Indium solder paste datasheet

OVER—>BELLCORE AND J-STD TESTS & RESULTST est Result J-STD-004 (IPC-TM-650)• Flux Type Classifi cation ORL0• Presence of Halide Fluoride Spot Test Pass • Elemental Analysis Halide-Free • Post Refl ow Flux Residue (ICA Test) 0.4% of solder paste • Corrosion Pass • SIR (Post Clean) Pass• Acid Value (Typical) 31.5 T estResult J-STD-005 (IPC-TM-650)• Typical Solder Paste Viscosity(Pb92.5/Sn5/Ag2.5, Type 3, 88%)Brookfi eld (TF 5 rpm)230 kcps Brookfi eld (R7 10 rpm)170 kcps • Slump TestPass • Solder Ball TestPass • Wetting TestPass • Standard Metal Load88%NC-SMQ ®75 Die Attach Solder PastePackagingStandard packaging for dispensing applications includes 25g fi ll and 40g fi ll 10cc, and 100g fi ll 30cc EFD syringes (Semco syringes also available). Other packaging options may be available upon request.Material Safety Data Sheets The MSDS for this product can be found online at /techlibrary/msds.php Features • Ultra-Low Voiding with Minimal Profi ling • Halide-Free • Vacuum Packed, Bubble-Free • Reliable Miss-Free, Clog-Free Dispensing • Consistent Dispensing Deposit Level • Superior Wetting • Compatible with All Common Metal Finishes • Very Low ResidueIntroduction NC-SMQ ®75 is a halide-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0.4% of paste or <5% of fl ux vehicle. It is designed for refl ow in a nitrogen atmosphere of 100-ppm oxygen or less. This product has superior wetting capabilities compared to most low residue formulations, offers troublefree probe testing and a “no-residue” appearance. NC-SMQ ®75 meets or surpasses all ANSI/J-STD-004, -005 specifi cations and Bellcore Electromigration test criteria.Alloys Indium Corporation manufactures low oxide spherical powder composed of Sn/Pb, Sb/Sn/Pb and Sn/Pb/Ag in a standard Type 3 mesh size. Other non-standard mesh sizes are available upon request. The weight ratio of the solder powder to the solder paste is referred to as the metal load and is typically 88% for standard alloy compositions.Standard Product Specifi catio nsAlloy Metal Content Mesh Size Particle SizeRecommended Needle Size Sn10/Pb88/Ag2 88% Type 3 25 to 45 microns 20 gauge* Sn5/Pb92.5/Ag2.5 (Type 3) Sn5/Pb95 Sn5/Pb85/Sb10Note: (1): 20 gauge needle - 0.58 mm or 0.023 in.All information is for reference only. Not to be used as incoming product specifi cations.Storage and HandlingProceduresRefrigerated storage will prolong the shelf life of solder paste. The shelf life of NC-SMQ®75is 6 months at storage temperatures of -20° to +5°C. When storing solder paste contained in syringes and cartridges, they should be stored tip down. Solder paste should be allowed to reach ambient working temperature prior to use. No heating should be employed.Generally, paste should be removed from refrigeration at least 2 hours before use. Actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verifi ed before use. Cartridges or syringes should be labeled with date and time of opening. DispensingNC-SMQ®75is formulated to be applied using automated high speed, high reliability, single point or multi-point dispensing equipment, but will also function in hand held applications. Highly accurate volumes can be dispensed using either pneumatic or positive displacement devices. Optimal dispensing performance is dependent on storage conditions, equipment type and set up. AtmosphereNC-SMQ®75is designed for use in a nitrogen (100 ppm oxygen or less) atmosphere.Cleaning or Residue Removal The post refl ow residue of NC-SMQ®75can be removed with commercially available solvents. The vehicle is capable of high temperature alloy refl ow without charring but in case of overheating, any charred residue can be removed with the aid of ultrasonic or mechanical agitation.QualityThe Indium Corporation of America is dedicated to producing the highest quality die attach solder paste.NC-SMQ®75is vacuum packaged by highly trained operators under controlled conditions in unique, specially designed equipment to minimize air bubbles in every syringe and cartridge. Rheology and refl ow characteris-tics as well as metal content and identity are carefully confi rmed for each lot. Also, evaluations are performed on each lot to verify dispensing performance.Recommended Profi le:The typical profi le above is designed for use with Sn10/ Pb88/Ag2 or Sn5/Pb92.5/Ag2.5 alloy in a nitrogen atmosphere (100 ppm oxygen or less). It can serve as a general guideline for establishing a profi le for your process and should be regarded as a typical example. Adjustments to this profi le may be necessary based on assembly size, thermal density, and other factors. Use of other alloys with lower or higher liquidus temperatures will also require changes.Heating and Liquidus Stage:Establish a profi le which provides a rapid heating of the assembly to the solder’s liquidus temperature. Ramp rates of 1 to 4°C/sec are recommended, but the nature of the assembly should govern the actual rate. Toachieve acceptable wetting, and to minimize voiding and intermetallics formation, the profi le must include a period of 15 to 30 seconds above the alloy’s liquidus, and a peak temperature of 10 to 20°C above liquidus. However, excessive time above liquidus (and/or excessively high temperatures above liquidus) can produce negative consequences including: charred residue, diffi cult residue removal, excessive intermetallics formation, voiding,and more.Cooling Stage:Cooling after refl ow should be as fast as practical. Thisis desired to form a fi ne-grained metallic structure. Slow cooling will result in a coarse, large grain structure that will exhibit poor thermal cycling and fatigue resistance.This product data sheet is provided for general information only. It is not intended, and shall not be construed, to warrant or guarantee the performance of the products described which are sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices.。