PCB Fabrication Process
pcb选化工艺流程
pcb选化工艺流程英文回答：PCB Fabrication Process.The PCB fabrication process is a complex and highly technical process that involves multiple steps, including:1. Design: The first step is to design the PCB layout using a computer-aided design (CAD) software. The layout includes the placement of components, traces, and vias.2. Printing: The designed layout is then printed onto a copper-clad laminate using a photoresist process. The photoresist is exposed to ultraviolet light through a mask, which hardens the exposed areas and leaves the unexposed areas soft.3. Etching: The unexposed areas of the copper-clad laminate are etched away using a chemical solution, leavingthe desired copper traces on the board.4. Drilling: Holes are drilled into the board to allow for the placement of components and vias.5. Plating: The copper traces and vias are plated witha thin layer of solder mask to protect them from oxidation and to provide a solderable surface.6. Component placement: The components are placed on the board using a pick-and-place machine.7. Soldering: The components are soldered to the board using a solder paste or wave soldering process.8. Inspection: The assembled PCB is inspected to ensure that it meets the design specifications and that there are no defects.中文回答：PCB 制造工艺流程。
PCB-Fabrication-印刷电路板制造流程
2-8 Routing
Before routing
After routing
2-9 Beveling
Before beveling
After beveling
9
Drilling Process
Drilling ： Flow
3-1 Backing & Entry board cutting 3-1 Entry and Backing 3-2 Alignment Pins Before cut 3-3 Drilling After cutting 3-4 Pin removal Stack for next procedure. Back-up boards Entry boards
Stack panels 3-2 Add pins
Add pins
Add entry board 3-3 Drilling
Tape Edges
Drill
3-4 Pin removal
Pins shown
After pin removal
10
Copper Plating
4-1 CP ： Deburr Flow 4-2 Desmear 4-3 PTH 4-4 Copper Plating High pressure water rinse Water column spray pressure 15kg/cm2 Deburr pre-treatment: non-woven rollers Use the brushing & high pressure water rinse to clean away the fibers on the board surface and in the holes. 1. Swelling 4-2 Desmear Dip boards into high temperature alkali bath liquids (which containes organic solvent) to swell the resin smears.
PCBA术语解释
Accuracy(精度)：测量结果与目标值之间的差额。
Additive Process(加成工艺)：一种制造PCB导电布线的方法，通过选择性的在板层上沉淀导电材料(铜、锡等)。
Adhesion(附着力)：类似于分子之间的吸引力。
Aerosol(气溶剂)：小到足以空气传播的液态或气体粒子。
Angle of attack(迎角)：丝印刮板面与丝印平面之间的夹角。
Anisotropic adhesive(各异向性胶)：一种导电性物质，其粒子只在Z轴方向通过电流。
Annular ring(环状圈)：钻孔周围的导电材料。
Application specific integrated circuit (AS IC特殊应用集成电路)：客户定做得用于专门用途的电路。
Array(列阵)：一组元素，比如：锡球点，按行列排列。
Artwork(布线图)：PCB的导电布线图，用来产生照片原版，可以任何比例制作，但一般为3:1或4:1。
Automated test equipment (ATE自动测试设备)：为了评估性能等级，设计用于自动分析功能或静态参数的设备，也用于故障离析。
Automatic optical inspection (AOI自动光学检查)：在自动系统上，用相机来检查模型或物体Ball grid array (BGA球栅列阵)：集成电路的包装形式，其输入输出点是在元件底面上按栅格样式排列的锡球。
Blind via(盲通路孔)：PCB的外层与内层之间的导电连接，不继续通到板的另一面。
Bond lift-off(焊接升离)：把焊接引脚从焊盘表面(电路板基底)分开的故障。
Bonding agent(粘合剂)：将单层粘合形成多层板的胶剂。
Bridge(锡桥)：把两个不该导电连接的导体连接起来的焊锡，引起短路。
Buried via(埋入的通路孔)：PCB的两个或多个内层之间的导电连接(即，从外层看不见的)。
CAD/CAM system(计算机辅助设计与制造系统)：计算机辅助设计是使用专门的软件工具来设计印刷电路结构；计算机辅助制造把这种设计转换成实际的产品。
pcb双面板的工艺流程
pcb双面板的工艺流程英文回答：PCB (Printed Circuit Board) double-sided fabrication involves several steps in its manufacturing process. Here, I will outline the general process flow for producing double-sided PCBs.1. Design and Layout: The first step is to create a design and layout for the PCB using a computer-aided design (CAD) software. This involves placing components, routing traces, and creating the necessary layers for the PCB.2. Material Selection: Once the design is complete, the next step is to select the appropriate materials for the PCB. This includes choosing the substrate material (usually fiberglass-reinforced epoxy), copper foil for the conductive layers, and solder mask materials.3. Substrate Preparation: The substrate material is cutinto the desired size and shape for the PCB. It is then cleaned and prepared for the subsequent processes.4. Copper Cladding: Copper foil is laminated onto both sides of the substrate using heat and pressure. This provides the conductive layers for the PCB.5. Imaging: A photosensitive material called a photoresist is applied to both sides of the copper-clad substrate. The PCB design is then transferred onto the photoresist using a UV light source and a photomask. The areas exposed to light become either the conductive traces or the pads for component attachment.6. Etching: The unexposed areas of the photoresist are removed, leaving behind the desired conductive traces and pads. The exposed copper is then etched away using an etching solution, leaving only the desired copper pattern on the substrate.7. Drilling: Holes for component mounting and interconnections are drilled into the PCB using a precisiondrilling machine. These holes are typically plated with copper to provide electrical continuity between the layers.8. Plating: A thin layer of copper is electroplatedonto the exposed copper surfaces, including the drilled holes. This helps to improve the conductivity and protect the copper from oxidation.9. Solder Mask Application: A solder mask is applied to both sides of the PCB to protect the copper traces from oxidation and to prevent solder bridges during assembly.The solder mask is typically green in color, but othercolors can also be used.10. Silkscreen Printing: Component designators, logos, and other information are printed onto the solder maskusing a silkscreen printing process. This helps with component placement and identification during assembly.11. Testing and Inspection: The finished PCBs are subjected to various tests and inspections to ensure their quality and functionality. This includes electrical testing,visual inspection, and sometimes, functional testing.12. Assembly: Once the PCBs pass all the tests, theyare ready for component assembly. This involves solderingthe components onto the PCB using either manual or automated assembly processes.13. Final Testing: The assembled PCBs undergo final testing to verify their functionality and performance. This may include functional testing, environmental testing, and reliability testing.中文回答：PCB（Printed Circuit Board）双面板的制造工艺包括多个步骤。
PCB行业HDI制程表面处理方式发展趋势
OSP 40 oC
Im-Ag 50 oC
Im-Sn 70 oC
2. The mechanical properties of the board may be damaged by thermal impact of HASL process
3. The reliability of the board may be reduced if residues of the HASL flux are not properly removed.
Platinum coated titanium mesh
2H2O → 4H+ + O2 + 4eNi surface on PCB
Au(CN)2- + e- → Au + 2CN-
16
Electrolytic Ni/Au Hoist plating line
TAB plating line
17
ImAg
0.000 －0.126
Sn2+ ＋ 2e- ＝ Sn
－0.136
Ni2+ ＋ 2e- ＝ Ni
－0.250
Co2+ ＋ 2 e- ＝ Co
－0.277
Tl+ ＋ e- ＝ Tl
－0.336
Cd2+ ＋ 2e-; ＋ 2 e- ＝ Fe
－0.440
H3PO3 + 2 H+ + 2 e ＝H2PO2- + H2O －0.50
Solder mask
Cu2+
Ag+
Displacement reaction between solution & Cu
cob与csp的制造流程
cob与csp的制造流程英文回答：Cob and CSP are two different manufacturing processes used in various industries.Cob, short for Chip-On-Board, is a technology used in electronic packaging where the bare integrated circuit (IC) chip is directly mounted onto a printed circuit board (PCB). The process involves wire bonding the IC chip to the PCB, followed by encapsulation to protect the chip from external elements.The manufacturing process of Cob typically involves the following steps:1. PCB fabrication: The first step is to fabricate the PCB, which involves designing the circuit layout, etching the copper tracks, and drilling holes for component placement.2. Wire bonding: The IC chip is then wire bonded to the PCB using fine wires made of gold or aluminum. This process involves making electrical connections between the chip and the PCB by bonding the wires to the appropriate contact points.3. Encapsulation: After wire bonding, the IC chip is encapsulated with a protective material, such as epoxy resin or silicone gel. This encapsulation provides mechanical support and protects the chip from moisture, dust, and other contaminants.4. Testing and inspection: Once the encapsulation is complete, the assembled Cob module undergoes rigorous testing and inspection to ensure its functionality and quality. This includes electrical testing, visual inspection, and functional testing.CSP, short for Chip Scale Package, is another packaging technology used in the semiconductor industry. In CSP, the IC chip is packaged in a compact form factor that is asclose to the size of the chip itself. This allows for higher packaging density and smaller form factors in electronic devices.The manufacturing process of CSP generally includes the following steps:1. Die preparation: The first step is to prepare the IC chip for packaging. This involves singulating the chips from the wafer and testing them for functionality.2. Substrate fabrication: A substrate is prepared, which acts as the base for mounting the IC chip. The substrate is typically made of materials like ceramic or organic laminate.3. Die attach: The IC chip is then attached to the substrate using conductive adhesive or solder. This process ensures a secure and reliable connection between the chip and the substrate.4. Wire bonding or flip chip bonding: Depending on thespecific CSP design, wire bonding or flip chip bonding may be used to make electrical connections between the IC chip and the substrate. Wire bonding involves using fine wires to connect the chip to the substrate, while flip chip bonding involves directly bonding the chip to the substrate using solder bumps.5. Encapsulation: Similar to Cob, the CSP module is encapsulated with a protective material to provide mechanical support and protect the chip from external elements.6. Testing and inspection: Finally, the assembled CSP module undergoes testing and inspection to ensure its functionality and quality.中文回答：Cob和CSP是用于各个行业的两种不同的制造工艺。
PCB工艺流程及内部运作培训
3C601
贴件
3C601
插件
Component元件
元件
Pad焊盘
Conductor 线路
W/F 绿油
Boards for customers’ Special Requirements 客户特别要求的线路板
金手指板： 用电镀方法使线路板的接口部位加上一定厚度的镍层与金层，获得良好的稳定性、耐磨性、抗蚀性和修理的导电性、可焊性等性能，从而提高线路板的质量，满足电子工业日益发展的要求。 碳油板： 在客户要求的线路板的特殊部位，用丝印的方法加上一层碳油。 镀金板： 在图形电镀工序，不仅镀铜，而且整个线路还镀上一层金，替代喷锡层。 Entek（防氧化）板： 在喷锡线路板的工序中，把喷锡替换为在覆铜的部分加上化学保护膜（也称有机助焊剂（Organic Deposit)。
绿油
锡圈
V-Cut/ V坑
白字
PAD/焊锡盘
线路
3P20116A0
金手指
12. E-Test 电测试
设备: 电测仪、飞针测试仪(用于检查样板,有多 少short、open).
例如：O-1:275-382 表示第275点与第382点之 间开路。 S+1:386+1257 表示第386点与第1257点之 间短路。
PCB成品，例如：
Wet Film/绿油
Annual ring 锡圈
Screen Marks 白字
PAD/焊锡盘
3P20116A0
金手指
10. 成型(外形加工)
对成品板进行外形加工。（锣、啤、V-Cut)。
11. Gold Finger 镀金手指
使板的接口（金手指）部位加一定厚度Ni-Au层。提高稳定性、耐磨性、抗腐蚀性、导电性、易焊接性。
PCB制作流程详解
主要缺陷
板面起泡及分层：板电铜与化学铜或化学铜与基铜结合力差造成的； 孔粗； 孔红、孔黑 ； 孔无铜； 塞孔 ； 板面砂粒及粗糙； 水渍。
Scrubbing 磨板
Developing 显影
Exposure 曝光
Laminate Dry Film 辘干菲林
Strip Film 褪菲林
Strip Tin 褪锡
Wet Film 湿绿油
主要过程图解
Surface treatment 表面处理
Profiling 成型
表面处理方法
Hot Air Levelling 喷锡 Gold finger board 金手指板 Carbon oil board 碳油板 Au plating board 镀金板 Entek（防氧化）板 Immersion Au board 沉金板 Immersion Tin 沉锡板 Immersion Silver 沉银板
PCB所用板料概述
常用板料FR4相关特性介绍： 1）、板料成分组成：由玻璃布、环氧树脂、铜箔组成； 2）、玻璃布分为：普通板料用玻璃布（即玻璃布成圆柱形的）及LDPP用玻璃布（即玻璃布为椭圆形的，便于激光打孔时孔壁质量的改进）。目前存在类型有：7629、7628、2116、1506、1500、2113、2112、1080、106、3313等类型，他们的区别主要是在厚度、树脂含量、经纬向玻璃布的数量、大小等区别。 3）、树脂体系分为：含卤素同不含卤素两种环氧树脂（通常普通FR4含Br）； 4）、铜箔：按照加工方式的不同可分为电解铜箔及压延铜箔两种。其中按照铜箔的重量来分通常有1/3OZ、HOZ、1OZ、2OZ、3OZ、4OZ等，通常是重量越重厚度相对就越厚，如HOZ厚度为0.65MIL，1OZ为1.35MIL。
多层铜基板的流程
多层铜基板的流程（中英文版）Title: The Process of Multilayer Copper Baseplates标题：多层铜基板的制作流程In the realm of electronics manufacturing, multilayer copper baseplates are extensively used for various applications.They are primarily employed to provide structural support and electrical conductivity to PCBs (Printed Circuit Boards).The process of manufacturing multilayer copper baseplates involves several intricate steps, which are discussed below.在电子制造业中，多层铜基板被广泛应用于各种场合。
它们主要用于为印制电路板（PCB）提供结构支撑和电导性。
多层铜基板的制作流程包括几个复杂的步骤，下面将进行详细介绍。
The initial step in the fabrication process is to design the baseplate.This involves calculating the required dimensions, determining the number of layers, and deciding on the thickness of each layer.Once the design is finalized, the next step is to prepare the materials.High-purity copper is commonly used for manufacturing these baseplates, as it offers excellent electrical conductivity and malleability.制作流程的第一个步骤是设计基板。
PCB板制作要求
PCB板制作要求PCB板制作要求(PCB fabrication requirements)是指在设计和制造PCB板时需要遵守的一些规定和要求，以确保PCB板能够达到设计要求并满足相关标准。
以下是一些常见的PCB板制作要求：1. 材料选择要求(Material selection requirements)：根据设计要求和应用环境，选择适当的基板材料和覆铜厚度。
常见的基板材料包括FR-4、金属基板和高频材料等。
2. 尺寸和层数要求(Dimension and layer requirements)：根据电路设计和应用需求，确定PCB板的尺寸和层数。
考虑到制造成本和电路复杂度，尽量选择最合适的尺寸和层数。
3. 线宽/线距要求(Line width/space requirements)：根据设计电流、高频信号等要求确定线宽和线距。
常见的线宽/线距要求包括4/4mil、6/6mil和8/8mil等。
4. 阻抗控制要求(Impedance control requirements)：对于高频或高速信号的电路设计，通常需要控制PCB板上的阻抗。
通过调整线宽/线距、覆铜厚度等参数来实现阻抗控制。
5. 铜箔厚度要求(Copper thickness requirements)：根据电流要求和通过孔连接性能，选择合适的铜箔厚度。
常见的铜箔厚度包括1oz、2oz和3oz等。
6. 焊盘要求(Pad requirements)：根据元件封装尺寸和焊接方式，确定合适的焊盘尺寸和形状。
常见的焊盘形状包括圆形、矩形和椭圆形等。
7. 工艺要求(Process requirements)：根据制造工艺可行性和成本考虑，确定合适的PCB制造工艺，如沉金、镀锡等。
同时，还需要考虑PCB板的装配工艺，如贴片、插件和特殊封装等。
8. 贴装要求(Assembly requirements)：根据贴片元件和插件元件的规格要求，确定贴装工艺和工装夹具。
PCB专业术语翻译
PCB专业术语（英语）PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PWA Printed Wire Assembly，Aperture list Editor：光圈表编辑器。
Aperture list windows：光圈表窗口。
Annular ring：焊环。
Array：拼版或陈列。
Acid trip：蚀刻死角。
Assemby：安装。
Bare Bxnel：光板，未进行插件工序的PCB板。
Bad Badsize：工作台，工作台有效尺寸。
Blind Buried via：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
Circuit layer：线路层。
Clamshell tester：双面测试机。
Coordinates Area：坐标区域。
Copy-protect key：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
Drill Rack：铅头表。
Drill Rack Editor：铅头表编辑器。
Drill Rack window：铅头表窗口。
D Code：Gerber格式中用不着于表达光圈的代码。
Double-sided Biard：双面板。
End of Block character（EOB）：块结束符。
Extract Netlist：提取网络。
Firdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。
Grid ：栅格。
Graphical Editor：图形编辑器。
Incremental Data：增量数据。
Land：接地层。
Layer list window：层列表窗口。
双面覆铜板工艺流程
双面覆铜板工艺流程英文回答：Double-Sided Plated Through Hole (PTH) PCB Fabrication Process.1. Board Preparation.Cut the raw copper-clad laminate to the desired dimensions.Clean the surface of the copper to remove any oxides or contaminants.Apply a thin layer of adhesive to the copper surface.2. Drilling.Drill holes through the board at the locations specified in the design.The holes should be slightly larger than the diameter of the plated through holes.3. Plating.Chemically deposit a thin layer of copper on the surface of the holes.This layer of copper will provide a conductive path between the two sides of the board.4. Imaging.Apply a photoresist to the surface of the board.Expose the photoresist to ultraviolet light through a mask that defines the circuit pattern.Develop the photoresist to remove the unexposed areas.5. Etching.Etch the exposed copper away from the board.This will create the circuit pattern.6. Stripping.Remove the remaining photoresist from the board.7. Tin/Lead Plating.Apply a thin layer of tin/lead solder to the exposed copper surfaces.This will protect the copper from oxidation and improve solderability.8. Final Inspection.Inspect the board to ensure that it meets the design specifications.Test the board for electrical continuity and shorts.中文回答：双面覆铜板工艺流程。
pcb板制作工艺流程实验报告
pcb板制作工艺流程实验报告Introduction:PCB (Printed Circuit Board) fabrication is a crucial process in the manufacturing of electronic devices. It involves the design, layout, and production of the circuit board that connects various electronic components. In this report, I will discuss the detailed process of PCB fabrication and its significance in the electronics industry.PCB Design:The first step in PCB fabrication is the design phase. This involves creating a schematic diagram of the circuit and converting it into a layout design using specialized software. The layout design includes the placement and routing of components, traces, and vias on the board. This process requires careful consideration of factors such as signal integrity, power distribution, and thermalmanagement.中文回答：PCB板制作工艺流程实验报告。
引言：PCB（印刷电路板）制作是电子设备制造中的关键过程。
pcb插件工艺流程 英文
pcb插件工艺流程英文English Answer：PCB Assembly Process.The PCB assembly process is a complex and multi-step one that involves a number of different steps, including:1. Design and layout: The first step in the PCB assembly process is to design and layout the board. This involves creating a schematic diagram of the circuit, as well as a layout for the board itself. The layout of the board will determine the placement of the components on the board, as well as the routing of the traces.2. Fabrication: Once the design and layout of the board have been finalized, the board is fabricated. This involves creating the physical board itself, as well as the traces and other features on the board. The fabrication process typically involves a number of steps, including:Laminating: The first step in the fabrication process is to laminate the board. This involves bonding together multiple layers of material to create the board itself. The layers of material typically include a copper layer, a core layer, and a solder mask layer.Drilling: Once the board has been laminated, the next step is to drill the holes for the components. The holes are typically drilled using a CNC (computer numerical control) machine.Plating: After the holes have been drilled, the board is plated. This involves coating the board with athin layer of metal, such as copper or gold. The plating process helps to protect the board from corrosion and wear.Soldering: The final step in the fabrication process is to solder the components to the board. This involves melting solder and applying it to the joints between the components and the board. The soldering process is typically done using a wave soldering machine.3. Testing: Once the board has been assembled, it is tested to ensure that it is functioning properly. This involves testing the board for a variety of parameters,such as electrical continuity, shorts, and opens. Thetesting process typically involves using a variety of test equipment, such as a multimeter and an oscilloscope.4. Inspection: After the board has been tested, it is inspected to ensure that it meets all of the specifications. This involves visually inspecting the board for any defects, as well as measuring the board to ensure that it is within the specified tolerances.5. Packaging and shipping: Once the board has been inspected and approved, it is packaged and shipped to the customer. The packaging process typically involves placing the board in a protective box or container, as well as labeling the board with the necessary information, such as the part number and the serial number.Chinese Answer：PCB插件工艺流程。
pcba英文生产流程
pcba英文生产流程English:PCBA (Printed Circuit Board Assembly) production process typically involves several stages. Firstly, it begins with the procurement of electronic components from suppliers. These components undergo thorough inspection and testing to ensure quality and functionality. Following this, the PCB fabrication process takes place, where the circuit layout is transferred onto the board, and layers are laminated together. Once the PCBs are fabricated, the assembly process commences. This involves soldering electronic components onto the board according to the circuit layout. Automated assembly machines are often employed for efficiency and accuracy. After assembly, the PCBs undergo inspection to detect any defects or faults. Quality control measures are implemented to rectify any issues found. Finally, the finished PCBAs undergo functional testing to ensure they meet performance specifications. This comprehensive process ensures the production of high-quality PCBA products that meet industry standards and customer requirements.中文翻译:PCBA（印刷电路板组装）的生产过程通常涉及几个阶段。
pcb生产流程理解
pcb生产流程理解PCB production process is a complex and intricate procedure that involves several steps to ensure the final product meets the required specifications. The first step in the PCB production process is design and layout. This involves creating a blueprint of the circuit board, determining the arrangement of components and their connections.在PCB生产过程中，第一步是设计和布局。
这涉及创建电路板的蓝图，确定元件的排列和它们之间的连接。
设计和布局需要精确的计划和技术知识，以确保电路板的功能和性能达到预期的水平。
设计师必须考虑电路板上所有元件的位置和布线，确保它们之间的连接正确并且没有混淆。
The next step in the PCB production process is the fabrication of the board itself. This involves the use of specialized equipment and techniques to create the physical circuit board from a substrate material, such as fiberglass or epoxy resin. The fabrication process requires high precision and attention to detail to ensure the board meets the required specifications.接下来的步骤是实际的电路板制作。
pcb光板生产工艺流程
pcb光板生产工艺流程英文回答：PCB (Printed Circuit Board) production involves several steps in order to create a functional and reliable circuit board. The process starts with the design and layout of the PCB, followed by the fabrication of the board, and finally the assembly of components onto the board.The first step in the production process is the design and layout of the PCB. This involves creating a schematic diagram of the circuit and determining the placement of components on the board. Software tools like Altium Designer or Eagle are commonly used for this purpose. The layout must take into consideration factors such as signal integrity, power distribution, and thermal management.Once the design is complete, the fabrication process begins. This involves transferring the design onto a copper-clad laminate material. The most common method is byusing a photoresist, where a photosensitive material is applied onto the laminate and exposed to UV light through a photomask. The exposed areas are then etched away, leaving behind the copper traces that form the circuit.After the etching process, the board is cleaned and inspected for any defects. This is followed by the drilling of holes for component placement and electrical connections. The holes are typically drilled using computer-controlled drilling machines.Next, a thin layer of solder mask is applied to the board. This helps to protect the copper traces and prevent solder bridges during the assembly process. The solder mask is typically applied using a screen printing method.Once the solder mask is applied, the board goes through a process called surface finishing. This involves applyinga thin layer of metal onto the exposed copper traces to improve solderability and prevent oxidation. The most common surface finish is called HASL (Hot Air Solder Leveling), where the board is dipped into a bath of moltensolder and then leveled using hot air.Finally, the assembled components are soldered onto the board. This can be done either by hand soldering or by using automated pick-and-place machines. The soldering process involves applying heat to the solder paste, which melts and creates a strong electrical and mechanical connection between the component leads and the copper traces on the board.中文回答：PCB（印制电路板）的生产涉及多个步骤，以创建一个功能齐全且可靠的电路板。
PCB专业术语翻译(英语)
PCB专业术语（英语）PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PW A Printed Wire Assembly，Aperture list Editor：光圈表编辑器。
Aperture list windows：光圈表窗口。
Annular ring：焊环。
Array：拼版或陈列。
Acid trip：蚀刻死角。
Assemby：安装。
Bare Bxnel：光板，未进行插件工序的PCB板。
Bad Badsize：工作台，工作台有效尺寸。
Blind Buried via：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
Circuit layer：线路层。
Clamshell tester：双面测试机。
Coordinates Area：坐标区域。
Copy-protect key：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
Drill Rack：铅头表。
Drill Rack Editor：铅头表编辑器。
Drill Rack window：铅头表窗口。
D Code：Gerber格式中用不着于表达光圈的代码。
Double-sided Biard：双面板。
End of Block character（EOB）：块结束符。
Extract Netlist：提取网络。
Firdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。
Grid ：栅格。
Graphical Editor：图形编辑器。
Incremental Data：增量数据。
Land：接地层。
Layer list window：层列表窗口。
PCB制作流程范文
PCB制作流程范文PCB（Printed Circuit Board）是印刷电路板的缩写，是电子产品中的重要组成部分。
PCB制作流程是指将电路图设计文件制作成实际可用的印刷电路板的过程。
下面将详细介绍PCB制作的流程。
第一步：设计电路图（Schematic Design）PCB制作的第一步是设计电路图。
电路图是电子产品中各个元件之间的连接图，用于指导后续PCB制作工作。
在设计电路图时，设计师需要根据所需功能、元器件的特性和基板的布局等因素，绘制电路图，并确定各个元件之间的连接方式。
第二步：制作原理图（Schematic Capture）制作原理图是根据设计的电路图，在电脑上使用相关设计软件将电路图进行绘制。
制作原理图时，需要在软件中选择合适的元器件并对其进行参数设置，使得原理图能够准确地反映电路图的设计意图。
第三步：布局设计（PCB Layout）布局设计是将制作好的原理图转换为PCB板的布线图。
在布局设计过程中，设计师需要根据原理图中元器件的连接关系、信号传输距离等因素，合理地布置元器件和连接线路，以使得电路板的性能和可靠性得到保证。
在布局设计完成后，需要对所需的元器件进行选择和采购。
在选择元器件时，需要考虑其参数和特性是否满足设计需求，并确保元器件的可靠性、供应可靠性和成本控制。
第五步：印刷电路板制造（PCB Fabrication）印刷电路板制造是将布局设计好的电路板进行制作的过程。
制造PCB 的方法有很多种，常用的方法包括：切割铜箔法、蚀刻法和电镀法。
制造PCB的过程中，需要进行图形转移、设备调试和加工工艺控制等步骤，以确保PCB制作的质量和性能达到设计要求。
元器件安装是将制作好的PCB板与所需的元器件进行焊接和装配的过程。
元器件安装有手工安装和自动化安装两种方式。
手工安装适用于一些小批量、高精度的产品；自动化安装适用于大批量和高速率的产品。
安装完成后，需要进行焊接质量检查和连接功性能测试。
绘制pcb板的一般流程
绘制pcb板的一般流程英文回答：PCB Layout Process.The PCB layout process is a critical step in the design of electronic devices. It involves creating a physical layout for the circuit board, which includes the placement of components, routing of traces, and design of power and ground planes. The goal of PCB layout is to create a board that is both functional and manufacturable.The PCB layout process typically involves the following steps:1. Schematic capture: The first step is to create a schematic diagram of the circuit. This diagram shows the electrical connections between the different components of the circuit.2. Component placement: Once the schematic diagram is complete, the next step is to place the components on the PCB. This is done by manually positioning the components or by using automated placement software.3. Trace routing: Once the components are placed, the next step is to route the traces. Traces are the copper conductors that connect the different components on the PCB. They must be routed in a way that minimizes their lengthand avoids interference with other components.4. Power and ground plane design: The power and ground planes are two important layers of the PCB. They provide power and ground connections to the components on the board. The power and ground planes must be designed carefully to avoid noise and interference.5. Board fabrication: Once the PCB layout is complete, the next step is to fabricate the board. This is done by a PCB fabrication house, which will use a variety of processes to create the board.6. Assembly: The final step in the PCB layout processis to assemble the board. This involves soldering the components onto the board and testing the board to ensure that it is functioning properly.The PCB layout process is a complex and challenging one, but it is essential for creating functional and manufacturable electronic devices. By following the steps outlined above, you can create a PCB layout that meets your design requirements.中文回答：PCB 布局流程。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
HASL PCB
一、开料
目的：根据工程资料MI的要求，在符合要求的大张板材上，裁切成小块生产板件．符合客户要求的小块板料．
流程：大板料→按MI要求切板→锔板→啤圆角＼磨边→出板
二、钻孔
目的：根据工程资料（客户资料），在所开符合要求尺寸的板料上，相应的位置钻出所求的孔径．
流程：叠板销钉→上板→钻孔→下板→检查＼修理
三、沉铜
目的：沉铜是利用化学方法在绝缘孔壁上沉积上一层薄铜．
流程：粗磨→挂板→沉铜自动线→下板→浸1%稀H2SO4→加厚铜
四、图形转移
目的：图形转移是生产菲林上的图像转移到板上
流程：（蓝油流程）：磨板→印第一面→烘干→印第二面→烘干→爆光→冲影→检查；（干膜流程）：麻板→压膜→静置→对位→曝光→静置→冲影→检查
五、图形电镀
目的：图形电镀是在线路图形裸露的铜皮上或孔壁上电镀一层达到要求厚度的铜层与要求厚度的金镍或锡层．
流程：上板→除油→水洗二次→微蚀→水洗→酸洗→镀铜→水洗→浸酸→镀锡→水洗→下板
六、退膜
目的：用NaOH溶液退去抗电镀覆盖膜层使非线路铜层裸露出来．
流程：水膜：插架→浸碱→冲洗→擦洗→过机；干膜：放板→过机
七、蚀刻
目的：蚀刻是利用化学反应法将非线路部位的铜层腐蚀去．
八、绿油
目的：绿油是将绿油菲林的图形转移到板上，起到保护线路和阻止焊接零件时线路上锡的作用
流程：磨板→印感光绿油→锔板→曝光→冲影；磨板→印第一面→烘板→印第二面→烘板
九、字符
目的：字符是提供的一种便于辩认的标记
流程：绿油终锔后→冷却静置→调网→印字符→后锔
十、镀金手指
目的：在插头手指上镀上一层要求厚度的镍＼金层，使之更具有硬度的耐磨性
流程：上板→除油→水洗两次→微蚀→水洗两次→酸洗→镀铜→水洗→镀镍→水洗→镀金
十、镀锡板
目的：喷锡是在未覆盖阻焊油的裸露铜面上喷上一层铅锡，以保护铜面不蚀氧化，以保证具有良好的焊接性能．
流程：微蚀→风干→预热→松香涂覆→焊锡涂覆→热风平整→风冷→洗涤风干
十一、成型
目的：通过模具冲压或数控锣机锣出客户所需要的形状成型的方法有机锣，啤板，手锣，手切
说明：数据锣机板与啤板的精确度较高，手锣其次，手切板最低具只能做一些简单的外形．
十二、测试
目的：通过电子100％测试，检测目视不易发现到的开路，短路等影响功能性之缺陷．
流程：上模→放板→测试→合格→FQC目检→不合格→修理→返测试→OK→REJ→报废
十三、终检
目的：通过100％目检板件外观缺陷，并对轻微缺陷进行修理，避免有问题及缺陷板件流出．
具体工作流程：来料→查看资料→目检→合格→FQA抽查→合格→包装→不合格→处理→检查OK
应用：
: 把传统热风整平工艺应用于无铅焊锡涂覆 , 对垂直式和水平式多种设备与材料进行试验比较 , 研究得出相应的无铅焊锡涂覆工艺参数。
1. 前言
热风整平焊锡 (HASL) 现在是印制板制造中普遍应用的技术 , 印制板无铅化要求取消
应用的锡铅合金 , 这就威胁到 HASL 工艺是否会被取消。
对于 HASL 需要变革的是材料一无铅焊锡代替锡铅焊锡 , 成熟的工艺与设备仍是实现印制板无铅化的理想技术。
国外已有多次报道热风整平无铅焊锡技术 , 现把英国《 Circuit World 》 2005 年第 2 期 , 作者杰克·弗利曼 (Jack Feliman) 的这篇研究报告介绍给国内同行 , 希望重视热风整平无铅焊锡技
术 , 充分利用现有的 HASL 资源。
该研究是在一个垂直式与二个水平式热风整平机上进行无铅焊锡热风整平试验 , 采用物理特性符合要求的助焊剂和油 , 对不同设备条件选择不同的
工艺参数。
试验样板是覆铜箔层压板和模拟产品板。
研究关键的是要掌握在各种生产运作时焊锡中铜和镍浓度变化 , 以及对合金配方进行稀释与补充调整的方案。
HASL 运作中质量控制 , 评估试验板上沉积焊锡层的品质性能。
2. 试验材料
2.1 垂直式中
试验是用锡铜镍合金焊锡 , 合金组成 SN0.7Cu+Ni, 熔点温度 227 ℃ , 比锡铅合金熔点高 44 ℃。
试样板也涂覆一种常规广泛应用的液态光成像阻焊剂 (LPISM), 考验经受高温试验后性能影响。
试验中板面涂复三种粘度不同的助焊剂 , 粘度是从 50cP( 厘泊 ) 到 400cP 。
生产过程模拟用双面覆铜箔层压板 , 板厚度 0.7mm , 铜箔厚 1oz , 板面尺寸 30.5 x 45.7c
m ( 12” x 18” ) 。
2.2 水平式 I 中
这个试验用典型的锡铅焊料整平设备 , 工艺中开发高温稳定的试验油。
同时也试验助焊剂。
水平式 I 中试验用到二种无铅合金 , 分别是 Sn0.7Cu 和 Sn0.7Cu+Ni 。
这样分别试验可以比较各种合金的优缺点。
试验板上所用阻焊剂和覆铜箔层压板与垂直式的相同 , 只是板面尺寸大些 , 为 45.7 x 61.0cm ( 18” x 24” ) 。
2.3 水平式 II 中
在水平式 II 试验时选择更高闪点和热稳定性的助焊剂和油。
试验用 Sn0.7Cu+Ni 焊
锡 , 试验板同水平式 I 中相同。
2.4 高温助焊剂特点
用于较高熔点的 Sn0.7Cu+Ni 合金焊锡的助焊剂应该活性较低 , 以使减少对热风整平
设备的腐蚀性 , 特别是对焊锡槽的腐蚀。
由于无铅焊锡操作温度较高 , 在 265 ～ 275 ℃之间 , 要求助焊剂闪点比工作温度更高 , 这是有利于生产中安全性 ; 同时希望助焊剂热稳定性好 , 在工作中助焊剂分解缓慢 , 防止烟雾气味放出。
还有 , 这种低活助焊剂主要由水溶性有机聚合物构成 , 便于清洗 , 焊渣也容易除去。
当然 , 低活性助焊剂仍需有好的助焊促进作
用 , 使板子铜面充满润湿焊锡。
不可因助焊剂活性太低 , 而造成有铜面曝露。
2.5 高温油特点
高温油是保护焊锡槽表面 , 减少焊锡的氧化和助焊剂的消耗 , 降低材料成本。
对高温油要求重要的是有高闪点 , 其闪点在设备操作温度以上 , 使有很大安全系数。
所用高温油应便于清洗 , 也不让助焊剂碳化物等聚积于机器上 , 使得机器保持清洁。
在实际应用中 , 只需在维护时把高温油充满槽体 , 不必时常添加补充。
3. 试验载体
该试验板板面18” x 24” , 厚度 0.093in ( 2.36mm ), 涂覆有广泛使用的 LPISM 。
整块试验板板面设计有四拼版图形 ,4 个拼版单元的尺寸是8.15” x 10.75” , 各个拼版单元再含
有 4 个更小的图形 ( 4” x 5” ) 。
每个单元上的 4 个图形并不是相同的复制 , 而是代表四种不同设计特征的图形。
图形是按照适合 BGA 和 QFP 器件的安装而设计 , 要求小节距、小盘和细线 , 如每个图形有 992 个孔 , 每个单元板有 3986 个孔。
4. 试验方案
对于三种设备类型的试验理论是相同的 , 只是水平式 II 试验会有更多材料和较长运作时间。
试验板在垂直式与水平式设备运作处理 , 进行有铅焊锡和无铅焊锡的比较。
在试验开始时 , 先从焊锡槽取样测定焊锡合金成份 , 特别是铜与镍的含量。
规定试验板开始运作时工艺条件。
产品是模拟工艺处理的 100 块双面覆铜箔层压板 , 垂直式试验板尺寸 30.5 x 45.7c m (1ftx 1.5ft ), 水平式试验板尺寸 45.7 x 61.0cm ( 1.5ft x 2ft ) 。
这两种尺寸试验板的铜表面积相当于 300ft 2 和 600ft 2 。
假定每块板面铜面积占 25%, 这相当于产品工件 1200 f
t 2 和 2400 ft 2 , 或者说约 200 和 400 块板。
在运作和比较启动条件的是第二试验板。
另外 100 块层压板是按第三试验板运作。
第四试验板前运作这第三设立的 100 块层压板。
在制板是按 IPC 中测量表面绝缘电阻 (SIR) 的原图设计。