74F241SC中文资料
关于74HC244芯片的中文资料
电源电压Vcc 54 4.5 5 5.5 V
74 4.75 5 5.25
输入高电平电ViH 2 V
输入低电平电ViL 54 0.7 V
74 0.8
输出高电平电流IOH 54 -12 mA
74 -15
输出低电平电流IOL 54 12 mA
74 24
求关于74HC244线接收器(3S,两组控制)
简要说明:
244为三态输出的八组缓冲器和总线驱动器,其主要电器特性的典型值如下(不同厂家具体值有差别):
型号 tPLH tphl PD
54LS241/74LS241 12ns 12ns 110mW
引出端符号:
1A1~1A4,2A1~2A4 输入端
/1G, /2G 三态允许端(低电平有效)
1Y1~1Y4,2Y1~2Y4 输出端
逻辑图:
双列直插封装
极限值:
电源电压 …………………………………………. 7V
输入电压 …………………………………………. 5.5V
tPHZ输出由高到高阻态禁止时间 Vcc=5V CL=5pF
RL=90 Ω 18 ns
tPLZ输出由低到高阻态禁止时间 25 ns
静态特性(TA为工作环境温度范围)
参 数 测 试 条 件【1】 LS244 单位
最小 最大
VIK输入嵌位电压 Vcc=最小,Iik=-18mA -1.5 V
输出高阻态时高电平电压 …………………………. 5.5V
工作环境温度
54XXX …………………………………. -55~125℃
74XXX …………………………………. 0~70℃
SN74BCT241DW,SN74BCT241DWE4,SN74BCT241DWG4,SN74BCT241N,SN74BCT241NE4, 规格书,Datasheet 资料
Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)5962-9074301M2A ACTIVE LCCC FK 201TBD Call TI Call TI 5962-9074301MRA ACTIVE CDIP J 201TBD Call TI Call TI 5962-9074301MSA ACTIVE CFP W 201TBD Call TI Call TI SN74BCT241DBLE OBSOLETE SSOP DB 20TBDCall TICall TISN74BCT241DW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241DWE4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241DWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74BCT241NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74BCT241NSR ACTIVE SO NS 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241NSRE4ACTIVE SO NS 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT241NSRG4ACTIVE SO NS 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54BCT241FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54BCT241J ACTIVE CDIP J 201TBD A42N / A for Pkg Type SNJ54BCT241WACTIVECFPW201TBDCall TIN / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.芯天下--/Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54BCT241, SN74BCT241 :•Catalog: SN74BCT241•Military: SN54BCT241NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 2芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74BCT241NSR SONS20330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)SN74BCT241NSR SO NS200367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。
M74HCT241资料
M54HCT240/241/244M74HCT240/241/244Septembe r 1993HCT240:INVERTED -HCT241/244NON INVERTEDOCTAL BUS BUFFER WITH 3STATE OUTPUTS B1R(Plastic Package)ORDER CODES :M54HCTXXXF1R M74HCTXXXM1R M74HCTXXXB1R M74HCTXXXC1RF1R(Ceramic Package)M1R(Micro Package)C1R (Chip Carrier)PIN CONNECTION (top view).HIGH SPEEDt PD =13ns (TYP.)at V CC =5V .LOW POWER DISSIPATIONI CC =4µA (MAX.)at T A =25oC.COMPATIBLE WITH TTL OUTPUTS V IH =2V (MIN.)V IL =0.8V (MAX).OUTPUT DRIVE CAPABILITY 15LSTTL LOADS.SYMMETRICAL OUTPUT IMPEDANCE |I OH |=I OL =6mA (MIN).BALANCED PROPAGATION DELAYS t PLH =t PHL.PIN AND FUNCTION COMPATIBLE WITH 54/74LS240/241/244DESCRIPTIONThe M54/74HCT240,HCT241and HCT244are high speed CMOS OCTAL BUS BUFFERs fabricated in silicon gate C 2MOS technology.They have the same high speed performance of LSTTL combined with true CMOS low power consumption.The designer has a choise of select combination of inverting and non-inverting outputs,symmetrical G (active low output control)input,and complementary G and G inputs.Each control input governs four BUS BUFFERs.This integrated circuit has input and output characteristics that are fully compatible with 54/74LSTTL logic families.M54/74HCT devices are designed to directly interface HSC 2MOS systems with TTL and NMOS components.They are also plug in replacements for LSTTL devices giving a reduction of power consumption.These devices are designed to be used with 3state memory address drivers,etc.All inputs are equipp ed with protection circuits against static discharge and transient excess voltage.HCT244HCT241HCT2401/12CHIP CARRIERINPUT AND OUTPUT EQUIVALENT CIRCUIT PIN DESCRIPTION (HCT240)PIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2,4,6,81A1to 1A4Data Inputs 9,7,5,32Y1to 2Y4Data Outputs 11,13,15,172A1to 2A4Data Inputs 18,16,14,121Y1to 1Y4Data Outputs 192G Output Enabel Input 10GND Ground (0V)20V CCPositive Supply VoltagePIN DESCRIPTION (HCT244)PIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2,4,6,81A1to 1A4Data Inputs 9,7,5,32Y1to 2Y4Data Outputs 11,13,15,172A1to 2A4Data Inputs 18,16,14,121Y1to 1Y4Data Outputs 192G Output Enabel Input 10GND Ground (0V)20V CCPositive Supply VoltagePIN DESCRIPTION (HCT241)PIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2,4,6,81A1to 1A4Data Inputs 9,7,5,32Y1to 2Y4Data Outputs 11,13,15,172A1to 2A4Data Inputs 18,16,14,121Y1to 1Y4Data Outputs 192G Output Enabel Input 10GND Ground (0V)20V CCPositive Supply VoltageHCT244HCT241HCT240M54/M74HCT240/241/2442/12IEC LOGIC SYMBOLSTRUTH TABLEINPUTOUTPUTG G (HCT241)An Yn (HCT240)Yn (HCT241)Yn (HCT244)L H L H L L L HH LHHHLXZZZX:”H”or ”L”Z:High impeda nceCIRCUIT SCHEMATIC (1/8PACKAGE)HCT244HCT241HCT240HCT240HCT241/244M54/M74HCT240/241/2443/12ABSOLUTE MAXIMUM RATINGSSymbol Parameter Value Unit V CC Supply Voltage-0.5to+7V V I DC Input Voltage-0.5to V CC+0.5V V O DC Output Voltage-0.5to V CC+0.5VI IK DC Input Diode Current±20mAI OK DC Output Diode Current±20mAI O DC Output Source Sink Current Per Output Pin±35mAI CC or I GND DC V CC or Ground Current±70mAP D Power Dissipation500(*)mW T stg Storage Temperature-65to+150o C T L Lead Temperature(10sec)300o C Absolute Maximum Ratings are those values beyond whichdamage to the device may occu r.Functiona l ope ration und er these cond ition isnotimplied. (*)500mW:≅65o C derate to300mW by10mW/o C:65o C to85o CRECOMMENDED OPERATING CONDITIONSSymbol Parameter Value Unit V CC Supply Voltage 4.5to5.5V V I Input Voltage0to V CC V V O Output Voltage0to V CC VT op Operating Temperature:M54HC SeriesM74HC Series -55to+125-40to+85o Co Ct r,t f Input Rise and Fall Time(V CC=4.5to5.5V)0to500ns M54/M74HCT240/241/2444/12DC SPECIFICATIONSSymbol ParameterTest Conditions ValueUnit V CC(V)T A=25o C54HC and74HC-40to85o C74HC-55to125o C54HCMin.Typ.Max.Min.Max.Min.Max.V IH High Level InputVoltage 4.5to5.52.0 2.0 2.0VV IL Low Level InputVoltage 4.5to5.50.80.80.8VV OH High LevelOutput Voltage4.5V I=V IHorV ILI O=-20µA 4.4 4.5 4.4 4.4VI O=-6.0mA 4.18 4.31 4.13 4.10V OL Low Level OutputVoltage4.5V I=V IHorV ILI O=20µA0.00.10.10.1VI O=6.0mA0.170.260.330.4I I Input LeakageCurrent 5.5V I=V CC or GND±0.1±1±1µAI CC Quiescent SupplyCurrent5.5V I=V CC or GND44080µA∆I CC Additional worstcase supplycurrent 5.5Per Input pinV I=0.5V or2.4VOther Inputs atV CC or GND2.0 2.93.0mAM54/M74HCT240/241/2445/12AC ELECTRICAL CHARACTERISTICS(C L=50pF,Input t r=t f=6ns)Symbol ParameterTest Conditions ValueUnit V CC(V)C L(pF)T A=25o C54HC and74HC-40to85o C74HC-55to125o C54HCMin.Typ.Max.Min.Max.Min.Max.t TLH t THL Output TransitionTime4.5507121518nst PLH t PHL PropagationDelay Time4.55015222833ns4.515021303845nst PLH t PHL PropagationDelay Time4.55015253138ns4.515021334150nst PZL t PZH Output EnableTime4.550R L=1KΩ17303845ns4.5150R L=1KΩ23384857nst PLZ t PHZ Output DisableTime4.550R L=1KΩ16303845nsC IN Input Capacitance5101010pF C OUT OutputCapacitance10pFC PD(*)Power DissipationCapacitanceHCT240HCT241/2443331pF(*)C PD is defined as the value of the IC’s internal equivalent capac itanc e which is calculated from the operating current con sump tion without load. (Refer to Test Circuit).Average operting current can be obtained by the following equ ation.I CC(opr)=C PD•V CC•f IN+I CC/8(per circuit)TEST CIRCUIT I CC(Opr.)HCT240M54/M74HCT240/241/2446/12M54/M74HCT240/241/244 SWITCHING CHARACTERISTICS TEST WAVEFORM7/12M54/M74HCT240/241/244Plastic DIP20(0.25)MECHANICAL DATAmm inch DIM.MIN.TYP.MAX.MIN.TYP.MAX.a10.2540.010B 1.39 1.650.0550.065b0.450.018b10.250.010D25.4 1.000 E8.50.335e 2.540.100e322.860.900F7.10.280I 3.930.155L 3.30.130Z 1.340.053P001J 8/12M54/M74HCT240/241/244 Ceramic DIP20MECHANICAL DATAmm inchDIM.MIN.TYP.MAX.MIN.TYP.MAX.A250.984B7.80.307D 3.30.130E0.5 1.780.0200.070e322.860.900F 2.29 2.790.0900.110G0.40.550.0160.022I 1.27 1.520.0500.060L0.220.310.0090.012M0.51 1.270.0200.050N14°(min.),15°(max.)P7.98.130.3110.320Q 5.710.225P057H9/12M54/M74HCT240/241/244SO20MECHANICAL DATAmm inch DIM.MIN.TYP.MAX.MIN.TYP.MAX.A 2.650.104a10.100.200.0040.007 a2 2.450.096 b0.350.490.0130.019 b10.230.320.0090.012 C0.500.020c145°(typ.)D12.6013.000.4960.512 E10.0010.650.3930.419e 1.270.050e311.430.450F7.407.600.2910.299 L0.50 1.270.190.050 M0.750.029 S8°(max.)P013L 10/12M54/M74HCT240/241/244PLCC20MECHANICAL DATAmm inchDIM.MIN.TYP.MAX.MIN.TYP.MAX.A9.7810.030.3850.395B8.899.040.3500.356D 4.2 4.570.1650.180d1 2.540.100d20.560.022E7.378.380.2900.330e 1.270.050e3 5.080.200F0.380.015G0.1010.004M 1.270.050M1 1.140.045P027A11/12M54/M74HCT240/241/244Information furnished is believed to be accurate and reliable.However,SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use.No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.Specificationsmentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics.©1994SGS-THOMSON Microelectronics-All Rights ReservedSGS-THOMSON Microelectronics GROUP OF COMPANIESAustralia-Brazil-France-Germany-Hong Kong-Italy-Japan-Korea-Malaysia-Malta-Morocco-The Netherlands-Singapore-Spain-Sweden-Switzerland-Taiwan-Thailand-United Kingdom-U.S.A12/12。
74F241SJ中文资料
© 1999 Fairchild Semiconductor Corporation DS009501April 1988Revised July 199974F240 • 74F241 • 74F244 Octal Buffers/Line Drivers with 3-STATE Outputs74F240 • 74F241 • 74F244Octal Buffers/Line Drivers with 3-STATE OutputsGeneral DescriptionThe 74F240, 74F241 and 74F244 are octal buffers and line drivers designed to be employed as memory and address drivers, clock drivers and bus-oriented transmitters/receiv-ers which provide improved PC and board density.Featuress 3-STATE outputs drive bus lines or buffer memory address registers s Outputs sink 64 mA (48 mA mil)s 12 mA source currents Input clamp diodes limit high-speed termination effectsOrdering Code:Devices also available in T ape and Reel. Specify by appending the suffix letter “X” to the ordering code.Connection Diagrams74F24074F24174F244Order Code Package NumberPackage Description74F240SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F240PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 74F241SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F241SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F241PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 74F244SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F244MSA MSA2020-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74F244PCN20A20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 274F 240 • 74F 241 • 74F 244Logic SymbolsIEEE/IEC 74F240IEEE/IEC 74F241IEEE/IEC 74F244Unit Loading/Fan OutNote 1: Worst-case 74F240 enabled; 74F241, 74F244 disabledTruth Tables74F24074F24174F244H = HIGH Voltage Level L = LOW Voltage Level X = ImmaterialZ = High ImpedancePin Names DescriptionU.L.Input I IH /I IL HIGH/LOW Output I OH /I OL OE 1, OE 23-STATE Output Enable Input (Active LOW) 1.0/1.66720 µA/−1 mA OE 23-STATE Output Enable Input (Active HIGH) 1.0/1.66720 µA/−1 mA I 0–I 7Inputs (74F240) 1.0/1.667 (Note 1)20 µA/−1 mA I 0–I 7Inputs (74F241, 74F244)1.0/2.667 (Note 1)20 µA/−1.6 mA O 0–O 7, O 0–O 7Outputs600/106.6 (80)−12 mA/64 mA (48 mA)OE 1D 1n O 1n OE 2D 2n O 2n H X Z H X Z L H L L H L LLH LLHOE 1D 1n O 1n OE 2D 2n O 2n H X Z L X Z L H H H H H LLLHLLOE 1D 1n O 1n OE 2D 2n O 2n H X Z H X Z L H H L H H LLLLLL74F240 • 74F241 • 74F244Absolute Maximum Ratings (Note 2)Recommended Operating ConditionsNote 2: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.Note 3: Either voltage limit or current limit is sufficient to protect inputs.DC Electrical CharacteristicsStorage Temperature−65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V CC Pin Potential to Ground Pin −0.5V to +7.0V Input Voltage (Note 3)−0.5V to +7.0V Input Current (Note 3)−30 mA to +5.0 mAVoltage Applied to Output in HIGH State (with V CC = 0V)Standard Output −0.5V to V CC 3-STATE Output −0.5V to +5.5V Current Applied to Output in LOW State (Max)twice the rated I OL (mA)ESD Last Passing Voltage (Min)4000V Free Air Ambient Temperature 0°C to +70°C Supply Voltage+4.5V to +5.5VSymbol ParameterMin TypMaxUnits V CCConditionsV IH Input HIGH Voltage 2.0V Recognized as a HIGH Signal V IL Input LOW Voltage 0.8V Recognized as a LOW Signal V CD Input Clamp Diode Voltage −1.2VMin I IN = −18 mA V OHOutput HIGH 10% V CC 2.4VMinI OH = −3 mA Voltage10% V CC 2.0I OH = −15 mA 5% V CC 2.7I OH = −3 mA V OL Output LOW 10% V CC 0.55V Min I OL = 64 mA VoltageI IH Input HIGH 5.0µA Max V IN = 2.7V CurrentI BVI Input HIGH Current 7.0µA Max V IN = 7.0V Breakdown Test I CEX Output HIGH 50µA Max V OUT = V CC Leakage Current V ID Input Leakage 4.75V 0.0I ID = 1.9 µATestAll Other Pins Grounded I OD Output Leakage 3.75µA 0.0V IOD = 150 mVCircuit Current All Other Pins GroundedI IL Input LOW Current −1.0mAMaxV IN = 0.5V (OE 1, OE 2, OE 2, D n 74F240))−1.6V IN = 0.5V (D n (74F241, 74F244))I OZH Output Leakage Current 50µA Max V OUT = 2.7V I OZL Output Leakage Current −50µA Max V OUT = 0.5V I OS Output Short-Circuit Current −100−225mA Max V OUT = 0V I ZZ Bus Drainage Test500µA 0.0V V OUT = 5.25V I CCH Power Supply Current (74F240)1929mA Max V O = HIGH I CCL Power Supply Current (74F240)5075mA Max V O = LOW I CCZ Power Supply Current (74F240)4263mA Max V O = HIGH Z I CCH Power Supply Current 4060mA Max V O = HIGH (74F241, 74F244)I CCL Power Supply Current 6090mA Max V O = LOW (74F241, 74F244)I CCZPower Supply Current 6090mAMaxV O = HIGH Z(74F241, 74F244) 474F 240 • 74F 241 • 74F 244AC Electrical CharacteristicsSymbolParameterT A = +25°CT A = −55°C to +125°CT A = 0°C to +70°CUnitsV CC = +5.0V V CC = 5.0V V CC = 5.0V C L = 50 pFC L = 50 pF C L = 50 pF MinTyp Max Min Max Min Max t PLH Propagation Delay 3.0 5.17.0 3.09.0 3.08.0ns t PHL Data to Output (74F240) 2.0 3.5 4.7 2.0 6.0 2.0 5.7t PZH Output Enable Time (74F240)2.03.54.7 2.0 6.5 2.05.7ns t PZL 4.06.99.0 4.010.5 4.010.0t PHZ Output Disable Time (74F240) 2.0 4.0 5.3 2.0 6.5 2.0 6.3t PLZ 2.0 6.08.0 2.012.5 2.09.5t PLH Propagation Delay2.5 4.0 5.2 2.0 6.5 2.5 6.2ns t PHL Data to Output (74F241, 74F244) 2.5 4.0 5.2 2.07.0 2.5 6.5t PZH Output Enable Time 2.0 4.3 5.7 2.07.0 2.0 6.7ns t PZL (74F241, 74F244) 2.0 5.47.0 2.08.5 2.08.0t PHZ Output Disable Time 2.0 4.5 6.0 2.07.0 2.07.0t PLZ(74F241, 74F244)2.04.56.02.07.52.07.074F240 • 74F241 • 74F244Physical Dimensions inches (millimeters) unless otherwise noted20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 WidePackage Number M20B20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M20D 674F 240 • 74F 241 • 74F 244Physical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm WidePackage Number MSA20774F240 • 74F241 • 74F244 Octal Buffers/Line Drivers with 3-STATE OutputsPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 WidePackage Number N20AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。
74F74中文资料
TL F 946954F 74F74 Dual D-Type Positive Edge-Triggered Flip-FlopDecember1994 54F 74F74Dual D-Type Positive Edge-Triggered Flip-FlopGeneral DescriptionThe’F74is a dual D-type flip-flop with Direct Clear and Setinputs and complementary(Q Q)outputs Information at theinput is transferred to the outputs on the positive edge ofthe clock pulse Clock triggering occurs at a voltage level ofthe clock pulse and is not directly related to the transitiontime of the positive-going pulse After the Clock Pulse inputthreshold voltage has been passed the Data input is lockedout and information present will not be transferred to theoutputs until the next rising edge of the Clock Pulse inputAsynchronous InputsLOW input to S D sets Q to HIGH levelLOW input to C D sets Q to LOW levelClear and Set are independent of clockSimultaneous LOW on C D and S Dmakes both Q and Q HIGHFeaturesY Guaranteed4000V minimum ESD protection Commercial MilitaryPackagePackage DescriptionNumber74F74PC N14A14-Lead(0 300 Wide)Molded Dual-In-Line54F74DM(Note2)J14A14-Lead Ceramic Dual-In-Line74F74SC(Note1)M14A14-Lead(0 150 Wide)Molded Small Outline JEDEC74F74SJ(Note1)M14D14-Lead(0 300 Wide)Molded Small Outline EIAJ54F74FM(Note2)W14B14-Lead Cerpack54F74LM(Note2)E20A20-Lead Ceramic Leadless Chip Carrier Type C Note1 Devices also available in13 reel Use Suffix e SCXNote2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQBLogic SymbolsTL F 9469–3TL F 9469–4IEEE IECTL F 9469–6TRI-STATE is a registered trademark of National Semiconductor CorporationC1995National Semiconductor Corporation RRD-B30M75 Printed in U S AConnection DiagramsPin Assignmentfor DIP SOIC and FlatpakTL F 9469–1Pin Assignmentfor LCCTL F 9469–2 Unit Loading Fan Out54F 74FPin Names Description U L Input IIH I ILHIGH LOW Output I OH I OLD1 D2Data Inputs1 0 1 020m A b0 6mACP1 CP2Clock Pulse Inputs(Active Rising Edge)1 0 1 020m A b0 6mAC D1 C D2Direct Clear Inputs(Active LOW)1 0 3 020m A b1 8mAS D1 S D2Direct Set Inputs(Active LOW)1 0 3 020m A b1 8mAQ1 Q1 Q2 Q2Outputs50 33 3b1mA 20mATruth TableInputs OutputsS D C D CP D Q QL H X X H LH L X X L HL L X X H HH H L h H LH H L l L HH H L X Q0Q0H(h)e HIGH Voltage LevelL(l)e LOW Voltage LevelX e ImmaterialQ0e Previous Q(Q)before LOW-to-HIGH Clock TransitionLower case letters indicate the state of the referenced input or output onesetup time prior to the LOW-to-HIGH clock transitionLogic DiagramTL F 9469–5 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays2Absolute Maximum Ratings(Note1)If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature b65 C to a150 CAmbient Temperature under Bias b55 C to a125 CJunction Temperature under Bias b55 C to a175 C Plastic b55 C to a150 CV CC Pin Potential toGround Pin b0 5V to a7 0V Input Voltage(Note2)b0 5V to a7 0V Input Current(Note2)b30mA to a5 0mA Voltage Applied to Outputin HIGH State(with V CC e0V)Standard Output b0 5V to V CC TRI-STATE Output b0 5V to a5 5V Current Applied to Outputin LOW State(Max)twice the rated I OL(mA) ESD Last Passing Voltage(Min)4000V Note1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not impliedNote2 Either voltage limit or current limit is sufficient to protect inputs Recommended Operating ConditionsFree Air Ambient TemperatureMilitary b55 C to a125 C Commercial0 C to a70 C Supply VoltageMilitary a4 5V to a5 5V Commercial a4 5V to a5 5VDC Electrical CharacteristicsSymbol Parameter54F 74FUnits V CC Conditions Min Typ MaxV IH Input HIGH Voltage2 0V Recognized as a HIGH Signal V IL Input LOW Voltage0 8V Recognized as a LOW Signal V CD Input Clamp Diode Voltage b1 2V Min I IN e b18mAV OH Output HIGH54F10%V CC2 5I OH e b1mA Voltage74F10%V CC2 5V Min I OH e b1mA74F5%V CC2 7I OH e b1mAV OL Output LOW54F10%V CC0 5V Min I OL e20mAVoltage74F10%V CC0 5I OL e20mAI IH Input HIGH54F20 0m A Max V IN e2 7V Current74F5 0I BVI Input HIGH Current54F100m A Max V IN e7 0V Breakdown Test74F7 0I CEX Output HIGH54F250m A Max V OUT e V CC Leakage Current74F50V ID Input Leakage74F4 75V0 0I ID e1 9m ATest All Other Pins GroundedI OD Output Leakage74F3 75m A0 0V IOD e150mVCircuit Current All Other Pins GroundedI IL Input LOW Current b0 6mA Max V IN e0 5V(D CP)b1 8V IN e0 5V(C D S D) I OS Output Short-Circuit Current b60b150mA Max V OUT e0VI CC Power Supply Current10 516 0mA Max3AC Electrical Characteristics74F54F74FT A e a25 CT A V CC e Mil T A V CC e Com Symbol Parameter V CC e a5 0VC L e50pF C L e50pF UnitsC L e50pFMin Typ Max Min Max Min Maxf max Maximum Clock Frequency10012580100MHzt PLH Propagation Delay3 85 36 83 88 53 87 8ns t PHL CP n to Q n or Q n4 46 28 04 410 54 49 2t PLH Propagation Delay3 24 66 13 28 03 27 1ns t PHL C Dn or S Dn to Q n or Q n3 57 09 03 511 53 510 5AC Operating Requirements74F54F74FSymbol ParameterT A e a25 CT A V CC e Mil T A V CC e Com Units V CC e a5 0VMin Max Min Max Min Maxt s(H)Setup Time HIGH or LOW2 03 02 0t s(L)D n to CP n3 04 03 0ns t h(H)Hold Time HIGH or LOW1 02 01 0t h(L)D n to CP n1 02 01 0t w(H)CP n Pulse Width4 04 04 0ns t w(L)HIGH or LOW5 06 05 0t w(L)C Dn or S Dn Pulse Width4 04 04 0nsLOWt rec Recovery Time2 03 02 0nsC Dn or S Dn to CP4Ordering InformationThe device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows74F74S C XTemperature Range Family Special Variations74F e Commercial QB e Military grade device with54F e Military environmental and burn-inprocessingDevice Type X e Devices shipped in13 reelPackage Code Temperature RangeP e Plastic DIP C e Commercial(0 C to a70 C)D e Ceramic DIP M e Military(b55 C to a125 C)F e FlatpakL e Leadless Chip Carrier(LCC)S e Small Outline SOIC JEDECSJ e Small Outline SOIC EIAJPhysical Dimensions inches(millimeters)20-Lead Ceramic Leadless Chip Carrier(L)NS Package Number E20A5Physical Dimensions inches(millimeters)(Continued)14-Lead Ceramic Dual-In-Line Package(D)NS Package Number J14A14-Lead(0 150 Wide)Molded Small Outline JEDEC(S)NS Package Number M14A6Physical Dimensions inches(millimeters)(Continued)14-Lead(0 300 Wide)Molded Small Outline EIAJ(SJ)NS Package Number M14D14-Lead(0 300 Wide)Molded Dual-In-Line Package(P)NS Package Number N14A754F 74F 74D u a l D -T y p e P o s i t i v e E d g e -T r i g g e r e d F l i p -F l o pPhysical Dimensions inches (millimeters)(Continued)14-Lead Ceramic Flatpak (F)NS Package Number W14BLIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a)are intended for surgical implant support device or system whose failure to perform can into the body or (b)support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectivenessbe reasonably expected to result in a significant injury to the userNational Semiconductor National Semiconductor National Semiconductor National Semiconductor National Semiconductores National Semiconductor CorporationGmbHJapan LtdHong Kong LtdDo Brazil Ltda(Australia)Pty Ltd 2900Semiconductor DriveLivry-Gargan-Str 10Sumitomo Chemical13th Floor Straight Block Rue Deputado Lacorda Franco Building 16。
HD74ALVC2G241US中文资料
Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg
Ratings −0.5 to 4.6 −0.5 to 4.6 −0.5 to VCC+0.5 −0.5 to 4.6 −50 ±50 ±50 ±100 200 −65 to 150
Unit V V V
mA mA mA mA mW °C
VI < 0 VO < 0 or VO > VCC VO = 0 to VCC
The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150°C.
Features
• The basic gate function is lined up as hitachi uni logic series. • Supplied on emboss taping for high speed automatic mounting. • Supply voltage range : 1.2 to 3.6 V Operating temperature range : −40 to +85°C • All inputs VIH (Max.) = 3.6 V (@VCC = 0 V to 3.6 V) All outputs VO (Max.) = 3.6 V (@VCC = 0 V) • Output current ±2 mA (@VCC = 1.2 V) ±4 mA (@VCC = 1.4 V to 1.6 V) ±6 mA (@VCC = 1.65 V to 1.95 V) ±18 mA (@VCC = 2.3 V to 2.7 V) ±24 mA (@VCC = 3.0 V to 3.6 V) • Package type
ALL常用贴片三极管
131 132 132 133 13A 13A 13E 13s 13s 13t 13V 13Y 13Y 14 14 14 14 14 142 14A 14s 14s 15 15 15 15 15 151 152 153 156 15A 15A 15s 15s 15V 15Y 16 16 16 161 162 163 166 16s 16s 16V 16Y 179 17s
BAS125-07W BFP181T PDTC143ZK PZM18NB1 PZM18NB2 PZM18NB3 PZM18NB BZV49-C18 BZV49-C18 PDTA143ZK DTA115EUA DTA115EKA Typ BC846 A PMBT3904 PXT3904 BC846A BC846AT FMMT3904 MMBT3904 IRLML2402 PMST3904 BC846AW MMBT3904L BC846A BC846A BC846AW PMBT2222 PXT2222 BC846 B BC846B BC846BT FMMT2222 MMBT2222 IRLML2803 PMST2222 BC846BW BC846B BC817UPN BC846B BC846BW FMMT-A20 MMBTA20L IRLML6302 BAP50-05 BC847S PMBTA42 BC846 MMBTA42
Sie Tfk Phi Phi Phi Phi Phi Phi Phi Rho Rho Herst.
S X N C C C C O N N N Base
Phi Phi Zet Mot IR Phi Phi Mot Phi Phi Phi
N N N N F N N N N N N
Phi Phi Zet Mot IR Phi Phi Phi Sie Phi Phi Zet Mot IR Phi Sie
74系列中文资料(超级全)
┌┴─┴─┴─┴─┴─┴─┴┐ 双 D 触发器 74LS74
│14 13 12 11 10 9 8 │
)
│
│ 1 2 3 4 5 6 7│
└┬─┬─┬─┬─┬─┬─┬┘
1Cr 1D 1Ck 1St 1Q -1Q GND
Vcc 8Q 8D 7D 7Q 6Q 6D 5D 5Q ALE
┌┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┐ 8 位锁存器 74LS373
Vcc -G B1 B2 B3 B4 B8 B6 B7 B8
┌┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┐ 8 位总线驱动器 74LS245
│20 19 18 17 16 15 14 13 12 11│
)
│ DIR=1 A=>B
│ 1 2 3 4 5 6 7 8 9 10│ DIR=0 B=>A
└┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┘
___
)
│ Y = A+B
│ 1 2 3 4 5 6 7│
└┬─┬─┬─┬─┬─┬─┬┘
1Y 1A 1B 2Y 2A 2B GND
Vcc 2Y 2B 2A 2D 2E 1F
┌┴─┴─┴─┴─┴─┴─┴┐ 双与或非门 74S51
│14 13 12 11 10 9 8│
_____
)
│ 2Y = AB+DE
DIR A1 A2 A3 A4 A5 A6 A7 A8 GND
正逻辑与门,与非门:
Vcc 4B 4A 4Y 3B 3A 3Y
┌┴─┴─┴─┴─┴─┴─┴┐
│14 13 12 11 10 9 8│
Y = AB )
│ 2 输入四正与门 74LS08
│ 1 2 3 4 5 6 7│
74ALS241A-1DB中文资料
元器件交易网DIP20:plastic dual in-line package; 20 leads (300 mil)SOT146-1SO20:plastic small outline package; 20 leads; body width 7.5 mm SOT163-1SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.This data sheet contains preliminary data, and supplementary data will be published at a later date. PhilipsSemiconductors reserves the right to make changes at any time without notice in order to improve designand supply the best possible product.Philips Semiconductors811 East Arques AvenueP .O. Box 3409Sunnyvale, California 94088–3409Telephone 800-234-7381DEFINITIONSData Sheet IdentificationProduct Status Definition Objective Specification Preliminary Specification Product Specification Formative or in Design Preproduction Product Full ProductionThis data sheet contains the design target or goal specifications for product development. Specificationsmay change in any manner without notice.This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changesat any time without notice, in order to improve design and supply the best possible product.© Copyright Philips Electronics North America Corporation 1997All rights reserved. Printed in U.S.A.。
74LV241DB中文资料
元器件交易网DIP20:plastic dual in-line package; 20 leads (300 mil)SOT146-1SO20:plastic small outline package; 20 leads; body width 7.5 mm SOT163-1SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1TSSOP20:plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.This data sheet contains preliminary data, and supplementary data will be published at a later date. PhilipsSemiconductors reserves the right to make changes at any time without notice in order to improve designand supply the best possible product.Philips Semiconductors811 East Arques AvenueP .O. Box 3409Sunnyvale, California 94088–3409Telephone 800-234-7381DEFINITIONSData Sheet IdentificationProduct Status Definition Objective Specification Preliminary Specification Product Specification Formative or in Design Preproduction Product Full ProductionThis data sheet contains the design target or goal specifications for product development. Specificationsmay change in any manner without notice.This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changesat any time without notice, in order to improve design and supply the best possible product.© Copyright Philips Electronics North America Corporation 1998All rights reserved. Printed in U.S.A.print codeDate of release: 05-96。
MC74HCT241ADTR2G,MC74HCT241ADTG,MC74HCT241ADWR2G,MC74HCT241ADWG, 规格书,Datasheet 资料
5.5
± 0.5
± 5.0
± 10
μA
Vin = VIL or VIH Vout = VCC or GND
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND Iout = 0 μA
5.5
4
40
160
μA
ΔICC Additional Quiescent Supply
© Semiconductor Components Industries, LLC, 2009
1
December, 2009 − Rev. 8
芯天下--/
Publication Order Number: MC74HCT241A/D
A1 2
A2 4
A3 6
DATA INPUTS
A4 8 B1 11
B2 13
B3 15
B4 17
LOGIC DIAGRAM
OUTPUT ENABLE A 1 ENABLES ENABLE B 19
MC74HCT241A
18 YA1 16 YA2 14 YA3 12 YA4
NONINVERTING 9 YB1 OUTPUTS 7 YB2 5 YB3 3 YB4
V
5.5
5.4
5.4
5.4
Vin = VIH or VIL |Iout| v 6 mA
4.5
3.98
3.84
3.7
VOL
Maximum Low−Level Output
Voltage
Vin = VIH or VIL |Iout| v 20 μA
2SK241中文资料(toshiba)中文数据手册「EasyDatasheet - 矽搜」
2SK241
4
2003-03-27
芯片中文手册,看全文,戳
2SK241
5
2003-03-27
特点 漏源电压 栅源电压 漏极电流 漏极功耗 通道温度 存储温度范围
电气特性
特点 栅极漏电流 漏源电压 漏极电流 门源截止电压 远期转移导纳 输入电容 反向传输电容 功率增益 噪声系数
注:I DSS 分类
(Ta = 25°C)
符号
VDS VGS ID PD Tch Tstg
等级
单元
20
V
±5
V
30
mA
Crss
¾
3.0
¾
pF
¾ 0.035 0.050 pF
Gps
VDS = 1赫(图1)
¾
28
¾
dB
¾ 1.7 3.0 dB
O: 1.5~3.5, Y: 3.0~7.0, GR: 6.0~14.0
1
2003-03-27
芯片中文手册,看全文,戳
¾
V
IDSS
VDS = 10 V, V GS = 0
(注意) 1.5
¾
14 mA
VGS (OFF) VDS = 10 V, I D = 100 mA
¾
¾ -2.5
V
ïY fsï
VDS = 10 V, V GS = 0, f = 1千赫
¾
10
¾
mS
Ciss
VDS = 10 V, V GS = 0, f = 1兆赫
200
mW
125
°C
-55~125
°C
(Ta = 25°C)
JEDEC
―
JEITA
74LS241中文资料
元器件交易网Hitachi Code JEDEC EIAJWeight (reference value)DP-20N —Conforms 1.26 gUnit: mm元器件交易网Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。
KK74HC241A中文资料
TECHNICAL DATAKK 74HC241AOctal 3-State Noninverting Buffer/LineDriver/Line ReceiverHigh-Performance Silicon-Gate CMOSThe KK device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs.This octal noninverting buffer/line driver/line receiver is designed to be used with 3-state memory address drivers, clock drivers, and other bus-oriented systems. The device has noninverting outputs and two output enables. Enable A is active-low and Enable B is active-high.• Outputs Directly Interface to CMOS, NMOS, and TTL• Operating Voltage Range: 2.0 to 6.0 V• Low Input Current: 1.0 µA• High Noise Immunity Characteristic of CMOS DevicesPIN ASSIGNMENTLOGIC DIAGRAMPIN 20=V CC PIN 10 = GNDFUNCTION TABLEInputs Output Inputs Output EnableAA YA EnableB BYB L L L H L L L H H H H H HXZLXZX = don’t careZ = high impedanceMAXIMUM RATINGS*Symbol Parameter ValueUnit V CC DC Supply Voltage (Referenced to GND) -0.5 to +7.0 VV IN DC Input Voltage (Referenced to GND) -1.5 to V CC +1.5 VV OUT DC Output Voltage (Referenced to GND) -0.5 to V CC +0.5 VI IN DC Input Current, per Pin ±20 mAI OUT DC Output Current, per Pin ±35 mAI CC DC Supply Current, V CC and GND Pins ±75 mAP D Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750500mWTstg Storage Temperature -65 to +150 °CT L Lead Temperature, 1 mm from Case for 10 Seconds(Plastic DIP or SOIC Package)260 °C*Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°CSOIC Package: : - 7 mW/°C from 65° to 125°CRECOMMENDED OPERATING CONDITIONSSymbol Parameter MinMaxUnit V CC DC Supply Voltage (Referenced to GND) 2.0 6.0 V V IN, V OUT DC Input Voltage, Output Voltage (Referenced to GND) 0 V CC VT A Operating Temperature, All Package Types -55 +125 °Ct r, t f Input Rise and Fall Time (Figure 1) V CC =2.0 VV CC =4.5 VV CC =6.0 V 01000500400nsThis device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, V IN and V OUT should be constrained to the range GND≤(V IN or V OUT)≤V CC.Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC). Unused outputs must be left open.DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)V CCGuaranteed LimitSymbol Parameter TestConditions V25 °Cto-55°C ≤85°C≤125°CUnitV IH Minimum High-Level InputVoltage V OUT= V CC-0.1 V⎢I OUT⎢≤ 20 µA2.04.56.01.53.154.21.53.154.21.53.154.2VV IL Maximum Low -Level InputVoltage V OUT= 0.1 V⎢I OUT⎢≤ 20 µA2.04.56.00.51.351.80.51.351.80.51.351.8VV OH Minimum High-Level OutputVoltage V IN= V IH⎢I OUT⎢≤ 20 µA2.04.56.01.94.45.91.94.45.91.94.45.9VV IN= V IH⎢I OUT⎢≤ 6.0 mA⎢I OUT⎢≤ 7.8 mA4.56.03.985.483.845.343.75.2V OL Maximum Low-Level OutputVoltage V IN = V IL⎢I OUT⎢≤ 20 µA2.04.56.00.10.10.10.10.10.10.10.10.1VV IN= V IL⎢I OUT⎢≤ 6.0 mA⎢I OUT⎢≤7.8 mA4.56.00.260.260.330.330.40.4I IN Maximum InputLeakage CurrentV IN=V CC or GND 6.0±0.1 ±1.0 ±1.0 µAI OZ Maximum threeState LeakageCurrent Output in High-Impedance StateV IN = V IL or V IHV OUT=V CC or GND6.0±0.5 ±5.0 ±10.0 µAI CC MaximumQuiescent SupplyCurrent(per Package) V IN=V CC or GNDI OUT=0µA6.0 4.0 40 160 µAAC ELECTRICAL CHARACTERISTICS (C L=50pF,Input t r=t f=6.0 ns)V CC Guaranteed LimitSymbol Parameter V25 °Cto-55°C≤85°C ≤125°C Unitt PLH, t PHL Maximum Propagation Delay, A to YA or B to YB (Figures 1 and 3) 2.04.56.090181511523201352723nst PLZ, t PHZ Maximum Propagation Delay, Output Enable to YA or YB (Figures 2 and 4) 2.04.56.0110221914028241653328nst PZH, t PZL Maximum Propagation Delay, Output Enable to YA or YB (Figures 2 and 4) 2.04.56.0110221914028241653328nst TLH, t THL Maximum Output Transition Time, Any Output (Figures 1 and 3) 2.04.56.0601210751513901815nsC IN Maximum Input Capacitance - 10 10 10 pFC OUT Maximum Three-State Output Capacitance(Output in High-Impedance State)- 15 15 15 pFPower Dissipation Capacitance (Per TransceiverChannel)Typical @25°C,V CC=5.0 VC PD Used to determine the no-load dynamic powerconsumption:P D=C PD V CC2f+I CC V CC34 pFFigure 1. Switching Waveforms Figure 2. Switching WaveformsFigure 3. Test Circuit Figure 4. Test CircuitEXPANDED LOGIC DIAGRAM(1/4 of the Device)。
74241中文资料
54/74241三态八缓冲器/线驱动器/线接收器(3S,两组控制)简要说明:241为三态输出的八组缓冲器和总线驱动器,共有54/74S241和54/74LS241两种线路结构型式,其主要电器特性的典型值如下(不同厂家具体值有差别): 型号t PLH t phl P D54S241/74S241 6ns 6ns 538mW54LS241/74LS241 12ns 12ns110mW引出端符号:1A1~1A4,2A1~2A4 输入端/G 三态允许端(低电平有效)G 三态允许端(高电平有效)1Y1~1Y4,2Y1~2Y4 输出端逻辑图:双列直插封装极限值:电源电压 (7V)输入电压 …………………………………………. 5.5V输出高阻态时高电平电压 …………………………. 5.5V工作环境温度54XXX ………………………………….-55~125℃ 74XXX ………………………………….0~70℃存储温度 …………………………………………. -65~150℃功能表:推荐工作条件:54S241/74S241 54LS241/74LS241最小 额定 最大 最小 额定 最大 单位54 4.5 5 5.5 4.5 5 5.5电源电压Vcc74 4.75 5 5.25 4.75 5 5.25V 输入高电平电V iH2 2 V 54 0.8 0.7输入低电平电V iL74 0.8 0.8 V 54 -12 -12 输出高电平电流I OH74 -15 -15 mA54 48 12 输出低电平电流I OL74 64 24 mA动态特性(T A =25℃)S241 LS241参 数 测 试 条 件 最大 最大单位t PLH 输出由低到高传输延迟时间 9 18 ns t PHL 输出由高到低传输延迟时间9 18 ns t PZH 输出由高阻态到高允许时间12 23 ns t PZL 输出由高阻态到低允许时间Vcc =5VC L =15Pf(LS241为45Pf) R L =90 Ω(LS241为667 Ω) 15 30 ns tPHZ 输出由高到高阻态禁止时间9 18 ns t PLZ 输出由低到高阻态禁止时间Vcc=5V C L =5Pf R L =90 Ω (LS241为667 Ω)15 25 ns静态特性(TA 为工作环境温度范围)S241 LS241参 数 测 试 条 件【1】最小 最大 最小 最大 单位V IK 输入嵌位电压 Vcc=最小,I ik =-18mA -1.2-1.5 V △V T 滞后电压 Vcc =最小0.2 0.2 V V OH 输出高电平电压Vcc =最小,V IL =最大I OH =-3mA2.4 2.4 V 54 0.55 0.4 V OL 输出低电平电压Vcc=最小,V IL =最大,V IH =2V,I OL =最大74 0.55 0.5 VV I =5.5V 1I I 最大输入电压时输入电流Vcc =最大V I =7V 0.1 mA I IH 输入高电平电流 Vcc =最大,V IH =2.7V50 20 uA V IL =0.5V -0.41A,2AV IL =0.4V-0.2 V IL =0.5V -2 I IL 输入低电平电流/G,GVcc =最大V IL =0.4V -0.2mA I OS 输出短路电流 Vcc =最大-50 -225 -40 -225 mA V O =2.4V 50 IOZH 输出高阻态时高电平电流Vcc =最大,V IH =2V V O =2.7V 20 uAV O =0.5V -50 I OZL 输出高阻态时低电平电流 Vcc =最大,V IH =2V,V IL =最大V O =0.4V -20 uA54 147 271Y,2Y 均为高电平74 160 2754 170 461Y,2Y 均为低电平74 180 46 54 170 54Icc 电源电流 Vcc =最大1Y,2Y 均为高阻态74 180 54 mA[1]: 测试条件中的“最小”和“最大”用推荐工作条件中的相应值。
74AC241SCX_NL资料
元器件交易网74AC241, 74ACT241 Octal Buffer/Line Driver with 3-STATE Outputs74AC241, 74ACT241 Octal Buffer/Line Driver with 3-STATE OutputsTruth TableH = HIGH Voltage Level X = ImmaterialL = LOW Voltage LevelZ = High ImpedanceAbsolute Maximum RatingsStresses exceeding the absolute maximum ratings may damage the device. The device may not function or beoperable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.Recommended Operating ConditionsThe Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.Inputs OutputsInputs OutputsOE 1I nPins 12, 14, 16, 18OE 2I nPins 3, 5, 7, 9L L L H L L L H H H H H HXZLXZSymbol ParameterRatingV CC Supply Voltage –0.5V to +7.0VI IKDC Input Diode Current V I = –0.5V V I = V CC + 0.5V–20mA +20mAV I DC Input Voltage –0.5V to V CC + 0.5VI OKDC Output Diode Current V O = –0.5V V O = V CC + 0.5V–20mA +20mAV O DC Output Voltage–0.5V to V CC + 0.5VI O DC Output Source or Sink Current ±50mA I CC or I GND DC V CC or Ground Current per Output Pin±50mAT STG Storage Temperature –65°C to +150°CT JJunction Temperature140°CSymbol ParameterRatingV CCSupply Voltage AC ACT2.0V to 6.0V 4.5V to 5.5V V I Input Voltage 0V to V CC V O Output Voltage 0V to V CCT A Operating Temperature–40°C to +85°C∆ V / ∆ t Minimum Input Edge Rate, AC Devices:V IN from 30% to 70% of V CC , V CC @ 3.3V , 4.5V , 5.5V 125mV/ns ∆ V / ∆ tMinimum Input Edge Rate, ACT Devices: V IN from 0.8V to 2.0V , V CC@ 4.5V , 5.5V125mV/ns元器件交易网74AC241, 74ACT241 Octal Buffer/Line Driver with 3-STATE OutputsDC Electrical Characteristics for ACNotes:1.All outputs loaded; thresholds on input associated with output under test.2.Maximum test duration 2.0ms, one output loaded at a time.3.I IN and I CC @ 3.0V are guaranteed to be less than or equal to the respective limit @ 5.5V V CC .SymbolParameterV CC (V)ConditionsT A = +25°CT A = –40°C to +85°C UnitsTyp.Guaranteed LimitsV IHMinimum HIGH Level Input Voltage3.0V OUT = 0.1V or V CC – 0.1V 1.5 2.12.1V4.5 2.25 3.15 3.155.5 2.75 3.85 3.85V ILMaximum LOW Level Input Voltage3.0V OUT = 0.1V or V CC – 0.1V 1.50.90.9V4.5 2.25 1.35 1.355.5 2.75 1.65 1.65V OHMinimum HIGHLevel Output Voltage3.0I OUT = –50µA2.99 2.9 2.9V 4.5 4.49 4.4 4.45.55.495.4 5.4V IN = V IL or V IH :3.0I OH = –12mA 2.56 2.464.5I OH = –24mA 3.86 3.765.5I OH = –24mA (1) 4.864.76V OLMaximum LOWLevel Output Voltage3.0I OUT = 50µA0.0020.10.1V 4.50.0010.10.15.50.0010.10.1V IN = V IL or V IH :3.0I OL = 12mA 0.360.444.5I OL = 24mA 0.360.445.5I OL = 24mA (1) 0.360.44I IN (3) Maximum Input Leakage Current 5.5V I = V CC , GND ±0.1±0.1µA IOZMaximum 3-STATE Leakage Current 5.5V I (OE) = V IL , V IH ; V I = V CC , GND; V O = V CC , GND ±0.25±2.5µA I OLD Minimum Dynamic Output Current (2) 5.5V OLD = 1.65V Max.75mA I OHD V OHD = 3.85V Min.–75mA I CC (3)Maximum Quiescent Supply Current5.5V IN = V CC or GND4.040.0µA元器件交易网Notes:4.All outputs loaded; thresholds on input associated with output under test.5.Maximum test duration 2.0ms, one output loaded at a time.I CCMaximumQuiescent Supply Current5.5V IN = V CC or GND4.040.0µANote:7.Voltage range 5.0 is 5.0V ± 0.5V.CapacitanceData to Output t PHL Propagation Delay, Data to Output 5.0 1.57.09.0 1.510.0ns t PZH Output Enable Time 5.0 1.5 6.09.0 1.010.0ns t PZL Output Enable Time 5.0 1.57.010.0 1.511.0ns t PHZ Output Disable Time 5.0 1.58.010.5 1.511.5ns t PLZOutput Disable Time5.02.07.010.51.511.5nsSymbolParameterConditionsTyp.UnitsC IN Input CapacitanceV CC = OPEN 4.5pF C PDPower Dissipation CapacitanceV CC = 5.0V45.0pFPackage Number M20B74AC241, 74ACT241 Octal Buffer/Line Driver with 3-STATE Outputs The Power Franchise™TinyBoost。
SN74LS244中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-7801201VRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 5962-7801201VSA ACTIVE CFP W201None Call TI Level-NC-NC-NC 7705701RA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 7705701SA ACTIVE CFP W201None Call TI Level-NC-NC-NC 78012012A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC 7801201RA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 7801201SA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32401B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/32401BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32401BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32402B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/32402BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32402BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32403B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/32403BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32403BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC JM38510/32403SRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/32403SSA ACTIVE CFP W201None Call TI Level-NC-NC-NC SN54LS240J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54LS241J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54LS244J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54S240J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54S241J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54S244J ACTIVE CDIP J201None Call TI Level-NC-NC-NCSN74LS240DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS240DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS240J OBSOLETE CDIP J20None Call TI Call TISN74LS240N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS240N3OBSOLETE PDIP N20None Call TI Call TISN74LS240NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS241DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS241DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS241J OBSOLETE CDIP J20None Call TI Call TISN74LS241N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS241N3OBSOLETE PDIP N20None Call TI Call TISN74LS241NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS244DBR ACTIVE SSOP DB202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS244DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS244DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74LS244J OBSOLETE CDIP J20None Call TI Call TISN74LS244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS244N3OBSOLETE PDIP N20None Call TI Call TISN74LS244NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74S240DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S240DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S240N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S240N3OBSOLETE PDIP N20None Call TI Call TISN74S241DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S241DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S241J OBSOLETE CDIP J20None Call TI Call TISN74S241N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S241N3OBSOLETE PDIP N20None Call TI Call TISN74S244DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S244DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74S244J OBSOLETE CDIP J20None Call TI Call TISN74S244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S244N3OBSOLETE PDIP N20None Call TI Call TISNJ54LS240FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS240J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54LS240W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54LS241FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS241J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54LS241W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54LS244FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS244J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54LS244W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54S240FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54S240J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54S240W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54S241FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SNJ54S241J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54S241W ACTIVE CFP W201None Call TI Level-NC-NC-NC SNJ54S244FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54S244J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54S244W ACTIVE CFP W201None Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide 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74F845SPC资料
© 1999 Fairchild Semiconductor Corporation DS009601April 1988Revised August 199974F845 8-Bit Transparent Latch74F8458-Bit Transparent LatchGeneral DescriptionThe 74F845 bus interface latch is designed to eliminate the extra packages required to buffer existing latches and pro-vide extra data width for wider address/data paths or buses carrying parity.The 74F845 is functionally- and pin-compatible with AMD’s Am29845.Featuress 3-STATE outputss Direct replacement for AMD’s Am29845Ordering Code:Devices also available in T ape and Reel. Specify by appending the suffix letter “X” to the ordering code.Logic Symbols IEEE/IECConnection DiagramOrder Number Package NumberPackage Description74F845SC M24B 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F845SPCN24C24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-100, 0.300 Wide 274F 845Unit Loading/Fan OutFunctional DescriptionThe 74F845 consists of eight D-type latches with 3-STATE outputs. The flip-flops appear transparent to the data when Latch Enable (LE) is HIGH. This allows asynchronous operation as the output transition follows the data in transi-tion. On the LE HIGH-to-LOW transition, the data that meets the setup times is latched. Data appears on the bus when the output Enable (OE) is LOW. When OE is HIGH,the bus output is in the high impedance state.Function TableH = HIGH Voltage Level Z = High Impedance L = LOW Voltage Level NC = No ChangeX = ImmaterialLogic DiagramPlease note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.Pin Names Description U.L.Input I IH /I IL HIGH/LOW Output I OH /I OL D 0–D 7Data Inputs 1.0/1.020 µA/−0.6 mA O 0–O 7Data Outputs 150/40−3.0 µA/24 mA OE 1–OE 3Output Enables 1.0/1.020 µA/−0.6 mA LE Latch Enable 1.0/1.020 µA/−0.6 mA CLR Clear 1.0/1.020 µA/−0.6 mA PREPreset1.0/1.020 µA/−0.6 mAInputsInternal Output Function CLR PRE OE LE D Q O H H H X X X Z High Z H H H H L L Z High Z H H H H H H Z High Z H H H L X NC Z Latched H H L H L L L Transparent H H L H H H H Transparent H H L L X NC NC Latched H L L X X H H Preset L H L X X L L Clear L L L X X H H Preset L H H L X L Z Latched HLHLXHZLatched74F845Absolute Maximum Ratings (Note 1)Recommended Operating ConditionsNote 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.Note 2: Either voltage limit or current limit is sufficient to protect inputs.DC Electrical CharacteristicsStorage Temperature−65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V CC Pin Potential to Ground Pin −0.5V to +7.0V Input Voltage (Note 2)−0.5V to +7.0V Input Current (Note 2)−30 mA to +5.0 mAVoltage Applied to Output in HIGH State (with V CC = 0V)Standard Output −0.5V to V CC 3-STATE Output −0.5V to +5.5V Current Applied to Output in LOW State (Max)twice the rated I OL (mA)Free Air Ambient Temperature 0°C to +70°C Supply Voltage+4.5V to +5.5VSymbol ParameterMin TypMaxUnits V CCConditionsV IH Input HIGH Voltage 2.0V Recognized as a HIGH Signal V IL Input LOW Voltage 0.8V Recognized as a LOW Signal V CD Input Clamp Diode Voltage −1.2VMin I IN = −18 mA V OHOutput HIGH 10% V CC 2.5I OH = −1 mA Voltage10% V CC 2.4VMinI OH = −3 mA 5% V CC 2.7I OH = −1 mA 5% V CC2.7I OH = −3 mA V OL Output LOW Voltage 10% V CC0.5V Min I OL = 24 mA I IH Input HIGH Current 5.0µA Max V IN = 2.7V I BVI Input HIGH Current 7.0µA Max V IN = 7.0V Breakdown Test I CEX Output HIGH 50µA Max V OUT = V CC Leakage Current V ID Input Leakage 4.75V 0.0I ID = 1.9 µATestAll Other Pins Grounded I OD Output Leakage 3.75µA 0.0V IOD = 150 mVCircuit Current All Other Pins Grounded I IL Input LOW Current −0.6mA Max V IN = 0.5V I OZH Output Leakage Current 50µA Max V OUT = 2.7V I OZL Output Leakage Current −50µA Max V OUT = 0.5V I OS Output Short-Circuit Current −60−150mA Max V OUT = 0V I ZZ Bus Drainage Test 500µA 0.0V V OUT = 5.25V I CCZPower Supply Current6385mAMaxV O = HIGH Z 474F 845AC Electrical CharacteristicsAC Operating RequirementsSymbolParameterT A = +25°CT A = 0°C to +70°C UnitsV CC = +5.0V V CC = +5.0V C L = 50 pFC L = 50 pF MinTyp Max Min Max t PLH Propagation Delay 2.5 4.88.0 2.09.0ns t PHL D n to O n1.5 3.6 6.5 1.57.0t PLH Propagation Delay 5.08.112.0 4.513.5ns t PHL LE to O n2.0 4.47.5 2.08.0t PLH Propagation Delay3.0 5.910.0 2.511.0ns PRE to O nt PHL Propagation Delay 3.0 6.510.0 2.511.0ns CLR to O nt PZH Output Enable Time 2.5 5.89.5 2.010.5ns t PZL OE to O n2.57.612.0 2.013.0t PHZ Output Disable Time 1.0 3.17.5 1.08.5ns t PLZOE to O n1.02.86.51.07.5Symbol ParameterT A = +25°CT A = 0°C to +70°C UnitsV CC = +5.0V V CC = +5.0V Min MaxMin Maxt S (H)Setup Time, HIGH or LOW 2.0 2.5ns t S (L)D n to LE2.0 2.5t H (H)Hold Time, HIGH or LOW 2.53.0ns t H (L)D n to LE3.0 3.5t W (H)LE Pulse Width, HIGH4.0 4.0ns t W (L)PRE Pulse Width, LOW5.0 5.0ns t W (L)CLR Pulse Width, LOW 5.0 5.0ns t REC PRE Recovery Time 10.010.0ns t RECCLR Recovery Time12.013.0ns74F845Physical Dimensions inches (millimeters) unless otherwise noted24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 WidePackage Number M24B674F 845 8-B i t T r a n s p a r e n t L a t c hPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-100, 0.300 WidePackage Number N24CFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。
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© 1999 Fairchild Semiconductor Corporation DS009501April 1988Revised July 199974F240 • 74F241 • 74F244 Octal Buffers/Line Drivers with 3-STATE Outputs74F240 • 74F241 • 74F244Octal Buffers/Line Drivers with 3-STATE OutputsGeneral DescriptionThe 74F240, 74F241 and 74F244 are octal buffers and line drivers designed to be employed as memory and address drivers, clock drivers and bus-oriented transmitters/receiv-ers which provide improved PC and board density.Featuress 3-STATE outputs drive bus lines or buffer memory address registers s Outputs sink 64 mA (48 mA mil)s 12 mA source currents Input clamp diodes limit high-speed termination effectsOrdering Code:Devices also available in T ape and Reel. Specify by appending the suffix letter “X” to the ordering code.Connection Diagrams74F24074F24174F244Order Code Package NumberPackage Description74F240SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F240PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 74F241SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F241SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F241PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 74F244SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F244MSA MSA2020-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74F244PCN20A20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 274F 240 • 74F 241 • 74F 244Logic SymbolsIEEE/IEC 74F240IEEE/IEC 74F241IEEE/IEC 74F244Unit Loading/Fan OutNote 1: Worst-case 74F240 enabled; 74F241, 74F244 disabledTruth Tables74F24074F24174F244H = HIGH Voltage Level L = LOW Voltage Level X = ImmaterialZ = High ImpedancePin Names DescriptionU.L.Input I IH /I IL HIGH/LOW Output I OH /I OL OE 1, OE 23-STATE Output Enable Input (Active LOW) 1.0/1.66720 µA/−1 mA OE 23-STATE Output Enable Input (Active HIGH) 1.0/1.66720 µA/−1 mA I 0–I 7Inputs (74F240) 1.0/1.667 (Note 1)20 µA/−1 mA I 0–I 7Inputs (74F241, 74F244)1.0/2.667 (Note 1)20 µA/−1.6 mA O 0–O 7, O 0–O 7Outputs600/106.6 (80)−12 mA/64 mA (48 mA)OE 1D 1n O 1n OE 2D 2n O 2n H X Z H X Z L H L L H L LLH LLHOE 1D 1n O 1n OE 2D 2n O 2n H X Z L X Z L H H H H H LLLHLLOE 1D 1n O 1n OE 2D 2n O 2n H X Z H X Z L H H L H H LLLLLL74F240 • 74F241 • 74F244Absolute Maximum Ratings (Note 2)Recommended Operating ConditionsNote 2: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.Note 3: Either voltage limit or current limit is sufficient to protect inputs.DC Electrical CharacteristicsStorage Temperature−65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C V CC Pin Potential to Ground Pin −0.5V to +7.0V Input Voltage (Note 3)−0.5V to +7.0V Input Current (Note 3)−30 mA to +5.0 mAVoltage Applied to Output in HIGH State (with V CC = 0V)Standard Output −0.5V to V CC 3-STATE Output −0.5V to +5.5V Current Applied to Output in LOW State (Max)twice the rated I OL (mA)ESD Last Passing Voltage (Min)4000V Free Air Ambient Temperature 0°C to +70°C Supply Voltage+4.5V to +5.5VSymbol ParameterMin TypMaxUnits V CCConditionsV IH Input HIGH Voltage 2.0V Recognized as a HIGH Signal V IL Input LOW Voltage 0.8V Recognized as a LOW Signal V CD Input Clamp Diode Voltage −1.2VMin I IN = −18 mA V OHOutput HIGH 10% V CC 2.4VMinI OH = −3 mA Voltage10% V CC 2.0I OH = −15 mA 5% V CC 2.7I OH = −3 mA V OL Output LOW 10% V CC 0.55V Min I OL = 64 mA VoltageI IH Input HIGH 5.0µA Max V IN = 2.7V CurrentI BVI Input HIGH Current 7.0µA Max V IN = 7.0V Breakdown Test I CEX Output HIGH 50µA Max V OUT = V CC Leakage Current V ID Input Leakage 4.75V 0.0I ID = 1.9 µATestAll Other Pins Grounded I OD Output Leakage 3.75µA 0.0V IOD = 150 mVCircuit Current All Other Pins GroundedI IL Input LOW Current −1.0mAMaxV IN = 0.5V (OE 1, OE 2, OE 2, D n 74F240))−1.6V IN = 0.5V (D n (74F241, 74F244))I OZH Output Leakage Current 50µA Max V OUT = 2.7V I OZL Output Leakage Current −50µA Max V OUT = 0.5V I OS Output Short-Circuit Current −100−225mA Max V OUT = 0V I ZZ Bus Drainage Test500µA 0.0V V OUT = 5.25V I CCH Power Supply Current (74F240)1929mA Max V O = HIGH I CCL Power Supply Current (74F240)5075mA Max V O = LOW I CCZ Power Supply Current (74F240)4263mA Max V O = HIGH Z I CCH Power Supply Current 4060mA Max V O = HIGH (74F241, 74F244)I CCL Power Supply Current 6090mA Max V O = LOW (74F241, 74F244)I CCZPower Supply Current 6090mAMaxV O = HIGH Z(74F241, 74F244) 474F 240 • 74F 241 • 74F 244AC Electrical CharacteristicsSymbolParameterT A = +25°CT A = −55°C to +125°CT A = 0°C to +70°CUnitsV CC = +5.0V V CC = 5.0V V CC = 5.0V C L = 50 pFC L = 50 pF C L = 50 pF MinTyp Max Min Max Min Max t PLH Propagation Delay 3.0 5.17.0 3.09.0 3.08.0ns t PHL Data to Output (74F240) 2.0 3.5 4.7 2.0 6.0 2.0 5.7t PZH Output Enable Time (74F240)2.03.54.7 2.0 6.5 2.05.7ns t PZL 4.06.99.0 4.010.5 4.010.0t PHZ Output Disable Time (74F240) 2.0 4.0 5.3 2.0 6.5 2.0 6.3t PLZ 2.0 6.08.0 2.012.5 2.09.5t PLH Propagation Delay2.5 4.0 5.2 2.0 6.5 2.5 6.2ns t PHL Data to Output (74F241, 74F244) 2.5 4.0 5.2 2.07.0 2.5 6.5t PZH Output Enable Time 2.0 4.3 5.7 2.07.0 2.0 6.7ns t PZL (74F241, 74F244) 2.0 5.47.0 2.08.5 2.08.0t PHZ Output Disable Time 2.0 4.5 6.0 2.07.0 2.07.0t PLZ(74F241, 74F244)2.04.56.02.07.52.07.074F240 • 74F241 • 74F244Physical Dimensions inches (millimeters) unless otherwise noted20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 WidePackage Number M20B20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M20D 674F 240 • 74F 241 • 74F 244Physical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm WidePackage Number MSA20774F240 • 74F241 • 74F244 Octal Buffers/Line Drivers with 3-STATE OutputsPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 WidePackage Number N20AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。