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金士顿e MMC 5.1嵌入式多媒体卡（e

Embedded Multi-Media Card(e•MMC™ 5.1)EMMC16G-IB29-PE90EMMC32G-IB29-PE90EMMC64G-IB29-PE90v1.0Product Features•Packaged managed NAND flash memory with e•MMC™ 5.1 interface•Backward compatible with all prior e•MMC™ specification revisions•153-ball JEDEC FBGA RoHS Compliant package•Operating voltage range:o VCCQ = 1.8 V/3.3 Vo VCC = 3.3 V•Operating Temperature (T case) - 40C to +85C•Storage Temperature -55C to +85C•Compliant with e•MMC™ 5.1 JEDEC Standard Number JESD84-B51•Factory configured with pseudo Single Level Cell (pSLC) mode for enhanced reliability and performance•Factory configured with reliable writee•MMC™ Specific Feature Support•High-speed e•MMC™ protocol•Variable clock frequencies of 0-200MHz•Ten-wire bus interface (clock, 1 bit command, 8 bit data bus) with an optional hardware reset •Supports three different data bus widths: 1 bit(default), 4 bits, 8 bits•Bus Modes:o Single data transfer rate: up to 52MB/s (using 8 parallel data lines at 52MHz)o Dual data rate mode (DDR-104) : up to 104MB/s @ 52MHzo High speed, single data rate mode (HS-200) : up to 200MB/s @ 200MHzo High speed, dual data rate mode (HS-400) : up to 400MB/s @ 200MHz•Supports alternate boot operation mode to provide a simple boot sequence methodo Supports SLEEP/AWAKE (CMD5)o Host initiated explicit sleep mode for power saving•Enhanced write protection with permanent and partial protection options•Multiple user data partition with enhanced attribute for increased reliability•Error free memory accesso Cyclic Redundancy Code (CRC) for reliable command and data communicationo Internal error correction code (ECC) for improved data storage integrityo Internal enhanced data management algorithmo Data protection for sudden power failure during program operations•Securityo Secure bad block erase commandso Enhanced write protection with permanent and partial protection options•Power off notification for sleep•Field firmware update (FFU)•Production state awareness•Device health report•Command queuing•Enhanced strobe•Cache flushing report•Cache barrier•Background operation control & High Priority Interrupt (HPI)•RPMB throughput improvement•Secure write protection•Pre EOL information•Optimal sizeProduct DescriptionKingston’s e•MMC™ products conform to the JEDEC e•MMC™ 5.1standard. These devices are an ideal universal storage solution for many commercial and industrial applications. In a single integrated packaged device, e•MMC™ combines triple-level cell (TLC) NAND flash memory with an onboard e•MMC™ controller, providing an industry standard interface to the host system. The integrated e•MMC™ controller directly manages NAND flash media which relieves the host processor of these tasks, including flash media error control, wear-leveling, NAND flash management and performance optimization. Future revision to the JEDEC e•MMC™ standard will always maintain backward compatibility. The industry standard interface to the host processor ensures compatibility across future NAND flash generations as well, easing product sustainment throughout the product life cycle. ConfigurationsKingston’s e•MMC™ products support a variety of configurations that allow the e•MMC™ device to be tailored to your specific application needs. The most popular configurations described below are each offered under standard part numbers.Standard TLC – By default the e•MMC™ device is configured with the NAND flash in a standard TLC mode. This configuration provides reasonable performance and reliability for many applications. Pseudo Single Level Cell (pSLC) – The TLC NAND flash in the Kingston e•MMC™ device can be configured to further improve device endurance, data retention, reliability and performance over the standard TLC configuration. This is done by converting the NAND TLC cells to a pseudo single level cell (SLC) configuration. In this configuration, along with the performance and reliability gains, the device capacity is reduced by 2/3 of the capacity. This one-time configuration is achieved by setting the e•MMC™ enhanced attribute for the hardware partition.Kingston e•MMC™ can be ordered preconfigured with the option of reliable write or pSLC at no additional cost. Standard TLC devices can also be one-time configured in-field by following the procedures outlined in the JEDEC e•MMC™ specification. The JEDEC e•MMC™ specification allows for many additional configurations such as up to 4 additional general purpose (GPn) hardware partitions each with the option to support pSLC and reliable write. Additionally, Kingston provides a content loading service that can streamline your product assembly while reducing production costs. For more information, contact your Kingston representative.Kingston e•MMC™ devices are fully compliant with the JEDEC Standard Specification No. JESD84-B51. This datasheet provides technical specifications for Kingston’s family of e•MMC™ devices. Refer to the JEDEC e•MMC™ standard for specific information related to e•MMC™ device function and operation. See: /sites/default/files/docs/JESD84-B51.pdfe•MMC™ Mode and ControllerTLC mode using PS8229 - Leading edge 3D NAND flash technology in TLC mode rated to 3,000 endurance cycles.- Strong data protection with LDPC Error control- Improved data integrity with end-to-end data protection.pSLC mode using PS8229 - Leading edge 3D NAND flash technology in pSLC mode.- Strong data protection with LDPC Error control- Improved data integrity with end-to-end data protection.Part NumberingFigure 1 – Part Number FormatEMMC 16G - xxxx - PE90A B C DPart Number FieldsA: Product Family : EMMCB: Device Capacity : Available capacities of 16GB – 64GBC: Hardware Revision and ConfigurationD: Device Firmware Revision and ConfigurationTable 1 - Device SummaryDevice PerformanceTable 2 below provides sequential read and write speeds for all capacities. Performance numbers can vary under different operating conditions. Values are given at HS400 bus mode. Contact your Kingston Representative for performance numbers using other bus modes.Power ConsumptionDevice current consumption for various device configurations is defined in the power class fields of the EXT_CSD register. Power consumption values are summarized in Table 3 below.Device and Partition CapacityThe device NAND flash capacity is divided across two boot partitions (2048 KB each), a Replay Protected Memory Block (RPMB) partition (512 KB), and the main user storage area. Four additional general purpose storage partitions can be created from the user partition. These partitions can be factory preconfigured or configured in-field by following the procedure outlined in section 6.2 of the JEDEC e•MMC™ specification JESD84-B51. A small portion of the NAND storage capacity is used for the storage of the onboard controller firmware and mapping tables. Additionally, several NAND blocks are held in reserve to boost performance and extend the life of the e•MMC™ device. Table 4 identifies the specific capacity of each partition. This information is reported in the device EXT_CSD register. The contents of this register are also listed in the Appendix.e•MMC™ Bus ModesKingston e•MMC™ devices support all bus modes defined in the JEDEC e•MMC™ 5.1 specification. These modes are summarized in Table 6 below.Signal DescriptionTable 7 - e•MMC™ Signals Name Type DescriptionCLK I Clock: Each cycle of this signal directs a one bit transfer on the command and either a one bit (1x) or a two bits transfer (2x) on all the data lines. The frequency may vary between zero and the maximum clock frequency.DAT[7:0] I/O/PP Data: These are bidirectional data channels. The DAT signals operate in push-pull mode. These bidirectional signals are driven by either the e•MMC™ device or the host controller. By default, after power up or reset, only DAT0 is used for data transfer. A wider data bus can be configured for data transfer, using either DAT0-DAT3 or DAT0-DAT7, by the e•MMC™ host controller. The e•MMC™ device includes internal pull-ups for data lines DAT1-DAT7. Immediately after entering the 4-bit mode, the device disconnects the internal pull ups of lines DAT1, DAT2, and DAT3. Correspondingly, immediately after entering to the 8-bit mode, the device disconnects the internal pull-ups of lines DAT1–DAT7.CMD I/O/PP/OD Command: This signal is a bidirectional command channel used for device initialization and transfer of commands. The CMD signal has two operation modes: open-drain for initialization mode, and push-pull for fast command transfer. Commands are sent from the e•MMC™ host controller to the e•MMC™ device and responses are sent from the device to the host.DS O This signal is generated by the device and used for output in HS400 mode. The frequency of this signal follows the frequency of CLK. For data output each cycle of this signal directs two bits transfer(2x) on the data - one bit for positive edge and the other bit for negative edge. For CRC status response output and CMD response output (enabled only HS400 enhanced strobe mode), the CRC status and CMD Response are latched on the positive edge only, and don't care on the negative edge.RST_n I Hardware Reset: By default, hardware reset is disabled and must be enabled in the EXT_CSD register if used. Otherwise, it can be left un-connected.RFU - Reserved for future use: These pins are not internally connected. Leave floatingNC - Not Connected: These pins are not internally connected. Signals can be routed through these balls to ease printed circuit board design. See Kingston’s Design Guidelines for further details.VSF - Vendor Specific Function: These pins are not internally connectedVddi - Internal Voltage Node: Note that this is not a power supply input. This pin provides access to the output of an internal voltage regulator to allow for the connection of an external Creg capacitor. See Kingston’s Design Guidelines for further details.Vcc S Supply voltage for core Vccq S Supply voltage for I/ODesign GuidelinesDesign guidelines are outlined in a separate document. Contact your Kingston Representative for more information.Package DimensionsFigure 2 – Package DimensionsFigure 3 – Ball Pattern DimensionsBall Assignment (153 ball)Table 8 – Ball Assignment, Top View (HS400)1 2 3 4 5 6 7 8 9 10 11 12 13 14A NC NC DAT0 DAT1 DAT2 Vss RFU NC NC NC NC NC NC NC AB NC DAT3 DAT4 DAT5 DAT6 DAT7 NC NC NC NC NC NC NC NC BC NC Vddi NC Vssq NC Vccq NC NC NC NC NC NC NC NC CD NC NC NC NC NC NC NC DE NC NC NC RFU Vcc Vss VSF VSF VSF NC NC NC EF NC NC NC Vcc VSF NC NC NC FG NC NC RFU Vss VSF NC NC NC GH NC NC NC DS Vss NC NC NC H J NC NC NC Vss Vcc NC NC NC J K NC NC NC RST_n RFU RFU Vss Vcc VSF NC NC NC K L NC NC NC NC NC NC L M NC NC NC Vccq CMD CLK NC NC NC NC NC NC NC NC M N NC Vssq NC Vccq Vssq NC NC NC NC NC NC NC NC NC N P NC NC Vccq Vssq Vccq Vssq RFU NC NC RFU NC NC NC NC P1 2 3 4 5 6 7 8 9 10 11 12 13 14 Note: VSF, RFU and NC balls are not electrically connected. RFU balls may be defined with functionality by the Joint Electron Device Engineering Council (JEDEC) in future revisions of the e•MMC™ standard. Please refer to Kingston’s design guidelines for more info.Device MarkingFigure 4 - EMMC Package Marking240xxxx-xxx.xxxxYYWW PPPPPPPPxxxxxxx-xxxx2xxxxxxTAIWANKingston Logo240xxxx-xxx.xxxx：Internal control numberYYWW：Date code (YY– Last 2 digits ofyear, WW- Work week)PPPPPPPP： Internal control numberxxxxxxx-xxxx Sales P/N2xxxxxx : Internal control numberCountry：TAIWANCard Identification Register (CID)The Card Identification (CID) register is a 128-bit register that contains device identification information used during the e•MMC™ protocol device identification phase. Refer to JEDEC Standard Specification No.JESD84-B51 for details.Field Byte ValueMID [127:120] 0x70reserved [119:114] 0x00CBX [113:112] 0x01OID [111:104] 0x00PNM [103:56 ] IB2916(16G) IB2932(32G) IB2964(64G)PRV [ 55:48 ] 0x90PSN [ 47:16 ] RandomMDT [ 15:8 ] month, yearCRC [ 7:1 ] Follows JEDEC Standard reserved [ 0:0 ] 0x01Card Specific Data Register [CSD]The Card-Specific Data (CSD) register provides information on how to access the contents stored in e•MMC™. The CSD registers are used to define the error correction type, maximum data access time, data transfer speed, data format…etc. For details, refer to section 7.3 of the JEDEC Standard Specification No.JESD84-B51.Field Byte ValueCSD_Structure [127:126] 0x03 (V2.0)SPEC_VER [125:122] 0x04 (V4.0~4.2)reserved [121:120] 0x00TAAC [119:112] 0x4F (40ms)NSAC [111:104] 0x01TRAN_SPEED [103:96 ] 0x32 (26Mbit/s)CCC [ 95:84 ] 0x0F5READ_BL_LEN [ 83:80 ] 0x09 (512 Bytes)READ_BL_PARTIAL [ 79:79 ] 0x00WRITE_BLK_MISALIGN [ 78:78 ] 0x00READ_BLK_MISALIGN [ 77:77 ] 0x00DSR_IMP [ 76:76 ] 0x00reserved [ 75:74 ] 0x00C_SIZE [ 73:62 ] 0xFFFVDD_R_CURR_MIN [ 61:59 ] 0x07 (100mA)VDD_R_CURR_MAX [ 58:56 ] 0x07 (200mA)VDD_W_CURR_MIN [ 55:53 ] 0x07 (100mA)VDD_W_CURR_MAX [ 52:50 ] 0x07 (200mA)C_SIZE_MULT [ 49:47 ] 0x07 (512 Bytes)ERASE_GRP_SIZE [ 46:42 ] 0x1FERASE_GRP_MULT [ 41:37 ] 0x1FWP_GRP_SIZE [ 36:32 ] 0x0FWP_GRP_ENABLE [ 31:31 ] 0x01DEFAULT_ECC [ 30:29 ] 0x00R2W_FACTOR [ 28:26 ] 0x02WRITE_BL_LEN [ 25:22 ] 0x09 (512 Bytes)WRITE_BL_PARTIAL [ 21:21 ] 0x00reserved [ 20:17 ] 0x00CONTENT_PROT_APP [ 16:16 ] 0x00FILE_FORMAT_GRP [ 15:15 ] 0x00COPY [ 14:14 ] 0x00PERM_WRITE_PROTECT [ 13:13 ] 0x00TMP_WRITE_PROTECT [ 12:12 ] 0x00FILE_FORMAT [ 11:10 ] 0x00Field Byte ValueECC [ 9:8 ] 0x00CRC [ 7:1 ] Follow JEDEC Standard reserved [ 0:0 ] 0x01Extended Card Specific Data Register [EXT_CSD]The Extended CSD register defines the Device properties and selected modes. It is 512 bytes long. The most significant 320 bytes are the Properties segment, which defines the Device capabilities and cannot be modified by the host. The lower 192 bytes are the Modes segment, which defines the configuration the Device is working in. These modes can be changed by the host by means of the SWITCH command. For details, refer to section 7.4 of the JEDEC Standard Specification No.JESD84-B51.Field Byte ValueReserved [511:506] 0EXT_SECURITY_ERR [505:505] 0x00S_CMD_SET [504:504] 0x01HPI_FEATURES [503:503] 0x01BKOPS_SUPPORT [502:502] 0x01MAX_PACKED_READS [501:501] 0x3CMAX_PACKED_WRITES [500:500] 0x20DATA_TAG_SUPPORT [499:499] 0x01TAG_UNIT_SIZE [498:498] 0x03TAG_RES_SIZE [497:497] 0x00CONTEXT_CAPABILITIES [496:496] 0x05LARGE_UNIT_SIZE_M1 [495:495] 0x17(16G) 0x2F(32G) 0x5F(64G)EXT_SUPPORT [494:494] 0x03 SUPPORTED_MODES [493:493] 0x01FFU_FEATURES [492:492] 0x00 OPERATION_CODE_TIMEOUT [491:491] 0x00FFU_ARG [490:487] 65535 BARRIER_SUPPORT [486:486] 0x01Reserved [485:309] 0CMDQ_SUPPORT [308:308] 0x01CMDQ_DEPTH [307:307] 0x0FReserved [306:306] 0x00 NUMBER_OF_FW_SECTORS_CORRECTLY_PROGRAMMED [305:302] 0 VENDOR_PROPRIETARY_HEALTH_REPORT [301:270] 0 DEVICE_LIFE_TIME_EST_TYP_B [269:269] 0x01DEVICE_LIFE_TIME_EST_TYP_A [268:268] 0x01PRE_EOL_INFO [267:267] 0x01 OPTIMAL_READ_SIZE [266:266] 0x01OPTIMAL_WRITE_SIZE [265:265] 0x08Field Byte Value OPTIMAL_TRIM_UNIT_SIZE [264:264] 0x01 DEVICE_VERSION [263:262] 0FIRMWARE_VERSION [261:254] 0x90 PWR_CL_DDR_200_360 [253:253] 0x00 CACHE_SIZE [252:249] 1024 GENERIC_CMD6_TIME [248:248] 0x32 POWER_OFF_LONG_TIME [247:247] 0xFF BKOPS_STATUS [246:246] 0x00 CORRECTLY_PRG_SECTORS_NUM [245:242] 0 INI_TIMEOUT_AP [241:241] 0x64 CACHE_FLUSH_POLICY [240:240] 0x01 PWR_CL_DDR_52_360 [239:239] 0x00 PWR_CL_DDR_52_195 [238:238] 0x00PWR_CL_200_195 [237:237] 0x00PWR_CL_200_130 [236:236] 0x00 MIN_PERF_DDR_W_8_52 [235:235] 0x00 MIN_PERF_DDR_R_8_52 [234:234] 0x00 Reserved [233:233] 0x00TRIM_MULT [232:232] 0x11(16G) 0x11(32G) 0x22(64G)SEC_FEATURE_SUPPORT [231:231] 0x55 SEC_ERASE_MULT [230:230] 0xF7 SEC_TRIM_MULT [229:229] 0xF7 BOOT_INFO [228:228] 0x07Reserved [227:227] 0x00 BOOT_SIZE_MULT [226:226] 0x20ACC_SIZE [225:225] 0x07(16G) 0x08(32G) 0x09(64G)HC_ERASE_GRP_SIZE [224:224] 0x01ERASE_TIMEOUT_MULT [223:223] 0x11(16G) 0x11(32G) 0x22(64G)REL_WR_SEC_C [222:222] 0x01HC_WP_GRP_SIZE [221:221] 0x10 S_C_VCC [220:220] 0x08S_C_VCCQ [219:219] 0x08 PRODUCTION_STATE_AWARENESS_TIMEOUT [218:218] 0x14 S_A_TIMEOUT [217:217] 0x15 SLEEP_NOTIFICATION_TIME [216:216] 0x0FField Byte ValueSEC_COUNT [215:212] 10207232 (16G) 20414464 (32G) 40828928 (64G)SECURE_WP_INFO [211:211] 0x01 MIN_PERF_W_8_52 [210:210] 0x08 MIN_PERF_R_8_52 [209:209] 0x08 MIN_PERF_W_8_26_4_52 [208:208] 0x08 MIN_PERF_R_8_26_4_52 [207:207] 0x08 MIN_PERF_W_4_26 [206:206] 0x08 MIN_PERF_R_4_26 [205:205] 0x08 Reserved [204:204] 0x00 PWR_CL_26_360 [203:203] 0x00 PWR_CL_52_360 [202:202] 0x00 PWR_CL_26_195 [201:201] 0x00 PWR_CL_52_195 [200:200] 0x00 PARTITION_SWITCH_TIME [199:199] 0xFF OUT_OF_INTERRUPT_TIME [198:198] 0xFF DRIVER_STRENGTH [197:197] 0x1F DEVICE_TYPE [196:196] 0x57 Reserved [195:195] 0x00 CSD_STRUCTURE [194:194] 0x02 Reserved [193:193] 0x00 EXT_CSD_REV [192:192] 0x08 CMD_SET [191:191] 0x00Reserved [190:190] 0x00 CMD_SET_REV [189:189] 0x00 Reserved [188:188] 0x00 POWER_CLASS [187:187] 0x00 Reserved [186:186] 0x00HS_TIMING [185:185] 0x01 STROBE_SUPPORT [184:184] 0x01 BUS_WIDTH [183:183] 0x02Reserved [182:182] 0x00 ERASED_MEM_CONT [181:181] 0x00 Reserved [180:180] 0x00 PARTITION_CONFIG [179:179] 0x00 BOOT_CONFIG_PROT [178:178] 0x00 BOOT_BUS_CONDITIONS [177:177] 0x00 Reserved [176:176] 0x00 ERASE_GROUP_DEF [175:175] 0x00 BOOT_WP_STATUS [174:174] 0x00C - 4Field Byte Value BOOT_WP [173:173] 0x00 Reserved [172:172] 0x00 USER_WP [171:171] 0x00 Reserved [170:170] 0x00 FW_CONFIG [169:169] 0x00 RPMB_SIZE_MULT [168:168] 0x20 WR_REL_SET [167:167] 0x00 WR_REL_PARAM [166:166] 0x15 SANITIZE_START [165:165] 0x00 BKOPS_START [164:164] 0x00 BKOPS_EN [163:163] 0x00 RST_n_FUNCTION[162:162] 0x00 HPI_MGMT[161:161] 0x00 PARTITIONING_SUPPORT [160:160] 0x07 MAX_ENH_SIZE_MULT [159:157] 623(16G) 1246(32G) 2492(64G) PARTITIONS_ATTRIBUTE[156:156] 0x01 PARTITION_SETTING_COMPLETED[155:155] 0x01 GP_SIZE_MULT_4 [154:152] 0 GP_SIZE_MULT_3 [151:149] 0 GP_SIZE_MULT_2 [148:146] 0 GP_SIZE_MULT_1[145:143] 0 ENH_SIZE_MULT[142:140] 623(16G) 1246(32G) 2492(64G)ENH_START_ADDR[139:136] 0 Reserved[135:135] 0x00 SEC_BAD_BLK_MGMNT[134:134] 0x00 PRODUCTION_STATE_AWARENESS[133:133] 0x00 TCASE_SUPPORT [132:132] 0x00 PERIODIC_WAKEUP[131:131] 0x00 PROGRAM _CID_CSD_DDR_SUPPORT[130:130] 0x01 Reserved[129:128] 0 VENDOR_SPECIFIC_FIELD[127:67 ] 538968064ERROR_CODE [ 66:65 ] 0 ERROR_TYPE[ 64:64 ] 0x00 NATIVE_SECTOR_SIZE [ 63:63 ] 0x00 USE_NATIVE_SECTOR [ 62:62 ] 0x00 DATA_SECTOR_SIZE [ 61:61 ] 0x00 INI_TIMEOUT_EMU[ 60:60 ] 0x00C - 5FieldByte Value CLASS_6_CTRL [ 59:59 ] 0x00 DYNCAP_NEEDED[ 58:58 ] 0x00 EXCEPTION_EVENTS_CTRL [ 57:56 ] 0 EXCEPTION_EVENTS_STATUS [ 55:54 ] 0 EXT_PARTITIONS_ATTRIBUTE[ 53:52 ] 0 CONTEXT_CONF[ 51:37 ] 0 PACKED_COMMAND_STATUS [ 36:36 ] 0x00 PACKED_FAILURE_INDEX [ 35:35 ] 0x00 POWER_OFF_NOTIFICATION[ 34:34 ] 0x00 CACHE_CTRL [ 33:33 ] 0x00 FLUSH_CACHE [ 32:32 ] 0x00 BARRIER_CTRL [ 31:31 ] 0x00 MODE_CONFIG[ 30:30 ] 0x00 MODE_OPERATION_CODES[ 29:29 ] 0x00 Reserved [ 28:27 ] 0 FFU_STATUS[ 26:26 ] 0x00 PRE_LOADING_DATA_SIZE [ 25:22 ] 0MAX_PRE_LOADING_DATA_SIZE[ 21:18 ] 3304106(16G) 6608213(32G) 13216426(64G)PRODUCT_STATE_AWARENESS_ENABLEMENT[ 17:17 ] 0x01 SECURE_REMOVAL_TYPE[ 16:16 ] 0x01 CMDQ_MODE_EN[ 15:15 ] 0x00 Reserved[ 14:0 ]。

驱动课程资料GEC6818开发板-硬件手册V1.1-201706

目录版权声明 (1)目录 (2)第一章前言 (3)1.1目的 (3)1.2对象范围 (3)第二章开发平台介绍 (4)2.1开发平台简介 (4)2.2S5P6818芯片特性 (5)第三章硬件资源 (6)3.1核心板资源 (6)3.1.1核心板特性 (6)3.1.2特性参数 (7)3.1.3引脚定义 (8)3.2开发板底板资源 (11)3.2.1平台硬件接口介绍 (11)3.2.2常用接口说明 (13)3.3.3LCD电容触摸屏 (16)第四章配置清单 (17)4.1标配清单 (17)4.2选配硬件清单 (17)4.3开发板资料清单 (17)第一章前言1.1目的帮助初学者快速了解和熟悉GEC6818开发平台。

另外，在使用设备之前，请仔细阅读和遵循该手册进行使用以及操作，以免非常规操作而导致设备的损坏；1.2对象范围该手册适用于该平台的初次使用者，既适合于计算机，软件，电子信息，自动化，机电一体化等开设嵌入式相关专业教师和学生，又适合于从事PMP、PDA、智能手机研发的硬件和软件工程师。

第二章开发平台介绍2.1开发平台简介GEC6818开发平台，核心板采用10层板工艺设计，确保稳定可靠，可以批量用于平板电脑，车机，学习机，POS机，游戏机，行业监控等多种领域。

该平台搭载三星Cortex-A53系列高性能八核处理器S5P6818，最高主频高达1.4GHz，可应用于嵌入式Linux和Android等操作系统的驱动、应用开发。

开发板留有丰富的外设，支持千兆以太网、板载LVDS接口、MIPI接口、USB接口等。

GEC6818开发平台支持三大操作系统，具备完整的教学资源和教学内容，包括：ARM微处理器系统驱动的实验、嵌入式实时操作系统Linux开发、嵌入式Android系统开发、嵌入式Android应用开发、嵌入式系统项目实战开发等内容。

尼克萨里鸟控制产品说明书

Effective Installations Don't Just Happen...They Are Planned.Thorough planning,proper instal-lation,follow-up maintenance in the first weeks and periodic inspection of the mounting sys-tem,are the keys to a successful plan for Nixalite Bird Control.Always study the building carefully .Nixalite must be installed on all areas where birds alight,roost or build nests.All areas above,from which birds can drop nesting materials,as well as areas where birds can fly above the installation to drop materi-als,must be protected with Nixalite.Even though stainless steel has a very low rate of corrosion or reaction with other metals,it is still recommended to apply a protective coating or sealer on dissimilar metal surfaces before installing Nixalite to prevent any gal-vanic action.When installing Nixalite in small pieces or on a complicated surface,cut and fit each piece carefully .Be patient and thorough when applying Nixalite,being sure to cover all con-tours and angles closely .Do not jam the Nixalite together .Before deciding on the proper amount of Nixalite to be used,there are some specific figures to consider .Take time to establish the proper position and amount of the Nixalite by referring to the Surface Depth and charts on .Too much Nixalite can be as ineffective as too little."Space-i-fication"page 4All exposed edges,as well as the inte-rior of flat surfaces,must be covered.On inside corners,particularly cornice returns and similarly protected areas,it may be necessary to make a screen or special device with Nixalite to close off the protected area.In some areas,the Nixalite should be installed both on the surface and upside down on the surface directly above.Nixalite can be used on pipes,sup-ports and similar areas.It is also used as a deterrent for climbing ani-mals,rodents and humans.Clean the surface thoroughly with a disinfectant.The scent of bird drop-pings can encourage the birds to come back.Birds will fight hard to retain their old roosts.Before installing Nixalite remove all overhanging branches and similar foliage where birds can land to drop nesting materials.A free consultation service is pro-vided by our planning depart-ment.Submit drawings with exact measurements for recommendations.On site consultation is available by request.However ,there is a charge for this service.In cases where the accumulation ofQuestions About Y our Installation?Ph:800-624-1189or 309-755-8771Fax:800-624-1196or 309-755-0077E-mail:*********************Website:www For your protection ,wear goggles,gloves and a protective mask to help protect you against the health haz-ards associated with the bird debris.bird dung is heavy ,it may be neces-sary to use a bactericide to kill the dis-ease carrying bacteria.1.Carefully measure the depth and length of the surface,then refer to the Surface Depth Specification Charts page 4on for the number of rows needed.It is sometimes necessary to measure for height clearance when installing Nixalite in tight spaces.Proper placement and quantity of Nixalite starts with accurate mea-surements of the surface.Installing Nixalite StripsNOTE:Make sure the dimensionsyou record are accurate .Do not guess or estimate dimensions from a distance.Accurate dimensions are essential for an effective Nixalite installation.The Guide To Success121819gaw - new mhdBefore installing the Nixalite strips into the mounting hard-ware,there are some important guidelines that must be followed.2.Do not leave gaps in the Nixalite coverage.Cover all possible land-ing areas above,behind or next to the installation areas.1.Be sure the Nixalite strips will fit the area properly .The Nixalite base strip must follow the installa-tion surface closely .3.At the exposed ends of a surface ,run the strips over the ends.Make sure the of the strip is the or wire at all exposed surface ends.Make sure the strip wires extend at least over the outside edges.1/2"tallest wire first last 1/4"2.Mark where the Nixalite base strip will be positioned.To help you space the Nixalite on the surface correctly ,refer to the "Space-i-fications "chart on page 4.Steel or IronMounting Hardware InstructionsAll Nixalite mounting hardware is made of high grade stainless steel or weather resistant materials. If you have any questions or need more information, contact Nixalite or go to .4.Slip Nixalite base strip into mount-ing clips.3.Drive flush with hammer .MasonryWood &Sheet Metal4.Slip Nixalite base strip into mount-ing clips.1.Drill 11/64"diameter holes,at least 1/2"deep or through the steel.2.Blow out debris,insert anchors.3.Insert sheet metal screws through the mounting clips and drive flush into anchors with a screw driver .1.If necessary ,make small guide holes with a drill,punch,etc.2.Insert stainless steel sheet metal screw through the mounting clip and washer (in that order ,top to bottom).1.Drill 3/16”diameter holes,1"deep.4.Slip Nixalite base strip into mount-ing clips.Optional:Fill drilled holes with silicone sealer before installing hardware.This provides protection against water damage2.Insert stainless steel drive screws with mounting clips and washers (in that order ,top to bottom)into drilled holes.Fill drilled holes with silicone sealer before inserting anchors.This provides protection against water damage.Optional:Use the Mounting HardwareSpacing Chart on page 4to find the proper mounting hardware spacing.e a screw driver to drive screws,clips and washers flush to surface.The "hook"end of the mounting clip should point to the closest out-side edge of the surface.e the Mounting HardwareSpacing Chart on ,to deter-mine the proper mounting hard-ware spacing.Make a mark for each mounting hardware unit,or use an installation template.Call Nixalite for installation template details.page 43.Mounting hardware is installed 7/8"from Nixalite base strip.Mark the surface where the mounting hardware units are to be placed.MasonryWood/Sheet MetalNixalite Mounting Hardware UnitsQuestions About Y our Installation?Ph:800-624-1189 or 309-755-8771 Fax:800-624-1196 or 309-755-0077Wire Tie and Adhesive2.Apply adhesive to the bottom of the Nixalite base strip and to the installation surface.Recommended for fastening the Nixalite strips to suspended struc-tures,such as pipe,cables,etc.Follow the adhesive manufacturers direc-tions printed on the container .1.Clean the surface thoroughly ."Non-removable"Method1.Clean the surface thoroughly .2.By following manufacturers direc-tions printed on the adhesive con-tainer ,apply adhesive to surface where clips are to be attached.Put clips into the adhesive,making sure not to get any adhesive into the hook end of the clip.The clip hook should point to the closest out-side edge of the surface.3.Cover the eyelet end of the clip with adhesive.Make sure not to get adhesive into the hook end of the mounting clip.5.It is absolutely necessary to allow the adhesive holding the mounting clips to cure for at least 24hours before inserting the Nixalite strips.Removable MethodKeeping TabsWhen the use of supplied mounting hardware is not possible,a removable adhesive installation can be done.However ,it is recommended to use one mounting hardware unit at each end of the Nixalite strip to ensure solid mounting.1.Clean the surface thoroughly .2.By following manufacturers direc-tions printed on the adhesive con-tainer ,apply adhesive to surface where clips are to be attached.Put clips into this adhesive,making sure not to get any adhesive into the hook end of the clip.The hook end of clip should point toward the closest outside edge of the surface (see sketch #2at left).3.Cover the eyelet of the mounting clip with adhesive making sure not to get adhesive in the hook end of the clip (see sketch #3at left).4.It is absolutely necessary to allow the adhesive holding the mounting clips to cure for at least 24hours before inserting the Nixalite strips.By setting up a bi-annual visualinspection of the installation,you can keep an eye out for any debris that may get caught in the needles of the strips.Also inspect the mounting hard-ware system at this time.This allows re-securing the strips in the unlikely event that the strips have come loose from the hardware.Bear in mind that the birds may fight to retain their nesting and roosting places.Credit the birds for being cun-ning,persistent and tenacious.Sufficient Nixalite must be installed to do the job effectively .Careful observa-tion before the installation is neces-sary to locate all the problem areas.Remember that birds will try to drop sticks and other nesting materials into the Nixalite in an attempt to.....continued next pageIn Closing...3.Press the Nixalite strip into the sur-face adhesive.4.Wrap the wire tie around the strip and the suspended surface.Twist the loop ends with wire tying tool until tight.Space the wire ties in accordance with the Mounting Hardware Spacing Chart on page 4of this guideline.Adhesive Installation InstructionsWhen the use of supplied mounting hardware is not possible,an adhesive installation can be done.It is recom-mended to use one mounting hard-ware unit at each end of the Nixalite strip to ensure solid mounting.Always follow instructions printed on the adhesive container .4.After the adhesive holding the clips has cured,apply adhesive to the bottom of the Nixalite base strip and the installation surface.Slip the Nixalite strip into the mounting clips.For More Information or Planning AssistanceE-mail:*********************Careful thought and planning are required to make the installation suc-cessful.We can furnish the material,render it useless.That is why the areas above the installation must be pro-tected with Nixalite strips.but it must be installed with skill and ingenuity .Naturally ,since there are so many dif-ferent factors to be considered,we make no warranties,guarantees or representations,expressed or implied.Surface Depth Specification ChartsDetails to Remember:Nixalite "Space-i-fication" ChartsMounting Hardware Spacing Chart*½row indicates the use of Model H Nixalite.Whole number indicate the use of full row models S Nixalite.charts apply to .If using Model W ,review the Installing Model W Nixalite pages from Nixalite.Download this brochure from www or contact Nixalite for a free copy .NOTE:Model W Nixalite DO NOT A Always measure from the of the Nixalite base strip.center C1¾”(4.4cm)max.from the outsiderow .B5”(12.7cm)max.and 3½”(8.9cm)min.between two rows of Nixalite.2½”(6.4cm)max.and 2”(5.1cm)min.between models H and S Nixalite.E Extend Nixalite base strip at least ½”(1.3cm)over ends of surface.D 2¼”(5.7cm)max.from inside wall to the center of the inside row of Nixalite.FNixalite needles must extend over the outside edge at least ¼”(0.6cm).48"6units -one at each end,four spaced evenly between 16"2units -one at each end.Strip length Mounting Hardware Spacing12"2units -one at each end.24"3units -one at each end,one inmiddle Outside Corners &Exposed Edges:At outside corners,space the strips as shown below .At exposed ends,the tallest wire of the strip is always the first and/or last wire.Make sure there are no gaps where Nixalite strips meet walls or other objects,or where two Nixalite strips butt together end-to-end.Gaps:When two Nixalite strips are butted together in a row ,make sure the Nixalite wire pattern continues from one strip to the next strip.No gaps.Butting Strips:Single ExposedSurface DepthInchesCentimetersRows Required 8.5 - 13.50 - 3.53.5 - 5.55.5 - 8.513.5 - 18.518.5 - 23.523.5 - 28.528.5 - 33.533.5 - 38.538.5 - 43.534.3 - 47.00 - 8.98.9 - 14.014.0 - 21.621.6 - 34.372.4 - 81.597.8 - 110.547.0 - 59.759.7 - 72.481.5 - 97.8 3 rows 1 row 6 rows 7 rows 9 rows4 rows 8 rows 2 rows5 rows 1½ row*½ row*1 row 4 rows 2 rows 8 rows1½ rows 3 rows 6 rows 7 rows 5 rows 73.7 - 86.45.2 - 10.20 - 5.161.0 - 73.710.3 - 15.322.9 - 35.635.6 - 48.348.3 - 61.086.4 - 99.115.3 - 22.90 - 22 - 44 - 66 - 99 - 1414 - 1919 - 2429 - 3424 - 2934 - 39Double ExposedSurface DepthInchesCentimetersRows Required Need Help?U.S.\Canada - Ph:800-624-1189 Fax:800-624-1196E-mail Web :******************: Nixalite is open 8:00 a.m. to 4:30 p.m. Central Time,Monday through Friday . Fax or E-mail anytime.International - Ph:309-755-8771 Fax:309-755-0077Never use less than 2hardware units per strip,no matter how short the strip may be.Copyright© 2008 - 2019 by Nixalite® of America Inc. All rights reserved.Nixalite® is a registered trademark of Nixalite® of America Inc. Printed with pride in the .USA 1025 16th Avenue East Moline,. 61244IL Nixalite of America Inc®Experts In Architectural Bird Control Since 1950P_GuideToSuccess100219gaw .cdr - mhd new。

SIPLUS ET 200SP F-DQ 8x24VDC 0.5A 产品说明书

● EN 50155
Yes; Rail vehicles - temperature class OT1, ST1/ST2, horizontal mounting position
● EN 61373
Yes; Rail vehicles - vibrations and shocks: Category 1 Class A/B
Data sheet
6AG2136-6DC00-1CA0
SIPLUS ET 200SP F-DQ 8x24VDC/0.5A rail based on 6ES7136-6DC000CA0 with conformal coating, -30…+60 °C, OT1 with ST1/2 (+70 °C für 10 minutes), fail-safe digital outputs Cat. 4, PL e (EN ISO 13849-1) up to SIL 3 (IEC 61508)
F-DQ 8x24 V DC/0.5 A PP HF
Yes BU type A0 CC02
Yes; I&M0 to I&M3
24 V 20.4 V 28.8 V Yes
75 mA; without load 21 mA; From the backplae; 5 bytes non-RIOforFA; 6 bytes RIOforFA 6 byte; 5 bytes non-RIOforFA; 6 bytes RIOforFA
0.5 A; note derating data in the manual 3 A; note derating data in the manual
3 A; note derating data in the manual 2.5 A; note derating data in the manual 2 A; note derating data in the manual 2 A; note derating information in the manual; only with configured slots to the left and right of the module

CR6853规格书

4%
VDD=16V, IO=20mA VDD=16V, IO=20mA CL=500pF CL=500pF CL=1000pF CL=1000pF CL=1500pF CL=1500pF CL=2000pF CL=2000pF VDD=20V
0.8 V
10
V
123
ns
71
ns
ns
ns
ns
ns
ns
ns
CR6853 Green-Power Function
V2.1
6/12
CR6853
具有低 EMI 技术的低成本绿色节能 PWM 控制器
同步斜坡补偿
虽然电流模式控制比起普通的电压模式
控制具有很多优点，但是，同时存在着峰值感
应电流模式转换器的缺点。特别是当PWM占空比大于50 %,整个控制环路可能变得不稳定,
14V/8.8V。启动时，VDD电容器必须通过启
动电阻充电高于14V，关闭时，VDD电容上的
电压必须低于8.8V。这5.2V的迟滞电压有效
地保证了芯片能够正常启动。
内部偏置电流和工作频率
RI引脚和GND引脚之间的电阻决定了内
部偏置电流的大小，而内部振荡器利用该电流
对固定电容充放电产生振荡信号。所以增加电
阻可以减小偏置电流，同时降低开关频率。 RI
和PWM开关频率的关系如下：
FOSC
=
6700 (kHz) RI (KΩ)
例如，一个 100kΩ 的电阻可以产生一个
20uA 的偏置电流和一个65K的PWM开关频
率；CR6853的建议工作频率范围是50KHz到
150KHz之间。
绿色节能
对一个小功率反激电源而言，主要的损耗包括传导损耗、开关损耗和控制芯片的损耗，而这些损耗都和开关频率有关。所以在轻负载或则无负载时，通过降低PWM工作频率，可以有效的减小反激电源的待机功耗。为了实现符合标准的待机功耗，CR6853采用了PWM， PFM 和CRM相结合的控制方法：在中等负载或重载时，CR6853工作在PWM方式，频率为65kHz(RI外接100K电阻时) ；通过修改脉冲宽度，CR6853可以控制输出电压。当负载逐渐减小时，FB端反馈电流增加。当反馈电流超过0.5mA时，内部模式控制器进入PFM 和PWM。振荡器的工作频率逐渐降低，当反馈电流超过0.55mA时，振荡器的工作频率保持不变，最后稳定在22kHz附近。为了进一步降低待机功耗，CR6853引入一种周期复位技术，当FB端的反馈电流大于0.59mA时，内部逻辑电路在PWM的下降沿对寄存器复位，在 PWM上升沿通过检测输出电压值对寄存器置位。因此内部振荡器频率保持不变，逻辑电路将会复位一些脉冲以至于在输出GATE的实际频率降低。

DR9系列三相多功能电力记录仪使用说明书

DR9系列三相多功能电力记录仪使用说明书⊙320*240 TFT彩色液晶显示屏⊙测量三相电压、电流、有功功率、无功功率、视在功率、功率因数、频率及总有功电度、总无功电度、正反向有功、无功电度等电参数⊙对三相电压、电流、有功功率、功率因数进行实时曲线记录和数据记录存储⊙对总有功电度、总无功电度进行累计存储⊙仪表内部有8M的FLASH存储器用于数据保存，支持外部U盘和SD卡转存功能⊙开关输出：2路AL1、AL2继电器报警输出⊙模拟量输出：1路模拟量变送输出，DC 4-20mA⊙开关量输入：4路S1、S2、S3、S4用于“遥信”电气开关状态⊙提供RS485通讯接口，支持MODBUS-RTU协议⊙具有复费率，需量统计功能⊙具有总谐波含量测量功能⊙SD卡自动备份历史数据，也可用U盘手动备份，再用PC专用软件打开主要功能简介:DR9系列仪表测量三相交流电路中的真有效值电压、电流、频率、有功功率、无功功率、功率因数、有功电度值、无功电度值等参数；同时记录电压、电流、有功功率、无功功率、功率因数、有功电度值、无功电度值。

可生成各种报表；且可通过U 盘或SD 卡将记录参数曲线及历史数据和电量报表转存到PC 机上进行数据分析，提供RS485通讯接口，支持MODBUS-RTU 协议。

可广泛应用于中、低压配电柜、工业自动化、智能型开关柜、楼宇自动化、能源管理系统等。

注意安全※ 请遵守下面的要点警告注意如果不按照说明操作会发生意外。

如果不按照说明操作会导致产品毁坏。

注意警告1.在以下情况下使用这个设备，如(核能控制、医疗设备、汽车、火车，飞机、航空、娱乐或安全装置等)，需要安装安全保护装置，或联系我们索取这方面的资料，否则会引起严重的损失，火灾或人身伤害。

2.必须要安装面板，否则可能会发生触电。

3.在供电状态中不要接触接线端子，否则可能会发生触电。

4.不要随意拆卸和改动这个产品，如确实需要请联系我们，否则会引起触电和火灾。

DR5001资料

Electrical Characteristics, 2.4 kbps On-Off KeyedCharacteristicSym NotesMinimum Typical Maximum Units Operating Frequency f O868.15868.55MHzModulation Type OOK Data Rate2.419.2kbpsReceiver Performance (OOK @ 2.4 kbps)Input Current, 3 Vdc Supply I R1.8mA Input Signal for 10-4 BER, 25 C -100dBm Rejection, ±30 MHzR REJ 55dB Sleep to Receive Switch Time(100 ms sleep, -85 dBm signal)t SR 3200µs Sleep Mode CurrentI S 5µA Power Supply Voltage Range V CC 2.7 3.5Vdc Operating Ambient TemperatureT A-20+65°C•Designed for Short-Range Wireless Data Communications •Supports up to 19.2 kbps Encoded Data Transmissions • 3 V, Low Current Operation plus Sleep Mode •Ready to Use OEM ModuleThe DR5001 receiver module is ideal for short-range wireless data applications where robust operation,small size and low power consumption are required. The DR5001 utilizes RFM’s RX6001 amplifier-sequenced hybrid (ASH) architecture to achieve this unique blend of characteristics. The receiver RX6001 is sensitive and stable. A wide dynamic range log detector provides robust performance in the presence of on-channel interference or noise. Two stages of SAW filtering provide excellent receiver out-of -band rejection.The DR5001 includes the RX6001 plus all configuration components in a ready-to-use PCB assembly excel-lent for prototyping and intermediate volume production runs.Absolute Maximum RatingsRatingValueUnitsPower Supply and All Input/Output Pins -0.3 to +4.0V Non-Operating Case Temperature -50 to +100°C Soldering Temperature (10 seconds)230°C868.35 MHz Receiver ModuleDR5001Pin DesciptionsPin Name Description1AGC/VCC This pin is connected directly to the receiver AGCCAP pin. To disable AGC operation, this pin is tied to VCC. To enable AGC operation, a capacitor is placed between this pin and ground. This pin controls the AGC reset operation. A capacitor between this pin and ground sets the minimum time the AGC will hold-in once it is engaged. The hold-in time is set to avoid AGC chat-tering. For a given hold-in time t AGH, the capacitor value C AGC is:C AGC = 19.1* t AGH, where t AGH is in µs and C AGC is in pFA ±10% ceramic capacitor should be used at this pin. The value of C AGC given above provides a hold-in time between t AGH and 2.65* t AGH, depending on operating voltage, temperature, etc. The hold-in time is chosen to allow the AGC to ride through the longest run of zero bits that can occur in a received data stream. The AGC hold-in time can be greater than the peak detector decay time, as discussed below. However, the AGC hold-in time should not be set too long, or the receiver will be slow in returning to full sensitivity once the AGC is engaged by noise or interference. The use of AGC is optional when using OOK modulation with data pulses of at least 30 µs. Active or latched AGC operation is required for ASK modulation and/or for data pulses of less than 30 µs. The AGC can be latched ON once engaged by connecting a 150 K resistor between this pin and ground, instead of a capacitor. AGC operation depends on a functioning peak detector, as discussed below. The AGC capacitor is discharged in the receiver power-down (sleep) mode. Note that provisions are made on the cir-cuit board to install a jumper between this pin and the junction of C2 and L3. Installing the jumper allows either this pin or Pin9 to be used for the Vcc supply when AGC operation is not required.2PK DET This pin is connected directly to the receiver PKDET pin. This pin controls the peak detector operation. A capacitor between this pin and ground sets the peak detector attack and decay times, which have a fixed 1:1000 ratio. For most applications, the attack time constant should be set to 6.4 ms with a 0.027 µF capacitor to ground. (This matches the peak detector decay time constant to the time constant of the 0.1 µF coupling capacitor C3.) A ±10% ceramic capacitor should be used at this pin. The peak detector is used to drive the "dB-below-peak" data slicer and the AGC release function. The AGC hold-in time can be extended beyond the peak detector decay time with the AGC capacitor, as discussed above. Where low data rates and OOK modulation are used, the "dB-below-peak" data slicer and the AGC are optional. In this case, the PKDET pin can be left unconnected, and the AGC pin can be connected to VCC to reduce the number of external components needed. The peak detector capacitor is discharged in the receiver power-down (sleep) mode. See the description of Pin 3 below for further information.3RX BBO This pin is connected directly to the receiver BBOUT pin. On the circuit board, BBOUT also drives the receiver CMPIN pin through C3, a 0.1 µF coupling capacitor (t BBC = 6.4 ms). RX BBO can also be used to drive an external data recovery pro-cess (DSP, etc.). The nominal output impedance of this pin is 1 K. The RX BBO signal changes about 10 mV/dB, with a peak-to-peak signal level of up to 675 mV. The signal at RX BBO is riding on a 1.1 Vdc value that varies somewhat with sup-ply voltage and temperature, so it should be coupled through a capacitor to an external load. A load impedance of 50 K to 500 K in parallel with no more than 10 pF is recommended. Note the AGC reset function is driven by the signal applied to CMPIN through C3. When the receiver is in power-down (sleep) the output impedance of this pin becomes very high, pre-serving the charge on the coupling capacitor(s). The value of C3 on the circuit board has been chosen to match typical data encoding schemes at 2.4 kbps. If C3 is modified to support higher data rates and/or different data encoding schemes and PK DET is being used, make the value of the peak detector capacitor about 1/3 the value of C3.4RX DATA RX DATA is connected directly to the receiver data output pin, RXDATA. This pin will drive a 10 pF, 500 K parallel load. The peak current available from this pin increases with the receiver low-pass filter cutoff frequency. In the power-down (sleep) or receive mode, this pin becomes high impedance. If required, a 1000 K pull-up or pull-down resistor can be used to establish a definite logic state when this pin is high impedance (do not connect the pull-up resistor to a supply voltage higher than 3.5 Vdc or the receiver will be damaged). This pin must be buffered to successfully drive low-impedance loads.5NC 6, 7GND8LPF ADJ This pin is the receiver low-pass filter bandwidth adjust, and is connected directly to the receiver LPFADJ pin. R6 on the cir-cuit board (330 K) is connected between LPFADJ and ground will be in parallel with any external resistor connected to LPF ADJ. The filter bandwidth is set by the parallel resistance of R6 and the external resistor (if used). The equivalent resistor value can range from 330 K to 820 ohms, providing a filter 3 dB bandwidth f LPF from 4.4 kHz to 1.8 MHz. The 3 dB filter bandwidth is determined by:f LPF = 1445/ (330*R LPF/(330 + R LPF)), where R LPF is in kilohms, and f LPF is in kHzA ±5% resistor should be used to set the filter bandwidth. This will provide a 3 dB filter bandwidth between f LPF and 1.3* f LPF with variations in supply voltage, temperature, etc. The filter provides a three-pole, 0.05 degree equiripple phase response. The peak drive current available from RXDATA increases in proportion to the filter bandwidth setting. As shipped, the receiver module is set up for nominal 2.4 kbps operation. An external resistor can be added between Pin 8 and ground to support higher data rates. Preamble training times will not be decreased, however, unless C3 is replaced with a smaller capacitor value (see the descriptions of Pins 2 and 3 above). Refer to sections 1.4.3, 2.5.1 and 2.6.1 in the ASH Transceiver Designer's Guide for additional information on data rate adjustments.9VCC This is the positive supply voltage pin for the module. The operating voltage range is 2.7 to 3.5 Vdc. It is also possible to use Pin 1 as the Vcc input. Please refer to the Pin 1 description above.10GND This is the supply voltage return pin.11CTR1CTR1 is connected to the CNTRL1 control pin on the receiver. CTR1 and CTR0 select the transceiver operating modes. CTR1 and CTR0 both high place the unit in the receive mode. CTR1 and CTR0 both low place the unit in the power-down (sleep) mode. CTR1 is a high-impedance input (CMOS compatible). This pin must be held at a logic level; it cannot be left unconnected. At turn on, the voltage on this pin and CTR0 should rise with VCC until VCC reaches 2.7 Vdc (receive mode). Thereafter, any mode can be selected.12CTR0CTR0 is connected to the CNTRL0 control pin on the receiver CTR0 is used with CTR1 to control the operating modes of the receiver. CTR0 is a high-impedance input (CMOS compatible). This pin must be held at a logic level; it cannot be left uncon-nected. At turn on, the voltage on this pin and CTR1 should rise with VCC until VCC reaches 2.7 Vdc (receive mode). There-after, any mode can be selected.13RFIO RFIO is the RF input/output pin. A matching circuit for a 50 ohm load (antenna) is implemented on the circuit board between this pin and the receiver SAW filter transducer.14RF GND This pin is the RF ground (return) to be used in conjunction with the RFIO pin. For example, when connecting the transceiver module to an external antenna, the coaxial cable ground is connected this pin and the coaxial cable center conductor is con-nected to RFIO.Note: Preliminary specifications, subject to change without notice.。

Soundtech X-618+X-DA2250产品数据书说明书

When HN-D32N Noise Detector is installed, X-DA2250 can adjust volume according to the ambient noise automatically to ensure high sound intelligibility.X-DA2250High Efficiency Power AmplifierX-DA2250High Efficiency Power Amplifierprovides amplification for audio signal delivered by high power loudspeakers that are connected to X-618Digital Public Address and Voice Alarm System.X-DA2250 is reliable, efficient and light in FeaturesX-DA2250supports both balanced andunbalanced audio inputs.To receive unbalanced audio inputs, simply connect the ground port with the negative input port to the rear panel.X-DA2250can receive audio signal fromX-DCS2000/EN via Ethernet through the RJ45standard port.X-DA2250can self-protect from overheat,over current,over voltageand under voltage. For example, when the internal temperature reaches its critical limit, the overheat protection circuit will shut down the power amplification module and activate the protection indicator light on the front panel.X-DA2250can detect power supply errors automatically during operation. The built-in fuse will provide over current protection to the main power supply.INPUT/OUTPUTFAULT DETECTIONWhen a shout circuit is detected in the main power supply circuit, the power will be automatically shut down.The backup powersupply will then be enabled to replace the main one.When a fault,self-protection or self-testinghappens, its audio input fault port on the rear panel will short circuit and a fault signal will then be sent to the control unit in the network.The device adopts lightweight design.The front panel is made of UL94V-0 fire proof ABS material,protecting the machine under extreme conditions.A cooling fan is equipped for heat exhaustion so that the machine can maintain high working efficiency.Power lightŸŸAC fault light x 2ŸSignal light (for each channel)ŸClip light (for each channel)ŸProtection light (for each channel)SAFETYVOLUME CONTROLINDICATOR LIGHTS ŸamplifierAutomatic protection ŸFault detectionŸEffective ventilation using forced air cooling ŸfanCE certification compliedTwo channel 250W high efficiency Class-D Ÿweight.Indicator lightsPower indicator light Main power fault light Backup power fault light Signal lightsPeak clipping lightsEquipment protection lightsNumber of channels 2Operating conditions95 % humidity, 0 °C ~ +40 °C (0 ~ 104 °F)(no condensation)Storage temperature-10 °C ~ +55 °C (14°F ~ 131°F)Cooling method Air coolingProduct dimensions (W×H×D)416 × 88 × 483 mm Package dimensions (W×H×D)489 × 186 × 568 mm Net weight 12.2 kg Gross weight15.3 kgINTERFACES Main power and backup power port ŸŸAudio inputs (balanced or unbalanced)ŸAudio outputs (100V or 70V)ŸRJ-45 net cable portTechnical SpecificationsNominal output power 2 × 250 WMain power supply voltage~ 220 - 240 V, 50/60 Hz Backup power supply voltage~ 220 - 240 V, 50/60 Hz Power consumption < 720 W Main power supply protectionT10 AL 250 V Speaker output voltage 100 V / 70 VFrequency response 70 Hz -18 kHz （+1 dB ~ -3 dB ）Input sensitivity 1.414 V RMS Impedance 20 k ΩSNR> 100 dB(withA-Weight)Non-linear distortion<0.05% (at 1/3 ratedpower, 1 kHz)Packing ListX-DA2250 High Efficiency Power Amplifier 1Network cable 1Input cable terminal 1Output cable terminal 1AC power cable 1Power connector kit 1Plastic foot 4Warranty card 1Quality certificate 1Product manual 1Rack2Certification and StandardSafety Europe CE C omplied SafetyEuropeCB Certified Material USAUL94V-0 Fire-proof ABS materialHoneywellAudiovisuals No. 257, Junye Road Guangzhou GETDD East 510530 ChinaTel: +86 20 2839 9600 Fax: +86 20 2820 8706 1013702005_EN2.1Aug 2013© 2013 Honeywell International Inc.Order InformationX-DA4125 High EfficiencyPower Amplifier 4×125WX-DA4125。

岛津DR参数

探测器有效探测面积14"X17"
采集矩阵2,208 x 2,688
像素大小160×160μm
X线照射剂量检测线性范围0.005-35mR
采集像素A/D转换位数14bit
MTF @ 1 lp/mm, RQA5 0.68
MTF @ 2 lp/mm, RQA5 0.35 二次曝光间隔6S
自动曝光控制
AEC探测器类型惰性气体
初始kV设置方式预置/手动手动设置具有
APR程序预置具有
AEC密度补偿调整方法预置/手动数字影像处理
图像处理矩阵2,208 x 2,688 图像预示时间<5s
图像浏览及常规后处理功能灰度转换，滤波，增强，翻转，
标注等
图像质量优化技术灰阶调整、增强显示计算机系统采集工作站（操作系统：Windows）
主机及工作站CPU 酷睿双核处理器3.0GHz，内存容量2G，硬盘容量80G，液晶显示器：15″、19"
主机硬盘80G硬盘存档系统(CDRW/DVD/PACS) DVDRW
网络连接、DICOM 符合DICOM 3.0，打印管理（SCU）及储存（SCU）
（JPEG格式传输可用）
工作流程控制
患者信息输入方式鼠标＋键盘
图像采集/存档/打印并行处理具有
根据APR解剖部位自动调整显
示参数进行图像优化处理
具有
根据摄影视野大小自动剪裁图
像，以最佳尺寸在屏幕上显示
具有
后处理后处理工作站选配
主机及工作站 20.1英寸黑白监视器（分辨率1600x1200）；
CPU Xeon 3.0GHz or more ；内存 1GB
主机硬盘硬盘容量 160GB。

MAX6818中文资料

o Pin-Compatible with ’LS573 (MAX6818)
Ordering Information
PART
TEMP. RANGE
PIN-
SOT
PACKAGE TOP MARK
MAX6816EUS-T -40°C to +85°C 4 SOT143
KABA
MAX6817EUT-T -40°C to +85°C 6 SOT23-6
OUT Short-Circuit Duration (One or Two Outputs to GND)....................................Continuous
Continuous Power Dissipation (TA = +70°C) 4-Pin SOT143 (derate 4.0mW/°C above +70°C)..........320mW 6-Pin SOT23 (derate 8.7mW/°C above +70°C)............691mW 20-Pin SSOP (derate 8.0mW/°C above +70°C) ...........640mW
Input Threshold
Input Hysteresis Input Pull-Up Resistance IN Input Current Input Voltage Range Undervoltage-Lockout Threshold
SYMBOL VCC ICC
tDP
VIL
VIH
CONDITIONS
Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10sec) .............................+300°C

奥林匹斯BX51微观平台说明书

Microscope PlatformMicroscope Olympus®BX51 Reflected Illumination FrameLamp100 W Halogen Lamp, front mounted intensity control dial, user-adjustable photo presetswitch, LED voltage indicator lightsObjective lenses5x, 20x and 50x objective lenses provided as standard, 100x objective available as optional extra. Long working distance objective lens upgrade kit also available.Nosepiece Quadruple lens centering bright field nosepieceVideo camera USB video camera for sample alignmentStage Options Manual Stage Standard Motorized Stage Multi-well Sample StageRange of motion XY75 x 50 mm (3 x 2 in)75 x 50 mm (3 x 2 in)114 x 75 mm (4.5 x 3 in)Accuracy XY Verniers scale Stage movement accuracy of Stage movement accuracy of0.1 µ0.1 µDrive control XY Rackless, coarse and Joystick for XY sample Joystick for XY samplefine manual adjust-adjustment adjustmentment, tension adjust-ment mechanismAccuracy Z Fine stroke 100 µm Stage movement accuracy of Stage movement accuracy of per rotation, 1µm 0.1 µ0.1 µgradationDrive control Z Rack and pinion, Joystick for Z focus adjustment Joystick for Z focus adjustment coarse and fine manualadjustment, tensionadjustment mechanismAccessoriesGeneral Quartz microscope slides offer a low background and are ideal for mounting thin samplesMicro-sampling tool Consists of sampling tools specifically designed for manipulating and preparing microsamples. kit The kit includes pin vice, micro needle, stainless steel tweezers, dissecting forceps, razor knife and straight stainless-steel micro probe. This kit is provided as standard with the RamanMicro 200.Power sampling kit Stage mounted tablet autosampler accessory. Provided with 11, 15 and 22 mm diameter tablet holders. Compatible with PerkinElmer Tablet Autosampler molds for accommodating irregularshaped samples. Compatible with Leica®EM Trim supports for depth profiling. Standard andlarge stage versions available.Tablet sampling kit Stage mounted accessory accepts stainless steel sample cups. Provided with cup filler.Standard and large stage versions available.Hot stage Heating block and a temperature controller. The heating block contains an integral thermocouple;the temperature is digitally displayed in degrees Centigrade on the controller. The hot stagecan heat samples up to 230 ˚C in 1 ˚C increments. A target temperature may be selected andmaintained. The hot stage is held in the slide clip on the sample stage of manual and motorizedsample stages.Fiber Optic Probe (Optional Upgrade 200F only)General Switching from microscope to fiber optic probe is provided under software control. Data quoted here refers to the standard Raman probe. See Raman Fiber Optic Probes Technical SpecificationsProbe cable 5 m, armor clad with stainless steelProbe head length150 mmProbe head diameter12.7 mmWorking distance7.5 mmProbe spectral range230-3,500 cm-1 Raman shiftMax temperature80 ˚CUpgrade options Optional immersion sleeve for liquid immersion measurementsAdditional lengths of fiber optic cabling are available for use in environments where thesample is located at a distance from the spectrometer.A range of high temperature and high pressure probes is also available.Bench DetailsSize500 x 440 x 195 mm (spectrometer), 587 x 320 x 580 mm (microscope)Weight35 Kgs (spectrometer), 20 Kgs (microscope)Laser class RamanMicro 200 and 200F are Class 3b laser devices, and appropriate laser safety precautions should be observed.Power requirements110/240 VAC, 50/60 Hz (<50 W Typical)SoftwareSpectrum Software for spectral data acquisition and analysisGeneral A single software platform incorporates all of the functions required for Raman data acquisition and processing – instrument control, data manipulation and analysis, and flexible report utilities.A suite of optional software packages provide advanced capabilities or functions designed forspecific application areas.User interface Password-protected user login function. Access to methods and routines, menu, toolbar and toolbox functions can be controlled by a supervisor.Reports Quick print facility for graphs, spectra and results windows. User defined templates can be created to enable custom printed and electronic reports.Processing1st-4th derivative with a variable filter, smooth (Savitsky-Golay, moving average and triangular), difference, normalization, baseline correction, deconvolution, apex, interpolate, peak table,peak height and peak area.Materials testing Patented COMPARE™spectral comparison algorithm and Euclidean searching available.Spectral searching against commercially available or customer developed libraries.Quantitative analysis Single frequency, method development software. Spectrum includes Beer’s Law, PLS and PCR quantitative prediction.Validation Software allows performance verification to ASTM standards. Comprehensive IQ/OQdocumentation and services available.System diagnostics Key microscope and instrument components are checked on startup. Status of all RamanMicro components are displayed via PC control toolbox.SpectrumIMAGE Software for Chemical Imaging, provided with Motorized Stage based systems.Image presentation Chemical images can be generated from spectral analysis using average intensity, singlewavenumber, ChemiMap, Band Ratio, Quant+ result or COMPARE correlation, or by usingshow structure.Images can be viewed in false color, 3D projection or contour map.Show structure Single-click button operation to automate contrast enhancement in collected images byidentifying and revealing true spectral differences.Optional SoftwareQuant+Powerful chemometrics calibration building software.Spectrum Insight Quantitative high throughput screening and reaction monitoring. Insight works hand in hand with Quant+. Collected data is send to Quant+ which provides quantitative information, thisinformation is displayed in a simple to understand format, depending on the type of datacollected, Insight can represent the data in several ways:•High throughput mode: data shown in multiwell view using false color, grey scale orRed /Green (Pass/Fail).•Reaction monitoring: multiple concentrations to be viewed in graph format, screen isupdated in real time.•Spreadsheet: Data is presented in a spreadsheet format (compatible Microsoft®Excel®). PerkinElmer, Inc.940 Winter StreetWaltham, MA 02451 USAPhone: (800) 762-4000 or(+1) 203-925-4602For a complete listing of our global offices, visit /lasoffices©2007 PerkinElmer, Inc. All rights reserved. The PerkinElmer logo and design are registered trademarks of PerkinElmer, Inc. COMPARE, Quant+, RamanMicro, Spectrum and SpectrumIMAGE are trademarks and PerkinElmer is a registered trademark of PerkinElmer, Inc. or its subsidiaries, in the United States and other countries. Leica is a registered trademark of Leica Microsystems IR GMBH. Microsoft and Excel are registered trademarks of Microsoft Corporation. Olympus is a registered trademark of Olympus Optical Co., Ltd. All other trademarks not owned by PerkinElmer, Inc. or its subsidiaries that are depicted herein are the property of their respective owners. PerkinElmer reserves the right to change this document at any time without notice and disclaims liability for editorial, pictorial or typographical errors.007928A_02。

英德斯科技公司 HSB-681 主板说明书

HSB-681中文使用手册Intel€ Celeron€ ULV Processor CPU Board LAN & VGA & AUDIO前言感谢您购买英德斯科技公司HSB-681主板，该主板内置有一个Intel ULV EBGA series CPU，采用VIA CLE266+VT8235芯片组设计。

板载128MB内存，提供一个DDR SO-DIMM插槽，支持DDR266/200(PC2100/1600)内存，最大容量达512MB。

采用AC97音频芯片,支持AC97音频解码和兼容AC972.1，提供1个板载10BaseT/100Base TX网卡，支持扩展的USB2.0（Universal Serial Bus Specification Revision 2.0），USB2.0提供比USB1.1更高的带宽。

该主板集成了一整套的I/O 端口，包括一个MINI IDE接口，一个CF插槽，一个FDD接口，PS/2 键盘和鼠标输入端口，两个串行端口，一个并行端口，一个TTL LCD端口、一个Digital IO端口、一个FIR红外端口和四个USB 端口，ISA总线。

该主板采用AT结构，4″EPIC规格，8层印刷电路板。

目录序章、版权宣告、配件清单与注意事项 (5)0.1版权宣告 (5)0.2配件清单 (5)0.3安装前注意事项 (5)第一章规格简介 (7)1.1规格简介 (7)第二章安装与设置指南 (9)2.1主板位图和背板I/O图 (9)2.2跳线说明 (10)2.2.1如何辨认跳线的1脚位置 (10)2.2.2 J1:清除CMOS跳线 (10)2.2.3 F_PANEL/J8面板插针 (10)2.3接口说明 (11)2.3.1 AT ---电源接口 (11)2.3.2 CPUFAN/CHIPFAN---CPU风扇接口 (11)2.3.3 J7 ---KB/MS 扩展接口 (11)2.3.4 IR1 ---红外接口 (11)2.3.5 DIO ---DIGITAL IO接口 (12)2.3.6 CN12---LCD背光接口 (12)2.3.7 CN13---TTL LCD接口 (13)2.3.8 COM2 ---COM2接口 (14)2.3.9 RS-J ---COM2 RS232/RS422/RS485跳线 (15)2.3.10 CN5/CN7---USB扩展接口 (15)2.3.11 CN8---并行接口 (16)2.3.12 J2---音频接口 (16)2.3.13 CD_IN ---CD-IN接口 (17)2.4外部设备的安装 (17)第三章驱动程序安装 (18)3.1前言 (18)3.2驱动程序目录一览表 (18)3.3驱动程序安装 (18)3.3.1VIA 4IN1驱动的安装 (18)3.3.2显卡驱动的安装 (20)3.3.3USB2.0驱动的安装 (20)3.3.4声卡驱动的安装 (20)3.3.5ITE8888驱动安装 (20)3.3.6REALTEK 8100BL网卡驱动安装 (20)3.4其它软件安装 (21)附录 (22)3.5WATCHDOG编程实例 (22)3.6应用DIO接口注意事项 (25)3.7DIO 编程实例 (25)联系英德斯公司 (26)序章版权宣告、配件清单与注意事项0.1 版权宣告本手册受到国际著作法以及相关法律的保护，本公司将保留所有的权利，未经本公司书面同意，不得擅自重制、改编、传送本手册的内容与相关数据，否则将进行民事或刑事诉讼。

力科产品手册说明书

力科产品手册关注我们，了解更多信息:LabMaster 10 Zi-A (SDA Models)WaveMaster 8 Zi-B (SDA/DDA 8 Zi-B)带宽20 GHz to 65 GHz 4 GHz to 30 GHz 分辨率8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间 6.5 ps to 19.3 ps15.5 ps to 95 ps通道(模拟+数字)Up to 80, 80 + 184, 4 + 18显示15.3" WXGA Touch Screen15.3" WXGA Touch Screen标配存储深度32 Mpts/Ch (64 Mpts/Ch)32 Mpts/Ch (64 Mpts/Ch)最大存储深度†Up to 1024 Mpts Up to 512 Mpts 采样率Up to 160 GS/sUp to 80 GS/sMSO 特性†(数字通道) 3 GHz, 12.5 GS/s,18 Ch3 GHz, 12.5 GS/s,18 Ch触发类型Edge, Width, Glitch, Pattern, Runt, Slew Rate,Interval (Period), Dropout, Qualified, Cascade (Sequence) Trigger,High-speed Serial Trigger †Edge, Width, Glitch, Pattern, Video, HDTV,Runt, Slew Rate, Interval (Period), Dropout, Qualified, Cascade(Sequence) Trigger, High-speed Serial Trigger †串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD: 80-bit NRZ, 8b/10b, 64b/66b D: 64b66b, 8b/10b, ARINC 429, Audio,CAN, CAN FD, CAN FD Symbolic, DigRF 3G, DigRF v4,ENET, ENET 10G, Fibre Channel, I 2C , LIN,Manchester, MDIO, MIL-STD-1553, NRZ, PCIe, RS-232. SAS, SATA,SENT, SpaceWire, SPI, UART, UniPro, USB 1.0/1.1/2.0,USB 3.2 (Gen1, Gen2, Gen2x2)DP : D-PHY, Fibre Channel, FlexRay, M-PHYDG: AudioTD: 80-bit NRZ, 8b/10b, 64b/66b, RS-232, UARTTD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic,I 2C , LIN, MIL-STD-1553, SPI,TD or TDxx: Audio (TDG), FlexRay (TDMP)D: DigRF 3G, DigRF v4, ENET, ENET 10G, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SAS, SATA, SENT, SpaceWire, SPMI,UniPro, USB 2.0-HSIC, USB 3.2 (Gen1, Gen2, Gen2x2),64b / 66b, 8b/10b DP : D-PHY, M-PHYDME: ARINC 429, USB 1.0/1.1/2.0串行数据分析Eye Jitter and Noise Analysis (SDAIII-CompleteLINQ), Virtual Probe, Eye Doctor II, PAM4 Signal Analysis, Serial Data Mask,Cable De-Embedding串行数据一致性测试DDR 3/4/5, LPDDR 3/4/5, DisplayPort 1.4, eDP , Automotive Ethernet 100Base-T1, 1000Base-T1 Ethernet 10GBase-T, 10GBase-KR, HDMI 2.1/2.0/1.4b, MIPI M-PHY, PAM4-56G, PCI Express 1.0/2.0/3.0/4.0/5.0, SAS 2/3, SATA, SFI, USB 3.2 (Gen1, Gen2, Gen2x2), USB4/TBT4DDR 2/3/4/5, LPDDR 2/3/4/5, DisplayPort 1.4, eDP , Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1,Ethernet 10/100/1000Base-T, Ethernet 10GBase-T, 10GBase-KR, HDMI 2.1/2.0/1.4b, MIPI D-PHY, MIPI M-PHY, MOST 50/150, PAM4-56G, PCI Express 1.0/2.0/3.0, SAS 2/3, SATA, SFI,USB 1.1/2.0, USB 3.2 (Gen1, Gen2, Gen2x2), USB4/TBT4应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Automotive Ethernet Debug, CrossSync PHY, DDR Debug Toolkit, Switch-mode Power Supply and Device Analysis, Advanced Customization (Standard with LabMaster 10 Zi-A),EMC Pulse Parameters, Digital Filter Package, Protocol Analyzer Synch (ProtoSync), Advanced Vector Signal Analysis, Vector Signal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements, Coherent Optical Analysis,Electrical Telecom Pulse Mask Test外设接口USB Host for Storage, LAN for PC, LXI for PC, GPIB for PC †函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope, Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof,Segment, Sparse, Square, Square Root, Track, Trend, Zoom尺寸 (HWD)MCM-Zi-A: 277 x 462 x 396 mm(10.9” x 18.2” x 15.6”)LabMaster 10-xxZi Acq. Module:202 x 462 x 660 mm (8.0” x 18.2” x 26”)355 x 467 x 406 mm (14” x 18.4” x 16” )重量MCM-Zi-A: 47 lbs. (21.4 kg)LabMaster 10-xxZi-A Acq. Module - 58 lbs. (24 kg)58 lbs. (26.4 kg)保修3 yr3 yrWavePro HD WaveRunner 8000HD/MDA 8000HDWaveRunner 9000/9000-MS带宽 2.5 GHz to 8 GHz 350 MHz to 2 GHz 500 MHz to 4 GHz 分辨率12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间57.5 ps to 166 ps1 ns to 235 ps700 ps to 100 ps通道(模拟+数字)4, 4 + 168, 8 + 164, 4 + 16显示15.6” Widescreen Capacitive Touch Screen15.6” Widescreen Capacitive Touch Screen15.4” WXGA Multi-Touch Screen 标配存储深度50 Mpts/Ch 100 Mpts Interleaved50 Mpts/Ch100 / 200 Mpts Interleaved16 Mpts/Ch; M Models: 64 Mpts/Ch32 Mpts Interleaved; M Models: 128 Mpts 最大存储深度†Up to 5 Gpts Up to 5 Gpts Up to 128 Mpts 采样率Up to 20 GS/sUp 10 GS/sUp to 20 GS/s; M Models: Up to 40 GS/s MSO 特性†(数字通道)250 MHz, 1.25 GS/s16 Ch500 MHz, 2.5 GS/s16 Ch250 MHz, 1.25 GS/s,16 Ch触发类型Edge, Width, Glitch, Pattern, Runt, Slew Rate,Interval (Period), Dropout, Qualified,Edge, Width, Glitch, Pattern, Runt, Slew Rate, Interval (Period), Dropout, Qualified,Measurement, WindowEdge, Width, Glitch, Pattern, Video, HDTV, Runt, Timeout, Slew Rate, Interval (Period), Dropout, Qualified, Measurement, Window,Cascade 串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD or TDME: 100Base-T1, CAN, CAN FD,CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PDTD or TDxx: Audio (TDG), FlexRay (TDMP)D: DigRF 3G, DigRF v4, ENET, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SATA, SAS,SpaceWire, UniPro, USB 2.0-HSIC,USB 3.2 (Gen1), 8b/10bDP : D-PHY, M-PHY DME: ARINC 429TD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus,SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 2.0-HSIC, 8b/10b DME: ARINC 429TD: SATA, 8b/10bTD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, ENET, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SAS, SpaceWire, UniPro, USB 2.0-HSIC DP : D-PHY, M-PHY DME: ARINC 429 串行数据分析Eye Jitter and Noise Analysis (SDAIII-CompleteLINQ), Virtual Probe, Eye Doctor II,Serial Data Mask, Cable De-EmbeddingEye and Jitter Analysis (SDAIII), Virtual Probe, Eye Doctor II, Serial Data Mask, Cable De-Embedding Eye Jitter, Virtual Probe, Eye Doctor II, SerialData Mask, Cable De-Embedding 串行数据一致性测试DDR 2/3, LPDDR 2/3, Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1,Ethernet 10/100/1000Base-T , MIPI D-PHY ,MOST 50/150, PCI Express 1.0, USB 1.1/2.0Automotive Ethernet 10Base-T1S, 100Base-T1,1000Base-T1, Ethernet 10/100/1000Base-T , MOST 50/150, USB 1.1/2.0DDR 2/3, LPDDR 2/3, Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1, Ethernet 10/100/1000Base-T , MIPI D-PHY ,MOST 50/150, USB 1.1/2.0应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, DDRDebug Toolkit, Switch-mode Power Supplyand Device Analysis, Three-phase ElectricalPower, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package,Protocol Analyzer Synch (ProtoSync), Vector Signal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements,Electrical Telecom Pulse Mask TestSpectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Automotive Ethernet Debug, Switch-mode Power Supply and Device Analysis, Three-phase Electrical Power, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Vector Signal Analysis, Three-phase Electrical and Mechanical PowerAnalysis (included with MDA Models)Spectrum Analyzer (Single, Dual+Reference),Clock and Clock-Data Jitter Analysis, DDR Debug Toolkit, Switch-mode Power Supply and Device Analysis, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Protocol Analyzer Synch (ProtoSync), VectorSignal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements,Electrical Telecom Pulse Mask Test 外设接口USB Host for Storage, USB Device for PC, LAN for PC, GPIB for PC†函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope,Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof,Segment, Sparse, Square, Square Root, Track, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope,Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log,Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof, Segment, Sparse, Square, Square Root,Track, Trend, Zoom尺寸 (HWD)345 x 445 x 196 mm (13.6” H x 17.5” W x 7.7” D)345 x 445 x 196 mm (13.6” H x 17.5” W x 7.7” D)358 x 445 x 242 mm (14.1” x 17.5” x 9.5”)重量24.4 lbs (11.1kg)24.4 lbs (11.1kg)25.8 lbs. (11.7 kg)保修3 yr3 yr3 yrHDO6000B/ HDO6000B-MSHDO4000A-MS WaveSurfer 4000HD 带宽350 MHz to 1 GHz 200 MHz to 1 GHz 200 MHz to 1 GHz 分辨率12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution上升时间 1 ns to 450 ps 1.75 ns to 450 ps1.75 ns to 450 ps通道(模拟+数字)4, 4 + 16, 4 + 16 + 244, 4 + 16, 4 + 16 + 244, 4 + 16, 4 + 16 + 24显示15.6” Widescreen Capacitive Touch Screen12.1” WXGA Multi-Touch Screen12.1” Widescreen Capacitive Touch Screen标配存储深度50 Mpts/Ch12.5 Mpts/Ch 25 Mpts Interleaved 12.5 Mpts/Ch 25 Mpts Interleaved 最大存储深度†Up to 250 Mpts Up to 50 Mpts Up to 25 Mpts 采样率Up to 10 GS/sUp to 10 GS/sUp to 5 GS/sMSO 特性†(数字通道)250 MHz, 1.25 GS/s 16 Ch 250 MHz, 1.25 GS/s 16 Ch 125 MHz, 500 MS/s16 Ch触发类型Edge, Width, Glitch, Pattern, Video, HDTV, Runt, Timeout, Slew Rate, Interval (Period), Dropout, Qualified, Measurement, Window, CascadeEdge, Width, Glitch, Pattern, Video, HDTV, Runt, Slew Rate, Interval (Period), Dropout, Qualified, Window Edge, Width, Pattern, Video, HDTV, Runt, Slew Rate, Interval (Period), Dropout, Qualified串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 1.0/1.1/2.0, USB-PD, USB 2.0-HSICDME: ARINC 429TD: 100Base-T1, Audio, CAN, CAN FD, FlexRay, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART,USB-PDD: ARINC 429, DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 1.0/1.1/2.0, USB-PD, USB 2.0-HSIC TD: Audio, CAN, CAN FD, LIN, FlexRay, I2C,SPI, UART, RS232串行数据分析Serial Data Mask ––串行数据一致性测试Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1, Ethernet 10/100/1000Base-T ,MOST 50/150––应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Switch-mode Power Supply and Device Analysis, Three-phase Electrical Power, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Vector Signal Analysis, Electrical Telecom PulseMask TestSpectrum Analyzer (Single), Switch-mode Power Supply and Device Analysis , Electrical Telecom Pulse Mask Test Spectrum Analyzer (Single), Switch-mode Power Supply and Device Analysis ,Arbitrary Waveform Generator, Digital Voltmeter (Included standard with registration)外设接口USB Host for Storage, USB Device for PCLAN for PC, GPIB for PC†函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope, Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof, Segment, Sparse, Square, Square Root, Track, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Derivative, Deskew, Envelope, Enhanced Resolution, Floor, Integral, Invert, Reciprocal, Rescale, Roof, Square, Square Root, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Derivative, Deskew, Envelope, Enhanced Resolution, Floor, Integral, Invert, Reciprocal, Rescale, Roof, Square, Square Root,Trend, Zoom尺寸 (HWD)352 mm x 445 mm x 170 mm (13.8” x 17.5” x 6.7”)291.7 x 399.4 x 131.31 mm (11.48”x 15.72”x 5.17“)273 x 380 x 160 mm (10.7” x 14.9” x 6.3”)重量21 lbs (9.8 kg)12.6 lbs (5.71 kg)11.7 lbs (5.3 kg)保修3 yr3 yr3 yrWaveSurfer 3000z T3DSO2000AT3DSO1000 / T3DSO1000A带宽100 MHz to 1 GHz 100 MHz to to 500 MHz100 MHz to 350 MHz 分辨率8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间 3.5 ns to 430 ps3.5 ns to 800 ps3.5 ns to 1 ns通道(模拟+数字)4, 4+162 or 4, 2 or 4 + 16 2 or 4,2 or 4 + 16显示10.1” Capacitive Touch Screen10.1” CapacitiveTouch Screen 1024 x 6007" 800 x 480标配存储深度10 Mpts/Ch, 20 Mpts Interleaved 100 Mpts/Ch,200 Mpts interleavedT3DSO1000:7 Mpts/Ch, 14 Mpts interleaved,T3DSO1000A:14 Mpts/Ch, 28 Mpts interleaved最大存储深度†Up to 20 Mpts Up to 200 Mpts Up to 28 Mpts采样率Up to 4 GS/s100 MHz models: Up to 2 GS/sUp to 2 GS/sT3DSO1000: Up to 1 GS/s T3DSO1000A: Up to 2 GS/sMSO 特性†(数字通道)125 MHz, 500 MS/s 500 MS/s, 3.3 ns min detectable pulse width250 MHz, 1 GS/s 触发类型Edge, Width, Pattern, TV , Runt, Slew Rate, Interval (Period), Dropout, QualifiedEdge, Pulse, Pattern, Video, Runt, Slope, Interval, Dropout, Window / Zone Edge,Pulse, Pattern, Video, Runt, Slope,Interval, Dropout, Window 串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD: Audio, CAN, CAN FD, FlexRay, I 2C , LIN,RS-232, SPI, UARTTD: I 2C, SPI, UART- RS232, CAN, LIND: CAN FD, FlexRay, I 2S,MILSTD-1553BTD: I 2C, SPI, UART-RS232, CAN, LIN串行数据分析–––串行数据一致性测试–––应用软件选项Switch-mode Power Supply and Device Analysis , Function Generator , Digital Voltmeter (Included standard withregistration)Arbitrary Waveform Generator, Switchmode Power Supply and DeviceAnalysis, Bode Plot, 10-bit mode, Mask TestArbitrary Waveform Generator, WiFi, BodePlot外设接口USB Host, USB Device, LAN, GPIB, and LXICompatibleUSB Host, USB Device, LAN USB Host, USB Device, LAN 函数+, -, x, /, FFT, Absolute Value, Average, Derivative, Envelope, Floor, Integral, Invert, Reciprocal, Rescale, Roof, SinX/x, Square,Square Root, Trend, Zoom+, -, x, /, FFT, Derivative, Integral, Square Root / Formula Editor+, -, x, /, FFT, Derivative, Integral,Square Root尺寸 (HWD)270 x 380 x 125 mm (10.63” x 14.96” x 4.92”)224 x 352 x 111 mm (8.81” x 13.86” x 4.37”)150 x 312 x 133 mm (5.91"x 12.28" x 5.94")重量10.6 lbs (4.81 kg)7.92 lbs. (3.6 kg)/ 8.6 lbs. (3.9 kg)5.72 lbs. (2.6 kg)保修3 yr3 yr3 yrMDA 8000HD 电机驱动分析仪三相电机功率分析电机驱动工程师需要了解驱动系统运行的每个部分，需要查看控制、传感器、功率器件和功率的波形，需要了解动态事件，并且需要灵活地调试任何异常，电机驱动分析仪可以完成所有工作。

G6818 硬件手册

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第1章G6818开发板简介 (7)1.1产品简介 (8)1.2功能特性 (9)1.3搭载系统简介 (11)1.3.1Android5.1系统 (11)1.3.2Linux QT系统 (12)1.3.3Ubuntu系统 (12)第2章硬件资源 (13)2.1硬件接口描述 (13)2.2开发板启动指引 (15)2.3接口定义 (16)2.3.1核心板引脚定义1 (16)2.3.2核心板引脚定义2 (17)2.3.3核心板引脚定义3 (17)2.3.4核心板引脚定义4 (18)2.3.5核心板引脚定义5 (19)2.3.6J18(SPI扩展口) (19)2.3.7LCD1(LCD&VGA扩展口) (19)2.3.8J14(LVDS显示扩展口) (21)2.3.9J12(MIPI显示扩展口) (21)2.3.10U451(DVP camera接口) (22)2.3.11J15(MIPI camera接口) (23)2.3.12J11(UART1,COM1) (23)2.3.13J17(UART2,COM3) (24)2.4硬件接口 (24)2.4.1电源开关及插座 (24)2.4.2调试串口 (24)2.4.3HDMI接口 (25)2.4.4DVP camera接口 (25)2.4.5MIPI camera接口 (26)2.4.6以太网接口 (26)2.4.7耳机接口 (26)2.4.8喇叭接口 (27)2.4.9录音接口 (27)2.4.10TF卡槽 (27)2.4.11独立按键 (27)2.4.12调试LED灯 (28)2.4.13电源指示灯 (28)2.4.14USB OTG接口 (29)2.4.15USB HOST接口 (29)2.4.16开机按钮 (29)2.4.17复位按钮 (29)2.4.18LCD接口 (30)2.4.19后备电池 (30)2.4.20精准可调电位器 (30)2.4.21蜂鸣器 (30)2.4.22红外一体接收头 (31)2.4.23LVDS接口 (31)2.4.24MIPI接口 (31)2.4.25电池接口 (32)2.4.26PCIE3G/4G接口 (32)2.4.27SPI接口 (32)2.5底板尺寸图 (33)第3章配置清单 (34)3.1标配硬件清单 (34)3.2选配硬件清单 (34)3.3网盘资料清单 (34)第4章产品线介绍 (35)4.1核心板系列 (35)4.2开发板系列 (35)4.3卡片电脑系列 (35)第1章G6818开发板简介本文档讲述G6818开发平台的硬件资源，电路原理，支持的接口等。

Buyer,purchasing,owner 外贸邮箱-电子产品及电器设备等

First Name Last Name Title Company Address Phone Email Revenue Employees Marguerite S help Purchasing Doron Preci174 Court S607-772-161mshelp@doro11100 Paul Lones Purchasing Fairchild S82 Running 207-775-841paul.lones@16709691 Tim Hart Director; C Intel Corpo CH5-286 500480-552-327tim.hart@in3758683900 Ellie GrassettiDirector Ma Commonwealt1400 State 413-787-670ellie.grass1725 Raymond Durand Vice Presid Custom Manu235 Main Du603-883-135ray.durand@550 Shirley Xavier Secretary; E-Max Instr13 Invernes303-799-664shirleyx@e-550 Ted PartridgePurchasing Diamond Pow2600 E Main740-687-650tcpartridge3075 Tom Gott Planning an Communicati811 Hansen 650-846-304tom.gott@cp2511200 Dean Ten BruinPurchasing I ntermatic 7777 Winn R815-675-232dtenbruin@i5769 Diana Palad purchasing Flextronics2090 Fortun408-576-796diana.palad1337978000 Mika Means purchasing Mer-Mac7042 SANTA 760-244-614mmeans@merm550 Purchasing Generac Pow Hwy 59 & Hi262-544-481smittels@ge701000 Shelley MittelstaedAndy Urkshus Purchasing Lake Court 1225 Elko D586-754-480aurkshus@la1150 Bob Curits Purchasing G SI Group I39 Manning 978-439-551curitsr@gsi3301347 Mark Simoncelli P urchasing Luminescent130 Commerc716-655-080msimoncelli36125 Ray McfarlandMaterials a Kokusai Sem2460 N 1st 408-456-275rmcfarland@3050 Tim Weir Director of Jabil Circu10560 N. 9T727-577-974tim_weir@ja1278061000 Eric Fournier Purchasing D ependable 1003 E Newp954-283-584efournier@d1150 Sandra Lyster Director of Mag Instrum1635 S Sacr909-947-100slyster@mag75500 Shirley Fan Purchasing G alaxy Elec201 E Arapa972-234-006shirley@gal30200 Gloria Wist Purchasing General Ele8880 Gorman410-888-520gloria.wist183207323000 Jack Rotzell PURCHASING Cybertech935 Horsham215-957-622rotzell@cbr115 Rose Axtell Administrat Micron Tech P.O. Box 6208-368-414raxtell@mic584122800 Joan Karner Director - Holaday Cir11126 Bren 952-988-803joank@holad25185 Tom Mumby Purchasing Integrated 6024 Silver408-360-156tom.mumby@i3454815 Eric Kirvel Purchasing Custom Craf PO Box 7363330-630-959ekirvel@cus150 Purchasing Kuchera Def345 Pomroys814-467-906bodenschatz33199 Tim BodenschatzRobert Mudge Director - Ithaca Coll953 Danby R607-274-328rmudge@itha56280 Matt Reiff Purchasing General Man1100 S Morg260-824-344mreiff@saft550 Alex Liew Vice Presid Flextronics2090 Fortun408-576-700alex.liew@f1337978000 Pat Cullen Vice Presid Flextronics2090 Fortun408-576-700pat.cullen@1337978000 Vice Presid Janus Hotel2300 NW Cor561-997-232rziegelmeye1502413 Rick ZiegelmeyerBob Valderrama P urchasing Integrated 6024 Silver408-284-820bob.valderr3454815 Chris Knorr Engineering Linear Tech1630 Sycamo408-941-977cknorr@line11003755 Greg Westby Purchasing Integrated 2975 Stende503-681-682gwestby@ore3454815 Rick Bowdoin Purchasing Linear Tech1630 McCart408-432-190rbowdoin@li11003755 Deb Frey Purchasing Hitran Corp362 State R908-782-552dfrey@hitra75200 Kim Carrey Purchasing Interconnec5024 W Vick817-377-947c.kim@inter30200 Angie Otam Purchasing IRC-Shallcr PO Box 2240919-934-518angieo@abau17125 Ann Eaton Network Pur Jabil Circu495 Billeri978-848-102ann_eaton@j752434000 Arthur Encinas Purchasing Environment17891 Arent626-965-082dchandler@a515 Aurora Bustamante P urchasing Laredo Comm1 W End Was956-721-511azapata@lar5200 Barbara Odonnell Purchasing Kulite Semi1 Willow Tr201-461-090barbara@kul29480 Becky Ianieri Purchasing M eyer Sound2832 San Pa510-486-116becky@meyer30200 Ben Evans Manager; Gr Graceland F1123 Main S231-352-718amahor@quik1196 Beverly Scheinberg P urchasing Eby Electro210 Express516-576-777sbaca@atkin67156 Beverly Schnieberg P urchasing Eby Electro210 Express516-576-777cstephanie@67156 Blanche Visalli Purchasing D ewey & LeB1301 Avenue212-259-800bvisalli@ll10005000 Bob BernaicheDirector-Pu CPI Interna150 Sohier 978-922-600bbernaiche@2511200 Bob Chaffet Purchasing I PC Informa3 2nd St St203-399-598bob_chaffet263765 Bob Duhaime Manager-Pur Delta Elect416 Cabot S978-927-106bduhaime@de30200 Bonnie Ohman Purchasing Electronic 5400 Legacy248-365-828OPT-OUT22135139500 Cecily Robinson Purchasing F lowtron15 Highland781-321-230cecilyr@arm5200Celeste Bislig Purchasing Interconnec708 Via Alo805-482-287celeste.bis30500 Chad Martin Purchasing H igh Indust1853 Willia717-299-898cmartin@hig3505000 Charles Wilson Manager-Pur Emerson Rad9 Entin Rd973-428-211cwilson@eme321371 Charlie Solis EDS-Purchas Electronic 1075 W Entr972-604-600OPT-OUT22135139500 Charolette D emott Purchasing Energizer H3131 E 1st 660-582-611charolettei299015221 Cheryln Kelly Purchasing E nergizer H50 N Dupont302-678-686cheryln.kel299015221 Director of Luvata70 Sayre St716-879-670christian.w750500 ChristianWojciechowsCindy Bryan Information Kissimmee U1701 W Carr407-933-980cbryan@kua.5170 Dale Kastning Purchasing L ake County7700 Clockt440-525-700dkastning@d515 Dale Kastning Purchasing L ake County7700 Clockt440-525-700larry@ela-l515 Dan Kubis Purchasing Kichler Lig7711 E Plea216-573-100dkubis@kich1000800 Dave Dalski Director Gl Electronic 5400 Legacy972-604-600dave.dalski22135139500 David Aussendorf P urchasing Cypress Sem198 Champio408-943-260dfa@cypress18034100 Vice Presid Meyer Sound2832 San Pa510-486-116davidb@meye30200 David BeddingfielDavid Jones Purchasing Ideal Elect330 E 1st S419-522-361djones@idea30200 David Wilson Purchasing Electrocraf1 Progress 603-742-333dwilson@ele43200 Dawn Bethel Purchasing JDS Uniphas5808 Church317-788-935dawn.bethel6804500 Dawn Greene Purchasing K&L Microwa2250 Northw410-219-399dgreene@klm5400 Debbie Arcello Eds Adminis Electronic 5400 Legacy972-604-600debbie.arce22135139500 Diane Graziano Purchasing DRS Laurel 246 Airport814-534-874dgrazian@lr100075000 Purchasing Electronic 600 E 50th 605-338-686rtelfer@the0200 Dick ChristensenDon Baynes Purchasing Mccain Prin525 Wilson 434-792-133joannegaude345 Dorothy Carrillo Senior Buye Infineon Te640 N McCar408-501-640dorothy.car111001000 Ed Roberson Purchasing HARBOR ELEC825 Old Tra717-938-720edr@harbor-30200 Edgar Sarreal Custom Purc Environment17891 Arent626-965-082dfloyd@aldr515 Ellen Lakey Purchasing Intel Corpo Intel 2200 key3758683900 Emily Seabolt Purchasing Frederic Pr14701 E 38t303-371-799emilys@fred30200 Erick Segura Finance/Pur Intel Corpo2200 MISSIO408-765-808erick.segur3758683900 Erik Bruder Purchasing Energizer H533 Maryvil440-835-789erikj.brude433116410 Gail Staton Purchasing Delta Star3550 Mayflo434-845-092gstaton@del5405 Gangasuthan Arumugam Manager Pur Emerson Ele8000 W Flor314-553-200gangasuthan25281140700 George Manory Director-Sa Kavlico Cor14501 Princ805-523-200gmanory@kav811400 Employee no Intel Corpo2200 MISSIO408-765-384gerda.green3758683900 Gerda Greenband SGlenn Hric Purchasing Kulite Semi1 Willow Tr201-461-090glenn@kulit29480 Irma Hernandezpurchasing H oriba Inst17671 Armst949-250-481irma.hernan26200 Janet Hessler Purchasing DATA DEVICE105 Wilbur 631-567-560hessler@ddc1401494 Janice Foley Purchasing Harman/Beck39001 W 12 248-994-210jfoley@harm15010606 Jeff Shelton Purchasing K EMET Corpo2835 Kemet 864-963-630jeffshelton4258100 Jennie Chung Finance/Pur Flextronics4415 Courtn469-229-211jennie.chun1337978000 Jeri Hilgert Purchasing Harris Corp3200 Wisman217-222-820jeri.hilger531116000 Jill Buttry Purchasing Dewey & LeB1301 Avenue212-259-800jbuttry@dew10005000 Jill Sanders Purchasing Jabil Circu30 Great Oa408-361-336jill_sander1278061000 Jim Schulz Purchasing M agnetek; I PO Box 1361262-783-350jschulz@mag188200 John Carroll Purchasing ERCO Worldw5700 Hunt R229-293-101jcarroll@er150500 John Sell Purchasing EMCORE Corp10420 Resea505-332-500john_sell@e93650 Kathy Ogurek General Man Electronic 5400 Legacy972-604-600kathy.ogure22135139500 Keith Hogston Purchasing Dewey & LeB1301 Avenue2074566000-khogston@dl10005000 Kendrick Fong Purchasing Integrated 6024 Silver408-284-820kfong@idt.c3454815 Kevin Junk Commodity M Deflect-O C7035 E 86th317-849-955kevin.junk@150200 Kris Brzezinski P urchasing Electrotek 7745 South 414-762-139kbrzezinski30200 Larry White Purchasing H.L. Electr2113 109th 972-660-409larrywhite@11200 Linda Hilten Purchasing Magnetek; I N49W13650 C800-288-817lhilten@mag188200 Mark Jordan Manager-Pur Luvata Gren553 Carter 920-749-382mjordan@luv750500 Purchasing ILSCO4730 Madiso513-533-620mvanschoyck75200 Marsha Van SchoyckMarvin Sox Purchasing Flextronics1000 Techno803-936-520marvin.sox@1337978000 Mary Gurrola Purchasing Harman/Beck12276 Chish248-994-210mgurrola@ha15010606 Mary Hammond Director-pu Micron Tech3475 E Comm208-363-591mhammond@mi584122800 Mary O'connellPurchasing L uvata Gren801 Pittsbu740-363-198mary.o'conn750500 Maryann Schabinger P urchasing Micrel Semi2180 Fortun408-944-080maryann.sch322884 Maureen Weiner Human Resou Keenan Moto854 N Easto215-340-900mweiner@kee30500 Max Chancellor M anaging Di Maxim Integ120 San Gab408-737-760max.chancel5177599 Melissa Godsey Purchasing C ircuit Wor110 Albrech847-283-860mgodsey@cwc30120 Michael Chaney Director; S Flextronics130 Mosswoo919-556-788mike.chaney1337978000 Michael Roche Purchasing Micrel; Inc2180 Fortun408-944-080michael.roc322821 Mike RasmussenInformation Kicker Stil3100 N Husb405-624-851mrasmussen@30500 Mike Rhodes Purchasing CrownTonka 140 T Elmer888-558-665mrhod@crown30200 Mike Villot Purchasing C ypress Sem3901 N 1st 408-943-260mev@cypress18034100 Mitch Smith Purchasing Finisar Cor600 Milleni214-509-270darryl.gree1663688 Omid Ghamami Corporate P Intel Corpo1900 Prairi408-765-808omid.ghamam3758683900 Pam King Purchasing F R C Compo1511 S Benj641-424-037pking@frcco30125 Pam Wilson Purchasing Hitachi Com3617 Parkwa770-797-252pwilson@hit550 Pat Cody Manager-Pur Kopin Corpo200 John Ha508-824-669pcody@kopin87379 Patricia Binkley Purchasing Flextronics3401 Platt 803-796-999pat.binkley1337978000 Paul Nawrocki Purchasing C rownTonka 304 Main St507-893-388pauln@crown30200 Paul Reddish Site Purcha Fairchild S3333 W 9000801-562-741paul.b.redd16039798 Paulino Valenzuela P urchasing H EI; Inc.610 S Rockf952-443-250paulino.val57299 Peter Kim Director; G Littelfuse;800 E North847-391-043pkim@littel5005822 Randy Stokes Director of Cree ; Inc.4600 Silico919-313-530randy_stoke3891364 Raquel Smith Purchasing Control Pan1275 Turret815-654-600rsmith@cont640 Renee Campbell Purchasing Electro-min68 W Commer201-460-051mblake@atki015 Rick Brown Purchasing/Micron Tech PO Box 6208-368-400rbrown@micr584122800 Robery Wolley PURCHASING Electropac 252 Willow 603-622-371wolley@elec12110 Ron Reed Director of JDS Uniphas1768 Automa408-546-500ron.reed@jd7126041 Ron Smack Purchasing Conelec of 421 Cornwal407-321-900rons@conele75500 Scot Ratozo Director-Pu HCC Industr485 Oberlin732-370-910sratozo@gla9300 Shaaron Anderson Purchasing C onax Flori2801 75th S727-345-800OPT-OUT515 Sherri Chung Purchasing Enlight Cor12059 Teleg562-781-989OPT-OUT550 Sherri Chung Purchasing Enlight Cor12059 Teleg562-781-989sherri.chun550 Sonya Huntzinger P urchasing Entellium1011 Wester206-245-230shuntzinger115 Purchasing Delta Syste1734 Frost 330-626-281sstonebrake12200 Steve StonebrakerSusan Long Purchasing Dcm Manufac4540 W 160t216-265-800dsparks@atk1161 Tammy Cardwell Purchasing I daTech; LL63065 NE 18541-322-102tcardwell@i5200 Teresa Fonseca Purchasing Laredo Comm1 W End Was956-721-511teresa.fons5200 Terri King Purchasing E MCORE Corp10420 Resea505-332-500terri_king@93650 Thomas Jones Global Purc Electronic EDS 5400 Le972-604-600thomas.f.jo22135139500 Thomas Meirink State Purch Illinois De201 S. Gran217-782-120mary.doles@8415 Tim Klumb Purchasing Control Pro1000 Hickor262-377-080lackerman@b115 Tom Jackson Purchasing General Ele667 Industr814-472-798tjackson@ca1259132100 Tom Bad Pho Walters Purchasing Flextronics10 Pomeroy 973-515-101twalters@fl1337978000 Willa Xu Purchasing Flextronics2090 Fortun408-576-700willa.xu@cn1337978000 Yolanda Salazar Finance/Pur Intel Corpo4100 Sara R505-794-405yolanda.m.s3758683900 Antonio Flores Vice Presid KEMET Corpo PO Box 3126956-982-467antonioflor4258100 Chris Sachs Head of Pur Fisher & Co33300 Fishe586-296-177csachs@fish255500 Dale Bernhardtpurchasing Intel Corpo CH6-236 500503-456-480dale.bernha2676485000 Dale TomlinsonPurchasing Lumax Indus PO Box 991814-944-253dlt@lumaxli30200 Dan Bolduc Purchasing Kim Lightin16555 Gale 626-968-566dbolduc@kim75400 Darrin Moorhead Purchasing IRC4222 S Stap361-992-790darrin.moor5292 Gary Poulsen Purchasing L-3 Communi1914 W Reno918-258-070gwpoulsen@l30200Gloria Lopez Director; P Exar Corpor48720 Kato 510-668-706gloria.lope67290 Jay Zaidel Purchasing I RC736 Greenwa828-264-886jay.zaidel@5292 Jodi Fatherly Director of Eurotech In13510 Oak S816-941-702jodi.father097 Kathleen Semiao Purchasing Cps Technol111 S Worce508-222-061ksemiao@als13131 Mary Piestrak Purchasing IdaTech; LL63160 Britt541-322-105mpiestrak@i150200 Miguel Garcia Purchasing DiCon Fiber1689 Regatt510-620-500mgarcia@dic5200 Mike Hughes Purchasing Korry Elect11910 Bever206-281-130mhughes@kor750500 Pauline Fernando Internation Horiba Inst17671 Armst949-250-481pauline.fer26200 Ralph Haney Program Exe Electronic 5400 Legacy972-605-290ralph.haney22135139500 Rodge HoushmandPurchasing Emerson Ele8000 W Flor903-868-322rodge.housh25281140700 Sandy Schlauch Purchasing Corrpro Com1090 Enterp330-723-508sschlauch@c1351238 Steve Spears Purchasing I ndustrial 48205 Warm 510-360-123steves@iemf30200 Javad Mirpanah General Man Energizer H533 Maryvil314-985-200javad.mirpa433116410 Linda Hayes Director of Harman Inte8500 Balboa203-328-350lhayes@harm303110606 Terry Hughes Director Pu Emerson Ele8000 W Flor314-553-200terry.hughe25281140700 Ted Iacocca Purchasing Mechdyne Co1580 King S519-664-003ted.iacocca550 Eddie Bacoonians D irector of Lucero Manu193 Stauffe408-298-600ebacoonians550 Garnet Bremner Director of Integrated 11353 Sorre858-259-260gbremner@im615 Greg Pedras NPD Purchas Cymer; Inc.17075 Thorn858-385-730gpedras@cym368770 James Bell Director of Interphase 2901 Dallas214-654-500jbell@iphas2915 John Rose Director-Pu Cooper Powe3660 S Scho479-521-370jrose@coope15030520 Kurt Ebbs Purchasing/Enertron305 Airport760-966-606kebbs@enert015 Leng Lay Director-Pu Desco Ind3651 y@de25200 Michael Eanni Director of Fair-Rite P1 Commercia845-895-205eannim@fair30200 Mike Abbott Director of Fasco Motor1401 E Nort573-392-715mike@fasco.54500 Virginia Fair Director Pu Kintronics500 Executi914-944-342virginia@ki55 Andy Chan Purchasing Jazz Semico4311 Jambor714-435-800AndyChan@Ja150805 Art Nogales Purchasing Coronet Man16210 S Ava310-327-670ANogales@Co1225 Barbara Shaner Purchasing Fmc Airline7300 Presid407-851-337Barbara.Sha27689800 Craig Godfrey Purchasing Homac Compa12 Southlan386-677-911Craig_Godfr11500 Eric Swogger Purchasing Internation41915 Busin951-676-750Eric.Swogge7625800 Janice Argent Purchasing Jack Ingram227 Eastern334-277-570Janice_Arge115 Karyn Guttman Purchasing Diodes Inc3050 E Hill805-371-444Karyn_Guttm1162268 Kathy Hoof Purchasing Integrated 11353 Sorre858-259-260KathyHoof@I615 Meena Zerha Purchasing Ledtronics 23105 Kashi310-534-150Meena@Ledtr10130 Pam Farley Purchasing Mack Techno7505 Techno321-725-699Pam@Macktec40500 Carol Gass Purchasing Magnetika I300 Red Sch908-454-260CGass@Magne30121 David Rogan Purchasing Harris Asse187 Industr607-772-120DRogan@Harr550 Derik Gervais Purchasing Kencoil2805 Engine504-394-401DGervais@Ke8130 Jim Haworth Purchasing Horiba Inst5900 Hines 734-213-655Jim@Horiba.2650 John Volante Purchasing Mac-Gray404 Wyman S781-487-760JVolante@Ma3743 Joseph Hacker Purchasing Harman Beck1201 S Ohio765-342-555JHacker@Har303110606 Kirk Keithley Purchasing Egide USA4 Washingto410-901-610Kirk@Egideu684 Mark Seymour Purchasing Metro Fabri1650 Tech D989-667-810MSeymour@Me6500 Mike Chaney Purchasing Flextronics130 Mosswoo919-556-788MChaney@Fle1337978000 Sherry Jones Purchasing Klipsch Aud3502 Woodvi317-860-810SherryJones30500 Amanda Kelly Purchasing Lcr Electro9 S Forrest610-278-084Amanda.Kell515 Bob Siegler Purchasing Lutron Elec7200 Suter 610-282-380Bob_Siegler36350 Craig Benson Purchasing Hi-Stat Man345 S Mill 419-884-121CraigBenson515 Darrell Thomas Purchasing Cryomagneti1006 Alvin 865-482-955DarrellThom550 Dave Serafin Purchasing Koehler-Bri380 Stewart570-825-190Dave_Serafi515 Dianna Mencer Purchasing Global Inst1501 Raff R330-479-420DMencer@Che115 Flo Tegher Purchasing Laser Drive5318 Ranall724-443-768Flo@Laserdr1464 Frank Charvat Purchasing Libra Indus7770 Divisi440-266-023Frank.Charv30100George Ware Purchasing Marlow Indu10451 Vista214-340-490GWare@Marlo75500 Joan Hoffman Purchasing M & G Elect889 Seahawk757-468-600JoanHoffman75700 Kathy Andrews Purchasing K-Tec1206 S 1680801-222-088Kathy_Andre30200 Keith Maddox Purchasing Maxim Integ4401 S Belt972-702-925Keith.Maddo5177599 Mark Gagle Purchasing Crown Equip44 S Washin419-629-231Mark.Gagle@1090135 Niki Cherpas Purchasing Delta Syste1734 Frost 330-626-281Niki@Deltas12200 Tony NatalizioPurchasing Electronic 1915 Mac Ar262-542-560tony@etcia.380 Vicki Sell Purchasing Koss Corp4129 N Port414-964-500vicki.sell@40111 Ann Morris Purchasing E spey Mfg &233 Ballsto518-584-410amorris@esp19175 Ann Tyznar Purchasing Kepco; Inc.13138 Sanfo718-461-700atyznar@kep10200 Belen BerenguerPurchasing Gables Engi PO Box 1408305-774-440bberenguer@1286 Charles Hahn Purchasing Curtiss-Wri201 Old Boi704-480-527chaen@curti350500 David Avery Director Of Electro Swi2010 Yonker919-833-070davery@elec2499 David Lee Purchasing Keystone El2511 Bell A515-283-256dlee@keysto115 Della Boone Purchasing Dover Corpo2250 Northw410-749-242dboone@klmi5400 Ed Jahn Purchasing Lincoln Ele947 Lehigh 908-688-290ejahn@lepro3050 Edison Alulema Purchasing Louis Baldi1902 Steinw718-204-570ealulema@ba00 Faith FennimorePurchasing Hunterdon T75 Industri908-454-240ffennimore@0103 Harry Smith Purchasing Lovejoy; In2655 Wiscon630-852-050hsmith@love30280 Ron Hartman Purchasing Lochinvar C300 Maddox 615-889-890rhartman@lo23375 Liz Akinsiku Senior Buye Cypress Sem10147 W Eme408-943-260lea@cypress18034033 Dan Rachis Director Wo Conexant Sy10670 N Tan949-483-460dan.rachis@16945 Stephi Luttrell Purchasing Cryomagneti1006 Alvin 865-482-955sluttrell@c550 Annette Bullock Purchasing Cryomagneti1006 Alvin 865-482-955abullock@cr550 Ed Slomba Purchasing Fairchild S82 Running 207-775-810ed.slomba@f16709691 Linda Small Purchasing F airchild S82 Running 207-775-810linda.small16709691 Ken Greer Project Pur Interlink E546 Flynn R805-484-885kgreer@inte35226 Dinesse Vicente Purchasing L inear Tech3220 Tillma408-432-190dvicente@li11003755 Harley Glassik Purchasing Comverse170 Crosswa949-863-870hglassik@st9591500 Amy Gabrielson P urchasing Micron Tech3080 3060 N208-368-400algabrielso584117900 Susan Lee Purchasing Micron Tech3080 3060 N208-368-400susanlee@mi584117900 Wendy Nguyen Purchasing I ntel Corpo5000 W Chan408-765-808wendy.m.ngu3758683900 Patricia Cody Purchasing K opin Corpo200 John Ha508-824-669patricia_co87379 Jennifer Harrison Purchasing I ntel Corpo5000 W Chan408-765-808jennifer.j.3758683900 Patricia Wogan Purchasing Cubic Corpo3800 Concor858-277-678patricia.wo7225700 Deborah Newton Purchasing Intel Corpo2200 MISSIO408-765-808deborah.new3758683900 Joe Alcantar Purchasing Memgen7911 Haskel818-786-332jalcantar@m235 Fred Greear Purchasing Graphic Res9334 Mason 818-886-734fred@graphi191 Jeff Greenhalgh P urchasing C onexant Sy10670 N Tan949-483-460jeff.greenh16945 Sandy Nunez Purchasing Interlink E546 Flynn R914-654-200snunez@newr35226 Lisa Martin Purchasing I ntel Corpo2800 Center253-371-808lisa.a.mart3758683900 Cory Felber Purchasing CyberOptics5900 Golden763-542-500cfelber@cyb58175 Mariela Salazar Purchasing I ntel Corpo2200 MISSIO408-765-808mariela.sal3758683900 Sandy Slinker Corporate P Intel Corpo2200 MISSIO408-765-808sandy.j.sli3758683900 Greg Fowers Purchasing Intel Corpo2200 MISSIO408-765-808gregory.h.f3758683900 Tori Perkins Purchasing Connectec C1701 Reynol949-252-107tori@connec750 Lynn Fleming Director Of Electronic 2700 Touhy 847-364-484lynn@eiconn599 Debbie Cervelli Purchasing Laser Techn7070 S Tucs303-649-100dcervelli@l890 Kim Marino Optical Pur Fiberplex I10840 Guilf301-604-010kmariano@fi550 Kevin Gardner Purchasing Da-Tech Cor141 Railroa215-322-941kgardner@da115 Mike Dutter Purchasing Da-Tech Cor141 Railroa215-322-941mdutter@da-115 Rich Loeffler Purchasing Da-Tech Cor141 Railroa215-322-941rloeffler@d115 Ann Sonntag Purchasing Da-Tech Cor141 Railroa215-322-941asonntag@da115 Karen Stone Purchasing Da-Tech Cor141 Railroa215-322-941kstone@da-t115Belinda Omiecinski P urchasing Composite M15460 Aviat352-799-259belinda.omi550 Sheri Walters Purchasing Composite M15460 Aviat352-799-259sheri@cmi-s550 Erivan Toledo Purchasing Corvalent C1101 Arrwpi512-456-240erivan.tole3050 Holly Paola Purchasing C ox Researc14697 S Har225-756-327holly@coxre00 Joanne Kuebler Purchasing Elma Electr760 Veteran215-956-120joannek@act530 Joe Solt Purchasing Elma Electr760 Veteran215-956-120joes@acttec530 Darlene Collopy Purchasing Dare Electr3245 S Coun937-335-003dcollopy@da550 Lori Carrier Purchasing F iber Instr161 Clear R315-736-220lcarrier@fi07 Dave Goad Purchasing Grupo Iusa;86 Tube Dr610-926-414dgoad@camle5910 Marv Williams Purchasing Gsi Group C8401 Jeffer763-391-792mwilliams@g3301347 Kathy Smith Purchasing HITACHI; LT630 Clyde C650-961-550ksmith@hcdi515 Walter Nuessle Director Pu Infineon Te2070 Bus Ce866-951-951walter.nues111001000 Seri Dvorak Purchasing Intel Corpo425 N Matin503-677-760seri.dvorak2676483900 Rebecca Scott Purchasing Inter-Globa918 Airport636-937-156rscott@plas570 Pat Shannon Purchasing M anutech As1400 Provid781-551-550pshannon@in550 Jerry MarinelloPurchasing L ace Techno3483 Swenso630-762-386jerry@leadf114 Ken St Charles P urchasing Leprecon; L10087 Indus810-231-937kenstcharle570 Troy Dixon Purchasing/Leemah Corp1001 E Arap214-570-717tdixon@leem150500 Ben Jones Purchasing L eemah Corp1088 Sansom415-394-128bjones@leem150500 Terry Weygant Purchasing Logical Pro1503 Saint 847-336-616tweygant@lo050 Dave Pullezi Purchasing M icrel; Inc1849 Fortun408-944-080dave.pulizz322821 Jim Gage Purchasing Cubic Corpo4550 3rd Av360-493-627jim.gage@cu7225700 Mary Smith Purchasing Custom Magn4050 N Rock773-463-650msmith@jeic550 Derek Long Purchasing C ustom Manu235 Main Du603-883-135derek.long@550 FranciscoMercado Purchasing Dearborn El1221 N US H407-695-656fmercado@de00 Sherman Freelin Corporate I Delta Group4801 Lincol505-883-767sfreelin@de30200 Dan Barz Purchasing D. C. Motor2200 Sturde715-536-978dan@dcmotor08 Shawn Wheatcroft P urchasing Duplium (u.2029 Westga972-512-001swheatcroft16100 Andy Coatney Purchasing Duplium (u.2029 Westga972-512-001acoatney@du16100 Keith Casey Purchasing E ltek ASA1303 E Arap469-330-910keith.casey303 Calvin Ward Purchasing General Mic1133 N Main704-663-597cward@gmimf1110 Geoffrey Chai Purchasing H ITACHI; LT475 Alaska 310-212-020geoffrey.ch5922 Erick Shiring Purchasing H ITACHI; LT222 North P724-548-763erick.shiri30500 Angelia Hall Purchasing H ITACHI; LT955 Warwick859-734-945angelia.hal5922 Barry Hicks Mro Buyer/c HITACHI; LT955 Warwick859-734-945barry.hicks5922 Crystal Young Purchasing H ITACHI; LT955 Warwick859-734-945crystal.you5922 Kelly Isaacs Purchasing HITACHI; LT955 Warwick859-734-945kelly.isaac5922 Maria HernandezPurchasing H ITACHI; LT9605 Airway619-661-660mhernandez@5650 Mark Martin Purchasing J k Microsys1403 5th St530-297-607mmartin@jkm07 Terry Mays Manager Of Jk North Am1 Walter Kr870-935-113terrym@sune3050 Randy Miller Purchasing Ilc Intelli5229 Edina 952-829-190rmiller@ilc115 Purchasing I nfineon Te1050 US Hig866-951-951christian.r111002128 ChristianRosengartenAchim Janker Purchasing I nfineon Te1901 N Rose866-951-951achim.janke111002128 Wolfgang SchneiderSenior Dire Infineon Te2070 Bus Ce866-951-951wolfgang.sc111001000 Amy Haralson Purchasing Jmr Industr136 Hillwoo770-251-532aharalson@c3015 Craig Wyrick Purchasing Jabil Circu10560 9th S502-240-100craig_wyric1278061000 Donald Klein Purchasing J abil Circu10560 Dr Ma727-577-974donald_klei1278061000 Carey Personette P urchasing Kauffman En315 N Liber574-546-466cpersonette7515 Karin Alcorn Purchasing Jabil Circu10560 Dr Ma727-577-974karin_alcor1278061000 Carolyn Thrasher Purchasing J abil Circu10560 Dr Ma727-577-974carolyn_thr1278061000 John Bogigian Purchasing Jaco; Inc.140 Constit508-553-100jbogigian@j7100 Gail Evans Purchasing Meridian Te700 Elmont 516-285-100gevans@meri530 Cynthia Merritt Purchasing C olonial As3361 Shanno540-372-650cmerritt@co550 Steve Douglas Purchasing C onveyant S1901 Carneg949-756-710steve@conve515Clint Wilson Purchasing Delta V Ins1870 Firman972-644-650clint@delta03 Claudia Harper Purchasing D eepsea Pow4033 Ruffin858-576-126claudia_har1150 Amy Thomas Purchasing Elan Indust401 Remingt630-679-200athomas@ela050 Gary Nusbaum Purchasing Dallas Elec2151 Delawa831-425-877garyn@dalla33200 George ContrerasPurchasing Electronic 2602 McGaw 949-855-662gcontreras@550 Steve Caron Purchasing E lectro Con N84w13562 L262-255-666scaron@elec020 Karen Lewis Purchasing E lectronics1387 Brghtn Henrtt T karenlewis@1215 Karen Lewis Purchasing Electronics1387 Brghtn Henrtt T karenlewis@1215 Patricia Pressel Purchasing Electro Tra1514 Progre574-234-060ppressel@et550 Larry Salyer Purchasing E lectro-Mec329 William276-466-820lsalyer@lin23 Lynn Reeves Purchasing Electro-Mec329 William276-466-820lreeves@ele23 Dennis Neiger Purchasing Electro-Pla329 14th St419-838-736dennis.neig215 Pauline Jennigs Purchasing Electronic 11200 Hamps952-922-688pauline@kin2200 Teresa Angel Purchasing Electronic 31 Millrace434-385-004tangel@edmv30200 Joan McEwen Purchasing Electronic 22410 70th 425-775-846joanm@audio515 Marco Polit Purchasing Ellenby Tec412 Grandvi856-848-202marco.polit550 Peggy Brand Purchasing Emrise Corp611 Industr732-460-021pbrand@adva1025 Joann Couse Purchasing Emrise Corp611 Industr732-460-021jcouse@adva1025 Richard Fischer Purchasing HITACHI; LT1024 Barach812-663-505rfischer@st31250 Ivan Campbell Purchasing HITACHI; LT117 Gulick 570-638-210ivan.campbe52612 Michele Michaels Purchasing HITACHI; LT12555 Loma 530-273-838michele_mic185 Vicki Thomas Purchasing H ITACHI; LT12555 Loma 530-273-838vicki_thoma185 Sean Conroy Purchasing I nservco; I110 Commerc440-355-510seanconroy@3050 Tammy Montoya Purchasing Insight Lig4341 Fulcru505-345-088tmontoya@in30200 Marvin Manz Purchasing Insource Te12124 Count419-399-360marvin.manz3050 Quin Manor Purchasing Ixys Corpor4268 Solar 510-651-670qmanor@mwti550 Kelvin Phillips Director Pu Ixys Corpor6800 Santa 408-513-150kphillips@z140500 Ken Fox Purchasing LSI Industr1108 Oakdal931-723-444kfox@lsi-in2821740 Sylvia Bilban Vice Presid LSI Industr1108 Oakdal513-793-320sylvia.bilb2821740 Jack Farnsworth P urchasing LSI Industr1108 Oakdal913-281-110jack.farnsw2821740 Kelley Bentley Purchasing Leightronix2330 Jarco 517-694-800kbentley@le121 John Evans Purchasing Lloyd Indus3081 Elm Po636-946-330jevans@jpcc550 Heidi Frampton Purchasing M icron Tech47300 Baysi801-767-400hframpton@i30193 Eric Kohl Purchasing M agnum Ener2211 W Casi425-353-883ekohl@magnu550 Diana Purtee Head Of Pur Maca Plasti3455 Cross 937-544-861dpurtee@mac015 Joe Skinner Purchasing Mainco Inve1861 Vander901-377-501jskinner@sa550 Purchasing Mainco Inve1861 Vander901-377-501echristenso550 Eric ChristensonJim Smith Purchasing Megatran In312 Rising 609-298-730jsmith@nwl.3050 Theresa LongridgePurchasing Micrometals5615 E La P714-970-940tlongridge@14100 Rick Colen Purchasing Delta Star;3550 Mayflo434-845-092rickc@delta30405 Joe Hoffmann Purchasing Compunetix 2420 Mopaid412-373-811jhoffmann@c75200 Lyle Burrell Purchasing E lectri-Cor312 E Main 814-367-226lyle@electr015 Thomas Berry Purchasing Electri-Cor312 E Main 814-367-226thomas@elec015 Marie Raubeson Purchasing D iablo Indu2245 Meridi775-782-104mraubeson@d320 Sherry Watts Purchasing Eminence Sp838 Mulberr502-845-562sherry.watt550 Michelle Sentance Purchasing Flintec; In18 Kane Ind978-562-454msentance@f515 Gary Thielman Director Of Glw Incorpo1026 Firest615-641-720gary@glw.co75500 Larry Tutor Director Of Hallmark Ma9631 De Sot818-885-501larry@hallm320 Greg Cooke Purchasing Harman Inte400 Atlanti203-328-350gcooke@harm303110606 Janet AbbenantePurchasing Harman Inte8500 Balboa818-830-877jabbenante@303110606 Marshall Hill Purchasing Harman Inte8500 Balboa818-830-877mhill@harma303110606 John Scofield Purchasing Harman Inte8760 Sandy 801-566-880jscofield@h411211694 Don Hall Manager Pur Harman Inte1101 Penn A202-393-110dhall@harma411210606 Robert Hoffer Purchasing I on Beam Ap110 Clyde R NULL robert.hoff4400。

75176B中文资料

75176B中⽂资料PACKAGING INFORMATION Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN65176BD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDR ACTIVE SOIC D82500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDRE4ACTIVE SOIC D82500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDRG4ACTIVE SOIC D82500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N/A for Pkg TypeSN65176BPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N/A for Pkg TypeSN75176BD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDR ACTIVE SOIC D82500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75176BPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75176BPSR ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BPSRG4ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /doc/7167b986cc22bcd126ff0c93.html /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die andpackage,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak soldertemperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATIONDevice Package Pins Site ReelDiameter(mm)ReelWidth(mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantSN65176BDR D8FMX33012 6.4 5.2 2.1812Q1 SN75176BDR D8FMX33012 6.4 5.2 2.1812Q1 SN75176BPSR PS8MLA330168.2 6.6 2.51216Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length(mm)Width(mm)Height(mm)SN65176BDR D8FMX338.1340.520.64SN75176BDR D8FMX338.1340.520.64SN75176BPSR PS8MLA342.9336.628.58。

3656A B D 矢量网络分析仪选件手册说明书

主机：2813A S参数测试装置 3656A/B矢量网络分析仪（3656A配3656-H17选件， 36568自己3656-H29选件）
析、配：序号 1 2 3 4 5 6 7
名称电源线组f牛 USB电缆半刚电缆 3.5mm力矩扳手 2813A快速使用指南合格证随机光盘com l电费在撒电话， 800 Hfi岛illll
2根N型接头， 4根3.5mm接头
选件：选f牛编号 2813-H01 2813-H02 2813-H03 2813-H04 2813-H05 2813-H06
名称 N型测试电缆（ GORE-OSZKUZKU0240，双阳，60cm) N型测试电缆（ GORE-OSZKUZKV0240，阴阳，60cm) 2813A中文用户手册 20205 N型校准件（ DC-3GHz) 20201 N型校准套件（ DC-9GHz) 20202 3.5mm校准套件（ DC-9GHz)
3656A/B/D矢量网络分析仪
( 1 OOkHz～3GHz/1 OOkHz～8.5GHz/300kHz～20GHz)
主机：36560矢量网络分析仪（ 300kHz～ 20GHz)
标配：
序号 1 2 3 4 5
名称电源线组件 USB鼠标快速使用指南合格证随机光盘
说明标准三芯电源线
选件：
选件编号 3656-H12 3656-H13 3656-H14 3656-H15 3656-H19 3656-H30 3656-H31 3656-H32 3656-H33 3656-H34 3656 H35 3656-H36 3656-H37 3656-H38
名称 20403电子校准件 20405电子校准件 3656系列中文用户手册 3656系列英文用户手册上机柜选件 31121 3.5mm校准件 87308 3.5NMD/3.5mm-KJ测试电缆 87308A 3.5NMD/3 5mm-KK测试电缆 FBOHAOHB025.0 3.5mm戈尔测试电缆 FBOHAOHC025.0 3.5mm戈尔测试电缆两端口英文选件四端口选件四端口英文选件铝合金运输箱

PAR指数在拔除第一恒磨牙后正畸治疗疗效评估中的作用

PAR指数在拔除第一恒磨牙后正畸治疗疗效评估中的作用程涛【摘要】目的探讨应用PAR指数(peer assessment rating)评估成人拔除第一恒磨牙后正畸治疗疗效的临床应用价值.方法纳入武汉科技大学附属汉阳医院40例拔除第一恒磨牙正畸治疗的患者进行回顾性分析,男性16例,女性24例.年龄在24～36岁,拔除1～4颗龋坏第一恒磨牙后正畸.其中拔除1颗的有10例患者,拔除2颗的有15例患者,拔除3颗的有12例患者,拔除4颗的有3例患者,均按照PAR指数进行治疗前后模型的测量、评估、分析,以判断正畸治疗效果.结果 40例患者中PAR正畸前评分为(29.86 ±7.56)分,正畸后评分为(2.63±0.96)分,正畸前后评分比较差异有统计学意义(P＜0.05);PAR各项指标包括颊侧殆关系、牙齿排列、覆盖、覆颌及中线等在正畸前后比较差异有统计学意义(P＜0.05);治疗后改善的患者有16例(40％),极大改善的患者有24例(60％).结论 PAR指数对正畸治疗是一项客观的评价标准,通过拔除第一恒磨牙后正畸可取得较为满意的临床疗效,该指标在诊疗中有着很高的应用价值.【期刊名称】《安徽医药》【年(卷),期】2018(022)007【总页数】4页(P1289-1292)【关键词】磨牙;牙齿矫正治疗需求指数;正畸学,矫正;正畸矫正器;治疗结果【作者】程涛【作者单位】武汉科技大学附属汉阳医院口腔科,湖北武汉430050【正文语种】中文随着国民经济水平及生活水平的提高，口腔正畸治疗在一定程度上可以让患者面貌变得美观，这逐渐成为当今医学研究的一个热点[1-2]。

第一恒磨牙是口腔中最早萌出的恒牙，承担着重要的咀嚼功能，也是重要的支抗牙。

一般情况下多不考虑拔除第一恒磨牙的方法进行正畸治疗，若遇到解剖学形态异常、钙化不足等问题时，应当考虑拔除，且对于龋齿的患者也应当拔除[3]。

如何客观评价矫正效果成为近年来牙齿矫形关注的重点问题。

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