.Information in this document supersedes and replaces information previously supplied in any prior versions of this document.© 2020 STMicroelectronics – All rights reservedSTTH25M06B-TR STTH25M06FP。
ST STM6520 数据手册
January 2011Doc ID15953 Rev 61/23STM6520Dual push-buttonSmart Reset ™ with push-button controlled output delayFeatures■Dual Smart Reset™ push-button inputs, with user-selectable extended reset setup delay (by two-state input logic): t SRC = 6, 10 s (min.)■Push-button controlled reset pulse duration (no fixed nor minimum pulse width guaranteed)■No power-on reset■Dual reset outputs–RST1 - active-low, open-drain –RST2 - active-high, push-pull■Fixed Smart Reset™ input logic voltage levels ■Broad operating voltage range 1.65 V to 5.5 V, inactive reset output levels valid down to 1.0 V ■Low supply current 1.5 µA■Operating temperature: –30 °C to +85 °C ■TDFN8 package: 2 mm x 2 mm x 0.75 mm ■RoHS compliantApplications■Mobile phones, smartphones ■e-books ■MP3 players ■Games■Portable navigation devices■Any application that requires delayed reset push-button(s) response for improved system stabilityContents STM6520Contents1Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73.1Power supply (V CC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73.2Ground (V SS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73.3Smart Reset™ inputs (SR0, SR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73.4User-selectable Smart Reset™ delay (DSR) . . . . . . . . . . . . . . . . . . . . . . . 73.5Reset outputs (RST1, RST2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4Typical application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9Package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10Tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 12Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 13Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222/23Doc ID 15953 Rev 6STM6520List of tables List of tablesTable 1.Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 2.Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 3.Operating and measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 4.DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 5.TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm package mechanical data . . . . . . . . . . . . . . . . . 15 Table 6.Parameter for landing pattern - TDFN – 8-lead 2 x 2 mm package . . . . . . . . . . . . . . . . . . 16 Table 7.Carrier tape dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 8.Reel dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 9.Ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 10.Package marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 11.Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Doc ID 15953 Rev 63/23List of figures STM6520 List of figuresFigure 1.Logic diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2.Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3.Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4.RST1 output used for microcontroller reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5.RST2 used for interrupting system power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 6.Timing waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 7.Undervoltage condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 8.Supply current (I CC) vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 9.Smart Reset™ delay (t SRC) vs. temperature, DSR = V SS . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 10.AC testing input/output waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 11.TDFN - 8-lead, 2 x 2 mm package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure nding pattern - TDFN – 8-lead 2 x 2 mm without thermal pad . . . . . . . . . . . . . . . . . . . . 16 Figure 13.Carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 14.Reel dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 15.Tape trailer/leader. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 16.Pin 1 orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 17.Package marking area, top view. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4/23Doc ID 15953 Rev 6STM6520Description 1 DescriptionThe Smart Reset™ devices provide a useful feature that ensures inadvertent short resetpush-button closures do not cause system resets. This is done by implementing extendedSmart Reset™ input delay time (t SRC) and combined push-button inputs, which togetherensures a safe reset and eliminates the need for a specific dedicated reset button.This reset configuration provides versatility and allows the application to discriminatebetween a software generated interrupt and a hard system reset. When the input push-buttons are connected to microcontroller interrupt inputs, and are closed for a short time, theprocessor can only be interrupted. If the system still does not respond properly, continuingto keep the push-buttons closed for the extended setup time t SRC causes a hard reset of theprocessor through the reset outputs.The STM6520 has two combined delayed Smart Reset™ inputs (SR0, SR1) with two user-selectable delayed Smart Reset™ setup time (t SRC) options of 7.5 s and 12.5 s typ.,selected by a dual-state Smart Reset™ DSR input pin. When DSR is connected to ground,t SRC = 7.5 s, when connected to V CC, t SRC = 12.5 s (typ.). There are two reset outputs, bothgoing active simultaneously after both of the Smart Reset™ inputs were held active for theselected t SRC delay time. The outputs remain asserted until either or both inputs go toinactive logic level (for this device the output reset pulse duration is fully push-buttoncontrolled, meaning neither fixed nor minimum reset pulse width, nor power-on reset pulseis implemented). The first reset output, RST1, is active-low, open-drain; the second resetoutput, RST2, is active-high, push-pull. The device fully operates over a broad V CC range1.65 to 5.5 V. Below 1.575 V typ. the inputs are ignored and outputs are deasserted; thedeasserted reset output levels are then valid down to 1.0 V.Doc ID 15953 Rev 65/23Device overview STM65206/23Doc ID 15953 Rev 62 Device overviewTable 1.Signal namesSymbol Input/output DescriptionRST1Output First reset output, active-low, open-drain.RST2Output Second reset output, active-high, push-pull.SR0Input Primary push-button Smart Reset™ input. Active-low.SR1InputSecondary push-button Smart Reset™ input. Active-low.DSR InputA dual-state Smart Reset™ input delay selection pin. Whenconnected to ground, t SRC = 7.5 s; when connected to V CC ,t SRC = 12.5 s (typ.). DSR is a DC-type input, intended to be either permanently grounded or permanently connected to V CC .V CC Supply voltage Positive supply voltage for the device. A 0.1 µF decoupling ceramiccapacitor is recommended to be connected between V CC and V SSpins.V SS Supply ground GroundNCNo connect (not bonded; should be connected to V SS ).STM6520Pin descriptionsDoc ID 15953 Rev 67/233 Pin descriptions3.1Power supply (V CC )This pin is used to provide power to the Smart Reset ™ device. A 0.1 µF ceramic decouplingcapacitor is recommended to be connected between the V CC and V SS pins, as close to the STM6520 device as possible.3.2 Ground (V SS )This is the ground pin for the device.3.3 Smart Reset™ inputs (SR0, SR1)Push-button Smart Reset™ inputs, active-low. Both inputs need to be assertedsimultaneously for at least t SRC to activate the reset outputs.3.4 User-selectable Smart Reset™ delay (DSR)An input that allows the user to program the setup time (t SRC ) for which both the push-buttons need to be pressed to activate the reset outputs. Controlled by different voltage levels on the DSR pin: when connected to ground, t SRC = 7.5 s, when connected to V CC , t SRC = 12.5 s (typ.). DSR is a DC-type input, intended to be either permanently grounded or permanently connected to V CC .3.5 Reset outputs (RST1, RST2)RST1 is active-low, open-drain, RST2 active-high, push-pull. Neither fixed nor minimum output reset pulse duration, nor power-on reset is implemented. Releasing any of the push-buttons while reset outputs are active, causes both outputs to deassert.Typical application diagram STM6520 4 Typical application diagramRST1 output used for microcontroller reset1.DSR pin (pin 5) must be tied to V CC or V SS.2.When only one Smart Reset™ input is used, connect the unused one permanently to V SS.1.DSR pin (pin 5) must be tied to V CC or V SS.2.When only one Smart Reset™ input is used, connect the unused one permanently to V SS.8/23Doc ID 15953 Rev 6STM6520Typical application diagramNote:If undervoltage occurs (V CC drops below 1.575 V typ.) while reset outputs are active, both outputs are released and go inactive.Doc ID 15953 Rev 69/23Typical operating characteristics STM6520 5 Typical operating characteristics10/23Doc ID 15953 Rev 6STM6520Maximum ratingDoc ID 15953 Rev 611/236 Maximum ratingStressing the device above the rating listed in the “Absolute maximum ratings” table maycause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions forextended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.Table 2.Absolute maximum ratingsSymbol ParameterValue Unit T STG Storage temperature (V CC off)–55 to +150°C T SLD (1)1.Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.Lead solder temperature for 10 seconds 260°C θJA Thermal resistance (junction to ambient) TDFN8149.0°C/W V IO Input or output voltage –0.3 to 5.5(2)2.For RST2 –0.3 to V CC +0.3 V only.V V CC Supply voltage–0.3 to 7VESD V HBM Electrostatic discharge protection, human body model, all pins (JESD22-A114-B level 2)2kV V RCDM Electrostatic discharge protection, charged device model, all pins1kV V MMElectrostatic discharge protection, machine model, all pins (JESD22-A115-A level A)200VLatch-up (V CC pin, reset input pins)EIA/JESD78DC and AC parameters STM6520 7 DC and AC parametersThis section summarizes the operating measurement conditions, and the DC and ACcharacteristics of the device. The parameters in the DC and AC characteristics table thatfollow, are derived from tests performed under the Measurement Conditions summarized inT able3: Operating and measurement conditions. Designers should check that the operatingconditions in their circuit match the operating conditions when relying on the quotedparameters.Table 3.Operating and measurement conditionsParameter Value Unit V CC supply voltage 1.65 to 5.5VAmbient operating temperature (T A)–30 to +85°CInput rise and fall times≤5nsInput pulse voltages0.2 to 0.8 V CC VInput and output timing ref. voltages0.3 to 0.7 V CC V12/23Doc ID 15953 Rev 6STM6520DC and AC parameters1.Valid for ambient operating temperature: T A = –30 to +85 °C; V CC = 1.65 to 5.5 V (except where noted).2.Typical value is at 25 °C and V CC =3.3 V unless otherwise noted.3.Reset outputs are deasserted below 1.575 V typ. and remain deasserted down to V CC = 1 V.4.Input glitch immunity is equal to t SRC (when both SR inputs are low), otherwise infinite.Doc ID 15953 Rev 613/23Package mechanical data STM652014/23Doc ID 15953 Rev 68 Package mechanical dataIn order to meet environmental requirements, ST offers these devices in different grades ofECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: . ECOPACK ® is an ST trademark.STM6520Package mechanical dataDoc ID 15953 Rev 615/23Table 5.TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm package mechanical dataSymbolDimension (mm)Dimension (inches)Min.Nom.Max.Min.Nom.Max.A 0.700.750.800.0280.0300.031A10.000.020.050.0000.0010.002b 0.150.200.250.0060.0080.010D BSC 1.9 2.00 2.10.0750.0790.083E BSC 1.92.00 2.10.0750.0790.083e 0.500.020L0.450.550.650.0180.0220.026Package footprint STM652016/23Doc ID 15953 Rev 69 Package footprintTable 6.Parameter for landing pattern - TDFN – 8-lead 2 x 2 mm packageParameter DescriptionDimension (mm)Min.Nom.Max.L Contact length 1.05— 1.15b Contact width0.25—0.30E Max. land pattern Y -direction — 2.85—E1Contact gap spacing —0.65—D Max. land pattern X-direction — 1.75—PContact pitch—0.5—STM6520Tape and reel informationDoc ID 15953 Rev 617/2310 Tape and reel informationTable 7.Carrier tape dimensionsPackageW D EP 0P 2FA 0B 0K 0P 1T UnitBulk qty.TDFN88.00+0.30–0.101.50+0.10/–0.001.75±0.10 4.00±0.102.00±0.103.50±0.052.30±0.052.30±0.051.00±0.054.00±0.100.250±0.05mm 3000Tape and reel information STM6520Table 8.Reel dimensionsTape sizes A max. B min.C D min.N min.G T max.8 mm180 (7 inches) 1.5013.0 +/– 0.2020.20608.4 +2/–014.40 18/23Doc ID 15953 Rev 6STM6520Tape and reel informationNote:1Drawings are not to scale.2All dimensions are in mm, unless otherwise noted.Doc ID 15953 Rev 619/23Ordering information STM652020/23Doc ID 15953 Rev 611 Ordering informationFor other options, voltage threshold values etc. or for more information on any aspect of this device, please contact the ST sales office nearest you.Table 9.Ordering information schemeExample:STM6520AQRRDG9FDevice type STM6520Reset (V CC monitoring threshold) voltage V RST A = no V CC monitoring featureSmart Reset™ setup delay (t SRC )Q = 7.5 or 12.5 s typ., user-selected (two-state);input comparator on SR0, SR1, no input pull-upsOutputs typeR = RST1 active-low, open-drain, no pull-up; RST2 active-high, push-pullReset pulse timeout period (t REC )R = push-button controlled (no defined t REC , no power-on reset)PackageDG = TDFN8 2 x 2 x 0.75 mm, 0.5 mm pitchTemperature range 9 = –30 °C to +85 °CShipping methodF = ECOP ACK ® package, tape and reelSTM6520Package marking information Doc ID 15953 Rev 621/2312 Package marking informationTable 10.Package markingPart number PackageTopmark STM6520AQRRDG9F TDFN8 2 x 2 x 0.75 mm, 0.5 mm pitchDRM STM6520AQRRDG9FTDFN8 2 x 2 x 0.75 mm, 0.5 mm pitch ERMRevision history STM652022/23Doc ID 15953 Rev 613 Revision historyTable 11.Document revision history DateRevision Changes 08-Jul-20091Initial release.20-Oct-20092Document reformatted, updated Section 1: Description ,Table 1, Figure 4, Figure 5, Table 4, renamed Section 2:Device overview , added Section 5: T ypical operatingcharacteristics , updated supply voltage range in T able 4.20-Jan-20103Updated Section 1: Description , T able 1.06-May-20104Updated title, Features , Applications , T able 5.31-May-20105Replaced “smart reset” by “Smart Reset™”, updatedApplications , Section 1, Section 3.1, Section 3.5, Figure 4,Figure 5, T able 2, T able 4, T able 6 and Table 10.06-Jan-20116Updated I CC - supply voltage in T able 4.STM6520Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2011 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of AmericaDoc ID 15953 Rev 623/23。
博科6520光纤交换机6520-switch-ds
DATA CENTERDATA SHEET BROCADE 6520SWITCHHIGHLIGHTS• Provides high scalability in an ultra-dense 96-port switch to support highly virtualized, private cloud storage and data center consolidation • Enables “pay-as-you-grow” flexibility from 48 to 96 ports using Ports on Demand (PoD) capabilities with speeds up to 16 Gbps • Provides up to eight in-flight encryption and compression ports, delivering data center-to-data center security and bandwidth savings • Optimizes link and bandwidth utilization with Brocade ISL Trunking and Dynamic Path Selection (DPS)• Helps maximize application uptime and performance while reducing overall operational expenses with D_Ports • Accelerates deployment and troubleshooting with Dynamic Fabric Provisioning (DFP), monitoring, and advanced diagnostics • Simplifies and centralizes management through Brocade Network Advisor,reducing operational costs and complexity Scalable Enterprise-ClassSAN Switch for Highly Virtualized, Cloud EnvironmentsTo meet dynamic and growing business demands, data centers are evolving into highly virtualized environments and cloud-based architectures. This approach enables organizations to consolidate and simplify their IT resources, resulting in increased business agility and lower capital and operating expenses. However, enterprise data centers must keep pace with the changes driven by increasingly virtualized workloads and storage resources. Selecting the right network is therefore key to realizing the full benefits of these cloud-based architectures. By treating the network as a strategic part of a highly virtualized environment, organizations can increase optimization and efficiency even as they rapidly scale their environments.Today, Brocade ® Fibre Channel switches are the de facto storage networking standard for mission-critical workloads and highly virtualized environments. Based on years of successful deployment in enterprise data centers around the globe, Brocade Fibre Channel SANs provide highly resilient, scalable, and simplified network infrastructure for storage.The Brocade 6520 Switch meets thedemands of growing, dynamic workloadsand private cloud storage environments by delivering market-leading Gen 5 Fibre Channel (16 Gbps) technology and capabilities. The Brocade 6520 is a high-density, purpose-built, foundational building block for large and growing Storage Area Network (SAN) infrastructures.Gen 5 Fibre Channel (16 Gbps) is the purpose-built, data center-proven network infrastructure for storage, delivering unmatched performance, reliability, and simplicity. The Brocade 6520 with Gen 5 Fibre Channel unleashes the full potential of high-density server virtualization, cloud architectures, and next-generation storage.It provides industry-leading scalability, reliability, and performance in a flexible, easy-to-deploy enterprise-class switch,enabling greater data center consolidation, operational efficiency, and business continuity. In addition to increased throughput, it helps improve bandwidth utilization, security, and network visibility and management through in-flight data compression and encryption and advanced diagnostics. It’s an ideal switch for bandwidth-intensive workloads, evolving virtualized data centers, and private cloud architectures.EXCEPTIONAL SCALABILITY FOR DEMANDING WORKLOADS AND DATA CENTER CONSOLIDATIONThe Brocade 6520 features 96 Fibre Channel ports in a 2U form factor, delivering industry-leading port density and space utilization for data center consolidation. Designed for maximum flexibility, this enterprise-class switch offers “pay-as-you-grow” scalability with Ports on Demand (PoD). Organizations can quickly, easily, andcost-effectively scale from 48 to 96 ports in 24-port increments, each supporting 2, 4, 8, 10, or 16 Gbps. In addition, flexible,high-speed 16 Gbps and 8 Gbps optics allow organizations to deploy bandwidth on demand to meet growing data center needs. Formaximum flexibility, the switch also features dual-direction airflow options to support the latest hot aisle/cold aisle configurations.ENTERPRISE-CLASS RELIABILITY, AVAILABILITY, AND SERVICEABILITYThe Brocade 6520 leverages proven enterprise-class Gen 5 Fibre Channeltechnology to deliver unmatched reliability to support non-stop operations for mission-critical workloads. It features advancedmonitoring, diagnostics, and RAS capabilities to maximize availability, optimize performance, and simplify administration. These enterprise-class features include:• Critical diagnostic and monitoringcapabilities to help ensure early problem detection and recovery • Non-intrusive and non-disruptive monitoring on every port to provide a comprehensive end-to-end view of the entire fabric • Forward Error Correction (FEC) to recover from bit errors on links, enhancingtransmission reliability and performance • Additional buffers to overcomeperformance degradation and congestion due to buffer credit loss • Monitoring of real-time bandwidth consumption by hosts/applications on Inter-Switch Links (ISLs) to easily identify hot spots and potential network congestionINDUSTRY-LEADING PERFORMANCE FOR GROWING WORKLOADSThe Brocade 6520 delivers exceptional performance for growing and dynamic workloads through a combination ofmarket-leading throughput and bandwidth utilization. With the unpredictability of virtualized workloads and cloud services, throughput becomes critical to ensuring that the network does not become the bottleneck. With 96 ports, the Brocade 6520 provides an aggregate 1536 Gbps full-duplexthroughput. Up to eight ISLs can be combined together in a 128 Gbps framed-based trunk. In addition, exchange-based Dynamic Path Selection (DPS) optimizes fabric-wide performance and load balancing by automatically routing data to the mostefficient, available path in the fabric (see Figure 1). This augments Brocade ISL Trunking to provide more effective load balancing in certain configurations.Moreover, the enterprise-class capabilities of this switch yield 40 percent higher performance compared to 10 GigabitEthernet (GbE) alternatives at a similar cost.SIMPLIFIED DEPLOYMENT AND CENTRALIZED MANAGEMENTAutomating and simplifying SAN management enables data centers to quickly adapt to change and overcome disruptions in a private cloud infrastructure. Brocade 6520 advanced diagnostics, monitoring, and management reduce end-to-end SAN management complexity and costs.The Brocade 6520 helps reduce operating costs through simplified server provisioning and change management, advanced cable and optics diagnostics, and comprehensive management. Several technologies support these capabilities, including:• Dynamic Fabric Provisioning (DFP): Combines Brocade switch and adapter technology to reduce or eliminate the need to reconfigure zoning and Logical Unit Number (LUN) masking when adding or replacing servers.• Diagnostic Ports (D_Ports): Help identify and isolate optics and cable problems, reducing fabric deployment and diagnostic times.• Brocade Network Advisor: Provides comprehensive management of data center fabrics, including configuration, monitoring, and management of Brocade backbones, switches, and adapters.Dynamic Path Selection (DPS)Balancing data flow between Up toUp to Frame-based Trunking...n GbpsFigure 1.Dynamic Path Selection (DPS) augments Brocade ISL Trunking to route dataefficiently between multiple trunk groups.A BUILDING BLOCK FOR VIRTUALIZED, PRIVATE CLOUD STORAGEThe Brocade 6520 provides a critical building block for today’s highly virtualized, private cloud storage environments. It simplifies server virtualization and Virtual Desktop Infrastructure (VDI) management while meeting the high-throughput demands of Solid State Disks (SSDs). The Brocade 6520 also supports multitenancy in cloud environments through Virtual Fabrics, Quality of Service (QoS), and fabric-based zoning features.The Brocade 6520 enables secure metro extension to virtual private or hybrid clouds with 10 Gbps Dense Wavelength Division Multiplexing (DWDM) link support, as well as in-flight encryption and data compression to optimize bandwidth and minimize the risk of unauthorized access. With four times more in-flight encryption and compression ports than the Brocade 6510 Switch, the Brocade 6520 supports higher data volumes over long distance. The switch also features on-board data security and acceleration, minimizing the need for separate acceleration appliances to support distance extension. Internalfault-tolerant and enterprise-class RASfeatures help minimize downtime to supportmission-critical cloud environments.BROCADE GLOBAL SERVICESBrocade Global Services has the expertiseto help organizations build scalable,efficient cloud infrastructures. Leveraging15 years of expertise in storage, networking,and virtualization, Brocade Global Servicesdelivers world-class professional services,technical support, network monitoringservices, and education, enablingorganizations to maximize their Brocadeinvestments, accelerate new technologydeployments, and optimize the performanceof networking infrastructures.MAXIMIZING INVESTMENTSTo help optimize technology investments,Brocade and its partners offer completesolutions that include professional services,technical support, and education. Formore information, contact a Brocade salespartner or visit .ACCELERATING FABRIC DEPLOYMENTWITH DIAGNOSTIC PORTSDiagnostic Ports (D_Ports) are a port typethat enables administrators to quicklyidentify and isolate optics and cableproblems, reducing fabric deploymentand diagnostic times. Organizationsalso can use D_Ports to run a variety oftests through Brocade Network Advisoror Command Line Interface (CLI) to testports, SFPs, and cables for faults, latency,and distance.SIMPLIFYING SERVER DEPLOYMENTWITH DYNAMIC FABRIC PROVISIONINGDynamic Fabric Provisioning (DFP)allows organizations to eliminate fabricreconfiguration when adding or replacingservers through the virtualization of hostWorld Wide Names (WWNs). It combinesBrocade switch and adapter technologyto reduce or eliminate the need tomodify zoning or Logical Unit Number(LUN) masking when replacing a server(or an HBA). In addition, DFP enablespre-provisioning of virtual WWNs, helpingorganizations eliminate time-consumingsteps when deploying new equipment.configurations (24-port increments throughPorts on Demand [PoD] licenses);E, F, M, D, EX portsScalability Full fabric architecture with a maximum of239 switchesCertified maximum6000 active nodes; 56 switches, 19 hopsin Brocade Fabric OS® fabrics; larger fabricscertified as requiredPerformance Fibre Channel: 2.125 Gbps line speed,full duplex; 4.25 Gbps line speed, full duplex;8.5 Gbps line speed, full duplex; 10.53 Gbpsline speed, full duplex; 14.025 Gbps linespeed, full duplex; auto-sensing of 2, 4, 8, and16 Gbps port speeds; 10 Gbps and optionallyprogrammable to fixed port speedISL trunking Frame-based Trunking with up to eight16 Gbps ports per ISL trunk; up to 128 Gbpsper ISL trunk. Exchange-based load balancingacross ISLs with DPS included in BrocadeFabric OS.Aggregate bandwidth1536 Gbps: 96 ports × 16 Gbps data rate Fabric latency Latency for locally switched ports is 700 ns;latency between port groups is 2.1 μsec,cut-through routing at 16 Gbps betweenlocally switched groups.Encryption/compression is 5.5 μsec per node;Forward Error Correction (FEC) adds 400 nsbetween E_Ports (enabled by default). Maximum frame size2112 byte payloadFrame buffers8192 dynamically allocatedClasses of service Class 2, Class 3, Class F (inter-switch frames)Port types D_Port (Diagnostic Port), E_Port, EX_Port, F_Port,M_Port (Mirror Port); optional port type control Data traffic types Fabric switches supporting unicastMedia types16 Gbps: Brocade 6520 requires Brocadehot-pluggable SFP+, LC connector; 16 GbpsSWL, LWL, ELWL10 Gbps: Brocade 6520 requires Brocadehot-pluggable SFP+, LC connector; 10 GbpsSWL, LWL8 Gbps: Brocade 6520 requires Brocade hot-pluggable SFP+, LC connector; 8 Gbps SWL,LWL, ELWLFibre Channel distance subject to fiber-opticcable and port speedUSB One USB port for system log file downloads orfirmware upgradesFabric services Brocade Advanced Performance Monitoring(APM) (including Top Talkers for E_Ports,F_Ports, and Fabric mode); Brocade AdaptiveNetworking (Ingress Rate Limiting, TrafficIsolation, QoS); Bottleneck Detection; BrocadeAdvanced Zoning (default zoning, port/WWNzoning, broadcast zoning); Dynamic FabricProvisioning (DFP); Dynamic Path Selection (DPS);Brocade Extended Fabrics; Enhanced BB creditrecovery; Enhanced Group Management (EGM);Brocade Fabric Watch; FDMI; Frame Redirection;Frame-based Trunking; FSPF; IntegratedRouting; IPoFC; Brocade ISL Trunking;Management Server; NPIV; NTP v3; Port Fencing;Registered State Change Notification (RSCN);Reliable Commit Service (RCS); Server ApplicationOptimization (SAO); Simple Name Server (SNS);Virtual Fabrics (Logical Switch, Logical Fabric)DATA SHEET© 2013 Brocade Communications Systems, Inc. All Rights Reserved. 01/13 GA-DS-1722-00ADX, AnyIO, Brocade, Brocade Assurance, the B-wing symbol, DCX, Fabric OS, ICX, MLX, MyBrocade, OpenScript, VCS, VDX, and Vyatta are registered trademarks, and HyperEdge, The Effortless Network, and The On-Demand Data Center are trademarks of Brocade Communications Systems, Inc., in the United States and/or in other countries. Other brands, products, or service names mentioned may be trademarks of their respective owners.Notice: This document is for informational purposes only and does not set forth any warranty, expressed or implied, concerning any equipment, equipment feature, or service offered or to be offered by Brocade. Brocade reserves the right to make changes to this document at any time, without notice, and assumes no responsibility for its use. This informational document describes features that may not be currently available. Contact a Brocade sales office for information on feature and product availability. Export of technical data contained in this document may require an export license from the United States government.Corporate Headquarters San Jose, CA USA T: +1-408-333-8000info@ European Headquarters Geneva, Switzerland T: +41-22-799-56-40 emea-info@ Asia Pacific Headquarters SingaporeT: +65-6538-4700apac-info@BROCADE 6520 SPECIFICATIONS (CONTINUED)ExtensionFibre Channel, in-flight compression(Brocade LZO) and encryption (AES-GCM-256); integrated optional 10 Gbps Fibre Channel for Back-to-front airflow; power from back, 2USizeWidth: 429.25 mm (16.90 in.)Height: 86.74 mm (3.42 in.)Depth: 609.75 mm (24.01 in.)System weight16.92 kg (37.3 lb) with two power supply FRUs, without transceiversFor information about supported SAN standards, visit /sanstandards .For information about switch and device interoperability, visit /interoperability .For information about hardware regulatory compliance, visit /regulatorycompliance.with integrated system cooling fans AC input85 V to 264 V ~5 A to 2.5 A Input line frequency 47 Hz to 63 HzPower consumption450 W with all 96 ports populated with 16 Gbps SWL optics350 W for empty chassis with no optics。
三星多范围转换器说明书
Connections:
3RS1725-2FW00 Page 1/4
08/01/2014
subject to modifications © Copyright Siemens AG 2014
Design of the electrical connection Type of the connectable conductor cross-sections
other
Declaration of Conformity
0 ... 10 V, 0 ... 20 mA, 4 ... 20 mA
% % %/°C ms ms mV
0.1 0.02 0.015 10 30 5
snap-on mounting on 35 mm DIN rail according to DIN EN 50022
• solid • finely stranded / with wire end processing • for AWG conductors
• stranded
Galvanic isolation: Design of the electrical isolation Galvanic isolation
Inputs: Limit frequency Input voltage / maximum Input voltage / typical
Outputs: Burden / at the current output / maximum Burden / at the voltage output / maximum Characteristic feature of the output / short-circuit protected Overvoltage strength / at the current output / maximum Type of signal
ST ST-LINK V2 数据手册
For further information contact your local STMicroelectronics sales office.May 2012Doc ID 018751 Rev 21/3ST-LINK/V2ST -LINK/V2 in-circuit debugger/programmer for STM8 and STM32Data briefFeatures■ 5 V power supplied by a USB connector ■USB 2.0 full speed compatible interface ■USB standard A to mini B cable■SWIM specific features– 1.65 V to 5.5 V application voltage supported on SWIM interface–SWIM low-speed and high-speed modes supported–SWIM programming speed rate: 9.7 Kbytes/s in low speed and 12.8 Kbytes/s in high speed–SWIM cable for connection to the application via an ERNI standardvertical connector (ref: 284697 or 214017) or horizontal connector (ref: 214012)–SWIM cable for connection to theapplication via a pin header or a 2.54 mm pitch connector ■JTAG/serial wire debugging (SWD) specific features– 1.65 V to 3.6 V application voltagesupported on the JTAG/SWD interface and 5 V tolerant inputs–JTAG cable for connection to a standard JTAG 20-pin pitch 2.54 mm connector –JTAG supported–SWD and serial wire viewer (SWV) communication supported ■Direct firmware update feature supported (DFU)■Status LED which blinks during communication with the PC■Operating temperature 0 to 50 °CDescriptionThe ST -LINK/V2 is an in-circuit debugger and programmer for the STM8 and STM32microcontroller families. The single wire interface module (SWIM) and JTAG/serial wire debugging (SWD) interfaces are used to communicate with any STM8 or STM32 microcontroller located on an application board.STM8 applications use the USB full speed interface to communicate withSTMicroelectronic’s ST Visual Develop (STVD) or ST Visual Program (STVP) software.STM32 applications use the USB full speedinterface to communicate with Atollic, IAR, Keil or TASKING integrated development environments.Table 1.Device summaryOrder code ReferenceST -LINK/V2ST -LINK incircuit debugger andprogrammer for the STM8 and STM32Revision history ST-LINK/V22/3Doc ID 018751 Rev 21 Revision historyTable 2.Document revision historyDate RevisionChanges21-Apr-20111Initial release.07-May-20122Added SWD to JTAG connection featuresST-LINK/V2Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OT HERWISE SET FORT H IN ST’S T ERMS AND CONDIT IONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANT Y WIT H RESPECT T O T HE USE AND/OR SALE OF ST PRODUCT S INCLUDING WIT HOUT LIMIT AT ION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRIT ING BY T WO AUT HORIZED ST REPRESENT AT IVES, ST PRODUCT S ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2012 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of AmericaDoc ID 018751 Rev 23/3。
纳尔森Type CLT自调节加热电缆说明书
• A standard option UV stabilized polyolefin over jacket is available to cover the braid for wet applications.
-29 (-20) 65 (205) 85 (275) 90 (290) 90 (290) 125 (415) 170 (550) 175 (580) 175 (580) 175 (580)
10 (50) 70 (220) 70 (225) 70 (225) 70 (225) 135 (445) 135 (450) 135 (450) 135 (450) 135 (450)
Operating Principle
• The parallel bus wires apply voltage along the entire length of the heater cable.
• The conductive core provides an infinite number of parallel conductive paths permitting the cable to be cut to any length in the field with no dead or cold zones developing.
Accessories
• Nelson PLT and AX Series Connection Kits for Power, Splice, Tee Splice, Powered Splices and End Terminations
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ST 2N6520
PNP Silicon Epitaxial Planar Transistor for switching and AF amplifier applications. On special request, these transistors can be manufactured in different pin confLECTRONICS LTD.
(Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724)
TO-92 Plastic Package Weight approx. 0.19g
Absolute Maximum Ratings (Ta = 25OC) Symbol Collector Base Voltage Collector Emitter Voltage Emitter Base Voltage Collector Current Base Current Power Dissipation Junction Temperature Storage Temperature Range -VCBO -VCEO -VEBO -IC -IB Ptot Tj TS Value 350 350 5 500 250 625 150 -55 to +150 Unit V V V mA mA mW
®
Dated : 07/12/2002
元器件交易网
ST 2N6520
Characteristics at Tamb=25 OC Symbol DC Current Gain at -VCE=10V, -IC=1mA at -VCE=10V, -IC=10mA at -VCE=10V, -IC=30mA at -VCE=10V, -IC=50mA at -VCE=10V, -IC=100mA Collector Base Breakdown Voltage at -IC=100μA Collector Emitter Breakdown Voltage at -IC=1mA Emitter Base Breakdown Voltage at -IE=10μA Collector Cutoff Current at -VCB=250V Emitter Cutoff Current at -VEB=4V Collector Base Capacitance at -VCB=20V, f=1MHz Emitter Base Capacitance at –VEB=0.5V, f=1MHz Base Emitter Saturation Voltage at -IC=10mA, -IB=1mA at -IC=20mA, -IB=2mA at -IC=30mA, -IB=3mA Collector Emitter Saturation Voltage at -IC=10mA, -IB=1mA at -IC=20mA, -IB=2mA at -IC=30mA, -IB=3mA at -IC=50mA, -IB=5mA Base Emitter On Voltage at -VCE=10V, -IC=100mA Current Gain Bandwidth Product at -VCE=20V, -IC=10mA, f=20MHz Turn On Time at -VBE(off)=2V, -VCC=100V -IC=50mA, -IB1=10mA Turn Off Time at -VCC=100V, -IC=50mA, -IB1=-IB2=10mA hFE hFE hFE hFE hFE -BVCBO -BVCEO -BVEBO -ICBO -IEBO Ccb Ceb -VBE(sat) -VBE(sat) -VBE(sat) -VCE(sat) -VCE(sat) -VCE(sat) -VCE(sat) -VBE(on) fT Min. 20 30 30 20 15 350 350 5 40 Typ. Max. 200 200 50 50 6 100 0.75 0.85 0.9 0.3 0.35 0.5 1 2 200 Unit V V V nA nA pF pF V V V V V V V V MHz
®
Dated : 07/12/2002
ton toff
-
-
200 3.5
ns ns
SEMTECH ELECTRONICS LTD.
(Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724)