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院系： 化学系 年级：10级 班级：五班 姓名：王晨阳 学号：20102310524 Registry Number : 6915-15-7

Formula : C4 H6 O5

CA Index Name : Butanedioic acid, 2-hydroxy-

Other Names : Butanedioic acid, hydroxy- (9CI); Malic acid (8CI); ( )-Malic acid; 2-Hydroxybutanedioic acid;

2-Hydroxyethane-1,2-dicarboxylic acid; 2-Hydroxysuccinic acid; DL-Malic acid; Deoxytetraric acid; E 296; Ethylene glycol-DL-malic acid-terephthalic acid graft copolymer; FDA 2018; Hydroxybutanedioic acid; Hydroxysuccinic acid; Musashi-no-Ringosan; NSC 25941; Nanoveson M; Pomalus Acid; R,S( )-Malic acid; dl-Malic acid; -Hydroxysuccinic acid

Resources : Reference s: ~30235

STN Files: CAPLUS, ADISNEWS, AGRICOLA, ANABSTR, BIOSIS, BIOTECHNO, CA, CABA, CASREACT, CBNB, CHEMCATS, CHEMINFORMRX, CHEMLIST, CIN, DDFU, DETHERM, DRUGU, EMBASE, ENCOMPLIT, ENCOMPLIT2, ENCOMPPAT, ENCOMPPAT2, GMELIN, IFICDB, IFIPAT, IFIUDB, IPA, MEDLINE, MRCK, MSDS-OHS, NAPRALERT, PIRA, RTECS, SPECINFO, TOXCENTER, USAN, USPAT2, USPATFULL

Database : REGISTRY atalog Name : Conier Chem & Pharma Product List Publication Date : 16 Aug 2011

Order Number : CM39107 Chemical Name : malic acid Registry Number : 6915-15-7

Database: CHEMCATS

Product and Regent CH O OH

O H

OH OH HO R S R R Abs ol ute s ter eo ch emi st ry.+CH O O H OH OH H O S R R Ab so lut e st ere oc hem is try.

S :H 2O, 144 h , r t MeC (=O)CO 2H +HO 2C CO 2H CH CH 2OH

+A cOH

+H O 2C CO 2H

C H 2CH 286%NOT E: fe rm ent at io n, en zym ic , des cr ibe d me diu m, bi ot ra nsf or mat io n, me ta bol ic all y

ev ol ved s tr ain o f r ec om bin an t E sc he ric hi a c ol i KJ122 (T G 400) gr own o n

xy lo se pr io r t o exp er im ent u sed , sc ree ni ng of m icr ob es,

Re ac tan ts : 2, So lve nt s: 1,

St ep s: 1, S tag es : 1

Bu -i Me C H O H

1.2 R :HC l, S :H 2O 1.1 C :Zn , C :6915-15-7, r t; 4 h , rt 50C; 50C rt ; 12 h, rt B u-i

Me

Cl CH 60%NOT E: al te rna ti ve pr ep ara ti on sh ow n, ca ta lys t pre pa re d a nd us ed , mod el iza ti on of

ha lo gen at io n r ea cti on p rov ok ed in a me ta llo ph yt e p la nt,

Re ac tan ts : 1, Re age nt s: 1, C ata ly st s: 2, So lv en ts: 1,

St ep s: 1, S tag es : 2

→︒︒→

HO 2C CO 2H CH CH 2OH

CO 2H HO 2C

E D oub le b ond g eom et ry as s how n.

25C HC HO +CO 2+

HO 2C C O 2H CH CH 2OH

+C O 2H HO 2C C H CH O H OH

+C O +CO 2H H O 2C Z D ou ble b ond g eo met ry as s how n.

+HO 2C CO 2H

CH 2C H 2N OTE : ul tra so und (200 W ), ot he r pro du cts a ls o d et ect ed (hyd ro gen ,h ydr og en

pe rox id e),

Re act an ts: 1,

St eps : 1, St ag es: 1

Retrieval results ：

Atomic Oxygen Effects on POSS Polyimides in Low Earth Orbit.

author ：Minton, Timothy K.; Wright, Michael E.; Tomczak, Sandra J.; Marquez, Sara A.; Shen, Linhan; Brunsvold, Amy L.; Cooper, Russell; Zhang, Jianming; Vij, Vandana; Guenthner, Andrew J.; Petteys, Brian J. Department of Chemistry and Biochemistry, Montana State University, Bozeman, MT, USA. ACS Applied Materials & Interfaces (2012), 4(2), 492-502.

Publisher: American Chemical Society, CODEN: AAMICK ISSN: 1944-8244. Journal ; Online Computer File written in English. CAN 156:231436 AN 2011:1656100 CAPLUS

Analyze or Refine:Kapton polyimide is extensively used in solar arrays, spacecraft thermal blankets, and space inflatable structures. Upon exposure to at. oxygen in low Earth orbit (LEO), Kapton is severely eroded. An effective approach to prevent this erosion is to

incorporate polyhedral oligomeric silsesquioxane (POSS) into the polyimide matrix by copolymg. POSS monomers with the polyimide precursor. The copolymn. of POSS provides Si and O in the polymer matrix on the nano level. During exposure of POSS polyimide to at. oxygen, org. material is degraded, and a silica passivation layer is formed. This silica layer protects the underlying polymer from further degrdn. Lab. and space-flight expts. have shown that POSS polyimides are highly resistant to at.-oxygen attack, with erosion yields that may be as little as 1% those of Kapton. The results of all the studies indicate that POSS polyimide would be a space-survivable replacement for Kapton on spacecraft that operate in the LEO

environment.Indexing -- Section 37-5 (Plastics Manufacture and Processing)

Section cross-reference(s): 35, 38

Chemical Treatment of Poly(lactic acid) Fibers to Enhance the Rate of Thermal Depolymerization. Author ：Dong, Hefei; Esser-Kahn, Aaron P.; Thakre, Piyush R.; Patrick, Jason F.; Sottos, Nancy R.; White, Scott R.; Moore, Jeffrey S. Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA. ACS Applied Materials & Interfaces (2012), 4(2), 503-509. Publisher: American ChemicalSociety, CODEN: AAMICK ISSN: 1944-8244. Journal; Online Computer File written in English. CAN156:231418 AN 2011:1329319 CAPLUS

Analyze or Refine:When heated, poly(lactic acid) (PLA) fibers depolymerize in a controlled manner, making them potentially useful as sacrificial fibers for microchannel fabrication. Catalysts that increase PLA depolymn. rates are explored and methods to incorporate them into com. available PLA fibers by a solvent mixt. impregnating technique are tested. In the present study, the most active catalysts are identified that are capable of lowering the depolymn. temp. of modified PLA fibers by ca. 100 C as compared to unmodified ones. Lower depolymn. temps. allow PLA fibers to be removed from a fully cured epoxy thermoset resin without causing significant thermal damage to the epoxy. For 500 m diam. PLA fibers, the optimized treatment