TLV2264AIPWRG4中文资料
12864液晶中文资料
12864液晶中文资料一、概述12864液晶是一种常用的显示器件,广泛应用于各种电子设备中。
本文将详细介绍12864液晶的基本原理、技术参数、接口定义以及使用方法。
二、基本原理12864液晶采用液晶材料的光电效应,通过控制液晶分子的排列状态来实现图像的显示。
其基本原理如下:1. 液晶分子的排列:液晶分子在电场作用下,可以呈现不同的排列状态,包括平行排列、垂直排列和斜向排列等。
2. 光的偏振特性:液晶分子的排列状态会改变光的偏振方向,从而影响光的透射和反射。
3. 电场控制:通过施加电场,可以改变液晶分子的排列状态,从而控制光的透射和反射,实现图像的显示。
三、技术参数12864液晶的技术参数如下:1. 分辨率:128x64像素,即共有128列和64行像素点。
2. 视角:可视角度为大约160度,支持广泛的观看角度。
3. 对比度:对比度高,图像显示清晰,可适应不同环境的显示需求。
4. 亮度:亮度可调节,适应不同环境的亮度要求。
5. 响应时间:响应速度快,显示图像刷新迅速。
四、接口定义12864液晶的接口定义如下:1. 电源接口:包括电源正负极连接口,用于提供电源给液晶显示模块。
2. 数据接口:包括数据引脚和控制引脚,用于传输图像数据和控制信号。
3. 背光接口:用于连接背光灯,提供背光照明。
五、使用方法12864液晶的使用方法如下:1. 连接电源:将电源正负极连接到液晶模块的电源接口,确保电源供应正常。
2. 连接数据接口:将数据引脚和控制引脚连接到控制器或微处理器的相应引脚。
3. 连接背光:将背光接口连接到背光灯,确保背光灯正常工作。
4. 编写代码:使用相应的编程语言,编写控制12864液晶显示的代码,包括图像数据传输和控制信号发送等。
5. 调试测试:将控制器或微处理器与12864液晶连接后,进行调试测试,确保图像能够正常显示。
六、应用领域12864液晶广泛应用于各种电子设备中,包括但不限于以下领域:1. 仪器仪表:用于显示各种仪器仪表的测量结果、参数和状态信息。
IUP系列智能直流电源说明书
在停电较长时间后或首次使用时,接上交流输入,开启开关,需连续充电 10 小时以上,以免要合分闸操作时,电池无法提供足够的功率。
■ 保护功能
5
IUP 系列智能微型直流操作电源
ivtsys 英微特电源
◆ 输出过压保护 直流输出有过压保护功能,当电压大于 231V,自动关闭输出,红色“关闭输
LM22674中文资料
器应有的一切有源功能。可以驱动电流高达500 mA的负载,并具 有优良的源及负载调整率。通过一个低导通电阻的N沟道MOSFET (金属氧化物半导体场效应管)获得超过90%的高效率。这个系列包
■ ■
内部补偿电压型模式控制 工作稳定性兼容低ESR(等效串联阻抗)的陶瓷电容器
含一个固定的5V输出和一个输出电压可调版本。
7
LM22675
相对于标称限流的降低百分比(%)
热保护
内部热关断电路在超过最大结点温度的情况下保护LM22675。当 激活时,典型温度为150℃,控制器被强制处于低功率复位状态。 通常有一个15°的典型迟滞值。
温度(℃)
30076908
4
LM22674
反馈电流(nA)
反馈偏置电流与温度
标准化使能阈值与温度
标准化使能阈值
温度(℃)
30076905
待机静态电流与输入电压
温度(℃)
30076910
标准化反馈电压与温度
标准化VFB
输入电压(V)
30076906
标准化反馈电压与输入电压
最大占空比/压差
开关频率为500kHz时,典型的最大占空比为90%。这对应200ns的 典型最小关断时间。为了在每个周期中给自举电容器提供足够的充 电时间,这个强制关断时间就很重要。 保证正常工作的最低输入电压是:
其中D是占空比。
电流限制
当电源开关打开时,肖特基二极管D1上寄生电容充电会产生显 著的一个前沿电流尖峰,且具有很长的自振周期。这个尖峰可导 致限流比较器过早发生跳跃。前沿消隐时间(TBLK)的典型值为 100ns,可用来避免尖峰的抽样。 当开关电流达到限流阈值时,开关就会立即关断。如果TON大于最 小值(典型值为100ns),开关将使输出电流维持在预设限流值。但 是如果TON等于或者减小到最小导通时间(典型值为100ns)时,开 关频率将降到典型频率的1/5。这会使输出电流折回到一个更低的 安全值。当过流状态结束后,开关频率会恢复至标称值。这个5X 频率反走会使电源开关产生一个更低占空比的脉冲,以使故障状 态下的功耗达到最小。
TLV3404IPWR
APPLICATIONS
q q q q q BATTERY-POWERED LEVEL DETECTION DATA ACQUISITION SYSTEM MONITORING OSCILLATORS SENSOR SYSTEMS: Smoke Detectors, Light Sensors, Alarms
Copyright © 2004, Texas Instruments Incorporated
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage .................................................................................... +7V Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V Current(2) .................................................. ±10mA Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –55°C to +150°C Storage Temperature ..................................................... –55°C to +150°C Junction Temperature .................................................................... +150°C Lead Temperature (soldering, 10s) ............................................... +300°C ESD Rating (Human Body Model) .................................................. 2000V NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. In put signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground.
atc中文手册
A T24C256中文资料2009-11-15 09:43特性???? 与1MHz I2C 总线兼容???? 到伏工作电压范围???? 低功耗CMOS 技术???? 写保护功能当WP 为高电平时进入写保护状态???? 64 字节页写缓冲器???? 自定时擦写周期???? 100,000 编程/擦写周期???? 可保存数据100 年???? 8 脚DIP SOIC 封装???? 温度范围商业级工业级和汽车级概述CAT24WC256 是一个256K 位串行CMOS E2PROM 内部含有32768 个字节每字节为8 位CATALYST 公司的先进CMOS 技术实质上减少了器件的功耗CAT24WC256 有一个64 字节页写缓冲器该器件通过I2C 总线接口进行操作管脚描述管脚名称功能A0 A1 地址输入SDA 串行数据/地址SCL 串行时钟WP 写保护Vcc + 电源Vss 地NC 未连接极限参数工作温度工业级-55 +125商业级0 +75贮存温度-65 +150各管脚承受电压 Vcc+Vcc 管脚承受电压 +封装功率损耗Ta=25焊接温度(10 秒) 300口输出短路电流100mA功能描述CAT24WC256 支持I2C 总线数据传送协议I2C 总线协议规定任何将数据传送到总线的器件作为发送器任何从总线接收数据的器件为接收器数据传送是由产生串行时钟和所有起始停止信号的主器件控制的CAT24WC256 是作为从器件被操作的主器件和从器件都可以作为发送器或接收器但由主器件控制传送数据发送或接收的模式管脚描述SCL 串行时钟CAT24WC256 串行时钟输入管脚用于产生器件所有数据发送或接收的时钟这是一个输入管脚SDA 串行数据/地址双向串行数据/地址管脚用于器件所有数据的发送或接收SDA 是一个开漏输出管脚可与其它开漏输出或集电极开路输出进行线或wire-ORWP 写保护当WP 脚连接到Vcc 所有内存变成写保护只能读当WP 引脚连接到Vss 或悬空允许器件进行读/写操作A0 A1 器件地址输入这些管脚为硬连线或者不连接对于单总线系统最多可寻址4 个CAT24WC256 器件参阅器件寻址当这些引脚没有连接时其默认值为0I2C 总线协议I2C 总线协议定义如下1 只有在总线空闲时才允许启动数据传送2 在数据传送过程中当时钟线为高电平时数据线必须保持稳定状态不允许有跳变时钟线为高电平时数据线的任何电平变化将被看作总线的起始或停止信号起始信号时钟线保持高电平期间数据线电平从高到低的跳变作为I2C 总线的起始信号停止信号时钟线保持高电平期间数据线电平从低到高的跳变作为I2C 总线的停止信号器件寻址主器件通过发送一个起始信号启动发送过程然后发送它所要寻址的从器件的地址8 位从器件地址的高5 位固定为10100 见图5 接下来的2 位A1 A0 为器件的地址位最多可以连接4 个器件到同一总线上这些位必须与硬连线输入脚A1 A0 相对应从器件地址的最低位作为读写控制位1表示对从器件进行读操作0 表示对从器件进行写操作在主器件发送起始信号和从器件地址字节后CAT24WC256 监视总线并当其地址与发送的从地址相符时响应一个应答信号通过SDA 线CAT24WC256 再根据读写控制位R/W 的状态进行读或写操作应答信号I2C 总线数据传送时每成功地传送一个字节数据后接收器都必须产生一个应答信号应答的器件在第9 个时钟周期时将SDA 线拉低表示其已收到一个8 位数据CAT24WC256 在接收到起始信号和从器件地址之后响应一个应答信号如果器件已选择了写操作则在每接收一个8 位字节之后响应一个应答信号当CAT24WC256 工作于读模式时在发送一个8 位数据后释放SDA 线并监视一个应答信号一旦接收到应答信号CAT24WC256 继续发送数据如主器件没有发送应答信号器件停止传送数据并等待一个停止信号写操作字节写在字节写模式下主器件发送起始信号和从器件地址信息R/W 位置0 给从器件在从器件送回应答信号后主器件发送两个8 位地址字写入CAT24WC256 的地址指针主器件在收到从器件的应答信号后再发送数据到被寻址的存储单元CAT24WC256 再次应答并在主器件产生停止信号后开始内部数据的擦写在内部擦写过程中CAT24WC256 不再应答主器件的任何请求页写在页写模式下单个写周期内CAT24WC256 最多可以写入64 个字节数据页写操作的启动和字节写一样不同在于传送了一字节数据后主器件允许继续发送63 个字节每发送一个字节后CAT24WC256 将响应一个应答位且内部低6 位地址加1 高位地址保持不变如果主器件在发送停止信号之前发送大于64 个字节地址计数器将自动翻转先前写入的数据被覆盖当所有64 字节接收完毕主器件发送停止信号内部编程周期开始此时所有接收到的数据在单个写周期内写入CAT24WC256应答查询可以利用内部写周期时禁止数据输入这一特性一旦主器件发送停止位指示主器件操作结束时CAT24WC256 启动内部写周期应答查询立即启动包括发送一个起始信号和进行写操作的从器件地址如果CAT24WC256 正在进行内部写操作将不会发送应答信号如果CAT24WC256 已经完成了内部写操作将发送一个应答信号主器件可以继续对CAT24WC256 进行下一次读写操作写保护写保护操作特性可使用户避免由于不当操作而造成对存储区域内部数据的改写当WP 管脚接高时整个寄存器区全部被保护起来而变为只可读取CAT24WC256 可以接收从器件地址和字节地址但是装置在接收到第一个数据字节后不发送应答信号从而避免寄存器区域被编程改写读操作CAT24WC256 读操作的初始化方式和写操作时一样仅把R/W 位置为1 有三种不同的读操作方式立即/当前地址读选择/随机读和连续读立即/当前地址读的地址计数器内容为最后操作字节的地址加1 也就是说如果上次读/写的操作地址为N 则立即读的地址从地址N+1 开始如果N=E 此处E=32767 则计数器将翻转到0 且继续输出数据CAT24WC256接收到从器件地址信号后R/W 位置1 它首先发送一个应答信号然后发送一个8 位字节数据主器件不需发送一个应答信号但要产生一个停止信号选择/随机读选择/随机读操作允许主器件对寄存器的任意字节进行读操作主器件首先通过发送起始信号从器件地址和它想读取的字节数据的地址执行一个伪写操作在CAT24WC256 应答之后主器件重新发送起始信号和从器件地址此时R/W 位置1 CAT24WC256 响应并发送应答信号然后输出所要求的一个8 位字节数据主器件不发送应答信号但产生一个停止信号连续读连续读操作可通过立即读或选择性读操作启动在CAT24WC256 发送完一个8 位字节数据后主器件产生一个应答信号来响应告知CAT24WC256 主器件要求更多的数据对应每个主机产生的应答信号CAT24WC256 将发送一个8 位数据字节当主器件不发送应答信号而发送停止位时结束此操作从CAT24WC256 输出的数据按顺序由N 到N+1 输出读操作时地址计数器在CAT24WC256 整个地址内增加这样整个寄存器区域在可在一个读操作内全部读出当读取的字节超过E 此处E=32767计数器将翻转到零并继续输出数据字节。
TLV2444资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。
MD204L使用手册j简体中文版EW02CN02-081215
eviewmd204l用户手册第一章产品概述11功能12一般规格13各部分名称14外形尺寸及安装方法第二章编辑软件tp20021tp200概述211关于工程和画面212画面内容213tp200使用流程22编辑用户画面221创建工程222制作基本画面223md204l系统参数10224文本11225动态文本12226功能键画面跳转13227数据显示17228数据设定20229指示灯212210功能键开关量控制252211272212报警列表282213报警列表2923保存工程3024下载画面31第三章md204l操作方法31联机通讯3232切换画面3233系统口令3334修改数据3335开关量控制eviewmd204l用户手册第四章与plc的连接方法41三菱fx系列3742西门子s7200系列3843欧姆龙c系列3944光洋s系列4045施耐德neza系列4146台达dvp系列4247松下fp系列4348lgmasterk系列4449facon永宏系列eviewmd204l用户手册第一章产品概述11功能md204l是可编程序控制器的小型人机界面以文字或指示灯等形式监视修改plc内部寄存器或继电器的数值及状态
KL26P64M48SF5 中文资料
定时器 • 六通道定时器/PWM (TPM) • 两个双通道定时器/PWM 模块 • 周期性中断定时器 • 16 位低功耗定时器(LPTMR) • 实时时钟
安全性和完整性模块 • 每个芯片具有 80 位唯一标识号
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2013–2014 Freescale Semiconductor, Inc. 保留
所有权利。
器件型号
MKL26Z32VFM4 MKL26Z64VFM4 MKL26Z128VFM4 MKL26Z32VFT4 MKL26Z64VFT4 MKL26Z128VFT4 MKL26Z32VLH4 MKL26Z64VLH4 MKL26Z128VLH4
Flash (KB) 32 64 128 32 64 128 32 64 128
• 在极低功耗运行模式下,运行功耗低至 40 μA/MHz • 静态功耗低至 2 μA,并具有全状态保留和 4.5 μs 唤醒能力 • 超高效 Cortex-M0+处理器,运行频率高达 48 MHz,具有业
界领先的吞吐速率 • 存储器选项为最高 128 KB Flash 和 16 KB RAM • 节能架构针对低功耗优化,采用 90nm TFS 技术、时钟和电
3 外设工作要求与特性......................................................................17 3.1 内核模块................................................................................. 17 3.1.1 SWD 电气特性 ......................................................... 17 3.2 系统模块................................................................................. 18 3.3 时钟模块................................................................................. 18 3.3.1 MCG 特性.................................................................. 18 3.3.2 振荡器电气规格........................................................ 20 3.4 存储器和存储器接口............................................................. 22 3.4.1 Flash 电气规格...........................................................22 3.5 安全性和完整性模块............................................................. 23 3.6 模拟......................................................................................... 24 3.6.1 ADC 电气规格...........................................................24 3.6.2 CMP 和 6 位 DAC 的电气规格................................ 28
SN74LVC139APWRG4中文资料
FEATURES1 2 3 4 5 6 7 816 15 14 13 12 11 10 91G 1A 1B 1Y0 1Y1 1Y2 1Y3 GND V CC 2G 2A 2B 2Y0 2Y1 2Y2 2Y3D, DB, DGV, NS, OR PW PACKAGE(TOP VIEW)RGY PACKAGE(TOP VIEW)116892345671514131211102G2A2B2Y02Y12Y2 1A1B1Y01Y11Y21Y3G2Y3VGNDCCDESCRIPTION/ORDERING INFORMATION SN74LVC139ADUAL2-LINE TO4-LINE DECODER/DEMULTIPLEXERSCAS341O–MARCH1994–REVISED FEBRUARY2005•Latch-Up Performance Exceeds250mA PerJESD17•Operates From1.65V to3.6V•ESD Protection Exceeds JESD22•Inputs Accept Voltages to5.5V–2000-V Human-Body Model(A114-A)•Max t pd of6.2ns–200-V Machine Model(A115-A)•Typical V OLP(Output Ground Bounce)<0.8V at V CC=3.3V,T A=25°C–1000-V Charged-Device Model(C101)•Typical V OHV(Output V OH Undershoot)>2V at V CC=3.3V,T A=25°CThis dual2-line to4-line decoder/demultiplexer is designed for1.65-V to3.6-V V CC operation.The device comprises two individual2-line to4-line decoders in a single package.The active-low enable(G) input can be used as a data line in demultiplexing applications.This decoder/demultiplexer features fully buffered inputs,each of which represents only one normalized load to its driving circuit.Inputs can be driven from either3.3-V or5-V devices.This feature allows the use of this device as a translator in a mixed3.3-V/5-V system environment.ORDERING INFORMATIONT A PACKAGE(1)ORDERABLE PART NUMBER TOP-SIDE MARKING QFN–RGY Reel of1000SN74LVC139ARGYR LC139ATube of40SN74LVC139ADSOIC–D Reel of2500SN74LVC139ADR LVC139AReel of250SN74LVC139ADTSOP–NS Reel of2000SN74LVC139ANSR LVC139ASSOP–DB Reel of2000SN74LVC139ADBR LC139A–40°C to85°CTube of90SN74LVC139APWTSSOP–PW Reel of2000SN74LVC139APWR LC139AReel of250SN74LVC139APWTTVSOP–DGV Reel of2000SN74LVC139ADGVR LC139AVFBGA–GQN SN74LVC139AGQNRReel of1000LC139AVFBGA–ZQN(Pb-free)SN74LVC139AZQNR(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at/sc/package. GQN OR ZQN PACKAGE(TOP VIEW)1234ABCDESelectInputsSelectInputs2B2A2G1B1A1GDataOutputs2Y32Y22Y12Y01Y31Y21Y11Y0 Pin numbers shown are for the D, DB, DGV, NS, PW, and RGY packages.SN74LVC139ADUAL2-LINE TO4-LINE DECODER/DEMULTIPLEXERSCAS341O–MARCH1994–REVISED FEBRUARY2005TERMINAL ASSIGNMENTS1234A1A1G V CC2GB1B NC(1)NC(1)2AC1Y11Y02Y02BD1Y2NC(1)NC(1)2Y1E GND1Y32Y32Y2(1)NC-No internal connectionFUNCTION TABLE(EACH DECODER/DEMULTIPLEXER)INPUTSOUTPUTSSELECTGB A Y3Y2Y1Y0L L L H H H LL L H H H L HL H L H L H HL H H L H H HH X X H H H HLOGIC DIAGRAM(POSITIVE LOGIC)Absolute Maximum Ratings(1) Recommended Operating Conditions(1)SN74LVC139A DUAL2-LINE TO4-LINE DECODER/DEMULTIPLEXERSCAS341O–MARCH1994–REVISED FEBRUARY2005over operating free-air temperature range(unless otherwise noted)MIN MAX UNIT V CC Supply voltage range–0.5 6.5VV I Input voltage range(2)–0.5 6.5VV O Output voltage range(2)(3)–0.5V CC+0.5VI IK Input clamp current V I<0–50mAI OK Output clamp current V O<0–50mAI O Continuous output current±50mAContinuous current through V CC or GND±100mAD package(4)73DB package(4)82DGV package(4)120θJA Package thermal impedance GQN/ZQN package(4)78°C/WNS package(4)64PW package(4)108RGY package(5)39T stg Storage temperature range–65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3)The value of V CC is provided in the recommended operating conditions table.(4)The package thermal impedance is calculated in accordance with JESD51-7.(5)The package thermal impedance is calculated in accordance with JESD51-5.MIN MAX UNITOperating 1.65 3.6V CC Supply voltage VData retention only 1.5V CC=1.65V to1.95V0.65×V CCV IH High-level input voltage V CC=2.3V to2.7V 1.7VV CC=2.7V to3.6V2V CC=1.65V to1.95V0.35×V CCV IL Low-level input voltage V CC=2.3V to2.7V0.7VV CC=2.7V to3.6V0.8V I Input voltage0 5.5VV O Output voltage0V CC VV CC=1.65V–4V CC=2.3V–8I OH High-level output current mAV CC=2.7V–12V CC=3V–24V CC=1.65V4V CC=2.3V8I OL Low-level output current mAV CC=2.7V12V CC=3V24∆t/∆v Input transition rise or fall rate10ns/V T A Operating free-air temperature–4085°C (1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs,literature number SCBA004.Electrical CharacteristicsSwitching CharacteristicsOperating CharacteristicsSN74LVC139ADUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXERSCAS341O–MARCH 1994–REVISED FEBRUARY 2005over recommended operating free-air temperature range (unless otherwise noted)PARAMETERTEST CONDITIONSV CCMIN TYP (1)MAXUNITI OH =–100µA 1.65V to 3.6VV CC –0.2I OH =–4mA1.65V 1.2I OH =–8mA2.3V 1.7V OHV2.7V 2.2I OH =–12mA 3V 2.4I OH =–24mA 3V 2.2I OL =100µA 1.65V to 3.6V0.2I OL =4mA1.65V 0.45V OLI OL =8mA 2.3V 0.7V I OL =12mA 2.7V 0.4I OL =24mA3V 0.55I I All inputsV I =5.5V or GND 3.6V ±5µA I CC V I =V CC or GND,I O =03.6V 10µA ∆I CC One input at V CC –0.6V,Other inputs at V CC or GND2.7V to3.6V500µA C i V I =V CC or GND3.3V5pF (1)All typical values are at V CC =3.3V,T A =25°C.over recommended operating free-air temperature range (unless otherwise noted)(see Figure 1)V CC =1.8V V CC =2.5V V CC =3.3V V CC =2.7V FROM TO ±0.15V ±0.2V ±0.3V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX A or B 120.619.317.31 6.2t pd Yns G119.517.215.214.7t sk(o)1ns T A =25°CV CC =1.8VV CC =2.5VV CC =3.3VTEST PARAMETERUNIT CONDITIONS TYP TYP TYP C pdPower dissipation capacitancef =10MHz28.529.530.5pFPARAMETER MEASUREMENT INFORMATIONFrom Output Under TestLOAD CIRCUITOpen Data InputTiming InputV I0 VV I0 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OLV I0 V InputOutput Waveform 1S1 at V LOAD (see Note B)Output Waveform 2S1 at GND (see Note B)V OLV OH V LOAD /20 V≈0 VV IVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputt PLH /t PHL t PLZ /t PZL t PHZ /t PZHOpen V LOAD GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.All parameters and waveforms are not applicable to all devices.Output Control V I1.8 V ± 0.15 V2.5 V ± 0.2 V2.7 V3.3 V ± 0.3 V1 k Ω500 Ω500 Ω500 ΩV CC R L 2 × V CC 2 × V CC 6 V 6 VV LOAD C L 30 pF 30 pF 50 pF 50 pF0.15 V 0.15 V 0.3 V 0.3 VV ∆V CC V CC 2.7 V 2.7 VV I V CC /2V CC /21.5 V 1.5 VV M t r /t f ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 nsINPUTS SN74LVC139ADUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXERSCAS341O–MARCH 1994–REVISED FEBRUARY 2005Figure 1.Load Circuit and Voltage WaveformsPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LVC139AD ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADBLE OBSOLETE SSOP DB 16TBDCall TI Call TISN74LVC139ADBR ACTIVE SSOP DB 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADBRE4ACTIVE SSOP DB 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADGVR ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADGVRE4ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADT ACTIVE SOIC D 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADTE4ACTIVE SOIC D 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139AGQNRACTIVEBGA MI CROSTA R JUNI ORGQN201000TBDSNPBLevel-1-240C-UNLIMSN74LVC139ANSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ANSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APW ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWE4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWG4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWLE OBSOLETE TSSOP PW 16TBDCall TI Call TISN74LVC139APWR ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWRE4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWRG4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWT ACTIVE TSSOP PW 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWTE4ACTIVETSSOPPW16250Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM18-Jul-2006Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LVC139APWTG4ACTIVE TSSOP PW 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ARGYR ACTIVE QFN RGY 161000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVC139ARGYRG4ACTIVE QFN RGY 161000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVC139AZQNRACTIVEBGA MI CROSTA R JUNI ORZQN201000Green (RoHS &no Sb/Br)SNAGCULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.18-Jul-2006PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LVC139AD ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADBLE OBSOLETE SSOP DB 16TBDCall TI Call TISN74LVC139ADBR ACTIVE SSOP DB 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADBRE4ACTIVE SSOP DB 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADGVR ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADGVRE4ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADT ACTIVE SOIC D 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADTE4ACTIVE SOIC D 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139AGQNRNRNDBGA MI CROSTA R JUNI ORGQN201000TBDSNPBLevel-1-240C-UNLIMSN74LVC139ANSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ANSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APW ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWE4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWG4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWLE OBSOLETE TSSOP PW 16TBDCall TI Call TISN74LVC139APWR ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWRE4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWRG4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWT ACTIVE TSSOP PW 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWTE4ACTIVETSSOPPW16250Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM30-Mar-2007Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LVC139APWTG4ACTIVE TSSOP PW 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC139ARGYR ACTIVE QFN RGY 161000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVC139ARGYRG4ACTIVE QFN RGY 161000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVC139AZQNRACTIVEBGA MI CROSTA R JUNI ORZQN201000Green (RoHS &no Sb/Br)SNAGCULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.30-Mar-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and todiscontinue any product or service without notice. Customers should obtain the latest relevant informationbefore placing orders and should verify that such information is current and complete. All products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extentTI deems necessary to support this warranty. Except where mandated by government requirements, testingof all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsiblefor their products and applications using TI components. To minimize the risks associated with customerproducts and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patentright, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,or process in which TI products or services are used. Information published by TI regarding third-partyproducts or services does not constitute a license from TI to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents orother intellectual property of the third party, or a license from TI under the patents or other intellectualproperty of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices.Reproduction of this information with alteration is an unfair and deceptive business practice. TI is notresponsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI forthat product or service voids all express and any implied warranties for the associated TI product or serviceand is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotive/broadbandBroadbandDSP DigitalControl /digitalcontrol Interface Military /military Logic Power Mgmt Optical Networking /opticalnetworkSecurity /security Microcontrollers Low Power Wireless /lpw Telephony /telephonyVideo & Imaging /video/wirelessWirelessMailing Address: Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated。
HP P22va G4 FHD 显示器技术参数手册说明书
HP P22va G4 FHD MonitorFront1. OSD Buttons2. Power Button (With power light)HP P22va G4 FHD MonitorBack1. Security Cable Slot 3. HDMI Port2. Power Connector 4. VGA ConnectorModels: 453D2APanel Specifications Display Size (Diagonal) 21.5-inchPanel Technology VACurved No CurveMax Refresh Rate 60 HzNative Resolution 1920 x1080Panel Bit Depth 8 bitsAspect Ratio 16:9Brightness (Typical) 250 nitsContrast Ratio (Static) 3000:1Dynamic Contrast Ratio 8000000:1Flicker Free YesPixel Pitch 0.0831x0.241Pixels Per Inch (PPI) 105 PPIBacklight Lamp Life30000(to half brightness - in hours)Backlight Type Edge-litScreen Treatment Anti-glareHardness 3HHaze 25%Response Time - Typical 7ms GtG (with overdrive)Horizontal Viewing Angle178°(typical CR>10)178°Vertical Viewing Angle(typical CR>10)Panel Active Area Metric (W X H) 478.65 x 260.28 mmPanel Active Area Imperial (W X H) 188.4 x 102.47NOTE: Performance specifications represent the typical specifications provided by HP's componentmanufacturers; actual performance may vary either higher or lower.Color Gamut Coverage NTSC Yes, with 72%Color Management Calibrated Color Presets Warm, Neutral, Cool, Native, Low Blue Light, Night,Reading, Custom RGBColor Space/ Subsampling Support RGB 4:4:4, YCBCR 4:4:4, YCBCR 4:2:2Rgb Channel Adjust Yes, GainDefault Color Temperature Neutral (6500K)Factory Color Calibrated Yes (Color Temperature)Factory Color Presets Warm - 5000K,Neutral - 6500K,Cool - 9300KMonitor Specifications Bezel Type NarrowColor Of Stand BlackColor Of Head BlackTilt from -5 to +20°VESA Mounting 100 mm x 100 mmSecurity Lock Ready Standard Security Lock SlotDetachable Stand YesWarranty (number of years) AMS: 3-3-0APJ: 3-3-3/3-3-0(JP)EMEA: 3-3-0Low Blue Light Mode YesOn Screen Display(OSD)Native Resolution FHD (1920 x 1080)**HDMI 1.4 required to drive panel at its native resolution.The video card of the connected PC must be capable ofsupporting 1920x1080 at 60 Hz with 6-bit color using one HDMI.Maximum Resolution 1920 x 1080@60 HzPreset Graphic Modes/Supported Resolutions 640 x 480 @ 60Hz720 x 400 @ 70 Hz800 x 600 @ 60 Hz1024 x 768 @ 60 Hz1280 x 720 @ 60 Hz1280 x 800 @ 60 Hz1280 x 1024 @ 60 Hz1440 x 900 @ 60 Hz1600 x 900 @ 60 Hz1600 x 1200 @ 60 Hz (Digital inputs only) 1680 x 1050 @ 60 Hz1920 x 1080 @ 60 HzMinimum Vertical Scan Rate 50 HzMaximum Vertical Scan Rate 60 HzMinimum Horizontal Scan Rate 30.0 kHzMaximum Horizontal Scan Rate80.0 kHzMaximum pixel clock 170 MHzUser Programmable Modes Yes, 10User-Assignable Function Buttons Yes, 3 (6 options)Languages 10 (English, Spanish, German, French, Italian, Netherlands,Portuguese, Japanese, T-Chinese and S-Chinese) Connector Types HDMI 1 HDMI 1.4HDCP Yes, HDMIVGA 1 VGASpecial Features SWITCH Menu/OK, Minus("-"))/Brightness, Plus ("+"),/Color/Auto-Adjustment, Next Input, PowerUser Presets 11Power & Operating Specs Power Supply ExternalPower Source 100~240 VAC 50/60 Hz Power Consumption - Maximum 20 WEnergy Saving/Stand By Mode 0.5 WPower Consumption - Typical 18.5 WPower cable lenght 1.8 mEnergy Star Data Operational Mode at 100 VAC 12.53 WOperational Mode at 115 VAC 12.6 WOperational Mode at 230 VAC 12.88 WEU Energy Efficiency Class (EC1062) On-mode Power Consumption 14.4 W Annual Power Consumption 21 kWh Energy Efficiency Class A+Operating Conditions Operating Temperature - Celsius 5° – 35°COperating Temperature - Fahrenheit 41° – 95°FNon-operating Temperature - Celsius –34° – 60°CNon-operating Temperature -Fahrenheit–29° – 140°COperating Humidity20 – 80% Non-operating Humidity 5 – 95%Operating Altitude0 – 5,000 m (16,400 ft.) Non-operating Altitude 0 – 12.192 m (40,000 ft.)Environmental Features and CertificationsArsenic-Free Display GlassYes Low HalogenYesGSE HP-00011-01B, table 2 defines low-halogen (BFR, CFR, PVC)NOTE: External power supplies, power cords, cables andperipherals are not Low Halogen. Service parts obtained after purchase may not be Low Halogen .Agency Approvals and CertificationsWW applicationCB/CE/cTUVus/FCC/ICES/VCCI/CCC/CEL/CECP/BSMI/Energy star/Australian-New Zealand MEPS/KCC/KC/E-standby/ISO 9241-307/BIS/UAE/EAC/CEC/NOM/Ukrainecertificates/NRCS of South Africa/ South Africa energy/ Eup Lot 6 and 26/ Eup Lot 5/ Vietnam MEPS/ Low blue light/ WEEE Microsoft WHQL Certification Win 10ENERGY STAR® CertifiedYes, ENERY STAR® 8EPEAT® RegisteredRegions need to verify by country EPEAT®*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit for more information.China Energy Label CEL Grade 1 TCO CertifiedYesSmartWay Transport Partnership - NA onlyYes (NA sku)Recycled Plastics Contains Recycled PlasticsABS 35%Recyclable Packaging (Box, packing materials)100% fiber packaging, EPS cushion, EPE+HDPE bag and HDPE bagsMetricImperialUnit Product/Package Specifications Product Dimensions(Unpacked with stand) (W x D x H)50.43 x 18.10 x 36.71 cm 19.85 x 7.13 x 14.45 in Product Dimensions (Packed) (W x D x H)56.7 x 12 x 38.7 cm 22.32 x 4.72 x 15.23in Display Head Dimensions (Unpacked without stand) (W x D x H)50.43 x 4.40 x 30.02 cm 19.85 x 1.73 x 11.82 in Base Area Footprint (w x d mm)188.95 x 181 mm 7.44 x 7.13 inBezel MeasurementsTop: 11.97 mm Left: 11.97 mm Right: 11.97 mm Bottom: 26.29 mm Top: 0.47 in Left: 0.47 in Right: 0.47 in Bottom: 1.04 in Product Weight(Unpacked with stand)2.85 kg 6.27lb Product Weight (Packed)3.41kg 7.52lbProduct Weight (Head Only) 2.24kg 4.94lbPallet InformationPallet Dimensions (L x W x H)Pallet:Pallet:1150 x1170 x1907 mm (40' ft)Silpsheet:1150 x 1170 x 2143 mm (40' ft) 45.28 x46.06 x75.08 inch (40' ft)Silpsheet:45.28 x46.06 x84.37 inch (40' ft)Pallet Total Weight Pallet: 377.426kg (40' ft)Slip Sheet: 428.389 kg(40' ft) Pallet: 832.07 lb (40' ft) Slip Sheet: 944.43 lb (40' ft)Pallet Layers 5 layers – pallet6 layers – slip sheetPallet Product per Layer 20 sets per pallet(slip sheet & pallet)Total Products per Pallet 100 sets – 40' pallet120 sets – 40' slip sheetContainer Load, 20-Foot 1000 sets (pallet)1200 sets (slip sheet)Container Load, 40-Foot 2000 sets (pallet)2400 sets (slip sheet)Container Load, 40-Foot HighQ 2400 sets (pallet)2800 sets (slip sheet) What's in the box? AC power cord (1.8m) 5.9 ft (except SG, EU)HDMI cable (1.8m) 5.9 ftDoc kitUser Guide and Warranty Languages User Guide Languages English, Arabic, S. Chinese, T. Chinese, Czech, Danish,Dutch, Finnish, French, German, Greek, Hungarian, Italian,Japanese, Kazakh, Korean, Norwegian, Polish, BrazilianPortuguese, Russian, Slovenian, Spanish, Swedish andTurkish.Warranty Languages English, Arabic, S. Chinese, T. Chinese, Czech, Danish,Dutch, Finnish, French, German, Greek, Hungarian, Italian,Japanese, Kazakh, Korean, Norwegian, Polish, BrazilianPortuguese, Russian, Slovenian, Spanish, Swedish andTurkish.This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:•IT ECO declaration•US ENERGY STAR®•US Federal Energy Management Program (FEMP)•EPEAT Silver registered in the United States. See for registration status in your country.•TCO Certified•China Energy Conservation Program (CECP)•China State Environmental Protection Administration (SEPA)•Taiwan Green Mark•Korea Eco-label•Japan PC Green label*Technical SpecificationsCopyright © 2021 HP Development Company, L.P.The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection Agency.Summary。
TLV2624IDR资料
FEATURESOperational Amplifier+−−10102030405060708090100110120f − Frequency − Hz150120906030−30−60−90PhaseMargin−°DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASEvsFREQUENCY−DifferentialVoltageAmplification−dBAVD180 DESCRIPTIONTLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER2000–REVISED JANUARY2005 FAMILY OF LOW-POWER WIDE BANDWIDTH SINGLE SUPPLYOPERATIONAL AMPLIFIERS WITH SHUTDOWN•CMOS Rail-To-Rail Output•V ICR Includes Positive Rail•Wide Bandwidth...11MHz•Slew Rate...10V/µs•Supply Current...800µA/Channel•Input Noise Voltage...27nV/√Hz•Ultralow Power-Down Mode:I DD(SHDN)=4µA/Channel•Supply Voltage Range...2.7V to5.5V•Specified Temperature Range:-40°C to125°C...Industrial Grade•Ultrasmall Packaging:5or6Pin SOT-23(TLV2620/1)8or10Pin MSOP(TLV2622/3)•Universal Opamp EVM(See SLOU060for MoreInformation)The TLV262x single supply operational amplifiers provide rail-to-rail output with an input range that includes the positive rail.The TLV262x takes the minimum operating supply voltage down to 2.7V over the extended industrial temperature range(-40°C to125°C)while adding the rail-to-rail output swing feature.The TLV262x also provides11-MHz bandwidth from only800µA of supply current.The maximum recommended supply voltage is5.5V,which,when coupled with a2.7-V minimum,allows the devices to be operated from lithium ion cells.The combination of wide bandwidth,low noise,and low distortion makes it ideal for high speed and high resolution data converter applications.The positive input range allows it to directly interface to positive rail referred systems.All members are available in PDIP and SOIC with the singles in the small SOT-23package, duals in the MSOP,and quads in the TSSOP package.The2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power micro-controllers available today including TI's MSP430.AMPLIFIER SELECTION TABLEV DD I DD/ch V IO I IB V ICR GBW SLEW RATE V n,1kHz I O SHUT-DEVICE[V][µA][µV][pA][V][MHz][V/µs][nV/√Hz][mA]DOWN TLV262x 2.7-5.575025011V to V DD+0.211102728YTLV263x 2.7-5.57502501GND to V DD-0.81092728YTLV278x 1.8-3.6650250 2.5-0.2to V DD+0.285910YTLC07x 4.5-16190060 1.50.5to V DD-0.81019755YTLC08x 4.5-161900603GND to V DD-110198.555YPlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright©2000–2005,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.元器件交易网 TLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER2000–REVISED JANUARY2005This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integratedcircuits be handled with appropriate precautions.Failure to observe proper handling and installationprocedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure.Precisionintegrated circuits may be more susceptible to damage because very small parametric changes couldcause the device not to meet its published specifications.TLV2620AND TLV2621AVAILABLE OPTIONS(1)PACKAGED DEVICESV IO max ATT A SOT-23SMALL OUTLINE25°C PLASTIC DIP(P)(D)(2)(DBV)(3)SYMBOLTLV2620ID TLV2620IDBV VBAI TLV2620IP -40°C to125°C3500µVTLV2621ID TLV2621IDBV VBBI TLV2621IP(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TIwebsite at .(2)This package is available taped and reeled.To order this packaging option,add an R suffix to the part number(e.g.,TLV2620IDR).(3)The SOT23package devices are only available taped and reeled.The R Suffix denotes quantities(3,000pieces per reel).For smallerquantities(250pieces per mini-reel),add a T suffix to the part number(e.g.TLV2620IDBVT).TLV2622AND TLV2623AVAILABLE OPTIONS(1)PACKAGED DEVICESV IO max AT SMALL MSOP PLASTIC T A PLASTIC25°C OUTLINE(2)DIPDIP(N)(DGK)(2)SYMBOL(DGS)(2)SYMBOL(D)(P)TLV2622ID TLV2622IDGK xxTIAKM———TLV2622IP -40°C to125°C3500µVTLV2623ID——TLV2623IDGS xxTIALC TLV2623IN—(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TIwebsite at .(2)This package is available taped and reeled.To order this packaging option,add an R suffix to the part number(e.g.,TLV2622IDR).TLV2624AND TLV2625AVAILABLE OPTIONS(1)PACKAGED DEVICESV IO maxT A SMALL OUTLINE PLASTIC DIP TSSOPAT25°C(D)(2)(N)(PW)TLV2624ID TLV2624IN TLV2624IPW-40°C to125°C3500µVTLV2625ID TLV2625IN TLV2625IPW(1)For the most current package and ordering information,see the Package Option Addendum at theend of this document,or see the TI website at .(2)This package is available taped and reeled.To order this packaging option,add an R suffix to thepart number(e.g.,TLV2624IDR).2元器件交易网TLV262X PACKAGE PINOUTS (1)(TOP VIEW)OUT GND IN+V DDIN−TLV2621DBV PACKAGE V DD 2OUT 2IN−2IN+2SHDN(TOP VIEW)OUT GND IN+V DD IN−TLV2620DBV PACKAGE SHDN TLV2623DGS PACKAGE (TOP VIEW)NC − No internal connectionTLV2620D OR P PACKAGE(TOP VIEW)NC V DD OUT NC TLV2621D OR P PACKAGE(TOP VIEW)1234 5671413121110981OUT 1IN−1IN+GND NC 1SHDNNCV DD 2OUT 2IN−2IN+NC 2SHDN NC (TOP VIEW)TLV2623D OR N PACKAGE1234 5671413121110981OUT 1IN−1IN+V DD 2IN+2IN−2OUT4OUT 4IN−4IN+GND 3IN+3IN−3OUT(TOP VIEW)TLV2624D, N, OR PW PACKAGE4OUT 4IN−4IN+GND 3IN+3IN−3OUT 3/4SHDN(TOP VIEW)TLV2625D, N, OR PW PACKAGEV DD 2OUT 2IN−2IN+TLV2622D, DGK, OR P PACKAGE(TOP VIEW)3/4SHDN Pin (9) controls amplifiers 3 and 4.Printed or Molded DotBevel EdgesPin 1Molded ”U” ShapePin 1StripePin 1Pin 1TLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER 2000–REVISED JANUARY 2005(1)SOT-23may or may not be indicated.TYPICAL PIN 1INDICATORSNOTE:If there is not a Pin 1indicator,turn device to enable reading the symbol from left to right.Pin 1is at the lower left corner of the device.3元器件交易网ABSOLUTE MAXIMUM RATINGSDISSIPATION RATING TABLERECOMMENDED OPERATING CONDITIONSTLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER 2000–REVISED JANUARY 2005over operating free-air temperature range (unless otherwise noted)(1)V DD Supply voltage(2)6V V ID Differential input voltage ±V DDV I Input voltage range (2)+1to V DD +0.2VI I Input current (any input)±10mA I O Output current±40mAContinuous total power dissipationSee Dissipation Rating TableT A Operating free-air temperature range:I-suffix -40°C to 125°CT J Maximum junction temperature 150°C T stg Storage temperature range-65°C to 150°CLead temperature 1,6mm (1/16inch)from case for 10seconds 260°C(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltage values,except differential voltages,are with respect to GND.θJCθJAT A ≤25°C T A =125°C PACKAGE (°C/W)(°C/W)POWER RATINGPOWER RATINGD (8)38.3176710mW 142mW D (14)26.9122.31022mW 204.4mW D (16)25.7114.71090mW 218mW DBV (5)55324.1385mW 77.1mW DBV (6)55294.3425mW 85mW DGK (8)54.2259.9481mW 96.1mW DGS (10)54.1259.7485mW 97mW N (14,16)32781600mW 320.5mW P (8)411041200mW 240.4mW PW (14)29.3173.6720mW 144mW PW (16)28.7161.4774mW154.9mWMINMAX UNIT Single supply 2.7 5.5V DD Supply voltageV Split supply±1.35±2.75V ICR Common-mode input voltage range 1V DD +0.2V T AOperating free-air temperature I-suffix -40125°C V IL 0.4Shutdown on/off voltage level (1)VV IH2(1)Relative to GND.4元器件交易网ELECTRICAL CHARACTERISTICSTLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625 SLOS251D–DECEMBER2000–REVISED JANUARY2005at specified free-air temperature,VDD=2.7V,5V(unless otherwise noted)PARAMETER TEST CONDITIONS T A(1)MIN TYP MAX UNITDC PERFORMANCE25°C2503500 V IO Input offset voltageµVV IC=V DD/2,V O=V DD/2,Full range4500R S=50ΩTemperature coefficient ofαVIO25°C3µV/°C input offset voltage25°C7798V DD=2.7VFull range63V IC=1to V DD,CMRR Common-mode rejection ratio dBR S=50Ω25°C7899V DD=5VFull range7525°C90100V DD=2.7V,R L=2kΩ,V O(PP)=1.7V Full range82Large-signal differential voltageA VD dBamplification25°C95100V DD=5V,R L=2kΩ,V O(PP)=4V Full range90INPUT CHARACTERISTICS25°C250I IO Input offset currentFull Range100V IC=V DD/2,V O=V DD/2,pAR S=50Ω25°C250I IB Input bias currentFull Range200r i(d)Differential input resistance25°C100GΩCommon-mode inputC i(c)f=1kHz25°C8pFcapacitanceOUTPUT CHARACTERISTICS25°C 2.6 2.67V DD=2.7VFull range 2.55V IC=V DD/2,I OH=-1mA25°C 4.95 4.98V DD=5VFull range 4.9V OH High-level output voltage V25°C 2.3 2.43V DD=2.7VFull range 2.2V IC=V DD/2,I OH=-10mA25°C 4.7 4.8V DD=5VFull range 4.625°C0.030.1V DD=2.7VFull range0.15V IC=V DD/2,I OL=1mA25°C0.0250.05V DD=5VFull range0.1 V OL Low-level output voltage V25°C0.260.4V DD=2.7VFull range0.45V IC=V DD/2,I OL=10mA25°C0.20.25V DD=5VFull range0.35Sourcing14V DD=2.7V,V O=0.5V from rail Sinking19I O Output current25°C mASourcing28V DD=5V,V O=0.5V from rail Sinking28V DD=2.7V50SourcingV DD=5V95I OS Short-circuit output current25°C mAV DD=2.7V50SinkingV DD=5V95(1)Full range is-40°C to125°C for the I-suffix.5元器件交易网TLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER 2000–REVISED JANUARY 2005ELECTRICAL CHARACTERISTICS (continued)at specified free-air temperature,V DD =2.7V,5V (unless otherwise noted)PARAMETERTEST CONDITIONST A (1)MINTYPMAXUNITPOWER SUPPLY 25°C 8001000I DDSupply current (per channel)V O =V DD /2,SHDN =V DDµAFull range 130025°C8098V DD =2.7V to 3.3V,V IC =V DD /2Full range 75Supply voltage rejection ratio PSRRNo loaddB(∆V DD /∆V IO )25°C 7590V DD =2.7V to 5V,V IC =V DD /2Full range 70DYNAMIC PERFORMANCE UGBWUnity gain bandwidthR L =2k Ω,C L =10pF25°C 11MHz25°C 3.5 4.5V DD =2.7V,V O(PP)=1.7V Full range 2.7SR+Positive slew rate at unity gainR L =2k Ω,C L =50pFV/µs 25°C 5.47V DD =5V,V O(PP)=3.5V Full range 3.425°C 2.75V DD =2.7V,V O(PP)=1.7V Full range 2.3SR-Negative slew rate at unity gain R L =2k Ω,C L =50pFV/µs25°C 4.56V DD =5V,V O(PP)=3.5V Full range 3.2φmPhase margin 63°R L =2k Ω,C L =10pF25°CGain margin8dBNOISE/DISTORTION PERFORMANCE A V =10.002%Total harmonic distortion plus V O(PP)=V DD /2,THD +NA V =100.019%noiseR L =2k Ω,f =10kHz A V =1000.095%25°Cf =1kHz 53V n Equivalent input noise voltage nV/√Hz f =10kHz 27I nEquivalent input noise currentf =1kHz0.9fA/√Hz SHUTDOWN CHARACTERISTICS Supply current,per channel in25°C411I DD(SHDN)shutdown mode (TLV2620,SHDN =0.4VµA Full range13TLV2623,TLV2625)V DD =2.7V 4.5t (on)Amplifier turnon time (2)R L =2k Ωµs V DD =5V25°C 1.5t (off)Amplifier turnoff time (2)R L =2k Ω200ns(2)Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply current has reached half its final value.6元器件交易网TYPICAL CHARACTERISTICSTABLE OF GRAPHSf − Frequency − HzC M R R − C o m m o n -M o d e R e j e c t i o n R a t i o − d B 101k 1M10k 100k100−100−500501001502002503003504004505000.00.30.60.9 1.2 1.5 1.8 2.1 2.4 2.7I O V I n p u t O f f s e t V o l t a g e −−VµV ICR − Common-Mode Input Voltage − V−100−50501001502002503003504004505000.00.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0I O V I n p u t O f f s e t V o l t a g e −−VµV ICR − Common-Mode Input Voltage − VTLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER 2000–REVISED JANUARY 2005FIGUREV IO Input offset voltagevs Common-mode input voltage 1,2CMRR Common-mode rejection ratio vs Frequency3V OH High-level output voltage vs High-level output current 4,6V OL Low-level output voltage vs Low-level output current 5,7I DD Supply current vs Supply voltage 8I DD Supply currentvs Free-air temperature 9PSRR Power supply rejection ratiovs Frequency 10A VDDifferential voltage amplification &phase vs Frequency11Gain-bandwidth productvs Free-air temperature 12vs Supply voltage 13SR Slew rate vs Free-air temperature 14,15φm Phase marginvs Load capacitance 16V nEquivalent input noise voltagevs Frequency17Voltage-follower large-signal pulse response 18Voltage-follower small-signal pulse response 19Crosstalkvs Frequency20I DD(SHDN)Shutdown supply current vs Free-air temperature 21I DD(SHDN)Shutdown supply currentvs Supply voltage 22I DD(SHDN)Shutdown supply current/output voltagevs Time23INPUT OFFSET VOLTAGEINPUT OFFSET VOLTAGECOMMON-MODE REJECTION RATIOvsvsvsCOMMON-MODE INPUT VOLTAGECOMMON-MODE INPUT VOLTAGEFREQUENCYFigure 1.Figure 2.Figure 3.7元器件交易网I OL − Low-Level Output Current − mAO L V − L o w -L e v e l O u t p u t V o l t a g e − V51015202530354045V O H − H i g h -L e v e l O u t p u t V o l t a g e − VI OH − High-Level Output Current − mA0102030405060708090100V O H − H i g h -L e v e l O u t p u t V o l t a g e − VI OH − High-Level Output Current − mAI OL − Low-Level Output Current − mAO L V − L o w -L e v e l O u t p u t V o l t a g e −V1002003004005006007008009001000−40−25−105203550658095110125T A − Free-Air Temperature − °CD D I S u p p l y C u r r e n t − −A /c hµDD D D I S u p p l y C u r r e n t − −A /c hµ−100102030405060708090100110120 f − Frequency − HzP h a s e M a r g i n − °− D i f f e r e n t i a l V o l t a g e A m p l i f i c a t i o n − d BA V D 0102030405060708090100 f − Frequency − Hz101k 10M10k 100k 100− P o w e r S u p p l y R e j e c t i o n R a t i o − d BP S R R 1M123456789101112−40−25−105203550658095110125T A − Free-Air Temperature − °CG a i n -B a n d w i d t h P r o d u c t − M H zTLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER 2000–REVISED JANUARY 2005HIGH-LEVEL OUTPUT VOLTAGELOW-LEVEL OUTPUT VOLTAGEHIGH-LEVEL OUTPUT VOLTAGEvsvsvsHIGH-LEVEL OUTPUT CURRENTLOW-LEVEL OUTPUT CURRENTHIGH-LEVEL OUTPUT CURRENTFigure 4.Figure 5.Figure 6.LOW-LEVEL OUTPUT VOLTAGESUPPLY CURRENTSUPPLY CURRENTvsvsvsLOW-LEVEL OUTPUT CURRENTSUPPLY VOLTAGEFREE-AIR TEMPERATUREFigure 7.Figure 8.Figure 9.DIFFERENTIAL VOLTAGE POWER SUPPLY REJECTION RATIOAMPLIFICATION AND PHASEGAIN-BANDWIDTH PRODUCTvsvsvsFREQUENCYFREQUENCYFREE-AIR TEMPERATUREFigure 10.Figure 11.Figure 12.8元器件交易网123456789101112131415−40−25−105203550658095110125T A − Free-Air Temperature − °CS R − S l e w R a t e − V /µs123456789101112131415−40−25−105203550658095110125T A − Free-Air Temperature − °CS R − S l e w R a t e − V /µs1234567891011122.73.03.33.63.94.24.54.85.15.45.76.0V DD − Supply Voltage − VS R − S l e w R a t e − V /µs0510152025303540455055606570C L − Load Capacitance − pF10300100φm − P h a s e M a r g i n − °050100150200250300350400450500 f − Frequency − Hz101k 100k10k100n V /H z− E q u i v a l e n t I n p u t N o i s e V o l t a g e −V n− C o m m o n -M o d e I n p u t V o l t a g e − VV I Ct − Time − µs− C o m m o n -M o d e I n p u t V o l t a g e − VV I C TLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER 2000–REVISED JANUARY 2005SLEW RATESLEW RATESLEW RATEvsvsvsSUPPLY VOLTAGEFREE-AIR TEMPERATUREFREE-AIR TEMPERATUREFigure 13.Figure 14.Figure 15.EQUIVALENT INPUT NOISEPHASE MARGINVOLTAGEvsvsLOAD CAPACITANCEFREQUENCYFigure 16.Figure 17.VOLTAGE-FOLLOWER LARGE-SIGNALVOLTAGE-FOLLOWER SMALL-SIGNALPULSE RESPONSEPULSE RESPONSEFigure 18.Figure 19.9元器件交易网−140−120−100−80−60−40−200 f − Frequency − Hz101k 100k10k100C r o s s t a l k − d B0.00.51.01.52.02.53.03.54.0−40−25−105203550658095110125T A − Free-Air Temperature − °CD D (S D )I S h u t d o w n S u p p l y C u r r e n t −−A /c hµDDD D (S D )I S h u t d o w n S u p p l y C u r r e n t −−A /c hµS D − S h u t d o w n P u l s e − Vt − Time − µs− O u t p u t V o l t a g e − m VV O D D (S D )I S h u t d o w n S u p p l y C u r r e n t −−A µTLV2620,TLV2621TLV2622,TLV2623TLV2624,TLV2625SLOS251D–DECEMBER 2000–REVISED JANUARY 2005CROSSTALKSHUTDOWN SUPPLY CURRENTSHUTDOWN SUPPLY CURRENTvsvsvsFREQUENCYFREE-AIR TEMPERATURESUPPLY VOLTAGEFigure 20.Figure 21.Figure 22.SHUTDOWN SUPPLY CURRENT/OUTPUT VOLTAGEvs Figure 23.10元器件交易网PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2620ID ACTIVE SOIC D875Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2620IDBVR ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2620IDBVT ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2620IDR ACTIVE SOIC D82500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2620IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCTLV2621ID ACTIVE SOIC D875Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2621IDBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2621IDBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2621IDR ACTIVE SOIC D82500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2621IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCTLV2622ID ACTIVE SOIC D875Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2622IDGK ACTIVE MSOP DGK880None CU NIPDAU Level-1-220C-UNLIM TLV2622IDGKR ACTIVE MSOP DGK82500None CU NIPDAU Level-1-220C-UNLIMTLV2622IDR ACTIVE SOIC D82500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2622IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCTLV2623ID ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPD Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2623IDGS ACTIVE MSOP DGS1080None CU SNPB Level-1-220C-UNLIM TLV2623IDGSR ACTIVE MSOP DGS102500None CU SNPB Level-1-220C-UNLIMTLV2623IDR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPD Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2623IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCTLV2624ID ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2624IDR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2624IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPD Level-NC-NC-NC TLV2624IPW ACTIVE TSSOP PW1490None CU NIPDAU Level-1-220C-UNLIM TLV2624IPWR ACTIVE TSSOP PW142000None CU NIPDAU Level-1-220C-UNLIM TLV2624IPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2625ID ACTIVE SOIC D1640Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2625IDR ACTIVE SOIC D162500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-220C-UNLIMTLV2625IN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC TLV2625IPW ACTIVE TSSOP PW1690None CU NIPDAU Level-1-220C-UNLIM TLV2625IPWR ACTIVE TSSOP PW162000None CU NIPDAU Level-1-220C-UNLIM (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
CPU226详细参数
CPU 226 CN 订货数据CPU 226 CN24V DC电源24V DC输入24V DC输出6ES7 216-2AD23-0XB8100~230V AC电源24V DC输入继电器输出6ES7 216-2BD23-0XB8返回TOP CPU 226 CN 技术数据物理特性尺寸(W X H X D) 重量功耗196 x 80 x 62 mm550 g11 W196 x 80 x 62 mm660 g17 W程序存储器在线程序编辑时非在线程序编辑时数据存储器装备(超级电容) (可选电池) 16384 bytes24576 bytes10240 bytes100小时/典型值(40°C时最少70小时)200天/典型值16384 bytes24576 bytes10240 bytes100小时/典型值(40°C时最少70小时)200天/典型值本机数字量输入本机数字量输出本机模拟量输入本机模拟量输出数字I/O映象区模拟I/O映象区允许最大的扩展I/O模块允许最大的智能模块脉冲捕捉输入高速计数器总数单相计数器两相计数器24 输入16 输出无无256 (128输入/128输出)64(32输入/32输出)7个模块7个模块246个6,每个30KHz4,每个20KHz24 输入16 输出无无256 (128输入/128输出)64(32输入/32输出)7个模块7个模块246个6,每个30KHz4,每个20KHz脉冲输出2个20KHz(仅限于DC输出) 2个20KHz(仅限于DC输出)定时器总数1ms10ms100ms计数器总数内部存储器位掉电保持时间中断边沿中断模拟电位器布尔量运算执行时间时钟卡件选项256个4个16个236个256(由超级电容或电池备份)256(由超级电容或电池备份)112(存储在EEPROM)2个1ms分辨率4个上升沿和/或4个下降沿2个8位分辨率0.22μs内置存储卡和电池卡256个4个16个236个256(由超级电容或电池备份)256(由超级电容或电池备份)112(存储在EEPROM)2个1ms分辨率4个上升沿和/或4个下降沿2个8位分辨率0.22μs内置存储卡和电池卡接口PPI/T波特率自由口波特率每段最大电缆长度最大站点数最大主站数点到点(PPI主站模式) MPI连接2个RS-485接口9.6,19.2和187.5kbaud1.2kbaud 至115.2kbaud使用隔离的中继器:187.5kbaud可达1000米,38.4kbaud可达1200米未使用隔离中继器:50米每段32个站,每个网络126个站32是(NETR / NETW)共4个,2个保留(1个给PG,1个给OP)2个RS-485接口9.6,19.2和187.5kbaud1.2kbaud 至115.2kbaud使用隔离的中继器:187.5kbaud可达1000米,38.4kbaud可达1200米未使用隔离中继器:50米每段32个站,每个网络126个站32是(NETR/ NETW)共4个,2个保留(1个给PG,1个给OP)输入电源输入电压输入电流冲击电流20.4至28.8V DC150mA (仅CPU,24V DC)1050mA (最大负载,24V DC)12A,28.8V DC时85至264 V AC(47至63 Hz)80/40mA(仅CPU,120/240V AC)320/160mA(最大负载,120/240V AC)20A,264V AC时隔离(现场与逻辑) 保持时间(掉电)保险(不可替换) 不隔离10ms,24V DC时3A,250V时慢速熔断1500V AC20/80ms,120/240V AC时2A,250V时慢速熔断传感器电压电流限定纹波噪声隔离(传感器与逻辑) L+减5V1.5A峰值,终端限定非破坏性来自输入电源非隔离20.4至28.8 VDC1.5A峰值,终端限定非破坏性小于1 V峰分值非隔离本机集成数字量输入点数输入类型额定电压最大持续允许电压浪涌电压逻辑1信号(最小)逻辑0信号(最大)输入延迟连接2线接近开关传感器(Bero)允许漏电流最大隔离(现场与逻辑)光电隔离隔离组高速输入速率高速计数器逻辑1=15 – 30V DC高速计数器逻辑1=15 – 26V DC同时接通的输入电缆长度最大屏蔽非屏蔽24输入漏型/源型(IEC 类型1/漏型)24V DC,4mA典型值时30V DC35V DC,0.5秒15V DC,2.5mA5V DC,1mA可选(0.2至12.8ms)1mA是500V AC,1分钟见接线图20KHz(单相), 10KHz(两相)30KHz(单相), 20KHz(两相)500米(标准输入)50米(高速计数器输入)300米(标准输入)24输入漏型/源型(IEC 类型1/漏型)24V DC,4mA典型值时30V DC35V DC,0.5秒15V DC,2.5mA5V DC,1mA可选(0.2至12.8ms)1mA是500V AC,1分钟见接线图20KHz(单相), 10KHz(两相)30KHz(单相), 20KHz(两相)500米(标准输入)50米(高速计数器输入)300米(标准输入)本机集成数字量输出点数输出类型额定电压电压范围16输出固态- MOSFET(源型)24 VDC20.4至28.8V DC16输出干触点24V DC或250V AC5至30V DC或5至浪涌电流(最大)逻辑1(最小)逻辑0(最大)每点额定电流(最大) 每个公共端的额定电流(最大)漏电流(最大)灯负载(最大)感性嵌位电压接通电阻(接点)隔离光电隔离(现场到隔离) 逻辑到接点电阻(逻辑到接点)隔离组8A,100ms20V DC,最大电流0.1V DC,10KΩ 负载0.75A6 A10μA5 WL+ 减48VDC,1W功耗0.3 Ω典型值(0.6Ω最大值)500 VAC,1分钟--见接线图250V AC5A,4s (10%工作率时)--2.0A10A-30W DC;200 W AC-0.2Ω(新的时候最大值)-1500V AC,1分钟100 MΩ见接线图延时(最大)断开到接通接通到断开切换脉冲频率(最大) 机械寿命周期触点寿命同时接通的输出两个输出并联电缆长度(最大) 屏蔽非屏蔽2μs(Q0.0, Q0.1),15μs(其它)10μs(Q0.0, Q0.1),130μs(其它)-20KHz(Q0.0和Q0.1)--55°C时,所有的输出(水平安装)45°C时,所有的输出(垂直安装)是,仅输出同组时500米150米--10ms1Hz10,000,000(无负载)100,000(额定负载)55°C时,所有的输出(水平)45°C时,所有的输出(垂直)否500米150米返回TOP CPU 226 CN DC/DC/DC 端子连接图CPU 226 CN 尺寸图返回TOP本页内容最新更新时间: 2007-12-28© 西门子(中国)有限公司工业业务领域工业自动化与驱动技术集团2010隐私政策| 法律条款最新更新时间:2011-7-。
爱立信PDG24P0100E2CN电源保护型型号2电路断路器说明书
Eaton PDG24P0100E2CNEaton Power Defense molded case circuit breaker, Globally Rated, Frame 2, Four-pole (100% N), 100A, 100kA/480V, PXR20 LSI w/ CAM Link and Relays, No TerminalsGeneral specificationsEaton Power Defense molded case circuit breakerPDG24P0100E2CN 78667944797088.9 mm 152.4 mm 139.5 mm 2.46 kg Eaton Selling Policy 25-000, one (1) year from the date of installation of theProduct or eighteen (18) months from thedate of shipment of the Product,whichever occurs first.RoHS Compliant CCC MarkedIEC 60947-2Product NameCatalog Number UPCProduct Length/Depth Product Height Product Width Product Weight WarrantyCompliancesCertifications100 AComplete breaker 2Four-pole (100% N)PD2 Global Class A PXR 20 LSICAM Link600 Vac600 V100% neutral protectionNo Terminals100 kAIC at 480 Vac35/25 kAIC @600V (UL/CSA)200 kAIC Icu/ 150 kAIC Ics/ 440 kAIC Icm @240V (IEC) 200 kAIC @240V (UL)10 kAIC Icu/ 5 kAIC Ics/ 21 kAIC Icm @690V (IEC)35/25 kAIC Icu/ 18/13 kAIC Ics @525V South Africa (IEC) 100 kAIC @480V (UL)22 kAIC Icu @125 Vdc85 kAIC Icu/ 40 kAIC Ics/ 187 kAIC Icm @480V Brazil (IEC) 100 kAIC Icu/ 65 kAIC Ics/ 220 kAIC Icm @440V (IEC)100 kAIC Icu/ 70 kAIC Ics/ 220 kAIC Icm @380-415V (IEC) 22 kAIC Icu @250 Vdc25 kAIC @600V (UL/CSA)Eaton Power Defense MCCB PDG24P0100E2CN 3D drawingConsulting application guide - molded case circuit breakersPower Xpert Protection Manager x32Power Xpert Protection Manager x64Power Defense technical selling bookletPower Defense molded case circuit breaker selection posterPower Defense brochurePower Defense molded case circuit breakers - Frame 2 product aid Power Xpert Release trip units for Power Defense molded case circuitAmperage RatingCircuit breaker frame type FrameNumber of poles Circuit breaker type ClassTrip Type CommunicationVoltage ratingVoltage rating - maxProtectionTerminalsInterrupt rating Interrupt rating range 3D CAD drawing package Application notesBrochuresCatalogs100 A breakersMolded case circuit breakers catalogPDG4 CB reportPDG4 CCC certificationEU Declaration of Conformity - Power Defense molded case circuit breakersPDG2 CB reportPower Defense Frame 2 screw terminal_end cap kit, 225A, 3 pole instructions - IL012258EN H01Power Defense Frame 2 clamp terminal (steel), 20A, 4 pole instructions - IL012246EN H04Power Defense Frame 2 box terminal (aluminum), 225A, 4 pole instructions - IL012235EN H04Power Defense Frame 2 tunnel terminal (aluminum), 50A, 4 pole instructions - IL012236EN H04Power Defense Frame 2 locking devices and handle block instructions - IL012149ENPower Defense Frame 2 shunt trip UVR instructions - IL012130EN Power Defense Frame 2 box terminal (steel), 100A, 4 pole instructions - IL012234EN H04Power Defense Frame 1-2-3-4 IP door barrier assembly instructions -IL012278ENPower Defense Frame 2 tunnel terminal (aluminum), 100A, 4 pole instructions - IL012237EN H04Power Defense Frame 2/3/4/5/6 voltage neutral sensor module wiring instructions – IL012316ENPower Defense Frame 2 multi wire connector kit -PDG2X3(2)(4)TA2256W instructions - IL012242EN H01Power Defense Frame 2 PDG2 and PDC(E)9 breaker instructions -IL012106ENPower Defense Frame 2 Bell Alarm Switch Instructions (IL012154EN).pdf Power Defense Frame 2 multi wire connector kit -PDG2X3(2)(4)TA2253W instructions - IL012243EN H01Power Defense Frame 2 global terminal shield, 4 pole - IL012330EN Power Defense Frame 2 terminal kit - PDG2X3(2)(4)TA150RF instructions - IL012244EN H01Power Defense Frame 2 tunnel terminal (aluminum), 150A, 4 pole instructions - IL012238EN H04Power Defense Frame 1 IEC and Frame 2 Rotary Mechanism with NFPA Handle Attachment Instructions (IL012260EN).pdfTrip ratingCertification reportsInstallation instructionsPower Defense Frame 2 terminal kit - PDG2X3(2)(4)TA225RF instructions - IL012245EN H01Power Defense Frame 2 tunnel terminal kits - PDG2X1TA225K instructions- IL012239EN H01Installation videosPower Defense Frame 2 withTMTU, Shunt Trip_UVR Animated Instructions.rhPower Defense Frame 2 Bell Alarm with PXR Animated Instructions.pdf.rh Power Defense Frame 2 TMTU Aux, Alarm, ST and UVR Animated Instructions.rhMultimediaPower Defense Frame 2 Aux, Alarm, Shunt Trip, and UVR How-To Video Power Defense Frame 3 Variable Depth Rotary Handle Mechanism Installation How-To VideoPower Defense Frame 2 Direct Rotary Handle Mechanism Installation How-To VideoPower Defense Frame 2 Variable Depth Rotary Handle Mechanism Installation How-To VideoPower Defense molded case circuit breakersPower Defense BreakersEaton Power Defense for superior arc flash safetyPower Defense Frame 6 Trip Unit How-To VideoPower Defense Frame 5 Trip Unit How-To VideoSpecifications and datasheetsEaton Specification Sheet - PDG24P0100E2CNTime/current curvesPower Defense time current curve Frame 2 - PD2Warranty guidesSelling Policy 25-000 - Distribution and Control Products and ServicesWhite papersIntelligent circuit protection yields space savingsMolded case and low-voltage power circuit breaker healthMaking a better machineIntelligent power starts with accurate, actionable dataSingle and double break MCCB performance revisitedSafer by design: arc energy reduction techniquesMolded case and low-voltage breaker healthEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia。
TLV1562IDW;TLV1562CPW;TLV1562IPW;TLV1562CPWG4;TLV1562IPWG4;中文规格书,Datasheet资料
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
D D D D D D D D D D D D D D D D
Built-In Internal/System Mid-Scale Error Calibration Built-In Mux With 2 Differential or 4 Single-Ended Input Channels Low Input Capacitance (10 pF Max Fixed, 1 pF Max Switching) DSP/µ P-Compatible Parallel Interface
TLV1562 2.7 V TO 5.5 V, HIGH-SPEED LOW-POWER RECONFIGURABLE ANALOG-TO-DIGITAL CONVERTER WITH 4-INPUT, DUAL S/H, PARALLEL INTERFACE, AND POWER DOWN
SLAS162 – SEPTEMBER 1998
applications
Portable Digital Radios Personal Communication Assistants Cellular Pager Scanner Digitizers Process Controls Motor Control Remote Sensing Automotive Servo Controls Cameras
TLV2774CPWG4资料
D D D D D
2 pA Input Bias Current Characterized From TA = −55°C to 125°C Available in MSOP and SOT-23 Packages Micropower Shutdown Mode . . . IDD < 1 µA Available in Q-Temp Automotive High Reliability Automotive Applications Configuration Control / Print Support Qualification to Automotive Standards
TLV2774 and TLV2775 AVAILABLE OPTIONS TA 0°C to 70°C VIOmax AT 25°C (mV) 2.7 2.7 −40°C to 125°C 2.1 PACKAGED DEVICES SMALL OUTLINE (D) TLV2774CD TLV2775CD TLV2774ID TLV2775ID TLV2774AID TLV2775AID PLASTIC DIP (N) — TLV2775CN — TLV2775IN — TLV2775AIN PLASTIC DIP (P) TLV2774CP — TLV2774IP — TLV2774AIP — TSSOP (PW) TLV2774CPW TLV2775CPW TLV2774IPW TLV2775IPW TLV2774AIPW TLV2775AIPW
description
The TLV277x CMOS operational amplifier family combines high slew rate and bandwidth, rail-to-rail output swing, high output drive, and excellent dc precision. The device provides 10.5 V/µs of slew rate and 5.1 MHz of bandwidth while only consuming 1 mA of supply current per channel. This ac performance is much higher than current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive make these devices a good choice for driving the analog input or reference of analog-to-digital converters. These devices also have low distortion while driving a 600-Ω load for use in telecom systems. These amplifiers have a 360-µV input offset voltage, a 17 nV/√Hz input noise voltage, and a 2-pA input bias current for measurement, medical, and industrial applications. The TLV277x family is also specified across an extended temperature range (−40°C to 125°C), making it useful for automotive systems, and the military temperature range (−55°C to 125°C), for military systems. These devices operate from a 2.5-V to 5.5-V single supply voltage and are characterized at 2.7 V and 5 V. The single-supply operation and low power consumption make these devices a good solution for portable applications. The following table lists the packages availa0 † All specifications measured at 5 V.
12864资料
码解码芯片PT2262/PT2272芯片原理简介:PT2262/2272是台湾普城公司生产的一种CMOS工艺制造的低功耗低价位通用编解码电路,PT2262/2272最多可有12位(A0-A11)三态地址端管脚(悬空,接高电平,接低电平),任意组合可提供531441地址码,PT2262最多可有6位(D0-D5)数据端管脚,设定的地址码和数据码从17脚串行输出,可用于无线遥控发射电路。
编码芯片PT2262发出的编码信号由:地址码、数据码、同步码组成一个完整的码字,解码芯片PT2272接收到信号后,其地址码经过两次比较核对后,VT脚才输出高电平,与此同时相应的数据脚也输出高电平,如果发送端一直按住按键,编码芯片也会连续发射。
当发射机没有按键按下时,PT2262不接通电源,其17脚为低电平,所以315MHz的高频发射电路不工作,当有按键按下时,PT2262得电工作,其第17脚输出经调制的串行数据信号,当17脚为高电平期间315MHz的高频发射电路起振并发射等幅高频信号,当17脚为低平期间315MHz的高频发射电路停止振荡,所以高频发射电路完全收控于PT2262的17脚输出的数字信号,从而对高频电路完成幅度键控(ASK调制)相当于调制度为100%的调幅。
PT2262/2272特点:CMOS工艺制造,低功耗,外部元器件少,RC 振荡电阻,工作电压范围宽:2.6~15v ,数据最多可达6位,地址码最多可达531441种。
应用范围:车辆防盗系统、家庭防盗系统、遥控玩具、其他电器遥控。
在具体的应用中,外接振荡电阻可根据需要进行适当的调节,阻值越大振荡频率越慢,编码的宽度越大,发码一帧的时间越长。
网站上大部分产品都是用2262/1.2M=2272/200K组合的,少量产品用2262/4.7M =2272/820K。
地址码和数据码都用宽度不同的脉冲来表示,两个窄脉冲表示“0”;两个宽脉冲表示“1”;一个窄脉冲和一个宽脉冲表示“F”也就是地址码的“悬空”。
LMV324IPWRG4中文资料
PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)LMV321IDBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV321IDBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV321IDBVTE4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV321IDCKR ACTIVE SC70DCK 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV321IDCKRG4ACTIVE SC70DCK 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV321IDCKT ACTIVE SC70DCK 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV321IDCKTE4ACTIVE SC70DCK 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324ID ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324IDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324IPWR ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324IPWRG4ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324QD ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324QDR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324QPW ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324QPWE4ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324QPWR ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324SID ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324SIDE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324SIDR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324SIDRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324SIPWR ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV324SIPWRE4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV358ID ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV358IDDUR ACTIVE VSSOP DDU 83000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LMV358IDDURE4ACTIVEVSSOPDDU83000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM6-Dec-2006Orderable Device Status(1)PackageType PackageDrawing Pins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)LMV358IDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IDGKR ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IPWE4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IPWRE4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358IPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QDDUR ACTIVE VSSOP DDU83000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QDDURE4ACTIVE VSSOP DDU83000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QDGKR ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QPWE4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLMV358QPWRE4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows:6-Dec-2006ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Dec-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and todiscontinue any product or service without notice. Customers should obtain the latest relevant informationbefore placing orders and should verify that such information is current and complete. All products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extentTI deems necessary to support this warranty. Except where mandated by government requirements, testingof all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsiblefor their products and applications using TI components. To minimize the risks associated with customerproducts and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patentright, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,or process in which TI products or services are used. Information published by TI regarding third-partyproducts or services does not constitute a license from TI to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents orother intellectual property of the third party, or a license from TI under the patents or other intellectualproperty of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices.Reproduction of this information with alteration is an unfair and deceptive business practice. TI is notresponsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI forthat product or service voids all express and any implied warranties for the associated TI product or serviceand is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotive/broadbandBroadbandDSP DigitalControl /digitalcontrol Interface Military /military Logic Power Mgmt Optical Networking /opticalnetworkSecurity /security Microcontrollers Low Power Wireless /lpw Telephony /telephonyVideo & Imaging /video/wirelessWirelessMailing Address: Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated。
ITAV产品参数归档
I T A V产品参数归档 Ting Bao was revised on January 6, 20021目录(产品实际情况以ITAV官网为准一、中央控制系统可编程控制主机ITPB系列控制主机产品描述:作为控制系统的核心运算主机,ITAV ITPB系列可编程中央控制主机配备了高性能的32位内嵌式处理器,采用大容量的存储FLASH(8M可扩充到64M),多达150多种逻辑指令使得系统能够更快更稳定的处理各种控制指令。
内部提供多种可编程控制接口,RS-485、RS-422、RS-232、IR、I/O、RELAY等多种控制方式来满足多种用途的需求。
主机更采用开放式的可编程控制平台,人性化的中文操作界面,交互式的控制结构;同时主机具有自学习红外文件功能,可以建立直接的红外代码库文件,方便工程应用主机自带8路可编程双向反馈按键,可以通过按键直接对主机进行操作,对主机进行双向编程控制。
产品特征:● 开放式的可编程控制平台,人性化的操作界面● 与ITAV数字会议系统系列产品进行无缝连接,组成完美的智能会议系统全面解决方案● 内嵌式红外遥控学习功能,无需配置专业学习器,简便可靠● 8路红外发射口可实现对VCR、DVD、CD、MD 放音机和投影机等的遥控● 8路数字I/0控制口和8路弱继电器控制口,用以控制环境装置,诸如投影幕的上/下,窗帘的开/闭,投影机的高低,灯光开/关等● 8路RS-232/422/485 控制端口,可控制视频矩阵或等离子显示等设备● 前面板LCD、LED 显示功能及实时时钟功能● 提供中/英文系统设置操作及编程软件● 自定义情景存贮及场景调用功能● 电脑连接口RS-232,用于连接电脑对控制主机进行设置、监控及程序上传● 1路RJ-45 接口,作为以太网接口,连接电脑控制软件或有线控制面板,用于实现远程控制。
● 配合无线双向触摸屏及接收器,可实现无线遥控所有功能● 结构紧凑,可安装在19 英寸标准机柜处理器32位内嵌式处理器主频210MHZ内部存储器FLASH 8MB(可扩充至64MB)总线支持IT-NET:ITPB II/ITPB II PRO/ITPB II PRO-EE-BUS:ITPB II PRO-EWiFi支持ITPBIIPRO-E串口数量8路串口双向支持数据模式RS-232;RS-485、RS-232IR红外控制端口8路独立数字I/O输入输出端口8路独立带保护电路支持0-5V数字输入信号弱电继电器端口8路支持0-24VITNET端口3路120W支持256个网络设备扩展端口2路红外学习模块内置USB数据传输口2路双反馈可编程按键8路主机硬件复位内置电源全制式环保电源(110V-240V)适合任何地区外形尺寸485L*236W*89H(MM)重量ITPB II特性:8路可编程双向反馈按键ITPB II PRO特性:8路可编程双向反馈按键30×8 LCD液晶显示面板ITPB II PRO-E(又ITPB AF)特性:8路可编程双向反馈按键30×8 LCD液晶显示面板E-BUS总线支持支持WiFi触屏控制ICPE开放式模块化可编程中控主机产品描述:ITAV ICPE开放式模块化可编程中控主机是一款以多年的市场经验及独特的产品技术为国内外AV控制行业提供的全新的控制应用解决方案。
TLV2264IDG4中文资料
D Low Input Offset Voltage D D D
950 µV Max at TA = 25°C (TLV226xA) Wide Supply Voltage Range 2.7 V to 8 V Macromodel Included Available in Q-Temp Automotive HighRel Automotive Applications Configuration Control / Print Support Qualification to Automotive Standards
TLV226x, TLV226xA Advanced LinCMOS RAILĆTOĆRAIL OPERATIONAL AMPLIFIERS
TLV2262 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C −40°C to 125°C −40°C to 125°C −55°C to 125°C VIOmax AT 25°C 2.5 mV 950 µV 2.5 mV 950 µV 2.5 mV 950 µV 2.5 mV SMALL OUTLINE (D) TLV2262CD TLV2262AID TLV2262ID TLV2262AQD TLV2262QD — — CHIP CARRIER (FK) — — — — — TLV2262AMFK TLV2262MFK CERAMIC DIP (JG) — — — — — TLV2262AMJG TLV2262MJG PLASTIC DIP (P) TLV2262CP TLV2262AIP TLV2262IP — — — — TSSOP (PW) TLV2262CPWLE TLV2262AIPWLE — — — — —
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
4 VDD = 3 V 3.5
ቤተ መጻሕፍቲ ባይዱ
description
The TLV2262 and TLV2264 are dual and quad low voltage operational amplifiers from Texas Instruments. Both devices exhibit rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV226x family offers a compromise between the micropower TLV225x and the ac performance of the TLC227x. It has low supply current for batterypowered applications, while still having adequate ac performance for applications that demand it. This family is fully characterized at 3 V and 5 V and is optimized for low-voltage applications. The noise performance has been dramatically improved over previous generations of CMOS amplifiers. Figure 1 depicts the low level of noise voltage for this CMOS amplifier, which has only 200 µA (typ) of supply current per amplifier.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Advanced LinCMOS is a trademark of Texas Instruments.
D Low Input Offset Voltage D D D
950 µV Max at TA = 25°C (TLV226xA) Wide Supply Voltage Range 2.7 V to 8 V Macromodel Included Available in Q-Temp Automotive HighRel Automotive Applications Configuration Control / Print Support Qualification to Automotive Standards
VOH − High-Level Output Voltage − V
3 2.5 TA = 125°C 2 TA = 25°C 1.5 1 TA = 85°C TA = − 40°C TA = − 55°C
0 The TLV226x, exhibiting high input impedance 0 500 1000 1500 2000 and low noise, are excellent for small-signal | IOH | − High-Level Output Current − µ A conditioning for high-impedance sources, such as Figure 1 piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). For precision applications, the TLV226xA family is available and has a maximum input offset voltage of 950 µV.
TLV226x, TLV226xA Advanced LinCMOS RAILĆTOĆRAIL OPERATIONAL AMPLIFIERS
TLV2262 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C −40°C to 125°C −40°C to 125°C −55°C to 125°C VIOmax AT 25°C 2.5 mV 950 µV 2.5 mV 950 µV 2.5 mV 950 µV 2.5 mV SMALL OUTLINE (D) TLV2262CD TLV2262AID TLV2262ID TLV2262AQD TLV2262QD — — CHIP CARRIER (FK) — — — — — TLV2262AMFK TLV2262MFK CERAMIC DIP (JG) — — — — — TLV2262AMJG TLV2262MJG PLASTIC DIP (P) TLV2262CP TLV2262AIP TLV2262IP — — — — TSSOP (PW) TLV2262CPWLE TLV2262AIPWLE — — — — —
Copyright 2001, Texas Instruments Incorporated
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
元器件交易网
SLOS186B − FEBRUARY 1997 − REVISED MARCH 2001
ą
CERAMIC FLATPACK (U) — — — — — TLV2262AMU TLV2262MU
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). ‡ The PW package is available only left-end taped and reeled. § Chips are tested at 25°C. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA −40°C to 125°C −40°C to 125°C −55°C to 125°C VIOmax AT 25°C 950 µV 2.5 mV 950 µV 2.5 mV 950 µV 2.5 mV SMALL OUTLINE (D) TLV2264AID TLV2264ID TLV2264AQD TLV2264QD — — CHIP CARRIER (FK) — — — — TLV2264AMFK TLV2264MFK CERAMIC DIP (J) — — — — TLV2264AMJ TLV2264MJ PLASTIC DIP (N) TLV2264AIN TLV2264IN — — — — TSSOP (PW) TLV2264AIPWLE — — — — — CERAMIC FLATPACK (W) — — — — TLV2264AMW TLV2264MW
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MILĆPRFĆ38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
元器件交易网
ąą
TLV226x, TLV226xA Advanced LinCMOS RAILĆTOĆRAIL OPERATIONAL AMPLIFIERS
SLOS186B − FEBRUARY 1997 − REVISED MARCH 2001
D D D D D D
Output Swing Includes Both Supply Rails Low Noise . . . 12 nV/√Hz Typ at f = 1 kHz Low Input Bias Current . . . 1 pA Typ Fully Specified for Both Single-Supply and Split-Supply Operation Low Power . . . 500 µA Max Common-Mode Input Voltage Range Includes Negative Rail