D20XB80_datasheet

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SCALANCE XB004-2LD 产品说明书

3-pole terminal block
● product component / 1 / fusing at power supply input
Yes
● fuse protection type / 1 / at input for supply voltage
0.6 A / 60 V
type of voltage / 2 / of the supply voltage
design
Box
width
45 mm
6GK50042BF001AB2 Page 1/2
7/4/2023
Subject to change without notice © Copyright Siemens
height depth net weight fastening method
● 35 mm top hat DIN rail mounting ● wall mounting ● S7-1500 rail mounting product functions / management, configuration, engineering product function ● multiport mirroring ● CoS PROFINET conformity class product function / switch-managed product functions / redundancy product function ● Parallel Redundancy Protocol (PRP)/operation in the PRP-network ● Parallel Redundancy Protocol (PRP)/Redundant Network Access (RNA) standards, specifications, approvals reference code ● according to IEC 81346-2 ● according to IEC 81346-2:2019 standards, specifications, approvals / CE certificate of suitability / CE marking further information / internet links internet link ● to web page: selection aid TIA Selection Tool ● to website: Industrial communication ● to website: Industry Mall ● to website: Information and Download Center ● to website: Image database ● to website: CAx-Download-Manager ● to website: Industry Online Support security information security information

ads1018 Datasheet

ADS1018 以高达 3300 次采样/秒 (SPS) 的数据速率进行转换。PGA 的输入范围为 ±256mV 至 ±6.144V，支持以高分辨率测量大信号和小信号。该器件通过输入复用器 (MUX) 测量双路差分输入或四路单端输入。高精度温度传感器用于监控系统级温度或对热电偶进行冷结点补偿。
ADS1018 可选择以连续转换模式或单次模式运行。该器件在单次模式下完成一次转换后自动断电。在空闲状态下，单次模式会显著降低流耗。所有数据均通过串行外设接口 (SPI™) 进行传输。
器件型号 ADS1018
器件信息(1)
封装 X2QFN (10) VSSOP (10)
封装尺寸（标称值） 1.50mm x 2.00mm 3.00mm × 3.00mm
(1) 要了解所有可用封装，请参见数据表末尾的封装选项附录。
K 型热电偶测量使用集成温度传感器进行冷结点补偿
3.3 V
3.3 V
0.1 F
AIN0 AIN1
VDD
Voltage Reference
ADS1018
3.3 V
Mux
PGA
AIN2 AIN3
GND
12-bit û ADC
பைடு நூலகம்
Digital Filter and
8.4 Device Functional Modes........................................ 15 8.5 Programming........................................................... 16 8.6 Register Maps ......................................................... 19 9 Application and Implementation ........................ 21 9.1 Application Information............................................ 21 9.2 Typical Application ................................................. 26 10 Power-Supply Recommendations ..................... 29 10.1 Power-Supply Sequencing.................................... 29 10.2 Power-Supply Decoupling..................................... 29 11 Layout................................................................... 30 11.1 Layout Guidelines ................................................. 30 11.2 Layout Example .................................................... 31 12 器件和文档支持 ..................................................... 32 12.1 文档支持................................................................ 32 12.2 社区资源................................................................ 32 12.3 商标 ....................................................................... 32 12.4 静电放电警告......................................................... 32 12.5 Glossary ................................................................ 32 13 机械、封装和可订购信息....................................... 32

Control4 CORE 1 家庭自动化控制器说明书

Control4 CORE 1 Controller Installation GuideSupported model• C4-CORE1 Control4 CORE 1 Hub & ControllerIntroductionDesigned for an exceptional family room entertainment experience, the Control4® CORE 1 Controller does more than automate the gear around your TV; it is the ideal smart home starter system with entertainment built in.The CORE 1 delivers a beautiful, intuitive, and responsive on-screen user interface with the ability to create and enhance the entertainment experience for any TV in the house. The CORE 1 can orchestrate a wide range of entertainment devices including Blu-ray players, satellite or cable boxes, game consoles, TVs, and virtually any product with infrared (IR) or serial (RS-232) control. It also features IP control for Apple TV, Roku, televisions, AVRs, or other network-connected devices, as well as secure wireless Zigbee control for lights, thermostats, smart locks, and more.For entertainment, the CORE 1 also includes a built-in music server that allows you to listen to your own music library, stream from a variety of leading music services, or from your AirPlay-enabled devices using Control4 ShairBridge technology.Box contentsThe following items are included in the CORE 1 controller box:• CORE 1 controller• AC power cord• IR emitters (2)• Rubber feet (2, pre-installed)• External antenna (1 for Zigbee)Accessories available for purchase• CORE 1 Wall-Mount Bracket (C4-CORE1-WM)• Control4 1U Rack-Mount Kit, Single/Dual Controller (C4-CORE1-RMK)• Control4 3-Meter Wireless Antenna Kit (C4-AK-3M)• Control4 Dual-Band Wi-Fi USB Adapter (C4-USBWIFI OR C4-USBWIFI-1)• Control4 3.5 mm to DB9 Serial Cable (C4-CBL3.5-DB9B) Requirements and specificationsWe recommend using Ethernet instead of Wi-Fi for the best networkThe Ethernet or Wi-Fi network should be installed before starting theThe CORE 1 requires OS 3.3 or newer.Composer Pro UserGuide (ctrl4.co/cpro-ug) for details.WarningsCaution! To reduce the risk of electrical shock, do not expose this apparatus torain or moisture.AVERTISSEMENT ! Pour réduire le risque de choc électrique, n’exposez pas cetappareil à la pluie ou à l’humidité.Caution! I n an over-current condition on USB, the software disables theoutput. If the attached USB device does not appear to power on, remove theUSB device from the controller.AVERTISSEMENT ! Dans une condition de surintensité sur USB ou sortie decontact le logiciel désactive sortie. Si le périphérique USB ou le capteurde contact connecté ne semble pas s’allumer, retirez le périphérique ducontrôleur.SpecificationsInputs / OutputsVideo out 1 video out—1 HDMIVideo HDMI 2.0a; 3840x2160 @ 60Hz; HDCP 2.2 and HDCP 1.4Audio out 2 audio out—1 HDMI and 1 digital coaxAudio playback formats AAC, AIFF, ALAC, FLAC, M4A, MP2, MP3, MP4/M4A, OggVorbis, PCM, WAV, WMAHigh-resolution audio playback Up to 192 kHz / 24 bitNetworkEthernet 2 10/100/1000BaseT compatible ports—1 PoE+ in and1 switch network portWi-Fi Optional Dual-Band Wi-Fi USB Adapter(2.4 GHz, 5 Ghz, 802.11ac/b/g/n/a)Zigbee Pro802.15.4Zigbee antenna External reverse SMA connectorUSB port 1 USB 3.0 port—500mAControlIR out 4 IR out—5V 27mA max outputIR capture 1 IR receiver—front, 20-60 KHzSerial out 2 serial out (shared with IR out 1 and 2)PowerPower requirements100-240 VAC, 60/50Hz or PoE+Power consumption Max: 18W, 61 BTUs/hourIdle: 9W, 30 BTUs/hourOtherOperating temperature32˚F ~ 104˚F (0˚C ~ 40˚C)Storage temperature4˚F ~ 158˚F (-20˚C ~ 70˚C)Dimensions (H × W × D) 1.16 × 7.67 × 5.2" (29.5 × 195 × 132 mm)Weight 1.5 lb (0.68 kg)Shipping weight 2.3 lb (1.04 kg)Additional resourcesThe following resources are available for more support.• Control4 CORE series help and information: ctrl4.co/core• Snap One Tech Community and Knowledgebase: •Control4 Technical Support:ctrl4.co/techsupport• Control4 website: 71231 Connect one of the included IR emitters to an IR OUT port on the controller.2 Place the stick-on emitter end onto the IR receiver on the Blu-ray player, TV, or othertarget device to emit IR signals from the controller to the target device.Setting up external storage devices (optional)You can store and access media from an external storage device, for example, a networkhard drive or USB memory device, by connecting the USB drive to the USB port andconfiguring or scanning the media in Composer Pro.We support only externally powered USB drives or solid state USB sticks.Composer Pro driver informationUse Auto Discovery and SDDP to add the driver to the Composer project. See theComposer Pro User Guide (ctrl4.co/cpro-ug) for details.OvrC setup and configurationOvrC gives you remote device management, real-time notifications, and intuitivecustomer management, right from your computer or mobile device. Setup isplug-and-play, with no port forwarding or DDNS address required.To add this device to your OvrC account:1 Connect CORE 1 controller to the Internet.2 Navigate to OvrC () and log in to your account.3 Add the device (MAC address and Service Tag numbers needed for authentication).Front viewA Activity LED—The Activity LED shows when the controller is streaming audio.B IR window—IR receiver for learning IR codes.C Caution LED—This LED shows solid red, then blinks blue during the boot process.The Caution LED blinks orange during the factory restore process. SeeD —The LED indicates that the controller has been identified in a Control4project and is communicating with Director.E Power LED—The blue LED indicates that AC power is present. The controller turns onimmediately after power is applied to it.Back viewPower port—AC power connector for an IEC 60320-C5 power cord.B IR OUT/SERIAL—3.5 mm jacks for up to four IR emitters or for a combination of IRemitters and serial devices. Ports 1 and 2 can be configured independently for serialcontrol (for controlling receivers or disc changers) or for IR control. See “Connectingthe IR ports/serial ports” in this document for more information.C USB—One port for an external USB drive (such as a USB stick formatted FAT32). See“Setting up external storage devices” in this document.D DIGITAL AUDIO—Outputs audio (AUDIO OUT) shared from other Control4 devices orfrom digital audio sources (local media or digital streaming services).E HDMI OUT—An HDMI port to display navigation menus. Also an audio out over HDMI.F ID button and RESET—ID button is pressed to identify the device in Composer Pro. TheID button on the CORE 1 is also an LED that displays feedback useful during a factoryrestore. The RESET pinhole is used to reset or factory restore the controller.G ENET OUT—RJ-45 jack for Ethernet out connection. Acts as a 2-port network switchwith ENET/POE+ IN jack.H ENET/POE+ IN—RJ-45 jack for a 10/100/1000BaseT Ethernet connection. Also canpower the controller with PoE+.I ZIGBEE—Antenna connector for the Zigbee radio.Installation instructionsTo install the controller:1 Ensure that the home network is in place before starting system setup. An Ethernetconnection to the local network is required for setup. The controller requires anetwork connection to use all of the features as designed. After initial configuration,Ethernet (recommended) or Wi-Fi (with an optional adapter) can be used toconnect the controller to web-based media databases, communicate with other IPdevices in the home, and access Control4 system updates.2 Mount the controller near the local devices you need to control. The controller canbe hidden behind a TV, mounted on a wall, installed in a rack, or placed on a shelf.The CORE 1 Rack Mount Kit is sold separately and is designed for easy installation ofup to two CORE 1 controllers side by side in a rack. The CORE 1 Wall-Mount Bracketis sold separately and designed for easy installation of the CORE 1 controller behinda TV or on the wall.3 Attach antenna to the ZIGBEE antenna connector.4 Connect the controller to the network.• Ethernet—To connect using an Ethernet connection, connect the network cableinto the controller’s RJ-45 port (labeled ENET/POE+ IN) and into the network porton the wall or at the network switch.• Wi-Fi—To connect using Wi-Fi, first connect the unit to Ethernet, connect theWi-Fi adapter to the USB port, and then use Composer Pro System Manager toreconfigure the unit for Wi-Fi.5 Connect system devices. Attach IR and serial devices as described in “Connectingthe IR ports/serial ports” and “Setting up IR emitters.”6 Set up any external storage devices as described in “Setting up external storagedevices” in this document. | 888.400.4070Copyright 2022, Snap One, LLC. All rights reserved. Snap One and its respective logos are registered trademarks or trademarks of Snap One, LLC (formerly known as Wirepath Home Systems, LLC), in the United States and/or other countries. 4Store, 4Sight, Control4, Control4 My Home, SnapAV, Mockupancy, NEEO, OvrC, Wirepath, and Wirepath ONE are also registered trademarks or trademarks of Snap One, LLC. Other names and brands may be claimed as the property of their respective owners. Snap One makes no claim that the information contained herein covers all installation scenarios and contingencies, or product use risks. Informationwithin this specification subject to change without notice.More helpFor the latest version of this document and to view additional materials, open the URL below or scan the QR code on a device that can view PDFs.Legal, Warranty, and Regulatory/Safety informationVisit /legal for details.MOST RECENT VERSIONctrl4.co/core1-ig200-00724-A 2022-05-31 DHATroubleshootingReset to factory settingsCaution! The factory restore process will remove the Composer project.To restore the controller to the factory default image:1 Insert one end of a paper clip into the small hole on the back of the controller labeled RESET .2 Press and hold the RESET button. The controller resets and the ID button changes to solid red.3 Hold the button until the ID flashes double orange. This should take five to seven seconds. The ID button flashes orange while the factory restore is running. When complete, the ID button turns off and the device power cycles one more time to complete the factory restore process.Note: During the reset process, the ID button provides the same feedback as the Caution LED on the front of the controller.Power cycle the controller1 Press and hold the ID button for five seconds. The controller turns off and back on.Reset the network settingsTo reset the controller network settings to the default:1 Disconnect power to the controller.2 While pressing and holding the ID button on the back of the controller, power on the controller.3 Hold the ID button until ID button turns solid orange and the Link and Power LEDs are solid blue, and then immediately release the button.Note: During the reset process, theID button provides the same feedback asthe Caution LED on the front of the controller.LED status informationActivityCautionLinkPowerMORE INFO ON CORE CONTROLLERSctrl4.co/core。

Micro800 非隔离型单极模拟量输出功能性插件模块产品目录号 2080-OF2说明书

接线图Micro800™ 非隔离型单极模拟量输出功能性插件模块产品目录号2080-OF2/idc/groups/literature/documents/wd/208 0-wd004_-mu-p.pdfFR Cette publication est disponible en français sous forme électronique (fichier PDF).Pour la télécharger, rendez-vous sur la page Internet indiquée ci-dessus.IT Questa pubblicazione è disponibile in Italiano in formato PDF. Per scaricarla collegarsi al sito Web indicato sopra.DE Diese Publikation ist als PDF auf Deutsch verfügbar. Gehen Sie auf die oben genannte Web-Adresse, um nach der Publikation zu suchen und sie herunterzuladen.ES Esta publicación está disponible en español como PDF. Diríjase a la dirección web indicada arriba para buscar y descarga esta publicación.PT Esta publicação está disponível em portugués como PDF. Vá ao endereço web que aparece acima para encontrar e fazer download da publicação.ZHZC2 Micro800™ 非隔离型单极模拟量输出功能性插件模块出版物 2080-WD004A-ZH-P - 2010年9 月环境和机柜防止静电放电本设备适用于在污染等级 2 工业环境、过电压 II 类应用中使用 (如 IEC 60664-1 所定义)，在海拔高达 2000 米 (6562 英尺) 时不降额。

X20(c)BB80数据手册 V 2.35说明书

3 Order data
Model number X20BB80 X20cBB80
Short description
System modules for bus controllers
X20 bus base, for X20 base module (BC, HB, etc.) and X20 power supply module, X20 end plates (left and right) X20AC0SL1/ X20AC0SR1 included
X20(c)BB80
X20(c)BB80
1 General information
The following modules are used on the bus module: • Base module (BC, HB, etc.) • Supply module
The left and right end plates are included in the delivery. • Bus base
Information:
It is important to absolutely ensure that there is no forced cooling by air currents in a closed control cabinet, for example using a fan or ventilation slots.
Table 1: X20BB80, X20cBB80 - Order data
Data sheet V 2.35
1
X20(c)BB80
4 Technical data
Model number Short description Bus module General information Power consumption

IXYB82N120C3H1;中文规格书,Datasheet资料

CES I C110= 82A V CE(sat) ≤ 3.2V t fi(typ)= 93nsHigh-Speed IGBTfor 20-50 kHz SwitchingFeaturesz Optimized for Low Switching Losses zSquare RBSOA zAnti-Parallel Ultra Fast Diode zPositive Thermal Coefficient of Vce(sat)zAvalanche Rated zHigh Current Handling Capability zInternational Standard PackageAdvantagesz High Power DensityzLow Gate Drive RequirementApplicationsz High Frequency Power Inverters z UPSz Motor Drives z SMPSz PFC Circuits z Battery Chargers z Welding Machines zLamp BallastsSymbol Test Conditions Characteristic Values (T J = 25°C, Unless Otherwise Specified) Min. Typ. Max.BV CES I C = 250μA, V GE = 0V 1200 VV GE(th)I C= 250μA, V CE = V GE3.05.0VI CES V CE = V CES , V GE = 0V50μA T J = 125°C 3 mA I GES V CE = 0V, V GE = ±20V±100 nAV CE(sat)I C = 82A, V GE = 15V, Note 12.753.20 V T J = 125°C3.50 VSymbol Test ConditionsMaximum Ratings V CES T J = 25°C to 150°C1200V V CGR T J = 25°C to 150°C, R GE = 1M Ω 1200V V GES Continuous ±20V V GEM Transient ±30V I C25T C = 25°C 160A I C110T C = 110°C 82A I F110T C = 110°C 42A I CM T C= 25°C, 1ms 320AI A T C = 25°C 41 A E AST C = 25°C 800 mJSSOA V GE = 15V, T VJ = 125°C, RG = 2Ω I CM = 164A (RBSOA) Clamped Inductive Load @V CE ≤ V CES P C T C = 25°C1040W T J -55 ... +150°C T JM 150°C T stg -55 ... +150°CT LMaximum Lead Temperature for Soldering 300°CT SOLD 1.6 mm (0.062in.) from Case for 10s 260°CF C Mounting Force 30..120 / 6.7..27N/lb.Weight10g1200V XPT TM IGBT GenX3TM w/ DiodeG = Gate C = Collector E = EmitterTab = CollectorEPLUS264TMG CIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Symbol Test Conditions (T J = 25°C Unless Otherwise Specified)fs I C = 60A, V CE = 10V, Note 1 30 50C ie sC oes V CE = 25V, V GE C resQ g(on)Q ge I C = 82A, V GE = 15V, V Q gc d(on)Pin 1 = Gate Pin 2,4 = Emitter Pin 3 = CollectorNotes:1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.2. Switching times & energy losses may increase for higher V CE (clamp), T J or R G .Reverse Diode (FRED)Symbol Test ConditionsCharacteristic ValuesFig. 1. Output Characteristics @ T 6080100120140160I C - A m p e r e sIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Fig. 7. Transconductance304050607080g f s - S i e m e n sFig. 12. Inductive Switching Energy Loss vs.Gate Resistance345678E o f f - M i l l i J o u l e sE off E on - - - - T J = 125ºC , V GE = 15V V CE = 600VIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Fig. 18. Inductive Turn-on Switching Times vs.Gate Resistance6080100120140160r i - N a n o s e c o n d st r i t d(on) - - - -T J = 125ºC, V GE = 15V V CE = 600VI CFig. 21.Fig. 22.Fig. 23.Fig. 24.Fig. 25.Fig. 26. transient thermal impedance分销商库存信息: IXYSIXYB82N120C3H1。

罗克韦尔自动化-2080-um002_-zh-e.pdf-Micro830、Micro850 和 M

Micro830、Micro850 和 Micro870可编程控制器Micro810 控制器产品目录号 2080-LC10-12AWA、2080-LC10-12QWB、2080-LC10-12DWD、2080-LC10-12QBBMicro820 控制器产品目录号 2080-LC20-20AWB、2080-LC20-20AWBR、2080-LC20-20QWB、2080-LC20-20QWBR、2080-LC20-20QBB、2080-LC20-20QBBRMicro830 控制器产品目录号 2080-LC30-10QWB、2080-LC30-10QVB、2080-LC30-16AWB、2080-LC30-16QWB、2080-LC30-16QVB、2080-LC30-24QWB、2080-LC30-24QVB、2080-LC30-24QBB、2080-LC30-48AWB、2080-LC30-48QWB、2080-LC30-48QVB、2080-LC30-48QBBMicro850 控制器产品目录号 2080-LC50-24AWB、2080-L50E-24AWB、2080-LC50-24QWB、2080-L50E-24QWB、2080-LC50-24QVB、2080-L50E-24QVB、2080-LC50-24QBB、2080-L50E-24QBB、2080-LC50-48AWB、2080-L50E-48AWB、2080-LC50-48QWB、2080-L50E-48QWB、2080-LC50-48QWBK、2080-L50E-48QWBK、2080-LC50-48QVB、2080-L50E-48QVB、2080-LC50-48QBB、2080-L50E-48QBBMicro870 控制器产品目录号 2080-LC70-24AWB、2080-L70E-24AWB、2080-LC70-24QWB、2080-L70E-24QWB、2080-LC70-24QWBK、2080-L70E-24QWBK、2080-L70E-24QWBN、2080-LC70-24QBB、2080-L70E-24QBB、2080-LC70-24QBBK、2080-L70E-24QBBK、2080-L70E-24QBBN2罗克⻙尔⾃动化出版物2080-UM002M-ZH-E - 2022 年4 月Micro830、Micro850 和 Micro870 可编程控制器⽤⼾⼿册重要⽤⼾须知在安装、配置、操作或维护本产品之前，请阅读本文档以及“其他资源”章节所列的文档，了解关于安装、配置和操作该设备的信息。

BQ20Z80ADBT-V110;BQ20Z80DBTG4;BQ20Z80DBT;BQ20Z80DBTR;BQ20Z80DBTRG4;中文规格书,Datasheet资料

FEATURESAPPLICATIONSDESCRIPTIONbq20z80bq20z80ASLUS782–JULY2007 SBS1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™TECHNOLOGY FOR USE WITH THE bq29312A•38-Pin TSSOP(DBT)•Patented Impedance Track™TechnologyAccurately Measures Available Charge in•Notebook PCsLi-Ion and Li-Polymer Batteries•Medical and Test Equipment•Better than1%Error Over Lifetime of the•Portable Instrumentation Battery•Instant Accuracy–No Learning CycleRequiredThe bq20z80SBS-compliant gas gauge IC,•Supports the Smart Battery Specification SBSincorporating patented Impedance Track™V1.1technology,is designed for battery-pack or in-system •Works With the TI bq29312A Analoginstallation.The bq20z80measures and maintains Front-End(AFE)Protection IC to Provide an accurate record of available charge in Li-ion orComplete Pack Electronics Solution Li-polymer batteries using its integrated •Full Array of Programmable Voltage,Current,high-performance analog peripherals.The bq20z80monitors capacity change,battery impedance, and Temperature Protection Featuresopen-circuit voltage,and other critical parameters of •Integrated Time Base Removes Need forthe battery pack,and reports the information to the External Crystal with Optional Crystal Inputsystem host controller over a serial-communication •Electronics for7.2-V,10.8-V or14.4-V Battery bus.It is designed to work with the bq29312A analog Packs With Few External Components front-end(AFE)protection IC to maximizefunctionality and safety,and minimize component •Based on a Powerful Low-Power RISC CPUcount and cost in smart battery circuits.Core With High-Performance Peripherals•Integrated Field Programmable FLASH The Impedance Track technology continuouslyanalyzes the battery impedance,resulting in superior Memory Eliminates the Need for Externalgas-gauging accuracy.This enables remaining Configuration Memorycapacity to be calculated with discharge rate,•Measures Charge Flow Using atemperature,and cell aging all accounted for during High-Resolution,16-Bit Integrating each stage of every cycle.Delta-Sigma Converter–Better Than0.65nVh of Resolution AVAILABLE OPTIONS–Self-Calibrating PACKAGE(1)T A–Offset Error Less Than1μV38-PIN TSSOP(DBT)38-PIN TSSOP(DBT)Tube Tape and Reel •Uses16-Bit Delta-Sigma Converter for–40°C toAccurate Voltage and Temperature bq20z80ADBT(2)bq20z80ADBTR(3)85°CMeasurements–40°C tobq20z80DBT(2)bq20z80DBTR(3)•Extensive Data Reporting Options For85°CImproved System Interaction•Optional Pulse Charging Feature for ImprovedCharge Times•Drives3-,4-or5-Segment LED Display for(1)For the most current package and ordering information,seeRemaining Capacity Indicationthe Package Option Addendum at the end of this document,or see the TI website at .•Supports SHA-1Authentication(2)A single tube quantity is50units.•Lifetime Data Logging(3)A single reel quantity is2000unitsPlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.Impedance Track is a trademark of Texas Instruments.PRODUCTION DATA information is current as of publication date.Copyright©2007,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters. SYSTEM DIAGRAMXCK1 / VSSAFIL TVDDASR2SR1VSSAVSSATNC - No internal connectionbq20z80bq20z80ASLUS782–JULY2007These devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.TSSOP(DBT)(TOP VIEW)2Submit Documentation Feedbackbq20z80bq20z80ASLUS782–JULY2007 TERMINAL FUNCTIONSTERMINALI/O(1)DESCRIPTION1VIN I Voltage measurement input from the AFE2TS1I1st Thermistor voltage input connection to monitor temperature3TS2I2nd Thermistor voltage input connection to monitor temperature4PU O Output to pull up the PRES pin for system detection5PRES I Active low input to sense system insertion and typically requires additional ESD protection6SCLK I/OD Communication clock to the AFE7SAFE O Active high output to enforce additional level of safety protection;e.g.,fuse blow.(Inverse of pin12) 8VDDD P Positive supply for digital circuitry and I/O pinsBackup power to the bq20z80data registers during periods of low operating voltage.RBI accepts a 9RBI Pstorage capacitor or a battery input.10SDATA I/O Data transfer to and from the AFE12SAFE O Active low output to enforce additional level of safety protection;e.g.,fuse blow.(Inverse of pin7) 13NC–Not used—leave floating14NC–Not used—leave floating15SMBC I/OD SMBus clock open-drain bidirectional pin used to clock the data transfer to and from the bq20z80 16SMBD I/OD SMBus data open-drain bidirectional pin used to transfer address and data to and from the bq20z80Display control for the LEDs.This pin is typically connected to bq29312A REG via a100-kΩresistor 17DISP Iand a push-button switch to VSSD.Active low input to detect secondary protector output status and allows the bq20z80to report the 18PFIN Istatus of the2nd level protection output20LED5O LED5display segment that drives an external LED depending on the firmware configuration21LED4O LED4display segment that drives an external LED depending on the firmware configuration22LED3O LED3display segment that drives an external LED depending on the firmware configuration23LED2O LED2display segment that drives an external LED depending on the firmware configuration24LED1O LED1display segment that drives an external LED depending on the firmware configuration25XALERT I Input from bq29312A XALERT output.26MRST I Master reset input that forces the device into reset when held highConnections for a small-value sense resistor to monitor the battery charge-and discharge-current 27SR2IAflowConnections for a small-value sense resistor to monitor the battery charge-and discharge-current 28SR1IAflow31VDDA P Positive supply for analog circuitryAnalog input connected to the external PLL filter components which are a150-pF capacitor to V SSA, 32FILT IA in parallel with a61.9-kΩresistor and a2200-pF capacitor in series.Place these components asclose as possible to the bq20z80to ensure optimal performance.32.768-kHz crystal oscillator output pin or connected to a100-kΩ,50-ppm or better resistor if the33XCK2/ROSC Ointernal oscillator is used.34XCK1/VSSA I32.768-kHz crystal oscillator input pin or connected to VSSA if the internal oscillator is used35CLKOUT O32.768-kHz output for the bq29312.This pin should be directly connected to the AFE.36,37NC-Not used—leave floating11,19,38VSSD P Negative supply for digital circuitry29,30VSSA P Negative supply for analog circuitry.(1)I=Input,IA=Analog input,I/O=Input/output,I/OD=Input/Open-drain output,O=Output,OA=Analog output,P=Power3Submit Documentation FeedbackABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSbq20z80bq20z80ASLUS782–JULY 2007over operating free-air temperature range (unless otherwise noted)(1)RANGEV DDA and V DDD relative to V SS (2)Supply voltage range –0.3V to 4.1V V (IOD)relative to V SS (2)Open-drain I/O pins–0.3V to 6V V I relative to V SS (2)Input voltage range to all other pins –0.3V to VDDA +0.3VT A Operating free-air temperature range –40°C to 85°C T stg Storage temperature range–65°C to 150°C(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)V SS refers to the common node of V (SSA)and V (SSD).V DD =3V to 3.6V,T A =–40°C to 85°C (unless otherwise noted)PARAMETERTEST CONDITIONS MIN TYP MAX UNIT V DD Supply voltageVDDA and VDDD 33.3 3.6V No flash programming 350(1)I DDOperating mode currentμA bq20z80+bq29312A 375Sleep mode8(1)I (SLP)Low-power storage mode current μA bq20z80+bq29312A 28Shutdown Mode 0.1(1)I (SLP)Shutdown CurrentμAbq20z80+bq29312A 0.1Output voltage low SMBC,SMBD,SDATA,SCLK,SAFE,I OL =0.5mA 0.4V SAFE,PU V OLLED1–LED5I OL =10mA 0.4V V OH Output high voltage,SMBC,SMBD,SDATA,SCLK,SAFE,I OH =–1mAV DD –0.5V SAFE,PUV ILInput voltage low SMBC,SMBD,SDATA,SCLK,XALERT,–0.30.8V PRES,PFIN DISP–0.30.8V V IHInput voltage high SMBC,SMBD,SDATA,SCLK,XALERT,26V PRES,PFIN DISP2V DD +0.3V C INInput capacitance5pF V (AI1)Input voltage range VIN,TS1,TS2V SS –0.30.8x V DDV V (AI2)Input voltage range SR1,SR2V SS –0.250.25Z (AI1)Input impedance SR1,SR20V–1V 2.5M ΩZ (AI2)Input impedance VIN,TS1,TS20V–1V8M Ω(1)This value does not include the bq29312A4Submit Documentation FeedbackPOWER-ON RESET2.102.152.202.252.302.352.402.452.50T A - Free-Air Temperature - °C- N e g a t i v e G o i n g I n p u t T h r e s h o l d V o l t a g e - VPOWER ON RESET BEHAVIORvsFREE-AIR TEMPERATUREV I T V h y s - H y s t e r i s i s V o l t a g e - m VINTEGRATING ADC (Coulomb Counter)CHARACTERISTICSPLL SWITCHING CHARACTERISTICSOSCILLATORbq20z80bq20z80ASLUS782–JULY 2007V DD =3V to 3.6V,T A =–40°C to 85°C (unless otherwise noted)PARAMETERTEST CONDITIONS MIN TYP MAX UNIT V IT–Negative-going voltage input 2.1 2.3 2.5V V HYSPower-on reset hysteresis50150200mVV DD =3V to 3.6V,T A =–40°C to 85°C (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYPMAX UNIT V (SR)Input voltage range,V (SR2)and V (SR1)V (SR)=V(SR2)–V(SR1)–0.250.25V V (SROS)Input offset1μVINLIntegral nonlinearity error0.004%0.019%V DD =3V to 3.6V,T A =–40°C to 85°C (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYP MAXUNIT t (SP)Start-up time(1)0.5%frequency error25ms(1)The frequency error is measured from the trimmed frequency of the internal system clock which is 128oscillator frequency,nominally 4.194MHz.V DD =3V to 3.6V,T A =–40°C to 85°C (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYP MAX UNITROSC =100k Ω–2%0.25%2%f (exo)Frequency error from 32.768kHzROSC =100k Ω,V DD =3.3V –1%0.25%1%XCK1=12-pF XTAL–0.25%0.25%ROSC =100k Ω250μs f (sxo)Start-up time(1)XCK1=12-pF XTAL200ms(1)The start-up time is defined as the time it takes for the oscillator output frequency to be within 1%of the specified frequency.5Submit Documentation FeedbackDATA FLASH MEMORY CHARACTERISTICSREGISTER BACKUPbq20z80bq20z80ASLUS782–JULY 2007V DD =3V to 3.6V,T A =–40°C to 85°C (unless otherwise noted)PARAMETERTEST CONDITIONS MIN TYP MAX UNIT t DRData retentionSee (1)10Years Flash programming write-cyclesSee (1)20,000Cyclest (WORDPROG)Word programming time See (1)2ms I (DDPROG)Flash-write supply currentSee(1)815mA(1)Specified by design.Not production testedV DD =3V to 3.6V,T A =–40°C to 85°C (unless otherwise noted)PARAMETERTEST CONDITIONSMINTYP MAX UNIT I (RBI)RBI data-retention input current V (RBI)>3V,V DD <V IT10100nA V (RBI)RBI data-retention voltage (1)1.3V(1)Specified by design.Not production tested.6Submit Documentation FeedbackSMBus TIMINGSPECIFICATIONSbq20z80bq20z80ASLUS782–JULY 2007V DD =3V to 3.6V,T A =–40°C to 85°C (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYP MAX UNIT f SMB SMBus operating frequency Slave mode,SMBC 50%duty cycle 10100kHzf MAS SMBus master clock frequency Master mode,no clock low slave extend51.2t BUF Bus free time between start and stop 4.7t HD:STA Hold time after (repeated)start 4μst SU:STA Repeated start setup time 4.7t SU:STO Stop setup time 4Receive mode 0t HD:DAT Data hold time Transmit mode 300nst SU:DAT Data setup time 250t TIMEOUT Error signal/detect See(1)2535ms t LOW Clock low period 4.7μs t HIGH Clock high periodSee (2)450t LOW:SEXT Cumulative clock low slave extend time See (3)25ms t LOW:MEXT Cumulative clock low master extend time See(4)10t F Clock/data fall time (V ILMAX –0.15V)to (V IHMIN +0.15V)300ns t R Clock/data rise time0.9VDD to (VILMAX –0.15V)1000(1)The bq20z80times out when any clock low exceeds t TIMEOUT .(2)t HIGH:MAX .is minimum bus idle time.SMBC =1for t >50μs causes reset of any transaction involving the bq20z80that is in progress.(3)t LOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.(4)t LOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.SMBus TIMING DIAGRAM7Submit Documentation FeedbackFEATURE SETPrimary (1st Level)Safety FeaturesSecondary (2nd Level)Safety FeaturesCharge Control Featuresbq20z80bq20z80ASLUS782–JULY 2007NOTEThe bq20z80-V102is designed to work with the bq29312A AFE.The bq20z80features are only available with the bq29312A..The bq20z80supports a wide range of battery and system protection features that care easily configured.The primary safety features includes:•Battery cell over/undervoltage protection •Battery pack over/undervoltage protection •2independent charge overcurrent protection •3independent discharge overcurrent protection •Short circuit protection•Overtemperature protection •Host watchdogThe secondary safety features of the bq20z80can be used to indicate more serious faults via the SAFE (pin 7)and SAFE (pin 12)pins.These pins can be used to blow a in-line fuse to permanently disable the battery pack from charging or discharging.The secondary safety features includes:•Safety over voltage •Battery cell imbalance•2nd level protection IC input •Safety overcurrent•Safety overtemperature •Open thermistor•Charge FET and 0Volt Charge FET fault •Discharge FET fault•Fuse blow failure detection •AFE communication error •Internal flash data errorThe bq20z80charge control features includes:•Report the appropriate charging current needed for constant current charging and the appropriate charging voltage needed for constant voltage charging to a smart charger using SMBus broadcasts.•Determines the chemical state of charge of each battery cell using Impedance Track™and can reduce the charge difference of the battery cells in fully charged state of the battery pack gradually using cell balancing algorithm during charging.This prevents fully charged cells from overcharging causing excessive degradation and also increases the usable pack energy by preventing to early charge termination •supports pre-charging/zero-volt charging •support fast charging •supports pulse charging •detects charge termination•report charging faults and also indicate charge status via charge and discharge alarms.8Submit Documentation FeedbackGas GaugingLED DisplayLifeTime Data Logging FeaturesAuthenticationPower ModesCONFIGURATIONOscillator Functionbq20z80bq20z80ASLUS782–JULY2007 FEATURE SET(continued)The bq20z80uses the Impedance Track™Technology to measure and calculate the available charge in battery cells.The achievable accuracy is better than the coulomb counting method over the lifetime of the battery and there is no full charge discharge learning cycle required.See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note (SLUA364)for further details.The bq20z80can drive3-,4-,or5-segment LED display for remaining capacity indication.The bq20z80offers a lifetime data logging array,where all important measurements are stored for warranty and analysis purposes.The data monitored includes:•Lifetime maximum temperature•Lifetime minimum temperature•Lifetime maximum battery cell voltage•Lifetime minimum battery cell voltage•Lifetime maximum battery pack voltage•Lifetime minimum battery pack voltage•Lifetime maximum charge current•Lifetime maximum discharge current•Lifetime maximum charge power•Lifetime maximum discharge power•Lifetime maximum average discharge current•Lifetime maximum average discharge power•Lifetime average temperatureThe bq20z80supports authentication by the host using SHA-1.The bq20z80supports3different power modes to reduce power consumption:•In Normal Mode,the bq20z80performs measurements,calculations,protection decision,data update in1 second intervals.Between these intervals,the bq20z80is in a reduced power stage.•In Sleep Mode,the bq20z80performs measurements,calculations,protection decision,data update in adjustable time intervals.Between these intervals,the bq20z80is in a reduced power stage.•In Shutdown Mode the bq20z80is completely disabled.The oscillator of the bq20z80can be set up for internal or external operation.On power up,the bq20z80 automatically attempts to start the internal oscillator.If a100-kΩresistor is not connected to ROSC(pin33), then it attempts to start the oscillator using an external32.768-kHz crystal.NOTEInstall either the100-kΩROSC resistor or the12-pF,32.768-kHz crystal.Do notinstall both.9Submit Documentation FeedbackSystem Present OperationBATTERY PARAMETER MEASUREMENTSCharge and Discharge CountingVoltageCurrentAuto CalibrationTemperatureCOMMUNICATIONSSMBus On and Off Statebq20z80bq20z80ASLUS782–JULY 2007FEATURE SET (continued)The performance of the internal oscillator depends on the tolerance of the 100-k Ωresistor between RSOC (pin 33)and VSSA (pin 34).Choose a resistor with a tolerance of ±0.1%,and 50-ppm or better temperature drift.Place this resistor as close as possible to the bq20z80.If a 12-pF crystal is used,place it as close as possible to the XCK1(pin 34)and XCK2(pin 33)pins.If not properly implemented,the PCB layout in this area can degrade oscillator performance.The bq20z80pulls the PU pin high periodically (1s).Connect this pin to the PRES pin of the bq20z80via a resistor of approximately 5k Ω.The bq20z80measures the PRES input during the PU-active period to determine its state.If PRES input is pulled to ground by external system,the bq20z80detects this as system present.The bq20z80uses an integrating delta-sigma analog-to-digital converter (ADC)for current measurement,and a second delta-sigma ADC for individual cell and battery voltage,and temperature measurement.The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage drop across a small-value sense resistor between the SR1and SR2pins.The integrating ADC measures bipolar signals from -0.25V to 0.25V.The bq20z80detects charge activity when V SR =V (SR1)-V (SR2)is positive and discharge activity when V SR =V (SR1)-V (SR2)is negative.The bq20z80continuously integrates the signal over time,using an internal counter.The fundamental rate of the counter is 0.65nVh.The bq20z80updates the individual series cell voltages through the bq29312A at one second intervals.The bq20z80configures the bq29312A to connect the selected cell,cell offset,or bq29312A VREF to the CELL pin of the bq29312A,which is required to be connected to VIN of the bq20z80.The internal ADC of the bq20z80measures the voltage,scales and calibrates it appropriately.This data is also used to calculate the impedance of the cell for the Impedance Track™gas-gauging.The bq20z80uses the SR1and SR2inputs to measure and calculate the battery charge and discharge current using a 5m Ωto 20m Ω(typical)sense resistor.The bq20z80provides an auto-calibration feature to cancel the voltage offset error across SR1and SR2for maximum charge measurement accuracy.The bq20z80performs auto-calibration when the SMBus lines stay low continuously for a minimum of 5s.The bq20z80TS1and TS2inputs,in conjunction with two identical NTC thermistors (default are Semitec 103AT),measure the battery environmental temperature.The bq20z80can also be configured to use its internal temperature sensor.The bq20z80uses SMBus v1.1with Master Mode and package error checking (PEC)options per the SBS specification.The bq20z80detects an SMBus off state when SMBC and SMBD are logic-low greater than an adjustable period of time.Clearing this state requires either SMBC or SMBD to transition high.Within 1ms,the communication bus is available.10Submit Documentation Feedback分销商库存信息:TIBQ20Z80ADBT-V110BQ20Z80DBTG4BQ20Z80DBT BQ20Z80DBTR BQ20Z80DBTRG4。

CD4028B系列芯片数据表说明书

Data sheet acquired from Harris Semiconductor SCHS033C − Revised October 2003The CD4028B-Series types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes),and 16-lead thin shrink small-outline packages (PW and PWR suffixes).PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Addendum-Page 1Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF CD4028B, CD4028B-MIL :•Catalog: CD4028B•Military: CD4028B-MILNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4028BM96SOICD 162500330.016.4 6.510.3 2.18.016.0Q1CD4028BPWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4028BM96SOIC D162500333.2345.928.6CD4028BPWR TSSOP PW162000367.0367.035.0PACKAGE OUTLINETSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGENOTES:1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall notexceed 0.15 mm per side.4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.5. Reference JEDEC registration MO-153.EXAMPLE BOARD LAYOUTTSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGENOTES: (continued)6. Publication IPC-7351 may have alternate designs.7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.EXAMPLE STENCIL DESIGNTSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGENOTES: (continued)8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.9. Board assembly site may have different recommendations for stencil design.IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA(INCLUDING DATASHEETS),DESIGN RESOURCES(INCLUDING REFERENCE DESIGNS),APPLICATION OR OTHER DESIGN ADVICE,WEB TOOLS,SAFETY INFORMATION,AND OTHER RESOURCES“AS IS”AND WITH ALL FAULTS,AND DISCLAIMS ALL WARRANTIES,EXPRESS AND IMPLIED,INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products.You are solely responsible for(1)selecting the appropriate TI products for your application,(2)designing,validating and testing your application,and(3)ensuring your application meets applicable standards,and any other safety,security,or other requirements.These resources are subject to change without notice.TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource.Other reproduction and display of these resources is prohibited.No license is granted to any other TI intellectual property right or to any third party intellectual property right.TI disclaims responsibility for,and you will fully indemnify TI and its representatives against,any claims, damages,costs,losses,and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale(/legal/termsofsale.html)or other applicable terms available either on or provided in conjunction with such TI products.TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2018,Texas Instruments Incorporated。

莫萨 EDS-208A 系列 8 口编程无管理以太网交换机产品介绍说明书

EDS-208A Series8-port compact unmanaged Ethernet switchesFeatures and Benefits•10/100BaseT(X)(RJ45connector),100BaseFX(multi/single-mode,SC or STconnector)•Redundant dual12/24/48VDC power inputs•IP30aluminum housing•Rugged hardware design well suited for hazardous locations(Class1Div.2/ATEX Zone2),transportation(NEMA TS2/EN50121-4),and maritimeenvironments(DNV/LR/ABS/NK)•-40to75°C wide operating temperature range(-T models)CertificationsIntroductionThe EDS-208A Series8-port industrial Ethernet switches support IEEE802.3and IEEE802.3u/x with10/100M full/half-duplex,MDI/MDI-X auto-sensing.The EDS-208A Series has12/24/48VDC(9.6to60VDC)redundant power inputs that can be connected simultaneously to live DC power sources.These switches have been designed for harsh industrial environments,such as in maritime(DNV/LR/ABS/NK),rail wayside,highway,or mobile applications(EN50121-4/NEMA TS2/e-Mark),or hazardous locations(Class I Div.2,ATEX Zone2)that comply with FCC,UL,and CE standards.The EDS-208A switches are available with a standard operating temperature range from-10to60°C,or with a wide operating temperature range from-40to75°C.All models are subjected to a100%burn-in test to ensure that they fulfill the special needs of industrial automation control applications.In addition,the EDS-208A switches have DIP switches for enabling or disabling broadcast storm protection,providing another level of flexibility for industrial applications.SpecificationsEthernet Interface10/100BaseT(X)Ports(RJ45connector)EDS-208A/208A-T Models:8EDS-208A-M-SC/M-ST/S-SC Models:7EDS-208A-MM-SC/MM-ST/SS-SC Models:6All Models Support:Auto negotiation speedFull/Half duplex modeAuto MDI/MDI-X connection100BaseFX Ports(multi-mode SC connector)EDS-208A-M-SC Models:1EDS-208A-MM-SC Models:2100BaseFX Ports(multi-mode ST connector)EDS-208A-M-ST Models:1EDS-208A-MM-ST Models:2100BaseFX Ports(single-mode SC connector)EDS-208A-S-SC Models:1EDS-208A-SS-SC Models:2Standards IEEE802.3for10BaseTIEEE802.3u for100BaseT(X)and100BaseFXIEEE802.3x for flow controlOptical Fiber800Typical Distance4km5km40kmWavelengthTypical(nm)13001310TX Range(nm)1260to13601280to1340 RX Range(nm)1100to16001100to1600Optical PowerTX Range(dBm)-10to-200to-5 RX Range(dBm)-3to-32-3to-34 Link Budget(dB)1229 Dispersion Penalty(dB)31Note:When connecting a single-mode fiber transceiver,we recommend using anattenuator to prevent damage caused by excessive optical power.Note:Compute the“typical distance”of a specific fiber transceiver as follows:Linkbudget(dB)>dispersion penalty(dB)+total link loss(dB).Switch PropertiesMAC Table Size2KPacket Buffer Size768kbitsProcessing Type Store and ForwardPower ParametersConnection1removable4-contact terminal block(s)Input Current EDS-208A/208A-T,EDS-208A-M-SC/M-ST/S-SC Models:0.11A@24VDCEDS-208A-MM-SC/MM-ST/SS-SC Models:0.15A@24VDCInput Voltage12/24/48VDCRedundant dual inputsOperating Voltage9.6to60VDCOverload Current Protection SupportedReverse Polarity Protection SupportedDIP Switch ConfigurationEthernet Interface Broadcast storm protectionPhysical CharacteristicsHousing AluminumIP Rating IP30Dimensions50x114x70mm(1.96x4.49x2.76in)Weight275g(0.61lb)Installation DIN-rail mountingWall mounting(with optional kit) Environmental LimitsOperating Temperature Standard Models:-10to60°C(14to140°F)Wide Temp.Models:-40to75°C(-40to167°F) Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN55032/24EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:10V/mIEC61000-4-4EFT:Power:2kV;Signal:1kVIEC61000-4-5Surge:Power:2kV;Signal:2kVIEC61000-4-6CS:10VIEC61000-4-8PFMFHazardous Locations ATEXClass I Division2Maritime ABSLRNKDNVRailway EN50121-4Safety UL508Shock IEC60068-2-27Traffic Control NEMA TS2Vibration IEC60068-2-6Freefall IEC60068-2-31MTBFTime2,701,531hrsStandards Telcordia(Bellcore),GBWarrantyWarranty Period5yearsDetails See /warrantyPackage ContentsDevice1x EDS-208A Series switchDocumentation1x quick installation guide1x warranty cardDimensionsOrdering InformationModel Name 10/100BaseT(X)PortsRJ45Connector100BaseFX PortsMulti-Mode,SCConnector100BaseFX PortsMulti-Mode,STConnector100BaseFX PortsSingle-Mode,SCConnectorOperating Temp.EDS-208A8–––-10to60°C EDS-208A-T8–––-40to75°C EDS-208A-M-SC71––-10to60°C EDS-208A-M-SC-T71––-40to75°C EDS-208A-M-ST7–1–-10to60°C EDS-208A-M-ST-T7–1–-40to75°C EDS-208A-MM-SC62––-10to60°C EDS-208A-MM-SC-T62––-40to75°C EDS-208A-MM-ST6–2–-10to60°C EDS-208A-MM-ST-T6–2–-40to75°C EDS-208A-S-SC7––1-10to60°C EDS-208A-S-SC-T7––1-40to75°C EDS-208A-SS-SC6––2-10to60°C EDS-208A-SS-SC-T6––2-40to75°C Accessories(sold separately)Power SuppliesDR-120-24120W/2.5A DIN-rail24VDC power supply with universal88to132VAC or176to264VAC input byswitch,or248to370VDC input,-10to60°C operating temperatureDR-452445W/2A DIN-rail24VDC power supply with universal85to264VAC or120to370VDC input,-10to50°C operating temperatureDR-75-2475W/3.2A DIN-rail24VDC power supply with universal85to264VAC or120to370VDC input,-10to60°C operating temperatureMDR-40-24DIN-rail24VDC power supply with40W/1.7A,85to264VAC,or120to370VDC input,-20to70°Coperating temperatureMDR-60-24DIN-rail24VDC power supply with60W/2.5A,85to264VAC,or120to370VDC input,-20to70°Coperating temperatureWall-Mounting KitsWK-46-01Wall-mounting kit,2plates,8screws,46x66.8x2mmRack-Mounting KitsRK-4U19-inch rack-mounting kit©Moxa Inc.All rights reserved.Updated Sep19,2023.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

PD80F01x系列_中文资料_数据手册

FSYS=8MHz: 2.0V - X
Rev1.20
第1页
2020-7-27
Pdmicro Technology Ltd
PD80F01X
目录
特性..................................................................................................................................................................................1
2.1. 地址映射................................................................................................................................................................. 9 2.1.1. SFR，BANK0................................................................................................................................................. 9 2.1.2. SFR，BANK1............................................................................................................................................... 10 2.1.3. TMR0，地址 0x01........

TDK-Lambda ZBM20 规格书说明书

TDK-LambdaZBM20SPECIFICATIONSPA642-01-01AMODELITEMS1Nominal Buffer Voltage (Fixed Mode)V 2Buffer Current A 3Buffer Power( * 1 )W 4Nominal Input Voltage V 5Input Voltage Range (Fixed Mode)(VIN-1)6Input Current (Typ.)7Charging Time (Typ.)s 8Buffer Voltage Accuracy ( * 1 )(Fixed Mode)%( * 9 )(VIN-1)%9Maximum Ripple & Noise ( * 1, 3 )mV 10Input Over Voltage Protection ( * 2 )-11Over Current Protection ( * 4 )-12Buffer time (Typ)( * 1, 5 )ms 13Monitoring Signals( * 6 )-14Bulk Capacitor Voltage Monitoring ( * 10 )-15Parallel Operation -16Series Operation-17Operating Temperature ( * 7 )°C18Operating Humidity -19Storage Temperature °C 20Storage Humidity -21Operating Altitude m 22Cooling-23Withstand Voltage -24Isolation Resistance -Vibration-26Shock (In package)m/s 2 28EMI( * 8 )-29Immunity -30Weight (Typ.)g 31Warranty-32Dimension (L x H x W)mm* Read instruction manual carefully , before using the buffer module unit.= NOTES=* 1 :At Ta=25 oC, nominal buffer voltage and average buffer power.* 2 :Input voltage is 35Vmax for ZBM20-24, 22Vmax for ZBM20-15 & 19Vmax for ZBM20-12.* 3 :Ripple & noise are measured at 20MHz by using a 150mm twisted pair of load wires terminated with a 0.1uF film capacitor and a 100uF electrolytic capacitor.* 4 : When the buffer current exceeds 105% of the maximum DC buffer current specification, OCP operation will be activated. Automatic recovery.* 5 : Refer to (PA642-01-03_ & 01-04_) for buffer time versus buffer current.* 6 : Please refer to instruction manual for more details.* 7 : Refer to Derating Curve (PA642-01-02_) for details of buffer current versus ambient temperature.* 8 : EMI (CE) compliance to be confirmed at system level. Product is considered as a peripheral accessory to power supply.* 9 : Buffer current, Iout > 5%.* 10 : LED is off when bulk capacitor is less than SELV level.* 11 : All parameters NOT specifically mentioned are measured at rated load & nominal input at ready mode, and during buffering at fixed mode.All measurement are conducted at Ta=25 o C.27-Safety V 24 - 30--25At no operating, 10 - 55Hz (sweep for 1min)19.6m/s 2 Constant, X, Y, Z 1hour each.Convection Cooling5000Input/output & signal ports - FG : 500VAC (100mA) 1 MINUTEInput/output & signal ports - FG : ... More Than 100MΩ (500VDC) AT Ta=25°C & 70%RH> 105% of rated Buffer CurrentA5-Year175 x 57 x 85 (Refer to Outline Drawing)Yes0.8 at Charging Mode 0.2 at Ready ModeNo 30 ~ 90%RH (No Dewdrop)-25 ~ + 8510 ~ 90%RH (No Dewdrop)-25 ~ + 70Yes b) Ready, Buffer & Inhibit Signals (Common Supply Voltage)Green LEDApproved by :380a) DC OK Signal (Photo Relay Rated : 30V, 0.2A)< 160< 2404011.5 - 14.414.4 - 1823 - 30--+3/-420220276448121524± 21113.822.4ZBM20-12ZBM20-15ZBM20-24IEC62368-1 (EN62368-1 : CB and Certificate),UL62368-1, CSA C22.2 No. 62368-1Less than 196.1Design to meet EN55032-B, CISPR32-BDesign to meet IEC61000-4-2 (Level 4), -3 (Level 3), -4 (Level 3), -5 (Level 2), -6 (Level 3)550TDK-Lambda ( E )( F )ZBM20PA642-01-03ABUFFER TIME VERSUS BUFFER CURRENT*Note : Ta=25⁰C and initial capacitance.ZBM20-24FIXED Mode and Nominal Buffer Voltage a) Buffer time : 0 - 2 secb) Buffer time for small buffer current : 2 - 18 sec VIN-1 and Maximum Buffer Voltage a) Buffer time : 0 - 2 secb) Buffer time for small buffer current : 2 - 18 sec 02.557.51012.51517.5200.00.20.40.60.81.01.21.41.61.82.0B u f f e rC u r r e n t (A )Buffer Time (sec)0.00.51.01.52.024681012141618B u f f e rC u r r e n t (A )Buffer Time (sec)02.557.51012.51517.5200.00.20.40.60.81.01.21.41.61.82.0B u f f e rC u r r e n t (A )Buffer Time (sec)0.00.51.01.52.024681012141618B u f f e rC u r r e n t (A )Buffer Time (sec)typical minimumtypical minimumtypical minimumtypical minimumZBM20PA642-01-04ABUFFER TIME VERSUS BUFFER CURRENT*Note : Ta=25⁰C and initial capacitance.ZBM20-12FIXED Mode and Nominal Buffer Voltage a) Buffer time : 0 - 2 secb) Buffer time for small buffer current : 2 - 18 sec ZBM20-15FIXED Mode and Nominal Buffer Voltage a) Buffer time : 0 - 2 secb) Buffer time for small buffer current : 2 - 18 sec 02.557.51012.51517.5200.00.20.40.60.81.01.21.41.61.82.0B u f f e rC u r r e n t (A )Buffer Time (sec)0.00.51.01.52.024681012141618B u f f e rC u r r e n t (A )Buffer Time (sec)02.557.51012.51517.5200.00.20.40.60.81.01.21.41.61.82.0B u f f e rC u r r e n t (A )Buffer Time (sec)0.00.51.01.52.024681012141618B u f f e rC u r r e n t (A )Buffer Time (sec)typical minimumtypical minimumtypical minimumtypical minimum。

D20_D200 fact sheet

GEDigital EnergyThe Business CaseThe pressure has never been greater for electric utilities to reduce costs and maximize the use of existing assets.Utilities must also focus on improving substation electrical system performance,reliability,and security while ensuring the safe operation of their electrical system.The D20substation controller from GE Energy offers an industry-leading substation controller design embedded with high value substation automation applications that provide cost savings, increased reliability,and improved operational efficiencies in your substations.A large protocol library facilitates communication to most existing substation devices for improved visibility and remote control.Product OverviewThe D20controller is the heart of GE’s substation automation architecture,providing data server functionality in a substation-hardened package.The D20device acts as the gateway to SCADA master stations for IEDs in the station,or for downstream substations or feeders.The distributed,expandable I/O architecture and mission-critical automation control applications reinforce why the D20controller is being used in over30,000installations around the world.Automation ApplicationsA full library of automation applications is available to increase system reliability and munication with Third Party DevicesA key differentiator of the D20controller is its ability to talk to many different devices from many different manufacturers.We understand that you sometimes need a specialized device,or already have existing equipment installed that you need to communicate with.The D20communication protocol library is second to none.The D20controller's large library of protocols facilitates commu-nication with various existing substation IEDs and SCADA hosts.A built-in terminal server emulator allows pass-through connec-tions to be initiated to any substation IED(relay,meter,RTU or other device).Once the connection is established,the local event records can be uploaded from the substation devices and viewed remotely.D20Substation Automation Controller fact sheet•Generation and transmission automation•Distribution automation•Communication services•Data logging/storage •Data reduction,summarization•Data format conversion•User programmable softlogic(IEC®61131-3and others)•DNP3.0•IEC60870-5-101/103/104•IEC61850(Server)•Modbus•8979•Over100otherprotocols availableRedundancy OptionsMany redundancy options are available for the D20main chassis,I/O,and communication paths.Customer Benefits•Leverage existing equipment investments using an industry leading data concentrator/protocol converter•Increase system reliability and efficiency with the D20 substation automation applications library•Defer capital expenditures with an expandable architecture •Reduce operational costs with a flexible design•Reduce your risk with a field-proven leaderTypical ApplicationsData concentratorProtocol converterLocal automation platformSubstation RTU retrofitsHardware OverviewThe core of the D20architecture is the main chassis,and distributed I/O modules.The available options allow you to tailor each D20controller to your specific needs,or build a fleet. Either way,you use the same tools and spares across your fleet.D20Main ChassisThe main chassis contains the central CPU(s)and communication ports and provides the data concentration,protocol conversion, and customizable local automation functionality.Available D20main chassis include:•D20main chassis–Single or2CPU options available•D200main chassis–Up to7CPUsD20I/O OptionsA complete family of substation hardened I/O modules makes the D20controller scalable to both large and small substations.A distributed architecture with both ring and star topologies allows for easy expandability and remote placement of I/O modules.The following I/O modules are available in a variety of models with I/O ranges up to300VDC.•D20S–64channel status input module•D20A–32channel DC Analog input module•D20K–32channel control output module•D20KI–8external interposer relay pairs module•D20C–16status input,8control output,optional16DC analog inputs or8analog inputs and8analog outputs•D20AC–15channel direct AC input,1DC analog input moduleCompliance to IEEE and IEC standards ensures reliable field visibility when other equipment may fail.For more information please visit us on-line atIEC®is a registered trademark by Commission Electrotechnique InternationaleModbus®is a registered trademark by Gould,Inc.*are trademarks of General Electric Company.©2010,General Electric Company.All rights reserved.The contents of this document are the property of General Electric Company.No part of this work may be reproduced or transmitted in any form or by any means,except as permitted in written license agreement with General Electric Company.General Electric Company has made every reasonable attempt to ensure the completeness and accuracy of this document.However,the information contained in this document is subject to change without notice,and does not represent a commitment on the part of General Electric Company.The GE logo is a registered trademark of General Electric Company.GEA-14466A(07/10)fact sheet。

Cree-XB-D Datasheet

.C R e e .C o m /X L A m pCLD-DS45 Rev 10DCree ® XLamp ® XB-D LEDsPRODUCT DESCRIPTIONThe XLamp ® XB-D LeD brings next-generation performance, price and size to all LeD lighting applications. The XB-D’s footprint enables smaller designs with densely packed arrays for better light mixing and concentration.The XB-D shares common footprint and uniform package design across all white and color configurations, simplifying board and optical designs for many LeD systems. The XB-D is optimized to dramatically lower system cost in any illumination application, from indoor and outdoor lighting to architectural and transportation lighting.FEATURES• Cree’s smallest lighting class LeD:2.45 X 2.45 mm• XB-D white binned @ 85 °C; XB-D color binned @ 25 °C • Up to 136 lm/W in cool white (@ 85 °C, 350 mA)• Available in white, 80-minimum CRI white, and 70-minimum CRI cool white, royal blue, blue, green, amber, red-orange & red• 1 A maximum drive current • Wide viewing angle: from 115° (white) to 140° (red)• Reflow solderable - JEDEC J-STD-020C compatible • Unlimited floor life at ≤ 30 °C/85% RH• electrically neutral thermal path • RoHS- and REACh-compliant • UL ® recognized component (E349212)TABLE OF CONTENTSCharacteristics .......................................2Flux Characteristics ...............................3Relative Spectral Power Distribution....6Relative Flux vs. JunctionTemperature ...........................................7electrical Characteristics .......................8Relative Flux vs. Current ........................9Relative Chromaticity vs. Current ........10Relative Chromaticity vs.Temperature .........................................11Typical Spatial Distribution ..................11Thermal Design ....................................12Reflow Soldering Characteristics ........13Notes ....................................................14Mechanical Dimensions ......................16Tape and Reel .......................................18Packaging (19)ChARACTERISTICS= 85 °C)FLUX ChARACTERISTICS - WhITE (TJThe following table provides several base order codes for XLamp XB-D LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XB-D LeD Binning and Labeling document.Notes:• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. See the Measurements section (page 14).• Typical CRI for Neutral White, 3700 K - 5000K CCT is 75.• Typical CRI for Warm White, 2600 K - 3700 K CCT is 80.• Minimum CRI for 70 CRI Minimum Cool White is 70.• Minimum CRI for 80 CRI Minimum White is 80.* Flux values @ 25 °C are calculated and are for reference only.** Calculated flux values at 700 mA and 1000 mA are for 85 °C and are for reference only.FLUX ChARACTERISTICS - COLOR (T= 25 °C)JThe following tables provide several base order codes for XLamp XB-D LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XB-D LeD Binning and Labeling document.Note: Cree maintains a tolerance of ±7% on flux and power measurements and ±1 nm on dominant wavelength measurements.See the Measurements section (page 14).FLUX ChARACTERISTICS - COLOR (T J = 25 °C) - ContinuedRELATIvE SPECTRAL POWER DISTRIBUTIONRELATIvE FLUX vS. JUNCTION TEMPERATURE (I= 350 m A)FELECTRICAL ChARACTERISTICS (TJ= 85 °C)ELECTRICAL ChARACTERISTICS (TJ = 25 °C)RELATIvE FLUX vS. CURRENT (TJ= 85 °C)RELATIvE FLUX vS. CURRENT (TJ = 25 °C)= 25 °C) - Continued RELATIvE FLUX vS. CURRENT (TJ ArrayReLAtive ChRomAtiCity vs. CuRRent (WARm White)ReLAtive ChRomAtiCity vs. tempeRAtuRe (WARm White)TyPICAL SPATIAL DISTRIBUTIONThERMAL DESIGNThe maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.REFLOW SOLDERING ChARACTERISTICSIn testing, Cree has found XLamp XB-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.Note: All temperatures refer to topside of the package, measured on the package body surface.IPC/JEDEC J-STD-020CTT T e m p e r a t u r eNOTESMeasurementsThe luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are provided for informational purposes only and are not intended as specifications.pre-Release Qualification testingPlease read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.Lumen MaintenanceCree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LeD junction temperature.Moisture SensitivityCree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.Once the MBP is opened, XLamp XB-D LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP.RohS ComplianceThe levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of .REACh ComplianceREACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request.NOTES - CONTINUEDUL® Recognized ComponentLevel 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/ UL 8750.vision AdvisoryWARNING: Do not look at exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the LeD eye Safety application note.MEChANICAL DIMENSIONSThermal vias, if present, are not shown on these drawings.All measurements are ±.13 mm unless otherwise indicated.2.452.45R Top view Side view1.840.760.65R1.090.Bottom view Alternate Bottom view 2.286 2.29 REF2.29 REF 2.29 REF2.29 REFEF Anode Alternate Bottom viewMEChANICAL DIMENSIONS - CONTINUED0.850.392.292.290.850.250.850.17Recommended PCB Solder PadRecommended Stencil Pattern (hatched Area is opening)2.290.330.362.290.92TAPE AND REELAll Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.except as noted, all dimensions in mm2402-00020Carrier Tape, 2525 HEW1. 10 sprocket hole pitch cumulative tolerance ±0.2mmLoaded Pockets (1,000 Lamps)Leader400mm (min) of empty pockets with at least 100mm sealed by tape(50 empty pockets min.)Trailer160mm (min) of empty pockets sealed with tape (20 pockets min.)STARTENDCover TapePocket TapeUser Feed DirectionUser Feed DirectionPACkAGINGPatent Label(on bottom of box)Label with Cree Order Code, Label with Cree Order Code,Quantity, Reel ID, PO #Label with Cree Bin Code,Quantity, Reel IDPackaged ReelLabel withPatent LabelLabel with Customer Order。

RDC80系列旋转潜变电阻器说明书

Rotary PotentiometersSlide Potentiometers Metal Shaft Insulated Shaft Knob Operating Through Shaft Type Ring TypeThrough Shaft Type / Soldering ConditionsThrough Shaft Type / Product SpecificationsReference for Manual SolderingExample of Reflow Soldering ConditionSeries Tip temperature Soldering timeRDC80350±5℃ 3 s+11. Cleaning should not be attempted.2. Type of solder to be used Use cream solder that contains 10 to 15 %wt flux.3. Number of solder applications - apply solder only once4. Recommended reflow conditionsSeries A B C D E F G H I No. ofreflows RDC80250℃ー180℃150℃90±30sー10±1sーー 1 time1. When using an infrared reflow oven, solder may not always be applied as intended.Be sure to use a hot air reflow oven or a type that uses infrared rays in combination with hot air.2. The temperatures given above are the maximum temperatures at the terminals of the products when employing a hotair reflow method. The temperature of the PC board and the surface temperature of the products may vary greatly depending on the PC board material, its size and thickness. Ensure that the surface temperature of the products does not rise to 250℃or greater.3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this priorto use.NotesMethod for Regulating the LinearityModel RDC804T output2T output±3%±3%±165˚±165˚180˚ phase differenceOutputvoltageratio%2. The center is in the configuration diagram condition1. Reference taper : 100%/340˚100500˚centerI max.H max.300200100RoomtemperaturePre-heatingE max.Time sTemperature℃ABCDF max.G max.。

PANDO 家用电器产品说明书

Modelo E-237PANDOOPTIMIZA SUS PROCESOS GRACIAS A SU APUESTA POR LAFABRICACIÓN INTELIGENTE CON SOLIDWORKSSituada en Argentona (Barcelona) con casi 40 años de experiencia, INOXPAN es reconocida en el mercado bajo la marca PANDO por su extensa experiencia en el diseño, fabricación y comercialización de campanas extractoras de cocina , hornos, placas de gas e inducción y vinotecas, para uso doméstico.niciaron su andadura en España en el año 1979, siempre como artesanos especialistas en la transformación del acero inoxidable. Al poco tiempo, se implantaron en mercados exteriores, como Francia y Portugal, donde su presencia está consolidada desde hace ya muchos años como el referente en productos de marca premium del sector y también en otros países de Europa como I nglaterra, Alemania, Bélgica y Holanda. Recientemente han conseguido posicionarse en el mercado latinoamericano y ahora se encuentran en la conquista de Estados Unidos.INNOVACIÓN CONSTANTEEl trabajo continuo, con fabricación propia y con un amplio departamento de I+D+i, llevaron a PANDO a convertirse en líder absoluto en el mercado español en el canal “Tienda estudio de cocina”; siendo éste su cliente principal, junto con arquitectos, decoradores-interioristas y diseñadores, que ven en PANDO como el único fabricante capaz de dar solución a todas sus necesidades.Una marca con un fuerte compromiso con sus orígenes y con la necesidad de aumentar el prestigio que ha conseguido gracias al trabajo de todo el equipo que la impulsa.Se esfuerzan cada día para ser mejores y para que sus campanas de cocina sean las más eficientes a nivel de extracción, ruido, tratamiento de los humos y consumo energético. Integran los mejores motores ECO del mercado y los sistemas de iluminación LED en prácticamente la totalidad de las campanas que fabrican para seguir siendo líderes en calidad frente a las empresas de su competencia en el sector. “Nuestro amplio portfolio y la posibilidad de ofrecer soluciones a medida a nuestros clientes, sumado a la calidad de todos los componentes, son nuestros principales puntos fuertes y han hecho que nos convirtamos en el N.º 1 en proveedores de campanas extractoras” comenta Sergio Seña, Director de compras de PANDO.SOLIDWORKS COMO SOLUCIÓN DEFINITIVAEn su búsqueda permanente de eficiencia e i nnovación, PANDO necesitó reestructurar sus procesos y ser competitivo en el sector, por ello en 2008 decidió incorporar las soluciones de diseño de SOLI DWORKS. Tras unos años trabajando en un entorno 3D más productivo, resolvieron en 2015 ampliar su eficacia e i mplantaron S OL DWORKS P DM P rofessional y SOL I DWORKS Composer con el objetivo de agilizar el desarrollo de sus productos, enriquecer la comunicación con sus proveedores, quienes disponían de la tecnología SOLIDWORKS para sus desarrollos, y mejorar la presentación de sus productos previos a la fabricación.Durante este proceso, CIMWORKS cómo su distribuidor oficial, apoyó la evaluación de las soluciones y brindó la formación y asesoramiento necesario, que hicieron determinante la toma de decisión y llevar a cabo la ampliación de la tecnología SOLI DWORKS en PANDO. Además, tras la implantación de las herramientas, contaron con una formación especializada que ha permitido una mejora constante de los procesos productivos dentro de la organización.LA IMPORTANCIA DEL CONTROL DE DATOSCon SOLI DWORKS PDM Professional, han logrado tener un mayor control de la información de los proyectos, permitiendo reutilizar los diseños gestionar todo el proceso de desarrollo de sus productos en un menor tiempo, optimizando los flujos de trabajo y mejorando notablemente la gestión de la documentación técnica. Ahora en PANDO el control de la información de cada documento agiliza la creación de nuevos proyectos, permitiendo la estandarización de productos de serie nuevos. También han conseguido ahorrar tiempo, ya queReto:Desarrollar productos de forma ágil y condatos precisos, gestionar y controlar los datosde los proyectos y mejorar su presencia en la presentación de productosSolución:Implantar el software de diseño SOLIDWORKS, de gestión de datos de producto SOLIDWORKS PDM Professional y de desarrollo de documentación gráfica SOLIDWORKS Composer.Beneficios:•Se ganó control en los datos, mejorando la optimización de los recursos y aumentando la agilidad para realizar cambios y personalizar productos.•Se agilizó la búsqueda de datos y archivos relacionados con otros proyectos•Se agilizó en un 30% la producción de documentación técnica, reduciendo el tiempo de salida al mercado de sus productos•Se mejoró estéticamente la presentación desus productos ganando presencia frente a susclientes potenciales“D esd e qu e h e mose ntrado e n e l mundoSOLIDWORKS si e mpr eque re mos ir ampliandolas herramientas de la suite. El mercadote re quie re cada ve z más datos, máspre se ncia y con e stas solucione s lohe mos conse guido.”antes la gestión de las referencias y de todas las versiones se realizaba de forma manual.El fácil acceso a archivos ordenados les proporciona una idea fiable y sólida para trabajar en cualquier proyecto. La trazabilidad de los datos y la adecuada estructura de éstos, les han ayudado a reducir al mínimo el número de errores y a agilizar el proceso de fabricación de sus productos. Así mismo, la comunicación fluye entre departamentos y se potencia la visibilidad de los datos, lo que repercute directamente en el aumento de agilidad para responder a las demandas de los clientes.DOCUMENTACIÓN TÉCNICA DE CALIDADLa creación de la documentación solía ser un paso por separado que tenía lugar después del diseño de productos, provocando retrasos y trabajo extra, mientras que ahora gracias a SOL DWORKS Composer, es un proceso que se realiza simultáneamente, lo que ha permitido que PANDO reduzca hasta en un 30% el tiempo de salida al mercado de sus productos y ha mejorado la estética de sus documentos técnicos, consiguiendo la presencia que requerían.“Ahora tenemos la documentación más rápido y bien organizada, pudiendo implicar no solo a la oficina técnica sino a otros departamentos. Hoy en día presentar a un cliente un plano en 2D se considera obsoleto”remarca Sergio Señ seguridad que proporcionan las herramientas de SOL I DWORKS ha hecho que se agilicen los procesos permitiendo a PANDO tener la oportunidad de innovar en sus productos y desarrollar nuevas líneas de negocio con el propósito de alcanzar sus objetivos de mercado. Actualmente, utilizan las herramientas SOLIDWORKS un total de 5 personas: 2 en el área de diseño, 1 persona para la gestión de datos en el área de calidad, el responsable técnico y el director de producción.El siguiente paso es potenciar la oficina técnica, tanto para desarrollo de producto nuevo, como producto especial, utilizando el potencial de SOL DWORKS para el desarrollo de los proyectos. También impulsar en más departamentos, el uso de la documentación gráfica como vídeos o manuales interactivos, utilizando los diseños 3D para la presentación de producto y además tener la posibilidad de validar los diseños y poder disponer de los datos de simulación del comportamiento de las campanas a nivel de fluodinámica, aspiración, etc.La documentación técnica de calidad generada con SOLIDWORKS Composer ha cobrado un importante papel en el posicionamiento de PANDO como líder indiscutible del sectorCampanas extractoras de cocina , hornos, placas de 50Argentona (Bancelona) - España www.pando.es CIMWORKSLa plataforma 3DEXPERIENCE impulsa nue stras aplicacione s y ofre ce un e xte nso portfolio de experiencias que dan solución a 12 industrias diferentes.Dassault Systèmes, la compañía de 3DEXPERIENCE®, suministra a empresas y usuarios universos virtuales en los que pueden dar rienda suelta a su imaginación para crear diseños innovadores y sostenibles. Sus soluciones, líderes mundiales, transforman las fases de diseño, producción y asistencia de todo tipo de productos. Las soluciones de colaboración de Dassault Systèmes fomentan la innovación social, lo que amplía las posibilidades de que el mundo virtual mejore el mundo real. El grupo aporta un gran valor a más de 220 000 clientes de todos los tamaños y sectores en más de 140 países. Si desea obtener más información, visite /es.Europe/Middle East/Africa Dassault Systèmes10, rue Marcel Dassault CS 4050178946 Vélizy-Villacoublay Cedex France AmericasDassault Systèmes 175 Wyman StreetWaltham, Massachusetts 02451-1223USA Asia-PacificDassault Systèmes K.K.ThinkPark Tower2-1-1 Osaki, Shinagawa-ku,Tokyo 141-6020Japan。

雷度ABL80血气分析仪参数

无偏离
无
测试原理：微型电化学技术（厚膜技术），测试卡与试剂包分离；单一电极盒完成多项参数的检测；
测试原理：微型电化学技术（厚膜技术），测试卡与试剂包分离；单一电极盒完成多项参数的检测；
无偏离
无
测试卡类型：多人份测试的电极卡（25/50/100/200/300/600人份），可根据需要自由选择不同参数和类型的测试卡；
无偏离
无
定标类型:自动2点液体定标，可自行设定定标时间间隔和频率；
定标类型:自动2点液体定标，可自行设定定标时间间隔和频率；
无偏离
无
进样方式: 自动封闭式吸入进样，减轻操作人员负担与人为操作因素对结果影响；
进样方式: 自动封闭式吸入进样，减轻操作人员负担与人为操作因素对结果影响；
无偏离
无
样本量: ≤70ul；
样本量: 70ul；
无偏离
节省成本
样本方式：注射器、毛细管、试管、安瓿瓶；
样本方式：注射器、毛细管、试管、安瓿瓶；
无偏离
无
样本种类：全血、血清、血浆、透析液、胸腹水
样本种类：全血、血清、血浆、透析液、胸腹水
无偏离
无
检测速度: 测试时间≤70秒；循环时间≤120秒；
检测速度: 测试时间70秒；循环时间120秒；
测试卡类型：多人份测试的电极卡（25/50/100/200/300/600人份），可根据需要自由选择不同参数和类型的测试卡；
无偏离
无
质控能提供2种质控方式选择：内置自动质控系统，将定标、质控和系统检查合三为一；传统液体质控，能提供4个水平的原厂质控品；
质控能提供2种质控方式选择：内置自动质控系统，将定标、质控和系统检查合三为一；传统液体质控，能提供4个水平的原厂质控品；

德Neverbon LED灯库Xi LP 75W 0.3-1.0A directional lamp

Unit oC %
Condition Non-condensing
Unit hours
Condition Tcase ≤ Tcase-life Maximum failures = 10%
Remark See Design-in guide
Vlow: < 160Vac Vhigh: 170 ... 264Vac CLO LITE Basic options Dynadimmer LITE
CISPR15: between driver and LED module
Insulation
Insulation Mains EQUI LED LineSwitch
Mains N/A Double Double None
EQUI Double N/A Basic Double
Dimensions and weight
Per IEC60598
4/7
Inrush current
Specification item Inrush current Ipeak Inrush current Twidth Typical number of drivers
Value 46 250 Max. 11
Driver touch current
Condition See graph Peak voltage at open load
Ripple = peak / average, 70Hz … 1kHz Ripple = peak / average, > 1kHz
Condition Output current amplitude dimming
Default setting 700mA

福建力得温控仪LDB系列说明书

目录1．技术指标.................. 错误!未指定书签。

1.1 基本技术参数........ 错误!未指定书签。

1.2 标准............... 错误!未指定书签。

2．功能与型号分类............ 错误!未指定书签。

3．显示..................... 错误!未指定书签。

4．传感电缆总成.............. 错误!未指定书签。

4.1 D25传感电缆（三线制）错误!未指定书签。

4.2 传感器............... 错误!未指定书签。

5．操作与显示................ 错误!未指定书签。

5.1 温控器工作状态显示... 错误!未指定书签。

5.2 按键功能............. 错误!未指定书签。

6. 功能模块.................. 错误!未指定书签。

6.1 功能密码............. 错误!未指定书签。

6.2 操作流程............. 错误!未指定书签。

7．4~20mA电流输出型（E型）... 错误!未指定书签。

7.1 功能特点............. 错误!未指定书签。

7.2 电流输出的技术要求... 错误!未指定书签。

8．RS485/232通讯型（F型）.... 错误!未指定书签。

9．现场故障处理小常识........ 错误!未指定书签。

10．配件与订货............... 错误!未指定书签。

11．服务................... 错误!未指定书签。

1．技术指标1.1 基本技术参数环境温度：-10~+55℃环境湿度：< 90％工作电压：220VAC （+10％，-15%）工作频率：50Hz或60Hz（±2Hz）测量范围：0.0～200.0℃或 -30.0～240.0℃测量精度：±1%FS（温控器0.5级,传感器0.5级）分辨力：0.1℃风机输出总容量：6A/250VAC控制输出容量：5A/250VAC；5A/30VDC (阻性)温控器功耗：≤8W1.2 标准生产标准： JB/T7631-2005《变压器用电子温控器》通过的认证标准：ISO9001：2000国际质量管理体系认证通过的试验标准：IEC61000-4：1995 国际标准GB/T17626-1998《电磁兼容试验和测量技术》标准2．功能与型号分类注：具体选型请参考封底的产品外形照片及对应的型号，D、E、F、G、I型是从具体功能上的划分，是属于功能字符，一般出现在型号的最后一位。

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