LTC2309CUF#PBF;LTC2309IUF#PBF;LTC2309HF#PBF;LTC2309CUF#TRPBF;LTC2309CF#PBF;中文规格书,Datasheet资料

合集下载

LTC2941 LTC2942 电池气体计测试电路说明书

DC1496A-A1dc1496fD ESCRIPTION Battery Gas Gauge with I 2C Interface [and 14-Bit ADC(DC1496A-B)]Demonstration circuit 1496A-A (Figure 1) features the L TC ®2941. Demonstration circuit 1496A-B features the L TC2942. Both devices measure battery charge state in handheld PC and portable product applications. The operating range is perfectly suited for single cell Li-Ion batteries. A precision analog coulomb counter integrates current through a sense resistor between the battery’s positive terminal and the load or charger . The L TC2942 adds battery voltage and on-chip temperature measurement with an internal 14-bit No Latency ΔΣ™ ADC. The three measured quantities (charge, voltage and temperature) are stored in internal registers accessible via the onboard SMBus/I 2C interface.The L TC2941 has programmable high and low thresholds for accumulated charge. The L TC2942 has programmable high and low thresholds for all three measured quantities. If a programmed threshold is exceeded, the device reports an alert using either the SMBus alert protocol or by setting a ﬂ ag in the internal status register .L , L T , L TC, L TM, Linear Technology and the Linear logo are registered trademarks and No Latency ΔΣ is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners.The L TC2941 and L TC2942 require only a single low value sense resistor to set the measured current range. The default value assembled on the DC1496 is 100mΩ for a maximum current measurement of 500mA. Both parts have a software-conﬁ gurable charge complete/alert pin. When the pin is set for charge complete, a jumper con-nects the pushbutton which simulates a logic high input to indicate a full battery. When the pin is conﬁ gured for alert, the same jumper is used to connect a red LED that indicates an alert is present.The DC1496A-A/B is a part of the QuikEval system for quick evaluation with a host controller through a PC.Design ﬁ les for this circuit board are available at http://www.linear.com/demo.Figure 1. DC1496A-A/B2dc1496fDEMO MANUAL DC1496A-A/B QUICK START PROCEDUREDemonstration circuit 1496A is easy to set up to evaluate the performance of the L TC2941/L TC2942. Refer to Figure 2 for proper measurement equipment setup and follow the procedure below.1. C onnect a 1-cell Li-I on battery across V_BAT and GND.2. Connect a load across V_CHRG/LD and GND for battery discharge measurement. Up to 500mA supplied from the battery can be measured with the board default 100mΩ sense resistor . Use SENSE + and SENSE – test points to read voltage across the sense resistor .3. Connect a 2.7V to 5.5V battery charger supply across V_CHRG/LD and GND. Up to 500mA supplied to the battery can be measured with the board default 100mΩ sense resistor . Use SENSE + and SENSE – test points to read voltage across the sense resistor .4. Connect a DC590 to 14-pin connector J1 for evaluation with QuikEval, or connect a host controller I 2C bus to the SDA, SCL and GND test turrets.5. Set JP1 to QuikEval if a DC590 is present. Otherwise set JP1 to Bat/Chrg for bus pull-up to the battery, or ﬂ oat JP1 and supply a bus pull-up voltage to VP .6. Read and write to the L TC2941/L TC2942 through I 2C.7. Through I 2C, configure the AL /CC pin. Set JP2 accordingly.8 f AL /CC is set for charge complete, use pushbutton switch S1 to simulate a logic high from a controller to indicate a fully charged battery.Figure 2. DC1496A-A/B Basic Setup3dc1496fDEMO MANUAL DC1496A-A/BQuikEval INTERFACEThe DC1496A-A/B can be connected to a DC590 and used with the QuikEval software. The DC590 connects to a PC through USB. QuikEval automatically detects the demo board and brings up the L TC2941/L TC2942 evaluation software interface (Figure 3). Compact and Detailed FormWhen the interface is brought up, a compact form is ﬁ rst shown with a display for the accumulated charge register (ACR), voltage ADC and temperature ADC. To expand the form for a more detailed display of the L TC2941/L TC2942 registers and board conﬁ gurations, click on Detail. To go back to the compact form, click on Hide.Start/RefreshClick on Start to begin a polling routine that refreshes the interface every 1 second. Click on Stop to halt the poll-ing. For a single update, click on Refresh. Each refresh scans through the internal I 2C registers and updates the respective displays.L TC2941 and L TC2942 DisplayOn a refresh or poll, the software reads Status bit A[7] to determine communication with an L TC2941 or L TC2942. When an L TC2941 is detected, the voltage and temperature ADC and threshold displays are not shown. Control bits B[7:6] conﬁ gure VBAT Alert for the L TC2941 and ADC Mode for the L TC2942.ACR DisplayThe data in the ACR (registers C and D) is displayed in one of three selected formats: Counter in coulombs, Counter in mA • hour , battery gas gauge in mA • hour , and battery gas gauge in charge percentage of battery. The two gas gauge displays correspond to the battery gas gauge full battery conﬁ guration set in the detailed form.Voltage and Temperature ADC (L TC2942)Data from the Voltage ADC (registers I and J) and the Temperature ADC (registers M and N) is displayed here in Volts and Celsius.Figure 3. L TC2941/LTC2942 QuikEval InterfaceDEMO MANUAL DC1496A-A/B QuikEval INTERFACEAddress/I2C StatusThe write address for the L TC2941/L TC2942 is C8h and the read address is C9h. The alert response address (ARA) is 19h. If an error occurs while reading from the L TC2941/ L TC2942, the I2C status will read as an error. Otherwise, the status is good. If the L TC2941/L TC2942 AL/CC pin is set for alert mode and an alert has been latched, the device will pull down this pin. Click on ARA to send out an ARA on to the bus lines and the device will respond with its address. The Alert pin will then be cleared if the alert is no longer present.StatusThe individual status bits A[0:7] and their states are shown here. A red indicator next to bits A[0:5] indicates the re-spective alert is currently present and will latch the Alert pin if conﬁ gured for alert. Bit A[7] shows if an L TC2941 or L TC2942 is detected.Sense ResistorEnter here the sense resistor value used in the application. The default for the DC1496A-A/B is a 100mΩ sense resis-tor. Check L TC2941-1/L TC2942-1 if one of these devices is used in place of the default IC. This sets the sense resistor value to 50mΩ, the value of the internal sense resistor in these devices. The sense resistor can only be changed when not polling. The software only accepts sense resis-tors between 0.1mΩ to 5Ω.Battery Gas GaugeThe battery capacity in the application is entered here. The ACR full scale (FFFFh) is set to this value and affects the two Gas Gauge ACR display options. Instead of counting up from 0 as in the Coulomb Counters, the Gas Gauge is used to count down from a full battery. The battery capacity can only be entered when not polling. The data in the ACR when a battery should be empty is calculated based off of R SENSE, and pre-scaler M, and displayed in hexadecimal below the ACR full scale.ControlConﬁ gurations done in the Control section write to the Control register (register B). For the L TC2941, the Control bits B[7:6] enables a battery monitor to one of three set voltage thresholds (2.8V, 2.9V, or 3V) or disables this battery voltage alert. The ADC mode with the L TC2942 is default to Sleep where both Voltage and Temperature ADCs (L TC2942) are disabled. Setting ADC Mode to Automatic Mode enables full-time the Voltage and Temperature ADC. Selecting Manual Voltage or Temperature mode enables the respective ADC once and returns the ADC to Sleep mode.Select a pre-scaler M value to scale the ACR according to battery capacity and maximum current. Changing the pre-scaler will halt the poll. A calculator tool is provided in the tool bar under Tools to assist in calculating a pre-scaler value and sense resistor (Figure 4).The AL#/CC pin can be conﬁ gured for Alert mode, Charge Complete mode, or disabled. Select the corresponding settings on the DC1496A-A/B jumper J2.The Shutdown Analog Section is checked to disable the Analog portion of the L TC2941/42 and set the device in a low current state.Register Read/WriteData in the internal registers of the L TC2941/L TC2942 is displayed here in hexadecimal or appropriate units. Data can also be entered and written to the write registers. Enter data to be written in hexadecimal, or select Unit and enter data in decimal form. Data in decimal scale is auto corrected if the maximum or minimum full scale is exceeded. Select the ACR display in Counter (Coulombs) to be able to write to the ACR and charge thresholds in Coulombs, or select Counter (mAh) to be able to write to the ACR and charge thresholds in mA • hour. Voltage and Temperature High thresholds are rounded down in the calculations to the nearest lower count, while the low thresholds are rounded up to nearest higher count.4dc1496f5dc1496fDEMO MANUAL DC1496A-A/BSwitching back and forth between Hex and Unit can be used as a conversion tool.The LSB value for the 16-bit ACR and charge thresholds is displayed on the bottom. This value is adjusted with the sense resistor and pre-scaler M. The units are in mAh or mC depending on the selected ACR display. Shown for the L TC2942 is the LSB for the 14-bit voltage ADC, 10-bit temperature ADC, and 8-bit high and low thresholds for voltage and temperature.Calculator ToolA calculator tool is available in the tool bar options under Tools. In this calculator (Figure 4), enter the maximum cur-rent passed through the sense and the maximum battery capacity. Click on Calculate to calculate a recommended sense resistor and pre-scaler (M) value. The display shows the battery capacity in comparison to ACR full scale and provides an LSB value in mAh. Also shown is the recom-mended equation to use to determine an appropriate sense resistor as a function of the maximum battery charge and maximum current.Figure 4. L TC2941/L TC2942 Pre-Scaler and Sense Resistor CalculatorQuikEval INTERFACEDEMO MANUAL DC1496A-A/BPARTS LISTITEM QTY REFERENCE PART DESCRIPTION MANUFACTURE/PART NUMBER12C1, C2CAP., CHIP X7R, 0.1μF, 25V, 0603AVX, 06033C104KAT2A24E1-E4TURRET, Test Point 0.094"MILL-MAX, 2501-2-00-80-00-00-07-035E5-E9TURRET, Test Point 0.064"MILL-MAX, 2308-241E10, E11TURRET, Test Point 0.037"MILL-MAX, 2309-150TP1, TP2(SMT Pads Only)62JP1, JP2HEADER, 3Pin 1 Row 0.079CC SAMTEC, TMM-103-02-L-S72for (JP1, JP2)SHUNT, 0.079" Center SAMTEC, 2SN-BK-G81J1HEADERS, Vertical Dual 2X7 0.079CC MOLEX, 87831-142091D1LED, RED, LIGHT EMITTING DIODES PANASONIC, LN1251CTR101R1RES., CHIP, 0.1Ω, 1/8W, 1%, 1206IRC, LRC-LR1206LF-01-R100-F113R6, R7, R8RES., CHIP, 5.10k, 1%, 0603VISHAY, CRCW06035K10FKEA123R2, R3, R4RES., CHIP, 10k, 5%, 0603VISHAY, CRCW060310K0JNEA131R5RES., CHIP, 1k, 5%, 0603VISHAY, CRCW06031K00JNEA141R9RES., CHIP, 100k, 5%, 0603VISHAY, CRCW0603100KJNEA151S1SWITCH, SMT Pushbutton PANASONIC, EVQPE105K161U2I.C., Serial EEPROM TSSOP8MICROCHIP, 24LC025-I/ST171for (J1)CABLE ASSY., 8" STRIP LINEAR RIBBON CABLE CA-24406dc1496f7dc1496fDEMO MANUAL DC1496A-A/BSCHEMATIC DIAGRAM8dc1496fDEMO MANUAL DC1496A-A/B Silkscreen TopComponent SideInner Layer 2PCB LAYOUT AND FILM9dc1496fDEMO MANUAL DC1496A-A/BI nformation furnished by Linear Technology Corporation is believed to be accurate and reliable. However , no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.PCB LAYOUT AND FILMInner Layer 3Solder SideSilkScreen Bottom10dc1496f DEMO MANUAL DC1496A-A/BLinear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear .com © LINEAR TECHNOLOGY CORPORA TION 2010LT 0510 • PRINTED IN USADEMONSTRATION BOARD IMPORTANT NOTICELinear Technology Corporation (L TC) provides the enclosed product(s) under the following AS IS conditions:This demonstration board (DEMO BOARD) kit being sold or provided by Linear Technology is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONL Y and is not provided by L TC for commercial use. As such, the DEMO BOARD herein may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including but not limited to product safety measures typically found in finished commercial goods. As a prototype, this product does not fall within the scope of the European Union direc-tive on electromagnetic compatibility and therefore may or may not meet the technical requirements of the directive, or other regulations.If this evaluation kit does not meet the specifications recited in the DEMO BOARD manual the kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY THE SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THIS INDEMNITY, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT , SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.The user assumes all responsibility and liability for proper and safe handling of the goods. Further , the user releases L TC from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge. Also be aware that the products herein may not be regulatory compliant or agency certified (FCC, UL, CE, etc.).No License is granted under any patent right or other intellectual property whatsoever. L TC assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or any other intellectual property rights of any kind.L TC currently services a variety of customers for products around the world, and therefore this transaction is not exclusive .Please read the DEMO BOARD manual prior to handling the product . Persons handling this product must have electronics training and observe good laboratory practice standards. Common sense is encouraged .This notice contains important safety information about temperatures and voltages. For further safety concerns, please contact a L TC applica-tion engineer .Mailing Address:Linear Technology1630 McCarthy Blvd.Milpitas, CA 95035Copyright © 2004, Linear Technology CorporationDC1496A-A。

LTC2309中文资料

L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
12-Bit Resolution Low Power: 1.5mW at 1ksps, 35μW Sleep Mode 14ksps Throughput Rate Low Noise: SNR = 73.4dB Guaranteed No Missing Codes Single 5V Supply 2-wire I2C Compatible Serial Interface with Nine Addresses Plus One Global for Synchronization Fast Conversion Time: 1.3μs Internal Reference Internal 8-Channel Multiplexer Internal Conversion Clock Unipolar or Bipolar Input Ranges (Software Selectable) 24-Pin 4mm × 4mm QFN Package
l
The l denotes the speciﬁcations which apply over the full operating temperature range, otherwise speciﬁcations are at TA = 25°C. (Notes 4, 5)
MIN 12 TYP ±0.45 ±0.35 ±1 0.002 ±0.1 ±0.4 0.002 ±0.2 ±0.5 ±0.4 0.05 ±0.4 ±0.4 ±0.3 0.05 ±0.3 MAX ±1 ±1 ±8 ±3 ±6 ±1 ±10 ±9 ±3 ±10 ±6 ±2 UNITS Bits LSB LSB LSB LSB/°C LSB LSB LSB/°C LSB LSB LSB LSB/°C LSB LSB LSB LSB/°C LSB

LTC4306IUFD-DC906A-用户手册说明书

QUICK START GUIDE FOR DEMONSTRATION CIRCUIT 906A4-CHANNEL, 2-WIRE BUS MULTIPLEXER WITH CAPACITANCE BUFFERINGLTC4306IUFDDESCRIPTIONDemonstration circuit 906A features the LTC ®4306IUFD, a 4-channel, 2-wire I2C bus and SMBus compatible multiplexer having bus buffers that provide capacitive isolation between the up-stream bus and downstream buses. Through soft-ware control, the LTC4306IUFD connects the up-stream 2-wire bus to any desired combination of downstream buses. Each bus can be pulled up to a supply voltage ranging from 2.2V to 5.5V, independ-ent of the LTC4306IUFD supply voltage. The down-stream buses are also provided with ALERT1B – ALERT4B inputs for fault reporting.Programmable timeout circuitry disconnects the downstream buses if the bus is stuck low. When acti-vated, rise time accelerators source currents into the 2-wire bus pins during rising edges to reduce rise time. Two general purpose input/output (GPIO) pins can be configured as inputs, open-drain outputs or push-pull outputs. Green LED’s D3 and D2 light up when GPIO1 and GPIO2, respectively, are low. Driv-ing the ENABLE pin low restores all device features totheir default states. Three address pins provide 27 distinct addresses.Design files for this circuit board are available. Call the LTC factory.LTC is a registered trademark of Linear Technology CorporationTable 1. Performance Summary (T A = 25°C)PARAMETERCONDITION VALUE V CC Voltage Operating Range2.7V – 5.5V Bus Pull-up Supply Voltage Range (V BUS1-V BUS4) 2.2V – 5.5V 2-Wire Bus Frequency Range0 - 400kHzBus Stuck Low Disconnect TimesV CC = 2.7V - 5.5V7.5ms, 15ms, 30ms optionsall times +/-16.7% feature can also be disabledBus Buffer V OL Offset Voltage R BUS = 10K 100mV (maximum) V CC = 3.3V 5.5mA (typical) Rise Time Accelerator Pull-up Current V CC = 5V9mA (typical) ALERTB and READY Output V OL VoltagesV CC = 2.7V - 5.5V; I ALERTB = I READY = 3mA0.4V (maximum)OPERATING PRINCIPLESFor operation with the DC906A, connect the host con-troller’s SDA and SCL pins to the LTC4306IUFD’s SDAIN and SCLIN pins (hereafter referred to as the upstream bus), and connect the upstream bus supply of 2.7V to 5.5V to Vcc (as shown in Figure 1). The host controller on the upstream side first addresses and configures the LTC4306IUFD to connect the up-stream bus to one or more of the four downstreambuses. Communications between the upstream and downstream components are then established and a host controller on any bus can then control the LTC4306IUFD.Use turrets VBUS1-VBUS4 and jumpers JP1-JP4 to pull up the downstream buses to supply voltages dif-ferent than VCC (i.e., to provide level-shifting). Forexample, in Figure1, JP1 is set to the right position and a supply voltage is connected between VBUS1 and ground. Voltages on VBUS1-VBUS4 must range between 2.2V and 5.5V. To connect a downstream bus’s pull-up supply to VCC, set its jumper to the left position.Additional configurations include enabling and dis-abling the rise time accelerators on the backplane side and/or the card side, setting the GPIO’s to open-drain output, push-pull output, or input mode, setting or resetting the GPIO’s outputs, disabling the Bus Stuck Low disconnect feature or setting the discon-nect time to 7.5ms, 15ms, 30ms. A host controller can also read the internal registers of the LTC4306IUFD to determine the settings of these fea-tures as well as fault statuses. All of these features are accessed by sending commands on the 2-wire bus.The ENABLE pin, when pulled low, resets the LTC4306IUFD to its registers default state and dis-ables communication to it. Communication can be reestablished when ENABLE is released high. There-fore, set jumper JP5 to the left position for normal operation, and set it to the right position to disable the LTC4306IUFD.Slave devices that are capable of fault reporting and that are located on downstream buses 1-4 should connect their fault pins to ALERT1B-ALERT4B, re-spectively. The LTC4306IUFD passes downstream faults to the upstream host by pulling down on the ALERTB pin, so this host’s fault input should be con-nected to the LTC4306IUFD ALERTB pin.When the upstream bus is connected to one or more downstream buses, the READY pin voltage is pulled up to VCC. When the upstream bus is disconnected from all downstream buses, the READY voltage is low (~0.2V).On the DC906A, the board’s default setting for jump-ers JP6, JP7 and JP8 is the center position, which sets the address of the LTC4306IUFD to (1001 010)2. To set a different address, configure the jumpers ac-cording to Table 1 of the data sheet (note: left posi-tion = H, middle position = NC, right position = L; de-fault = NC for all three jumpers).QUICK START PROCEDUREDemonstration circuit 906A is easy to set up to evalu-ate the performance of the LTC4306IUFD. Refer toFigure 1 for proper measurement equipment setup and follow the procedure below:KEY NOTES: a. Do not activate rise time acceleratorson buses whose pull-up supply voltages are lower than VCC. b. Make sure logic low voltages forced onall clock and data pins are < 0.4V. c. When activatingmultiple downstream buses that are powered from separate supply voltages, make sure that theLTC4306IUFD’s VCC voltage is less than or equal tothe lowest downstream bus pull-up supply voltage. 1.Jumpers JP1-JP4 choose the pull-up supply volt-ages VBUS1 – VBUS4 for downstream buses 1-4.For unused buses and buses pulled up to VCC, set the jumpers in the left position. To pull up a down-stream bus to a different voltage than VCC, set itsjumper to the right position, and connect the sup-ply voltage to the appropriate turret on the left side of the board.2.Set jumper J5 in the left position to enable communication to the LTC4306IUFD.3.Configure jumpers JP6 – JP8 to set the desired 2-wire bus address for the LTC4306IUFD according to Table 1 on page 13 of the datasheet (note: left position = H, middle position = NC, right position = L; default = NC for all three jumpers).4.Connect a cable from 6-pin header J2 to a board containing the master device(s).5.Connect a 20-pin ribbon cable from J1 to a board that contains downstream slave devices. Note: the downstream buses can contain masters, but the original command to connect must come from amaster connected to the upstream SDAIN/SCLIN bus.6. Connect power supplies to VCC and, if required,one or more of VBUS1 – VBUS4.7. Turn on the power supplies.NOTE: Make sure that the power supply voltages donot exceed 5.5V.8. Use the SMBus Read Byte and Write Byte proto-cols in conjunction with the register definitions on pages 8 and 9 of the datasheet to experiment with the LTC4306IUFD’s features and to establish up-stream-downstream communications between the master and slave devices.Figure 1.Proper Measurement Equipment Setup。

LTC4213 1 4213f 电子电路保护器说明书

2µs/DIV4213 TA01b124213fBias Supply Voltage (V CC )...........................–0.3V to 9V Input VoltagesON, SENSEP, SENSEN.............................–0.3V to 9V I SEL ..........................................–0.3V to (V CC + 0.3V)Output VoltagesGATE .....................................................–0.3V to 15V READY.....................................................–0.3V to 9V Operating Temperature RangeLTC4213C ...............................................0°C to 70°C LTC4213I.............................................–40°C to 85°C Storage Temperature Range.................–65°C to 150°C Lead Temperature (Soldering, 10sec)...................300°CORDER PART NUMBER DDB PART*MARKING T JMAX = 125°C, θJA = 250°C/WEXPOSED PAD (PIN 9)PCB CONNECTION OPTIONALConsult LTC Marketing for parts specified with wider operating temperature ranges.*The temperature grade is identified by a label on the shipping container.LBHVLTC4213CDDB LTC4213IDDB ABSOLUTE AXI U RATI GSW W WU PACKAGE/ORDER I FOR ATIOUUW (Note 1)ELECTRICAL CHARACTERISTICSThe ● denotes the specifications which apply over the full operatingtemperature range, otherwise specifications are at T A = 25°C. V CC = 5V, I SEL = 0 unless otherwise noted. (Note 2)SYMBOL PARAMETER CONDITIONSMIN TYP MAX UNITSV CC Bias Supply Voltage ● 2.36V V SENSEP SENSEP Voltage ●06V I CC V CC Supply Current●1.63mA V CC(UVLR)V CC Undervoltage Lockout Release V CC Rising● 1.8 2.07 2.23V ∆V CC(UVHYST)V CC Undervoltage Lockout Hysteresis ●30100160mV I SENSEP SENSEP Input Current V SENSEP = V SENSEN = 5V, Normal Mode 154080µA V SENSEP = V SENSEN = 0, Normal Mode –1±15µA I SENSENSENSEN Input CurrentV SENSEP = V SENSEN = 5V, Normal Mode 154080µA V SENSEP = V SENSEN = 0, Normal Mode –1±15µA V SENSEP = V SENSEN = 5V,50280µAReset Mode or Fault ModeV CBCircuit Breaker Trip Voltage I SEL = 0, V SENSEP = V CC●22.52527.5mV V CB = V SENSEP – V SENSEN I SEL = Floated, V SENSEP = V CC ●455055mV I SEL = V CC, V SENSEP = V CC ●90100110mV V CB(FAST)Fast Circuit Breaker Trip Voltage I SEL = 0, V SENSEP = V CC●63100115mV V CB(FAST)= V SENSEP – V SENSEN I SEL = Floated, V SENSEP = V CC ●126175200mV I SEL = V CC, V SENSEP = V CC ●252325371mV I GATE(UP)GATE Pin Pull Up Current V GATE = 0V●–50–100–150µA I GATE(DN)GATE Pin Pull Down Current ∆V SENSEP – V SENSEN = 200mV, V GATE = 8V ●1040mA ∆V GSMAX External N-Channel Gate Drive V SENSEN = 0, V CC ≥ 2.97V, I GATE = –1µA ● 4.8 6.58V V SENSEN = 0, V CC = 2.3V, I GATE = –1µA ● 2.65 4.38V ∆V GSARMV GS Voltage to Arm Circuit BreakerV SENSEN = 0, V CC ≥ 2.97V ● 4.4 5.47.6V V SENSEN = 0, V CC = 2.3V●2.53.57VTOP VIEWDDB PACKAGE8-LEAD (3mm × 2mm) PLASTIC DFN567894321READY ON I SEL GND V CC SENSEP SENSEN GATE34213f∆V GSMAX – ∆V GSARM Difference Between ∆V GSMAX and V SENSEN = 0, V CC ≥ 2.97V ●0.3 1.1V ∆V GSARMV SENSEN = 0, V CC = 2.3V●0.150.8VV READY(OL)READY Pin Output Low Voltage I READY = 1.6mA, Pull Down Device On ●0.20.4V I READY(LEAK)READY Pin Leakage Current V READY = 5V, Pull Down Device Off ●0±1µA V ON(TH)ON Pin High Threshold ON Rising, GATE Pulls Up ●0.760.80.84V ∆V ON(HYST)ON Pin Hysteresis ON Falling, GATE Pulls Down104090mV V ON(RST)ON Pin Reset Threshold ON Falling, Fault Reset, GATE Pull Down ●0.360.40.44V I ON(IN)ON Pin Input Current V ON = 1.2V●0±1µA ∆V OV Overvoltage Threshold ●0.410.7 1.1V ∆V OV = V SENSEP – V CCt OVOvervoltage Protection Trip Time V SENSEP = V SENSEN = Step 5V to 6.2V 2565160µs t FAULT(SLOW)V CB Trips to GATE Discharging ∆V SENSE Step 0mV to 50mV,●71627µs V SENSEN Falling, V CC = V SENSEP = 5V t FAULT(FAST)V CB(FAST) Trips to GATE Discharging ∆V SENSE Step 0V to 0.3V, V SENSEN Falling,●12.5µs V SENSEP = 5Vt DEBOUNCE Startup De-Bounce Time V ON = 0V to 2V Step to Gate Rising,2760130µs (Exiting Reset Mode)t READY READY Delay Time V GATE = 0V to 8V Step to READY Rising,2250115µs V SENSEP = V SENSEN = 0t OFF Turn-Off Time V ON = 2V to 0.6V Step to GATE Discharging 1.5510µs t ON Turn-On Time V ON = 0.6V to 2V Step to GATE Rising,4816µs (Normal Mode)t RESETReset TimeV ON Step 2V to 0V2080150µsNote 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.ELECTRICAL CHARACTERISTICSThe ● denotes the specifications which apply over the full operatingtemperature range, otherwise specifications are at T A = 25°C. V CC = 5V, I SEL = 0 unless otherwise noted. (Note 2)SYMBOLPARAMETERCONDITIONSMIN TYP MAX UNITSNote 2: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to ground unless otherwise specified.4564213ft RESET vs Temperaturet FAULT(SLOW) vs V CCt FAULT(SLOW) vs Temperaturet FAULT(FAST) vs V CCt FAULT(FAST) vs TemperatureTYPICAL PERFOR A CE CHARACTERISTICSU WSpecifications are at T A = 25°C. V CC = 5Vunless otherwise noted.t F A U L T (F A S T ) (µs )4213 G230.90.80.71.01.11.21.3TEMPERATURE (°C)–50050100125–252575BIAS SUPPLY VOLTAGE (V)2.010t F A U L T (S L O W ) (µs )14121618 3.0 4.0 5.0 6.04213 G202022 2.53.54.55.5TEMPERATURE (°C)–500501001254213 G21–25257510t F A U L T (S L O W ) (µs )141216182022TEMPERATURE (°C)–500501001254213 G19–252575t R E S E T (µs )60708090100BIAS SUPPLY VOLTAGE (V)2.0t F A U L T (F A S T ) (µs )3.04.05.06.04213 G222.53.54.55.50.90.80.71.01.11.21.374213fPI FU CTIO SU U UREADY (Pin 1): READY Status Output. Open drain output that goes high impedance when the external MOSFET is on and the circuit breaker is armed. Otherwise this pin pulls low.ON (Pin 2): ON Control Input. The LTC4213 is in reset mode when the ON pin is below 0.4V. When the ON pin increases above 0.8V, the device starts up and the GATE pulls up with a 100µA current source. When the ON pin drops below 0.76V, the GATE pulls down. To reset a circuit breaker fault, the ON pin must go below 0.4V.I SEL (Pin 3): Threshold Select Input. With the I SEL pin grounded, float or tied to V CC the V CB is set to 25mV, 50mV or 100mV, respectively. The corresponding V CB(FAST)values are 100mV, 175mV and 325mV.GND (Pin 4): Device Ground.GATE (P in 5): GATE D rive Output. An internal charge pump supplies 100µA pull-up current to the gate of the external N-channel MOSFET. Internal circuitry limits thevoltage between the GATE and SENSEN pins to a safe gate drive voltage of less than 8V. When the circuit breaker trips, the GATE pin abruptly pulls to GND.SENSEN (Pin 6): Circuit Breaker Negative Sense Input.Connect this pin to the source of the external MOSFET.During reset or fault mode, the SENSEN pin discharges the output to ground with 280µA.SENSEP (P in 7): Circuit Breaker Positive Sense Input.Connect this pin to the drain of external N-channel MOSFET.The circuit breaker trips when the voltage across SENSEP and SENSEN exceeds V CB . The input common mode range of the circuit breaker is from ground to V CC + 0.2V when V CC < 2.5V. For V CC ≥ 2.5V, the input common mode range is from ground to V CC + 0.4V.V CC (Pin 8): Bias Supply Voltage Input. Normal operation is between 2.3V and 6V. An internal under-voltage lockout circuit disables the device when V CC < 2.07V.Exposed Pad (Pin 9): Exposed pad may be left open or connected to device ground.8910114213fsupply transient dips below 1.97V of less than 80µs are ignored.ON FunctionWhen V ON is below comparator COMP1’s threshold of 0.4V for 80µs, the device resets. The system leaves reset mode if the ON pin rises above comparator COMP2’s threshold of 0.8V and the UVLO condition is met. Leaving reset mode, the GATE pin starts up after a t DEBOUNCE delay of 60µs. When ON goes below 0.76V, the GATE shuts off after a 5µs glitch filter delay. The output is discharged by the external load when V ON is in between 0.4V to 0.8V. At this state, the ON pin can re-enable the GATE if V ON exceeds 0.8V for more than 8µs. Alternatively, the device resets if the ON pin is brought below 0.4V for 80µs. Once reset, the GATE pin restarts only after the t DEBOUNCE 60µs delay at V ON rising above 0.8V. To protect the ON pin from overvoltage stress due to supply transients, a series resistor of greater than 10k is recommended when the ON pin is connected directly to the supply. An external resis-tive divider at the ON pin can be used with COMP2 to set a supply undervoltage lockout value higher than the inter-nal UVLO circuit. An RC filter can be implemented at the ON pin to increase the powerup delay time beyond the internal 60µs delay.Gate FunctionThe GATE pin is held low in reset mode. 60µs after leaving reset mode, the GATE pin is charged up by an internal 100µA current source. The circuit breaker arms when V GATE > V SENSEN + ∆V GSARM . In normal mode operation,the GATE peak voltage is internally clamped to ∆V GSMAX above the SENSEN pin. When the circuit breaker trips, an internal MOSFET shorts the GATE pin to GND, turning off the external MOSFET.READY StatusThe READY pin is held low during reset and at startup. It is pulled high by an external pullup resistor 50µs after the circuit breaker arms. The READY pin pulls low if the circuit breaker trips or the ON pin is pulled below 0.76V, or V CC drops below undervoltage lockout.∆V GSARM and V GSMAXEach MOSFET has a recommended V GS drive voltage where the channel is deemed fully enhanced and R DSON is minimized. Driving beyond this recommended V GS volt-age yields a marginal decrease in R DSON . At startup, the gate voltage starts at ground potential. The GATE ramps past the MOSFET threshold and the load current begins to flow. When V GS exceeds ∆V GSARM , the circuit breaker is armed and enabled. The chosen MOSFET should have a recommended minimum V GS drive level that is lower than ∆V GSARM . Finally, V GS reaches a maximum at ∆V GSMAX.Trip and Reset Circuit BreakerFigure 2 shows the timing diagram of V GATE and V READY after a fault condition. A tripped circuit breaker can be reset either by cycling the V CC bias supply below UVLO thresh-old or pulling ON below 0.4V for >t RESET . Figure 3 shows the timing diagram for a tripped circuit breaker being reset by the ON pin.Calculating Current LimitThe fault current limit is determined by the R DSON of the MOSFET and the circuit breaker voltage V CB .I V R LIMIT CB DSON=()2The R DSON value depends on the manufacturer’s distribu-tion, V GS and junction temperature. Short Kelvin-sense connections between the MOSFET drain and source to the LTC4213 SENSEP and SENSEN pins are strongly recommended.For a selected MOSFET, the nominal load limit current is given by:I V R LIMIT NOM CB NOM DSON NOM ()()()()=3The minimum load limit current is given by:I V R LIMIT MIN CB MIN DSON MAX ()()()()=4APPLICATIO S I FOR ATIOW UUU1213144213fOperating temperature of 0° to 70°C.R DSON @ 25°C = 100%R DSON @ 0°C = 90%R DSON @ 70°C = 120%MOSFET resistance variation:R DSON(NOM) = 15m • 0.82 = 12.3m ΩR DSON(MAX) = 15m • 1.333 • 0.93 • 1.2 = 15m • 1.488= 22.3m ΩR DSON(MIN) = 15m • 0.667 • 0.80 • 0.90 = 15m • 0.480= 7.2m ΩV CB variation:NOM V CB = 25mV = 100%MIN V CB = 22.5mV = 90%MAX V CB = 27.5mV = 110%The current limits are:I LIMIT(NOM) = 25mV/12.3m Ω = 2.03A I LIMIT(MIN) = 22.5mV/22.3m Ω = 1.01A I LIMIT(MAX) = 27.5mV/7.2m Ω = 3.82AFor proper operation, the minimum current limit must exceed the circuit maximum operating load current with margin. So this system is suitable for operating load current up to 1A. From this calculation, we can start with the general rule for MOSFET R DSON by assuming maxi-mum operating load current is roughly half of the I LIMIT(NOM). Equation 7 shows the rule of thumb.I V R OPMAX CB NOM DSON NOM =()()•()27Note that the R DSON(NOM) is at the LTC4213 nominal operating ∆V GSMAX rather than at typical vendor spec.Table 1 gives the nominal operating ∆V GSMAX at the various operating V CC . From this table users can refer to the MOSFET’s data sheet to obtain the R DSON(NOM) value.Table 1. Nominal Operating ∆V GSMAX for Typical Bias Supply VoltageV CC (V)∆V GSMAX (V)2.3 4.32.5 5.02.7 5.63.0 6.53.37.05.07.06.07.0Load Supply Power-Up after Circuit Breaker Armed Figure 4 shows a normal power-up sequence for the circuit in Figure 1 where the V IN load supply power-up after circuit breaker is armed. V CC is first powered up by an auxiliary bias supply. V CC rises above 2.07V at time point 1. V ON exceeds 0.8V at time point 2. After a 60µs debounce delay, the GATE pin starts ramping up at time point 3. The external MOSFET starts conducting at time point 4. At time point 5, V GATE exceed ∆V GSARM and the circuit breaker is armed. After 50µs (t READY delay), READY pulls high by an external resistor at time point 6. READY signals the V IN load supply module to start its ramp. The load supply begins soft-start ramp at time point 7. The load supply ramp rate must be slow to prevent circuit breaker tripping as in equation (8).∆∆V t I I C IN OPMAX LOADLOAD<−()8Where I OPMAX is the maximum operating current defined by equation 7.For illustration, V CB = 25mV and R DSON = 3.5m Ω at the nominal operating ∆V GSMAX . The maximum operating current is 3.5A (refer to equation 7). Assuming the load can draw a current of 2A at power-up, there is a margin of 1.5A available for C LOAD of 100µF and V IN ramp rate should be <15V/ms. At time point 8, the current through the MOSFET reduces after C LOAD is fully charged.APPLICATIO S I FOR ATIOW UUU1516174213fThe selected MOSFET V GS absolute maximum rating should meet the LTC4213 maximum ∆V GSMAX of 8V.Other MOSFET criteria such as V BDSS , I DMAX , and R DSON should be reviewed. Spikes and ringing above maximum operating voltage should be considered when choosing V BDSS . I DMAX should be greater than the current limit. The maximum operating load current is determined by the R DSON value. See the section on “Calculating Current Limit” for details.Supply RequirementsThe LTC4213 can be powered from a single supply or dual supply system. The load supply is connected to the SENSEP pin and the drain of the external MOSFET. In the single supply case, the V CC pin is connected to the load supply, preferably with an RC filter. With dual supplies,V CC is connected to an auxiliary bias supply V AUX where V AUX voltage should be greater or equal to the load supply voltage. The load supply voltage must be capable of sourcing more current than the circuit breaker limit. If the load supply current limit is below the circuit breaker trip current, the LTC4213 may not react when the output overloads. Furthermore, output overloads may trigger UVLO if the load supply has foldback current limit in a single supply system.V IN Transient and Overvoltage ProtectionInput transient spikes are commonly observed whenever the LTC4213 responds to overload. These spikes can be large in amplitude, especially given that large decoupling capacitors are absent in hot swap environments. These short spikes can be clipped with a transient suppressor of adequate voltage and power rating. In addition, the LTC4213can detect a prolonged overvoltage condition. WhenAPPLICATIO S I FOR ATIOW UUU point 6 should be within the circuit breaker limits. Other-wise, the system fails to start and the circuit breaker trips immediately after arming. In most applications additional external gate capacitance is not required unless C LOAD is large and startup becomes problematic. If an external gate capacitor is employed, its capacitance value should not be excessive unless it is used with a series resistor. This is because a big gate capacitor without resistor slows down the GATE turn off during a fault. An alternative method would be a stepped I SEL pin to allow a higher current limit during startup.In the event of output short circuit or a severe overload, the load supply can collapse during GATE ramp up due to load supply current limit. The chosen MOSFET must withstand this possible brief short circuit condition before time point 6 where the circuit breaker is allowed to trip. Bench short circuit evaluation is a practical verification of a reliable design. To have current limit while powering a MOSFET into short circuit conditions, it is preferred that the load supply sequences to turn on after the circuit breaker is armed as described in an earlier section.Power-Off CycleThe system can be powered off by toggling the ON pin low.When ON is brought below 0.76V for 5µs, the GATE and READY pins are pulled low. The system resets when ON is brought below 0.4V for 80µs.MOSFET SelectionThe LTC4213 is designed to be used with logic (5V) and sub-logic (3V) MOSFETs for V CC potentials above 2.97V with ∆V GSMAX exceeding 4.5V. For a V CC supply range between 2.3V and 2.97V, sub-logic MOSFETs should be used as the minimum ∆V GSMAX is less than 4.5V.1819Information furnished by Linear Technology Corporation is believed to be accurate and reliable.However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.201630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● © LINEAR TECHNOLOGY CORPORA TION 2005LT/TP 0405 500 • PRINTED IN USA。

SI2309CDS中文资料

Vishay SiliconixSi2309CDSP-Channel 60-V (D-S) MOSFETFEATURES•Halogen-free Option Available •TrenchFET ® Power MOSFETAPPLICATIONS•Load SwitchPRODUCT SUMMARYV DS (V)R DS(on) (Ω)I D (A)d Q g (Typ.)- 600.345 at V GS = - 10 V - 1.6 2.7 nC0.450 at V GS = - 4.5 V- 1.4Notes:a. Surface Mounted on 1" x 1" FR4 board.b. t = 5 s.c. Maximum under Steady State conditions is 166 °C/W.d. When T C = 25 °C.ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise notedParameter Symbol Limit nitDrain-Source Voltage V DS - 60VGate-Source VoltageV GS± 20Continuous Drain Current (T J = 150 °C)a, bT C = 25 °CI D - 1.6A T C = 70 °C - 1.3T A = 25 °C - 1.2a, b T A = 70 °C- 1.0a, bPulsed Drain Current (10 µs Pulse Width)I DM - 8Single Pulse Avalanche Current L = 0.1 mH I AS - 5Continuous Source-Drain Diode CurrentT C = 25 °C I S - 1.4T A = 25 °C - 0.9a, b Maximum Power DissipationT C = 25 °CP D 1.7W T C = 70 °C 1.1T A = 25 °C 1.0a, b T A = 70 °C0.67a, b Operating Junction and Storage T emperature Range T J , T stg - 55 to 150°C Soldering Recommendations (Peak Temperature)c260THERMAL RESISTANCE RATINGSParameter Symbol Typical Maximum UnitMaximum Junction-to-Ambient a, c t ≤ 5 s R thJA 92120°C/WMaximum Junction-to-Foot (Drain)Steady StateR thJF5873Vishay SiliconixSi2309CDSNotes:a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.b. Guaranteed by design, not subject to production testing.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.SPECIFICATIONS T J = 25 °C, unless otherwise notedParameter Symbol Test Conditions Min.Typ.Max.U nitStaticDrain-Source Breakdown Voltage V DS V GS = 0 V , I D = - 250 µA- 60V V DS Temperature Coefficient ΔV DS /T J I D = - 250 µA - 65mV/°C V GS(th) Temperature Coefficient ΔV GS(th)/T J 4.5Gate-Source Threshold Voltage V GS(th) V DS = V GS , I D = - 250 µA - 1- 3VGate-Source LeakageI GSS V DS = 0 V , V GS = ± 20 V - 100nAZero Gate Voltage Drain Current I DSS V DS = - 60 V , V GS = 0 V - 1µA V DS = - 60 V , V GS = 0 V , T J = 55 °C- 10On-State Drain Current aI D(on) V DS ≤ 5 V , V GS = - 10 V - 6A Drain-Source On-State Resistance a R DS(on) V GS = - 10 V , I D = - 1.25 A 0.2850.345ΩV GS = - 4.5 V , I D = - 1.0 A 0.3600.450Forward T ransconductance a g fsV DS = - 10 V, I D = - 1.0 A2.8SDynamic bInput Capacitance C iss V DS = - 30 V , V GS = 0 V, f = 1 MHz210pFOutput CapacitanceC oss 28Reverse Transfer Capacitance C rss 20Total Gate Charge Q g V DS = - 30 V, V GS = - 4.5 V , ID = - 1.25 A 2.7 4.1nC Gate-Source Charge Q gs 0.8Gate-Drain Charge Q gd 1.2Gate Resistance R g f = 1 MHz7ΩTurn-On Delay Time t d(on) V DD = - 30 V, R L = 30 Ω I D ≅ - 1 A, V GEN = - 4.5 V , R g = 1 Ω4060nsRise Timet r 3555Turn-Off Delay Time t d(off) 1525Fall Timet f 1020Turn-On Delay Time t d(on) V DD = - 30 V, R L = 30 ΩI D ≅ - 1 A, V GEN = - 10 V, R g = 1 Ω510Rise Timet r 1020Turn-Off Delay Time t d(off) 1525Fall Timet f1020Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current I S T C = 25 °C- 1.4A Pulse Diode Forward Current I SM - 8Body Diode VoltageV SD I S = - 0.75 A, V GS = 0 V- 0.8- 1.2V Body Diode Reverse Recovery Time t rr I F = - 1.25 A, dI/dt = 100 A/µs, T J = 25 °C3060ns Body Diode Reverse Recovery Charge Q rr 3360nC Reverse Recovery Fall Time t a 18nsReverse Recovery Rise Timet b12Gate ChargeOn-Resistance vs. Junction TemperatureSource-Drain Diode Forward VoltageThreshold VoltageSingle Pulse Power, Junction-to-AmbientVishay SiliconixSi2309CDSTYPICAL CHARACTERISTICS 25°C, unless otherwise notedVishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?68980.Normalized Thermal Transient Impedance, Junction-to-AmbientDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。

ltc2950的原理和应用

LTC2950的原理和应用1. LTC2950简介LTC2950是一款轻型电源管理芯片，适用于各种电池供电系统的自动开关功能。

它基于CMOS工艺，具有低功耗和高稳定性的特点。

本文将介绍LTC2950的原理和应用。

2. LTC2950的工作原理LTC2950采用了一种称为监视器模式的工作原理，其主要功能是监视系统电源电压并控制开关输出。

下面是LTC2950的工作原理：•输入电源电压监测：LTC2950能够监测输入电源的电压，并根据设定的电压阈值来确定系统是否正常工作。

当输入电压低于阈值时，LTC2950将触发系统关闭动作。

•开关输出控制：LTC2950有一个开关输出，用于控制其他外部设备的开关。

当系统运行正常时，开关输出保持开启状态；当输入电压低于阈值时，开关输出将关闭。

•自动开启恢复：LTC2950具有自动开启恢复功能，即当输入电压回复到正常范围内时，开关输出将自动开启，系统将恢复正常工作状态。

3. LTC2950的应用LTC2950的原理和功能使其在电池供电系统中具有广泛的应用。

下面是几个常见的应用场景：3.1 电池供电系统的自动开关LTC2950可以作为电池供电系统的自动开关，当电池电压低于设定阈值时，LTC2950将关闭系统以避免过放电，从而保护电池的寿命。

当电压回复正常时，LTC2950将自动开启系统，实现自动恢复。

3.2 低功耗电源管理由于LTC2950本身具有低功耗特点，可以提供给其他电路使用作为电源管理芯片。

它可以监控输入电压，根据需求控制开关输出，实现低功耗的电源管理功能。

3.3 电池充电系统LTC2950可以作为电池充电系统的控制芯片使用。

它可以监控充电电压和电流，并根据需求控制充电器的开关状态。

当充电电压和电流达到设定值时，LTC2950可以触发停止充电动作，从而保护电池的安全。

3.4 电源切换系统LTC2950还可以应用于电源切换系统中，当主电源发生故障或不稳定时，LTC2950可以自动切换到备用电源以保证系统的正常运行。

利特尔比特ltc4059 ltc4059a-900ma-线性锂离子电池充电器用热控制在2-2 dfn

124059fbInput Supply Voltage (V CC )...................... –0.3V to 10V BAT, PROG, EN, Li CC, ACPR ................... –0.3V to 10V BAT Short-Circuit Duration...........................Continuous BAT Pin Current............................................... 1000mA PROG Pin Current............................................. 1000µA Junction Temperature.......................................... 125°C Operating Temperature Range (Note 2)..–40°C to 85°C Storage Temperature Range.................–65°C to 125°CORDER PART NUMBER Consult LTC Marketing for parts specified with wider operating temperature ranges.LTC4059EDC LTC4059AEDC ABSOLUTE AXI U RATI GSW W WU PACKAGE/ORDER I FOR ATIOUUW (Note 1)T JMAX = 125°C, θJA = 60°C/W TO 85°C/W (NOTE 3)*Li CC PIN 2 ON LTC4059EDC,ACPR PIN 2 ON LTC4059AEDC EXPOSED PAD (PIN 7) IS GND MUST BE SOLDERED TO PCBTOP VIEW7DC6 PACKAGE6-LEAD (2mm × 2mm) PLASTIC DFN456321GND BAT EN PROG V CCLi CC/ACPR*DC6 PART MARKING LAFU LBJHELECTRICAL CHARACTERISTICSThe ● denotes the specifications which apply over the full operatingtemperature range, otherwise specifications are at T A = 25°C. V CC = 5V unless otherwise noted.SYMBOL PARAMETERCONDITIONSMIN TYP MAX UNITSV CC V CC Supply Voltage●3.758V I CC Quiescent V CC Supply Current V BAT = 4.5V (Forces I BAT and I PROG = 0)●2560µA I CCMS V CC Supply Current in Shutdown V EN = V CC●1025µA I CCUV V CC Supply Current in Undervoltage V CC < V BAT ; V CC = 3.5V, V BAT = 4V ●410µA LockoutV FLOAT V BAT Regulated Output Voltage I BAT = 2mA4.175 4.2 4.225V 4.5V < V CC < 8V, I BAT = 2mA● 4.158 4.2 4.242V I BAT BAT Pin CurrentR PROG = 2.43k, Current Mode, V BAT = 3.8V ●475500525mA R PROG = 12.1k, Current Mode, V BAT = 3.8V ●94100106mA I BMS Battery Drain Current in Shutdown V EN = V CC , V CC > V BAT ●0±1µA I BUV Battery Drain Current in Undervoltage V CC < V BAT , V BAT = 4V●014µA LockoutV UV V CC – V BAT Undervoltage Lockout V CC from Low to High, V BAT = 3.7V ●100150200mV ThresholdV CC from High to Low, V BAT = 3.7V ●03580mV V PROG PROG Pin VoltageR PROG = 2.43k, I PROG = 500µA ● 1.18 1.21 1.24V R PROG = 12.1k, I PROG = 100µA ● 1.18 1.21 1.24V V MS Manual Shutdown Threshold V EN Increasing ●0.30.92 1.2V V MSHYS Manual Shutdown Hysteresis V EN Decreasing 85mV R EN EN Pin Input ResistanceV EN = 5V●1 1.853M ΩV Li CC Voltage Mode Disable Threshold V Li CC Increasing (LTC4059 Only)●0.30.92 1.2V V Li CCHYS Voltage Mode Disable Hysteresis V Li CC Decreasing (LTC4059 Only)85mV V ACPR ACPR Pin Output Low Voltage I ACPR = 300µA (LTC4059A Only)0.250.5V t LIM Junction Temperature In Constant 115°C Temperature ModeR ONPower FET “ON” Resistance I BAT = 150mA (Note 4)8001200m Ω(Between V CC and BAT)Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.Note 2: The LTC4059E/LTC4059AE are guaranteed to meet performance specifications from 0°C to 70°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls.Note 3: Failure to solder the exposed backside of the package to the PC board ground plane will result in a thermal resistance much higher than 60°C/W.Note 4: The FET on-resistance is guaranteed by correlation to wafer level measurements.3454059fbPI FU CTIO SU U UGND (P ins 1, 7): Ground/Exposed Pad. The exposed package pad is ground and must be soldered to the PC board for maximum heat transfer.Li CC (Pin 2, LTC4059): Li-Ion/Constant Current Input Pin. Pulling this pin above V Li CC disables voltage mode thereby providing a constant current to the BAT pin. This feature is useful for charging Nickel chemistry batteries.Tie to GND if unused.ACP R (P in 2, LTC4059A): Open-Drain Power Supply Status Output. When V CC is greater than the undervoltage lockout threshold, the ACPR pin will pull to ground;otherwise the pin is forced to a high impedance state.BAT (P in 3): Charge Current Output. Provides charge current to the battery and regulates the final float voltage to 4.2V. An internal precision resistor divider from this pin sets this float voltage and is disconnected in shutdown mode.V CC (P in 4): Positive Input Supply Voltage. This pin provides power to the charger. V CC can range from 3.75V to 8V. This pin should be bypassed with at least a 1µF capacitor. When V CC is within 35mV of the BAT pin voltage, the LTC4059 enters shutdown mode, dropping I BAT to less than 4µA.PROG (Pin 5): Charge Current Program and Charge Cur-rent Monitor Pin. Connecting a resistor, R PROG , to ground programs the charge current. When charging in constant-current mode, this pin servos to 1.21V. In all modes, the voltage on this pin can be used to measure the charge current using the following formula:I V R BAT PROGPROG=•1000EN (Pin 6): Enable Input Pin. Pulling this pin above the manual shutdown threshold (V MS is typically 0.92V) puts the LTC4059 in shutdown mode, thus terminating a charge cycle. In shutdown mode, the LTC4059 has less than 25µA supply current and less than 1µA battery drain current.Enable is the default state, but the pin should be tied to GND if unused.674059fbOPERATIOUThe LTC4059/LTC4059A are linear battery chargers de-signed primarily for charging single cell lithium-ion bat-teries. Featuring an internal P-channel power MOSFET,the chargers use a constant-current/constant-voltage charge algorithm with programmable current. Charge current can be programmed up to 900mA with a final float voltage accuracy of ±0.6%. No blocking diode or external sense resistor is required; thus, the basic charger circuit requires only two external components. The ACPR pin (LTC4059A) monitors the status of the input voltage with an open-drain output. The Li C C pin (LTC4059) disables constant-voltage operation and turns the LTC4059 into a precision current source capable of charging Nickel chem-istry batteries. Furthermore, the LTC4059/LTC4059A are designed to operate from a USB power source.An internal thermal limit reduces the programmed charge current if the die temperature attempts to rise above a preset value of approximately 115°C. This feature protects the LTC4059/LTC4059A from excessive temperature, and allows the user to push the limits of the power handling capability of a given circuit board without risk of damaging the LTC4059/LTC4059A or external components. Anotherbenefit of the thermal limit is that charge current can be set according to typical, not worst-case, ambient tempera-tures for a given application with the assurance that the charger will automatically reduce the current in worst-case conditions.The charge cycle begins when the voltage at the V CC pin rises approximately 150mV above the BAT pin voltage, a program resistor is connected from the PROG pin to ground, and the EN pin is pulled below the shutdown threshold (typically 0.92V).If the BAT pin voltage is below 4.2V, or the Li CC pin is pulled above V Li CC (LTC4059 only), the LTC4059 will charge the battery with the programmed current. This is constant-current mode. When the BAT pin approaches the final float voltage (4.2V), the LTC4059 enters constant-voltage mode and the charge current begins to decrease.To terminate the charge cycle the EN should be pulled above the shutdown threshold. Alternatively, reducing the input voltage below the BAT pin voltage will also terminate the charge cycle.APPLICATIO S I FOR ATIOW UUU Programming Charge CurrentThe charge current is programmed using a single resistor from the PROG pin to ground. The battery charge current is 1000 times the current out of the PROG pin. The program resistor and the charge current are calculated using the following equations:R V I I VR PROG CHG CHG PROG==10001211000121•.,•.For best stability over temperature and time, 1% metal-film resistors are recommended.The charge current out of the BAT pin can be determinedat any time by monitoring the PROG pin voltage and using the following equation:I V R BAT PROGPROG=•1000Undervoltage Lockout (UVLO)An internal undervoltage lockout circuit monitors the input voltage and keeps the charger in undervoltage lockout until V CC rises approximately 150mV above the BAT pin voltage.The UVLO circuit has a built-in hysteresis of 115mV. If the BAT pin voltage is below approximately 2.75V, then the charger will remain in undervoltage lockout until V CC rises above approximately 3V. During undervoltage lockout conditions, maximum battery drain current is 4µA.Power Supply Status Indicator (ACPR, LTC4059A Only)The power supply status output has two states: pull-down and high impedance. The pull-down state indicates that V CC is above the undervoltage lockout threshold (see Undervoltage Lockout). When this condition is not met,the ACPR pin is high impedance indicating that the LTC4059A is unable to charge the battery.894059fbPower DissipationThe conditions that cause the LTC4059/LTC4059A to reduce charge current through thermal feedback can be approximated by considering the power dissipated in the IC. For high charge currents, the LTC4059 power dissipa-tion is approximately:P D = (V CC – V BAT ) • I BATwhere P D is the power dissipated, V CC is the input supply voltage, V BAT is the battery voltage and I BAT is the charge current. It is not necessary to perform any worst-case power dissipation scenarios because the LTC4059/LTC4059A will automatically reduce the charge current to maintain the die temperature at approximately 115°C.However, the approximate ambient temperature at which the thermal feedback begins to protect the IC is:T A = 115°C – P D θJAT A = 115°C – (V CC – V BAT ) • I BAT • θJAExample: Consider an LTC4059 operating from a 5V wall adapter providing 900mA to a 3.7V Li-Ion battery. The ambient temperature above which the LTC4059/LTC4059A begin to reduce the 900mA charge current is approximately:T A = 115°C – (5V – 3.7V) • (900mA) • 50°C/W T A = 115°C – 1.17W • 50°C/W = 115°C – 59°C T A = 56°CThe LTC4059 can be used above 56°C, but the charge current will be reduced from 900mA. The approximate current at a given ambient temperature can be calculated:I C T V V BAT A CC BAT JA=°()115––•θUsing the previous example with an ambient temperature of 65°C, the charge current will be reduced to approximately:I C C V V C W CC AI mABAT BAT =°°()°=°°=11565537505065770––.•//F urthermore, the voltage at the PROG pin will change proportionally with the charge current as discussed in the Programming Charge Current section.It is important to remember that LTC4059/LTC4059A applications do not need to be designed for worst-case thermal conditions since the IC will automatically reduce power dissipation when the junction temperature reaches approximately 115°C.Board Layout ConsiderationsIn order to be able to deliver maximum charge current under all conditions, it is critical that the exposed metal pad on the backside of the LTC4059/LTC4059A package is soldered to the PC board ground. Correctly soldered to a 2500mm 2 double sided 1oz copper board the LTC4059/LTC4059A have a thermal resistance of approximately 60°C/W. F ailure to make thermal contact between the exposed pad on the backside of the package and the copper board will result in thermal resistances far greater than 60°C/W. As an example, a correctly soldered LTC4059/LTC4059A can deliver over 900mA to a battery from a 5V supply at room temperature. Without a backside thermal connection, this number could drop to less than 500mA.Stability ConsiderationsThe LTC4059 contains two control loops: constant voltage and constant current. The constant-voltage loop is stable without any compensation when a battery is connected with low impedance leads. Excessive lead length, how-ever, may add enough series inductance to require a bypass capacitor of at least 1µF from BAT to GND. Further-more, a 4.7µF capacitor with a 0.2Ω to 1Ω series resistor from BAT to GND is required to keep ripple voltage low when the battery is disconnected.High value capacitors with very low ESR (especially ce-ramic) reduce the constant-voltage loop phase margin.Ceramic capacitors up to 22µF may be used in parallel with a battery, but larger ceramics should be decoupled with 0.2Ω to 1Ω of series resistance.I n constant-current mode, the PROG pin is in the feedback loop, not the battery. Because of the additional pole created by PROG pin capacitance, capacitance on this pin must be kept to a minimum. With no additional capaci-tance on the PROG pin, the charger is stable with program resistor values as high as 12k. However, additional ca-pacitance on this node reduces the maximum allowedAPPLICATIO S I FOR ATIOW UUUFigure 5. Photo of Typical Circuit (2.5mm × 2.7mm) 1011Information furnished by Linear Technology Corporation is believed to be accurate and reliable.However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.121630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● © LINEAR TECHNOLOGY CORPORA TION 2003LT/LT 0505 REV B • PRINTED IN USA。

LTC1298 微功耗双通道采样12位A D转换器演示手册说明书

1DESCRIPTIOUThe LTC ®1298 is a micropower, 11.1ksps, two-channel sampling 12-bit A/D converter that draws only 1.25mW from a single 5V supply. The LTC1298 demo board pro-vides the user with a stable and consistent platform on which to evaluate the LTC1298 A/D converter. In addition,the LTC1298 demo board illustrates the layout and by-passing techniques required to obtain optimum perfor-mance from this part. The LTC1298 demo board is de-signed to be easy to use and requires only a 7V to 15V supply, a clock signal, and an analog input signal. As shown in the Board Photo, the LTC1298 is a very space efficient solution for A/D users. By combining a mi-cropower 12-bit A/D, sample-and-hold, two-channel mul-tiplexer, serial port, and auto shutdown circuit into a single 8-pin SOIC package, all the data acquisition circuitry including the bypass caps occupy an area of only 0.1square inch.This manual shows how to use the demo board. It includes timing diagrams, power supply requirements, and analog input range information. Additionally, a schematic, parts list, drawings, and dimensions of all the PC board layers are included. Finally, an explanation of the layout andbypass strategies used in this board allows anyone de-signing a PC board to achieve maximum performance from the device.12-Bit A/D ConverterDemo Boards Proven µPower 12-Bit ADC Surface Mount Layout s On-Chip Two-Channel MulitplexersActual ADC Footprint Only 0.1 Inch 2 Including Bypass Capacitorss 71dB SINAD, 84dB THD and ±0.25LSB DNL sGerber Files for This Circuit Board Are Available.Call the LTC Factory.FEATURESTYPICAL PERFOR A CE CHARACTERISTICS A D BOARD PHOTOU UW DC045 • BP01SAMPLE FREQUENCY (Hz)0.1k11010010001k 10k 100kLT1286/98 G03S U P P L Y C U R RE N T (µA )Supply Current vs Sample Rate2DEMO MANUAL DC045W W T O P V I E WA EC 1DEMO MANUAL DC045 REFERENCEDESIGNATOR QUANTITY PART NUMBER DESCRIPTION VENDOR TELEPHONE C11TAJD476M01047µF 10V 20%, Tantalum Capacitor AVX(207) 282-5111 C2 to C5, C85GRM42-6X7R104K050AD0.1µF 50V 10%, X7R Chip Capacitor Murata Erie(814) 237-1431 C6, C9, C12312063G105ZATMA1µF 25V +80%/–20%, Y5V Chip Capacitor AVX(803) 448-9411 C71TAJB106M01010µF 10V 20%, Tantalum Capacitor AVX(207) 282-5111 C10112062R150K9BB215pF 50V 10% NPO Chip Capacitor Philips(407) 744-4200 C11108055A470GATBA47pF 50V 2% NPO Chip Capacitor AVX(803) 448-9411 D0 to D1112SF1-BR Red LED Data Display(800) 421-6815 E1, E22575-4Banana Jack Keystone(718) 956-8900 E3 to E531502-2Turret Keystone(718) 956-8900 JP11TSW-101-07-G-D Header Samtec(800) 726-8329 JP21TSW-104-07-G-D Header Samtec(800) 726-8329 JP31TSW-107-06-G-D Header Samtec(800) 726-8329 JP41TSW-105-07-G-SN Header Samtec(800) 726-8329 J11227699-3BNC Connector AMP(717) 564-0100 R1 to R1212CR32-621J-T620Ω 1/8W 5% 1206 Chip Resistor AVX(803) 448-9411 R13 to R153CT32-223J-T22k 1/8W 5% 1206 Chip Resistor AVX(803) 448-9411 R161CT32-102J-T1k 1/8W 5% 1206 Chip Resistor AVX(803) 448-9411 R171CT32-103J-T10k 1/8W 5% 1206 Chip Resistor AVX(803) 448-9411 R181CT32-5101J-T51Ω 1/8W 5% 1206 Chip Resistor AVX(803) 448-9411 S1190HBW03S DIP Switch Grayhill(708) 354-1040 U1174HC592IC Toshiba(408) 737-9844 U2174HC165IC Toshiba(408) 737-9844 U31LTC1298CS8IC LTC(408) 432-1900 U41LTC1021DCS8-5IC LTC(408) 432-1900 U5174HC14IC Texas Instruments(800) 336-5236 U61LT1121CST-5IC LTC(408) 432-1900 U7, U8274HC595IC Toshiba(408) 737-9844 4HTSP-3Plastic Stand.Micro Plastic(501) 453-88615SNT-100-BK-5Shunt Samtec(800) 726-832944/40 × 3/8Steel ScrewPARTS LISTOPERATIOUOPERATING THE BOARDPowering the BoardTo use the demo board, apply a 7V to 15V power source capable of supplying ≥100mA to the banana jacks (E1 and E2). Be careful to observe the correct polarity. On-board regulators provide 5V to the LTC1298’s V CC pin. LT1121-5 and LT1021 regulators generate 5V for the digital circuitry and ADC, respectively.Applying the Analog InputAnalog input signals are applied to the LTC1298’s two-channel (CH0 and CH1) input multiplexer through the demonstration board’s turret terminals E3 (CH0) and E4 (CH1). The input signals’ ground reference is applied to turret terminal E5. The analog signal input range is 0V to 5V. Optimum performance is achieved using a signal source that has low output impedance, is low noise, and34DEMO MANUAL DC045OPERATIOUhas low distortion. Signal generators such as the B & K Type 1051 sine generator give excellent results.Applying the Clock SignalThe clock signal is applied to BNC connector J1 and the CS signal is generated on the board. The clock input uses TTL or CMOS levels. The maximum clock frequency is 200kHz. While the clock signal is active, a high-to-low logic level transition is generated on the LTC1298’s CS input which initiates a conversion. The data transfer is shown in the timing diagrams (Figure 1).Reading the Output DataThe LTC1298 serial data outputs are buffered by the two 74HC595 latches and are available as a parallel output on connector JP3. The latches are used to drive the LEDs D0to D11. (Refer to the LTC1298 data sheet for details on different digital interface modes.)The LTC1298 output data is in unipolar format. A Data Ready line, RDY, (JP3 pin 13) is provided to latch the data.Data is valid on the rising edge of RDY. Connector JP3 has one ground pin (JP3 pin 14). Connect this pin to the data receiving system’s digital ground.MSB-First Data (MSBF = 0)Figure 1. Timing DiagramD CLKODD/ CSD LTC1286/98 • F02*AFTER COMPLETING THE DATA TRANSFER, IF FURTHER CLOCKS ARE APPLIED WITH CS LOW, THE ADC WILL OUTPUT ZEROS INDEFINITELY.ODD/ D t DATA : DURING THIS TIME, THE BIAS CIRCUIT AND THE COMPARATOR POWER DOWN AND THE REFERENCE INPUTBECOMES A HIGH IMPEDANCE NODE. WITH CS LOW AND THE CLOCK ACTIVE, THE OUTPUT ON D OUT IS EITHER LSB-FIRST DATA (MSBF = 0) OR ZEROS (MSBF = 1).MSB-First Data (MSBF = 1)5DEMO MANUAL DC045OPERATIOUTable 1.JUMPER JUMPER NAME JUMPER CONNECTIONJP1LED EnableShorted to enable LEDs. Open to disable the LEDs.JP2A CS Shorted for normal operation. If open, the CS line can be driven externally to select or deselect the LTC1286.JP2B CLK Shorted for normal operation. If open, the CLK line can be driven externally to clock the LTC1286.JP2C D OUT Shorted for normal operation. If open, the D OUT line can drive a scope probe.JP2DD INShorted for normal operation. If open, the D IN line can be driven externally to configure the input multiplexer.The LTC1298’s data word can be acquired with a logic analyzer. By using a logic analyzer that has a PC-compat-ible floppy drive, (such as an HP1663A), conversion data can be stored on a disk and easily transferred to a PC. Once the data is transfered to a PC, programs such as Mathcad or Excel can be used to calculate FFTs. The FFTs can be used to obtain LTC1298 AC specifications such as signal-to-noise ratio and total harmonic distortion.LEDs D0 to D11 provide a visual display of the LTC1298’s digital output word. D0 is the LSB and D11 is the MSB.Jumper JP1 can be removed to disable the LEDs, reducing supply consumption by up to 56mA.Driving CS, D IN , and CLKJumpers for CS, CLK, D IN , and D OUT (JP2) are shorted for normal operation. The jumpers can be removed and CS,D IN , and CLK lines can be externally driven if desired. See the LTC1298 data sheet for details on driving these YOUTThe use of separate analog and digital ground planes is a good practice for a well designed LTC1298 PC board. Theproper way to make the analog and digital ground planes can be seen by examining the solder side of the PCB layout. The two ground planes are completely isolated except for one connection at the power supply ground input, E1. The two ground planes follow the same path on the component and solder sides of the board to reduce coupling between the ground planes. Also ensure that the analog ground plane’s solder side has a limited number of plane-breaking traces within it. Any trace that opens a portion of the ground plane may reduce the ground plane’s efficiency. Further, the analog and digital traces do not cross each other (whether on the board’s top or bottom side) or run adjacent to each other.BYPASSINGIt is important to place the supply/reference bypass ca-pacitor as close as possible to the LTC1298’s supply/reference pin. The ground side of the capacitor should have a very short path to analog ground. The V CC /V REF pins should be bypassed with high quality ceramic capaci-tors of at least 0.1µF.6DEMO MANUAL DC045OPERATIOUTable 2.INPUT/OUTPUT PINFUNCTIONJ1Clock InputE1GroundE27V to 15V at ≥100mA CH0Multiplexer Input Channel 0CH1Mulitplexer Input Channel 1AGND Input signals’ ground reference JP3-1D0 (LSB)JP3-2D1JP3-3D2JP3-4D3JP3-5D4JP3-6D5INPUT/OUTPUT PINFUNCTIONJP3-7D6JP3-8D7JP3-9D8JP3-10D9JP3-11D10JP3-12D11 (MSB)JP3-13RDY. Can be used by an external system to latch the ADC’s output. Latch data on the rising edge.JP3-14Ground. Connect to the digital ground of a data receiving system.PCB LAYOUT A D FILU WComponent Side Silkscreen7DEMO MANUAL DC045Information furnished by Linear Technology Corporation is believed to be accurate and reliable.However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.PCB LAYOUT A D FILUWCircuit: Component SideCircuit: Solder SideComponent Side Solder MaskSolder Side Solder Mask8DEMO MANUAL DC045SYMBOL DIAMETER # OF HOLESA 0.1254B 0.2102C 0.0943D 0.035129E 0.04029F 0.0455UNMARKED0.01897TOTAL HOLES269Linear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7487(408) 432-1900 qFAX : (408) 434-0507 qTELEX : 499-3977© PC FAB DRAWI GUA DAFEX8EX5F FF FAE X 14D X 128B C CC BEE NOTES:1.MATERIAL IS FR4, 0.062˝ THICK WITH 2 OUNCE COPPER.2.PCB WILL BE DOUBLE-SIDED WITH PLATED THROUGH-HOLES.3.HOLE SIZES ARE AFTER PLATING. PLATED THROUGH-HOLE WALL THICKNESS MINIMUM 0.0014˝ (1OZ.).E PADMASTER PROCESS.5.SOLDER MASK BOTH SIDES WITH PC401 USING FILM PROVIDED.6.SILKSCREEN COMPONENT SIDE USING FILM E WHITE, NON-CONDUCTIVE INK.7.ALL DIMENSIONS ARE IN INCHES.。

FM2309(非隔离降压型有源PFC LED驱动IC)

概述FM2309 是一款带有源功率因数校正的高精度降压型LED 恒流控制芯片，适用于85Vac-265Vac 全范围输入电压的非隔离LED 恒流电源。

这款控制器集成有源功率因数校正电路，可以实现很高的功率因数和很低的总谐波失真。

由于工作在电感电流临界连续模式，功率MOS 管处于零电流开通状态，开关损耗得以减小，同时变压器的利用率也较高。

FM2309 采用专有的电流采样机制，可实现高精度输出恒流控制。

芯片采用了专利的源极驱动技术和内部快速充电电路，可以实现较低的原边驱动损耗，超快速的系统上电和LED 启动。

FM2309 采用专利的线电压补偿技术和负载电压补偿技术，可以达到优异的线电压调整率和负载调整率。

线电压补偿系数还可以通过外部元件灵活调整。

FM2309 具有多重保护功能以加强系统可靠性，包括LED 开路保护、LED 短路保护、芯片供电过压保护、欠压保护、电流采样电阻开路和短路保护和逐周期限流等。

所有的保护状态都具有自动重启功能。

特点有源功率因数校正，高PF值，低THD高达95%的系统效率超快LED 启动( <300ms @85Vac)±3% LED 输出电流精度优异的线电压调整率和负载调整率电感电流临界连续模式源极驱动方式超低(20uA) 启动电流超低(600uA) 工作电流FB 反馈电阻值高，功耗低LED 短路/开路保护电流采样电阻短路/开路保护变压器饱和保护逐周期电流限流芯片供电过压/欠压保护自动重启功能封装形式：SOP-8产品应用GU10/E27 LED 球泡灯、射灯LED PAR30、PAR38 灯LED 日光灯其它LED 照明内部结构框图注1：最大极限值是指超出该工作范围，芯片有可能损坏。

推荐工作范围是指在该范围内，器件功能正常，但并不完全保证满足个别性能指标。

电气参数定义了器件在工作范围内并且在保证特定性能指标的测试条件下的直流和交流电参数规范。

对于未给定上下限值的参数，该规范不予保证其精度，但其典型值合理反映了器件性能。

ltc2949的典型应用电路的变形

文章标题：深度解析ltc2949的典型应用电路及其变形一、什么是ltc2949？在现代电子设备中，电池管理一直是一个重要的话题。

对于需要长时间工作的设备，如便携式电子产品、传感器设备等，如何有效管理电池的充电和放电，成为了一项具有挑战性的任务。

而ltc2949是一款具有广泛应用价值的电池电量测量芯片。

它能够测量电池的电流、电压和温度，可广泛应用于便携式电源、无线传感器等设备中。

二、ltc2949的典型应用电路介绍1. ltc2949的基本功能ltc2949是一款多功能电池电量测量芯片，具有电流和电压测量功能，同时还能够进行温度补偿和电池容量计算。

其主要功能包括：电池电流测量、电池电压测量、温度测量、电池容量计算、充电状态指示等。

在实际应用中，典型的ltc2949应用电路通常包括与电池相连的电流感测电阻、电源系统、微处理器等组件。

2. 典型应用电路示意图在标准的ltc2949应用电路中，通常包括电流感测电阻、电池、电源系统和微处理器等核心部件。

电流感测电阻负责测量电池的电流，电压感测器则用来测量电池的电压，通过这两项数据的测量，结合ltc2949内部的ADC转换器，可以准确计算出电池的容量。

而温度传感器则用来进行温度补偿，确保测量的准确性。

3. ltc2949的典型应用场景ltc2949多功能电池电量测量芯片可以广泛应用于便携式设备中，如智能手机、平板电脑、便携式电源等，同时在工业领域中也具有广泛的应用前景，如传感器设备、数据采集设备等。

其精准的测量功能和多功能的特性，使得ltc2949在电池管理领域具有重要的地位。

三、ltc2949应用电路的变形1. 基于ltc2949的创新电路设计随着电子技术的不断发展，人们对于电池管理的需求也愈发迫切，这就需要针对ltc2949的典型应用电路进行创新和改进。

针对某些特定应用场景，可能需要对ltc2949应用电路进行变形设计，以满足特定需求。

在这种情况下，可能需要对电流感测电阻、电压感测器、温度补偿电路等进行定制设计，以适应特定的应用场景。

si2309场效应管参数

si2309场效应管参数
SI2309是一种P沟道场效应管（MOSFET），常用于低压和低功
耗应用。

以下是SI2309场效应管的一些参数：
1. 额定电压（VDS），SI2309的额定电压通常在20V左右，这
意味着在正常工作条件下，其耐受的最大电压为20V。

2. 额定电流（ID），SI2309的额定电流通常在1-2安培之间，这是指在规定的电压下，场效应管能够承受的最大电流。

3. 阈值电压（VGS(th)），SI2309的阈值电压通常在1-2V之间，这是指在栅极和源极之间的电压达到一定数值时，场效应管开
始导通的电压。

4. 导通电阻（RDS(on)），SI2309的导通电阻通常在几欧姆到
几十欧姆之间，这是指在导通状态下，场效应管的导通电阻。

5. 最大功率（PD），SI2309的最大功率通常在0.5-1瓦特之间，这是指场效应管能够稳定工作的最大功率。

总的来说，SI2309场效应管是一种低压低功耗的器件，适用于
需要高效能控制的电路中。

以上是SI2309场效应管的一些基本参数，这些参数可以帮助工程师在设计电路时选择合适的器件以满足特定
的性能要求。

ltc2942工作原理

硫醇固化温度在现代材料科学中，硫醇因其独特的反应性而被广泛应用于各种聚合物材料的合成与改性。

然而，硫醇的固化温度对其反应活性及最终的材料性能具有显著影响。

本文将深入探讨硫醇的固化温度与其反应行为之间的关系，以及如何实现硫醇固化温度的精细调控。

一、硫醇固化温度的重要性硫醇在适当的温度下可以与多种官能团发生反应，如胺基、羟基和羧基等，从而形成稳定的化学键。

然而，硫醇的反应活性受温度影响显著。

温度过低，硫醇的反应速度缓慢，甚至无法进行；温度过高，则可能导致副反应增多，影响材料性能。

因此，精确控制硫醇的固化温度是实现其预期反应效果的关键。

二、硫醇固化温度的影响因素硫醇的固化温度不仅受自身分子结构的影响，还与环境因素密切相关。

例如，溶剂的种类和浓度、催化剂的存在与否以及外部环境的温度和压力等均可能对硫醇的固化温度产生影响。

因此，在进行硫醇反应时，需要对各种因素进行综合考量，以实现对其固化温度的精细调控。

三、硫醇固化温度的调控方法要实现对硫醇固化温度的精细调控，可以从以下几个方面着手：1.分子结构设计：通过调整硫醇分子中的官能团和连接基团，可以实现对固化温度的调控。

例如，引入电子给体或受体基团可以调节硫醇的反应活性。

2.溶剂选择：选择合适的溶剂对于调节硫醇的固化温度至关重要。

有时，仅仅通过更换溶剂，便可以在一定程度上改变硫醇的固化温度。

3.催化剂使用：在某些情况下，使用催化剂可以降低硫醇的固化温度。

然而，需要注意的是，催化剂可能会影响最终产物的纯度和性能。

4.外部条件控制：通过精确控制反应环境的温度和压力，可以实现硫醇固化温度的精细调节。

例如，在一定的压力下，升高温度可以促进硫醇的反应。

5.动力学研究：深入了解硫醇反应的动力学机制，有助于预测在不同条件下的固化行为，从而实现对固化温度的精确调控。

四、结论硫醇的固化温度是决定其反应效果和材料性能的关键因素。

通过分子结构设计、溶剂选择、催化剂使用、外部条件控制以及动力学研究等方法，可以实现硫醇固化温度的精细调控。

ltc2949的典型应用电路的变形

ltc2949的典型应用电路的变形（实用版）目录1.LTC2949 简介2.LTC2949 的典型应用电路3.LTC2949 应用电路的变形4.变形电路的优点与应用5.总结正文一、LTC2949 简介LTC2949 是一款高效率、低噪声、低失真的线性稳压器，它具有极低的输出电压噪声和源电阻。

LTC2949 提供了一个 2.5A 的输出电流，可以满足大多数应用场景的需求。

此外，该器件具有多种保护功能，如过热关断、过压关断等，能够确保电路的稳定运行。

二、LTC2949 的典型应用电路LTC2949 的典型应用电路包括四个主要部分：输入电源、滤波电容、稳压器和负载。

输入电源为 LTC2949 提供稳定的电压，滤波电容用于滤除输入电压中的高频噪声，稳压器将输入电压转换为稳定的输出电压，负载则连接在稳压器的输出端。

三、LTC2949 应用电路的变形在实际应用中，为了满足不同的需求，LTC2949 的应用电路可以进行一定的变形。

以下是两种常见的变形电路：1.并联输出电路：在并联输出电路中，多个 LTC2949 器件被并联在一起，以提供更大的输出电流。

这种电路适用于需要高电流供应的场合，如计算机、服务器等。

2.级联输出电路：在级联输出电路中，多个 LTC2949 器件被串联在一起，以提供更高的输出电压。

这种电路适用于需要高电压供应的场合，如工业控制、通信设备等。

四、变形电路的优点与应用变形电路具有以下优点：1.可扩展性：通过并联或级联多个 LTC2949 器件，可以灵活地调整输出电流或电压，以满足不同应用场景的需求。

2.稳定性：多个 LTC2949 器件的并联或级联可以提高电路的稳定性，降低输出电压或电流的波动。

3.系统简化：通过使用多个 LTC2949 器件，可以简化电源系统的设计，减少电路板的面积和成本。

这些优点使得变形电路在各种应用领域中得到了广泛的应用，如通信、工业控制、计算机、服务器等。

五、总结LTC2949 是一款性能优良的线性稳压器，其典型应用电路具有简单、稳定的特点。

LTC2309

LTC2309 - 具I2C 接口的8 通道、12 位SAR 型ADC∙∙∙∙∙∙Print Friendly特点∙12 位分辨率∙低功率：1.5mW (在1ksps)、35μW (睡眠模式)∙14ksps 吞吐速率∙低噪声：SNR = 73.4dB∙保证无漏失码∙单5V 电源∙具有9 个地址和一个全局地址(用于实现同步) 的二线式I2C 兼容型串行接口∙快速转换时间：1.3μs∙内部基准∙内部8 通道多路复用器∙内部转换时钟∙单极或双极输入范围(可利用软件来选择)∙在-40ºC 至125ºC 范围内保证运作(TSSOP 封装)∙24 引脚4mm x 4mm QFN 和20 引脚TSSOP 封装TYPICAL APPLICATIONBACK TO TOP描述LTC®2309 是一款低噪声、低功率、8 通道、12 位逐次逼近型ADC，具有一个I2C 兼容型串行接口。

该ADC 包括一个内部基准和一个全差分采样及保持电路，用于降低共模噪声。

LTC2309 从一个内部时钟运作，旨在实现一个 1.3μs 的快速转换时间。

LTC2309 采用单5V 电源，在1ksps 吞吐速率条件下的吸收电流仅为300μA。

当不执行转换操作时，该ADC 将进入打盹模式，从而降低了功耗。

LTC2309 采用小型24 引脚4mm x 4mm QFN 和20 引脚TSSOP 封装。

内部2.5V 基准和8 通道多路复用器进一步降低了PCB 板级空间要求。

低功耗和小外形尺寸使LTC2309 非常适合于电池供电型和便携式应用，而二线式 I2C 兼容型串行接口则令该ADC 成为空间受限型系统的一种上佳选择。

BACK TO TOP封装QFN-24BACK TO TOP订购信息∙以PBF 结尾的器件型号表示这些是无铅型器件。

如需了解有关含铅涂层器件的信息，请与凌力尔特公司联系。

∙型号当中包含TR 或TRM 的器件分别采用卷带装或500 片微型卷带装的形式进行装运。

LTC5509 RF电源检测器演示板快速使用指南说明书

February 14, 2003DC539B DEMO BOARD QUICK START GUIDEINTRODUCTIONThe DC539B demo board is used to evaluate the LTC5509, RF power detector with integrated output buffer and voltage reference. The LTC5509 converts an RF input signal at pin 6 (RF) to a DC voltage at pin 3 (Vout). The RF input frequency range is 300 MHz to 3000 MHz. Maximum input power is8 dBm. The output voltage at Vout will start at an initial DC value of typically 250mV. When the RF signal is applied the output voltage will increase.The optional 68Ω (R1) termination resistor is not placed on PCB. The optional C5 shunt capacitor is not installed. R2 and C5 form a low pass filter at Vout. Capacitor C1 is 33 pF for high frequency tests and evaluations at 1000 to 3000 MHz. For frequencies at 300 to 1000 MHz a 51 pF value is suggested.A logic high at pin 1 enables the part. It is controlled by a jumper JP1.The DC539B demo board is easily set up for evaluating the LTC5509 RF power detector performance. Follow the procedures outlined below and connections on the attached diagram for proper operation. 1.Connect the input DC power supply (2.7V to 6V) to Vcc pin (E1). Connect the power supply groundto ground pin (E3 or E5). Connect RF input (SMA connector J1) to the RF signal generator output via coaxial cable. It is common practice to include a 3dB pad at the RF input of the demo board to minimize reflections back into the signal generator.2.The part can be shutdown via jumper switch JP1. When JP1 is connected to ground the part will bein shutdown. When JP1 is connected to VCC via the 22k resistor the part will be enabled. The shutdown terminal E4 can also be controlled externally by a pulse from function generator, tocharacterize enable times from the shutdown state. When external shutdown signal is used, set JP1 to the enable position. External 50Ω termination from E4 to ground is recommended for timing measurements when signal source with 50Ω output impedance is used. Connect a pulse generator to E4 via a coaxial cable.3.With JP1 set to the enable position, apply an RF input signal (-35 to +9dBm) and measure the VoutDC voltage at E2.DC539B Demo Board Connection Diagram。

SI2309DS PDF规格书

400 Ciss
300
200
Coss 100
Crss
0
0
6
12
18
24
30
VDS - Drain-to-Source Voltage (V)
2.0 On-Resistance vs. Junction Temperature
1.8
VGS = 10 V
ID = 1.25 A
1.6
1.4
1.2
1.0
0.8
0.4
Unit: mm
0.1 +0.05 -0.01
1.Gate 2.Source 3.Drain
G1 S2
■ Features
● VDS (V) =-60V ● ID =-1.25 A (VGS =-10V) ● RDS(ON) ＜ 340mΩ (VGS =-10V) ● RDS(ON) ＜ 550mΩ (VGS =-4.5V)
0.6 -50 -25 0 25 50 75 100 125 150
TJ - Junction Temperature ( C)
V GS - Gate-to-Source Voltage (V)
SI2309DS P-Channel Enhancement MOSFET
I S - Source Current (A)
VGS(th) Variance (V)
■ Typical Characterisitics
Source-Drain Diode Forward Voltage 10
On-Resistance vs. Gate-to-Source Voltage 1.0
0.8
rDS(on) - On-Resistance ( )

si2309ds场效应管参数

si2309ds场效应管参数
Si2309DS是一款N通道增强型场效应管，具有低导通电阻、高开关速度和低功耗等优点。

以下是Si2309DS的参数介绍：
1.晶体管类型：N通道增强型场效应管
2.最大工作电压：60V
3.最大导通电流：60A
4.最大功耗：150W
5.开关速度：非常快
6.输入电容：非常小，适用于高频率电路
7.热稳定性好，适用于高温环境
Si2309DS的导通电阻低，可有效降低能耗和发热，特别适合于高负载电流的应用场景，如电源转换、电机驱动等。

此外，Si2309DS还具有优秀的开关速度和低输入电容，适用于高频电路和高性能的电子设备。

该场效应管的热稳定性好，能够在高温环境下稳定工作，适用于各种恶劣的工作环境。

Si2309DS的封装形式为TO-220，具有可承受大电流、耐高温的优点。

在使用时，需要注意场效应管的引脚应正确连接，避免出现短路或断路等异常情况。

同时，在应用中还需要注意散热问题，确保场效应管能够正常工作并延长其使用寿命。

总之，Si2309DS是一款高性能的N通道增强型场效应管，具有低导通电阻、高开关速度和低功耗等优点，适用于各种高负载电流的应用场景。

在使用时，需要注意正确连接引脚、散热问题等细节，以确保其正常工作并延长其使用寿命。

LTCC技术参数手册

LTCC技术参数手册LTCC技术参数手册1、引言1.1 本手册旨在介绍和详细描述LTCC（低温共烧陶瓷）技术的参数。

1.2 LTCC是一种先进的封装技术，广泛应用于微电子器件以及高频和高温应用中。

2、LTCC基本原理2.1 LTCC工艺简介2.1.1 LTCC工艺的特点和优势2.1.2 LTCC工艺的基本步骤2.2 LTCC材料2.2.1 LTCC材料组成和特性2.2.2 选择合适的LTCC材料的考虑因素3、LTCC技术参数3.1 LTCC封装参数3.1.1 封装器件尺寸要求3.1.2 管脚和引脚要求3.1.3 外部连接要求3.2 LTCC电气参数3.2.1 电阻和电导率要求3.2.2 介电常数和介质损耗要求 3.3 LTCC热学参数3.3.1 热传导系数要求3.3.2 热膨胀系数和热稳定性要求 3.4 LTCC机械参数3.4.1 弯曲强度要求3.4.2 硬度和耐磨性要求3.4.3 表面粗糙度要求3.5 LTCC可靠性参数3.5.1 温度循环和湿热循环要求3.5.2 振动和冲击要求4、附件4.1 LTCC技术规范书4.2 LTCC产品样例集4.3 LTCC相关技术报告5、法律名词及注释5.1 LTCC: 低温共烧陶瓷（Low Temperature Co-fired Ceramic）技术5.2 封装器件尺寸要求: LTCC封装中关于器件尺寸的规定5.3 管脚和引脚要求: LTCC封装中关于管脚和引脚的要求5.4 电阻和电导率要求: LTCC材料的电阻和电导率的指标5.5 介电常数和介质损耗要求: LTCC材料的介电常数和介质损耗的指标5.6 热传导系数要求: LTCC材料的热传导系数的指标5.7 热膨胀系数和热稳定性要求: LTCC材料的热膨胀系数和热稳定性的指标5.8弯曲强度要求: LTCC材料的弯曲强度的指标5.9硬度和耐磨性要求: LTCC材料的硬度和耐磨性的指标5.10 表面粗糙度要求: LTCC材料的表面粗糙度的指标5.11 温度循环和湿热循环要求: LTCC器件的温度循环和湿热循环的要求5.12 振动和冲击要求: LTCC器件的振动和冲击的要求。