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EFR32xG24 2.4 GHz 10 dBm 无线极度芯片开发板参考手册说明书

EFR32xG24 2.4 GHz 10 dBm Radio Board BRD4186C Reference ManualThe BRD4186C Radio Board is an excellent starting point to get familiar with theEFR32™ Wireless Gecko Wireless System-on-Chip. The board enables developers to develop smart home, lighting, building automation, and AI/ML applications. It is opti-mized for operating in the 2.4 GHz band at 10 dBm output power. Radiated and conduc-ted testing is supported with the on-board printed antenna and UFL connector.The BRD4186C Radio Board is a plug-in board for the Wireless Starter Kit Mainboard (BRD4001A) and the Wireless Gecko Pro Kit Mainboard (BRD4002A) that gives access to debug interface, Virtual COM port, packet trace, display, buttons, LEDs, and addition-al features from expansion boards. With the supporting Simplicity Studio suite of tools, developers can take advantage of graphical wireless application development and visu-al energy profiling and optimization. The board also serves as a reference design for the EFR32xG24 Wireless SoC with matching network and a PCB antenna optimized for op-erating at 10 dBm output power in the 2.4 GHz band.RADIO BOARD FEATURES •Wireless SoC:EFR32MG24B210F1536IM48•CPU core: ARM® Cortex®-M33•Flash memory: 1536 kB•RAM: 256 kB•Operation frequency: 2.4 GHz•Transmit power: 10 dBm•Integrated PCB antenna, UFL connector(optional)•Crystals for LFXO and HFXO: 32.768 kHzand 39 MHz•8 Mbit low-power serial flash for over-the-air updatesThis document contains a brief introduction and description of the BRD4186C RadioBoard features, focusing on the RF sections and performance.Table of Contents1. Introduction (4)2. Radio Board Connector (5)2.1 Introduction (5)2.2 Radio Board Connector Pin Associations (5)3. Radio Board Block Summary (6)3.1 Introduction (6)3.2 Radio Board Block Diagram (6)3.3 Radio Board Block Description (6)3.3.1 Wireless MCU (6)3.3.2 LF Crystal Oscillator (LFXO) (6)3.3.3 HF Crystal Oscillator (HFXO) (6)3.3.4 Matching Network for 2.4 GHz (7)3.3.5 UFL Connector (7)3.3.6 Radio Board Connectors (7)3.3.7 Inverted-F Antenna (7)3.3.8 Serial Flash (7)3.3.9 Serial EEPROM (7)4. RF Section (8)4.1 Introduction (8)4.2 RF Section Schematic (8)4.2.1 2.4 GHz RF Matching Description (8)4.3 Bill of Materials for the 2.4 GHz Matching Network (8)4.4 Inverted-F Antenna (9)5. Mechanical Details (10)6. EMC Compliance (11)6.1 Introduction (11)6.2 EMC Regulations for 2.4 GHz (11)6.2.1 ETSI EN 300-328 Emission Limits for the 2400-2483.5 MHz Band (11)6.2.2 FCC15.247 Emission Limits for the 2400-2483.5 MHz Band (11)6.2.3 Applied Emission Limits for the 2.4 GHz Band (11)7. RF Performance (12)7.1 Conducted Power Measurements (12)7.1.1 Conducted Power Measurements with Unmodulated Carrier (12)7.1.2 Conducted Power Measurements with Modulated Carrier (13)7.2 Radiated Power Measurements (13)7.2.1 Maximum Radiated Power Measurements (14)7.2.2 Antenna Pattern Measurements (14)8. EMC Compliance Recommendations (15)8.1 Recommendations for 2.4 GHz ETSI EN 300-328 Compliance (15)8.2 Recommendations for 2.4 GHz FCC 15.247 Compliance (15)9. Board Revision History (16)10. Errata (17)11. Document Revision History (18)Introduction 1. IntroductionThe BRD4186C Radio Boards provide a development platform (together with the Wireless Starter Kit Mainboard or the Wireless Pro Kit Mainboard) for the Silicon Labs EFR32MG24 Wireless System-on-Chips and serve as reference designs for the matching network of the RF interface.The BRD4186C Radio Board is designed to operate in the 2400-2483.5 MHz band with the RF matching network optimized for operat-ing at 10 dBm output power.To develop and/or evaluate the EFR32 Wireless Gecko, the BRD4186C Radio Board can be connected to the Wireless Starter Kit Mainboard or the Wireless Pro Kit Mainboard to get access to debug interface, Virtual COM port, packet trace, display, buttons, LEDs, and additional features from expansion boards, and also to evaluate the performance of the RF interface.2. Radio Board Connector2.1 IntroductionThe board-to-board connector scheme allows access to all EFR32MG24 GPIO pins as well as the RESETn signal. For more informa-tion on the functions of the available pins, see the EFR32MG24 data sheet.2.2 Radio Board Connector Pin AssociationsThe figure below shows the mapping between the connector and the EFR32MG24 pins and their function on the Wireless Starter Kit Mainboard.GND F9 / PA00 / VCOM_RTS 3v3JOYSTICK* / PD02* / P36P200Upper RowNC / P38NC / P40DBG_TDO_SWO / TRACED0 / PA03 / P42TRACED2 / PA06 / P44DBG_TMS_SWDIO / PA02 / F0DISP_ENABLE / PC09 / F14UIF_BUTTON0 / PB01 / F12UIF_LED0 / PB02 / F10VCOM_CTS / PB05 / F8DBG_RESET / RESETn / F4DBG_TDO_SWO / TRACED0 / PA03 / F2DISP_SI / PC01 / F16VCOM_TX / PA08 / F6PTI_DATA / PD04 / F20DISP_EXTCOMIN / PC06 / F18USB_VBUS5VBoard ID SCLGNDBoard ID SDAUSB_VREG F7 / PA09 / VCOM_RX F5 / PB00 / VCOM_ENABLE F3 / PA04 / DBG_TDI / TRACECLK F1 / PA01 / DBG_TCK_SWCLK P45 / PA07 / TRACED3P43 / PA05 / TRACED1P41 / PA04 / DBG_TDI / TRACECLK P39 / NCP37 / NC F11 / PB04 / UIF_LED1F13 / PB03 / UIF_BUTTON1F15 / PC03 / DISP_SCLK F17 / PC08 / DISP_SCS F19 / PD05 / PTI_SYNC F21 / NC GNDVMCU_INVCOM_CTS / PB05 / P0P201Lower RowVCOM_RTS / PA00 / P2TRACED1 / PA05 / P4JOYSTICK* / PD02* / P6GNDVRF_INP35 / PC04P7 / PC00P5 / PC03 / DISP_SCLK P3 / PC02P1 / PC01 / DISP_SI P33 / PC06 / DISP_EXTCOMIN P31 / PC08 / DISP_SCSP29 / PC09 / DISP_ENABLE P27 / NCP25 / PD04 / PTI_DATA P23 / NCP21 / PB03 / UIF_BUTTON1P19 / PB02 / UIF_LED0P17 / PB01 / UIF_BUTTON0P15 / PB00 / VCOM_ENABLE P13 / PC07P11 / PA09 / VCOM_RX P9 / PA08 / VCOM_TX NC / P34NC / P32NC / P30NC / P28UIF_LED1 / PB04 / P26PTI_SYNC / PD05 / P24NC / P22DBG_TCK_SWCLK / PA01 / P20DBG_TMS_SWDIO / PA02 / P18DBG_TDO_SWO / TRACED0 / PA03 / P16DBG_TDI / TRACECLK / PA04 / P14PC05 / P12TRACED3 / PA07 / P10TRACED2 / PA06 / P8 *Mutually exclusive connections. Default: PD02 to P6.Figure 2.1. BRD4186C Radio Board Connector Pin MappingRadio Board Connector3. Radio Board Block Summary3.1 IntroductionThis section introduces the blocks of the BRD4186C Radio Board.3.2 Radio Board Block DiagramThe block diagram of the BRD4186C Radio Board is shown in the figure below.Figure 3.1. BRD4186C Block Diagram3.3 Radio Board Block Description3.3.1 Wireless MCUThe BRD4186C Radio Board incorporates an EFR32MG24B210F1536IM48 Wireless System-on-Chip featuring 32-bit Cortex®-M33 core, 1536 kB of flash memory, 256 kB of RAM, and a 2.4 GHz band transceiver with output power up to 10 dBm. For additional infor-mation on the EFR32MG24B210F1536IM48, refer to the EFR32MG24 data sheet.3.3.2 LF Crystal Oscillator (LFXO)The BRD4186C Radio Board has a 32.768 kHz crystal mounted. For details regarding the crystal configuration, refer to application note AN0016.2: Oscillator Design Considerations.3.3.3 HF Crystal Oscillator (HFXO)The BRD4186C Radio Board has a 39 MHz crystal mounted. For details regarding the crystal configuration, refer to application note AN0016.2: Oscillator Design Considerations.3.3.4 Matching Network for 2.4 GHzThe BRD4186C Radio Board incorporates a 2.4 GHz matching network which connects the 2.4 GHz RF input/output of the EFR32MG24 to the one on-board printed Inverted-F antenna. The component values were optimized for the 2.4 GHz band RF perform-ance and current consumption with 10 dBm output power.For a detailed description of the matching network, see section 4.2.1 2.4 GHz RF Matching Description.3.3.5 UFL ConnectorTo be able to perform conducted measurements, Silicon Labs added a UFL connector to the Radio Board. The connector allows an external 50 Ohm cable or antenna to be connected during design verification or testing.Note: By default, the output of the matching network is connected to the printed inverted-F antenna by a series 0 Ohm resistor. To support conducted measurements, or the connection of an external antenna, the option to connect the output to the UFL connector is available. If using this option, move the series 0 Ohm resistor to the antenna to the series resistor to the UFL connector (see section 4.2.1 2.4 GHz RF Matching Description for further details). On the layout, the footprints of these two resistors have overlapping pads to prevent simultaneous connection of the antenna and the UFL connector.3.3.6 Radio Board ConnectorsTwo dual-row, 0.05” pitch polarized connectors make up the BRD4186C Radio Board interface to the Wireless Starter Kit Mainboard. For more information on the pin mapping between the EFR32MG24B210F1536IM48 and the connectors, refer to section 2.2 Radio Board Connector Pin Associations.3.3.7 Inverted-F AntennaThe BRD4186C Radio Board includes a printed inverted-F antenna (IFA) tuned to have close to 50 Ohm impedance at the 2.4 GHz band.For a detailed description of the antenna, see section 4.4 Inverted-F Antenna.3.3.8 Serial FlashThe BRD4186C Radio Board is equipped with an 8 Mbit Macronix MX25R SPI flash that is connected directly to the EFR32MG24 to support over-the-air (OTA) updates. For additional information on the pin mapping, see the BRD4186C schematic.3.3.9 Serial EEPROMThe BRD4186C Radio Board is equipped with a serial I2C EEPROM for board identification and to store additional board-related infor-mation.4. RF Section4.1 IntroductionThis section gives a short introduction to the RF section of the BRD4186C Radio Board.4.2 RF Section SchematicBRD4186C Radio Board RF section schematic is shown in the following figure.2.4 GHz Matching Path SelectionInverted-F AntennaAntenna Tuning High Frequency Figure 4.1. BRD4186C RF Section Schematic4.2.1 2.4 GHz RF Matching DescriptionThe 2.4 GHz RF matching connects the 2G4RF1 pin to the on-board printed IFA. The component values were optimized for the 2.4 GHz band RF performance and current consumption with the targeted 10 dBm output power.The matching network consists of a five-element impedance matching and harmonic filter circuitry and a DC blocking capacitor (not required for the 20 dBm part).For conducted measurements, the matching network output can also be connected to the UFL connector by removing the series R1resistor (0 Ohm) between the antenna and the matching network and mounting it to the R2 resistor position between the matching net-work and the UFL connector.4.3 Bill of Materials for the 2.4 GHz Matching NetworkThe bill of materials for the BRD4186C Radio Board 2.4 GHz matching network is shown in the following table.Table 4.1. Bill of Materials for the BRD4186C 2.4 GHz RF Matching Network4.4 Inverted-F AntennaThe BRD4186C Radio Board includes an on-board, printed inverted-F antenna, tuned for the 2.4 GHz band. Due to the design restric-tions of the radio board, the input of the antenna and the output of the matching network can't be placed directly next to each other. Therefore, a 50 Ohm transmission line was necessary to connect them.The resulting impedance that is presented to the matching network output is shown in the following figure. During the measurement, the BRD4186C Radio Board was attached to a Wireless Starter Kit Mainboard.As shown in the figure, the antenna impedace (blue curve) is close to 50 Ohm in the entire 2.4 GHz band, and the reflection (red curve) is under -10 dB.Figure 4.2. Impedance and Reflection of the Inverted-F Antenna of the BRD4186C Board Measured from the Matching Output5. Mechanical DetailsThe BRD4186C Radio Board is illustrated in the figures below.45 mm30 mmFigure 5.1. BRD4186C Top View24 mm5 mm Interface ConnectorInterface ConnectorFigure 5.2. BRD4186C Bottom ViewMechanical DetailsEMC Compliance 6. EMC Compliance6.1 IntroductionBRD4186C Radio Board fundamental and harmonic levels compliance is tested against the following standards:• 2.4 GHz:•ETSI EN 300-328•FCC 15.2476.2 EMC Regulations for 2.4 GHz6.2.1 ETSI EN 300-328 Emission Limits for the 2400-2483.5 MHz BandBased on ETSI EN 300-328, the allowed maximum fundamental power for the 2400-2483.5 MHz band is 20 dBm EIRP. For the unwan-ted emissions in the 1 GHz to 12.75 GHz domain, the specific limit is -30 dBm EIRP.6.2.2 FCC15.247 Emission Limits for the 2400-2483.5 MHz BandFCC 15.247 allows conducted output power up to 1 W (30 dBm) in the 2400-2483.5 MHz band. For spurious emissions, the limit is -20 dBc based on either conducted or radiated measurement, if the emission is not in a restricted band. The restricted bands are speci-fied in FCC 15.205. In these bands, the spurious emission levels must meet the levels set out in FCC 15.209. In the range from 960 MHz to the frequency of the 5th harmonic, it is defined as 0.5 mV/m at 3 m distance, which equals to -41.2 dBm in EIRP.If operating in the 2400-2483.5 MHz band, the 2nd, 3rd, and 5th harmonics can fall into restricted bands. As a result, for those harmon-ics the -41.2 dBm limit should be applied. For the 4th harmonic, the -20 dBc limit should be applied.6.2.3 Applied Emission Limits for the 2.4 GHz BandThe above ETSI limits are applied both for conducted and radiated measurements.The FCC restricted band limits are radiated limits only. In addition, Silicon Labs applies the same restrictions to the conducted spec-trum. By doing so, compliance with the radiated limits can be estimated based on the conducted measurement by assuming the use of an antenna with 0 dB gain at the fundamental and the harmonic frequencies.The overall applied limits are shown in the table below. For the harmonics that fall into the FCC restricted bands, the FCC 15.209 limit is applied. ETSI EN 300-328 limit is applied for the rest.Table 6.1. Applied Limits for Spurious Emissions for the 2.4 GHz Band7. RF Performance7.1 Conducted Power MeasurementsDuring measurements, the BRD4186C Radio Board was attached to a Wireless Starter Kit Mainboard which was supplied by USB. The voltage supply for the radio board (VMCU) was 3.3 V and for the power amlifier (PAVDD), it was 1.8 V.7.1.1 Conducted Power Measurements with Unmodulated CarrierThe transceiver was operated in unmodulated carrier transmission mode. The output power of the radio was set to 10 dBm. The typical output spectrum is shown in the following figure.Figure 7.1. Typical Output Spectrum of the BRD4186C; PAVDD = 1.8 VAs shown in the figure, the fundamental is 10 dBm and all of the unwanted emissions are under the -41.2 dBm limit.Note: The conducted measurement is performed by connecting the on-board UFL connector to a spectrum analyzer through an SMA conversion adapter (P/N: HRMJ-U.FLP(40)). This connection itself introduces approximately 0.3 dB insertion loss.7.1.2 Conducted Power Measurements with Modulated CarrierDepending on the applied modulation scheme and the spectrum analyzer settings specified by the relevant EMC regulations, the meas-ured power levels are usually lower compared to the results with unmodulated carrier. These differences are measured and used as relaxation factors on the results of the radiated measurement performed with unmodulated carrier. This way, the radiated compliance with modulated transmission can be evaluated.In this case, both the ETSI EN 300-328 and the FCC 15.247 regulations define the following spectrum analyzer settings for measuring the unwanted emissions above 1 GHz:•Detector: Average•RBW: 1 MHzThe table below shows the measured differences for the supported modulation schemes.Table 7.1. Measured Relaxation Factors for the Supported Modulation SchemesAs shown, the BLE 125 Kb/s coded modulation scheme has the lowest relaxation factors. These values will be used as the worst case relaxarion factors for the radiated measurements.7.2 Radiated Power MeasurementsDuring measurements, the BRD4186C Radio Board was attached to a Wireless Starter Kit Mainboard which was supplied by USB. The voltage supply for the radio board was 3.3 V, for the power amlifier (PAVDD) it was 1.8 V. The radiated power was measured in an antenna chamber by rotating the board 360 degrees with horizontal and vertical reference antenna polarizations in the XY, XZ, and YZ cuts. The measurement planes are illustrated in the figure below.XZYFigure 7.2. Illustration of Reference Planes with a Radio BoardNote: The radiated measurement results presented in this document were recorded in an unlicensed antenna chamber. Also, the radi-ated power levels may change depending on the actual application (PCB size, used antenna, and so on). Therefore, the absolute levels and margins of the final application are recommended to be verified in a licensed EMC testhouse.7.2.1 Maximum Radiated Power MeasurementsFor the transmitter antenna, the on-board printed inverted-F antenna of the BRD4186C Radio Board was used (the R1 resistor was mounted). The supply for the RF section (RFVDD) and the 2.4 GHz power amplifier (PAVDD) was 1.8 V provided by the on-chip DC-DC converter; for details, see the BRD4186C schematic. The transceiver was operated in unmodulated carrier transmission mode. The output power of the radio was set to 10 dBm based on the conducted measurement.The results are shown in the tables below. The correction factors are applied based on the BLE 125 Kb/s coded modulation, shown in section 7.1.2 Conducted Power Measurements with Modulated Carrier . For the rest of the supported modulation schemes, the correction factors are larger, thus the related calculated margins would be higher compared to the ones shown in the table below. Thus,the margins below can be considered as worst case margins.Table 7.2. Maximums of the Measured Radiated Powers in EIRP [dBm] and the Calculated Modulated Margins in [dB] with theWireless Starter Kit Mainboard; PAVDD = 1.8 VAs shown in the table, with 10 dBm output power, the radiated power of the fundamental is higher than 10 dBm due to the high antenna gain. The 3rd harmonic is very close to the limit with the Wireless Starter Kit Mainboard in case of the unmodulated carrier transmis-sion. But with the relaxation of the supported modulation schemes, the margin is at least 5.1 dB.7.2.2 Antenna Pattern MeasurementsThe measured normalized antenna patterns are shown in the following figures.180°-35-30-25-20180°-35-30180°-35-30-25Figure 7.3. Normalized Antenna Pattern of the BRD4186C with the Wireless Starter Kit MainboardEMC Compliance Recommendations 8. EMC Compliance Recommendations8.1 Recommendations for 2.4 GHz ETSI EN 300-328 ComplianceAs shown in section 7.2 Radiated Power Measurements, the power of the BRD4186C fundamental with 10 dBm output is compliant with the 20 dBm limit of the ETSI EN 300-328 regulation. With the supported modulation schemes, the harmonics are also compliant with the relevant limits. Although the BRD4186C Radio Board has an option for mounting a shielding can, it is not required for compli-ance.8.2 Recommendations for 2.4 GHz FCC 15.247 ComplianceAs shown in section 7.2 Radiated Power Measurements, the power of the BRD4186C fundamental with 10 dBm output is compliant with the 30 dBm limit of the FCC 15.247 regulation. With the supported modulation schemes, the harmonics are also compliant with the relevant limits. Although the BRD4186C Radio Board has an option for mounting a shielding can, it is not required for compliance.9. Board Revision HistoryThe board revision is laser engraved in the Board Info field on the bottom side of the PCB, as outlined in the figure below. The revision printed on the silkscreen is the PCB revision.Board RevisionPCB RevisionBRD4186C Rev. A01P C B 4186C R e v . A 01184500348Figure 9.1. Revision InfoTable 9.1. BRD4186C Radio Board Revision HistoryBoard Revision HistoryErrata 10. ErrataThere are no known errata at present.Document Revision History 11. Document Revision HistoryRevision 1.0April, 2022•Initial document release.IoT Portfolio/IoTSW/HW/simplicityQuality/qualitySupport & Community/communitySilicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USADisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required, or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, ormissiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.Trademark InformationSilicon Laboratories Inc.®, Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, ClockBuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, Gecko OS, Gecko OS Studio, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri, the Zentri logo and Zentri DMS, Z-Wave®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.。

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IntroductionThe Smart Thermal Camera can be used to connect the android smartphone with USB-C or Micro-USB. It doesn't need additional battery,it can work only need to insert the USB interface of the smartphone. It is so compact and portable, can be used to detect at anytime, anywhere.Display the thermal image on the better screen of the smartphone will bring better visual experience. With the Smart Thermview APP it can provide a big storage of the thermal image and video,provide more powerful point/ line/area analysis function and provide powerful PDF report export function. Real-time preview the results of 9 color palettes.Structure DescriptionSpecificationsConnect to SmartphoneInfrared Camera lensMicro USB USB-CImaging & OpticalThermal Resolution206×156 Wavelength8~14μmFrame Rate9 HzField of View, Horizontal35.4°Field of View, Vertical26.8°Shutter AutomaticFocus Mode Manual Minimum Focus Distance T ypical 0.5m, Max 1m Detection Range330m Recognition Range83m Identification Range48mMeasurementMeasurement Range-10°C~330°C (14°F~626°F) Accuracy (-10~100°C)±5°C(±9°F)Accuracy (100~330°C)±5%Repeatability (-10~100°C)(14~212°F)±2°C(±3.6°F) Repeatability (100~330°C)(212~626°F)±2%Thermal Sensitivity/NEDT @f/1.0 T ypical 50mk Max 70mk @f/1.2 T ypical 70mk Max 100mkEnvironmentOperating T emperature-20°C~80°C (-4°F~176°F) StorageT emperature (non-condensing)-40°C~100°C (-40°F~212°F) Mechanical shock Drop from 2 mCommon FeaturesWeight54gDimensions(W×H×D)68×33×28 mmPhone AndroidConnections USB-C(Android) Micro USB(Android) APP FeaturesColor Palette9 OptionsCapture modes Photo, VideoFile formats HIR, Mp4Spot Center SpotAutomatic Hot/Cold Detection Auto hot or cold markersT emperature Analysis Customize Point/Line/Area T emperature PDF Report Export & Share PDF ReportAdjust FocusT o adjust focus, clockwise or Anti-clockwise rotates the Infrared Camera lens. When target comes into focus, it shows a sharper image. When the target moves out of focus,the thermal image becomes blurry.NoteCorrect focus is important in all imaging applications.Correct focus makes sure that the infrared energy is correctly directed onto the pixels of the detector. Without the correct focus, the thermal image can be blurry and the radiometric data will be inaccurate. out-of-focus infrared images are frequently unusable or of little value.Install Smart Thermview APPScan the QR code or search “Smart Thermview” on Google Play to download and Install it.Notice: System Android 5.0 above required and USB OTG support.。

电子工程-重要国际学术会议汇总

IBC
国际广播会议
16.
IEEE Wireless Communications & Networking Conference
WCNC
IEEE无线通信和网络会议
17.
SPIE Conference on Visual Communications and Image Processing
VCIP
SPIE视觉通信和图像处理会议
3Gand Beyond
IEEE第三代（及三代以上）无线通信国际会议
20.
European Conference on Speech Communication and Technology
EUROSPEECH
欧洲语音通信和技术会议
21.
IEEEPacific RimConference on Multimedia
ASID
亚洲显示会议
16.
International Symposium of infrared and millimeter wave
SPIE
国际远红外与毫米波会议
每年，主要在美国
17.
AsiaPacific Microwave Conference
APMC
亚太微波会议
每年，主要在美国
18.
IEEE International Symposium of Circuits and Systems
电子工程系电子科学与技术一级学科重要国际学术会议汇总
一、A类会议
序号
英文名称
英文简称
中文名称
备注
1.
Conference on Optical fiber Communication
OFC

基恩士放大器 FS-N系列详细说明书-中文

基恩士放大器 FS-N系列详细说明书-中文------------------------------------------------------------------------------------------------基恩士放大器 FS-N系列详细说明书-中文数字光纤传感器FS-N10 系列用户手册使用前请阅读本手册。

本手册应妥善保管，以便日后参考。

介绍本手册介绍 FS-N10 系列的基本操作和硬件功能。

请仔细阅读本手册，以确保安全实现 FS-N10 系列的性能和功能。

请将本手册保存在安全的地方，以便将来参考。

请确保本产品的最终用户收到本手册。

?符号以下符号提醒您注意有关防止人身伤害和产品损坏的事项。

注提供关于正确操作的附加说明。

提供操作的高级信息和有用信息。

安全预防措施正确使用须知?请勿沿电源线或高压线一道布设放大器线路，否则可能因噪声导致传感器发生故障或受损。

?使用市面所售的开关稳压器时，请将壳体接地端子和接地端子接地。

?请勿在户外或光接收元件受外部光线直射的场所使用 FS 系列产品。

——————————————————————————————————————------------------------------------------------------------------------------------------------?因特性的个别差异以及光纤模块型号的不同，所有模块的最大感测距离或显示值可能不尽相同。

?如果在启用 APC 功能的情况下长时间使用传感器，LED 指示灯将承载沉重负荷。

在这种情况下，传感器因发光所需耗电量是恒定的，并将显示"END APC"。

传感器仍可继续使用。

不过，如果要关注接收光量的微小变化，请更换传感器。

??关于 UL 认证FS-N 系列已通过 UL 和 C-UL 认证，符合 UL 与 CSA 标准。

?适用标准UL508 工业控制设备CAN/CSA C22.2 No.14-M05 工业控制设备?UL 档案编号 E301717?UL 类别: NRKH, NRKH7?外壳类型 1(基于 UL50 标准)??UL 认证相关说明?FS-N 系列所用电源必须通过针对 2 级输出(据美国国家电气法规 (NEC) NFPA70之规定)的 UL 列名认证。

CA0010 创新产品说明说明书

The innovative CA0010 is the full compliance companion for the 9010 EMI FFT receiver allowing performing any kind of click (discontinuous disturbance) analysis and measurement.The conjunction of the 9010F FFT EMI receiver with this click analyzer is capable of four simultaneous measurements at the frequencies of 150 kHz, 500 kHz, 1,4 MHz and 30 MHz and can work as a standalone setup for compliant tests. In addition, when connected to a PC, a dedicated software produces a full trace with additional information like IF and QP time diagram of every channel, graph of the detected clicks for each channel and a complete trace with offline Rewind-Play-Pause-Forward capability for any possible use.This software can also manage a unique internal click calibrator able to generate all the signals required to check the analyzer performance in compliance with CISPR 16-1-1 requirements. It is possible to set all the relevant parameters such as amplitude and duration of each click, the interval between them, the number of click repetition and, last but not least, the amplitude of CISPR pulses. Indeed, unique on the market the CA0010 Calibrator embeds a full compliance B-Band Cispr16-1-1 pulse generator allowing thus performing the test #2 and #3 of table 14 Cispr16-1-1 without the need of any external additional generator.The internal click generator is full compliance with the requirements specified in CISPR 16-1-1 and can be used to self-calibrate the CA0010 or any other external click meter.The same high versatility is also reflected in the User selectable operating modes: two rates/two upper quartiles, two rates/four upper quartiles, four rates/four upper quartiles and single run/double run (not conditioned by the previous ones).Full compliant to all old and new “click” existing standards: CISPR 16-1-1:2015 Ed. 4 and previous editions, CISPR 14-1:2016 Ed. 6 and previous editions, CENELEC old and new equivalent versions of these two standards (EN 55016-1-1 and EN 55014-1). This Click Meter also features an internal 16 ampere LISN (although an external one can always be connected) and a switch operations counting unit, too.The CA0010 has an outstanding dynamic range and saturation control, thanks to the internal tailored preselection, guaranteed by its CISPR full compliance RF front end.CA0010Click AnalyzerMain Features• Discontinuous disturbance (click) analysis• Four independent frequency channels measuring simultaneously• Each channel with embedded preselector, attenuator and preamplifier • Designed to fully match CISPR 16-1-1 and CISPR 14-1 Standards• Highly flexible selection of number of rates, quartiles and runs operating mode • Test duration reduced to the minimum theoretically achievable • Built-in two-lines 16A Line Impedance Stabilization Network (LISN)• User port for driving any external LISNs • Embedded switch operation counting unit• CISPR 16-1-1 embedded click and pulse generator output for internal or external use • Autocheck and calibration• Stand alone or PC driven operations • Free PCA PMM Click Analysis software • Free PCG PMM Click Generation software • Full IF and QP history 500us resolution • Compact yet sturdy construction•140 dBμV (2 W) maximum input level without damageOrdering information:CA0010 Click AnalyzerIncludes: L SN mains cable, DB9 male - DB9 male cable for 9010F, USB cable, BNC-BNC cable, AC/DC power adapter, PCA PMM Click Analysis software, PCG PMM Click Generation software, 9010F Click option Dongle code, soft carrying case, user’s manual, standard calibration certificateGenerators/Receivers/SystemsAntennas/Calibration servicesLISNs/Probes• 1008: Magnetic field generator system • 7010/00: EMI Receiver 150 kHz to 1 GHz • 7010/01: EMI Receiver 9 kHz to 1 GHz • 7010/02: EMI Receiver 9 kHz to 30 MHz • 7010/03: EMI Receiver 9 kHz to 3 GHz • 9010: EMI Receiver 10 Hz to 30 MHz • 9010F: EMI Receiver 10 Hz to 30 MHz• 9010/03P: EMI Receiver 10 Hz to 300 MHz • 9010/30P: EMI Receiver 10 Hz to 3 GHz • 9010/60P: EMI Receiver 10 Hz to 6 GHz • 9030: EMI Receiver 30 MHz to 3 GHz • 9060: EMI Receiver 30 MHz to 6 GHz • 9180: EMI Receiver 6 GHz to 18 GHz • FR4003: Field Receiver 9 KHz to 30 MHz • COND-IS: RF Conducted Immunity System • RAD-IS: RF Radiated Immunity System •AUT-IS: Automotive Immunity System• BC-01: Biconical Antenna 30 to 200 MHz• DR-01: Double-ridged horn Antenna 6 to 18 GHz • LP-02: Log Periodic Antenna 200 MHz to 3 GHz • LP-03: Log Periodic Antenna 800 MHz to 6 GHz • LP-04: Log Periodic Antenna 200 MHz to 6 GHz • TR-01: 60-180 cm wooden extendable tripod• VDH-01: Van der Hoofden Test Head 20 kHz to 10 MHz • Antenna Set AS-02 (BC01+LP02+TR01)• Antenna Set AS-03 (BC01+LP02+LP03+TR01) • Antenna Set AS-04 (BC01+LP04+TR01)• Antenna Set AS-05 (BC01+LP04+DR01+TR01)• RA-01: Rod Antenna 9 kHz to 30 MHz• RA-01-HV: Rod Antenna 150 kHz to 30 MHz • RA-01-MIL: Rod Antenna 9 kHz to 30 MHz • Ansi 63,5 Antenna Factor • SAE ARP 958-D• Free-Space Antenna Factor• CAL-6630: Traceable calibration •LAT-6630: Accredited calibration• L2-16B: single phase AMN, 16 A • L3-32: 4 lines, 3-phase AMN, 32 A • L3-64: 4 lines, 3-phase AMN, 63 A• L3-64/690V: 4 lines, 3-phase AMN, 63 A • L3-100: 4 lines, 3-phase AMN, 100 A• L1-150M: single-path, 50 Ohm AMN, 150 A • L1-150M1: single-path, 50 Ohm AMN, 150 A • L1-500: single phase AMN, 500 A • L3-500: 4 lines, 3-phase AMN, 500 A • L2-D: Delta LISN for telecom, 2 A, 150 Ω• RF-300: Van Veen Loop • SBRF4: RF Switching Box• SHC-1/1000: Voltage probe, 1000 Vac, 35 dB • SHC-2/1000: Voltage probe, 1000 Vac, 30 dBRelated products and servicesOptional accessories:LISN service kit(AC-BNC adapter for LISN verification and calibration)C A 0010-F E N -80504 - S p e c i fi c a t i o n s s u b j e c t t o c h a n g e w i t h o u t n o t i c eHeadquarters:Via Benessea, 29/B17035 Cisano sul Neva (SV) - ITALY Phone: +39 0182 58641Fax: +39 0182 586400E-Mail:***********************Internet: www.narda-sts.itSales:Via Leonardo da Vinci, 21/2320090 Segrate (Milano) - ITALY Phone: +39 02 2699871Fax: +39 02 26998700CA0010Click AnalyzerFrequency range RF Input VSWRAttenuator Preamplifier RF Output VSWRMax input level(without equipment damage)Preselector(Permanent built-in)Insertion loss (Att 0 dB)RF generator CW Frequency range Frequency resolution Accuracy Amplitude range Amplitude resolution Click (OOK) Minimum ON time Minimum separation Time resolution CISPR PULSES Spectral density range Amplitude resolution Flatness PRF PRF resolution RF outputAutocalibration CISPR conformity I/O InterfaceApplication softwareOperating temperature Power supplyBuilt-in LISN (compliant to CISPR 16-1-2)Frequency rangeContinuous rated output current Max permissible operating voltage EUT supply frequency range CISPR equivalent circuit EUT power connector Line plugArtificial hand RF OutputDimensions (W x H x D)Weight150 kHz; 500 kHz; 1,4 MHz; 30 MHzZin 50 Ω, Internal switch from LISN or BNC fem.< 1,20 dB to 35 dB (5 dB steps) one per channel, independent setting 15 dB one per channel, independent setting Zout 50 Ω, BNC fem.< 1,2140 dBμV (2 W)(four BP filters)150 kHz / 60 kHz BW@6dB 500 kHz / 120 kHz BW@6dB 1,4 MHz / 220 kHz BW@6dB 30 MHz / 180 kHz BW@6dB < 10 dB150 kHz to 30 MHz 100 Hz 10 ppM20 to 95 dBuV 0.1 dB 100 us 100 us 10 us80 to 101 dBuV/MHz 0.1 dB1.8 dB from 150 kHz to 30 MHz 1 to 500 Hz 1 HzInternal switch or BNC fem.Embedded generator for autocalibration and system test CISPR 14-1, CISPR 16-1-1, CISPR 16-1-2USB 2.0, RS-232PCA PMM Click Analysis software. Four channels IF and QP time diagram with click detection and analysis Measurement log and reportPCG PMM Click Generation software. CISPR 16-1-1 standard, annex F and user’s definable test generation -5° to +45°C12 Volt DC, 0,7 A (AC universal adapter)150 kHz to 30 MHz 16 A250 Vac – 350 Vdc DC to 60 Hz 50 Ω // 50 μH Schuko 2P+E IEC 60320 C204 mm socketInternal switch or BNC fem.235 x 105 x 335 mm 4,1 kgSPECIFICATIONS。

美思先端MTP10-B1F55红外传感器_规格书

型号：MTP10-B7F55
3/6
滤光片规格
参数
透过率波长范围平均透过率平均截止率
热电堆传感器
数值
5.5 ≥ 75
1
单位
μm % %
条件
长波通 5.5~14 μm
＜ 5 μm
电气连接
引脚定义
1 热电堆 +
2 NTC
3 热电堆 -
4 GND
型号：MTP10-B7F55
4/6
NTC R-T表
T (℃)
500 K, 5.5 μm（长波通）环温 25~75 ℃
滤光片 F5.5, 500 K, 1 Hz 25 ℃
25 ℃/50 ℃
型号：MTP10-B7F55
2/6
热电堆传感器
典型性能曲线
5
测量条件：
4
1. 全视场角度覆盖
2. 环境温度25 ℃
3
热电堆输出电压 (ቤተ መጻሕፍቲ ባይዱV)
2
1
0
-1
-2 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 物温 (℃)
光学特点
参数
视角
数值
83
单位
o
条件
50% 最大信号
归一化幅度 (100%)
100.00% 90.00% 80.00% 70.00% 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00%
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 角度 (°)
-20 -19 -18 -17 -16 -15 -14 -13 -12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

QuickScanTM Lite QW2100 通用型有线手持线性成像条形码阅读器快速参考指南说明书

QuickScan TM Lite QW2100通用型有线手持线性成像条形码阅读器General Purpose Corded Handheld Linear Imager Bar CodeReader快速参考指南Quick Reference GuideDatalogic ADC, Inc.959 Terry StreetEugene, Oregon 97402USA（美国）电话：(541) 683-5700 传真：(541) 345-7140© 2011 - 2014 Datalogic ADC, Inc.未公开发行文档 — 保留所有权利。

未经 Datalogic ADC, Inc. 或其附属公司或联营公司（“Datalogic”或“Datalogic ADC”）事先书面许可，不得以任何形式或任何方式复制或传播本文档的任何内容或其中所述程序。

特此向 Datalogic 产品的所有者授予复制和传播本文档的非独占性、可撤销性许可，用于买方自身内部的商业用途。

如果本手册的未来修订本将要出版，您可以联系 Datalogic 代表以获得印刷版本。

电子版本可从 Datalogic 网站() 下载，或通过适当的媒介提供。

如果您访问我们的网站，并想对本文档或其他 Datalogic 出版物提出意见或建议，请通过“联系 Datalogic”页面让我们知晓。

免责声明Datalogic 已要采取合理措施于本文档提供完整、准确的信息，但是 Datalogic 保留在不事先通知的情况下随时更改任何规格的权利。

Datalogic 和 Datalogic 标志是 Datalogic S.p.A. 在包括美国和欧盟在内的很多国家或地区的注册商标。

所有其他品牌和产品名称均是其相关所有者的商标。

Datalogic ADC, Inc.959 Terry StreetEugene, OR 97402USATelephone: (541) 683-5700Fax: (541) 345-7140An Unpublished Work - All rights reserved. No part of the contents of this docu-mentation or the procedures described therein may be reproduced or transmitted in any form or by any means without prior written permission of Datalogic ADC, Inc. or its subsidiaries or affiliates ("Datalogic" or "Datalogic ADC"). Owners of Datalogic products are hereby granted a non-exclusive, revocable license to reproduce and transmit this documentation for the purchaser's own internal business purposes. Purchaser shall not remove or alter any proprietary notices, including copyright notices, contained in this documentation and shall ensure that all notices appear on any reproductions of the documentation.Should future revisions of this manual be published, you can acquire printed ver-sions by contacting your Datalogic representative. Electronic versions may either be downloadable from the Datalogic website () or provided on appropriate media. If you visit our website and would like to make comments or suggestions about this or other Datalogic publications, please let us know via the "Contact Datalogic" page.DisclaimerDatalogic has taken reasonable measures to provide information in this manual that is complete and accurate, however, Datalogic reserves the right to change any specification at any time without prior notice.Datalogic and the Datalogic logo are registered trademarks of Datalogic S.p.A. in many countries, including the U.S.A. and the E.U. All other brand and product names may be trademarks of their respective owners.QuickScan is a registered trademark of Datalogic ADC, Inc. in many countries, including the U.S.A. and the E.U. Autosense is a registered trademark of Datalogic ADC, Inc. in the U.S.本产品包含以下一个或多个专利：This product may be covered by one or more of the following patents:Design Patents: CN ZL201230049587.7; EP1987843; USD677258.Utility Patents: EP0789315B1; EP1128315B1; EP1396811B1; EP1413971B1; US5481098; US5992740; US6098883; US6454168; US6561427; US6758403; US6808114; US6997385; US7387246; US7506816. Additional patents pending其他未决专利语言Language 中国 . . . . . . . . . . . . . . . . . . . . . . . . . . 1 English. . . . . . . . . . . . . . . . . . . . . . . 19NOTESDatalogic ADC, Inc.QUICKSCAN(TM) 产品系列最终用户许可协议最终用户通知：您获取的 Datalogic 产品包含产品运行不可或缺的内嵌式软件。

122 EE-SX3081 -SX4081 光学传输微光传感器说明说明书

122EE-SX3081/-SX4081 Photomicrosensor (Transmissive)■DimensionsNote:All units are in millimeters unless otherwise indicated.■Features•Incorporates an IC chip with a built-in detector element and ampli-■Electrical and Optical Characteristics (Ta = 25°C)Internal CircuitDimensions Tolerance 3 mm max. ±0.33 < mm ≤ 6 ±0.3756 < mm ≤ 10 ±0.4510 < mm ≤ 18 ±0.5518 < mm ≤ 30±0.65Unless otherwise specified, the tolerances are as shown below.Terminal No. Name A Anode K Cathode V Power supply (Vcc)O Output (OUT)GGround (GND)KAV GOCross section AACross section BBOptical axisFour, C0.3Two, C1±0.3Five, 0.25±0.1(Five, 0.5±0.1)8.5±0.18.2±0.55±0.12.5±0.22.5+0.16.5±0.16.2±0.510±0.27.5±0.213.7+0.3(10.5)(2.5)ItemSymbol ValueConditionEmitterForward voltage V F1.2 V typ., 1.5 V max.I F = 20 mA Reverse current I R 0.01 μA typ., 10 μA max.V R = 4 V Peak emission wave-lengthλP 940 nm typ.I F = 20 mADetectorLow-level output volt-ageV OL 0.12 V typ., 0.4 V max.V CC = 4.5 to 16 V, I OL = 16 mA, I F = 0 mA (EE-SX3081), I F = 8 mA (EE-SX4081)High-level output volt-ageV OH 15 V min.V CC = 16 V, R L = 1 k Ω, I F = 8 mA (EE-SX3081), I F = 0 mA (EE-SX4081)Current consumptionI CC3.2 mA typ., 10 mA max.V CC = 16 V Peak spectral sensitivi-ty wavelengthλP 870 nm typ.V CC = 4.5 to 16 V LED current when output is OFF I FT8 mA max.V CC = 4.5 to 16 VLED current when output is ON HysteresisΔH 15% typ.V CC = 4.5 to 16 V (see note 1)Response frequency f 3 kHz min.V CC = 4.5 to 16 V, I F = 20 mA, I OL = 16 mA (see note 2)Response delay time t PLH (t PHL ) 3 μs typ.V CC = 4.5 to 16 V, I F = 20 mA, I OL = 16 mA (see note 3)Response delay timet PHL (t PLH )20 μs typ.V CC = 4.5 to 16 V, I F = 20 mA, I OL = 16 mA (see note 3)Be sure to read Precautions on page 25.EE-SX3081/-SX4081 Photomicrosensor (Transmissive) 123■Engineering DataNote:The values in the parentheses apply to the EE-SX4081.2.1 mm0.5 mm0.5 mmDiskInput OutputInput OutputEE-SX3081EE-SX4081Note: 1. H ysteresis denotes the difference in forward LEDcurrent value, expressed in percentage, calculated from the respective forward LED currents when the photo IC in turned from ON to OFF and when the photo IC in turned from OFF to ON.2. The value of the response frequency is measured by rotating the disk as shown below.3. The following illustrations show the definition of response delay time. The value in the parentheses applies to the EE-SX4081.Forward Current vs. Collector Dissipation Temperature RatingForward Current vs. Forward Voltage Characteristics (Typical)LED Current vs. Supply Voltage (Typical)Low-level Output Voltage vs. Output Current (Typical)Current Consumption vs. Supply Voltage (Typical)Response Delay Time vs. Forward Current (Typical)Repeat Sensing Position Characteristics (Typical)O u t p u t t r a n s i s t o rDistance d (mm)Center of optical axisSupply voltage V CC (V)L o w l e v e l o u t p u t v o l t a g e V O L (V )C u r r e n t c o n s u m p t i o n I c c (m A )Supply voltage V CC (V)Forward current I F (mA)I FT OFF (I FT ON)I FT ON (I FT OFF)V CC = 5 VI F = 0 mA (15 mA)I OL = 16 mAI OL = 5 mAT a = 25°CI F = 0 mA (15 mA)V CC = 5 V R L = 330 Ω Ta = 25°CV OUT(EE-SX3@@)V OUT(EE-SX4@@)T a = 25°C I F = 15 mA V CC = 5 V R L = 330 Ωn = repeat 20 timesd 1 = 0.01 mmAmbient temperature T a (°C)O u t p u t a l l o w a b l e d i s s i p a t i o n P C (m W )Forward voltage V F (V)F o r w a r d c u r r e n t I F (m A )F o r w a r d c u r r e n t I F (m A )L E D c u r r e n t I F T (m A )T a = 25°C R L = 1 k ΩR e s p o n s e d e l a y t i m e t P H L , t P L H (μs )I F = 0 mA (15 mA)V CC = 5 VT a = 25°C L E D c u r r e n t I F T (m A )I FT OFF (I FT ON)I FT ON (I FT OFF)Ambient temperature T a (°C)V CC = 5 V R L = 330 ΩTa = −30°C Ta = 25°C Ta = 70°CL o w l e v e l o u t p u t v o l t a g e V O L (V )Output current I C (mA)Ambient temperature Ta (°C)Low-level Output Voltage vs. Am-bient Temperature Characteristics (Typical)LED Current vs. Ambient Temper-ature Characteristics (Typical)。

恩智浦 MIMXRT1020 EVK 开发板硬件用户指南说明书

© 2018 NXP B.V.MIMXRT1020 EVK Board Hardware User’sGuide1.IntroductionThis Hardware User’s Guide for the MIMXRT 1020Evaluation Kit (EVK) is based on the NXP Semiconductor i.MX RT1020 Processor. This board is fully supported by NXP Semiconductor. The guide includes system setup and debugging, and provides detailed information on overall design and usage of the EVK board from a hardware systems perspective.1.1. Board overviewThis EVK board is a platform designed to showcase the most commonly used features of the i.MX RT1020 Processor in a small, low cost package. The MIMXRT1020 EVK board is an entry level development board, which gives the developer the option of becoming familiar with the processor before investing a large amount or resources in more specific designs.NXP Semiconductors Document Number: MIMXRT1020EVKHUGUser's GuideRev. 0 , 05/2018Contents1.Introduction ........................................................................ 11.1.Board overview ....................................................... 11.2.MIMXRT1020 EVK contents ................................. 21.3.MIMXRT1020 EVK Board revision history ........... 32.Specifications ..................................................................... 32.1.i.MX RT1020 processor .......................................... 52.2.Boot Mode configurations ....................................... 52.3.Power tree ............................................................... 62.4.SDRAM memory .................................................... 92.5.SD Card slot ............................................................ 92.6.QSPI flash ............................................................... 92.7.Ethernet connector .................................................. B PHY connector ............................................. 102.9.Audio input / output connector .............................. 102.10.OpenSDA circuit (DAP-Link) ............................... 102.11.JTAG connector .................................................... 102.12.Arduino expansion port ......................................... er interface LED indicator ................................ 133.PCB information .............................................................. 134.EVK design files .............................................................. 135.Contents of the Evaluation Kit ......................................... 146.Revision history (14)IntroductionFeatures of the MIMXRT1020 EVK board are shown in Table 11.2. MIMXRT1020 EVK contentsThe MIMXRT1020 EVK contains the following items: •MIMXRT1020 EVK Board•USB Cable (Micro B)Specifications 1.3. MIMXRT1020 EVK Board revision history•Rev A: Prototype.2. SpecificationsThis chapter provides detailed information about the electrical design and practical considerations of the EVK Board, and is organized to discuss each block in the following block diagram of the EVK board.( Figure 1)Figure 1. Block diagramThe overview of the MIMXRT1020 EVK Board is shown in Figure 1 & Figure 2.SpecificationsFigure 2. Overview of the MIMXRT1020 EVK Board (Front side)Figure 3. Overview of the MIMXRT1020 EVK Board (Back side)Specifications 2.1. i.MX RT1020 processorThe i.MX RT1020 is a new processor family featuring NXP's advanced implementation of the Arm® Cortex®-M7 Core. It provides high CPU performance and best real-time response. The i.MX RT1020 provides various memory interfaces, including SDRAM, Raw NAND FLASH, NOR FLASH,SD/eMMC, Quad SPI, HyperBus and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS. Same as other i.MX processors, i.MX RT1020 also has rich audio features, including SPDIF and I2S audio interface.The i.MX RT1020 applications processor can be used in areas such as industrial HMI, IoT, motor control and home appliances. The architecture's flexibility enables it to be used in a wide variety of other general embedded applications too. The i.MX processor provides all interfaces necessary to connectp eripherals such as WLAN, Bluetooth™, GPS.The more detail information about i.MX RT1020 can be found in the Datasheet and Reference Manual2.2. Boot Mode configurationsThe device has four boot modes (one is reserved for NXP’s use). The boot mode is selected based on the binary value stored in the internal BOOT_MODE register. Switch (SW8-3 & SW8-4) is used to select the boot mode on the MIMXRT1020 EVK Board.Typically, the internal boot is selected for normal boot, which is configured by external BOOT_CFG GPIOs. The following Table 3 shows the typical Boot Mode and Boot Device settings.NOTEFor more information about boot mode configuration, see the System Boot chapter of theMIMXRT1020 Reference Manual. (waiting for update)For more information about MIMXRT1020 EVK boot device selection and configuration, see the main board schematic. (waiting for update)Specifications2.3. Power treeA DC 5 V external power supply is used to supply the MIMXRT1020 EVK Board at J2, and a slide switch SW1 is used to turn the Power ON/OFF. J23 and J9 also can be used to supply the EVK Board. Different power supply need to configure different Jumper setting of J1. Table 4 shows the details:NOTEFor some computers’ USB, it cannot support 500ma before establishingcommunication. In this case, it is recommended to replace the computer oruse the power adapter(J2) to power the EVK Board.The power tree is shown in Figure 4SpecificationsFigure 4. Power TreeThe power control logic of the MIMXRT1020 EVK board is shown in the Figure 5: •It will power up SNVS, and then PMIC_REQ_ON will be switched on to enable external DC/DC to power up other power domains.•ON/OFF button is used to switch ON/OFF PMIC_REQ_ON to control power modes.•RESET button and WDOG output are used to reset the system power.SpecificationsFigure 5. Power Control Diagram The power rails on the board are shown in Table 5.Specifications2.4. SDRAM memoryOne 256 Mb, 166MHz SDRAM (MT48LC16M16A2P) is used on the EVK Board.2.5. SD Card slotThere is a SD card slot(J15) on the MIMXRT1020 EVK Board. J15 is the Micro SD slot for USDHC1 interface. If the developer wants to boot from the SD Card, the boot device switch (SW8) settings should be: OFF, ON, ON, OFF, as shown in Table 3.2.6. QSPI flashA 64 Mbit QSPI Flash is used on the MIMXRT1020 EVK Board. If the developer wants to boot from the QSPI Flash, the boot device switch(SW8) settings should be: OFF, OFF, ON, OFF, as shown in Table 3.2.7. Ethernet connectorThere is one Ethernet Mac controller in the MIMXRT1020 processor. The Ethernet subsystem of the MIMXRT1020 EVK Board is provided by the KSZ8081RNB 10/100M Ethernet Transceiver (U11) and a RJ45 (J14) with integrated Magnetic.Figure 6. Ethernet Connector RJ45Specifications2.8. USB PHY connectorThe MIMXRT1020 contains a integrated USB 2.0 PHYs capable of connecting to USB host/device systems at the USB low-speed (LS) rate of 1.5 Mbits/s, full-speed (FS) rate of 12 Mbits/s or at the USB 2.0 high-speed (HS) rate of 480 Mbits/s.2.9. Audio input / output connectorThe Audio CODEC used on the MIMXRT1020 EVK Board is Wolfson’s Low Power, high quality Stereo Codec, WM8960.The MIMXRT1020 EVK Board include one headphone interface (J11), one onboard MIC (P1), two speaker interfaces (J12, J13). J11 is a 3.5 mm audio stereo headphone jack, which supports jack detect.2.10. OpenSDA circuit (DAP-Link)The OpenSDA circuit (CMSIS–DAP) is an open-standard serial and debug adapter. It bridges serial and debug communications between a USB host and an embedded target processor.CMSIS-DAP features a mass storage device (MSD) bootloader, which provides a quick and easy mechanism for loading different CMSIS-DAP Applications such as flash programmers, run-control debug interfaces, serial-to-USB converters, and more. Two or more CMSIS-DAP applications can run simultaneously. For example, run-control debug application and serial-to-USB converter runs in parallel to provide a virtual COM communication interface while allowing code debugging via CMSIS-DAP with just single USB connection.For the MIMXRT1020 EVK Board, J23 is the connector between the USB host and the target processor. Jumper to serial downloader mode to use stable DAP-Link debugger function. If developer wants to make OpenSDA going to the bootloader mode, and press SW5 when power on. Meanwhile, the OpenSDA supports drag/drop feature for U-Disk. First, use the seral downloader mode and drag/drop the image file to U-Disk. Then select QSPI Flash as boot device and reset the Board, the image will run.2.11. JTAG connectorJ16 is a standard 20-pin/2.54 mm Box Header Connector for JTAG. The pin definitions are shown in Figure 7. Support SWD by default.SpecificationsFigure 7. JTAG pin definitions2.12. Arduino expansion portJ17 – J20 (unpopulated) is defined as Arduino Interface. The pin definitions of Arduino Interface are shown in Table 6.Specifications2.12.1. Power switchSW1 is a slide switch to control the power of the MIMXRT1020 EVK Board when the power supply is from J2. The function of this switch is listed below:•Sliding the switch to the ON position connects the 5 V power supply to the Evaluation board main power system.•Sliding the switch to OFF position immediately removes all power from the board.2.12.2. ON/OFF buttonSW2 is the ON/OFF button for MIMXRT1020 EVK Board. A short pressing in OFF mode causes the internal power management state machine to change state to ON. In ON mode, a short pressing generates an interrupt (intended to be a software-controllable(power-down). An approximate 5 seconds or more pressing causes a forced OFF. Both boot mode inputs can be disconnected.2.12.3. Reset buttonThere are two Reset Button on the EVK Board. SW5 is the Power Reset Button. Pressing the SW5 in the Power On state will force to reset the system power except SNVS domain. The Processor will be immediately turn off and reinitiate a boot cycle from the Processor Power Off state. SW3 is POR Reset Button.EVK design files 2.12.4. USER buttonSW4 is the USER Button(GPIO5-00) for developers using. Pressing can produce changes in high and low levels.2.13. User interface LED indicatorThere are four LED status indicators located on the EVK Board. The functions of these LEDs include: •Main Power Supply(D3)Green: DC 5V main supply is normal.Red: J2 input voltage is over 5.6V.Off: the board is not powered.•Reset RED LED(D15)•OpenSDA LED(D16)•USER LED(D5)3. PCB informationThe MIMXRT1020 EVK Board is made using standard 2-layer technology. The material used was FR-4. The PCB stack-up information is shown in Table 7.4. EVK design filesThe schematics, layout files, and gerber files (including Silkscreen) can be downloaded from/MIMXRT1020-EVK(waiting for update).Revision history5. Contents of the Evaluation KitNOTEPower adaptor, Micro SD Card are not standard parts of the Evaluation Kit.6. Revision historyTable 9 summarizes the changes made to this document since the initial release.Document Number: MIMXRT1020EVKHUGRev. 0 05/2018How to Reach Us: Home Page: Web Support: /supportInformation in this document is provided solely to enable system and softwareimplementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein.NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequenti al or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals”, must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: /SalesTermsandConditions . While NXP has implemented advanced security features, all products may be subject to unidentified vulnerabilities. Customers are responsible for the design and operation of their applications and products to reduce the effect of these vulnerabilities oncustomer’s applications and products, and NXP accepts no liability for any vulne rability that is discovered. Customers should implement appropriate design and operating safeguards to minimize the risks associated with their applications and products NXP, the NXP logo, NXP SECURE CONNECTIONS FOR A SMARTER WORLD, , Freescale, the Freescale logo, and Kinetis, are trademarks of NXP B.V. All other product or service names are the property of their respective owners. Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. © 2018 NXP B.V.。

智能对齐器多波传感器说明书

Image courtesy of Fortune Wireless, Indianapolis, IN.RIGHT POINTING ARMS A Major Advancement in Antenna Alignment SystemsLEFT POINTING ARMS RIGHT SIDE OF ANTENNA SIDE MOUNTING FORWARD POINTING ARMS 1981Smart Aligner FeaturesSmart Aligner Specifications Performance Azimuth accuracy: 0.5ºTilt and roll accuracy: 0.1ºPosition accuracy: 60 cm with SBAS Start up time: < 30 seconds Power Internal battery: Rechargeable lithium ion Operation time: 7 hrs (over 80 alignments)Battery charger: AC wall charger and DC car charger Physical Smart Aligner Tool (patent pending)Dimensions: 19”x 4.5”x 3” (48.3 cm x 11.4 cm x 7.6 cm)Weight: 4 lb (1.8 kg)Universal Mounting Bracket (patented)Dimensions: 19”x 5”x 3” (48.3 cm x 12.7 cm x 7.6 cm)Weight: 5 lb (2.3 kg)Carrying Case (contains all components)Dimensions: 21”x 16”x 8.5” (53.3 cm x 40.6 cm x 21.6 cm)Weight: 12 lb (5.4 kg)TOTAL WEIGHT 21 lb (9.5 kg)Communication Ports LED backlit display: User interface and display Wi-Fi: Smart Aligner to user’s mobile device Connectivity: Smartphone/Tablet – iOS or Android Cable interface: Serial RS-232Reporting Report formats: JPEG (screenshot), PDF or CSV Photos: Embedded in PDF report Photos can also be used as a backup, by taking a picture of the User Display.© 2014 Multiwave Sensors Inc. - All rights reserved. MultiWave Sensors and SmartAligner names and logos are trademarks of Multiwave Sensors Inc. Other names, logos and trademarks are property of their respective owners. 1402Multiwave Sensors Inc.8510 Torbram Road, Unit 67Brampton, Ontario L6T 5C7Canada TEL: (905) 458-9060FAX: (905) 458-3079*************************• First foldable GPS Antenna Alignment Tool • Universal Mounting Bracket - only one bracket required • Multiple antenna mounting configurations for the most demanding spatial and RF conditions • Tool and Bracket fit into Ruggedized Case • Carry on baggage acceptable size • Included Backpack to carry the Tool and Bracket – all included weighs 10 pounds • GLONASS (Global Navigation Satellite System) enabled for increased performance • Free smartphone app • Pre-site setup using app : » Azimuth and Tilt targets » Sector/Position » Antenna types • Measure, Verify and Save data using app • Create Report from app » Include up to four photos in the report » Email Report directly from app » Database-ready data • Import emailed Site data directly to app Environmental Operational temp: -22º F to +158º F (-30º C to + 70º C)Sealing: NEMA 4X, IP67Shock/vibration: IEC 68-2-27 / IEC 68-2-6EMI: FCC Part 15 Subpart B: 2008 and ICES-003:2004Mounting Configurations to Antenna Multiple offset positions from bracket: forward, side, backwards on left or right side of antenna Multiple arm positions: user can orientate the arms according to physical limitations Offset and arm position tracking: sensors track tool configuration and adjust the azimuth and tilt relative to antenna Number of mounting configurations: 18Modes of Use (Smart Aligner App)Quick measure: real time display of antenna orientation information with option to save a screenshot of the data Site survey: set up of site and antenna information Align antenna: real time display of antenna orientation information with option to verify the alignment Verify: verify the alignment - ability to ”Save” the alignment information after verification Report mode: create PDF reports from verified alignments or historically saved sites - automatic attachment to email message Import profiles: import CSV file with site and antenna information Export profiles: export completed CSV file with appended measured alignment information - automatic attachment to email message。

Memosens Wave CAS80E 全光谱传感器说明书

应用Memosens Wave CAS80E 全光谱传感器支持多参数测量，包括SAC、光谱衰减系数、TOCeq、CODeq、BODeq、浊度（TU）、悬浮颗粒物浓度（TSS）、硝酸盐（NO3-N）、色度（APHA Hazen）等参数。

全光谱传感器可靠输出测量值，高效实施过程监测，适用于下列应用场合：•饮用水•污水•地表水优势•针对过程条件优化传感器设计•提供三种不同的光程•钛材传感器可以在严苛工况中使用•蓝宝石窗口，长使用寿命•全光谱传感器自带数据处理功能：•信号传输几乎不受干扰因素的影响•响应时间短•不间断检测峰值负载，早期识别，无延迟•开箱即用：支持标准通信协议（Memosens 技术），传感器即插即用•采用压缩空气清洗，长维护周期•按照特定应用要求和用户需求执行传感器标定，实验室和现场标定均可行Products Solutions Services技术资料Memosens Wave CAS80E 全光谱传感器数字式全光谱水质分析传感器TI01522C/28/ZH/03.22-00715973202022-04-25Memosens Wave CAS80E 全光谱传感器2Endress+Hauser功能与系统设计测量原理全光谱传感器由以下部件组成：•电源•频闪光源高压发生器•氙气频闪光源•监测二极管•测量池•光谱计：紫外光（UV）/可见光（VIS），波长范围200 … 800 nm •微处理器1产品设计1光谱分析单元2透镜3监测二极管4光源5测量池光源发射光线，波束穿透透镜，射向介质。

测量池中注有待分析的样品。

进入光谱分析单元的波束经处理，转换成可测量的电信号。

双波束工作原理，补偿光源变化→ 1, 2。

全光谱传感器基于物质吸收特定波长的电磁辐射的原理工作，分析记录的光谱，测定测量参数。

2不同参数对应吸收光谱范围λ波长范围A 吸光度B 紫外光（UV）C 可见光（VIS）a 254 nm，SAC，SSK 1硝酸盐2水质指标：BODeq、CODeq、TOCeq、DOCeq 3色度、浊度、悬浮颗粒物浓度Memosens Wave CAS80E 全光谱传感器Endress+Hauser 3每种分子都有特定的吸收光谱。

灵敏度感应器Flex Sensor的数据手册（spectrasymbol）说明书

Features- Angle Displacement Measurement- Bends and Flexes physically with motion device - Possible Uses - Robotics- Gaming (Virtual Motion) - Medical Devices- Computer Peripherals - Musical Instruments - Physical Therapy - Simple Construction- Low ProfileMechanical SpecificationsElectrical Specifications-Life Cycle: >1 million-Flat Resistance: 10K Ohms ±30%-Bend Resistance: minimum 2 times greater than the flat resistance at 180° pinch bend (see "How it Works" below)-Power Rating : 0.5 Watts continuous; 1 Watt PeakDimensional Diagram - Stock Flex Sensor6.35 [0.250]How It WorksHow to Order - Stock Flex SensorSchematicsFollowing are notes from the ITP Flex Sensor Workshop"The impedance buffer in the [Basic Flex Sensor Circuit] (above) is a single sided operational amplifier, used with these sensors because the low bias current of the op amp reduces errer due to source impedance of the f lex sensor as voltage divider. Suggested op amps are the LM358 or LM324.""You can also test your flex sensor using the simplest circut, and skip the op amp.""Adjustable Buffer- a potentiometer can be added to thecircuit to adjust the sensitivity range.""Variable Deflection Threshold Switch- an op amp is usedand outputs either high or low depending on the voltage of theinverting input. In this way you can use the f lex sensor as aswitch without going through a microcontroller.""Resistance to Voltage Converter- use the sensor as theinput of a resistance to voltage converter using a dual sidedsupply op-amp. A negative reference voltage will give a positiveoutput. Should be used in situations when you want output at alow degree of bending."。

testo 300回ioresidential 商业包含内容说明书

SmartTouchtesto 300 Residential / Commercial KitIncluded in the kit:• t esto 300 combustion analyzer with O2 and CO sensor up to4,000 ppm• U SB power supply• C ompact flue gas probe, 12 in, Ø 0.25 in, Tmax 932°F • S pare dirt filters (10 off)• E asyHeat PC analysis software• I nstrument soft case• O ptional: testo Bluetooth printer, including spare paper Order no. 0564 3002 82 (without printer)0564 3002 83 (with printer)testo 300 Longlife Residential / Commercial kitIncluded in the kit:• t esto 300 combustion analyzer with O₂ and CO sensor up to4,000 ppm• U SB power supply• C ompact flue gas probe, 12 in, Ø 0.25 in, Tmax 932°F• S pare dirt filters (10 off)• E asyHeat PC analysis software• I nstrument case• testo Bluetooth printer, including spare paperOrder no. 0564 3004 79testo 300 Longlife Commercial Kit Included in the kit:• t esto 300 combustion analyzer with O₂ and CO sensor up to 4,000 ppm• U SB power supply• M odular flue gas probe, 12 in, Ø 0.25 in, Tmax 932°F • S pare dirt filters (10 off)• E asyHeat PC analysis software• I nstrument case• O ptional: testo Bluetooth printer, including spare paper Order no. 0564 3004 92 (without printer)0564 3004 93 (with printer)testo 300 Longlife Commercial Kit -NO Included in the kit:• t esto 300 combustion analyzer with O₂, CO up to 4,000 ppm and NO sensor• U SB power supply• M odular flue gas probe, 12 in, Ø 0.25 in, Tmax 932°F• S pare dirt filters (10 off)• E asyHeat PC analysis software• I nstrument case• t esto Bluetooth printer, including spare paperOrder no. 0564 3004 94testo 300 Longlife Commercial / Industrial Kit Included in the kit:• t esto 300 combustion analyzer with O₂ and CO sensorH2-compensated sensor up to 30,000 ppm• NO sensor can be retrofitted• U SB power supply• M odular flue gas probe, 12 in, Ø 0.25 in, Tmax 932°F • S pare dirt filters (10 off)• E asyHeat PC analysis software• I nstrument caseOrder no. 0564 3004 95testo 300 Longlife Commercial / Industrial Kit - NOIncluded in the kit:• t esto 300 combustion analyzer with O₂, CO sensor H2-compen-sated sensor up to 30,000 ppm and NO sensor• U SB power supply• M odular flue gas probe, 12 in, Ø 0.25 in, Tmax 932°F• S pare dirt filters (10 off)• E asyHeat PC analysis software• I nstrument case• t esto Bluetooth printer, including spare paperOrder no. 0564 3004 96Trulycombustionmeasurement.testo 300testo 300 Longlife testo 300 Longlife(30,000 ppm CO)Fuels Oil, gas, solid fuels Oil, gas, solid fuels Oil, gas, solid fuelsSensor slots O₂, CO O₂, CO,NO - can be retrofitted O₂, CO H₂-compensated, NO - can be retrofittedMeasuring ranges CO: 0 to 4,000 ppm CO: 0 to 4,000 ppmCO H₂-compensated:0 to 30,000 ppm(by fresh air dilution)Longlife sensors with upto 6 years' service life–Flue gas loss measurementDraft measurementDifferential / gas flowpressure measurementError and sensor diagnosisZeroing with probe in flue gas––PDF reportsSignature functionWarranty (instrument, probe, O₂ and CO sensors)2 years4 years(NO sensor 2 years)4 years(NO sensor 2 years)Warranty with productregistration3 years 5 years 5 yearsDisplay 5“ HD touch display(1280 x 720 pixels)5“ HD touch display(1280 x 720 pixels)5“ HD touch display(1280 x 720 pixels)Memory1,000,000 readings1,000,000 readings1,000,000 readingsPC software testo EasyHeat software testo EasyHeat software testo EasyHeat softwareInstrument operation via smart-touch display via smart-touch display via smart-touch display SmartTouch。

让误检测的烦恼“归零”堡盟0300光电传感器在传送带上物品检测中的应用

让误检测的烦恼“归零”堡盟0300光电传感器在传送带上物
品检测中的应用
佚名
【期刊名称】《智慧工厂》
【年(卷),期】2016(000)010
【摘要】（1）光电传感器是传感器家族中种类最为齐全、功能最为强大的一种，在生产制造中应用十分广泛。

但你知道吗？受限于所检测物体的介质本身，依然还有许多生产中的检测问题是使用一般的光电传感器无法解决的，这些用户不得不忍受较高的检测差错率。

【总页数】1页(P44-44)
【正文语种】中文
【中图分类】TP212
【相关文献】
1.堡盟SmartReflect智能反射式光电传感器在包装机械中的应用
2.为血液检测提供便利——堡盟UNDK 09超声波传感器在医疗血液检测中的应用
3.让误检测的烦恼＂归零＂
4.堡盟光电传感器0300Y系列
5.让检测永无差错——堡盟工业相机在汽车零部件检测中的应用
因版权原因，仅展示原文概要，查看原文内容请购买。

M10CA 10.1寸高清智能镜说明书

10.1寸高清智能镜R1 型号：M10CA型号MediaTek MT8127芯片架构Cortex A7核心数4核主频 1.5GHz 型号Mali450核心数4核频率最高500Mhz OpenGL版本ES2.0 and 1.1视频加速支持3D加速支持系统内存（RAM）容量2GB DDR3系统存储（ROM）容量16GB Emmc 系统版本安卓5.0语言多语言可选视频格式H.264 HP/MP/BP、MPEG 1/2/4、HEVC、H.263 D1/HP 音频格式WAV 、MP3、MP2、AAC、APE、ADPCM、FLAC 图片格式BMP, JPEG, GIF, PNG 类型IPS 屏幕尺寸10.1寸色彩16.7M 裸屏亮度500cd/m2整机亮度150cd/m2分辨率1200*1920镜面尺寸270*360mm 类型10点触控电容屏(1.8mm)材质G+G 摄像头前置8M 喇叭内置2*3W/4Ω温湿度传感器内置支持类型WIFI 802.11b/g/n 加密方式WEP,WPA,WPA2无线投影支持内置支持版本V4.0USB接口数据接口Type A数据接口 USB DC 内置DC2.0按键触摸按键Power键（白灯）内置电池6400mAh/3.7V 直流输入12V/1.5A 最大功耗18W 待机功耗<2W 中央处理器（CPU）图形处理器（GPU）操作系统（OS）显示屏（LCD）多媒体触摸屏（TP）蓝牙无线Wi-Fi 电源YES 包装盒尺寸包装箱尺寸装箱数量包装盒毛重净重/毛重（kgs ）货柜大小：20尺货柜大小：40尺货柜大小：40尺高柜0℃～+40℃说明书机壳材质铝材和钣金颜色玫瑰金尺寸360*270*15.7mm 产品规格发生变化时，不作另行通知。

AC 线深圳梦牌教育技术有限公司地址：深圳市宝安区西乡街道宝田一路博智中心201重量TDB 存储温度-10℃～+60℃工作温度。

灵活完整的红外光谱系统

每台 Nicolet iS10 光谱仪上都标配有集成面板控制和标准化操作流程 SOP 创建按键，并包含有状态显示和湿度指示。
明确简单的答案，以便质量控制和质量保证的顺利进行
5
通用采样 — 功能卓越
衰减全反射法（ATR）是一种强大的采样技术，它几乎不需要样品制备。用于 Nicolet iS10 光谱仪的 Thermo Scientific Smart iTX ATR 采样配件具有卓越性能和通用采样普适性。
采用 TGA-IR 进行物料分析
• 通过将红外分析与热分析关联，了解材料的更多信息 • 鉴别热分解后各种产物的种类 • 解析混合物、共聚物和混合物的组成
确保您的产品质量并鉴别微观污染物
OMNICSeries 软件以其独特的 Mercury TGA 数据分析功能和 3-D 显示功能，使您可以从 TGA-IR 和其他时效性实验中快速有效地提取有用信息。
性能验证 • 设计认证文件材料（DQ） • OQ、PQ 方案和文件材料 • 可提供安装认证（IQ）
每台 Nicolet iS10 包括符合 ASTM 要求的验证软件和工具，具备下述能力： NIST 系统性能验证方法和 NIST 可追溯标准。ValPro 高级认证包可选择用于要求更高的监管环境和制药行业。
Smart iTX 通用 ATR 采样配件
参考图表
晶体类型
待测样品
金刚石
硒化锌
锗
软固体、粉末
最佳
最佳
良好
硬样品
最佳
弱
弱
刺激性化学品
最佳
弱
良好
金属涂层
良好
弱
弱
液体样品、凝胶

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8
Advantages
Less signal loss - Signal loss, or degradation (退化) results in an unclear signal being received. Optical fibre cables suffer less signal degradation than coaxial cables, particularly over long distances. No interference (干扰) (e.g. electromagnetic)- Unlike the electrical signals used in copper and coaxial cables, light signals from one optical fibre do not interfere with other fibres nearby. This means the fibres can be gathered closer together to save space. It also means there is even less signal loss. Fibre is thinner - Each optical fibre can be smaller in diameter than individual copper wires, meaning more can fit in a smaller space and be gathered together into an optical cable (光缆).
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Advantages
Flexible (柔性) - Optical fibre cables can be bent (弯曲) without a big risk (风险) of breaking the cable. Copper and coaxial cables are less flexible. Use less energy - Because there is less signal loss, lower-power transmitters can be used to send information through optical fibres than through coaxial cables. This reduces cost and maintenance, saving money for customers. Less risk of injury - Because no electricity is sent through optical fibres, there is no risk of electrocution ( 触电) or burns when handling or accidentally cutting through optical fibre cables (光缆). There is also less risk of the cables causing fires.
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What is an Optical Fibre?
A flexible, optically transparent fibre, usually made of glass or plastic, through which light can be transmitted by internal reflections (内部反射).
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Smart Material?
Optical fibres, however, do not do anything to improve the situation, they are pure sensors. They produce data which then needs to be analysed before anything useful can be done by another device to improve the situation. However, optical fibres are very important in smart structures for one important reason – they can provide a distributed sensing system (分布式传感系统), in some ways similar to our own nervous system (中枢神经系统). The information they have gathered can then be used by other systems (sometime smart sometimes not smart) to provide an appropriate response to improve the situation. Therefore optical fibres are very important in the design and operation of smart systems/structures.
Introduction Types of Sensors Light Properties that can be modified
Fibre Optic Sensing Systems Applications
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Optical Fibres
Introduction
Traditionally coaxial cables (同轴电缆) are used for data transfer. However, over the past 20 years optical fibres have revolutionized the telecommunications industry ( 电信业革命) by providing higher performance, more reliable telecommunications links with ever decreasing bandwidth (带宽) cost. As a result the cost of optical fibres has fallen and the quality has increased.
Chromism - Review Questions
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Fibre Optic Sensors 光纤传感器
Smart Material?
An optical fibre is an optically pure glass (光学纯玻璃) or plastic fibre as thin as a human hair that carries information in the form of light over long distances. Is it a smart material? A smart material is a material that converts energy from one form to another.
An average human hair is 18-80µm
0.5mmຫໍສະໝຸດ 11Principle of Operation
The light in an optical fibre travels through (传播) the core by reflecting (反射) off the cladding. Because the cladding does not absorb any light from the core, the light wave can travel great distances. However, some of the light signal degrades (退化) within the fibre, mostly due to impurities in the glass (杂质在玻璃). The amount that the signal degrades depends on the purity of the glass (玻璃的纯度) and the wavelength (波长) of the transmitted light The reflection of the light within the core is based on a principle called total internal reflection (TIR) (全内反射全内反射). 全内反射 TIR is based on refraction (a change in the velocity of light as it changes media).
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Lecture 10 – Teaching Aims
Optical Fibres
Introduction What is an Optical Fibre Principle of Operation Types of Fibres Dispersion losses (色散损失)
Fibre Optic Sensors
Normally a smart material is used in a situation where the energy conversion produces a response which improves the situation.
Piezoelectric - lighter SMA – change the shape of an aircraft wing MR fluids – reduce vibrations Chromism – make your clothes look good
Changes in many different types of energy in the surrounding environment can cause a change in the energy/properties of the light transmitted along the optical fibre.