Standard MEMS sensor technologies for harsh environment

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mems工程师需要的资格证书

mems工程师需要的资格证书（原创版）目录1.MEMS 工程师的职业定义和重要性2.MEMS 工程师所需的资格证书3.如何获得这些证书4.总结正文MEMS 工程师，即微机电系统工程师，是一种专注于设计和制造微小机器和设备的工程师。

这些微小的机器和设备通常由电子和机械组件构成，被广泛应用于各种领域，如医疗、工业和消费类电子产品。

因此，MEMS 工程师对于现代科技社会的发展起着至关重要的作用。

作为一名 MEMS 工程师，需要具备一定的技术和知识，因此需要获得一些资格证书来证明自己的能力和专业知识。

这些证书可以提高工程师的专业水平，使他们在职业生涯中更具竞争力。

首先，MEMS 工程师需要具备基本的工程教育背景，通常要求至少拥有一个工程学学位，如机械工程、电子工程或材料工程等。

此外，他们还需要掌握相关的技术知识，如计算机辅助设计（CAD）和计算机辅助制造（CAM）等。

其次，MEMS 工程师还需要获得一些专业证书，以证明他们在微机电系统领域的专业能力。

例如，美国微机电系统学会（MEMS Innovation Group）提供的 MEMS 设计师证书，以及国际微电子及组装技术协会（International Society for Microelectronics and Packaging）提供的微电子组装技术证书等。

那么，如何获得这些证书呢？通常，获得这些证书需要参加相关的培训课程和考试。

这些课程和考试通常由专业的机构或学会提供，旨在帮助MEMS 工程师提高专业技能和知识。

总的来说，作为一名 MEMS 工程师，获得相关的资格证书是非常重要的。

这些证书不仅可以提高工程师的专业水平，还可以增加他们在职业生涯中的竞争力。

Sensata Technologies 压力传感器产品简介说明书

Temperature FunctionWORLD CLASSPERFORMANCESensata Technologiesoffers a wide range ofsensing solutions forpressure applications ofevery kind. By focusingour unparalleledengineering and manu-facturing expertise onyour needs, we willmeet the highestexpectations of all -your own.Sensata Technologiesis the world’s leadingsupplier of sensors andcontrols across a broadrange of markets andapplications.WORLD CLASS PERFORMANCE The CP Series’ pressure transducers with their proven ceramiccapacitive technology have been on the market for many years.Our large portfolio with a variety of mechanical and electrical connec-tions creates a broad range of combination possibilities.50.5 (2)73.8 max (2.9)57.9 max (2.3)35.6 max (1.8)ø 24.3 (0.96)8.2 (0.3)3.6 (0.14)40.2 (1.6)30.4 (1.2)Sensata Technologies is the world’s leading supplier of sensors and controls across a broad range of markets and applications.WORLD CLASS 65.0 (2.56)45.6 (1.8)23.9 (0.94)Pressure outputGroundSupply voltageThermistor outputFeatures and benefits• Hermetic pressure sensors with multiple Input/Output options • High accuracy and repeatability • Multiple standard and custom ports • Outstanding EMC performance and high dielectric strengthTypical applications• Air conditioning• Alternative energy management • Compressors and pumps • Hydraulics and pneumatics• Processing control and automation • Vending machinesWORLD CLASS PERFORMANCE The CH Series’ pressure transducers are ideally suited for the most demanding industrial applications. This innovative product is hermetic but not oil-filled and boasts case isolation up to 1800 V.Ground57.2 (2.25)Aø 31.8 (1.25)Power terminalAOuput terminalø 27.4 (1.08)Sensata Technologies is the world’s leading supplier of sensors and controls across a broad range of markets and applications.Technical specificationsWORLD CLASS PERFORMANCE The PP Series’ pressure transducers allow for the best control in an industrial system. A piezo-resistive technology has been selected, whereby the strain gauges are glass fused onto a metal membrane and hermetically sealed.Small Form Factor 30.1 (1.19)ø 13 (0.51)31.7 (1.25)30 m a x (1.18)40 max (1.58)28 (1.10) 26.8 max (1.06)ø 6 (0.24)Sensata Technologies is the world’s leading supplier of sensors and controls across a broad range of markets and applications.WORLD CLASS PERFORMANCE The most accurate technologies for a true Differential Pressure Sensor are Micro-Electro-Mechanical-Systems (MEMS). Our patented MEMSproducts offer the best-value solutions for differential pressure applications.23 (0.9)ø 6 (0.24)23 (0.9)ø 8 (0.32)20 (0.8)71 (2.8)12.6 (0.5)Supply Voltage GroundOutput signal6 (0.24)Sensata Technologies is the world’s leading supplier of sensors and controls across a broad range of markets and applications.Seal material compatibility guideSeal material Media compatibility (please contact Sensata for more information)Maximum seal temperature range*petroleum oils, lubricants, detergent solutionssteam soaps, polar solvents, brake fluid, acetone Skydrol TM chlorinated solvents, oils, fuels, air Pressure connections(please contact Sensata for other connections)27.6 (1.09)Packard Metri-PackAMP MQS - 3 pins 1/4” - 18 NPTF male1/8” - 27 NPTF male1/4” SAE female flare with deflator (7/6” - 20 UNF - 2B)ø 17 (0.67)Electrical connections(please contact Sensata for other connections)16.4 (0.65)23.5 (0.95)34.4 (1.35)DIN 7258519.6 (0.77)ø 23.6 (0.93)12.9 (0.51)26.4 (1.04)34.1 (1.34)3/8” - 24 UNF male1/4” - 19 BSPT male25.1 (0.99)20 (0.79)10.9 (0.43)7 (0.28)14.5 (0.57)24.3 (0.96)9.8 (0.39)14.5 (0.57)8.9 (0.35)VDA13.8 (0.54)27.1 (1.07)7/16” - 20 UNF maleHex 17.5 (0.69)14.6 (0.58)Hex 17.5 (0.69)11.4 (0.45)Hex 15.7 (0.62)9.5 (0.38)M12 x 1 maleM12 x 1.5 maleM14 x 1.5 male13.7 (0.54)16.2 (1.48)11.3 (0.45)10.3 (0.41)9.8 (0.39)M10 x 1.25 female M18 x 1.5 male 10 (0.39)Hex 14 (0.55)12.7 (0.5)14 (0.55)12 (0.47)12 (0.47)6.9 (0.27)13.2 (0.84)12 (0.47)15.5 (0.6)18 (0.71)19.3 (0.76)19.9 (0.78)14.3 (0.56)11.1 (0.44)17.5 (0.69)6.4 (0.25)Hex 15.9 (0.63)12.7 (0.5)9.2 (0.36)Note: Dimensions are shown in mm (inches)Note: Dimensions are shown in mm (inches)10.6 (0.42)12.7 (0.5)15.3 (0.6)10.3 (0.41)Yazaki10.4 (0.41)21.8 (0.96)RD22.3 (0.88)70.1 (2.76)Sensata Technologies Holland B.V. Kolthofsingel 87602 EM ALMELOThe NetherlandsPhone: +31 546 879555Fax:+31 546 870535 Important Notice: Sensata Technologies (Sensata) reserves the right to make changes to or discontinue any product or service identified in this publication without notice. Sensata advises its customers to obtain the latest version of the relevant information to verify, before placing any orders, that the information being relied upon is current. Sensata assumes no responsibility for infringement of assistance or product specifications since Sensata does not possess full access concerning the use or application of customers' products. Sensata also assumes no responsibil-ity for customers' product design.。

传感器技术论文中英文对照资料外文翻译文献

传感器技术论文中英文对照资料外文翻译文献Development of New Sensor TechnologiesSensors are devices that can convert physical。

chemical。

logical quantities。

etc。

into electrical signals。

The output signals can take different forms。

such as voltage。

current。

frequency。

pulse。

etc。

and can meet the requirements of n n。

processing。

recording。

display。

and control。

They are indispensable components in automatic n systems and automatic control systems。

If computers are compared to brains。

then sensors are like the five senses。

Sensors can correctly sense the measured quantity and convert it into a corresponding output。

playing a decisive role in the quality of the system。

The higher the degree of n。

the higher the requirements for sensors。

In today's n age。

the n industry includes three parts: sensing technology。

n technology。

and computer technology。

MEMS陀螺仪的简要介绍（性能参数和使用）

MEMS陀螺仪的简要介绍（性能参数和使用）MEMS传感器市场浪潮可以从最早的汽车电子到近些年来的消费电子，和即将来到的物联网时代。

如今单一的传感器已不能满足人们对功能、智能的需要，像包括MEMS惯性传感器、MEMS环境传感器、MEMS光学传感器、甚至生物传感器等多种传感器数据融合将成为新时代传感器应用的趋势。

工欲善其事，必先利其器，这里就先以MEMS陀螺仪开始，简要介绍一下MEMS陀螺仪、主要性能参数和使用。

传统机械陀螺仪主要利用角动量守恒原理，即：对旋转的物体，它的转轴指向不会随着承载它的支架的旋转而变化。

MEMS陀螺仪主要利用科里奥利力（旋转物体在有径向运动时所受到的切向力）原理，公开的微机械陀螺仪均采用振动物体传感角速度的概念，利用振动来诱导和探测科里奥利力。

MEMS陀螺仪的核心是一个微加工机械单元，在设计上按照一个音叉机制共振运动，通过科里奥利力原理把角速率转换成一个特定感测结构的位移。

以一个单轴偏移（偏航，YAW）陀螺仪为例，通过图利探讨最简单的工作原理。

两个相同的质量块以方向相反的做水平震荡，如水平方向箭头所示。

当外部施加一个角速率，就会出现一个科氏力，力的方向垂直于质量运动方向，如垂直方向箭头所示。

产生的科氏力使感测质量发生位移，位移大小与所施加的角速率大小成正比。

因为感测器感测部分的动电极（转子）位于固定电极（定子）的侧边，上面的位移将会在定子和转子之间引起电容变化，因此，在陀螺仪输入部分施加的角速率被转化成一个专用电路可以检测的电子参数---电容量。

下图是一种MEMS陀螺仪的系统架构，，陀螺仪的讯号调节电路可以分为马达驱动和加速度计感测电路两个部分。

其中，马达驱动部分是透过静电引动方法，使驱动电路前后振动，为机械元件提供激励；而感测部分透过测量电容变化来测量科氏力在感测质量上产生的位移。

当然，MEMS陀螺仪还具有其它功能模块，比如自检功能电路，低功耗以及运动唤醒电路等等。

下面主要介绍MEMS陀螺仪的主要性能参数。

mems微机电系统名词解释

mems微机电系统名词解释MEMS（Micro-Electro-Mechanical Systems，微机电系统）是一种集成微型机械、电子与传感器功能于一身的微型设备。

它结合了传统的机械制造技术、半导体工艺和微纳米技术，将微型机械部件、传感器、电子电路以及微纳加工技术集成在一个晶圆上，以实现微型化、多功能化和集成化的目标。

以下是一些与MEMS相关的名词解释：1. 传感器（Sensor）：一种能够感知并转换外部物理量、化学量或生物量的设备，可以将感应到的物理量转化为电信号。

2. 执行器（Actuator）：一种能够接收电信号并将其转化为相应的机械运动的设备，用来实现对外界的控制或作用。

3. 微型机械（Micro-Mechanical）：指尺寸在微米或纳米级别的机械部件，由微细加工技术制造而成，具有微小、精确和高效的特点。

4. 纳米技术（Nanotechnology）：一种研究和应用物质在纳米尺度下的特性、制备和操作的技术，常用于MEMS器件的加工制造。

5. 惯性传感器（Inertial Sensor）：一种基于测量物体运动状态和变化的MEMS传感器，如加速度计和陀螺仪。

6. 压力传感器（Pressure Sensor）：一种可以测量气体或液体压力的MEMS传感器，常用于汽车、医疗、工业等领域。

7. 加速度计（Accelerometer）：一种测量物体在空间中加速度的MEMS传感器，常用于移动设备、运动检测等应用。

8. 微镜（Micro-Mirror）：一种利用MEMS技术制造的微型反射镜，通常用于显示、成像和光学通信等应用。

9. 微流体器件（Microfluidic Device）：一种用于实现微小流体控制的MEMS器件，常用于生化分析、药物传递和微生物学研究等领域。

10. 无线传感器网络（Wireless Sensor Network）：一种由多个分布式的MEMS传感器节点组成的网络系统，可以实现对环境信息的实时采集、处理和通信。

IEEE Std 2700-2014 MEMS

Abstract: A common framework for sensor performance specification terminology, units, conditions and limits is provided. Specifically, the accelerometer, magnetometer, gyrometer/gyroscope, barometer/pressure sensors, hygrometer/humidity sensors, temperature sensors, ambient light sensors, and proximity sensors are discussed. Keywords: ambient light, accelerometer, gyroscope, humidity, IEEE 2700™, magnetometer, MEMS, microelectromechanical proximity, sensors systems, pressure, temperature, terminology
IEEE Standard for Sensor Performance Parameter Definitions
SponsorMicro源自lectromechanical Systems Standards Development Committee
of the
IEEE Electron Devices Society
•
The Institute of Electrical and Electronics Engineers, Inc. 3 Park Avenue, New York, NY 10016-5997, USA Copyright © 2014 by The Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Published 20 August 2014. Printed in the United States of America. IEEE is a registered trademark in the U.S. Patent & Trademark Office, owned by The Institute of Electrical and Electronics Engineers, Incorporated. PDF: Print: ISBN 978-0-7381-9252-9 ISBN 978-0-7381-9253-6 STD98747 STDPD98747

什么是3D MEMS？三维微电子机械系统

什么是3D MEMS？三维微电子机械系统
微机电（MEMS）技术在电子产品中的地位愈来愈重要，不论是在汽车、工业、医疗或军事上需要用到此类精密的元器件，在信息、通讯和消费性电
子等大众的市场，也可以看到快速增长的MEMS应用。

MEMS本质上是一种把微型机械组件（如传感器、制动器等）与电子电
路集成在同一颗芯片上的半导体技术。

一般芯片只是利用了硅半导体的电气
特性，而MEMS 则利用了芯片的电气和机械两种特性。

三维微电子机械系统（3D-MEMS），是将硅加工成三维结构，其封装和触点便于安装和装配，用这种技术制作的传感器具有极好的精度、极小的尺寸
和极低的功耗。

这种传感器仅由一小片硅就能制作出来，并能测量三个互相
垂直方向的加速度。

例如为承受强烈震动的加速度传感器和高分辨率的高度
计提供合适的机械阻尼。

这类传感器的功率消耗非常低，这使它们在电池驱
动设备中具有不可比拟的优越性。

在MEMS 传感器芯片内，三轴（X、Y、Z）上的运动或倾斜会引起活动。

测控技术与仪器专业英语unit

主语为the reduction和the presence，谓语为pose，宾语 challenges。
全句译为：然而，供应电压从5V衰减到3.3V甚至更低，以及系统中多种电压形式的出现，并不只是对最智能的传感器提出的考验。
Separate integrated circuits (ICs) are available to handle the variety of voltages and resolve the problem, but they add to system and sensor complexity. 译为：单独的集成电路（ICs）可用来处理各种不同的电压并解决问题，但它们增加了系统和传感器的复杂性。
译为：该转换器将测量的物理量进行转换。观察员对系统进行修正以使结果接近理想值。典型的测量系统的组成框图如图3.1所示。
Figure 3.1 General sensing system
6
Unit3 Smart Sensors
Many home thermostats（恒温（调节）器）, tire pressure gauges（轮胎气压表）, and factory flow meters still operate in the same manner.
Unit3 Smart Sensors
1
Unit3 Smart Sensors
Introduction
Just about everything today in the technology area is a candidate（申请求职者，候选人；报考者）for having the prefix （前缀）smart added to it. The term smart sensor was coined in the mid-1980s, and since then several devices have been called smart sensors.

微系统技术介绍

集成电路以集成度每三年增加四倍、特征尺寸每三年缩小1. 414倍的摩尔定律发展。技术密集、信息含量大。
微电子技术包括相关的设计、制造和封装技术，融合了材料、器件物理、计算机、光学、化学、真空、精密机械、理化分析等科学技术的最新成就。
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2 微系统相关技术基础
射频与无线电技术
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1 What Is MICROSYSTEMS
微系统与集成电路制造的关系（Cont.）
• 因此，微系统的整个制造过程，即芯片加工、集成组装、封装测试等要比集成电路制造过程复杂得多。
• 微系统技术的发展已经使许多高速信息处理、大容量存储、超低功耗的电子产品成为现实，未来的微系统产品将覆盖人类生活的方方面面。
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Actuator
Sensor
Parameters to be
Controlled
4
1 What Is MICROSYSTEMS
微系统构成
微系统的构成：一个完整的微系统由传感器模块、执行元件模块、信号处理模块、外部环境接口模块以及定位机构、支撑机构、工具等机械结构等部分构成。
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2 微系统相关技术基础
微机电系统技术（MicroElectroMechanical Systems）
• MEMS is a class of systems that are physically small. These systems have both electrical and mechanical components. MEMS originally used modified integrated circuit (computer chip) fabrication techniques and materials to create these very small mechanical devices. Today there are many more fabrication techniques and materials available.

isa标准 mems

ISA（Inertial Sensor Assembly）标准MEMS （Micro-Electro-Mechanical Systems）是一种基于微电子技术和微机械制造工艺的惯性传感器装配件。

它由加速度计和陀螺仪两个主要组件构成，能够测量和监测物体的线性加速度和角速度。

ISA标准MEMS在多个领域具有广泛的应用，包括航空航天、汽车、船舶、工业制造等。

其小巧、高精度和低功耗的特点使得它成为现代导航、姿态控制和运动跟踪系统中的重要组成部分。

首先，ISA标准MEMS的核心技术在于微电子和微机械制造工艺的结合。

它采用了微米级别的制造工艺，将传感器的关键组件集成在芯片上。

这种集成化的设计不仅大大减小了传感器的体积，还提高了系统的可靠性和稳定性。

其次，ISA标准MEMS的加速度计模块能够测量物体的线性加速度。

当物体受到外力作用时，加速度计能够感知到物体的加速度变化，并通过处理电路将其转换成电信号输出。

这样，我们可以利用加速度计来监测物体的运动状态、振动以及碰撞等情况。

另外，ISA标准MEMS的陀螺仪模块能够测量物体的角速度。

陀螺仪利用机械结构和微电子器件来感知物体绕其自身旋转的角速度。

通过对角速度的测量和分析，我们可以实时获取物体的旋转姿态、方向和角度变化。

ISA标准MEMS的应用非常广泛。

在航空航天领域，它可以被用于导航系统、飞行控制系统和姿态稳定系统中，为飞行器提供精准的位置和方向信息。

在汽车领域，它可以应用于车辆稳定性控制系统、惯性导航系统和碰撞检测系统等，提高行车安全性和驾驶体验。

此外，ISA标准MEMS还可以在工业制造中起到关键作用。

例如，在机床和机器人领域，它可以用于实现精确的工件定位和运动控制。

在船舶和海洋工程领域，它可以应用于船舶导航和姿态控制系统，确保船只的航行安全和稳定性。

综上所述，ISA标准MEMS作为一种基于微电子和微机械制造工艺的惯性传感器装配件，在各个领域都具有重要的应用价值。

全球十大主流传感器厂商以及代工厂盘点

全球⼗⼤主流传感器⼚商以及代⼯⼚盘点传感器是什么？传感器（英⽂名称：transducer/sensor）是⼀种检测装置，能感受到被测量的信息，并能将感受到的信息，按⼀定规律变换成为电信号或其他所需形式的信息输出，以满⾜信息的传输、处理、存储、显⽰、记录和控制等要求。

传感器分类通常据其基本感知功能可分为热敏元件、光敏元件、⽓敏元件、⼒敏元件、磁敏元件、湿敏元件、声敏元件、放射线敏感元件、⾊敏元件和味敏元件等⼗⼤类。

常将传感器的功能与⼈类5⼤感觉器官相⽐拟：压敏/温敏/流体传感器——触觉⽓敏传感器——嗅觉光敏传感器——视觉声敏传感器——听觉化学传感器——味觉传感器细分的话，分类很多:光电/光敏传感器电磁/磁敏传感器霍尔/电流（压）传感器超声波/声敏传感器光纤/激光传感器测距/距离传感器视觉/图像传感器微波传感器光栅/光幕传感器压⼒/称重/⼒（敏）传感器⼒矩/扭矩传感器温度/湿度/湿温度传感器汽车传感器速度/加速度传感器⽓体/⽓敏/烟雾传感器料位/液位传感器振动/接近/位移/照度传感器流量传感器风速/风向/风量传感器⾓度/倾⾓传感器红（紫）外/射线/辐射传感器⾊标/颜⾊传感器⽕焰（警）传感器⽣物传感器压电传感器电量传感器旋转位置传感器区域传感器⾼压传感器，⽓压/压差传感器，长度传感器电阻/电容/电感传感器分析传感器电导率传感器离⼦传感器硬度传感器密度传感器惯性传感器MEMS传感器⽆线传感器智能传感器⾦属氧化传感器陀螺仪AMR传感器（磁性开关）磁性识别传感器其他传感器根据输出信号的性质可分为：模拟式传感器和数字式传感器。

即模拟式传感器输出模拟信号，数字式传感器输出数字信号。

(这是参考维库仪器仪表⽹上的分类)2016年传感器主流类型及应⽤温度传感器简介：温度传感器在早期的⼿机中就已经出现，它可以检测⼿机电池和处理器温度变化情况。

⽬前的智能⼿机中拥有更多的温度传感器，⽤于检测⼿机的⼯作情况，控制⼿机发热程度等。

TE Connectivity传感器产品简介说明书

SMARTER SOLUTIONS START WITHTE CONNECTIVITY SENSORSPIEZO FILM HUMIDITY PHOTO OPTIC PRESSURE TEMPERATURE FLUID PROPERTY POSITIONVIBRATION/ FORCE/TORQUE SPEED TE SENSORS EVERYWHERE SMARTER SOLUTIONS START WITH TE CONNECTIVITY SENSORSTE Connectivity (TE) is one of the largest connectivity and sensor companies in the world, withinnovative sensor solutions that help customers transform concepts into smart, connected creations.Our sensors are vital to the next generation of data-driven technology. TE offers an unmatchedportfolio of intelligent, efficient and high-performing sensor solutions to customers across a widerange of industries including automotive, medical, appliance, aerospace & defense, oil & gas,industrial and commercial transportation and consumer applications. Our sensor portfolio includestechnologies capable of measuring most physical characteristics, including pressure, position,temperature, vibration, force/torque, humidity and fluid property, even in harsh conditions.Measurement Specialties (MEAS) Quality Certifications:American Sensor T echnologies (AST) & Macro Sensors (MACRO) Approvals/Certifications:• AS/EN 9100• ATEX • ATEX 949EC • CE-MDD • CMDR–Health Canada • EN 13980• ESA 266• ESCC266E • ESCC 400C • FDA • ISO 13485• ISO 14001• ISO 9001• M easuring Instruments Directive 2004/22/EC annex D • NASA Qualified • NSF-61 Water Quality• PART21G• TS 16949• ABS • ATEX • CCOE • CNEX • CRN B31.3• CSA • CE•EC 79• IEC 61508• IECEx• ISO 9001• KGS (Korean Gas Safety)• ULINNOVATIVE SENSOR SOLUTIONS THAT HELP CUSTOMERS TRANSFORM CONCEPTS INTO SMART, CONNECTED CREATIONS.PIEZO FILM SENSORS Piezoelectric fluoropolymer film produces voltage or charge proportional to strain. A highly versatile, enabling sensor technology, Piezo Film has thin cross-section, is flexible, very robust, chemically inert and can withstand temperatures up to 85°C.POSITION SENSORS TE is one of the world’s largest manufacturers of industrial and automotive sensors for linear displacement, rotary position and speed sensing. TE owns a wide range of sensing technologies like MR, PLCD, LVDT and Resolver, and offers the complete spectrum from sensing element up to system packaging for harsh environments. On the strength of our customized design and packaging, based on TE application know-how, we can provide an essential value for our customers.PRESSURE SENSORS TE leads the industry with a wide array of standard and custom pressure products. These range from board level components to fully amplified and packaged transducers. Using MEMS and silicon strain gauge (Microfused) technologies, our products measure pressure, ranging from inches of water (<5 mbar) to 100K psi (7K bar).RATE & INERTIAL SENSORS TE Connectivity is a proven leader in providing electronic test and measurement solutions and inertial sensors for demanding industrial, military, aerospace, and research applications. Our accurate, rugged, and easy-to-use line of MEMS accelerometers, rate gyros, and inertial measurement systems meet the complex measurement needs of OEMs as well as test and measurement labs worldwide.SCANNERS & SYSTEMS SENSORS Primarily used for wind tunnel, flight test and turbomachinery testing, TE scanning systems provide high accuracy measurement solutions due to multi-channel test installations. Wind tunnel and flight testing use ESP pressure scanners for their compact size and high accuracy.TEMPERATURE SENSORS TE manufacture’s NTC thermistors, RTDs, thermocouples, thermopiles, digital output and customized sensor assemblies. Building on more than 100 years of experience, our know-how allows us to cover one of the largest ranges of temperature measurement, control and compensation applications in the industry.TORQUE SENSORS TE is a pioneer in the design and manufacture of precision sensors for electro-mechanical flight control applications, test and measurement applications and ultra-low cost OEM load cells for high volume applications. We are experts in developing sensors that require high performance or unique packaging.ULTRASONIC SENSORS Ultrasonic sensors provide accurate air bubble detection, contact and non-contact container fill, pump protection and pipeline fluid/type detection. Standard products are offered for level applications that require no moving parts, no adjustments and no maintenance.VIBRATION SENSORS TE microelectromechanical systems (MEMS), bonded gage and piezoelectric ceramic/film technologies provide OEM and test & measurement customers with the broadest range of sensor solutions in the industry. All products are EAR99, RoHS compliant and meet CE standards.WATER LEVEL SENSORS TE Connectivity is a leader in the water resources monitoring market with long standing experience in the design and manufacture of water level and water quality sensors. We also provide water quality instrumentation for analyzing lakes, rivers, estuaries, and aquifers worldwide.AEROSPACE & DEFENSE When quality and reliability are paramount, aerospace & defense companies rely on TE Connectivity’s (TE) technology to help solve mission critical challenges. Our core competencies in high reliability sensors for harsh environments such as temperature extremes, RFI, EMI, vibration, and lightning strikes make us a leading choice in sensor technology. Our design engineering capabilities, as well as AS9100 certified sensor manufacturing facilities in North America, Europe and Asia Pacific, support Tier 1, 2 and 3 providers. We work closely with the customer to provide stable, reliable and cost effective solutions that meet the extensive development cycles and qualifications critical to aerospace & defense.APPLIANCES T oday’s smart and green appliances are built using more efficient designs, meeting the latest regulations while saving energy, water and time. Customers rely on TE sensor technologies to enable appliances to respond to human touch, sense vibration, adjust to loads, and operate more efficiently. We work to develop custom solutions that can monitor humidity, water levels, and temperature. TE sensors contribute to new levels of convenience and productivity in a wide range of household appliances. AUTOMATION & CONTROL Automation & control includes a wide range of industrial applications that span all markets, and at all levels, from the factory floor and process end users, to integrators and large scale OEM production. Industrial production is increasingly driven by greater automation, safety and energy efficiency. TE’s broad portfolio of sensor products offer many options to meet custom performance, application and regulation/certification requirements. DATA & DEVICES Whether it’s an altimeter built into a wearable band to measure how many steps we climb each day, or a sports watch charting the ascent up one of the world’s highest mountain peaks, TE’s miniature sensors are used to convey critical information for the dashboard of our daily lives. Our dive computer sensors help provide safety in leisure activities, while our piezo film enables your bed to monitor your heart rate, breathing and even how well you sleep. We’ve been making sensors for wearables before there were wearables. We’re recognized for our technical skill in miniaturization, low power consumption, and high-performance. That’s why TE sensors are in harsh environments, from the world’s highest parachute jump to the deepest dive.INDUSTRIAL While the future of the Industrial Internet of Things (IIoT) is not yet certain, one thing is: sensors will play a critical role. Industrial applications span a wide range of applications, from banknote handling to printers and ovens. TE Connectivity’s broad portfolio of products offers customers many options to meet specific performance, application and certification requirements. We work closely to help identify the best solution to meet the needs of the customer. INTELLIGENT BUILDINGS Buildings today require reliable solutions to confirm they are operating safely and efficiently. As a global designer and manufacturer of sensors and sensor-based systems, TE works closely with building engineers in both the development and instrumentation of automated systems. Our sensors are designed and manufactured to exacting specifications, often on a custom basis. T ogether with our customers, we are working to solve today’s toughest challenges. Our portfolio can address the breadth and depth of applications needed for today’s intelligent buildings. MEDICAL Because accurate monitoring, diagnosis and treatment counts, today’s medical devices rely on our high-performance sensor technologies to meet exacting specifications, including ISO 13485 certification and FDA registration. TE is a leading provider of sensor solutions to the medical device market. Our engineers work with device manufacturers to provide application-specific, standard and custom requirements, from product concept through manufacturing. TE sensors meet the rigorous demands of a wide range of medical and healthcare applications.OIL & GAS The energy market continues to face new challenges with deeper drilling, higher temperatures and higher pressures. TE’s latest sensor technologies with new electronics, materials, and design packages provide safe, reliable, and accurate data measurements—all while enduring some of the harshest application environments on earth. By combining application expertise and global hazardous location certifications, our broad portfolio of standard designs and custom packages are helping to improve performance and reliability for the oil and gas industry.TEST & MEASUREMENT TE Connectivity sensors for test & measurement applications support customers across all of our market verticals. Our sensor technologies and engineering capabilities are used for product research, development, testing and evaluation (RDT&E). Each of these critical areas has unique technology and performance requirements. We work closely with RDT&E engineers to determine the right solution, as our broad portfolio can address the breadth and depth of applications across a number of markets.INDUSTRIAL & COMMERICAL TRANSPORTATION When performance and reliability count, engineers rely on us to help solve tough industry challenges such as emissions reduction, power train improvement and added comfort. TE Connectivity is a leader in providing sensor technologies and associated software/diagnostic capabilities built on market experience and technical expertise. We work closely with customers to design and provide solutions critical for a wide range of harsh and demanding applications, including exhaust, engines, transmissions, braking, suspension and cabins. AUTOMOTIVE Data is critical for making vehicles safer, more connected and greener. Customers rely on TE sensor technologies to provide data for control, adaptation and response of vehicle functions and features that increase safety, comfort, efficiency, and more. We work closely with customers to provide solutions for demanding and harsh applications such as automated transmissions, engines, clutch, brakes and exhaust. Our products are found in vehicles traveling the world’s roads and highways. AUTOMOTIVE SENSORS TE Connectivity (TE) sensors have become an integral part of many modern vehicle architectures, or nervous systems. Our sensor technologies for passenger cars provide data for control, adaptation, and response of vehicle functions and features that make vehicles safer, greener and more connected.DIGITAL COMPONENT SENSORSMany TE digital sensor products are available in low power and small form factors. They are suited for wearable and miniature devices that are used to collect and share critical data for health monitoring, fitness, air quality, aerospace, battery powered, and related applications. T o increase knowledge sharing and reduce time to market, we have teamed with semiconductor manufacturers to design and provide plug and play tools for a variety of development platforms. In addition, we offer several wireless demo/development tools to help engineers quickly achieve their design objectives with wireless applications. FLOW SENSORS TE mass air flow (MAF) sensors are designed for a variety of automotive, medical and industrial gas applications while our flow switches are used for such applications as water control, power showers and circulation pump protection.FLUID PROPERTY SENSORS TE’s fluid property sensors are based on tuning fork technology. It is specifically designed to provide fluid quality and condition monitoring capability to a wide range of dedicated applications including oils (engine, hydraulic, transmission), fuels and DEF (i.e., urea) monitoring.FORCE SENSORS TE is a pioneer in the design and manufacture of precision sensors for electro-mechanical flight control applications, test and measurement applications and ultra-low cost OEM load cells for high volume applications. We are experts in developing sensors that require high performance or unique packaging.HUMIDITY SENSORS Accurate dew point and absolute humidity measurements are made possible through the combination of relative humidity and temperature measurements. TE sensor products are qualified for the most demanding applications including automotive, heavy truck, aerospace and home appliance.LIQUID LEVEL SENSORS TE liquid level products address the sensing requirements of the construction, off-road and automotive industries. Our solutions include level sensors for power steering, coolant, windscreen wash, fuel and oil.PHOTO OPTIC SENSORS TE optic-based sensors include both photo optic components and complete sensor solutions. Our component series features dual LED, bi-wavelength emitters and spectrally paired photo detectors./sensorsolutions© 2016 TE Connectivity. All Rights Reserved.Microfused, Measurement Specialties, MEAS, American Sensor T echnologies, AST, Macro Sensors, MACRO, TE Connectivity, TE, and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. Other logos, product and company names mentioned herein may be trademarks of their respective owners.While TE has made every reasonable effort to ensure the accuracy of the information in this brochure, TE does not guarantee that it is error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. The dimensions in this brochure are for reference purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult TE for the latest dimensions and design specifications.SS-TS-TE201 06/2016TE CONNECTIVITYFor More Information Contact TE Connectivity/sensorsolutions-contact。

智能家居外文翻译外文文献英文文献

Increasing an individual’s quality of life via their intelligent home The hypothesis of this project is: can an individual’s quality of life be increased by integrating “intelligent technology” into their home environment. This hypothesis is very broad, and hence the researchers will investigate it with regard to various, potentially over-lapping, sub-sections of the population. In particular, the project will focus on sub-sections with health-care needs, because it is believed that these sub-sections will receive the greatest benefit from this enhanced approach to housing. Two research questions flow from this hypothesis: what are the health-care issues that could be improved via “intelligent housing”, and what are the technological issues needing to be sol ved to allow “intelligent housing” to be constructed? While a small number of initiatives exist, outside Canada, which claim to investigate this area, none has the global vision of this area. Work tends to be in small areas with only a limited idea of how the individual pieces contribute towards a greater goal. This project has a very strong sense of what it is trying to attempt, and believes that without this global direction the other initiatives will fail to address the large important issues described within various parts of this proposal, and that with the correct global direction the sum of the parts will produce much greater rewards than the individual components. This new field has many parallels with the field of business process engineering, where many products fail due to only considering a sub-set of the issues, typically the technology subset. Successful projects and implementations only started flow when people started to realize that a holistic approach was essential. This holistic requirement also applies to the field of “smart housing”; if we genuinely want it to have benefit to the community rather than just technological interest. Having said this, much of the work outlined below is extremely important and contains a great deal of novelty within their individual topics.Health-Care and Supportive housing：To date, there has been little coordinated research on how “smart house” technologies can assist frail seniors in remaining at home, and/or reduce the costs experienced by their informal caregivers. Thus, the purpose of the proposed research is to determine the usefulness of a variety of residential technologies in helping seniors maintain their independence and in helping caregivers sustain their caringactivities.The overall design of the research is to focus on two groups of seniors. The first is seniors who are being discharged from an acute care setting with the potential for reduced ability to remain independent. An example is seniors who have had hip replacement surgery. This group may benefit from technologies that would help them become adapted to their reduced mobility. The second is seniors who have a chronic health problem such as dementia and who are receiving assistance from an informal caregiver living at a distance. Informal caregivers living at a distance from the cared-for senior are at high risk of caregiver burnout. Monitoring the cared-for senior for health and safety is one of the important tasks done by such caregivers. Devices such as floor sensors (to determine whether the senior has fallen) and access controls to ensure safety from intruders or to indicate elopement by a senior with dementia could reduce caregiver time spent commuting to monitor the senior.For both samples, trials would consist of extended periods of residence within the ‘smart house’. Samples of seniors being discharged from acute care would be recruited from acute care hospitals. Samples of seniors being cared for by informal caregivers at a distance could be recruited through dementia diagnosis clinics or through request from caregivers for respite.Limited amounts of clinical and health service research has been conducted upon seniors (with complex health problems) in controlled environments such as that represented by the “smart house”. For exa mple, it is known that night vision of the aged is poor but there is very little information regarding the optimum level of lighting after wakening or for night activities. Falling is a major issue for older persons; and it results in injuries, disabilities and additional health care costs. For those with dementing illnesses, safety is the key issue during performance of the activities of daily living (ADL). It is vital for us to be able to monitor where patients would fall during ADL. Patients and caregivers activities would be monitored and data will be collected in the following conditions.Projects would concentrate on sub-populations, with a view to collecting scientific data about their conditions and the impact of technology upon their life styles. For example:Persons with stable chronic disability following a stroke and their caregivers: to research optimum models, types and location of various sensors for such patients (these patients may have neglect, hemiplegia, aphasia and judgment problems); to research pattern of movements during the ambulation, use of wheel chairs or canes on various type of floor material; to research caregivers support through e-health technology; to monitor frequencies and location of the falls; to evaluate the value of smart appliances for stroke patients and caregivers; to evaluate information and communication technology set up for Tele-homecare; to evaluate technology interface for Tele-homecare staff and clients; to evaluate the most effective way of lighting the various part of the house; to modify or develop new technology to enhance comfort and convenience of stroke patients and caregivers; to evaluate the value of surveillance systems in assisting caregivers.Persons with Alzheimer’s disease and their caregivers: to evaluate the effect of smart house (unfamiliar environment) on their ability to conduct self-care with and without prompting; to evaluate their ability to use unfamiliar equipment in the smart house; to evaluate and monitor persons with Alzheimer’s diseas e movement pattern; to evaluate and monitor falls or wandering; to evaluate the type and model of sensors to monitor patients; to evaluate the effect of wall color for patients and care givers; to evaluate the value of proper lighting.Technology - Ubiquitous Computing：The ubiquitous computing infrastructure is viewed as the backbone of the “intelligence” within the house. In common with all ubiquitous computing systems, the primary components with this system will be: the array of sensors, the communication infrastructure and the software control (based upon software agents) infrastructure. Again, it is considered essential that this topic is investigated holistically.Sensor design: The focus of research here will be development of (micro)-sensors and sensor arrays using smart materials, e.g. piezoelectric materials, magneto strictive materials and shape memory alloys (SMAs). In particular, SMAs are a class of smart materials that are attractive candidates for sensing and actuating applications primarily because of their extraordinarily high work output/volume ratiocompared to other smart materials. SMAs undergo a solid-solid phase transformation when subjected to an appropriate regime of mechanical and thermal load, resulting in a macroscopic change in dimensions and shape; this change is recoverable by reversing the thermo mechanical loading and is known as a one-way shape memory effect. Due to this material feature, SMAs can be used as both a sensor and an actuator.A very recent development is an effort to incorporate SMAs in micro-electromechanical systems (MEMS) so that these materials can be used as integral parts of micro-sensors and actuators.MEMS are an area of activity where some of the technology is mature enough for possible commercial applications to emerge. Some examples are micro-chemical analyzers, humidity and pressure sensors, MEMS for flow control, synthetic jet actuators and optical MEMS (for the next generation internet). Incorporating SMAs in MEMS is a relatively new effort in the research community; to the best of our knowledge, only one group (Prof. Greg Carman, Mechanical Engineering, University of California, Los Angeles) has successfully demonstrated the dynamic properties of SMA-based MEMS. Here, the focus will be to harness the sensing and actuation capabilities of smart materials to design and fabricate useful and economically viable micro-sensors and actuators.Communications: Construction and use of an “intelligent house” offers extensive opportunities to analyze and verify the operation of wireless and wired home-based communication services. While some of these are already widely explored, many of the issues have received little or no attention. It is proposed to investigate the following issues:Measurement of channel statistics in a residential environment: knowledge of the indoor wireless channel statistics is critical for enabling the design of efficient transmitters and receivers, as well as determining appropriate levels of signal power, data transfer rates, modulation techniques, and error control codes for the wireless links. Interference, channel distortion, and spectral limitations that arises as a result of equipment for the disabled (wheelchairs, IV stands, monitoring equipment, etc.) is of particular interest.Design, analysis, and verification of enhanced antennas for indoor wirelesscommunications. Indoor wireless communications present the need for compact and rugged antennas. New antenna designs, optimized for desired data rates, frequency of operation, and spatial requirements, could be considered.Verification and analysis of operation of indoor wireless networks: wireless networking standards for home automation have recently been commercialized. Integration of one or more of these systems into the smart house would provide the opportunity to verify the operation of these systems, examine their limitations, and determine whether the standards are over-designed to meet typical requirements.Determination of effective communications wiring plans for “smart homes.”: there exist performance/cost tradeoffs regarding wired and wireless infrastructure. Measurement and analysis of various wireless network configurations will allow for determination of appropriate network designs.Consideration of coordinating indoor communication systems with larger-scale communication systems: indoor wireless networks are local to the vicinity of the residence. There exist broader-scale networks, such as the cellular telephone network, fixed wireless networks, and satellite-based communication networks. The viability and usefulness of compatibility between these services for the purposes of health-care monitoring, the tracking of dementia patients, etc needs to be considered.Software Agents and their Engineering: An embedded-agent can be considered the equivalent of supplying a friendly expert with a product. Embedded-agents for Intelligent Buildings pose a number of challenges both at the level of the design methodology as well as the resulting detailed implementation. Projects in this area will include：Architectures for large-scale agent systems for human inhabited environment: successful deployment of agent technology in residential/extended care environments requires the design of new architectures for these systems. A suitable architecture should be simple and flexible to provide efficient agent operation in real time. At the same time, it should be hierarchical and rigid to allow enforcement of rules and restrictions ensuring safety of the inhabitants of the building system. These contradictory requirements have to be resolved by designing a new architecture that will be shared by all agents in the system.Robust Decision and Control Structures for Learning Agents: to achieve life-long learning abilities, the agents need to be equipped with powerful mechanisms for learning and adaptation. Isolated use of some traditional learning systems is not possible due to high-expected lifespan of these agents. We intend to develop hybrid learning systems combining several learning and representation techniques in an emergent fashion. Such systems will apply different approaches based on their own maturity and on the amount of change necessary to adapt to a new situation or learn new behaviors. To cope with high levels of non-determinism (from such sources as interaction with unpredictable human users), robust behaviors will be designed and implemented capable of dealing with different types of uncertainty (e.g. probabilistic and fuzzy uncertainty) using advanced techniques for sensory and data fusion, and inference mechanisms based on techniques of computational intelligence.Automatic modeling of real-world objects, including individual householders: The problems here are: “the locating and extracting” of information essential for representation of personality and habits of an individual; development of systems that “follow and adopt to” individual’s mood and behavior. The solutions, based on data mining and evolutionary techniques, will utilize: (1) clustering methods, classification tress and association discovery techniques for the classification and partition of important relationships among different attributes for various features belonging to an individual, this is an essential element in finding behavioral patterns of an individual; and (2) neuro-fuzzy and rule-based systems with learning and adaptation capabilities used to develop models of an individual’s characteristics, this is essential for estimation and prediction of potential activities and forward planning.Investigation of framework characteristics for ubiquitous computing: Consider distributed and internet-based systems, which perhaps have the most in common with ubiquitous computing, here again, the largest impact is not from specific software engineering processe s, but is from available software frameworks or ‘toolkits’, which allow the rapid construction and deployment of many of the systems in these areas. Hence, it is proposed that the construction of the ubiquitous computing infrastructure for the “smart house” should also be utilized as a software engineering study. Researchers would start by visiting the few genuine ubiquitous computing systems inexistence today, to try to build up an initial picture of the functionality of the framework. (This approach has obviously parallels with the approach of Gamma, Helm, Johnson and Vlissides deployed for their groundbreaking work on “design patterns”. Unfortunately, in comparison to their work, the sample size here will be extremely small, and hence, additional work will be required to produce reliable answers.) This initial framework will subsequently be used as the basis of the smart house’s software system. Undoubtedly, this initial framework will substantially evolve during the construction of the system, as the requirements of ubiquitous computing environment unfold. It is believed that such close involvement in the construction of a system is a necessary component in producing a truly useful and reliable artifact. By the end of the construction phase, it is expected to produce a stable framework, which can demonstrate that a large number of essential characteristics (or patterns) have been found for ubiquitous computing.Validation and Verification (V&V) issues for ubiquitous computing: it is hoped that the house will provide a test-bed for investigating validation and verification (V&V) issues for ubiquitous computing. The house will be used as an assessment vehicle to determine which, if any, V&V techniques, tools or approaches are useful within this environment. Further, it is planned to make this trial facility available to researchers worldwide to increase the use of this vehicle. In the long-term, it is expected that the facilities offered by this infrastructure will evolve into an internationally recognized “benchmarking” site for V&V activities in ubiquitous computing.Other technological areas：The project also plans to investigate a number of additional areas, such as lighting systems, security systems, heating, ventilation and air conditioning, etc. For example, with regard to energy efficiency, the project currently anticipates undertaking two studies:The Determination of the effectiveness of insulating shutters: Exterior insulating shutters over time are not effective because of sealing problems. Interior shutters are superior and could be used to help reduce heat losses. However, their movement and positioning needs appropriate control to prevent window breakage due to thermalshock. The initiation of an opening or closing cycle would be based on measured exterior light levels; current internal heating levels; current and expected use of the house by the current inhabitants, etc.A comparison of energy generation alternatives: The energy use patterns can easily be monitored by instrumenting each appliance. Natural gas and electricity are natural choices for the main energy supply. The conversion of the chemical energy in the fuel to heat space and warm water can be done by conventional means or by use of a total energy system such as a V olvo Penta system. With this system, the fuel is used to power a small internal combustion engine, which in turn drives a generator for electrical energy production. Waste heat from the coolant and the exhaust are used to heat water for domestic use and space heating. Excess electricity is fed back into the power grid or stored in batteries. At a future date, it is planned to substitute a fuel cell for the total energy system allowing for a direct comparison of the performance of two advanced systems.Intelligent architecture: user interface design to elicit knowledge modelsMuch of the difficulty in architectural design is in integrating and making explicit the knowledge of the many converging disciplines (engineering, sociology, ergonomic sand psychology, to name a few), the building requirements from many view points, and to model the complex system interactions. The many roles of the architect simply compound this. This paper describes a system currently under development—a 3Ddesign medium and intelligent analysis tool, to help elicit and make explicit these requirements. The building model is used to encapsulate information throughout the building lifecycle, from inception and master planning to construction and ‘lived-in’ use. From the tight relationship between m aterial behaviour of the model, function analysis and visual feedback, the aim is to help in the resolution of functional needs, so that the building meets not only the aims of the architect, but the needs of the inhabitants, users and environment.The Problem of Designing the Built Environment：It is often said that architecture is the mother of the arts since it embodies all the techniques of painting: line, colour, texture and tone, as well as those of sculpture: shape, volume, light and shadow, and the changing relative position of the viewer, andadds to these the way that people inhabit and move through its space to produce—at its best—a spectacle reminiscent of choreography or theatre. As with all the arts, architecture is subject to personal critical taste and yet architecture is also a public art, in that people are constrained to use it. In this it goes beyond the other arts and is called on to function, to modify the climate, provide shelter, and to subdivide and structure space into a pattern that somehow fits the needs of social groups or organizations and cultures. Whilst architecture may be commissioned in part as a cultural or aesthetic expression, it is almost always required to fulfill a comprehensive programme of social and environmental needs.This requirement to function gives rise to three related problems that characterize the design and use of the built environment. The first depends on the difference between explicit knowledge—that of which we are at least conscious and may even have a scientific or principled understanding—and implicit knowledge, which, like knowing your mother tongue, can be applied without thinking. The functional programmes buildings are required to fulfill are largely social, and are based on implicit rather than explicit bodies of knowledge. The knowledge we exploit when we use the built environment is almost entirely applied unconsciously. We don’t have to think about buildings or cities to use them; in fact, when we become aware of it the built environment is often held to have failed. Think of the need for yellow lines to help people find their way around the Barbican complex in the City of London, or the calls from tenants to ‘string up the architects’ when housing estates turn out to be social disasters.The second is a problem of complexity. The problem is that buildings need to function in so many different ways. They are spatial and social, they function in terms of thermal environment, light and acoustics, they use energy and affect people’s health, they need to be constructed and are made of physical components that can degrade and need to be maintained. On top of all this they have an aesthetic and cultural role, as well as being financial investments and playing an important role in the economy. Almost all of these factors are interactive—decisions taken for structural reasons have impacts on environment or cost—but are often relatively independent in terms of the domains ofknowledge that need to be applied. This gives rise to a complex design problem in which everything knocks on to everything else, and in which no single person has a grasp of all the domains of knowledge required for its resolution. Even when the knowledge that needs to be applied is relatively explicit—as for instance in structural calculations, or thoseconcerning thermal performance—the complex interactive nature of buildings creates a situation in which it is only through a team approach that design can be carried out, with all that this entails for problems of information transfer and breakdowns in understanding.The third is the problem of ‘briefing’. It is a characteristic of building projects that buildings tend not to be something that people buy ‘off-the-shelf’. Often the functional programme is not even explicit at the outset. One might characterise the process that actually takes place by saying that the design and the brief ‘co-evolve’. As a project moves from inception to full sp ecification both the requirements and the design become more and more concrete through an iterative process in which design of the physical form and the requirements that it is expected to fulfill both develop at once. Feasible designs are evaluated according to what they provide, and designers try to develop a design that matches the client’s requirements. Eventually, it is to be hoped, the two meet with the textual description of what is required and the physical description of the building that will provide it more or less tying together as the brief becomes a part of the contractual documentation that theclient signs up to.These three problems compound themselves in a number of ways. Since many of the core objectives of a client organization rest on implicit knowledge—the need for a building to foster communication and innovation amongst its workers for instance—it is all too easy for them to be lost to sight against the more explicitly stated requirements such as those concerned with cost, environmental performance or statutory regulations. The result is that some of the more important aspects of the functional programme can lose out to less important but better understood issues. This can be compounded by the approach that designers take in order to control themcomplexity of projects. All too often the temptation is to wait until the general layout of a building is ‘fixed’ before calling in the domain experts. The result is that functional design has to resort to retrofitting to resolve problems caused by the strategic plan.The Intelligent Architecture project is investigating the use of a single unified digital model of the building to help resolve these problems by bringing greater intelligence to bear at the earliest ‘form generating’ phase of the design process when the client’s requirements are still being specified and when both physical design and client expectations are most easily modified. The aim is to help narrow the gap between what clients hope to obtain and what they eventually receive from a building project.The strategy is simple. By capturing representations of the building as a physical and spatial system, and using these to bring domain knowledge to bear on a design at its earliest stages, it is hoped that some of the main conflicts that lead to sub- optimal designs can be avoided. By linking between textual schedules of requirements and the physical/spatial model it is intended to ease the reconciliation of the brief and the design, and help the two to co-evolve. By making available some of the latest ‘intelligent’ techniques for modelling spatial systems in the built environment, it is hoped to help put more of the implicit knowledge on an equal footing with explicit knowledge, and by using graphical feedback about functional outcomes where explicit knowledge exists, to bring these within the realm of intuitive application by designers.The Workbench：In order to do this, Intelligent Architecture has developed Pangea. Pangea has been designed as a general-purpose environment for intelligent 3D modelling—it does not pre-suppose a particular way of working, a particular design solution, or even a particular application domain. Several features make this possible.Worlds can be constructed from 3D and 2D primitives (including blocks, spheres, irregular prisms and deformable surfaces), which can represent real-world physical objects, or encapsulate some kind of abstract behaviour. The 3D editor provides a direct and simple interface for manipulating objects—to position, reshape, rotate andrework. All objects, both physical and abstract, have an internal state (defined by attributes), and behaviour, rules and constraints (in terms of a high-level-language ‘script’). Attributes can be added dynamically, making it possible for objects to change in nature, in response to new knowledge about them, or to a changing environment. Scripts are triggered by events, so that objects can respond and interact, as in the built environment, molecular systems, or fabric falling into folds on an irregular surface.Dynamic linking allows Pangea’s functionality to be extended to include standard ‘off-the-peg’ software tools —spreadsheets, statistical analysis applications, graphing packages and domain-specific analysis software, such as finite element analysis for air- flow modelling. The ‘intelligent toolkit’ includes neural networks [Koho89] [Wass89], genetic algorithms [Gold89] [Holl75] and other stochastic search techniques [KiDe95], together with a rule- based and fuzzy logic system [Zade84]. The intelligent tools are objects, just like the normal 3D primitives: they have 3D presence and can interact with other 3D objects. A natural consequence of this design is easy ‘hybridisability’ of techniques, widely considered as vital to the success of intelligent techniques in solving realistically complex problems [GoKh95]. This infrastructure of primitive forms, intelligent techniques and high-level language makes it possible to build applications to deal with a broad range of problems, from the generation of architectural form, spatial optimisation, object recognition and clustering, and inducing rules and patterns from raw data.Embedding Intelligence：Many consider that there is an inevitable trade-off between computers as a pure design medium, and computers with intelligence, ‘as a thinking machine’ [Rich94]. We propose here that it is possible to provide both these types of support, and allow the user to choose how best to use each, or not, according to the situation.It is essential that the creative role of the architect is preserved as he or she uses the work bench, that the architect as artist may draw manipulate the world as seen through the workbench as freely as they would when using a sheet of paper. Much of。

MEMS传感器和智能传感器的发展

MEMS传感器和智能传感器的发展MEMS传感器（Micro-Electro-Mechanical Systems Sensor）是一种微型化电子机械系统传感器，能够将电子元件和机械元件集成在一起，用于测量和感知环境中的各种物理量。

随着科技的不断进步，MEMS传感器已经成为现代智能设备的基础元件之一，广泛应用于汽车、智能手机、医疗器械、工业控制等领域。

随着智能设备和物联网的快速发展，MEMS传感器的应用范围也在不断扩大，其市场规模也在不断增长。

MEMS传感器采用微纳加工技术制造，具有体积小、功耗低、成本低等优点，逐渐替代了传统的机械传感器和电子传感器，成为了智能化装置中不可或缺的一部分。

随着人工智能、大数据分析等技术的不断发展，MEMS传感器也在不断升级和优化，以满足智能设备对高精度、高灵敏度、多功能化的需求。

MEMS传感器的发展史自20世纪60年代起源于美国，经过数十年的发展，已经成为了现代传感技术的重要代表。

与传统的机械传感器相比，MEMS传感器无需机械元件的运动，其具有更高的稳定性和可靠性。

与电子传感器相比，MEMS传感器体积更小、功耗更低，具有更好的集成性和适应性。

MEMS传感器不仅在物联网、智能设备等领域广泛应用，也在科学研究、军事装备等领域发挥着重要作用。

随着MEMS传感器技术的不断成熟和完善，另一种新型的智能传感器也逐渐走入人们的视野。

智能传感器是利用现代信息技术、微电子技术和传感技术相结合，利用嵌入式系统、通信技术等实现对环境物理量的感知和测量，并能够实现数据处理、分析和智能控制的一种新型传感器。

智能传感器与传统的传感器相比，能够更加智能化、自动化地完成对环境的感知和控制，可以实现实时监测、数据采集、远程控制等功能。

智能传感器的发展正是与MEMS传感器技术的发展相辅相成。

MEMS传感器作为智能传感器的核心部件之一，为智能传感器的发展提供了技术基础和支撑。

智能传感器利用MEMS 技术制造出更小、更精密、更智能的传感器，使得传感器的应用范围更广、功能更强大。

TE Connectivity 产品说明书

SENSOR SOLUTIONS /// INDUSTRIAL MACHINERY & PROCESSESSENSOR SOLUTIONS /// INDUSTRIAL MACHINERY & PROCESSES• FORCE SENSORS • PIEZO FILM SENSORS • POSITION SENSORSTE SENSOR SOLUTIONSFOR INDUSTRIAL MACHINERY & PROCESSESTE Connectivity (TE) is one of the largest connectivity and sensor companies in the world, with the acquisition of Measurement Specialties. Our broad portfolio of sensor technologies is designed for a wide range of applications and serves a number of industries, including Industrial Machinery & Processes. We collaborate with engineers to help transform their concepts into creations—redeﬁ ning what’s possible using intelligent, effi cient and high-performing TE products and solutions proven in harsh environments.SENSOR PORTFOLIOTE Sensor Solutions supports industrial machinery and processes by off ering a broad range of pressure transducers, liquid level sensors, accelerometers, LVDT/RVDT’s, inclinometers, string and linear/rotary potentiometers, load cells, temperature, torque sensors, and a full range of interface electronics.QUALITY CERTIFICATES*• AS 9000B • ATEX • EN 9100• EN 13980• ISO 14001• ISO 9001• NADCAP Welding & Brazing • NASA Qualiﬁ ed• PRESSURE SENSORS• TEMPERATURE SENSORS • VIBRATION SENSORS*Partial listing of Quality Certiﬁ cates. For a full listing please visit .PAGE 3TE Sensor Solutions combines the strengths and experiences of several merged sensor companies to resolve challenging physical measurement problems. Our products have a proud lineage, originating from the pioneering ICSensors MEMS (micro electro-mechanical systems) technology and the Schaevitz inductive position sensors. TE designs and manufactures sensors to exacting speciﬁ cations for the rigors of industrial applications. Our engineers provide full support of application-speciﬁ c, standard and custom requirements, from product concept through manufacturing.F o r c e S e n s o r sP i e z o F i l m S e n s o r sP o s i t i o n S e n s o r s a n d I n s t r u m e n t a t i o nP r e s s u r e S e n s o r sT e m p e r a t u r e S e n s o r sV i b r a t i o n S e n s o r sProgrammable Logic Controller •Human Machine Interface ••••I/O Module •Servo Drive ••Servo Motor •••Control Cabinet ••••Molding Machine •••• Machine T ool •••••Robot Control •••••Robot Arm••••SENSOR SOLUTIONS /// INDUSTRIAL MACHINERY & PROCESSESNote: T he sensor technologies listed above are examples for reference purpose only.Please visit us at for product speciﬁ cations, application notes, manuals and white papers./sensorsolutions© 2015 TE Connectivity. All Rights Reserved.Measurement Specialties, Microfused, TE Connectivity, TE, and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. Other logos, product and company names mentioned herein may be trademarks of their respective owners.While TE has made every reasonable eff ort to ensure the accuracy of the information in this brochure, TE does not guarantee that it is error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or ﬁ tness for a particular purpose. The dimensions in this brochure are for reference purposes only and are subject to change without notice. Speciﬁ cations are subject to change without notice. Consult TE for the latest dimensions and design speciﬁ cations.SS-TS-TE200-A4 04/2015About TTI, Inc.TTI, Inc., a Berkshire Hathaway company, is one of the world’s leading specialist distributors of passive, connector, electromechanical, discrete, power and sensor components. TTI’s philosophy is “Lead by Design”, and the company diff erentiates itself by focusing on people, parts and process. TTI in Europe strives to be the distributor of choice for customers and suppliers alike by introducing new product technologies and by stocking broad and deep inventory across its franchise base. TTI’s sophisticated inventory management system ensures the ability to service changes in demand due to ﬂ uctuating markets and supply chains. For more information about TTI, please visit .TTI European Headquarters TTI, Inc.Ganghoferstr. 3482216 Maisach-Gernlinden GermanyT el +49 (0) 8142 6680–0Fax +49 (0) 8142 6680–490***************.com。

MEMS sensor 微传感器原理

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其中变量分别为电容(F)、真空介电常数(8.854x10-14F/cm)、相对介电常数、极板重叠面积(cm2)和极板间距(cm)。当有多层介质时
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C=
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-------电容传感器结构相对简单和宜于加工。可以通过改变d、ε或A 来实现非线性(比如用d)和线性(比如用A)的位置-电容转换。 ------电容传感器的最大优点是其温度系数低(只要极间材料是温度系数低的介电质，比如空气或者真空)。根据文献，空气介电常数的温度常数在1atm20℃时约为2ppm/ ℃(干燥), 到7ppm/ ℃(最潮湿)。但是空气介电常数对于气压很敏感，约为100ppm/atm。如果极板间是压力恒定的空气(或真空)，起支配作用的影响是结构热变形不平衡 (通常也很小)。 -------另外一个优点是测量是非接触的。
半导体材料，特别是Ge和Si，作为机械量-电学量转换器利用起源于 1957年。在此以前C.S.Smith发表了Ge和Si的压阻系数比其它材料高的结果。F.P.Burns用两块Si薄片制成了声音传感器，W.P.Mason等人几乎在同时发表了更实用化的同种器件。二者是压阻传感的开始。这之后，随着半导体材料加工技术的快速发展，材料变得更容易获得。 1960年左右丰田理研开发出了十分实用的半导体应变传感器，同时,W.P.Wason等人制作了细长的Si传感器，可以贴在弹性体上作为载荷计使用。1961和1962年的Instrument Society of America大会上半导体应变传感器相关的报告很多。在此基础上，MicroSystem、Baidwin-LimaHamiton、和Kulite-Bytrex公司都先后推出了半导体应变计商品。另外一些工业化生产的微传感器产品，包括在石英上制作的霍尔效应（Hall Effect）探头、加速度计、力传感器以及化学传感器等等。可以用微系统技术开发的微型传感器种类很多，本课程无法全部介绍。所以我们只能从基本的传感原理讨论入手，然后从一些典型微传感器结构来看这些原理是如何应用的。

MEMS技术在THz无源器件中的应用

2011年第30卷第7期传感器与微系统（Transducer and Microsystem Technologies）MEMS技术在THz无源器件中的应用*赵兴海1，鲍景富2，杜亦佳2，高杨1，郑英彬1（1．中国工程物理研究院电子工程研究所，四川绵阳621900；2．电子科技大学，四川成都611731）摘要：太赫兹技术将在未来高精度频谱探测技术、高分辨率成像和高性能通讯等应用前景良好。

太赫兹技术处于电子学与光子学领域的交叉领域，太赫兹器件的尺寸在数十微米到毫米量级，传统的机械加工技术很难达到加工精度要求，甚至无法加工。

MEMS技术在太赫兹器件的加工方面具有巨大的优势。

总结了目前采用DRIE，LIGA等工艺加工太赫兹器件的研究现状，包括太赫兹传输波导器件、太赫兹传输线器件、慢波结构和特种复合结构的加工。

分析了MEMS加工工艺的优缺点和在太赫兹器件加工中的应用前景。

关键词：太赫兹器件；微机电系统；LIGA；深反应离子刻蚀中图分类号：O451；TN432文献标识码：A文章编号：1000—9787（2011）07—0005—05 Application of MEMS technology in passive THz-devices*ZHAO Xing-hai1，BAO Jing-fu2，DU Yi-jia2，GAO Yang1，ZHENG Ying-bin1（1．Institute of Electronic Engineering，China Academy of Engineering Physics，Mianyang621900，China；2．University of Electronic Science and Technology of China，Chengdu611731，China）Abstract：The primary applications for terahertz（THz）technology have so far been high precision spectrum detection technology，superresolution imaging，and high performance communication et al．THz region locates on the border between far-IR and submillimeter which is still rather blurry．The dimension of THz devices is from several ten micrometers to several millimeters which are difficult or hard to fabricate by the traditional machining technology．MEMS technology has many advantages to fabricate these devices．An overview of recent progress in the research and development of MEMS antennas，transmission lines，waveguides structures，and slow wave structures and metamaterial devices based on DRIE，LIGA technologies for terahertz frequencies is presented．The advantages and disadvantages of MEMS technology and applications in THz devices fabrication are analyzed．Key words：THz devices；MEMS；LIGA；DRIE0引言太赫兹（terahertz，THz）波在电磁波谱中位于0．1 10THz的频段，对应于电磁波长为0．03 3mm，处于电子学与光子学的“空白”地带。

MEMS加速度传感器简介(最终版)

MEMS电容式加速度传感器学校：哈尔滨工业大学（威海）学院：信息与电气工程学院专业：电子科学与技术作者：***090260207纪鹏飞090260208摘要本文从MEMS电容式加速度传感器的基本原理切入，主要介绍了该类型传感器的原理和三种主要结构：三明治式、扭摆式、梳齿式及其各自结构方面优点。

同时介绍目前应用较为广泛的集成式的基于电容原理的芯片MMA7455，主要分析了该集成传感器的内部结构和应用。

关键字：MEMS，电容式，加速度传感器，MMA7455AbstractIn this paper, we discussed the MEMS capacitive accelerometer from its fundamental principle and its three main structure which are sandwich, twist, and comb. Different structures have their own advantages. We also give the introduction to a popular IC accelerometer MM7455, putting an emphasis on its internal structure and some applications.Key words:MEMS, capacitive, accelerometer, MMA7455一、引言1.1 MEMS 加速度传感器简介MEMS(Micro-Machined Electro Mechanical Sensor)是微机电机械传感器的简称，它是一种微米级的类似集成电路的装置和工具。

MEMS 技术是一项有着广泛应用前景的基础技术。

以半导体技术和微机电加工工艺设计、制造的MEMS 传感器，集成度高，并可与信号处理电路集成在一起，大大降低了生产成本，已在汽车、消费电子和通信电子领域取得极大发展。

惯性传感器的介绍

惯性传感器介绍构成惯性传感器包括加速度计（或加速度传感计）和角速度传感器（陀螺）以及它们的单、双、三轴组合IMU（惯性测量单元），AHRS（包括磁传感器的姿态参考系统）。

MEMS加速度计是利用传感质量的惯性力测量的传感器，通常由标准质量块（传感元件）和检测电路组成。

IMU主要由三个MEMS加速度传感器及三个陀螺和解算电路组成。

分类惯性传感器分为两大类：一类是角速率陀螺；另一类是线加速度计。

角速率陀螺又分为：机械式干式﹑液浮﹑半液浮﹑气浮角速率陀螺；挠性角速率陀螺；MEMS硅﹑石英角速率陀螺（含半球谐振角速率陀螺等）；光纤角速率陀螺；激光角速率陀螺等。

线加速度计又分为：机械式线加速度计；挠性线加速度计；MEMS硅﹑石英线加速度计（含压阻﹑压电线加速度计）；石英挠性线加速度计等。

惯性传感器作用原理(1)．科里奥利(Coriolis)原理：也称科氏效应（科氏力正比于输入角速率）。

该原理适用于机械式干式﹑液浮﹑半液浮﹑气浮角速率陀螺；挠性角速率陀螺；MEMS硅﹑石英角速率陀螺（含半球谐振角速率陀螺）等。

Coriolis法国物理学家（1792年～1843年）。

(2)．萨格纳（Sagnac）原理：也称萨氏效应（相位差正比于输入角速率）。

该原理适用于光纤角速率陀螺；激光角速率陀螺等。

Sagnac法国物理学家（1869年～1926年），居里夫妇的朋友。

1913年发明萨氏效应。

术语1. 角速率陀螺术语(1)．测量范围（°/ S）Measurement Range也称量程。

指陀螺仪能测量正、反方向角速率的额定值范围。

在此额定值范围内，陀螺仪刻度因数非线性满足规定要求。

(2)．刻度因数（mV /°/ S）Scale Factor (Sensitivity)也称刻度因子、标度因数、梯度、灵敏度。

指陀螺仪输出量与输入角速率的比值。

该比值是根据整个输入角速率范围内测得的输入、输出数据，通过最小二乘法拟合求出的直线的斜率。