L9407F中文资料
LANF中文资料
FEATURES● Low Ripple and Noise● Single and Dual Output● Ultra Miniature SIP: 12 Pin● RoHS Approved Type Available● Regulated and Non-Regulated Versions Available● Two Levels of I/O Isolation Available: 500VDC or 3KVDCSPECIFICATIONS: LAN F SeriesAll specifications apply @ ±25°C ambient unless otherwise notedINPUT SPECIFICATIONSInput Voltage Range.......5V nom. input..................4.5 – 5.5VDC12V nom. input............10.8 – 13.2VDC15V nom. input............13.5 – 16.5VDC24V nom. input............21.6 – 26.4VDC Input Filter...................................................................Pi Network. OUTPUT SPECIFICATIONSOutput Current................................................................see table Output Voltage................................................................see table Voltage Tolerance (nom. Line 100% load).. (5)Line RegulationRegulated...............................................................±0.5% max. Non-Regulated.................................................±1.2%/% of Vin Load RegulationRegulated.......................................................................±0.5% Non-Regulated (load 20% to 100%).. (10)Ripple/Noise (20 MHz BW)....................................50mVp-p max. PROTECTIONShort Circuit Protection.................................................Continuous GENERAL SPECIFICATIONSEfficiencyRegulated...........................................................55 to 65% typ. Non-Regulated....................................................70 to 75% typ. Switching Frequency....................................................20KHz min. Isolation Voltage (input to output).................500VDC or 3000VDC ENVIRONMENTAL SPECIFICATIONSOperating Temperature..........................................-25°C to +71°C Storage Temperature.............................................-40°C to+100°C Cooling.............................................................Free air convection PHYSICAL SPECIFICATIONS Dimensions..............................1.25(L) x 0.34(W) x 0.57(H) inches Case Material.....................................Non-conductive black plasticDue to advances in technology, specifications subject to change without noticeOUTPUT VOLTAGE / CURRENT RATING CHARTModel (See Note 2) Input Voltage Range Output VoltageOutput CurrentLANF505N 5 VDC 300 mA LANF509N 9 VDC 170 mA LANF512N 12 VDC 125 mA LAN5515N 15 VDC 100 mA LANF524N 24 VDC 65 mA LANF505ND ±5 VDC 100 mA LANF512ND ±12 VDC 60 mA LAN5515ND 5 VDC 4.5 – 5.5 VDC±15 VDC 50 mA LANF1205N 5 VDC 300 mA LANF1209N 9 VDC 170 mA LANF1212N 12 VDC 125 mA LANF1215N 15 VDC 100 mA LANF1224N 24 VDC 65 mA LANF1205ND ±5 VDC 100 mA LANF1212ND ±12 VDC 60 mA LANF1215ND 12 VDC 10.8 – 13.2 VDC±15 VDC 50 mA LANF1505N 5 VDC 300 mA LANF1509N 9 VDC 170 mA LANF1512N 12 VDC 125 mA LANF1515N 15 VDC 100 mA LANF1524N 24 VDC 65 mA LANF1505ND ±5 VDC 100 mA LANF1512ND ±12 VDC 60 mA LANF1515ND 15 VDC 13.5 – 16.5 VDC±15 VDC 50 mA LANF2405N 5 VDC 300 mA LANF2409N 9 VDC 170 mA LANF2412N 12 VDC 125 mA LANF2415N 15 VDC 100 mA LANF2424N 24 VDC 65 mA LANF2405ND ±5 VDC 100 mA LANF2412ND ±12 VDC 60 mA LANF2415ND24 VDC 21.6 – 26.4 VDC±15 VDC50 mANOTES1. All case and pin-to-case dimensions reference only unless otherwise noted.2. All LANF models can be regulated, substitute “R” for “N” in last digits of part number (Ex: LANF2415R).3. Add “H” onto the end of LANF part number for 3000VDC isolation (Ex: LANF2415NH).4. For RoHS type add the suffix “-NL” to part number (Ex: LANF2415N-NL).MECHANICAL DRAWINGSPIN CONNECTIONPIN SINGLE OUTPUT DUAL OUTPUT1 +INPUT +INPUT2 NC -OUTPUT9 NC NC10 -OUTPUT COM11 +OUTPUT +OUTPUT12 -INPUT -INPUT。
R5F21274KXXXFP资料
R8C/26 Group, R8C/27 GroupSINGLE-CHIP 16-BIT CMOS MCU1.OverviewThese MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks).The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash.Their peripheral functions are the same.1.1ApplicationsElectronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.REJ03B0168-0130Rev.1.30May 25, 2007J and K versions are under development. Specifications may be changed without prior notice.1.2Performance OverviewTable 1.1 outlines the Functions and Specifications for R8C/26Group and Table 1.2 outlines the Functions and Specifications for R8C/27 Group.NOTES:1.I 2C bus is a trademark of Koninklijke Philips Electronics N. V.2.Specify the D, K version if D, K version functions are to be used.Table 1.1Functions and Specifications for R8C/26GroupItemSpecificationCPUNumber of fundamental instructions89 instructionsMinimum instruction execution time 50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) (other than K version)62.5 ns (f(XIN) = 16 MHz, VCC = 3.0 to 5.5 V) (K version)100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V)200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) (N, D version)Operating mode Single-chip Address space 1 MbyteMemory capacity Refer to Table 1.3 Product Information for R8C/26 Group Peripheral FunctionsPortsI/O ports: 25 pins, Input port: 3 pins LED drive ports I/O ports: 8 pins (N, D version)TimersTimer RA: 8 bits × 1 channel Timer RB: 8 bits × 1 channel(Each timer equipped with 8-bit prescaler)Timer RC: 16 bits × 1 channel(Input capture and output compare circuits)Timer RE: With real-time clock and compare match function(For J, K version, compare match function only.)Serial interfaces 2 channels (UART0, UART1)Clock synchronous serial I/O, UART Clock synchronous serial interface 1 channelI 2C bus Interface (1)Clock synchronous serial I/O with chip select LIN module Hardware LIN: 1 channel (timer RA, UART0)A/D converter 10-bit A/D converter: 1 circuit, 12 channels Watchdog timer 15 bits × 1 channel (with prescaler)Start-on-reset selectableInterrupts Internal: 15 sources, External: 4 sources, Software: 4 sources, Priority levels: 7 levels Clock generation circuits3 circuits•XIN clock generation circuit (with on-chip feedback resistor)•On-chip oscillator (high speed, low speed)High-speed on-chip oscillator has a frequency adjustment function •XCIN clock generation circuit (32 kHz) (N, D version)•Real-time clock (timer RE) (N, D version)Oscillation-stopped detectorXIN clock oscillation stop detection function Voltage detection circuitOn-chipPower-on reset circuit On-chipElectricalCharacteristicsSupply voltageVCC = 3.0 to 5.5 V (f(XIN) = 20 MHz) (other than K version)VCC = 3.0 to 5.5 V (f(XIN) = 16 MHz) (K version)VCC = 2.7 to 5.5 V (f(XIN) = 10 MHz)VCC = 2.2 to 5.5 V (f(XIN) = 5 MHz) (N, D version)Current consumption (N, D version)Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz)Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz)Typ. 2.0 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz)Typ. 0.7 µA (VCC = 3.0 V, stop mode)Flash MemoryProgramming and erasure voltage VCC = 2.7 to 5.5 V Programming and erasure endurance100 timesOperating Ambient Temperature-20 to 85°C (N version)-40 to 85°C (D, J version)(2), -40 to 125°C (K version)(2)Package 32-pin molded-plastic LQFPNOTES:1.I 2C bus is a trademark of Koninklijke Philips Electronics N. V.2.Specify the D, K version if D, K version functions are to be used.Table 1.2Functions and Specifications for R8C/27 GroupItem SpecificationCPU Number of fundamental instructions89 instructionsMinimum instruction execution time 50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) (other than K version)62.5 ns (f(XIN) = 16 MHz, VCC = 3.0 to 5.5 V) (K version)100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V)200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) (N, D version)Operating mode Single-chip Address space 1 Mbyte Memory capacity Refer to Table 1.4 Product Information of R8C/27 GroupPeripheral Functions Ports I/O ports: 25 pins, Input port: 3 pins LED drive ports I/O ports: 8 pins (N, D version)Timers Timer RA: 8 bits × 1 channelTimer RB: 8 bits × 1 channel(Each timer equipped with 8-bit prescaler)Timer RC: 16 bits × 1 channel(Input capture and output compare circuits)Timer RE: With real-time clock and compare match function(For J, K version, compare match function only.)Serial interfaces 2 channels (UART0, UART1)Clock synchronous serial I/O, UARTClock synchronous serial interface 1 channel I 2C bus Interface (1)Clock synchronous serial I/O with chip selectLIN module Hardware LIN: 1 channel (timer RA, UART0)A/D converter 10-bit A/D converter: 1 circuit, 12 channels Watchdog timer 15 bits × 1 channel (with prescaler)Start-on-reset selectableInterrupts Internal: 15 sources, External: 4 sources,Software: 4 sources, Priority levels: 7 levelsClock generation circuits 3 circuits •XIN clock generation circuit (with on-chip feedback resistor)•On-chip oscillator (high speed, low speed)High-speed on-chip oscillator has a frequency adjustment function •XCIN clock generation circuit (32 kHz) (N, D version)•Real-time clock (timer RE) (N, D version)Oscillation-stopped detectorXIN clock oscillation stop detection function Voltage detection circuit On-chip Power-on reset circuit On-chipElectrical Characteristics Supply voltage VCC = 3.0 to 5.5 V (f(XIN) = 20 MHz) (other than K version)VCC = 3.0 to 5.5 V (f(XIN) = 16 MHz) (K version)VCC = 2.7 to 5.5 V (f(XIN) = 10 MHz)VCC = 2.2 to 5.5 V (f(XIN) = 5 MHz) (N, D version)Current consumption (N, D version)Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz)Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz)Typ. 2.0 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz)Typ. 0.7 µA (VCC = 3.0 V, stop mode)Flash Memory Programming and erasure voltage VCC = 2.7 to 5.5 VProgramming and erasure endurance 10,000 times (data flash)1,000 times (program ROM)Operating Ambient Temperature -20 to 85°C (N version)-40 to 85°C (D, J version)(2), -40 to 125°C (K version)(2)Package 32-pin molded-plastic LQFP1.3 Block DiagramFigure 1.1 shows a Block Diagram.1.4Product InformationTable 1.3 lists Product Information for R8C/26 Group and Table 1.4 lists Product Information for R8C/27 Group.(D): Under development NOTES:1.These versions are under development. Specifications may be changed without prior notice.2.The user ROM is programmed before shipment.Table 1.3Product Information for R8C/26 Group Current of May. 2007 Part No.ROM Capacity RAM Capacity Package Type RemarksR5F21262SNFP 8 Kbytes 512 bytes PLQP0032GB-A N versionR5F21264SNFP 16 Kbytes 1 Kbyte PLQP0032GB-A R5F21265SNFP 24 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21266SNFP 32 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21262SDFP 8 Kbytes 512 bytes PLQP0032GB-A D versionR5F21264SDFP 16 Kbytes 1 Kbyte PLQP0032GB-A R5F21265SDFP 24 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21266SDFP 32 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21264JFP (D)16 Kbytes 1 Kbyte PLQP0032GB-A J version (1)R5F21266JFP (D)32 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21264KFP (D)16 Kbytes 1 Kbyte PLQP0032GB-A K version (1)R5F21266KFP (D)32 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21262SNXXXFP (D) 8 Kbytes 512 bytes PLQP0032GB-A N version (1)Factoryprogramming product (2)R5F21264SNXXXFP (D)16 Kbytes 1 Kbyte PLQP0032GB-A R5F21265SNXXXFP (D)24 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21266SNXXXFP (D)32 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21262SDXXXFP (D) 8 Kbytes 512 bytes PLQP0032GB-A D version (1)R5F21264SDXXXFP (D)16 Kbytes 1 Kbyte PLQP0032GB-A R5F21265SDXXXFP (D)24 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21266SDXXXFP (D)32 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21264JXXXFP (D)16 Kbytes 1 Kbyte PLQP0032GB-A J version (1)R5F21266JXXXFP (D)32 Kbytes 1.5 Kbytes PLQP0032GB-A R5F21264KXXXFP (D)16 Kbytes 1 Kbyte PLQP0032GB-A K version (1)R5F21266KXXXFP (D)32 Kbytes1.5 KbytesPLQP0032GB-A(D): Under development NOTES:1.These versions are under development. Specifications may be changed without prior notice.2.The user ROM is programmed before shipment.Table 1.4Product Information for R8C/27 GroupCurrent of May. 2007Part No.ROM Capacity RAM Capacity Package Type RemarksProgramROMData flashR5F21272SNFP 8 Kbytes 1 Kbyte × 2512 bytes PLQP0032GB-A N versionR5F21274SNFP 16 Kbytes 1 Kbyte × 2 1 Kbyte PLQP0032GB-A R5F21275SNFP 24 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21276SNFP 32 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21272SDFP 8 Kbytes 1 Kbyte × 2512 bytes PLQP0032GB-A D versionR5F21274SDFP 16 Kbytes 1 Kbyte × 2 1 Kbyte PLQP0032GB-A R5F21275SDFP 24 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21276SDFP 32 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21274JFP (D)16 Kbytes 1 Kbyte × 2 1 Kbyte PLQP0032GB-A J version (1)R5F21276JFP (D)32 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21274KFP (D)16 Kbytes 1 Kbyte × 2 1 Kbyte PLQP0032GB-A K version (1)R5F21276KFP (D)32 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21272SNXXXFP (D) 8 Kbytes 1 Kbyte × 2512 bytes PLQP0032GB-A N version (1)Factoryprogramming product (2)R5F21274SNXXXFP (D)16 Kbytes 1 Kbyte × 2 1 Kbyte PLQP0032GB-A R5F21275SNXXXFP (D)24 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21276SNXXXFP (D)32 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21272SDXXXFP (D) 8 Kbytes 1 Kbyte × 2512 bytes PLQP0032GB-A D version (1)R5F21274SDXXXFP (D)16 Kbytes 1 Kbyte × 2 1 Kbyte PLQP0032GB-A R5F21275SDXXXFP (D)24 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21276SDXXXFP (D)32 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21274JXXXFP (D)16 Kbytes 1 Kbyte × 2 1 Kbyte PLQP0032GB-A J version (1)R5F21276JXXXFP (D)32 Kbytes 1 Kbyte × 2 1.5 Kbytes PLQP0032GB-A R5F21274KXXXFP (D)16 Kbytes 1 Kbyte × 2 1 Kbyte PLQP0032GB-A K version (1)R5F21276KXXXFP (D)32 Kbytes 1 Kbyte × 21.5 KbytesPLQP0032GB-A1.5Pin AssignmentsFigure 1.4 shows Pin Assignments (Top View).1.6Pin FunctionsTable 1.5 lists Pin Functions.I: InputO: OutputI/O: Input and outputTable 1.5Pin FunctionsTypeSymbolI/O TypeDescriptionPower supply input VCC, VSS I Apply 2.2 V to 5.5 V (J, K version are 2.7 V to 5.5 V) to the VCC pin. Apply 0 V to the VSS pin.Analog power supply input AVCC, AVSS I Power supply for the A/D converter.Connect a capacitor between AVCC and AVSS.Reset input RESET I Input “L” on this pin resets the MCU.MODE MODE I Connect this pin to VCC via a resistor.XIN clock input XIN I These pins are provided for XIN clock generation circuit I/O.Connect a ceramic resonator or a crystal oscillator between the XIN and XOUT pins. To use an external clock, input it to the XIN pin and leave the XOUT pin open.XIN clock output XOUT O XCIN clock input (N, D version)XCIN I These pins are provided for XCIN clock generation circuit I/O.Connect a crystal oscillator between the XCIN and XCOUT pins. To use an external clock, input it to the XCIN pin and leave the XCOUT pin open.XCIN clock output (N, D version)XCOUTO INT interrupt input INT0, INT1, INT3I INT interrupt input pins Key input interrupt KI0 to KI3I Key input interrupt input pins Timer RA TRAO O Timer RA output pin TRAIO I/O Timer RA I/O pin Timer RB TRBO O Timer RB output pin Timer RCTRCCLK I External clock input pin TRCTRGI External trigger input pinTRCIOA, TRCIOB, TRCIOC, TRCIODI/O Sharing output-compare output / input-capture input / PWM / PWM2 output pins Timer RE TREO O Timer RE output pin Serial interfaceCLK0, CLK1I/O Clock I/O pinRXD0, RXD1I Receive data input pin TXD0, TXD1O Transmit data output pin I 2C bus interfaceSCL I/O Clock I/O pin SDAI/O Data I/O pin Clock synchronous serial I/O with chip selectSSI I/O Data I/O pinSCS I/O Chip-select signal I/O pin SSCKI/O Clock I/O pin SSOI/O Data I/O pinReference voltage input VREF I Reference voltage input pin to A/D converter A/D converter AN0 to AN11I Analog input pins to A/D converterI/O portP0_0 to P0_7, P1_0 to P1_7, P3_1, P3_3 to P3_7,P4_5,P5_3, P5_4I/OCMOS I/O ports. Each port has an I/O select direction register,allowing each pin in the port to be directed for input or output individually.Any port set to input can be set to use a pull-up resistor or not by a program.P1_0 to P1_7 also function as LED drive ports. (N, D version)Input port P4_2, P4_6, P4_7IInput-only portsR8C/26 Group, R8C/27 Group1. OverviewNOTES:1.This can be assigned to the pin in parentheses by a program.2.XCIN, XCOUT can be used only for N or D version.Table 1.6Pin Name Information by Pin NumberPin Number Control Pin PortI/O Pin Functions for of Peripheral ModulesInterruptTimerSerial Interface ClockSynchronous Serial I/O with Chip Select I 2C busInterface A/D Converter1P3_5(TRCIOD)(1)SSCK SCL 2P3_7TRAO RXD1/(TXD1)(1)SSO3RESET 4XOUT/XCOUT (2)P4_75VSS/AVSS 6XIN/XCIN (2)P4_67VCC/AVCC 8MODE9P4_5INT0(RXD1)(1)10P1_7INT1TRAIO11P3_6(INT1)(1)(TXD1)/(RXD1)(1)12P3_1TRBO 13P5_4TRCIOD 14P5_3TRCIOC 15P1_6CLK0(SSI)(1)16P1_5(INT1)(1)(TRAIO)(1)RXD017P1_4TXD018P1_3KI3(TRBO)AN1119P1_2KI2TRCIOB AN1020VRFFP4_221P1_1KI1TRCIOA/TRCTRGAN922P1_0KI0AN823P3_3INT3TRCCLK SSI 24P3_4(TRCIOC)(1)SCSSDA25P0_7AN026P0_6AN127P0_5CLK1AN228P0_4TREOAN329P0_3AN430P0_2AN531P0_1AN632P0_0(TXD1)(1)AN72.Central Processing Unit (CPU)Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. R0, R1, R2, R3, A0, A1, and FB configure a register bank. There are two sets of register bank.2.1Data Registers (R0, R1, R2, and R3)R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split into high-order bits (R0H) and low-order bits (R0L) to be used separately as 8-bit data registers. R1H and R1L are analogous to R0H and R0L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). R3R1 is analogous to R2R0.2.2Address Registers (A0 and A1)A0 is a 16-bit register for address register indirect addressing and address register relative addressing. It is also used for transfer, arithmetic, and logic operations. A1 is analogous to A0. A1 can be combined with A0 to be used as a 32-bit address register (A1A0).2.3Frame Base Register (FB)FB is a 16-bit register for FB relative addressing.2.4Interrupt Table Register (INTB)INTB is a 20-bit register that indicates the start address of an interrupt vector table.2.5Program Counter (PC)PC is 20 bits wide and indicates the address of the next instruction to be executed.2.6User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)The stack pointers (SP), USP, and ISP, are each 16 bits wide. The U flag of FLG is used to switch betweenUSP and ISP.2.7Static Base Register (SB)SB is a 16-bit register for SB relative addressing.2.8Flag Register (FLG)FLG is an 11-bit register indicating the CPU state.2.8.1Carry Flag (C)The C flag retains carry, borrow, or shift-out bits that have been generated by the arithmetic and logic unit.2.8.2Debug Flag (D)The D flag is for debugging only. Set it to 0.2.8.3Zero Flag (Z)The Z flag is set to 1 when an arithmetic operation results in 0; otherwise to 0.2.8.4Sign Flag (S)The S flag is set to 1 when an arithmetic operation results in a negative value; otherwise to 0.2.8.5Register Bank Select Flag (B)Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is set to 1.2.8.6Overflow Flag (O)The O flag is set to 1 when an operation results in an overflow; otherwise to 0.2.8.7Interrupt Enable Flag (I)The I flag enables maskable interrupts.Interrupt are disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0 when an interrupt request is acknowledged.2.8.8Stack Pointer Select Flag (U)ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1.The U flag is set to 0 when a hardware interrupt request is acknowledged or the INT instruction of software interrupt numbers 0 to 31 is executed.2.8.9Processor Interrupt Priority Level (IPL)IPL is 3 bits wide and assigns processor interrupt priority levels from level 0 to level 7.If a requested interrupt has higher priority than IPL, the interrupt is enabled.2.8.10Reserved BitIf necessary, set to 0. When read, the content is undefined.3.Memory3.1R8C/26 GroupFigure 3.1 is a Memory Map of R8C/26 Group. The R8C/26 group has 1 Mbyte of address space from addresses 00000h to FFFFFh.The internal ROM is allocated lower addresses, beginning with address 0FFFFh. For example, a 16-Kbyte internal ROM area is allocated addresses 0C000h to 0FFFFh.The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each interrupt routine.The internal RAM is allocated higher addresses beginning with address 00400h. For example, a 1-Kbyte internal RAM area is allocated addresses 00400h to 007FFh. The internal RAM is used not only for storing data but also for calling subroutines and as stacks when interrupt requests are acknowledged.Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control registers are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use and cannot be accessed by users.3.2R8C/27 GroupFigure 3.2 is a Memory Map of R8C/27 Group. The R8C/27 group has 1 Mbyte of address space from addresses 00000h to FFFFFh.The internal ROM (program ROM) is allocated lower addresses, beginning with address 0FFFFh. For example, a 16-Kbyte internal ROM area is allocated addresses 0C000h to 0FFFFh.The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each interrupt routine.The internal ROM (data flash) is allocated addresses 02400h to 02BFFh.The internal RAM area is allocated higher addresses, beginning with address 00400h. For example, a 1-Kbyte internal RAM is allocated addresses 00400h to 007FFh. The internal RAM is used not only for storing data but also for calling subroutines and as stacks when interrupt requests are acknowledged.Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control registers are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use and cannot be accessed by users.4.Special Function Registers (SFRs)An SFR (special function register) is a control register for a peripheral function. Tables 4.1 to 4.7 list the special function registers.Table 4.1SFR Information (1)(1)X: Undefined NOTES:1.The blank regions are reserved. Do not access locations in these regions.2.The CSPROINI bit in the OFS register is set to 0.3.In J, K version these regions are reserved. Do not access locations in these regions.Address RegisterSymbolAfter reset0000h 0001h 0002h 0003h 0004h Processor Mode Register 0PM000h 0005h Processor Mode Register 1PM100h0006h System Clock Control Register 0CM001101000b 0007h System Clock Control Register 1CM100100000b0008h 0009h 000Ah Protect RegisterPRCR 00h 000Bh 000Ch Oscillation Stop Detection Register OCD 00000100b 000Dh Watchdog Timer Reset Register WDTR XXh 000Eh Watchdog Timer Start Register WDTS XXh000Fh Watchdog Timer Control Register WDC 00X11111b 0010h Address Match Interrupt Register 0RMAD000h 0011h 00h 0012h 00h 0013h Address Match Interrupt Enable Register AIER 00h 0014h Address Match Interrupt Register 1RMAD100h 0015h 00h 0016h 00h0017h 0018h 0019h 001Ah 001Bh 001ChCount Source Protection Mode Register CSPR00h10000000b (2)001Dh 001Eh 001Fh 0020h 0021h 0022h 0023h High-Speed On-Chip Oscillator Control Register 0FRA000h0024h High-Speed On-Chip Oscillator Control Register 1FRA1When shipping 0025h High-Speed On-Chip Oscillator Control Register 2FRA200h0026h 0027h 0028h Clock Prescaler Reset Flag CPSRF 00h0029h High-Speed On-Chip Oscillator Control Register 4(3)FRA4When shipping 002Ah 002Bh High-Speed On-Chip Oscillator Control Register 6(3)FRA6When shipping002Ch 002Dh 002Eh 002FhTable 4.2SFR Information (2)(1)X: Undefined NOTES:1.The blank regions are reserved. Do not access locations in these regions.2.(N, D version) Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect this register.(J, K version) Software reset, watchdog timer reset, or voltage monitor 2 reset do not affect this register.3.The LVD0ON bit in the OFS register is set to 1 and hardware reset.4.Power-on reset, voltage monitor 0 reset or the LVD0ON bit in the OFS register is set to 0, and hardware reset.5.(N, D version) Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect b2 and b3.(J, K version) Software reset, watchdog timer reset, or voltage monitor 2 reset do not affect b2 and b3.6.(N, D version) Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect this register.(J, K version) These regions are reserved. Do not access locations in these regions.7.The LVD1ON bit in the OFS register is set to 1 and hardware reset.8.Power-on reset, voltage monitor 1 reset, or the LVD1ON bit in the OFS register is set to 0 and hardware reset.9.Selected by the IICSEL bit in the PMR register.Address RegisterSymbolAfter reset0030h 0031h Voltage Detection Register 1 (2)VCA100001000b0032hVoltage Detection Register 2 (2)VCA2•N, Dversion 00h (3)00100000b (4)•J, K version 00h (7)01000000b (8)0033h 0034h 0035h 0036hVoltage Monitor 1 Circuit Control Register (5)VW1C•N, D version 00001000b •J, K version 0000X000b (7)0100X000b (8)0037h Voltage Monitor 2 Circuit Control Register (5)VW2C 00h0038h Voltage Monitor 0 Circuit Control Register (6)VW0C0000X000b (3)0100X001b (4)0039h 003Fh 0040h 0041h 0042h 0043h 0044h 0045h 0046h 0047h Timer RC Interrupt Control Register TRCIC XXXXX000b0048h 0049h 004Ah Timer RE Interrupt Control Register TREIC XXXXX000b004Bh 004Ch 004Dh Key Input Interrupt Control RegisterKUPIC XXXXX000b 004Eh A/D Conversion Interrupt Control Register ADICXXXXX000b 004Fh SSU / IIC Interrupt Control Register (9)SSUIC / IICIC XXXXX000b 0050h 0051h UART0 Transmit Interrupt Control Register S0TIC XXXXX000b 0052h UART0 Receive Interrupt Control Register S0RIC XXXXX000b 0053h UART1 Transmit Interrupt Control Register S1TIC XXXXX000b 0054h UART1 Receive Interrupt Control Register S1RIC XXXXX000b 0055h 0056h Timer RA Interrupt Control Register TRAIC XXXXX000b 0057h 0058h Timer RB Interrupt Control Register TRBIC XXXXX000b 0059h INT1 Interrupt Control Register INT1IC XX00X000b 005Ah INT3 Interrupt Control RegisterINT3ICXX00X000b005Bh 005Ch 005Dh INT0 Interrupt Control Register INT0IC XX00X000b005Eh 005Fh 0060h 006Fh 0070h 007FhTable 4.3SFR Information (3)(1)Address Register Symbol After reset 0080h0081h0082h0083h0084h0085h0086h0087h0088h0089h008Ah008Bh008Ch008Dh008Eh008Fh0090h0091h0092h0093h0094h0095h0096h0097h0098h0099h009Ah009Bh009Ch009Dh009Eh009Fh00A0h UART0 Transmit/Receive Mode Register U0MR00h00A1h UART0 Bit Rate Register U0BRG XXh00A2h UART0 Transmit Buffer Register U0TB XXh00A3h XXh00A4h UART0 Transmit/Receive Control Register 0U0C000001000b 00A5h UART0 Transmit/Receive Control Register 1U0C100000010b 00A6h UART0 Receive Buffer Register U0RB XXh00A7h XXh00A8h UART1 Transmit/Receive Mode Register U1MR00h00A9h UART1 Bit Rate Register U1BRG XXh00AAh UART1 Transmit Buffer Register U1TB XXh00ABh XXh00ACh UART1 Transmit/Receive Control Register 0U1C000001000b 00ADh UART1 Transmit/Receive Control Register 1U1C100000010b 00AEh UART1 Receive Buffer Register U1RB XXh00AFh XXh00B0h00B1h00B2h00B3h00B4h00B5h00B6h00B7h00B8h SS Control Register H / IIC bus Control Register 1(2)SSCRH / ICCR100h00B9h SS Control Register L / IIC bus Control Register 2(2)SSCRL / ICCR201111101b 00BAh SS Mode Register / IIC bus Mode Register(2)SSMR / ICMR00011000b 00BBh SS Enable Register / IIC bus Interrupt Enable Register(2)SSER / ICIER00h00BCh SS Status Register / IIC bus Status Register(2)SSSR / ICSR00h / 0000X000b 00BDh SS Mode Register 2 / Slave Address Register(2)SSMR2 / SAR00h00BEh SS Transmit Data Register / IIC bus Transmit Data Register(2)SSTDR / ICDRT FFh00BFh SS Receive Data Register / IIC bus Receive Data Register(2)SSRDR / ICDRR FFhX: UndefinedNOTES:1.The blank regions are reserved. Do not access locations in these regions.2.Selected by the IICSEL bit in the PMR register.Table 4.4SFR Information (4)(1)Address Register Symbol After reset 00C0h A/D Register AD XXh00C1h XXh00C2h00C3h00C4h00C5h00C6h00C7h00C8h00C9h00CAh00CBh00CCh00CDh00CEh00CFh00D0h00D1h00D2h00D3h00D4h A/D Control Register 2ADCON200h00D5h00D6h A/D Control Register 0ADCON000h00D7h A/D Control Register 1ADCON100h00D8h00D9h00DAh00DBh00DCh00DDh00DEh00DFh00E0h Port P0 Register P000h00E1h Port P1 Register P100h00E2h Port P0 Direction Register PD000h00E3h Port P1 Direction Register PD100h00E4h00E5h Port P3 Register P300h00E6h00E7h Port P3 Direction Register PD300h00E8h Port P4 Register P400h00E9h Port P5 Register P500h00EAh Port P4 Direction Register PD400h00EBh Port P5 Direction Register PD500h00ECh00EDh00EEh00EFh00F0h00F1h00F2h00F3h00F4h00F5h Pin Select Register 1PINSR100h00F6h Pin Select Register 2PINSR200h00F7h Pin Select Register 3PINSR300h00F8h Port Mode Register PMR00h00F9h External Input Enable Register INTEN00h00FAh INT Input Filter Select Register INTF00h00FBh Key Input Enable Register KIEN00h00FCh Pull-Up Control Register 0PUR000h00FDh Pull-Up Control Register 1PUR100h00FEh Port P1 Drive Capacity Control Register(2)P1DRR00h00FFhX: UndefinedNOTES:1.The blank regions are reserved. Do not access locations in these regions.2.In J, K version these regions are reserved. Do not access locations in these regions.Table 4.5SFR Information (5)(1)Address Register Symbol After reset 0100h Timer RA Control Register TRACR00h0101h Timer RA I/O Control Register TRAIOC00h0102h Timer RA Mode Register TRAMR00h0103h Timer RA Prescaler Register TRAPRE FFh0104h Timer RA Register TRA FFh0105h0106h LIN Control Register LINCR00h0107h LIN Status Register LINST00h0108h Timer RB Control Register TRBCR00h0109h Timer RB One-Shot Control Register TRBOCR00h010Ah Timer RB I/O Control Register TRBIOC00h010Bh Timer RB Mode Register TRBMR00h010Ch Timer RB Prescaler Register TRBPRE FFh010Dh Timer RB Secondary Register TRBSC FFh010Eh Timer RB Primary Register TRBPR FFh010Fh0110h0111h0112h0113h0114h0115h0116h0117h0118h Timer RE Second Data Register / Counter Data Register TRESEC00h0119h Timer RE Minute Data Register / Compare Data Register TREMIN00h011Ah Timer RE Hour Data Register(2)TREHR00h011Bh Timer RE Day of Week Data Register(2)TREWK00h011Ch Timer RE Control Register 1TRECR100h011Dh Timer RE Control Register 2TRECR200h011Eh Timer RE Clock Source Select Register TRECSR00001000b 011Fh0120h Timer RC Mode Register TRCMR01001000b 0121h Timer RC Control Register 1TRCCR100h0122h Timer RC Interrupt Enable Register TRCIER01110000b 0123h Timer RC Status Register TRCSR01110000b 0124h Timer RC I/O Control Register 0TRCIOR010001000b 0125h Timer RC I/O Control Register 1TRCIOR110001000b 0126h Timer RC Counter TRC00h0127h00h0128h Timer RC General Register A TRCGRA FFh0129h FFh012Ah Timer RC General Register B TRCGRB FFh012Bh FFh012Ch Timer RC General Register C TRCGRC FFh012Dh FFh012Eh Timer RC General Register D TRCGRD FFh012Fh FFh0130h Timer RC Control Register 2TRCCR200011111b 0131h Timer RC Digital Filter Function Select Register TRCDF00h0132h Timer RC Output Master Enable Register TRCOER01111111b 0133h0134h0135h0136h0137h0138h0139h013Ah013Bh013Ch013Dh013Eh013FhX: UndefinedNOTES:1.The blank regions are reserved. Do not access locations in these regions.2.In J, K version these regions are reserved. Do not access locations in these regions.。
AO4707中文资料
Symbol Units R θJL R θJL40°C/WMaximum Junction-to-Ambient A Steady-State 6775Maximum Junction-to-Lead CSteady-State2530Maximum Junction-to-AmbientA t ≤ 10s R θJA 36°C/W5421Thermal Characteristics Schottky Maximum Junction-to-Ambient A t ≤ 10s R θJA 2475Maximum Junction-to-Lead CParameter: Thermal Characteristics MOSFETTyp Max Steady-State 3040Maximum Junction-to-Ambient ASteady-State AO4707AO4707SymbolMin TypMaxUnits BV DSS -30V -1T J =55°C-5I GSS ±100nA V GS(th)-1.2-2-2.4V I D(ON)40A 24.533T J =125°C334156m Ωg FS 14.5S V SD -0.76-1V I S-4.2A C iss 920pF C oss 190pF C rss 122pF R g3.6ΩQ g (10V)18.4nC Q g (4.5V)9.3nC Q gs 2.7nC Q gd 4.9nC t D(on)7.1ns t r 3.4ns t D(off)18.9ns t f 8.4ns t rr 21.5ns Q rr12.5nC SCHOTTKY PARAMETERS V F 0.480.52V0.070.154.2201560C T120pF THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICEMaximum Body-Diode Continuous CurrentInput Capacitance Output Capacitance Turn-On DelayTime DYNAMIC PARAMETERS V GS =0V, V DS =-15V, f=1MHz Gate Drain Charge Total Gate Charge (10V)V GS =-10V, V DS =-15V, I D =-8ATurn-On Rise Time Turn-Off DelayTime V GS =-10V, V DS =-15V, R L =1.8Ω, R GEN =3ΩGate resistanceV GS =0V, V DS =0V, f=1MHzTurn-Off Fall TimeSWITCHING PARAMETERSTotal Gate Charge (4.5V)Gate Source Charge m ΩV GS =-4.5V, I D =-5AI S =-1A,V GS =0VV DS =-5V, I D =-8AR DS(ON)Static Drain-Source On-ResistanceForward TransconductanceDiode Forward Voltage I DSS µA Gate Threshold Voltage V DS =V GS I D =-250µA V DS =-24V, V GS =0VV DS =0V, V GS =±20V Zero Gate Voltage Drain Current Gate-Body leakage current Electrical Characteristics (T J =25°C unless otherwise noted)STATIC PARAMETERS Parameter Conditions Body Diode Reverse Recovery TimeBody Diode Reverse Recovery Charge I F =-8A, dI/dt=100A/µsDrain-Source Breakdown Voltage On state drain currentI D =-250µA, V GS =0V V GS =-10V, V DS =-5V V GS =-10V, I D =-8AReverse Transfer Capacitance I F =-8A, dI/dt=100A/µsForward Voltage Drop I F =3.0AI rm Maximum reverse leakage current V R =24VmAV R =24V, T J =125°C V R =24V, T J =150°C Junction CapacitanceV R =15VA: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.B: Repetitive rating, pulse width limited by junction temperature.C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The SOA curve provides a single pulse rating. Rev4: August 2005AO4707AO4707AO4707。
VLF4012AT-4R7M1R1;VLF4012AT-100MR79;VLF4012AT-3R3M1R3;VLF4012AT-2R2M1R5;中文规格书,Datasheet资料
Inductance tolerance(%) ±30 ±20 ±20 ±20 ±20 ±20 ±20
Test frequency (kHz) 100 100 100 100 100 100 100
DC resistance( ) max. 0.054 0.1 0.15 0.2 0.31 0.46 1.20 typ. 0.047 0.091 0.13 0.1R7
2.8±0.2
1.4max. Dimensions in mm
RECOMMENDED PC BOARD PATTERN
1.2 2.1 3.4 Dimensions in mm
Inductance [at 1/2 Idc1]3 (µH) 1 2.2 3.3 4.7 6.8 10 22
• All specifications are subject to change without notice.
/
001-04 / 20120310 / e531_vlf
(3/17)
Inductors for Power Circuits Wound/STD • Magnetic Shielded
Part No. VLF3014AT-1R0N1R7 VLF3014AT-2R2M1R2 VLF3014AT-3R3M1R0 VLF3014AT-4R7MR90 VLF3014AT-6R8MR72 VLF3014AT-100MR59 VLF3014AT-220MR37
1
SHAPES AND DIMENSIONS
VLF-MT Series VLF302510MT
With the VLF302510MT Series, a DC to DC converter with topclass voltage conversion efficiency for similar size products was achieved by optimizing the magnetic material and configuration. These products are optimal for use as choke coils in switching power supplies such as those in mobile devices requiring spacesaving design. FEATURES • Miniature size Mount area: 3.02.5mm Low profile: 1.0mm max. height • Generic use for portable DC to DC converter line. • High magnetic shield construction should actualize high resolution for EMC protection. • The products contain no lead and also support lead-free soldering. • The products is halogen-free. • It is a product conforming to RoHS directive. APPLICATIONS Smartphones, cellular phones, DSCs, DVCs, HDDs, LCD displays, compact power supply modules, etc. SHAPES AND DIMENSIONS
MIC94067YML中文资料
MIC94066-69Dual High Side Power SwitchesMLF and Micro Lead Frame is a registered trademark of Amkor TechnologiesGeneral DescriptionThe MIC94066-69 are dual high-side load switches designed for operation between 1.7V to 5.5V. The devices contain a pair of low on-resistance, 115m Ω(max) P-channel MOSFETs that support over 2A of continuous current. The MIC94067 and MIC94069 feature an active load discharge circuit which insures capacitive loads retain no charge when the main switch is in an OFF state.An active pull-down on the enable input keeps MIC94066-69 in a default OFF state until the EN pin is pulled to a high level. The built-in level shift circuitry allows for a logic signal that may be different from the supply voltage to switch the high-side P-channel MOSFET on or off.MIC94066-67 feature rapid turn on while MIC94068-69 provide a slew rate controlled Soft-Start turn-on of 800µs (typical) to prevent in-rush current from glitching supply rails.MIC94066-69’s voltage range makes them suitable for 1-cell Lithium ion and 2- to 3-cell NiMH/NiCad/Alkaline powered systems, as well as all 5V applications. Their low operating current of 2µA and low shutdown current of <1µA maximize battery life.Data sheets and support documentation can be found on Micrel’s web site at .Features• 1.7V to 5.5V input voltage range • 2A continuous operating current • 85m Ω (typ) R ON• Built-in level shift for control logic; can be operated by 1.5V logic. • Low 2µA quiescent current • Soft-Start: MIC94068-69 • Micro-power shutdown <1µA• Load discharge circuit: MIC94067, MIC94069 • Space saving 2mm x 2mm MLF™Applications• Load switch in portable applications: - Cellular phones - PDAs - MP3 players - Digital Cameras - Portable instrumentation • Battery switch-over circuits • Level translators____________________________________________________________________________________________________Typical Application½ MIC94066, 68Load Switch Application½ MIC94067, 69Load Switch with Capacitive Load DischargeOrdering Information* Note: Over bar symbol may not be to scalePin ConfigurationTop View2x2 mm MLF™ (code)Pin DescriptionPin NumberPin NamePin Function1 V IN ASource of P-channel MOSFET.2 ENAEnable (Input): Active-high CMOS compatible control input for switch A. Do not leave floating. 3 V IN BSource of P-channel MOSFET.4 ENBEnable (Input): Active-high CMOS compatible control input for switch A. Do not leave floating. 5 V OUT B Drain of P-channel MOSFET.6 GND Ground. Both ground pins must be grounded.7 V OUT ADrain of P-channel MOSFET.8GNDGround. Both ground pins must be grounded.Absolute Maximum Ratings (1)Input Voltage (V IN )...............................................+6V Enable Voltage (V EN ) ..........................................+6V Continuous Drain Current (I D ) (3) T A = 25°C ......................................................±2A T A = 85°C ...................................................±1.4A Pulsed Drain Current (I DP ) (4)................................±6A Continuous Diode Current (I S ) (4).....................–50mA Storage Temperature (T s )...............–55°C to +150°C EDS Rating – HBM (6)..........................................4KV Operating Ratings (2)Input Voltage (V IN ).................................+1.7 to +5.5V Junction Temperature (T A )..............–40°C to +125°C Package Thermal Resistance 2x2 MLF (ΘJA )..........................................90°C/W 2x2 MLF (ΘJC ) (3)......................................45°C/WElectrical Characteristics V IN = 5V; T A = 25°C, bold values indicate –40°C< T A < +85°C, unless noted.Symbol Parameter ConditionMin Typ Max Units V IN = 1.8V to 4.5V, I D = –250µA 0.5 1.2 V V EN_TH Enable Threshold Voltage V IN = 1.7V to 4.5V, I D = –250µA 0.4 1.2 V I EN Enable Input Current V IN = V EN = 5.5V2 4 µA I VIN OFF State Leakage Current V IN = +5.5V, V EN = 0V1 µA V IN = +4.5V, ID = –100mA, V EN = 1.5V 85 115 m Ω V IN = +3.6V, ID = –100mA, V EN = 1.5V 100 140 m Ω V IN = +2.5V, ID = –100mA, V EN = 1.5V 145 200 m Ω R DS(ON)P-Channel Drain to Source On ResistanceV IN = +1.8V, ID = –100mA, V EN = 1.5V155 215 m ΩV IN = +1.7V, ID = –100mA, V EN = 1.5V165225m ΩR SHUTDOWNTurn-off ImpedanceV IN = +3.6V, I TEST = 1mA, V EN = 0V MIC94067, 69200 300 ΩDynamicSymbol Parameter ConditionMin Typ Max Units V IN = +3.6V, ID = –100mA, V EN = 1.5V MIC94066, 670.85 1.5 µst ON_DLYTurn-On Delay TimeV IN = +3.6V, ID = –100mA, V EN = 1.5V MIC94068, 69700 1200 µs V IN = +3.6V, ID = –100mA, V EN = 1.5V MIC94066, 670.5 1 5 µs t ON_RISETurn-On Rise TimeV IN = +3.6V, ID = –100mA, V EN = 1.5V MIC94068, 69500 800 1500 µs V IN = +3.6V, ID = –100mA, V EN = 1.5V MIC94066, 67115 200 ns t OFF_DLYTurn-Off Delay TimeV IN = +3.6V, ID = –100mA, V EN = 1.5V MIC94068, 69100 200 nsDynamic (cont.)V IN = +3.6V, ID = –100mA, V EN = 1.5V MIC94066, 67 60 100 nst OFF_FALL Turn-Off Fall TimeV IN = +3.6V, ID = –100mA, V EN = 1.5VMIC94068, 6960 100 nsNotes:1. Exceeding the absolute maximum rating may damage the device.2. The device is not guaranteed to function outside its operating rating.3. With backside thermal contact to PCB.4. Pulse width <300µs with < 2% duty cycle.5. Continuous body diode current conduction (reverse conduction, i.e. V OUT to V IN) is not recommended.6. Devices are ESD sensitive. Handling precautions recommended. HBM (Human body model), 1.5k in series with 100pF.Typical CharacteristicsR L = 100mA, C L = 0µF for the following plotsFunctional Characteristics MIC94066Package InformationMICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USATEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.© 2006 Micrel, Incorporated._____________________________________________________________________________________________________________________。
IRF9540NL中文资料
IRF9540NS/LHEXFET ® Power MOSFETPD - 91483ClAdvanced Process Technology l Surface Mount (IRF9540S)l Low-profile through-hole (IRF9540L)l 175°C Operating Temperature l Fast Switching l P-Channell Fully Avalanche Rated5/13/98Absolute Maximum RatingsFifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.The D 2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D 2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.The through-hole version (IRF9540L) is available for low-profile applications.Description2 D PakT O -262ParameterTyp.Max.UnitsR θJC Junction-to-Case––– 1.1R θJAJunction-to-Ambient ( PCB Mounted,steady-state)**–––40Thermal Resistance°C/WParameterMax.UnitsI D @ T C = 25°C Continuous Drain Current, V GS @ -10V -23I D @ T C = 100°C Continuous Drain Current, V GS @ -10V -16A I DMPulsed Drain Current -76P D @T A = 25°C Power Dissipation 3.8W P D @T C = 25°C Power Dissipation 140W Linear Derating Factor 0.91W/°C V GS Gate-to-Source Voltage± 20V E AS Single Pulse Avalanche Energy 430mJ I AR Avalanche Current-11A E AR Repetitive Avalanche Energy 14mJ dv/dt Peak Diode Recovery dv/dt -5.0V/ns T J Operating Junction and-55 to + 175T STGStorage Temperature RangeSoldering Temperature, for 10 seconds300 (1.6mm from case )°CIRF9540NS/LIRF9540NS/LIRF9540NS/LIRF9540NS/LIRF9540NS/LIRF9540NS/LIRF9540NS/LIRF9540NS/LIRF9540NS/L。
低温控制器说明书
１．在仪表显示当前库温时，持续按仪表面板上的 ＳＥＴ 键至少 ５ 秒钟，仪表将显示第一个参数卷代码 ＣＰ。
２．此时按 ＳＥＴ 键，即进入了 ＣＰ 参数卷，仪表面板上将显示第一个参数 ｄｉＦ。
３．按︽键或︾键，仪表面板上将逐一循环显示 ＣＰ 参数卷中的所有参数。
４．若要查看或修改其中某一参数的参数值，在仪表显示该参数代码时，按 ＳＥＴ 键，可以看到当前参数设定值，再按︽键或︾键，可以改变参数设定值。
ＩＤ９７４
除霜型数显温度控制器
感谢您选用 ＩＤ９７４ 产品。在正式安装使用产品前，请认真仔细地阅读本产品说明书。 请妥善保存此中文产品说明书，以备将来使用。 中文产品说明书是在意大利生产商提供的英文产品说明书的基础上制作的，在实际使用产品时，对此中文说明书若有疑问，请参考霜型数显温度控制器。它提供了 ３ 路开关量输出，分别用于控制压缩机、除霜、冷风机的工作。产品在出厂时已被 设定为使用 ＰＴＣ 或 ＮＴＣ 热敏电阻型温度传感器。 ＩＤ９７４ 被安装在 ７４＊３２＊５９ｍｍ 的外壳中，小巧、美观、易于安装。
注意：用户一旦设定了参数 ＰＡ１，请务必记住此口令值，以免今后无法进入参数卷，影响参数值的查看与更改。
信号指示灯和报警
指示灯
ＩＤ９７４ 面板上方从左到右共有 ５ 个信号指示灯，分别表示以下含义：
信号指示灯
含义
亮起表示压缩机正在工作工程中
闪烁表示压缩机正在延时输出工作过程中
亮起表示自动除霜循环正在进行中
注意：在断电的情况下，仪表插上拷贝卡，通电后，仪表将立即下载拷贝卡中的数据，并且下载成功后，将在仪表面板上提示“ｄＬＹ”５ 秒钟；若未成
功，则仪表面板上将提示“ＤＬｎ”５ 秒钟。
1N4007FF资料
1N4001, 1N4002, 1N4003,1N4004, 1N4005, 1N4006,1N40071N4004 and 1N4007 are Preferred DevicesAxial Lead Standard Recovery RectifiersThis data sheet provides information on subminiature size, axial lead mounted rectifiers for general−purpose low−power applications. Features•Shipped in plastic bags, 1000 per bag•Available Tape and Reeled, 5000 per reel, by adding a “RL” suffix to the part number•Available in Fan−Fold Packaging, 3000 per box, by adding a “FF”suffix to the part number•These devices are manufactured with a Pb−Free external leadfinish only*Mechanical Characteristics•Case: Epoxy, Molded•Weight: 0.4 gram (approximately)•Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable•Lead and Mounting Surface Temperature for Soldering Purposes: 220°C Max. for 10 Seconds, 1/16 in. from case•Polarity: Cathode Indicated by Polarity Band*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.CASE 59−10AXIAL LEADPLASTICLEAD MOUNTED RECTIFIERS50−1000 VOLTSDIFFUSED JUNCTIONPreferred devices are recommended choices for future use and best overall value.MARKING DIAGRAMSee detailed ordering and shipping information on page 3 of this data sheet.ORDERING INFORMATIONAL= Assembly Location1N400x= Device Numberx= 1, 2, 3, 4, 5, 6 or 7YY= YearWW= Work WeekAL1N400xYYWWMAXIMUM RATINGSvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.ELECTRICAL CHARACTERISTICS*ORDERING INFORMATION†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSAXIAL LEAD CASE 59−10ISSUE SDIM MIN MAX MIN MAX MILLIMETERSINCHES A 4.10 5.200.1610.205B 2.00 2.700.0790.106D 0.710.860.0280.034F −−− 1.27−−−0.050K25.40−−−1.000−−−NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.59−04 OBSOLETE, NEW STANDARD 59−09.4.59−03 OBSOLETE, NEW STANDARD 59−10.5.ALL RULES AND NOTES ASSOCIATED WITH JEDEC DO−41 OUTLINE SHALL APPLY6.POLARITY DENOTED BY CATHODE BAND.7.LEAD DIAMETER NOT CONTROLLED WITHIN F DIMENSION.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
mk9019f的规格书
mk9019f的规格书MK9019F芯片是一款高性能的微控制器芯片，具有广泛的应用范围和出色的功能特性。
本文将从MK9019F的概述、技术规格、应用领域和未来发展趋势等方面进行详细介绍，以帮助读者更全面地了解这款产品。
一、概述MK9019F是一款基于ARM架构的32位微控制器芯片，由一家知名芯片设计公司研发生产。
该芯片采用先进的制造工艺和设计理念，具有高性能、低功耗、稳定性好等特点，适用于各种嵌入式系统和智能设备。
MK9019F作为一款通用型的芯片，可以广泛应用于工业控制、智能家居、汽车电子、物联网等领域。
二、技术规格1.处理器核心：ARM Cortex-M4F2.主频：100MHz3.存储器：Flash存储器32KB，RAM存储器8KB4.通信接口：UART、SPI、I2C5. ADC/DAC：12位ADC，8位DAC6.工作温度：-40℃~85℃7.电源电压：3.3V8.封装形式：LQFP48MK9019F的技术规格表明了其在处理能力、存储容量、通信能力等方面的优势，能够满足各种复杂应用场景的需求。
三、应用领域1.工业控制：MK9019F在工业控制领域应用广泛，可以作为PLC、电机控制器、传感器接口等设备的核心控制单元，实现工业自动化生产。
2.智能家居：MK9019F支持多种通信接口，可用于智能家居设备的控制与联网，如智能门锁、智能插座、智能照明等。
3.汽车电子：MK9019F具有高速处理能力和丰富的接口资源，可用于汽车电子系统中的控制器、仪表盘、车载娱乐等功能。
4.物联网：MK9019F小巧灵活，适合用于物联网设备中，如智能传感器、智能监控、智能终端等应用。
MK9019F在各个领域都有广泛的应用前景，其强大的性能和可靠性为各种智能设备的研发提供了强大的支持。
四、未来发展趋势随着科技的不断进步和市场的快速发展，MK9019F芯片将不断优化和升级，以满足新一代智能设备对性能和功能的需求。
未来，MK9019F 可能会加强功耗管理、数据处理速度、通信稳定性等方面的能力，以应对日益复杂的应用场景。
in4007中文资料_数据手册_参数
, PEAK FORWARD SURGE (A)
version:02
2of3
1N 4 ant Notice and Disclaimer
•Reproducing and modifying information of the document is prohibited without permission
•Since DIYI uses lot number as the tracking base, please provide the lot number for tracking when complaining.
version:02
3of3
万联芯城-电子元器件采购网，提供一站式配套，解决物料 烦恼，万联芯城销售电子元器件范围包括 IC 集成电路，电 阻电容，二三极管，可进行一站式 BOM 表配单，BOM 配 单整单采购可享优惠价，提交 BOM 表报价，最快可当天发 货，电子元器件一站式采购，满足客户多样化物料需求， 点击进入万联芯城。
SYMBOL 1N
1N
4001G 4002G
1N 4003G
1N 4004G
1N 4005G
1N 4006G
1N 4007G
Unit
VRRM
50
100 200 400 600 800 1000 V
VRMS
35
70
140 280 420 560 700 V
VDC
50 100 200 400 600 800 1000 V
•The products shown herein are not designed and authorized for equipments requiring high level of reliability or relating to human life and for any applications concerning life-saving or life-sustaining, such as medical instruments, transportation equipment, aerospace machinery et cetera. Customers using or selling these products for use in such applications do so at their own ris k andagree to fully indemnify DIYI for any damages resulting from such improper use or sale.
F1070中文资料
F1070中⽂资料RF CHARACTERISTICS ( WATTS OUTPUT )200General DescriptionSilicon VDMOS and LDMOS transistors designed specifically for broadband RF applications. Suitable for Military Radios, Cellular and Paging Amplifier Base Stations, Broadcast FM/AM, MRI, Laser Driver and others.PATENTED GOLD METALIZED 200Watts Gemini Package Style AH HIGH EFFICIENCY, LINEAR,ABSOLUTE MAXIMUM RATINGS (TC = 25 C)oTotal Device Junction to Case Thermal Maximum Junction StorageTemperatureDC Drain CurrentDrain to Gate Drain to Source Gate to Source 350Watts0.5Co 200-65to 15016A30VVV7070ELECTRICAL CHARACTERISTICS (EACH SIDE)SYMBOL PARAMETERMIN TYPMAXUNITS TEST CONDITIONSSYMBOL PARAMETERMIN TYPMAXUNITSTEST CONDITIONS GpsηVSWRCommon Source Power Gai Drain EfficiencyLoad Mismatch TolerancdB %Relative13601.620:1Idq = Idq = Idq = 1.61.6A,A,A,28.0Vds =V,28.0Vds =V,28.0Vds =V, F =175MHz F =175MHz F =175MHzBvdss Idss Igss Vgs gM Rdson Idsat Ciss Crss CossDrain Breakdown Voltag Zero Bias Drain Curren Gate Leakage Curren Gate Bias for Drain Curren Forward Transconductanc Saturation Resistanc Saturation CurrenCommon Source Input Capacitanc Common Source Feedback Capacitanc Common Source Output Capacitanc6541713.20.35221321680Mho Ohm Amp pF V V pF pFmA uA 0.2Ids = A,Vgs = 0V 28.0Vds =V,Vgs = 0V Vds = 0 V,Vgs = 30V 0.4Ids =A,Vgs = VdsVds = 10V,Vgs = 5V Vgs = 20V,Ids =16Vgs = 20V,Vds = 10V28.0Vds =V, Vgs = 0V, F = 1 MHz A 28.0Vds =V, Vgs = 0V, F = 1 MHz 28.0Vds =V, Vgs = 0V, F = 1 MHzPOLYFET RF DEVICES1110 Avenida Acaso, Camarillo, CA 93012 TEL:(805) 484-4210 FAX:(805) 484-3393EMAIL:Sales@/doc/e066c93e0b4c2e3f57276384.htmlURL:/doc/e066c93e0b4c2e3f57276384.htmlREVISION SILICON GATE ENHANCEMENT MODE RF POWER HIGH GAIN, LOW NOISE"Polyfet" process features gold metal for greatly extended lifetime. Low output capacitance and high F enhance broadband performancet TMC o Co C/Wo F1070polyfet rf devicesDissipation Resistance Temperature Voltage Voltage Voltage 8/1/97VDMOS TRANSISTORPOUT VS PIN GRAPHF1070POLYFET RF DEVICES1110 Avenida Acaso, Camarillo, CA 93012 TEL:(805) 484-4210 FAX:(805) 484-3393 EMAIL:Sales@/doc/e066c93e0b4c2e3f57276384.html URL:/doc/e066c93e0b4c2e3f57276384.html CAPACITANCE VS VOLTAGEIV CURVEID AND GM VS VGSS11 AND S22 SMITH CHART PACKAGE DIMENSIONS IN INCHES REVISION 8/1/97。
L9404中文资料
Telephone: 781-935-4442 Fax: 781-938-5867
sales@ Engineering Catalog 169 17
元器件交易网
A
Quartz Halogen Projection Lamps
元器件交易网
A
Miniature Quartz Halogen Lamps
Line No. Part No. Volts Color Temp. Degrees Watts Lumens Kelvin 3,150 2,850 2,950 3,200 3,000 2,800 2,900 2,850 3,150 3,000 2,850 2,900 Life Hours 100 2,000 1,000 100 2,000 2,000 1,000 1,000 250 2,000 2,000 2,000 Burning Filament Filament Position Type Lgth. x Dia. Any Any Any Any Any Any Any Any Any Any Any Any C-6 C-6 C-6 C-6 C-6 C-6 C-6 C-6 C-6 C-6 C-6 C-6 2.5 3.0 2.8 2.1 2.9 3.4 3.8 4.25 2.6 3.3 4.0 4.8 0.6 0.7 0.6 1.0 1.0 0.7 0.7 0.35 1.0 0.9 0.7 1.1 D 9.0 9.0 9.0 9.0 9.0 9.0 9.0 9.0 9.0 9.0 9.0 9.0 Dimensions MOL LCL 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 19.5±0.25 19.5±0.25 19.5±0.25 19.5±0.25 19.5±0.25 19.5±0.25 19.5±0.25 18.75±0.25 19.5±0.25 19.5±0.25 19.5±0.25 19.5±0.25 Base Type Drawing G-4 G-4 G-4 G-4 G-4 G-4 G-4 G-4 G-4 G-4 G-4 G-4 A A A A A A A A A A A A 1 L7387 6.0 10 180 2 L6402 6.0 10 130 3 L6414 6.0 10 150 4 L7388 6.0 20 420 5 L7394 6.0 20 350 6 L6415 12.0 10 120 7 L6416 12.0 15 210 8 L6417 12.0 10 130 9 L7401 12.0 20 420 10 L7404 12.0 20 350 11 L7404A 12.0 20 280 12 L7414A 12.0 35 560 Recommended Holders/Sockets Pages 28 & 29
SI9407AEY中文资料
VDS – Drain-to-Source Voltage (V)
10 VDS = 30 V ID = 3.5 A
Gate Charge
2.0
On-Resistance vs. Junction Temperature
V GS – Gate-to-Source Voltage (V)
r DS(on)– On-Resistance ( W ) (Normalized)
ID (A)
"3.5 "3.1
S S S
SO-8
S S S G 1 2 3 4 Top View 8 7 6 5 D D D D G
D D D D P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
5
0 0 1 2 3 4 5
0 0 1 2 3 4 5 6
VDS – Drain-to-Source Voltage (V)
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.20 1500
Capacitance
r DS(on)– On-Resistance ( W )
0.00 0 2 4 6 8 10
VSD – Source-to-Drain Voltage (V)
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
0.8
50
Single Pulse Power
0.6
40
NDS9407;中文规格书,Datasheet资料
–1
–1.6 4 78 99 122
–3
V mV/°C
150 240 250
mΩ
ID(on) gFS
–12 8
A S
Hale Waihona Puke Dynamic Characteristics
Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance
Package Marking and Ordering Information
Device Marking NDS9407
2002 Fairchild Semiconductor Corporation
Device NDS9407
Reel Size 13’’
Tape width 12mm
Quantity 2500 units
NDS9407 Rev B1(W)
/
NDS9407
Electrical Characteristics
Symbol
BVDSS ∆BVDSS ∆T J IDSS IGSSF IGSSR VGS(th) ∆VGS(th) ∆T J RDS(on)
TA = 25°C unless otherwise noted
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.
0.3 RDS(ON), ON-RESISTANCE (OHM)
1.8 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 1.6 1.4 1.2 1 0.8 0.6 -50 -25 0 25 50 75 100
MIL-STD-704F中文资料
MIL-STD-704F中文资料SENSITRONSEMICONDUCTORSPDXXD28 SERIES TECHNICAL DATADATASHEET 4310, Rev BDC Solid State Power Controller ModuleDescription:The Solid State Power Controller (SSPC) Module is a microcontroller-based Solid State Relay rated upto 25A designed to be used in Army, Air force and Navy in 28V DC applications. This module has integrated current sensing with no derating over the full operating temperature range. The module is the electronic equivalent to an electromechanical circuit breaker with isolated control and status.This series is supplied in 3 product families covering 9 current ranges:SPD5D28 Family:1A- SPD5D28-1:- SPD5D28-3:3A5A- SPD5D28-5:SPD15D28 Family:7A- SPD14D28-7:- SPD14D28-10:10A14A- SPD14D28-14:SPD25D28 Family:15A- SPD25D28-15:20A- SPD25D28-20:25A- SPD25D28-25:Compliant Documents & Standards:MIL-STD-1275B, Notice1 Characteristics of 28 Volt DC Electrical Systems in Military Vehicles-4/20/04Power Characteristics 12 March 2004 MIL-STD-704F Aircraft ElectricalMIL-STD-217F, Notice 2 Reliability Prediction of Electronic Equipment 28 Feb 1995Module Features:Epoxy Shell Construction Array?Solid State Reliability; Low Weight (20 gms) - High Power DensitySame Pin Out as Industry Standard SSPCs in a Smaller OutlineExtremely Low Power, No Derating Over the Full Temperature RangeElectrical Features (SPDXXD28 Series):28VDC Input with Very Low Voltage Drop; 60mV, typ. @15A True I2t Protection from 32A to 250A with Nuisance Trip SuppressionInstant Trip Protection (50 μsec typ) for Loads Above 250AUnlimited Interrupt Capability; Repetitive Fault Handling CapabilityThermal MemoryInternally Generated Isolated Supply to Drive the SwitchLow Bias Supply Current: 20 mA typ @ 5V DCHigh Control Circuit Isolation: 750V DC Control to Power CircuitSoft Turn-On to Reduce EMC IssuesEMI TolerantModule Reset with a Low Level Signal; Reset Circuit is Trip-FreeTTL/CMOS Compatible, Optically Isolated, Input and Outputs SENSITRONSEMICONDUCTORTECHNICAL DATADATASHEET 4310, Rev B SPDXXD28 SERIESTable 1 - Electrical Characteristics (at 25 o C and V bias = 5.0V DC unless otherwise specified)PowerInput Voltage – Continuous – Transient 0 to 40V DC, 50V DC Absolute Maximum +600V or –600V Spike (< 10 uS) Power Dissipation See Table 4 CurrentSee Table 4 See Trip Curve Max Voltage DropSee Table 4 Max current without tripping110% minTrip timeSee Trip Curve Output Rise Time (turn ON)110 μsec ty p Output Fall Time under normal turn-off 110 usec typ Output Fall Time under Fault 50 usec typ Min Load RequirementNilProtectionShort Circuit Protection UnlimitedInstant Trip800%, min; 1200%, maxPhysical CharacteristicsTemperatureOperating Temperature T A = -55 °C to +100 °C Storage TemperatureT A = -55 °C to +125 °CEnvironmentalAltitudeUp to 30,000 ftCan be installed in an unpressurized area Case Dimensions 1.825”L x 1.25”W x 0.38”H Operating Orientation AnyWeight20 grams typMTBF (Estimate: MIL STD 217F)1.1 Mhrs at 25°C Full loadControl & Status (TTL/CMOS Compatible)BIAS (Vcc)5.0V DC Nominal,6.5V DC Absolute Maximum 4.5V to 5.5 VDC BIAS (Vcc) Current20 mA typ 25 mA, maxGATE Status, Load Status SignalsV oh =3.7V, min, at I oh =-20mA V ol =0.4V, max, at I ol =20mA CONTROL SignalV T+ (Positive-going input threshold voltage) V T ? (Negative-going input threshold voltage) ?V T Hysteresis (V T + V T ?)2.0V, min,3.5V, max 1.2V, min, 2.3V, max 0.6V, min, 1.4V, maxResetCycle CONTROL Signal SENSITRON SEMICONDUCTOR TECHNICAL DATA DATASHEET 4310, Rev B SPDXXD28 SERIES Figure 1 - Trip CurveFigure 2 - Timing DiagramSENSITRONSEMICONDUCTORTECHNICAL DATADATASHEET 4310, Rev BSPDXXD28 SERIESTable 2 - Signal Timing – (-55 o C to 100 o C @ LINE = 28V DC)Parameter Symbol Min MaxUnitsCONTROL to GATE Status Delay for Turn On t0 1 ms Turn ON Delay t1 200 μs Load Current Rise Time t2 50 200 μs Turn ON to LOAD Status Delay t3 1 ms CONTROL to GATE Status Delay for Turn Off t4 1 ms T urn OFF Delay t5 200 μs Load Current Fall Time t6 50 200 μs Turn OFF to LOAD Delay t7 1 ms Note: Current Fall Time from trip dependent on magnitude of overload Figure 3 - Mechanical DimensionsTable 3 - Pin DefinitionsPin Number Pin NameFunction1 BIAS+5V DC Supply 2 GND 5V Return 3 GATE Status Switch Status4 LOAD Status Load Current Detection5 CONTROL Input On/Off Control6 LINE+28V DC Supply 7 ---No Pin 8 PWRGND 28V ReturnSENSITRONSEMICONDUCTORTECHNICAL DATADATASHEET 4310, Rev BSPDXXD28 SERIESTable 4 – Individual Model RatingsSPD5D28 FamilyModel SPD5D28-1 SPD5D28-3 SPD5D28-5 Current Rating @ 100O C1A 3A 5A*********************************0.035W max @ 1A 25O C0.04W max @ 1A 100O C*****************0.14W max @ 3A 25O C0.16W max @ 3A 100O C0.09W typ @ 3A 25O C0.30W max @ 5A 25O C0.36W max @ 5A 100O C******************************35mV max @ 1A 25O C40mV max @ 1A 100O C****************46mV max @ 3A 25O C53mV max @ 3A 100O C30mV typ @ 3A 25O C60mV max @ 5A 25O C71mV max @ 5A 100O CSPD14D28 FamilyModel SPD14D28-7 SPD14D28-10 SPD14D28-14 Current Rating @ 100O C7A 10A 14A*********************************0.49W max @ 7A 25O C0.60W max @ 7A 100O C0.26W typ @ 6A 25O C0.87W max @ 10A 25O C1.10W max @ 10A 100O C*****************1.61W max @ 14A 25O C2.06W max @ 14A 100O C******************************70mV max @ 7A 25O C86mV max @ 7A 100O C43mV typ @ 6A 25O C87mV max @ 10A 25O C110mV max @ 10A 100O C****************115mV max @ 14A 25O C147mV max @ 14A 100O CSPD25D28 FamilyModel SPD25D28-16 SPD25D28-20 SPD25D28-25 Current Rating @ 100O C16A 20A 25A********************************* 1.44W max @ 16A 25O C1.73W max @ 16A 100O C0.60W typ @ 12A 25O C2.11W max @ 20A 25O C2.56W max @ 20A 100O C0.90W typ @ 15A 25O C3.15W max @ 25A 25O C3.86W max @ 25A 100O C****************************** 90mV max @ 16A 25O C108mV max @ 16A 100O C50mV typ @ 12A 25O C105mV max @ 20A 25O C128mV max @ 20A 100O C60mV typ @ 15A 25O C126mV max @ 25A 25O C154mV max @ 25A 100O C SENSITRONSEMICONDUCTORSPDXXD28 SERIES TECHNICAL DATA DATASHEET 4310, Rev BFigure 4 - Electrical Block DiagramDescriptionFigure 4 shows the block diagram of the SPDXXD28 SSPC Series. It uses a SN74LVC3G14 device for digital I/O. This TTL compatible device has a Schmitt-Trigger input to minimize the effects of noise on the input. Its outputs can each drive more than 10 standa rd TTL loads. It’s also compatible with CMOS inputs and outputs. The SN74LVC3G14 is isolated from the remainder of the module circuitry by three optocouplers.The block labeled “Control & Protection Circuitry” gets power from the DC-DC converter and is referenced to the output of the SSPC. This block contains an amplifier to gain up the voltage developed across the sense resistor. It also contains a microcontroller with on-board timers, A/D converter, clock generator and independent watchdog timer. The microcontroller implements a precision I2t protection curve as well as an Instant Trip function to protect the wiring and to protect itself. It performs all of the functions of multiple analog comparators and discrete logic in one high-reliability component.The code programmed in the microcontroller acquires the output of the internal A/D converter, squares the result and applies it to a simulated RC circuit. It checks the output of the simulated circuit to determine whether or not to trip (turn off the power Mosfets). Because the microcontroller simulates an analog RC circuit, the SSPC has ‘thermal memory’. That is, it trips faster if there had been current flowing prior to the overload than if there hadn’t been current flowing. This behavior imitates thermal circuit breakers and better protects the application’s wiring since the wiring cannot take as much an overload if current had been flowing prior to the overload.SENSITRONSEMICONDUCTORSPDXXD28 SERIES TECHNICAL DATADATASHEET 4310, Rev BThe watchdog timer operates from its own internal clock so a failure of the main clock will not stop the watchdog timer. The code programmed in the microcontroller will periodically reset the watchdog timer preventing it from timing out. If the code malfunctions for any reason, the watchdog timer is not reset and it times out. When the watchdog timer times out, it resets the microcontroller. Since the code is designed to detect levels and not edges, the output of the module, and therefore the output of the SPDXXD28, immediately reflects the command on its input.The Power Mosfets used in the SPDXXD28 Series have been selected for very low R ds(on) and results in low voltage drop and low power dissipation. In most applications, the SPDXXD28 will be operated at 50 –60% of rated current to provide a safety margin. As can be seen in Table 1, when the SPD25D28 is operated at 15 Amps, 60% of rated current, it only dissipates 1.0Watt at room temperature. No heatsinking is required for this condition. However, if the SPD25D28 is to be operated at maximum rating and/or at elevated temperatures, the dissipation can exceed 4 Watts and heatsinking is required. Some heatsinking can be accomplished by adding copper area to the LINE and LOAD pins, a heatsink can be epoxied to the surface of the module or a flat copper or aluminum heatsink can be sandwiched between the SPD25D28 and the printed circuit board using a thermal pad to maximize heat transfer. Each application should be evaluated at maximum expected constant current. For overloads, no heatsinking is required provided the SPDXXD28 Series is allowed some time to cool down. The SPDXXD28 has sufficient thermal mass that the temperature will rise only a few degrees under the worst-case overload. Repetitive overloads should be avoided. When the SPDXXD28 reports a trip condition, the controller driving the SPDXXD28 should allow no more than four repetitions and then allow thirty seconds to cool down before trying to turn on again.The SPDXXD28 will trip on overloads in the ALWAYS TRIP region shown in Figure 1 and will never trip when in the NEVER TRIP region. The SPDXXD28 can be reset by bringing the CONTROL pin to a logic low. When the CONTROL pin is brought back to logic high, the SPDXXD28 will turn back on. If the overload is still present, the SPDXXD28 will trip again. Cycling the 5 Volt BIAS power will also reset the SPDXXD28. If the CONTROL pin is at logic high when the BIAS power is cycled, the SPDXXD28 will turn back on when the BIAS power is re-applied.Status OutputsThe LOAD and GATE status outputs of the SPDXXD28 show whether or not the load is drawing current and whether or notthe SPDXXD28 Power Mosfet switch is on. A logic high on the LOAD status output shows that the load draws < 5% of rated load and a logic low shows that the load draws > 15% of rated current.A load that draws between 5% and 15% of rated current could result in either a high or low logic level on the LOAD status output.A logic high on the GATE output indicates that the Power Mosfet switch is on while a logic low indicates that the switch is off.As can be seen in Table 4, of the 8 possible states for the combination of CONTROL, LOAD and GATE, only 3 states represent valid SSPC operation. The other 5 states indicate either a failed SSPC or, more likely, a short to ground or a short to the BIAS supply of one of the logic outputs. By comparing the CONTROL input with the LOAD and GATE outputs, the user can determine whether or not the load is supposed to be ON (GATE), whether or not it’s drawing current (GATE) and whether or not the LOAD and GATE outputs are valid responses to the CONTROL input.Table 4 – CONTROL, LOAD & GATE Truth TableState CONTROL LOAD GATE Comments1 L L L SSPC failure or shorted LOAD output to groundfailure2 L L H SSPCOFFcondition3 L H L Normal4 L H H SSPC failure or shorted GATE output to BIAS supply5 H L L SSPC failure or shorted GATE output to ground6 H L H Normal ON condition with load current > 15% rated currentSENSITRONSEMICONDUCTORTECHNICAL DATADATASHEET 4310, Rev BSPDXXD28 SERIESWire SizeMIL-W-5088L has a chart the shows wire size as a function of wire temperature and current. This chart is for a single copper wire in free air. For an ambient temperature of 70 o C, the chart allows an 18-gauge wire to handle 25 Amps continuously at a wire temperature of 200 o C – a wire temperature rise of 130 o C. For a wire temperature limited to 150 o C, the chart requires a 16-gauge wire and for a wire temperature of 105 o C, the chart requires a 14-gauge wire.Amendment 1 of MIL-W-5088L has a table for copper wire in a bundle, group or harness with conditions on the number of wires, percent of total harness capacity, etc. This table shows that a 12 gauge wire is necessary for 200 o C operation, 10 gauge for 150 o C and 8 gauge for 105 o C.MIL-W-5088L has various figures showing derating for harnesses as a function of the number of current carrying conductors and for altitude. MIL-W-5088L only specifies wire for DC or RMS AC conditions, not for transient or overload conditions.For transient or overload conditions, the transient or overload happens so quickly that heat is not transferred from the wire to the surroundings. The heat caused by the I 2R heating of the wire causes the temperature to rise at a linear rate controlled by the heat capacity of the wire. The equation for this linear rise in temperature, with respect to time, can be solved as: I 2t = constant. Every wire has an I 2t rating that’s dependent on thetemperature rise allowed and the diameter of the wire. If the I 2t rating of the SSPC or circuit breaker is less than the I 2t rating of the wire, then the SSPC or circuit breaker can protect the wire. The maximum I 2t rating for the SPD25D28 is 7.45 Amp 2-Seconds. Every wire size in the paragraphs above has an I 2t rating that exceeds the SPD25D28 I 2t rating for the temperature rises stated. Therefore, to select a wire size, it’s simply a matter of determining the maximum temperature rise of the application and deciding whether or not the wire will be in a bundle and use the information above.Application ConnectionsThe SPDXXD28 Series may be configured as a high-side or low-side switch and may be used in positive ornegative supply applications. Figure 5 shows the connections as a high-side switch with a positive power supply.SENSITRONSEMICONDUCTORTECHNICAL DATADATASHEET 4310, Rev BSPDXXD28 SERIESFigure 6 shows a low-side switch with a negative power supply. Note that the PWRGND pin is now connected to the LINE pin (see Rise/Fall Time paragraph below for more information on the PWRGND pin).Figure 6 – Low-Side Switch, Positive SupplyFigures 7 and Figure 8 show negative supply high-side switch and low-side switch implementations. Again, note the connection of the PWRGND pin.SENSITRONSEMICONDUCTORSPDXXD28 SERIES TECHNICAL DATADATASHEET 4310, Rev BFigure 8 – Low Side Switch, Negative SupplyRise Time & Fall TimeThe rise and fall times of the SPDXXD28 is pre-set at the factory for a nominal 100uS with a LINE supply of 28VDC (see Table 2 for min/max limits). The rise and fall times will vary linearly with supply voltage. The PWRGND pin is used to control the rise and fall times. If the PWRGND pin is left open, the rise and fall times will be about 50uS. Leaving the PWRGND pin open can be useful when a faster rise or fall time is desirable. With the PWRGND pin connected as in Figures 5 through 8, the SPDXXD28 can turn on into a capacitive load of 440uF, min, 880uF, typ, without tripping for any power supply voltage within the ratings.Wiring and Load InductanceWiring inductance can cause voltage transients when the SPDXXD28 is switched off due to an overload. Generally, these transients are small but must be considered when long wires are used on either the LINE or LOAD pins or both. A 10 foot length of wire in free air will cause a transient voltage of about 10 Volts when the SPD25D28 trips at an Instant Trip level of 250 Amps. At the rated load current of 25 Amps, the voltage transient will beabout 1 Volt. If longer wire lengths are used, a transient suppressor may be used at the LINE pin and a power diode may be used at the LOAD pin so that the total voltage between the LINE and LOAD pins is less than 50 Volts.When powering inductive loads, the negative voltage transient at the LOAD pin can cause the voltage between LINE and LOAD to exceed the SPDXXD28 rating of 50 Volts and a power diode from the LOAD pin to ground must be used. The cathode of the power diode is connected to the LOAD pin with the anode connected to ground. The power diode must be able to carry the load current when the SPDXXD28 switches off.ParallelingFor example, putting two SPD25D28s in parallel will not double the rating to 50 Amps. Due to differences in the R ds(on) of the Power Mosfets in the SSPCs, the current will not share equally. In addition, there are unit-to-unit differences in the trip curves so that two SPD25D28s in parallel may possibly trip at 35 Amps. Also, bothSENSITRONSEMICONDUCTORSPDXXD28 SERIES TECHNICAL DATADATASHEET 4310, Rev BBoard LayoutThe current-carrying power circuit should be kept well away from the control circuit and other low-level circuits in the system. It’s unlikely, but possible, that magnetic coupling could affect the control circuit when turning normal loads on and off. However, in the case of an overload, the magnetic coupling could be 10 times greater than with normal loads. Effects of such coupling could cause ‘chattering’ when turning on and off,oscillation, and the possibility of turning the SPDXXD28 back on after an overload. The SPDXXD28 Series is a Trip-Free device. Once tripped it will not turn back on until reset and commanded on again. Reset is accomplished by bringing the CONTROL pin low and turning the SSPC back on is accomplished by bringing the CONTROL pin high. Sufficient magnetic coupling between the current-carrying power circuit and the control circuit can negate the Trip-Free characteristic.MIL-STD-704F and MIL-STD-1275BThese standards cover the characteristics of the electrical systems in Military Aircraft and Vehicles. The SPDXXD28 Series meets all of the requirements of MIL-STD-704F including Normal, Emergency, Abnormal and Electric Starting conditions with the Ripple, Distortion Factor and Distortion Spectrum defined in the standard. The SPDXXD28 Series also meets all of the requirements of MIL-STD-1275B including operation with Battery and Generator, Generator Only and Battery Only for all of the conditions described in the standard including Cranking, Surges, Spikes and Ripple.In addition, the SPDXXD28 Series can withstand + 600 V spikes for 10uS. This capability is beyond that required by the standards cited above.DISCLAIMER:1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the Sensitron Semiconductor sales department for the latest version of the datasheet(s).2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, trafficequipment, medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement .3- In no event shall Sensitron Semiconductor be liable for any damages that may result from an accident or any other cause during operation of the user’s units according to the datasheet(s). Sensitron Semiconductor assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in the datasheets.4- In no event shall Sensitron Semiconductor be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating.5- No license is granted by the datasheet(s) under any patents or other rights of any third party or Sensitron Semiconductor.6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of Sensitron Semiconductor.7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations.。
Canon FX7 打印机废纸盒说明书
Safety Data SheetIssuing date : 25-Jun-2002SDS # : TCW 0656 R - 01 EU ENRevision date : 25-May-2015Version : 06SECTION 1: Identification of the substance/mixture and of the company/undertaking1.1. Product Identifier Product name Canon FX7 Cartridge for Facsimile Product Code(s)7621A0021.2. Relevant identified uses of the substance or mixture and uses advised against UseToner for electrophotographic machines1.3. Details of the supplier of the safety data sheet Supplier ImporterCanon Europa N.V.Bovenkerkerweg 59, 1185XB Amstelveen, The Netherlands +31 20 5458545, +31 20 5458222Manufacturer Canon Inc.30-2, Shimomaruko 3-Chome, Ohta-ku, Tokyo 146-8501, Japan 1.4. Emergency Telephone Number *1 Kontakt Giftlinien på tlf.nr.: 82 12 12 12 (åbent 24 timer i døgnet). Se punkt 4 om førstehjælp.*2 Only for the purpose of informing medical personnel in cases of acute intoxications.*3 Ask for Poison InformationSECTION 2: Hazards identification2.1. Classification of the substance or mixtureClassification according to Regulation (EC) No 1272/2008Not classifiedClassification according to EU Directives 67/548/EEC or 1999/45/EC Not classifiedAustria +43 (0) 1 406 43 43Belgium +32 (0) 70 245 245Bulgaria 112Croatia+385 (0)1-23-48-342Cyprus 1401Czech Republic +420 224919293Denmark +45 82 12 12 12 [*1]Estonia 16662Finland +358 (0)9 471977France +33 (0)1 45 42 59 59Greece +30 210 7793777Hungary +36 80 20 11 99Italy+39 (0)55 7947819Latvia+371 67042473Lithuania +370 687 53378Luxembourg 112Malta 112Netherlands +31 (0)30-2748888 [*2]Poland 112Portugal +351 808 250 143Romania +40 21 318 36 06Slovakia +421 2 5477 4166Slovenia 112Spain112Sweden 112 [*3]United Kingdom 111 (UK only)Iceland 112Liechtenstein 145Norway+47 22 59 13 00Switzerland1452.2. Label ElementsLabelling according to Regulation (EC) No 1272/2008Not requiredHazard pictogramsNot requiredSignal wordNot requiredHazard statementsNot requiredPrecautionary Statements - EU (§28, 1272/2008)Not requiredOther InformationNone2.3. Other HazardsNoneSECTION 3: Composition/information on ingredients 3.2. MixturesChemical name CAS-No EC-No REACH registrationnumber Weight %Classification(67/548)Indication ofdangerClassification (Reg.1272/2008)Styrene acrylatecopolymerCBI CBI None40 - 50None None None Iron oxide1317-61-9215-277-501-2119457646-28-xxxx40 - 50None None NoneAmorphous silica7631-86-9231-545-401-2119379499-16-xxxx 1 - 3None None NoneSECTION 4: First aid measures4.1. Description of first aid measuresInhalation Move to fresh air. Get medical attention immediately if symptoms occur.Ingestion Rinse mouth. Drink 1 or 2 glasses of water. Get medical attention immediately if symptomsoccur.Skin Contact Wash off immediately with soap and plenty of water. Get medical attention immediately ifsymptoms occur.Eye Contact Flush with plenty of water. Get medical attention immediately if symptoms occur.4.2. Most important symptoms and effects, both acute and delayedInhalation None under normal use. Exposure to excessive amounts of dust may cause physicalirritation to respiratory tract.Ingestion None under normal use.Skin Contact None under normal use.Eye Contact None under normal use. May cause slight irritation.Chronic Effects None under normal use. Prolonged inhalation of excessive amounts of dust may cause lungdamage.4.3. Indication of any immediate medical attention and special treatment neededNoneSECTION 5: Firefighting measures5.1. Extinguishing mediaSuitable extinguishing mediaUse CO2, dry chemical, or foam, Water.Unsuitable extinguishing mediaNone5.2. Special hazards arising from the substance or mixtureSpecial HazardMay form explosive mixtures with air.Hazardous combustion productsCarbon dioxide (CO 2), Carbon monoxide (CO)5.3. Advice for firefightersSpecial protective equipment for fire-fightersNoneSECTION 6: Accidental release measures6.1. Personal precautions, protective equipment and emergency proceduresAvoid breathing dust. Avoid contact with skin, eyes and clothing.6.2. Environmental PrecautionsKeep out of waterways.6.3. Methods and material for containment and cleaning upClean up promptly by scoop or vacuum. If a vacuum cleaner is used, be sure to use a model with dust explosion safety measures. May form explosive mixtures with air.6.4. Reference to other sectionsNoneSECTION 7: Handling and storage7.1. Precautions for safe handlingAvoid breathing dust. Avoid contact with skin, eyes and clothing. Clean contaminated surface thoroughly. Use only with adequate ventilation.7.2. Conditions for safe storage, including any incompatibilitiesKeep in a dry, cool and well-ventilated place. Keep out of the reach of children. Incompatible with oxidizing agents.7.3. Specific end usesToner for electrophotographic machines. Obtain special instructions before use.SECTION 8: Exposure controls/personal protection8.1. Control parametersExposure LimitsChemical name EU OEL Austria Belgium Bulgaria CyprusIron oxide 1317-61-9None None None TWA: 5.0 mg/m3TWA: 6.0 mg/m3 dust,inhalable fractionNoneAmorphous silica 7631-86-9None TWA: 4 mg/m3inhalable fractionNone None NoneChemical name Czech Republic Denmark Finland France Germany Iron oxide1317-61-9TWA: 10.0 mg/m3 dust None None None NoneAmorphous silica 7631-86-9TWA: 4.0 mg/m3amorphous SiO2None TWA: 5 mg/m3None TRGS TWA: 4 mg/m3inhalable fractionDFG TWA: 4 mg/m3inhalable fractionChemical name Greece Hungary Ireland Italy NetherlandsAmorphous silica 7631-86-9None None TWA: 6 mg/m3 totalinhalable dustTWA: 2.4 mg/m3respirable dustNone NoneChemical name Poland Portugal Romania Slovakia SpainIron oxide 1317-61-9None None None TWA: 4 mg/m3 totalaerosolNoneAmorphous silica 7631-86-9None None None TWA: 4.0 mg/m3 totalaerosolNoneChemical name Sweden United Kingdom Norway Switzerland TurkeyAmorphous silica 7631-86-9None TWA: 6 mg/m3inhalable dustTWA: 2.4 mg/m3respirable dustTWA: 1.5 mg/m3respirable dustSTEL: 3 mg/m3respirable dustTWA: 4 mg/m3inhalableNone8.2. Exposure controlsAppropriate engineering controls None under normal use conditions.Individual protection measures, such as personal protective equipmentEye/face Protection Not required under normal use.Skin Protection Not required under normal use.Respiratory Protection Not required under normal use.Thermal hazards Not ApplicableSECTION 9: Physical and chemical properties 9.1. Information on basic physical and chemical propertiesAppearance Black ; powderOdor Slight odorOdor threshold No data availablepH Not ApplicableMelting/Freezing point (°C)100-150 (Softening point)Boiling Point/Range (°C)Not ApplicableFlash Point (°C)Not ApplicableEvaporation Rate Not ApplicableFlammability (solid, gas)Not flammable; estimated Flammability Limits in AirUpper Flammability Limit Not ApplicableLower Flammability Limit Not ApplicableVapor pressure Not ApplicableVapor Density Not ApplicableRelative density 1.4-1.8Solubility(ies)Organic solvent; partly soluble Partition coefficient: n-octanol/water Not ApplicableAutoignition Temperature (°C)No data availableDecomposition Temperature (°C)> 200Viscosity (mPa s)Not ApplicableExplosive properties May form explosive mixtures with air Oxidizing properties No data available9.2. Other InformationNo data availableSECTION 10: Stability and reactivity10.1. ReactivityNone10.2. Chemical stabilityStable10.3. Possibility of Hazardous ReactionsNone10.4. Conditions to AvoidNone10.5. Incompatible materialsAcids, Bases, Oxidizing agents, Reducing agents.10.6. Hazardous Decomposition ProductsCarbon dioxide (CO 2), Carbon monoxide (CO)SECTION 11: Toxicological information11.1. Information on toxicological effectsAcute toxicity Estimate: LD50 > 2000 mg/kg (Ingestion)Skin corrosion/irritation Estimate: Non-irritantSerious eye damage/eye irritation Estimate: Transient slight conjunctival irritation only.Sensitization Estimate: Non-sensitizingGerm cell mutagenicity Estimate: Ames Test (S. typhimurium, E. coli): NegativeCarcinogenicity No data availableReproductive Toxicity No data availableSTOT - single exposure No data availableSTOT - repeated exposure Muhle et al. reported pulmonary response upon chronic inhalation exposure in rats to atoner enriched in respirable-sized particles compared to commercial toner. No pulmonarychange was found at 1 mg/m3 which is most relevant to potential human exposure. Aminimal to mild degree of fibrosis was noted in 22% of the animals at 4 mg/m3, and a mildto moderate degree of fibrosis was observed in 92% of the animals at 16 mg/m3.These findings are attributed to "lung overloading", a generic response to excessiveamounts of any dust retained in the lung for a prolonged interval.Aspiration hazard No data availableOther Information No data availableSECTION 12: Ecological information12.1. ToxicityEcotoxicity effectsEstimate: Fish, 96h LL50 > 1000 mg/l (WAF)Estimate: Crustaceans, 48h EL50 > 1000 mg/l (WAF)Estimate: Algae, ErL50(0-72h) > 1000 mg/l (WAF)12.2. Persistence and degradabilityNo data available12.3. Bioaccumulative potentialNo data available12.4. Mobility in soilNo data available12.5. Results of PBT and vPvB assessmentThis preparation contains no substance considered to be persistent, bioaccumulating nor toxic (PBT).This preparation contains no substance considered to be very persistent nor very bioaccumulating (vPvB).12.6. Other adverse effectsNo data availableSECTION 13: Disposal considerations13.1. Waste treatment methodsDO NOT put toner or a toner container into fire. Heated toner may cause severe burns. DO NOT dispose of a toner container in a plastic crusher. Use a facility with dust explosion prevention measures. Finely dispersed particles form explosive mixtures with air.Dispose of in accordance with local regulations.SECTION 14: Transport informationSECTION 15: Regulatory information15.1. Safety, health and environmental regulations/legislation specific for the substance or mixture (EC) No 1907/2006 Authorisation Not regulated (EC) No 1907/2006 Restriction Not regulated (EC) No 1005/2009Not regulated (EC) No 850/2004Not regulated (EU) No 649/2012Not regulated Other InformationNone15.2. Chemical safety assessment NoneSECTION 16: Other informationKey literature references and sources for data- World Health Organization International Agency for Research on Cancer, IARC Monographs on the Evaluation on the Carcinogenic Risk of Chemicals to Humans - EU Directive 1999/45/EC- EU Regulation (EC) No 1907/2006, (EC) No 1272/2008, (EC) No 1005/2009, (EC) No 850/2004, (EU) No 649/2012Key or legend to abbreviations and acronyms used in the safety data sheet - PBT: Persistent, Bioaccumulative and Toxic - vPvB: very Persistent and very Bioaccumulative - SVHC: Substances of Very High Concern- IARC: International Agency for Research on Cancer- EU OEL: Occupational exposure limits at Community level under Directive 2004/37/EC, 98/24/EC, 91/322/EEC, 2000/39/EC,2006/15/EC and 2009/161/EU.- TWA: Time Weighted Average - STEL: Short Term Exposure Limit- CBI: Confidential Business Information Issuing date :25-Jun-2002Revision date :25-May-201514.1. UN number280714.2. UN Proper Shipping Name Magnetized material 14.3. Transport Hazard Class 914.4. Packing Group None14.5. Environmental Hazards No special environmental precautions required.14.6. Special Precautions for users55 or more of these products shipped together, by air, are regulated as magnetized material.14.7. Transport in bulk according to Annex II of MARPOL 73/78 and the IBC CodeNot ApplicableRevision Note Entirely revisedThis safety data sheet (SDS) is supplied voluntarily.DisclaimerThe information provided on this SDS is correct to the best of our knowledge, information and belief at the date of its publication. The information given is designed only as a guide for safe handling, use, processing, storage, transportation, disposal and release and is not to be considered as a warranty or quality specification. The information relates only to the specific material designated and may not be valid for such material used in combination with any other material or in any process, unless specified in the text.。
940l不锈钢成分
940L不锈钢成分1. 介绍不锈钢是一种重要的材料，具有耐腐蚀、耐高温等特性，在工业、建筑和家居等领域得到广泛应用。
940L不锈钢是一种常见的不锈钢材料，本文将对其成分进行全面、详细、完整和深入的探讨。
2. 940L不锈钢的基本成分940L不锈钢的基本成分包括铁（Fe）、铬（Cr）、镍（Ni）和钼（Mo）。
其中，铁是不锈钢的主要成分，占比最高，通常超过50%。
铬是不锈钢的关键成分，具有耐腐蚀的作用，一般占比在17%到20%之间。
镍和钼的含量相对较低，但对不锈钢的性能影响重大，通常镍的含量在8%到10%之间，钼的含量在2%到3%之间。
3. 940L不锈钢的特性940L不锈钢具有以下特性：3.1 耐腐蚀性940L不锈钢含有较高的铬和镍含量，使其具有优异的耐腐蚀性。
在常温下，它能够抵抗大部分有机酸、无机酸和盐溶液的腐蚀。
此外，它还能够在高温下抵抗氧化腐蚀，适用于一些特殊环境下的使用。
3.2 耐高温性940L不锈钢的铬含量较高，使其具有良好的耐高温性。
它能够在高温下保持较好的强度和韧性，不易变形和熔化。
因此，它广泛应用于高温工作环境中，如石油化工、航空航天等领域。
3.3 优良的机械性能940L不锈钢具有良好的机械性能，包括高强度、高硬度和良好的塑性。
它的强度大约是普通碳钢的两倍，硬度高于大部分不锈钢材料。
同时，它还具有良好的塑性，可以通过冷加工和热加工进行成型和加工。
3.4 优异的焊接性能940L不锈钢具有优异的焊接性能，可通过常规的焊接方法进行连接和组装。
焊接后的接头强度高，与基材的性能相当。
4. 940L不锈钢的应用领域940L不锈钢由于其优异的性能，在众多领域得到广泛应用，包括但不限于以下几个方面：4.1 化工工业940L不锈钢在化工工业中应用广泛，特别是在腐蚀性介质的储存和输送设备中。
其耐腐蚀性能能够保证设备长期稳定运行，不会发生泄漏和腐蚀。
4.2 石油化工940L不锈钢在石油化工领域中起到重要作用。
Eaton FI3090L型号的完整模具筒电路保护器说明说明书
Eaton FI3090LEaton Series C complete molded case circuit breaker, F-frame, FI, Complete breaker, Thermal-magnetic trip type, Three-pole, 90A, 480 Vac, 14 kAIC at 480 Vac, Line and load, InternationalGeneral specificationsEaton Series C complete molded case circuit breakerFI3090L 7866792795887.6 in 6 in5 in 4.65 lb Eaton Selling Policy 25-000, one (1) year from the date of installation of the Product or eighteen (18) months from the date of shipment of the Product, whichever occurs first.IEC 947Product NameCatalog Number UPCProduct Length/Depth Product Height Product Width Product Weight WarrantyCertifications14 kAIC at 480 Vac FFIInternational Complete breaker Line and load480 Vac Universal90 AThermal-magnetic Three-pole Application of Tap Rules to Molded Case Breaker TerminalsUL listed 100%-rated molded case circuit breakersApplication of Multi-Wire Terminals for Molded Case Circuit BreakersStrandAble terminals product aidCircuit breaker motor operators product aidMulti-wire lugs product aidCurrent limiting Series C molded case circuit breakers product aid Power metering and monitoring with Modbus RTU product aidMotor protection circuit breakers product aidPlug-in adapters for molded case circuit breakers product aid Breaker service centersMolded case circuit breakers catalogInstallation Instructions for Gi, Fi, Ji, Ki, Li, Molded Case Circuit Breakers Universal LineCircuit breakers explainedCircuit Breakers ExplainedSeries C F-Frame molded case circuit breakersSeries C G-Frame molded case circuit breakers time current curves MOEM MCCB product selection guideSeries C J-Frame molded case circuit breakers time current curves Eaton Specification Sheet - FI3090LInterrupt ratingFrameCircuit breaker type ClassCircuit breaker frame type TerminalsVoltage rating ApplicationAmperage RatingTrip TypeNumber of poles Application notesBrochuresCatalogsInstallation instructions MultimediaSpecifications and datasheetsEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia。
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1/11L9407FFebruary 2003This is preliminary information on a new product now in development. Details are subject to change without notice.s FULLY MONOLITHIC DESIGN s LOW SIDE FIELD DRIVER s THERMAL PROTECTIONs FIELD SHORT CIRCUIT PROTECTION s PROTECTED DIAGNOSTIC LAMP DRIVER s PROTECTED HIGH SIDE RELAY DRIVER s COMPLEX DIAGNOSTICS s LOAD RESPONSE CONTROL sDFM OUTPUT (FIELD MONITOR)DESCRIPTIONThe L9407F is a monolithic multifunction alternator voltage regulator intended for use in automotive ap-plication. It includes the control section, the field pow-er stage, fault diagnostic circuit which drives a warning lamp, and the protection against short cir-cuits.CIRCUIT OPERATIONThe alternator's voltage regulator performs the fol-lowing main functions:–1) voltage regulation –2) protection–3) control fault diagnosis –4) load response control VOLTAGE REGULATIONThe alternator voltage is compared with a reference voltage in an amplifier, whose output determines the switching frequency of output power MOS whose current excites the coil of the alternator; as the regu-lators are a self-oscillating type this frequency de-pends on the whole system parameter set including the alternator characteristics. The regulators have an integrated filter in the voltage sensing path guaran-teeing the correct behaviour of the devices also when the rectifier diodes feature very high switching spikes. The internal filtering allows the usage of thedevice also with very long cables connecting the al-ternator to the battery with an impedance so high to cause a superimposed ripple on the alternator volt-age higher than 5-6V. Consequently it doesn't need,in the standard application, any external component.Anyway an external application (2.2uF or 2.7uF)must be inserted between A+ and ground when using the device with very long cables.PROTECTIONIt is present a protection against short circuits of the lamp and the relay power drivers (D+) and of the field power driver (DF), a thermal drivers shutdown pro-tection and an overvoltage protection of D+ power drivers.DIAGNOSISThe circuit detects fault conditions related to the phase and DF status and receives informations from one of the three alternator phases. In order to prevent spurious indications, fault warnings are not displayed immediately but are dalayed by a fixed time.LOAD RESPONSE CONTROLThe internal circuit regulates the soft start character-istics (activated always at engine start) and the soft attack characteristics.PRODUCT PREVIEWCAR ALTERNATOR VOLTAGE REGULATORL9407F2/11PIN DESCRIPTIONABSOLUTE MAXIMUM RATINGSN°Pin Function1D+Lamp terminal low side driver; relay terminal high side driver2A+Alternator output voltage supply 3NC Not connected4DF Field low side driver output 5GND Ground6DFM Field monitor output 7NC Not connected 8PHPhase sense inputSymbol ParameterValue Unit V SDC Supply Voltage (2 min. @ 25°C) [all pins vs. GND]24V T ransient Supply Voltage (load dump) [see application circuit] t<500ms40V T ransient Supply Voltage (low energy spikes) [see application circuit] ISO7637-1 pulse 1,2,3 /ISO7637-3100 (clamped at 60 byapplication)V T j Junction temperature range-40 to 170°C T stg , T caseStorage and case temperature range-40 to 150°C P totT otal power Dissipation (@ Tcase = 150°C, Ifield = 5A) 8W Reverse Voltage (see application diagram) @ 25°C, T = 15 sec all pins, except for PH (normal working condition) -2.5V DC Pin Current on DF , A+, GND (bonding limitation)15A ESD Voltage MILSTD883C (All pins vs.GND)±4KVL9407FTHERMAL DATASymbol Parameter Value Unit R th j-case Thermal Resistance Junction to Case0.6°C/WELECTRICAL CHARACTERISTCS(T case = -40ºC ÷ 150ºC; unless otherwise specified)Symbol Parameter Test Condition Min.Typ.Max Unit Vbat Operating Supply Voltage618VIb-sinked Supply Battery Current50mA Ib-stby Stand-by Current Vbat = A+, DF = 12.5V 500uAVreg Regulated Volt. & Therm. Drift Ialt=1A-0.9*Inom; Tcase=20ºC;1200<rpm<RPMMAX;Vreg clamped at 14.8V Max. (Fig.3)13.9-4.514.35-3.514.8-2.5VmV/°Cfsw Switching Frequency preexcitation30400Hz Delta Vrpm1500<rpm<RPMMAX; Ialt=5A;Tcase=23ºC200mVDelta Vload5A<Ialt<Inom; rpm=6000rpm;Tcase=23ºC250mVVreg Reg. Voltage without Battery Ialt = 3A resistive; Tcase=25º;2000<rpm<RPMMAX1216VVov D+ Drivers Disable Threshold Voltage on pin A+ to have D+OFF1822V Tj-sd Thermal Shut-down D+/DF = OFF STATE180200220ºCTj-sd-hys Thermal Shut-down hysteresis D+/DF from OFF STATE (due tothermal shutdown) to ON STATETj-sd-2Tj-sd-10ºCVuv Low voltage detectionthreshold D+ low side driver ON afterdiagnosis delay time7.78.69.5VVuv-hys Low voltage detectionthreshold hysteresis D+ low side driver OFF withoutdelayVuv +0.40Vuv +0.50Vuv +0.60VRon LSD Low Side Driver Rdson T = 150ºC; I = 4.5A189mΩRon LSD Low Side Driver Rdson T = 25ºC; I = 7A107mOhm Vf Freewheeling diode DF I=5A2VIf_SCTH Short Circuit Threshold DF DF = 12V; Tcase = -40ºC 1118ADF = 12V; Tcase = -25ºC 8.518ADF = 12V; Tcase = -150ºC 5.518A Vs1Output Short to GROUND DFThreshold2.13.9VFS_duty Pre-excitation F.S.D.F. f = 333Hz +/- 15% 15.9318.7521.57%3/11L9407F4/11t_ST Soft Start Delay Time (see fig. 5)activated always at engine start 0s t_SL Soft Attack Time / Soft Start Time (see fig. 5)from 0 to 100% field duty cycle 2.4533.45s BlSoft Attack Blind Zonepercentage of maximum duty cycle immediate variation at soft attack010%t-rise Output Voltage Rise Time Ifield = 3A resistive (Fig. 6)450µs t_fall Output Voltage Fall Time Ifield = 3A resistive (Fig. 6)550µs If_leak Output Field Driver Leakage CurrentDF = 24V 1mA VH_SAT High Side Driver Saturation Voltage (Fig. 9)I source = 1A 1.2V VL_SAT1Low Side Driver Saturation VoltageI sink = 0.5A 2V VL_SAT2Low Side Driver Saturation VoltageI sink = 0.3A1.5V VLSB Selfbias without supply Lamp driver Voltage4V IHSC High Side Driver short circuit current (Fig. 9)A+ = 17.5V; D+ = GND 1.23A ILSC Low Side Driver short circuit currentA+ = D+ = 17.5V0.7 2.5A VthD+Enable Regulator Voltage D+0.50.70.9V IthD+Enable Regulator pull-down Current D+0.43.5mA L-t-D Lamp on delay at Ign. switch turn on(Fig. 7)2ms Vcan Test mode to cancel soft start/attack (voltage)(Fig. 8)3644V VPHL1Enable control voltage input high threshold square wave f = 1KHz0.670.7950.92V t_PH PH Filtering Time50200µs VPHH1Diagnosis phase loss input high threshold910.2511.5V VPHH2Diagnosis phase loss input low thresholdguaranteed by design 456V tPHd Diagnostic PH Filtering Time guaranteed by design50200µs I_Th-PHPhase Pull-down Current18mAELECTRICAL CHARACTERISTCS (continued)(T case = -40ºC ÷ 150ºC; unless otherwise specified)Symbol ParameterTest ConditionMin.Typ.MaxUnit5/11L9407FENSoft start enable frequency rangeTcase = 25ºCTcase = -40 to150ºC144136160160176184Hz Hz f_RESS_SS Reset frequency range toenable soft start 405060Hz DISAB Soft start enable frequency rangeTcase = 25ºCTcase = -40 to150ºC 367347408408449469Hz Hz f-dfm Output open drain switching freq.preexc. mode; Isink=14mA 30400Hz VL-DF-MONOutput low voltage saturationI-sink=14mA1.5V I-DF-MON Short circuit current protection V-DF-MON=24V field fully on 15120mA Ilk-DF-MON Output leakage current V-DF-MON=24V field off 0.1mA t-TM Output voltage rise time R=2.7K Ohm; C=1nF; Valim=13.5V (Fig. 6)0.0550us t-TD Output voltage fall time R=2.7K Ohm; C=1nF; Valim=13.5V (Fig. 6)0.0550us t-DDiagnostic Alarm Delay Time0.150.5sELECTRICAL CHARACTERISTCS (continued)(T case = -40ºC ÷ 150ºC; unless otherwise specified)Symbol ParameterTest ConditionMin.Typ.Max UnitL9407F6/11L9407F7/11L9407FTable 1. FAULT DETECTION TABLERoot Cause Signal Effect Test detect Alternator belt breaking PH Alternator disexcitation VPH<VPHH & VA+<Vreg Brushes open PH Alternator disexcitation VPH<VPHH & VA+<Vreg Driver Open PH Alternator disexcitation VPH<VPHH & VA+<Vreg Field interruption PH Alternator disexcitation VPH<VPHH & VA+<Vreg Field short circuit to the battery PH Alternator disexcitation VPH<VPHH & VA+<Vreg Field short circuit to the ground DF Overvoltage DF<VS1 & VA+>Vreg Battery discharge (Field Driver open)A+Undervoltage VA+<VregNo fully excited A+Undervoltage VA+<VuvBattery discharge A+Undervoltage VA+<VuvThe diagnostic result is disabled during the Soft-start delay time t_ST and the soft-start / soft attack timing t_SL8/11L9407F9/11L9407F10/11元器件交易网L9407F Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequencesof use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grantedby implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subjectto change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.STMicroelectronics acknowledges the trademarks of all companies referred to in this document.The ST logo is a registered trademark of STMicroelectronics© 2003 STMicroelectronics - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco -Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.11/11。