TFA9887 introduction
MT6595_MT6331_MT6332_ MT6169_MT6261_MT6630_EMMC_DSDA_EXTPWR_V0.03
Modules
I2C
C
I2C 4-Phase buck
CTP
I2C
controller
MEMs & ALS/PS I2C
GPIOs
SIM1
SIM1
SIM2
SIM2
B
External
I2S
speaker AMP.
Keypad
Debug port
JTAG UART
I2S
MHL
DPI
USB
A
USB 2.0
Front Camera
400 Kbps
Yes.
Front camera (OV5648) I2C address: 0X36 (Write:0x6C, Read:0x6D )
AF driver (AD5820) I2C address: 0X0C (Write:0x18, Read:0x19)
I2C-1
M Sensor
400 Kbps
AK8963C / M-Sensor I2C Address: 0x0C (Write:0x18, Read:0x19)
C
A+Gyro Sensor
400 Kbps
Yes.
MPU-6050C / A+Gyro I2C Address: 0x68 (Write:0xD0, Read:0xD1)
3
ABB
MT6595 (POP)
Audio I/F PWRAP I/F BC 1.1
3
2
1
BPI, APC
RXD ANT
RXD
RF IQ
Байду номын сангаасMT6169
RxD FEM
东芝TPCA8087规格书
联系人：朱小姐
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Ｔｅｌ：１３５１０６６６８２０
7
TPCA8087
Package Dimensions
Unit: mm
Weight: 0.069 g (typ.)
Package Name(s) TOSHIBA: 2-5Q1S Nickname: SOP Advance
联系人：朱小姐
TPCA8087
MOSFETs Silicon N-Channel MOS (U-MOS)
TPCA80871. Appl Nhomakorabeacations
• • Notebook PCs Mobile Handsets
2. Features
(1) (2) (3) (4) Small footprint due to a small and thin package Low drain-source on-resistance: RDS(ON) = 1.5 mΩ (typ.) (VGS = 10 V) Low leakage current: IDSS = 10 µA (max) (VDS = 30 V) Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 1.0 mA)
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4
TPCA8087
8. Characteristics Curves (Note)
Fig. 8.1 ID - VDS
Fig. 8.2 ID - VDS
Fig. 8.3 ID - VGS
Fig. 8.4 VDS - VGS
Fig. 8.5 RDS(ON) - ID
Fig. 8.6 RDS(ON) - Ta
阿尔派CDA9887主动分音详解
外貌平平的9887看起来跟其它主机差不多,内在的强大功能与普通主机相比可是无与伦比了.下面来了解下它的强大功能吧在安装主机之前,要把主机下面几个控制设置一下,F/R/SUb-w此端口为被动. ,在被动时主机可以调节前后喇叭和超低音, 3WAY此端口为主动,在主动时前后是不能调节的只能调节左右.EQ/DIV此端口为外加音频数字处理器.如701.NORM此端口为外加碟盒在用主机做主动分音时(X-OVER)拨到3WAY上 .(Ai-NET)拨到NORM上再来看主机的音频输出这一块,单用机主做主动分音时主机的输出音频就改变了.R是高音输出F是中低音输出.SW是超低音输出.说说主机的接线:黄色：+BATT，12V电源，接常火线绿色：高音输出左喇叭线正极绿色/黑：高音输出左喇叭线负极紫色：高音输出右喇叭线正极紫色/黑：高音输出右喇叭线负极蓝色/白条纹：REM，遥控开机控制线蓝色：ANT CON，收音机天线启动线，接电动天线启动线红色：ACC，开启电源线，接钥匙控制的ACC电源线粉红色：MUTE，静音线，接其它电器设备的静音控制端橙色：ILL，小灯线，接原车的小线灰色：中低音输出右喇叭线正极灰色/黑：中低音输出右喇叭线负极白色：中低音输出左喇叭线正极白色/黑：中低音输出左喇叭线负极黑色：GND，接地，搭铁或接地线主机上的连接和设定都说完了,再来说说主机内的厉害.第一步按FUNC/SETUP至少2秒钟第二步旋转音量到Crossorer进入分频设定第三步按ENT键进入分频设定按 BAND键按AUDIO键按＜/＞键 SOUKCE选择声道音量衰减选择分频点衰减频率截至以下分频点高HIGH 0/-12 2K-20K FLAT 截至以上分频点中MID-H 0/-12 20-20K 6 .12.18.24截至以下分频点中MID-L 0/-12 20-2OK 6. 12.18.24 截至以上分频点低LOW 0/-12 20-300 6.24.18 .24第四步T.correction喇叭延时L-F.高音左R-F. 高音右 L-R.中音左 R-R 中音右 .L-SW 低音左 .R-SW低音右注:设定好之后,别忘了储存喔.储存方法是按住 1.2.3.4.5.6任何一个数字,再按ENT确定储存时间延迟的基本调试方法：1、按说明把距离输入显示屏，自动计算延迟2、自主定位（这里的案例主机的阿尔派的9887）然后讲解了一下均衡器，均衡器主要分为参数型和图形型，参数型分为五个频段分别是：20~80HZ，50~200HZ，125~3.2KHZ，315~8KHZ，800~20KHZ。
阿尔派 CDA-9887型 接收机 说明书
2. 它能校正时间与频率问题，改善音场，产生更柔和、更自然 的声音。
3. 它使用动态频率分配，将数百个校正点应用在声音问题最大 的区域。
Cedex, France Phone 01-48638989
ALPINE ITALIA S.p.A. Viale C. Colombo 8, 20090 Trezzano
Sul Naviglio (MI), Italy Phone 02-484781
ALPINE ELECTRONICS DE ESPAÑA, S.A. Portal de Gamarra 36, Pabellón, 32
（关于 MP3/WMA/AAC） ......................... 10 快速搜索 ........................................................ 10 关于 MP3/WMA/AAC .................................. 10
01CS00CDA9887.book Page 1 Friday, March 16, 2007 2:51 PM
R
CS
MP3/WMA/AAC CD Receiver
CDA-9887
• 用户说明书 使用设备前请阅读本说明书。
ALPINE ELECTRONICS MARKETING, INC. 1-1-8 Nishi Gotanda, Shinagawa-ku,
无线电
收听无线电 ...................................................... 7 手动储存预设电台 .......................................... 7 自动储存预设电台 .......................................... 8 调谐至预设电台 .............................................. 8 频率搜索功能 .................................................. 8
2008年Ford自动变速箱组件目录说明书
1622008 AUTOMATIC TRANSMISSION KIT & COMPONENTS CATALOG ©2008 PARKER HANNIFIN CORP. ALL RIGHTS RESERVED3790103008397797405R55N / 5R55S / 5R55WRWD 5 SpeedA544510034070670Input ShaftO.Dr. Ring GearO.Dr. CenterShaft783Center SupportInterm. BandDirect DrumForward ClutchForward PlanetReverse BandReverse DrumLow Sprag310037179520036178530311914363912911913910896904896437490996V.B.Parts741E414494765-6370Case313321320Valve Body917747765746322420002OHK Kit004Master L/Steels Kit 006Master 030External Seal Kit1632008 AUTOMATIC TRANSMISSION KIT & COMPONENTS CATALOG ©2008 PARKER HANNIFIN CORP . ALL RIGHTS RESERVEDRWD 5 Speed5R55N / 5R55S / 5R55W862981971961560961971985879565126106146861*229964974877564285872962972104124552894Intermediate Sprag690074266Park Gear264847Park Pawl Assy995-1995-2995-3995916-2916-3919922915916-2916-3919922916263EDA181554770Ext. Hsg.781493305678Output ShaftO.Dr. Band StrutInterm. Band Strut268841Internal Linkage991-2991-3994799991-4761P-4991072410992Yoke1642008 AUTOMATIC TRANSMISSION KIT & COMPONENTS CATALOG©2008 PARKER HANNIFIN CORP. ALL RIGHTS RESERVED*Prefix Letter ‘T’ denotes Toledo-Trans Kit (TTK) Brand Transmission Kits *Prefix Letter ‘B’ denotes Bryco Brand Transmission Kits002.............T16002AP......Overhaul Kit, 5R55N (With Bonded Pistons) 1999-Up ..............................................................1..........002.............T16002GP......Overhaul Kit, 5R55S/5R55W (With Bonded Pistons) 2002-Up..................................................1..........004.............T16004AP......Master L/Steels Kit, 5R55N (With Bonded Pistons) 1999-Up ....................................................1..........004.............T16004GP......Master L/Steels Kit, 5R55S/5R55W (With Bonded Pistons) 2002-Up .......................................1..........006.............T16006AP......Master W/Steels Kit, 5R55N (With Bonded Pistons) 1999-Up...................................................1..........006.............T16006GP......Master W/Steels Kit, 5R55S/5R55W (With Bonded Pistons) 2002-Up ......................................1..........E300...........45019............Gasket, 5R55N Bottom Pan (Plastic With Silicon Bead) OE Style (With Large Holes) 1999-Up 1..........XW4Z-7A191CA D305...........45097668......Gasket, 5R55N/5R55S/5R55W Extension Housing To Case 1999-Up......................................1..........XW4Z-7086-AA A309..........41217............Gasket, 5R55N/5R55S/5R55W Pump Bolt Washer...................................................................AR ........A310..........45097667......Gasket, 5R55N/5R55S/5R55W Pump 1999-Up..........................................................................1..........XW4Z-7A136AB A311...........1988096........O-Ring, 5R55N/5R55S/5R55W Pump Cover 1999-Up ...............................................................1..........XW4Z-7A248AA A313..........1994747........O-Ring, 5R55N Inner Pump Gear 1999-Up.................................................................................1..........F77Z-7L323AA E320...........45097692......Gasket, 5R55N Valve Body Separator Plate To Case 1999-Up ................................................1..........XW4Z-7D100-BF E320...........45097738......Gasket, 5R55S/5R55W Valve Body Separator Plate To Case (Upper) 2002-Up......................1..........1L2Z-7Z490AB-1A070..........70243V..........Seal, 5R55N/5R55S/5R55W Front (No Flange) (Rubber Coated) 1999-Up ..............................1..........F77Z-7A248AA D072...........70083............Seal, 5R55N Linkage 1999-Up ..................................................................................................1..........D5AZ-7B498A D074...........70283............Seal, 5R55N Rear 2WD 2000-Up ...............................................................................................1..........XW4Z-7052AA D074...........70205............Seal, 5R55S/5R55W Rear (W/Long Boot) 2WD 2002-Up .........................................................1..........F6UZ-7052A D074...........70282............Seal, 5R55S/5R55W Extension Housing 4X4 2002-Up .............................................................1..........1L2Z-7052BA175.............6358..............Ring Kit, 5R55N/5R55S/5R55W (2 Metal 4PTFE 2 Torlon Rings) 1999-Up ...............................1..........A178..........45060279......Ring, 5R55N, 5R55W, 5R55S Pump Support (Lock-Up) 1999-Up .............................................1..........B181...........TAW- 2212....Ring, 5R55N, 5R55W, 5R55S Forward Clutch Cylinder 1999-Up .............................................2..........D184...........45060265......Ring, 5R55N, 5R55W, 5R55S Output Shaft 1999-Up.................................................................1..........A179..........30308............Ring, 5R55N, 5R55W, 5R55S Overdrive Brake Drum 1999-Up.................................................2..........B179...........30308P ..........Ring, 5R55N, 5R55W, 5R55S Direct Clutch (Center Support) 1999-Up Torlon .........................2..........119.............45082NR........Friction Module, 5R55N 1999-Up................................................................................................1..........119.............45082LR........Friction Module, 5R55S/5R55W 2002-Up...................................................................................1..........E010...........45040N ..........Filter, 5R55N (3/8” Tall Pick-up Tube) 1999-Up ..........................................................................1..........XW4Z-7A098BB E010...........F-340.............Filter, 5R55S/5R55W (2 1/4” Tall Pick-Up Tube) 2002-Up..........................................................1..........1L2Z-7A098AC5R55N / 5R55S / 5R55WRWD 5 Speed1652008 AUTOMATIC TRANSMISSION KIT & COMPONENTS CATALOG ©2008 PARKER HANNIFIN CORP. ALL RIGHTS RESERVEDB022...........45090............Band, 5R55N Overdrive/Intermediate (Hi-Energy) 1999-Up......................................................2..........XW4Z-7D034BA 030.............45030G..........Bushing Kit, 5R55N/5R55S/5R55W 1999-Up.............................................................................1..........A034..........31530............Bushing, 5R55N/5R55S/5R55W Pump Cover 1999-Up .............................................................1..........A036..........31531............Bushing, 5R55N/5R55S/5R55W Overdrive Sun Gear 1999-Up................................................1..........A036..........45039............Bushing, 5R55N/5R55S/5R55W Stator (Front) 1999-Up ...........................................................1..........A037..........31532............Bushing, 5R55N/5R55S/5R55W Stator (Rear) 1999-Up............................................................1..........A046..........31533............Bushing, 5R55N/5R55S/5R55W Coast Clutch Drum e 56036A................................................................................................................................1..........B211...........45176A..........Washer, 5R55N/5R55S/5R55W Pump To Coast Clutch Drum .063" (Plastic) 1999-Up.............1..........F7TZ-7D014TA B211...........45176B ..........Washer, 5R55N/5R55S/5R55W Pump To Coast Clutch Drum .071" (Plastic) 1999-Up.............1..........F7TZ-7D014MA B211...........45176C ..........Washer, 5R55N/5R55S/5R55W Pump To Coast Clutch Drum .075" (Plastic) 1999-Up.............1..........F7TZ-7D014NA B211...........45176D ..........Washer, 5R55N/5R55S/5R55W Pump To Coast Clutch Drum .079" (Plastic) 1999-Up.............1..........F7TZ-7D014PA B211...........45176E ..........Washer, 5R55N/5R55S/5R55W Pump To Coast Clutch Drum .083" (Plastic) 1999-Up.............1..........F7TZ-7D014RA B211...........45176F ..........Washer, 5R55N/5R55S/5R55W Pump To Coast Clutch Drum .087" (Plastic) 1999-Up.............1..........F7TZ-7D014SA C232...........45145............Washer, 5R55N/5R55S/5R55W Bearing to Forward Hub (Solid Bronze) 1999-Up .................1..........FOTZ-7D090A D263...........45077............Washer, 5R55N/5R55S/5R55W Parking Gear To Case 1999-Up ..............................................1..........D4ZZ-7B368-AD410...........D56955J ........Switch, 5R55N Neutral Safety (12 Prong Connector) 1999-Up ...............................................1..........XW4Z-7F293AA E922...........33991............Nut, 5R55N/S/W Band 1999-Up .................................................................................................2..........380850-SRWD 5 Speed5R55N / 5R55S / 5R55W。
SURROUND 算法
-Headset configuration device -FM support -Pop Noise Reduction -Increased Crosstalk performance
馬達產品的新應用 New Feature of Motor
1. Haptics 2. SIM card ejects 3. Camera angle adjustment
先讓我們做個總結
Feature
SmartAMP
HIFI audio HP driver
Hero Parts
TAS2552 TAS2553
PCM5x42 TPA6120 TPA6166
Description
Opulam algorithm + TAS2552/3 is better performance and suit pricing solution for current SP/Tablet audio amplifier.
TPA6166 - Audio Headset Switching and Detection Turnkey Solutions
The American/Apple and China/Nokia headsets have different band configuration GND and Microphone bands are switched in place
HiFi audio is our best solution for end customers. TPA6166 is Class-G Headphone AMP with integrated Headset detection and Passive multi-button support , very great solution. Headset Detection and auto Switching Real world feedback for SP/tablet. Camera control support. SIM card eject Independent 1.5A LED Driver for color compensation architectures Optical Image Stabilization Standalone Switch-Mode Battery Charger with Power-Path Management and OTG The 5Gbps speed of USB3.0 is driving the need for redrivers to open up eye mask and pass compliance for >1M cables 1:2 MHL/USB switch supporting 1080p/60fps 1:3 MHL/USB switch supporting 1080p/60fps Inter Chip-USB Voltage Level Translator
MCD 988 用户手册说明书
MCD 988 Guida RapidaCosa c'è nella confezione?Nella confezione si dovrebbero trovare i seguenti articoli.12435Collegare il subwoofer all'unità principale tramite il cavo DIN in dotazione.Collegare gli altoparlanti.Collegare l'antenna FM.Collegare il cavo AV al televisore.Collegare il cavo di alimentazione del sistema e della TV .Tips–Cfr. il Manuale Utente per ulteriori opzioni di collegamento TV.–Per collegarsi a una TV con Scansione Progressiva, fare riferimento al manuale per effettuare collegamenti corretti e per i particolari dell'impostazione.Impostare l'orologio123Nella modalità standby, tenere premuto CLOCK/RDS sul telecomando.Premere VOLUME +/ - (VOL+/- sul telecomando) per impostare l'ora e CLOCK/RDS per completare l'impostazione.Premere VOLUME -/+ (VOL +/- sul telecomando) per impostare i minuti e CLOCK/RDS per completare l'impostazione.Impostare le opzioni del menu DVDAVVERTENZA!Se la funzione di scansione progressiva è attiva, ma non è supportata daltelevisore o i cavi non sono collegati correttamente, vedere Manuale d'uso per verificare la configurazione della scansione progressiva oppure disattivarla attenendosi a quanto riportato di seguito:1) Disattivare la modalità scansione progressiva del televisore oppure attivare la modalità interlacciata.2) Premere SYSTEM MENU sul telecomando per uscire dal menù del sistema e poi DISC 1 (DISC 2) e “1” per uscire dalla scansione progressiva.Riprodurre un disco 123Premere il pulsante DISC 1 ç/ DISC 2 çsul telecomando per aprire il comparto del disco e caricare un disco, quindi chiudere il comparto del disco.➜Assicurarsi che il lato del disco con l'etichetta sia rivolto verso l'esterno.Se la riproduzione non si avvia automaticamente, premere ÉÅ .Premere STOP 9 (9 sul telecomando) Per arrestare la riproduzione.Programmare e sintonizzare le stazioni radio 123Premere SOURCE (TUNER sul telecomando) per selezionare la fonte tuner.Premere PROGRAM per più di due secondi per programmare tutte le stazioni disponibili in ordine di gamma di frequenze.Premere ¡ / ™ sino a visualizzare il numero prestabilito della stazione desiderata.PDCC-JS/JW-0736TipLe funzioni di riproduzione dettagliate ed altre funzioni sono descritte nell’accluso manuale dell’utente.Note per il telecomando:–Per prima cosa, selezionare la sorgente che si desidera comandare premendo uno dei tasti di selezione di sorgente sul telecomando (ad esempio DISC o TUNER).–Quindi selezionare la funzione desiderata ( ad esempio 2;, í, ë).Royal Philips Electronics N.V . 2007All rights reserved.。
TFA9882UKN1,023,TFA9882UKN1,023,TFA9882UKN1,023, 规格书,Datasheet 资料
TFA98823.4 W I2S input mono class-D audio amplifierRev. 2 — 20 April 2011Product data sheet1. General descriptionThe TFA9882 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP (WaferLevel Chip-Size Package) with a 400 μm pitch.It receives audio and control settings via an I2S digital interface. The Power-down toOperating mode transition is triggered when a clock signal is detected on the bit clockinput (BCK). Two devices can be combined to build a stereo application.In stereo applications, the left or right I2S audio stream is selected by connecting the wordselect signal to, respectively, pin WSL or pin WSR. Mono mixing can be achieved byconnecting the word select signal to both WSL and WSR. Switching off the word selectsignal selects Mute mode.The device features low RF susceptibility because it has a digital input interface that isinsensitive to clock jitter. The second order closed loop architecture used in the TFA9882provides excellent audio performance and high supply voltage ripple rejection.2. Features and benefitsSmall outline WLCSP9 package: 1.27 × 1.49 × 0.6 mmWide supply voltage range (fully operational from 2.5 V to 5.5 V)High efficiency (90 %, 4 Ω/20 μH load) and low power dissipationQuiescent power:6.5 mW (V DDD=1.8 V, V DDP=3.6 V, 4 Ω/20 μH load, f s=32kHz)7.65 mW (V DDD=1.8V,V DDP=3.6 V, 4 Ω/20 μH load, f s=48 kHz)Output power:1.4 W into 4 Ω at 3.6 V supply (THD = 1%)2.7 W into 4 Ω at 5.0 V supply (THD = 1%)3.4 W into 4 Ω at 5.0 V supply (THD = 10%)Output noise voltage: 24 μV (A-weighted)Signal-to-noise ratio: 103 dB (V DDP=5 V, A-weighted)Fully short-circuit proof across load and to supply linesCurrent limiting to avoid audio holesThermally protectedUndervoltage and overvoltage protectionHigh-pass filter for DC blockingSimplified interface for audio and control settingsLeft/right selection and mono mixingThree gain settings: −3dB,0dB and+3dBOutput slope setting for EMI reduction Clip control for smooth clipping Mute modeLow RF susceptibilityInsensitive to input clock jitter‘Pop noise' free at all mode transitions Short power-up time: 4 ms Short power-down time: 5 μs 1.8 V/3.3 V tolerant digital inputsOnly two external components required3. ApplicationsPDAsMobile phonesPortable gaming devicesPortable Navigation Devices (PND) Notebooks/netbooksPortable media players4. Quick reference data[1]R L =load resistance; L L =load inductance.Table 1.Quick reference dataAll parameters are guaranteed for V DDP = 3.6 V;V DDD =1.8 V; R L = 4 Ω[1]; L L = 20μH [1]; f i =1kHz; f s = 48 kHz; T amb = 25°C; default settings, unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit V DDP power supply voltage on pin V DDP 2.5- 5.5V V DDD digital supply voltage on pin V DDD1.65 1.8 1.95V I DDPpower supply currentOperating mode with load - 1.5 1.7mA Mute mode - 1.1 1.25mA Power-down mode-0.11μA I DDDdigital supply currentOperating mode - 1.25 1.4mA Mute mode- 1.1 1.2mA Power-down modeBCK =WS =DATA = 0 V-2.510μAP o(RMS)RMS output powerTHD + N = 1 %V DDP = 3.6 V, f i = 100 Hz - 1.4-W V DDP = 5.0 V, f i = 100 Hz - 2.7-W THD + N = 10 %V DDP = 3.6 V, f i = 100 Hz - 1.75-W V DDP = 5.0 V, f i = 100 Hz- 3.4-W ηpooutput power efficiencyP o(RMS)=1.4W-90-%5. Ordering informationTable 2.Ordering informationType number PackageName Description Version TFA9882UK WLCSP9wafer level chip-size package; 9 bumps; body 1.49 × 1.27 mm TFA9882UK6. Block diagram7. Pinning information7.1Pinning7.2Pin descriptionTable 3.Pin descriptionSymbol Pin Type DescriptionDATA A1I data inputWSL A2I word select input left channel; connect to V DDP or PCBground if right channel is selectedOUTB A3O inverting outputV DDD B1P digital supply voltage (1.8 V)V DDP B2P power supply voltage (2.5 V to 5.5 V)GND B3P ground referenceBCK C1I bit clock inputWSR C2I word select input right channel; connect to V DDP or PCBground if left channel is selectedOUTA C3O non-inverting output8. Functional descriptionThe TFA9882 is a high-efficiency mono Bridge Tied Load (BTL) class-D audio amplifierwith a digital stereo I2S input interface. A High-Pass (HP) filter removes the DCcomponents from the incoming I2S stream. This stream is subsequently converted intotwo Pulse Width Modulated (PWM) signals. A 3-level PWM scheme supports filterlessspeaker drive.8.1Mode selection and interfacingThe TFA9882 supports four operating modes:•Power-down mode, with low supply current•Mute mode, in which the output stages are floating so that the audio input signal issuppressed•Operating mode, in which the amplifier is fully operational, delivering an output signal•Fault modeThe TFA9882 switches to Fault mode automatically when a protection mechanism isactivated (see Section8.8). The defined patterns required on the BCK, WSL and WSRinputs to select the other three modes are given in Table4.Power-down mode is selected when there is no bit clock signal on the BCK input.Applying the bit clock signal will cause the TFA9882 to switch from Power-down mode toOperating mode (provided the word select signal is switched on).Mute mode is activated when the word select signal is switched off.The left or right channel is selected by applying the word select signal to, respectively, theWSL or the WSR terminal. The word select terminal not connected should be connectedto V DDP or to PCB ground. This simplifies the connection to the V DDP terminal in theWLCSP9 package.When the word select signal is connected to both terminals, the TFA9882 amplifies thesum of both channels divided by two.Table 4.Mode selectionMode Channel Frequency on BCK Frequency on WSL Frequency on WSR OUTA, OUTB Power-down0 Hz don’t care don’t care floatingMute 2.048 MHz to 3.072 MHz0 Hz0 Hz floating Operating left 2.048 MHz to 3.072 MHz32 kHz to 48 kHz0 Hz switching right 2.048 MHz to 3.072 MHz0 Hz32 kHz to 48 kHz switching(left+right)/2 2.048 MHz to 3.072 MHz32 kHz to 48 kHz32 kHz to 48 kHz switching8.2I2S formatThe TFA9882 supports the Philips I2S standard with a BCK frequency 64 times greater than the sampling rate (64fs). The bit length can be from 8 to 32 bits. Supported I2S sample rates are listed in Table5 while Figure5 illustrates the I2S data transfer format.Table 5.Supported I2S sample ratesf s (kHz)WS (kHz)BCK, 64f s (MHz)3232 2.04844.144.1 2.82244848 3.0728.3Power-up/power-down sequenceThe TFA9882 power-up/power-down sequence is shown in Figure 6. External power supplies V DDP and V DDD should be within their operating limits before the TFA9882switches to Operating mode. The TFA9882 should be switched to Power-down mode before the power supplies are disconnected or turned off.Table 6.Power-up/power-down timingAll parameters are guaranteed for V DDP = 3.6 V;V DDD=1.8 V; R L = 4 Ω[1]; L L = 20μH[1]; f i=1kHz;f s = 48 kHz; T amb= 25°C; default settings, unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unitt d(on)turn-on delay time[2]--4mst d(off)turn-off delay time[2]--5μs[1]R L=load resistance; L L=load inductance.[2]Inversely proportional to f s.8.4Control settingsIf the device can operate effectively with the default settings, the control settings don’tneed to be changed.8.4.1Control setting pattern recognitionThe TFA9882 can detect control settings via the I2S input. Control settings are selected by transmitting control patterns on the DATA input during the power-up sequence (the first12288 bit clock cycles). The word select signal (WS) must be switched off during thisinterval. Figure7 illustrates the control setting sequence. After receiving 128 consecutive control setting bytes, the TFA9882 activates the appropriate control setting (see the third column of Table7). Control settings remain unchanged in all modes unless control pattern 0xAA is received or the V DDD supply voltage is removed.Table 7.Control settingsByte Related bytes[1]Control settings0xD20x69/B4/5A/2D/96/4B/A5clip control on; see Section8.4.20xD40x6A/35/9A/4D/A6/53/A9gain=−3 dB (V DDP=2.5 V); see Section8.4.30xD80x6C/36/1B/8D/C6/63/B1gain=+3 dB (V DDP=5.0 V); see Section8.4.30xE10xF0/78/3C/1E/0F/87/C3slope low (EMC); see Section8.4.40xE20x71/B8/5C/2E/17/8B/C5Dynamic Power Stage Activation (DPSA) off; seeSection8.4.50xAA0x55Default; no mute, reset settings to default[1]The related bytes are the bytes from the first column phase shifted by 1, 2, 3, 4, 5, 6 and 7 bits.8.4.2Clip controlTFA9882 clip control is off by default. Clip control can be turned on via control setting0xD2 (see Section8.4.1). The TFA9882 clips smoothly with clip control on. Output poweris at maximum with clip control off.8.4.3Gain selectionSignal conversion from digital audio to PWM modulated audio out is independent ofsupply voltages V DDP and V DDD. At the default gain setting (0 dB), the audio output signallevel is just below the clipping point at a supply voltage of 3.6 V at −6dBFS (peak) input.The TFA9882 supports two further gain settings to support full output power atV DDP=2.5V and V DDP = 5.0 V. The gain settings can be selected via control settings0xD4 and 0xD8 (see Section8.4.1).Table8 details the corresponding peak output voltage level at −6dBFS for the three gainsettings.Table 8.Output voltageAll parameters are guaranteed for V DDP= 3.6 V; V DDD=1.8V;R L = 4 Ω[1], L L=20 μH[1], f i=1 kHz, f s =48 kHz, T amb=25 °C, default settings; unless otherwise specified.Symbol Parameter Conditions Min Typ Max UnitV oM peak output voltage at −6dBFS (peak) digital inputgain = −3dB, V DDP = 2.5 V, R L = 4 Ω[1]- 2.4-Vgain = 0dB, V DDP = 3.6 V, R L = 4 Ω; default[1]- 3.4-Vgain = +3 dB, V DDP = 5.0 V, R L = 8 Ω[1]- 4.7-V[1]R L=load resistance; L L=load inductance.8.4.4PWM slope selectionThe rise and fall times of the PWM output edges can be set to one of two values, asdetailed in Table9. The default setting is ‘slope normal’ (10 ns with V DDP =3.6 V). ‘Slopelow’ is selected via control setting 0xE1 (see Section8.4.1). This function is implementedto reduce ElectroMagnetic Interference (EMI).Table 9.Slope rise and fall timesSetting Rise and fall times of the PWM output edgesslope low40 ns with V DDP =3.6 Vslope normal; default setting10 ns with V DDP =3.6 V8.4.5Dynamic Power Stage Activation (DPSA)The TFA9882 uses DPSA to regulate current consumption in line with the level of theincoming audio stream. This function switches off power stage sections that are notneeded, reducing current consumption.Each of the TFA9882 H-bridge power stages is divided into eight sections. The number ofpower stage sections activated depends on the level of the incoming audio stream. Thethresholds used by the DPSA to determine how many stages are switched on are given inTable10. The DPSA signal is used as a reference signal for switching power stagesections on and off. The DPSA signal will rise in tandem with the rectified audio inputsignal. When the rectified audio input signal falls, the DPSA decreases with a negativeexponential function, as illustrated in Figure8.The DPSA function can be switched off via control setting 0xE2 (see Section 8.4.1). When DPSA is off, all power stage sections are activated in Operating mode.8.5High-pass filterThe high-pass filter blocks the DC components in the incoming audio stream. The cut-off frequency, f high(−3dB), is determined by the sampling frequency, f s , and is defined in Equation 1:(1)f high(−3dB) is about 1.9 Hz at a sampling frequency of 48 kHz. The high-pass filter is always enabled.8.6PWM frequencyThe TFA9882 translates the I 2S input stream into an amplified 3-level PWM output signal. The PWM switching frequency is linearly proportional to the sampling frequency, and is defined in Equation 2.(2)The PWM switching frequency equals 384 kHz when the sampling frequency is 48 kHz.Table 10.DPSA input levelsSettingNumber of power stage sections active ≤ 0.035 ×full scale (−29 dBFS)1> 0.035 ×full scale (−29 dBFS)2> 0.07 ×full scale (−23 dBFS)4> 0.105 ×full scale (−19.5 dBFS)8f high 3dB –()f s –40954096⁄()ln ⋅2π⋅-------------------------------------------------=f sw PWM ()8f s⋅=8.7BandwidthThe TFA9882 output spectrum has a sigma-delta converter characteristic. Figure 9 illustrates the output power spectrum of the TFA9882 when it is receiving an I 2S input stream without audio content. The quantization noise is shaped above the band of interest. The band of interest (bandwidth) is determined by the high corner frequency where the noise is increasing. The bandwidth in Figure 9 scales with the sampling frequency and is defined in Equation 3:(3)8.8Protection mechanismsThe following protection circuits are included in the TFA9882:•OverTemperature Protection (OTP)•OverVoltage Protection (OVP)•UnderVoltage Protection (UVP)•OverCurrent Protection (OCP)The reaction of the device to fault conditions differs depending on the protection circuit involved.8.8.1OverTemperature Protection (OTP)OTP prevents heat damage to the TFA9882. It is triggered when the junction temperature exceeds T act(th_prot). When this happens, the output stages are set floating. OTP is cleared automatically via an internal timer (200 ms), after which the output stages will start to operate normally again.BW 0.4535f s⋅=8.8.2Supply voltage protection mechanisms (UVP and OVP)UVP is activated, setting the outputs floating, if the supply voltage drops below theundervoltage protection threshold, V P(uvp). This transition will be silent, without pop noise.When the supply voltage rises above V P(uvp) again, the system will be restarted after200ms.OVP is activated, setting the power stages floating, if the supply voltage rises above the overvoltage protection threshold, V P(ovp). The power stages are re-enabled as soon as the supply voltage drops below V P(ovp) again. The system will be restarted after 200ms.8.8.3OverCurrent Protection (OCP)OCP will detect a short circuit across the load or between one of the amplifier outputs and one of the supply lines. If the output current exceeds the overcurrent protection threshold(I O(ocp)), it will be limited to I O(ocp) while the amplifier outputs are switching (the amplifier isnot powered down completely). This is called current limiting. The amplifier candistinguish between an impedance drop at the loudspeaker and a low-ohmic short circuit across the load or to one of the supply lines. The impedance threshold depends on which supply voltage is being used:•In the event of a short circuit across the load or a short to one of the supply lines, the audio amplifier is switched off completely. It will try to restart again after approximately200 ms. If the short-circuit condition is still present after this time, this cycle will berepeated. Average dissipation will be low because of the short duty cycle.•In the event of an impedance drop (e.g. due to dynamic behavior of the loudspeaker), the same protection mechanism will be activated. The maximum output current isagain limited to I O(ocp), but the amplifier will not switch off completely (thus preventingaudio holes from occurring). This will result in a clipped output signal without artifacts.9. Internal circuitry10. Limiting valuesTable 11.Internal circuitry Pin Symbol Equivalent circuitA1DATA C1BCKB1V DDD B2V DDPA2WSL C2WSRA3OUTB C3OUTA010aaa714010aaa715B3B1, B2010aaa716010aaa717B3B2A3, C3Table 12.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit V DDP power supply voltage on pin V DDP −0.3+5.5V V DDD digital supply voltage on pin V DDD−0.3+1.95V T j junction temperature -+150°C T stg storage temperature −55+150°C T amb ambient temperature −40+85°C V xvoltage on pin xpins BCK and DATA −0.3+3.6V pins OUTA and OUTB −0.6V DDP + 0.6V pins WSL and WSR−0.6V DDPV[1]Measurements taken on the TFA9882 in a HVSON10 package (engineering samples) due to handling restrictions with WLCSP9.11. Thermal characteristics[1]Measured on a JEDEC high K-factor test board (standard EIA/JESD 51-7).[2]Value depends on where measurement is taken on package.12. Characteristics12.1DC characteristicsV ESDelectrostatic discharge voltageaccording to the Human Body Model (HBM)[1]pins OUTA and OUTB −8+8kV any other pin−2+2kV according to the Charge Device Model (CDM)[1]−500+500V according to the Machine Model (MM)[1]−200+200VTable 12.Limiting values …continuedIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter ConditionsMin Max Unit Table 13.Thermal characteristics Symbol ParameterConditionsTyp Unit R th(j-a)thermal resistance from junction to ambientin free air; natural convection JEDEC test board [1]128K/W 2-layer application board97K/W Ψj-topthermal characterization parameter from junction to top of package[2]12K/WTable 14.DC characteristicsAll parameters are guaranteed for V DDP = 3.6 V;V DDD =1.8V;R L = 4 Ω[1]; L L = 20μH [1]; f i = 1 kHz; f s = 48 kHz; T amb = 25°C, default slope and gain settings; unless otherwise specified.Symbol ParameterConditions Min Typ Max Unit V DDP power supply voltage on pin V DDP 2.5- 5.5V V DDD digital supply voltage on pin V DDD1.651.81.95VI DDPpower supply currentOperating mode with load f s =48 kHz - 1.5 1.7mA f s =32 kHz - 1.38-mA Mute mode 1.1 1.25mA Power-down mode-0.11μA[1]R L =load resistance; L L =load inductance.I DDDdigital supply currentOperating mode f s =48 kHz - 1.25 1.4mA f s =32 kHz -0.85-mA Mute mode f s =48 kHz - 1.1 1.2mA f s =32 kHz-0.8-mA Power-down modeBCK = WS =DATA = 0 V-2.510μASeries resistance output power switches R DSon drain-source on-state resistance -125150m ΩAmplifier output pins; pins OUTA and OUTB |V O(offset)|output offset voltage --3mV BCK, DATA, WSL and WSRV IH HIGH-level input voltage 0.7V DDD - 3.6V V IL LOW-level input voltage --0.3V DDD V C iinput capacitance--3pF Protection T act(th_prot)thermal protection activation temperature 130-150°C V P(ovp)overvoltage protection supply voltage 5.5- 6.0V V P(uvp)undervoltage protection supply voltage 2.3- 2.5V I O(ocp)overcurrent protection output current1.45--ATable 14.DC characteristics …continuedAll parameters are guaranteed for V DDP = 3.6 V;V DDD =1.8V;R L = 4 Ω[1]; L L = 20μH [1]; f i = 1 kHz; f s = 48 kHz; T amb = 25°C, default slope and gain settings; unless otherwise specified.Symbol ParameterConditions Min Typ Max Unit12.2AC characteristicsTable 15.AC characteristicsAll parameters are guaranteed for V DDP = 3.6 V;V DDD=1.8V;R L = 4 Ω[1]; L L = 20μH[1]; f i = 1 kHz; f s = 48 kHz; T amb= 25°C, default slope and gain settings; unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit Output powerP o(RMS)RMS output power THD + N = 1 %V DDP = 3.6 V, f i = 100 Hz- 1.4-WV DDP = 5.0 V, f i = 100 Hz- 2.7-WTHD + N = 1 %; R L = 8 Ω; L L = 44μHV DDP = 3.6 V, f i = 100 Hz-0.75-WV DDP = 5.0 V, f i = 100 Hz- 1.45-WTHD + N = 10 %V DDP = 3.6 V, f i = 100 Hz- 1.75-WV DDP = 5.0 V, f i = 100 Hz- 3.4-WTHD + N = 10 %; R L = 8 Ω; L L = 44μHV DDP = 3.6 V, f i = 100 Hz-0.95-WV DDP = 5.0 V, f i = 100 Hz- 1.85-W Performanceηpo output power efficiency P o(RMS) = 1.4 W-90-% THD+N total harmonic distortion-plus-noise P o(RMS) = 100 mW-0.020.1%V n(o)output noise voltage A-weighted-24-μVS/N signal-to-noise ratio V DDP=5V;V o = 3.4V (RMS); A-weighted-103-dB PSRR power supply rejection ratio V ripple=200 mV; f ripple=217 Hz-85-dBV oM peak output voltage at −6dBFS (peak) digital input:gain=−3 dB; V DDP=2.5 V- 2.3-Vgain=0 dB; V DDP=3.6 V 3.1 3.3 3.5Vgain=+3 dB; V DDP=5.0 V; R L=8 Ω- 4.7-V Power-up, power-down and propagation timest d(on)turn-on delay time[2]--4mst d(off)turn-off delay time[2]--5μst PD propagation delay[2]-600-μs[1]R L=load resistance; L L=load inductance.[2]Inversely proportional to f s.12.3I2S timing characteristicsTable 16.I2S timing characteristicsAll parameters are guaranteed for V DDP = 3.6 V;V DDD=1.8V;R L = 4 Ω[1]; L L = 20μH[1]; f i = 1 kHz; f s = 48 kHz; T amb= 25°C, default slope and gain settings; unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit f s sampling frequency on pins WSL or WSR32-48kHz f clk clock frequency on pin BCK-64f s-Hzt su set-up time WS edge to BCK HIGH10--nsDATA edge to BCK HIGH10--nst h hold time BCK HIGH to WS edge10--nsBCK HIGH to DATA edge10--ns [1]R L=load resistance; L L=load inductance.13. Application information13.1ElectroMagnetic Compatibility (EMC)EMC standards define to what degree a (sub)system is susceptible to externally imposedelectromagnetic influences and to what degree a (sub)system is responsible for emittingelectromagnetic signals, when in Standby mode or Operating mode.EMC immunity and emission values are normally measured over a frequency range from180 kHz up to 3 GHz.13.1.1ImmunityA major reason why amplifier devices pick up high frequency signals, and (after detection)manifest these in the device's audio band, is the presence of analog circuits inside thedevice or in the (sub)system.The TFA9882 has digital inputs and digital outputs. Comparative tests on aTFA9882-based (sub)system show that the impact of externally imposed electromagneticsignals on the device is negligible in both Standby and Operating modes.13.1.2EmissionsSince the TFA9882 is a class-D amplifier with digitally switched outputs in a BTLconfiguration, it can potentially generate emissions due to the steep edges on theamplifier outputs. External components can be used to suppress these emissions.However, the TFA9882 features built-in slope control to suppress such emissions byreducing the slew rate of the BTL output signals. By reducing the slew rate, the emissionsare reduced by some 10dB when compared with full-speed operation.13.2Supply decoupling and filteringA ceramic decoupling capacitor of between 4.7 μF and 10 μF should be placed close tothe TFA9882 for decoupling the V DDP supply. This minimizes the size of thehigh-frequency current loop, thereby optimizing EMC performance.13.3Typical application diagram (simplified)13.4Curves measured in reference design (demonstration board)All measurements were taken with V DDD =1.8V,f clk =6.144 MHz, clip control off, DPSA off and slope normal, unless otherwise specified.14. Package outlineFig 21.Package outline TFA9882UK (WLCSP9)15. Soldering of WLCSP packages15.1Introduction to soldering WLCSP packagesThis text provides a very brief insight into a complex technology. A more in-depth accountof soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application noteAN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surfacemount reflow soldering description”.Wave soldering is not suitable for this package.All NXP WLCSP packages are lead-free.15.2Board mountingBoard mounting of a WLCSP requires several steps:1.Solder paste printing on the PCBponent placement with a pick and place machine3.The reflow soldering itself15.3Reflow solderingKey characteristics in reflow soldering are:•Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure22) than a PbSn process, thusreducing the process window•Solder paste printing issues, such as smearing, release, and adjusting the processwindow for a mix of large and small components on one board•Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peaktemperature is high enough for the solder to make reliable solder joints (a solder pastecharacteristic) while being low enough that the packages and/or boards are notdamaged. The peak temperature of the package depends on package thickness andvolume and is classified in accordance with Table17.Table 17.Lead-free process (from J-STD-020C)Package thickness (mm)Package reflow temperature (°C)Volume (mm3)< 350350 to 2000> 2000< 1.62602602601.6 to2.5260250245> 2.5250245245Moisture sensitivity precautions, as indicated on the packing, must be respected at alltimes.Studies have shown that small packages reach higher temperatures during reflowsoldering, see Figure22.For further information on temperature profiles, refer to application note AN10365“Surface mount reflow soldering description”.15.3.1Stand offThe stand off between the substrate and the chip is determined by:•The amount of printed solder on the substrate•The size of the solder land on the substrate•The bump height on the chipThe higher the stand off, the better the stresses are released due to TEC (ThermalExpansion Coefficient) differences between substrate and chip.15.3.2Quality of solder jointA flip-chip joint is considered to be a good joint when the entire solder land has beenwetted by the solder from the bump. The surface of the joint should be smooth and theshape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumpsafter reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to berelated to these voids. Solder joint inspection after reflow can be done with X-ray tomonitor defects such as bridging, open circuits and voids.15.3.3ReworkIn general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from thesubstrate, most solder balls of the chip will be damaged. In that case it is recommendednot to re-use the chip again.Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate withoutdamaging the tracks and solder lands on the substrate. Removing the device must bedone using plastic tweezers, because metal tweezers can damage the silicon. Thesurface of the substrate should be carefully cleaned and all solder and flux residuesand/or underfill removed. When a new chip is placed on the substrate, use the fluxprocess instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewingwith a microscope. To reflow the solder, use the solder profile shown in application noteAN10365 “Surface mount reflow soldering description”.15.3.4CleaningCleaning can be done after reflow soldering.。
TFA9810T中文资料
VSSP2
19
BOOT2N
20
Negative power-supply voltage channel 2 Bootstrap high-side driver negative output channel 2
Fig 2. Pin configuration
TFA9810 SO32
32 VSSD(HW) 31 STAB1 30 VSSP1 29 BOOT1N 28 OUT1N 27 BOOT1P 26 OUT1P 25 VDDP1 24 VDDP2 23 OUT2P 22 BOOT2P 21 OUT2N 20 BOOT2N 19 VSSP2 18 STAB2 17 VSSD(HW)
010aaa017
The SO32 package has four corner leads. These leads (1, 16, 17, and 32) are internally connected to the die pad and must be connected to VSSA in the application. Together with the applied copper area on the Printed Circuit Board (PCB) these leads determine the ambient temperature, which affects the thermal resistance of the junction.
Table 3. Pin description …continued
Symbol
Pin
Description
IN2N
14
Negative input comparator channel 2
fr9887引脚功能参数
FR9887引脚功能参数1. FR9887引脚功能概述1.1 FR9887芯片简介：1.1.1 芯片型号：FR9887是一款集成电路芯片，主要用于（填写具体应用场景，比如音频处理、通信等）。
1.1.2 制造厂商：该芯片由（填写制造厂商名称）公司生产，是其产品线中的一部分。
1.2 引脚功能的重要性：1.2.1 引脚定义：FR9887芯片上的引脚扮演着连接外部电路与芯片内部功能模块的桥梁作用。
1.2.2 功能多样性：每个引脚都有特定的功能，涉及到输入输出、电源供应、通信接口等多种方面。
1.3 引脚功能与应用场景：1.3.1 设计灵活性：引脚功能的设计考虑到了应用的多样性，使得FR9887芯片能够适用于不同的应用场景。
1.3.2 性能优势：合理配置引脚功能可以充分发挥芯片的性能，提高整体系统的稳定性和效率。
2. FR9887引脚功能详解2.1 电源引脚与地引脚：2.1.1 VCC引脚：作为电源输入，供应电压给芯片内部电路，通常需要连接到电源电池或适配器。
2.1.2 GND引脚：作为地引脚，用于回流电流，连接到系统的电地，确保电路的稳定工作。
2.2 输入输出引脚：2.2.1 模拟输入引脚：用于接收外部模拟信号，例如声音输入，需要通过模数转换器进行数字化处理。
2.2.2 数字输出引脚：将芯片内部处理后的数字信号输出，可能连接到其他设备或者用于音频输出。
2.3 通信接口引脚：2.3.1 I2C接口：FR9887芯片可能具有I2C接口，用于与其他器件进行数字通信，比如控制寄存器的设置。
2.3.2 SPI接口：如果芯片支持SPI通信，相应引脚会用于串行通信，与其他设备进行高速数据传输。
2.4 控制引脚与状态引脚：2.4.1 使能引脚（EN）：通过控制EN引脚的高低电平，可以启用或禁用芯片的特定功能模块。
2.4.2 状态引脚（STAT）：芯片可能提供状态输出引脚，用于指示芯片内部的特定状态，方便系统监测。
3. 引脚参数配置与设计建议3.1 引脚电压与电流要求：3.1.1 电源电压范围：确保VCC引脚接收的电压在芯片规定的范围内，以防止过电压损坏芯片。
恩智浦TFA9887lC为微型扬声器提供超过5倍的功率
恩智浦TFA9887lC为微型扬声器提供超过5倍的功率佚名
【期刊名称】《中国电子商情·基础电子》
【年(卷),期】2012(000)008
【摘要】恩智浦半导体新型音频系统中的革命性嵌入式算法可以使微型扬声器的输出功率提升5倍以上，从而极大地提高了移动设备的音质。
这款恩智浦
TFA9887IC可为微型扬声器提供超过2．6WRMS功率（以前限为0．5W），将为
【总页数】1页(P90-90)
【正文语种】中文
【中图分类】TN722.75
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因版权原因，仅展示原文概要，查看原文内容请购买。
移动音频解决方案
移动音频解决方案
佚名
【期刊名称】《今日电子》
【年(卷),期】2012(000)009
【摘要】TFA9887可为微型扬声器提供超过2．6WRMS功率（以前限为0．5W），将为手机、便携武音乐播放器和平板电脑带来更高的音量、更浑厚的低音与更出色的音质一一而且不存在损坏扬声器的风险。
TFA9887集成了振幅控制和实时温度保护等安全特性，并通过电流检测放大器监控扬声器，
【总页数】1页(P65-65)
【正文语种】中文
【中图分类】TN722
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广数988数控系统介绍PPT课件
机床主要特性
： 1、两端面进行一次装夹可以对各类盘 零件加工成型； 2、夹持双主轴同步相对运动零件，可 确保盘类零件的同轴度；
双主轴双刀架机床
成功配置 中山亚萨合莱安防科技有限公司 机床型号:敏佳机床HF302
双主轴双排刀架机床
机床主要特性 ： 1、两通道同时运行两个程序，加工效 率高； 2、主轴同步功能可满足零件对两端面 同轴度和同起始角度的要求；
双主轴单刀架机床
机床主要特性
可实现轴/径向的车、钻、铣、攻丝 等复合加工；
可通过一次装夹，加工工件两端面
成功配置 沈阳机床厂 机床型号: HTC4030T
单主轴双刀架机床
：
机床主要特性
1、该机床配置两个排刀架，一个主轴；
2、两个刀架可同时加工一个工件，有
效提高加工效率
成功配置 盐城苏工高科 机床型号: SKL300
GSK988MA 6轴 3轴 3轴 支持 支持
100m/min 支持 支持
前加减速 支持 支持 支持 支持 支持
支持选择车床G代码 支持
8.4寸/10.4寸 有
FANUC0i-MD 5轴 2轴 1轴 支持 支持
100m/min 支持 支持
前/后加减速 支持 支持 支持 支持 支持
支持选择车床G代码 支持
功能 控制路径数 总控制轴数（合计）
最多控制轴数（各路径）
总控制主轴数（合计）
最多控制主轴数（各路 径） Cs轮廓控制轴数 （合计）
最 多 Cs 轮 廓 控 制 轴 数 （各路径）
GSK988TD 2个 10轴
6轴
4轴
3轴
4轴
3轴
FANUC0i-TD 2个 8轴
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COMPANY CONFIDENTIAL
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TFA9890 and TFA9887 vs. Non-Boost Amp
Louder
TFA9887 = 3 to 5 dB TFA9890 = 6 to 8 dB
More Bass
(@600 Hz)
TFA9887 = 10 dB TFA9890 = 16 dB
NXP Smart Audio Introduction
Jul 2013
Why are Louder Sound and more Bass problematic?
Doing this without protection leaves you with a broken loudspeaker!!
对喇叭振幅和温度的 未知是制约手机音频 设计的主要因素
Damaged Speaker
Damaged Brand Reputation
Loud Sound Too Hot Speaker
(glue holding the coil melts)
High repair costs
COMPANY CONFIDENTIAL
9V output
*6~8+ dB loudness
DSP EQ
Boost
TFA9890
TFA9887
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TFA9887 Vs. YAMAHA 145
TFA9887具有DPSA(Dynamic Power Stage Activation)，提高效率 TFA9887：功率分级输出，自动调节，比 一般Class D 效率更高！
具有电池管理功能，在电池欠电时，动态调低功放输出，使系统有足够的电 力优先给其他部分（比如网络和屏幕）供电，延长手机待机时间。
内置DSP和EQ，可以预设场景模式 NXP 产品已经经过市场验证，保证客户顺利设计和量产
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2
NXP Smart PA最大优势：
NXP Smart PA集成了喇叭保护、腔体侦测、音效增强、电源和电池管理的功 能, 单芯片解决方案，最大化方便设计。
NXP 最大优势 › o 创新的喇叭反馈机制，实时侦测喇叭状态
• • • 可以侦测喇叭实时振幅和温度，可以保护喇叭。 在保护喇叭前提下，可以实时调整功放增益、EQ、 频响等，可以使喇叭发挥最大效能。 可以侦测喇叭腔体是否损坏或漏气，并及时自动调 整驱动方式
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TFA9887 Vs Yamaha 手机应用条件m 喇叭，THD=10%
TFA9887
2.1W YDA145 0.6W TFA9887具有DC 升压电 路，可以显著提高输出功率
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• Slim speaker for louder output • High voltage drive • NXP solution o TFA9890(9V output) o 4-6 dB more output
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总结：TFA9887(90) Advantages
Loudspeaker Model Embedded Processing
Current Sensing Hardware
通过电流形成的喇叭反馈电路
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Success Story（MP project only)
与传统功放最大的不同，TFA9887(90)可以通过反馈电路侦测喇叭的实时数 据，包括喇叭实时振幅数据，温度及腔体变化。 基于喇叭的实时数据，功放就可以实时调整工作状态，最大限度的发挥喇叭 效能，同时又能保护喇叭过载过热，防止喇叭损坏。 功放具有智能升压电路，在取得最大功率同时又能保证工作效率。同时，功 放放大电路可以根据实际需要动态分配输出，显著提升效率。
Lumia 1020 New ONE 8X ONE X+
P6
Lumia 928 ONE XL+ Butterfly Droid DNA
Shield
NXP has shipped over 100Mpcs TFA9887!
COMPANY CONFIDENTIAL
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NXP Smart Audio amp Roadmap
Audio In Speaker Protect and Audio Boost Boost Converter
Class-D Amp
o NXP Smart PA可以把给定的喇叭功效发挥到 极致，同时保护喇叭。 o 业界第一款把半导体（功放）和声学（喇 叭）结合在一起的产品 o 业内唯一已经过量产和市场验证的产品
Consumers Want
More Bass
(low frequencies)
Without speaker protection:
Too Large Membrane Excursion
(membrane cracks)
Consequence!!
Lower consumer satisfaction
Trend 1
• Combo SPK+RCV • NXP solution:
oTFA9887+switch oTFA9888(MP 2H14)
Trend 2
• Stereo output • NXP solution o 2 x TFA9887(90) o Easy design in I2S
Trend 3
Power Supply
¼ IQ
¼ IQ
¼ IQ
¼ IQ
Quiescent Current (IQ)
Input Output
Output Signal
DPSA Output Transistors
Transistors Shut-down when not needed; saving Quiescent Current
TFA9887在AGC上的优势
YDA145只控制电信号 TFA9887不仅控制电信号，更控制振 幅和腔体模型
TFA9887侦 测振幅并控 制增益
TFA9887也侦测 电压信号
TFA9887采用更高级的AGC，喇叭的条件也 会作为AGC相应的一个条件
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Audio amp implement trend
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TFA9887 Vs. Yamaha 工作效率
YDA145 efficiency •84%(Vdd=3.6V, Rl=8ohm, Po=600mW) •78%(Vdd=3.6V, Rl=8ohm, Po=100mW)
TFA9887
结论： o TFA9887(具备了DPSA功能的功放） 工作效率高（94% VS. 84% at 0.6W) o TFA9887在取得高效率的同时，还在实现喇叭保护和I2S 转ANALOG的功能（使 用YDA145时，这部分功能在CODEC中实现，系统需要损耗一定的电流。）
Speaker + Receiver Driver 9V output TFA9888 (MP 2H14)
*6~8+ dB loudness
TFA9890(MP Now) DSP EQ TFA9887(MP Now) TFA9895(sample ready) Boost
Multi-Band DRC *Noise improve