700SP7M1QEAP2BLKBLK;中文规格书,Datasheet资料
XL7007规格书(中文版).
特点n 10V 到65V 宽输入电压范围 n 输出电压从1.25V 到50V 可调 n 最大占空比100% n 最小压降0.3V n 固定180KHz 开关频率 n 最大0.8A 开关电流 n 内置功率MOSFET n 高效率n 出色的线性与负载调整率 n 内置过热关断护功能 n 内置限流功能 n 内置输出短路保护功能 n SOP8L 封装应用n 车载充电器 n 电池充电器 n 电动车控制器供电 n 便携式仪表电源 n 通信描述XL7007是一款高效、高压降压型DC-DC 转换器，固定180KHz 开关频率，可提供最高0.8A 输出电流能力，低纹波，出色的线性调整率与负载调整率。
XL7007内置固定频率振荡器与频率补偿电路，简化了电路设计。
PWM 控制环路可以调节占空比从0~100%之间线性变化。
内置输出过电流保护功能，当输出短路时，开关频率从180KHz 降至36KHz 。
内部补偿模块可以减少外围元器件数量。
图1. XL7007封装0.8A 180KHz 65V降压型DC-DC转换器XL7007 引脚配置图2. XL7007引脚配置表1.引脚说明引脚号引脚名描述1 NC 无连接。
2 FB 反馈引脚，通过外部电阻分压网络，检测输出电压进行调整。
参考电压为1.25V。
3 VC 内部电压调节旁路电容，需要在VC与VIN之间并联1uF电容。
4 VIN 电源输入引脚，支持DC10V~65V范围电压输入，需要在VIN与GND之间并联电解电容以消除噪声。
5,6 SW 功率开关输出引脚，SW是输出功率的开关节点。
7,8 GND 接地引脚。
0.8A 180KHz 65V降压型DC-DC转换器XL7007 方框图图3. XL7007方框图典型应用图4. XL7007系统参数测量电路0.8A 180KHz 65V降压型DC-DC转换器XL7007 订购信息产品型号打印名称封装方式包装类型XL7007E1 XL7007E1 SOP-8L 2500只每卷XLSEMI无铅产品，产品型号带有“E1”后缀的符合RoHS标准。
ZY7007LU-T2中文资料(Power-One)中文数据手册「EasyDatasheet - 矽搜」
对于频率单线串行通信总线
同步,编程和监视 最佳电压定位,可编程斜率
在六线
过流,过压,欠压,和 过热防护护,可编程
阈值和类型
可编程固定开关频率0.5-1.0MHz
可编程导通和关断延迟
可编程导通和关断电压摆率 与跟踪防护护 可编程反馈环路补偿
电源良好信号,可编程限
可编程故障管理
起动到负载预偏置到100％
2
3
Units °C
°C
grams MHrs
°C °C
芯片中文手册,看全文,戳
ZY7007 7A DC-DC POL智能数据表 3V至14V输入 0.5V至5.5V输出
4. 电气规格
技术指标适用于从3V输入电压14V,输出负载从0到7A,环境温度为-40°C至85°C,
100 F 输出电容,和默认性能参数设置,除非另有说明.
2. 绝对最大额定值 在超过绝对最大额定值应力可能会导致性能下降,长期可靠性产生不利影响,并导致变频器永久性损坏.
参数 工作温度
输入电压 输出电流
3. 环防护和机械规格
参数 环境温度范围
存储温度（TS）
重量
MTBF
回流峰值温度
镀铅 潮湿敏感度等级
条件 /说明
控制器外壳温度
250ms瞬态
（见输出电流降额曲线）
Delay
Logic
下限阈值 阈值上限
Delay
门限准确度
ZY7007 7A DC-DC POL智能数据表 3V至14V输入 0.5V至5.5V输出
输出欠压防护护
默认 可编程
默认
可编程在5％步骤
测量V
O.SET =2.5V
从什么时候超过阈值,直到瞬间
2N7002K,215;中文规格书,Datasheet资料
2N7002KTrenchMOS™ logic level FETRev. 01 — 20 October 2003Product dataM3D0881.Product profile1.1DescriptionN-channel enhancement mode field-effect transistor in a plastic package using TrenchMOS™ technology.1.2Features1.3Applications1.4Quick reference data2.Pinning informations Logic level compatible s Very fast switchings Subminiature surface mount package s Gate-source ESD protection diodes.s Relay drivers High speed line driver.s V DS ≤60V s I D ≤340mA s P tot ≤0.83Ws R DSon ≤3.9Ω.Table 1:Pinning - SOT23, simplified outline and symbolPin Description Simplified outlineSymbol1gate (g)SOT232source (s)3drain (d)MSB003Top view123gds03ab603.Ordering informationTable 2:Ordering informationType number PackageName Description Version2N7002K SOT23Plastic surface mounted package; 3 leads.SOT23 4.Limiting valuesTable 3:Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit V DS drain-source voltage (DC)25°C≤T j≤150°C-60VV DGR drain-gate voltage (DC)25°C≤T j≤150°C; R GS=20kΩ-60VV GS gate-source voltage (DC)-±15VI D drain current (DC)T sp=25°C; V GS=10V;Figure2and3-340mAT sp=100°C; V GS=10V;Figure2-215mA I DM peak drain current T sp=25°C; pulsed; t p≤10µs;Figure3-680mA P tot total power dissipation T sp=25°C;Figure1-0.83W T stg storage temperature−65+150°C T j junction temperature−65+150°C Source-drain diodeI S source (diode forward) current (DC)T sp=25°C-340mA I SM peak source (diode forward) current T sp=25°C; pulsed; t p≤10µs-680mA Electrostatic discharge voltageV esd electrostatic discharge voltage Human Body Model1; C=100pF; R=1.5kΩ-1kVFig 1.Normalized total power dissipation as afunction of solder point temperature.Fig 2.Normalized continuous drain current as afunction of solder point temperature.T sp =25°C; I DM is single pulse; V GS =10VFig 3.Safe operating area; continuous and peak drain currents as a function of drain-source voltage.03aa1704080120050100150200(%)T sp (°C)P der 03aa2504080120050100150200T sp (°C)I der (%)P der P totP tot 25C °()-----------------------100%×=I der I DI D 25C °()-------------------100%×=03an6610-210-11110102V DS (V)I D (A)DC100 ms10 msLimit R DSon = V DS / I D1 mst p = 10 µs100 µs5.Thermal characteristics5.1Transient thermal impedanceTable 4:Thermal characteristicsSymbol ParameterConditionsMin Typ Max Unit R th(j-sp)thermal resistance from junction to solder point Figure 4--150K/W R th(j-a)thermal resistance from junction to ambientminimum footprint;mounted on a printed-circuit board-350-K/WFig 4.Transient thermal impedance from junction to solder point as a function of pulse duration.03aa3911010210310-510-410-310-210-1110t p (s)Z th(j-sp)(K/W)single pulseδ = 0.50.20.10.050.02t pt p TPtTδ =6.CharacteristicsTable 5:CharacteristicsT j=25°C unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit Static characteristicsV(BR)DSS drain-source breakdown voltage I D=10µA; V GS=0VT j=25°C6075-VT j=−55°C55--VV(BR)GSS drain-source breakdown voltage I G=±1mA; V DS=0V1622-VV GS(th)gate-source threshold voltage I D=1mA; V DS=V GS;Figure9VT j=25°C12-VT j=150°C0.6--VT j=−55°C-- 3.5VI DSS drain-source leakage current V DS=48V; V GS=0VT j=25°C-0.011µAT j=150°C--10µA I GSS gate-source leakage current V GS=±10V; V DS=0V-50500nA R DSon drain-source on-state resistance V GS=10V; I D=500mA;Figure7and8T j=25°C- 2.8 3.9ΩT j=150°C- 5.27.2ΩV GS=4.5V; I D=200mA;Figure7and8- 3.8 5.3ΩDynamic characteristicsC iss input capacitance V GS=0V; V DS=10V; f=1MHz;Figure11-1340pFC oss output capacitance-830pF C rss reverse transfer capacitance-410pFt on turn-on time V DD=50V; R L=250Ω;V GS=10V;R G=50Ω; R GS=50Ω-310nst off turn-off time-915ns Source-drain diodeV SD source-drain (diode forward) voltage I S=300mA; V GS=0V;Figure12-0.93 1.5Vt rr reverse recovery time I S=300mA; dI S/dt=−100A/µs;V GS=0V; V R=25V -30-nsQ r recovered charge-30-nCT j =25°C T j =25°C and 150°C; V DS >I D x R DSonFig 5.Output characteristics: drain current as afunction of drain-source voltage;typical values.Fig 6.Transfer characteristics: drain current as afunction of gate-source voltage; typical values.T j =25°CFig 7.Drain-source on-state resistance as a functionof drain current; typical values.Fig 8.Normalized drain-source on-state resistance factor as a function of junction temperature.03an7000.10.20.30.40.500.511.52V DS (V)I D (A) 3.5 VT j = 25 °CV GS = 10V4 V4.5 V3 V6 V03an7200.10.20.30.40.50246V GS (V)I D (A)V DS > I D x R DSonT j = 25 °C150 °C03an71024681000.10.20.30.40.5I D (A)R DSon (Ω)V GS = 3.5 VT j = 25 °C4.5 V4 V10 V6 V 03aa2800.61.21.82.4-6060120180a T j (°C)a RDSon R DSon 25C °()----------------------------=I D =1mA; V DS =V GS T j =25°C; V DS =5VFig 9.Gate-source threshold voltage as a function ofjunction temperature.Fig 10.Sub-threshold drain current as a function ofgate-source voltage.V GS =0V; f =1MHzFig 11.Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.03aa3400.61.21.82.4-6060120180T j (°C)V GS(th)(V)typmin03aa3710-610-510-410-310-210-100.61.21.82.4V GS (V)I D (A)typmin03aa4611010210-11 10102V DS (V)C (pF)C issC ossC rssT j =25°C and 150°C; V GS =0V I D =0.5A; V DD =48VFig 12.Source (diode forward) current as a function ofsource-drain (diode forward) voltage; typical values.Fig 13.Gate-source voltage as a function of gatecharge; typical values.03an7300.10.20.30.40.500.30.60.91.2V SD (V)I S (A)T j = 25 °C150 °CV GS = 0 V03ab090510150.30.60.91.2Q G (nC)V GS (V)I D = 0.5AV DD = 48 V T j = 25 °C7.Package outlineFig 14.SOT23.UNIT A 1max.b p c D E e 1H E L p Q w v REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE 97-02-2899-09-13IECJEDEC EIAJmm0.10.480.380.150.093.02.81.41.20.95e 1.92.52.10.550.450.10.2DIMENSIONS (mm are the original dimensions)0.450.15SOT23TO-236ABb pD e 1eAA 1L pQdetail XH EE w M v M ABAB 01 2 mmscaleA 1.10.9cX123Plastic surface mounted package; 3 leadsSOT238.Revision historyTable 6:Revision historyRev Date CPCN Description0120031020Product data (9397 750 11703)分销商库存信息: NXP2N7002K,215。
克伊利·7002开关系统数据手册说明书
1.888.KEITHLEY (U.S. only) SideTextSWITCHINGANDCONTROLA G R E A T E R M E A S U R E O F C O N F I D E N C ETen-slothighdensityswitchmainframe The Model 7002 Switch System is a 10-slot mainf rame that supports up to400 2-pole mul t i p lex e r channels or 400 matrix crosspoints. The front panelincludes a unique in t er a c t ive display of chan n el status for quick pro g ram-ming. Scanning speeds of up to 300 channels per second are possible withthe high density switch cards. The wide selection of more than 30 d ifferentswitch cards makes the 7002 one of the most flexible switch i ng main-frames avail a ble.Reduce the Size and Costof Your Switching Application.up to 400 channels of 2-pole switching. A single Model 7002 mainframecan accommodate up to ten 40-channel cards. That’s 400 channels in asingle full-rack package that is only 178mm high (7 in). This level of density provides some impor-tant advantages. First, it reduces the amount of switching hardware required for a given ap p li c a t ion. Second, it provides high flexibility. The high density cards can be used with the special signal cardsto cover all your signal needs for a large application with one m ainframe.The 7002 is fully compatible with all 7001 switch cards. From thisf ig u r a t ion flex i b il-a m p le, the outputs of a mul t ip lex e r card can be connectedt i p lex e r cards can be con n ect e d to formlex e r. Intercard wiring is eliminated by using the an a l og backplane to formThe interactive front panel display helps shorten the time requiredAn optional light pen provides point and click pro g ram m ing from thep lete switch patterns.Automatic card configuration. When the high density cards are installed,the 7002 au t o m at i c al l y configures each slot independently for the propercard. The channel status display on the front panel adjusts to show eachcard’s capacity and con f ig u r a t ion.Front panel info key. At the touch of a button, the operator receives con-text-sensitive, on-line information to help configure the system. This infor-mation is displayed on a 52-character alphanumeric display for clear andreadable messages. There is no need to refer constantly to the operator’smanual. All information messages, operating instructions, and prompts areavailable in English, German, and French. Just select the desired languagein the con f ig u r a t ion menu.Programmable channel closure restrictions. The 7002 allows specificchannels to be locked out from closure. This restriction can be conditionalbased on the open/close state of other channels or crosspoints. This capa-bility is useful to prevent certain signals from being accidentally connectedto high power circuits, for example.DC, RF, and optical switchcapabilityInteractive channel statusdisplaySERVICES AVAILABLE7002-3Y-EW 1-year factory warranty extended to 3 years from date of shipment19811.888.KEITHLEY (U.S. only)A G R E A T E R M E A S U R E O F C O N F I D EN CE7002 7002Switch/Control Mainframe400-channelSystem Throughput300 channel per second scanning. The 7002 can scan through up to 300 chan-nels per second. This scan process can be controlled by the internal time base of the 7002 or through external triggers. The scan sequence is con t rolled by what appears in the scan list. The scan list can include channels, ranges of channels, and memory locations. This ap p roach gives max i m um flexibility while obtaining maximum through p ut.Built-in Scan Control and trigger Link. The built-in scan control eliminates the need for the computer to control every step of the test pro-cedure. Simply program the 7002 to control the channel spacing, scan spacing, and number of scans. Trigger Link gives you access to six inde-pen d ent hardware trigger lines on a single cable.SYSTEMCAPACitY: 10 plug-in cards per mainframe.MeMoRY: Battery backed-up storage for 500 switch pat t erns. SWitCh SettLiNg tiMe: Automatically selected by the main-frame. For different switchcards, 7002 will be set to the slow-est relay settling time. Additional time from 0 to 99999.999s econds can be added in 1ms increments.tRiggeR SouRCeS:External Trigger (TTL-compatible, programmable edge, 600ns min i m um pulse, rear panel BNC).IEEE-488 bus (GET, *TRG)Trigger LinkTHROUGHPUTeXeCutioN SPeeD oF SCAN LiSt (channels or memory l ocationsper s econd):ChannelsMemoriesBreak-Before-MakeOFF 300243ON 270189tRiggeR eXeCutioN tiMe (maximum time from ac t i v a t ion of trig g er Source to start of switch open or close 2):Source Latency Jitter GET1 200 µs <15 µs *TRG2, 3 3.0 ms Trigger Link 200 µs <10 µs External200 µs<10 µs Timer <25 µsNOTES1. Excluding switch settling time.2. Assuming no IEEE-488 commands are pending execution.3. Display off.IEEE-488 COMMAND EXECUTION TIMECommand Execution Time 1CLOS (@1!1)<8 ms + Relay Settle Time NOTES1. Measured from the time at which the command terminator is taken from the bus to relay energize. With display OFF.IEEE-488 BUS IMPLEMENTATIONStANDARDS CoNFoRMANCe: Conforms to SCPI-1990, IEEE-488.2, and IEEE-488.1.MuLtiLiNe CoMMANDS: DCL, LLO, SDC, GET, GTL, UNT, UNL, SPE, SPD.uNiLiNe CoMMANDS: IFC, REN, EOI, SRQ, ATN.iNteRFACe FuNCtioNS: SH1, AH1, T5, TE0, L4, LE0, SR1, RL1, PP0, DC1, DT1, C0, E1.All aspects of 7002 op e r a t ion are available from the front panel or over the IEEE-bus interface. The 7002 conforms to IEEE-488.2 and the SCPI (Standard Com m ands for Programmable Instru m ents) command language protocol.• Scan List • Scan Spacing • Channel Spacing • Number of Scans • Number of Channels • Trigger Source• Single Channel Mode • Channel Restrictions • Save Mainframe Con f ig u r a t ion Setups • Digital I/O • Card Pair • Channel Delay • Number of Poles• Channel Pattern MemoryGENERALDiSPLAY: Dual-line vacuum fluorescent. 1st line: 20-char-ac t er alphanumeric. 2nd line: 32-character alphanu-meric. Chan n el status LED grid.Light PeN oPtioN: Provides interactive programming of channels, cross points, scan lists, and memory.ReAR PANeL CoNNeCtoRS: IEEE-488; 9-pin DB9 Female; 8-pin micro DIN for Trigger Link; 8-pin micro DIN for Trigger Link expansion; BNC for External Trigger; BNC for Channel ReadyPoWeR: 100V to 240Vrms, 50/60Hz, 110VA max i m um.eMC: Complies with European Union Directive 89/336/ EEC, EN61326-1.SAFetY: Conforms to European Union Directive 73/23/EEC, EN61010-1).eMi/RFi: Meets VDE 0871B and FCC Class B.eNViRoNMeNt: operating: 0°C to 50°C, <80% RH (0°C to 35°C). Storage: –25°C to +65°C.DiMeNSioNS, Weight: 178mm high × 438mm wide × 448mm deep (7 in × 171⁄4 in × 175⁄8 in). Net weight 9.1kg (20 lb).。
ICS557-01 Datasheet说明书
PCI-EXPRESS CLOCK SOURCEDescriptionThe ICS557-01 is a clock chip designed for use inPCI-Express Cards as a clock source. It provides a pair of differential outputs at 100 MHz in a small 8-pin SOIC package.Using IDT’s patented Phase-Locked Loop (PLL) techniques, the device takes a 25 MHz crystal input and produces HCSL (Host Clock Signal Level) differential outputs at 100 MHz clock frequency. LVDS signal levels can also be supported via an alternative termination scheme.Features•Supports PCI-Express TM HCSL Outputs0.7 V current mode differential pair •Supports LVDS Output Levels•Packaged in 8-pin SOIC•RoHS 5 (green ) or RoHS 6 (green and lead free) compliant packaging•Operating voltage of 3.3 V•Low power consumption•Input frequency of 25 MHz•Short term jitter 100 ps (peak-to-peak)•Output Enable via pin selection•Industrial temperature range availableBlock DiagramPin Assignment Pin DescriptionsPin NumberPinNamePinTypePin Description1OE Input Output Enable signal(H = outputs are enabled, L = outputs are disabled/tristated).Internal pull-up resistor.2X1Input Crystal or clock input. Connect to a 25 MHz crystal or single ended clock. 3X2XO Crystal Connection. Connect to a parallel mode crystal.Leave floating if clock input.4GND Power Connect to ground.5IREF Output A 475Ω precision resistor connected between this pin and groundestablishes the external reference current.6CLK Output HCSL differential complementary clock output.7CLK Output HCSL differential clock output.8VDD Power Connect to +3.3 V.Applications Information External ComponentsA minimum number of external components are required for proper operation.Decoupling CapacitorsDecoupling capacitors of 0.01 μF should be connected between VDD and the ground plane (pin 4) as close to the VDD pin as possible. Do not share ground vias between components. Route power from power source through the capacitor pad and then into IDT pin.CrystalA 25 MHz fundamental mode parallel resonant crystal with C L = 16 pF should be used. This crystal must have less than 300 ppm of error across temperature in order for theICS557-01 to meet PCI Express specifications.Crystal CapacitorsCrystal capacitors are connected from pins X1 to ground and X2 to ground to optimize the accuracy of the output frequency.C L= Crystal’s load capacitance in pFCrystal Capacitors (pF) = (C L- 8) * 2For example, for a crystal with a 16 pF load cap, each external crystal cap would be 16 pF. (16-8)*2=16.Current Source (Iref) Reference Resistor - R RIf board target trace impedance (Z) is 50Ω, then R R = 475Ω(1%), providing IREF of 2.32 mA. The output current (I OH) is equal to 6*IREF.Output TerminationThe PCI-Express differential clock outputs of the ICS557-01 are open source drivers and require an external series resistor and a resistor to ground. These resistor values and their allowable locations are shown in detail in thePCI-Express Layout Guidelines section.The ICS557-01can also be configured for LVDS compatible voltage levels. See the LVDS Compatible Layout Guidelines sectionGeneral PCB Layout RecommendationsFor optimum device performance and lowest output phase noise, the following guidelines should be observed.1. Each 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible.2. No vias should be used between decoupling capacitor and VDD pin.3. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. Distance of the ferrite bead and bulk decoupling from the device is less critical.4. An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers (any ferrite beads and bulk decoupling capacitors can be mounted on the back). Other signal traces should be routed away from the ICS557-01.This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device.PCI-Express Layout GuidelinesFigure 1: PCI-Express Device RoutingTypical PCI-Express (HCSL) WaveformLVDS Compatible Layout GuidelinesFigure: LVDS Device RoutingTypical LVDS WaveformAbsolute Maximum RatingsStresses above the ratings listed below can cause permanent damage to the ICS557-01. These ratings are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.DC Electrical CharacteristicsUnless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85°C1 Single edge is monotonic when transitioning through region.2 Inputs with pull-ups/-downs are not included.ItemRatingSupply Voltage, VDD, VDDA 5.5 VAll Inputs and Outputs-0.5 V to VDD+0.5 V Ambient Operating Temperature (commercial)0 to +70°C Ambient Operating Temperature (industrial)-40 to +85°C Storage Temperature -65 to +150°C Junction Temperature 125°C Soldering Temperature 260°CESD Protection (Input)2000 V min. (HBM)ParameterSymbolConditions Min.Typ.Max.UnitsSupply Voltage V 3.135 3.465Input High Voltage 1V IH 2.0VDD +0.3V Input Low Voltage 1V IL VSS-0.30.8V Input Leakage Current 2I IL 0 < Vin < VDD-55μA Operating Supply Current I DD With 50Ω and 2 pF load 55mA I DDOE OE =Low35mA Input Capacitance C IN Input pin capacitance 7pF Output Capacitance C OUT Output pin capacitance 6pF Pin Inductance L PIN 5nH Output Resistance Rout CLK outputs 3.0k ΩPull-up ResistorR PUPOE60k ΩAC Electrical Characteristics - CLK/CLKUnless stated otherwise, VDD=3.3 V ±5%, Ambient Temperature -40 to +85°C1 Test setup is R L =50 ohms with2 pF , R R = 475Ω (1%).2 Measurement taken from a single-ended waveform.3 Measurement taken from a differential waveform.4Measured at the crossing point where instantaneous voltages of both CLKOUT and CLKOUT are equal.5 CLKOUT pins are tri-stated when OE is low asserted. CLKOUT is driven differential when OE is high.Thermal Characteristics (8-pin SOIC)ParameterSymbolConditions Min.Typ.Max.UnitsInput Frequency 25MHz Output Frequency 100MHzOutput High Voltage 1,2V OH 660700850mV Output Low Voltage 1,2V OL-150027mV Crossing Point Voltage 1,2Absolute250350550mV Crossing Point Voltage 1,2,4Variation over all edges140mV Jitter, Cycle-to-Cycle 1,380ps Rise Time 1,2t OR From 0.175 V to 0.525 V 175332700ps Fall Time 1,2t OFFrom 0.525 V to 0.175 V175344700ps Rise/Fall Time Variation 1,2125ps Duty Cycle 1,34555%Output Enable Time 5All outputs 30µs Output Disable Time 5All outputs30µs Stabilization Time t STABLEFrom power-up VDD=3.3 V3.0ms Spread Change Timet SPREAD Settling period after spread change3.0msParameterSymbolConditionsMin.Typ.Max.UnitsThermal Resistance Junction to AmbientθJA Still air150°C/W θJA 1 m/s air flow 140°C/W θJA 3 m/s air flow120°C/W Thermal Resistance Junction to CaseθJC40°C/WMarking Diagram (ICS557M-01LF) Marking Diagram (ICS557MI-01LF)Notes:1. ###### is the lot code.2. YYWW is the last two digits of the year, and the week number that the part was assembled.3. “L ” designates Pb (lead) free packaging.4. “I” denotes industrial temperature.5. Bottom marking: (orgin). Origin = country of origin if not USA.Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95Ordering InformationPart / Order Number Marking Shipping Packaging Package Temperature 557M-01LF See Page 8Tubes8-pin SOIC0 to +70° C557M-01LFT Tape and Reel8-pin SOIC0 to +70° C557MI-01LF Tubes8-pin SOIC-40 to +85° C557MI-01LFT Tape and Reel8-pin SOIC-40 to +85° C"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.Corporate HeadquartersIntegrated Device Technology, For Sales800-345-7015408-284-8200Fax: 408-284-2775For Tech Support/go/clockhelpInnovate with IDT and accelerate your future networks. Contact:www.IDT .com。
onsemi 2n7002k-d 数据表说明书
DATA SHEETSmall Signal MOSFET60 V, 380 mA, Single, N−Channel, SOT−232N7002K, 2V7002KFeatures•ESD Protected•Low R DS(on)•Surface Mount Package•2V Prefix for Automotive and Other Applications Requiring UniqueSite and Control Change Requirements; AEC−Q101 Qualified andPPAP Capable•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliantApplications•Low Side Load Switch•Level Shift Circuits•DC−DC Converter•Portable Applications i.e. DSC, PDA, Cell Phone, etc.MAXIMUM RATINGS (T J = 25°C unless otherwise stated)Rating Symbol Value UnitDrain−to−Source Voltage V DSS60VGate−to−Source Voltage V GS±20VDrain Current (Note 1)Steady State 1 sq in Pad T A = 25°CT A = 85°C I D380270mADrain Current (Note 2)Steady State Minimum Pad T A = 25°CT A = 85°C I D320230mAPower Dissipation Steady State 1 sq in PadSteady State Minimum Pad P D420300mWPulsed Drain Current (t p = 10 m s)I DM 5.0AOperating Junction and Storage Temperature Range T J, T STG−55 to+150°CSource Current (Body Diode)I S300mA Lead Temperature for Soldering Purposes(1/8″ from case for 10 s)T L260°C Gate−Source ESD Rating(HBM, Method 3015)ESD2000VStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.Surface−mounted on FR4 board using 1 sq in pad size with 1 oz Cu.2.Surface−mounted on FR4 board using 0.08 sq in pad size with 1 oz Cu.Device Package Shipping†ORDERING INFORMATION2N7002KT1G,2V7002KT1G3000 / Tape & Reel SIMPLIFIED SCHEMATICSOT−23CASE 318STYLE 21704 M GGMARKING DIAGRAM& PIN ASSIGNMENT321DrainGate SourceSOT−23(Pb−Free)60 V1.6 W @ 10 VR DS(on) MAX380 mAI D MAXV(BR)DSS†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.2.5 W @ 4.5 VDrain(Top View)704= Specific Device Code*M= Date Code*G= Pb−Free Package2N7002KT7G3500 / Tape & ReelSOT−23(Pb−Free)*Specific Device Code, Date Code or overbarorientation and/or location may vary depend-ing upon manufacturing location. This is arepresentation only and actual devices maynot match this drawing exactly.(Note: Microdot may be in either location)THERMAL CHARACTERISTICSCharacteristic Symbol Max Unit Junction−to−Ambient − Steady State (Note3)R q JA300°C/W Junction−to−Ambient − t ≤ 5 s (Note 3)92Junction−to−Ambient − Steady State (Note4)417Junction−to−Ambient − t ≤ 5 s (Note 4)1543.Surface−mounted on FR4 board using 1 sq in pad size with 1 oz Cu.4.Surface−mounted on FR4 board using 0.08 sq in pad size with 1 oz Cu.ELECTRICAL CHARACTERISTICS (T J = 25°C unless otherwise specified)Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICSDrain−to−Source Breakdown Voltage V(BR)DSS V GS = 0 V, I D = 250 m A60V Drain−to−Source Breakdown VoltageTemperature CoefficientV(BR)DSS/T J71mV/°CZero Gate Voltage Drain Current I DSS VGS = 0 V,V DS = 60 V T J = 25°C1m A T J = 125°C10V GS = 0 V,V DS = 50 VT J = 25°C100nA Gate−to−Source Leakage Current I GSS V DS = 0 V, V GS = ±20 V±10m AV DS = 0 V, V GS = ±10 V450nAV DS = 0 V, V GS = ±5.0 V150nA ON CHARACTERISTICS (Note 5)Gate Threshold Voltage V GS(TH)V GS = V DS, I D = 250 m A 1.0 2.3V Negative Threshold TemperatureCoefficientV GS(TH)/T J 4.0mV/°C Drain−to−Source On Resistance R DS(on)V GS = 10 V, I D = 500 mA 1.19 1.6WV GS = 4.5 V, I D = 200 mA 1.33 2.5Forward Transconductance g FS V DS = 5 V, I D = 200 mA530mS CHARGES AND CAPACITANCESInput Capacitance C ISSV GS = 0 V, f = 1 MHz,V DS = 20 V 24.545pFOutput Capacitance C OSS 4.28.0 Reverse Transfer Capacitance C RSS 2.2 5.0Total Gate Charge Q G(TOT)V GS = 4.5 V, V DS = 10 V;I D = 200 mA 0.7nCThreshold Gate Charge Q G(TH)0.1 Gate−to−Source Charge Q GS0.3 Gate−to−Drain Charge Q GD0.1 SWITCHING CHARACTERISTICS, V GS = V (Note 6)Turn−On Delay Time t d(ON)V GS = 10 V, V DD = 25 V,I D = 500 mA, R G = 25 W 12.2nsRise Time t r9.0 Turn−Off Delay Time t d(OFF)55.8 Fall Time t f29 DRAIN−SOURCE DIODE CHARACTERISTICSForward Diode Voltage V SD VGS = 0 V,I S = 200 mA T J = 25°C0.8 1.2V T J = 85°C0.7Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.5.Pulse Test: pulse width ≤ 300 m s, duty cycle ≤ 2%6.Switching characteristics are independent of operating junction temperaturesFigure 1. On −Region CharacteristicsFigure 2. Transfer CharacteristicsV DS , DRAIN −TO −SOURCE VOLTAGE (V)V GS , GATE −TO −SOURCE VOLTAGE (V)Figure 3. On −Resistance vs. Drain Current andTemperatureFigure 4. On −Resistance vs. Drain Current andTemperatureI D , DRAIN CURRENT (A)Figure 5. On −Resistance vs. Gate −to −SourceVoltage Figure 6. On −Resistance Variation withTemperatureV GS , GATE −TO −SOURCE VOLTAGE (V)T J , JUNCTION TEMPERATURE (°C)I D , D R A I N C U R R E N T (A )I D , D R A I N C U R R E N T (A )R D S (o n ), D R A I N −T O −S O U R C E R E S I S T A N C E (W )R D S (o n ), D R A I N −T O −S O U R C E R E S I S T A N C E (W )R D S (o n ), D R A I N −T O −S O U R C E R E S I S T A N C E (N O R M A L I Z E D )I D , DRAIN CURRENT (A)R D S (o n ), D R A I N −T O −S O U R C E R E S I S T A N C E (W )Figure 7. Capacitance VariationFigure 8. Gate −to −Source andDrain −to −Source Voltage vs. Total ChargeQg, TOTAL GATE CHARGE (nC)Figure 9. Diode Forward Voltage vs. CurrentV SD , SOURCE −TO −DRAIN VOLTAGE (V)V G S , G A T E −T O −S O U R C E V O L T A G E (V )I S , S O U R C E C U R R E N T (A)C , C A P A C I T A N C E (p F )GATE −TO −SOURCE OR DRAIN −TO −SOURCE VOLTAGE (V)Figure 10. Threshold Voltage withTemperatureT J , JUNCTION TEMPERATURE (°C)V G S (T H ), T H R E S H O L D V O L T A G E (V )0.11101000.0000010.000010.00010.0010.010.11000Figure 11. Thermal Response − 1 sq in padt, PULSE TIME (s)R q J A (t ) (°C /W ) E F F E C T I V E T R A N S I E N T T H E R M A L R E S I S T A N C E11010010000.11101000.0000010.000010.00010.0010.010.11000Figure 12. Thermal Response − minimum padt, PULSE TIME (s)R q J A (t ) (°C /W ) E F F E C T I V E T R A N S I E N T T H E R M A L R E S I S T A N C E1101001000SOT −23 (TO −236)CASE 318−08ISSUE ASDATE 30 JAN 2018SCALE 4:11XXXM G G XXX = Specific Device Code M = Date Code G = Pb −Free Package*This information is generic. Please refer to device data sheet for actual part marking.Pb −Free indicator, “G” or microdot “ G ”,may or may not be present.GENERICMARKING DIAGRAM*NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL.4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.SOLDERING FOOTPRINTDIM A MIN NOM MAX MINMILLIMETERS0.89 1.00 1.110.035INCHES A10.010.060.100.000b 0.370.440.500.015c 0.080.140.200.003D 2.80 2.90 3.040.110E 1.20 1.30 1.400.047e 1.78 1.90 2.040.070L 0.300.430.550.0120.0390.0440.0020.0040.0170.0200.0060.0080.1140.1200.0510.0550.0750.0800.0170.022NOM MAX L1STYLE 22:PIN 1.RETURN2.OUTPUT3.INPUT STYLE 6:PIN 1.BASE2.EMITTER3.COLLECTOR STYLE 7:PIN 1.EMITTER2.BASE3.COLLECTORSTYLE 8:PIN 1.ANODE2.NO CONNECTION3.CATHODESTYLE 9:PIN 1.ANODE2.ANODE3.CATHODE STYLE 10:PIN 1.DRAIN2.SOURCE3.GATE STYLE 11:PIN 1.ANODE 2.CATHODE 3.CATHODE −ANODE STYLE 12:PIN 1.CATHODE2.CATHODE3.ANODE STYLE 13:PIN 1.SOURCE2.DRAIN3.GATESTYLE 14:PIN 1.CATHODE2.GATE3.ANODESTYLE 15:PIN 1.GATE2.CATHODE3.ANODE STYLE 16:PIN 1.ANODE2.CATHODE3.CATHODE STYLE 17:PIN 1.NO CONNECTION2.ANODE3.CATHODE STYLE 18:PIN 1.NO CONNECTION 2.CATHODE 3.ANODE STYLE 19:PIN 1.CATHODE 2.ANODE 3.CATHODE −ANODE STYLE 23:PIN 1.ANODE2.ANODE3.CATHODESTYLE 20:PIN 1.CATHODE2.ANODE3.GATE STYLE 21:PIN 1.GATE2.SOURCE3.DRAIN STYLE 1 THRU 5:CANCELLEDSTYLE 24:PIN 1.GATE2.DRAIN3.SOURCESTYLE 25:PIN 1.ANODE2.CATHODE3.GATESTYLE 26:PIN 1.CATHODE2.ANODE3.NO CONNECTIONSTYLE 27:PIN 1.CATHODE2.CATHODE3.CATHODE2.10 2.40 2.640.0830.0940.104H E 0.350.540.690.0140.0210.027c0−−−100−−−10T°°°°END VIEWDIMENSIONS: MILLIMETERS3X3XRECOMMENDED STYLE 28:PIN 1.ANODE2.ANODE3.ANODEMECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor thePUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************onsemi Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales Representative。
700S-P220X中文资料
9-29Contactors & Control RelaysSafety Control Relays700S-PFeatures•Mechanically linked contacts meeting IEC 947-5-1-L •2…12 poles – all mechanically linked•Red faceplate for easy identification of safety circuits•IEC mechanically linked contacts symbol displayed on front •Double-break contacts to reduce probability of welded contacts •Visual indication of contact state•Tamper resistant cover helps prevent changes which could jeopardize safety•Complete Catalogue number displayed on front •Ideal for use in safety circuitsSpecifications➊ Coil voltage required for proper operation (percent of rated coil voltage).➋ 90% of devices are expected to meet or exceed 12.5 million operations,and 50% of devices are are expected to meet 20 million operations.➌ Temperature inside the panel.T ype700S-PContact Rating Continuous 10 A @ 600V AC / 5 A @ 600V DCRatings Make/BreakAC NEMA A600DCNEMA P600Min. Contact Switching Ratings10V , 50 mA DC SwitchingContacts in SeriesVolts DC24 6412525050060015A 2.2A 1.1A 0.55A 0.24A 0.2A210A 10A 5A 2A 0.7A 0.5A 3 ——7A 3A 1.5A 1.0A 4——10A5A2.5A 1.5AContact Electrical Life—Resistive Loads1.5 mil. ops. at 10A break at 120V AC 14 mil. ops. at 1A break at 120V AC 6 mil. ops. at 1A break at 24V DCCoil Voltage Range ➊AC85…110%DC 80…110%Battery Charging85…115%Coil Con-sump-tion50 Hz60 Hz AC Inrush 132 VA 138 VA Sealed 19.3 VA19 VADCInrush 12.7 W Sealed12.7 WMechanically Linked Contacts All contacts are mechanically linked per IEC 947-5-1 annex L for 2 to 12 polesOperating TimePick-up AC – 10…20 ms / DC – 30…50 ms DropoutAC – 10…20 ms / DC – 20…33 msMechanical Life 12.5 million operations ➋Contact Arrangement 2 to 12 Poles, Double Break Contacts N.O. or N.C. (8 N.C. Maximum)Contact Material/Design Silver Nickel/BifurcatedMountingPanel mount or mount on 700-MP Rail Horizontal Mounting RecommendedT emperatureOperating ➌–20…+65°C (–4…149°F)Storage–40…+65°C (–40…149°F)Wire size per UL/CSA 1X #18 AWG…2X #12 AWG Tightening T orque8…12 lb-in. (0.9…1.4 N•m)Contactors & Control RelaysSafety Control Relays700S-PProduct SelectionT ype S-P Control Relays — AC and DC Coil VoltageFor other coil voltage, consult your local Allen-Bradley sales office. All Catalogue Numbers are factory-stocked.⊗ AC Voltage Suffix CodeThe Catalogue Number as listed is incomplete. Select a voltage suffix code from the table below to complete the Catalogue Number. Example: Catalogue Number 700S-P310 becomes Catalogue Number 700S-P310A1 for a 120V AC coil.Hz24115-120230-240277460-48060A24A1A2A27A49-30Contactors & Control Relays9-31Safety Control Relays700S-P Approximate Dimensions—mm (inches)Dimensions are not intended for manufacturing purposes.(0.5)2- and 4-Pole Bulletin 700S-P RelayApproximate Shipping Weight AC - 0.68kg (1.5lbs),DC - 1.34kg (2.95lbs)6- and 8-Pole Bulletin 700S-P RelayApproximate Shipping Weight AC - 0.79kg (1.75lbs),DC - 1.45kg (3.20lbs)10- and 12-Pole Bulletin 700S-P RelayApproximate Shipping Weight AC - 1.02kg (2.25lbs),DC - 1.68kg (3.7lbs)Universal Mounting Rail for Bulletin 700-P, -PH, -PK,and 700S-P Relays。
Bulletin 700-P 产品说明书
Bulletin 700-PIndustrial Relays 224Specifications, ContinuedOperating Coils ➊Coils for AC relays cannot be used in DC relays and vice versa.➋This coil is optimized for 115…120V, 60 Hz applications and will operate satisfactorily at 110V, 50 Hz.➌This coil is optimized for 110…115V, 50 Hz applications and will operate satisfactorily at 120V, 60 Hz.➍This coil is designed and marked for use at 100…110V DC.Bulletin 700 Bulletin 700-P-PH-PK Relays — Bulletin 700-PLL-PKLL Mechanical Latch Attachments ➊Coil Volts Bulletin 700-P, -PK 2-…12-pole,Bulletin 700-PH 1-…6-pole AC Bulletin 700-PLL–PKLL AC Mechanical Latch Attachment Bulletin 700-P-PK 2-…12-pole,Bulletin 700-PH 1-…6-pole DC 60 Hz 50 Hz 60 Hz 50 Hz —24PA013PA407PL013PL407PD71432————PD71848PA222PA314PL222PL314PD724110 ➋—PA236—PL236PD733 ➍ (100…110)115…120 ➋PA236—PL236——110…115 ➌—PA322—PL322—115…125————PD735120 ➌PA322—PL322——130…140————PD738200…208PA249—PL249——220…230PA251PA339—PL339—230…240PA254PA342PL254PL342—230…250——PD748—PD748277PA260————380—PA354—PL354—415—PA357—PL357—440…460—PA360—PL360—460…480PA273—PL273——500—PA364—PL364PD759575…600PA273—PL278—PD758Bulletin 700-P Operating Coil Bulletin 700-PL Unlatch Coil and Magnet Assembly 700S-P Safety Control Relays Bulletin 700S-P Relays with AC Coils Bulletin 700S-DCP Relays with DC Coils Bulletin 700S-P and 700S-DCP Relays Page 1 of 2 Knowledgebase Technote ID # Q57630393 9/12/2003 Knowledgebase technotes can be found at /Page 2 of 2 Knowledgebase Technote ID # Q57630393 9/12/2003 Important User Information Because of the variety of uses for the products described in this publication, those responsible forthe application and use of this control equipment must satisfy themselves that all necessary stepshave been taken to assure that each application and use meets all performance and safetyrequirements, including any applicable laws, regulations, codes and standards.The illustrations, charts, sample programs and layout examples shown in this guide are intendedsolely for purposes of example. Since there are many variables and requirements associated with anyparticular installation, Rockwell Automation does not assume responsibility or liability (to includeintellectual property liability) for actual use based upon the examples shown in this publication.Allen-Bradley publication SGI-1.1, Safety Guidelines for the Application, Installation and Maintenance ofSolid-State Control (available from your local Allen-Bradley office), describes some importantdifferences between solid-state equipment and electromechanical devices that should be taken intoconsideration when applying products such as those described in this publication.Reproduction of the contents of this copyrighted publication, in whole or part, without writtenpermission of Rockwell Automation, is prohibited.Throughout this document we use notes to make you aware of safety considerations:Identifies information about practices or circumstances that can lead topersonal injury or death, property damage or economic lossIdentifies information that is critical for successful application andunderstanding of the product.Use only replacement parts and devices recommended by Rockwell Automation to maintain theintegrity of the equipment. It is the user’s responsibility to ensure that the renewal part numberselected is properly matched to the model, series and revision level of the equipment being serviced.Servicing energized Industrial Control Equipment can be hazardous.Severe injury or death can result from electrical shock, burn, orunintended actuation of controlled equipment. Recommended practiceis to disconnect and lockout control equipment from power sources,and release stored energy, if present.Refer to National Fire Protection Association Standard No. NFPA70E, Part 2 and (asapplicable) OSHA rules for Control of Hazardous Energy Sources (Lockout/Tagout) andOSHA Electrical Safety Related Work Practices for safety related work practices, includingprocedural requirements for lockout/tagout, and appropriate work practices, personnelqualifications and training requirements where it is not feasible to de-energize and lockout or tagoutelectric circuits and equipment before working on or near exposed circuit parts.ROCKWELL DISCLAIMS ALL WARRANTIES WHETHER EXPRESSED OR IMPLIED INRESPECT TO THE INFORMATION (INCLUDING SOFTWARE) PROVIDED HEREBY,INCLUDING THE IMPLIED WARRANTIES OF FITNESS FOR A PARTICULAR PURPOSE,MERCHANTABILITY, AND NON-INFRINGEMENT. Note that certain jurisdictions do notcountenance the exclusion of implied warranties; thus, this disclaimer may not apply to you.Allen-Bradley is a trademark of Rockwell AutomationKnowledgebase technotes can be found at /。
2N7002K PDF规格书
1
0.1 0.001 0.01 0.1 1
0 0 2 4 6 8 10 12 14 16 18 20
I D , DRAIN CURRENT (A) Fig. 5 Static Drain-Source On-Resistance vs. Drain Current
V GS, GATE SOURCE VOLTAGE (V) Fig. 6 Static Drain-Source On-Resistance vs. Gate-Source Volta ge
D rai n
● ESD Protected 2KV HBM
+0.1 0.38 -0.1
0-0.1
Gate
Gate Protection Diode
Source
Absolute Maximum Ratings Ta=25
Parameter Drain-Source Voltage Gate-Source Voltage -Continuous Drain Current Power Dissipation -Continuous ( Note:1) -Pulsed (Note 1) Thermal Resistance.Junction- to-Ambient Junction Temperature Junction and Storage Temperature Range
Notes: 1. Device mounted on FR-4 PCB.
Symbol VDS VGS ID PD RthJA TJ Tstg
Rating 60 ±20 300 800 350 357 150 -55 to 150
Unit V mA mW ℃/W ℃
Electrical Characteristics Ta = 25
700S-P中文资料
9-29Contactors & Control RelaysSafety Control Relays700S-PFeatures•Mechanically linked contacts meeting IEC 947-5-1-L •2…12 poles – all mechanically linked•Red faceplate for easy identification of safety circuits•IEC mechanically linked contacts symbol displayed on front •Double-break contacts to reduce probability of welded contacts •Visual indication of contact state•Tamper resistant cover helps prevent changes which could jeopardize safety•Complete Catalogue number displayed on front •Ideal for use in safety circuitsSpecifications➊ Coil voltage required for proper operation (percent of rated coil voltage).➋ 90% of devices are expected to meet or exceed 12.5 million operations,and 50% of devices are are expected to meet 20 million operations.➌ Temperature inside the panel.T ype700S-PContact Rating Continuous 10 A @ 600V AC / 5 A @ 600V DCRatings Make/BreakAC NEMA A600DCNEMA P600Min. Contact Switching Ratings10V , 50 mA DC SwitchingContacts in SeriesVolts DC24 6412525050060015A 2.2A 1.1A 0.55A 0.24A 0.2A210A 10A 5A 2A 0.7A 0.5A 3 ——7A 3A 1.5A 1.0A 4——10A5A2.5A 1.5AContact Electrical Life—Resistive Loads1.5 mil. ops. at 10A break at 120V AC 14 mil. ops. at 1A break at 120V AC 6 mil. ops. at 1A break at 24V DCCoil Voltage Range ➊AC85…110%DC 80…110%Battery Charging85…115%Coil Con-sump-tion50 Hz60 Hz AC Inrush 132 VA 138 VA Sealed 19.3 VA19 VADCInrush 12.7 W Sealed12.7 WMechanically Linked Contacts All contacts are mechanically linked per IEC 947-5-1 annex L for 2 to 12 polesOperating TimePick-up AC – 10…20 ms / DC – 30…50 ms DropoutAC – 10…20 ms / DC – 20…33 msMechanical Life 12.5 million operations ➋Contact Arrangement 2 to 12 Poles, Double Break Contacts N.O. or N.C. (8 N.C. Maximum)Contact Material/Design Silver Nickel/BifurcatedMountingPanel mount or mount on 700-MP Rail Horizontal Mounting RecommendedT emperatureOperating ➌–20…+65°C (–4…149°F)Storage–40…+65°C (–40…149°F)Wire size per UL/CSA 1X #18 AWG…2X #12 AWG Tightening T orque8…12 lb-in. (0.9…1.4 N•m)Contactors & Control RelaysSafety Control Relays700S-PProduct SelectionT ype S-P Control Relays — AC and DC Coil VoltageFor other coil voltage, consult your local Allen-Bradley sales office. All Catalogue Numbers are factory-stocked.⊗ AC Voltage Suffix CodeThe Catalogue Number as listed is incomplete. Select a voltage suffix code from the table below to complete the Catalogue Number. Example: Catalogue Number 700S-P310 becomes Catalogue Number 700S-P310A1 for a 120V AC coil.Hz24115-120230-240277460-48060A24A1A2A27A49-30Contactors & Control Relays9-31Safety Control Relays700S-P Approximate Dimensions—mm (inches)Dimensions are not intended for manufacturing purposes.(0.5)2- and 4-Pole Bulletin 700S-P RelayApproximate Shipping Weight AC - 0.68kg (1.5lbs),DC - 1.34kg (2.95lbs)6- and 8-Pole Bulletin 700S-P RelayApproximate Shipping Weight AC - 0.79kg (1.75lbs),DC - 1.45kg (3.20lbs)10- and 12-Pole Bulletin 700S-P RelayApproximate Shipping Weight AC - 1.02kg (2.25lbs),DC - 1.68kg (3.7lbs)Universal Mounting Rail for Bulletin 700-P, -PH, -PK,and 700S-P Relays。
ic-700中文说明书
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商标
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启动 CD 光盘
1 将 CD 光盘插入到光驱。 2 双击 CD 光盘上的“Menu.exe”。
• 根据 PC 上的设置，自动显示下面所示的菜单屏 幕。
3 点击需要的图标，打开对应的文件。 ○i 如要关闭菜单屏幕，点击[Quit]。
• 领先的 RMDR 和相位噪声特性
相比 IC-7200，RMDR 提高 97dB（典型值），相位噪 声特性也提高了 15dB（1 kHz 分离度）。
• 4.3 英寸彩色触摸屏 • 内置自动天调 • 便于设置的多功能旋钮
手咪 （HM-219）
ACC 插头 （13 芯）
直流电源线 （3 米）
CW 电键插头 （6.35 毫米立体声）
AP2N7002K中文资料
N-CHANNEL ENHANCEMENT MODE POWER MOSFET▼ Simple Drive Requirement BV DSS 60V ▼ Small Package Outline R DS(ON)2Ω▼ Surface Mount Device I D640mA▼ RoHS CompliantDescriptionAbsolute Maximum RatingsSymbol Units V DS V V GSV I D @T A =25℃mA I D @T A =70℃mA I DMmA P D @T A =25℃W W/℃T STG ℃T J℃Symbol Value Unit Rthj-aThermal Resistance Junction-ambient 3Max.90℃/WData and specifications subject to change without noticeThermal DataParameterStorage Temperature RangeTotal Power Dissipation 1.38-55 to 150Operating Junction Temperature Range-55 to 150Linear Derating Factor 0.01Continuous Drain Current 3, V GS @ 10V 500Pulsed Drain Current 1,2950Gate-Source Voltage±20Continuous Drain Current 3, V GS @ 10V 640ParameterRating Drain-Source Voltage 60Pb Free Plating Product200209062-1/4AP2N7002KDG SSOT-23Advanced Power MOSFETs utilized advanced processing techniques to achieve the lowest possible on-resistance, extremely efficient and cost-effectiveness device.The SOT-23 package is universally used for all commercial-industrial applications.Electrical Characteristics@T j =25o C(unless otherwise specified)Symbol ParameterTest ConditionsMin.Typ.Max.Units BV DSSDrain-Source Breakdown VoltageV GS =0V, I D =250uA60--V ΔB V DSS /ΔT jBreakdown Voltage Temperature Coefficient Reference to 25℃, I D =1mA-0.06-V/℃R DS(ON)Static Drain-Source On-ResistanceV GS =10V, I D =500mA --2ΩV GS =4.5V, I D =200mA --4ΩV GS(th)Gate Threshold Voltage V DS =V GS , I D =250uA 1- 2.5V g fs Forward TransconductanceV DS =10V, I D =600mA -600-mS I DSS Drain-Source Leakage Current (T j =25o C)V DS =60V, V GS =0V --10uA Drain-Source Leakage Current (T j =70o C)V DS =48V ,V GS =0V --100uA I GSS Gate-Source Leakage V GS =±20V --±30uA Q g Total Gate Charge 2I D =600mA -1 1.6nC Q gs Gate-Source Charge V DS =50V -0.5-nC Q gd Gate-Drain ("Miller") Charge V GS =4.5V -0.5-nC t d(on)Turn-on Delay Time 2V DS =30V -12-ns t r Rise TimeI D =600mA -10-ns t d(off)Turn-off Delay Time R G =3.3Ω,V GS =10V -56-ns t f Fall Time R D =52Ω-29-ns C iss Input Capacitance V GS =0V -3250pF C oss Output CapacitanceV DS =25V -8-pF C rssReverse Transfer Capacitancef=1.0MHz-6-pFSource-Drain DiodeSymbol ParameterTest ConditionsMin.Typ.Max.Units V SDForward On Voltage 2I S =1.2A, V GS =0V-- 1.2VNotes:1.Pulse width limited by Max. junction temperature.2.Pulse width <300us , duty cycle <2%.3.Surface mounted on 1 in 2 copper pad of FR4 board ; 270℃/W when mounted on min. copper pad.2/4AP2N7002KFig 1. Typical Output CharacteristicsFig 3. On-Resistance v.s. Gate VoltageFig 4. Normalized On-Resistancev.s. Junction TemperatureFig 5. Forward Characteristic ofReverse DiodeJunction TemperatureFig 7. Gate Charge Characteristics Fig 8. Typical Capacitance CharacteristicsFig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal ImpedanceFig 11. Transfer Characteristics Fig 12. Gate Charge WaveformAP2N7002K。
700系列门口机说明书
普天天纪CP ITE06型可视对讲系统数码式可视/非可视门口机使用说明书(版本号：NPL/0L0829C)适用以下机型：G700 G700K G700K/ICVG700 VG700K VG700K/ICVG700C VG700KC VG700KC/IC目录一、概述 (1)二、特点 (2)三、技术特性 (2)3.1技术参数 (2)3.2部件名称 (3)3.3尺寸 (3)3.4端口定义 (4)3.5接口线定义 (4)3.6安装 (5)四、开通说明 (7)4.1开通设置 (7)4.2初始化参数说明 (8)五、使用说明 (8)5.1按键说明 (9)5.2显示说明 (9)5.3权限说明 (9)5.3.1高级管理员 (9)5.3.2管理员 (10)5.4操作说明 (11)5.4.1呼叫室内分机 (11)5.4.2公共密码开门 (11)5.4.3刷卡开门 (11)六、功能说明 (12)6.1管理员模块 (12)6.1.1管理员模块相关初始参数 (12)6.1.2管理员功能说明 (12)6.2高级管理员模块 (16)6.2.1高级管理员模块相关初始参数 (16)6.2.2高级管理员功能说明 (17)七、运输与贮存 (22)八、注意事项 (23)九、故障及错误排除 (23)一、概述数码式可视/非可视系列门口机对讲系统是普天天纪楼宇智能有限公司面向大众客户开发的一款可视对讲产品。
产品造型美观，系统配置灵活，是一套技术先进、功能丰富的对讲系统。
数码式可视/非可视系列门口机（以下简称门口机）是一置于单元门口的对讲设备。
采用铝合金外观，豪华气派，夜光防水按键，LED显示屏方便耐用。
以下型号门口机适用于本说明书。
彩色单元门口机 VG700C 密码开门,带联网功能VG700KC 密码开门,带刷卡门禁(ID卡),带联网功能 VG700KC/IC 密码开门,带刷卡门禁(IC卡),带联网功能黑白单元门口机 VG700 密码开门,带联网功能VG700K 密码开门,带刷卡门禁(ID卡),带联网功能 VG700K/IC 密码开门,带刷卡门禁(IC卡),带联网功能非可视单元门口机 G700 密码开门,带联网功能G700K 密码开门,带刷卡门禁(ID卡),带联网功能 G700K/IC 密码开门,带刷卡门禁(IC卡),带联网功能二、特点●数字式信号传输，总线式布线，预置多种编码方式，可适应多种不同的楼房结构，安装调试方便。
2N7002K-7;中文规格书,Datasheet资料
Product SummaryV (BR)DSSR DS(ON) max I D max T A = 25°C 60V2Ω @ V GS = 10V380mA 3Ω @ V GS = 5V310mAFeatures and Benefits• Low On-Resistance • Low Input Capacitance • Fast Switching Speed • Low Input/Output Leakage • Lead, Halogen and Antimony Free, RoHS Compliant "Green"Device (Notes 1 and 2) • ESD Protected Up To 2kV • Qualified to AEC-Q101 Standards for High ReliabilityDescription and ApplicationsThis MOSFET has been designed to minimize the on-state resistance (R DS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. • Motor control • Power Management Functions • BacklightingMechanical Data• Case: SOT23• Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals: Finish ⎯ Matte Tin annealed over Alloy 42 leadframe. Solderable per MIL-STD-202, Method 208 • Weight: 0.008 grams (approximate)Ordering Information (Note 3)Part Number Qualification Case Packaging2N7002K-7 Commercial SOT23 3000/Tape & Reel 2N7002KQ-7 Automotive SOT23 3000/Tape & Reel2N7002K-13 Commercial SOT23 10000/Tape & Reel 2N7002KQ-13 Automotive SOT23 10000/Tape & ReelNotes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free. 2. Diodes Inc.’s “Green” policy can be found on our website at . 3. For packaging details, go to our website at .Marking InformationDate Code KeyYear 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 Code T U V WX Y Z A B C D EMonth Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov DecCode SOT23Top View ESD protected up to 2kV Top View Equivalent Circuit K = SAT (Shanghai Assembly/ Test site) C = CAT (Chengdu Assembly/ Test site) 7K= Product Type Marking Code YM = Date Code Marking Y = Year (ex: N = 2002) M = Month (ex: 9 = September) Chengdu A/T Site Shanghai A/T Site C7K Y MK7KY MMaximum Ratings @T A = 25°C unless otherwise specifiedCharacteristic Symbol Value UnitsDrain-Source Voltage V DSS60 V Gate-Source Voltage V GSS±20 V Continuous Drain Current (Note 5) V GS = 10VSteady State T A = 25°C T A = 70°CI D380300 mA t<5s T A = 25°C T A = 70°CI D430340 mA Continuous Drain Current (Note 5) V GS = 5VSteady State T A = 25°C T A = 70°CI D310240 mA t<5s T A = 25°C T A = 70°CI D350270 mA Maximum Continuous Body Diode Forward Current (Note 5) I S0.5 A Pulsed Drain Current (10μs pulse, duty cycle = 1%) (Note 5) I DM1.2 AThermal Characteristics @T A = 25°C unless otherwise specifiedCharacteristic Symbol Value UnitsTotal Power Dissipation (Note 4) P D370 mW Thermal Resistance, Junction to Ambient (Note 4) Steady State R θJA357°C/W t<5s 292Total Power Dissipation (Note 5) P D540 mW Thermal Resistance, Junction to Ambient (Note 5) Steady StateR θJA240 °C/Wt<5s 197 Thermal Resistance, Junction to Case (Note 5) R θJC91 Operating and Storage Temperature Range T J, T STG-55 to 150 °CElectrical Characteristics @T A = 25°C unless otherwise specifiedCharacteristic Symbol Min Typ Max Unit Test ConditionOFF CHARACTERISTICS (Note 6) Drain-Source Breakdown Voltage BV DSS 60 ⎯ ⎯ V V GS = 0V, I D = 10μA Zero Gate Voltage Drain Current I DSS ⎯ ⎯ 1.0 μA V DS = 60V, V GS = 0V Gate-Source Leakage I GSS ⎯ ⎯ ±10 μA V GS = ±20V, V DS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage V GS(th) 1.0 1.6 2.5 V V DS = 10V, I D = 1mAStatic Drain-Source On-Resistance R DS (ON)⎯ ⎯⎯ 2.0 3.0 Ω V GS = 10V, I D = 0.5A V GS = 5V, I D = 0.05AForward Transfer Admittance |Y fs | 80 ⎯ ⎯ ms V DS =10V, I D = 0.2A Diode Forward Voltage V SD ⎯ 0.75 1.1 V V GS = 0V, I S = 115mA DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance C iss ⎯30 50 pF V DS = 25V, V GS = 0Vf = 1.0MHzOutput Capacitance C oss ⎯4.2 25 pF Reverse Transfer Capacitance C rss ⎯2.9 5.0 pF Gate Resistance R g⎯ 133 ⎯ m Ω f = 1MHz , V GS = 0V, V DS = 0V Total Gate Charge Q g⎯ 0.3 ⎯ nC V GS = 4.5V, V DS = 10V,I D = 250mAGate-Source Charge Q gs⎯ 0.2 ⎯ nC Gate-Drain Charge Q gd⎯ 0.08 ⎯ nC Turn-On Delay Time t D(on)⎯ 3.9 ⎯ ns V DD = 30V, V GS = 10V, R G = 25Ω, I D = 200mA Turn-On Rise Time t r⎯ 3.4 ⎯ ns Turn-Off Delay Time t D(off)⎯ 15.7 ⎯ ns Turn-Off Fall Time t f⎯ 9.9 ⎯ ns Notes:4. Device mounted on FR-4 PCB, with minimum recommended pad layout5. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.6. Short duration pulse test used to minimize self-heating effect.7. Guaranteed by design. Not subject to product testing.V , DRAIN-SOURCE VOLTAGE (V)Fig. 1 Typical Output CharacteristicsDS I , D R A I N C U R R E N T (A )V , GATE-SOURCE VOLTAGE (V)Fig. 2 Typical Transfer CharacteristicsGS T , CHANNEL TEMPERATURE (°C)Fig. 3 Gate Threshold Voltage vs. Channel Temperaturech 00.51.52Fig. 4 Static Drain-Source On-Resistance vs. Drain Current DFig. 5 Static Drain-Source On-Resistance vs. Drain Current DV GATE SOURCE VOLTAGE (V)GS ,Fig. 6 Static Drain-Source On-Resistance vs. Gate-Source VoltageFig. 7 CH Static Drain-Source On-State Resistancevs. Channel T emperatureI , DRAIN CURRENT (A)D Fig.10 Forward Transfer Admittance vs. Drain Current|Y |, F O R W A R D T R A N S F E R A D M I T T A N C E (S )Fig. 11 Safe Operation AreaV , DRAIN-SOURCE VOLTAGE (V)DS I , D R A I N C U R R E N T (A )D t1, PULSE DURATION TIME (sec)Fig. 12 Single Pulse Maximum Power DissipationP , P E A K T R A N S I E N T P O I W E R (W )(P K )t1, PULSE DURATION TIME (sec)Fig. 13 Transient Thermal Resistancer (t ), T R A N S I E N T T H E R M A L R E S I S T A N C EPackage Outline Dimensions Suggested Pad LayoutSOT23Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.0130.10 0.05 K 0.903 1.10 1.00 K1 - - 0.400 L 0.45 0.61 0.55 M 0.0850.18 0.11α0° 8°- All Dimensions in mmDimensions Value (in mm)Z2.9 X 0.8 Y 0.9 C 2.0 E 1.35X EYCZIMPORTANT NOTICEDIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.LIFE SUPPORTDiodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:A. Life support devices or systems are devices or systems which:1. are intended to implant into the body, or2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabeling can be reasonably expected to result in significant injury to the user.B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause thefailure of the life support device or to affect its safety or effectiveness.Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.Copyright © 2012, Diodes Incorporated分销商库存信息: DIODES2N7002K-7。
西门子 Smart 700、Smart 1000 Smart Line 精彩系列面板 说明书
Smart Line 精彩系列面板Smart 700、Smart 1000操作手册SIMATIC HMIAnswers for industry.SIMATIC HMIHMI 设备Smart 700、Smart 1000 操作说明10/2010A5E03313397 前言Siemens AGIndustry SectorPostfach 48 4890026 NÜRNBERG德国A5E03313397 11/2010Copyright © Siemens AG 2010. 本公司保留技术更改的权利法律资讯警告提示系统为了您的人身安全以及避免财产损失，必须注意本手册中的提示。
人身安全的提示用一个警告三角表示，仅与财产损失有关的提示不带警告三角。
警告提示根据危险等级由高到低如下表示。
危险表示如果不采取相应的小心措施，将会导致死亡或者严重的人身伤害。
警告表示如果不采取相应的小心措施，可能导致死亡或者严重的人身伤害。
小心带有警告三角，表示如果不采取相应的小心措施，可能导致轻微的人身伤害。
小心不带警告三角，表示如果不采取相应的小心措施，可能导致财产损失。
注意表示如果不注意相应的提示，可能会出现不希望的结果或状态。
当出现多个危险等级的情况下，每次总是使用最高等级的警告提示。
如果在某个警告提示中带有警告可能导致人身伤害的警告三角，则可能在该警告提示中另外还附带有可能导致财产损失的警告。
合格的专业人员本文件所属的产品/系统只允许由符合各项工作要求的合格人员进行操作。
其操作必须遵照各自附带的文件说明，特别是其中的安全及警告提示。
由于具备相关培训及经验，合格人员可以察觉本产品/系统的风险，并避免可能的危险。
siemens 产品请注意下列说明：警告siemens 产品只允许用于目录和相关技术文件中规定的使用情况。
如果要使用其他公司的产品和组件，必须得到 siemens 推荐和允许。
正确的运输、储存、组装、装配、安装、调试、操作和维护是产品安全、正常运行的前提。
PowerFlex 700S Phase II Control Kit 安装指南说明书
Installation InstructionsPowerFlex 700S Phase II Control KitCatalog Numbers: 20D-P2-CKSx, 20D-P2-CKEx, 20D-DL2-CKSx, 20D-DL2-CKExTools That You Need•Wrench for M5 hex nuts •Phillips screwdriver for M3 screws •Standard (flat blade) screwdriver What You Need to Do T o install the PowerFlex® 700S Phase II Control Kit:•S tep 1: Remove power from the drive•Step 2: Remove covers from the Phase I control assembly•Step 3: Remove the Phase I control assembly•Step 4: Open the main cover•Step 5: Remove the Phase I cassette•Step 6: Install the Phase II cassette•Step 7: Document the revision change•Step 8: Reconnect I/O and CommunicationsATTENTION: To avoid an electric shock hazard, verify that the voltage on the bus capacitors has discharged before performing any work on the drive. Measure the DC bus voltage at the +DC & –DC terminals of the Power Terminal Block. Thevoltage must be zero.ATTENTION: HOT surfaces can cause severe burns. Do not touch the heatsink surface during operation of the drive. After disconnecting power, allow time forcooling.ATTENTION: This drive contains ESD (Electrostatic Discharge) sensitive parts and assemblies. Static control precautions are required when installing, testing, servicing or repairing this assembly. Component damage may result if ESD control procedures are not followed. If you are not familiar with static control procedures, reference Allen-Bradley® publication 8000-4.5.2, “Guarding Against Electrostatic Damage” or any other applicable ESD protection handbook.2Rockwell Automation Publication 20D-IN014B-EN-P - April 2017PowerFlex 700S Phase II Control KitStep 1: Removing Powerfrom the DriveATTENTION: To avoid an electric shock hazard, verify that the voltage on the bus capacitors has discharged before performing any work on the drive. Measure the DC bus voltage at the +DC & –DC terminals of the Power Terminal Block. The voltage must be zero.Remove power before making or breaking cable connections. When you remove or insert a cable connector with power applied, an electrical arc may occur. An electrical arc can cause personal injury or property damage by:•sending an erroneous signal to your system’s field devices, causing unintended machine motion •causing an explosion in a hazardous environment Electrical arcing causes excessive wear to contacts on both the module and its mating connector. Worn contacts may create electrical resistance.PowerFlex 700S Phase II Control KitStep 2: Removing the CoversTask DescriptionLoosen captive screwPush down on front coverPull front cover away from assemblyPull side cover forwardLift side cover off control assemblyThe actual product image may differ slightly, depending on whether the drive is equipped with a slim or expanded cassette.Rockwell Automation Publication 20D-IN014B-EN-P - April 20173PowerFlex 700S Phase II Control KitStep 3: Removing the Control AssemblyStep 4: Opening the Main Cover Task DescriptionUnplug I/O and SynchLink™ cables from the main control board, unplug feedback wiring from FeedbackOption card, and unplug communication cables from DriveLogix™ controllerUnplug ribbon cableRemove three M5 nutsRemove control assemblyAAAAIf the drive is panel-mounted,you may remove it from theback mounting plate at thisstage, but it is not necessary.Mounting the drive without themounting plate requires newmounting holes on the panel.Frames 1-4Locate the slot in the upper left corner. Slide the lockingtab up and swing the cover open. Special hinges allowcover to move away from drive and lay on top ofadjacent drive (if present).Frame 5Slide the locking tab up, loosen the right-hand coverscrew and remove.Frame 6Loosen two screws at bottom of drive cover. Carefullyslide bottom cover down and out. Loosen the twoscrews at top of cover and remove.4Rockwell Automation Publication 20D-IN014B-EN-P - April 2017PowerFlex 700S Phase II Control Kit Step 5: Removing theCassette Task DescriptionDisconnect the two cable connectorsLoosen the two screw latchesSlide the cassette outRockwell Automation Publication 20D-IN014B-EN-P - April 20175PowerFlex 700S Phase II Control KitStep 6: Installing the Phase II CassetteStep 7: Documenting Revision Changes Document drive revisions on the “Field Installed Options” tag. Use the blank line.Task DescriptionInsert the cassetteTighten screws on face of cassette (7-10 lb.-in.)Connect the cables to the main board6Rockwell Automation Publication 20D-IN014B-EN-P - April 2017PowerFlex 700S Phase II Control KitStep 8: Reconnecting I/O and CommunicationsIf you are converting from Phase I to Phase II, refer to the PowerFlex 700S AC Drive Conversion Guide, Phase I to Phase II Control, publication 20D-AT001, for information about reconnecting I/O wiring. This publication also contains information regarding the compatibility of older feedback and communications options with the Phase II drive.Feedback option cards from drives with Phase I control are not compatible with drives with Phase II control.DPI™ communication adapters and NetLinx communication daughtercards from drives with Phase I control are compatible with drives with Phase II control.If you are replacing Phase II to Phase II, reconnect the I/O wiring, and replace the DPI communication adapter, if applicable.Rockwell Automation Publication 20D-IN014B-EN-P - April 20177PowerFlex 700S Phase II Control KitPublication 20D-IN014B-EN-P - April 2017P/N 422744Supersedes Publication 20D-IN014A-EN-P - July 2004Copyright © 2017 Rockwell Automation, Inc. All rights reserved. Printed in the U.S.A.Allen-Bradley, DPI, DriveLogix, PowerFlex, Rockwell Software, Rockwell Automation, and SynchLink are trademarks of Rockwell Automation, Inc.EtherNet/IP is a trademark of ODVA, Inc.Trademarks not belonging to Rockwell Automation are property of their respective companies.Rockwell Automation maintains current product environmental information on its website at /rockwellautomation/about-us/sustainability-ethics/product-environmental-compliance.page .Additional Resources These documents contain additional information concerning related productsfrom Rockwell Automation.Y ou can view or download publications at /literature/. T o order paper copies oftechnical documentation, contact your local Allen-Bradley distributor orRockwell Automation sales representative.ResourceDescription PowerFlex 700S High Performance AC Drive – Phase IIControl Programming Manual, publication 20D-PM001Provides the information that is needed to start up, program, and troubleshoot PowerFlex 700S high performance AC drives with Phase II control.Stegmann Feedback Option Board for PowerFlex 700SDrives Installation Instructions,publication 20D-IN001Provides installation instructions for the Stegmann feedback option board.Resolver Feedback Option Card for PowerFlex 700SDrives Installation Instructions, publication20D-IN002Provides installation instructions for the Resolver feedback option card.Multi-Device Interface Option Board for PowerFlex 700S Drives Installation Instructions,publication 20D-IN004Provides installation instructions for the Multi-deviceInterface option board.Second Encoder Option Card for PowerFlex 700S Driveswith Phase II Control Installation Instructions,publication 20D-IN009Provides installation instructions for the Second Encoder option card.SynchLink Board for PowerFlex 700S Drives with PhaseII Control Installation Instructions, publication 20D-IN010Provides installation instructions for the SynchLink option card.Embedded EtherNet/IP Option Card for DriveLogix 5730 Controllers Installation Instructions,publication 20D-IN012Provides installation instructions for the EmbeddedEtherNet/IP option card for DriveLogix5730 controllers.Logix Expansion Board for DriveLogix5730 InstallationInstructions, publication 20D-IN013Provides installation instructions for the Logix expansion board for DriveLogix5730.Heidenhain Feedback Option Card for PowerFlex 700SPhase II Drives Installation Instructions,publication 20D-IN017Provides information on how to install the Heidenhain feedback option card Product Certifications website, Provides declarations of conformity, certificates, and othercertification details.。
SilverStone DECATHLON OP700 700W 电源说明书
SPECIFICATIONSilverStone DECATHLON OP700Switching Power SupplyWith Active PFC PS/2 700W1. GeneralThis is the specification of Model OP700; it is intended to describe the functions and performance of the subject power supply. This PS/2 700 watts switching power supply with Active PFC (Power Factor Correction) capability, meets EN61000-3-2 and equips Full Range Input features.2. AC Input Specifications2-1. AC Input Voltage, Frequency and Current ( Rating: 100V-240Vac, 47-63Hz, 10-5A )The power supply must operate within all specified limits over the input voltage range in Table 1.Harmonics distortion of up to 10% THD must not cause the power supply to go out of specified limits.Table 1 - AC Input Voltage and Frequency2-2. AC Inrush CurrentThe power supply must meets inrush requirements of any rated AC voltage, during turn on at any phase of voltage, during a single cycle AC dropout condition, during repetitive On/Off cycling of AC, and over the specified temperature range. The peak inrush current shall be less than the rating of its critical components (including input fuse, bulk rectifiers, and surge limiting device).2-3. Input Power Factor Correction ( Active PFC)The power factor at full load shall be 0.99 at nominal input voltage.2-4. Input Current HarmonicsWhen the power supply is operated in 90-264Vac of Sec. 2.1, the input harmonic currentdrawn on the power line shall not exceed the limits set by EN61000-3-2 class "D"standards. The power supply shall incorporate universal power input with active power factor correction.2-5. AC Line DropoutAn AC line dropout of 17mS or less shall not cause any tripping of control signals or protection circuits. If the AC dropout lasts longer than 17mS the power supply should recover and meet all turn on requirements. The power supply shall meet the regulation requirement over all rated AC voltages, frequencies, and output loading conditions. Any dropout of the AC line shall not cause damage to the power supply. An AC line dropout is defined as a drop in AC line to 0VAC at any phase of the AC line for any length of time.01＜－OLYMPIA OP700023. DC Output Specification3-1. Output Current / LoadingThe following tables define two power and current rating. The power supply shall meet both static and dynamic voltage regulation requirements for minimum load condition.Table 5 - Output Loads Range 1 Note Maximum continuous total DC output power should not exceed 700W.3-2. DC Voltage Regulation, Ripple and NoiseThe power supply output voltages must stay within the following voltage limits whenoperating at steady state and dynamic loading conditions. All outputs are measured with reference to the return remote sense (ReturnS) signal. The +5V,+3.3V, +12V, -12V and +5VSB outputs are measure at the power supply connectors references to ReturnS. The +5V and +3.3V is measured at its remote sense signal (+5VS, +3.3VS) located at the signal connector.Table 7 - Regulation, ripple and noise.Ripple and Noise shall be measured using the following methods:a) Measurements made differentially to eliminate common-mode noiseb) Ground lead length of oscilloscope probe shall be 0.25 inch.c) Measurements made where the cable connectors attach to the load.d) Outputs bypassed at the point of measurement with a parallel combination of 10uF tantalum capacitor in parallel with a 0.1uF ceramic capacitors.e) Oscilloscope bandwidth of 0 Hz to 20MHz.f ) Measurements measured at locations where remote sense wires are connected.g) Regulation tolerance shall include temperature change, warm up drift and dynamic load3-3. Timing RequirementsThese are the timing requirements for the power assembly operation. The outputvoltages must rise from 10% to within regulation limits (T vout_rise ) within 5 to 70mS. The +5V, +3.3V and +12V output voltages should start to rise at about the same time. All outputs must rise monotonically. The +5V output needs to be greater than the +3.3V output during any point of the voltage rise. The +5V output must never be greater than the +3.3V output by more than 2.25V. Each output voltage shall reach regulation within 50 mS (T vout_on ) of each other during turn on of the power supply. Each output voltage shall fall out of regulation within 400 mS (T vout_off ) of each other during turn off. Figure 1 and figure 2 show the turn On and turn Off timing requirement. In Figure 2, the timing is shown with both AC and PSON# controlling the On/Off of the power supply.＜－Table 11 - Turn On/Off Timing 03OLYMPIA OP700Figure 2 : Turn On/Off Timing3-4. Remote On/Off Control : PSON#The PSON# signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +5V, +3.3V, +12V and -12V power rails. Whenthis signal is not pulled low by the system, or left open, the outputs (except the+5VSB and V bias) turn off. This signal is pulled to a standby voltage by a pull-upresistor internal to the power supply.Table 13 - PWOK Signal Characteristic3-5. EfficiencyThe efficiency is specified at 50% and 20% loading conditions to help reduce system power consumption at typical system loading conditions.3-6. +5VSB (Standby)The +5VSB output is always on (+5V Standby) when AC power is applied and power switch is turned on.The +5VSB line is capable of delivering at a maximum of 3A for PC board circuit tooperate.044. ProtectionProtection circuits inside the power supply shall cause only the power supply's mainoutputs to shutdown. If the power supply latches off due to a protection circuit tripping,either a AC cycle OFF for 15 sec, or PSON# cycle HIGH for 1 sec must be able to restart the power supply.4-1. Over Current ProtectionThis power supply shall have current limit to prevent the +5V, +3.3V, and +12Voutputs from exceeding the values shown in table 14. The current limit shall not tripunder maximum continuous load or peak loading as described in Table 5. The powersupply shall latch off if the current exceeds the limit. The latch shall be cleared bytoggling the PSON# signal or by cycling the AC power. The power supply shall notbe damaged from repeated power cycling in this condition. The -12V and +5VSBoutputs shall be shorted circuit protected so that no damage can occur to the powersupply.Table 14 -Over Current protection4-2. Over Voltage ProtectionThe power supply shall shut down in a latch off mode when the output voltageexceeds the over voltagelimit shown in Table 4.Table 15 -Over Voltage protection.4-3. Short Circuit ProtectionThe power supply shall shut down in a latch off mode when the output voltage isshort circuit.5. Environmental Requirements5-1. Temperature05OLYMPIA OP700 5-2. Humidity6. Agency Requirements6-1. Safety Certification.Table 16 -Safety Certification6-2. AC Input Leakage CurrentInput leakage current from line to ground will be less than 3.5mA rms. Measurementwill be made at 240 VAC and 60Hz.7. Reliability7-1. Mean Time Between Failures (MTBF)The MTBF of the power supply shall be calculated utilizing the Part-Stress Analysismethod of MIL217F or Bell core RPP. The calculated MTBF of the power supplyshall be greater than 100,000 hours under the following conditions:Full rated load120V AC inputGround Benign25℃7-2 WarrantyThree (3) years manufacture's warranty.Technical information in this specification is subject to change without notice.The revision of specification will be marked on the cover.068. Connections8-1. AC Input ConnectorThe AC input connector shall be an IEC 320 C-14 power inlet. This inlet is rated for15 A/250 VAC.8-2. DC Wire Harness and Connector Requirements(Subject to change without notice; please see appendix: wireharness drawing)P1: Motherboard Power ConnectorConnector housing: 24- Pin Molex 5557 (No.39-01-2240) or EquivalentContact: Molex 5556T (No.44476-1111) or Equivalent07OLYMPIA OP700P2: Processor Power Connector (sectional connector 4-Pin + 4-Pin)Connector housing: 8- Pin Molex 5557 (39-01-2080) or EquivalentContact: Molex 5556T (39-00-0059) or Equivalent4-Pin HDD / CD-ROM Drive Power ConnectorsConnector housing: 4- Pin AMP: 1-480424-0 or Molex 8981-04P or EquivalentContact: Amp 61314-1 or EquivalentSmall 4-Pin : Floppy Disk Drive Power ConnectorsConnector housing: 4- Pin AMP: 171822-4 or Equivalent08Serial ATA Power ConnectorThis is a required connector for systems with serial ATA devices.Molex Housing #675820000 or EquivalentMolex Terminal #67510000 or EquivalentWorkstation Power Connector for High Power Graphics CardsFor workstationFor workstation systems with high-powered graphics cards an additional powerconnector to the baseboard may be needed. This connector supplies additional +12Vpower for the higher power level graphics cards used in workstation applications.Connector housing: 6-pin Molex 45559-0002 or equivalentContacts: Molex 39-00-0207 or equivalentPCI-Express 6-PinPCI-Express 8-Pin09OLYMPIA OP700109. Physical Characteristics Size9.1 Power Supply Dimension: 150 mm(W) x 86 mm(H) x 150 mm(D)Mechanical drawing: Please refer to the attached sketch.。
LG Digital Signage Contents Player MP700 用户指南说明书
OWNER’S MANUALDIGITAL SIGNAGE CONTENTS PLAYER (Hardware)DIGITAL SIGNAGE CONTENTS PLAYER MP700Please read this manual carefully before operatingthe product and retain it for future reference.TABLE OF CONTENTSReplacing Flash Memory Battery (3)Specifications (4)General Specifications (4)Multi I/O Port (4)Operational Specifications (4)Included in the Box (5)Basic Components (5)Optional Items (5)Connections (6)Front Panel (6)Back Panel (6)Monitor Integration (7)**WS50 Model (7)**WX50MF Model (8)84WS70MS Model (9)In/Out Cable Connection (10)DP to HDMI dongle product list (10)Connecting a Monitor with an RGB Cable (11)Connecting a Monitor with DP(DisplayPort) Cable (13)Connection to Multiple Monitors (17)Frequently Asked Questions (FAQs) (18)Unified Codecs (21)Network Setting (21)23Replacing Flash Memory BatteryThe flash memory battery helps maintain the system (BIOS) settings when the computer is powered off. The flash memory battery is a consumable part.Flash Memory Battery4Resolution Recommended Resolution DP with HBR2: 3840 x 2160 @ 30 Hz DP: 1920 x 1080 @ 60 Hz RGB: 1920 x 1080 @ 60 Hz PowerPower Rating 100-240 V~ 50/60 Hz 1.3 AOperating ConditionSync (H/V)Video LED Normal Mode On/On Active On Deep Sleep Mode (Set = Off)Off/Off Off Off Environmental ConditionsOperating Conditions 5 ℃ to 40 ℃Humidity 10 % to 80 %Storage Conditions-20 ℃ to 60 ℃Humidity5 % to 95 %Operational SpecificationsMulti I/O PortSerial Port One external RS-232C Serial port USB Port USB 2.0 port (x2), USB 3.0 port (x1)LAN Port Intel® 82579 Gigabit Ethernet RGB x1 / DP x4x2 for UHD which is printed with 'HBR2'Mini PCIe Supported LINE OUTSupported6Connections**WX50MF ModelFor proper use, it is recommended to use the basic components provided with the MP700 to attach it to a monitor.In/Out Cable ConnectionTo view images on the monitor that is not connected to the monitor docking port of MP700, you need to con-nect the MP700 to the monitor via an RGB or DP Cable.DP to HDMI dongle product listAs the MP700 does not have an HDMI output port, the DP to HDMI converting dongle that supports UHD output should be used if 4K UHD HDMI output is required. Below are the DP to HDMI dongle vendor/product lists. The sale of the products varies depending on the circumstances of each relevant vendor.● BizLink: KS10047● Wieson Technologies: G9857C219-026-H10Connecting a Monitor with an RGB CableRGB connections does not allow analog video and audio signals to be transferred with one cable. RGB cable connections require an additional audio in cable.Connecting a Monitor with DP(DisplayPort) Cable Attention15Connecting/Disconnecting DP(DisplayPort) Audio Device in Windows Embedded Standard 7P16Connection to Multiple MonitorsConnect the RS-232C Out port of the MP700 to the RS-232C In port of the first monitor (SET ID 1).Connect rest of the monitors using a RS-232C cable. (Be careful about input and output ports.)Multiple monitors can be connected to a single MP700. (The maximum number of monitors connected varies depending on the monitor type.) You can set the tile mode by connecting multiple monitors.( SET ID Max )MP700RS232C Cable( SET ID Max )**WS50**WX50MF181920Unified CodecsYou need to install codecs required to play videos. Video files may require different codecs for playing. Web-sites to download unified codecs are listed below:···Network SettingAs there are various network connection methods, please follow the specifications of your carrier or those of your Internet service provider.1. If you cannot connect to the network, check the following.a. Check whether the network connection tray icon is displayed as shown below.If it is not displayed as above, it indicates that the network cable is not connected correctly or that there is a problem with your network system. In this case, check the network cable connection or contact your network system administrator.b.I f you cannot connect to the network even though the tray icon is correctly displayed, make sure that the IP isset correctly by following the procedure below.● Click the Start buttonv Control Panel Network and Internet Network and Sharing Center and then onthe left menu, click "Change adapter settings".21● Right-click the Local Area Connection icon to open a pop-up menu and go to the "Properties" menu.● In the Properties pop-up, select "Internet Protocol Version 4 (TCP/IPv4)" and double-click it.● Check that the IP is set to "Fixed IP" in the IP settings window.● If IP is set to "Fixed IP", change it to the DHCP setting (Automatic) and re-check the network connection.2. The hub (router/switch) connection may be configured as described below.a. Turn the router power on.b. Connect the router port (excluding the WAN port) and the network port of the MP700 using a network cable.c. As in step "a" of item 1, check if the tray icon is displayed correctly. If it is not displayed correctly, go through thewhole procedure in item 1 to check your network settings.d. If you wish to connect to an external network, connect the external network cable to the WAN port.22Make sure to read the Important Precautions before using the product.Keep the User’s Guide(CD) in an accessible place for furture reference.The model and serial number of the SET is located on the back and one side of the SET. Record it below should you ever need service.WARNING - This is a class A product. In a dome stic e nvironme nt this product may cause radio inte rfe re nce in which case the use r may be re quire d to take ade quate measures.MODEL SERIAL T emporary noise is normal when poweringON or OFF this device.。