5730规格书

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A7版5730产品规格书

A7版5730产品规格书

01SMD 5730Series Data Sheet高光效Super high efficiency高可靠性High reliability performance角度120120°°Viewing angle 120120°°适合所有SMT 组装及焊接工艺Suitable for all SMT assembly and solder process 符合RoHS 指令要求Complied with RoHS directive产品分类Change Category:T57301-JV series\T57301-QN series\T57301-JZ series\T57301-AZ series图中所有尺寸均以毫米为单位All dimensions are in millimeter若无特别标注,图中尺寸公差为±0.1mmTolerance is ±0.1mm unless otherwisenoted焊盘尺寸Pecommend padlayout●产品编码解说Product Definition Code●特性Features●封装尺寸D imension●极限参数(温度=25℃)Absolute maximum ratings at Ta=25℃Notes:I fp conditions with pulse width≤10ms and duty cycle≤10%Notes:光通量(LM)±10%Luminous Flux(LM)10%正向电压±0.1Forward Voltage(VF)0.1V02●典型光电特性曲线Typical Optical-Electrical Characteristics curves环境参数Environment Parameter:温度Temperature=25℃,湿度Humidity=45%电压与电流关系曲线图ForwarForward d Current VS Forward Volatage亮度与电流关系曲线图Relative Flux VS Forward Current亮度与温度关系曲线图Relative Flux VS Ambient Temperature电流与温度关系曲线图Forward Curent VS Ambient Temperature03040.200.220.240.260.280.300.320.340.36 0.380.400.420.440.460.480.230.250.270.290.310.330.350.370.390.410.430.450.470.490.510.530.550.57Runlite白光分级打靶图2000K 1900K20G2200K 20H20W21G2100K 21H21W22G23H22H22W 24G23G23W 2300K 2425K 25H 24H24W 25W73W73G 68H68W 79W 79H 73H9000K8200K 79G 10800K86G86W14000KWgWh 20500KWeWf37000KWcWdWb100000KWrWaWs26H 2580K 25G26W2870K2725K 26G28G 29H 28H 28W29W31G3045K 29G 3220K34G31H 31W3465K 3710K34H34W36W38G36H36G 3985K41G 38H38W4260K 44W 44G41H41W4503K 46W46H44H49W49G 4745K46G 52W 52G49H5028K 55W55G 52H 5310K 58W58G55H 5665K62W 62G58H 6020K 7040K7600K62H 6530K68G分光打靶图Chromaticity range&Color lineup光谱特性图Relative Spectral Distr Distri i bution 发光角度图(极坐标)Typical Spectral Distribution●分光等级Range of bins05测试项目Test Item测试条件TestConditions持续周期Duration/Cycle破坏数量Number of amage参考Reference温度循环Temperature -40℃30min↑↓↑↓2525℃(2min)100℃30min循环100次100times0/100JEITA ED-4701300303冷热冲击Thermal Shock -40℃30min↑↓5sec100℃30min循环100次100times0/100JEITA ED-4701200303高温储存High TemperatureStorage Ta=100℃1000小时1000hours0/100EIAJED-4701200201高温高湿Humidity Heat Storage Ta=85℃RH=85%1000小时1000hours0/100EIAJED-4701100103低温储存Low Temperatue Storage Ta=-40℃1000小时1000hours0/100EIAJED-4701200202常温老化Room Temperatue TestTa=25℃IF=IF=1515150mA0mA1000小时1000hours0/100Tested with Runlitestandard高温高湿老化High Humidity Heat Test 60℃RH=90%IF=IF=1515150mA0mA1000小时1000hours0/100Tested with Runlitestandard低温老化Low Temperature TestTa=-40℃IF=IF=1515150mA0mA1000小时1000hours0/100Tested with Runlitestandard静电放电人体模式ESD(HBM)-4-4KVKV at1.5K1.5KΩΩ;100pF3次3times0/100MIL-STD-883D●失效判断标准Criteria for judging the Damage备注[Note]:*1USL:标准上限值Uper Specification Level*2LSL:标准下限值Lower Specification Level●信赖性测试项目及标准Test items and results of reliability0607●包装规格PackPackag ag aging ing 1.料带尺寸(单位:mm )Dimensions of Tape (Unit Unit::mm )3.装箱尺寸图(单位:mm )Package Dimension (Unit:mm )2.卷盘尺寸(单位:mm )Dimensions of Reel(Unit:mm)Moisture-poof bagLable3静电屏蔽袋包装卷带覆盖膜使用方向Outside boxMaximums for inside bosesInside box Maximums seven reels每个外箱装5个内箱外箱尺寸=425*245*273mm 每盒5袋内箱尺寸:247*230*75mm。

5730支架推广文案

5730支架推广文案

联系人:莫总 联系电话:18022012233 地址:深圳市宝安区永福路87号
标题:LED5730支架 SMD支架 LED灯珠5730支架 0.5W支架
LED5730支架主要技术参数如下:
使用功率:0.5W 150mA
规格尺寸:57.0mm*30.0mm
整片规格:144*60mm
单片颗数:14*20=280pcs
晶 片 数:1
支架材质:红铜 C194 黄铜 铁材
企业服务:建有数十人的高标准业管服务团队,随时为您提供询价、定单到产品的交接及售后专人服务;
工艺精湛:铜与塑料永久粘合不离隔,保证品质稳定[注:注塑工艺与脚成形每颗支架尺寸均匀、规范,符合贴片产业化生产;
规范包装:特制LED SMD支架包装,保证在运输过程中不扭曲,不变形,同时采用防潮保护膜,有效防止产品氧化及变形.
塑料材质:PPA-114
电 镀:全镀银 选镀银
镀银厚度:功能区[100-120μ]
引 脚 数:2PIN
发光角度:120-140度
耐强高温:耐高温,280℃不变形[注:熔点为305℃]
深圳华顺科技有限公司生产的LED支架5054、4014、7070、3528全彩、2835、5730、5050等系列,多年来以超高的产品质量,稳定的供应着广大LED封装企业,华顺科技有限公司的5730系列支架光效更高,性价比更优,快速广大市场占有率得到了客户的赞誉。

5730白光LED灯珠,贴片5730LED,SMD白光5730,5730LED规格书(英文版)

5730白光LED灯珠,贴片5730LED,SMD白光5730,5730LED规格书(英文版)

Customer Service Hotline :400-676-8616TEL :0769-8662 5999 0769-8200 2226 FAX :0769-8200 2227E-MIAL ∶ WEB :Customer: Description:dg@5.7x3.0mm SMD CHIP LED◆ Package DimensionsNotes:1. All dimensions are in millimeters.2. Tolerance is ±0.25 unless otherwise noted.3. Specifications are subject to change without notice.WHITE ATTENTIONOBSERVE PRECAUTIONSFOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVEDEVICESPRELIMINARY SPECFeatures● 5.7mmx3.0mm SMT LED, 0.9mm THICKNESS. ● WIDE VIEWING ANGLE. ● PACKAGE : 3000PCS / REEL. ● RoHS COMPLIANT.Applications● LED TV backlight● Light pipe applicationTAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTDDONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTDCustomer Service Hotline :400-676-861612Part No.Lens colorMaterial Emitted colorYellow Fluorescent(InGaN) WHITEChip◆ Electrical / Optical Characteristics at T A =25°C◆ Absolute Maximum Ratings at T A =25°CNotes:*1: Pulse width ≤0.1ms, Duty cycle ≤1/10◆ Device Selection GuideParameter Symbol ValueUnit Power Dissipation P D 500 mW Forward Current I F 150 mA Peak Forward Current*1 I FP 200 mA Reverse Voltage V R 5 VOperating Temperature T opr -40°C To +85°C Storage TemperatureT stg-40°C To +85°CParameterSymbol Min. Typ. Max UnitTest ConditionsForward Voltage V F 2.8 — 3.6 V IF =150mA Reverse CurrentI R — — 10 μA VR =5V Chromaticity CoordinatesX — 0.32 — Y— 0.33 —Color temperature CCT 6000 -0 6500 K Luminous Intensity IF=150mA Luminous Flux Lm 55 - 60 Lm IF=150mA Viewing Angle 2θ1/2 — 120 — Deg.IF=150mAIF=150mARemarks:If special sorting is required (e.g. binning based on forward voltage, luminous intensity, or chromaticity), the typical accuracy of the sorting process is as follows: 1. Chromaticity Coordinates: ±0.01 2. Luminous Intensity: ±15% 3. Forward Voltage: ±0.1VTAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTDDONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTDCustomer Service Hotline :400-676-861640Lm 55 - 60 Lm TJ-BJT57WY01◆ Soldering Profile◆ Recommended soldering pattern(Units:mm)◆ Tape specifications(Units:mm)Customer Service Hotline:400-676-8616◆ VF RankRankVF(V)ConditionMinMax G 2.8 3.0IF=150mA H 3.0 3.2 J 3.2 3.4 K3.43.6Tolerance:±0.1VRankIV(LM)ConditionMinMaxZKIF=150mAZLTolerance:±15%◆ IV Rank50555560◆ X/Y RankTolerance:±0.005C2-2X 0.302 0.311 0.304 0.295C2-3X 0.311 0.321 0.313 0.304 Y 0.336 0.329 0.321 0.327 Y 0.329 0.322 0.314 0.321 C3-2X0.308 0.318 0.311 0.302C3-3X 0.318 0.328 0.321 0.311 Y 0.344 0.337 0.329 0.336 Y 0.337 0.330 0.322 0.329 C4-2X0.315 0.325 0.318 0.308C4-3X 0.325 0.335 0.328 0.318 Y 0.353 0.345 0.337 0.344 Y 0.345 0.338 0.330 0.337 D1-2X0.326 0.335 0.325 0.315D1-3X 0.335 0.344 0.335 0.325 Y0.361 0.354 0.345 0.353Y0.354 0.346 0.338 0.345TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTDDONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD:400-676-8616TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTDDONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTDCustomer Service Hotline :400-676-8616。

SMD5730灯珠及SMD2835灯珠介绍

SMD5730灯珠及SMD2835灯珠介绍

华中照明SMD5730灯珠贴片及SMD2835灯珠贴片5730灯珠顾名思义是以灯珠的规格来命名的,即:5.7(长)*3.0(宽)*0.8(厚)mm,目前市场上生产的5730灯珠多以功率为0.5W,电流为150MA,电压3.0-3.4V为主,目前市场上也有高压灯珠生产。

5730灯珠属于贴片的一种,也称做5730灯珠贴片。

随着led芯片技术的不断发展,灯珠技术也在不断的提高和发展,5730灯珠贴片具有亮度高,显色指数高,寿命长,低碳环保,省电,无紫外线和红外线辐射等优点。

以前白炽灯,荧光灯开始慢慢的淡出人们的视野,其淘汰的原因有,耗电量大,紫外线强,亮度不高,寿命不长,容易发生危险等情况。

所以慢慢的白炽灯和荧光灯等产品逐渐开始淘汰,因为产品处于新旧更替的时节,所以导致市场竞争非常的激烈,价格战成为商家生存下去的一种手段。

5730灯珠因其色温齐全,亮度高,显色性高,光效高,越来越被广大的照明厂商所看重,目前5730灯珠用在灯具上最广泛的是:球泡灯,筒灯,面板灯,日光灯,吸顶灯等照明灯具上。

国内市场色温多以正白光为主即,一般家用的话显色指数要求不高一般RA>70即可,市场上一般的灯珠厂家即可满足。

但对于工程照明,要求可能会较高。

工程照明不仅在亮度显色指数有要求,而且对材质有的工程照明也会有要求。

比如说5730灯珠正白色温显色指数要达到80以上,亮度要达到55LM以上或者是更高。

材质方面也会有要求,比如说用的是哪家的芯片,是否是金线,硅胶用的是什么?相对于工程照明,家居照明在材质方面也没有多大的要求,比如说市场上价格低廉的可能用的是铁线,国产低廉小芯片,国产劣质硅胶封装或者是二次分光产品从新加以分光投入市场使用。

其缺点就是使用寿命短,亮度不高,电压不稳定时容易烧坏,或者是存在安全隐患。

现在重点谈下出口,随着经济的发展,交通工具的多样化,国与国之间的交流也越来越密切, 国与国之间的经济来往也越来越频繁。

5730暖白光灯珠参数

5730暖白光灯珠参数

5730暖白光灯珠参数
5730 暖白光贴片灯珠的特点:
●功率低,热量少,节约散热成本
●高导热材料低热阻、体积小散热佳
●高电流(60-150mA)
●卓越的耐温耐候性能
●光源均匀性好,视角宽
●满足红墨水的防渗实验
5730 暖白光贴片灯珠的主要参数:
功耗:500mw
正向电流:150mA
正向脉冲电流:500mA
反向电压:5V
使用温度:-40℃~+80℃
保存温度:-40℃~+80℃
5730 暖白光贴片灯珠的结构5730 暖白光贴片灯珠的特有优势:
1.高亮度,低衰减,耗能小,寿命长,抗静电能力强
2.发光效率高,光谱窄,单色性好
3.显色性高,显示逼真色彩,色彩还原能力优异
4.绿色环保。

不含铅、汞等有毒有害物质
5.拥有最先进的生产设备与成熟的封装工艺(详情请看本公司相册及动态)
6.实力厂家,拥有一支高素质的专业研发队伍
5730 暖白光贴片灯珠的应用产品:。

XL-5730UWC-05 Data Sheet 5730白0.5W说明书

XL-5730UWC-05 Data Sheet 5730白0.5W说明书

XL-5730UWC-05Technical Data Sheet 5730白0.5wharacteristics*外观尺寸(L/W/H):5.7*3.0*0.85mmQutline Dimensions(L/w/h):5.7*3.0*0.85mm*发光颜色及胶体:高亮度白/黄色胶体Luminous color and colloid:High brightness white/yellow colloid*环保工艺符合ROHS要求Environmental protection products Complied With ROHS Directive*EIA规范标准包装EIA standard packaging*适用于SMT贴片自动化生产Suitable for SMT automatic production*适用于红外线回流焊制程Suitable for infrared reflow soldering processroduct application*医用设备:内窥镜、血氧仪Medical equipment:endoscope、oximeter*汽车电子:背光按键灯、指示灯Automotive electronics:backlight key light、indicator light*工业产品:电子仪表盘、工业设备Industrial products:electronic instrument panel、industrial equipment*智能家居:白色家电、数码管LEDSmart home:white appliances,nixie tube LED*通讯产品:手机按键灯、路由器、电视盒Communication products:mobile phone button lamp,routerCatalogueElectrical Characteristics (3)Typical Characteristic Curves (5)Reliability Test Items And Conditions (6)Outline Dimensions (7)Packaging (8)Guideline for Soldering (10)Precautions (12)Electrical Characteristics(温度=25℃)Absolute Maximum Ratings (Temperature=25°C):Electro-Optical Charasteristics (Temperature=25°C):参数名称Parameter 符号Symbol 测试条件Test conditions最小值Min 典型值Typ 最大值Max 单位Unit 光强Light intensity IVIF=150mA55-65lm 主波长Main wavelengthD6000-7000K 显色指数Color rendering indexCRI -70-Ra 正向电压Forward voltage VF 3.0- 3.4V 半光强视角Half light angle 2θ1/2-120-Deg 反向电流Reverse currentIRVR=5V--10μA参数名称Parameter 符号Symbol 数值Rating 单位Unit 消耗功率Consumed power Pd 500mW 正向脉冲电流Peak Forward current IFP 180mA 正向工作电流Forward workingcurrent I F 150mA 反向电压Reverse voltage V R 5V 结温Junction temperature T J 110℃静电放电Electrostatic dischargeESD 2000(HBM)V工作环境温度Operating ambient temperature Topr-30℃~+85℃储存环境温度Storage ambient temperature Tstg -30℃~+100℃焊接条件Welding conditionsTsol回流焊(reflow soldering ):260°C ,5s 手动焊(manual welding ):300°C ,3s*注:脉冲宽度≤0.1ms ,占空比≤1/10*Note:Pulse width ≤0.1ms,Duty ≤1/10λ色阶@IF=150mA ,Ta=25℃(Unit:X/Y)Color scale @if=150ma,ta=25℃(unit:x/y)备注:色坐标测量余量±0.01Note:The color coordinate measurement margin ±0.01色区名坐标相对色温30K-3A X 0.43410.44230.46870.4582Y 0.40390.42120.42950.410730K-4AX 0.42590.43410.45820.4476Y0.38650.40390.41070.3918:Brightness gradingCode Min Max Unit Test conditions EV75560Lm IF=150mA EV86065:Voltage gradingCode Min Max Unit Test conditionsI7 3.0 3.2V IF=150mA I8 3.2 3.4M20 3.1 3.2:Wavelength gradingCode Min Max Unit Test conditions CH360006500K IF=150mA CH465007000Typical Characteristics Curves注:如无另外注明,测试环境温度为25+3︒C If not otherwise noted,the test ambient temperature is25+3︒C.可靠性实验Reliability experiment测试项目Test items测试条件Testconditions测试次数Number of tests 参考标准Reference standard失效判定标准Failuredeterm inationstandar d 失效LED 数量Number of failed LEDsQuantity防潮等级Moistuproof grade 1.回流焊最高温度=260℃,10秒,2次回流焊;2.2.回流焊之前存储条件:30℃,相对湿度=70%,168H;1.Maximum temperature of reflow soldering =260℃,10seconds,2reflow soldering;2.Storage conditions before reflow soldering:30℃,relative humidity =70%,168h;-JEITA ED-4701300.301﹟10/22焊接信赖性(无铅回流焊)Weldingreliability (lead free reflow soldering)回流焊最高温度=245±5℃,5秒(无铅回流焊)Maximum temperature of reflow soldering =245±5℃,5seconds (lead-freeReflow soldering)-JEITAED-4701303303A﹟20/22冷热循环thermal cycling-40℃30分钟(minute )~25℃5分钟(minute )~100℃30分钟(mi nute )~25℃5分钟(minute)300个循环(loop)JESD22-A104﹟10/22冷热冲击Thermal Shock -35℃15分钟(minute )转换时间(Conversion time )3分钟(minute )85℃15分钟(minute )300个循环(loop)JESD22-A106﹟10/22高温存储Hightemperaturestorage Ta=100℃1000小时(hour)JESD22-A103﹟10/22低温存储Lowtemperaturestorage Ta=-40℃1000小时(hour)JESD22-A119﹟10/22常温老化NormaltemperatureagingTa=25℃IF=20mA1000小时(hour)JESD22-A108﹟10/22标准Standard项目Project测试条件Test conditions失效标准Failure criteria ﹟1正向电压(V F )Forward voltageI F =20mA >U.S.L*1.1光强(IV)Light intensity I F =20mA <L.S.L*0.7反向电流(I R )Reverse currentV R =5V >U.S.L*2.0﹟2焊接可靠性Welding reliability-锡膏覆盖焊盘比例小于95%\The proportion of solder paste covering pad is less than 95%Outline Dimension备注: 1.单位:毫米(mm)Remarks:1Unit:mm2.公差:如无特别标注则为±0.10mm2.Tolerance:±0.10mm unless otherwise specified1Packaging(1)Belt and disk dimensions注:1.尺寸单位为毫米(mm)。

5730贴片LED灯珠特点

5730贴片LED灯珠特点

4月17日华胜光电5730贴片灯珠厂家直销华胜光电出售5730贴片灯珠厂家直销,一律采用正规芯片封装,坚决不采用廉价的专案芯片、大圆片、珠毛片、假方片、处理芯片或次品芯片;每一粒LED光源在自动封装线上完成,经过严格的分光分色筛选,经过品管层层的严格把关,保证出厂的每一批产品的可靠性、稳定性、一致性及标准化;特别适合做中高端LED应用产品。

5730贴片参数表如下:规格型号:5730贴片LED灯珠白光系列:暖白光系列5730白光,5730暖白光强亮度:光通量50-60LM 50-55LM色温范围:6000-7000K 2700-3300K衰减数据:3000小时3%以下3000小时3%以下发光角度:120度 120度反向漏电:0-2UA 0-2UA正向电流:150ma150ma消耗功率:0.5W热诚的欢迎全国各地用户与我司洽谈业务,我们将本着客户第一,服务至上的原则,积极为客户提供最全面,最优质,价格最优惠的产品,让客户感受到星级的产品服务。

华胜光电5730贴片LED灯珠特点华胜光电5730贴片LED灯珠特点:一、产品1、采用进口芯片;特点:高亮度,低衰减,耗能小,寿命长.抗静电能力强。

产品均使用硅胶封装,符合环保无铅制程产品要求。

2、亮度高,光色一致性好;3、LED贴片寿命:》5万小时;4、采用日本进口优质硅胶胶水封装,光衰低,寿命长;5、采用进口正规合格芯片,美国英特美荧光粉,质量保证;6、质量保障,价格合理,常规都有库存,交货非常及时。

备注:a)材料焊接次数不超过2 次。

b)焊接时请不要重压LED 灯。

c)焊接后温度未回降到常温时请勿扭曲线路板。

二、手工焊接规范:手工焊接时,烙铁温度不高于300℃,每个焊脚焊接时间不超过3 秒三、贮存规范:1. 请在未准备使用LED 之前不要打开防静电袋子。

2. LED 在未开封之前应保存在30℃以下,湿度在60%以下的环境中,最长保存期为1 年。

3. 打开包装待后,LED 需保存在30℃/40%湿度以下的条件,且必须在7 天内使用完。

华为S5730-HI系列下一代 ги格勒布敏切换器说明书

华为S5730-HI系列下一代 ги格勒布敏切换器说明书

DataSheetProduct OverviewThe S5730-HI series switches (S5730-HI) are the next-generation agile fixed switches developed by Huawei. The S5730-HI builds on Huawei's unified Versatile Routing Platform (VRP) and boasts various IDN-Ready features. For example, the integrated wireless AC capabilities can manage up to 1K wireless APs; the free mobility feature ensures consistent user experience; the VXLAN functionality implements network virtualization; and built-in security probes support abnormal traffic detection, threat analysis even in encrypted traffic, and network-wide threat deception. With these merits, the S5730-HI is ideal for branches of medium- and large-sized campus networks, the core layer of small-sized campus networks, and the access layer of data center networks.Models and AppearancesThe following models are available in the S5730-HI series.S5730-36C-HI-24SS5730-44C-HI-24S S5730-60C-HI-48S S5730-68C-HI-48SFeatures and HighlightsEnabling Networks to Be More Agile for ServicesS5730-HI has a built-in high-speed and flexible processor chip. The chip's flexible packet processing and traffic control capabilities can meet current and future service requirements, helping build a highly scalable network.In addition to capabilities of traditional switches, the S5730-HI provides open interfaces and supports user-defined forwarding behavior. Enterprises can use the open interfaces to develop new protocols and functions independently or jointly with equipment vendors to build campus networks meeting their own needs.S5730-HI series switches, on which enterprises can define their own forwarding models, forwarding behavior, and lookup algorithms. Microcode programmability makes it possible to provide new services within six months, without the need of replacing the hardware. In contrast, traditional ASIC chips use a fixed forwarding architecture and follow a fixed forwarding process. For this reason, new services cannot be provisioned until new hardware is developed to support the services one to three years later.Delivering Abundant Services More AgilelyThe S5730-HI integrates the AC function, so customers do not need to buy independent AC devices or hardware components. An S5730-HI switch can manage a maximum of 1K APs, adapting to the fast growth of wireless services.With the unified user management function, the S5730-HI authenticates both wired and wireless users, ensuring a consistent user experience no matter whether they are connected to the network through wired or wireless access devices. The unified user management function supports various authentication methods, including 802.1x, MAC address, and Portal authentication, and is capable of managing users based on user groups, domains, and time ranges. These functions visualize user and service management and boost the transformation from device-centric management to user-centric management.The S5730-HI provides excellent quality of service(QoS) capabilities and supports queue scheduling and congestion control algorithms. Additionally, it adopts innovative priority queuing and multi-level scheduling mechanisms to implement fine-grained scheduling of data flows, meeting service quality requirements of different user terminals and services.Providing Fine Granular Network Management More AgilelyThe S5730-HI uses the Packet Conservation Algorithm for Internet(iPCA) technology that changes the traditional method of using simulated traffic for fault location. iPCA technology can monitor network quality for any service flow anywhere and anytime, without extra costs. It can detect temporary service interruptions in a very short time and can identify faulty ports accurately. This cutting-edge fault detection technology turns "extensive management" to "fine granular management."The S5730-HI supports Two-Way Active Measurement Protocol(TWAMP) to accurately check any IP link and obtain the entire network's IP performance. This protocol eliminates the need of using a dedicated probe or a proprietary protocol.The S5730-HI supports SVF and functions as a parent switch. With this virtualization technology, a physical network with the "Small-sized core/aggregation switches + Access switches + APs" structure can be virtualized into a "super switch", offering the industry's simplest network management solution.With the Easy Deploy function, the S5730-HI manages access switches in a similar way an AC manages APs. In deployment, access switches and APs can go online with zero-touch configuration. In the Easy Deploy solution, the Commander collects topology information about the connected clients and stores the clients' startup information based on the topology. Clients canbe replaced with zero-touch configuration. The Commander can deliver configurations and scripts to clients in batches and query the delivery results. In addition, the Commander can collect and display information about power consumption on the entire network.Comprehensive VPN TechnologiesThe S5730-HI supports the MPLS function, and can be used as access devices of high-quality enterprise leased line. TheS5730-HI allows users in different VPNs to connect to the same switch and isolates users through multi-instance routing. Users in multiple VPNs connect to a provider edge(PE) device through the same physical port on the switch, which reduces the coston VPN network deployment.Flexible Ethernet NetworkingIn addition to traditional Spanning Tree Protocol(STP), Rapid Spanning Tree Protocol(RSTP), and Multiple Spanning Tree Protocol(MSTP), the S5730-HI supports Huawei-developed Smart Ethernet Protection(SEP) technology and the latest Ethernet Ring Protection Switching(ERPS) standard. SEP is a ring protection protocol specific to the Ethernet link layer, and applies to various ring network topologies, such as open ring topology, closed ring topology, and cascading ring topology. This protocol is reliable, easy to maintain, and implements fast protection switching within 50 ms. ERPS is defined in ITU-T G.8032. It implements millisecond-level protection switching based on traditional Ethernet MAC and bridging functions.The S5730-HI supports Smart Link and Virtual Router Redundancy Protocol(VRRP), which implement backup of uplinks. OneS5730-HI switch can connect to multiple aggregation switches through multiple links, significantly improving reliability of access devices.The S5730-HI has large entry sizes and 512MB buffers, coping with the fast growth of data volume in the big data era. With the support for 256K MAC addresses, 512K FIB entries, the S5730-HI meets the requirements of educational networks and metro area networks and allows the access of a large number of terminals. The S5730-HI is the best choice in cloud computing era.Various Security Control MethodsThe S5730-HI supports 802.1x authentication, MAC address authentication, Portal authentication, and hybrid authentication, and can dynamically delivery user policies such as VLANs, QoS policies, and access control lists(ACL). It also supports user management based on user groups.The S5730-HI provides a series of mechanisms to defend against DoS and user-targeted attacks. DoS attacks are targeted at switches and include SYN flood, Land, Smurf, and ICMP flood attacks. User-targeted attacks include bogus DHCP server attacks, IP/MAC address spoofing, DHCP request flood, and change of the DHCP CHADDR value.The S5730-HI sets up and maintains a DHCP snooping binding table, and discards the packets that do not match the table entries. You can specify DHCP snooping trusted and untrusted ports to ensure that users connect only to the authorized DHCP server.The S5730-HI supports strict ARP learning, which prevents ARP spoofing attackers from exhausting ARP entries.Mature IPv6 FeaturesThe S5730-HI is developed based on the mature, stable VRP and supports IPv4/IPv6 dual stacks, IPv6 routing protocols(RIPng, OSPFv3, BGP4+, and IS-IS for IPv6). With these IPv6 features, the S5730-HI can be deployed on a pure IPv4 network, a pure IPv6 network, or a shared IPv4/IPv6 network, helping achieve IPv4-to-IPv6 transition.Intelligent Stack(iStack)The S5730-HI supports the iStack function that combines multiple switches into a logical switch. Member switches in a stack implement redundancy backup to improve device reliability and use inter-device link aggregation to improve link reliability. iStack provides high network scalability. You can increase a stack's ports, bandwidth, and processing capacity by simply adding member switches. iStack also simplifies device configuration and management. After a stack is set up, up to nine physical switches can be virtualized into one logical device. You can log in to any member switch in the stack to manage all the member switches in the stack.PoE++ Power SupplyThe S5730-HI series PoE switches provide a maximum of 60 W PoE output power on a single interface, and can provide power for high-power terminals such as APs and surveillance cameras. This solves the problem of power supply in specific scenarios.Perpetual PoEWhen a PoE switch is rebooted after the software version is upgraded, the power supply to PDs is not interrupted. This capability ensures that PDs are not powered off during the switch reboot.Fast PoEPoE switches can supply power to PDs within 10s after they are powered on. This is different from common switches that generally take 1 to 3 minutes to start to supply power to PDs. When a PoE switch reboots due to a power failure, the PoE switchcontinues to supply power to the PDs immediately after being powered on without waiting until it finishes reboot. This greatly shortens the power failure time of PDs.VXLAN FeaturesVXLAN is used to construct a Unified Virtual Fabric(UVF). As such, multiple service networks or tenant networks can be deployed on the same physical network, and service and tenant networks are isolated from each other. This capability truly achieves 'one network for multiple purposes'. The resulting benefits include enabling data transmission of different services or customers, reducing the network construction costs, and improving network resource utilization. The S5730-HI series switches are VXLAN-capable and allow centralized and distributed VXLAN gateway deployment modes. These switches also support the BGP EVPN protocol for dynamically establishing VXLAN tunnels and can be configured using NETCONF/YANG.Big Data Security CollaborationAgile switches use NetStream to collect campus network data and then report such data to the Huawei Cybersecurity Intelligence System(CIS). The purposes of doing so are to detect network security threats, display the security posture across the entire network, and enable automated or manual response to security threats. The CIS delivers the security policies to the Agile Controller. The Agile Controller then delivers such policies to agile switches that will handle security events accordingly. All these ensure campus network security.The S5730-HI supports Encrypted Communication Analytics(ECA). It uses built-in ECA probes to extract characteristics of encrypted streams based on NetStream sampling and Service Awareness(SA), generates metadata, and reports the metadata to Huawei Cybersecurity Intelligence System(CIS). The CIS uses the AI algorithm to train the traffic model and compare characteristics of extracted encrypted traffic to identify malicious traffic. The CIS displays detection results on the GUI, provides threat handling suggestions, and automatically isolates threats with the Agile Controller to ensure campus network security.The S5730-HI supports deception. It functions as a sensor to detect threats such as IP address scanning and port scanning on a network and lures threat traffic to the honeypot for further checks. The honeypot performs in-depth interaction with the initiator of the threat traffic, records various application-layer attack methods of the initiator, and reports security logs to the CIS. The CIS analyzes security logs. If the CIS determines that the suspicious traffic is an attack, it generates an alarm and provides handling suggestions. After the administrator confirms the alarm, the CIS delivers a policy to the Agile Controller. The Agile Controller delivers the policy to the switch for security event processing, ensuring campus network security.Open Programmability System(OPS)Open Programmability System(OPS) is an open programmable system based on the Python language. IT administrators can program the O&M functions of a switch through Python scripts to quickly innovate functions and implement intelligent O&M.Adapting to Network EvolutionThe S5730HI series switches provide a buffer size of 4 GB and an SSD storage card slot(240 GB) for VNF evolution.Intelligent O&MThe S5730-HI provides telemetry technology to collect device data in real time and send the data to Huawei campus network analyzer CampusInsight. The CampusInsight analyzes network data based on the intelligent fault identification algorithm, accurately displays the real-time network status, effectively demarcates and locates faults in a timely manner, and identifies network problems that affect user experience, accurately guaranteeing user experience.The S5730-HI supports Enhanced Media Delivery Index(eMDI). It functions as a monitoring node to periodically collect and report eMDI fault data to eSight, and then eSight quickly locates video service quality faults based on monitoring results of multiple nodes. The device can also report eMDI fault data to the campus network analyzer CampusInsight for intelligent diagnosis of video services.Product SpecificationsService FeaturesNetworking and ApplicationsLarge enterprise campuses and branch/small campusesHuawei S5730-HI is the next-generation fixed agile switch. The S5730-HI has large table sizes and buffers, avoiding packet loss in traffic bursts. It supports wired and wireless convergence and unified management on devices, users, and services. TheS5730-HI can be used as the core device on an enterprise branch network or a small campus network or as the aggregation or access device on a large campus network, to achieve a manageable and reliable enterprise campus network with scalable services.Ordering InformationThe following table lists ordering information of the S5730-HI series switches.More InformationFor more information about Huawei Campus Switches, visit or contact us in the following ways: ●Global service hotline: /en/service-hotline●Logging in to the Huawei Enterprise technical support website: /enterprise/●Sending an email to the customer service mailbox: ********************Copyright © Huawei Technologies Co., Ltd. 2018. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior writtenconsent of Huawei Technologies Co., Ltd.Trademarks and Permissionsand other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders.NoticeThe purchased products, services and features are stipulated by the contract made between Huawei and thecustomer. All or part of the products, services and features described in this document may not be within thepurchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, andrecommendations in this document are provided "AS IS" without warranties, guarantees or representations ofany kind, either express or implied.The information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but all statements, information, andrecommendations in this document do not constitute a warranty of any kind, express or implied. Huawei Technologies Co., Ltd. Address:Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China Website:。

DriveLogix5730控制器的紧凑I O线缆安装说明书

DriveLogix5730控制器的紧凑I O线缆安装说明书

Installation Instructions Compact I/O Cable forDriveLogix™5730 Controller(Cat. No. 20D-DL2-CR3, 20D-DL2-CL3)Inside ...For More Information (2)Hazardous Location Considerations (3)O verview (3)Cable Types and Length (4)System Configurations (5)Installation (6)Publication 20D-IN008B-EN-P - August 20042 Compact I/O Cable for DriveLogix™5730 ControllerPublication 20D-IN008B-EN-P - August 2004For More InformationForRefer to this DocumentPub. rmation on how to install and use your 1769-ADN AdapterCompact TM I/O 1769-ADN DeviceNet Adapter Installation Instructions1769-IN001Installation guides for 1769 Discrete Compact I/O module 1769-IA8I Compact 1769-IA8I Individually Isolated 120V ac Input Module1769-IN012Installation guides for 1769 Discrete Compact I/O module 1769-IA16Compact 1769-IA16 120V ac Input Module Installation Instructions1769-IN006Installation guides for 1769 Discrete Compact I/O module 1769-OW8Compact 1769-OW8 AC/DC Relay Output Module Installation Instructions1769-IN051Installation guides for 1769 Discrete Compact I/O module 1769-OW8I Compact 1769-OW8I Individually Isolated AC/DC Relay Output Module1769-IN053Installation guides for 1769 Discrete Compact I/O module 1769-IQ16Compact 1769-IQ16 24V dc Sink/Source Input Module Installation Instructions1769-IN007Installation guides for 1769 Discrete Compact I/O module 1769-OB16Compact 1769-OB16 Solid State 24V dc Source Output Module Installation Instructions 1769-IN054Installation guides for 1769 Discrete Compact I/O module 1769-OB16P Compact 1769-OB16P Solid State 24V dc Source Output Module Installation Instructions 1769-IN052Installation guides for 1769 Discrete Compact I/O module 1769-OA8Compact 1769-OA8 100 to 240V ac Solid State Output Module Installation Instructions1769-IN055Installation guides for 1769 Discrete Compact I/O module 1769-OV16Compact 1769-OV16 Solid State 24V dc Sink Output Module Installation Instructions1769-IN056Installation guides for 1769 Discrete Compact I/O module 1769-IQ6XOW4Compact 1769-IQ6XOW4 24V dc Sink/Source Input AC/DC Relay Output Module Installation Instructions 1769-IN050Installation guides for 1769 Discrete Compact I/O module 1769-IM12Compact 1769-IM12 240V ac Input Module Installation Instructions1769-IN011Installation guides for 1769 Analog Compact I/O module 1769-IF4Compact 1769-IF4 Analog Input Module Installation Instructions1769-IN048Installation guides for 1769 Analog Compact I/O module 1769-OF2Compact 1769-OF2 Analog Output Module Installation Instructions1769-IN049Installation guides for 1769 Analog Compact I/O module 1769-IF4XOF2 * For Series B DeviceNet adapters onlyCompact 1769-IF4XOF2 Combination Analog Module Installation Instructions1769-IN057Information on how to install and use your 1769-IF4XOF2 moduleCompact 1769-IF4XOF2 8-Bit Low-Resolution Analog I/O Combination Module User Manual 1769-UM008Installation guides for 1769 High Speed Counter module 1769-HSC* For Series B DeviceNet adapters only Compact 1769-HSC High Speed Counter Module Installation Instructions1769-IN030Installation guides for 1769Thermocouple/mV module 1769-IT6Compact 1769-IT6 Thermocouple/mV Input Module Installation Instructions1769-IN026Compact I/O Cable for DriveLogix™5730 Controller 3Publication 20D-IN008B-EN-P - August 2004If you would like a manual, you can:•download a free electronic version from the internet:/literature •purchase a printed manual by:–contacting your local distributor or Rockwell Automation representativeHazardous Location ConsiderationsThis product must be installed in an enclosure. This equipment is suitable for use in Class I, Division 2, Groups A, B, C, D or non-hazardous locations only. The following ATTENTION statement applies to use in hazardous locations.EXPLOSION HAZARD•Substitution of components may impair suitability for Class I, Division 2.•Do not replace components or disconnect equipment unless power has been switched off or the area is known to be non-hazardous.•Do not connect or disconnect components unless power has been switched off or the area is known to be non-hazardous.•All wiring must comply with N.E.C. article 501-4(b).OverviewThe 20D-DL2-CR3 and 20D-DL2-CL3 cables allow you to connect a DriveLogix5730 Phase II controller to a bank of Compact I/O. A maximum of two banks of I/O can be used a DriveLogix5730 Phase II controller. Each bank requires its own power supply. See System Configurations on page 5.ForRefer to this DocumentPub. rmation on how to install and use your 1769-IT6 moduleCompact 1769-IT6 Thermocouple/mV Input Module User Manual1769-UM004Installation guides for 1769 RTD/resistance module 1769-IR6Compact 1769-IR6 RTD/Resistance Input Module Installation Instructions1769-IN027Information on how to install and use your 1769-IR6 moduleCompact 1769-IR6 RTD/Resistance Input Module User Manual1769-UM005Installation guides for 1769 power suppliesCompact 1769 Expansion I/O Power Supplies Installation Instructions1769-IN028Installation guides for 1769 cablesCompact I/O Communication Bus Expansion Cables Installation Instructions1769-IN014Installation guides for 1769 end caps and terminators Compact I/O End Caps/Terminators Installation Instructions1769-IN0154 Compact I/O Cable for DriveLogix™5730 ControllerCable Types and LengthCables for Connecting Controllers to I/O BanksCatalog Number Cable Type Length(1)20D-DL2-CL3Controller-to-left bank expansion 3.28 ft. (1 m) 20D-DL2-CR3Controller-to-right bank expansion 3.28 ft. (1 m)(1)Approximate cable length is measured from end-to-end of the cable only.Cables for Connecting I/O Banks to I/O BanksCatalog Number Cable Type Length(1) 1769-CLL1Left bank-to-left bank expansion 1 ft. (305 mm) 1769-CLL3Left bank-to-left bank expansion 3.28 ft. (1 m) 1769-CRR1Right bank-to-right bank expansion 1 ft. (305 mm) 1769-CRR3Right bank-to-right bank expansion 3.28 ft. (1 m) 1769-CRL1Right bank-to-left bank expansion 1 ft. (305 mm) 1769-CRL3Right bank-to-left bank expansion 3.28 ft. (1 m)(1)Approximate cable length is measured from end-to-end of the cable only.Publication 20D-IN008B-EN-P - August 2004Compact I/O Cable for DriveLogix™5730 Controller 5Publication 20D-IN008B-EN-P - August 2004System ConfigurationsThe following illustration show examples of four valid system setups.Bank 1Bank 1I/O Slot NumberI/O Slot Number26 Compact I/O Cable for DriveLogix™5730 ControllerInstallationRemove PowerTo avoid an electric shock hazard, verify that the voltage on the buscapacitors has discharged before performing any work on the drive.Measure the DC bus voltage at the +DC & –DC terminals of thePower Terminal Block. The voltage must be zero.HOT surfaces can cause severe burns. Do not touch the heatsinksurface during operation of the drive. After disconnecting powerallow time for cooling.Remove power before making or breaking cable connections. Whenyou remove or insert a cable connector with power applied, anelectrical arc may occur. An electrical arc can cause personal injury orproperty damage by:•sending an erroneous signal to your system’s field devices,causing unintended machine motion•causing an explosion in a hazardous environmentElectrical arcing causes excessive wear to contacts on both themodule and its mating connector. Worn contacts may create electricalresistance.Electrostatic discharge can damage integrated circuits orsemiconductors if you touch bus connector pins or the terminalblock. Follow these guidelines when handling 1769 Compact I/Ocomponents:•Touch a grounded object to discharge static potential.•Wear an approved wrist-strap grounding device.•Do not touch the bus connector or connector pins.•Do not touch circuit components inside the module.•If available, use a static-safe workstation.•When not in use, keep cables in static shield packaging. Publication 20D-IN008B-EN-P - August 2004Compact I/O Cable for DriveLogix™5730 Controller 7Publication 20D-IN008B-EN-P - August 2004What You Need to Do❐ Step 1: Remove power from drive and Compact I/O❐ Step 2: Remove the control cassette from the drive and the cover from the control cassette ❐ Step 3: Install the controller end of the cable ❐ Step 4: Replace the cover and control cassette ❐ Step 5: Connect the Compact I/O end of the cable8 Compact I/O Cable for DriveLogix™5730 ControllerPublication 20D-IN008B-EN-P - August 2004Step 1: Removing Power from Drive and Compact I/OTo avoid an electric shock hazard, verify that the voltage on the bus capacitors has discharged before performing any work on the drive. Measure the DC bus voltage at the +DC & –DC terminals of the Power Terminal Block. The voltage must be zero.Remove power before making or breaking cable connections. When you remove or insert a cable connector with power applied, anelectrical arc may occur. An electrical arc can cause personal injury or property damage by:•sending an erroneous signal to your system’s field devices, causing unintended machine motion•causing an explosion in a hazardous environmentElectrical arcing causes excessive wear to contacts on both themodule and its mating connector. Worn contacts may create electrical resistance.TaskDescriptionTurn off and lock out input power. Wait five minutes.Verify that there is no voltage at the drive’s input power terminals.Measure the DC bus voltage at the +DC & -DC terminals on the Power Terminal Block. The voltage must be zero.A B CCompact I/O Cable for DriveLogix™5730 Controller 9Publication 20D-IN008B-EN-P - August 2004Step 2: Removing the Control Cassette from the Drive and the Covers fromthe Cassettetorque for reassembly is 6 lb.-in.Removing the Side CoversTaskDescriptionLoosen screws on face of front cover and remove the cover Loosen screws on side of rear cover and remove the coverA B10 Compact I/O Cable for DriveLogix™5730 ControllerStep 3: Installing the Controller End of the CableStep 4: Replacing the Cover and Control CassetteThe procedure for replacing the cover and control cassette is the reverse of removing these components. Refer to Step 2: Removing the Control Cassette from the Drive and the Covers from the Cassette on page 9.Publication 20D-IN008B-EN-P - August 2004Compact I/O Cable for DriveLogix™5730 Controller 11 Step 5: Installing the Compact I/O End of the CableWhen energized bus connections break in hazardous environments,resulting sparks can cause explosions.Risk of personal injury and/or equipment damage exists.Securely lock the bus connectors (tasks D and E below) to avoid thishazard.Task DescriptionUnlock the Bus Lever on the I/O module accepting the cable cover by pushingthe lever back and then rightAlign both of the cable cover’s tongues (1) with the grooves (2) on the side of theI/O moduleSlide the cable cover back onto the module until the bus connectors (3) arealignedLock the Bus Lever on the I/O module by pushing the lever back and then leftuntil lockedOn a right-hand cable cover, lock the Bus Lever by pushing the lever back tothe left until lockedPublication 20D-IN008B-EN-P - August 2004Each I/O bank requires its own power supply. The 1769 cables extend the1769 communication bus, but do not extend bus power.SpecificationsApproximate ShippingWeight (with carton)3-foot cables: 350 g (0.77lbs.)Storage Temperature-40°C to +85°C (-40°F to +185°F)Operating Temperature0°C to +60°C (32°F to +140°F)Operating Humidity5% to 95% non-condensingOperating Altitude2000 meters (6561 feet)Vibration Operating: 10 to 500 Hz, 5G, 0.030 inches maximum peak-to-peakRelay Operation: 2GShock Operating: 30G panel mounted (20G DIN rail mounted)Relay Operation: 7.5G panel mounted (5G DIN rail mounted)Non-Operating: 40G panel mounted (30G DIN rail mounted) Agency Certification C-UL certified (under CSA C22.2 No. 142)UL 508 listedCE compliant for all applicable directivesHazardous Environment Class Class I, Division 2, Hazardous Location, Groups A, B, C, D (UL 1604, C-UL under CSA C22.2 No. 213)Publication 20D-IN008B-EN-P - August 2004PN 335729-P02 Supersedes 20D-IN008A-EN-P - April 2004 Copyright © 2004 Rockwell Automation. All rights reserved. Printed in the U.S.A.。

福禄克 5730A 操作员手册说明书

福禄克 5730A 操作员手册说明书

5730AMultifunction Calibrator操作员手册August 2013 Rev. 1, 6/15 (Simplified Chinese)有限担保及责任范围Fluke 公司保证其每一个Fluke的产品在正常使用及维护情形下,其用料和做工都是毫无瑕疵的。

保证期限是一年并从产品寄运日起开始计算。

零件、产品修理及服务的保证期是 90 天。

本保证只提供给从 Fluke 授权经销商处购买的原购买者或最终用户,且不包括保险丝、电池以及因误用、改变、疏忽、或非正常情况下的使用或搬运而损坏(根据 Fluke 的意见而定)的产品。

Fluke 保证在 90 天之内,软件会根据其功能指标运行,同时软件已经正确地被记录在没有损坏的媒介上。

Fluke 不能保证其软件没有错误或者在运行时不会中断。

Fluke 仅授权经销商将本保证提供给购买新的、未曾使用过的产品的最终用户。

经销商无权以 Fluke 的名义来给予其它任何担保。

保修服务仅限于从 Fluke 授权销售处所购买的产品,或购买者已付出适当的Fluke国际价格。

在某一国家购买而需要在另一国家维修的产品,Fluke 保留向购买者征收维修/更换零件进口费用的权利。

Fluke 的保证是有限的,在保用期间退回 Fluke 授权服务中心的损坏产品,Fluke有权决定采用退款、免费维修或把产品更换的方式处理。

欲取得保证服务,请和您附近的Fluke服务中心联系,或把产品寄到最靠近您的Fluke服务中心(请说明故障所在,预付邮资和保险费用,并以 FOB 目的地方式寄送)。

Fluke 不负责产品在运输上的损坏。

保用期修理以后,Fluke 会将产品寄回给购买者(预付运费,并以 FOB 目的地方式寄送)。

如果 Fluke 判断产品的故障是由于误用、改装、意外或非正常情况下的使用或搬运而造成,Fluke 会对维修费用作出估价,并取得购买者的同意以后才进行维修。

维修后,Fluke 将把产品寄回给购买者(预付运费、FOB 运输点),同时向购买者征收维修和运输的费用。

5730灯珠封装尺寸

5730灯珠封装尺寸

5730灯珠封装尺寸
5730灯珠封装尺寸是指一种LED灯珠的封装规格,它在电子显示、照明和光电子等领域有着广泛的应用。

本文将介绍5730灯珠的封装尺寸,包括其外观、尺寸规格和特点。

一、外观描述
5730灯珠采用了方形的外观设计,整体封装结构紧凑。

其外观尺寸
为5.7 mm × 3.0 mm,高度约为0.9 mm,具有较小的体积和轻便的特点,方便在各种器件和产品中进行安装和应用。

二、尺寸规格
5730灯珠封装尺寸规格如下:
1. 外观尺寸:5.7 mm × 3.0 mm × 0.9 mm
2. 焊盘间距:2.8 mm
三、特点分析
5730灯珠封装尺寸的特点有:
1. 小巧轻便:由于其尺寸较小,5730灯珠方便携带和安装,不占用
过多的空间。

2. 优异的光学性能:5730灯珠具有高亮度和高均匀性的特点,能够
提供明亮而均匀的光照效果。

3. 易于集成:由于封装尺寸小巧,5730灯珠适合在各种载体上进行
集成和组合,可实现多种复杂应用场景的需求。

4. 节能环保:5730灯珠采用LED技术,具有低功耗、长寿命和无
紫外辐射等优点,符合节能环保的特点。

结语
5730灯珠封装尺寸为5.7 mm × 3.0 mm × 0.9 mm,具有小巧轻便、
优异的光学性能、易于集成和节能环保的特点。

这种封装尺寸的灯珠
广泛应用于各种电子显示、照明和光电子产品中,为人们的生活和工
作提供了高品质的光照效果。

随着科技的不断进步和应用领域的扩大,5730灯珠封装尺寸的应用前景必将更加广阔。

华为S5730-SI系列交换机说明书

华为S5730-SI系列交换机说明书

CONTENTOverview (2)Models & Appearance (2)Key Features and Benefits (3)Product Specifications (6)Basic Ordering Information (13)Where to Buy (15)Sources (15)Contact UsTel: +1-626-239-8066 (USA) +852-3050-1066 / +852-3174-6166Fax: +852-3050-1066 (Hong Kong)Email:***********************(SalesInquiries) 1Huawei's S5730-SI series switches (S5730-SI for short) are next-generation standard gigabit Layer 3 Ethernet switches that provide flexible full gigabit access and cost-effective fixed GE ports and 10 GE uplink ports, meanwhile can provide 40 GE uplink ports with an interface card. The S5730-SI was developed based on next-generation high-performing hardware and the Huawei Versatile Routing Platform (VRP). The S5730-SI supports simplified Operations and Maintenance (O&M), intelligent Stack (iStack), flexible Ethernet networking. It also provides enhanced Layer 3 features and mature IPv6 features. The S5730-SI can be used in various scenarios. For example, it can be used as an access or aggregation switch on a campus network or as an access switch in a data center.1. S5730-48C-SI-AC· 24 Ethernet 10/100/1,000 ports, 8 x 10 Gig SFP+· One interface slot· Dual pluggable AC or DC power supplies, one 150W AC power supply equipped by default· Forwarding performance: 240 Mpps; Switching capacity: 680 Gbit/s2. S5730-48C-PWR-SI-AC· 24 Ethernet 10/100/1,000 ports, 8 x 10 Gig SFP+· One interface slot· One 500W AC power supply equipped by default· PoE+· Forwarding performance: 240 Mpps; Switching capacity: 680 Gbit/s3. S5730-68C-SI-AC 2· 48 Ethernet 10/100/1,000 ports, 4 x 10 Gig SFP+· One interface slot· Dual pluggable AC or DC power supplies, one 150W AC power supply equipped by default· Forwarding performance: 240 Mpps; Switching capacity: 680 Gbit/s4. S5730-68C-PWR-SI-AC· 48 Ethernet 10/100/1,000 ports, 4 x 10 Gig SFP+,· One interface slot· One 500W AC power supply equipped by default· PoE+· Forwarding performance: 240 Mpps; Switching capacity: 680 Gbit/s5. S5730-68C-PWR-SI· 48 Ethernet 10/100/1,000 ports, 4 x 10 Gig SFP+, PoE+· One interface slot· PoE+· Forwarding performance: 240 Mpps; Switching capacity: 680 Gbit/sKEY FEATURES AND BENEFITSPowerful service processing capability and multiple security control mechanismsThe S5730-SI supports many Layer 2/Layer 3 multicast protocols such as PIM SM, PIM DM, PIM SSM, MLD, and IGMP snooping, to support multi-terminal high-definition video surveillance and video conferencing services.The S5730-SI supports multiple Layer 3 features including OSPF, IS-IS, BGP, and VRRP, meeting enterprises’ requirements for access and aggregation service transmission, and enabling a variety of voice, video, and data applications.The S5730-SI supports MAC address authentication, 802.1x authentication, and Portal authentication, and implements dynamic delivery of policies (VLAN, QoS, and ACL) to users. 3The S5730-SI provides a series of mechanisms to defend against DoS and user-targeted attacks. DoS attacks are targeted at switches and include SYN flood, Land, Smurf, and ICMP flood attacks. User-targeted attacks include bogus DHCP server attacks, IP/MAC address spoofing, DHCP request flood, and change of the DHCP CHADDR value.The S5730-SI sets up and maintains a DHCP snooping binding table, and discards the packets that do not match the table entries. You can specify DHCP snooping trusted and untrusted ports to ensure that users connect only to the authorized DHCP server.The S5730-SI supports strict ARP learning, which protects a network against ARP spoofing attacks to ensure normal network access.Easy O&MThe S5730-SI supports Super Virtual Fabric (SVF), which virtualizes the “Core/aggregation + Access switch + AP” structure into a logical device. The S5730-SI provides the simplest network management solution in the industry to simplify device management. It allows plug-and-play access switches and APs. In addition, the S5730-SI supports service configuration templates. The templates are configured on core devices and automatically delivered to access devices, enabling centralized control, simplified service configuration, and flexible configuration modification. The S5730-SI functions as a client in an SVF system.The S5730-SI supports zero-touch deployment, replacement of faulty devices without additional configuration, USB-based deployment, batch configuration, and batch remote upgrade. The capabilities facilitate device deployment, upgrade, service provisioning, and other management and maintenance operations, and also greatly reduce O&M costs. The S5730-SI can be managed using SNMP v1/v2c/v3, CLI, web-based network management system, or SSH v2.0. Additionally, it supports RMON, multiple log hosts, port traffic statistics collection, and network quality analysis, which facilitate network optimization and reconstruction.The S5730-SI supports the Sampled Flow (sFlow) function. It uses a method defined in the sFlow standard to sample traffic passing through it and sends sampled traffic to the collector in real time. The collected traffic statistics are used to generate statistical reports, helping enterprises maintain their networks.Multiple reliability mechanismsThe S5730-SI supports iStack. This technology can virtualize up to nine physical switches into one logical switch. Downlink electrical ports support iStack. Member switches in a stack implement redundancy backup to improve device reliability and use inter-device link aggregation to improve link reliability. iStack provides high network scalability. You can increase a stack’s ports, bandwidth, and processing capacity by simply adding member switches. iStack also simplifies device configuration and management. After a stack is set up, multiple physical switches are virtualized into one logical device. You can log in to any member switch in the stack to manage all the member switches in the stack. 4The S5730-SI is equipped with two removable power modules that can work in 1+1 redundancy backup mode. Mixed installation of AC and DC power modules is supported, allowing for flexible configuration of AC or DC power modules according to service requirements.In addition to traditional STP, RSTP, and MSTP, the S5730-SI supports Huawei-developed Smart Ethernet Protection (SEP) technology and the latest Ethernet Ring Protection Switching (ERPS) standard. SEP is a ring protection protocol specific to the Ethernet link layer, and applies to various ring network topologies, such as open ring topology, closed ring topology, and cascading ring topology. This protocol is reliable, easy to maintain, and implements fast protection switching within 50 ms. ERPS is defined in ITU-T G.8032. It implements millisecond-level protection switching based on traditional Ethernet MAC and bridging functions.The S5730-SI supports Smart Link. One S5730-SI switch can connect to multiple aggregation switches through multiple links, implementing backup of uplinks and significantly improving reliability of access devices.The S5730-SI supports Ethernet OAM (IEEE 802.3ah/802.1ag) to detect link faults quickly.Mature IPv6 technologiesThe S5730-SI uses the mature, stable VRP platform and supports IPv4/IPv6 dual stack, IPv6 RIPng, and IPv6 over IPv4 tunnels (including manual, 6-to-4, and ISATAP tunnels). With these IPv6 features, the S5730-SI can be deployed on a pure IPv4 network, a pure IPv6 network, or a shared IPv4/IPv6 network, helping achieve IPv4-to-IPv6 transition.OPSOpen Programmability System (OPS) is an open programmable system based on the Python language. IT administrators can program the O&M functions of a switch through Python scripts to quickly innovate functions and implement intelligent O&M.PoEPerpetual PoE: When a PoE switch is rebooted after the software version is upgraded, the power supply to PDs is not interrupted. This capability ensures that PDs are not powered off during the switch reboot.Fast PoE: S5730-48C/68C-PWR-SI switches can supply power to PDs within 10s after they are powered on. This is different from common switches that generally take 1 to 3 minutes to start to supply power to PDs. When a PoE switch reboots due to a power failure, the PoE switch continues to supply power to the PDs immediately after being powered on without waiting until it finishes reboot. This greatly shortens the power failure time of PDs.Intelligent O&M 5The S5730-SI provides telemetry technology to collect device data in real time and send the data to Huawei campus network analyzer CampusInsight. The CampusInsight analyzes network data based on the intelligent fault identification algorithm, accurately displays the real-time network status, effectively demarcates and locates faults in a timely manner, and identifies network problems that affect user experience, accurately guaranteeing user experience.The S5730-SI supports a variety of intelligent O&M features for audio and video services, including the enhanced Media Delivery Index (eMDI). With this eDMI function, the switch can function as a monitored node to periodically conduct statistics and report audio and video service indicators to the CampusInsight platform. In this way, the CampusInsight platform can quickly demarcate audio and video service quality faults based on the results of multiple monitored nodes. 6 7 8 9 10 11 12 13 14Want to buy this series of products? please contact:● Tel: +1-626-239-8066 (USA)/ +852-3050-1066 / +852-3174-6166● Fax: +852-3050-1066 (Hong Kong)●Email:***********************(SalesInquiries)Or visit: Huawei S5730-SI Series SwitchesAbout us, founded in 2002, is one of the biggest Global Network Hardware Supplier. We are a leading provider of network products with 14,500+ customers in over 200 countries. We provide original new and used network equipments (Cisco, Huawei, HPE, Dell, Juniper, EMC, etc.), including Routers, Switches, Servers, Storage, Telepresence and Videoconferencing, IP Phones, Firewalls, Wireless APs & Controllers, EHWIC/HWIC/VWIC Cards, SFPs, Memory & Flash, Hard Disk, Cables, and all kinds of network solutions related products.https:///us/related-page/products/enterprise-network/switches/campus-switches/s5700/brochure/switches-s5730-si 15。

中山市木林森电子有限公司 E5730UG35 LED产品说明书

中山市木林森电子有限公司 E5730UG35 LED产品说明书

型号Model:E5730UG35日期Date:2020-4-23部门Department:RD版本Edition:A/0承认Acceptance▇批量生产Batch production□初步试样Initial sample□客户专用设计Customer Special Design 设计编号Design Number:MLS批准Approval审核Audit制作production客户会签Customersignature客户意见Customercomment地址:广东省中山市小榄镇龙山工业区木林森大道1号Address: XiaoLan town LongShan industrial zone Mulinsen road no. 1,Zhongshan City, Guangdong Province总机(switchboard):*************E-mail:*************目录Contents产品介绍(Product Introduction) 3 光电参数(Photoelectric Parameters) 4 电性曲线(Electrical Curve) 5 Bin等级(Bin Level) 6 实验标准(Experimental Standard) 7 包装规格(Packing Specification) 8 使用说明(Instructions For Use) 10 储存方式(Storage) 13 硫化标准(Vulcanization Experiments) 14简述(Description):平面发光二极管(Flat LED)封装尺寸(Package Dimensions)胶体(Colloid)材质(Material)发光颜色(Color)透明胶体Water Clear AlGaInP 绿色Green备注(Remarks):1、所有尺寸单位为毫米All dimensions are in millimeters2、未注明公差为±0.1毫米(除非另有说明)Tolerance of + or – 0.1mm (unless otherwise noted)3、规格若有变更恕不另行通知Specifications subject to change without prior notice温度为25℃时的最大参数值( Absolute Maximum Rating Value Temperature at 25℃)参数(Parameters) 极限参数(Maximum Rating)单位(Units)功耗(Power) 120 mW 顺向直流电(Forward Current)40 mA反向电压(Reverse V oltage) 6 V 正向脉冲电流≦10ms,工作周期=1/10(PulseForward Current(tp≦10ms,Duty cycle=1/10))45 mA温度为25℃时的光电特性参数( Optical Parameters Temperature at 25℃)参数Parameter符号Symbols最小值Min标准值Typical最大值Max单位Units测试条件Testing Conditions光强度(Luminous Intensity)Iv 200 ﹍3000 Mcd IF=20mA 发光角度(Viewing Angle)2θ1/2﹍120 ﹍Deg IF=20mA 正向电压(Forward voltage)VF 2.8 --- 4.0 V IF=20mA 反向电流(Reverse Current)IR 0 ﹍ 1 uA VR=6V 结温(Junction temperature)Tj ﹍﹍120 ℃IF=20mA 热阻(Thermal Resistance)T Sol﹍﹍20 ℃/W IF=20mA 备注(Remarks):1、此发光亮度为根据人眼对发光亮度的感应曲线之模拟发光强度符合CIE(国际光委会组织)。

led3030灯珠和5730哪个好?led3030灯珠和1W仿流明灯珠哪个好?

led3030灯珠和5730哪个好?led3030灯珠和1W仿流明灯珠哪个好?

led3030灯珠和5730哪个好?led3030灯珠和1W仿流明灯珠哪个好?展开全文led3030灯珠和5730哪个好?led3030灯珠和1W仿流明灯珠哪个好?前两天,有客户问我led3030灯珠和5730哪个好?led3030灯珠和5730哪个好?我们先来看看它们两个的参数,再来看看到底哪个好。

led3030灯珠参数1、3030灯珠的规格尺寸:3.0×3.0×0.6mm2、3030灯珠的功率单颗0.2W,0.5W和1W。

3、3030灯珠用在照明上LED灯珠,比如路灯,取代仿流明大功率灯珠的功率一般是单颗1W。

4、3030灯珠亮度高,1W光通量120-150LM。

(高光效大芯片灯珠光通量高)5、3030灯珠其它颜色:红光,橙光,黄光,普绿和翠绿光,蓝光,紫光等。

6、3030灯珠色温范围:暖白2800-3300K,中性白:4000-4500K ,正白:6000-6500K,冷白光:7000-100000K以上。

7、3030灯珠比较薄,厚度只有0.6mm, 是贴片系列中很簿,同比2835,5730灯珠都要薄,体积小。

led5730灯珠参数1、5730灯珠的规格尺寸:5.7×3.0×0.8mm2、5730灯珠单颗功率 : 0.5W。

3、5730灯珠白光色温范围:暖白2700-3300K,中性白:4000-4500K ,正白:6000-6500K,冷白光:7000-100000K以上4、5730灯珠白光亮度:光通量55-75LM/颗5、5730灯珠彩光:5730红光、5730绿光、5730黄光、5730蓝光,5730橙光等6、5730灯珠发光角度:120度7、5730灯珠正向电流:150mA,正向脉冲电流:500mA8、5730灯珠正向电压:3.0-3.3V,反向电压:5V9、5730灯珠其它颜色:红光,橙光,黄光,普绿和翠绿光,蓝光,紫光灯珠。

10、5730灯珠应用:景观灯,灯带,日光灯管等室内外照明灯具,亮化工程等。

贴片灯珠5730参数表(CF-WI-GC-017-A CFS5730W6D60-1BQ0)

贴片灯珠5730参数表(CF-WI-GC-017-A CFS5730W6D60-1BQ0)

ISO9001: 2008 quality management system documentationDongguan Chunfa Lighting Electronics Co. LtdCFS5730W6D60-1BQ0ICF-WI-GC-017Written by:杨福Audit:Approve:Without Chunfa permission Copying is prohibited lendingModify recordsTechnical Data SheetTOP View White LED (5730)For: IF= 150mAContents1. Features2. Applications3. Package outline dimension4. Absolute maximum ratings5. Electrical-optical characteristics6. Typical electro-optical characteristics curves7. BIN code description8. BIN range9. Luminous intensity10. Forward voltage11. Reliability test items and conditions12. Precautions for use13. Package method1.0 Features:1.1 Package: 5.7*3.0*0.8mm (TOP view white LED) 1.2 Emitted Color: Warm color 1.3 Mono-color type1.4 Soldering methods: All SMT assembly methods 1.5 Comply ROHS standard.2.0 Applications:2.1 LCD back light. 2.2 Mobile phones: LCD.2.3 Status indicators: Consumer & industrial electronics.2.4 General use.3.0 Package Outline Dimension:3.1 NOTES:3.1.1 All dimensions are in millimeters (inches). 3.1.2 Tolerance is ±0.10mm unless otherwise specified.3.1.3 Specifications are subject to change without notice.4.0 Absolute Maximum Ratings(Ta=25℃)4.1 *1 I FP condition: pulse of 1/10 duty and 0.1ms width.5.0 Electrical-optical characteristics(Ta=25℃)5.1 Note:5.1.1 Tolerance of luminous intensity is ±10%5.2.2 Tolerance of forward voltage is ±0.05V6.0 Typical Electro-Optical Characteristics Curves7.0 BIN code description8.0 BIN range9.0 Luminous intensity (tolerance is ±10%@ If=150mA)11.0 Reliability test items and conditions:11.1.1 Iv: Below 50% of initial values11.1.2 Vf: Over 20% of upper limit value11.1.3 IR: Over 2 times of upper limit value11.2 Note:11.2.1 Measurement shall be taken between 2 hours and after the test LED have been returned tonormal ambient conditions after completion of each test.12.0 Precautions for use :12.1 Customer must apply the current limiting resistor in the circuit so as to drive the LEDs withinthe rated current. Otherwise slight voltage shift maybe will cause big current change and burn out will happen.12.2 Also, caution should not be taken to overload the LEDs with instantaneous high voltage at the turningON and OFF of the circuit.12.3 Storage:12.3.1 SMD LED must be stored in dry, the humidity should be kept less than 60%RH to prevent damping.12.3.2 Ensure the aluminum foil bag is perfectly sealed before use. Any leaking or damage of thebag is not acceptable, should return back to the factory for repacking.12.3.3 as the product is perfectly sealed and stored within 60%RH of humidity, the product can beused without any further baking process in a month. If the product is stored over a month,it should be baked without the bag before use. Baking treatment: 75℃ for 72 hours. Any unsealedproduct should be used up within 6 hours, otherwise the product should follow the bakingtreatment to prevent any disability incurred of the product12.3.4 reflow soldering is recommended for this product. Any soldering with temperature over 300℃is not recommended.12.3.5 reflow soldering temperature should be set around 230℃, and should not over 250℃. Reflowsoldering should be done within 7 minute, the time used in high temperature zone should lessthan 7 seconds. Different solder paste require different soldering temperature, we recommendto use hypothermia solder paste since it lower the expansion rate of the SMD LED. We alsorecommend to set the reflow soldering process into 3 parts with different soldering temperature:preheat zone, soldering zone and preservation zone/cooling zone.12.3.6 SMD LED 2835 series product contains PPA material with the highest temperature capabilityof 290℃, higher temperature could cause melting of SMD LED.12.3.7 any hydrous or sulfurated solder paste should not be used. Do not add diluent into anyunfinished solder paste ,otherwise water could easily go through the SMD LED while soldering.12.4 Soldering condition:12.4.1 Lead solder temperature. Time section12.4.2 DIP soldering (Wave Soldering) temp. -time profile:12.4.4 DIP soldering (Wave Soldering) temp. -time profile:12.5.2 Don’t put stress on the LEDs when soldering.12.5.3 Don’t warp the circuit board before it have been returned to normal ambient conditions aftersoldering.12.5.4 All products require customers to follow the terms and conditions issued under the <Cautionsbefore use>. Any overloading current and inconformity dehumidification process or storage in use of the products will not be provided with quality assurance.13.1 Loaded quantity: 3000 pcs/Volume13.2 Carrier tape dimension (Company: mm)13.3 Reel Dimensions (Company: mm)13.4 Moisture Resistant Packaging。

CloudEngine S5730系列交换机介绍

CloudEngine S5730系列交换机介绍

• 支持随板AC,最大可管理1K AP
• 支持SVF Parent/Client模式,极简部署及管理
• 支持千兆/万兆光口混合接入,接口丰富
• 配合HiSec Insight平台实现ECA及威胁诱捕,整网 安全协防
CloudEngine S5732-H:多速率接入交换机
内置可编程芯片
CPU:4核*1.4GHz
10GE SFP+
内置可编程芯片
CPU:4核*1.4GHz
内存:4GB Flash:2GB
4个25GE
2个100GE* 2个40GE*
USB 2.0
1个扩展子卡槽位
2个可插拔风扇槽位, 前后通风
2个可插拔电源槽位,支持1+1冗余
1)当端口工作模式为100GE时,前面板4个25GE不可用,且100GE端口支持拆分为4*25GE SFP28 2)当端口工作模式为40GE时,前面板4个25GE正常使用,且40G端口支持拆分为4*10GE SFP+
S5732-H
128K
192K
80K
140K
80K
64K
4K
S5731-H
288K
512K
64K
128K
64K
16K
16K
S5731S-H
288K
256K
32K
64K
32K
8K
8K
S5731-S
32K
16K
8K
16K
8K
1K
1K
S5731S-S
32K
8K
4K
8K
4K
512
512
S5735-S
16K
8K

5730灯珠工作电压,5730贴片led灯珠电压是多少?

5730灯珠工作电压,5730贴片led灯珠电压是多少?

5730灯珠⼯作电压,5730贴⽚led灯珠电压是多少?
5730灯珠⼯作电压,5730贴⽚led灯珠电压是多少?5730led灯珠参数⼀览表
5730灯珠⼯作电压。

5730灯珠⽩⾊光⼯作电压:3.0-3.3V (包括暖⽩光,中性⽩光,正⽩光和冷⽩光)
5730灯珠红⾊光⼯作电压:2.0-2.3V5730灯珠橙⾊光⼯作电压:2.0-2.3V5730灯珠黄⾊光⼯作
电压:2.0-2.3V5730灯珠翠绿光⼯作电压:3.0-3.3V5730灯珠蓝⾊光⼯作电压:3.0-3.3V5730灯
珠紫⾊光⼯作电压:3.0-3.3V5730灯珠粉红光⼯作电压:3.0-3.3V
以上就是5730贴⽚led灯珠电压,⼤家对⽐参照就⼀⽬了然了。

5730led灯珠参数可以参考下表
希望今天的分享能给你带来帮助,如果你在LED灯珠的选型或使⽤过程中有任何LED灯珠问题
咨询,可以联系我们。

灯珠教授每天分享LED灯珠资讯和⾏业信息。

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灯珠教授!往⽇推荐:led灯珠规格型号⼀览表(贴⽚灯珠规格型号系列⼀)发光⼆极管价格,
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Tekneka 5730 双通道温度数据记录器说明书

Tekneka 5730 双通道温度数据记录器说明书
Байду номын сангаас
Applications
This 5730 dual-channel temperature data logger can be widely used in Agricultural Greenhouses, Breeding Facilities, Museums, Pharmaceuticals, Laboratories, Hospitals, Production Facilities, Food Transportation, Quality Inspection, Warehouse Storage, Homes, and Office Environment Monitoring.
• 3.9-inch larger LCD screen with backlight and extended standby time • 25,920 readings can be stored in its storage capacity • Most effective touch-sensitive buttons for quick navigation • Automatic keypad lock to prevent unintentional disruption • When in record mode, displays minimum, maximum, and average readings • If it exceeds the specified limit, an audible buzzer alarm is available • Allows for the insertion of several sensor probes (higher range) • When the record state is active, users can mark up to 3 points • Allows for multiple calibration points for this device • Easily export the necessary data while exploring in graph mode • Previous data will be stored by software, which helps in analysis at any moment • Allows the option of continuing recording to prevent having to configure each time

5730芯片

5730芯片

5730芯片5730芯片是一种尺寸为57mm x 30mm的集成电路芯片,常用于LED照明应用中。

其主要特点是高亮度、高稳定性和高可靠性,适用于各种室内和室外照明场景。

5730芯片具有以下特点:1.高亮度:5730芯片采用高亮度LED芯片,能够提供较高的亮度输出。

其亮度相较于传统的5050芯片要更高,可满足对光照强度要求较高的场所,如商业照明、户外广告牌等。

2.节能环保:5730芯片采用了高效的驱动电路设计,在相同亮度输出的情况下,功耗更低。

与传统的荧光灯相比,5730芯片能够节约能耗,具有较长的使用寿命,符合节能环保的要求。

3.高稳定性:5730芯片具有较高的稳定性,对电压变化较为抗干扰,能够稳定输出亮度。

这对于照明应用来说非常重要,可以确保灯光的稳定性,减少光照变化对视觉的影响。

4.耐用性强:5730芯片采用了高质量的材料和先进的制造工艺,具有较高的耐用性。

其可靠性更高,能够长时间稳定工作,不易受到外界环境的干扰。

这使得5730芯片适用于各种苛刻的照明环境,如室外照明、工业照明等。

5.灵活性:5730芯片具有较小的尺寸,便于安装和布局。

其尺寸为57mm x 30mm,可方便地集成到各种照明产品中,如灯管、灯泡、灯带等。

同时,5730芯片还可以根据需求进行组合,实现不同亮度、不同颜色的光照效果。

5730芯片可以应用于各种照明场景,如家庭照明、商业照明、工业照明、户外照明等。

其高亮度和稳定性可以满足对亮度和稳定性要求较高的场所,如商场、写字楼、工厂等。

其节能环保和耐用性可以降低能源消耗和维护成本,实现可持续发展。

总之,5730芯片是一种高亮度、高稳定性和高可靠性的LED照明芯片,具有节能环保和耐用性强的优点。

在照明应用中具有广泛的应用前景,可以为各类照明产品提供高质量的照明效果。

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规格书
公司名称:创明之星光电科技有限公司部门:生产技术部
产品规格:CMZX5730-GE
Kit number system 产品编码规则:
A、luminous 流明值(50-55)
B、electricity(mA)电流(≤150)
C、model 产品型号(5730)
D、Viewing angle and materials 角度和材料(红铜支架金线台湾进口芯片)
E、color 颜色(正白6000K-6500K)
F、公司名称(创明之星光电)
Note: The sent out of the product not only indicate that their products NAME, but also marked on the
label out of the parameters, or marked parameters of the product code. Code consists of four digits,
◇voltage 电压
O P Q R S T
2.9-
3.1V 3.1-3.3V 3.3-3.5V 3.5-3.7V 3.7-3.9V 3.9-
4.1V
Electro-optical characteristics 主要光电参数(Ta=25℃)
NOTES 注意:
Tolerance: Iv ±10%, λd±2nm, Vf±0.05V, X, Y ±0.01)
公差:光强±10%,主波长±2nm, 正向电压±0.05V, 色坐标X, Y ±0.01)
IFP Conditions: Pulse Width≦10msec and Duty≦1/10.
峰值电流条件: 脉冲范围≦10 毫秒, 占空比≦1/10
Typical optical characteristics curves 光电特性曲线
Packaging 包装:Unit 单位(mm)
NOTES 注意:
1. Empty component pockets are sealed with top cover tape;
空载带顶部用封带密封
2. The maximum number of missing lamps is two;
包装好的产品的数量最大误差值为±2
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications.
产品的负极朝载带有孔的方向,产品规格符合ANSI/EIA RS-481 标准
4. 3,000 PCS / Reel.
3,000 颗/卷
Specifications 规格
一、Requirements for application and reflow soldering:应用及回流焊要

Notes for reflow soldering 回流焊注意事项:
1. No more than twice for reflow soldering.
注意回流焊不可超过两次
2. To ensure the quality of our LEDs, we encapsulate them with silica gels. So please do not put pressure on the LEDs.
为保证产LED 质量及可靠性我司采用硅胶封装,胶体表面较软,焊接加热过程中,不可施加压力在LED
表面。

3. Please choose the right nozzle to avoid the damage to products due to the pressure. 在吸嘴的选取上要选择吸嘴的大小和压力合适的吸嘴,以避免造成压力过大伤害产品
4. Please put on the antistatic hand loop during the use. The worktable should be with antistatic finish. The equipments must
be contacted with ground.
LED 为静电敏感产品,使用时请佩带防静电手环,工作台做好防静电处理,机台设备等保证接地
Handwork soldering 手工焊接:
1. During the soldering, the electronic soldering iron must be kept under the temperature of 300℃and the soldering time
must not be beyond 3 seconds. No touch between the electronic soldering iron and colloid.
手工焊接时,要保持电烙铁温度在300 摄氏度以下,并且焊接时间小于3 秒,电烙铁不可接触胶体
2. Handwork soldering is onl y allowed once. We won’t take responsibility for more than that.
手工焊接只可进行一次,重复焊接不保证产品是否完好
3. Avoid using sharp objects to compress products Colloidal Part directly.
避免使用尖锐的物体直接接触产品胶体部分
4. Please put on the antistatic hand loop during the use. The worktable should be with antistatic finish. The equipments must
be contacted with ground.
LED 为静电敏感产品,使用时请佩带防静电手环,工作台做好防静电处理,机台设备等保证接地
Storage conditions 储存条件
Before opening the package 打开包装袋前:
1. The LEDs can be preserved for 1 year in condition of temperature no more than 30℃and humidity no more than 60%RH.
Recommended for moisture-proof foil bag with desiccant packaging methods and stored in the constant temperature and
humidity box.
在温度不超过30℃及湿度不超过60%RH 条件下,LED 可以保存一年,建议采用带干燥剂的防潮铝箔袋
的包装方式,存放在恒温恒湿箱中
2. Stored for more than 7 days, next time must be dehumidification, the dehumidification conditions is 75℃with 12hours.
存放时间超过7 天的,下次使用时必须进行除湿,除湿条件为75℃12 小时
After opening the package 打开包装后:
1. The SMD LEDs should be run out with 24hours in condition of temperature no more than 30℃and humidity nomore than
60%RH. The rest products should be pressurized in vacuum condition with desiccants. Stored for more than 7 days, next
time also must be dehumidification, the dehumidification conditions is 75℃with 12hours 开封后,LED 在≤30℃,≤60%RH 相对湿度的条件下,24 小时内完成贴片作业,未用完的产品重新真空
密封,并放置在一个密封容器中,同时必须使用干燥剂。

存储超过7 天,下次使用时同样需要除湿操作,
除湿条件为75℃12 小时
2. The sealed storage products stock in the drying cabinet more for than one month, then must be dehumidified before used,
and the dehumidified conditions is 75℃24 hours.
密封的产品在干燥箱中存储超过1个月的,须经过深度除湿作业才能上线,除湿条件:75℃24小时
3. If the product does not vacuum sealed packaging, and in the air for more than 72 hours, this product must be removed from
the tape of reel and put into the steel plate to dehumidify with 150℃2 hours, then could ensure the quality of the product
after the soldering operation.
如果产品没有真空包装密封保存,且在空气中放置超过72小时,此产品必须从载带中拆出,放入钢盘进
行150℃2小时的除湿,之后进行回流焊作业才能保证产品品质。

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