PC792A1AC2-12S中文资料
SSL12中文资料
元器件交易网
RATINGS AND CHARACTERISTIC CURVES (SSL12 THRU SSL14)
FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE
1.0
FIG.2- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT
Rating at 25℃ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Symbol Type Number SSL12
.062(1.58) .050(1.27)
SMA/DO-214AC
.111(2.83) .090(2.29)
.187(4.75) .160(4.06)
Mechanical Data
Cases: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Packaging: 12mm tape per EIA STD RS-481 Weight: 0.064 gram
SL12 TJ TSTG
SL14 ℃ ℃
Notes: 1. Pulse Test with PW=300 usec, 1% Duty Cycle. 2. Measured on P.C. Board with 0.2 x 0.2”(5.0 x 5.0mm) Copper Pad Areas.
PVII-12中文手册(版本号070502)
P/VⅡ-12交流金属封闭开关设备使用手册安全第一：在开关设备安装使用前请先仔细阅读本使用手册：●开关设备的使用场所应符合电气设备规定的使用条件的要求。
●安装、操作和维护均需由专职电气人员完成，该人员必须接受相应的培训。
●必须保证电气设备的联锁条件和工作规程的适用和安全性。
●有关开关设备的一切操作，都要遵守手册中的相关规定。
●不要超出开关设备正常工作条件下的技术参数中规定的数值。
●手册应放于安装、操作和维护人员方便拿到的地方。
用户的专职人员应对所有影响工作安全的事项负责，并正确管理开关设备。
如果对本操作手册尚有疑问，欢迎向我们提出，我们将提供进一步的咨讯与服务版权所有，本公司保留对此手册的修改权利。
严禁误用及滥用，包括盗版、篡改及断章取义并提供给第三方。
对所有其它渠道获取的咨讯，本公司概不负责。
目录产品概述概述符合标准技术参数外型尺寸和重量正常使用条件产品结构结构特点外壳与隔板手车功能隔室手车室母线室电缆室低压室防误闭锁装置压力释放装置储运与安装运输交货与保管安装安装现场的一般要求基础混凝土地坪上的基础框架柜体安装母线安装电缆连接电力电缆连接控制电缆连接开关装置接地其它事项运行与维护设备运行准备工作起动调试操作断路器手车断路器接地开关负荷开关组合式过电流继电器调试注意事项检查和维护概述检查和维护时间间隔检查维护主要附件VB2真空断路器手车典型接线图1 1 1 1 1 1 2 2 2 2 3 3 3 4 4 4 4 5 5 5 5 5 6 6 7 7 7 7 7 7 7 8 8 8 8 8 8 9 9 10 10 10 10 10 11 11 11 12概 述P/VⅡ-12型铠装移开式户内交流金属封闭开关设备是上海通用电气广电有限公司最新一代的户内成套配电装置。
设备适用于标称系统电压3~10kV，额定电流4000A及以下，额定频率50Hz的单母线或单母线分段三相交流户内配电系统，用于接收和分配电能，并对电路实行控制、保护及监测。
PC792A1CP-12SR中文资料
Enclosure C: Dust Cover, S: Sealed Case
Parallel Component Nil: None; D: Diode; R: Resistor; N: Nickle Plated Terminals
PC792A Rev C 3-7-06
3220 Commander Drive, Suite 102, Carrollton, Texas 75006 Sales: Call Toll Free (888)997-3933 Fax (818) 342-5296 email: pickerwest@ URL:
PAGE 1
元器件交易网
Temperature Rise C Coil Temperature Rise C Switching Current (Amps)
o o
PC792A
REFERENCE CURVES
100 95 90 85 80 75 70 65 60 55 50 11
元器件交易网
Automotive Plug-In / PCB Power Relay
PC792A
FEATURES Most popular automotive relay 1 A and 1 C contact forms available Contact switching capacity up to 120 Amps 40 Amps continuous carrying capacity Up to 125 degrees C operating temperature Internal diodes or resistors available Sockets available from Picker Components
莫加 MPC-2121 系列 12英寸无风扇车辆面板计算机商品介绍说明书
MPC-2121Series12-inch industrial fanless panel computers with EN50155compliance for the railway marketFeatures and Benefits•12-inch panel computer•Intel Atom®processor E38451.91GHz•1000-nit sunlight-readable LCD•-40to70°C wide-temperature design,no fan or heater•EN50155:2017CompliantCertificationsIntroductionThe MPC-212112-inch panel computers with E3800Series Intel Atom®processor deliver a reliable,durable,and versatile platform for use in industrial environments.All interfaces come with IP66-rated M12connectors to provide anti-vibration and waterproof connections.With two software-selectable RS-232/422/485serial ports and two Ethernet ports,the MPC-2121panel computers support a wide variety of serial interfaces as well as high-speed IT communications,all with native network redundancy.The MPC-2121Series panel computers are designed with a wide,-40to70°C temperature range,and come with a fanless,streamlined enclosure designed for highly efficient heat dissipation,making this one of the most reliable industrial platforms available for vibration prone,harsh,hot, outdoor environments.The MPC-2121also features a1000-nit LCD panel offering a sunlight readable,projected-capacitive,multi-touch screen, providing an excellent user experience.AppearanceSpecificationsComputerCPU Intel Atom®Processor E3845(2M Cache,1.91GHz)Graphics Controller Intel®HD GraphicsSystem Memory Pre-installed4(8GB Max.)GB DDR3LSystem Memory Slot SODIMM DDR3/DDR3L slot x1Pre-installed OS MPC-2121-E4-LB-CT-T-W7E/MPC-2101-E4-CT-T-W7E:Windows Embedded Standard7(WS7P)64-bit pre-installedMPC-2121-E4-LB-CT-T-LX/MPC-2121-E4-CT-T-LX:Linux9pre-installedSupported OS Windows10Pro64-bitWindows10Embedded IoT Ent2019LTSC64-bitWindows10Embedded IoT Ent2016LTSBWindows7Pro for Embedded SystemsWindows Embedded Standard7(WS7P)64-bitLinux Debian9Expansion Slots Mini PCIeStorage Slot CFast slot x1SD slots x1,SD3.0(SDHC/SDXC)socketStorage Pre-installed MPC-2121-E4-LB-CT-T-W7E/MPC-2121-E4-CT-T-W7E:32GB CFast CardMPC-2121-E4-LB-CT-T-LX/MPC-2121-E4-CT-T-LX:32GB CFast CardComputer InterfaceEthernet Ports Auto-sensing10/100Mbps ports(M12D-coded4P)x2Serial Ports RS-232/422/485ports x1(M12A-code12P)USB2.0USB2.0hosts x1(M12A-coded5P)Digital Input DIs x4(M12A-code)Digital Output DOs x2(M12A-code)LED IndicatorsSystem Power x1DisplayActive Display Area245.76(H)x184.32(V)mmAspect Ratio4:3Contrast Ratio1000:1Light Intensity(Brightness)500/1000cd/m2Max.No.of Colors16.2M(8-bit/color)Panel Size12-inch viewable imagePixel Pitch(RGB)0.240(H)x0.240(V)mmPixels1024x768Response Time5ms(gray to gray)Viewing Angles176°/176°Touch FunctionTouch Type Capacitive Touch(PCAP)Touch Support Points4pointsGlove Support YesSerial InterfaceBaudrate50bps to115.2kbpsData Bits5,6,7,8Flow Control RTS/CTS,XON/XOFFParity None,Even,Odd,Space,MarkStop Bits1,1.5,2Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GND RS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersInput Voltage24to110VDCPhysical CharacteristicsHousing MetalIP Rating IP66Dimensions297x238x59mm(11.69x9.37x2.32in) Weight2850g(6.28lb)Environmental LimitsOperating Temperature-40to70°C(-40to158°F)Storage Temperature(package included)-40to70°C(-40to158°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:20V/mIEC61000-4-4EFT:Power:2kV;Signal:2kVIEC61000-4-5Surge:Power:2kV;Signal:1kVIEC61000-4-6CS:10VIEC61000-4-8PFMFMechanical Protection Rating IEC60529,IP codeShock EN50155standardVibration EN50155standardEMC EN55032/35Safety IEC60950-1,IEC62368-1,UL62368-1 DeclarationGreen Product RoHS,CRoHS,WEEEWarrantyWarranty Period LCD:1yearSystem:3yearsDetails See /warrantyPackage ContentsDevice1x MPC-2121Series computerInstallation Kit6x screw,for panel-mounting1x M12-Phone jack power cable1x M12-Type A USB cable1x terminal block,2-pin(for remote power input) Documentation1x quick installation guide1x warranty cardDimensionsOrdering Information2.0MPC-2121-E4-LB-CT-T-W7E 12"(4:3)500nitsE3845Quadcore4GBW7E(64-bit)2(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-CT-T-W7E12"(4:3)1,000nitsE3845Quadcore4GBW7E(64-bit)2(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-LB-CT-T-LX 12"(4:3)500nitsE3845Quadcore4GB Debian92(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-CT-T-LX12"(4:3)1,000nitsE3845Quadcore4GB Debian92(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-LB-CT-T 12"(4:3)500nitsE3845Quadcore4GB–2(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-CT-T12"(4:3)1,000nitsE3845Quadcore4GB–2(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°C©Moxa Inc.All rights reserved.Updated Jun28,2021.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。
常用三极管参数大全
玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理。
联想 7339AL2台式电脑配置
联想 7339AL2台式电脑配置----------------------------------以下信息由电脑管家提供导出时间：2015-10-27 10:21:9----------------------------------电脑概览电脑型号联想 7339AL2操作系统 Microsoft Windows 7 旗舰版 (32位/Service Pack 1)CPU AMD Phenom(tm) 8400 Triple-Core Processor(2100 Mhz)主板联想 LENOVO内存 GB (圣创雷克 PC2-5300 DDR2 SDRAM 667MHz)主硬盘 320 GB (西数 WDC WD3200AAJS-08B4A0 ATA Device 已使用时间: 19812小时)显卡 G98 [GeForce 9300 GE]显示器联想 L195 Wide 32位真彩色 1Hz声卡 Realtek 888 High Definition Audio网卡 Marvell Yukon 88E8039 PCI-E Fast Ethernet Controller--------------------------------------------------------------------------------------------------------------------------1、CPU详情CPU厂商 AMDCPU AMD Phenom(tm) 8400 Triple-Core ProcessorCPU核心数 3CPU默认频率 2100 Mhz （）CPU外频 200 MHzCPU当前频率 1050 MHz Ghz)一级缓存数据 64 KB一级缓存数据 64 KB二级缓存 1536 KB三级缓存 2048 KBCPU电压 VCPU序列号 178BFBFF00100F22数据宽度 64bit技术参数 65 纳米插座/插槽 AM2+指令集 MMX,SSE,SSE2,SSE3,MMX+,3DNow!+,3DNow!,SSE4A,x86-64扩展版本 1 0--------------------------------------------------------------------------------------------------------------------------2、主板详情制造商联想主板型号 AMIBIOS(LENOVO)制造日期 2008/06/03主板序列号 111111BIOS厂商 LENOVOBIOS版本 LENOVO - Lenovo BIOS Version:BIOS大小 MB芯片组 AMD RS690 Host Bridge电脑厂商联想电脑型号 7339AL2系统安装日期 2015/10/01最近启动时间 2015/10/06--------------------------------------------------------------------------------------------------------------------------3、内存内存厂商圣创雷克内存名称圣创雷克 PC2-5300 DDR2 SDRAM 667MHz内存大小 1GB内存类型 DDR2 SDRAM内存频率 667MHz插槽 DIMM0生产日期 2008/7数据宽度 72bitPC-Clock PC2-5300内存厂商金士顿内存名称金士顿 PC2-6400 DDR2 SDRAM 800MHz内存大小 2GB内存类型 DDR2 SDRAM内存频率 800MHz插槽 DIMM1生产日期 2008/1数据宽度 72bitPC-Clock PC2-6400--------------------------------------------------------------------------------------------------------------------------4、显卡详情显卡名称 G98 [GeForce 9300 GE]显卡厂商英伟达显存大小 512 MB--------------------------------------------------------------------------------------------------------------------------5、显示器详情显示器厂商联想显示器名称 L195 Wide显示器代号 LEN1142屏幕尺寸英寸 (41厘米X26厘米)屏幕比例 16:10当前分辨率 1280 * 1024 (32位真彩色@1Hz)最大分辨率 1440 * 900制造时间 2008/6--------------------------------------------------------------------------------------------------------------------------6、硬盘详情硬盘厂商西数硬盘名称西数 (WDC WD3200AAJS-08B4A0 ATA Device)硬盘大小 320 GB硬盘转速 7200 转/分钟接口类型 SATA 3Gb/s硬盘传输速度 300 MB/S硬盘缓存 8 MB硬盘已使用时间 19812小时硬盘序列号 WD-WMAT137268 (BIOS 版本:--------------------------------------------------------------------------------------------------------------------------7、声卡详情声卡名称 Realtek 888 High Definition Audio声卡厂商瑞昱UAA总线名称 SBx00 Azalia (Intel HDA)8、网卡详情网卡名称 Marvell Yukon 88E8039 PCI-E Fast Ethernet Controller 网卡厂商美满Mac地址 00:21:85:46:4A:AB9、鼠标详情制造商 IBM名称 Wheel Mouse10、键盘类型 PS/2 标准键盘11、其它硬件详情制造商创见名称 63-in-1 Multi-Card Reader/Writer移动硬盘详情移动硬盘1硬盘序列号 Generic USB CF Reader USB Device 硬盘转速 0 转/分钟硬盘传输速度 0 MB/S硬盘缓存 0 MB硬盘已使用时间移动硬盘2硬盘序列号 Generic USB SM Reader USB Device硬盘转速 0 转/分钟硬盘传输速度 0 MB/S硬盘缓存 0 MB硬盘已使用时间移动硬盘3硬盘序列号 Generic USB SD Reader USB Device 硬盘转速 0 转/分钟硬盘传输速度 0 MB/S硬盘缓存 0 MB硬盘已使用时间移动硬盘4硬盘序列号 Generic USB MS Reader USB Device 硬盘转速 0 转/分钟硬盘传输速度 0 MB/S硬盘缓存 0 MB硬盘已使用时间。
Christie NAS-S2 用户手册说明书
用户手册
020-101657-01
Christie NAS-S2
用户手册
020-101657-01
声明
版权和商标
版权所有 ©2014 Christie Digital Systems USA Inc. 保留所有权利。
所有品牌名称和产品名称均为其各自所有者的商标、注册商标或商号名称。
或损坏。 e. 因使用从未经授权的科视灯泡、替换部件或组件分销商处购买或获得的任何灯泡、替换部件或组件而引发的问题或造成的损坏，包括
但不限于通过 internet 提供科视灯泡、替换部件或组件的任何分销商 （可向科视确认有哪些经授权的分销商）。 f. 因使用不当、电源不匹配、意外事故、火灾、洪水、闪电、地震或其他自然灾害而引发的问题或造成的损坏。 g.因安装 / 校正不当而引发的问题或造成的损坏，以及由非科视维修人员或非科视授权维修服务供应商进行的设备改装所引发的问题或
天、每天 8 小时。 k. 因在户外使用产品而引发的问题或造成的损坏 （除非产品专用于户外用途），但以下情况除外：保护此类产品免于受到降雨或其他恶
劣天气或环境条件的影响并且室温位于规格中所设定的适合此类产品的推荐室温范围内。 l. LCD 平板上的影像滞留。 m.由正常磨损或产品正常老化造成的缺陷。 保修不适用于序列号已移除或擦除的任何产品。保修也不适用于由转销商出售给转销商所在国家 / 地区之外的最终用户的任何产品，但以 下情况除外：(i) 科视在最终用户所在的国家 / 地区拥有办事处或 (ii) 已支付所需的国际保修费用。
* This part uses metallic alloys, which may contain Lead. - 因该部件使用金属合金材料，故可能含有铅。
FPM-2120G 2150G 2170G系列12英寸XGA 15英寸XGA 17英寸SXGA工业L
User ManualFPM-2120G/2150G/2170G Series12"XGA/15" XGA/17" SXGAIndustrial LED Monitor withResistive Touchscreen, VGADisplay Port and DC12 V Input顯示器CopyrightThe documentation and the software included with this product are copyrighted 2013 by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right to make improvements in the products described in this manual at any time without notice. No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means without the prior written permission of Advantech Co., Ltd. Information provided in this manual is intended to be accurate and reliable. How-ever, Advantech Co., Ltd. assumes no responsibility for its use, nor for any infringe-ments of the rights of third parties, which may result from its use. AcknowledgementsIntel and Pentium are trademarks of Intel Corporation.Microsoft Windows® are registered trademarks of Microsoft Corp.All other product names or trademarks are properties of their respective owners.This manual includes the following products:FPM-2170G-R3BE;FPM-2150G-R3BE;FPM-2120G-R3BE;FPM-2170GR3B1601-T;FPM-2170GR3B1701-T;FPM-2170GR3B1801-T;FPM-2170GR3B1602-T;FPM-2170GR3B1702-T;FPM-2170GR3B1802-T;FPM-2170GR3B1603-T;FPM-2170GR3B1703-T;FPM-2170GR3B1803-T;FPM-2170GR3B1604-T;FPM-2170GR3B1704-T;FPM-2170GR3B1804-T;FPM-2150GR3B1601-T;FPM-2150GR3B1701-T;FPM-2150GR3B1801-T;FPM-2150GR3B1602-T;FPM-2150GR3B1702-T;FPM-2150GR3B1802-T;FPM-2150GR3B1603-T;FPM-2150GR3B1703-T;FPM-2150GR3B1803-T;FPM-2150GR3B1604-T;FPM-2150GR3B1704-T;FPM-2150GR3B1804-T;FPM-2120GR3B1601-T;FPM-2120GR3B1701-T;FPM-2120GR3B1801-T;FPM-2120GR3B1602-T;FPM-2120GR3B1702-T;FPM-2120GR3B1802-T;FPM-2120GR3B1603-T;FPM-2120GR3B1703-T;FPM-2120GR3B1803-T;FPM-2120GR3B1604-T; FPM-2120GR3B1704-T; FPM-2120GR3B1804-TPart No. 2003215050Edition 2Printed in China January 2016FPM-2120G/2150G/2170G Series User Manual iiProduct Warranty (2 years)Advantech warrants to you, the original purchaser, that each of its products will be free from defects in materials and workmanship for two years from the date of pur-chase.This warranty does not apply to any products which have been repaired or altered by persons other than repair personnel authorized by Advantech, or which have been subject to misuse, abuse, accident or improper installation. Advantech assumes no liability under the terms of this warranty as a consequence of such events.Because of Advantech’s high quality-control standards and rigorous testing, most of our customers never need to use our repair service. If an Advantech product is defec-tive, it will be repaired or replaced at no charge during the warranty period. For out-of-warranty repairs, you will be billed according to the cost of replacement materials, service time and freight. Please consult your dealer for more details.If you think you have a defective product, follow these steps:1.Collect all the information about the problem encountered. (For example, CPUspeed, Advantech products used, other hardware and software used, etc.) Noteanything abnormal and list any onscreen messages you get when the problemoccurs.2.Call your dealer and describe the problem. Please have your manual, product,and any helpful information readily available.3.If your product is diagnosed as defective, obtain an RMA (return merchandizeauthorization) number from your dealer. This allows us to process your returnmore quickly.4.Carefully pack the defective product, a fully-completed Repair and ReplacementOrder Card and a photocopy proof of purchase date (such as your sales receipt)in a shippable container. A product returned without proof of the purchase dateis not eligible for warranty service.5.Write the RMA number visibly on the outside of the package and ship it prepaidto your dealer.[警告使用者：這是甲類資訊產品，在居住的環境中使用時，可能會造成射頻干擾，在這種情況下，使用者會被要求採取某些適當對策。
asus使用手册
第六章：附錄
6-1 藍牙鼠標設置步驟（選配）........................................... 66 6-2 簡易故障排除. ...................................................................... 68
C5462
筆記本電腦
硬件使用手冊
HDMI
E-SATA
2010 年 4 月
版權說明
版權所有．不得翻印 © 2010 華碩電腦 本使用手冊包括但不限於其所包含的所有���� 信息�� 受到著作權法之保護，未經 華碩電腦股份有限公司（以下簡稱“華碩”）許可，不得任意地仿製、拷貝、 謄抄、轉譯或為其他使用或處分。
第一章：認識您的電腦
1-1 1-2 1-3 1-4 1-5 1-6 外觀介紹................................................................................ 10 選購配件說明. ...................................................................... 16 日常維護保養. ...................................................................... 17 外出使用................................................................................ 20 個人數據備份. ...................................................................... 22 安全防護功能（選購）.................................................... 24
EP1C12Q240I7N中文资料(Altera)中文数据手册「EasyDatasheet - 矽搜」
400-Pin FineLine
BGA
1.0 441 21 × 21
1–3
初稿
芯片中文手册,看全文,戳
第一节气旋FPGA
系列数据表
修订记录
本节为设计师提供数据表规格
Cyclone器件.该章节包含内部功能定义 架构,配置和JTAG边界扫描测试信息, DC操作条件下,AC时序参数,一提到功耗和订购信息Cyclone器件.
本节包含以下章节：
■ 简介 ■ 旋风架构
配置与测试直流和开
表4-19.
对于EP1C3定稿定时信息和
EP1C12器件.更新时间信息
inTables 4–25 通过 4–26 and 表4-30
通过 4–51.
更新PLL规范
表4-52.
更新时间信息.时间最终确定 EP1C6和EP1C20器件.更新 性能信息.添加 部分.
"PLL时序"
添加文件到Cyclone器件手册.
运行条件 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 能量消耗 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8 时序模型. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9
× 36位） (1)
注意 表 1-1： (1) 该参数包括全局时钟引脚.
EP1C3 2,910
13 59,904
1 104
EP1C4 4,000
ZSSC3122AA2R中文资料(ZMDI)中文数据手册「EasyDatasheet - 矽搜」
描述 ZSSC3122 cLite™ die — Temperature range: -40°C to +125°C ZSSC3122 cLite™ die — Temperature range: -40°C to +125°C ZSSC3122 cLite™ TSSOP14 — Temperature range: -40°C to +125°C – Lead-free package
L7922AC中文资料
L7900AC SERIES2%NEGATIVE VOLTAGE REGULATORSNovember 1999s OUTPUT CURRENT UP TO 1.5AsOUTPUT VOLTAGESOF -5;-5.2;-6;-8;-12;-15;-18;-20;-22;-24Vs THERMAL OVERLOAD PROTECTION s SHORT CIRCUIT PROTECTIONsOUTPUT TRANSITION SOA PROTECTIONDESCRIPTIONThe L7900AC series of three-terminal negative regulators is available in TO-220and D 2PAK packages and several fixed output voltages.These regulators can provide local on-card regulation,eliminating the distribution problems associated with single point regulation;furthermore,having the same voltage option as the L7800A positive standard series,they are particularly suited for split power supplies.In addition,the -5.2V is also available for ECL system.If adequate heat sinking is provided,they can deliver over 1.5A output current.Although designed primarily as fixed voltage regulators,these devices can be used with external components to obtain adjustable voltages and currents.TO-22013D 2PAKSCHEMATIC DIAGRAM®1/11CONNECTION DIAGRAM AND ORDERING NUMBERS (top view)TO-220D 2PAKTHERMAL DATASymbolParameterD 2PAK TO-220UnitR thj-ca se R thj-amb Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max362.5350o C/W oC/WABSOLUTE MAXIMUM RATINGSSymbol ParameterValue Unit V i DC Input Voltage (for V O =-5to -18V)(for V O =-20,-24V)-35-40V VI o Output Current Internally limited P tot Power DissipationInternally limitedT op Operating Junction Temperature Range 0to 125o C T st gStorage Temperature Range-65to 150oCTypeTO-220D 2PAK (*)Output VoltageL7905AC L7952AC L7906AC L7908AC L7912AC L7915AC L7918AC L7920AC L7922AC L7924ACL7905ACV L7952ACV L7906ACV L7908ACV L7912ACV L7915ACV L7918ACV L7920ACV L7922ACV L7924ACVL7905ACD2T L7952ACD2T L7906ACD2T L7908ACD2T L7912ACD2T L7915ACD2T L7918ACD2T L7920ACD2T L7922ACD2T L7924ACD2T-5V -5.2V -6V -8V -12V -15V -18V -20V -22V -24V(*)AVAILABLE IN TAPE AND REEL WITH ”-TR”SUFFIXAPPLICATION CIRCUITL7900AC2/11*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulce testing with low duty cycle is used.ELECTRICAL CHARACTERISTICS FOR L7905A (refer to the test circuits,T j =0to 125o C,V i =-10V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest ConditionsMin.Typ.Max.Unit V o Output Voltage T j =25oC -4.9-5-5.1V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =8to 20V -4.8-5-5.2V ∆V o *Line Regulation V i =-7to -25V T j =25o C V i =-8to -12VT j =25o C10050mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25oC I o =250to 750mA T j =25o C10050mV mV I d Quiescent Current T j =25oC 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-8to -25V 1.3mA ∆V o ∆T Output Voltage Drift I o =5mA-0.4mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 100µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.4V I s c Short Circuit Current2.1A I scpShort Circuit Peak CurrentT j =25oC2.5AELECTRICAL CHARACTERISTICS FOR L7952A (refer to the test circuits,T j =0to 125o C,V i =-10V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest Conditions Min.Typ.Max.Unit V o Output Voltage T j =25o C -5.1-5.2-5.3V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-9to -21V -5-5.2-5.4V ∆V o *Line Regulation V i =-8to -25V T j =25oC V i =-9to -13VT j =25o C10552mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25o C I o =250to 750mA T j =25o C10552mV mV I d Quiescent Current T j =25oC 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-9to -25V 1.3mA ∆V o ∆T Output Voltage Drift I o =5mA-0.5mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 125µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.4V I s c Short Circuit Current2.1A I scpShort Circuit Peak CurrentT j =25o C 2.5AL7900AC3/11*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulce testing with low duty cycle is used.ELECTRICAL CHARACTERISTICS FOR L7906A (refer to the test circuits,T j =0to 125o C,V i =-11V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest ConditionsMin.Typ.Max.Unit V o Output Voltage T j =25oC-5.88-6-6.12V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-9.5to -21.5V-5.76-6-6.24V ∆V o *Line Regulation V i =-8.5to -25V T j =25o C V i =-9to -15V T j =25o C 12060mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25oC I o =250to 750mA T j =25o C12060mV mV I d Quiescent Current T j =25o C 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-9.5to -25V 1.3mA ∆V o ∆T Output Voltage Drift I o =5mA-0.6mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 144µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.4V I s c Short Circuit Current 2A I scpShort Circuit Peak CurrentT j =25oC2.5AELECTRICAL CHARACTERISTICS FOR L7908A (refer to the test circuits,T j =0to 125o C,V i =-14V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest Conditions Min.Typ.Max.Unit V o Output Voltage T j =25o C-7.84-8-8.16V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-11.5to -23V-7.68-8-8.32V ∆V o *Line Regulation V i =-10.5to -25V T j =25oC V i =-11to -17V T j =25o C 16080mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25o C I o =250to 750mA T j =25o C16080mV mV I d Quiescent Current T j =25oC 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-11.5to -25V 1mA ∆V o ∆T Output Voltage Drift I o =5mA-0.6mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 175µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.1V I s c Short Circuit Current 1.5A I scpShort Circuit Peak CurrentT j =25o C 2.5AL7900AC4/11*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulce testing with low duty cycle is used.ELECTRICAL CHARACTERISTICS FOR L7912A (refer to the test circuits,T j =0to 125o C,V i =-19V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest ConditionsMin.Typ.Max.Unit V o Output Voltage T j =25oC-11.75-12-12.25V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-15.5to -27V-11.5-12-12.5V ∆V o *Line Regulation V i =-14.5to -30V T j =25o C V i =-16to -22V T j =25o C 240120mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25oC I o =250to 750mA T j =25o C240120mV mV I d Quiescent Current T j =25o C 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-15to -25V 1mA ∆V o ∆T Output Voltage Drift I o =5mA-0.8mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 200µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.1V I s c Short Circuit Current 1.5A I scpShort Circuit Peak CurrentT j =25oC2.5AELECTRICAL CHARACTERISTICS FOR L7915A (refer to the test circuits,T j =0to 125o C,V i =-23V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest Conditions Min.Typ.Max.Unit V o Output Voltage T j =25o C-14.7-15-15.3V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-18.5to -30V-14.4-15-15.6V ∆V o *Line Regulation V i =-17.5to -30V T j =25oC V i =-20to -26V T j =25o C 300150mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25o C I o =250to 750mA T j =25o C300150mV mV I d Quiescent Current T j =25oC 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-18.5to -30V 1mA ∆V o ∆T Output Voltage Drift I o =5mA-0.9mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 250µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.1V I s c Short Circuit Current 1.3A I scpShort Circuit Peak CurrentT j =25o C 2.3AL7900AC5/11*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulce testing with low duty cycle is used.ELECTRICAL CHARACTERISTICS FOR L7918A (refer to the test circuits,T j =0to 125o C,V i =-27V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest ConditionsMin.Typ.Max.Unit V o Output Voltage T j =25oC -17.64-18-18.36V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-22to -33V -17.3-18-18.7V ∆V o *Line Regulation V i =-21to -33V T j =25o C V i =-24to -30VT j =25o C 360180mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25oC I o =250to 750mA T j =25o C360180mV mV I d Quiescent Current T j =25oC 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-22to -33V 1mA ∆V o ∆T Output Voltage Drift I o =5mA-1mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 300µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.1V I s c Short Circuit Current 1.1A I scpShort Circuit Peak CurrentT j =25oC2.2AELECTRICAL CHARACTERISTICS FOR L7920A (refer to the test circuits,T j =0to 125o C,V i =-29V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest Conditions Min.Typ.Max.Unit V o Output Voltage T j =25o C -19.6-20-20.4V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-24to -35V -19.2-20-20.8V ∆V o *Line Regulation V i =-23to -35V T j =25oC V i =-26to -32VT j =25o C 400200mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25o C I o =250to 750mA T j =25o C400200mV mV I d Quiescent Current T j =25oC 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-24to -35V 1mA ∆V o ∆T Output Voltage Drift I o =5mA-1.1mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 350µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.1V I s c Short Circuit Current 0.9A I scpShort Circuit Peak CurrentT j =25o C 2.2AL7900AC6/11*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulce testing with low duty cycle is used.ELECTRICAL CHARACTERISTICS FOR L7922A (refer to the test circuits,T j =0to 125o C,V i =-31V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest ConditionsMin.Typ.Max.Unit V o Output Voltage T j =25oC -21.5-22-22.4V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-26to -37V -21.1-22-22.8V ∆V o *Line Regulation V i =-25to -37V T j =25o C V i =-28to -34VT j =25o C 440220mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25oC I o =250to 750mA T j =25o C440220mV mV I d Quiescent Current T j =25oC 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-26to -37V 1mA ∆V o ∆T Output Voltage Drift I o =5mA-1.1mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 375µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.1V I s c Short Circuit Current 1.1A I scpShort Circuit Peak CurrentT j =25oC2.2AELECTRICAL CHARACTERISTICS FOR L7924A (refer to the test circuits,T j =0to 125o C,V i =-33V,I o =500mA,C i =2.2µF,C o =1µF unless otherwise specified)Symbol ParameterTest Conditions Min.Typ.Max.Unit V o Output Voltage T j =25o C -23.5-24-24.5V V o Output Voltage I o =-5mA to -1A P o ≤15W V i =-27to -38V -23-24-25V ∆V o *Line Regulation V i =-27to -38V T j =25oC V i =-30to -36VT j =25o C 480240mV mV ∆V o *Load Regulation I o =5to 1500mA T j =25o C I o =250to 750mA T j =25o C480240mV mV I d Quiescent Current T j =25oC 3mA ∆I d Quiescent Current Change I o =5to 1000mA 0.5mA ∆I d Quiescent Current Change V i =-27to -38V 1mA ∆V o ∆T Output Voltage Drift I o =5mA-1mV/o C e N Output Noise Voltage B =10Hz to 100KHz T j =25o C 400µV SVR Supply Voltage Rejection ∆V i =10Vf =120Hz5460dB V d Dropout Voltage I o =1A T j =25oC ∆V O =100mV1.1V I s c Short Circuit Current 1.1A I scpShort Circuit Peak CurrentT j =25o C 2.2AL7900AC7/11Figure 1:Fixed Output Regulator.Figure 2:Split Power Supply (±15V/1A).Notes :1.To specify an output voltage,substitute voltage value for ”XX”.2.Required for stability.For value given,capacitor must be solid tantalum.If aluminium electrolitics are used,at least ten times value should be selected.C 1is required if regulator is located an appreciable distance from power supply filter.3.To improve transient response.If large capacitors are used,a high current diode from input to output (1N4001or similar)should be introduce d to protect the device from momentary input short circuit.Against potential latch-up problems.APPLICATION INFORMATION Figure 3:Circuit for Increasing Output Voltage.Figure 4:High Current Negative Regulator(–5V/4A with 5A current limiting).C3Optional for improved transient response and ripple rejection.Figure 5:Typical ECL System Power Supply(–5.2V/4A).Optional dropping resistor to reduce the power dissipated in the boost transistor.V O =VXXR 1+R 2R 2V XXR 2>3I d L7900AC8/11DIM.mm inch MIN.TYP.MAX.MIN.TYP.MAX.A 4.80.189C 1.370.054D 2.4 2.80.0940.110D1 1.2 1.350.0470.053E 0.350.550.0140.022F 0.610.940.0240.037F2 1.15 1.40.0450.055G 4.955.08 5.210.1950.2000.205H210.40.409H310.0510.40.3960.409L216.20.638L326.326.727.1 1.035 1.0511.067L52.630.1020.118L615.115.80.5940.622L76 6.60.2360.260Dia.3.65 3.850.1440.152P011DTO-220MECHANICAL DATAL7900AC9/11DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.A 4.4 4.60.1730.181A1 2.49 2.690.0980.106B 0.70.930.0270.036B2 1.14 1.70.0440.067C 0.450.60.0170.023C2 1.23 1.360.0480.053D 8.959.350.3520.368E 1010.40.3930.409G 4.88 5.280.1920.208L 1515.850.5900.624L2 1.27 1.40.0500.055L31.41.750.0550.068L2L3LB2B GEAC2DCA1DETAIL”A”DETAIL”A”A 2P011P6/FTO-263(D 2PAK)MECHANICAL DATAL7900AC10/11元器件交易网L7900ACInformation furnished is believed to be accurate and reliable.However,STMicroelectroni c s assumes no responsibility for the consequencesof use of such information nor for any infringement of patents or other rights of third parties which may result from its use.No license isgranted by implication or otherwise under any patent or patent rights of STMicroelectroni c s.Specification mentioned in this publication aresubject to change without notice.This publication supersedes and replaces all informati o n previously supplied.STMicroelectronics productsare not authorized for use as critical components in life support devices or systems withoutexpress written approval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronics©1999STMicroelectronics–Printed in Italy–All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia-Brazil-China-Finland-France-Germany-Hong Kong-India-Italy-Japan-Malaysia-Malta-MoroccoSingapore-Spain-Sweden-Switzerland-United Kingdom-U.S.A..11/11。
PC929中文资料
g TÜV ( VDE 0884 ) approved type is also available as an option.
s Features 1. Built-in IGBT shortcircuit protector circuit 2. Built-in direct drive circuit for IGBT drive
V
VCC = V01 = 24V, RG = 47Ω
6.5 6.0 5.5
CG = 3 000pF, FS = OPEN
1
2
3
V
(9)
*9
O2 "High→Low" delay time at protection from overcurrent
tPCOHL
Ta = 25˚C
-
4
10
µs
O2 fall time at protection from overcurrent
Amp.
1 2 3 4 5 67
1 Cathode 2 Cathode 3 Anode 4 NC 5 NC 6 NC 7 NC
8 FS
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10 GND
11 O2 12 O1 13 VCC 14 GND
Terminals 4 to 7 : Shortcircuit in element
* "OPIC" (Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and signal processing circuit integrated onto a single chip.
AD7927BRUZ;AD7927BRUZ-REEL;AD7927BRUZ-REEL7;AD7927WYRUZ-REEL7;AD7927BRU;中文规格书,Datasheet资料
8-Channel, 200 kSPS, 12-Bit ADCwith Sequencer in 20-Lead TSSOP Data Sheet AD7927Rev. CInformation furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, N orwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 ©2003–2011 Analog Devices, Inc. All rights reserved.FEATURESFast throughput rate: 200 kSPSSpecified for AV DD of 2.7 V to 5.25 VLow power3.6 mW maximum at 200 kSPS with 3 V supply7.5 mW maximum at 200 kSPS with 5 V supply8 (single-ended) inputs with sequencerWide input bandwidth70 dB minimum SINAD at 50 kHz input frequency Flexible power/serial clock speed managementNo pipeline delaysHigh speed serial interface SPI-, QSPI™-, MICROWIRE™-, DSP-compatibleShutdown mode: 0.5 μA maximum20-lead TSSOPQualified for automotive applicationsGENERAL DESCRIPTIONThe AD7927 is a 12-bit, high speed, low power, 8-channel, successive approximation ADC. The part operates from a single 2.7 V to 5.25 V power supply and features throughput rates up to 200 kSPS. The part contains a low noise, wide bandwidth track-and-hold amplifier that can handle input frequencies in excess of 8 MHz.The conversion process and data acquisition are controlled using CS and the serial clock signal, allowing the device to easily interface with microprocessors or DSPs. The input signal is sampled on the falling edge of CS and the conversion is also initiated at this point. There are no pipeline delays associated with the part. The AD7927 uses advanced design techniques to achieve very low power dissipation at maximum throughput rates. At maximum throughput rates, the AD7927 consumes 1.2 mA maximum with 3 V supplies; with 5 V supplies, the current consumption is 1.5 mA maximum.Through the configuration of the control register, the analog input range for the part can be selected as 0 V to REF IN or 0 V to 2 × REF IN, with either straight binary or twos complement output coding. The AD7927 features eight single-ended analog inputs with a channel sequencer to allow a preprogrammed selection of channels to be converted sequentially.The conversion time for the AD7927 is determined by the SCLK frequency, as this is also used as the master clock to control the conversion. The conversion time may be as short as 800 ns with a 20 MHz SCLK.FUNCTIONAL BLOCK DIAGRAMREFV INV IN388-1Figure 1.PRODUCT HIGHLIGHTS1.High Throughput with Low Power Consumption.The AD7927 offers up to 200 kSPS throughput rates. At the maximum throughput rate with 3 V supplies, the AD7927 dissipates 3.6 mW of power maximum.2.Eight Single-Ended Inputs with a Channel Sequencer.A consecutive sequence of channels can be selected onwhich the ADC cycles and converts.3.Single-Supply Operation with V DRIVE Function.The AD7927 operates from a single 2.7 V to 5.25 V supply.The V DRIVE function allows the serial interface to connectdirectly to either 3 V or 5 V processor systems independent of AV DD.4.Flexible Power/Serial Clock Speed Management.The conversion rate is determined by the serial clock,allowing the conversion time to be reduced through theserial clock speed increase. The part also features variousshutdown modes to maximize power efficiency at lowerthroughput rates. Current consumption is 0.5 μA maxi-mum when in full shutdown.5.No Pipeline Delay.The part features a standard successive approximation ADCwith a CS input pin, which allows for accurate control ofeach sampling instant.AD7927Data SheetRev. C | Page 2 of 28TABLE OF CONTENTSFeatures .............................................................................................. 1 General Description ......................................................................... 1 Functional Block Diagram .............................................................. 1 Product Highlights ........................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Timing Specifications .................................................................. 5 Absolute Maximum Ratings ............................................................ 6 ESD Caution .................................................................................. 6 Pin Configuration and Function Descriptions ............................. 7 Terminology ...................................................................................... 8 Typical Performance Characteristics ........................................... 10 Control Register .............................................................................. 12 Sequencer Operation ...................................................................... 13 Shadow Register .............................................................................. 14 Circuit Information .................................................................... 15 Converter Operation .................................................................. 15 Analog Input ............................................................................... 15 ADC Transfer Function ............................................................. 16 Handling Bipolar Input Signals ................................................ 16 Typical Connection Diagram ........................................................ 17 Analog Input Selection .............................................................. 17 Digital Inputs .............................................................................. 17 V DRIVE ............................................................................................ 18 The Reference ............................................................................. 18 Modes of Operation ....................................................................... 19 Normal Mode (PM1 = PM0 = 1) ............................................. 19 Full Shutdown (PM1 = 1, PM0 = 0) ........................................ 19 Auto Shutdown (PM1 = 0, PM0 = 1) ....................................... 20 Powering Up the AD7927 ......................................................... 21 Power vs. Throughput Rate ....................................................... 21 Serial Interface ................................................................................ 22 Writing Between Conversions .................................................. 22 Microprocessor Interfacing ........................................................... 24 AD7927 to TMS320C541 .......................................................... 24 AD7927 to ADSP-21xx .............................................................. 24 AD7927 to DSP563xx ................................................................ 25 Application Hints ........................................................................... 26 Grounding and Layout .............................................................. 26 Evaluating the AD7927 Performance ...................................... 26 Outline Dimensions ....................................................................... 27 Ordering Guide .......................................................................... 27 Automotive Products .. (27)REVISION HISTORY12/11—Rev. B to Rev. CChanges to Features Section............................................................ 1 Changes to Table 1 ............................................................................ 3 Changes to Table 3 ............................................................................ 6 Changes to Ordering Guide, Added Automotive ProductsSection .............................................................................................. 27 12/08—Rev. A to Rev. BChanges to ESD Parameter, Table 3 ............................................... 6 Changes to Ordering Guide .......................................................... 27 1/07—Rev. 0 to Rev. AUpdated Format .................................................................. U niversal Updated Layout ................................................................................. 8 Updated Layout .............................................................................. 10 Changes to Figure 12 Caption ...................................................... 14 Changes to Figure 13 Caption ...................................................... 15 Changes to Ordering Guide .......................................................... 27 1/03—Revision 0: Initial VersionData SheetAD7927Rev. C | Page 3 of 28SPECIFICATIONSAV DD = V DRIVE = 2.7 V to 5.25 V , REF IN = 2.5 V , f SCLK = 20 MHz; T A = T MIN to T MAX , unless otherwise noted. Table 1.ParameterB Version 1 Unit Test Conditions/CommentsDYNAMIC PERFORMANCEf IN = 50 kHz sine wave, f SCLK = 20 MHz Signal-to-(Noise + Distortion) (SINAD)2 70 69.5 dB min dB min @ 5 V, B models @ 5 V, W models69 dB min @ 3 V Typically 70 dB Signal-to-Noise Ratio (SNR)2 70 69.5 dB min dB min B models W modelsTotal Harmonic Distortion (THD) 2 −77 dB max @ 5 V Typically −84 dB−73 dB max @ 3 V Typically −77 dB Peak Harmonic or Spurious Noise −78 dB max @ 5 V Typically −86 dB (SFDR) 2−76 dB max @ 3 V Typically −80 dB Intermodulation Distortion (IMD)2f A = 40.1 kHz, f B = 41.5 kHz Second-Order Terms −90 dB typ Third-Order Terms −90 dB typ Aperture Delay 10 ns typ Aperture Jitter50 ps typChannel-to-Channel Isolation 2 −82 dB typ f IN = 400 kHz Full Power Bandwidth 8.2 MHz typ @ 3 dB1.6 MHz typ @ 0.1 dB DC ACCURACY 2 Resolution12 Bits Integral Nonlinearity ±1LSB maxDifferential Nonlinearity −0.9/+1.5 LSB max Guaranteed no missed codes to 12 bits 0 V to REF IN Input RangeStraight binary output coding Offset Error±8 LSB max Typically ±0.5 LSB Offset Error Match ±0.5 LSB max Gain Error±1.5 LSB max Gain Error Match±0.5 LSB max0 V to 2 × REF IN Input Range−REF IN to +REF IN biased about REF IN with Positive Gain Error±1.5 LSB max Twos complement output coding Positive Gain Error Match ±0.5 LSB maxZero Code Error±8 LSB max Typically ±0.8 LSB Zero Code Error Match ±0.5 LSB max Negative Gain Error±1 LSB max Negative Gain Error Match ±0.5 LSB maxANALOG INPUTInput Voltage Ranges 0 to REF IN V RANGE bit set to 10 to 2 × REF IN VRANGE bit set to 0, AV DD /V DRIVE = 4.75 V to 5.25 V DC Leakage Current ±1 μA maxInput Capacitance 20 pF typ f SAMPLE = 200 kSPS REFERENCE INPUTREF IN Input Voltage 2.5 V±1% specified performance DC Leakage Current ±1 μA max REF IN Input Impedance 36 kΩ typLOGIC INPUTSInput High Voltage, V INH 0.7 × V DRIVE V min Input Low Voltage, V INL 0.3 × V DRIVE V maxInput Current, I IN±1 μA max Typically 10 nA, V IN = 0 V or V DRIVE Input Capacitance, C IN 310pF maxAD7927Data SheetRev. C | Page 4 of 28Parameter B Version 1 Unit Test Conditions/Comments LOGIC OUTPUTS Output High Voltage, V OH V DRIVE − 0.2 V min I SOURCE = 200 μA, AV DD = 2.7 V to 5.25 V Output Low Voltage, V OL 0.4 V max I SINK = 200 μA Floating-State Leakage Current ±1 μA max Floating-State Output Capacitance 3 10 pF max Output Coding Straight (Natural) Binary Coding bit set to 1 Twos Complement Coding bit set to 0 CONVERSION RATE Conversion Time 800 ns max 16 SCLK cycles with SCLK at 20 MHz Track-and-Hold Acquisition Time 300 ns max Sine wave input 300 ns max Full-scale step input Throughput Rate 200 kSPS max See Serial Interface section POWER REQUIREMENTS AV DD 2.7/5.25 V min/max V DRIVE 2.7/5.25 V min/max I DD 4 Digital inputs = 0 V or V DRIVE During Conversion 2.7 mA max AV DD = 4.75 V to 5.25 V, f SCLK = 20 MHz 2 mA max AV DD = 2.7 V to 3.6 V, f SCLK = 20 MHzNormal Mode (Static) 600 μA typ AV DD = 2.7 V to 5.25 V, SCLK on or off Normal Mode (Operational) f SAMPLE = 200 kSPS 1.5 mA max AV DD = 4.75 V to 5.25 V, f SCLK = 20 MHz 1.2 mA max AV DD = 2.7 V to 3.6 V, f SCLK = 20 MHz Using Auto Shutdown Mode f SAMPLE = 200 kSPS 900 μA typ AV DD = 4.75 V to 5.25 V, f SCLK = 20 MHz 650 μA typ AV DD = 2.7 V to 3.6 V, f SCLK = 20 MHz Auto Shutdown (Static) 0.5 μA max SCLK on or off (20 nA typ) Full Shutdown Mode 0.5 μA max SCLK on or off (20 nA typ)Power Dissipation 4Normal Mode (Operational) 7.5 mW max AV DD = 5 V, f SCLK = 20 MHz 3.6 mW max AV DD = 3 V, f SCLK = 20 MHz Auto Shutdown (Static) 2.5 μW max AV DD = 5 V 1.5 μW max AV DD = 3 V Full Shutdown Mode 2.5 μW max AV DD = 5 V 1.5 μW max AV DD = 3 V1 Temperature ranges as follows: B Version: −40°C to +85°C; W Version: −40°C to +125°C. 2See Terminology section. 3Sample tested @ 25°C to ensure compliance. 4See Power vs. Throughput Rate section.Data SheetAD7927Rev. C | Page 5 of 28TIMING SPECIFICATIONS 1AV DD = 2.7 V to 5.25 V , V DRIVE ≤ AV DD , REF IN = 2.5 V; T A = T MIN to T MAX , unless otherwise noted.1Sample tested at 25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of AV DD ) and timed from a voltage level of 1.6 V, (see Figure 2). The 3 V operating range spans from 2.7 V to 3.6 V. The 5 V operating range spans from 4.75 V to 5.25 V. 2Mark/space ratio for the SCLK input is 40/60 to 60/40. 3Measured with the load circuit of Figure 2 and defined as the time required for the output to cross 0.4 V or 0.7 × V DRIVE . 4t 8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 2. The measured number is then extrapolated back to remove the effects of charging or discharging the 50 pF capacitor. This means the time, quoted in the t 8 timing characteristics, is the true bus relinquish time of the part and is independent of the bus loading.1.6VTO OUTPUTPIN03088-002Figure 2. Load Circuit for Digital Output Timing SpecificationsAD7927Data SheetRev. C | Page 6 of 28ABSOLUTE MAXIMUM RATINGST A = 25°C, unless otherwise noted. Table 3.Parameter RatingAV DD to AGND −0.3 V to +7 VV DRIVE to AGND−0.3 V to AV DD + 0.3 V Analog Input Voltage to AGND −0.3 V to AV DD + 0.3 V Digital Input Voltage to AGND −0.3 V to +7 VDigital Output Voltage to AGND −0.3 V to AV DD + 0.3 V REF IN to AGND−0.3 V to AV DD + 0.3 V Input Current to Any Pin Except Supplies 1 ±10 mA Operating Temperature RangeCommercial (B Version) −40°C to +85°C Automotive (W Version) −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C TSSOP , Power Dissipation 450 mWθJA Thermal Impedance 143°C/W (TSSOP) θJC Thermal Impedance 45°C/W (TSSOP) Lead Temperature, SolderingVapor Phase (60 sec) 215°C Infrared (15 sec) 220°C ESD1.5 kV1Transient currents of up to 100 mA do not cause SCR latch-up.Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operationalsection of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.ESD CAUTIONData SheetAD7927Rev. C | Page 7 of 28PIN CONFIGURATION AND FUNCTION DESCRIPTIONSDIN AGND REF IN AV DD AV DD SCLK V IN 6V IN 7AGND V DRIVE DOUTAGND V IN 2V IN 1V INV IN 5V IN 4V IN 3AGND 03088-003CSFigure 3. 20-Lead TSSOP Pin ConfigurationAD7927Data SheetRev. C | Page 8 of 28TERMINOLOGYIntegral Nonlinearity (INL)INL is the maximum deviation from a straight line passing through the endpoints of the ADC transfer function. The end-points of the transfer function are zero scale, a point 1 LSB below the first code transition, and full scale, a point 1 LSB above the last code transition. Figure 9 shows a typical INL plot for the AD7927.Differential Nonlinearity (DNL)DNL is the difference between the measured and the ideal 1 LSB change between any two adjacent codes in the ADC. Figure 10 shows a typical DNL plot for the AD7927. Offset ErrorThis is the deviation of the first code transition (00 . . . 000) to (00 . . . 001) from the ideal, that is, AGND + 1 LSB.Offset Error MatchThis is the difference in offset error between any two channels. Gain ErrorThis is the deviation of the last code transition (111 . . . 110) to (111 . . . 111) from the ideal (that is, REF IN − 1 LSB) after the offset error has been adjusted out.Gain Error MatchThis is the difference in gain error between any two channels. Zero Code ErrorThis applies when using the twos complement output coding option, in particular to the 2 × REF IN input range with −REF IN to +REF IN biased about the REF IN point. It is the deviation of the midscale transition (all 0s to all 1s) from the ideal V IN voltage, that is, REF IN − 1 LSB.Zero Code Error MatchThis is the difference in zero code error between any two channels.Positive Gain ErrorThis applies when using the twos complement output coding option, in particular to the 2 × REF IN input range with −REF IN to +REF IN biased about the REF IN point. It is the deviation of the last code transition (011. . .110) to (011 . . . 111) from the ideal (that is, +REF IN − 1 LSB) after the zero code error has been adjusted out.Positive Gain Error MatchThis is the difference in positive gain error between any two channels.Negative Gain ErrorThis applies when using the twos complement output coding option, in particular to the 2 × REF IN input range with −REF IN to +REF IN biased about the REF IN point. It is the deviation of the first code transition (100 . . . 000) to (100 . . . 001) from the ideal (that is, −REF IN + 1 LSB) after the zero code error has been adjusted out.Negative Gain Error MatchThis is the difference in negative gain error between any two channels.Channel-to-Channel IsolationChannel-to-channel isolation is a measure of the level of crosstalk between channels. It is measured by applying a full-scale 400 kHz sine wave signal to all seven nonselected input channels and determining how much that signal is attenuated in the selected channel with a 50 kHz signal. The figure given is the worst case across all eight channels for the AD7927. Power Supply Rejection (PSR)Variations in power supply affect the full-scale transition, but not the converter’s linearity. Power supply rejection is the maximum change in full-scale transition point due to a change in power supply voltage from the nominal value (see the Typical Performance Characteristics section).Power Supply Rejection Ration (PSRR)The power supply rejection ratio is defined as the ratio of the power in the ADC output at full-scale frequency (f) to the power of a 200 mV p-p sine wave applied to the ADC AV DD supply of frequency (f S ):PSRR(dB ) = 10log(Pf/Pf S )where:Pf is equal to the power at Frequency f in ADC output. Pf S is equal to the power at Frequency f S coupled onto the ADC AV DD .Here a 200 mV p-p sine wave is coupled onto the AV DD supply. Figure 6 shows the power supply rejection ratio vs. supply ripple frequency for the AD7927 with no decoupling.Track-and-Hold Acquisition TimeThe track-and-hold amplifier returns into track mode at the end of conversion. Track-and-hold acquisition time is the time required for the output of the track-and-hold amplifier to reach its final value, within ±1 LSB, after the end of conversion.Data SheetAD7927Rev. C | Page 9 of 28Signal-to-(Noise + Distortion) Ratio (SINAD)This is the measured ratio of signal-to-(noise + distortion) at the output of the ADC. The signal is the rms amplitude of the fundamental. Noise is the sum of all nonfundamental signals up to half the sampling frequency (f S /2), excluding dc. The ratio is dependent on the number of quantization levels in the digiti-zation process; the more levels, the smaller the quantization noise. The theoretical signal-to-(noise + distortion) ratio for an ideal N-bit converter with a sine wave input is given bySignal-to-(Noise + Distortion) = (6.02N + 1.76)dB Thus, for a 12-bit converter, this is 74 dB. Figure 5 shows the signal-to-(noise + distortion) ratio performance vs. input fre-quency for various supply voltages while sampling at 200 kSPS with an SCLK of 20 MHz. Total Harmonic Distortion (THD)THD is the ratio of the rms sum of harmonics to the fundamental. For the AD7927, it is defined as:12625242322log20)dB (V V V V V V THD ++++=where:V 1 is the rms amplitude of the fundamental.V 2, V 3, V 4, V 5, and V 6 are the rms amplitudes of the second through the sixth harmonics.Figure 7 shows a graph of total harmonic distortion vs. analog input frequency for various supply voltages, and Figure 8 shows a graph of total harmonic distortion vs. analog input frequency for various source impedances (see the Analog Input section).AD7927Data SheetRev. C | Page 10 of 28TYPICAL PERFORMANCE CHARACTERISTICSFREQUENCY (kHz)0S N R (d B )10080604020103050709003088-004Figure 4. Dynamic Performance at 200 kSPS INPUT FREQUENCY (kHz)S I N A D (d B )03088-005Figure 5. SINAD vs. Analog Input Frequency for Various Supply Voltagesat 200 kSPS SUPPL Y RIPPLE FREQUENCY (kHz)0200P S R R (d B )–40–60–80–90100–20–50–7018016014012080604020–10–3003088-006Figure 6. PSRR vs. Supply Ripple FrequencyINPUT FREQUENCY (kHz)–5000101T H D (d B )–65–75–85–90–55–70–80–6003088-007Figure 7. THD vs. Analog Input Frequency for Various Supply Voltagesat 200 kSPS分销商库存信息:ANALOG-DEVICESAD7927BRUZ AD7927BRUZ-REEL AD7927BRUZ-REEL7 AD7927WYRUZ-REEL7AD7927BRU。
飞思卡尔9S12G系列单片机中文简介
飞思卡尔9S12系列单片机中文简介1.1介绍MC9S12G系列是一个专注于低功耗、高性能、低引脚数量的高效汽车级16位微控制器产品。
这个系列是桥连8位高端微机和16位高性能微机，像MC9S12XS系列。
MC9S12G系列是为了满足通用汽车CAN或LIN/J2602通信应用。
这些应用的典型例子包括body controllers, occupant detection, door modules, seat controllers, RKE receivers, smart actuators, lighting modules, and smart junction boxes.MC9S12G系列使用了许多MC9S12XS系列和MC9S12P系列里面的相同特性，包括在闪存（flash memory）上的纠错指令（ECC），一个快速A/D转换器（ADC）和一个为了改善电磁兼容性（EMC）性能的频率调制相位锁存循环(IPLL).MC9S12G系列是高效的对较低的程序存储器至16K。
为了简化顾客使用它，特制了一个4字节可擦除扇区的EEPROM。
MC9S12G系列传送所有16位单片机的优势和效率，定位于低成本，低功耗，EMC，现行代码尺寸效率优势被现存8位和16位单片机系列的使用者所分享。
像MC9S12XS系列，MC9S12G 系列运行16位位宽的访问对所有的周期和存储器状态都不用等待。
MC9S12G系列可得到的封装有100-pin LQFP, 64-pin LQFP, 48-pin LQFP/QFN, 32-pin LQFP and 20-pin TSSOP，特别是对较少引脚的封装发挥出最大的功能。
此外，在每个模块中可得到的Ｉ／Ｏ口，进一步的可用于中断的Ｉ／Ｏ口允许从停止或等待模式中唤醒。
1.2特点这部分说明了MC9S12G系列的关键特性。
1.2.1MC9S12G系列比较表1-1提供了MC9S12G系列不同型号特点的概要。
飞利浦HR7922厨师机用户手册说明书
HR7922User manual ZH-S 用户手册English1 ImportantCongratulations on your purchase and welcome to Philips! To fully benefit from the support that Philips offers, register your product at.Read this user manual carefully before you use the appliance and save it for future reference.Warning• Do not immerse the motor unit in water nor rinse it under the tap.• Before you connect the appliance to the power, make sure that the voltage indicated on the bottom of the appliance corresponds to thelocal power voltage.• Never connect this appliance to a timer switch, to avoid a hazardous situation.• Do not use the appliance if the power cord, the plug, protecting cover, or any other parts are damaged or has visible cracks.• If the power cord is damaged, you must have it replaced by Philips, a service center authorized by Philips, or similarly qualified persons toavoid a hazard.• This appliance can be used by persons with reduced physical, sensory or mental capabilities or lack of experience and knowledge if they have been given supervision or instruction concerning use of the appliance ina safe way and if they understand the hazards involved.• Children shall not play with the appliance.• This appliance shall not be used by children. Keep the appliance and its cord out of reach of children.• Never let the appliance run unattended.• Remove the beater, whisk or dough hook from your kitchen machine before washing.• If the bowl tools get stuck, unplug the appliance before you remove the ingredients that block the bowl tools.• If food sticks to the wall of mixing bowl, switch off the appliance and unplug it. Then use a spatula to remove the food from the wall.• Never stick or use your fingers or an object (for example, a spatula) into to the mixing bowl when using any of the bowl tools while theappliance is running.• Be careful if hot liquid is poured into the bowl, as it can be ejected out of the appliance due to a sudden steaming.• This appliance is intended for household use only.Caution• Always switch off and unplug the appliance if it is left unattended, and before assembling, disassembling, cleaning and changing accessories, or approaching parts that move in use.• Always switch off the appliance by turning the knob to 0.• Always wait until the moving parts stop running after switching off, then unplug the appliance before lifting the arm of the stand.• Do not exceed the maximum capacity as indicated. Follow the quantities, processing time and speed when using the kitchen machine tools, as indicated in the user manual.• Thoroughly clean the parts that come into contact with food before you use the appliance for the first time. Refer to the instructions and tablefor cleaning given in this manual.• Never use any accessories or parts from other manufacturers that Philips does not specifically recommend. If you use such accessories or parts,your guarantee becomes invalid.• Let hot ingredients cool down before processing them. Do not add ingredients 60ºC hotter than ambient temperature.• Certain ingredients such as carrots may cause discolorations on the surface of the parts. This does not have a negative effect on the parts.The discolorations usually disappear after some time.• In order to avoid a hazard due to inadvertent resetting of the thermal cut-out, this appliance must not be supplied through an externalswitching device, such as a timer, or connected to a circuit that isregularly switched on and off by the utility.• Noise level: Lc <= 85 dB [A]Electromagnetic fields (EMF)This Philips appliance complies with all standards regarding electromagnetic fields (EMF). If handled properly and according to the instructions in this user manual, the appliance is safe to use based on scientific evidence available today.RecyclingDo not throw away the product with the normal household waste at the endof its life, but hand it in at an official collection point for recycling. By doingthis, you help to preserve the environment.Follow your country's rules for the separate collection of electrical andelectronic products. Correct disposal helps prevent negative consequencesfor the environment and human health.2 Your kitchen machinea Motor head f Mains plugb Beater shaft g Tilt switchc Protective splash cover h Flat beaterd Mixing bowl i Whiske Speed selector j Dough hook0: off position1 - 12 (from low to high):speed settingsP: pulse setting3 ApplicationWarning•Do not stick knife, metal spoons, fork and so on into bowl whenoperating.•The speed selector must be at “0” position after use.•Unplug the the power cord before pulling out the beater, dough hookor whisk.•Do not process ingredient more than the MAX quantity in table 4•Do not add hard ingredients for mixing.Note•Clean all parts of the Kitchen Machine thoroughly before using it for thefirst time.•Make sure unplugged the power cord from the power outlet and turnthe speed selector to the “0” position before assembling the mixer.•Make sure the beater or dough hook or whisk is fully inserted into thesocket and locked firmly.1 Put the mains plug into the wall socket.• Ensure that the speed selector is at the “0” position.2 Add ingredients to mix.3 Turn the speed selector to the mixing speed you want.4 Turn the speed selector to “0” position and unplug the cord from wallsocket when mixing is completed.5 Press the tilt button.6 Scrape the excess food particles from the beaters or dough hooks byplastic spatula.• Use a spatula to aid the mixing by scraping the ingredients from thebowl’s wall.4 TroubleshootingThe flour/dry ingredients splash out during mixing• Use “Speed 1” at the beginning of mixing to minimize splashing.• Add splash guard before you add ingredients to avoid splashing.5 FAQsWhich tool should I use for kneading dough?• Use the kneading hook to knead dough.Which tool should I use for mixing cake batter, cookie batter, pastry, andmashing potato?• Use the beater to mix ingredients.Which tool should I use to whisk egg white or cream?• Use the whisk.Which speed should I use to knead dough?• Use Speed 1 to 4 for kneading dough.简体中文1 重要事项欢迎购买并使用飞利浦产品！为了您能充分享受飞利浦提供的支持，请在 上注册您的产品.使用本产品之前，请仔细阅读本用户手册，并妥善保管以备日后参考。
Mellanox WinOF-2 产品知识库说明书
Mellanox Technologies Mellanox WinOF-2 Known IssuesLast Updated: 01 March 2018Mellanox Technologies350 Oakmead Parkway Suite 100Sunnyvale , CA 94085U.S.A.Tel: (408) 970-3400Fax: (408) 970-3403© Copyright 2018. Mellanox Technologies Ltd. All Rights Reserved.Mellanox®, Mellanox logo, Accelio®, BridgeX®, CloudX logo, CompustorX®, Connect -IB®, ConnectX®, CoolBox®, CORE-Direct®, EZchip®, EZchip logo, EZappliance®, EZdesign®, EZdriver®, EZsystem®, GPUDirect®, InfiniHost®, InfiniBridge®, InfiniScale®, Kotura®, Kotura logo, Mellanox CloudRack®, Mellanox CloudXMellanox®, Mellanox Federal Systems®, Mellanox HostDirect®, Mellanox Multi-Host®, Mellanox Open Ethernet®, Mellanox OpenCloud®, Mellanox OpenCloud Logo®, Mellanox PeerDirect®, Mellanox ScalableHPC®, Mellanox StorageX®, Mellanox TuneX®, Mellanox Connect Accelerate Outperform logo , Mellanox Virtual Modular Switch®, MetroDX®, MetroX®, MLNX-OS®, NP-1c®, NP-2®, NP-3®, NPS®, Open Ethernet logo , PhyX®, PlatformX®, PSIPHY®, SiPhy®, StoreX®, SwitchX®, Tilera®, Tilera logo, TestX®, TuneX®, The Generation of Open Ethernet logo , UFM®, Unbreakable Link®, Virtual Protocol Interconnect®, Voltaire® and Voltaire logo are registered trademarks of Mellanox Technologies , Ltd.All other trademarks are property of their respective owners .For the most updated list of Mellanox trademarks, visit /page/trademarksNOTE:THIS HARDWARE, SOFTWARE OR TEST SUITE PRODUCT (“PRODUCT(S)”) AND ITS RELATED DOCUMENTATION ARE PROVIDED BY MELLANOX TECHNOLOGIES “AS -IS” WITH ALL FAULTS OF ANY KIND AND SOLELY FOR THE PURPOSE OF AIDING THE CUSTOMER IN TESTING APPLICATIONS THAT USE THE PRODUCTS IN DESIGNATED SOLUTIONS. THE CUSTOMER'S MANUFACTURING TEST ENVIRONMENT HAS NOT MET THE STANDARDS SET BY MELLANOX TECHNOLOGIES TO FULLY QUALIFY THE PRODUCT(S) AND/OR THE SYSTEM USING IT . THEREFORE, MELLANOX TECHNOLOGIES CANNOT AND DOES NOT GUARANTEE OR WARRANT THAT THE PRODUCTS WILL OPERATE WITH THE HIGHEST QUALITY. ANY EXPRESS OR IMPLIED WARRANTIES , INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY , FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT ARE DISCLAIMED. IN NO EVENT SHALL MELLANOX BE LIABLE TO CUSTOMER OR ANY THIRD PARTIES FOR ANY DIRECT, INDIRECT, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES OF ANY KIND (INCLUDING, BUT NOT LIMITED TO, PAYMENT FOR PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY FROM THE USE OF THE PRODUCT(S) AND RELATED DOCUMENTATION EVEN IF ADVISED OF THE POSSIBILITY OF SUCHDAMAGE.Doc #: N/A 2Mellanox TechnologiesRev 1.03Mellanox Technologies Table of ContentsTable of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3List Of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Chapter 1 Archived Known Issues . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Rev 1.04Mellanox Technologies List Of TablesTable 1:Archived Known Issues . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5Archived Known Issues Rev 1.05Mellanox Technologies 1Archived Known IssuesThe following table describes archived known issues in the former releases on WinOF-2.Table 1 - Archived Known Issues (Sheet 1 of 5)Internal Ref.Issue1121688Description: Mellanox WinOF-2 Device Diagnostics and Mellanox WinOF-2 PCI Device Diag-nostics counters in Perfmon are available only on the adapter that was initialized first, which is thecounters’ owner.In case both adapters are viewed in Perfmon:1. The owner will receive correct values, while the second adapter will only receive zeros.2. If the owner goes down, the ownership will move to the second adapter.Workaround : N/AKeywords: WinOF-2 Device Diagnostics, Mellanox WinOF-2 PCI Device Diagnostics, Perfmon,ownershipDetected in version: 1.70.0.1961251Description: On a dual port device, when the first port is IPoIB and the second port is Ethernet, thedevice will not start over iSCSI and Windows 2012 in the Ethernet port.Workaround : N/AKeywords: IPoIB port, Ethernet port, ISCSI, Windows 2012Detected in version: 1.701000390Description: Configuring a different RoCE mode between VF and PF is not supportedWorkaround : N/AKeywords: RoCE, VF, PFDetected in version: 1.70917856Description: All folders under %PROGRAMFILES%Mellanox\MLNX_WINOF2 are deleted incase of upgrade failure. The old driver remains, and no connectivity loss should occur. The issueoccurs only when the upgrade fails after the old version was removed.Workaround : Following the upgrade failure, reinstall the new package folder.Keywords: Installation, setup, missing foldersDetected in version: 1.70915981Description: On IPoIB adapters, the network adapter and task manager network counters count allport traffic when only non-RDMA traffic should be shown.Workaround : N/AKeywords: IPoIB, counters, RDMADetected in version: 1.60939227Description: When upgrading from WinOF-2 1.50 to 1.60 or later, the MAC address used for theIPoIB interface changes.Workaround : N/AKeywords: IPoIB, MAC addressDetected in version: 1.60Rev 1.06Mellanox Technologies 928999Description: When installing a new driver, driver version queries via WMI may not be up-to-date,due to information caching in the WMI service.Workaround : Stop and restart the WMI service, running the following CMD commands:net stop winmgmtnet start winmgmtKeywords: Driver version queries, WMI, information cachingDetected in version: 1.60964973Description: SRQ limit event is not supported in the ND and NDK RDMA programming inter-faces.Workaround : N/AKeywords: SRQ, ND, NDK RDMADetected in version: 1.60900928Description: The packet sniffer is currently not supported in InfiniBand mode.Workaround : N/AKeywords: InfiniBand, packet snifferDetected in version: 1.50-Description: The installation process or restart of the driver does not close any RoCE userspace applications running in the background, and may cause a bug check as a result of a stuckcmdWorkaround : It is recommended to close all running RoCE user space applications prior toupgrading the driver.Keywords: Installation/Upgrade-Description: Installation/upgrade fails due to PNP failure to copy the driver files to the driverstore, and the following text is printed in the event logs: Fault bucket, type 0Event Name: PnPDriverImportError Response: Not availableAttached Files: C:\Users\<user>\AppData\Local\Temp\DMI151A.tmp.log.xmlC:\Program Files\Mellanox\ MLNX_WinOF2\Drivers\”Current OS”\mlx5.infWorkaround : Reboot the machine and reinstall.Keywords: Installation/Upgrade-Description: Installing both WinOF for ConnectX-3 and ConnectX-3 Pro, and WinOF-2 forConnectX-4 is supported only from WinOF version 5.00 and above.Workaround : N/AKeywords: Installation/UpgradeTable 1 - Archived Known Issues (Sheet 2 of 5)Internal Ref.IssueArchived Known Issues Rev 1.07Mellanox Technologies 654674Description: When trying to uninstall the mlx5 driver manually (by using pnputil/DPINST orDIFX API), additional hardware scan will be required before viewing the device in the DeviceManager or before reinstalling.This used to happen due to a bug in the NetCfgx.dll.(Microsoft case ID is: 115020112345121).Workaround : Rescan the hardware after performing the uninstallation.Keywords: Installation/Upgrade650489Description: While installing the driver on Windows Server 2012, and if SR-IOV mode isdisabled in the BIOS and enabled in the firmware, the server might reboot, and the BIOS willhang while loading.Workaround : To work in SR-IOV mode, enable SR-IOV in BIOS. Otherwise, disable SR-IOV in the firmware using mlxconfig.For further information on how to enable/disbale SR-IOV, please refer to the “Single Root I/OVirtualization (SR-IOV)” section in the User Manual.Keywords: Installation/Upgrade-Description: On machines configured with NVGRE encapsulation with the encapsulation taskoffload enabled, incoming VXLAN traffic on the interface may be reported with wrong check-sum status.Workaround : N/AKeywords: Virtualization-Description: Running Ntttcp without the “-a X” flag (X >1) in a NIC configured with10GbE may cause low bandwidth in TCP single streamWorkaround : Run Ntttcp with “-a 8” for best performanceKeywords: Performance-Description: RDMA read on single QP 100GbE RoCE cannot achieve more than 50Gb/s.Workaround :•Use more than one QP•Use Jumbo packets (4K)Keywords: Performance576556Description: “TCP RSC Average Packet Size” counter under network adapter does not countcorrectly. This is a known operating system issue.Workaround : N/AKeywords: GeneralWorkaroundTable 1 - Archived Known Issues (Sheet 3 of 5)Internal Ref.IssueRev 1.08Mellanox Technologies 683840Description: In Windows Server 2016, the following RDMA counters for VPorts that werecreated to use RDMA capability will show statistics for all the VPorts connected to the sameinterface and not for a specific VPort:•RDMA Inbound Bytes/sec•RDMA Inbound Frames/sec•RDMA Outbound Bytes/sec•RDMA Outbound Frames/secWorkaround : N/AKeywords: RDMA786035Description: Running applications on top of MS MPI may result in failure.Workaround : N/AKeywords: RDMA877750Description: Occasionally, the adapter card shows an error of duplicate IPv4 address whendisabling and enabling the adapter through Device Manager.Workaround : Reboot the machine instead of disabling and enabling it in the Device Manager.Keywords: Device Manager, IPv4825154Description: Mellanox WinOF-2 Device Diagnostic and PCI Device Diagnostic countersreported in PerfMon are per device. The counters that are reported per adapter under these setsshow the counters for all the devices and not only for the specific adapter.Workaround : N/AKeywords: perfmon, counters894614Description: The nd_*_bw and nd_*_lat tools do not work on Windows server 2012, Win-dows 8.1 and Windows Server 2012 R2. An error message appears, notifying that the api-ms-win-crt.dll is missing.Workaround : Windows update kb2999226 must be downloaded and installed, in order toobtain the universal c run time dlls. To download the update, go to https://support.micro-/en-us/kb/2999226.To verify that the update is installed, run the following powershell command:get-hotfix -id kb2999226Keywords: nd tools, Windows 2012, Windows 2012 R, missing dll, Universal C Runtime899853Description: Uninstallation of the driver does not reset all network adapter configurations tothe default values.Workaround : Upon completion of the uninstallation process, run the following powershellcommand for each network adapter, while replacing <AdapterName> with the name of the rel-evant network adapter:Reset-NetAdapterAdvancedProperty -Name "<AdapterName>" -DisplayName"*"Keywords: Uninstallation, network adapter configurations, Windows Server 2016, Windows10Table 1 - Archived Known Issues (Sheet 4 of 5)Internal Ref.IssueArchived Known Issues Rev 1.09Mellanox Technologies 778631Description: IB utils are currently not a part of the WinOF-2 packageWorkaround : Fabric diagnostic can be done from a managed switch or a different node in the fabric with IB utils support.Keywords: InfiniBand, IB utils, fabric diagnosticTable 1 - Archived Known Issues (Sheet 5 of 5)Internal Ref.Issue。
创佳彩电产品介绍按功能
创佳彩电产品介绍按产品功能介绍USB电影播放功能：创佳电视32HME5000 X12创佳电视42LWE6300 F1创佳电视19HDE3000 V6创佳电视32HME8000 R35创佳电视22HZE9000 C68创佳电视32HZE9000 C68创佳电视19HZE9000 C68创佳电视26HZE9000 C68创佳电视32LME7000 T25创佳电视43HPD6000 K91创佳电视40HZE9000 C68创佳电视46HZE9000 C68创佳电视32LME8800 E6创佳电视51HPD6000 K91创佳电视22HDE3000 V655HZE9000 C6839HWE6300 F1创佳电视32HDE3000 V6创佳电视40LME8800 E6互联网电视功能：创佳电视32HME5000 X12创佳电视32LME8800 E6创佳电视40LME8800 E6电视/显示屏两用功能：创佳电视32HME5000 X12创佳电视19HDE3000 V6创佳电视22HZE9000 C68创佳电视32HZE9000 C68创佳电视32LME7000 T25创佳电视40HZE9000 C68创佳电视46HZE9000 C68创佳电视32LME8800 E6创佳电视22HDE3000 V6创佳电视 55HZE9000 C68创佳电视32HDE3000 V6创佳电视40LME8800 E6超窄边电视功能：创佳电视42LWE6300 F1创佳电视32HME8000 R35创佳电视32LME7000 T25创佳电视39HWE6300 F1内容总结。
HP Sure Recover L49622-001 2018年版 产品说明书
HP Sure RecoverA comprehensive, flexible recovery solution for HPElite computersMinimize downtime via an automated operating system recovery solution integrated into HP computer hardware and firmware. HP Sure Recover enables you to quickly recover the operating system whenever needed, throughout the lifecycle of the computer. HP Sure Recover succeeds even if the primary drive has been completely erased.The need for cyber-resilient computers Cyberattacks continue to grow at an incredible pace. Reports of cybersecurity breacheshave become commonplace, even impacting companies that deploy state-of-the-artdefenses. Defenses against these types of attacks are an absolute necessity, but given the increasing sophistication of the attackers and the growing number of breaches, additional strategies are needed.Cyber-resilience is an emerging strategy that is rapidly gaining acceptance in business and the public sector. Cyber-resilience is defined as the ability to prepare for and adapt to changing conditions in order to recover rapidly from disruptions to IT systems or critical infrastructure. One of the core principles of cyber-resilience is to recognize up front that hackers may launch a successful attack against you. Cyber-resilient systems are designed to include mechanisms to enable rapid recovery to a working and secure state after such an attack.A cyber-resilient computer is designed to quickly and automatically recover itself to a working state, even from unforeseen attacks that bypass existing protections and inject malicious software and/or firmware into the target platform.This kind of attack may also attempt to render the computer inoperable by removing or corrupting software and/or firmware on the device. To thwart such attempts by malware, the ideal solution must be designed to function independently of the operating system and of any software stored on the mass storage device.Beyond attack responses, cyber-resilient computers can also optimize standard processes that can be pain points for IT administrators and individual users. The operating system may need to be restored for reasons other than malware or corruption —such as initial system installations, or to reset the system drive before a device is re-provisioned for another user. In a public environment —for example, a hotel or grocery store —theadministrator may want to schedule regular reimaging of all devices to help keep the OS image in a clean state.In all these examples, manually restoring the OS can be a time-intensive process. An automatic, easy-to-use recovery process can save time for administrators of large fleets of computers. And for the end user, a straightforward, quick and reliable mechanism to recover or reset the operating system can be the difference between a momentary outage or days of downtime.HP SURE RECOVER REQUIREMENTS HP Sure Recover is available on HP Elite computers with 8th generation Intel® or AMD processors and requires an open, wired network connection. HP Sure Recover with Embedded Reimaging is available on select HP Elite computers with 8th generation Intel processors. You must back up important files, data, photos, videos, etc. before using either version of HP Sure Recover to avoid lossof data.Not available on computers with multipleinternal storage drives or Intel Optane TM .HP Sure Recover helps make computers cyber-resilientHP Sure Recover is a PC OS recovery solution built into the hardware and firmware that can fully recover the HP OS image without requiring that recovery software be present on the machine. HP Sure Recover supports recovery using a network connection. Some devices have additional embedded storage on the motherboard to support recovery in an offline state (not connected to a network). This configuration is called HP Sure Recover with Embedded Reimaging. The embedded storage is unique from other technologies in that it is hardware-isolated from the host operating system to disallow unauthorized change.HP Sure Recover is enabled by default and can be started manually by pressing the F11 key at boot, or it can be configured to trigger automatically. HP Sure Recover is configured by default to restore from Windows® 10 image and device driver repositories that are hosted by HP and accessible via the public Internet. During the recovery process, HP Sure Recover utilizes strong public key cryptography to verify both the identity of the recovery image’s pro vider and the integrity of the images themselves.HP Sure Recover with Embedded Reimaging benefits the local user with a shorter recovery time, since there is a local copy of the Windows 10 image and device driver already on the computer. This shortens the recovery process by removing the need to first download the image from the network. Additionally, local users benefits by having recovery capability when they are in a location without a wired connection to the public Internet. HP recommends not distributing secrets within custom images, as HP currently does not offer the capability to securely erase the contents of the local embedded storage device.HP Sure Recover with Embedded Reimaging also utilizes strong public key cryptography to verify the integrity of the image on the local embedded storage device. HP Sure Recover with Embedded Reimaging can be configured to determine if there is a newer version of the image online and refresh the local image.Alternatively, HP Sure Recover can be configured to use custom images hosted on an internal private network or the public Internet. Additionally, the HP Sure Recover configuration can be managed either locally or remotely, with the HP Sure Recover configuration for each computer protected in the isolated, non-volatile memory of the HP Endpoint Security Controller hardware.HP Sure Recover can be used by an administrator or the user to easily restore the system to the desired state, quickly installing the latest version of the operating system, platform-specific device drivers, and (in the case of a custom image) software applications.All HP computers that support HP Sure Recover also support HP Sure Start, HP’s industry-leading firmware security-and-resiliency solution that meets or exceeds the National Institute of Standards Technology (NIST) Platform Firmware Resiliency guidelines (Special Publication 800-193). Building on the resilient firmware foundation provided by HP Sure Start, HP computers with HP Sure Recover for the OS are extremely cyber-resilient. Regardless of whether you want to perform custom operating system installations, recover from destructive malware, reset the system drive to the desired state prior to computer redeployment, or automatically re-image on a regular schedule, HP’s cyber-resilient computers with HP Sure Recover are the right solution.When an image recovery is triggered, the HP Sure Recover policies stored in the HP Endpoint Security Controller are deployed through the BIOS to download the recovery image from the proper repository and install it on the system hard drive.Figure 1: Image recovery process (with download)Alternatively, when an image recovery is triggered with Embedded Reimaging in use, the HP Sure Recover policies stored in the HP Endpoint Security Controller are deployed through the BIOS to install it the recovery image on the system hard drive from its onboard repository.Figure 2: Image recovery process (with embedded reimaging)Flexible and customizable managementHP Sure Recover can be started manually by an end user, or it can be configured to trigger automatically:•When no OS is found on the hard drive•When Sure Run determines that the platform is out of compliance•On a scheduleHP Sure Recover is enabled by default but can be disabled by the local user via F10 setup or the HP Client Security Manager Software that is pre-installed in the HP image. HP Client Security Manager can also be used to manage policies locally. Alternatively, HP Sure Recover can be securely enabled and configured remotely using the HP Manageability Integration Kit (MIK) for Microsoft® System Center Configuration Manager (SCCM). Images can be installed from HP repositories or from custom image repositories managed by the system administrator in either the public or private cloud. Custom images can be created with standard tools such as the Windows Assessment and Deployment Kit (Windows ADK).The process for creating custom images is simple: use the Windows ADK to create an image in a Windows IMaging (WIM) format file, create a manifest containing a version header, the sha256sum hash of the image, its filename, and its file size in bytes, then sign the manifest with your private key. Place the image, manifest, and signature file in a public or private cloud repository, and then provision the system with the location of the image repository and corresponding public key.HP Sure Recover can be configured remotely via the HP MIK plugin. Figure 3: Remote configurationLocal users can configure HP Sure Recover using the HP Client Security Manager. Remote server WindowsHP MIK agent Microsoft SCCMHP Sure Recover configuration HP Sure Recover configurationHP EndpointSecurity ControllerHP MIK plugin for SCCMProtected non-volatile storageRemote Administrator HP Sure Recover configurationHP EndpointSecurity ControllerProtected non-volatile storageWindowsHP Client Security ManagerHP Sure RecoverFigure 4: Remote configurationLocal UserConclusionNo matter the reason you need to restore the operating system, HP Sure Recover makes the process simple. Count on hardware-based platform resiliency throughout the lifecycle of the computer, from initial provisioning through end-of-life deprovisioning.Learn more:/go/computersecurityTechnical content:/us-en/topic/goIT.© Copyright 2018 HP Development Company, L. P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Intel is a trademark of Intel Corporation or its subsidiaries in the U.S. and/or other countries. AMD is a trademark of Advanced Micro Devices, Inc.。
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Automotive Plug-In / PC B Power Relay
FEATURES
Most popular automotive relay
1 A and 1 C contact forms ava ilable
40 Amps continuous carrying c apacity
Contact switching capacity up to 120 Amps Up to 125 degrees C operating temperature Internal diodes or resisto rs available
PC792A
Max. Switching Voltage 75 VDC
1 Form A or 1 Form C
CONTACT RATINGS
CHARACTERISTICS
Operate Time 7 ms. typical Release Time Insulation Resistance 5 ms. typical
100 megohms min, at 500VDC, 50%R H Dielectric Strength 500 Vrms, 1 min. between coil and contacts Shock Resistance 20 g, 11ms, functional; 200 g, destructive
Vibration Resistance Power Consumption 1.6 W approx.
Ambient Temperature Range -40 to 85 degrees C operating, -40 to 125 degrees C for Class F Weight
31 grams approx.
ORDERING INFORMATION
Example:
PC792A Model
-12Sockets available from Picker C omponents
Parallel Component
-1C CONTACT DATA
Material
Initial Contact Resistance Service Life
Mechanical Electrical
AgSnInO (Silver Tin Indium Oxide)100 milliohms max @ 0.1A, 6VDC 1 X 107
2 X 105Operations Operations
Normally Open Nil: None; D: Diode; R: Resistor; N: N ickle Plated Terminals
Coil Voltage
-C1Contact Form
Max Switching Current Break 40 Amps
Make 120 Amps 60 Amps (at 20 degrees C)Max. Continuous Current Minimum Load
0.1 A @ 12 VDC
-RN
Drop Resistance 1 Meter height drop on concrete in final enclosu re Normally Closed Break 30 Amps
Make 45 Amps 40 Amps (at 20 degrees C)Case Style
C: Plug-In; P: PCB; C1: Plastic Bracket; C 2: Metal Bkt DA 1.27 mm, 10 - 40 Hz; 40-70 Hz: 5 g; DA 0.5mm, 70-100 Hz; 100-500 Hz: 10 g.S Enclosure
C: Dust Cover, S: Sealed Case
Contact Form
1A, 1C or 1U (1 form A with 2 #87 Termin als) 40 Amps (at 85 degrees C)
30 Amps (at 85 degrees C)
PC792A
PC792A
REFERENCE CURVES
COIL DATA
Coil Voltage
624
Resistance
ohms + 10%
Must Operate
Voltage Max.
(VDC)Must Release Voltage Min.
(VDC)Continuous Voltage Max.
(VDC)2290330
7.214.3
1.2
2.4
20.539.1
_ 3.60.610.112(17.9)
.705(8.4)
.331(16.9)
.665(8.0)
.31587
87A
3085
86
(17.9)
.705(8.4)
.331(16.9)
.665(8.0)
.31587
87A 30
85
86
(1.2 X 2.4).047 X .094All Holes
30
85Wiring Diagrams
30
85Form 1U
Form 1A
Form 1C
Dimensions in Inches (millimet ers)Plug-In Type
Bottom View PC Board Layout
Tolerances +.010 unless otherwise noted
Notes:
Maximum make current refers to inrush of a lamp load In 85 degree C ambient reduce maximum coil volt age to 72%
Plug-In Case (C) and PCB Case (P)
(24.5)
.965(26.5)
1.04(26.5)
1.04(6.3)
.250(11.5)
.453(0.8)
.03150
55606570758085909510011
12131415161718
AT 20 C
o
AT 85 C
o
AT 125 C
o
Coil Temp Rise Contacts Carrying 40A
T e m p e r a t u r e R i s e C
o
40506070809010011
12131415161718
20A
30A 35A 40A Coil Temp Rise
Ambient Temp 20 C
o
C o i l T e m p e r a t u r e R i s e C
o
Coil Applied Voltage
Coil Applied Voltage
1210203530501001
23101005203050N.O. Contact N.C. Contact
Maximum Switching Capacity at 85 C Arc Extinguished Resistive Loads
Switching Voltage(VDC)
S w i t c h i n g C u r r e n t (A m p s )
o
PC792A PC792A
(22.0)
.866
(16.0)
.630
(24.5)
.965
(6.0)
.236
(6.4)
.252 Dia.
(26.5)
1.04
(26.5)
1.04
(4.2)
.165
(26.5)
1.04
(26.5)
1.04
(16.0)
.630
(24.5)
.965
(15.0)
.591
(6.0)
.236
(5.3)
.210 Dia.
(4.6)
.181
(13.3)
.524
(18.0)
.709
(7.0)
.275
.252 Dia.
(6.4)
(20.6)
.811
(45.3)
1.78
(36.0)
1.42
(36.0)
1.42
(10.4)
.409
Molded Plastic Bracket (C1)
Bent Metal Bracket (C3)
Metal Bracket (C2)
Skirted Case with Metal Bracke t (C4)
Skirted Case with Bent Metal B racket (C5)。