NBB-310中文资料

capacitor, suitable for the frequency of operation, should be used in
most applications. DC coupling of the input is not allowed, because this
will override the internal feedback loop and cause temperature instabil-
RF Micro Devices, Inc.
Tel (336) 664 1233
7628 Thorndike Road
Fax (336) 664 0454
Greensboro, NC 27409, USA

4-17
元器件交易网
NBB-310
Parameter
Overall
Small Signal Power Gain, S21
Gain Flatness, GF Input and Output VSWR
Bandwidth, BW Output Power @
-1dB Compression, P1dB
Noise Figure, NF Third Order Intercept, IP3 Reverse Isolation, S12 Device Voltage, VD Gain Temperature Coefficient,
• Gain Stage or Driver Amplifiers for MWRadio/Optical Designs (PTP/PMP/ LMDS/UNII/VSAT/WLAN/Cellular/DWDM)
Product Description
The NBB-310 cascadable broadband InGaP/GaAs MMIC amplifier is a low-cost, high-performance solution for general purpose RF and microwave amplification needs. This 50Ω gain block is based on a reliable HBT proprietary MMIC design, providing unsurpassed performance for small-signal applications. Designed with an external bias resistor, the NBB-310 provides flexibility and stability. The NBB-310 is packaged in a low-cost, surface-mount ceramic package, providing ease of assembly for highvolume tape-and-reel requirements. It is available in either packaged or chip (NBB-310-D) form, where its gold metallization is ideal for hybrid circuit designs.
9.0
10.0
±0.6
1.4:1
1.75:1
2.0:1
12.0
13.8
15.2
14.5
12.0
4.9
+24.0
-17
4.6
5.0
5.3
-0.0015
85 139 >1,000,000
216
Unit
dB dB dB dB dB
GHz
dBm dBm dBm dBm dB dBm dB
V dB/°C
Condition
4
GND
Same as pin 2.
Rev A5 030912
4-19
元器件交易网
NBB-310
Typical Bias Configuration
Application notes related to biasing circuit, device footprint, and thermal considerations are available on request.
NBB-310-D
NBB-310 Chip Form (100 pieces minimum order)
NBB-310-E
Fully Assembled Evaluation Board
NBB-X-K1
Extended Frequency InGaP Amp Designer’s Tool Kit
f = 2.0 GHz f = 6.0 GHz f = 8.0 GHz f = 12.0 GHz f = 3.0 GHz f = 2.0 GHz f=0.1GHz to 12.0GHz
°C °C hours
°C/W
J---T-----–----T----C---A---S---EVD ⋅ ICC
=
θJC(°C ⁄ Watt)
RF IN 1
ห้องสมุดไป่ตู้
3 RF OUT
2 GND
Functional Block Diagram Rev A5 030912
Ordering Information
NBB-310
Cascadable Broadband GaAs MMIC Amplifier DC to
12 GHz
NBB-310-T1 or -T3Tape & Reel, 1000 or 3000 Pieces (respectively)
δGT/δT
MTTF versus Temperature @ ICC=50mA
Case Temperature Junction Temperature MTTF
Thermal Resistance
θJC
Specification
Min.
Typ.
Max.
12.5
13.0
12.0
12.5
11.0
11.5
°C
Storage Temperature
-65 to +150
°C
Exceeding any one or a combination of these limits may cause permanent damage.
Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s).
VCC
RCC
1 In
C block
4
L choke
Si Bi-CMOS
9InGaP/HBT
SiGe HBT GaN HEMT
Si CMOS SiGe Bi-CMOS
GND 4
MARKING - N6
Package Style: Micro-X, 4-Pin, Ceramic
Features • Reliable, Low-Cost HBT Design • 13dB Gain • High P1dB of +15.2dBm at 6GHz • Single Power Supply Operation • 50Ω I/O Matched for High Freq. Use
45°
UNITS: Inches (mm)
0.040 (1.02)
0.070 (1.78)
0.020 0.200 sq. (5.08)
N6
0.055 (1.40)
0.005 (0.13)
Optimum Technology Matching® Applied
Si BJT
GaAs HBT
GaAs MESFET
resistor and choke inductor to VCC. The resistor is selected to set the
DC current into this pin to a desired level. The resistor value is deter-
mined by the following equation:
Absolute Maximum Ratings
Parameter
Rating
Unit
RF Input Power
+20
dBm
Power Dissipation
350
mW
Device Current
70
mA
Channel Temperature
200
°C
Operating Temperature
-45 to +85
VD=+5V, ICC=50mA, Z0=50Ω, TA=+25°C f=0.1GHz to 1.0GHz f=1.0GHz to 4.0GHz f=4.0GHz to 8.0GHz f=8.0GHz to 12.0GHz f=0.1GHz to 8.0GHz f=0.1GHz to 7.0GHz f=7.0GHz to 10.0GHz f=10.0GHz to 12.0GHz BW3 (3dB)