半导体工厂使用的化学品清单

Chemical UseStandard Operating Procedure1.0PurposeThis document provides detailed instructions on chemical use at the wet benches at WashingtonTechnology Center.2.0Equipment and Materials2.1Equipment2.1.1Wet bench2.1.2Spin rinse dryer2.1.3Face shield2.1.4Apron2.1.5Chemical gloves2.1.6Timer2.1.7Tweezers2.1.8Teflon cassettes2.1.9Teflon cassette handles2.1.10Teflon single wafer holders2.2ChemicalsThe chemicals available in the lab are as followsName Composition Purpose Acetic acid 100% acetic acid Wafer cleanAcetone 99-100%acetone SolventAluminum etch 71-73% Phosphoric acid5-15% water9-11% nitric acid1-3% acetic acidEtch aluminumAmmonium fluoride 40% ammonium fluoride60% waterOxide etchAmmonium hydroxide 29% ammonium hydroxidewaterWafer cleanAZ300T 4% Tetramethylammonium hydroxide41% N-methylpyrrolidone, NMP, 1-methyl-2-pyrrolidinone55% Propylene glycol, 1, 2-propane-diolremove photoresistAZ 351 <10% sodium borates>90% water Developer for 1512 and 1518AZ 400K <15% Potassium borates>85% water Developer for 4620 and 9260AZ 1512 75% 1-methoxy-2-propanol acetate Thin Photoresist<25% Cresol novolak resin<10% diazonapthoquinonesulfoniestersAZ 1518 71% 1-methoxy-2-propanol acetate<30% Cresol novolak resin<10% diazonapthoquinonesulfoniestersThin (~2um) PhotoresistAZ 4620 62% 1-methoxy-2-propanol acetate<35% Cresol novolak resin<5% diazonaphthoquinonesulfoniestersThick photoresistAZ 9260 57% 1-methoxy-2-propanol acetate<40% Cresol-novolak resin<5% DiazonaphthoquinonesulfonicestersThick photoresist10:1 BOE 40% ammonium fluoride5% hydrogen fluoride55% water0.2% surfactantetch oxideChromium etch (TFD) 5-10% Ceric Sulfate5-10% Nitric Acid1-5% Sulfuric Acid75-89% WaterEtch chromiumCopper etch (Type 100/200) 30% ferric chloride3-4% hydrochloric acidwaterEtch copperEKC 830 50-60% 2-(2-Aminoethoxy) Ethanol40-50% N-Methyl PyrrolidoneRemove photoresistFuturrex 2.27% tetramethyl ammoniumhydroxidewaterNegative resist developerGold Etch (TFA) 1-10% iodine complex20-40% potassium iodide50-79% waterEtch goldHMDS 100% Hexamethyl disilazane Adhesion promoter Hydrocholoric acid 37% hydrogen chloridewaterremove metalsHydrofluoric acid 49% HFwateretch oxide, nitrideHydrogen peroxide 30% hydrogen peroxidewaterOxidizerIsopropyl alcohol 100% 2-propanol solventNanostrip 90% sulfuric acid5% peroxymonosulfuric acid<1% hydrogen proxideRemoves organics, metals Nickel etch TFB 10 to 20% nitric acid Electroless plating<1% Potassium PerfluoroalkylSulfonate80 to 90% waterNitric acid 70% nitric acid etchantP-20 20% Hexamethyl disilazane80% 1-methoxy-2-propyl acetateAdhesion promoterPad etch 1 31-35% acetic acid12-16% ammonium fluoride51-55% waterOxide etchPad etch 4 30-34% acetic acid11-15% ammonium fluoride4-8% glycol47-51% waterOxide etchPalladium Etch (TFP) 30% ferric chloride3-4% hydrogen chloride66-67% water**this is the same as copper etch 100*Etch palladiumPhosphoric acid 74-95%waterEtch nitridePolyimide Coating 30-60% n-methyl-2-pyrollidone5-10% tetraethylene glycol diacrylate30-60% photosensitive polimide resin1-5% proprietary ingredientsPlanarization “oxide”Polyimide Developer (HD Microsystems) >60% cyclohexanone30-40% 4-butyrolactoneDeveloperPolyimide Rinse 10-30% cyclohexanone>60% butyl acetaterinsePotassium hydroxide 45% potassium hydroxidewater Etch silicon with nitride maskQZ3501 polyimide developer 60-80% dihydrofuranone20-40% butyl acetatedeveloperR19180 polyimide developer 10-30% cyclohexanone>60% butyl acetatedeveloperRD6 Negative Resist Developer 97-98% water2-3% tetramethyl ammoniumhydroxidedeveloperSilver Etch (TFS) 3-10% iodine complex18-42% potassium iodide48-79% waterEtch silverSPR 220 30-52% Ethyl lactate15-25% anisole1-10% diazo photoactive compound14-40% Cresol Novolak Resin1-5% 2-Methyl Butyl Acetate2-7% n-amyl acetateThick resistSTR 1075 48-53% Ethyl lactate1-5% n-butyl acetate1-10% diazo photoactive compound30-40% Cresol Novolak Resin1-5% xylene<1% organic siloxane surfactantThick resistSU8 developer 100% methoxy-2propyl acetate developerSulfuric acid 98% sulfuric acid remove organics, metalsSylgard silicone elastomer curing agent 59% Dimethyl, methyl hydrogensiloxane13% Dimethyl vinylated andtrimethylated silicaCuring agentXP SU-8 10 40-45% Gamma butyrolactone55-60% Mixed triarylsulfonium/hexafluoroantimonate saltNegative photoresistXP SU-8 developer 98-100% 1-methoxy-2-propyl acetate DeveloperTMAH 25% tetramethylammonium hydroxide75% waterAnisotropic etch3.0SafetyA buddy system applies to the use of chemicals after normal working hours: anotherknowledgeable user should be in the clean room, aware of your situation, and closeenough to be of assistance if you have an accident.3.1 Heat3.1.1 Hot plates used for heating chemicals must be attended. You must be in the cleanroom and near the hot plate when it is on.3.1.2Check that each container you use on a hotplate is approved for hotplate use.3.1.3 The wafer baking hot plates are not to be used with chemicals.3.2 Chemical Vapor3.2.1 When working with chemicals, always use the vented chemical hoods.3.2.2 Wear appropriate personal protective equipment.3.2.3 Keep your head above the Plexiglas especially when mixing, pouring, andheating.3.2.4 Pour only approved chemical mixtures.3.2.5 If you can smell chemicals while you are processing wafers, find out why. Youmay have chemicals on your lab coat or gloves. Fresh gloves are available on topof the resist cabinet. Fresh lab coats are available in the gowning room. Theremay also be contaminated trash in the unvented waste basket. Be sure to worktoward the back of the fume hood. Clean the outside of bottles thoroughly, beforeputting them back in the chemical cabinet.3.3 Fire3.3.1 When working with chemicals, always use the vented chemical hoods.3.3.2 Check chemical flashpoints before heating. Do not heat chemicals to temperaturesnear their flashpoints. Do not heat solvents above 120 degrees C.3.3.3 Chemicals on hotplates must be attended.3.3.4 Be particularly careful with solvents like acetone around heat sources or oxidizers(peroxide or nitric acid).3.4 Contact burns3.4.1 Wear appropriate personal protective equipment.3.4.2 Keep work area clean and dry.3.4.3 Add acid to water. Do not add water to acid.3.4.4 Add peroxide to sulphuric, when pouring pirahna.3.4.5 Pour only approved chemical mixtures.3.5 Reproductive effectsUsers who are pregnant should discuss laboratory use with the lab manager assoon as possible. This need not severely restrict laboratory use but shouldnonetheless be discussed (see MSDS of photoresist). Be aware that there aremany different names for the same photoresist solvents4.0Supplies4.1Personal Protective EquipmentAprons, orange chemical resistant gloves, and face shields are available for use at thechemical hoods. Select an appropriate size orange glove. Check gloves for holes before each use; discard them if they have holes. Wear gloves to open cabinets, sign the log.Wash gloves when they become contaminated. Do not touch door knobs, notebooks,phone or microscope with gloves on. Wash and dry gloves when you are done; hangthem up on the rack. Wipe off aprons as needed and return them to the rack.4.2LabwareClean glassware and plastic ware are available for lab users. To prevent crosscontamination, many dishes are labeled. When you are done with your glassware, please empty it into the appropriate container, clean it, rinse three times, dry it and leave itupside down on the glassware shelf. Do not store WTC supplies on your own shelf.You may bring in your own labware labeled with your name; glassware not labeled with anyone’s name belongs to WTC.4.3ChemicalsThe lab stocks and supplies the chemicals commonly required for processing in thefacility. As we have limited storage, please get staff approval to store custom solutions.Mix only enough to use each day. In most cases, the shelf life of these chemicals is very short anyway. All special chemicals and solutions must be labeled with the arrival dateand the owner's name and phone number. Expired chemicals or chemicals older than 1year will be periodically disposed of.The exception is with photoresist, where each group may have a few private smallbottles of resist; these are kept in several small plastic boxes in the yellow vented cabinet next to the spinners. Before you decide to use your own bottles, consider that positiveresist has a very limited life at room temperature. Those people using the WTC bottlesare getting much fresher resist than those who use their own bottles to store a six-month supply. Please clean the outside of all resist bottles thoroughly after each use tominimize solvent odor in the resist cabinet.Working stocks of chemicals are kept in the chemical cabinets near each chemical area.Extra stock is kept in several chemical bunkers outside the lab. When a chemical hasbeen used up, write it on the white board in the gowning room, so staff can replenish the clean room stock from the bunker.4.4Emergency Response Equipment4.4.1Phone systemPhones are located at the entrance to the laboratory, as well as severalplaces within the laboratory. These are part of the university phonesystem. In an emergency, dial 9-911. You may request help for largechemical spills, accidents, medical emergencies, injuries, etc. For minoremergencies, staff contact information is available next to each phone.4.4.2Chemical spill cartSpill control pads are available on the spill cart for absorbing liquidchemical spills. Bottles of neutralization liquid are available for use onacid spills. Gloves, full protective coveralls, a squeegee, scoop pan,calcium gluconate gel and other useful items are located in or near thechemical spill cart. It is located in the grey area. A vacuum cleaner is alsoavailable for cleaning up powdered residue from neutralized chemicalspills.4.4.3Emergency showersEmergency showers and eye washes are located in each room of thelaboratory. Most chemical burns, particularly in the eyes, should bewashed for 15 minutes before seeking further medical attention.4.4.4First aid kitA first aid kit is available on the wall of the gowning room. Tubes ofcalcium gluconate gel are available at the HF wet bench and on thechemical spill cart for application to HF burns. This should be appliedpromptly, but is not a substitute for medical attention.5.0Operating Procedures5.1 Set up5.1.1 Get approval for any new chemicalIf your exact chemical is not currently in use in the lab, you must get approvalfrom the lab manager before bringing the chemical into the lab. You will beexpected to supply the appropriate MSDS, a reason why this chemical should beused in the lab, and an explanation of how it is compatible with lab usage.5.1.2 Read the MSDS for each chemical you plan to use.PPEappropriate5.1.3 SelectSafety glasses should be worn at all times in the laboratory. When pouringchemicals, wear face shield, orange gloves, acid apron. When moving wafersfrom acids to dump rinsers, operators should wear orange gloves and acid apron.stationappropriate5.1.4 SelectAcids are used at wet bench #3. Bases and acids are used at wet benches #4Solvents may only be used at the solvent station (bench #12) and resist coatingstations, never at the acid station. Log in to workbench as necessary.5.1.5 Decide whether it is necessary for you to pour your own chemicals, or whetheryou can safely use chemicals maintained by staff for lab users. In general, it issafer to use lab solutions than to pour your own. If you are concerned about theage of the solution or potential cross-contamination, you may be able to scheduleyour work, so that you use the lab chemicals immediately after they are poured(every two weeks). If you see obvious contamination in the chemical, notify labstaff, so that fresh chemicals can be poured.5.1.6 Select appropriate containerSelect a dish labeled with the specific chemical name you will be using. Do notput chemicals in a dish that is labeled with another chemical name. If there is nodish for your chemical, use an unlabeled, compatible dish. To conserve onchemicals, select the smallest dish that is appropriate for the job. Do not pour HFinto glass or metal dishes. Dishes for heated solutions must be hotplate-compatible.5.1.7 Label containerLabel dish with a Sharpie (your name, chemical name, concentration, date, andphone number)5.1.8Select chemical bottleWhen selecting a bottle to pour, finish any open bottles before opening new ones.Be sure the concentration of the chemical is correct.5.1.9Pour solutionPour solutions in a vented hood. Add acid to water. Wipe residue from outside ofbottle. Replace chemical bottles in the appropriate place in the cabinet. Coverany chemical not immediately in use.5.1.10 Wash bottles that you have emptied.Cross out the label on any chemical bottle you have emptied, rinse three times,and write “rinsed” with a Sharpie at the top of the bottle. Place rinsed bottles onthe bottom shelf of the waste chemical cabinet.5.1.11 Prepare hotplateHot plate controllers are located above the Plexiglass shield. Set temperature. Putchemical solution on the hotplate. Use an appropriate thermometer to monitor thetemperature. Do not leave the lab when the hotplate is on.5.2 Dip—Acid or Base5.2.1 Select appropriate sample holderParts to be dipped in chemicals should be in a holder. When immersing wafers inchemicals, 3” and 4” Teflon cassettes are available. Attach a Teflon handle to thecassettes. Single wafer Teflon carriers can also be used. For parts that are notwhole wafers, there are perforated Teflon ladles, as well as a small Teflon rack for tiny parts. Tweezers may be sufficient for immersing single wafers in a smallamount of developer, but are not appropriate for use in acids.5.2.2 Ensure proper PPEWhen moving wafers from acids to dump rinsers, operators should wear safetyglasses, orange gloves and an apron.5.2.3 Determine appropriate dip timeYou can determine proper time by checking in reference material, checkingprevious entries in the log book, or doing an etch rate check. To do an etch ratecheck, use a silicon wafer with the same film you are trying to etch. Measure film thickness with the Nanospec. Etch the wafer for a specified time (say, 1 minute).Then re-measure the wafer on the Nanospec. You can then calculate etch rate inAngstroms/minute. Calculate etch time by dividing film thickness on yoursample by etch rate.5.2.4 Dip sampleSet timer for the proper time, then start timer as you lower sample into thesolution. Do not sit down at the hood while processing wafers, as this positiondoes not protect your face from fume exposure.5.2.5 Remove sample from solution5.2.6 Place sample still in its container into dump rinser or cascade rinserControllers are located in the control panel above the Plexiglass. Set dump rinser for at least three cycles by pushing “cycle count” until the display reads thenumber of cycles you want (at least 3). Push “start.” When wafers are doneprocessing, push “stop,” and remove the wafers.Cascade rinser can be started by pushing “run.” When carrying wafers from onebench to another, put the wafer container in a tub to avoid dripping. If wafers areespecially fragile, you can manually rinse them in tubs of water. Use at least fivechanges of water.5.2.7 Dry sample in spin rinse dryer or under nitrogen gun.After a complete rinse, whole wafers can be put in the spin rinse dryer. Do notput unrinsed wafers in the spin rinse dryer. Substrates other than whole waferscan be dried with a nitrogen gun. Check the pressure coming out of the nitrogengun before using it on your substrate, as some have a gentle flow, and others areforceful. Fragile wafers can be dried in the vacuum oven located under theBranson barrel asher.5.3 Dip—solvent5.3.1 Use heated EKC830 and AZ 300T to strip positive photoresist. Temperatureshould be set at 75 degrees for the EKC and 90 degrees for the AZ300T.5.3.2 Allowed materials in this tank are silicon, quartz, aluminum, and positivephotoresist. Materials not allowed in this tank are water, negative photoresist andother polymers like polyimide. Water will form hydroxyls that will pit aluminum,creating a problem for some users.5.3.3 Typical strip times are 10 minutes in EKC, and 10 minutes in AZ300T.5.3.4 If you would like to use EKC, but your wafer has a material not allowed, you maypour up your own batch in a separate container, but you may not use the generaltank.5.3.5 Be sure to use Teflon cassettes.5.3.6 Bring a tub of plain water over to the station to use to carry your wafers to thedump rinser.5.4 Clean up5.4.1 Squirt wet deck with DI water, and wipe down with squeegee, then towel5.4.2 Dispose of solutionPlease dispose of chemicals as soon as you are finished. Chemicals left in thehood for more than 24 hours are subject to disposal. Hot or reacting mixtures maybe left a reasonable amount of time to settle down.5.4.2.1 Aspirate acids and basesAspirator is located in the Microvision wet bench. Put the aspirator tubein the solution, and step on the pedal on the floor. Aspirator will suck upchemical into the acid neutralization system. Do NOT aspirate solvents,as they are an explosion hazard in the acid neutralization system.5.4.2.2 Put solvents in designated carboysPut the carboy in the dishwashing sink, or the vented chemical cabinet topour. Use a funnel. Wipe sides of container. Return it to the properstorage area. The acetone/IPA waste is located on the bottom shelf of theyellow, ventilated cabinet next to the spinners.5.4.2.3 Put other chemicals into labeled containers in waste chemical storage.5.4.2.3.1.1Using the bottle labeled for your chemical.Carry the waste bottle to the appropriate sink, and use afunnel to transfer your waste. Leave two inches at the topfor thermal expansion, and put the cap on. Do not put solidcaps on any bottle containing hydrogen peroxide (H2O2). Itcontinues to decompose for months and must be stored in avented container. Wash any residue from the outside of thecontainer. Return waste container to the waste cabinet. Ifyou have filled the existing waste bottle, make a new one.5.4.2.3.1.2Making a new waste chemical bottle.If there is no bottle with the proper chemical name, get aclean, dry bottle from the bottom shelf of the chemical wastecabinet, get an EH&S label, and label the bottle properly. Besure that the bottle type is compatible with the chemical youare disposing; if in doubt, ask! Chemicals left withoutproperly labeling will be assayed by Environmental Healthand Safety, and your budget number will be billed.5.4.2.4 Do not pour anything except rinse water and AZ developer down thedrain.5.4.3 Wash and dry lab ware and return it to the proper shelf5.4.4 Final checkRemove beakers, towels, chemical and liquid residue from the wet decks. Thework surface should be clean and dry when you leave.5.5 Accidents5.5.1 Spills5.5.1.1 You are primarily responsible for cleaning up any minor chemical spillyou cause, using safe and approved procedures. Do not dispose ofcontaminated rags and broken chemically laden glass in the normal wastebaskets. You should rinse the waste articles and bag them. Bags arelocated in the gowning room in the large cabinet. Label the bags, leavethem in a ventilated area and seek assistance from a staff member onfurther disposal.5.5.1.2 Request assistance from staff for any significant spill. We will assist you,using the materials on the chemical spill cart located in the grey area nextto the tool box, which has supplies like tape to block off spill area, spillcontrol pads, and neutralizers.5.5.2.3 For major chemical spills and for any unanticipated chemical reaction,evacuate the area, and call the staff. You must remain available to provideinformation. Any user may call for an evacuation of the laboratory at anytime. These "requests" must be honored by all users until such time as thesituation is evaluated. Alternatively, you may evacuate the laboratoryusing the fire alarm in justified instances. You must first exit thelaboratory to find an alarm pull box next to the building exits.5.5.3.4 Significant events must be reported in writing, so that corrective actioncan be taken to prevent future problems, on a time scale appropriate to theseverity of the event.5.5.2 Chemical Exposure5.5.2.1 Flush affected area immediately with large quantities of water for at leastfifteen minutes. Use the sink, the safety shower, or the eyewash station asappropriate.5.5.2.2 Remove any contaminated clothing immediately.5.5.2.3 For HF exposures only, after flushing the area for a couple of minutes withwater, spread affected area liberally with calcium gluconate gel, located atthe HF wet bench and on the chemical spill cart. Wear clean gloves whenapplying the gel to prevent secondary HF burns to the hands.All HFburns, no matter how seemingly trivial, should be considered serious andproper medical treatment sought. Note: BOE is a dilute solution of HF.5.5.2.4 Minor medical treatment is available from Hall Health occupational healthand safety staff. Major medical treatment is available from HarborviewMedical Center. If you go for medical treatment, take the MSDS of therelevant chemicals from the gowning room to the medical staff to aid inprompt, appropriate medical treatment. Paramedic services are availableby dialing 9-911 from the lab phone.5.5.2.5 Notify lab staff immediately about any chemical exposures, and providewritten documentation as necessary, so that proper follow up can be done.6.0 Chemical Mixtures Approved for Lab UseDo not mix solvents with acids (potentially flammable). Do not mix organicswith peroxides (potentially explosive). You may not arbitrarily mix chemicalstogether. Only specifically approved solutions can be made. Solutions not on thischart should be checked with the lab manager.Name CompositionTemperature(°C)Removes Silicon etch 6parts acetic acid19 parts nitric acid1 part hydrofluoricacidRoom temperature siliconPiranha 4 part sulphuric acid1 parts hydrogenperoxide Reaction isexothermic will raisetemp to 110-140°organicsSC1 1 part ammoniumhydroxide1 parts hydrogenperoxide5 parts DI water 70 particles,organics(Makes surfacehydrophilic)SC2 1 part hydrochloricacid1 part Hydrogenperoxide5 parts DI water70 metallicsAqua regia 3.896 parts HCl(37%)1 part nitric acid(70%) etchesgold,platinumTitanium etch 20 parts DI water1 part H2O21 part HFRoom Temp Etches titanium7.0 Processes Approved for Lab Use7.0.1Prefurnace clean: Nanostrip (5 min), BOE (10 sec), SCI (5 min) and SC2 (5 min)8.0RevisionsRevision Initials Date PurposeA ACT 8/28/2003 format, waste chemical procedure, chemical contents,mixtures, revisionsB ACT 1/20/2004 Add wet strip criteriaC MEH 8/31/2005 Updated chemical list。