Rapid Prototyping of a Reusable 4x4 Active ATM Switch Core with the PCI Pamette

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快速成型技术Rapid Prototyping

Байду номын сангаас
LOM原理图
工作台上升
多余网格部分的去除
头盖骨
薄壳件
LOM 2030 H机器外观
LOM优点：（1）成型效率高，LOM工艺只需在片材上切割出零件截面的轮廓，而不用扫描整个截面，因此成型厚壁零件的速度较快，易于制造大型零件；（2）无翘曲变形，工艺过程中不存在材料相变，因此没有热应力、膨胀和收缩不易引起翘曲变形；（3）无需加支撑，工件外框与截面轮廓之间的多余材料在加工中起到了支撑作用，所以LOM工艺无需加支撑。 LOM缺点：材料浪费严重，表面质量差。
单层层厚指铺粉厚度,即工作缸下降一层的高度。对于某一制品,采用较大的单层厚度,所需制造的总层数少,制造时间短。但由于激光在粉末中的透射强度随厚度的增加而急剧下降,单层厚度过大,会导致层与层之间黏结不好,甚至出现分层,严重影响成型件的强度。 SLS的优点是无需支撑,成型的零件机械性能好,强度高。缺点是粉末比较松散,烧结后精度不高,尤其是Z轴方向的精度难以控制。
目前美国在RP领域处于主导地位，德国、以色列、日本也处于国际领先水平。
2、RP技术原理和成型过程传统加工：去材法、变形法。 RP加工：材料累加法。计算机科学
CAD/ CAM
数控技术
激光技术新材料
自动、快速、准确
RP 制品
RP技术基本原理：离散—堆积（叠加）
三维模型构建： Pro/E、UG、 SolidWorks、激光扫描、 CT断层扫描等三维模型的近似处理:三角形平面来逼近原来的模型（STL文件）三维模型的切片处理：加工方向（Z方向）进行分层
目前，基于RP的RT的方法多为间接制模法，依据材质不同，间接制模法生产出来的模具一般分为软质模具和硬质模具两大类。软质模具制造方法主要有树脂浇注法、金属喷涂法、电镀法、硅橡胶浇铸法等。（1）硅橡胶浇注法制作过程为：原型的表面处理涂刷脱模剂，固定原型并放臵型框硅橡胶计量、真空脱泡后进行混合硅橡胶固化后，刀剖开模，取出原型

创新的例子简短英语作文

创新的例子简短英语作文Title: Examples of Innovation。

Innovation is the cornerstone of progress, driving advancements across various fields and shaping the way we live, work, and interact. Here, we delve into a few compelling examples of innovation that have revolutionized industries and impacted society profoundly.1. Tesla's Electric Vehicles (EVs):Tesla, led by visionary entrepreneur Elon Musk, disrupted the automotive industry with its innovativeelectric vehicles. By prioritizing sustainable technology, Tesla not only addressed environmental concerns but alsoset new standards for performance and design in the automotive sector. The integration of cutting-edge battery technology, autonomous driving features, and over-the-air software updates showcases Tesla's commitment to innovation.2. SpaceX's Reusable Rockets:SpaceX, founded by Elon Musk, revolutionized space exploration by developing reusable rocket technology. Traditionally, space missions incurred exorbitant costs due to the expendable nature of rocket components. However, SpaceX's Falcon rockets, equipped with reusable first stages, significantly reduce the cost of launching payloads into space. This innovation has made space exploration more accessible and economically viable, fostering new opportunities for scientific research and commercial ventures.3. CRISPR-Cas9 Gene Editing:CRISPR-Cas9 is a revolutionary gene-editing toolthat enables precise modifications to the genetic code of organisms. This technology has immense potential for applications in agriculture, medicine, and biotechnology.By providing researchers with a versatile and efficient method for genetic manipulation, CRISPR-Cas9 hasaccelerated advancements in gene therapy, disease treatment,and crop improvement. Its impact on genetic research and its therapeutic potential for genetic disorders signify a paradigm shift in biomedicine.4. Blockchain Technology:Blockchain technology, best known as the underlying infrastructure for cryptocurrencies like Bitcoin, offers a decentralized and secure method for recording transactions across a network of computers. Beyond its application in finance, blockchain has the potential to revolutionize various industries, including supply chain management, healthcare, and voting systems. Its transparency, immutability, and resistance to tampering provide a foundation for trustless systems and innovative solutions to age-old problems.5. 3D Printing:3D printing, also known as additive manufacturing, enables the creation of three-dimensional objects by layering materials based on digital designs. Thistechnology has transformed prototyping, manufacturing, and customization processes across industries ranging from aerospace to healthcare. By allowing rapid prototyping and on-demand production of complex geometries, 3D printing reduces waste, shortens production cycles, and empowers designers to unleash their creativity.6. Artificial Intelligence (AI) in Healthcare:AI applications in healthcare, such as machine learning algorithms and predictive analytics, have revolutionized patient care, diagnosis, and treatment planning. By analyzing vast amounts of medical data, AI systems can identify patterns, predict outcomes, and assist healthcare professionals in making informed decisions. From early disease detection to personalized treatment plans,AI-powered healthcare solutions have the potential to improve patient outcomes and reduce healthcare costs.These examples illustrate the transformative power of innovation across diverse domains, driving progress, and shaping the future of our society. As pioneers continue topush the boundaries of what is possible, the impact of innovation will continue to redefine industries and improve the quality of life for people around the globe.。

Packaging and Containers Design

Packaging and Containers Design Packaging and container design is a crucial aspect of product development and marketing. It plays a significant role in protecting the product, attracting consumers, and communicating the brand's identity. When designing packaging and containers, various factors need to be considered, including functionality, sustainability, aesthetics, and cost-effectiveness. This essay will explore the importance of packaging and container design from different perspectives, discussing the challenges, trends, and future prospects in the industry. From a consumer's perspective, packaging and container design is the first point of contact with a product. It influences the consumer's perception of the product's quality, value, and brand identity. A well-designed package can create a positive emotional response and make the product stand out on the shelf. On the other hand, poor packaging design can deter consumers from making a purchase, even if the product itself is of high quality. Therefore, it is essential for designers to understand consumer behavior and preferences when creating packaging and containers. From a marketing standpoint, packaging and container design is a powerful tool for brand communication. It conveys the brand's message, values, and personality, helping to differentiate the product from competitors. Packaging design can also evoke emotions and create a memorable experience for consumers. For example, environmentally friendly packaging can appeal to consumers who prioritize sustainability, while luxurious packaging can convey a sense of premium quality. In today's competitive market, companies are increasingly investing in innovative packaging designs to captivate consumers and build brand loyalty. From a functional perspective, packaging and container design serves the practical purpose of protecting the product during storage, transportation, and display. It should ensure the product's safety, freshness, and integrity while being convenient for handling and use. Designers need to consider factors such as material durability, product compatibility, and ergonomics to create packagingthat meets these functional requirements. Additionally, with the rise of e-commerce, packaging design needs to adapt to the challenges of shipping and delivery, such as minimizing waste and maximizing space efficiency. From a sustainability standpoint, packaging and container design plays a critical role inaddressing environmental concerns. The excessive use of non-biodegradable materials and single-use plastics has led to a global waste crisis. Designers are now tasked with creating eco-friendly packaging solutions that minimize environmental impact without compromising functionality and aesthetics. This has led to the development of sustainable materials, such as bioplastics, compostable packaging, and reusable containers, as well as innovative design concepts that prioritize recyclability and waste reduction. From a technological perspective, packaging and container design is constantly evolving with advancements in materials, manufacturing processes, and printing techniques. Digital printing technology, for instance, allows for more intricate and customizable designs, enabling brands to create unique and personalized packaging. 3D printing is also revolutionizing the prototyping and production of packaging, offering greater flexibility and creativity in design. Furthermore, smart packaging technologies, such as RFID tags and QR codes, are being integrated into packaging to provide interactive and informative experiences for consumers. In conclusion, packaging and container design is a multifaceted discipline that encompasses various considerations, from consumer preferences to sustainability and technological innovation. It is a dynamic and evolving field that requires creativity, strategic thinking, and a deep understanding of market trends. As the industry continues to face challenges such as environmental impact and changing consumer behaviors, designers must adapt and innovate to create packaging and containers that are not only visually appealing and functional but also sustainable and socially responsible. Ultimately, effective packaging and container design has the power to enhance the overall product experience and drive the success of brands in the marketplace.。

3D快速建模【英文】

Rapid Prototyping Operations
CHAPTER 19
Rapid prototyping
• • • • • Introduction Subtractive processes Additive process Virtual Prototyping Applications
Additive Process
Require elaborate software
1 : Obtain cad file
2 : Computer then constructs slices of a 3-dimensional part 3 : slice analyzed and compiled to provide the rapid prototyping machine 4 : setup of the proper unattended and provide rough part after few hours 5 : Finishing operations and sanding and painting
Advantages
• CAD data files can be manufactured in hours. • Tool for visualization and concept verification. • Prototype used in subsequent manufacturing operations to obtain final part • Tooling for manufacturing operations can be produced
• Manufacturing Software (Planning Machining operations)

飞思卡尔半导体用户指南说明书

Freescale Semiconductor User’s Guide1OverviewThe Freescale Freedom development platform is a set of software and hardware tools for evaluation and development. It’s ideal for the rapid prototyping ofmicrocontroller-based applications. The Freescale Freedom KL26Z hardware (FRDM-KL26Z) is a capable and cost-effective design featuring a Kinetis L seriesmicrocontroller, the industry’s first microcontroller built on the ARM® Cortex™-M0+ core.FRDM-KL26Z can be used to evaluate the KL16 and KL26 Kinetis L series devices. It features a KL26Z128VLH4, a device boasting a maximum operating frequency of 48MHz, 128KB of flash, a full-speed USB controller, and numerous analog and digital peripherals. The FRDM-KL26Z hardware is form-factor compatible with the Arduino™ R3 pin layout, providing a broad range of expansion board options. The on-board interfaces include an RGB LED, a 6-axis digital sensor (combining a 3D accelerometer and 3Dmagnetometer), ambient light sensor, and a capacitive touch slider.The FRDM-KL26Z features the Freescale open standard embedded serial and debug adapter known as OpenSDA.Doc Number:FRDMKL26ZUGRev. 0, 10/2013Contents1.Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . 23.Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24.FRDM-KL26Z hardware overview . . . . . . . . . . . . . . 25.FRDM-KL26Z hardware description . . . . . . . . . . . . . 5FRDM-KL26Z User’s GuidebyFreescale Semiconductor, Inc.Reference documentsThis circuit offers several options for serial communications, flash programming and run-control debugging.2Reference documentsThe table below provides a list of reference documents for the FRDM-KL26Z hardware. All of these documents are available online at /FRDM-KL26Z.Table1. FRDM-KL26Z reference documentsFilename DescriptionFRDM-KL26Z Quick Start Package Quick Start Guide and supporting files for getting started with the FRDM-KL26Z FRDM-KL26Z User’s Guide This document—overview and detailed information for the FRDM-KL26ZhardwareFRDM-KL26Z Pinouts Spreadsheet of pin connections for all MCU pins. Includes pinout for the I/Oheaders, Arduino R3 compatibility chart, and OpenSDA MCU pinout.FRDM-KL26Z Schematics PDF schematics for the FRDM-KL26Z hardwareFRDM-KL26Z Design Package Zip file containing all design source files for the FRDM-KL26Z hardware OpenSDA User’s Guide Overview and instructions for use of the OpenSDA embedded debug circuit3Getting startedSee the FRDM-KL26Z Quick Start Package for step-by-step instructions to get started with the FRDM-KL26Z. See the Jump Start Your Design section on /FRDM-KL26Z for the Quick Start Package and software lab guides.4FRDM-KL26Z hardware overviewThe features of the FRDM-KL26Z include:•MKL26Z128VLH4 in a 64 LQFP package•Capacitive touch slider•FXOS8700CQ accelerometer and magnetometer•Tri-color (RGB) LED•Ambient light sensor•User push button•Flexible power supply options – USB, coin cell battery, external source•Battery-ready, power-measurement access points•Easy access to MCU I/O via Arduino™ R3 compatible I/O connectors•Programmable OpenSDA debug interface with multiple applications available including:—Mass storage device flash programming interface—P&E Debug interface provides run-control debugging and compatibility with IDE toolsFRDM-KL26Z hardware overview—CMSIS-DAP interface: new ARM standard for embedded debug interface—Data logging applicationFigure1 shows a block diagram of the FRDM-KL26Z design. The primary components and their placement on the hardware assembly are pointed out in Figure2.Figure1. FRDM-KL26Z block diagramFRDM-KL26Z hardware overview! (Figure2. FRDM-KL26Z feature call-outsFRDM-KL26Z hardware description5FRDM ‐KL26Z hardware description5.1Power supplyThere are multiple power supply options on the FRDM-KL26Z. It can be powered from either of the USB connectors, the VIN pin on the I/O header, an on-board coin cell battery, or an off-board 1.71-3.6V supply from the 3.3V pin on the I/O header. The USB and VIN supplies are regulated on-board using a 3.3V linear regulator to produce the main power supply. The other two sources are not regulated on-board. Table 2 provides the operational details and requirements for the power supplies.Table 2.Power supply requirementsNote that the OpenSDA circuit is only operational when a USB cable is connected and supplying power to J10. However, protection circuitry is in place to allow multiple sources to be powered at once.Figure 3 shows the schematic drawing for the power supply inputs and the on-board voltage regulator.Figure 3. Power supply schematicIn addition, regulated power can be supplied to J3 pin 10 from an external source through P5-9V_VIN by populating the board with an optional voltage regulator, e.g. a 7805 style regulator in a TO-220 package, thus providing a high current supply to external devices. To prevent voltage sag under a high load, C23,Supply Source Valid RangeOpenSDA Operational?Regulated on-board?OpenSDA USB (J7)5V Yes Yes KL26Z USB (J5)5V No Yes V in 4.3-9V No Yes 3.3V pin 1.71-3.6V No No Coin cell battery1.71-3.6VNoNoFRDM-KL26Z hardware descriptionC24, C25 & C28 should be populated with appropriately sized capacitors to match the regulator chosen. See Figure4.Figure4. Optional voltage regulator schematicTable3. FRDM-KL26Z power suppliesPowerDescriptionSupply NameP5-9V_VIN Power supplied from the V in pin of the I/O headers (J3 pin 16)P5V_SDA Power supplied from the OpenSDA USB connector (J10). A Schottky diode provides back drive protection.P5V_KL26Z Power supplied from the KL26Z USB connector (J6). A Schottky diode provides back drive protection P3V3_VREG Regulated 3.3V supply. Sources power to the P3V3 supply rail with an optional back drive protection Schottky diode.12P3V3_BATT Coin cell battery supply voltage. Sources power to the P3V3 supply rail with the option of adding a back drive protection Schottky diode.3P3V3Main supply rail for the FRDM-KL26Z assembly. May be sourced from P3V3_VREG, P3V3_BATT, or directly from the I/O headers (J3 pin 8).P3V3_KL26Z KL26Z MCU supply. Header J5 provides a convenient means for energy consumption measurements.4 P3V3_SDA OpenSDA circuit supply. Header J15 provides a convenient means for energy consumptionmeasurements.4P5V_USB Nominal 5V supplied to the I/O headers (J3 pin 10). Sourced from either the P5V_KL26Z or P5V_SDA supply through a back drive protection Schottky diode.FRDM-KL26Z hardware description5.2Serial and debug adapter (OpenSDA)OpenSDA is an open standard serial and debug adapter. It bridges serial and debug communications between a USB host and an embedded target processor as shown in Figure 5. The hardware circuit is based on a Freescale Kinetis K20 family microcontroller (MCU) with 128 KB of embedded flash and anintegrated USB controller. OpenSDA features a mass storage device (MSD) bootloader, which provides a quick and easy mechanism for loading different OpenSDA applications such as flash programmers, run-control debug interfaces, serial-to-USB converters, and more. See the OpenSDA User’s Guide for more details.Figure 5. OpenSDA high-level block diagramOpenSDA is managed by a Kinetis K20 MCU built on the ARM® Cortex™-M4 core. The OpenSDA circuit includes a status LED (D8) and a pushbutton (SW2). The pushbutton asserts a reset signal to the KL26Z target MCU. It can also be used to place the OpenSDA circuit into Bootloader mode. OpenSDA MCU RESET can be isolated from SW2 by cutting the trace between pins on J13. SPI and GPIO signals1By default the linear regulator, U1, is a 3.3V output regulator. However, this is a common footprint that would allow the user to modify the assembly to utilize an alternative device such as a 1.8V or 2.5V regulator. The KL26Z microcontroller has an operating range of 1.71V to 3.6V.2D2 is bypassed by J14. By default, the pins of J14 are shorted together, to reduce the voltage drop across D2. To use D2, cut the trace between the pins of J14.3If a coin cell battery is to be used, add a small amount of solder to the coin cell ground pad before adding the battery holder. Also, it is recommended to populate D1 as a protection diode when using a coin cell battery.4J5 and J15 are not populated by default. The two pins of these headers are in parallel with 0 Ω resistors. In addition, J5 is also in parallel with a 10 Ω resistor. To measure the energy consumption of the KL26Z, either a voltmeter or an ammeter may be used. To use a voltmeter, R3 (0 Ω) must be removed before connecting the voltmeter probes to the pins of J5. Both R3 and R2 (10 Ω) must be removed to measure current with an ammeter. For the OpenSDA MCU, energy consumption can be measured by removing R4 (0 Ω) and connecting ammeter probes to the pins of J15.FRDM-KL26Z hardware descriptionprovide an interface to the SWD debug port of the KL26Z. Additionally, signal connections are available to implement a UART serial channel. The OpenSDA circuit receives power when the USB connector J10 is plugged into a USB host.5.2.1Debug interfaceSignals with SPI and GPIO capability are used to connect directly to the SWD of the KL26Z. These signals are also brought out to a standard 10-pin (0.05”) Cortex Debug connector (J7). It is possible to isolate the KL26Z MCU from the OpenSDA circuit and use J7 to connect to an off-board MCU. To accomplish this, cut the trace on the bottom side of the PCB that connects J8 pin 1 to J8 pin 2. This will disconnect the SWD_CLK pin to the KL26Z so that it will not interfere with the communications to an off-board MCU connected to J7.Figure6. SWD debug connectorNote that J7 is not populated by default. A Samtec FTSH-105-02-F-D or compatible connector can be added to the J7 through-hole connector. A mating cable, such as a Samtec FFSD IDC cable, can then be used to connect from the OpenSDA of the FRDM-KL26Z to an off-board SWD connector.5.2.2Virtual serial portA serial port connection is available between the OpenSDA MCU and pins PTA1 and PTA2 of the KL26Z. Several of the default OpenSDA Applications provided by Freescale, including the MSD Flash Programmer and the P&E Debug Application, provide a USB communications device class (CDC) interface that bridges serial communications between the USB host and this serial interface on the KL26Z.5.3KL26Z microcontrollerThe target microcontroller of the FRDM-KL26Z is the KL26Z128VLH4, a Kinetis L series device in a 64 LQFP package. The KL26Z MCU features include:FRDM-KL26Z hardware description•32-bit ARM Cortex-M0+ core—Up to 48 MHz operation—Single-cycle fast I/O access port•Memories—128 KB flash—16 KB SRAM•System integration—Power management and mode controllers—Low-leakage wakeup unit—Bit manipulation engine for read-modify-write peripheral operations—Direct memory access (DMA) controller—Computer operating properly (COP) Watchdog timer•Clocks—Clock generation module with FLL and PLL for system and CPU clock generation—4 MHz and 32 kHz internal reference clock—System oscillator supporting external crystal or resonator—Low-power 1kHz RC oscillator for RTC and COP watchdog•Analog peripherals—16-bit SAR ADC w/ DMA support—12-bit DAC w/ DMA support—High speed comparator•Communication peripherals—Two 16-bit Serial Peripheral Interfaces (SPI)—USB dual-role controller with built-in FS/LS transceiver—USB voltage regulator—Two I2C modules—One low-power UART and two standard UART modules—One I2S module•Timers—One 6-channel Timer/PWM module—T wo 2-channel Timer/PWM modules—2-channel Periodic Interrupt Timer (PIT)—Real time clock (RTC)—Low-power Timer (LPTMR)—System tick timer•Human-Machine Interfaces (HMI)—General purpose input/output controllerFRDM-KL26Z hardware description—Capacitive touch sense input interface hardware module5.3.1Clock sourceThe Kinetis KL26 microcontrollers feature an on-chip oscillator compatible with three ranges of input crystal or resonator frequencies: 32-40 kHz (low freq. mode), 3-8 MHz (high frequency mode, low range) and 8-32 MHz (high frequency mode, high range). The KL26Z128 on the FRDM-KL26Z is clocked from an 8 MHz crystal.5.3.2USB interfaceThe Kinetis KL26 microcontrollers feature a dual-role USB controller with on-chip full-speed andlow-speed transceivers. The USB interface on the FRDM-KL26Z is configured as a full-speed USB device. J6 is the USB connector for this interface.Figure7. USB connector schematicIn order to enable USB host functionality on the FRDM-KL26Z, it is necessary to populate J9 and R8 as shown in Figure7. However, there is no electrical protection provided. Use the USB host functionality at your own risk.FRDM-KL26Z hardware description 5.3.3Serial portThe primary serial port interface signals are PTA1 and PTA2. These signals are connected to both the OpenSDA and to the J1 I/O connector. Note that the OpenSDA connection can be isolated from J1 by removing R13 & R14, if required.5.3.4ResetThe PTA20/RESET signal on the KL26Z128 is connected externally to a pushbutton, SW2, and also to the OpenSDA circuit. However, J13 has been provided to isolate the OpenSDA MCU from SW2. Isolating the RESET line allows a more accurate measurement of the target device’s power consumption in low-power modes. The reset button can be used to force an external reset event in the target MCU. The reset button can also be used to force the OpenSDA circuit into bootloader mode. See Section5.2, “Serial and debug adapter (OpenSDA), for more details.5.3.5DebugThe sole debug interface on all Kinetis L Series devices is a serial wire debug (SWD) port. The primary controller of this interface on the FRDM-KL26Z is the onboard OpenSDA circuit (see Section5.2, “Serial and debug adapter (OpenSDA)). However, an unpopulated 10-pin (0.05”) Cortex Debug connector, J7, provides access to the SWD signals. The Samtec FTSH-105-02-F-D or compatible connector can be added to the J7 through-hole debug connector to allow for an external debug cable to be connected.5.4Capacitive touch sliderTwo Touch Sense Input (TSI) signals, TSI0_CH9 and TSI0_CH10, are connected to capacitive electrodes configured as a touch slider. Freescale’s Touch Sense Software (TSS) provides a software library for implementing the capacitive touch slider.5.56-axis accelerometer and magnetometerA Freescale FXOS8700CQ low-power, six-axis accelerometer and magnetometer is interfaced through an I2C bus and two GPIO signals as shown in Table4. By default, the I2C address is 0x1D (SA0 pulled high).Table4. Accelerometer signal connectionsFX0S8700CQ KL26Z128SCL PTE24SDA PTE25INT1PTD0INT2PTD1FRDM-KL26Z hardware descriptionFigure 8. FXOS8700CQ schematic diagram5.6RGB LEDThree PWM-capable signals are connected to a red, green, blue LED, D7. The signal connections are shown in Table 5.Table 5. RGB LED signal connectionsFigure 9. RGB LED schematic diagramRGB LEDKL26Z128Red cathodePTE29Green cathodePTE31Blue cathodePTD511PTD5 is also connected to the I/O header on J2 pin 10 (also known as D13).FRDM-KL26Z hardware description5.7Ambient light sensorAn ambient light sensor is connected to ADC0_SE3 (PTE22). This sensor may be isolated from PTE22 by removing R36.5.8Input/Output connectorsThe KL26Z128VLK4 microcontroller is packaged in a 64-pin LQFP. Some pins are utilized in on-board circuitry, but many are directly connected to one of four I/O headers.The pins on the KL26Z microcontroller are named for their general purpose input/output port pin function. For example, the 1st pin on Port A is referred to as PTA1. The I/O connector pin names are given the same name as the KL26Z pin connected to it, where applicable.FRDM-KL26Z hardware descriptionNote that all pinout data is available in spreadsheet format in FRDM-KL26Z Pinouts. See Section2, “Reference documents” for details.5.9Analog reference voltageThe onboard ADC of the KL26Z128VLH4 MCU uses the Reference V oltage High (VREFH) and Reference V oltage Low (VREFL) pins to set high and low voltage references for the analog modules. On the FRDM-KL26Z, by default VREFH is attached to P3V3_KL26Z (3.3V Supply). VREFL is connected to GND. Figure10 illustrates this circuitry.Figure10. FRDM-KL26Z VREFH circuit schematicIf desired, VREFH can use a VDDA independent reference by adding R11 and a Zener diode (D6). R10 (0 Ω resistor) must be removed when implementing this option. Alternatively, VREFH can be attached to an external source through AREF by removing R10 and populating R9 with a 0 Ω resistor.5.10Arduino compatibilityThe I/O headers on the FRDM-KL26Z are arranged to allow compatibility with peripheral boards (known as shields) that connect to Arduino™ and Arduino-compatible microcontroller boards. The outer rows of pins (the even numbered pins) on the headers share the same mechanical spacing and placement as the I/O headers on the Arduino Revision 3 (R3) standard.FRDM-KL26Z hardware descriptionRefer to the FRDM-KL26Z Pinouts spreadsheet for a compatibility chart showing how all the functions of the KL26Z signals on the I/O connectors map to the pin functions available on the Arduino Uno R3.Document Number:FRDMKL26ZUG Rev. 010/2013Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document.Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: /SalesTermsandConditions.How to Reach Us:Home Page:Web Support:/supportFreescale, the Freescale logo, and Kinetis are trademarks of FreescaleSemiconductor, Inc., Reg. U.S. Pat. & Tm. Off. ARM is the registered trademark ofARM Limited. ARM Cortex-M0+ is the trademark of ARM Limited. All other product orservice names are the property of their respective owners.© 2013 Freescale Semiconductor, Inc.。

莱维飞行、混沌映射和自适应t分布蜣螂算法

莱维飞行、混沌映射和自适应t分布是蜣螂算法中的三个重要概念。

莱维飞行是一种随机过程，描述了在随机游走过程中，每一步的长度和方向都遵循某种概率分布。

在蜣螂算法中，莱维飞行用于模拟蜣螂在搜寻食物时所走的路径，通过不断随机游走，可以寻找更好的食物来源。

混沌映射是一种非线性动力学系统中的映射关系，具有对初值敏感的特点。

在蜣螂算法中，混沌映射用于模拟蜣螂在移动过程中的行为，使得蜣螂能够根据当前环境进行灵活的移动和决策。

自适应t分布是一种概率分布函数，用于描述在复杂系统中数据的分布情况。

在蜣螂算法中，自适应t分布用于描述蜣螂在不同环境下的行为特征，帮助蜣螂更好地适应环境变化。

蜣螂算法是一种模拟自然界中蜣螂行为的优化算法，通过模拟蜣螂的移动、搜寻和合作等行为，可以解决许多优化问题。

莱维飞行、混沌映射和自适应t分布是蜣螂算法中的三个关键技术，它们共同作用，使得蜣螂算法具有很好的全局优化能力。

AEA R44C CX快速入门指南说明书

R44C/CXQuickstart Manualchanges had altered the microphone during the production years of 1936 through 1958. We con-sulted many engineers and users and decided that the earlier versions from the 30’s to mid-40’s were the all-around favorite, the ones with the ‘magic sound.’The AEA R44C/CX is a faithful reproduction, down to one ten-thousandth of an inch. The parts are completely interchangeable with a real 44, the only difference being the magnets. Our modern AEA R44C/CX uses Neodymium magnets, which are more powerful than the Alnico originals. This produces an output level that is about 1 dB higher than the original microphone, while our R44CX High Output version is about 5 dB higher. The ribbon is made from the original RCA rib-bon stock! Yes, some of the real stuff had been stored for all these years after RCA discontinued that arm of its business. We also were able to garner some help from one of the original RCA engi-neers. With their invaluable help, we were able to make this legendary microphone available again.THE RESULT IS THE AEA R44C and CX.Painstakingly crafted, and hand-assembled, it looks, feels, and sounds EXACTLY like the original. All of us at AEA are extremely proud to be involved in the reissue of this beloved microphone.But ﬁ rst, there are a few things you should know about your new R44…CONGRATULATIONS on your purchase of an AEA R44 Microphone!The AEA R44 is an exacting reproduction of the RCA 44B/BX Ve-locity Microphone, circa 1936.Audio Engineering Associates had already been buying, selling, and repairing vintage RCA and other ribbon microphones for two decades, before deciding to reissue the RCA 44. The ﬁ rst question, however, was “Which model should we rerelease?” Many design • STUDIO RIBBON MICS • M/S STEREO• TALL STANDS• MIC POSITIONERSA udio E ngineering Associates1029 N. Allen Ave., Pasadena, CA 91104 Phone: (626) 798-9128 Fax: (626) 798-2378It’s big and heavy!Yes. About 13 ½ inches (34.3 cm), and about 8 ½ pounds (3.8 Kg).Remember that we are working with 1936 technology. In order to create a magnetic ﬁeld powerful enough to yield a useable output, the magnets and the framework to support them had to be big and heavy.It’s bidirectional!True. With the magnets and their support and focusing structures wrapping around the sides, top and bottom, the ribbon, which is about .2 inches (.5 cm) wide and about 2 inches (5.08 cm) long, is exposed front and rear. The microphone is therefore, is inherently bidirectional, with the only difference between front and rear response being polarity (phase). The strength of a bidirectional microphone includes the excellent null rejection that naturally occurs at the plane of the ribbon providing good isolation of signals approaching 90 degrees off-axis.So, how does it work?The 44 is a ribbon microphone. An extremely thin aluminum ribbon is placed within a powerful magnetic ﬁeld. Any sound energy, which moves the ribbon, causes it to travel within the magnetic ﬁeld. This generates a tiny electrical current within the ribbon, which is an exact analog of the sound. It is called a velocity microphone because its output is a function of particle velocity. Next, there is a transformer, which converts the extremely low impedance of the ribbon to a more useable level. And that’s it, no power supply, no pad, and no pattern selector.The most elegant things in life are always the simplest, don’t you think? But it is precisely this simplicity that leads to the character of sound that has been cherished for so many years. No damp-ing, no uncomfortable resonances in the audible range, and no active electronics preserve more sonic accuracy than most or all microphones because no external features are introduced to the signal. This accounts for the “truthfulness” of the sound that has made the 44 a classic.It’s delicate!The ribbon has to be able to respond to the tiniest amount of acoustic energy in the air. To do this, it must be ‘air-like’, or low mass. Low mass means thin, and the ribbon in the 44 is 1.8 microns (1.8 uM) thick, or about one-ﬁftieth the thickness of a human hair! The ribbon is as thin and deli-cate as it is because it must be able to react to the air mass around it. It cannot be protected and iso-lated, but must be exposed to all the extremes that a noisy and sometimes careless world can inﬂict on it. This is the strength, and the weakness, of all ribbon microphones. The low mass of the ribbon results in an excellent transient response because it is able to “pretend that it is air.”Because the ribbon is supposed to register every tiny movement of air, this makes it extremely sen-sitive to moving air. There is a big difference between air that is moving in a pressure wave, which is energy moving through air in the same way that waves move through the ocean, and wind, which is a current, or mass of air, moving from one place to another. Wind is a tremendous stressor to a ribbon and you should protect your microphone from it. Wind can stretch the ribbon which effec-tively detunes it and will change the character of your microphone.It is best to store it vertically.The case provided with your R44 is speciﬁcally designed to store it in the recommended vertical position. The ribbon, which is about 2 inches long (the longest of any microphone), could be de-graded by long-term storage in a horizontal position. Gravity will cause the ribbon to sag, and can lead to stretching over time.Store your microphone in a plastic bag.Remember what lies at the heart of this microphone….an ultrathin wisp of metal that, except for the outside grill and some internal blast shields is completely exposed to the air around it. HV AC vents, swinging it in your hand as you walk across the studio, excessive SPLs, things like this can damage or destroy the ribbon. Some engineers feel that it should ALWAYS be bagged except when in actual use. Your R44 has been provided with an exact reproduction of the gray twill bag that RCA shipped with their mics. Any plastic or paper bag will do. Besides protecting the microphone from stray air currents, the bag also protects against against tramp iron.‘Tramp iron’The horizontal surfaces in any technical space are likely to have microscopic bits of metal on them. If you put your R44 down on such a surface, the powerful magnetic ﬁeld will pick up this ‘tramp iron’. That is bad, but it gets worse. As time goes by, these tiny bits will work their way inside the microphone, and eventually get to where the magnetic ﬁeld is the strongest, which is the gap where the ribbon is. Now, they will start to combine and build ‘whiskers’ across the gap, following the magnetic lines of force. These whiskers will interfere with the functioning of the ribbon.We have seen this many times with the old RCA mics. The ribbon is OK, but it is impossible to clean out the whiskers without removing the ribbon. Unfortunately, it is also impossible to remove and then reinstall the same ribbon without damaging it, so a good ribbon must be replaced because of tramp iron.It doesn’t need, want, or like, phantom power!What happens when this mic is connected to phantom power? Well, the answer ranges all the way from ‘nothing’ to ‘total disaster.’ If the phantom power is perfect, and the cable is perfect, and the connection transient isn’t too severe, ﬁne. But a bad cable, or unbalanced voltages, or bad patch-point, or large transient can damage or destroy the ribbon. It is much better and safer to not connect this microphone to phantom power!A little extra care in the use and handling of this microphone is all that is needed, and it will give you decades of service. The 44 has been the favorite of recording engineers for nearly as long as there have BEEN recording engineers! Its warm, rich, powerful voice is unmistakable, and irre-placeable.ENJOY!!On-Axis Frequency Response (1 meter)Speciﬁcations:Operating Principle: Velocity microphone� Frequency Response: Below 30 Hz to above 20 kHz� Maximum SPL: 140 + dB SPL above 200Hz for 1% third harmonic� Output Sensitivity: 2.25 mV / Pa into unloaded circuit� Output Impedance: 270 ohms broadband� Recommended Load: 1.2 K ohm or greater� Powering: Not required or recommended� Polarity: Pin 2 high for positive pressure on the front of the microphone.� Connector: XLR-3M wired to a 2 meter captive cableOff Axis Response: (level changes with angle, frequency response is consistent)� Polar Pattern: Native bi-directional pattern� Horizontal: –90 dB null at 90 / 270 degrees� Vertical: Reduced HF response above and below 0 / 180 degree axis, null at 90 / 270 degrees Transducer element� Ribbon Thickness: 1.8 microns ( .0000018 meter ) of pure aluminum� Ribbon Width: 4.7 mm� Ribbon Length: 59.7 mmReferences and Recommended Reading:BASIC STEREO MICROPHONE PERSPECTIVES - A REVIEW, ﬁrst published in the AES Journal, vol. 33, no. 7/8, pp. 548-586, 1985 July/August; republished in the STEREOPHONIC TECHNIQUES ANTHOLOGY, pp. 297-305THE BIDIRECTIONAL MICROPHONE: A FORGOTTEN PATRIARCH, was ﬁrst presented at the 113th AES Convention in Los Angeles, 2002 October, Preprint no. 5646; it is scheduled for publication in the AES Journal in the 2003 April issue (vol. 51, no. 4)THE NEW STEREO SOUNDBOOK, third edition, by Ron Streicher and F. Alton Everest, published by Audio Engineering Associates, 1998; .RIBBON MICROPHONE ESSAYS by Wes Dooley, Ron Streicher and Philip Merrill published by Audio Engineering Associates, June 2003; .Other Products by Audio Engineering Associates:TRP - The Ribbon PreAEA/Fred Forsell collaboration preamp with no phantom power and 83dB of clean gainRCA Working Reproduction Microphones and replacement partsAEA R44C and CNE Microphone - Tribute to the classic RCA 44B using NOS ribbonsAEA R44CX Microphone - 6db more output for critical digital recordingsRCA44 and RCA77 microphones - Spare parts and prop shellsAEA Ribbon MicrophonesAEA R92 Microphone - Large-ribbon optimized for guitar and other close-micing situationsAEA R88 Microphone - Large-ribbon coincident pair in a sleek black “stealth” packageAEA R84 Microphone - That big ribbon sound in a smaller more affordable packageModular Microphone PositionersSMT - Stereo Microphone Template for Blumlein and ORTF spacingSMP-17, 1M and 1.25M - Stereo bars in three lengths for the ultimate in positioning ﬂexibility Decca and Mini-Decca Trees - For microphone arrays including recording for multichannelModular Studio Microphone Stands and BoomsFlightweight StandsMedium-Duty Vertical Stands and BoomsHeavy-Duty Stands and BoomsCrank-up StandsSince 1983 we’ve been the US agent for Coles Electroacoustics, manufacturers of the 4038 studio rib-bon microphone and the 4104B, “lip” mic for voice-over work in high noise environments. We sell and service Coles microphones and genuine Coles parts.In North America we represent CB Electronics, a leading worldwide supplier of machine control equip-ment to the sound-for-picture industry. Their products specialize in professional control of and translation between bi-phase, 9-pin serial and time code machines. Their SR line provides low cost multiple machine remote controls for RS-422, Sony, and Tascam DA88 protocol machines. The new P2DVD Interface may is a RS422 controlled Master with most RS422 synchronisers and Console automation systems.Our Audio Test Department buys, sells, trades, and rents new and used audio test gear. Audio Precision, B&K, Hewlett Packard, Galaxy, Goldline, Neutrik, and Amber are among the lines we maintain in stock for audio measurements of Level, Polarity, Phase, THD and IMD, W&F, SPL, and Real-Time Analyzers.Audio Engineering Associates1029 N. Allen Ave., Pasadena, CA 91104, USAPhone: (626) 798-9128 Fax: (626) 798-2378Visit us on the web at 。

Glider Flying Handbook说明书

Glider Flying Handbook2013U.S. Department of TransportationFEDERAL AVIATION ADMINISTRATIONFlight Standards Servicei iPrefaceThe Glider Flying Handbook is designed as a technical manual for applicants who are preparing for glider category rating and for currently certificated glider pilots who wish to improve their knowledge. Certificated flight instructors will find this handbook a valuable training aid, since detailed coverage of aeronautical decision-making, components and systems, aerodynamics, flight instruments, performance limitations, ground operations, flight maneuvers, traffic patterns, emergencies, soaring weather, soaring techniques, and cross-country flight is included. Topics such as radio navigation and communication, use of flight information publications, and regulations are available in other Federal Aviation Administration (FAA) publications.The discussion and explanations reflect the most commonly used practices and principles. Occasionally, the word “must” or similar language is used where the desired action is deemed critical. The use of such language is not intended to add to, interpret, or relieve a duty imposed by Title 14 of the Code of Federal Regulations (14 CFR). Persons working towards a glider rating are advised to review the references from the applicable practical test standards (FAA-G-8082-4, Sport Pilot and Flight Instructor with a Sport Pilot Rating Knowledge Test Guide, FAA-G-8082-5, Commercial Pilot Knowledge Test Guide, and FAA-G-8082-17, Recreational Pilot and Private Pilot Knowledge Test Guide). Resources for study include FAA-H-8083-25, Pilot’s Handbook of Aeronautical Knowledge, FAA-H-8083-2, Risk Management Handbook, and Advisory Circular (AC) 00-6, Aviation Weather For Pilots and Flight Operations Personnel, AC 00-45, Aviation Weather Services, as these documents contain basic material not duplicated herein. All beginning applicants should refer to FAA-H-8083-25, Pilot’s Handbook of Aeronautical Knowledge, for study and basic library reference.It is essential for persons using this handbook to become familiar with and apply the pertinent parts of 14 CFR and the Aeronautical Information Manual (AIM). The AIM is available online at . The current Flight Standards Service airman training and testing material and learning statements for all airman certificates and ratings can be obtained from .This handbook supersedes FAA-H-8083-13, Glider Flying Handbook, dated 2003. Always select the latest edition of any publication and check the website for errata pages and listing of changes to FAA educational publications developed by the FAA’s Airman Testing Standards Branch, AFS-630.This handbook is available for download, in PDF format, from .This handbook is published by the United States Department of Transportation, Federal Aviation Administration, Airman Testing Standards Branch, AFS-630, P.O. Box 25082, Oklahoma City, OK 73125.Comments regarding this publication should be sent, in email form, to the following address:********************************************John M. AllenDirector, Flight Standards Serviceiiii vAcknowledgmentsThe Glider Flying Handbook was produced by the Federal Aviation Administration (FAA) with the assistance of Safety Research Corporation of America (SRCA). The FAA wishes to acknowledge the following contributors: Sue Telford of Telford Fishing & Hunting Services for images used in Chapter 1JerryZieba () for images used in Chapter 2Tim Mara () for images used in Chapters 2 and 12Uli Kremer of Alexander Schleicher GmbH & Co for images used in Chapter 2Richard Lancaster () for images and content used in Chapter 3Dave Nadler of Nadler & Associates for images used in Chapter 6Dave McConeghey for images used in Chapter 6John Brandon (www.raa.asn.au) for images and content used in Chapter 7Patrick Panzera () for images used in Chapter 8Jeff Haby (www.theweatherprediction) for images used in Chapter 8National Soaring Museum () for content used in Chapter 9Bill Elliot () for images used in Chapter 12.Tiffany Fidler for images used in Chapter 12.Additional appreciation is extended to the Soaring Society of America, Inc. (), the Soaring Safety Foundation, and Mr. Brad Temeyer and Mr. Bill Martin from the National Oceanic and Atmospheric Administration (NOAA) for their technical support and input.vv iPreface (iii)Acknowledgments (v)Table of Contents (vii)Chapter 1Gliders and Sailplanes ........................................1-1 Introduction....................................................................1-1 Gliders—The Early Years ..............................................1-2 Glider or Sailplane? .......................................................1-3 Glider Pilot Schools ......................................................1-4 14 CFR Part 141 Pilot Schools ...................................1-5 14 CFR Part 61 Instruction ........................................1-5 Glider Certificate Eligibility Requirements ...................1-5 Common Glider Concepts ..............................................1-6 Terminology...............................................................1-6 Converting Metric Distance to Feet ...........................1-6 Chapter 2Components and Systems .................................2-1 Introduction....................................................................2-1 Glider Design .................................................................2-2 The Fuselage ..................................................................2-4 Wings and Components .............................................2-4 Lift/Drag Devices ...........................................................2-5 Empennage .....................................................................2-6 Towhook Devices .......................................................2-7 Powerplant .....................................................................2-7 Self-Launching Gliders .............................................2-7 Sustainer Engines .......................................................2-8 Landing Gear .................................................................2-8 Wheel Brakes .............................................................2-8 Chapter 3Aerodynamics of Flight .......................................3-1 Introduction....................................................................3-1 Forces of Flight..............................................................3-2 Newton’s Third Law of Motion .................................3-2 Lift ..............................................................................3-2The Effects of Drag on a Glider .....................................3-3 Parasite Drag ..............................................................3-3 Form Drag ...............................................................3-3 Skin Friction Drag ..................................................3-3 Interference Drag ....................................................3-5 Total Drag...................................................................3-6 Wing Planform ...........................................................3-6 Elliptical Wing ........................................................3-6 Rectangular Wing ...................................................3-7 Tapered Wing .........................................................3-7 Swept-Forward Wing ..............................................3-7 Washout ..................................................................3-7 Glide Ratio .................................................................3-8 Aspect Ratio ............................................................3-9 Weight ........................................................................3-9 Thrust .........................................................................3-9 Three Axes of Rotation ..................................................3-9 Stability ........................................................................3-10 Flutter .......................................................................3-11 Lateral Stability ........................................................3-12 Turning Flight ..............................................................3-13 Load Factors .................................................................3-13 Radius of Turn ..........................................................3-14 Turn Coordination ....................................................3-15 Slips ..........................................................................3-15 Forward Slip .........................................................3-16 Sideslip .................................................................3-17 Spins .........................................................................3-17 Ground Effect ...............................................................3-19 Chapter 4Flight Instruments ...............................................4-1 Introduction....................................................................4-1 Pitot-Static Instruments ..................................................4-2 Impact and Static Pressure Lines................................4-2 Airspeed Indicator ......................................................4-2 The Effects of Altitude on the AirspeedIndicator..................................................................4-3 Types of Airspeed ...................................................4-3Table of ContentsviiAirspeed Indicator Markings ......................................4-5 Other Airspeed Limitations ........................................4-6 Altimeter .....................................................................4-6 Principles of Operation ...........................................4-6 Effect of Nonstandard Pressure andTemperature............................................................4-7 Setting the Altimeter (Kollsman Window) .............4-9 Types of Altitude ......................................................4-10 Variometer................................................................4-11 Total Energy System .............................................4-14 Netto .....................................................................4-14 Electronic Flight Computers ....................................4-15 Magnetic Compass .......................................................4-16 Yaw String ................................................................4-16 Inclinometer..............................................................4-16 Gyroscopic Instruments ...............................................4-17 G-Meter ........................................................................4-17 FLARM Collision Avoidance System .........................4-18 Chapter 5Glider Performance .............................................5-1 Introduction....................................................................5-1 Factors Affecting Performance ......................................5-2 High and Low Density Altitude Conditions ...........5-2 Atmospheric Pressure .............................................5-2 Altitude ...................................................................5-3 Temperature............................................................5-3 Wind ...........................................................................5-3 Weight ........................................................................5-5 Rate of Climb .................................................................5-7 Flight Manuals and Placards ..........................................5-8 Placards ......................................................................5-8 Performance Information ...........................................5-8 Glider Polars ...............................................................5-8 Weight and Balance Information .............................5-10 Limitations ...............................................................5-10 Weight and Balance .....................................................5-12 Center of Gravity ......................................................5-12 Problems Associated With CG Forward ofForward Limit .......................................................5-12 Problems Associated With CG Aft of Aft Limit ..5-13 Sample Weight and Balance Problems ....................5-13 Ballast ..........................................................................5-14 Chapter 6Preflight and Ground Operations .......................6-1 Introduction....................................................................6-1 Assembly and Storage Techniques ................................6-2 Trailering....................................................................6-3 Tiedown and Securing ................................................6-4Water Ballast ..............................................................6-4 Ground Handling........................................................6-4 Launch Equipment Inspection ....................................6-5 Glider Preflight Inspection .........................................6-6 Prelaunch Checklist ....................................................6-7 Glider Care .....................................................................6-7 Preventive Maintenance .............................................6-8 Chapter 7Launch and Recovery Procedures and Flight Maneuvers ............................................................7-1 Introduction....................................................................7-1 Aerotow Takeoff Procedures .........................................7-2 Signals ........................................................................7-2 Prelaunch Signals ....................................................7-2 Inflight Signals ........................................................7-3 Takeoff Procedures and Techniques ..........................7-3 Normal Assisted Takeoff............................................7-4 Unassisted Takeoff.....................................................7-5 Crosswind Takeoff .....................................................7-5 Assisted ...................................................................7-5 Unassisted...............................................................7-6 Aerotow Climb-Out ....................................................7-6 Aerotow Release.........................................................7-8 Slack Line ...................................................................7-9 Boxing the Wake ......................................................7-10 Ground Launch Takeoff Procedures ............................7-11 CG Hooks .................................................................7-11 Signals ......................................................................7-11 Prelaunch Signals (Winch/Automobile) ...............7-11 Inflight Signals ......................................................7-12 Tow Speeds ..............................................................7-12 Automobile Launch ..................................................7-14 Crosswind Takeoff and Climb .................................7-14 Normal Into-the-Wind Launch .................................7-15 Climb-Out and Release Procedures ..........................7-16 Self-Launch Takeoff Procedures ..............................7-17 Preparation and Engine Start ....................................7-17 Taxiing .....................................................................7-18 Pretakeoff Check ......................................................7-18 Normal Takeoff ........................................................7-19 Crosswind Takeoff ...................................................7-19 Climb-Out and Shutdown Procedures ......................7-19 Landing .....................................................................7-21 Gliderport/Airport Traffic Patterns and Operations .....7-22 Normal Approach and Landing ................................7-22 Crosswind Landing ..................................................7-25 Slips ..........................................................................7-25 Downwind Landing ..................................................7-27 After Landing and Securing .....................................7-27viiiPerformance Maneuvers ..............................................7-27 Straight Glides ..........................................................7-27 Turns.........................................................................7-28 Roll-In ...................................................................7-29 Roll-Out ................................................................7-30 Steep Turns ...........................................................7-31 Maneuvering at Minimum Controllable Airspeed ...7-31 Stall Recognition and Recovery ...............................7-32 Secondary Stalls ....................................................7-34 Accelerated Stalls .................................................7-34 Crossed-Control Stalls ..........................................7-35 Operating Airspeeds .....................................................7-36 Minimum Sink Airspeed ..........................................7-36 Best Glide Airspeed..................................................7-37 Speed to Fly ..............................................................7-37 Chapter 8Abnormal and Emergency Procedures .............8-1 Introduction....................................................................8-1 Porpoising ......................................................................8-2 Pilot-Induced Oscillations (PIOs) ..............................8-2 PIOs During Launch ...................................................8-2 Factors Influencing PIOs ........................................8-2 Improper Elevator Trim Setting ..............................8-3 Improper Wing Flaps Setting ..................................8-3 Pilot-Induced Roll Oscillations During Launch .........8-3 Pilot-Induced Yaw Oscillations During Launch ........8-4 Gust-Induced Oscillations ..............................................8-5 Vertical Gusts During High-Speed Cruise .................8-5 Pilot-Induced Pitch Oscillations During Landing ......8-6 Glider-Induced Oscillations ...........................................8-6 Pitch Influence of the Glider Towhook Position ........8-6 Self-Launching Glider Oscillations During Powered Flight ...........................................................8-7 Nosewheel Glider Oscillations During Launchesand Landings ..............................................................8-7 Tailwheel/Tailskid Equipped Glider Oscillations During Launches and Landings ..................................8-8 Aerotow Abnormal and Emergency Procedures ............8-8 Abnormal Procedures .................................................8-8 Towing Failures........................................................8-10 Tow Failure With Runway To Land and Stop ......8-11 Tow Failure Without Runway To Land BelowReturning Altitude ................................................8-11 Tow Failure Above Return to Runway Altitude ...8-11 Tow Failure Above 800' AGL ..............................8-12 Tow Failure Above Traffic Pattern Altitude .........8-13 Slack Line .................................................................8-13 Ground Launch Abnormal and Emergency Procedures ....................................................................8-14 Abnormal Procedures ...............................................8-14 Emergency Procedures .............................................8-14 Self-Launch Takeoff Emergency Procedures ..............8-15 Emergency Procedures .............................................8-15 Spiral Dives ..................................................................8-15 Spins .............................................................................8-15 Entry Phase ...............................................................8-17 Incipient Phase .........................................................8-17 Developed Phase ......................................................8-17 Recovery Phase ........................................................8-17 Off-Field Landing Procedures .....................................8-18 Afterlanding Off Field .............................................8-20 Off-Field Landing Without Injury ........................8-20 Off-Field Landing With Injury .............................8-20 System and Equipment Malfunctions ..........................8-20 Flight Instrument Malfunctions ................................8-20 Airspeed Indicator Malfunctions ..........................8-21 Altimeter Malfunctions .........................................8-21 Variometer Malfunctions ......................................8-21 Compass Malfunctions .........................................8-21 Glider Canopy Malfunctions ....................................8-21 Broken Glider Canopy ..........................................8-22 Frosted Glider Canopy ..........................................8-22 Water Ballast Malfunctions ......................................8-22 Retractable Landing Gear Malfunctions ..................8-22 Primary Flight Control Systems ...............................8-22 Elevator Malfunctions ..........................................8-22 Aileron Malfunctions ............................................8-23 Rudder Malfunctions ............................................8-24 Secondary Flight Controls Systems .........................8-24 Elevator Trim Malfunctions .................................8-24 Spoiler/Dive Brake Malfunctions .........................8-24 Miscellaneous Flight System Malfunctions .................8-25 Towhook Malfunctions ............................................8-25 Oxygen System Malfunctions ..................................8-25 Drogue Chute Malfunctions .....................................8-25 Self-Launching Gliders ................................................8-26 Self-Launching/Sustainer Glider Engine Failure During Takeoff or Climb ..........................................8-26 Inability to Restart a Self-Launching/SustainerGlider Engine While Airborne .................................8-27 Self-Launching Glider Propeller Malfunctions ........8-27 Self-Launching Glider Electrical System Malfunctions .............................................................8-27 In-flight Fire .............................................................8-28 Emergency Equipment and Survival Gear ...................8-28 Survival Gear Checklists ..........................................8-28 Food and Water ........................................................8-28ixClothing ....................................................................8-28 Communication ........................................................8-29 Navigation Equipment ..............................................8-29 Medical Equipment ..................................................8-29 Stowage ....................................................................8-30 Parachute ..................................................................8-30 Oxygen System Malfunctions ..................................8-30 Accident Prevention .....................................................8-30 Chapter 9Soaring Weather ..................................................9-1 Introduction....................................................................9-1 The Atmosphere .............................................................9-2 Composition ...............................................................9-2 Properties ....................................................................9-2 Temperature............................................................9-2 Density ....................................................................9-2 Pressure ...................................................................9-2 Standard Atmosphere .................................................9-3 Layers of the Atmosphere ..........................................9-4 Scale of Weather Events ................................................9-4 Thermal Soaring Weather ..............................................9-6 Thermal Shape and Structure .....................................9-6 Atmospheric Stability .................................................9-7 Air Masses Conducive to Thermal Soaring ...................9-9 Cloud Streets ..............................................................9-9 Thermal Waves...........................................................9-9 Thunderstorms..........................................................9-10 Lifted Index ..........................................................9-12 K-Index .................................................................9-12 Weather for Slope Soaring .......................................9-14 Mechanism for Wave Formation ..............................9-16 Lift Due to Convergence ..........................................9-19 Obtaining Weather Information ...................................9-21 Preflight Weather Briefing........................................9-21 Weather-ReIated Information ..................................9-21 Interpreting Weather Charts, Reports, andForecasts ......................................................................9-23 Graphic Weather Charts ...........................................9-23 Winds and Temperatures Aloft Forecast ..............9-23 Composite Moisture Stability Chart .....................9-24 Chapter 10Soaring Techniques ..........................................10-1 Introduction..................................................................10-1 Thermal Soaring ...........................................................10-2 Locating Thermals ....................................................10-2 Cumulus Clouds ...................................................10-2 Other Indicators of Thermals ................................10-3 Wind .....................................................................10-4 The Big Picture .....................................................10-5Entering a Thermal ..............................................10-5 Inside a Thermal.......................................................10-6 Bank Angle ...........................................................10-6 Speed .....................................................................10-6 Centering ...............................................................10-7 Collision Avoidance ................................................10-9 Exiting a Thermal .....................................................10-9 Atypical Thermals ..................................................10-10 Ridge/Slope Soaring ..................................................10-10 Traps ......................................................................10-10 Procedures for Safe Flying .....................................10-12 Bowls and Spurs .....................................................10-13 Slope Lift ................................................................10-13 Obstructions ...........................................................10-14 Tips and Techniques ...............................................10-15 Wave Soaring .............................................................10-16 Preflight Preparation ...............................................10-17 Getting Into the Wave ............................................10-18 Flying in the Wave .................................................10-20 Soaring Convergence Zones ...................................10-23 Combined Sources of Updrafts ..............................10-24 Chapter 11Cross-Country Soaring .....................................11-1 Introduction..................................................................11-1 Flight Preparation and Planning ...................................11-2 Personal and Special Equipment ..................................11-3 Navigation ....................................................................11-5 Using the Plotter .......................................................11-5 A Sample Cross-Country Flight ...............................11-5 Navigation Using GPS .............................................11-8 Cross-Country Techniques ...........................................11-9 Soaring Faster and Farther .........................................11-11 Height Bands ..........................................................11-11 Tips and Techniques ...............................................11-12 Special Situations .......................................................11-14 Course Deviations ..................................................11-14 Lost Procedures ......................................................11-14 Cross-Country Flight in a Self-Launching Glider .....11-15 High-Performance Glider Operations and Considerations ............................................................11-16 Glider Complexity ..................................................11-16 Water Ballast ..........................................................11-17 Cross-Country Flight Using Other Lift Sources ........11-17 Chapter 12Towing ................................................................12-1 Introduction..................................................................12-1 Equipment Inspections and Operational Checks .........12-2 Tow Hook ................................................................12-2 Schweizer Tow Hook ...........................................12-2x。

软件工程大题含解答精华版

Exam 1 Practical - Solutions1.List two of the factors that contributed to the "software crisis" in the early history of softwaredevelopment, and explain how software engineering life-cycle approaches attempt to address thosefactors.列出软件开发早期的导致“软件危机”的因素，并解释软件工程生命周期试图解决这些因素的方法Many answers are possible. For example: high cost of maintenance addressed by better documentation, better design for understandability and extensibility, formal reviews, testing procedures, etc; high cost of development addressed by more emphasis on analysis and design before implementation begins; etc.(维护成本高解决办法为更好的文案，对于可理解性，可扩展性更好的设计，正式的评审，测试程序等;开发成本高解决办法为在实现开始前进行更全面的分析与设计)2.What software life-cycle model would you use if there is significant technical risk and the customer'srequirements are not well-known in advance? Justify your answer in a short essay.(如果有重大技术风险和客户的要求是不明确的，你会使用什么软件生命周期模型？在一篇短文中证明你的答案)Either spiral or rapid prototyping, or a combination of both. Spiral has good risk management characteristics, and can be implemented to include early prototypes or simulations to show to the customer. Rapid prototyping is good for clarifying requirements with the customer, and can be used to put early pressure on componentswith technical risk.（无论是螺旋模型或快速原型模型，还是两者的结合都可以。

figma常见英文术语

figma常见英文术语Figma is a popular design tool used by designers to create user interfaces and prototypes. It has gained significant popularity in recent years due to its collaborative features and ease of use. When working with Figma, designers often encounter specific terms and concepts that are unique to the tool. In this article, we will explore some common Figma terminologies and their meaning in English.1. Artboard: An artboard is a canvas area where designers create their designs. It is like a blank sheet of paper or a digital canvas that allows designers to work on their ideas.2. Frame: A frame is a container within an artboard that holds individual design elements. It helps organize the design and allows designers to work on different sections or components separately.3. Layer: A layer refers to a single element or a group of elements within a frame. Layers can be text, shapes, images, or entire components. Layers are organized in a hierarchical structure to make it easier for designers to manage and edit them.4. Group: A group is a collection of multiple layers that are combined together for easier management. Designers often group related elements together to keep their design organized and easily editable.5. Component: A component is a reusable design element that can be used multiple times throughout a project or across different projects. It allows for consistent design and saves time by updating all instances when a change is made to the component.6. Instance: An instance is a duplicate of a component that can be edited independently while still retaining a connection to the main component. It allows designers to customize a component for a specific use case without affecting other instances.7. Prototype: Prototyping is the process of creating interactive and clickable designs that simulate the user experience. Figma allows designers to create prototypes by linking different frames and adding interactive elements like buttons, links, or animations.8. Auto Layout: Auto Layout is a feature in Figma that allows for responsive and flexible design. It ensures that elements within a frame will automatically resize and rearrange themselves when the frame is resized.9. Constraints: Constraints define how an element should behave when its parent container is resized. There are four types of constraints in Figma: top, right, bottom, and left. Constraints can be set on individual layers or groups to control their position, size, or scaling behavior.10. Grids: Grids help designers create consistent layouts by defining a set of horizontal and vertical lines. Figma allows designers to create grid systems that snap elements to the grid for precise positioning.11. Fill and Stroke: Fill refers to the color or pattern applied to the inside of a shape or text, while stroke refers to the outline or border applied to the shape or text. Figma provides various options forfilling and stroking elements to create visually appealing designs.12. Constraints: Constraints define how an element should behave when its parent container is resized. There are four types of constraints in Figma: top, right, bottom, and left. Constraints can be set on individual layers or groups to control their position, size, or scaling behavior.13. Libraries: Libraries enable designers to share and maintain consistent design assets across different projects. Designers can create a library of components that can be accessed and used by all team members, ensuring consistency and efficiency in design workflows.14. Plugins: Figma allows developers to create plugins that extend the functionality of the tool. Plugins can be used to automate tasks, integrate with other tools, or add new features to enhance the design process.15. Version History: Figma has a version history feature that allows designers to track changes made to a design over time. Designers can view previous versions, compare changes, and revert to previous versions if needed.16. Collaboration: Figma is known for its collaborative features that allow multiple designers to work together on a project in real-time. Designers can comment, make edits, and provide feedback directly within the design file, making it easier for teams to collaborate and iterate on designs.17. Team Libraries: Team libraries are libraries created and maintained at the team level. Team members can access and use components from these libraries, ensuring consistency across all designs created by the team.18. Exporting: Figma allows designers to export their designs in various formats such as PNG, JPG, SVG, or PDF. Designers can choose specific frames or elements to export or export the entire design as a single file.19. Version Control: Figma has built-in version control that allows designers to work simultaneously on a design without the risk of overriding each other's changes. It keeps track of each designer's edits and allows for easy merging of changes.20. Design System: A design system is a collection of reusable components, guidelines, and assets that define and maintain a consistent visual language and user experience across an organization. Figma is often used as a central tool to create, manage, and document design systems.These are just a few of the common Figma terminologies that designers encounter while working with the tool. By understanding and familiarizing yourself with these terms, you can better navigate and utilize the features and capabilities of Figma to create outstanding designs efficiently.。

genecopoeia klf4 lentifect lentiviral particles da

Data Sheet ●KLF4 Lentifect™ Lentiviral Particles ●Cat Nos. LP-KLF4-LV105-0200,LP-KLF4-LV105-0205Ready-to-use lentiviral particles for the transduction of a variety of mammalian cells including difficult-to-transfect, primary, stem and non-dividing cells as well as in vivo use for transgenic animals.DescriptionGeneCopoeia Lentifect™ Lentiviral Particles are produced from a standardized protocol using purified plasmid DNA and the proprietary reagents, EndoFectin™ Lenti (for transfection) and TiterBoost™ solution. The protocol uses a third generation self-inactivating packaging system meeting BioSafety Level 2 requirements.The Lentifect particles include a CMV promoter for efficient expression of non-tagged native KLF4 in target cells and use a puromycin resistance marker for selection of stably transduced cells.Contents and storageProvided as 1 vial of 200 µl or 5 vials of 200 µl of KLF4 lentiviral particles with titers of ~1 x 108 copies/ml.Lentifect particles are shipped on dry ice and must be stored at –80°C immediately upon receipt. Avoid repeated freeze-thaw cycles as this will reduce titers.Quality controlThe lentiviral expression construct was validated by full-length sequencing, restriction enzyme digestion and PCR-size validation using gene-specific and vector-specific primers. Product is confirmed free of bacteria, fungi and common Mycoplasma contamination.Viral titerLentivirus products were titrated using qRT-PCR, which determines the physical copy numbers of viral genomic RNA. We suggest that the customer estimate the transduction unit (TU or IFU) for the specific host cells based on the following formula before transduction:TU=Titer (physical copy number)/100.The customer should test the transduction at MOI=0.3, 1, 3, 5, 10 using TU for the best transduction efficiency. Overview of productionThe KLF4 OmicsLink™ ORF lentiviral expression plasmid (GeneCopoeia Cat. No. EX-Z2836-Lv105) was constructed using GeneCopoeia proprietary RecJoin™ technology. This plasmid was co-transfected into 293Ta cells (GeneCopoeia Cat. No. CLv-PK-01) with the Lenti-Pac HIV Packaging Mix (GeneCopoeia Cat. No. HPK-LvTR-20). Lentivirus- containing supernatants were harvested 48 hours after transfection and stored at –80°C.Important note: The KLF4 clones was updated and replaced with EX-Z5703-Lv105.User manualPlease contact GeneCopoeia for a copy or download at:/product/lentiviral/pdf/packaging_kit_manual.pdfGeneCopoeia, Inc.9620 Medical Center Drive, #101Rockville, Maryland 20850Tel: 301-762-0888 Fax: 301-762-8333Email:***********************Web: GeneCopoeia Products are for Research Use Only Copyright © 2011 GeneCopoeia Inc. Trademarks: Lentifect™, Lenti-Pac™, OmicsLink™, EndoFectin™, TiterBoost™ (GeneCopoeia Inc.) LLPKL061311www.g en ecopoeia.co m。

stable diffusion prompt 故事

stable diffusion prompt 故事
在一个遥远的星球上，有一个名为稳定扩散的城市。

稳定扩散是一个现代化且充满活力的地方，它的居民在和谐、宽容的社会中共同生活着。

这个城市以其高效的交通系统而闻名。

无论是公共汽车、轻轨，还是自行车共享系统，稳定扩散的居民都能够快速、便捷地到达目的地。

城市里的道路宽敞而整洁，设计合理的交通规则使行车相当安全。

这使得居民们能够更好地利用时间，享受更多的休闲和娱乐活动。

稳定扩散还以其绿色环保而自豪。

城市内大量种植了树木和花草，公园和广场随处可见。

居民们乐于在这些绿地上散步、锻炼和与朋友聚会。

同时，城市还鼓励人们采取可持续的生活方式，如垃圾分类回收和能源节约。

这些努力使稳定扩散成为了一个宜居的城市，为居民们提供了健康而舒适的生活环境。

稳定扩散亦以其先进的科技而闻名。

城市内充满了高科技公司和创新中心，吸引了许多年轻人和创业者前来寻找机会。

科技的发展也为城市提供了便利，比如自动化系统和智能家居设备，使居民能够更加舒适和便捷地生活。

稳定扩散是一个多元化的城市，具有文化交融的特点。

人们来自各行各业，背景各异，互相尊重和包容。

城市里有各式各样的餐馆、艺术展览和音乐演出，让居民们享受不同文化的体验。

这种多样性使得稳定扩散成为了一个充满活力和创意的地方。

总而言之，稳定扩散是一个先进、绿色、多元化且充满活力的城市。

它以其高效的交通系统、绿色环保、先进科技和文化多样性而闻名。

居民们在这里享受着舒适和宜居的生活，他们为创建这个城市的繁荣共同努力着。

我了解的新技术作文英语

The rapid advancement of technology has brought about a myriad of new techniques and innovations that have transformed various aspects of our lives. Heres an overview of some of the most significant new technologies that I have come to understand and their potential impacts:1. Artificial Intelligence AI: AI has made significant strides in recent years, with machine learning and deep learning algorithms becoming more sophisticated. These technologies are now capable of recognizing patterns, making decisions, and even creating content, which has applications in everything from healthcare diagnostics to creative industries.2. Blockchain Technology: Initially known for its use in cryptocurrencies like Bitcoin, blockchain technology has expanded into various other sectors. Its decentralized and secure nature makes it ideal for supply chain management, voting systems, and even intellectual property rights management.3. Quantum Computing: While still in its infancy, quantum computing promises to revolutionize computing power by leveraging the principles of quantum mechanics. This technology could solve complex problems that are currently beyond the reach of classical computers, such as drug discovery and climate modeling.4. Augmented Reality AR and Virtual Reality VR: AR and VR technologies have made significant progress, offering immersive experiences in gaming, education, and training. AR overlays digital information onto the real world, while VR creates entirely virtual environments, both of which are transforming how we interact with digital content.5. 5G Networks: The rollout of 5G networks is expected to bring about faster internet speeds and lower latency, which will enhance the capabilities of IoT devices, enable realtime data processing, and support the development of smart cities.6. Internet of Things IoT: IoT is the network of physical devices, vehicles, and other items embedded with sensors and software that enable them to connect and exchange data. This technology is transforming industries by providing realtime monitoring and control capabilities.7. Biotechnology: Advances in biotechnology, including gene editing tools like CRISPR, are opening up new possibilities in medicine, agriculture, and environmental management. These technologies could lead to personalized medicine and more sustainable food production methods.8. Autonomous Vehicles: Selfdriving cars are becoming more common, with companieslike Tesla and Waymo leading the way. Autonomous vehicles have the potential to reduce traffic accidents, improve traffic flow, and provide mobility solutions for those who cannot drive.9. Renewable Energy Technologies: Solar, wind, and other renewable energy sources are becoming more efficient and costeffective. Innovations in energy storage, such as advanced batteries, are also crucial for the widespread adoption of clean energy.10. 3D Printing: Also known as additive manufacturing, 3D printing is expanding beyond prototyping to include the production of consumer goods, medical devices, and even construction materials.11. Cybersecurity: As our reliance on digital systems grows, so does the importance of cybersecurity. New techniques in encryption, threat detection, and prevention are constantly being developed to protect against cyber attacks.12. Space Technology: With companies like SpaceX and Blue Origin pushing the boundaries of space exploration, we are seeing the development of reusable rockets, satellite internet networks, and even plans for manned missions to Mars.Each of these technologies has the potential to bring about significant changes in how we live and work. As they continue to evolve, its important for society to consider the ethical implications and ensure that these advancements are used responsibly for the benefit of all.。

外文翻译-快速成型

外文翻译-快速成型河南理工大学本科毕业设计(论文)外文资料翻译题目:Rapid Prototyping快速成型学院: 机械与动力工程学院专业: 机械设计制造及其自动化班级: 机制专升本05-1姓名: 孙泽章学号: 0503050126指导老师:焦锋Rapid Prototyping1 Rapid Prototyping basic conceptRapid Prototyping is a general term applied to a family of fabrication technologies that allow engineering of solids parts to be madein minimum lead time. The common feature of the rapid prototyping processes is that they fabricate the part directly from the CAD geometric model. This is usually done by dividing the solid object into a series of small thickness and then defining the area shapes of each layer. For example, a vertical cone would be divided into a series of circular layers, each circle becoming smaller and smaller as the vertex of the cone is approached. The rapid prototyping processes then fabricate the object at the base and building each layer on top of the preceding layer to approximate the solid shape. The fidelity of the approximation depends on the thickness of each layer. As layer thickness decreases, accuracy increases. There are a variety of layer-building processes used in rapid prototyping. The most common process, called stereo lithography, uses a photosensitive liquid polymer that cures when subjected to intense light. Curing of the polymer is accomplished using a moving laser beam whose path layer is controlled by means of the CAD model. By hardening each layer, one on top of the preceding, a solid polymer prototype of the part built.Virtual prototyping, based on virtual reality technology, involves the use of the CAD geometric model to construct a digital mock-up of the product, enabling the designer and other to obtain the sensation of the real physical product without actually building the physical prototype. Virtual prototyping has been used in the automotive industry to evaluate new car style designs. The observer of the virtual prototype is able toasses the appearance of the new design even though no physical model is on display. Other applications of virtual prototyping include checking the feasibility of assembly operations, for example, parts matting, access and clearance of parts during assembly, and assembly sequence.Automated Drafting The fourth area where CAD isuseful is presentation and documentation. CAD systems can be used as automated drafting machines to prepare highly accurate engineering drawings quick. It is estimated that a CAD system increases productivity in the drafting function about fivefold over manual preparation of drawingsCAD System HardwareThe hardware for a typical CAD system consists of the following components; 1 one or more design workstations; 2 digital computer; 3 plotters, and other output devices, and 4 storage devices. The relationship among the components is illustrated in Fig. 18.5. In addition, the CAD system would have a communication interface to permit transmission of date to and from other computer systems, thus enabling some of the benefits of computer integration.Design Workstations. The workstation is the interface between computer and user in the CAD system. Its functions are the following: 1 communicate with the CPU; 2 continuously generate a graphic image; 3 provide digital descriptions of the image” 4 translate user commands into operating functions; and 5 facilitate interaction between the user andthe system The design of the CAD workstation and its available features have an important influence on the convenience, productivity, and quality of the user’s output. The workstation must include a graphics display terminal and a set of user input devices. The display terminal must be capable of showing both graphics and alphanumeric text. It is the principal means by which the system communicates with the user. For optimum graphics display, the monitor should have a large color screen with high resolution.The user input devices permit the operator to communicate with the system. To operate the CAD system, the user must be able to accomplish the following: 1 enter alphanumeric date; 2 enter commands to the display screen. To enter alphanumeric date, an alphanumeric keyboard is provided.A conventional typewriter-like keyboard allows the designer to input numerical and alphabetic characters into the system. The alphanumeric keyboard can also be used to enter commands and instructions to the system. However, other input devices accomplish this function more conveniently. Special function keyboards have been developed to allow entry of a command in only one or tow keystrokes. These special keypads have from 10 to 50 function keys, depending on the system. However, each key provides more than one function, depending on the commands to a CAD system is the electronic tablet, an electronically sensitive board on which an instruction set is displayed, and commands are entered using a puck orelectronic pen.Cursor control permits the operator to position the cursor in the screen to identify a location where some function is to be executed. For example, to draw a straight line on the screen, the endpoints of the line can be identified by locating the cursor in sequence at the tow points and giving the command to construct the line. There are various cursor control devices used in CAD, including pucks, mousse, joysticks, trackballs, thumbwheels, light pens, and electronic tablets. An input device for entering coordinates from an existing drawing into the CAD system is a digitizer, which consists of a large flat board and an electronic tracking element such as a puck that can be moved across the surface of the board to record x-and y-coordinate positions.1.2Digital Computer CAD applications require a digital computer with a high-speed central processing unit; math coprocessor systems have 32-bit processors, which permit high-speed execution of CAD graphics and engineering analysis applications.Several CAD system configurations are available within the general arrangement show in Fig.18.5. Let us identify three principal configurations, illustrated in Fig.18.6: a host and terminal, b engineering workstation, and c CAD system based on a personal computer.The host and terminal was the original CAD configuration in the 1970s and early 1980 when the technology was first developing, for manyyears, it was the only configuration available. In this arrangement, a large mainframe computer or a minicomputer serves as the host for one or more graphics terminals. These systems were expensive, each installation typically representing an investment of a million dollars or more. The powerful microprocessors and high-density memory devices that are so common today were not available at that time. The only way to meet the computational requirements for graphics processing and related CAD applications was to use a mainframe connected to multiple terminals operating on a time-sharing basis. Host and terminal CAD systems are still used today in the automotive industry and other industries sin which it is deemed necessary to operate a large central databaseAn engineering workstation is a stand-alone computer system that is dedicated to one user and capable of executing graphics software and other programs requiring high-speed computational power. The graphics display is a high-resolution monitor with a large screen. As shown in our figure, engineering workstations are often networked to permit exchange of date files and programs between users and to share plotters and date storage devices.A PC-based CAD system is a PC with high-performance CPU and medium-to-high resolution graphics display screen. The computer is equipped with a large random access memory, math coprocessor, and large-capacity hard disk for storage of the large applications softwarepackages used for CAD. PC-based CAD systems can be networked to share files, output devices, and for other purposes. Starting around 1996, CAD software developers began offering products that utilize the excellent graphics environment of Microsoft Windows NT, thus enhancing the popularity and familiarity of PA-based CAD.When the engineering workstation is with the PC-based system, the former is superior in terms of most performance criteria. Its capacity to efficiently accomplish 3-D geometric modeling and execute other advanced software exceeds that of a PC, and this makes the workstation more responsive and interactive than a PC-based CAD system. However, the performance characteristics of PCs are improving each year, and the prices of engineering workstations are dropping each year, so that the distinction between the two types is becoming blurred.1.3Plotters and Printers The CRT display is often the only output device physically located at the CAD workstation. There is a need to document the design on paper. The peripherals of the CAD system include one more or more output devices for this purpose. Among these output devices are the following.Pen plotters. There are x-y plotters types used to produce high accuracy line drawings Electrostatic plotters. These are faster devices based on the same technology as photocopying. The resolution of drawings from electrostatic plotters is generally lower than those made by a penplotter.Dot-matrix printers. In the operation of these printers, small hammers strikes an ink ribbon against the paper to form a drawing consisting of many ink dots. Ink jet printers. These are similar to dot-matrix printers except that the dots are formed by high-speed jets of ink impacting the paper.Storage Devices. Storage peripherals are used in CAD system to store programs and data files. The storage medium is usually a magnetic disk or magnetic tape. Files can be retrieved more quickly form magnetic disks, which facilitates loading and exchange of files between CPU and disk. Magnetic tape is less expensive, but more time is required to access a given file due to the sequential file storage on the tape. It is suited to disk backup, archival files, and transfer to output devices.CAM, CAD/CAM, AND CIMWe have briefly defined the terms CAM/CAM, and CIM in our introduction. Let us explain and differentiate these terms more thoroughly here. The term computer integrated manufacturing is sometimes used interchangeably with CAM and CAD/CAM. Although he terms closely related, our assertion is that CIM possesses a broader meaning than does either CAM or CAN/CAM.2 Computer-Aided ManufacturingComputer-aided Manufacturing is defined as the effective use of computer technology in manufacturing planning and control. CAD is most closely associated with functions in manufacturing engineering, such as process planning and numerical control part programming. With reference to our model of production, the application of CAM can be divided into two broad categories: 1 manufacturing planning and 2 manufacturing control. Let us provide a brief discussion of them here to complete our definition of CAM.2.1 Manufacturing Planning CAM applications for manufacturing planning are those in which the computer is used indirectly to support the production function, but there is no direct connection between the computer and the process. The computers used “off-line” to provide information for the effective planning and management of production activities. The following list surveys the important applications of CAM in this category:Computer-aided process planning. Process planning is concerned with the preparation of routes sheets that list the sequence of operations and work centers required to produce the product and its computers. CAPPsystems are available today to prepare these route sheets.Computer-assisted NC part programming. The subject of part programming for NC was discussed. For complex part geometries, computer-assisted part programming represents a much more efficient method of generating the control instructions for the machine tool that manual part programming is.Computerized mach inability date systems. One of the problems in operating a metal cutting machine tool is determining the speeds and feeds that should be used to machine a given work part, computer programs have been written are based on date that have been obtained either in the factory or laboratory that relate tool life to cutting conditions.Development of work standards. The time study department has the responsibility for setting time standards on direct labor jobs performed in the factory. Establishing standards by direct time study can be a tedious and time-consuming task. There are several commercially available computer packages for setting work standards. These computer programs use standards time data that have been developed for basic work elements that comprise any manual task. By summing the times for the individual elements required to perform a new job, the program calculates the standard time for the job.Cost estimating. The task of estimating the cost of a new product has been simplified in most industries by computerizing several of thekey steps required to prepare the estimate. The computer is programmed to apply the appropriate labor and overhead rates to the sequence of planned operations for the components of new products. The program then sums the individual component costs form the engineering bill of materials to determine the overall product cost.2.2Production and inventory planning The computer has found widespread use in many of the functions in production and inventory planning. These functions include: maintenance of inventory records, automatic reordering of stock items when inventory is depleted, production scheduling, maintaining current priorities for the different production orders, material requirements planning, and capacity planning.Computer-aided line balancing. Finding the best allocation of work elements among stations on an assembly line is a large and difficult problem if the line is of significant size. Computer programs have been developed to assist in the solution of this problem.Manufacturing Control. The second category of CAM applications is concerned with developing computer systems to implement the manufacturing control function. Manufacturing control is concerned with managing and controlling the physical operations in the factory. These management and control areas include:2.3Process monitoring and control.Process monitoring and control is concerned with observing and regulating the production equipment and manufacturing processes in the plant. We have previously discussed process control. The applications of computer process control are pervasive today in automated production systems. They include transfer lines, assembly systems, NC, robotics, material handling, and flexible manufacturing systems. All of these topics have been covered in earlier chapters.Quality control includes a variety of approaches to ensure the highest possible quality levels in the manufactured product.Shop floor control. Shop floor control refers to production management techniques for collecting data from factory operations and using the data to help control production and inventory in the factory.Inventory control is concerned with maintaining the most appropriate levels of inventory in the face of two opposing objectives: minimizing the investment and storage costs of holding inventory and imizing service to customers.The term just-in-time refers to a production system that is organized to deliver exactly the right number of each component to downstream workstations in the manufacturing sequence just at the when that component is needed. The term applies not only to production operations but to supplier delivery operations as well.CAD/CAM is concerned with the engineering function in both design and manufacturing. Product design, engineering analysis, and documentation of the design represent engineering activities in design. Process planning, NC part programming, and other activities associated with CAM represent engineering activities in manufacturing. The CAD/CAM systems developed during the 1970s and early 1980s were designed primarily to address these types of engineering problems. In addition, CAM has evolved to include many other functions in manufacturing, such as material requirements planning, production scheduling, computer production monitoring, and computer process control.It should also be noted that CAD/CAM denotes an integration of design and manufacturing activities by means of computer systems. The method of manufacturing a product is a direct function of its design. With conventional procedures practiced for so many years in industry, engineering drawings were prepared by design draftsmen and later used by manufacturing engineers to develop the process plan. The activities involved in designing the product were separated from the activities associated with process planning. Essentially a two-step procedure was employed. This was time-consuming and involved duplication of effort by design and manufacturing personnel. Using CAD/CAM technology, it is possible to establish a direct link between product design and manufacturing engineering. In effect, CAD/CAM is one of the enablingtechnologies for concurrent engineering. It is the goal of CAD/CAM not only to automate certain phases of design and certain phases of manufacturing, but also to automate the transition form design to manufacturing. In the ideal CAD/CAM system, it is possible to take the design specification of the product, this conversion being done automatically controlled machine tool. As part of the process plan, the NC part program is generated automatically by CAD/CAM. The CAD/CAM system downloads the NC program directly to the machine tool by means of a telecommunications network. Hence, under this arrangement, product design, NC programming, and physical product。

Autodesk Factory Design Suite 说明书

Autodesk®Factory Design SuiteThe flexibility to innovate,in one cost-effective package.Rendering of factory interiorwith DWG™ underlay. Autodesk®Factory Design Suite andAutodesk® 3ds Max® Designsoftware products were used inthe design process.Extend the Benefits of Digital Prototyping to the Factory FloorAutodesk Factory Design Suite combines the power of AutoCAD with the benefits of Digital Prototyping—so you spend less time drafting, and more time optimizing and visually communicating factory layouts.Autodesk® Factory Design Suite is an integrated2D and 3D factory layout and optimization solution that can help you create more efficient factory layouts by developing a digital model of your factory. The solution complements AutoCAD®and Autodesk® Inventor® software with workflows that enhance accuracy, design efficiency, and communication.Win More BusinessCreate factory layout models that help you quickly evaluate multiple what-if layout scenarios, so you can determine the best solution before any equipment is installed. Use factory-specific visualization tools to impress potential clients with immersive and interactive layout proposals in 3D rather than difficult-to-interpret multilayered 2D drawings.Optimize Your Factory Layout ProcessUse Factory Design Suite to create layout designsmuch faster than you could with traditional factorylayout workflows. Analyze existing 2D layouts formore efficient material flow and transform layoutliabilities into profit-generating assets. IncorporatePoint Cloud scans to capture the as-built stateof your factory, drastically reducing manualmeasurement. Perform engineering reviews andexplore factory layouts with interactive 3D virtualwalk-throughs. And because Factory Design Suitesupports the DWG™ file format, you can continueto use valuable legacy data and improve yourfamiliar AutoCAD workflow without making drasticworkflow changes.Meet Tight Project SchedulesWork faster with automated workflows and afactory-centric work environment in both AutoCADand Autodesk Inventor software. Automaticallyconvert 2D drawings into 3D layout models.Then integrate reusable 3D machine and factorycomponent models to find the most optimal layoutsolution.Collaborate More Effectively with Suppliers andPartnersDevelop immersive, high-quality 3D animations andvisualizations to improve communication. Includemodels from suppliers—regardless of CAD format—in your layout, shrink-wrapping and stripping themof unwanted details. Reduce installation risks byanalyzing the digital factory model for clashesand space constraints before they become on-siteproblems.Autodesk Factory Design Suite Standard • AutoCAD ® Architecture• AutoCAD ® Mechanical• Autodesk ® Vault• Autodesk ® Showcase ®• Autodesk ® Factory Design Suite Utilities Autodesk Factory Design Suite Premium • Autodesk ® Inventor ®• Autodesk ® Navisworks ® Simulate • Autodesk ® 3ds Max ® Design • AutoCAD ® Architecture• AutoCAD ® Mechanical• Autodesk ® Vault• Autodesk ® Showcase ®• Autodesk ® Factory Design Suite Utilities Autodesk Factory Design Suite Ultimate • Autodesk ® Inventor ® Professional • Autodesk ® Navisworks ® Manage • Autodesk ® 3ds Max ® Design • AutoCAD ® Architecture • AutoCAD ® Mechanical • Autodesk ® Vault • Autodesk ® Showcase ®• Autodesk ® Factory Design Suite UtilitiesAutodesk Factory Design Suite offers:• 2D and 3D visual layout environment . Test what-if scenarios by dragging anddropping 3D models of machine andfacilities content onto your 2D floor plan.• Large library of factory assets .Access, resize, and reuse out-of-the-box 2D and 3D parametric factory content such as conveyors, material handling equipment, and facility equipment.• Factory asset builder .Use Autodesk Inventor software to create 3D models of factory equipment, or tomore easily import suppliers’ factory assets into your layout.• Factory design efficiency .Automate repetitive manual tasks,automatically convert 2D drawings into 3D layouts, and save time on measurements by using laser scanning.• 3D factory visualization and analysis . Collaborate better with immersive high-quality renderings and visualizations.Reduce installation risks by exploring digital factory models with interactive 3D virtual walk-throughs and fly-throughs.Learn how Autodesk Factory Design Suite can accelerate your factory layout process at /factorydesignsuite .Build Your Digital Factory Autodesk Factory Design Suite adds factory-specific functionality to AutoCAD, Autodesk Inventor, and Autodesk ® Navisworks ® software. It combines this functionality with powerful visualization software—Autodesk ® 3ds Max ® Design and Autodesk ® Showcase ®—to help manufacturers improve innovation, collaboration, and flexibility as they respond to changing business requirements.Autodesk Factory Design Suite adds the following factory-specific functionality in AutoCAD:• Optimize 2D layout for material flow efficiency • Access large library of factory content Autodesk Factory Design Suite adds the following factory-specific functionality in Autodesk Inventor:• Convert 2D drawings into 3D layouts automatically, and build accurate factory models • Drag and drop 3D models of factory assets on top of your 2D floor plan • Access large library of 3D parametric factory content • Add smart connection points and landing surface definitions on an asset Autodesk Factory Design Suite adds the following factory-specific functionality in Autodesk Navisworks:• Benefit from the introduction of factory floor concept • Get associative updates with Autodesk Inventor• Use factory-specific layout toolsAutoCAD ArchitectureAutoCAD ® Architecture is AutoCAD software for architects that combines architectural drafting tools with a familiar AutoCAD software-based working environment to increase design productivity and improve collaboration.Autodesk InventorCreate accurate digital models of factory layouts and equipment in a factory-specific parametric work environment, so you can make better layout decisions before equipment is installed.Autodesk Inventor Professional Design, visualize, and simulate factory equipment under real-world conditions with advanced software for 3D mechanical design, product simulation, routed systems design, and tooling creation.AutoCAD Mechanical Create and revise mechanical drawings quickly, using all the functionality of world-class AutoCAD software plus a complete set of features designed to boost the productivity of your mechanical design.Autodesk 3ds Max Design Use award-winning software to create near photorealistic renderings and cinema-quality 3D animations with the push of a button. Demonstrate the operation of layout designs in real-world settings to improve communication and accelerate your path to new business.Autodesk Showcase Transform CAD data into compelling imagery, movies, and interactive presentations to improve the design review process, secure internal buy-in, and win competitive bids. Realistic environments, lighting, and materials let stakeholders and prospects experience your ideas before they’re real.Autodesk Navisworks Use this project review software to integrate 3D models and multiformat data, reduce construction risks, and validate design accuracy by detecting space constraints and equipment collisions early in the design process.Autodesk Vault Use Autodesk ® Vault software to manage the process of designing, optimizing, and documenting factory layouts—and gain more control over yourdesign data.。

Parallel Robot

Parallel RobotOverviewCompared with a traditional industrial robot of equivalentfunctions (such as Cartesian coordinate robot and industrialserial robot), a parallel robot has the advantages of simplerstructure and higher acceleration and deceleration capability.In addition, some problems in structure of this type of robotssuch as singularity and narrow working space can be solvedby increasing redundancy constraints or adding redundancydrive. Parallel robot is currently receiving great attention inindustrial and academic circlesGPM series of redundant parallel robots is a new experimentand research system specially designed and developed byGoogol Technology for research on redundant parallel robot.GPM can be used in robotics courses such as AutomationControl and Mechatronics to meet laboratory experiment requirements for studying mechanism, kinematics, dynamics, motion planning and programming. This system can also be used in studying controlling and programming redundant parallel robot, in testing various nonlinear control algorithms and redundancy coordination control algorithms, in assisting the control experiments of various automatic control theories and be used as a non-linear system with three inputs and two outputs. Besides its research and teaching usage, GPM series of parallel robots can also be used in developing new principles and experiment prototypes with high-speed, high-accuracy gluing and bonding.System FeaturesSpecial plane joint structure is designed to maximize the Array workspace of end-effecter.Aluminum alloy connecting bars, with unique structuredesign－lightweight, low inertia and high rigidity.Three motors to drive, which enable 2 DOF movement ofthe end-effecter. All motors are mounted on the base toachieve higher acceleration.Industrial AC servomotors equipped with absolute encoderand harmonic decelerators are used to ensure its personalityof compact structure and high motion precision. .High-performance motion controller in the control system,in order to facilitate the users to develop the systemsubsequently and do research on coordinated controlalgorithms.Technical SpecificationsItem IndexStructure Planar joint typeLoad capability 1KgMotion accuracy (Pulse equivalent weight/ rev) 819200Repeated positioning accuracy at end ±0.05mmPositioning accuracy ±0.1mmJoint 1 125°Joint 2 128°Max. swing of each axisJoint 3 125°Max. angular velocity of each axis 3.14rad/sWeight ≤50KgDimension (Length x Width x Height) 590mm x 525mm x 400mm Ordering GuideModel Number Model Name DescriptionGPM2002 2 DOF redundant parallel robot • 2 DOF redundant parallel mechanism•Control system (Motion controller + Axiselectrical control module)•demo software (with source codes)GPM2012 2 DOF redundant parallel robot •GPM2002•Pneumatic z-axisGPM2003 3 DOF redundant parallel robot •GPM2002•pneumatic z-axis and electrical θ-axis GPM2004 4 DOF redundant parallel robot •GPM2002•electrical z-axis and θ-axis (withintegrated screw)GOOGOL TECHNOLOGY (HONG K ONG)L IMITEDR M 3639,A NNEX B LDG,HKUSTC LEAR W ATER B AY,K LN,HKT EL:+852********F AX:+852********E MAIL:SALES@(P RODUCTS E NQUIRY)W EBSITE: GOOGOL TECHNOLOGY (SHENZHEN)L IMITEDR M W211,IER B UILDING, SOUTH AREASHENZHEN HI-TECH INDUSTRIAL PARKT EL:+0755********F AX:+0755********E MAIL:GOOGOL@(P RODUCTS E NQUIRY)W EBSITE:。

有时,简单的就是最好的!点击化学也这样证明

有时,简单的就是最好的!点击化学也这样证明
佚名
【期刊名称】《大众科学》
【年(卷),期】2022()10
【摘要】10月5日下午,2022年诺贝尔化学奖授予美国化学家CarolynR·Bertozzi,丹麦化学家MortenMeldal和美国化学家K·BarrySharpless,以表彰他们为点击化学和生物正交化学的发展做出的贡献。

其中,Sharpless是第二次获得诺奖。

【总页数】4页(P16-19)
【正文语种】中文
【中图分类】G63
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