Method of wire-bonding circuit chip to bonding pad
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专利名称：Method of wire-bonding circuit chip to
bonding pad
发明人：Te-Tsung Chuo,Hui-Chin Fang
申请号：US09590288
申请日：20000609
公开号：US06457235B1
公开日：
20021001
专利内容由知识产权出版社提供
专利附图：
摘要：An integrated circuit device includes a substrate with a contact unit, an
integrated circuit chip with a bonding pad unit, and a bonding wire interconnecting the bonding pad unit and the contact unit. The bonding wire has a electrical bonding contact
attached to the bonding pad unit, a first extension portion extending from the electrical bonding contact in a direction that inclines slightly and upwardly relative to a plane of the substrate toward the contact unit, and a second extension portion extending from the first extension portion and attached to the contact unit.
申请人：ADVANCED SEMICONDUCTOR ENGINEERING, INC.
代理机构：Greenblum & Bernstein, P.L.C.
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