无铅化电子产品可靠度试验

SGS Confidential
15
Reliability Tests for Lead-free E&E Products
沾錫能力試驗—沾錫天平法 J-STD-002B Method E/ F
Environmental Testing & Reliability Lab
SGS Confidential
Reflow Profile Comparisons (Sample) SnPb versus Pb-free
Time in Minutes
Environmental Testing & Reliability Lab
SGS Confidential
9
Reliability Tests for Lead-free E&E Products
1
Reliability Tests for Lead-free E&E Products
電子產品無鉛化會遇到什麼問題？
料件耐熱溫度須提升 表面處理變更：沾錫性、相容性及可靠度須 行評估
焊錫材料標準化、疲勞耐久及可靠 度須行評估
迴焊溫度最適化
表面處理變更：沾錫性、相容性 及可靠度須行評估
選擇合適的電路板材
Peak：260℃
Pre-heating Zone
3℃ ～ 6℃/s
Soldering Zone
Heating Time
Environmental Testing & Reliability Lab
SGS Confidential
19
Reliability Tests for Lead-free E&E Products
10
Reliability Tests for Lead-free E&E Products
端子／焊墊沾錫能力
Environmental Testing & Reliability Lab
SGS Confidential
11
端子／焊墊沾錫能力 Case Study- Mobil Phone
Reliability Tests for Lead-free E&E Products
電子產品無鉛化會遇到什麼問題？ 端子／焊墊沾錫能力 濕氣／迴焊敏感性（耐錫熱能力） 錫鬚形成的可能性 焊點可靠度 與傳統鉛錫合金產品比較具備相同特性與功能 (產品的環測與可靠度試驗規格要求應一致甚至更好)
Environmental Testing & Reliability Lab
SGS Confidential
Environmental Testing & Reliability Lab
SGS Confidential
2
Reliability Tests for Lead-free E&E Products
電子產品無鉛化會遇到什麼問題？
隨各部件選用材料的變更，製程對材料本身及不同材 料間的物理、化學特性的影響需重新評估 今後3~5年間在電子產品生產過程中需解決下列問題
IPC A 610D
Environmental Testing & Reliability Lab
SGS Confidential
14
Reliability Tests for Lead-free E&E Products
沾錫能力試驗—蒸氣老化
Environmental Testing & Reliability Lab
Environmental Testing & Reliability Lab
SGS Confidential
21
Reliability Tests for Lead-free E&E Products
耐錫熱試驗- 手焊(Iron Soldering)
MIL-STD 202G, Method 210F：Axial/ Radial/ Insertion Components or Hand Soldering SMD
Jockey Huang Asst. Supervisor t: 02-2298-3355 ext. 3763 f: 02-2299-9558 e: jockey.huang@
Environmental Testing & Reliability Lab
SGS Confidential
相圖─Sn-Ag-Cu合金系統
Source: /phase/solder/agcusn.html
Environmental Testing & Reliability Lab
SGS Confidential
6
Reliability Tests for Lead-free E&E Products
無鉛焊錫合金之選用
Environmental Testing & Reliability Lab
SGS Confidential
7
Reliability Tests for Lead-free E&E Products
各類焊錫合金比較
Melting Base material point(℃) Sn-Ag 190～210 210～220 Added material Bi(Lower T) Cu(Wettab.) Zn, In(Th. Fat.) Ag,Cu etc. Bi(Wettab.) In(Th. Fat.) Ag Cu Ag etc. Feature Good for thermal Strong pull strength Good elongation Lower melting temp. is possible Strong pull strength Good wettability Same profile as PbSn solder Low cost（ＳｎＰｂ x 1.5） Strong pull strength Good elongation Lower melting temp. is possible Good elongation Issues High melting temperature Expensive(ＳｎＰｂ x 2 to 3） Poor wettability Hard and fragile Difficult to machining Short thermal fatigue life Short thermal fatigue life Poor wettability (N2 reflow is necessary） Expensive Property of paste is easy to change Small pull strength
SGS Confidential
20
Reliability Tests for Lead-free E&E Products
耐錫熱試驗- 浸焊(Dip Soldering)
SS-00254-4 Solder Heat Resistance Test for TMDs, Lead-free Soldering
無鉛標示
According JEDEC Standard- JESD 97 : Marking, Symbols and Labels for Identification of Lead (Pb) Free Assemblies, Components and Devices.
Environmental Testing & Reliability Lab
SGS Confidential
4
Reliability Tests for Lead-free E&E Products
相圖─Pb-Sn合金系統
Environmental Testing & Reliability Lab
SGS Confidential
5
Reliability Tests for Lead-free E&E Products
傳統錫鉛製程 無鉛製程 Lead Free Components
Pb Components
SnPb Solder
Environmental Testing & Reliability Lab
Lead Free Solder
3
SGS Confidential
Reliability Tests for Lead-free E&E Products
耐錫熱試驗- 浸焊(Dip Soldering)
MIL-STD 202G, Method 210F：Axial/ Radial/ Insertion Components
Test Condition B, Solder Dip
Environmental Testing & Reliability Lab
Flow soldering with solder bath [Flow] → [Left at a room temperature] → [Flow] Flow soldering condition: 260 ℃, 5 seconds Hand soldering (with soldering iron): 380 ℃, 3 seconds
Reliability Concern.
Reliability Tests for Lead-free E&E Products
Reference: IPC A610D.
Environmental Testing & Reliability Lab
SGS Confidential
13
Reliability Tests for Lead-free E&E Products
Test Condition B, Solder Iron Temp. 400ºC
Environmental Testing & Reliability Lab
SGS Confidential
22
Reliability Tests for Lead-free E&E Products
Sn-Bi
Байду номын сангаас
190～210
Sn-Zn
190～200
Sn-In
117 (52%In)
Environmental Testing & Reliability Lab
SGS Confidential
8
Reliability Tests for Lead-free E&E Products
迴焊(Reflow)製程比較-例
Reliability Tests for Lead-free E&E Products
無鉛化電子產品可靠度試驗 Reliability Tests for Lead-free E&E Products
環測及可靠度實驗室―黃三泰
Environmental Testing & Reliability Lab- Jockey Huang
SnAgCu (Pb-free) Profile
Reflow @ 217C Peak Temp = 235 to 245C Time above liquidous: 40120 s Ramp rate: 3oC/s
Temperature, Deg C
SnPb Profile
Reflow @ 183C Peak Temp. = 205 to 220C
All components should be evaluated. PCB, R/ C Chip, ICs, Connectors.
Environmental Testing & Reliability Lab
SGS Confidential
12
端子／焊墊沾錫能力 Case Study- Mobil Phone
16
沾錫能力評估_J-STD-002B Method E
Reliability Tests for Lead-free E&E Products
Environmental Testing & Reliability Lab
SGS Confidential
17
Reliability Tests for Lead-free E&E Products
沾錫能力優劣示意圖
Environmental Testing & Reliability Lab
SGS Confidential
18
Reliability Tests for Lead-free E&E Products
濕氣／迴焊敏感性&耐錫熱試驗
Temp. （℃）
Lead Free Temp. Profile