07-Phenolic Resin Coated Natural Graphite Oxide as an Anode Material for Lithium Ion Batteries[1]
PCB专业英文单词
printed circuit 印制電路printed wiring 印制線路printed board 印制板printed circuit board 印制板電路printed wiring board 印制線路板printed component 印制元件printed contact 印制接點printed board assembly 印制板裝配board 板rigid printed board 剛性印制板flexible printed circuit 撓性印制電路flexible printed wiring 撓性印制線路flush printed board 齊平印制板metal core printed board 金屬芯印制板metal base printed board 金屬基印制板mulit-wiring printed board 多重布線印制板molded circuit board 模塑電路板discrete wiring board 散線印制板micro wire board 微線印制板buile-up printed board 積層印制板surface laminar circuit 表面層合電路板B2it printed board 埋入凸塊連印制板chip on board 載芯片板buried resistance board 埋電阻板mother board 母板daughter board 子板backplane 背板bare board 裸板copper-invar-copper board 鍵盤板夾心板dynamic flex board 動態撓性板static flex board 靜態撓性板break-away planel 可斷拼板cable 電纜flexible flat cable (FFC) 撓性扁平電纜membrane switch 薄膜開關hybrid circuit 混合電路thick film 厚膜thick film circuit 厚膜電路thin film 薄膜thin film hybrid circuit 薄膜混合電路interconnection 互連conductor trace line 導線flush conductor 齊平導線transmission line 傳輸線crossover 跨交edge-board contact 板邊插頭stiffener 增強板substrate 基底real estate 基板面conductor side 導線面component side 元件面solder side 焊接面printing 印制grid 網格pattern 圖形conductive pattern 導電圖形non-conductive pattern 非導電圖形legend 字符mark 標志base material 基材laminate 層壓板metal-clad bade material 覆金屬箔基材copper-clad laminate (CCL) 覆銅箔層壓板composite laminate 復合層壓板thin laminate 薄層壓板basis material 基體材料prepreg 預浸材料bonding sheet 粘結片preimpregnated bonding sheer 預浸粘結片epoxy glass substrate 環氧玻璃基板mass lamination panel 預制內層覆箔板core material 內層芯板bonding layer 粘結層film adhesive 粘結膜unsupported adhesive film 無支撐膠粘劑膜cover layer (cover lay) 覆蓋層stiffener material 增強板材copper-clad surface 銅箔面foil removal surface 去銅箔面unclad laminate surface 層壓板面base film surface 基膜面adhesive faec 膠粘劑面plate finish 原始光潔面matt finish 粗面length wise direction 縱向cross wise direction 模向cut to size panel 剪切板ultra thin laminate 超薄型層壓板A-stage resin A階樹脂B-stage resin B階樹脂C-stage resin C階樹脂epoxy resin 環氧樹脂phenolic resin 酚醛樹脂polyester resin 聚酯樹脂polyimide resin 聚亞胺樹脂bismaleimide-triazine resin 雙馬來亞胺三樹脂acrylic resin 丙烯酸樹脂melamine formaldehyde resin 三聚氰胺甲醛樹脂polyfunctional epoxy resin 多官能環氧樹脂brominated epoxy resin 溴化環氧樹脂epoxy novolac 環氧酚醛fluroresin 氟樹脂silicone resin 硅樹脂silane 硅烷polymer 聚合物amorphous polymer 無定形聚合物crystalline polamer 結晶現象dimorphism 雙晶現象copolymer 共聚物synthetic 合成樹脂thermosetting resin 熱固性樹脂thermoplastic resin 熱塑性樹脂photosensitive resin 感光性樹脂epoxy value 環氧值dicyandiamide 雙氰胺binder 粘結劑adesive 膠粘劑curing agent 固化劑flame retardant 阻燃劑opaquer 遮光劑plasticizers 增塑劑unsatuiated polyester 不飽和聚酯polyester 聚酯薄膜polyimide film (PI) 聚亞胺薄膜polytetrafluoetylene (PTFE) 聚四氟乙烯reinforcing material 增強材料glass fiber 玻璃纖維E-glass fibre E玻璃纖維D-glass fibre D玻璃纖維S-glass fibre S玻璃纖維glass fabric 玻璃布non-woven fabric 非織布glass mats 玻璃纖維墊yarn 紗線filament 單絲strand 絞股weft yarn 緯紗warp yarn 經紗denier 但尼爾warp-wise 經向thread count 織物經緯密度weave structure 織物組織plain structure 平紋組織grey fabric 壞布woven scrim 稀松織物bow of weave 弓緯end missing 斷經mis-picks 缺緯bias 緯斜crease 折痕waviness 雲織fish eye 魚眼feather length 毛圈長mark 厚薄段split 裂縫twist of yarn 捻度size content 浸潤劑含量size residue 浸潤劑殘留量finish level 處理劑含量size 浸潤劑couplint agent 偶聯劑finished fabric 處理織物polyarmide fiber 聚胺纖維aromatic polyamide paper 聚芳胺纖維紙breaking length 斷裂長height of capillary rise 吸水高度wet strength retention 溼強度保留率whitenness 白度ceramics 陶瓷conductive foil 導電箔copper foil 銅箔rolled copper foil 壓延銅箔annealed copper foil 退火銅箔thin copper foil 薄銅箔adhesive coated foil 涂膠銅箔resin coated copper foil 涂膠脂銅箔composite metallic material 復合金屬箔carrier foil 載體箔invar 殷瓦foil profile 箔（剖面）輪廓shiny side 光面matte side 粗糙面treated side 處理面stain proofing 防銹處理double treated foil 雙面處理銅箔shematic diagram 原理圖logic diagram 邏輯圖printed wire layout 印制線路布設master drawing 布設總圖computer aided drawing 計算機輔助制圖computer controlled display 計算機控制顯示placement 布局routing 布線layout 布圖設計rerouting 重布simulation 模擬logic simulation 邏輯模擬circit simulation 電路模擬timing simulation 時序模擬modularization 模塊化layout effeciency 布線完成率MDF databse 機器描述格式數據庫design database 設計數據庫design origin 設計原點optimization (design) 優化（設計）predominant axis 供設計優化坐標軸table origin 表格原點mirroring 鏡像drive file 驅動文件intermediate file 中間文件manufacturing documentation 制造文件queue support database 隊列支撐數據庫component positioning 元件安置graphics dispaly 圖形顯示scaling factor 比例因子scan filling 掃描填充rectangle filling 矩形填充region filling 填充域physical design 實體設計logic design 邏輯設計logic circuit 邏輯電路hierarchical design 層次設計top-down design 自頂向下設計bottom-up design 自底向上設計net 線網digitzing 數字化design rule checking 設計規則檢查router (CAD) 走（布）線器net list 網絡表subnet 子線網objective function 目標函數post design processing (PDP) 設計後處理interactive drawing design 交互式制圖設計cost metrix 費用矩陣engineering drawing 工程圖block diagram 方塊框圖moze 迷宮component density 元件密度traveling salesman problem 回售貨員問題degrees freedom 自由度out going degree 入度incoming degree 出度manhatton distance 曼哈頓距離euclidean distance 歐幾裏德距離network 網絡array 陣列segment 段logic 邏輯logic design automation 邏輯設計自動化separated time 分線separated layer 分層definite sequence 定順序conduction (track) 導線（通道）conductor width 導線（體）寬度conductor spacing 導線距離conductor layer 導線層conductor line/space 導線寬度/間距conductor layer No.1 第一導線層round pad 圓形盤square pad 方形盤diamond pad 菱形盤oblong pad 長方形焊盤bullet pad 子彈形盤teardrop pad 淚滴盤snowman pad 雪人盤V-shaped pad V形盤annular pad 環形盤non-circular pad 非圓形盤isolation pad 隔離盤monfunctional pad 非功能連接盤offset land 偏置連接盤back-bard land 腹（背）裸盤anchoring spaur 盤址land pattern 連接盤圖形land grid array 連接盤網格陣列annular ring 孔環component hole 元件孔mounting hole 安裝孔supported hole 支撐孔unsupported hole 非支撐孔via 導通孔plated through hole (PTH) 鍍通孔access hole 餘隙孔blind via (hole) 盲孔buried via hole 埋孔buried blind via 埋,盲孔any layer inner via hole 任意層內部導通孔all drilled hole 全部鑽孔toaling hole 定位孔landless hole 無連接盤孔interstitial hole 中間孔landless via hole 無連接盤導通孔pilot hole 引導孔terminal clearomee hole 端接全隙孔dimensioned hole 準尺寸孔via-in-pad 在連接盤中導通孔hole location 孔位hole density 孔密度hole pattern 孔圖drill drawing 鑽孔圖assembly drawing 裝配圖datum referan 參考基準。
机械制造基础英文词汇附表-总2要点
第一章金属切削中的基本知识切削运动——cutting motion工件——workpiece待加工表面——workpiece surface to be cut (machined)加工表面——cutting surface已加工表面——machined surface主运动——main motion进给运动——feeding motion合成切削运动——resultant cutting motion合成切削速度——resultant cutting speed切削参数——cutting parameters切削速度——cutting speed进给——feed进给速度——feeding speed背吃刀量——back engagement of the cutting edge前刀面——rake face后刀面——flank切削刃——tool cutting edge刀尖——tool nose (tip)参考系——reference system基面——tool reference plane工作基面——working reference plane切削平面——tool cutting edge plane工作切削平面——working cutting edge plane 主剖面——main section plane工作主剖面——working orthogonal plane法剖面——normal section plane横向进给剖面——transverse feed section plane 纵向进给剖面（背平面）——longitudinal section plane法剖面——normal section plane切深剖面——tool back plane工作切深剖面——working back plane前角——rake angle后角——clearance angle （relief angle）工作后角——working orthogonal clearance主偏角——tool cutting edge angle工作主偏角——working cutting edge angle副偏角——minor cutting edge angle工作副偏角——working minor cutting edge angle刃倾角——tool cutting edge inclination angle (inclined angle)工作刃倾角——working cutting edge inclination angle楔角——wedge angle刀尖角——tool included edge angle主切削刃——major cutting edge工作主切削刃——working major cutting edge 切削刃法剖面——cutting edge normal plane切削刃工作法剖面——working cutting edge normal plane副切削刃——tool minor cutting edge工作副切削刃——working minor cutting edge 副切削刃的主剖面——tool orthogonal plane of the minor cutting edge副切削刃的切削平面——tool cutting edge plane of the minor cutting edge副切削刃的基面——tool reference plane of the minor cutting edge切削层——cutting layer切削厚度——undeformed chip thickness( cutting layer thickness)切削宽度——width of uncut chip (cutting layer width)切削面积——cross-sectional area of uncut chip刀尖钝圆半径——corner radius正切削——orthogonal cutting斜切削——oblique cutting自由切削——free cutting非自由切削——constrained cutting刀具材料——tool cutting material硬度——hardness强度——strength韧性——toughness耐热性——heat resistance工艺性——forming property (特指成形性)经济性——economy property高速钢——high-speed steel硬质合金——carbide alloy涂层刀具——coated tool陶瓷——ceramics金刚石——diamond立方氮化硼——cubic boron nitride砂轮——grinding wheel磨料——abrasive material粒度——grain size油酸——oleic acid松脂——turpentine酚醛树脂——phenolic resin虫胶——shellac树脂——resinoid粘结剂——bond material气孔——porosity第二章金属切削过程中的基本规律及应用切削变形——cutting deformation带状切屑——ribbon chip挤裂切屑——cracked chip单元切屑——unit chip崩碎切屑——splintering chip相对滑移—— relative slide变形系数——deformation coefficient剪切屈服点——shear yielding point剪切角——angle of the shear plane积屑瘤——built-up edge切削合力——resultant tool force轴向进给抗力——axial thrust force径向切深抗力——radial thrust force主切削力——main cutting force水平分力——thrust component of the result tool force切削扭矩——cutting torque单位切削力——specific cutting force切削功率——power required to perform the machining operation单位切削功率——specific cutting power切削热——heat in metal cutting导热系数——thermal conductivity切削温度——machining temperature刀具磨损——tool wear正常磨损——normal wear磨粒磨损——abrasive wear粘结磨损——adhesive wear扩散磨损——diffusion wear相变磨损——phrase change wear氧化磨损——oxidized wear刀具耐用度——tool life月牙洼磨损深度——crate depth 经济耐用度——tool life for the minimum production cost最大生产率耐用度——tool life for the maximum production efficient换刀时间——tool-changing time切削时间——machining time工序工时——operation time单位时间内的金属切除量——metal-removal rate 一定耐用度下的切削速度——cutting speed giving a tool life of T辅助工时——nonproductive time加工性——machinability相对加工性——relative machinability切削液——cutting fluid第三章机械加工工艺基础知识技术条件——specification生产过程——manufacturing process零件加工工艺——process of a part工序——operation走刀——cutting pass安装——set up工位——operation position定位——location定位元件——location element圆柱支承钉——cylindrical support post支承板——support plate圆柱形定位销——cylindrical location pin削角销——rhombic pin定位心轴——location centeringV形块——V-shaped block楔块——wedge定位误差——location error公差——tolerance夹紧力——clamping force夹紧力方向——clamping direction夹紧力作用点——clamping position轨迹法——track machining method成形法——form machining method相切法——tangential machining method展成法——generating process method工艺规程——process route工艺过程卡——process sheet生产纲领——production expectation基准重合原则——principle of coincident locating surfaces夹具——fixture/jig千分尺——micrometer基准面——reference surface自由度——degree of freedom加工余量——allowance (material removal)表面粗糙度——surface roughness调质处理——quality treatment废品率——reject rates尺寸链——dimensional chain封闭环——resultant dimension组成环——component dimension增环——plus dimension减环——minus dimension极值法——extremum method上偏差——upper deviation下偏差——lower deviation概率法——probability method算术平均值——average arithmetic value相对分布系数——relative distribution coefficient 时间定额——time ration临界产量——critical output投资回收期——invest reclaim period第四章回转体零件加工工艺与装备机床——machine tool车床——lathe铣床——milling machine刨床——planer牛头刨床——shaping machine龙门刨床——planing machine镗床——boring machine钻床——drilling machine螺纹机床——screw thread machine拉床——broaching machine锯床——saw machine磨床——grinding machine普通车床——engine lathe落地车床——ground lathe立式车床——vertical lathe转塔（六角）车床——turret lathe多刀半自动车床——Semi-automatic lathe 仿形车床及仿形半自动车床——profiling lathe单轴自动车床——single-axis automatic lathe多轴自动车床——multi-axis automatic lathe多轴半自动车床——multi-axis semi automatic lathe 专门化车床——special-purpose lathe数控车床——CNC lathe立式——vertical摇臂——radial深孔——deep hole drills主轴箱——headstock刀架——tool post进给箱——feed-box溜板箱——apron尾座——tailstock床身——bed卡盘——chuck立柱——column工作台——worktable滑鞍——saddle光杆——feed rod丝杆——lead screw刀杆——tool arbor砂带磨削——belt grinding缓进磨削——creep-feed grinding横向进给磨削——plunge feed每齿进给量——feed per tooth扩孔core drilling钻台阶孔——step drilling锪孔——counter boring铰孔——reaming钻中心孔——center drilling深孔钻——gun drilling鞍形支座——saddle support镗杆端部支撑轴承——end support bearing for boring bar坐标镗床——jig boring machine金刚镗床——diamond boring machine麻花钻——twist drill直刃钻——straight-flute drill阶梯钻——step drill扁钻——spade drill枪钻——gun drill铰刀——reamer镗刀——boring tool平面——plane槽——groove螺旋面——spiral surface曲面——curved surfaces主轴——spindle刀轴——arbor横梁——transverse column吊架——cantilever纵向工作台——longitudinal table横向工作台——transverse table升降台——lift table圆柱铣——slab milling周铣——slab milling立铣——face milling端铣——end milling工艺——process烧结——agglomeration注塑——infusing气动夹具——pneumatic fixture液压夹具——hydraulic fixture电动夹具——electric fixture电磁夹具——electromagnetic fixture真空夹具——vacuum fixture自紧夹具——self-clamping fixture螺纹——screw thread齿轮——gear差分传动链——difference chain蜗杆——worm小齿轮——pinion刨齿——gear shaping花键孔——splined hole第5章非回转体加工工艺与装备铣削——milling周铣（周边铣削，圆柱铣削）——peripheral milling 端铣（端面铣削）——face milling立铣——end milling平面铣削——slab milling顺铣——down milling, climb milling逆铣——up milling, conventional milling铣刀——milling cutter, milling tool圆柱铣刀——peripheral cutter, cylindrical cutter端面铣刀——face mill, face cutter立铣刀，指铣刀——end mill 组合铣刀（三面刃铣刀）——face and side cutter 尖齿铣刀——pointed tool, pointed cutter铲齿铣刀——relieving tool, relieving cutter成形铣刀——formed cutter铣床——milling machine, miller万能卧式升降台铣床——horizontalknee-and-column type milling machine立式单轴铣床——vertical single spindle milling machine落地铣床——floor type milling machine龙门铣床——planer-type milling machine工具铣床——tool milling machine仿形铣床——profile milling machine, duplicating milling machine牛头刨上刨削——shaping龙门刨上刨削——planing插削——slotting刨刀——planer tool插刀——slotting tool牛头刨床——shaper龙门刨床——planning machine, planer插床——slotting machine, slotter拉削——broaching拉刀——broach拉床——broaching machine磨削——grinding砂轮——grinding wheel, abrasive wheel, emery wheel油石——abrasive stick周边磨削——peripheral grinding平面磨削——face grinding成形磨削——form grinding磨床——grinder光学曲线磨床——optical contour grinder, optical curve grinding machine夹具——fixture偏心轮—eccentric wheel电磁吸盘——electro magnetic chuck虎钳——vice连杆——link rod, connecting rod机架——chassis, frame台阶轴——stepped shaft曲轴——crank shaft花键轴——spline shaft摩擦轮——friction pulley, friction wheel键槽——key slot, key seat, key way, key groove燕尾槽——dovetail groove链轮——chain wheel, sprocket棘轮——ratchet wheel第六章机械加工精度加工精度——machining accuracy加工误差——machining error工艺系统——processing system原始误差——original errors静态加工误差——static processing error动态加工误差——dynamic processing error加工原理误差——Principle error调整误差——Adjustment error主轴回转误差——spindle rotational error导轨误差——guideway error传动链误差——transmission error静态刚度——static stiffness工艺系统的热变形——thermal deformation of the processing system系统误差——system error随机误差——random error分布曲线法——method of error distribution curve正态分布曲线——normal distribution graph误差补偿法——error compensation误差分组法——error grouping误差转移法——Error transforming“就地加工”法——Machining on spot误差平均法——error average method控制误差法——error controlling method第七章机械加工表面质量表面波纹度——surface waviness金相组织变化——metallurgical structure change残余应力——Residual stress疲劳强度——fatigue strength应力集中——stress concentration冷作硬化——work-hardening抗腐蚀——anti-erosion砂轮的修整——dressing of grinding wheel金相组织——metallurgical structure 回火烧伤——tempering burn淬火烧伤——quenching burn退火烧伤——annealing burn热态塑性变形——hot plastic deformation冷态塑性变形——cold plastic deformation金相组织的变化——variation of metallurgical structure磨削裂纹——grinding crack冷作硬化——work cold hardening喷丸——shot peening滚压——press rolling强迫振动——forced vibration自激振动——self-excited vibration。
PCB专业术语中英文翻译
来源：风荷雨莲作者：风荷雨莲发布时间：2007-11-27 00:00:00 点击次数：01、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismale imide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：intersti t ial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB专业用语-英汉对照
PCB专业用语-英汉对照：一、综合词汇:1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board 10、单面印制板：single-sided printed board(ssb) 11、双面印制板：double-sided printed board(dsb) 12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board 14、多层印制线路板：mulitlayer prited wiring board 15、刚性印制板：rigid printed board 16、刚性单面印制板：rigid single-sided printed borad 17、刚性双面印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed board 19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board 21、挠性单面印制板：flexible single-sided printed board 22、挠性双面印制板：flexible double-sided printed board 23、挠性印制电路：flexible printed circuit (fpc) 24、挠性印制线路：flexible printed wiring 25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、金属基印制板：metal base printed board 31、多重布线印制板：mulit-wiring printed board 32、陶瓷印制板：ceramic substrate printed board 33、导电胶印制板：electroconductive paste printed board 34、模塑电路板：molded circuit board 35、模压印制板：stamped printed wiring board 36、顺序层压多层印制板：sequentially-laminated mulitlayer 37、散线印制板：discrete wiring board 38、微线印制板：micro wire board 39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board 42、表面层合电路板：surface laminar circuit (slc) 43、埋入凸块连印制板：b2it printed board 44、多层膜基板：multi-layered film substrate(mfs) 45、层间全内导通多层印制板：alivh multilayer printed board 46、载芯片板：chip on board (cob) 47、埋电阻板：buried resistance board 48、母板：mother board 49、子板：daughter board 50、背板：backplane 51、裸板：bare board 52、键盘板夹心板：copper-invar-copper board 53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board 55、可断拼板：break-away planel 56、电缆：cable 57、挠性扁平电缆：flexible flat cable (ffc) 58、薄膜开关：membrane switch 59、混合电路：hybrid circuit 60、厚膜：thick film 61、厚膜电路：thick film circuit 62、薄膜：thin film 63、薄膜混合电路：thin film hybrid circuit 64、互连：interconnection 65、导线：conductor trace line 66、齐平导线：flush conductor 67、传输线：transmission line 68、跨交：crossover 69、板边插头：edge-board contact 70、增强板：stiffener 71、基底：substrate 72、基板面：real estate 73、导线面：conductor side 74、元件面：component side 75、焊接面：solder side 76、印制：printing 77、网格：grid 78、图形：pattern 79、导电图形：conductive pattern 80、非导电图形：non-conductive pattern 81、字符：legend 82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-cladlaminate 7、复合层压板：composite laminate 8、薄层压板：thin laminate 9、金属芯覆铜箔层压板：metal core copper-clad laminate 10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material 13、预浸材料：prepreg 14、粘结片：bonding sheet 15、预浸粘结片：preimpregnated bonding sheer 16、环氧玻璃基板：epoxy glass substrate 17、加成法用层压板：laminate for additive process 18、预制内层覆箔板：mass lamination panel 19、内层芯板：core material 20、催化板材：catalyzed board ,coated catalyzed laminate 21、涂胶催化层压板：adhesive-coated catalyzed laminate 22、涂胶无催层压板：adhesive-coated uncatalyzed laminate 23、粘结层：bonding layer 24、粘结膜：film adhesive 25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film 26、无支撑胶粘剂膜：unsupported adhesive film 27、覆盖层：cover layer (cover lay) 28、增强板材：stiffener material 29、铜箔面：copper-clad surface 30、去铜箔面：foil removal surface 31、层压板面：unclad laminate surface 32、基膜面：base film surface 33、胶粘剂面：adhesive faec 34、原始光洁面：plate finish 35、粗面：matt finish 36、纵向：length wise direction 37、模向：cross wise direction 38、剪切板：cut to size panel 39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl) 40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl) 41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates 44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates 45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates 48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates 49、超薄型层压板：ultra thin laminate 50、陶瓷基覆铜箔板：ceramics base copper-clad laminates 51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料:1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin 4、环氧树脂：epoxy resin 5、酚醛树脂：phenolic resin 6、聚酯树脂：polyester resin 7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin 9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin 11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin 13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin 15、硅树脂：silicone resin 16、硅烷：silane 17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic 23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin 25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent (wpe) 27、环氧值：epoxy value 28、双氰胺：dicyandiamide 29、粘结剂：binder 30、胶粘剂：adesive 31、固化剂：curing agent 32、阻燃剂：flame retardant 33、遮光剂：opaquer 34、增塑剂：plasticizers 35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester 37、聚酰亚胺薄膜：polyimide film (pi) 38、聚四氟乙烯：polytetrafluoetylene (ptfe) 39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep) 40、增强材料：reinforcing material 41、玻璃纤维：glass fiber 42、 e玻璃纤维：e-glass fibre 43、 d玻璃纤维：d-glass fibre 44、 s玻璃纤维：s-glass fibre 45、玻璃布：glass fabric 46、非织布：non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝：filament 50、绞股：strand 51、纬纱：weft yarn 52、经纱：warp yarn 53、但尼尔：denier 54、经向：warp-wise 55、纬向：weft-wise, filling-wise 56、织物经纬密度：thread count 57、织物组织：weave structure 58、平纹组织：plain structure 59、坏布：grey fabric 60、稀松织物：woven scrim 61、弓纬：bow of weave 62、断经：end missing 63、缺纬：mis-picks 64、纬斜：bias 65、折痕：crease 66、云织：waviness 67、鱼眼：fish eye 68、毛圈长：feather length 69、厚薄段：mark 70、裂缝：split 71、捻度：twist of yarn 72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size 76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 79、聚酯纤维非织布：non-woven polyester fabric 80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper 82、断裂长：breaking length 83、吸水高度：height of capillary rise 84、湿强度保留率：wet strength retention 85、白度：whitenness 86、陶瓷：ceramics 87、导电箔：conductive foil 88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil (ed copper foil) 90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil 94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil (rcc) 96、复合金属箔：composite metallic material 97、载体箔：carrier foil 98、殷瓦：invar 99、箔（剖面）轮廓：foil profile 100、光面：shiny side 101、粗糙面：matte side 102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil四、设计:1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae) 10、计算机辅助测试：computer-aided test.(cat) 11、电子设计自动化：electric design automation .(eda) 12、工程设计自动化：engineering designautomaton .(eda2) 13、组装设计自动化：assembly aided architectural design. (aaad) 14、计算机辅助制图：computer aided drawing 15、计算机控制显示：computer controlled display .(ccd) 16、布局：placement 17、布线：routing 18、布图设计：layout 19、重布：rerouting 20、模拟：simulation 21、逻辑模拟：logic simulation 22、电路模拟：circit simulation 23、时序模拟：timing simulation 24、模块化：modularization 25、布线完成率：layout effeciency 26、机器描述格式：machine descriptionm format .(mdf) 27、机器描述格式数据库：mdf databse 28、设计数据库：design database 29、设计原点：design origin 30、优化（设计）：optimization (design) 31、供设计优化坐标轴：predominant axis 32、表格原点：table origin 33、镜像：mirroring 34、驱动文件：drive file 35、中间文件：intermediate file 36、制造文件：manufacturing documentation 37、队列支撑数据库：queue support database 38、元件安置：component positioning 39、图形显示：graphics dispaly 40、比例因子：scaling factor 41、扫描填充：scan filling 42、矩形填充：rectangle filling 43、填充域：region filling 44、实体设计：physical design 45、逻辑设计：logic design 46、逻辑电路：logic circuit 47、层次设计：hierarchical design 48、自顶向下设计：top-down design 49、自底向上设计：bottom-up design 50、线网：net 51、数字化：digitzing 52、设计规则检查：design rulechecking 53、走（布）线器：router (cad) 54、网络表：net list 55、计算机辅助电路分析：computer-aided circuit analysis 56、子线网：subnet 57、目标函数：objective function 58、设计后处理：post design processing (pdp) 59、交互式制图设计：interactive drawing design 60、费用矩阵：cost metrix 61、工程图：engineering drawing 62、方块框图：block diagram 63、迷宫：moze 64、元件密度：component density 65、巡回售货员问题：traveling salesman problem 66、自由度：degrees freedom 67、入度：out going degree 68、出度：incoming degree 69、曼哈顿距离：manhatton distance 70、欧几里德距离：euclidean distance 71、网络：network 72、阵列：array 73、段：segment 74、逻辑：logic 75、逻辑设计自动化：logic design automation 76、分线：separated time 77、分层：separated layer 78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.1 7、圆形盘：round pad 8、方形盘：square pad 9、菱形盘：diamond pad 10、长方形焊盘：oblong pad 11、子弹形盘：bullet pad 12、泪滴盘：teardrop pad 13、雪人盘：snowman pad 14、 v形盘：v-shaped pad 15、环形盘：annular pad 16、非圆形盘：non-circular pad 17、隔离盘：isolation pad 18、非功能连接盘：monfunctional pad 19、偏置连接盘：offset land 20、腹（背）裸盘：back-bard land 21、盘址：anchoring spaur 22、连接盘图形：land pattern 23、连接盘网格阵列：land grid array 24、孔环：annular ring 25、元件孔：component hole 26、安装孔：mounting hole 27、支撑孔：supported hole 28、非支撑孔：unsupported hole 29、导通孔：via 30、镀通孔：plated through hole (pth) 31、余隙孔：access hole 32、盲孔：blind via (hole) 33、埋孔：buried via hole 34、埋/盲孔：buried /blind via 35、任意层内部导通孔：any layer inner via hole (alivh) 36、全部钻孔：all drilled hole 37、定位孔：toaling hole 38、无连接盘孔：landless hole 39、中间孔：interstitial hole 40、无连接盘导通孔：landless via hole 41、引导孔：pilot hole 42、端接全隙孔：terminal clearomee hole 43、准表面间镀覆孔：quasi-interfacing plated-through hole 44、准尺寸孔：dimensioned hole 45、在连接盘中导通孔：via-in-pad 46、孔位：hole location 47、孔密度：hole density 48、孔图：hole pattern 49、钻孔图：drill drawing 50、装配图：assembly drawing 51、印制板组装图：printed board assembly drawing 52、参考基准：datum referance。
线路板英语词汇
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：multilayer printed board(mlb)13、多层印制电路板：multilayer printed circuit board14、多层印制线路板：multilayer printed wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed broad17、刚性双面印制板：rigid double-sided printed broad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：multi-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electro conductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated multilayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：build-up printed board40、积层多层印制板：build-up multilayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive face34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad laminates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline phenomena20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adhesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaque34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whiteness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：elements diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrate manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circuit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout efficiency26、机器描述格式：machine description format .(mdf)27、机器描述格式数据库：mdf database28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics display40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digital52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost matrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：maze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：Manhantton distance70、欧几里德距离：Euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：nonfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：tooling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearance hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum reference。
PCB材料英语
38、 聚四氟乙烯：polytetrafluoetylene (ptfe)
39、 聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)
40、 增强材料：reinforcing material
41、 玻璃纤维：glass fiber
42、 e玻璃纤维：e-glass fibre
43、 d玻璃纤维：d-glass fibre
44、 s玻璃纤维：s-glass fibre
45、 玻璃布：glass fabric
46、 非织布：non-woven fabric
47、 玻璃纤维垫：glass mats
48、 纱线：yarn
91、 退火铜箔：annealed copper foil
92、 压延退火铜箔：rolled annealed copper foil (ra copper foil)
93、 薄铜箔：thin copper foil
94、 涂胶铜箔：adhesive coated foil
95、 涂胶脂铜箔：resin coated copper foil (rcc)
12、 溴化环氧树脂：brominated epoxy resin
13、 环氧酚醛：epoxy novolac
14、 氟树脂：fluroresin
15、 硅树脂：silicone resin
16、 硅烷：silane
17、 聚合物：polymer
18、 无定形聚合物：amorphous polymer
85、 白度：whitenness
86、 陶瓷：ceramics
线路板常用术语资料
一、线路板常用术语1． Warp与Fill：经向(Warp),指大料(或Prepreg)的短方向，纬向(Fill)指大料(或Prepreg)的长方向。
2．横料与直料：多层板开料时将Panel长方向与大料长方向一致的称为直料；将Panel长方向与大料短方向一致的称为横料；3． Material Thickness(Board Thickness)：客户图纸或Spec无特别说明的均指成品厚度(Finished Thickness)，Material Thickn ess无Tolerance要求时, 选用厚度最接近的板料；4． Copper Thickness：客户图纸或Spec无特别说明情况下，均指成品线路铜厚度；5． Pitch：节距，相邻导体中心之间的距离；6． Solder Mask Clearance：绿油开窗的直径；7．LPI 阻焊油： Liquid Photo-Imaging 液态感光成像阻焊油,俗称湿绿油；8．SMOBC： Solder Mask On Bare Copper绿油丝印在光铜面上，一般有 SMOBC+HAL/Entek/ENIG等工艺；9．BGA： Ball Grid Array (BGA球栅列阵)：集成电路的封装形式，其输入输出点是在元件底面上按栅格样式排列的锡球；10． Blind via(盲孔)：PCB的外层与内层之间的导电连接，不继续通到板的另一面；Buried via(埋孔)：PCB的两个或多个内层之间的导电连接(即从外层看不见的)；11． Positive Pattern：正像图形、正片、照相原版、生产底版上的导电图形为不透明时的图形；12． Negative Pattern：负像图形，负片，照相原版、生产底版上的导电图形是透明时的图形。
我们一般称直蚀线路菲林、绿油挡墨菲林、干/UV绿油菲林为负片菲林；需要电镀线路菲林、湿绿油菲林、字符菲林、碳油菲林、兰胶菲林称为正片菲林；13． FPT： Fine-Pitch Technology 精细节距技术, 表面贴片元件包装的引角中心间隔距离为0.025”(0.0635mm)或更少；14． Lead Free：无铅；15． Halogen Free：无卤素，指环保型材料；16． RoHS：Restriction of Use of Hazardous Substances 危险物质的限制使用，禁铅、禁汞、禁镉（Cadmium）、禁六价铬（Hexava lent Chromium）与禁溴耐燃剂（Flame Retardents）；17． OSP： Organic Solderability Protector 防氧化；18． CTI： Comparative Tracking Index 相对漏电起痕指数，即材料表面能经受住50滴电解液而没有形成漏电痕迹的最高电压值；19． PTI： Proof Tracking Index 耐漏电起痕指数，即材料表面能经受住50滴电解液而没有形成漏电痕迹的耐电压值用V表示；20． Tg： Glass Transition temperature 玻璃态转化温度; 21．试孔纸：将各测试点、管位、以1：1打印出来的图纸; 22．测试点：一般指独立的PTH孔、SMT PAD、金手指、Bonding手指、IC手指、BGA焊接点、以及客户于插件后测试的测试点; 23．测试端点：线路网络中不能再向前延伸的测试点。
中英文对照的PCB专业用语
中英文对照地PCB专业用语作者：深圳村村长分类:英汉词汇大全提交日期：2007-4-220:41:00 | 访问量：366一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb>5、印制线路板：printed wiring board(pwb>6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb>11、双面印制板：double-sided printed board(dsb>12、多层印制板：mulitlayer printed board(mlb>13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc>24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printedboard26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printedboard34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum>41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc>43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs>45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob>47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc>58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl>5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay>28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose papercopper-cladlaminates(phenolic/paper ccl>40、环氧纸质覆铜箔板：epoxide cellulose paper copper-cladlaminates (epoxy/paper ccl>41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-cladlaminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glasscloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glassreinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-cladlaminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-cladlaminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewoven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabriccopper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-cladlaminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材地材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe>27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi>38、聚四氟乙烯：polytetrafluoetylene (ptfe>39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylenecopolymer film (fep>40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil>90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil>93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc>96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔<剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad>7、计算机辅助制造：computer-aided manufacturing.(cam>8、计算机集成制造：computer integrat manufacturing.(cim>9、计算机辅助工程：computer-aided engineering.(cae>10、计算机辅助测试：computer-aided test.(cat>11、电子设计自动化：electric design automation .(eda>12、工程设计自动化：engineering designautomaton .(eda2>13、组装设计自动化：assembly aided architectural design. (aaad>14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlleddisplay .(ccd>16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf>27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化<设计）：optimization (design>31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走<布）线器：router (cad>54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp>59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线<通道）：conduction (track>2、导线<体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹<背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth>31、余隙孔：access hole32、盲孔：blind via (hole>33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh>36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance b5E2RGbCAP。
酚醛树脂(phenolic resin)
酚醛树脂（phenolic resin）1. introduction:Phenolic resin is the world's first found and thermosetting synthetic resin industry, as raw materials, synthesis process and convenient, has the mechanical strength and good heat resistance, has excellent mechanical properties and electrical properties, has the characteristics of high temperature creep resistance heat resistance, flame retardant, it is still widely used in plastics, friction material, adhesive, coating, casting resin, foam and other fields. However, with the rapid development of industrial economy, more and more requirements for the properties of phenolic resin have been put forward. The reaction mechanism, structure and properties of phenolic resin are still deeply studied. Many achievements have been made in toughening, reinforcing and modifying of phenolic resin. A variety of phenolic composite materials have also been listed as human engineering plastics series. Phenolic hydroxyl groups and methylene groups in phenolic resin structure are easily oxidized, so that their heat resistance is affected, and phenolic resin is brittle after curing. Therefore, until now, how to improve phenolic resin and apply it to industry is still an important topic.2. technology development:The development of bakelite, after all to the modification of phenolic resin modified phenolic resin, now mainly in the following aspects: 1. using natural plant oil modified phenolic resin; 2. using thermal plastic resin modified phenolic resin;3. low molecular chemical modified phenolic resin; modifiedphenolic resin 4. thermosetting resin; 5. rubber modified phenolic resin; 6. nano material toughened phenolic resin; 7. thermotropic liquid crystal toughened phenolic resin.2.1 natural vegetable oil modified phenolic resinThe natural plant oil modified phenolic resin is chemically modified, flexible long chain molecular structure in vegetable oil containing double bond or conjugated triple bond, by double or triple bond phenolic resin synthesized in the reaction process, the flexible long chain into rigid phenolic molecule chain, play in the role of toughening, thereby improving the phenolic resin brittle.2.1.1 cashew nut shell oil modified phenolic resinCashew nut shell oil is a by-product of cashew processing, and it is a very rich biological resource. Compared with phenol, cashew nut shell oil is much cheaper. From the structure of main components can be seen, the characteristics of cashew oil both phenolic compounds, aliphatic compounds and flexible, with the modified phenolic resin, heat resistance and toughness were significantly improved and modified products used for friction materials, friction performance, flexible film formed on the surface of carbonization process of friction easy to fall off, the friction and heat state of the material surface evenly, ensure stable friction properties. A cashew oil modified phenolic resin was synthesized by Novalac Liu Xuemei, the middle shell oil content is continuous, notched impact strength and flexural strength of cashew oil modified phenolic resins and molding materials were increased by 10.7% and 14.8%. Thisis because the long alkane chain structure of cashew shell oil in existence, the equivalent in phenolic resin matrix are introduced in the flexible chain, to the toughening effect of phenolic resin, so as to increase the notched impact strength of molding materials prepared and bending strength.2.1.2 tung oil modified phenolic resinWhen tung oil reacted with phenol, tung oil became positive ion under the action of acid catalyst, and then reacted with phenol instead of phenol. When the ratio of phenol / tung oil is greater than 6, the interpenetrating network of phenolic resin modified by tung oil and tung oil is obtained, thus improving the toughness of phenolic resin. Shang Shibin with tung oil, bismaleimide maleic anhydride, reaction with phenolic resin, prepared Eleostearic Acid Anhydride imide phenolic resin by thermal analysis method of tung oil anhydride imide resin at 170 degrees bake for 4 h, the measured temperature index of up to 165.8 DEG C, indicating a good heat-resistant resin. Li Chao of tung oil / phenolic resin and nano SiO2 / 2 phenolic / tung oil modified phenolic resin were studied. The results show that the decomposition temperature in 420 degrees Celsius above their initial heat, nano SiO2 / tung oil / phenolaldehyde system heat resistance is better than that of phenolic / tung oil, and 600 C, the former than the latter in each a focus on the loss of heat temperature has increased by 30 to 50 DEG C. A friction material made of this tung oil modified phenolic resin,Not only the friction coefficient of low temperature (100~200 DEG C) remains at 0.45 ~ 0.51, but also the friction coefficient at high temperature (200~300 DEG C) is up to 0.38 ~ 0.51, andthe friction factor recovery performance is good, and can be maintained at more than 0.40.2.1.3 Catalpol modified phenolic resinThe phenolic resin modified by catalpa oil is a kind of resin which reacts the excess phenol with vegetable oil under acidic conditions, and then reacts with formaldehyde under alkaline condition to produce the resin. The principle is similar to that of Tung oil. It was found that the toughness and heat resistance of phenolic resin modified by catalpa oil were improved.2.1.4 linseed oil modified phenolic resinLinseed oil is eighteen carbon three acid esters of glycerol, 3 non conjugated double bonds in the molecule, in the presence of acid and linseed oil non conjugated three ene of nuclear phenol alkylation reaction, obtained linseed oil modified phenolic resin, improve the toughness of resin. Study on phenolic resin modified by linseed oil on Yuan Xinhua's show in 320 ~ 600 DEG C linseed oil modified phenolic resin was 53.11%, while the ordinary phenolic resin 73.51% weight loss; the peak temperature of thermal decomposition, common phenolic resin 400 ~ 425 and 540 ~ 600 DEG C, and linseed oil modified is 440 ~ 470 C and 600 to 660 DEG C. Linseed oil modified phenolic resin for testing wear properties and mechanical properties of friction material showed that the modified resin adhesion and toughness are improved, the friction coefficient of the material is large and stable, low wear rate, impact strength, hardness, can be used as matrix resin for high performance friction materials.2.2 thermoplastic resin modified phenolic resinThe blending of thermoplastic resin with phenolic resin is a simple and easy way to strengthen and toughen. Thermoplastic resins for strengthening and toughening include polyether, polyamide, polyvinyl alcohol and polyvinyl acetals.2.2.1 polyether modified phenolic resinGe Dongbiao et al modified phenolic resins with a series of different molecular weight polyethylene glycol (PEG) and active polyethers. The tensile strength and elongation at break of PEG modified phenolic resin begin to increase with the increase of molecular weight of PEG. When the molecular weight is 1000, the peak value is reached, and then decreases with the increase of molecular weight of PEG. For the same molecular weight PEG and active polyether, the tensile strength and elongation at break of the modified polyether are better than those of the corresponding PEG modification. Among them, the tensile strength and elongation of PEG1000 modified phenolic resin 11.546MPa and 2.358% respectively; the tensile strength and elongation of 1000 active polyether modified phenolic resin 19.032MPa and 3.779% respectively. In addition, the effect of toughening modification of active polyether is better than that of carboxyl terminated nitrile rubber. This is mainly because the hydroxyl of -NCO based active polyether resin reaction more easily and makes the introduction of flexible ether phenolic resin chain network system, and the reaction probability of hydroxy carboxyl and hydroxyl of PEG1000 resin and carboxyl terminated nitrile rubber in the very small, tend to be morephysical modification.2.2.2 polyamide modified phenolic resinPolyamide has good toughness and mechanical properties. It can be co cured with phenolic resin or form a partially interpenetrating network structure to improve mechanical properties of the resin. Gao Yuejing, with three yuan of nylon modified phenolic resin was found in modified phenolic resin system, nylon as dispersed phase, phenolic resin as continuous phase copolymerization of dispersion phase particle size distribution was narrow, the mechanical properties of plastic is much better than that of blends of plastic material. The impact strength of modified nylon resin modified by unmodified resin, blending three yuan nylon and copolymerization three yuan is 57 KJ/m2, 47.1 KJ/m2 and 112 KJ/m2 respectively. The properties of copolymer modified resins are best due to the formation of graft phase copolymers during the synthesis and curing of modified resins. In addition, the phenolic resin toughened with nylon 3 has obtained good results. The nylon 3 molecule contains amide groups which react with hydroxymethyl groups in the phenolic resin, thereby improving the impact toughness and adhesion of the phenolic resin, and maintaining the advantages of the phenolic resin. The impact strength of the resin before and after modification is 3.5 to 4.5KJ/m2 and 5~12 KJ/m2 respectively, and the tensile strength is 7 to 11MPa and 15 to 20MPa respectively.2.2.3 polyvinyl alcohol modified phenolic resinIn the curing process of phenolic resin, if the PVA is added, the hydroxyl groups on the polyvinyl alcohol will react with the hydroxymethyl group of the phenolic polymer to form the graft copolymer. Jiang Detang in the development of a new HF- I modified epoxy resin, adding polyvinyl alcohol modifier. The results show that the addition of modifier to improve resin adhesion, improve the brittleness of phenolic resin, reduce the curing rate, thereby reducing the molding pressure, the toughening effect of phenolic resin on. However, the amount of use should not be too high, otherwise it will affect its strength.2.2.4 polyvinyl butyral modified phenolic resinThe phenolic resin modified with polyvinyl alcohol acetal is a modified phenolic resin which is applied earlier in industry. Under heating conditions, hydroxyl groups in polyvinyl acetals can undergo dehydration reactions with hydroxyl groups in phenolic resins to form graft or block copolymers. Polyvinyl alcohol acetal can improve the brittleness of phenolic resin, improve adhesion and mechanical properties, and reduce molding pressure. However, because of the introduction of longer fat chains in the structure of phenolic resins, heat resistance is affected. In order to improve the heat resistance, the polyvinyl alcohol acetal with higher heat resistance is often used, and a certain proportion of organosilicon monomer is added.2.3 low molecular chemical modified phenolic resin2.3.1 dicarboxylic acid modified phenolic resinThe molecular weight of the polymer molecules can also be used to improve the brittleness of resole resin (DA4), adipic acid, suberic acid (DA6), sebacic acid (DA8) and twelve alkyl acid (DA10) can be used to improve the brittleness of resole resin.A study found that the elasticity of dicarboxylic acid and resole resin in curing process in the reaction of ester bond formation, and also can be formed in the dibasic acid ester bond of carboxyl and hydroxyl methyl reaction into phenolic resin in brittle tensile strength of modified resin, toughness and fracture elongation increased with the increase of DA8 content, but the content in per gram of resin DA8 is over 0.014mol the performance decreased. Indicating the incorporation of flexible groups containing dibasic acid can improve the brittleness of resin. The performance of the modified resin decreased after the content of DA8 exceeded 0.014mol, indicating that more DA8 would lead to a decrease in the properties of the resin, or an unreacted DA8 would become defective in phase separation. When the phenolic resin was modified with DA6 with the best molecular chain length, the tensile strength of the resin increased by 54% and the toughness increased by 64%.2.3.2 halogenated phenolic resin modified by cyanogenLinear phenolic resins can react with cyanogen halides to form phenolic three - triazine resins. Novolac resin first with cyanogen bromide and three yuan amine reaction of Novolac Cyanate Ester and Novolac Cyanate Ester in the heat under the action of the cyclization reaction of three, eventually formingthree phenolic cyanate resin mesh structure. Phenol three Benzoxazine Resin has the following characteristics: the solubility of melt viscosity and gel time length, thermal oxidative stability, long-term in a low boiling solvent high low, under different curing conditions of Tg can reach 399 DEG C, polyimide system elongation and fracture mechanics with high performance, low toxicity, low the flame retardancy and smoke rate. At the same time, the network structure of phenolic three triazine contains tenacity ether bond, so it has better toughness after modification.2.3.3 molybdenum modified phenolic resinMolybdenum phenolic resin (Mo2PF) is a modified phenolic resin in which the metal element molybdenum is chemically bonded to the main molecular chain of the phenolic resin by chemical reaction. Is the reaction by molybdate and phenol in the presence of catalyst into molybdate benzene ester, phenyl ester and molybdate addition reaction and condensation reaction with formaldehyde, generation of phenolic resin, after cooling is a green solid, with the increase of molybdenum content in the resin resin, the initial decomposition temperature rise. Liu Xiaohong et al made aluminum phenolic resin with aluminum modifier, phenol and formaldehyde as main raw materials. The metal molybdenum could enter the molecular chain of phenolic resin, and the great bonding O - MO - O bond could connect the benzene ring to improve the heat resistance. The thermal decomposition temperature of modified phenolic resin prepared by this method can reach 522 DEG C, and the weight loss is only 17.5% at 600 centigrade,Other properties are comparable to that of ordinary phenolic resins. In addition, the in situ polymerization method was used to improve the heat resistance, impact properties and tensile properties of the molybdenum phenolic resin /TiO2 nanocomposite by filling and modifying the surface treated nano TiO2. Zhang Shuangqing with phenol and formaldehyde in the first synthesis of hydroxymethyl phenol, and molybdic acid and hydroxymethyl by esterification reaction to obtain a new thermosetting phenolic resin and its carbon residue rate was 56.31%, the rate of 13 percentage points higher than the average carbon residue of thermosetting phenolic resin.2.3.4 boron modified phenolic resinThe modification of phenolic resin with boron compounds, the change of its structure, the formation of B - O bond with higher bond energy and the formation of boron - containing three - direction crosslink structure are one of the effective methods to improve its heat resistance. Che Jianfei by in situ synthesis method with TiO2 nanoparticles added to the boron phenolic resin, can significantly improve the heat resistance and toughness, when 5% TiO2 was added, the initial decomposition temperature is increased by about 150 degrees, the impact strength increased 231%. In addition, the processing technology of modified phenolic resin was also improved obviously. The introduction of boron is also beneficial to improve the flame retardancy of phenolic resin. Modified phenolic resin with boric acid and Aman Chang [16], the product still has a solid residue 75.3% in 700.8 DEG, 900 DEG C without decomposition residue is still above 64%, far higher than similar foreign products (700 C solid residue 63%). Theflexural strength, flexural modulus and impact strength of the composites obtained by Qiu Jun and other carbon fiber composite boron phenolic resins have been greatly improved. Tung oil, high performance double boron modified phenolic resin was synthesized by two steps such as Wang Manli, used it as a non asbestos braided brake belt has good friction performance of matrix resin, reached the level of similar foreign products.2.3.5 amine modified phenolic resinIs the main aromatic amine compounds and total phenol and formaldehyde condensation reaction in the presence of catalyst, introducing aromatic amine unit structure and good heat resistance in the structure of the phenolic resin, aromatic amines are commonly used melamine and melamine methylol compound and aniline. Amine modified phenolic resin, the heat resistance is improved, thermogravimetric analysis results show that aniline modified phenolic resin thermal decomposition temperature is 410 DEG C, melamine modified resin is 438 DEG, 380 DEG C than the pure phenolic resin to improve its heat resistance is high, reason is the introduction of a more stable heterocyclic the construction and curing resin crosslinking density increased. The prepared friction material has good friction property at high temperature, and it is a common modification method.2.3.6 silicone modified phenolic resinSilicone modified phenolic resin has high heat resistance, thermal stability, toughness and other excellent properties, the modified method is: the phenolic resin is reacted withorganosilicon compounds containing alkoxy groups, forming a three-dimensional network structure containing silicon oxygen bond, there is a competitive reaction from poly phenolic reaction process, so two kinds of reactivity is the key to the success of the modified. Allyl phenolic resin reacted with organosilicon compound to form organosilicon modified phenolic resin with excellent heat resistance. The tribological properties of the friction material modified with silicone resin are stable and the wear rate is low. The friction coefficient varies little (=0.136 ~ 0.140) at the temperature range of 100 ~ 350 DEG CPhenolic resin modified by 2.3.7 aromaticsThe modified aromatic hydrocarbons are toluene, xylene, substituted benzene, naphthalene and so on. The modified principle is introduced so that the stability of the aromatic molecules increased, increased rigidity, thereby improving the heat resistance modification methods were as follows: the main aromatic hydrocarbons (Ar) reacts with formaldehyde to produce aromatic alcohols, and then generate the phenol and formaldehyde resin. Aromatic hydrocarbon, phenol and formaldehyde react simultaneously to form resin. The heat resistance of the modifier depends on the structure of the aromatic compound. The 53 Research Institute of ordnance industry has achieved satisfactory results by using the tower substrate (aromatic compound) extracted from xylene to modify phenolic resin. The modified route using first methods, modified phenolic thermal decomposition temperature above 450 degrees, thanThe phenolic resin is higher than 50 DEG C, and the weight loss rate at high temperature increases slowly,Suitable for high temperature use, the friction material produced has good friction performance, high temperature coefficient of friction is high and stable, low wear rate.2.4 thermosetting resin modified phenolic resin2.4.1 polyimide modified phenolic resinPolyimide is composed of two aromatic amines and two anhydrides. It has excellent heat resistance and flame retardancy, and can remarkably improve the heat resistance of phenolic resin. Yan Yehai and so on were synthesized bismaleimide modified phenolic resin I, the cured resin has outstanding heat resistance, the thermal deformation temperature (HDT) is 273 DEG C, and the glass temperature is 288 DEG C. The structure content of high phenyl ring and high cross linking density are the structural basis for the excellent heat resistance of cured resins. Phenolic resin II was obtained by blending resin I with appropriate high temperature curing agent. Resin II with deformation temperature and glass transition temperature of the bending performance of more excellent and more heat than resin I, use this source in high temperature curing agent to improve the crosslinking density of the cured resin, so as to ensure the heat resistance of the cured resin. Resin I and II with glass cloth composite materials with excellent mechanical properties and heat resistance based at 300 DEG C based on the flexural strength and modulus of I resin composite material retention rate is respectively 65% and 78%, the II phenolicresin composites flexural strength and modulus retention rate of up to 73% and 83% respectively.2.4.2 polysulfone modified phenolic resinPolysulfone has excellent heat resistance, outstanding creep resistance and dimensional stability, excellent electrical insulation and other characteristics. It has become a comprehensive engineering plastics, and occupies an important position in plastic varieties. Dong Ruiling, Qi Shuhua and others found that polysulfone modified phenolic resin, polysulfone in the form of grafting and blending exist simultaneously. The modified phenolic resin glass fiber reinforced plastic toughness is improved, the impact strength increased from 200KJ/m2 to 283KJ/m2, the tensile strength of 960MPa, the dielectric strength reached 20KV/mm, Martin heat resistance temperature more than 310 DEG C. The glass fiber reinforced mould plastics made of this kind of polysulfone modified phenolic resin have been successfully applied to aerospace products.Phenolic resin modified with 2.4.3 maleimide polymerIn order to improve the toughness and heat resistance of phenolic resin, maleimide resin was used as modifier. The modified resin had high toughness and heat resistance, and the modification effect was obvious. Novolac resin with maleimide groups (PMF) is composed of phenol and N- mixture and 4 hydroxy phenol formaldehyde polyimide under acid catalysis reaction and its curing, mainly through maleimide group addition polymerization. This system greatly improved the heatresistance of phenolic resin and improved the thermal stability of the resin in the higher temperature region, but the toughness was not improved. Someone uses a new addition curing system to improve the toughness of resin system, this system is composed of PMF resin and novolac resin containing allyl group (PAF) according to the different ratio of mixed into, in the reaction with allyl blends.With the increase of the content of propyl phenol, the crosslinking density of the cured matrix decreases, the toughness increases, and the mechanical properties increase. Under the curing conditions, the optimum performance is obtained when the equivalence ratio of allyl and maleimide is 1 to 3.2.4.4 epoxy modified phenolic resinPhenolic hydroxyl groups and hydroxymethyl groups on phenolic resins can react with epoxy groups and hydroxyl groups in epoxy resins to form an cross-linked structure, which reduces the crosslinking density of the cured products and increases the flexibility of the molecules. The study of Jiang Detang and others showed that the brittleness of phenolic resin was improved and the mechanical properties were obviously improved after adding epoxy resin. When the equivalence ratio between epoxy and phenolic resin was 1 to 3, two diglycidyl ether bisphenol A epoxy modified phenolic resin was obtained with the largest KIC (0.85MPa, m1/2). The properties of the composites are also considerably improved than those of DDS curable materials. When the content of novolac resin in thecross-linked network structure increases, the Tg of themodified resin decreases and the toughness increases. In addition, with the increase of linear phenolic resin content, the flame retardancy of the modified resin will increase significantly. Therefore,We can obtain a dense system with excellent mechanical properties and flame retardancy by controlling the content of novolac resin.2.5 rubber modified phenolic resinMany large molecules such as Ding Jing, styrene butadiene rubber and natural rubber were used to toughen phenolic resin. The rubber toughened phenolic resin is a kind of physical mixing modification, but there are different degrees of graft or block copolymerization in the course of curing. Li Xinming et al [17 study found that without nitrile rubber, the impact strength of pure phenolic resin was 5.43 KJ/m2, adding 1% nitrile rubber, the impact strength reached 8.60KJ/m2, an increase of about 58.4%; nitrile rubber with 2%, the impact strength of phenolic resin reached 11.49 KJ /m2, increased by about 116%, improve the the amplitude is the other modification methods can not be compared. With the increase of NBR dosage, the impact strength of phenolic resin is further improved, but the amplitude increases. In addition to the nitrile rubber, rubber containing active functional groups such as epoxy based liquid butadiene rubber, acrylic acid carboxylated nitrile rubber and epoxy adduct can also toughened phenolic resin, and the toughening effect, improved heat resistance. Especially in the liquid rubber toughening system, because the liquid rubber is easy to form the island structure, the form structure which improvedthe impact strength of the composite hardness, heat resistance and little influence on the materials, is an ideal toughening system.Phenolic resin toughened with 2.6 nanometer materialThere are two main methods: 1 nanoparticles toughened polymer nanoparticles and polymer blends; using nano material intercalation method, namely the first polymer monomer is dispersed into layered silicate layers, then in situ polymerization. The polymerization of the released heat can be put into the stripping layer structure of silicate structure unit thickness 1nm width and length of about 10nm, which are uniformly dispersed in the phenolic resin, composite resin and stripping unit structure on the nanometer scale. The toughened phenolic resin has better toughness and thermal stability than the conventional toughened phenolic resin.2.7 thermotropic liquid crystal toughened phenolic resinToughening of thermosetting resins with thermotropic liquid crystals improves toughness and toughness while maintaining heat resistance and stiffness of the resin. Liquid crystalline macromolecules contain a large number of rigid mesogenic units and a certain amount of flexible spacers, and their structural characteristics determine their excellent properties. The presence of a small amount of thermotropic liquid crystalline polymer fibrils can prevent cracks and improve the toughness of the brittle matrix without decreasing the heat resistance and stiffness of the material. Compared with thermoplastics, the same toughening effect can be obtained by using only 25%- 30% of thermoplastic3. conclusionAt present, the toughening modification of phenolic resin on maturity, there have been many modified phenolic resin with high performance, such as excellent mechanical properties, high temperature resistance, electrical insulation, flame retardant, low smoke and low toxicity and mechanical processing of new phenolic resin. It can be predicted that with the continuous development of aviation, aerospace, automobile and electronics industry, study on modified phenolic resin constantly, will make "phenolic resin old" further development, play a greater role in more and more fields.Reference[1]., Min, Ho, Choi, Ho, Yun, Byun, In, Jae, Chung., Theeffect, of, chain, length, of, flexible, diacid, on, Morphologyand, mechanical, property, of,, modified, phenolicresin.Polymer, 2002,43 (): 4437 ~[2]. He J, Raghavan D, Hoffman D, Hunston D. Theinfluence of elastomer concentration on toughness in dispersions containing preformed acrylic elastomeric particles in an epoxy matrix?.Polymer1999,40 (8): 1923 ~ 1933.[3]., Reghunadhan, N, C, P., Advances, in, cure, phenolic, resins., Progress, addition-, in, Polymer, Science.2004,29 (5): 401 ~。
FPC专业英语词汇
一综合词汇印制电路：printed circuit印制线路：printed wiring印制板：printed board印制板电路：printed circuit board (PCB)印制线路板：printed wiring board(PWB)印制元件：printed component印制接点：printed contact印制板装配：printed board assembly板：board单面印制板：single-sided printed board(SSB)双面印制板：double-sided printed board(DSB)多层印制板：mulitlayer printed board(MLB)多层印制电路板：mulitlayer printed circuit board 多层印制线路板：mulitlayer printed wiring board 刚性印制板：rigid printed board刚性单面印制板：rigid single-sided printed borad 刚性双面印制板：rigid double-sided printed borad 刚性多层印制板：rigid multilayer printed board挠性多层印制板：flexible multilayer printed board 挠性印制板：flexible printed board挠性单面印制板：flexible single-sided printed board挠性双面印制板：flexible double-sided printed board挠性印制电路：flexible printed circuit (FPC)挠性印制线路：flexible printed wiring刚性印制板：flex-rigid printed board, rigid-flex printed board刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board齐平印制板：flush printed board金属芯印制板：metal core printed board金属基印制板：metal base printed board多重布线印制板：mulit-wiring printed board陶瓷印制板：ceramic substrate printed board导电胶印制板：electroconductive paste printed board模塑电路板：molded circuit board模压印制板：stamped printed wiring board顺序层压多层印制板：sequentially-laminated mulitlayer散线印制板：discrete wiring board微线印制板：micro wire board积层印制板：build-up printed board积层多层印制板：build-up mulitlayer printed board (BUM)积层挠印制板：build-up flexible printed board表面层合电路板：surface laminar circuit (SLC)埋入凸块连印制板：B2it printed board多层膜基板：multi-layered film substrate(MFS) 层间全内导通多层印制板：ALIVH multilayer printed board 载芯片板：chip on board (COB)埋电阻板：buried resistance board母板：mother board子板：daughter board背板：backplane裸板：bare board键盘板夹心板：copper-invar-copper board动态挠性板：dynamic flex board静态挠性板：static flex board可断拼板：break-away plane电缆：cable挠性扁平电缆：flexible flat cable (FFC)薄膜开关：membrane switch混合电路：hybrid circuit厚膜：thick film厚膜电路：thick film circuit薄膜：thin film薄膜混合电路：thin film hybrid circuit互连：interconnection导线：conductor trace line齐平导线：flush conductor传输线：transmission line跨交：crossover板边插头：edge-board contact增强板：stiffener基底：substrate基板面：real estate导线面：conductor side元件面：component side焊接面：solder side印制：printing网格：grid图形：pattern导电图形：conductive pattern非导电图形：non-conductive pattern字符：legend标志：mark二基材：基材：base material层压板：laminate覆金属箔基材：metal-clad bade material覆铜箔层压板：copper-clad laminate (CCL) 单面覆铜箔层压板：single-sided copper-clad laminate双面覆铜箔层压板：double-sided copper-clad laminate复合层压板：composite laminate薄层压板：thin laminate金属芯覆铜箔层压板：metal core copper-clad laminate金属基覆铜层压板：metal base copper-clad laminate挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film基体材料：basis material预浸材料：pre-preg粘结片：bonding sheet预浸粘结片：preimpregnated bonding sheer环氧玻璃基板：epoxy glass substrate加成法用层压板：laminate for additive process 预制内层覆箔板：mass lamination panel内层芯板：core material催化板材：catalyzed board ,coated catalyzed laminate涂胶催化层压板：adhesive-coated catalyzed laminate涂胶无催层压板：adhesive-coated uncatalyzed laminate粘结层：bonding layer粘结膜：film adhesive涂胶粘剂绝缘薄膜：adhesive coated dielectric film 无支撑胶粘剂膜：unsupported adhesive film覆盖层：cover layer (cover lay)增强板材：stiffener material铜箔面：copper-clad surface去铜箔面：foil removal surface层压板面：unclad laminate surface基膜面：base film surface胶粘剂面：adhesive faec原始光洁面：plate finish粗面：matt finish纵向：length wise direction模向：cross wise direction剪切板：cut to size panel酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates超薄型层压板：ultra thin laminate陶瓷基覆铜箔板：ceramics base copper-clad laminates紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三基材的材料A阶树脂：A-stage resinB阶树脂：B-stage resinC阶树脂：C-stage resin环氧树脂：epoxy resin酚醛树脂：phenolic resin聚酯树脂：polyester resin聚酰亚胺树脂：polyimide resin双马来酰亚胺三嗪树脂：bismaleimide-triazine resin丙烯酸树脂：acrylic resin三聚氰胺甲醛树脂：melamine formaldehyde resin 多官能环氧树脂：polyfunctional epoxy resin溴化环氧树脂：brominated epoxy resin环氧酚醛：epoxy novolac氟树脂：fluroresin硅树脂：silicone resin硅烷：silane聚合物：polymer无定形聚合物：amorphous polymer结晶现象：crystalline polamer双晶现象：dimorphism共聚物：copolymer合成树脂：synthetic热固性树脂：thermosetting resin热塑性树脂：thermoplastic resin感光性树脂：photosensitive resin环氧当量：weight per epoxy equivalent (WPE)环氧值：epoxy value双氰胺：dicyandiamide粘结剂：binder胶粘剂：adesive固化剂：curing agent阻燃剂：flame retardant遮光剂：opaquer增塑剂：plasticizers不饱和聚酯：unsatuiated polyester聚酯薄膜：polyester聚酰亚胺薄膜：polyimide film (PI)聚四氟乙烯：polytetrafluoetylene (PTFE)聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylene copolymer film (FEP)增强材料：reinforcing material玻璃纤维：glass fiberE玻璃纤维：E-glass fibreD玻璃纤维：D-glass fibreS玻璃纤维：S-glass fibre玻璃布：glass fabric非织布：non-woven fabric玻璃纤维垫：glass mats纱线：yarn单丝：filament绞股：strand纬纱：weft yarn经纱：warp yarn但尼尔：denier经向：warp-wise纬向：weft-wise, filling-wise织物经纬密度：thread count织物组织：weave structure平纹组织：plain structure坏布：grey fabric稀松织物：woven scrim弓纬：bow of weave断经：end missing缺纬：mis-picks纬斜：bias折痕：crease云织：waviness鱼眼：fish eye毛圈长：feather length厚薄段：mark裂缝：split捻度：twist of yarn浸润剂含量：size content浸润剂残留量：size residue处理剂含量：finish level浸润剂：size偶联剂：couplint agent处理织物：finished fabric聚酰胺纤维：polyarmide fiber聚酯纤维非织布：non-woven polyester fabric 浸渍绝缘纵纸：impregnating insulation paper 聚芳酰胺纤维纸：aromatic polyamide paper断裂长：breaking length吸水高度：height of capillary rise湿强度保留率：wet strength retention白度：whitenness陶瓷：ceramics导电箔：conductive foil铜箔：copper foil电解铜箔：electrodeposited copper foil (ED copper foil)压延铜箔：rolled copper foil退火铜箔：annealed copper foil压延退火铜箔：rolled annealed copper foil (RA copper foil)薄铜箔：thin copper foil涂胶铜箔：adhesive coated foil涂胶脂铜箔：resin coated copper foil (RCC)复合金属箔：composite metallic material载体箔：carrier foil殷瓦：invar箔（剖面）轮廓：foil profile 光面：shiny side粗糙面：matte side处理面：treated side防锈处理：stain proofing双面处理铜箔：double treated foil四设计原理图：shematic diagram逻辑图：logic diagram印制线路布设：printed wire layout布设总图：master drawing可制造性设计：design-for-manufacturability计算机辅助设计：computer-aided design.(CAD) 计算机辅助制造：computer-aided manufacturing.(CAM)计算机集成制造：computer integrat manufacturing.(CIM)计算机辅助工程：computer-aided engineering.(CAE)计算机辅助测试：computer-aided test.(CAT)电子设计自动化：electric designautomation .(EDA)工程设计自动化：engineering design automaton .(EDA2)组装设计自动化：assembly aided architectural design. (AAAD)计算机辅助制图：computer aided drawing计算机控制显示：computer controlleddisplay .(CCD)布局：placement布线：routing布图设计：layout重布：rerouting模拟：simulation逻辑模拟：logic simulation电路模拟：circit simulation时序模拟：timing simulation模块化：modularization布线完成率：layout effeciency机器描述格式：machine descriptionmformat .(MDF)机器描述格式数据库：MDF databse设计数据库：design database设计原点：design origin优化（设计）：optimization (design)供设计优化坐标轴：predominant axis表格原点：table origin镜像：mirroring驱动文件：drive file中间文件：intermediate file制造文件：manufacturing documentation队列支撑数据库：queue support database元件安置：component positioning图形显示：graphics dispaly比例因子：scaling factor扫描填充：scan filling矩形填充：rectangle filling填充域：region filling实体设计：physical design逻辑设计：logic design逻辑电路：logic circuit层次设计：hierarchical design自顶向下设计：top-down design自底向上设计：bottom-up design线网：net数字化：digitzing设计规则检查：design rule checking走（布）线器：router (CAD)网络表：net list计算机辅助电路分析：computer-aided circuit analysis子线网：subnet目标函数：objective function设计后处理：post design processing (PDP) 交互式制图设计：interactive drawing design 费用矩阵：cost metrix工程图：engineering drawing方块框图：block diagram迷宫：moze元件密度：component density巡回售货员问题：traveling salesman problem 自由度：degrees freedom入度：out going degree出度：incoming degree曼哈顿距离：manhatton distance欧几里德距离：euclidean distance网络：network阵列：array段：segment逻辑：logic逻辑设计自动化：logic design automation分线：separated time分层：separated layer定顺序：definite sequence五形状与尺寸：导线（通道）：conduction (track)导线（体）宽度：conductor width导线距离：conductor spacing导线层：conductor layer导线宽度/间距：conductor line/space第一导线层：conductor layer No.1圆形盘：round pad方形盘：square pad菱形盘：diamond pad长方形焊盘：oblong pad子弹形盘：bullet pad泪滴盘：teardrop pad 雪人盘：snowman padV形盘：V-shaped pad环形盘：annular pad非圆形盘：non-circular pad隔离盘：isolation pad非功能连接盘：mon-functional pad偏置连接盘：offset land腹（背）裸盘：back-bard land盘址：anchoring spaur连接盘图形：land pattern连接盘网格阵列：land grid array孔环：annular ring元件孔：component hole安装孔：mounting hole支撑孔：supported hole非支撑孔：unsupported hole导通孔：via镀通孔：plated through hole (PTH)余隙孔：access hole盲孔：blind via (hole)埋孔：buried via hole埋/盲孔：buried /blind via任意层内部导通孔：any layer inner via hole (ALIVH)全部钻孔：all drilled hole定位孔：toaling hole无连接盘孔：landless hole中间孔：interstitial hole无连接盘导通孔：landless via hole引导孔：pilot hole端接全隙孔：terminal clearomee hole准表面间镀覆孔：quasi-interfacing plated-through hole准尺寸孔：dimensioned hole在连接盘中导通孔：via-in-pad孔位：hole location孔密度：hole density孔图：hole pattern钻孔图：drill drawing装配图：assembly drawing印制板组装图：printed board assembly drawing 参考基准：datum referanAssembly line组装线 Layout布置图 Conveyer 流水线物料板Rivet table拉钉机 Rivet gun拉钉枪 Screw driver起子Electric screw driver电动起子 Pneumatic screw driver气动起子worktable 工作桌 OOBA开箱检查 fit together 组装在一起fasten锁紧(螺丝) fixture 夹具(治具) pallet栈板 barcode条码barcode scanner条码扫描器 fuse together熔合 fuse machine热熔机repair修理 operator作业员 QC品管 supervisor 课长 ME制造工程师 MT制造生技 cosmetic inspect外观检查 inner parts inspect 内部检查 thumb screw大头螺丝 lbs. inch镑、英寸 EMI gasket导电条front plate前板 rear plate后板 chassis 基座 bezel panel面板power button电源按键 reset button重置键 Hi-pot test of SPS高源高压测试 sheet metal parts 冲件 plastic parts塑胶件 SOP制造作业程序material check list物料检查表 work cell工作间电源电压接拉键carton纸箱 sub-line支线 left fork叉车personnel resource department 人力资源部 production department生产部门 planning department企划部 QC Section品管科 stamping factory冲压厂 painting factory烤漆厂 molding factory成型厂common equipment常用设备 uncoiler and straightener整平机punching machine 冲床robot机械手hydraulic machine油压机lathe车床planer |'plein| 刨床miller铣床grinder磨床driller??床linear cutting线切割electrical sparkle电火花welder电焊机staker=reviting machine铆合机position职务president董事长general manager总经理 special assistant manager特助factory director厂长 department director部长deputy manager | =vice manager副理 section supervisor课长deputy section supervisor =vice section superisor 副课长group leader/supervisor组长 line supervisor线长 assistant manager助理 to move, to carry, to handle搬运 be put in storage入库pack packing包装 to apply oil擦油 to file burr 锉毛刺final inspection终检 to connect material接料 to reverse material 翻料wet station沾湿台 Tiana天那水 cleaning cloth抹布 to load material上料 to unload material卸料 to return material/stock to退料scraped |'skræpid|报废 scrape ..v.刮;削 deficient purchase来料不良manufacture procedure制程 deficient manufacturing procedure制程不良 oxidation |' ksi'dein|氧化 scratch刮伤 dents压痕 defective upsiding down抽芽不良 defective to staking铆合不良embedded lump镶块 feeding is not in place 送料不到位stamping-missing漏冲 production capacity生产力education and training教育与训练 proposal improvement提案改善spare parts=buffer备件 forklift叉车 trailer=long vehicle拖板车compound die合模 die locker锁模器 pressure plate=plate pinch压板bolt螺栓 name of a department部门名称 administration/general affairs dept总务部 automatic screwdriver电动启子 thickness gauge厚薄规 gauge(or jig)治具 power wire电源线 buzzle蜂鸣器 defective product label不良标签 identifying sheet list标示单screwdriver holder起子插座 pedal踩踏板 stopper阻挡器flow board流水板 hydraulic hand-jack油压板车 forklift叉车pallet栈板 glove(s)手套 glove(s) with exposed fingers割手套 thumb 大拇指 forefinger食指 mid-finger中指 ring finger无名指little finger小指 band-aid创可贴 iudustrial alcohol工业酒精alcohol container沾湿台 head of screwdriver起子头sweeper扫把 mop拖把 vaccum cleaner吸尘器rag 抹布 garbage container灰箕 garbage can垃圾箱garbage bag垃圾袋 chain链条 jack升降机 production line流水线chain链条槽 magnetizer加磁器 lamp holder 灯架to mop the floor拖地 to clean the floor扫地 to clean a table擦桌子air pipe 气管 packaging tool打包机 packaging打包missing part漏件 wrong part错件 excessive defects过多的缺陷critical defect极严重缺陷 major defect主要缺陷minor defect次要缺陷 not up to standard不合规格dimension/size is a little bigger尺寸偏大(小) cosmetic defect外观不良slipped screwhead/slippery screw head螺丝滑头slipped screwhead/shippery screw thread滑手speckle斑点 mildewed=moldy=mouldy发霉 rust生锈deformation变形 burr(金属)flash(塑件)毛边 poor staking铆合不良excesssive gap间隙过大 grease/oil stains油污 inclusion杂质painting peel off脏污 shrinking/shrinkage缩水 mixed color杂色scratch划伤 poor processing 制程不良 poor incoming part事件不良fold of packaging belt打包带折皱painting make-up补漆 discoloration羿色 water spots水渍polishing/surface processing表面处理 exposed metal/bare metal金属裸露 lack of painting烤漆不到位 safety安全 quality品质 delivery deadline交货期 cost成本 engineering工程 die repair模修enterprise plan = enterprise expansion projects 企划QC品管 die worker模工 production, to produce 生产equipment设备 to start a press开机 stop/switch off a press关机classification整理 regulation整顿 cleanness清扫 conservation清洁 culture教养 qualified products, up-to-grade products良品defective products, not up-to-grade products不良品waste废料 board看板 feeder送料机 sliding rack滑料架defective product box不良品箱 die change 换模 to fix a die装模to take apart a die拆模 to repair a die修模 packing material包材basket蝴蝶竺 plastic basket胶筐isolating plate baffle plate; barricade隔板 carton box纸箱to pull and stretch拉深to put material in place, to cut material, to input 落料to impose lines压线 to compress, compressing 压缩character die字模 to feed, feeding送料 transportation运输(be)qualfied, up to grade合格 not up to grade, not qualified不合格material change, stock change材料变更 feature change 特性变更evaluation评估 prepare for, make preparations for 准备parameters参数 rotating speed, revolution转速manufacture management制造管理 abnormal handling异常处理production unit生产单位 lots of production生产批量steel plate钢板 roll material卷料 manufacture procedure制程operation procedure作业流程 to revise, modify 修订to switch over to, switch---to throw--over switchi ng over切换engineering, project difficulty 工程瓶颈 stage die工程模automation自动化 to stake, staking, reviting铆合add lubricating oil加润滑油 shut die架模 shut height of a die架模高度analog-mode device类模器die lifter举模器 argon welding氩焊vocabulary for stamping模具专业英语[分享] 模具述语一、入水：gate进入位：gate location 水口形式：gate type 大水口：edge gate 细水口： pin-point gate 水口大小：gate size 转水口：switching runner/gate唧嘴口径：sprue diameter二、流道: runner热流道：hot runner,hot manifold 热嘴冷流道: hot sprue/cold runner唧嘴直流: direct sprue gate 圆形流道：round(full/half runner流道电脑分析：mold flow analysis 流道平衡:runner balance热嘴：hot sprue 热流道板：hot manifold发热管：cartridge heater 探针: thermocouples插头：connector plug 插座： connector socket 密封/封料： seal三、运水：water line喉塞：line plug 喉管：tube塑胶管：plastic tube 快速接头：jiffy quick connector plug/socker四、模具零件：mold components三板模：3-plate mold 二板模：2-plate mold边钉/导边：leader pin/guide pin 边司/导套：bushing/guide bushing中托司：shoulder guide bushing 中托边L：guide pin顶针板：ejector retainner plate 托板：support plate螺丝： screw 管钉：dowel pin 开模槽：ply bar scot内模管位：core/cavity inter-lock 顶针：ejector pin司筒：ejector sleeve 司筒针：ejector pin推板：stripper plate 缩呵：movable core,return core core puller扣机（尼龙拉勾）：nylon latch lock 斜顶：lifter模胚（架）： mold base 上内模：cavity insert下内模：core insert 行位（滑块）： slide镶件：insert 压座/斜鸡：wedge 耐磨板/油板：wedge wear plate 压条：plate 撑头: support pillar 唧嘴： sprue bushing挡板：stop plate 定位圈：locating ring 锁扣：latch扣鸡：parting lock set 推杆：push bar 栓打螺丝：S.H.S.B顶板：eracuretun 活动臂：lever arm 分流锥：spure sperader水口司:bush 垃圾钉：stop pin 隔片：buffle弹弓柱：spring rod 弹弓:die spring 中托司：ejector guide bush中托边：ejector guide pin 镶针：pin 销子：dowel pin波子弹弓：ball catch 喉塞: pipe plug 锁模块：lock plate斜顶：angle from pin 斜顶杆：angle ejector rod尼龙拉勾：parting locks 活动臂：lever arm复位键、提前回杆：early return bar 气阀：valves斜导边：angle pin 术语：terms承压平面平衡：parting surface support balance模排气：parting line venting回针碰料位：return pin and cavity interference模总高超出啤机规格：mold base shut hight顶针碰运水：water line interferes withejector pin料位出上/下模：part from cavith (core) side模胚原身出料位：cavity direct cut on A-plate,core direct cut on B-p late.不准用镶件： Do not use (core/cavity) insert用铍铜做镶件： use beryllium copper insert 初步（正式）模图设计：preliinary (final) mold design反呵：reverse core 弹弓压缩量：spring compressed length稳定性好：good stability,stable 强度不够：insufficient rigidity均匀冷却：even cooling 扣模：sticking热膨胀：thero expansion 公差：tolorance 铜公(电极）：copper electrode常用塑料英语缩略语[分享]英文简称英文全称中文全称ABA Acrylonitrile-butadiene-acrylate 丙烯腈/丁二烯/丙烯酸酯共聚物ABS Acrylonitrile-butadiene-styrene 丙烯腈/丁二烯/苯乙烯共聚物AES Acrylonitrile-ethylene-styrene 丙烯腈/乙烯/苯乙烯共聚物AMMA Acrylonitrile/methyl Methacrylate 丙烯腈/甲基丙烯酸甲酯共聚物ARP Aromatic polyester 聚芳香酯AS Acrylonitrile-styrene resin 丙烯腈-苯乙烯树脂ASA Acrylonitrile-styrene-acrylate 丙烯腈/苯乙烯/丙烯酸酯共聚物CA Cellulose acetate 醋酸纤维塑料CAB Cellulose acetate butyrate 醋酸-丁酸纤维素塑料CAP Cellulose acetate propionate 醋酸-丙酸纤维素CE Cellulose plastics, general 通用纤维素塑料CF Cresol-formaldehyde 甲酚-甲醛树脂CMC Carboxymethyl cellulose 羧甲基纤维素CN Cellulose nitrate 硝酸纤维素CP Cellulose propionate 丙酸纤维素CPE Chlorinated polyethylene 氯化聚乙烯CPVC Chlorinated poly(vinyl chloride) 氯化聚氯乙烯CS Casein 酪蛋白CTA Cellulose triacetate 三醋酸纤维素EC Ethyl cellulose 乙烷纤维素EMA Ethylene/methacrylic acid 乙烯/甲基丙烯酸共聚物EP Epoxy, epoxide 环氧树脂EPD Ethylene-propylene-diene 乙烯-丙烯-二烯三元共聚物EPM Ethylene-propylene polymer 乙烯-丙烯共聚物EPS Expanded polystyrene 发泡聚苯乙烯ETFE Ethylene-tetrafluoroethylene 乙烯-四氟乙烯共聚物EVA Ethylene/vinyl acetate 乙烯-醋酸乙烯共聚物EVAL Ethylene-vinyl alcohol 乙烯-乙烯醇共聚物FEP Perfluoro(ethylene-propylene) 全氟（乙烯-丙烯）塑料FF Furan formaldehyde 呋喃甲醛HDPE High-density polyethylene plastics 高密度聚乙烯塑料HIPS High impact polystyrene 高冲聚苯乙烯IPS Impact-resistant polystyrene 耐冲击聚苯乙烯LCP Liquid crystal polymer 液晶聚合物LDPE Low-density polyethylene plastics 低密度聚乙烯塑料LLDPE Linear low-density polyethylene 线性低密聚乙烯LMDPE Linear medium-density polyethylene 线性中密聚乙烯零件英语零件类punch冲头 insert入块(嵌入件) deburring punch压毛边冲子groove punch压线冲子 stamped punch字模冲子round punch圆冲子 special shape punch异形冲子bending block折刀 roller滚轴 baffle plate挡块located block定位块 supporting block for location 定位支承块air cushion plate气垫板 air-cushion eject-rod气垫顶杆trimming punch切边冲子 stiffening rib punch = stinger 加强筋冲子ribbon punch压筋冲子 reel-stretch punch卷圆压平冲子guide plate定位板 sliding block滑块 sliding dowel block滑块固定块active plate活动板 lower sliding plate下滑块板upper holder block上压块 upper mid plate上中间板spring box弹簧箱 spring-box eject-rod弹簧箱顶杆spring-box eject-plate弹簧箱顶板 bushing block 衬套cover plate盖板 guide pad导料块塑件&模具相关英文compression molding压缩成型 flash mold溢流式模具plasitive mold挤压式模具 split mold分割式模具cavity型控母模 core模心公模 taper锥拔 leather cloak仿皮革 shiver饰纹 flow mark流痕 welding mark溶合痕 post screw insert螺纹套筒埋值 self tapping screw自攻螺丝striper plate脱料板 piston活塞 cylinder汽缸套chip细碎物 handle mold手持式模具移转成型用模具encapsulation molding低压封装成型射出成型用模具 two plate两极式（模具） well type蓄料井insulated runner绝缘浇道方式 hot runner热浇道runner plat浇道模块 valve gate阀门浇口band heater环带状的电热器 spindle阀针spear head刨尖头 slag well冷料井cold slag冷料渣 air vent排气道welding line熔合痕 eject pin顶出针 knock pin 顶出销return pin回位销反顶针 sleave套筒 stripper plate脱料板insert core放置入子 runner stripper plate浇道脱料板guide pin导销 eject rod (bar)（成型机）顶业捧subzero深冷处理 three plate三极式模具runner system浇道系统 stress crack应力电裂orientation定向 sprue gate射料浇口，直浇口nozzle射嘴 sprue lock pin料头钩销(拉料杆)slag well冷料井 side gate侧浇口edge gate侧缘浇口 tab gate搭接浇口 film gate 薄膜浇口flash gate闸门浇口 slit gate缝隙浇口 fan gate扇形浇口 dish gate因盘形浇口 diaphragm gate隔膜浇口 ring gate环形浇口subarine gate潜入式浇口 tunnel gate隧道式浇口 pin gate针点浇口Runner less无浇道 (sprue less)无射料管方式long nozzle延长喷嘴方式 sprue浇口;溶渣冲压英语stamping, press冲压 punch press, dieing out press冲床uncoiler & strainghtener整平机 feeder送料机rack, shelf, stack料架 cylinder油缸robot机械手 taker取料机 conveyer belt输送带transmission rack输送架 top stop上死点 bottom stop下死点one stroke一行程 inch寸动 to continue, cont.连动to grip(material)吸料 location lump, locating piece, block stop 定位块reset复位 smoothly顺利 dent压痕 scratch刮伤 deformation变形filings铁削 to draw holes抽孔 inquiry, search for查寻to stock, storage, in stock库存 receive领取approval examine and verify审核 processing, to process加工delivery, to deliver 交货 to return delivenry to. to send delinery back to retrn of goods退货registration登记 registration card登记卡to control管制 to put forward and hand in提报safe stock安全库存 acceptance = receive验收to notice通知 application form for purchase请购单consume, consumption消耗 to fill in填写abrasion磨损 reverse angle = chamfer倒角character die字模 to collect, to gather收集failure, trouble故障 statistics统计 demand and supply需求career card履历卡 to take apart a die卸下模具to load a die装上模具 to tight a bolt拧紧螺栓to looser a bolt拧松螺栓 to move away a die plate移走模板easily damaged parts易损件 standard parts标准件breaking.(be)broken,(be)cracked 断裂 to lubricate润滑common vocabulary for die engineering模具工程常用词汇die 模具 figure file, chart file图档cutting die, blanking die冲裁模 progressive die, follow (-on)die 连续模compound die复合模 punched hole冲孔 panel board镶块 to cutedges=side cut=side scrap切边 to bending折弯 to pull, to stretch拉伸 Line streching, line pulling线拉伸 engraving, to engrave刻印 upsiding down edges翻边 to stake铆合designing, to design设计 design modification设计变化die block模块 folded block折弯块sliding block滑块 location pin定位销 lifting pin 顶料销die plate, front board模adding block垫块 stepping bar垫条upper die base上模座 lower die base下模座upper supporting blank上承板 upper padding plate blank上垫板spare dies模具备品 spring 弹簧 bolt螺栓。
电路板中英文专业术语词汇(N-Z)
电路板专业词汇（N－Z）N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄.Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂.Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度.Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜.Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.)Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phenolic纸质酚醛树脂(板材).Parting Agent脱膜剂.Passivation钝化,钝化外理.Passive Device (Component)被动组件(零件)Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.Periodic Reverse (PR) Current周期性反电流. Peripheral周边附属设备.Permeability透气性,导磁率.Permittivity诱电率,透电率.pH Value酸碱值.Phase相.Phase Diagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光启始剂.Photomask光罩.Photoplotter, Plotter光学绘图机.Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工. Phototool底片.Pick and Place拾取与放置.Piezoelectric压电性.Pin 插脚,插梢,插针.Pin Grid Array (PGA)矩阵式针脚对装.Pinhole针孔.Pink Ring粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.Plain Weave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.Pneumatic Stretcher气动拉伸器.Pogo Pin伸缩探针.Point 钻尖.Point Angle钻尖面.Point Source Light点状光源.Poise泊."粘滞度"单位=1dyne*sec/cm2.Polar Solvent极性溶剂.Polarity电极性.Polarization分极,极化.Polarizing Slot偏槽.Polyester Films聚酯类薄片.Polymer Thick Film (PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亚醯胺.Popcorn Effect爆米花效应.Porcelain瓷材,瓷面.Porosity Test疏孔度试验.Positive Acting Resist正性光阻剂.Post Cure后续硬化,后烤.Post Separation后期分离,事后公离.Pot Life运用期,锅中寿命.Potting铸封,模封.Power Supply电源供应器.Preform 预制品.Preheat预热.Prepreg胶片,树脂片.Press Plate钢板.Press-Fit Contact挤入式接触.Pressure Foot 压力脚.Pre-tinning预先沾锡.Primary Image线路成像.Print Through压透,过度挤压..Probe探针.Process Camera制程用照像机.Process Window操作范围.Production Master生产底片.Profile轮廓,部面图,升温曲线图棱线.Propagation传播.Propagation Delay传播延迟.Puddle Effect水坑效应.Pull Away拉离.Pulse Plating脉冲电镀法.Pumice Powder 浮石粉.Punch冲切.Purge, Purging净空,净洗.Purple Plague紫疫(金与铝的共化物层).Pyrolysis热裂解,高温分解.*****Q*****Quad Flat Pack (QFP)方扁形封装体.Qualification Agency资格认证机构.Qualification Inspection资格检验.Qualified Products List合格产品(供应者)名单.Qualitative Analysis定性分析.Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板). Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*****R*****Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference (RFI)射频干扰.Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压. Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮(盘)式操作.Reference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合.Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂. Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶(糊)渣.Resin Starve Area缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反电流(电解)清洗. Reverse Etchback反回蚀.Reverse Image负片影像(阻剂).Reverse Osmosis (RO)反(逆渗透).Reversion反转,还原.Revision修正版.改订版.Rework(ing)重工,再加工.Rhology流变学,流变性质.Ribbon Cable圆线缆带.Rigid-Flex Printed Board硬软合板.Ring 套环.Rinsing水洗,冲洗.Ripple纹波(指整流器所输出电流中不稳定成分). Rise Time上升时间.Roadmap 线路与零件之布局图.Robber辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*****S*****Sacrificial Protection牺牲性保护层.Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验.Schemetic Diagram电路概略图.ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷.Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程.Semi-Conductor半导体.Sensitizing敏化.Separable Component Part可分离式零件.Separator Plate隔板, 钢板.Sequential Lamination接续性压合法.Sequestering Agent螯合剂.Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma (Standard Deviation)标准差.Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.Silver Migration银迁移.Silver Paste 银膏.Single-In-Line Package(SIP)单边插脚封装体.Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应(高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀.Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃(铅玻璃).Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法. Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking(S/M)防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞(柱).Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应. Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油. Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样.Spectrophotometry分光光度计检测法. Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术. Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂.*****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合.Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数. Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合. Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法. Thermogravimetric Analysis, (TGA)热重分析法. Thermomechanical Analysis (TMA)热机分析法. Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器.Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value (TLV)极限值.Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路.Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体.UL Symbol(UL.为Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度. Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化. Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式传输线. Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机.Unsupported Hole非镀通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法. Vacuum Lamination真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器. Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.Void 破洞,空洞.Volatile Content挥发份含量.Voltage电压.Voltage Breakdown崩溃电压.Voltage Drop 电压降落.Voltage Efficiency电压效率.Voltage Plane电压层.Voltage Plane Clearance电压层的空环.Volume Resistivity体绩电阻率.Volume Resistivity体绩电阻率.Volumetric Analysis容量分析法.Vulcanization交联,硫化.Wafer晶圆.Waive暂准过关,暂不检查. Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理. Water Absorption吸水性. Water Break水膜破散,水破. Water Mark水印.Watt瓦特.Watts Bath瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊. Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure织纹显露. Weave Texture织纹隐现.Web蹼部.Wedge Bond 楔形结合点. Wedge Void楔形缺口(破口). Weft Yarn纬纱.Welding熔接.Wet Blasting湿喷砂.Wet Lamination湿压膜法.Wet Process湿式制程.Wetting Agent润湿剂.Wetting Balance沾锡天平. Wetting Balance沾锡,沾湿. Whirl Brush旋涡式磨刷法. Whirl Coating旋涡涂布法. Whisker晶须.White Residue白色残渣.White Spot白点.Wicking灯蕊效应.Window操作范围,传动齿孔. Wiping Action 滑动接触(导电). Wire Bonding打线结合.Wire Gauge线规.Wire Lead金属线脚.Wire Pattern布线图形.Wire Wrap绕线互连.Working Master工作母片.Working Time (Life)堪用时间.Workmanship 手艺,工艺水平,制作水准.Woven Cable扁平编线.Wrinkle皱折, 皱纹.Wrought Foil锻碾金属箔.*****X*****X AxisX轴.X-Ray X光.X-Ray FluorescenceX萤光.*****Y*****Yarn纱线.Y-AxisY轴.Yield良品率,良率,产率.Yield Point屈服点.*****Z*****Z-AxisZ轴.Zero Centering中心不变(叠合法).Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.。
FPC基材物料中英文对照
FPC基材物料中英文对照1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板:single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料:prepreg14、粘结片：bonding sheet15、预浸粘结片:preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板:laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板:core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板:adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层:cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive face34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates 基材材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂:phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin15、硅树脂：silicone resin 16、硅烷：silane17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value 28、双氰胺：dicyandiamide29、粘结剂：binder 30、胶粘剂：adesive31、固化剂：curing agent 32、阻燃剂：flame retardant33、遮光剂：opaquer 34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI) 38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material 41、玻璃纤维：glass fiber42、E玻璃纤维:E-glass fibre 43、D玻璃纤维：D-glass fibre 44、S玻璃纤维：S-glass fibre 45、玻璃布：glass fabric46、非织布:non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝：filament50、绞股：strand 51、纬纱：weft yarn52、经纱：warp yarn 53、但尼尔：denier54、经向：warp-wise 55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count 57、织物组织：weave structure58、平纹组织：plain structure 59、坏布：grey fabric60、稀松织物：woven scrim 61、弓纬：bow of weave62、断经：end missing 63、缺纬：mis-picks64、纬斜：bias 65、折痕：crease66、云织：waviness 67、鱼眼：fish eye68、毛圈长：feather length 69、厚薄段：mark70、裂缝：split 71、捻度：twist of yarn72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length 83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention 85、白度：whitenness86、陶瓷：ceramics 87、导电箔：conductive foil88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material 97、载体箔：carrier foil98、殷瓦：invar 99、箔（剖面）轮廓：foil profile100、光面：shiny side 101、粗糙面：matte side102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil。
酚醛树脂包覆氧化天然石墨作为锂离子电池负极材料
酚醛树脂包覆氧化天然石墨作为锂离子电池负极材料高文超1黄桃1沈宇栋2余爱水1,*(1复旦大学化学系,新能源研究院,上海市分子催化和功能材料重点实验室,上海200438;2无锡东恒新能源材料有限公司,江苏无锡214037)摘要:天然石墨经过浓硫酸氧化处理,酚醛树脂包覆并高温碳化后形成具有核壳结构的碳包覆氧化天然石墨复合材料.采用扫描电子显微镜(SEM),透射电子显微镜(TEM),X 射线衍射(XRD),激光显微拉曼光谱(Raman)等检测技术对氧化处理以及酚醛树脂热解碳包覆前后天然石墨材料的结构与形貌进行分析与表征.结果表明,氧化处理与适量的酚醛树脂热解碳包覆有效修复了天然石墨表面的一些缺陷结构,使其表面更为光滑.电化学测试结果显示,经过氧化处理与酚醛树脂热解碳包覆后天然石墨材料电化学性能得到明显提高.酚醛树脂包覆量为9%时,复合材料表现出最好的电化学性能,其首次放电比容量为434.0mAh ·g -1,40次循环后,放电比容量保持在361.6mAh ·g -1,而未经处理的天然石墨放电比容量仅为332.3mAh ·g -1.该改性方法有效提高了天然石墨材料的比容量,对其进一步应用具有重要意义.关键词:负极材料;天然石墨;酚醛树脂;氧化;包覆中图分类号:O646Phenolic Resin Coated Natural Graphite Oxide as an Anode Material forLithium Ion BatteriesGAO Wen-Chao 1HUANG Tao 1SHEN Yu-Dong 2YU Ai-Shui 1,*(1Department of Chemistry,Institute of New Energy,Shanghai Key Laboratory of Molecular Catalysis and Innovative Materials,Fudan University,Shanghai 200438,P .R.China ;2Wuxi Dongheng New Energy Material Co.,Ltd,Wuxi 214037,Jiangsu Province,P .R.China )Abstract:A core-shell structure of the carbon-coated natural graphite oxide composite was successfully prepared.Natural graphite was initially oxidized using concentrated sulfuric acid and then carbon coated by the carbonization of phenolic resin at high temperature.Scanning electron microscopy (SEM),transmission electron microscopy (TEM),X-ray diffraction (XRD),and Raman techniques were used to characterize the morphology and structure of the natural graphite materials before and after oxidation and carbon coating by the pyrolysis of the phenolic resin.The results showed that the surface of the natural graphite particles became smoother and the surface defects were effectively modified after oxidation and carbon coating.The electrochemical test results showed that the electrochemical performance of the natural graphite improved significantly by oxidation with sulfuric acid and by carbon coating.When the covering amount of phenolic resin was 9%the modified natural graphite material gave the best electrochemical performance.Its initial discharge capacity was 434.0mAh ·g -1and it remained 361.6mAh ·g -1after 40charge-discharge cycles.The discharge capacity of the untreated natural graphite was only 332.3mAh ·g -1.The modification approach that improved the capacity of the natural graphite effectively is of great significance for the application of natural graphite in lithium ion batteries.[Article]物理化学学报(Wuli Huaxue Xuebao )Acta Phys.-Chim.Sin .2011,27(9),2129-2134September Received:May 13,2011;Revised:July 7,2011;Published on Web:July 29,2011.∗Corresponding author.Email:asyu@;Tel/Fax:+86-21-51630320.The project was supported by the Key Program of Basic Research of the Shanghai Committee of Science and Technology,China (10JC1401500)and Department of Chemistry and Shanghai Key Laboratory of Molecular and Innovative Materials,China (08DZ2270500).上海市基础研究重点项目(10JC1401500)和上海市分子催化和功能材料重点实验室(08DZ2270500)资助ⒸEditorial office of Acta Physico-Chimica Sinica2129Vol.27Acta Phys.-Chim.Sin.2011Key Words:Anode material;Natural graphite;Phenolic resin;Oxidation;Coating1引言锂离子电池是当今社会最为重要的二次电池,它具有工作电压高、能量密度高、循环寿命长、对环境友好等优点,1,2在手机、数码相机、便携式电脑等领域得到广泛应用.目前,已商业化的锂离子电池负极材料为石墨材料.3其中,天然石墨具有比容量较高、充放电平台平稳、储量大、成本低等优点,是一种十分理想的锂离子电池负极材料.但是,天然石墨与电解液相容性较差,充放电过程中容易发生由于溶剂化锂离子共插入而引起的石墨片层剥离,进而造成循环性能下降,倍率性能差等缺陷,4,5影响了它的进一步应用.针对这些问题,国内外展开相应的研究,对天然石墨进行表面改性和修饰,改善其电化学性能.目前,常见的改性方法包括表面氧化、6,7碳包覆、8,9金属包覆、10,11掺杂其它非碳元素12,13等.其中碳包覆法取得了较好的效果且最易在工业化中实施.然而,碳包覆过程中不可避免地会形成一些没有被包覆在天然石墨表面的热解碳并且经常会遇到包覆过量以及包覆不完全的问题,对材料的容量、循环性能等方面产生不利影响.14,15对此,Zhao等4在碳包覆前预先对天然石墨进行氧化处理,随之用原位聚合法在氧化处理后的天然石墨表面包覆一层间苯二酚甲醛树脂,并高温碳化,取得较好的效果.本文采用浓硫酸对天然石墨进行氧化处理,氧化处理后的天然石墨再以酚醛树脂溶液包覆,包覆方法为更易实现工业化的物理浸渍法,随后在高温下碳化,得到以氧化天然石墨为核心,酚醛树脂热解碳为外壳的核壳型结构改性天然石墨材料,并系统研究了酚醛树脂包覆含量对改性复合材料表面形貌以及电化学性能的影响.2实验2.1氧化石墨的制备取40g球形天然石墨(山东)于圆底烧瓶中,加入100mL98%的H2SO4溶液(分析纯)将其完全浸没,200°C油浴10h,过滤,所得产物经去离子水反复洗涤、过滤后烘干,得到氧化天然石墨.2.2碳包覆氧化石墨的制备将酚醛树脂的乙醇溶液与一定质量的氧化天然石墨均匀混合,分别制成酚醛树脂与氧化天然石墨质量比为5:95,7:93,9:91,11:89的混合溶液.常温下搅拌5h,70°C缓慢蒸发掉乙醇溶液,烘干.在氮气气氛保护下,所得产物在100°C固化1h,再以2°C·min-1的升温速度升温至900°C碳化3h.碳化后所得产物经250目筛过滤,得酚醛树脂包覆氧化天然石墨.按上述酚醛树脂不同质量百分比,将材料分别标记为ONG-5、ONG-7、ONG-9、ONG-11(5、7、9、11代表酚醛树脂的质量分数分别为5%、7%、9%、11%),同时将未经处理的天然石墨标记为NG,氧化天然石墨标记为ONG.2.3材料的物理表征采用X射线粉末衍射仪(XRD,Brucker D8,德国)和激光显微拉曼光谱仪(Renishaw inVia Reflex,英国)表征氧化及包覆前后天然石墨晶体结构;扫描电子显微镜(SEM,Hitachi,FE-SEM S-4800,日本)和透射电子显微镜(TEM,JEOL,JEM-2100F,日本)表征氧化及包覆前后天然石墨表面形貌及尺寸.2.4电池的组装及测试条件将上述处理的天然石墨、导电炭黑和聚偏氟乙烯(PVDF粘结剂,分析纯)按质量比94:1:5充分混合,在N-甲基吡咯烷酮(NMP,分析纯)溶液中搅拌得均匀浆状物.将所得的粘稠浆料均匀涂覆于铜箔上,70°C烘干后冲压成直径为14mm的电极片,10 MPa下压片.压好的电极片于80°C下真空干燥20 h,除去极片中所含微量的水分与NMP.在氩气手套箱内以制得的极片作为工作电极,金属Li作为对电极,Celgard2300聚丙烯(日本)为隔膜,制成扣式电池,电解液为溶于碳酸乙烯酯(EC)和碳酸二乙酯(DMC)(体积比1:1)混合溶剂中浓度为1mol·L-1的LiPF6溶液(国泰华荣化工新材料有限公司).电池的测试在武汉LAND电池测试系统CT2001A上完成.测试条件:恒电流充放电,电压范围为0-2.5V,电流密度为30mA·g-1.测试过程在室温下进行.3结果与讨论3.1氧化处理与碳包覆前后天然石墨的结构与表面形貌图1为氧化处理以及碳包覆改性前后天然石墨的XRD图.由图1可见,改性处理后天然石墨材料的XRD衍射峰位基本没有发生改变,均含(002)峰,这说明氧化处理与酚醛树脂包覆并碳化改性并没2130高文超等:酚醛树脂包覆氧化天然石墨作为锂离子电池负极材料No.9有破坏天然石墨的基本层状结构.此外,在碳包覆石墨材料的XRD衍射图中,并没有观察到无定形碳所特有的宽峰,这是因为酚醛树脂的包覆量有限,高温碳化后形成的复合材料的外层无定形碳壳非常薄,以至于很难在XRD衍射图中显现出来,但是在SEM和TEM中可以清楚地观察到这层无定形碳壳的存在.从这几种石墨材料的XRD衍射图中还可以观察到,经过氧化处理以及碳包覆改性的天然石墨其(002)峰强度明显小于原始天然石墨材料,并且随着酚醛树脂热解碳包覆含量的增加,(002)峰强逐渐降低.这说明石墨材料的结晶度随着氧化处理与碳包覆改性过程的进行而降低,结晶度的降低意味着石墨材料表面的无序化结构增加,进而说明酚醛树脂已经被成功地包覆在球形天然石墨表面,并且经过高温热解,在球形天然石墨表面形成了一层热解碳壳.图2为氧化处理以及碳包覆改性前后天然石墨的Raman光谱图.Raman光谱可以反映石墨表面的无序程度.由图2可见,这六种石墨材料均含有两个Raman峰,分别位于1580cm-1(G峰)与1360cm-1(D 峰)处.其中位于1580cm-1处的G峰被指认为sp2电子结构的E2g联合振动模式,对应石墨片层的芳环结构碳;在1360cm-1处的D峰被指认为类金刚石碳sp3电子结构的A1g联合振动模式,对应石墨片层的边缘碳和无序碳.16因此可以用I D/I G来表征碳材料的石墨化度R(R＝I D/I G).17由图2可见,R值随着氧化处理与碳包覆的进行而增大,这说明氧化处理与碳包覆改性增大了天然石墨材料表面的无序化程度,特别是碳包覆改性过程,随着酚醛树脂包覆含量的不断增加,R值不断增大,天然石墨表面无序化程度不断加强.表明酚醛树脂已经被成功地包覆在球形天然石墨表面,并且经过高温热解,在球形天然石墨表面形成了一层热解碳壳,这与XRD显示的结果一致.图3为氧化处理以及碳包覆改性前后天然石墨的SEM图.由图3a可见,未经处理的天然石墨表面存在一些明显的裂纹和缺陷.在充放电过程中,溶剂化锂离子很容易通过这些裂纹与缺陷进入天然石墨层间,引起天然石墨材料的体积膨胀与片层剥离,最终导致其循环性能下降.由图3(b-f)可见,氧化处理和碳包覆改性有效修复了天然石墨表面存在的裂纹与缺陷状况,明显改善了天然石墨的表面形貌.这一修复作用在碳包覆改性过程中表现得尤为明显.外层酚醛树脂热解碳的存在有效覆盖住了天然石墨表面的裂纹、缺陷.随着酚醛树脂包覆含量的增加,天然石墨表面逐渐变得更为光滑,裂纹和缺陷慢慢消失.当酚醛树脂包覆含量达9%时,天然石墨表面的裂纹与缺陷基本消失,由图4可见,此时天然石墨表面形成一层均匀的,厚度约为20nm 的无定形碳壳,该无定形碳壳的存在将有效改善天然石墨材料的电化学性能.而酚醛树脂包覆含量继续增加时,一些多余的热解碳在天然石墨表面形成结块,另外一些则散落在材料中.这些结块以及散图1石墨样品的XRD图Fig.1XRD patterns of graphite samples(a)natural graphite(NG),(b)natural graphite oxide(ONG),(c)ONG-5,(d)ONG-7,(e)ONG-9,(f)ONG-11;ONG-5,ONG-7,ONG-9,ONG-11denote5%,7%,9%,11%(w)phenolic resin coated on the surface of natural graphite oxide.图2石墨样品的Raman光谱Fig.2Raman spectra of the graphite samples(a)NG,(b)ONG,(c)ONG-5,(d)ONG-7,(e)ONG-9,(f)ONG-11;R=I D/I G2131Vol.27 Acta Phys.-Chim.Sin.2011落在材料中的酚醛树脂热解碳的存在将阻碍锂离子在石墨层中嵌入及脱出,造成其容量衰减.3.2碳包覆含量对改性天然石墨电化学性能的影响图5与表1给出了氧化处理及碳包覆改性前后天然石墨的首次充放电情况.从图5和表1中可以观察到,氧化处理后天然石墨的首次充放电容量及循环效率都得到进一步提高.主要是因为氧化处理去除了天然石墨表面的一些活性较高的基团,使得生成的SEI膜较薄,且更为均匀,进而减小了首次充放电循环过程中的不可逆容量.而对于碳包覆来讲,随碳包覆含量的增加,改性复合材料比容量呈先增加后减小的趋势.当酚醛树脂包覆含量为9%时,复合材料首次充放电比容量最高,其首次放电比容量为434.0mAh·g-1,首次充电比容量为374.8 mAh·g-1,首次充放电效率为86.4%.然而,当酚醛树脂包覆含量继续增加时,复合材料充放电比容量反而呈下降趋势.这可能是由于酚醛树脂热解碳层过厚,阻碍了锂离子插入石墨层间,从而使其充放电图4石墨样品的的TEM图Fig.4TEM images of the graphite samples(a)NG,(b)ONG-9图5电流密度为30mA·g-1时石墨样品的首次充放电曲线Fig.5The initial charge-discharge curves for graphite samples at a current density of30mA·g-1(a)NG,(b)ONG,(c)ONG-5,(d)ONG-7,(e)ONG-9,(f)ONG-11图3石墨样品的SEM图Fig.3SEM images of the graphite samples(a)NG,(b)ONG,(c)ONG-5,(d)ONG-7,(e)ONG-9,(f)ONG-11 2132高文超等:酚醛树脂包覆氧化天然石墨作为锂离子电池负极材料No.9比容量有所降低.图6为氧化处理及碳包覆前后天然石墨的循环充放电性能曲线,充放电电流密度为30mA ·g -1.我们可以看到,酚醛树脂包覆含量为9%的改性天然石墨表现出最为优异的循环性能,经过40次充放电循环后,其放电比容量保持在361.6mAh ·g -1,较未经处理的天然石墨比容量(332.3mAh ·g -1)提高了约30mAh ·g -1.这是因为,适量的酚醛树脂包覆在天然石墨表面形成了一层机械强度较高的缓冲层,该缓冲层的形成有效阻止了由于溶剂共嵌入所引起的石墨结构破坏,提高了石墨负极材料的循环稳定性.而当酚醛树脂包覆含量继续增加时,材料循环性能反而有所下降,过厚的包覆碳层的存在阻碍了锂离子的嵌入和脱嵌.此外,当酚醛树脂包覆含量过多时,很难保证所有的酚醛树脂热解碳都被包覆于石墨材料表面,一些热解碳会散落在石墨材料中,造成了循环性能的下降.图7为酚醛树脂包覆含量为9%的天然石墨与未经处理的天然石墨材料的倍率性能对比图.从图中可以观察到,酚醛树脂包覆含量为9%的改性天然石墨表现出了良好的倍率性能.在330mA ·g -1的电流密度下,其容量仍然保持在150mAh ·g -1以上,较原始天然石墨(60mAh ·g -1)提高了150%.且当电流密度恢复到30mA ·g -1时,其容量基本完全恢复.这可能是由于相比于石墨材料,外层无定形碳材料的层间距更大,锂离子在其中扩散性能较好.这相当于在天然石墨外表面形成一层锂离子缓冲层,从而提高了天然石墨类碳材料的大电流充放电性能.4结论天然石墨经过氧化处理和适量的酚醛树脂热解碳包覆改性后其首次充放电比容量及循环性能得到明显提高.酚醛树脂包覆量为9%时,复合材料表现出最好的电化学性能,其首次放电比容量为434.0mAh ·g -1,循环40次后的放电比容量为361.6mAh ·g -1,且倍率性能良好,在330mA ·g -1的电流密度下进行充放电测试,其容量仍然保持在150mAh ·g -1以上.可见经氧化处理与酚醛树脂热解碳包覆处理后形成的核壳结构有效改善了天然石墨的电化学性能.References(1)Doyle,M.;Fuller,T.F.;Newman,J.J.Electrochem.Soc.1993,140,1526.(2)Whittingham,M.S.Chem.Rev.2004,104(10),4271.(3)Li,F.Q.;Lai,Y .Q.;Zhang,Z.A.;Gao,H.Q.;Yang,J.Acta Phys.-Chim.Sin.2008,24,1302.[李凡群,赖延清,张治安,高宏权,杨娟.物理化学学报,2008,24,1302.](4)Zhao,H.P.;Ren,J.G.;He,X.M.;Li,J.J.;Jiang,C.Y .;Wan,C.R.Electrochim.Acta 2007,52,6006.(5)Yoshio,M.;Wang,H.;Fukuda,K.;Hara,Y .;Adachi,Y .J.Electrochem.Soc.2000,147,1245.(6)Mao,W.Q.;Wang,J.M.;Xu,Z.H.;Niu,Z.X.;Zhang,mun.2006,8,1326.C 1:initial charge capacity,D 1:initial discharge capacity,η:initialefficiency,D 40:discharge capacity at the 40th cycle 表1石墨材料的电化学性能Table 1Electrochemical performance of the graphitesamplesSample NG ONG ONG-5ONG-7ONG-9ONG-11C 1/(mAh ·g -1)348.7357.7357.8362.9374.8345.2D 1/(mAh ·g -1)391.3398.5398.7415.9434.0397.7η/%89.189.889.787.286.486.7D 40/(mAh ·g -1)332.3335.1342.2351.2361.6340.9图6电流密度为30mA ·g -1时石墨样品的循环充放电性能图Fig.6Charge-discharge cycling performance curves of graphite samples at a current density of 30mA ·g -1图7石墨样品的倍率性能曲线Fig.7Rate capacity curves of the graphite samples2133Vol.27 Acta Phys.-Chim.Sin.2011(7)Menachem,C.;Wang,Y.;Floners,J.;Peled,E.;Greenbaum,S.G.J.Power 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胶粘剂英文
胶料Glue氨ammonia氨基氰cyanamide氨基树脂胶粘剂amino resin adhesive氨基塑料树脂aminoplastic resin氨水ammonia liquor半耐久性胶粘剂semi-durable adhesive半溶性酚醛树脂resitol薄膜胶；胶膜纸film adhesive苯benzene苯酚phenol苯酚-间苯二混合物phenoresorcin苯酚甲醛树脂phenol formaldehyde resin苯酚甲醛树脂胶phenol formaldehydesynthetic resin苯酚热固树脂phenol thermosetting resin苯基二氯胺phenyl dichloramine (P.D.A)丙阶酚醛树脂；不溶性酚醛树脂resit (e)丙酮acetone丙烯propylene (= propene)丙烯醛树脂acrylic thermoplastic resin丙烯热朔性树脂acrylic thermoplastic resin丙烯酸（类）树脂acrylic acid resin丙烯酸甲脂methyl acrylate不连续涂胶glue applied in discrete spots不溶物质insoluble substance不溶于水water insoluble不受强酸影响not affected by strong acids不需要固化剂no hardener required部分稀释partially dilutable部分与水混合partially water miscible采脂resin tapping沉淀消失precipitate dissolves陈化时间assembly time; curing time迟缓剂retarder; retarding agent枞酸甲酯methy abietate粗汽油；轻油naphtha催化（作用）catalysis催化剂catalyst萃取extracte达玛（氧化）树脂；不溶树脂dammar resin单面涂胶single sutface spreading单体monomer蛋白胶protein glueprotein adhesive; albumin glue 导电性胶electrically conductive adhesive导电性胶粘剂electrically conductive adhesive低克分子量聚合物low MW polymers低温固化low-temperature setting底浓度溶液low viscosity solution 点状胶合spotty bond淀粉胶starch glue; dextrin(e) adhesive淀粉胶粘剂starch adhesive动物胶animal glue;(size; adhesive)豆胶粉soybean glue ; soybean meal glue毒性toxic对位取代para-substitution多元醇（缩合）树脂polybasic alcohol resin二次固化afrer-cure二聚物；二聚体dimer二聚作用dimerization二羟甲基脲dimethylol urea(DMU)二氢枞酸甲酯menthyl dihydroabietate二氧化碳carbon dioxide发泡剂foamer芳樟醇linalool芳樟基linalyl防水胶（1类）perfect water resistance(tape1)防水胶，耐水胶waterproof glue防水胶粘剂moisture-proof adhesive防水乳胶emulision water repellent放热的exoth分馏fraction分馏塔fractionating tower分散剂disperse agent酚醇phenolic alcohol酚基phenolic group酚醛胶phenol glue; phenolic adhesive酚醛树脂phenok resin; phenol-fornaldehyde resin; phenol aldehyde resin 酚醛树脂胶粘剂phenol aldehyde resin adhesive; phenolic-adhesive粉状固化剂powder hardener粉状胶powder glue封边涂胶edge gluing封边涂胶机edge gluer; glue alpplicator for edge呋喃furan(e);furfuran呋喃甲醇；糖醇furfuryl alcohol呋喃甲醛；糖醛furfural; furaldehyde呋喃树脂furan(e) resin呋喃树脂胶粘剂furan(e) resin adhesive呋喃烷furanidine腐蚀性corrosive干混合胶dry mixing glue高频固化radio-frequency curing高频胶合radio-frequency gluing高温固化胶high temperature setting glue高粘度溶液high viscosity solution高粘度液体high viscosity liquid工作周期operating cycle骨胶bone glue鼓泡blister固化（或硬化）期setting-up period固化过程curing process固化剂curing agent; hardener固化时间curing time;setting time固化速度curing velocity固化温度setting tenoerature固体（树脂）含量solid content固体胶solid resin辊涂机roller coater滚筒搅拌机drum mixer滚筒式搅拌机cylinder gluing machine过量的碱excess alkali过氧化氢异丙基苯cumene hydrogen peroxide海松酸甲脂methyl pimarate合成胶synthetic glue合成胶料synthetic size合成树脂胶synthetic resin glue合成树脂胶粘剂synthetic resin adhesive合成有机胶粘剂synthetic organic adhesives环氧芳樟醇epoxy linalool环氧酚醛树脂胶粘机epoxy-phenolic adhesive环氧树脂epoxy resin环氧树脂胶粘机epoxy resin adhesive回流reflux混合胶mix(ed) glue混合阶段blending stage活性剂activator活性期（有效期）pot life活性炭active carbon挤涂机extrusion coater加速老化aging accelerated甲醇methanol; methane alcohol甲酚树脂胶cresol resin adhesive甲基丙烯酸甲脂methyl methacrylate甲阶酚醛树脂；可溶性酚醛树脂resol甲醛formaldehyde甲醛树脂formaldehyde resin甲醛水溶液（水合甲醇）formaldehyde in aqueous solution;formalin 甲氧基methoxyl group间苯二酚resorcinol间苯二酚甲醛树脂胶粘机resorcinol formaldehyde adhesive间苯二酚胶resorcinol glue间苯二酚树脂resorcinol resin间苯二酚树脂胶粘机resorcinol resin adhesive间歇式搅拌机batch碱性条件alkaling conndition碱性制备alkaling preparation胶斑glue stain;gum spot 胶层glue line胶层加热glue -lone heating胶层太厚excess glue line胶称重装置glue weighing device胶合；粘附；附着adhesion胶合板用调制胶mixed glue for plywood胶合剪切强度glue shear strength胶合剪切试验glue shear test胶合牢度size fastness胶合木构件glue laminated constructions胶合强度glue strength; bonding strength胶合溶液配料batching of binder solution胶合时间gluing time胶合性质gluing property(properties)胶结bonding;gluing胶料溶剂adhesive solvent胶膜glue film胶膜纸film adhesive胶凝gel; gelatinize胶凝剂gelatinize; gel-forming agent; gelling agent; gel sensitizer 胶凝期（时间）gelation胶凝作用gelificarion; gelling; gelatination胶破坏glue failure胶倾析槽glue decanting pit胶乳latex胶渗透glue penetration胶雾glue mist胶循环泵glue circulating pump胶粘剂adhesive; agglutinant; tackiness agent; sticking agent胶粘性adhesiveness; tackiness焦炭coke接触剂;促进剂accelerator接触胶close contact glue接触胶粘剂cintact adhesive静电喷涂electeo-state coating; electro-static spray coating局部胶合spot gluing聚氨脂树脂胶粘剂polyurethane resin sdhesive聚苯乙烯polystyrene聚合体pokymer聚合作用放热exothermic polymerization聚氯乙烯polyvinyl chloride(PVC)聚偏二氯乙烯polyvinylidene chloride (PVDC)聚四氟乙烯polytetrafluoro ethylene(PTFE)聚乙酸乙烯polyvinyl acetate emulsion聚乙酸乙烯胶粘剂polyvinyl acetate resin adhesive聚乙酸乙烯脂polyvinyl acetate(PVA)聚脂热固树脂polyester thermosetting resin聚酯树脂polyester resin开式陈化时间open time; open waiting糠醇；呋喃甲醇furancarbinol; furfuryl alcohol; furfuralcohol糠醛furaldehyde; furfural; furfuraldaldehyde; furfurol; oil of ants 糠醛树脂胶粘剂furfural; resin adhesive抗刮花scratch-resisfant抗湿剂moisture retardant可溶性降低reduction in solubility可涂布时间spreadable time快速固化expediting setting老化时间aging time老化试验weathering test胳蛋白；胳朊casein胳朊大豆胶casein-soybean glue胳素胶casein glue胳素胶粘剂casein adhesive冷固性胶cold setting glue冷固性胳素胶cold setting casein glue冷胶合cold gluing冷凝固cold-setting冷凝固胶粘剂cold-setting adhesive冷却阶段cooling stage冷杉胶fir balsam离缝gap; open joint立式涂胶剂fall shaft glue spreader粒状胶；未加工的胶coarse glue粒紫胶seed lac淋涂机curtain coater流脂tesin flux;resinosis; resin flow硫化；硫化作用sulphidizing氯苯chlorobenzene; chlorobenzoyl氯丁橡胶粘剂neoprene adhesive密胺树脂；三聚氰胺树脂melamine resin密胺甲醛树脂melamine-formaldehyde resin摩尔比molar ratio耐风雨weather proof耐光照light-fast耐侯性胶粘剂weather proof adhesive耐化学药品chemically resistant耐水胶（2类）common water resistance(type2)难熔化的infusible粘稠液体viscous liquid粘弹特性viscoelastic behavior粘度viscosity粘度单位-泊viscosity unit-poise粘合剂binder粘胶viscoder粘胶（人造）丝viscose silk粘胶液viscose粘接剂bonding agent粘接稳定bonding resistant 粘性tack粘性胶体viscoloid粘性凝胶viscogel粘性期tack range尿醛胶urea-formaldehyde glue尿醛树脂urea formaldehyde (UF) resin尿素urea (= carbamide)尿素树脂胶粘剂carbamide resin adhesive脲醛树脂Aminocel凝胶状酚醛聚合物gelled PF polymer浓缩尿醛树脂concentrated urea formaldehyde resin 泡沫胶foam glue配方规定量formula ratio配方调整formula adjustment配胶glue preparation配料车间furnishing department喷热处理；蒸汽处理steam treatment喷涂spray coating喷涂机spraying coater喷雾施胶机spray glue applicator皮胶hide glue; leather glue强化松香胶料Cyfor; fortified resin size强酸strong acid羟甲基methylol groups羟甲基苯酚methylol phenol羟甲基化methylolation羟甲基化反应methylolation reaction羟甲基脲methylol urea亲水的hydrophilic氰氨（基）化钙calcium cyanamied全铰链聚合物fully cross-linked polymer热固thermosetting热固（性）胶粘剂hot-setting adhesive热固化hot setting; thermoset热固性合成树脂thermosetting artificial resin热固性胶glue of hot setting热固性胶粘剂hot-setting adhesive热固性树脂heat convertible resin热固性树脂胶合剂thermosetting resin adhesive热冷熔胶PVAC-gluing热熔胶thermosol热融hot melt热朔树脂thermoplastic resin热朔性thermoplastic热朔性树脂胶合剂thermoplastic resin adhesive韧性胶tough glue乳化剂emulsifier三官能引发剂trifunctional initiator三聚氰胺（甲醛）树脂melamine resin三聚氰胺醇酸树脂胶粘剂melamine alkyd resin adhesive三聚氰胺酚醛树脂melamine-phenolic resin三聚氰胺甲醛树脂melamine formaldehyde resin三聚氰胺甲醛树脂胶melamine-formaldehyde resin glue三聚氰胺胶melamine glue; melamine resin glue三聚氰胺浸渍纸melamine impregnated paper三聚氰胺脲醛树脂melamine urea-formaldehyde resin三聚氰胺树脂（粘剂）melamine resin adhesive三维结构的聚合物分子three dimensional polymeric molecules 上胶glue sizing施胶槽（桶）sizing-tub (vat)施胶辊sizing roll施胶剂sizing agent施胶量rate of spreading施胶强度size fastness试管胶凝时间test tube gelling times收敛剂astringent树胶wood-gum树脂改性木材resin modified wood树脂含量resin content树脂胶resin glue; resin adhesive树脂酸resin acid; resinolic acid树脂酸树脂resinolic acid resin双氰胺；二聚氨基氰dicyandiamide水杨酸甲酯methyl salicylate水中浸泡water immersion缩合（作用）condensation缩合反应condensation reaction缩合剂condensating agent缩甲醛formal缩聚（作用）polymerization缩醛树脂acetal resin碳化钙calcium carbide糖醛基uronic groups天然树脂natural resin添加剂additive填缝gap-filling填缝用的胶glue for gap filling填料filler调胶glue mix调胶机glue blender; glue mixer; glue dissolver酮ketone涂胶glue spread(ing)涂胶辊glue spreading roll涂胶时间spreading time of glue脱氢枞酸甲酯methyl dehydroabietate脱水剂glue waterless完全水溶fully water soluble温度-粘度曲线temperature-viscosity graph 稳定性低low stability无定形沉淀amorphous precipitate无机胶inorganic glue无机粘合剂binder inorganic; inorganic adhesive细木工胶wood glue; joiner’s glue纤维素胶合剂cellulose adhesive橡胶状的rubbery新枞酸甲酯methyl neoabietate需要固化剂交链hardener required to cross link血胶blood glue; blood adhesive亚氨基imidogen; imido-group亚甲基交链键methylene bonding groups亚甲基醚键连接基methylene ether bonding groups 亚甲基尿素化合物methylene urea compounds氧化oxidation氧化剂oxidizing agent液化liquification液体状胶wet mix glue乙醇alcohol乙酸；醋酸acetic acid乙酸甲酯methyl acetate异丙基苯cumene异构体isomer异海松酸甲酯methyl isopimarate硬化剂stiffening agent; stiffener; hardener硬树脂solid resin游离氨基free amino groups游离酚含量free phenol content游离醛free aldehyde有机溶液organic solvent有无限的贮存稳定性infinitely storage stable鱼胶fish glue预混合premix增量剂（胶）extender (of glue)增强剂fortifier增塑剂plasticizer; plasticizing agent增塑增溶剂plasticizer extender增粘剂tackifier褶层pleat蒸发阶段evaporation stage植物胶vegetable glue酯胶ester gum中和阶段neutralization stage中间阶段intermediate stage肋催化剂；助聚剂promoter贮胶罐glue pot组合胶assembly glue组合胶粘剂assembly adhesive。
铸造专业英语词汇
铸造专业英语词汇分部心型sectional core分层浇口side step gating分层进模口side step gate分层精炼法zone refining分次式混合机batch mixer分次式火炉batch type annealing furnace分次式磨粉机batch mill分次式配砂场batch sand plant分次式熔炉batch furnace，batch-type furnace) 分次退火炉periodic annealing furnace分道砖runner core分度盘dividing plate分度圈limb分段淬火interrupted quenching分段淬火stage hardening分段淬火step quenching分段时效interrupted aging分段退火stepped annealing分级，刻度graduation分级节(模砂) classifying screen分级进模口steeped sprue分级进模口step gate分级进模口stepped side gate分级进模口铸造step gate casting分级筛grading screen分级筛size screen分级摇动筛size jigging screen分级硬度gradient hardness分件图parts drawing分解resolution别离器separator别离筛sepaating screen别离型波来铁(球状云明碳机) divorced pearlite 分模粉parting powder分模剂parting agent分模剂parting pound分模面mold joint分模面parting surface分模面进模口parting gate分模砂parting sand分模线parting line分模纸parting paper分配流槽distributing launder分配销(压铸) sprue pin分支砂心，分支心模branch core分铸试验separately cast test bar分子molecule酚phenol酚<>喃树脂phenolic furan resin酚甲醛树脂phenol-formaldehyde resin 酚树脂phenolic resin酚塑，黏结剂phenol plast binder粉煤powdered coal粉煤pulverized coal粉煤装置powdeed coal equipment粉末金属powdered metal粉末金属机件powdered metal parts粉末冶金，粉末冶金术powder metallurgy粉状石墨plumbago封闭sealing封闭剂sealing pound封闭砂条sealing ring封罐退火pot annealing封合模型，分割模型parted pattern封盒退火box annealing封漏，浸入impregnation风锤air hammer风管输送机pneumatic tube conveyer风管输送系统penumatic tube dispatch system 风化石锥辗硅砂conical sand from stone风口，风嘴tuyere风口棒tuyere bar风口比tuyere ratio风口带tuyere zone风口面buyere line风力分级air classification风力净化法air cleaning process 风量，体积air volume风量计air volume meter风量计blast volume meter风量控制仪air weight controller 风干air drying风干法air seasoning风干强度air strength风干强度air-dried strength风扇fan风速计anemometer风箱air belt风箱air box风箱air tank风箱wind belt风箱wind box风硬air hardening风硬钢air-hardening steel枫木maple蜂巢炉beehive oven蜂巢炉焦炭beehive coke蜂蜡bees wax伏利安[气体]搅拌法voianik method 氟(F) fluorine浮渣dross浮渣incrustation浮渣，夹渣scum浮渣，撇渣skim幅射高温计radiation pyrometer幅射管炉radiant tube furnace复合辊posite roll复合接种剂plex inoculant复合涂膜plex coating复合形砂pound sand复合铸造posite casting复磷repetition castings复热器recuperator复热系统recuperative system复置模型试模replacing pattern in the mold 复制品replica腐蚀corrosion腐蚀脆化corrosion embrittlement附件accessories附浇口系模型gated pattern附设铸工场capitive foundry附设铸工场tied foundry附体试杆cast-on bar附体试杆cast-on test bar附体试片test coupon附体试片test lug附体试验attached test coupon负偏析negative segregation负载load副产焦炭by-product coke副电流sedondary current副料indirect materials副线圈secondary coil腹板web覆盖热cover heating折心展性铸铁iron oxide covering覆盖层[熔剂], 涂层covering flux钆(Cd)(烯土金属) gadolinium改进合金modified alloy钙(Ca) calcium钙系膨土calcium bentonite灰汁，碱水lye盖M法，疏塞气体搅拌法Gazal process甘油glycerine坩埚crucible坩埚底座，垫砖stool坩埚式感应电炉coreless induction furance 坩蜗吊钳crucible lifter坩蜗法crucible process坩蜗钢crucible steel坩蜗浇铸装置crucible pouring device坩蜗炉crucible furnace坩蜗钳crucible tongs坩蜗涂浆crucible wash杆，棒，条bar杆盘松砂机spike disintegrator杆条矫直机rod straightener感应淬火induction quenching感应电炉electric induction furnace感应电炉induction furnace感应加热induction heating感应器inductor感应线圈induction coil感应硬化induction hardening橄榄石砂oliving sand刚铝，杜拉铝duralumin刚铝石alundum刚模半边(压铸) die half，die cast刚模钢die steel刚模试验(压铸) die try-out，die cast 刚模穴(压铸模) die cavity刚砂emery刚性rigidity刚玉corundum纲丝netting wire纲状组织(金相) net-work structure 钢steel钢厂steel works钢锭steel ingot钢坩埚steel crucible钢皮镁砖metal-case magnesite brick 钢输送带steel conveyor belt钢水瓢，抹砂匙spoon钢水瓢测温法spoon test钢丝钳pliers钢丝刷wire brush钢丝索wire rope钢丝位wire cut钢条bar steel钢条steel bar钢线粒cut wire shot钢屑，废钢料steel scrap钢性铸铁semi-steel钢铸件steel castings傲慢砂blended sand高级钢high-grade steel高级铸铁high class cast iron高级铸铁high grade cast iron高加波感应电炉，高频率感应电炉high frequency induction furance高架磁选机overhead magnetic seperator高架单轨overhead monorail高架起重机gantry crane高拉力黄铜high tensile brast高拉力铸铁，高强度铸铁high tension cast iron 高磷生铁high phosphorus pig iron高磷生铁phosphoric pig iron高岭石kaolinite高岭土kaolin高硫钢(易切钢之一种) sulphur steel高炉shaft furnace高炉，鼓风炉blast furnace高炉焦furnace coke高炉煤焦，鼓风煤焦blast furnace coke高铝红柱石mullite高锰钢Hadfield's manganese steel高锰钢铸件high manganese steel castings 高黏土砂fat sand高黏土铸砂loamy sand高强度钢，高拉力钢high tension steel高强度黄铜high strength brass高强度铸铁high strength cast iron高碳钢high carbon steel高温淬火hot quenching高温计pyrometer高温耐火砖highly refractory brick高温强度(铸砂用) hot strength高温烧结high sintering高温试验hot test高温冶金学pyrometallurgy高硅生铁silvery iron高硅砖high siliceous brick高压罐bomb高压水清砂机hydro-blast高压造模法high pressure molding高氧化铝砖high-alumina brick高氧砖alumina brick高硬度钢glass hard steel高周波枯燥，高频率枯燥dielectric dry高周波枯燥机，高频率枯燥机dielectric dryer高周波砂心枯燥炉hign-frequency core drying stove 搞压试验pression test锆(Zr) zirconium锆砂zircon sand锆石粉zircon flour锆英石zircon格子(结晶) lattice格子构造lattice structure格子筛分输送机grid type screening conveyor格子形耐火砖checker brick隔条砂箱barred box镉(Cd) cadmium铬(Cr) chromium铬钢chrome steel铬基耐火材料chrome base refractories铬克合金nichrome铬镁砂chrome-magnesite铬砂chromite sand铬砂hevi sand铬酸处理chrome pickle treatment铬酸处理(镁锌铸件镀铬) dichromate treatment 铬铁ferro-chromium铬铁矿chromite铬铸铁chrome cast iron铬砖chromite brick给砂机sand expansion工地熔接site weld工具tool工具钢tool steel工具台tool table工模jig工资labor cost工作场所working aea工作大纲图表outline process chart 工作路线排定rounding工作台working table工作图，制造图working drawing 弓锯hack saw弓锯机hack-sawing machine公差tolerance公忽micron(u)汞(水银)(Hg) mercury拱arch拱砖arch brick共晶eutectic共晶点eutectic point共晶反响eutectic peaction共晶合金eutectic alloy共晶石墨eutectic graphite共晶温度eutectic temperature 共晶细胞eutectic cell共晶细胞数eutectic cell count 共晶雪明碳铁eutectic cementite 共晶铸铁eutectic cast iron共晶组织eutectic structure共析eutectoid共析反响eutectoid reaction共析钢eutectoid steel共析组织eutectoid structure钩hook购入废料purchused scrap股strand骨架模型skeleton pattern钴60，钴六十cobalt 60鼓风blast鼓风，喷风air blast鼓风调节器blast regulator鼓风管blast pipe鼓风机blower鼓风计blast gage鼓风计blast meter鼓风控制blast control鼓风量blast volume鼓风门blast gate鼓风压力blast pressure鼓风重量blast weight榖粉黏结剂cereal binder固定板fixed plate固定环fixed collar固定浇桶stationary ladle固定模，固定压铸模fixed die固定模板，固定压铸模板fixed die plate 固定磨轮机(法飞边) fioor grinder固定式摔砂造模机stationary slinger 固定碳fixed carbon固熔体solid solution固态合金损失impoverishment固体，实体solid固体收缩solid contraction固相曲线solidus curve固相线solidus固相线solidus line固硬性树脂黏结剂no-bake binder 刮板输送机scraper conveyor刮板造模template molding刮尺(板) strike -off bar刮刀，刮板scraper刮痕scratch刮痕保护surface scratching test刮痕硬度试验scratch hardness test 刮浆板loam board刮平strike strike off刮砂strick刮砂striking off sand刮心平刮板core strickle观察孔observation hole管，缩孔，缩管(铸疵) pipe管件，管接头pipe fittings管抹镘pipe sleeker管制图表control chart管状竖浇刀切刀tubular sprue cutter 管状心型撑pipe chaplet贯穿炉straight-flow furnace惯性集尘器inertia dust collector灌浆grouting灌浆造模法grout molding灌模能力(浇铸) filling capacity罐，釜pot光镘smother光面加工hardwarefinish光谱分析spectroscopic analysis光谱照相spectrograph光学高温计optical pyrometer光学显微镜optical microscope光泽碳(添加剂) lustrous carbon 规，量规，表，计gage(gauge) 规，量规，表，计gauge，gage规测gaging规格外合金off grade metal龟甲纹(铁水面) tortoise shell figure 轨道track贵金属noble metal滚光barreling滚光机，滚筒tumbling barrel滚光机，滚筒tumbling mill滚光机，滚筒，齿轮换向器tumbler 滚光机，滚筒，齿轮换向器tumbling滚式浇桶barrel type ladle滚台喷粒机shot tumblast滚筒试验(铸焦) tubmbler test滚转机rollover machine滚子床，滚子输送器roller bed滚子输送机rooler conveyer滚子输送机岔道roller conveyer switch滚子输送机台roller conveyer table滚子台roller table辊碎机roll crusher辊轧厂，辊轧机rolling mill辊轧机roller mill锅炉boiler锅炉配件boiler fittings国际铸造工程学会ICFTA(International mittee of Foundry Technical Association)裹冷珠entrapped cold shot裹贴法coating process裹贴砂coated sand过饱和super-saturation过道，通路gangway过低温金属液dull metal过度处理over-treatment过度接种over-inoculation过度应力over-stress过共晶合金hypereutetic alloy过共晶铸铁hypereutectic cast iron 过共析钢hypereutectoid steel过共析铸铁hypereutectoid cast iron 过搅拌(熔铜除氧) over poling过浸蚀over etching过冷super-cooling过冷undercooling过冷石墨undercooled graphite过量金属excess metal过滤filtration过滤袋pocket filter过滤器filter过滤器，滤渣片strainer过滤式集尘器filtration dust collector 过滤心型strainer core过滤用砂心core strainer过热over-heating过热super heat过热处理super heating过热度degree of superheat过热鼓风super-heating blast过热率，升温率super-heating rate 过烧金属，过烧金属液burnt metal 铪(Hf) hafnium海湖滨砂beach or lake sand海军黄铜admiralty brass海军黄铜naval brass海军炮铜admiralty gun-metal海绵铁spongy iron海绵状腐蚀graphitic corrosion海绵状铸件(铸疵) spongy castings海砂sea sand氦(He) helium含尘量dust content含量content含黏土份containing clay汗点(铸疵) sweat焊珠weld bead焊珠修补bead forming号角形进模口，号角形浇口horn gate 合成单元模砂synthetic unit sand合成模砂synthetic molding sand合成黏结剂synthetic binder合成砂synthetic sand合成树脂模型synthetic resin pattern 合成铸铁synthetic cast iron合钉，定位销dowel合钉，定位销dowel pin合金alloy合金钢alloy steel合金钢铸件alloy steel castings 合金晶粒轧辊alloy grain rool合金冷硬轧辊alloy chilled rool 合金生铁alloy pig iron合金元素alloying element合金铸钢alloy cast steel合金铸铁alloy cast iron合理方案rationalization scheme 合模，装配assembly合模飞边joint fin合模飞边joint flash合模机closing device合模机top box closing machine 合模记号assembly mark合模记号sighting mark合模记号tally mark合模记号，假中间模箱false cheek合模面joint face合模面joint surface合模面边角压坏crushes of parting edge 合模面压坏crushes of parting surface 合模填缝，合模封条joint sealing合模线joint line合模线，装配机assembly line合模销closing pin合模销mold closing pin合模销projection合模楔子closing wedge合模压(压铸模) die closing force合模装置mold closing mechanism合砂机sand blender合箱机molding box closing device合箱销子flask pins合用应力operating stress河砂river sand褐煤lingite褐铁矿limonite黑浆black wash黑浆blacking wash黑铅，石墨black lead黑色涂料foundry blacking黑涂料black黑心展性铸铁，黑心可锻铸铁blackheart malleable cast iron痕迹，微量trace恒久连续铸造permanent continuous casting恒温器，整温器thermostat横断面cross section横拱transverse arch横流道cross gate横流道，浇槽，出铁槽，轨轮(起重机) runner 横流道尾extended runner横流道尾runner extension横强度transverse strength横弯曲试验transverse bending test横行输送机transverse conveyor。
ccl覆铜板（CCL覆铜板）
ccl 覆铜板（CCL 覆铜板）一、铜箔基板CCL（覆铜板）简称CCL，为PC板的重要机构组件。
它是由铜箔（皮）、树脂（肉）、补强材料（骨骼）、及其它功能补强添加物（组织）组成。
PC板种类层数应用领域纸质酚醛树脂单、双面板（＆FR1，FR2）电视、显示器、电源供应器、音响、复印机、录放机、计算器、电话机、游乐器、键盘环氧树脂复合基材单、双面板（CEM1、CEM3）电视、显示器、电源供应器、高级音响、电话机、游乐器、汽车用电子产品、鼠标、电子记事本玻纤布环氧树脂单、双面板（4）适配卡、计算机外设设备、通讯设备、无线电话机、手表、游乐器玻纤布环氧树脂多层板（FR4和FR5）桌上型计算机、笔记型计算机、掌上型计算机、硬盘机、文书处理机、呼叫器、行动电话、IC卡、数字电视音响、传真机、汽车工业、军用设备二、特征码定位器CCL寻找出防病毒软件报警的PE文件（病毒、木马等）中恶意代码的位置◆强大的自动检测功能，可以定位PE文件中的多处特征码◆自由的参数设置，定制自己的手动检测◆可以选择定位精度和检测范围◆可以对某区间填充0，排除该区间的干扰◆可以浏览定位结果并保存一般印制板用基板材料可分为两大类：刚性基板材料和柔性基板材料。
一般刚性基板材料的重要品种是覆铜板。
它是用增强材料（加固材料），浸以树脂胶黏剂，通过烘干、裁剪、叠合成坯料，然后覆上铜箔，用钢板作为模具，在热压机中经高温高压成形加工而制成的。
一般的多层板用的半固化片，则是覆铜板在制作过程中的半成品（多为玻璃布浸以树脂，经干燥加工而成）。
覆铜箔板的分类方法有多种。
一般按板的增强材料不同，可划分为：纸基、玻璃纤维布基、复合基（CEM系列）、积层多层板基和特殊材料基（陶瓷、金属芯基等）五大类。
若按板所采用的树脂胶黏剂不同进行分类，常见的纸基CCI。
有：酚醛树脂（XPC、xxxpc、FR一1、FR一2等）、环氧树脂（Fe一3）、聚酯树脂等各种类型。
常见的玻璃纤维布基CCL有环氧树脂（FR-4、FR-5），它是目前最广泛使用的玻璃纤维布基类型。
防腐蚀涂料(Anticorrosive coating)
防腐蚀涂料（Anticorrosive coating）防腐蚀涂料（Anticorrosive coating）This paper consists of 316935929 contributionsPdf documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view.-.Page.20 / 46220.72) P0I2, one, 0815 (80.9; ICH1109B)Sperm CsttogrsascaAcid) 3% (two - 9 equivalent) of the acid component, 00 (alcohol, heat, flexibility, and electrical insulation). Coated conductors (coated with an amide insulating coating) and coated with an enamelled wire with the composition. For example, useTwo a two amino benzene methane benzene two formic acid two methyl glycol phenyl anhydride of three B a partial (ethyl) isocyanurate copolymer composition coated copper wire, bake 2 hydroxyl ISO roast, the breakdown voltage of enameled wire in the 70g load is l.k, 017VThe conductive coating contains a silicone base material and a conductive polymer, and is prepared in the organic (- ethyl) - 2 hydroxy urea ester. The composition has a good dispersion in solvent resistance. The workpiece has a conductive (or antistatic) coating on the base material (e.g., plastics, rubber, glass, metal, ceramics, and paper). For example, WD12N- 060 (ethyl silicate solution) methanol mixture, a composition, with its 08 water and coated with H1W (E) K3FPT film, drying, the conductive coating mist.% 03, 11 x 1 "E surface resistance, pencil hardness 2. L0Q /.HM (conductive polymer polyaniline doped with methanol dispersion) N - one of BK45 polymers containing long chain amino acid polyester amide salt containing 4.T and TLY0 (and), 4The softening resistance is 45o. 2C21019 inorganic high temperature antistatic coating: Cl1705 [0070N065, 0AChina's patent for invention patent / China: North coatings industry research and Design Institute (Wang 21014) an insulating coating for overhead high voltage wires and its preparation 0071Zhiqiang etc.) 21..0 111 (91;.0003.20902948020.13) a6ICC9l0P0D / 0 method: C1189 [country to apply for a patent for invention: China: N07148A PLA University of Science and Technology Engineering / China Force Engineering Institute (Harvest etc.) 21. gold.0 0O.1.011911 (000.8:ICC9I7I72, 210010.21.12) P0D / 80221010 preparation of solvent-free long lasting antistaticcoating: C110071N070lA China to apply for a patent for invention: North China: 6L / 3 coatings industry research and Design Institute (Xi fachen etc.) 21..0 01l1..0003.209029461, one, 6(1) I01 / 2910PCD600.3; c923;Anticorrosive coating21011 rare earth modified barium zirconate titanate nano powder as anti corrosion 21015 conductive filler and aqueous coating of metal and plastic adhesion 00710071Electrostatic coating and its preparation method: C1185lA @ China invention special agent and its preparation: W20 48, N0711Es009l490 international patent application date: Japan / apply for public benefit. China: Harbin Institute of Technology (21.7.00. / Hao Sue) 021.211176232.40) ICC916 / 2000. (010.1:P0D30030)DCCroainSiaaiJn) 20.20.5Ioprto (hrkm, u, etc..091. one, 8 pages. One, 3, one.)J20 / 65820.52) ICC9110P0812 (80.6; P0D / 635)The finishing agent containing a () A core-shell type resin particle, with each particle (A) shell (by carboxyl orcarboxylic acid ester; / T and 2000 N0 ~ 550m? Mlgo / K alicyclic structure prepared polyurethane) (nuclear layer (and) containing basic nitrogen atoms theElectrical insulating coating21012 polyamide polyimide coating and insulated wire: 0071In the case of ethyl acetate, 07:0 olefin polymer is better than AA / 1 ~ 03 ~B (9) and with epoxy group (Group); alcohol / water dry our silicon O (B) with dry mouth) or silicon B}A compound of alkyl groups. A water-based coating containing Z6400 and a core / shell treeJ2111l Japan Patent: Japan: Smtmlcrc fat particles (by butyl acrylate, P0O3 / uiooEeti containing 0 methyl two dimethylamino ethyl methacrylate and methylWnen.ohd, Kno.21.21.1.20 / methyl acrylate was prepared by the 14 nuclear and two methanol cyclohexane, adipic acid, jtcIc (siaeg) 0O0.2 1Y - 08, 130020..8ICC9I907 (0802) P0D / 8977 (A) of the title coatings containing (0O ~ O1B) diisocyanate and.3.3 containing benzene partial equivalentFor example: 1 = 13, 44 D three benzene anhydride copolymer coating. 1, MI bias22 dimethylol propionic acid, neopentyl glycol, ethylenehydrogenation of MI prepared by D and a nuclear shell, 27, light transmittance of 9% TFH / 3:7 shell solution containing the particles, 34)Good in character, solvent resistance and hot water resistance.Three acid anhydride and 12 -, 4 - amino acids,The equivalence ratio of AB is > 1, and the resultant film has good adhesion to metal and plastic, and has the advantages of corrosion resistance, heat resistance, and / orThe insulated wires covered with copper wires have good adhesion, flexibility, heat resistance and impact resistance.21013 dielectric resin composition and enameled wire: J20 - 80071P092685: Japan open Japanese Patent: Htcihmclo, t.ao2 / iaheia.Ld (T, CCS21016 iron base anticorrosive coating water diluted resin composition: 0071J21 758: P038, Japan Japan Patent O / CioaCeiahydhmclC.t.ad, Ai) 21.21.2 page.20 / 0o, Ld (eakoM.0O0.8 - 0 - 8205820.80 05 (80) P2F / ICC3I041;(Sih) 20.21.8, page.20178120.52) EII one, 91, one, C., one, 0819 (080.7:3)ICC87 / 8P0L90The resin composition containing (A = 1) diluted water (B), more than 1 kinds of coupling agents,(C = 1) from aqueous wax, resin modifier, curing agent, waterborne emulsion,In the composition, a long chain amino amide salt of 00 to 1.10 portions of polymeric acid polyester is added to a 10 polyester and 0 imide resins (1, 5) (from 6% to 5Compositions of levelling agents, heterocyclic compounds, organic acids, lanolin derivatives, rosin derivatives, sulfonates and oils, and (D) equilibrium water. For example, the JSG34I11CotaasnS...SThe SC board is soaked in ammonia containing poly ~ (uefe7) three ethanol titanate (PCSprlxl0, IAfter soaking, anticorrosive coating has good adhesion. 21010 has good adhesion, abrasion resistance, alkali resistance, salt resistance and aging 0072 fat rot coating compositions containing phthalate coupling agent of K3R99.72 page (090.0ICC9130 34220.81) P0D / 83Coupling agent) composition of glycidyl methacrylate (and resin modifier)3, and 10C drying 1, the test film thickness of 1 ~ 50sOC0Sm, salt spray test has good corrosion resistance. 21017 anticorrosive coating composition with good ethanol resistance and 0071Corrosion protection coating structure: W21 - 138 international patent application, m0002021..5 one, 6 pages,.J20 / 17420.82) IC002.202, one P0825 (080.1:P2)C9] 700D6 / 6The coating composition comprises acrylic resin 1% to 4%72, and water-based alkyd resin02% to 1, aluminium tripolyphosphate I2%%.5%? 5 ~ 2, zinc phosphate 12%%? ~ 2, 5 ~ 7, 5 iron oxide red iron oxide yellow pigment 1%4 5 ~ 7, 0 ~ 1%,%Ben: S0aHqD] mrC.Ld (ioht, ihai. resin, l%3, fluorocarbon resin 1.5 ~ 1%hwihoye).. T.nsiaMcik) K 1 ~ 1%02%, titanate coupling agent 2matter.sliceNoPolyester composition, the"One..."...OneComposition containing unsaturated polyester () "(" containing 7oIl%:b by B (010) ~ fIf%0 / hAnd () 5%0%c to the main chain and C B containing 0~10 with O side chains of ethylene glycol of multielement 1And water 5%-70%21011 preparation of low shrinkage polyethylene vinyl ester heavy duty anticorrosive coating 0072Composition of alcohols] B and (polymerizable unsaturated monomers). A paint containing peroxide method: CII701A Chinese Chinese. To apply for a patent for invention: North N65 O1 / RF10 and compound, a composition containing 4%5ms (C6 ~ n5%5s ~ party coatings industry research and Design Institute (Li Qingcai) 21.63.01000.0 2090One.A polyester obtained from glycol, 15 amyl glycol and maleic anhydride, 1 of which is formedFor OI%.2, thickness varies to 22. .240820.13) ICC913i012 (091.0:P0D / 96).21012 synthesis of modified waterborne epoxy resin and its anticorrosion coating 0072Aqueous solution and method of 21018 metal surface anticorrosive coating with the European patent application: P0071E21141 / CeiceWreKuh8, in 5 De Dehmsheklte058620..1:ICC91037 (0800): P0D / 08OneChina: Harbin Institute of Technology (Huang Yudong)21.71.2100.000.4 01 P0F8 6. (0. / 1295821.32);ICC82313006021013 two-component epoxy phenolic resin with rust primer and preparation process thereof: 0072 (Guo Fang Zhu) 21? 63? 20802014i20 22).000 (081? 0 - 13 - 4 - 7;Environmental safety anticorrosive coatings for metals, 5I content, C] 160 [5N070i9A] [Chinese patent applications] [Guo Fangzhu, China]Surface modified silica, organic solvents and other additives. IA, a kind of > NJPH is 45. containing 2gL / surface modified silica sol and 02gHr. .Children F and water ICC9111ZP0D6 / 4The composition is coated with a pre treated aluminum plate, a steel plate, and a galvanized sheet surface.:Oh, oh, oh, oh, ohSexual rot... 06 anti C10N11710I.....21015 organic acid resistant coatings developed L / 0072 J Guo Jinyan, paintThe combination of the coating J2100 patent this Ai two ~: 0O76 P3 / Ah SVKsihmclCroainGt, Tii, etc.) 0..AeCeiasoprto (ooej.210040.12 - L pages, 2O / 33. 8O? 7Icc9l?. One 0B27742. (9L) P0D, 82The composition contains I0 partial vinylidene chloride copolymer emulsion (8%0 from 0 to9%5.%% vinyl vinylidene chloride and / or vinyl chloride, 05 ~ 5 with carboxylIndustry.One21, 4 () 1, 30005.3 - 3M 'n3%i% to l other vinyl monomer emulsion polymerization) 00 ~ 321016 two-component waterborne acrylic primer design, M / 5, and Chen.50072 JournalAlkane coupling agent (in latex solids). For example, the pigment dispersion and C China, industrial silicon coatedmaterial ".One2) 00, 4 () 9205. - 6, one, 5Acid butyl acrylate vinyl vinylidene chloride copolymer latex helium (H 4P, by the regulation of ammonia. (05), with latex solids) B03 chloro%KH73 (- propyl trimethoxy silane) sodium nitrite and film-forming agent, a mixed coating obtained. 21017 a polyether polyurethane marine heavy anticorrosive coating and its preparation method: 0072 C1162 N070I3A China to apply for a patent for invention: / Chinese.With the coating of polished steel, drying, and then coated with Plto (Li Yue) 2l..0 ~ 158 (081.6:oylnF LiYue.0003.2O0l90820.12) 68380 acrylic latex base) 3 (acrylic finish), to test piece, get ICC9150P0D187 in water,CoatngsiS...S21018, an underwater painting heavy-duty coating and its preparation method: 0072C1180 [N07155A China patent for invention] in China / ShenyangThe journal / fouling paint Li Shucai and "paint industry.21, 4 (521017)] - 0005.1I containing base polymer and antifouling coatings containing the polymer group 0073 complexes: W21 - 8l4 international patent application, English: LAN.Az00O14 / Ko bearingN B LC I G N E N T O ..我需要它我N E O T、N、Si RW O T R I N （N I是LBV RA D E F科腐蚀控制工程技术中心等（今人等）2 1. 7王。
自己整理的常用电子电路英语词汇
电子专业英语新手必备词汇1 backplane 背板2 Band gap voltage reference 带隙电压参考3 benchtop supply 工作台电源4 Block Diagram 方块图5 Bode Plot 波特图6 Bootstrap 自举7 Bottom FET Bottom FET8 bucket capcitor 桶形电容9 chassis 机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 铁芯饱和13 crossover frequency 交叉频率14 current ripple 纹波电流15 Cycle by Cycle 逐周期16 cycle skipping 周期跳步17 Dead Time 死区时间18 DIE Temperature 核心温度19 Disable 非使能，无效，禁用，关断20 dominant pole 主极点21 Enable 使能，有效，启用22 ESD Rating ESD额定值23 Evaluation Board 评估板24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 超过下面的规格使用可能引起永久的设备损害或设备故障。
建议不要工作在电特性表规定的参数范围以外。
25 Failling edge 下降沿26 figure of merit 品质因数27 float charge voltage 浮充电压28 flyback power stage 反驰式功率级29 forward voltage drop 前向压降30 free-running 自由运行31 Freewheel diode 续流二极管32 Full load 满负载33 gate drive 栅极驱动34 gate drive stage 栅极驱动级35 gerber plot Gerber 图36 ground plane 接地层37 Henry 电感单位：亨利38 Human Body Model 人体模式39 Hysteresis 滞回40 inrush current 涌入电流41 Inverting 反相42 jittery 抖动43 Junction 结点44 Kelvin connection 开尔文连接45 Lead Frame 引脚框架46 Lead Free 无铅47 level-shift 电平移动48 Line regulation 电源调整率49 load regulation 负载调整率50 Lot Number 批号51 Low Dropout 低压差52 Miller 密勒53 node 节点54 Non-Inverting 非反相55 novel 新颖的56 off state 关断状态57 Operating supply voltage 电源工作电压58 out drive stage 输出驱动级59 Out of Phase 异相60 Part Number 产品型号61 pass transistor pass transistor62 P-channel MOSFET P沟道MOSFET63 Phase margin 相位裕度64 Phase Node 开关节点65 portable electronics 便携式电子设备66 power down 掉电67 Power Good 电源正常68 Power Groud 功率地69 Power Save Mode 节电模式70 Power up 上电71 pull down 下拉72 pull up 上拉73 Pulse by Pulse 逐脉冲（Pulse by Pulse）74 push pull converter 推挽转换器75 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二极管78 resistive divider 电阻分压器79 ringing 振铃80 ripple current 纹波电流81 rising edge 上升沿82 sense resistor 检测电阻83 Sequenced Power Supplys 序列电源84 shoot-through 直通，同时导通85 stray inductances 杂散电感86 sub-circuit 子电路87 substrate 基板88 Telecom 电信89 Thermal Information 热性能信息90 thermal slug 散热片91 Threshold 阈值92 timing resistor 振荡电阻93 Top FET Top FET94 Trace 线路，走线，引线95 Transfer function 传递函数96 Trip Point 跳变点97 turns ratio 匝数比，＝Np / Ns。
纺织染整中术语的英文对照
纺织印染中英文对照大全A 色牢度试验项目COLOUR FASTNESS TESTS皂洗牢度washing摩擦牢度rubbing/crocking汗渍牢度perspiration干洗牢度drycleaning光照牢度light水渍牢度water氯漂白chlorine bleach spotting非氯漂白non-chlorine bleach漂白bleaching实际洗涤（水洗一次）actual laundering （one wash）氯化水chlorinated water含氯泳池水chlorinated pool water海水sea-water酸斑acid spotting碱斑alkaline spotting水斑water spotting有机溶剂organic solvent煮呢potting湿态光牢度wet light染料转移dye transfer热（干态）dry heat热压hot pressing印花牢度print durability臭氧ozone烟熏burnt gas fumes由酚类引起的黄化phenolic yellowing唾液及汗液saliva and perspirationB 尺寸稳定性（缩水率）及有关试验项目（织物和成衣）DIMENSIONAL STABILITY （SHRINKAGE）AND RELA TED TESTS （F ABRIC & GARMENT）皂洗尺寸稳定性dimensional stability to washing （washing shrinkage）洗涤/手洗后的外观appearance after laundering / hand wash热尺寸稳定性dimensional stability to heating熨烫后外观appearance after ironing商业干洗稳定性dimensional stability to commercial drycleaning （drycleaning shrinkage）商业干洗后外观（外观保持性）appearance after commercial drycleaning （appearance retention）蒸汽尺寸稳定性dimensional stability to steaming松弛及毡化dimensional stabilty to relaxation and felting缝纫线形稳定性dimensional stability for sewing threadC 强力试验项目STRENGTH TESTS拉伸强力tensile strength撕破强力tear strength顶破强力bursting strength接缝性能seam properties双层织物的结合强力bonding strength of laminated fabric涂层织物的粘合强力adhesion strength of coated fabric单纱强力single thread strength缕纱强力lea strength钩接强力loop strength纤维和纱的韧性tenacity of fibres and yarnD 织物机构测试项目FABRIC CONSTRUCTION TESTS织物密度（机织物）threads per unit length （woven fabric construction）织物密度（针织物）stitch density （knittted fabric）纱线支数counts of yarn纱线纤度（原样）denier counts as received织物幅宽fabric width织物克重fabric weight针织物线圈长度loop length of knitted fabric纱线卷曲或织缩率crimp or take-up of yarn割绒种类type of cut pile织造种类type of weave梭织物纬向歪斜度distortion in bowed and skewed fabrics （report as received and after one wash）圈长比terry to ground ratio织物厚度fabric thicknessE 成分和其他分析试验项目COMPOSITION AND OTHER ANAL YTICAL TESTS纤维成分fibre composition染料识别dyestuff identification靛蓝染料纯度purity of indigo含水率moisture content可萃取物质extractable matter填充料和杂质含量filling and foreign matter content淀粉含量starch content甲醛含量formaldehyde content甲醛树脂presence of formaldehyde resin棉丝光度mercerisation in cottonPH值PH value水能性absorbanceF 可燃性试验项目FLAMMABILITY TESTS普通织物的燃烧性能flammability of general clothing textiles布料的燃烧速率（45。
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酚醛树脂包覆氧化天然石墨作为锂离子电池负极材料高文超1黄桃1沈宇栋2余爱水1,*(1复旦大学化学系,新能源研究院,上海市分子催化和功能材料重点实验室,上海200438;2无锡东恒新能源材料有限公司,江苏无锡214037)摘要:天然石墨经过浓硫酸氧化处理,酚醛树脂包覆并高温碳化后形成具有核壳结构的碳包覆氧化天然石墨复合材料.采用扫描电子显微镜(SEM),透射电子显微镜(TEM),X 射线衍射(XRD),激光显微拉曼光谱(Raman)等检测技术对氧化处理以及酚醛树脂热解碳包覆前后天然石墨材料的结构与形貌进行分析与表征.结果表明,氧化处理与适量的酚醛树脂热解碳包覆有效修复了天然石墨表面的一些缺陷结构,使其表面更为光滑.电化学测试结果显示,经过氧化处理与酚醛树脂热解碳包覆后天然石墨材料电化学性能得到明显提高.酚醛树脂包覆量为9%时,复合材料表现出最好的电化学性能,其首次放电比容量为434.0mAh ·g -1,40次循环后,放电比容量保持在361.6mAh ·g -1,而未经处理的天然石墨放电比容量仅为332.3mAh ·g -1.该改性方法有效提高了天然石墨材料的比容量,对其进一步应用具有重要意义.关键词:负极材料;天然石墨;酚醛树脂;氧化;包覆中图分类号:O646Phenolic Resin Coated Natural Graphite Oxide as an Anode Material forLithium Ion BatteriesGAO Wen-Chao 1HUANG Tao 1SHEN Yu-Dong 2YU Ai-Shui 1,*(1Department of Chemistry,Institute of New Energy,Shanghai Key Laboratory of Molecular Catalysis and Innovative Materials,Fudan University,Shanghai 200438,P .R.China ;2Wuxi Dongheng New Energy Material Co.,Ltd,Wuxi 214037,Jiangsu Province,P .R.China )Abstract:A core-shell structure of the carbon-coated natural graphite oxide composite was successfully prepared.Natural graphite was initially oxidized using concentrated sulfuric acid and then carbon coated by the carbonization of phenolic resin at high temperature.Scanning electron microscopy (SEM),transmission electron microscopy (TEM),X-ray diffraction (XRD),and Raman techniques were used to characterize the morphology and structure of the natural graphite materials before and after oxidation and carbon coating by the pyrolysis of the phenolic resin.The results showed that the surface of the natural graphite particles became smoother and the surface defects were effectively modified after oxidation and carbon coating.The electrochemical test results showed that the electrochemical performance of the natural graphite improved significantly by oxidation with sulfuric acid and by carbon coating.When the covering amount of phenolic resin was 9%the modified natural graphite material gave the best electrochemical performance.Its initial discharge capacity was 434.0mAh ·g -1and it remained 361.6mAh ·g -1after 40charge-discharge cycles.The discharge capacity of the untreated natural graphite was only 332.3mAh ·g -1.The modification approach that improved the capacity of the natural graphite effectively is of great significance for the application of natural graphite in lithium ion batteries.[Article]物理化学学报(Wuli Huaxue Xuebao )Acta Phys.-Chim.Sin .2011,27(9),2129-2134September Received:May 13,2011;Revised:July 7,2011;Published on Web:July 29,2011.∗Corresponding author.Email:asyu@;Tel/Fax:+86-21-51630320.The project was supported by the Key Program of Basic Research of the Shanghai Committee of Science and Technology,China (10JC1401500)and Department of Chemistry and Shanghai Key Laboratory of Molecular and Innovative Materials,China (08DZ2270500).上海市基础研究重点项目(10JC1401500)和上海市分子催化和功能材料重点实验室(08DZ2270500)资助ⒸEditorial office of Acta Physico-Chimica Sinica2129Vol.27Acta Phys.-Chim.Sin.2011Key Words:Anode material;Natural graphite;Phenolic resin;Oxidation;Coating1引言锂离子电池是当今社会最为重要的二次电池,它具有工作电压高、能量密度高、循环寿命长、对环境友好等优点,1,2在手机、数码相机、便携式电脑等领域得到广泛应用.目前,已商业化的锂离子电池负极材料为石墨材料.3其中,天然石墨具有比容量较高、充放电平台平稳、储量大、成本低等优点,是一种十分理想的锂离子电池负极材料.但是,天然石墨与电解液相容性较差,充放电过程中容易发生由于溶剂化锂离子共插入而引起的石墨片层剥离,进而造成循环性能下降,倍率性能差等缺陷,4,5影响了它的进一步应用.针对这些问题,国内外展开相应的研究,对天然石墨进行表面改性和修饰,改善其电化学性能.目前,常见的改性方法包括表面氧化、6,7碳包覆、8,9金属包覆、10,11掺杂其它非碳元素12,13等.其中碳包覆法取得了较好的效果且最易在工业化中实施.然而,碳包覆过程中不可避免地会形成一些没有被包覆在天然石墨表面的热解碳并且经常会遇到包覆过量以及包覆不完全的问题,对材料的容量、循环性能等方面产生不利影响.14,15对此,Zhao等4在碳包覆前预先对天然石墨进行氧化处理,随之用原位聚合法在氧化处理后的天然石墨表面包覆一层间苯二酚甲醛树脂,并高温碳化,取得较好的效果.本文采用浓硫酸对天然石墨进行氧化处理,氧化处理后的天然石墨再以酚醛树脂溶液包覆,包覆方法为更易实现工业化的物理浸渍法,随后在高温下碳化,得到以氧化天然石墨为核心,酚醛树脂热解碳为外壳的核壳型结构改性天然石墨材料,并系统研究了酚醛树脂包覆含量对改性复合材料表面形貌以及电化学性能的影响.2实验2.1氧化石墨的制备取40g球形天然石墨(山东)于圆底烧瓶中,加入100mL98%的H2SO4溶液(分析纯)将其完全浸没,200°C油浴10h,过滤,所得产物经去离子水反复洗涤、过滤后烘干,得到氧化天然石墨.2.2碳包覆氧化石墨的制备将酚醛树脂的乙醇溶液与一定质量的氧化天然石墨均匀混合,分别制成酚醛树脂与氧化天然石墨质量比为5:95,7:93,9:91,11:89的混合溶液.常温下搅拌5h,70°C缓慢蒸发掉乙醇溶液,烘干.在氮气气氛保护下,所得产物在100°C固化1h,再以2°C·min-1的升温速度升温至900°C碳化3h.碳化后所得产物经250目筛过滤,得酚醛树脂包覆氧化天然石墨.按上述酚醛树脂不同质量百分比,将材料分别标记为ONG-5、ONG-7、ONG-9、ONG-11(5、7、9、11代表酚醛树脂的质量分数分别为5%、7%、9%、11%),同时将未经处理的天然石墨标记为NG,氧化天然石墨标记为ONG.2.3材料的物理表征采用X射线粉末衍射仪(XRD,Brucker D8,德国)和激光显微拉曼光谱仪(Renishaw inVia Reflex,英国)表征氧化及包覆前后天然石墨晶体结构;扫描电子显微镜(SEM,Hitachi,FE-SEM S-4800,日本)和透射电子显微镜(TEM,JEOL,JEM-2100F,日本)表征氧化及包覆前后天然石墨表面形貌及尺寸.2.4电池的组装及测试条件将上述处理的天然石墨、导电炭黑和聚偏氟乙烯(PVDF粘结剂,分析纯)按质量比94:1:5充分混合,在N-甲基吡咯烷酮(NMP,分析纯)溶液中搅拌得均匀浆状物.将所得的粘稠浆料均匀涂覆于铜箔上,70°C烘干后冲压成直径为14mm的电极片,10 MPa下压片.压好的电极片于80°C下真空干燥20 h,除去极片中所含微量的水分与NMP.在氩气手套箱内以制得的极片作为工作电极,金属Li作为对电极,Celgard2300聚丙烯(日本)为隔膜,制成扣式电池,电解液为溶于碳酸乙烯酯(EC)和碳酸二乙酯(DMC)(体积比1:1)混合溶剂中浓度为1mol·L-1的LiPF6溶液(国泰华荣化工新材料有限公司).电池的测试在武汉LAND电池测试系统CT2001A上完成.测试条件:恒电流充放电,电压范围为0-2.5V,电流密度为30mA·g-1.测试过程在室温下进行.3结果与讨论3.1氧化处理与碳包覆前后天然石墨的结构与表面形貌图1为氧化处理以及碳包覆改性前后天然石墨的XRD图.由图1可见,改性处理后天然石墨材料的XRD衍射峰位基本没有发生改变,均含(002)峰,这说明氧化处理与酚醛树脂包覆并碳化改性并没2130高文超等:酚醛树脂包覆氧化天然石墨作为锂离子电池负极材料No.9有破坏天然石墨的基本层状结构.此外,在碳包覆石墨材料的XRD 衍射图中,并没有观察到无定形碳所特有的宽峰,这是因为酚醛树脂的包覆量有限,高温碳化后形成的复合材料的外层无定形碳壳非常薄,以至于很难在XRD 衍射图中显现出来,但是在SEM 和TEM 中可以清楚地观察到这层无定形碳壳的存在.从这几种石墨材料的XRD 衍射图中还可以观察到,经过氧化处理以及碳包覆改性的天然石墨其(002)峰强度明显小于原始天然石墨材料,并且随着酚醛树脂热解碳包覆含量的增加,(002)峰强逐渐降低.这说明石墨材料的结晶度随着氧化处理与碳包覆改性过程的进行而降低,结晶度的降低意味着石墨材料表面的无序化结构增加,进而说明酚醛树脂已经被成功地包覆在球形天然石墨表面,并且经过高温热解,在球形天然石墨表面形成了一层热解碳壳.图2为氧化处理以及碳包覆改性前后天然石墨的Raman 光谱图.Raman 光谱可以反映石墨表面的无序程度.由图2可见,这六种石墨材料均含有两个Raman 峰,分别位于1580cm -1(G 峰)与1360cm -1(D 峰)处.其中位于1580cm -1处的G 峰被指认为sp 2电子结构的E 2g 联合振动模式,对应石墨片层的芳环结构碳;在1360cm -1处的D 峰被指认为类金刚石碳sp 3电子结构的A 1g 联合振动模式,对应石墨片层的边缘碳和无序碳.16因此可以用I D /I G 来表征碳材料的石墨化度R (R ＝I D /I G ).17由图2可见,R 值随着氧化处理与碳包覆的进行而增大,这说明氧化处理与碳包覆改性增大了天然石墨材料表面的无序化程度,特别是碳包覆改性过程,随着酚醛树脂包覆含量的不断增加,R 值不断增大,天然石墨表面无序化程度不断加强.表明酚醛树脂已经被成功地包覆在球形天然石墨表面,并且经过高温热解,在球形天然石墨表面形成了一层热解碳壳,这与XRD 显示的结果一致.化处理和碳包覆改性有效修复了天然石墨表面存在的裂纹与缺陷状况,明显改善了天然石墨的表面形貌.这一修复作用在碳包覆改性过程中表现得尤为明显.外层酚醛树脂热解碳的存在有效覆盖住了天然石墨表面的裂纹、缺陷.随着酚醛树脂包覆含量的增加,天然石墨表面逐渐变得更为光滑,裂纹和缺陷慢慢消失.当酚醛树脂包覆含量达9%时,天然石墨表面的裂纹与缺陷基本消失,由图4可见,此时天然石墨表面形成一层均匀的,厚度约为20nm 的无定形碳壳,该无定形碳壳的存在将有效改善天然石墨材料的电化学性能.而酚醛树脂包覆含量继续增加时,一些多余的热解碳在天然石墨表面形成结块,另外一些则散落在材料中.这些结块以及散图1石墨样品的XRD 图Fig.1XRD patterns of graphite samples(a)natural graphite (NG),(b)natural graphite oxide (ONG),(c)ONG-5,(d)ONG-7,(e)ONG-9,(f)ONG-11;ONG-5,ONG-7,ONG-9,ONG-11denote 5%,7%,9%,11%(w )phenolic resin coated on the surface of natural graphite oxide.2石墨样品的Raman 光谱Fig.2Raman spectra of the graphite samples(a)NG,(b)ONG,(c)ONG-5,(d)ONG-7,(e)ONG-9,(f)ONG-11;R =I D /I G本页已使用福昕阅读器进行编辑。