JANTXV2N6796U中文资料

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2N6661JANTX中文资料

2N6661JANTX中文资料

2N6661JAN/JANTX/JANTXVVishay SiliconixDocument Number: 70225 S-04279—Rev. B, 11-1JAN Qualified N-Channel 90-V (D-S) MOSFETsFEATURES BENEFITS APPLICATIONSD Military QualifiedD Low On-Resistance: 3.6 WD Low Threshold: 1.6 VD Low Input Capacitance: 35 pF D Fast Switching Speed: 6 ns D Low Input and Output Leakage D Guaranteed ReliabilityDLow Offset VoltageD Low-Voltage OperationD Easily Driven Without BufferD High-Speed CircuitsD Low Error VoltageD Military ApplicationsD Direct Logic-Level Interface: TTL/CMOSD Drivers: Relays, Solenoids, Lamps, Hammers,Displays, Memories, Transistors, etc.D Battery Operated SystemsD Solid-State RelaysTO-205AD(TO-39)Top ViewDevice MarkingSide ViewJAN2N6661*“S” fllxxyy“S” = Siliconix Logof = Factory Codell = Lot Traceabilityxxyy = Date Code*Note: or JANTX2N6661JANTXV2N6661Notesa.Pulse width limited by maximum junction temperature.b.Not required by Military Spec.2N6661JAN/JANTX/JANTXV Vishay Siliconix 11-2Document Number: 70225 S-04279—Rev. B, 16-Jul-01Notesa.For DESIGN AID ONLY, not subject to production testing.VNDQ09b.Pulse test: PW v300 m s duty cycle v2%.c.Switching time is essentially independent of operating temperature.d.For typical characteristics curves see the 2N6661/VN88AFD data sheet.Document Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。

Xvision X2R16N 16通道H.265 NVR产品说明书

Xvision X2R16N 16通道H.265 NVR产品说明书

X2R16N-12TB X2R16N-1TB X2R16N-2TB X2R16N-3TB X2R16N-4TB X2R16N-6TB X2R16N-8TBProfessional 16 Camera HD-IP 5MP H264 NVRX2R16NVersion 1Full HD 1080P Real-Time Recording Pentaplex OperationUSB/Network BackupHDMI & VGA Monitor Output16 PoE Ports for Direct ConnectionP2P Remote Access via Smartphone, Tablet, PC & MacPRO IPHDFeaturesThe Xvision X2R16N 16 Channel H.265 NVR o ers the very latest in digital recording. The unit can record up to 5 Megapixel Super High De nition images. It has an built-in 16-port PoE switch to allow simple direct connection to the cameras o ering either auto or manual allocation of IP addresses for the connected cameras.The NVR provides a full HD 1080P monitor output via VGA or HDMI and can be controlled from the front panel touch sensitive controls or by supplied remote control or USB mouse. The NVR uses P2P technology for quick, seamless Network connectivity and is supplied with a dedicated Smartphone/Tablet App that can also receive Push Video alerts, showing alarms detected by Video Motion Detection. The NVR has a simple back-up procedure via USB or Network and is fully ONVIF compliant. Technical Speci cationsBrand XVISION Model Number X2R16N IP Camera Support ONVIF, Xvision PRO-HD Compression H264 / H265Recording Resolution 1080P (1920x1080) / 720P (1280x720) / D1 (704x576) Recording Bandwidth200Mbps D1: 16 Channel Real-Time, 720P : 12 Channel Real-Time, 1080P : 6 Channel Real-Time Live/PlaybackVideo Output 1x HDMI, 1x VGA Bit Rate 32-8192kbps Recording ModeContinuous / Manual / Motion Detection / Sensor / Alarm Alarm Input / OutputAutomatic Electronic Shutter Display Resolution 1920x1080, 1280x1024, 1440x900, 1280x720, 1024x768Ethernet RJ45 Port (1000M)Mobile AppiPhone, iPad, Android, Tablet - XIQ Mobile CMS USB1x 3.0 USB for backup/upgrade, 2x 2.0 USB for Mouse Max. Hard Drive Supported 2x 6TB (12TB Total)Controls USB Mouse, Remote Control PoE Ports 16e-Sata Optional ONVIF ONVIF Version 2.0 Power Supply NVR : DC 20V 190W PoE Switch : DC48V Dimension (WxHxD) mm 380x50x340X2R16N8 CH Input / 1 CH Output All speci cations shown are subject to change without notice, please con rm up-to-date details when ordering. All network speci cations and recording times are based upon theoretical scenarios. Actual performances will vary depending on external factors. No liability will be accepted by Y3K for any errors or omissions in this information. All relevant trade marks acknowledged. © Y3K (Europe) Limited 2015DISTRIBUTED BY1/4/8/16Display SplitX2R16N-12TB X2R16N-1TB X2R16N-2TB X2R16N-3TB X2R16N-4TB X2R16N-6TB X2R16N-8TB。

集特海光系列

集特海光系列

■ 产品特点• 采用2U 19英寸标准机架式机箱• 双路国产申威3231处理器,高速DLI 总线互联, 双向峰值带宽为168.75GB/s 。

• 标准化BMC 模块:支持无缝更换升级模块; • 支持启动介质调整、SOL 、KVM 等功能; • 支持带外升级CPU 固件基于海光平台的单路服务器准系统,该系统 4U 高度,支持 1 颗海光 7100/7200系列 CPU ,最多支持 16 根内存。

本系统使用通用主板,主板名称 G2SERO-B ,可支持 24/36 个 SATA/SAS 硬盘,其中 24 盘位简称 4U24,36 盘位简称 4U36。

■ 应用场景网络安全金融服务运营商能源电力数据处理24盘位36盘位■ 机箱参数项目ASH401-S24REASH401-S36RECPU支持 DDR4 RDIMM/LRDIMM 服务器内存;内存频率支持2133/2400/2666MHz ;支持 8 个DDR4 通道,每个通道支持 2 个 DIMM ,总共支持 16 个DDR4 插槽;支持单条容量为 16GB ,32GB ,64GB ,128GB 整机最大支持2TB 内存容量。

注:为了使系统更稳定,建议使用兼容性列表内存前置支持 24/36 块 3.5 或2.5 英寸热插拔硬盘 后置支持 2 块 2.5 英寸热插拔硬盘 网络功能 支持2个RJ45千兆网口 管理接口 1 个 RJ45 IPMI 管理网口显示功能 Aspeed® AST2500 64MB,由自定义高密度连接器扩展 1 个标准 VGA 接口 M.2 支持 1 个 M.2 接口 外部端口 前置端口:2 个 USB3.0后置端口:1 个 VGA 、2 个 USB3.0、1 个管理网口、2 个 RJ45 数据网口、1个 COM 口 扩展插槽最多支持 10 个 PCIE 扩展插槽(6 个 PCIe 3.0 x8;4 个 PCIe 3.0 x16)电源支持AC 220V 550W 、800W 、1300W 、1600W 冗余电源(根据实际功率适配)支持高压直流240V ~336V 550W 、800W 、1300W 冗余电源 支持低压直流-48V 550W 、800W 、1300W 冗余电源系统风扇 系统支持4个8038温控风扇(选配8056温控风扇) 尺寸695mm*433.4mm*176.5mm (长*宽*高)■ 订购信息名称料号描述GDC-2000 806-001-250101 申威3231处理器*2/32核/2.4G/128GECCDDR4/512GSSD GDC-2000 806-001-250102 申威3231处理器*2/32核/2.4G/256GECCDDR4/512GSSD GDC-2000806-001-250103申威3231处理器*2/32核/2.4G/512GECCDDR4/512GSSD集 特 国 产 系 列集 特 国 产 系 列■ 产品特点• 单个SP3 Socket ,支持海光7100/7200系列处理器 • 总共支持 16 个 DDR4 插槽;整机最大支持 2TB • 单板上面有10组 PCIE 3.0扩展插槽• 1 个 M.2 Key M SSD 插槽,只支持2280 尺寸及PCIe3.0X4信号• 集成了2个千兆网口 ,采用 I350-AM2芯片GME-5001是一款单路 CPU 标准 E-ATX 服务器主板,支持海光 7100、7200 系列处理器。

Cavium_OCTEON31xx30xx_Chinese_v16

Cavium_OCTEON31xx30xx_Chinese_v16

Cavium Networks Contact: Cavium NetworksAngel Atondo 805 East Middlefield RoadTel: (650) 623-7033 Mountain View, CA 94043 Email: angel.atondo@ Phone: (650) 623-7000Cavium Networks 发布业界最全的基于单核与双核 MIPS64®面向下一代智能网络的 OCTEON™ 处理器新的 OCTEON SOC 处理器为网络、无线、控制和存储应用提供处理器为网络、无线、控制和存储应用提供了了高度集成高度集成和和有成本效益有成本效益的的 64 位计算的解决方案2006 年 1 月 30 日,美国加州日,美国加州山景城山景城 —— 安全、网络服务和嵌入式处理器解决方案的世界领导者 Cavium Networks 今天发布 10 款新的价格从 $20 以下开始基于单核和双核 MIPS64 高度集成的处理器。

为了突破下一代网络、无线、控制和存储应用对特性、性价比和功耗的需求,新的 SOC (System on Chip )集成了定制的 MIPS64 处理器和业界最先进的多层应用(multi-layer applications )加速和安全处理硬件,以及丰富的可配置的网络接口。

新的 OCTEON CN31XX 和 CN30XX 系列处理器与目前市场上领先的多核处理器家族 CN38XX 系列保持软件兼容。

OCTEON 产品家族目前提供从单核到 16 核的业界最具可扩展性和兼容的 MIPS64 处理器产品线,这样 OEM 厂商可以使用同一套通用的软件开发不同性能和价格点的设备,大量的降低了开发成本和缩短了产品面市时间。

OCTEON 处理器被广泛的设计进了各种网络设备,包括路由器、交换机、统一威胁管理(UTM ,Unified Threat Management )设备、应用认知(Application-aware )网关、三网合一(Triple-play )网关、无线局域网(WLAN )、3G 接入和聚合设备以及网络存储设备等。

JANTXV1N6642U中文资料

JANTXV1N6642U中文资料

6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841 PHONE (978) 620-2600 FAX (781) 689-0803 WEBSITE:
157
元器件交易网
IN6638U&US, IN6642U&US
1000
100
150ºC
IR - Reverse Current - (µA)
10
100º
1
C
0.1
25ºC
.01
-65ºC
-65ºC
1
25º
C
NOTE :
All temperatures shown on graphs are junction temperatures
.001 20 40 60 80 100 120 140 Percent of Reverse Working Voltage (%) FIGURE 3 Typical Reverse Current vs Reverse Voltage
1N6638U & US 1N6642U & US 1N6643U & US
MAXIMUM RATINGS
Operating Temperature: -65°C to +175°C Storage Temperature: -65°C to +175°C Operating Current: 300 mA Derating: 4.6 mA/°C Above TEC = + 110°C Surge Current: IFSM = 2.5A, half sine wave, Pw = 8.3ms
DIM D F G S

ZDT6790中文资料(Zetex Semiconductors)中文数据手册「EasyDatasheet - 矽搜」

ZDT6790中文资料(Zetex Semiconductors)中文数据手册「EasyDatasheet - 矽搜」

转换频率
fT
输入电容
Cibo
输出电容
Cobo
开关时间
t on
t off
*脉冲条件下进行测定.脉冲宽度= 300 对于典型特性曲线图看FZT690数据表.
amb = 25°C).
MIN. TYP. 最大.部件
45
V
45
V
5
V
0.1 µA
0.1 µA
0.1 V 0400 150
工作和存储温度范围T
符号
VCBO VCEO VEBO ICM IC
j:Tstg
NPN PNP
45
-50
45
-40
5
-5
6
-6
2
-2
-55到+150
热特性
参数
符号

在T总功率耗​散
amb = 25°C*
Ptot
"关于"任何单一芯片
2.25
这两个死""平等
2.75
减免上述25°C *
"关于"任何单一芯片
18
这两个死""平等
22
热电阻 - 结到环境*
"关于"任何单一芯片
55.6
这两个死""平等
45.5
*可以消散假设设备功率是安装在一个典型方式上与铜等于2英寸见方印刷电路板.
单元
V V V A A °C
单元
W W
毫瓦/°C 毫瓦/°C
°C/ W °C/ W
芯片中文手册,看全文,戳
ZDT6790
芯片中文手册,看全文,戳
SM-8互补中功率

VQFN16中文资料

VQFN16中文资料

4.0 4.2
13
16
15
11
10
元器件交易网
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design.

2N2906中文资料

2N2906中文资料

MIN. MAX. UNIT

−60
V

−40
V

−60
V

−5
V

−600 mA

−800 mA

−200 mA

400
mW

1.2
W
−65
+150 °C

200
°C
−65
+150 °C
VALUE 438 146
UNIT K/W K/W
1997 Jun 02
3
Philips Semiconductors
DC current gain 2N2906A
collector-emitter saturation voltage base-emitter saturation voltage collector capacitance emitter capacitance transition frequency
PNP switching transistors
Product specification
2N2906; 2N2906A
CHARACTERISTICS Tamb = 25 °C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN. MAX. UNIT
2N2906 2N2906A emitter-base voltage collector current (DC) peak collector current peak base current total power dissipation

NUF2042XV6中文资料

NUF2042XV6中文资料


CIRCUIT DESCRIPTION
D1(0) 6
VBUS 5
D2(0) 4
RS
C1
C1
RS
1 D1(i)
2 GND
3 D2(i)
6 1
SOT−563 CASE 463A
MARKING DIAGRAM
xx M G G
1 xx = Specific Device Code

10 100

30
36
NUF2042XV6T1
5.25 5.6 6.8 8.0

10 100 37.6 42 56.4
1. Measured between pins 1, 3, 4, 6 and ground with pin 5 also grounded. 2. For other resistance value (e.g. 33 W), please contact your local ON Semiconductor sales representative.
E 1.10 1.20 1.30 0.043 0.047 0.051
e
0.5 BSC
0.02 BSC
L 0.10 0.20 0.30 0.004 0.008 0.012
HE 1.50 1.60 1.70 0.059 0.062 0.066
SOLDERING FOOTPRINT*
0.3 0.0118
1.35 0.0531
Implementation because the Small IC minimizes Parasitic Inductances
Typical Applications:
• USB Hubs • Computer Peripherals Using USB

2N6796中文资料

2N6796中文资料

Min.
100
Typ.
Max. Unit
V 250 1000 100 –100 µA
VDS=Rated VDSS
nA
ON CHARACTERISTICS
Gate Thresshold Voltage Static Drain–Source On–Resistance Drain–Source On–Voltage Forward Transconductance 2.0 4.0 0.18 0.35 1.56 3.0 350 150 50 9.0. 900 500 150 30 VDD = 30V ID = 5.0A 75 40 45 0.75 1.5
Prelim. 11/98
Underside View PIN 1 – Source PIN 2 – Gate PIN 3 – Drain Case
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
Drain–Source Voltage VDGR Drain–Gate Voltage (RGS = 1.0mΩ) VGS Gate–Source Voltage ID Drain Current Continuous IDM Drain Current Pulsed PD Total Device Dissipation @ TC = 25°C Derate above 25°C TJ , TSTG Operating and Storage Junction Temperature Range THERMAL CHARACTERISTICS RθJC Thermal Resistance Junction to Case RθJC Thermal Resistance Junction to Ambient TL Maximum Lead Temperature 1.5mm from Case for 10 s VDSS 100V 100V ±20V 8.0A 32A 25W 0.2W/ °CW –55 to +150°C 5.0°CW 175°CW 300°C

DAGE XD7800NT Ruby XL X-ray Inspection System 说明书

DAGE XD7800NT Ruby XL X-ray Inspection System 说明书

B G A w i t h O p e n J o i n t sXD7800NT Ruby XL X-ray Inspection SystemAdvantagesD AGE NT500 Maintenance-Free, Sealed-Transmissive X-ray Tube< 0.5 μm Feature Recognition160 kV Tube with Up to 10 W Target Power - Always Retains Sub-Micron AbilityD AGE 3 Mpixel @ 25fps Long Lifetime CMOS Flat Panel Detector with Real Time Image Enhancements G eometric Magnification 1,800 X, System 7,800 X for Total 23,400 X with Digital ZoomDAGE, the only x-ray company whose focus is on x-ray electronics inspection, offers the DAGE XD7800NT Ruby XL x-ray inspection system as the DAGE NT maintenance-free, sealed-transmissive x-ray tube, providing 0.5 μm feature The Solution for Large Board Applicationsall controlled through simple, joystick-free, ‘point and click’ operation, provides the safe, collision-free and high magnification inspection required for production applications. All these tasks can be simply 33” x 24.2” (840 x 615mm) Tray Size47” x 26.4” (1205 x 672 mm) Maximum Board Size with reduced Magnification70° Oblique Views without Loss of Magnification T wo 24” TFT LCD MonitorsAXiS - Active X-ray Image StabilizationNo Programming Skills Required for Automated Inspection TasksO ptions: X-Plane®; Joysticks For more information, speak with your Nordson representative or contact your Nordson regional officeAmericas+ 1 760 930 3307*********************Europe+44 1296 317800***************************China+86 512 6665 2008************************Germany+49 89 2000 338 270************************Japan+81 120 537 555************************Korea+82 31 462 9642***********************South East Asia+65 6552 7533************************Taiwan+886 2 2902 1860***************************United Kingdom+44 1296 317800***************************XD7800NT Ruby XL X-ray Inspection System Specifications• DAGE NT500 sealed-transmissive, filament-free x-ray tube:– < 0.5 μm feature recognition 30 - 160 kV for < 4 W target power– < 0.95 μm feature recognition when above 4 W target power– 10 W max. target power above 110 kV– automated tube stabilisation• 1,800 X geometric magnification (7,800 X system magnification)• 23,400 X total magnification including digital zoom• Easy, collision-free, high magnification inspection:– even at oblique angle views– joystick-free, ‘point and click’ operation• Tray size: 33” x 24.2” (840 x 615mm)• Maximum board size: 47” x 26.4” (1205 x 672 mm) with reduced magnification *Please refer to Dage for clarification for larger boards• Maximum inspection area: 33” x 24.2” (840 x 615mm)• 70° oblique angle views (over 30” x 24”, 762 x 610 mm):– for 360° around a point of interest– isocentric manipulator configuration keeps features in field of view • Long Lifetime CMOS digital detector with 1940 x 1530 pixels (3 Mpixels)– 25 fps full-frame ‘real time’ image acquisition– real time image enhancements• 16-bit digital image processing• AXiS - Active X-ray Image Stabilisation - anti-vibration control• Two off 24” TFT LCD operator display monitors• DAGE Image Wizard operating software including:– automated and manual component fault analysis including BGA & QFN– simple to create and use robust automated inspection routines– plated through hole (PTH) fill percentage calculation– accurate measurement functions– automated and manual die attach / area void calculation– patented1 X-ray navigation map for easy fault location– simple to use, no complicated joysticks required• Fully lead-shielded system safety cabinet– providing < 1 μSv/hr x-ray leakage– meets all international standards• 1 years system warrantyOptions• P atented X-Plane® 2• J oystick control (X,Y or X,Y & Z)• B arcode reader• 2nd Year warranty System• A pproximate Size: 94.5” x 98.5” x 81.5” (w x d x h)• A pproximate Size: 2400 x 2500 x 2070 mm (w x d x h)• A pproximate System Weight: 3000 kg (6600 lbs)• M aximum Sample Weight: 10 kg (22 lbs)• P ower: Single Phase 200 - 230Vac, 16A• M ax. P ower Consumption: 1000 W Max.• A ir: 4-6 bar of clean dry air for anti-vibration• O perating Temp. Range: 10 - 30ºC• H umidity: < 85% (non-condensing)1 EP 20632612 US 9129427 DS-RXL-110821。

MOXA V3200 Series 11th Gen Intel Core 铁路计算机说明书

MOXA V3200 Series 11th Gen Intel Core 铁路计算机说明书

V3200Series11th Gen Intel®Core™processor railway computers with power isolation,multiple expansion slots for wireless,2SSD slotsFeatures and Benefits•Intel®Celeron®/Intel®Core™i3/i5/i7embedded computer for in-vehicleapplications•Multiple interfaces:Up to8GbE,2serial,2USB ports,2DIs,2DOs,and2M.2B key slots for wireless(5G),1mPCIe slot for wireless(Wi-Fi5or4G),1M.2E key for wireless(Wi-Fi6)•Supports dual independent displays(VGA and HDMI with4K resolution)•Native TSN support(for models with i7-1185GRE processor)•Onboard TPM module for enhanced cybersecurity•Complies with all EN50155mandatory test items1•Compliant with EN50121-4•IEC61373certified for shock and vibration resistanceCertificationsIntroductionThe V3200Series embedded computers are built around an Intel®Core™i7/i5/i3or Intel®Celeron®high-performance processor and come with up to64GB RAM,one M.22280M key slot,and two2.5"SSD slots for storage expansion.The computers are compliant with EN50155:2017and EN50121-4standards covering operating temperature,power input voltage,surge,ESD,and vibration,making them suitable for railway onboard and wayside applications.For connecting with onboard and wayside systems and devices,the V3200computers are equipped with a rich set of interfaces including4Gigabit Ethernet ports(default;can go up to8ports)with one-pair LAN bypass function to ensure uninterrupted data transmission,2RS-232/422/485serial ports,2DIs,2DOs,and2USB3.0ports.The built-in TPM2.0module ensures platform integrity and provides hardware-based security as well as protection from tampering.Vehicular applications require reliable connectivity.They also require clear indicators on the device that identify the status of the software.TheV3200computers come with two5G/one LTE and6SIM-card slots to help establish redundant LTE/Wi-Fi connections and three programmable LEDs that enable monitoring of the runtime status of software.1.This product is suitable for rolling stock railway applications,as defined by the EN50155standard.For a more detailed statement,click here:/doc/specs/EN_50155_Compliance.pdfAppearance Front View8P ModelsFront View4P ModelsRear ViewSpecificationsComputerCPU V3210-TL1-4L-T/8L-T/4L-CT-T/8L-CT-T:Intel®Celeron®6305E processor(2C/2T,4M cache,1.8GHz)V3210-TL3-4L-T/8L-T/4L-CT-T/8L-CT-T:Intel®Core™i3-1115G4E processor(2C/4T,6M cache,2.2GHz)V3210-TL5-4L-T/8L-T/4L-CT-T/8L-CT-T:Intel®Core™i5-1145G7E processor(4C/8T,8M cache,1.5GHz)V3210-TL7-4L-T/8L-T/4L-CT-T/8L-CT-T:Intel®Core™i7-1185G7E processor(4C/8T,12M cache,1.8GHz)V3210-TL7-4L-TSN-CT-T/8L-TSN-CT-T:Intel®Core™i7-1185GRE processor(4C/8T,12M cache,1.8GHz) System Memory Slot SODIMM DDR4slots x2(64GB max)System Memory Pre-installed16GB DDR4Storage Slot 2.5-inch SSD slots x2M.2M key2280slot x1(NVMe;128GB preinstalled)Supported OS Windows10Embedded IoT Ent2021LTSC64-bitLinux Debian11/Ubuntu20.04/CentOS7.9(driver)Graphics Controller Intel®Celeron®/Core™i3Models:Intel®UHD GraphicsIntel®Core™i5/i7Models:Intel®Iris®Xe GraphicsComputer InterfaceEthernet Ports Default:4ports(2.5GbE x1and GbE x3),can go up to8portsAuto-sensing1000/2500Mbps x1Auto-sensing10/100/1000Mbps x up to7LAN1:Intel®Ethernet Network Adapter I225with Intel®AMT support Serial Ports RS-232/422/485ports x2,software selectable(DB9male)Digital Input DIs x2Digital Output DOs x2USB3.0USB3.0hosts x2,type-A connectorsVideo Output VGA x1,15-pin D-sub connector(female)HDMI x1,HDMI connector(type A)Wi-Fi Antenna Connector QMA x8(optional with accessory kit)Expansion Slots M.2B key3052/3050slots x2(for5G;4Micro SIMs)M.2E key slots x1(for Wi-Fi6)mPCIe slots x1(for cellular with2Micro SIMs,Wi-Fi5,or I/O expansion) SIM Format MicroNumber of SIMs6TPM TPM v2.0Digital InputsConnector Screw-fastened Euroblock terminalIsolation3k VDCSensor Type Dry contactWet contact(NPN)Dry Contact Logic0:Close to GNDLogic1:OpenWet Contact(COM to DI)Logic0:10to30VDCLogic1:0to3VDCDigital OutputsConnector Screw-fastened Euroblock terminalCurrent Rating200mA per channelI/O Type SinkVoltage0to30VDCIsolation3k VDCLED IndicatorsSystem Power x1Storage x1LAN2per port(LAN1:1000/2500Mbps,LAN2to LAN8:100/1000Mbps)1per LAN bypass pair(LAN7-LAN8)Serial2per port(Tx,Rx)User Programmable3Serial InterfaceBaudrate50bps to115.2kbpsConnector DB9maleESD Contact:6kV;Air:8kV(level3)Isolation2kVData Bits5,6,7,8Stop Bits1,1.5,2Parity None,Even,Odd,Space,MarkFlow Control RTS/CTS,XON/XOFFAutomatic Data Direction Control(ADDC)for RS-485RTS Toggle(RS-232only)Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersInput Voltage24to110VDCPower Connector M12A-coded male connectorPower Consumption100W(max.)Physical CharacteristicsHousing AluminumDimensions(without ears)249x88.9x180mm(9.80x3.50x7.09in) Weight Product Only:3.86kg(8.51lb)Product With Package:5.10kg(11.24lb)IP Rating IP30Installation Wall mountingProtection PCB conformal coatingAvailable on requestEnvironmental LimitsOperating Temperature-40to70°C(-40to158°F)Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN55032/35EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:20V/mIEC61000-4-4EFT:Power:2kV;Signal:2kVIEC61000-4-5Surge:Power:2kVIEC61000-4-6CS:10VIEC61000-4-8PFMFSafety EN62368-1IEC62368-1UL62368-1Railway Fire Protection EN45545-2:2020Railway EN50121-4EN50121-3-2EN50155:2017Shock IEC60068-2-27,IEC61373Vibration IEC60068-2-64,IEC61373DeclarationGreen Product RoHS,CRoHS,WEEEMTBFTime4L Models:382,624hrs8L Models:305,836hrsStandards Telcordia(Bellcore),GBWarrantyWarranty Period3yearsDetails See /warrantyPackage ContentsDevice1x V3200Series computer Installation Kit4x SSD/HDD brackets1x wall-mounting kit Documentation1x quick installation guide1x warranty card Dimensions8P Models4P ModelsOrdering InformationModel NameCPUMemoryOS Storage (M.2M Key) 2.5"SSD Slots (2)GbE PortsTPM 2.0Native TSN Enhance mentPower InputOperating Temp.Conforma l CoatingV3210-TL1-4L-TCeleron 6305E 16GB 128GBOptional 4✓–24-110VDC -40to 70°C –V3210-TL3-4L-T i3-1115G4E16GB 128GB Optional 4✓–24-110VDC -40to 70°C –V3210-TL3-4L-CT-T i3-1115G4E 16GB 128GB Optional 4✓–24-110VDC -40to 70°C ✓V3210-TL7-4L-T i7-1185G7E 16GB 128GB Optional 4✓–24-110VDC -40to 70°C –V3210-TL1-8L-CT-T Celeron 6305E 16GB 128GB Optional 8✓–24-110VDC -40to 70°C ✓V3210-TL5-8L-CT-T i5-1145G7E16GB 128GB Optional 8✓–24-110VDC-40to 85°C✓2.0V3210-TL7-8L-CT-T i7-1185G7E16GB128GB Optional8✓–24-110VDC-40to70°C✓V3210-TL7-8L-TSN-CT-T i7-1185GRE16GB128GB Optional8✓✓24-110VDC-40to70°C✓Accessories(sold separately)CablesCBL-M12(FF5P)/OPEN-100IP67A-coded M12-to-5-pin power cable,IP67-rated5-pin female M12connector,1m©Moxa Inc.All rights reserved.Updated Sep21,2023.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

Sophos XGS 116(w) 126(w) 136(w) 操作指南说明书

Sophos XGS 116(w) 126(w) 136(w) 操作指南说明书

Operating Instructions XGS 116(w)/126(w)/136(w)ForewordWe are pleased to welcome you as a new customer of our Sophos XGS appliances.To install and configure the hardware appliance you can use the following documents:Hardware Quick Start Guide: Connection to the system peripherals in a few stepsOperating Instructions: Notes on the security and commissioning of the hardware applianceSophos Firewall How-To Library: Installing and configuring the software applianceThe Hardware Quick Start Guide and the Safety Instructions are also delivered in printed form together with the hardware appliance. The instructions must be read carefully prior to using the hardware and should be kept in a safe place.You may download all user manuals and additional documentation from the support webpage at: /supportSecurity SymbolsThe following symbol and its meaning appears in the Hardware Quick Start Guide, Safety Instructions and in these Operating Instructions.Caution and Important Note. If these notes are not correctly observed:ÌThis is dangerous to life and the environmentÌThe appliance may be damagedÌThe functions of the appliance will be no longer guaranteedÌSophos shall not be liable for damages arising from afailure to comply with the Safety InstructionsDesigned UseThe hardware appliances are developed for use in networks. The XGS116(w)/126(w)/136(w) models may be operated as a standalone appliance. The hardware appliance can be used in commercial, industrial and residential environments.The XGS 116(w)/126(w)/136(w) models belongs to the appliance group B.The hardware appliance must be installed pursuant to the current installation notes. Otherwise failure-free and safe operation cannot be guaranteed. The EU declaration of conformity is available at the following address:Sophos Technology GmbHGustav-Stresemann-Ring 165189 WiesbadenGermanyCE Labeling, FCC and ApprovalsThe XGS 116(w)/126(w)/136(w) appliance comply with CB, CE, UL, FCC Class B, ISED, VCCI, CCC, KC, BSMI, RCM, NOM, Anatel.Important Note: For computer systems to remain CE and FCC compliant, only CE and FCCcompliant parts may be used. Maintaining CE and FCC compliance also requires proper cable and cabling techniques.Operating Elements and ConnectionsXGS 116(w)Status LEDs (w-model has additional WiFi LED)1 x USB 2.01 x COM Micro USB 2 x external antenna (XGS 116w only)6 x GbE copper port F1 1 x SFP fiber port 1 x COM (RJ45)1 x USB 3.0Power supply Connector for optional 2 redundant power supply Optional module expansion bay 1 x GbE PoE port 1 x GbE copper portXGS 126(w)/136(w)Status LEDs (w-model has additional WiFi LED)1 x USB 2.01 x COM Micro USB 3 x external antenna (XGS 126w/136w only)10 x GbE copper port F1–F2 2 x SFP fiber ports 1 x COM (RJ45)1 x USB 3.0Power supply Optional module expansion bay 2 x 2.5 GbE PoE port (136(w)) 2 x GbE PoE port (126(w))Connector for optional 2 redundant power supplyTechnical SpecificationsInterfacesLED StatusPutting into OperationCaution: Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.Scope of SupplyThe supplied parts are indicated in the Hardware Quick Start Guide.Mounting InstructionsThe XGS 116/126/136 appliance can be placed on a stable horizontal surface or canbe mounted to a rack or you can hang it on the wall by using the optionally available rackmount kit.Warnings and PrecautionsThe appliance can be operated safely if you observe the following notes and the notes on the appliance itself.Rack PrecautionsÌEnsure that the leveling jacks on the bottom of the rack are fully extendedto the floor with the full weight of the rack resting on them.ÌIn single rack installation, stabilizers should be attached to the rack.ÌIn multiple rack installations, the racks should be coupled together.ÌAlways make sure the rack is stable before extending a component from the rack.ÌYou should extend only one component at a time—extending two ormore simultaneously may cause the rack to become unstable.General Server PrecautionsÌReview the electrical and general safety precautions that camewith the components you are adding to your appliance.ÌDetermine the placement of each component in the rack before you install the rails.ÌInstall the heaviest server components on the bottom of the rack first, and then work up.ÌAllow the hot plug hard drives and power supply modules to cool before touching them.ÌAlways keep the rack‘s front door, all panels and server componentsclosed when not servicing to maintain proper cooling.Rack Mounting ConsiderationsÌAmbient operating temperature: If installed in a closed or multiunit rack assembly,the ambient operating temperature of the rack environment may be greater than the ambient temperature of the room. Therefore, you should install the equipment in an environment compatible with the manufacturer’s maximum rated ambient temperature.ÌReduced airflow: Equipment should be mounted into arack with sufficient airflow to allow cooling.ÌMechanical loading: Equipment should be mounted into a rack so that ahazardous condition does not arise due to uneven mechanical loading.ÌCircuit overloading: Consideration should be given to the connection of the equipment to the power supply circuitry and the effect that any possible overloading of circuits might have on overcurrent protection and power supply wiring. Appropriate consideration of equipment nameplate ratings should be used when addressing this concern.ÌReliable ground: Reliable grounding must be maintained at all times.To ensure this, the rack itself should be grounded. Particular attentionshould be given to power supply connections other than the directconnections to the branch circuit (i.e., the use of power strips, etc.).Connection and ConfigurationHow to connect the appliance is described in the Hardware Quick Start Guide. For configuration you can follow the initial setup wizard described in the Web Admin Quick Start Guide or cancel it and perform a manual setup (see the Sophos Firewall How-To Library).Serial ConsoleYou can connect a serial console to either of the COM ports of the Sophos XGS hardware appliances. You can use, for instance, the Hyperterminal terminal program which is included with most versions of Microsoft Windows to log on to the appliance console. Use an RJ45 to DB9 adapter cable or the provided USB cable to connect the console to your hardware appliance.The required connection settings are:ÌBits per second: 38,400ÌData bits: 8ÌParity: N (none)ÌStop bits: 1Access via the serial console is activated by default on ttyS0. The connections of the appliances and the respective functionality are listed in chapter ‘Operating Elements and Connections’.Please Note: If you are connecting to the Micro USB port and it doesn’t show up as COM port but as unknown hardware in your system, please download a Micro USB Driver from https:///drivers/d2xx-drivers/.United Kingdom and Worldwide Sales Tel: +44 (0)8447 671131Email:****************North American SalesToll Free: 1-866-866-2802Email:******************Australia and New Zealand SalesTel: +61 2 9409 9100Email:****************.auAsia SalesTel: +65 62244168Email:********************© Copyright 2021. Sophos Ltd. All rights reserved.Registered in England and Wales No. 2096520, The Pentagon, Abingdon Science Park, Abingdon, OX14 3YP, UK Sophos is the registered trademark of Sophos Ltd. All other product and company names mentioned are trademarks or registered trademarks of their respective owners.。

MPXV7002GC6U中文资料

MPXV7002GC6U中文资料

Document Number: MPXV7002Rev 0, 09/2005Freescale Semiconductor Technical Data© Freescale Semiconductor, Inc., 2005. All rights reserved.Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and CalibratedThe MPXV7002 series piezoresistive transducers are state-of-the-artmonolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features • 2.5% Typical Error over +10°C to +60°C with Auto Zero• 6.25% Maximum Error over +10°C to +60°C without Auto Zero•Ideally Suited for Microprocessor or Microcontroller-Based Systems •Thermoplastic (PPS) Surface Mount Package •Temperature Compensated over +10° to +60°C •Patented Silicon Shear Stress Strain Gauge•Available in Differential and Gauge Configurations Typical Applications•Hospital Beds •HVAC•Respiratory Systems •Process ControlORDERING INFORMATIONDevice TypeOptionsCase No.MPX Series Order No.Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV7002 SERIES)Ported ElementsGauge, Axial Port, SMT 482A MPXV7002GC6URailsMPXV 7002GGauge, Axial Port, SMT482A MPXV 7002G C6T1Tape & Reel MPXV 7002GGauge, Side Port, SMT 1369MPXV 7002G P Trays MPXV 7002G Differential, Dual Port, SMT1351MPXV 7002DP Trays MPXV 7002G Differential, Dual Port, SMT1351MPXV7002DPT1Tape & Reel MPXV7002G MPXV7002 SERIESINTEGRATED PRESSURE SENSOR -2 to 2 kPa (-0.3 to 0.3 psi)0.5 to 4.5 V OUTPUT SMALL OUTLINE PACKAGEPIN NUMBERS(1)1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.1N/C 5N/C 2V S 6N/C 3Gnd 7N/C 4V out8N/CSensing ElementThin Film Temperature Compensationand Gain Stage #1Gain Stage #2and Ground Reference Shift CircuitryV SV outGNDPins 1 and 5 through 8 are NO CONNECTS for surface mount packageMPXV7002SensorsFigure 1. Fully Integrated Pressure Sensor SchematicTable 1. Maximum Ratings (1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbol Value Unit Maximum Pressure (P1 > P2)P max 8.0kPa Storage Temperature T stg –30 to +100°C Operating TemperatureT A10 to +60°CTable 2. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.)CharacteristicSymbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.P OP –2.0— 2.0kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.V S 4.75 5.0 5.25Vdc Supply Current I o ——10mAdc Pressure Offset (3)(10 to 60°C)@ V S = 5.0 Volts 3.Offset (V off ) is defined as the output voltage at the minimum rated pressure.V off 2.25 2.5 2.75Vdc Full Scale Output (4)(10 to 60°C)@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.V FSO 4.25 4.5 4.75Vdc Full Scale Span (5)(10 to 60°C)@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS 3.5 4.0 4.5 V Vdc Accuracy (6)(10 to 60°C)6.Accuracy (error budget) consists of the following:•Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.•Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled toand from the minimum or maximum operating temperature points, with zero differential pressure applied.•Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from theminimum or maximum rated pressure, at 25°C.•TcSpan:Output deviation over the temperature range of 10° to 60°C, relative to 25°C.•TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to25°C.•Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS , at 25°C.——±2.5(7)7.Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement.±6.25%V FSS Sensitivity V/P — 1.0—-V/kPa Response Time (8)8.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I O+—0.1—-mAdc Warm-Up Time (9)9.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.——20—-msMPXV7002SensorsON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONINGThe performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip.Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.The MPXV7002 series pressure sensor operatingcharacteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensorperformance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of amicroprocessor or microcontroller. Proper decoupling of the power supply is recommended.Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.Figure 2. Cross-Sectional Diagram SOP(not to scale)Figure 3. Recommended Power Supply Decouplingand Output Filtering(For additional output filtering, please refer toApplication Note AN1646.)Figure 4. Output versus Pressure DifferentialFluoro Silicone Gel Die CoatWire Bond DieP1Stainless Steel CapThermoplasticCaseDie BondDifferential SensingElementP2+5 V1.0 µF0.01 µF470 pFGNDV sV outIPSOUTPUTLead FrameDifferential Pressure (kPa)O u t p u t V o l t a g e (V )5.04.03.02.01.002TYPICALMIN-2-11Transfer Function:V out = V S × (0.2 × P(kPa)+0.5) ± 6.25% V FSS V S = 5.0 Vdc T A = 10 to 60°CMAXMPXV7002SensorsPRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLEFreescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media.The Pressure (P1) side may be identified by using the table below:MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correctfootprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.Figure 5. Small Outline Package FootprintPart NumberCase Type Pressure (P1)Side IdentifierMPXV7002GC6U/GC6T1482A-01Vertical Port Attached MPXV7002GP 1369-01Side with Port Attached MPXV7002DP1351-01Side with Dual Port Attached0.66016.760.060 TYP 8X 1.520.100 TYP 8X 2.540.100 TYP 8X 2.540.3007.62inch mmSCALE 2:1PACKAGE DIMENSIONSISSUE ASMALL OUTLINE PACKAGEMPXV7002 SensorsCASE 1351-01ISSUE ASMALL OUTLINE PACKAGEMPXV7002SensorsCASE 1351-01ISSUE ASMALL OUTLINE PACKAGEMPXV7002 SensorsCASE 1369-01ISSUE BSMALL OUTLINE PACKAGEMPXV7002SensorsCASE 1369-01ISSUE BSMALL OUTLINE PACKAGEMPXV7002 SensorsMPXV7002Rev. 0How to Reach Us:Home Page: E-mail:support@USA/Europe or Locations Not Listed:Freescale SemiconductorTechnical Information Center, CH3701300 N. Alma School Road Chandler, Arizona 85224+1-800-521-6274 or +1-480-768-2130support@Europe, Middle East, and Africa:Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 781829 Muenchen, Germany +44 1296 380 456 (English)+46 8 52200080 (English)+49 89 92103 559 (German)+33 1 69 35 48 48 (French)support@Japan:Freescale Semiconductor Japan Ltd.Headquarters ARCO Tower 15F1-8-1, Shimo-Meguro, Meguro-ku,Tokyo 153-0064Japan0120 191014 or +81 3 5437 9125support.japan@Asia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center 2 Dai King StreetTai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080@For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P .O. Box 5405Denver, Colorado 802171-800-441-2447 or 303-675-2140Fax: 303-675-2150LDCForFreescaleSemiconductor@Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may beprovided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended orunauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.All other product or service names are the property of their respective owners.© Freescale Semiconductor, Inc. 2005. All rights reserved.。

台科技 SMD Power Inductor TMPA1265SP-Series(N)-D 说明书

台科技 SMD Power Inductor TMPA1265SP-Series(N)-D 说明书

ECN HISTORY LISTREV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.018/06/20新發行羅宜春梁周虎許靜備注B:Dimension BxC.C:Type Standard.D:Inductance R10=0.1uh,1R0=1.0uh,100=10uh,101=100uh,102=1000uh. E:Inductance Tolerance K=±10%,L=±15%,M=±20%,N=±25%,Y=±30%F:Code Marking:Black.100and1536(15YY,36WW,follow production date).5.Specification1.Test frequency:Ls:100KHz/1.0V.2.All test data referenced to25℃ambient.3.Testing Instrument(or equ):L:HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER/Rdc:CH16502,Agilent33420A MICRO OHMMETER.4.Heat Rated Current(Irms)will cause the coil temperature rise approximatelyΔT of40℃5.Saturation Current(Isat)will cause L0to drop approximately30%.6.The part temperature(ambient+temp rise)should not exceed125℃under worst case operating conditions.Circuit design,component,PCB trace size andthickness,airflow and other cooling provisions all affect the part temperature.Part temperature should be verified in the end application.7.Special inquiries besides the above common used types can be met on your requirement.6.Material List7.Reliability and Test ConditionItemPerformanceTest ConditionOperating temperature-40~+125℃(Including self-temperature rise)Storage temperature1.-10~+40℃,50~60%RH (Product with taping )2.-40~+125℃(on board)Electrical Performance TestInductanceRefer to standard electrical characteristics list.HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter.DCRCH16502,Agilent33420A Micro-Ohm Meter.Saturation Current (Isat)Approximately △L30%.Saturation DC Current (Isat)will cause L0to drop △L(%)Heat Rated Current (Irms)Approximately △T40℃Heat Rated Current (Irms)will cause the coil temperature rise △T(℃).1.Applied the allowed DC current2.Temperature measured by digital surface thermometerReliability TestLife TestAppearance :No damage.Impedance :within ±15%of initial value Inductance :within ±10%of initial valueQ :Shall not exceed the specification value.RDC :within ±15%of initial value and shall not exceed the specification valuePreconditioning:Run through IR reflow for 2times.(IPC/JEDECJ-STD-020DClassification Reflow Profiles)Temperature :125±2℃(Inductor)Applied current :rated current Duration :1000±12hrsMeasured at room temperature after placing for 24±2hrs.Load HumidityPreconditioning:Run through IR reflow for 2times.(IPC/JEDECJ-STD-020DClassification Reflow Profiles)Humidity :85±2﹪R.H,Temperature :85℃±2℃Duration :1000hrs Min.with 100%rated currentMeasured at room temperature after placing for 24±2hrs.Moisture ResistancePreconditioning:Run through IR reflow for 2times.(IPC/JEDECJ-STD-020DClassification Reflow Profiles)1.Baked at50℃for 25hrs,measured at room temperature after placing for 4hrs.2.Raise temperature to 65±2℃90-100%RH in 2.5hrs,and keep 3hours,cool down to 25℃in 2.5hrs.3.Raise temperature to 65±2℃90-100%RH in 2.5hrs,and keep 3hours,cool down to 25℃in2.5hrs,keep at 25℃for 2hrs then keep at -10℃for 3hrs4.Keep at 25℃80-100%RH for 15min and vibrate at the frequency of 10to 55Hz to 10Hz,measure at room temperature after placing for 1~2hrs.Thermal shockPreconditioning:Run through IR reflow for 2times.(IPC/JEDECJ-STD-020DClassification Reflow Profiles)Condition for 1cycleStep1:-40±2℃30±5min Step2:25±2℃≦0.5minStep3:125±2℃30±5minNumber of cycles :500Measured at room fempraturc after placing for 24±2hrs.VibrationPreconditioning:Run through IR reflow for 2times.(IPC/JEDECJ-STD-020DClassification Reflow Profiles)Oscillation Frequency:10~2K ~10Hz for 20minutes Equipment :Vibration checker Total Amplitude:1.52mm±10%Testing Time :12hours(20minutes,12cycles each of 3orientations)。

2N6987UJAN资料

2N6987UJAN资料

OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage IC = 10 mAdc Collector-Base Cutoff Current VCB = 60 Vdc VCB = 50 Vdc Emitter-Base Cutoff Current VBE = 5.0 Vdc VEB = 3.5 Vdc
IEBO
6 La1-800-446-1158 / (978) 794-1666 / Fax: (978) 689-0803
120101 Page 1 of 2
元器件交易网
2N6987, 2N6988 JAN, SERIES
元器件交易网
TECHNICAL DATA
MULTIPLE (QUAD) PNP SILICON SWITCHING TRANSISTOR
Qualified per MIL-PRF-19500/558 Devices 2N6987 2N6987U 2N6988 Qualified Level JAN JANTX JANTXV JANS
hFE
VCE(sat)
0.4 1.6 1.3 2.6
Vdc Vdc
VBE(sat)
DYNAMIC CHARACTERISTICS
Magnitude of Small-Signal Short-Circuit Forward-Current Transfer Ratio IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz Small-Signal Short-Circuit Forward Current Transfer Ratio IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz Output Capacitance VCB = 10 Vdc, IE = 0, 100 kHz ≤ f ≤ 1.0 MHz Input Capacitance VEB = 2.0 Vdc, IC = 0, 100 kHz ≤ f ≤ 1.0 MHz

Magnum Cable Tracker MS6812 用户手册说明书

Magnum Cable Tracker MS6812 用户手册说明书

MS6812Cabl e Tracker User's ManualCE IntroductionThe Magnum Cable Tracker sends a tone down a wire to identify and trace wires or cables bunched in a group without damaging insulation. With this tracker, you can find and trace non-energized electrical wires, telephone lines, data cables, alarm cables, speaker wires, coax, thermostat wires and more.Set includes a Sender (MS6812-T) with two alligator clips and an RJ11 plug, Receiver (MS6812-R), user manual and two 9 volt batteries.01Di!Functions•Test the continuity of cables or wires•Find a cable in a bunch without damaging insulation•Trace the tip and ring wires in telephone lines•Identify the status (clear, busy, ringing) of working telephone linesWarningDo not use this tracker to test energized wires. Disconnect all power before tracking wires or testing continuity. If you're not sure, consult a qualified electrician.Setting tone volumeTurn the dial on the Receiver to adjust tone volumeChanging tone settingSelect a dual alternating tone or a single solid tone with the switch inside the Sender (MS6812-T)Replacing batteriesThe Sender and Receiver are battery powered. Each requires one 9 volt battery (included). To change the batteries, open the panel on the back of either component, remove the old battery and replace it with a new one.Testing Continuity Identifying the State of Working Telephone Lines When not in use, switch the Sender to OFF and store the set in a dry,。

西斯特(Westcott)Flex Cine LED Mat 快速入门指南说明书

西斯特(Westcott)Flex Cine LED Mat 快速入门指南说明书

LED MA T QUICK START GUIDEFlex Cine 1' x 1' RGBW Mat Metal CornersLEDsIP64 Rated SurfaceFastener EdgingEach CornerMagnets in Dimmer TE-9 Pin ConnectorFlex Cine Mats have an IP rating of 64, which is stated as being protected from total dust ingress and from water spraying from any direction onto the mat and cable area closest to the mat. After contact with water, dry the Flex’s surface with a cloth and store in a dry location.The TE-9 Pin connector that connects to a Flex Cine Dimmer is not IP64 rated.• Use only with a Westcott Flex Cine Dimmer• Do not crease• Do not sharply fold• Keep away from fire or extreme temperatures• Do not submerge in water• Do not leave in wet conditions for extended amounts of time • Do not get cable connector wet• Avoid direct contact with any heat source or extreme cold• Do not attempt to disassemble or repair LED chips Flex Cine Mats require a Flex Cine Dimmer and power source for operation. Flex Cine RGBW Mats require a Flex Cine Wireless DMX Dimmer.DMX Dimmer AC Adapter or 26V V-Mount BatteryAll Mats14.4 or 14.8V V-Mount Battery1' x 1' Daylight and 1' x 1' Bi-Color MatsNever force entry or removal of the connector.Wipe Flex Cine Mat with a damp cloth. Store in a dry environment.Connecting to a Flex Cine Dimmer1. Ensure the dimmer is turned OFF .2. Plug the Flex Cine mat’s TE-9 Pin connector into the TE-9 Pin receiver located on the top of the Flex Cine Dimmer. Proper connection may require the connector to be turned until the pins align and it easily inserts into the dimmer’s receiver.3. Once connected, rotate the locking ring 3/4 clockwise on the cable connector to secure.4. Connect the dimmer to a compatible power source. See the Power section for compatibility and connecting details.Disconnecting from a Flex Cine Dimmer1. Ensure the dimmer is turned OFF .2. Grasp the locking ring and rotate counterclockwise 3/4 turn.3. Gently pull the cable connector straight out and away from the dimmer.Flex Cine Mats are pliable and can be shaped for mounting or adjusting light spread. Gently roll the mat into your desired position. Do not crease or sharply fold.BarndoorsYokesLearn more atVisit for videos, pro tips, inspiration, and more!Westcott products are made to the company’s traditionally high standards of quality and comply with all applicable government safety regulations and requirements. In an effort to provide the best quality products possible, we periodically make product modifications. Actual products may not be identical to items pictured. Made in Korea. ©F.J. Westcott Co. All rights reserved. HW0918Register your new gear online atWestcott Flex Cine LED Mats have been manufactured under the highest standards of quality and workmanship. Westcott’s warranty obligations for this product are limited to the following terms.The F.J. Westcott Co. (“Westcott”) warrants to the original end-user purchaser for as long as the original end-user purchaser owns their Flex Cine LED Mat (“Warranty Period”), that this Flex LED Mat will function under normal use and will be free from defects in material and manufacturing workmanship. If a defect arises and a valid claim is received within the Warranty Period, at its option and to the extent permitted by law, Westcott will either (1) repair the defect at no charge, using new or refurbished replacement parts, or (2) exchange the product with a product that is new or which has been manufactured from new or serviceable used parts and is at least functionally equivalent to the original product. This Limited Warranty applies only to products manufactured by or for Westcott that can be identified by the Westcott trademark, trade name, or logo affixed to them.This warranty does not apply to: (a) damage caused by accident, abuse, misuse, flood, fire, earthquake, mold, or other external causes; (b) damage caused by operating the product outside the permitted or intended uses described by Westcott; (c) a product or part that has been modified to alter functionality or capability without the written permission of Westcott; or (d) cosmetic damage, including but not limited to scratches, dents and broken plastic.This Lifetime Limited Warranty covers Westcott Flex Cine LED Mats only. This warranty does not cover any accessories or controllers associated with the Westcott Flex System. Westcott Flex Mats purchased through a third-party retailer must be registered with Westcott using the Product Warranty Registration form within one year of the original purchase date.Disclaimer: By purchasing, borrowing and/or using this product for any event, both public or private, you, the customer, accepts all responsibility and releases Westcott, and its associates, of any and all liability in the event of manufacturer’s defect, malfunction or misuse of the product which may lead to further injuries or complications unforeseen by the user. Westcott is not responsible for any potential or incurred damage caused by failure to properly mount, hang, or store the product, which includes, but is not limited to damage to cameras, electronics, electrical equipment, buildings, building materials, personal injury, death, or disability, fire damage, or any and all other damage not mentioned previously.Please contact Westcott’s Repair Department for a Return Authorization Number “RMA” prior to requesting warranty service. This RMA must be clearly written on the outside of the box to the left of the shipping label. Items sent in without pre-authorization or that do not fall under the limited warranty will be returned at the expense of the sender.Repair Department: 800-886-1689 / 419-243-7311 (International)Email:**********************Shipping: F.J. Westcott Co, 1425-B Holland Rd. Maumee, OH 43537。

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— 45
1.8 — 4.3 —
nH
Measured from drainpadto Modified MOSFET symbol show-
die.
ing the internal inductances.
Measured from center of source pad to the end of source bonding wire.
Product Summary
Part Number
BVDSS
IRFE130
100V
RDS(on) 0.18Ω
Features:
n Hermetically Sealed n Simple Drive Requirements n Ease of Paralleling n Small footprint n Surface Mount n Lightweight
HEXFET transistors also feature all of the well-established advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical parameter temperature stability. They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high-energy pulse circuits, and virtually any application where high reliability is required.
IRFE130, JANTX-, JANTXV-, 2N6796U Units
8.0
5.0
A
32
25
W
0.17
W/K
±20
V
134
mJ
8.3
V/ns
-55 to 150
oC
300 ( for 5 seconds)
0.42 (typical)
g
11/13/97
IRFE130, JANTX-, JANTXV-, 2N6796U Device Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
RthJPCB Junction-to-PC Board
Min Typ Max Units
— — 5.0 K/W
— — 19
Test Conditions Soldered to a copper clad PC board
Details of notes through are on the last page
100Volt, 0.18Ω, HEXFET The leadless chip carrier (LCC) package represents the logical next step in the continual evolution of surface mount technology. The LCC provides designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the LCC package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package is grounded to the source to reduce RF interference.
Internal Source Inductance
Min 100 —
— — 2.0 3.0 — —
— — — — — — — — — —

Typ Max Units —— V 0.11 — V/°C
Test Conditions VGS =0 V, ID = 1.0mA Reference to 25°C, ID = 1.0mA
Parameter
Min Typ Max Units
Test Conditions
IS Continuous Source Current (Body Diode) ISM Pulse Source Current (Body Diode)
— — 8.0 — — 32
A Modified MOSFET symbol showing the integral reverse p-n junction rectifier.
— — 970 nC
VDD ≤ 50V
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC
Junction-to-Case
TJ = 25° C TJ = 150° C
10
1
0.1 4
V DS = 50V 20µs PULSE WIDTH
5
6
7
8
9
10
VGS , Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
RDS(on) , Drain-to-Source On Resistance (Normalized)
VGS = 0V, TJ = 125°C
— 100 — -100 nA — 29
VGS = 20 V VGS = -20V VGS = 10V, ID = 8.0A
— 6.5 nC — 17
VDS = Max Rating x 0.5
— 30 — 75 — 40 ns
VDD = 50V, ID = 8.0A, RG = 7.5Ω
Parameter
BVDSS
Drain-to-Source Breakdown Voltage
∆BVDSS/∆TJ Temperature Coefficient of Breakdown Voltage
RDS(on)
Static Drain-to-Source On-State Resistance
1
4.5V
0.1 0.1
20µs PULSE WIDTH TJ = 150 °C
1
10
100
VDS , Drain-to-Source Voltage (V)
Fig 2. Typical Output Characteristics
ID , Drain-to-Source Current (A)
100
1
10
100
VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
I D, Drain-to-Source Current (A)
100 10
VGS
TOP
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
ID , Drain-to-Source Current (A)
IRFE130, JANTX-, JANTXV-, 2N6796U Device
100 10
VGS
TOP
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
1
4.5V
0.1 0.1
20µs PULSE WIDTH TJ = 25 °C
VGS(th) gfs IDSS
Gate Threshold Voltage Forward Transconductance Zero Gate Voltage Drain Current
IGSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LD
LS
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (‘Miller’) Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance
VSD trr QRR
ton
Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge
Forward Turn-On Time
— — 1.5 V Tj = 25°C, IS = 8.0A, VGS = 0V
— — 300 ns Tj = 25°C, IF = 8.0A, di/dt ≤ 100A/µs
— 0.18 — 0.207 Ω
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