2ALP3LB-012中文资料
REF3212中文资料
proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could400ms/divSTEP RESPONSEC L=0pF,5V STARTUP V IN040020060080010001200Time(Hours)THEORY OF OPERATIONThe REF32xx is a family of CMOS, precision bandgap voltage references. Figure 1 shows the basic bandgapare biased so that theis greater than that of Q2. The difference of the two base-emitter voltages (Vbe1– Vbe2) has a positive temperature coefficient and is forced across . This voltage is amplified and added to the, which has a negative temperature coefficient. The resulting output voltage is APPLICATION INFORMATION The REF32xx does not require a load capacitor and is stable with any capacitive load. Figure 2 shows typical connections required for operation of the REF32xx. A supply bypass capacitor of 0.470.47µFPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)REF3212AIDBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3212AIDBVT ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3220AIDBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3220AIDBVT ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3225AIDBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3225AIDBVT ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3230AIDBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3230AIDBVT ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3233AIDBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3233AIDBVT ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3240AIDBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR REF3240AIDBVTACTIVESOT-23DBV6250Green (RoHS &no Sb/Br)CU NIPDAULevel-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not inproduction.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM8-Jul-2005Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
MX23A34SF1;MX23A26SF1;MX23A36SF1;MX23A18SF1;MX23A12SF1;中文规格书,Datasheet资料
•Insulation resistance: 100M ohm min. •Life time: 50 times •Applicable wire : Position of using wire is specified. Cable type Conductive area A.W.G No. Sheath diameter AVSS, AVS(partially) 0.3 to 1.25mm2 #22 to #16 1.6dia. to 2.2dia. mm
Part Number MX23A12SF1 MX23A12XF1 MX23A12NF1 MX23A18SF1 MX23A18XF1 MX23A18NF1 MX23A18NF2 MX23A26SF1 MX23A26XF1 MX23A26NF1 MX23A26NF2 MX23A34SF1 MX23A34XF1 MX23A34NF1 MX23A34NF2 M23S05K351 M120-55780
■Socket Contact Materials/Finishes Copper alloy/Sn plating
Rear cover Grommet Socket housing
Seal ring Front cap
Pin insulator
Pin contact
Crimp tool
Hand crimping tool CT160-3B-MX23 Semi automatic applicator 350-MX23-2 Contact release jig ET-MX23
mx23a34sf1;mx23a26sf1;mx23a36sf1;mx23a18sf1;mx23a12sf1;中文规格书,datasheet资料 componentsproduct information connector new 1/7 mb-0094-2 june 2006 jae pmk div. proprietary. copyright 2006,japanaviation electronics industry, ltd. features general specifications mx23a series compact type low-profiled waterproof connector contacts:12 ,18, 26, 34 pos. (pin side 2types: reverse standard**excluding 12 pos.) contact resistance: 10m ohm max.?dielectric withstanding voltage: ac 1000 vr.m.s minute)?operating temperature: -40 to+125 deg. (includingtemperature rise caused powerdistribution)?current rating: 3a?insulation resistance: 100m ohm min.?life time: 50 times?applicable wire usingwire specified.low profiled type boardmounting height socketconnector height 22.2mmmax. double fin structure highreliability socketcontact largechamfer front-edgeside preventgrommet from damaging. incomplete insertion socketcontact itshousing can frontcap mounting process. full water poof grommet socketcontact crimping area reducesize. water pro
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Password Recovery 1.33－－注册码：PDFP-99322-EYSVY-886Advanced Archive Password Recovery 1.01－－NAME:Juan Lozada SERIAL:ARCHPR-TBHW5SSMYGQS-CUQ9SNYDE59T4KMMAdvanced ZIP Password Recovery v3.11－－sn: 00003112193920061941Nqu5h797f6cAjz4UAltoMP3 Maker 2.2--Name:Free User SN:1LfDE2UKh1F5i9fCAlgolab_photo_vector_v1.01－－Name:stcsr Companv: Email:stcsr@ Serial:ALPVHFCHINCTMGOPQRSAqua 3D Screen Saver 1.5 汉化破解版－－name:任意Code:1234-6789-1234-67C2(程序运行时按空格键即可输入注册码)AutoCAD 2002 最终零售版－－Serial:400-12345678 CD-KEY:T4ED6P 找E8B2FEFFFF 85C0 744F 8D4DF0 改为E8B2FEFFFF 85C0 754F 8D4DF0 就可以用了Audio Converter 3.0(0402)特别版－－Use Name:chaoruan Company:china Licenses:1 Serial key:08199-04923680536126119550AudioCD MP3 Studio 2000 V2.3－－SN:CSN77B-174094802faB TOP冰雨音画（音画时尚）ICE Player 2.6－－注册码:PL68A-yhss-style-98566-55860 6615-FCJX-LDgs-155868-ice260a北信源杀毒专家VRV2001 正式零售版－－序列号:FJDLKICPEAEBlindWrite v0.99.1.4－－sn:GOLXB3GJE4S46LFJBlindRead 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Code: CXM-AYY ABBXDSPG 或者用户名：我爱蔡兔子密码：CX-BBBAWBETUVB超级兔子注册表优化v4.12增强版－－Name:Only For Chinese Code:AFABXBCVWXB或者Name:conanxu[BCG] Code:conanxu[BCG]超级兔子魔法设置v3.88简体中文版完美注册－－Name: Sun Bird [CCG] Sn: CX-AYY ABBPDOLG超级兔子魔法设置v3.88中文版－－Name:swnetcn17 Code:SPQHQRSWOXW或者Name:Only For Chinese Code:AFABXBCVWXB或者NameurewomCode:2Y2PMEFG3或者Name:Al Gore Code:1W1IFHIJ8或者Name:Bauer Lindemann Code:3U5YVLMN6或者Name:蔡旋Code:ABASGBCXMCB超级兔子魔法设置v3.86中文版－－Name:Only For Chinese Code:AFABXBCVWXB 或者Nameurewom Code:2Y2PMEFG3或者Name:Al Gore Code:1W1IFHIJ8或者Name:Bauer Lindemann Code:3U5YVLMN6超级兔子魔法设置V3.85多语言版－－注册码：NAME：swnetcn17 CODE：SPQHQRSWOXW（适用于简体中文版的超级兔子魔法设置），注册表优化可以用conanxuBCG的注册码：AFABXBCVWXB，注册名任意。
MF-RX012中文资料
MF-RX/250 Series - Telecom PTC Resettable Fuses
Electrical Characteristics
Model
Max. Operating
Voltage
(Vdc)
Max. Interrupt Ratings
Volts (Vrms)
Amps (A)
Max.
Min.
Max.
4.0
8.0
7.0
9.0
5.5
7.5
6.0
10.5
6.0
9.0
8.0
10.5
7.0
12.0
6.0
10.0
3.0
6.0
3.0
5.5
4.5
6.0
5.4
7.5
3.5
6.5
0.8
2.0
0.8
2.2
0.8
2.0
One Hour Post-Trip Resistance
Ohms at
23 °C
Max.
+125 °C to -55 °C,10 times
±15 % typical resistance change
Solvent Resistance -STD-202, Method 215B............................................No change
Model MF-RX012/250 MF-RX012/250U MF-RX014/250 MF-RX014/250U MF-RX018/250 MF-RX018/250U MF-RX018/250F
A Max. 6.5 (0.256) 6.0 (0.236) 6.5 (0.256) 6.0 (0.236) 11.0 (0.433) 10.4 (0.409) 9.0 (0.354)
共晶相变资料重点
硅铝合金
发动机 的活塞
上一代活塞材料：
共晶
共晶硅铝合金（α+Si）
无法满足新的要求
过 共晶
初晶Si+共晶（α+Si）
优：硅作为硬质相含量提高，
增加总体的机械性能。
缺：初晶硅为粗大板状晶块，
严重割裂基体，降低力学性能。
优化
优化处理后的硅铝合金
硅铝合金
优化 处理
熔铸出细小均匀、 形状圆钝的晶粒 达到改善总体机械性能的目的
能形成成分固定的相。
二元共晶相图(Eutectic phase diagrams)的两种基本形式
LE TE C ＋D
L
α
β
1 根据相律，三相共存时系统的自由度为 0。 2 共晶反应是在是恒温转变(Isothermal transform) 3 三相平衡共存时，每一相的成分都是固定的。
共晶反应(Eutectic reaction)
导电胶粘接： 电阻大，导热差，寿命低。 影响芯片的功率输出、稳定性和寿命
金属焊接：Au 电阻小，传热效率高 散热均匀，焊接强度高
共晶焊接
共晶焊接
熔点
纯金：1063℃ 纯硅：1414 ℃ Au-Si共晶点 ：363℃
加硅
1)降低熔点温度
2)硅的导电导热性良好， 对总体性能的影响小
低共 晶点
1)保护器件和基片不受损坏 2)减小冷却后的残余应力 3)降低设备要求，减少成本
TPb 纯Pb的熔点(327.5 ˚C)
TSn 纯Sn的熔点(231.9 ˚C)
点
E 共晶点(61.9%Sn, 183˚C)
C Sn在Pb中的最大溶解度(19.2%Sn, 183˚C)
D Pb在Sn中的最大溶解度(2.5%Pb, 183˚C)
MP24833真正中文版
描述MP24833 是 55V，3A白光 LED 驱动器适用于降压，反相升/降压和升压应用。
它具有 3A输出电流在较宽的输入电压范围内具有优异的负载和线性调整。
电流模式能提供快速的瞬态响应和环路稳定性设计。
故障保护包括热关断，逐周期峰值电流限制，开弦保护和输出短路保护。
MP24833 采用模拟和PWM调光复用一个控制引脚。
单独的输入参考接地引脚可以直接使能芯片或者调光控制为正的负功率转换。
MP24833需要最少的标准外部元件和采用SOIC8E 封装。
特点•3A 最大输出电流•独特的升降压操作 (降压-升压模式)•宽输入电压范围：4.5V~55V（降压模式）•0.19Ω 内部功率MOSFET开关•开关频率：200KHz•模拟和PWM调光•0.198V 参考电压•6μA 关断模式•无LED最小数量•稳定低ESR陶瓷输出电容器•逐周期过流保护•热关断保护•开弦保护•输出短路保护•封装： SOIC8E应用•常规 LED 照明•LCD背光板•笔记本电脑•汽车内部照明•便携式多媒体播放器•便携式 GPS 设备For MPS green status, please visit MPS website under Quality Assurance.“MPS” and “The Future of Analog IC Technology” are Registered Trademarks of Monolithic Power Systems, Inc.MP24833A, 55V3白光LED驱动器The Future of Analog IC Technology绝对最大额定值 (1)供应电压 V DD - V SS .............................................. 60V V SW - V SS ......................................-0.3V to V IN + 0.3V V BST .............................................................V SW + 6V V EN/Dim - V INGND ..........................................-0.3Vto+6V V INGND - V SS ............................................-0.3V to 60V 其他引脚 - V SS ….....................................-0.3V to +6V 连续功率耗散(T A= +25°C) (2)SOIC8E..............................................................2.5W 结温……………………....................................150°C 铅温度………………….....................................260°C 贮存温度……………..................-65°C to +150°C推荐的操作条件 (3)供应电压 V DD - V SS ..................................4.5V to 55VJ C热阻 (4) θJA θJCSOIC-8 EP ..............................50 ......10...°C/W备注:1) 超过绝对最大额定值可能会损坏芯片.2) 最大允许功率耗散是一个函数的最大结温T J (MAX), 结到环境热阻 θJA , 和 环境温度 T A . 在任何环境温度的最大允许连续功率耗散计算由P D (MAX) = (T J (MAX)-T A )/θJA . 超过最大允许功耗 会导致过高的模具温度, 同时芯片将进入热关断.对内部热关断电路造成永久性的损坏.3) 芯片不能保证在推荐的工作条件以外的情况下正常工作. 4) 测试是在 JESD51-7, 4-layer PCB.定购信息引脚配置4.5V V IN 55V5) 保证所设计的.典型性能特征性能波形测试在评估板的设计示例部分. V IN = 36V, I LED = 1A, 7个WLEDs 串联, L = 68µH, T A = 25°C, 降压应用,除非另有说明.典型的性能特征(续)性能波形测试在评估板的设计示例部分. V IN = 24V, I LED = 1A, 7个WLEDs 串联, L = 68µH, T A = 25°C, 降压升压应用, 考阅 INGND, 除非另有说明.引脚功能功能方框图图1: 功能框图操作MP24833是一个电流型调节器,误差放大器 (EA) 的输出电压与峰值电感电流成正比。
石油常用名词解释
石油常用名词解释不同的测井仪器有不同的性能和作用，在某种地质条件和钻孔条件下，根据一定的地质或工程目的，采用多种有针对性的测井仪器组合起来进行测井，称为达到这种目的的测井系列。
电阻率测井是在钻孔中采用布置在不同部位的供电电极和测量电极来测定岩石(包括其中的流体)电阻率的方法。
通常所用的三电阻率测井系列是：深侧向、浅侧向和微侧向电阻率测井。
声速测井声速测井是利用不同的岩石和流体对声波传播速度不同的特性进行的一种测井方法。
通过在井中放置发射探头和接收探头，记录声波从发射探头经地层传播到接收探头的时间差值，所以声速测井也叫时差测井。
用时差测井曲线可以求出储集层的孔隙度，相应地辨别岩性，特别是易于识别含气的储集层。
放射性测井放射性测井即是在钻孔中测量放射性的方法，一般有两大类：中子测井与自然伽马测井。
中子测井是用中子源向地层中发射连续的快中子流，这些中子与地层中的原子核碰撞而损失一部分能量，用深测器(计数器)测定这些能量用以计算地层的孔隙度并辨别其中流体性质。
自然伽马测井是测量地层和流体中不稳定元素的自然放射性发出的伽马射线，用以判断岩石性质，特别是泥质和粘土岩。
井温测井井温测井又称热测井，它可以进行地温梯度的测量；可以在产液井中寻找产液的井段，在注入井中寻找注入的井段；对热力采油井，可以通过邻井的井温测量检查注蒸汽的效果；可以评价压裂酸化施工的效果等。
地层倾角测井地层倾角测井是在钻孔中测量地层倾斜方向和倾斜角度的方法。
根据测得的数据，可以研究地质构造与沉积环境，从而追踪地下油气的分布情况。
井径测井仪是用来测量钻孔直径的。
在未下套管的井中可以测量井径不规则程度，提供下套管固井施工所需要的水泥用量参数；还可根据钻孔的不规则形态，分析判断地下岩层裂缝的发育程度和裂缝的方向。
在套管受损坏的井中，可以测量套管损坏的位置和变形情况。
自然伽马射能谱测井自然伽马能谱测井是测量地层中放射性元素铀、钍和钾40的伽马射线强度谱，从而确定它们在地层中的含量，用于分析岩石及流体性质。
AV16823DL资料
74ALVT1682318-bit bus-interface D-type flip-flop with reset and enable;3-stateRev. 04 — 2 August 2005Product data sheet1.General descriptionThe 74ALVT16823 18-bit bus interface register is designed to eliminate the extrapackages required to buffer existing registers and provide extra data width for widerdata/address paths of buses carrying parity.The 74ALVT16823 has two 9-bit wide buffered registers with clock enable (pin nCE) andmaster reset(pin nMR)which are ideal for parity bus interfacing in high microprogrammedsystems.The registers are fully edge-triggered. The state of each D input, one set-up time beforethe LOW-to-HIGH clock transition is transferred to the corresponding Q output of theflip-flop.It is designed for V CC operation from 2.5 V to 3.0 V with I/O compatibility to 5 V.2.Featuress Two sets of high speed parallel registers with positive edge-triggered D-type flip-flopss 5 V I/O compatibles Ideal where high speed, light loading, or increased fan-in are required with MOSmicroprocessorss Bus hold data inputs eliminate the need for external pull-up resistors to hold unusedinputss Live insertion and extraction permitteds Power-up 3-states Power-up resets No bus current loading when output is tied to 5 V buss Output capability: +64 mA to−32 mAs Latch-up protection:x JESD78: exceeds 500 mAs ESD protection:x MIL STD 883, method 3015: exceeds 2000 Vx Machine Model: exceeds 200 V3.Quick reference data4.Ordering informationTable 1:Quick reference data T amb = 25°C.Symbol Parameter ConditionsMin Typ Max Unit t PLH propagation delay nCP to nQx C L = 50 pF; V CC =2.5V 1.5 2.9 4.5ns C L = 50 pF; V CC =3.3V 1.0 2.3 3.1ns t PHL propagation delay nCP to nQx C L = 50 pF; V CC =2.5V 1.4 2.7 4.2ns C L = 50 pF; V CC =3.3V 1.0 2.1 2.9ns C i input capacitance V I = 0 V or V CC -3-pF C o output capacitance V I/O = 0 V or V CC -9-pF I CCquiescent supply currentoutputs disabled;V CC =2.5V -40-µA outputs disabled;V CC =3.3V-70-µATable 2:Ordering informationType numberPackagetemperature range NameDescriptionVersion 74ALVT16823DL −40°C to +85°C SSOP56plastic shrink small outline package; 56leads;body width 7.5mmSOT371-174ALVT16823DGG−40°C to +85°CTSSOP56plastic thin shrink small outline package;56leads;body width 6.1mmSOT364-15.Functional diagramFig 1.IEC logic symbolFig 2.Bushold circuit (one data input)4D1,2543525516498489471045128D5,644134314421541164017381937203621342333243126001aad24255G328R65627EN530G72EN1R23C41291D01D11D21D31D41D51D61D71D82D02D12D22D32D42D52D62D72D81Q01Q11Q21Q31Q41Q51Q61Q71Q82Q02Q12Q22Q32Q42Q52Q62Q72Q81CE 2MR 1CP 2OE 2CE 1OE 1MR 2CP 7C8001aad245data input to internal circuitV CCxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx74ALVT16823_4© Koninklijke Philips Electronics N.V . 2005. All rights reserved.Product data sheet Rev. 04 — 2 August 20054 of 20Philips Semiconductors74ALVT1682318-bit bus-interface D-type flip-flop with reset and enable; 3-stateFig 3.Logic diagram001aad243nQ8nD8nQ3nD3nQ2nD2nQ1nD1nQ0nD0nD QnCPRnD QRnD QRnD QRnD QRnOEnMR CP CP CP CP CP nCEnQ4nD4nD QRCP nQ5nD5nD QRCP nQ6nD6nD QRCP nQ7nD7nD QRCP6.Pinning information6.1Pinning6.2Pin descriptionFig 4.Pin configuration74ALVT168231MR 1CP 1OE 1CE 1Q01D0GND GND 1Q11D11Q21D2V CC V CC 1Q31D31Q41D41Q51D5GND GND 1Q61D61Q71D71Q81D82Q02D02Q12D12Q22D2GND GND 2Q32D32Q42D42Q52D5V CC V CC 2Q62D62Q72D7GND GND 2Q82D82OE 2CE 2MR 2CP001aad4031234567891011121314151617181920212223242526272856555453525150494847464544434241403938373635343332313029Table 3:Pin descriptionSymbol Pin Description1MR 1 1 master reset input (active-LOW)1OE 2 1 output enable input (active-LOW)1Q03 1 data output 0GND 4ground (0 V)1Q15 1 data output 11Q26 1 data output 2V CC 7supply voltage 1Q381 data output 3Table 3:Pin description …continuedSymbol Pin Description1Q49 1 data output 41Q510 1 data output 5GND11ground (0 V)1Q612 1 data output 61Q713 1 data output 71Q814 1 data output 82Q015 2 data output 02Q116 2 data output 12Q217 2 data output 2GND18ground (0 V)2Q319 2 data output 32Q420 2 data output 42Q521 2 data output 5V CC22supply voltage2Q623 2 data output 62Q724 2 data output 7GND25ground (0 V)2Q826 2 data output 82OE27 2 output enable input (active-LOW)2MR28 2 master reset input (active-LOW)2CP29 2 clock pulse input (active rising edge) 2CE30 2 clock enable input (active-LOW)2D831 2 data input 8GND32ground (0 V)2D733 2 data input 72D634 2 data input 6V CC35supply voltage2D536 2 data input 52D437 2 data input 42D338 2 data input 3GND39ground (0 V)2D240 2 data input 22D141 2 data input 12D042 2 data input 01D843 1 data input 81D744 1 data input 71D645 1 data input 6GND46ground (0 V)1D547 1 data input 51D448 1 data input 41D349 1 data input 37.Functional description7.1Function table[1]H = HIGH voltage level;h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition;L = LOW voltage level;l = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition;NC = no change;X = don’t care;Z = high-impedance OFF-state;↑ = LOW-to-HIGH clock transition;↑ = not a LOW-to-HIGH clock transition.8.Limiting valuesV CC 50supply voltage 1D251 1 data input 21D152 1 data input 1GND 53ground (0 V)1D054 1 data input 01CE 55 1 clock enable input (active-LOW)1CP561 clock pulse input (active rising edge)Table 3:Pin description …continuedSymbol Pin Description Table 4:Function tableOperating mode Input OutputnOEnMR nCE nCP nDx nQx clearL L X X X L load and read data L H L ↑h H l L holdL H H ↑X NC high-impedanceHXXXXZTable 5:Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit V CC supply voltage −0.5+4.6V V I input voltage [1]−0.5+7.0V V O output voltage output in OFF-state or HIGH-state [1]−0.5+7.0V I IK input diode current V I < 0 V −50-mA I OKoutput diode currentV O < 0 V−50-mA[1]The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.[2]The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability.9.Recommended operating conditionsI O output current output in LOW-state -128mA output in HIGH-state−64-mA T stg storage temperature −65+150°C T jjunction temperature[2]-150°CTable 5:Limiting values …continuedIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit Table 6:Recommended operating conditionsSymbol Parameter ConditionsMin Typ Max Unit V CC =2.5 V V CC supply voltage 2.3- 2.7V V I input voltage0- 5.5V V IH HIGH-level input voltage 1.7--V V IL LOW-level input voltage --0.7V I OH HIGH-level output current --−8mA I OLLOW-level output currentnone--8mA current duty cycle ≤50%;f ≥ 1 kHz--24mA ∆t/∆v input transition rise or fall rateoutputs enabled --10ns/V T amb ambient temperature in free air−40-+85°C V CC =3.3 VV CC supply voltage 3.0- 3.6V V I input voltage0- 5.5V V IH HIGH-level input voltage 2.0--V V IL LOW-level input voltage --0.8V I OH HIGH-level output current --−32mA I OLLOW-level output currentnone--32mA current duty cycle ≤50%;f ≥ 1 kHz--64mA ∆t/∆v input transition rise or fall rateoutputs enabled --10ns/V T ambambient temperaturein free air −40-+85°C10.Static characteristicsTable 7:Static characteristicsAt recommended operating conditions; voltages are referenced to GND (ground=0V); T amb =−40°C to +85°C. Symbol Parameter Conditions Min Typ Max Unit V CC = 2.5 V± 0.2 V[1]V IK input clamping voltage V CC = 2.3V; I IK=−18mA-−0.85−1.2VV OH HIGH-level output voltage V CC = 2.3 V to 2.7 V; I OH=−100µA V CC− 0.2V CC-VV CC = 2.3 V; I OH=−8mA 1.8 2.5-VV OL LOW-level output voltage V CC = 2.3V; I OL=100µA-0.070.2VV CC = 2.3V; I OL=24 mA-0.30.5VV CC = 2.3V; I OL=8 mA--0.4VV OL(pu)power-up LOW-level outputvoltage V CC = 2.7 V; I O = 1 mA;V I=V CC or GND[2]--0.55VI LI input leakage currentcontrol pins V CC=2.7V; V I = V CC or GND-0.1±1µAV CC = 0 V to 2.7 V; V I=5.5V-0.110µA I/O data pins V CC =2.7V; V I= V CC[3]-0.11µAV CC =2.7V; V I= 0V[3]-+0.1−5µA I OFF off current V CC = 0V; V I or V O=0V to 4.5V-+0.1±100µA I HOLD bus hold current data inputs V CC = 2.3V; V I = 0.7V[4]-100-µAV CC = 2.3V; V I = 1.7V[4]-−70-µA I EX external current into output output HIGH-state when V O>V CC;V O=5.5V; V CC=2.3 V-10125µAI PU power-up 3-state outputcurrent V CC≤ 1.2V; V O=0.5V to V CC;V I=GND or V CC[5]-1±100µAI PD power-down 3-state outputcurrent V CC≤ 1.2V; V O=0.5V to V CC;V I=GND or V CC[5]-1±100µAI OZ3-state output current V CC = 2.7 V; V I = V IL or V IHoutput HIGH state; V O = 2.3 V-0.55µAoutput LOW-state; V O = 0.5 V-+0.5−5µA I CC quiescent supply current V CC = 2.7 V; V I = GND or V CC; I O = 0Aoutputs HIGH-state-0.040.1mAoutputs LOW-state- 2.7 4.5mAoutputs disabled[6]-0.040.1mA∆I CC additional quiescent supplycurrent per input pin V CC = 2.3 V to 2.7 V; one input atV CC−0.6V, other inputs at V CC or GND[7]-0.040.4mAC I input capacitance V I = 0 V or V CC-3-pF C O output capacitance V I/O = 0 V or 3.0V-9-pF V CC = 3.3 V± 0.3 V[8]V IK input clamping voltage V CC = 3.0V; I IK=−18mA-−0.85−1.2V V OH HIGH-level output voltage V CC = 3.0 V to 3.6 V; I OH=−100µA V CC− 0.2V CC-VV CC = 3.0 V; I OH=−32mA 2.0 2.3-V[1]All typical values are at V CC = 2.5V and T amb = 25°C.[2]For valid test results, data must not be loaded into the flip-flops (or latches) after applying power.[3]Unused pins at V CC or GND.[4]Not guaranteed.[5]This parameter is valid for any V CC between 0V and 1.2V with a transition time of up to 10ms.From V CC =1.2V to V CC =2.5V ±0.2V a transition time of 100µs is permitted. This parameter is valid for T amb =25°C only.[6]I CC is measured with outputs pulled up to V CC or pulled down to ground.[7]This is the increase in supply current for each input at the specified voltage level other than V CC or GND.[8]All typical values are at V CC = 3.3V and T amb = 25°C.[9]This is the bus hold overdrive current required to force the input to the opposite logic state.V OLLOW-level output voltageV CC = 3.0V; I OL =100µA -0.070.2V V CC = 3.0V; I OL =16 mA -0.250.4V V CC = 3.0V; I OL =32 mA -0.30.5V V CC = 3.0V; I OL =64 mA-0.40.55V V OL(pu)power-up LOW-level output voltageV CC = 3.6 V; I O = 1 mA;V I =V CC or GND[2]--0.55VI LIinput leakage current control pins V CC =3.6V; V I = V CC or GND -0.1±1µA V CC = 0 V or 3.6 V; V I =5.5V -0.110µA I/O data pinsV CC = 3.6 V; V I =V CC [3]-0.51µA V CC =3.6V; V I = 0 V[3]-+0.1−5µA I OFF off currentV CC = 0V; V I or V O =0V to 4.5V -0.1±100µA I HOLDbus hold current data inputsV CC = 3V; V I = 0.8V 75130-µA V CC = 3V; V I = 2.0V −75−140-µA V CC = 3.6 V; V I = 0V to 3.6 V[9]±500--µA I EX external current into output output HIGH-state when V O >V CC ;V O =5.5V; V CC =3.0 V -10125µA I PU power-up 3-state output currentV CC ≤ 1.2V; V O =0.5V to V CC ;V I =GND or V CC[10]-1±100µA I PD power-down 3-state output currentV CC ≤ 1.2V; V O =0.5V to V CC ;V I =GND or V CC[10]-1±100µAI OZ3-state output currentV CC = 3.6 V; V I = V IL or V IH output HIGH state; V O = 3.0 V -0.55µA output LOW-state; V O = 0.5 V-+0.5−5µA I CCquiescent supply currentV CC = 3.6 V; V I = GND or V CC ; I O = 0A outputs HIGH-state -0.060.1mA outputs LOW-state - 3.9 5.5mA outputs disabled[6]-0.060.1mA ∆I CC additional quiescent supply current per input pin V CC = 3 V to 3.6 V; one input atV CC −0.6V , other inputs at V CC or GND [7]-0.040.4mA C I input capacitance V I = 0 V or V CC -3-pF C Ooutput capacitanceV I/O = 0 V or 3.0V-9-pFTable 7:Static characteristics …continuedAt recommended operating conditions; voltages are referenced to GND (ground =0V); T amb =−40°C to +85°C.Symbol Parameter ConditionsMin Typ Max Unit[10]This parameter is valid for any V CC between0V and1.2V with a transition time of up to10ms.From V CC=1.2V to V CC=3.3V±0.3Va transition time of 100µs is permitted. This parameter is valid for T amb=25°C only.11.Dynamic characteristicsTable 8:Dynamic characteristicsVoltages are referenced to GND (ground=0V); for test circuit see Figure10;T amb=−40°C to+85°C.Symbol Parameter Conditions Min Typ Max UnitV CC = 2.5 V± 0.2 V[1]f max maximum clock frequency see Figure5150--MHzt PLH propagation delay nCP to nQx see Figure5 1.5 2.9 4.5nst PHL HIGH-to-LOW propagation delaynCP to nQx see Figure5 1.4 2.7 4.2nsnMR to nQx see Figure7 1.5 2.7 4.2ns t PZH output enable time to HIGH-level see Figure8 2.1 3.4 5.0nst PZL output enable time to LOW-level see Figure9 1.8 3.0 4.7nst PHZ output disable time from HIGH-level see Figure8 1.7 3.0 4.3nst PLZ output disable time from LOW-level see Figure9 1.4 2.3 3.3nst su(H)set-up time HIGHnDx to nCP see Figure6 1.00.5-nsnCE to nCP see Figure6 1.00.2-ns t su(L)set-up time LOWnDx to nCP see Figure6 1.8 1.3-nsnCE to nCP see Figure6+0.5−0.1-ns t h(H)hold time HIGHnDx to nCP see Figure6+0.1−1.4-nsnCE to nCP see Figure6 1.00.2-ns t h(L)hold time LOWnDx to nCP see Figure6+0.1−0.5-nsnCE to nCP see Figure6+1.0−0.1-ns t WH pulse width HIGH nCP see Figure5 2.00.8-nst WL pulse width LOWnCP see Figure5 3.0 2.1-nsnMR see Figure7 2.00.8-ns t rec recovery time nMR to nCP see Figure7 2.0 1.3-nsV CC = 3.3 V± 0.3 V[2]f max maximum clock frequency see Figure5250--MHzt PLH propagation delay nCP to nQx see Figure5 1.0 2.3 3.1nst PHL HIGH-to-LOW propagation delaynCP to nQx see Figure5 1.0 2.1 2.9nsnMR to nQx see Figure7 1.0 2.3 2.9ns t PZH output enable time to HIGH-level see Figure8 1.7 2.7 4.0nst PZL output enable time to LOW-level see Figure9 1.4 2.3 3.5ns[1]All typical values are measured at V CC = 2.5V and T amb = 25°C.[2]All typical values are measured at V CC = 3.3V and T amb = 25°C.12.Waveformst PHZ output disable time from HIGH-level see Figure 8 2.2 3.1 4.0ns t PLZ output disable time from LOW-level see Figure 9 1.8 2.6 3.5ns t su(H)set-up time HIGH nDx to nCP see Figure 6 1.00.5-ns nCE to nCPsee Figure 6 1.00.1-ns t su(L)set-up time LOW nDx to nCP see Figure 6 1.6 1.1-ns nCE to nCPsee Figure 6+0.5−0.5-ns t h(H)hold time HIGH nDx to nCP see Figure 6+0.1−0.7-ns nCE to nCPsee Figure 6 1.00.5-ns t h(L)hold time LOW nDx to nCP see Figure 6+0.1−0.5-ns nCE to nCPsee Figure 6+1.0−0.1-ns t WH pulse width HIGH nCP see Figure 5 1.50.7-ns t WLpulse width LOW nCP see Figure 5 2.5 1.4-ns nMRsee Figure 7 2.0 1.5-ns t recrecovery time nMR to nCPsee Figure 72.01.1-nsTable 8:Dynamic characteristics …continuedVoltages are referenced to GND (ground =0V); for test circuit see Figure 10;T amb =−40°C to +85°C.Symbol Parameter ConditionsMin Typ Max Unit Measurement points are given in Table 9.V OH is a typical voltage output drop that occur with the output load.Fig 5.Propagation delay, clock input to output, clock pulse width and maximum clockfrequencyV M V MV Mt PLHt PHLt WH t WL1/f maxV Minput nCPoutput nQx0 VV I0 VV OH001aad399Measurement points are given in Table 9.The shaded areas indicate when the input is permitted to change for predictable output performance.Fig 6.Data set-up and hold timesMeasurement points are given in Table 9.V OH is a typical voltage output drop that occur with the output load.Fig 7.Master reset pulse width, master reset to output delay and master reset to clockrecovery timeMeasurement points are given in Table 9.V OH is a typical voltage output drop that occur with the output load.Fig 8.3-state output enable time to HIGH-level and output disable time from HIGH-level001aad401V M input nDx,nCEinput nCPV M V M V MV MV M t su(H)t h(H)t su(L)t h(L)0 V0 VV IV Iinput nMRinput nCPoutput nQxt PHLt WLt RECV M0 VV OH0 V0 VV M V MV M001aad400V IV I001aad402V M V YV Mt PHZt PZHV MV OH0 V0 Vinput nOEoutput nQxV IMeasurement points are given in Table 9.V OL is a typical voltage output drop that occur with the output load.Fig 9.3-state output enable time to LOW-level and output disable time from LOW-level Table 9:Measurement pointsSupply voltageInput Output V MV M V XV Y≥3 V 1.5 V 1.5 V V OL + 0.3V V OH − 0.3 V ≤2.7 V0.5× V CC0.5×V CCV OL + 0.3VV OH − 0.3 V001aad404input nOEV M V MV Xt PLZt PZLoutput nQxV M0 VV OLV IV IMeasurement points are given in Table9.a.Input pulse definitionTest data is given in T able10.Definitions test circuit:R L = Load resistor.C L = Load capacitance including jig and probe capacitance.R T = Termination resistance should be equal to output impedance Z o of the pulse generator.V EXT = Test voltage for switching times.b.T est circuitFig 10.Load circuitry for switching timesTable 10:Test dataInput Load V EXTV I f i t W t r, t f C L R L t PLZ, t PZL t PLH, t PHL t PHZ,t PZH3.0 V or V CC whichever is less ≤ 10 MHz500 ns≤ 2.5 ns50 pF500Ω 6 V or2× V CCopen GND001aac221V M V Mt Wt W10 %90 %90 %0 VV IV Inegativepulsepositivepulse0 VV M V M90 %10 %10 %t THL(t f)t TLH(t r)t TLH(t r)t THL(t f)V EXTV CCV I V Omna616DUTC LR TR LR LPULSEGENERATOR13.Package outlineFig 11.Package outline SOT371-1 (SSOP56)UNIT A 1A 2A 3b p c D (1)E (1)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.40.22.352.200.250.30.20.220.1318.5518.307.67.40.63510.410.11.00.61.21.00.850.4080oo 0.180.251.40.1DIMENSIONS (mm are the original dimensions)Note1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.SOT371-199-12-2703-02-18(1)w Mb pD H EE Z ecv M AXAy5629MO-118281θAA 1A 2L pQdetail XL(A )3pin 1 index0510 mmscaleSSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mmSOT371-1Amax.2.8Fig 12.Package outline SOT364-1 (TSSOP56)UNIT A 1A 2A 3b p c D (1)E (2)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.150.0580oo 0.1DIMENSIONS (mm are the original dimensions).Notes1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.SOT364-199-12-2703-02-19w MθAA 1A 2D L p Qdetail XE ZecLX(A )30.251285629ypin 1 indexb H 1.050.850.280.170.20.114.113.96.26.00.518.37.90.500.350.50.10.080.250.80.4pEv M AATSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1Amax.1.20 2.5 5 mmscaleMO-15314.Revision historyTable 11:Revision historyDocument ID Release date Data sheet status Change notice Doc. number Supersedes74ALVT16823_420050802Product data sheet--74ALVT16823_3 Modifications:•The format of this data sheet has been redesigned to comply with the new presentation andinformation standard of Philips Semiconductors.•Section2: modified ‘Jedec Std 17’ into ‘JESD78’•Table8: changed propagation delays.74ALVT16823_319980612Product specification-9397 750 0401674ALVT16823_2 74ALVT16823_219980612Product specification-9397 750 0401674ALVT16823 74ALVT1682319980303----15.Data sheet status[1]Please consult the most recently issued data sheet before initiating or completing a design.[2]The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL .[3]For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.16.DefinitionsShort-form specification —The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device.These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.17.DisclaimersLife support —These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductorscustomers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes —Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’),relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes noresponsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to theseproducts,and makes no representations or warranties that these products are free from patent,copyright,or mask work right infringement,unless otherwise specified.18.TrademarksNotice —All referenced brands, product names, service names and trademarks are the property of their respective owners.19.Contact informationFor additional information, please visit: For sales office addresses, send an email to: sales.addresses@Level Data sheet status [1]Product status [2][3]DefinitionI Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice.IIPreliminary dataQualificationThis data sheet contains data from the preliminary specification.Supplementary data will be published at a later date.Philips Semiconductors reserves the right to change the specification without notice,in order to improve the design and supply the best possible product.III Product data ProductionThis data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design,manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).20.Contents1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Quick reference data. . . . . . . . . . . . . . . . . . . . . 24Ordering information. . . . . . . . . . . . . . . . . . . . . 25Functional diagram . . . . . . . . . . . . . . . . . . . . . . 36Pinning information. . . . . . . . . . . . . . . . . . . . . . 56.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 57Functional description . . . . . . . . . . . . . . . . . . . 77.1Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 78Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 79Recommended operating conditions. . . . . . . . 810Static characteristics. . . . . . . . . . . . . . . . . . . . . 911Dynamic characteristics . . . . . . . . . . . . . . . . . 1112Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1213Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1614Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1815Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 1916Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1917Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1918Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1919Contact information . . . . . . . . . . . . . . . . . . . . 19© Koninklijke Philips Electronics N.V.2005All rights are reserved.Reproduction in whole or in part is prohibited without the priorwritten consent of the copyright owner.The information presented in this document doesnot form part of any quotation or contract,is believed to be accurate and reliable and maybe changed without notice.No liability will be accepted by the publisher for anyconsequence of its use.Publication thereof does not convey nor imply any license underpatent- or other industrial or intellectual property rights.Date of release: 2 August 2005Document number: 74ALVT16823_4。
建筑常用专业名词中英文对照
tekcarb 腿牛 noititrap thgiew-thgil 断隔质轻 lenap etisopmoc 板合复 lenap gniddalc 板墙外 etalp leets elgnis detagurroc 板单型压 draob hciwdnas 板心夹合复 tnioj cimsies 缝震抗 tnioj tnemelttes 缝降沉 tnioj noisnapxe 缝缩伸 ynoclab 台阳 edahsnus 板阳遮 )C.P.D( esruoc foorp-pmad 层潮防 llaw dezalg 断隔璃玻 htrig ,trig ,drig 梁圈 gnipoc 顶压 llaw ytivac 墙心空 wodniw neewteb llaw 墙间窗 llaw erif 墙火防 llaw rellif 墙充填 llaw )roiretni( lanretni 墙内 llaw )roiretxe( lanretxe 墙外 llaw esrevsnart 墙横
liar pot 头冒上 letnil rood 梁过门 llis rood 槛门 rood neercs 门纱 rood ycnegreme 门散疏 rood elbuod 门扇双 rood elgnis 门扇单 gninepo larutcurts 洞开构结 gninepo rood 洞门 fael rood 扇门 emarf rood 框门 tekciw 门小)的上门大( rood erif 门火防 rood hsem eriw leets dezinavlag 门网丝铁锌镀 rood gnitalusni lamreht 门温保 rood thgiT-ria 门闭密 rood dezalg 门璃玻 rood gnivlover 门转旋 rood gnidlof 门叠折 rood gnuh-edis 门开平 rood gnidils 门拉推 rood gniws 门簧弹
B-2203中文资料
FIGURE 2.CIRCUIT FOR COMMON-MODE REJECTIONFIGURE 3.CIRCUIT FOR WAVEFORM INTEGRITYNote:Input to be applied and output to be measured for all dash numbers as shown.N represents highest turns winding in each -STD-1553 TRANSFORMERS© 1996, 1999Data Device CorporationFEATURES•Complete Line of Custom andQPL Units•For Use with MIL-STD-1553Aand B,MacAir A-5690,A-5232,and A-4905•Low Profile•Epoxy Cased,HermeticallySealed•-55°C to +130°C OperatingTemperature Range•Built and Tested to MIL-PRF-21038 and MIL-STD-202Web site:元器件交易网Transceiver T ype 1 (Trapezoidal +5 V/-15 V) BU-61580X1BU-65170X1BUS-61559BUS-61553BUS-65153BUS-65142BUS-63105/25IITransceiver T ype 2 (Trapezoidal +5 V/-12 V) BU-61580X2BU-65170X2BUS-61560BUS-61554BUS-65154BUS-65143BUS-63107/27IITransceiver T ype 3 (Monolithic T rapezoidal +5 V) BU-61580X3BU-65170X3BU-61580X6BU-65170X6Transceiver T ype 3A (Discrete T rapezoidal +5 V) BUS-61561BUS-61555BUS-63147/48Transceiver T ype 5 (Sinusoidal McAir)BU-61590X5BUS-65149BUS-63102Consult Factory For:MIL-PRF-21038 QPL Part Numbers Special MarkingSpecial T estingSpecial PackagingSource InspectionNotes:1.Numbers in parenthesis ( ) reference MIL-PRF-21038 dash numbers.2.For configuration “A”only.See individual specifications for actual values.3.Design parameter only.Not screened in production.ORDER BY BETA PART NUMBER FROM ADDRESS AT THE TOP OF THE PAGE元器件交易网The information in this data sheet is believed to be accurate;however, no responsibility isassumed by Beta T ransformer Technology Corporation for its use, and no licenseor rights are granted by implication or otherwise in connection therewith.Specifications are subject to change without notice.A Subsidiary of Data Device Corporation40 Orville Drive, Bohemia, NY 11716-2529Phone:(631) 244-7393;Fax:(631) 244-8893Web site:J-04/01-500PRINTED IN THE U.S.A.。
FOXBORO I A Series HARDWARE产品规格说明书
FOXBORO ®The FBM214 HART ® Communication Input Interface Module provides eight input channels, each accepting a 4 to 20mA analog signal or a digital HART signal superimposed on a 4 to 20 mA analog input signal.FEATURESKey features of the FBM214 module are:Eight analog input channels, each accepting oneof the following inputs:•Standard 4 to 20 mA analog sensor signal •Digital HART Frequency Shift Keying (FSK) signal superimposed on a 4 to 20 mA analog input signal.FSK modem dedicated to each input channel forbi-directional digital communications with a HART field deviceAnalog to digital conversion of each of the 4to20mA input signals from the HART devicesSupport for the HART universal commandsnecessary to interface the field device with the I/A Series ® system databaseGalvanic isolation of the group of 8 inputchannels from ground and module logicCompact, rugged design suitable for enclosure inClass G3 (harsh) environmentsHigh accuracy achieved by sigma-delta dataconversions for each channelTermination Assemblies (TAs) for locally orremotely connecting field wiring to the FBM214Termination Assemblies for per channel internallyand/or externally loop powered transmitters.PSS 21H-2Z14 B4 Page 2OVERVIEWThe FBM214 HART Communication Input Interface Module contains eight 4to20mA group isolated analog input channels. The FBM214 supports any mix of standard 4to20mA devices and HART devices.The FBM214 serves as a HART communications field device host, enabling the I/A Series system to request and receive two digital messages per second from the field device. The message pass-through capability can be used to support HART universal, common practice, and device-specific commands, but not the burst communication mode. These commands are implemented using the Intelligent Field Device Configurator (IFDC — refer toPSS 21S-8A3 B3 for details).The FBM214 provides a common isolated power supply to power all eight channels. Optionally, the channels can be powered by an external power supply. However, when a common external power supply is used with two or more channels, a Cable Balun module is required to prevent channel cross talk.COMPACT DESIGNThe FBM214 has a compact design, with a rugged extruded aluminum exterior for physical protection of the circuits. Enclosures specially designed for mounting the FBMs provide various levels of environmental protection, up to harsh environments per ISA Standard S71.04.HIGH ACCURACYFor high accuracy, the module incorporates a Sigma-Delta converter which can provide new analog input values for each channel every 100 milliseconds.VISUAL INDICATORSLight-emitting diodes (LEDs) incorporated into the front of the module provide visual indication of the module’s operational status, and communication activity on the channels.EASY REMOVAL/REPLACEMENTThe module can be removed/replaced without removing field device termination cabling, power, or communications cabling.FIELDBUS COMMUNICATIONA Fieldbus Communication Module or a Control Processor interfaces the redundant 2 Mbps module Fieldbus used by the FBMs. The FBM214 module accepts communication from either path (A or B) of the redundant 2 Mbps fieldbus – should one path fail or be switched at the system level, the module continues communication over the active path.The use of an external power supply common to two or more loops requires a Cable Balun Module to maintain communication signal line balance.MODULAR BASEPLATE MOUNTINGThe module mounts on a modular baseplate which accommodates up to four or eight FBMs. The modular baseplate is either DIN rail mounted or rack mounted, and includes signal connectors for redundant fieldbus, redundant independent dc power, and termination cables.TERMINATION ASSEMBLIESField input signals connect to the FBM subsystem via DIN rail mounted TAs. The TAs used with theFBM214 are described in “TERMINATION ASSEMBLIES AND CABLES” on page8.PSS 21H-2Z14 B4Page 3CABLE BALUN MODULEThe Cable Balun module is used to maintain digital communication line balance for HART Transmitter to FBM loops that are powered from a common external power supply. This powering effectively connects one line of each loop together. Without the Baluns, in each loop so powered, the common connection at the external power supply, would cause near end crosstalk at the system end of the loop wiring cable. Loops using FBM internal power source do not require Baluns.The Cable Balun module contains multiple Baluns. One Balun segment is interconnected in each loop powered from an external power supply per the diagram above. There is one Cable Balun module.Figure 1. Cable Balun Module Cable Balun ModuleModule Model ModulePart No.No. of Balunsin the ModuleCBM-4P0903SV4PSS 21H-2Z14 B4Page 4FUNCTIONAL SPECIFICATIONSField Device ChannelsVERSION SUPPORTEDHART Protocol v6INTERFACE8 group-isolated channelsCOMMUNICATION TO THE DEVICEPoint-to-point, master/slave, asynchronous, half-duplex, at 1200 baud.ERROR CHECKINGParity on each byte, and one CRC check byte.SPEED2 messages per secondFASTEST ALLOWED ECB BLOCK PERIOD500 msecMAXIMUM DISTANCE (FBM214 TO FIELDDEVICE)Meets HART FSK physical layer specificationHCF_SPEC-54, Revision 8.1 [up to 3030 m(10000ft)](1).COMPLIANCE VOLTAGE18 V dc minimum at 20.5 mACURRENT INPUTSSense Resistor61.9 Ω nominalTotal Input Resistance280 Ω minimumAccuracy (Includes Nonlinearity)±0.03% of full scaleTemperature Coefficient50 ppm/ºCResolution15 bitsUpdate Rate100 msIntegration Time500 msCommon Mode Rejection>100 db at 50 or 60 HzNormal Mode Rejection>35 db at 50 or 60 HzMAXIMUM LOOP RESISTANCE280 Ω (not including the field device)(2)LOOP POWER SUPPLY PROTECTIONEach channel is galvanically group isolated,current limited and voltage regulated. All inputsare limited by their design to less than 30 mA. Ifthe current limit circuit shorts out, the current islimited to about 85 mA.FBM INPUT IMPEDANCE280 Ω minimumFBM INTERNAL POWER FOR FIELD DEVICE24 V dc ±10% common power supply for allchannels. Loop load limited to one device perchannel.ISOLATIONThe channels are not galvanically isolated fromeach other, but are galvanically isolated (bothoptical and transformer isolation) as a group from ground and module logic. Inputs use an internal FBM isolated power supply for field power. Themodule withstands, without damage, a potential of 600 V ac applied for one minute between the group-isolated channels and earth (ground).CAUTIONThis does not imply that these channels areintended for permanent connection tovoltages of these levels. Exceeding the limitsfor input voltages, as stated elsewhere in thisspecification, violates electrical safety codesand may expose users to electric shock. Fieldbus CommunicationCommunicates with its associated FCM or FCP via the redundant 2 Mbps module FieldbusHEAT DISSIPATION4 W (maximum)(1)The maximum allowable distance decreases when the loop is operated through an intrinsic safety barrier. The maximum distance ofthe field device from the FBM is a function of compliance voltage, wire gauge and voltage drop at the device.(2)In an intrinsic safety application, if a zener barrier is used between the FBM and the field device, the power supply must be set at24V dc +5%, -1%. There are no specific constraints with the use of galvanic barriers.PSS 21H-2Z14 B4Page 5 FUNCTIONAL SPECIFICATIONS (CONTINUED)Power RequirementsINPUT VOLTAGE RANGE (REDUNDANT)24V dc ±5%CONSUMPTION7 W (maximum)Regulatory ComplianceELECTROMAGNETIC COMPATIBILITY (EMC) European EMC Directive 89/336/EECMeets:EN 50081-2 Emission standardEN 50082-2 Immunity standardEN 61326 Annex A (Industrial Levels) CISPR 11, Industrial Scientific and Medical(ISM) Radio-frequency Equipment -Electromagnetic Disturbance Characteristics- Limits and Methods of MeasurementMeets Class A LimitsIEC 61000-4-2 ESD ImmunityContact 4 kV, air 8 kVIEC 61000-4-3 Radiated Field Immunity10 V/m at 80 to 1000 MHzIEC 61000-4-4 Electrical FastTransient/Burst Immunity2 kV on I/O, dc power and communicationlinesIEC 61000-4-5 Surge Immunity2kV on ac and dc power lines; 1kV on I/Oand communications linesIEC 61000-4-6 Immunity to ConductedDisturbances Induced by Radio frequencyFields10 V (rms) at 150 kHz to 80 MHz on I/O,dc power and communication linesIEC 61000-4-8 Power Frequency MagneticField Immunity30 A/m at 50 and 60 HzPRODUCT SAFETY (FBM AND CABLE BALUN) Underwriters Laboratories (UL) for U.S. andCanadaUL/UL-C listed as suitable for use inUL/UL-C listed Class I, Groups A-D;Division 2; temperature code T4 enclosurebased systems. These modules are also ULand UL-C listed as associated apparatus forsupplying non-incendive communicationcircuits for Class I, Groups A-D hazardouslocations when connected to specifiedI/A Series® processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Wherepower is supplied by the FBM,communications circuits also meet therequirements for Class2 as defined inArticle725 of the National Electrical Code(NFPA No.70) and Section 16 of theCanadian Electrical Code (CSA C22.1).Conditions for use are as specified in theI/A Series DIN Rail Mounted SubsystemUser’s Guide (B0400FA).European Low Voltage Directive 73/23/EECand Explosive Atmospheres (ATEX) directive94/9/ECCENELEC (DEMKO) certified as EEx nA IICT4 for use in CENELEC certified Zone 2enclosure certified as associated apparatusfor supplying non-incendive field circuits forZone 2, Group IIC, potentially explosiveatmospheres when connected to specifiedI/A Series processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Also,see Table1 on page9.Calibration RequirementsCalibration of the module or termination assembly is not required.PSS 21H-2Z14 B4Page 6ENVIRONMENTAL SPECIFICATIONS(3)OperatingTEMPERATUREModule-20 to +70°C (-4 to +158°F)Termination AssemblyPVC-20 to +50°C (-4 to +122°F)PA-20 to +70°C (-4 to +158°F) RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +3,000m (-1,000 to +10,000ft)StorageTEMPERATURE-40 to +70°C (-40 to +158°F)RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +12,000m (-1,000 to +40,000ft) ContaminationSuitable for use in Class G3 (Harsh) environments as defined in ISA Standard S71.04, based on exposure testing according to EIA Standard 364-65, Class III. Vibration7.5 m/S2 (0.75 g) from 5 to 500 Hz(3)The environmental limits of this module may be enhanced by the type of enclosure containing the module. Refer to the applicableProduct Specification Sheet (PSS) which describes the specific type of enclosure that is to be used.PSS 21H-2Z14 B4Page 7 PHYSICAL SPECIFICATIONSMountingMODULEFBM214 mounts on a modular baseplate. Thebaseplate can be mounted on a DIN rail(horizontally or vertically), or horizontally on a19-inch rack using a mounting kit. Refer toPSS21H-2W6B4 for details.TERMINATION ASSEMBLYThe TA mounts on a DIN rail and accommodates multiple DIN rail styles including 32mm (1.26in) and 35mm 1.38in).MassMODULE284 g (10 oz) approximateTERMINATION ASSEMBLYCompression181 g (0.40 lb) approximateRing Lug249 g (0.55 lb) approximateDimensions – ModuleHEIGHT102 mm (4 in)114 mm (4.5 in) including mounting lugsWIDTH45 mm (1.75 in)DEPTH104 mm (4.11 in)Dimensions – Termination AssemblySee page10.Part NumbersFBM214 MODULEP0922VTTERMINATION ASSEMBLIESSee “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” on page8. Termination CablesCABLE LENGTHSUp to 30 m (98 ft)CABLE MATERIALSPolyurethane or Hypalon®/XLPTERMINATION CABLE TYPEType 1 – See Table2 on page9.CABLE CONNECTION – TA25-pin male D-subminiatureConstruction – Termination AssemblyMATERIALPolyvinyl Chloride (PVC), compressionPolyamide (PA), compressionPVC, ring lugFAMILY GROUP COLORGreen – communicationTERMINAL BLOCKS3 tiers, 8 positionsField Termination ConnectionsCOMPRESSION-TYPE ACCEPTED WIRINGSIZESSolid/Stranded/AWG0.2 to 4 mm2/0.2 to 2.5 mm2/24 to 12 AWGStranded with Ferrules0.2 to 2.5 mm2 with or without plastic collarRING-LUG TYPE ACCEPTED WIRING SIZES#6 size connectors (0.375 in (9.5 mm))0.5 to 4 mm2/22 AWG to 12 AWGPSS 21H-2Z14 B4Page 8TERMINATION ASSEMBLIES AND CABLESField input signals connect to the FBM subsystem via DIN rail mounted Termination Assemblies, which are electrically passive.TAs for the FBM214 are available in the following forms: Compression screw type using Polyvinyl Chloride(PVC) materialCompression screw type using Polyamide (PA) material Ring lug type using PVC material.See the following “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” for a list of TAs used with the FBM214.The FBM214 provides sufficient loop resistance to allow use of the HART Hand-Held Terminal, or PC20 Intelligent Field Device Configurator (PSS 2A-1Z3 E).A removable termination cable connects the DIN railmounted TA to the FBM via a field connector on the baseplate in which the FBM is installed. Termination cables are available in the following materials: PolyurethaneHypalon XLP .Termination cables are available in a variety of lengths, up to 30 meters (98feet), allowing the Termination Assembly to be mounted in either theenclosure or in an adjacent enclosure. See Table 2 for a list of termination cables used with the TAs forthe FBM214.FUNCTIONAL SPECIFICATIONS – TERMINATION ASSEMBLIESFBM Type Input SignalTA Part NumberTermination TA Cable TACertification PVC (a)(a)PVC is polyvinyl chloride rated from -20 to +50°C (-4 to +122°F).PA is Polyamide rated from -20 to +70°C (-4 to +158°F).PA (a)Type (b)(b) C = TA with compression terminals; RL = TA with ring lug terminals.Type (c)(c)See Table 2 for cable part numbers and specifications.Type (d)(d)See Table 1 for Termination Assembly certification definitions.FBM2148 input channels, 4 to 20mA analog signal, alone or with HART signal superimposedP0916BX P0926EA P0926TD CRL11, 2PSS 21H-2Z14 B4Page 9Table 1. Certification for Termination AssembliesType Certification (a)(a)All TAs are UL/UL-C listed to comply with applicable ordinary location safety standards for fire and shock hazards. Hazardous locationtypes comply with ATEX directive for II 3 G use. They also comply with the requirements of the European Low Voltage Directive. All listings/certifications require installation and use within the constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA) and the conditions stated in UL and DEMKO reports.Type 1TAs are UL/UL-C listed as suitable for use in Class I; Groups A-D; Division 2 temperature code T4 hazardous locations. They are CENELEC (DEMKO) certified EEx nA IIC T4 for use in Zone 2 potentially explosive atmospheres.Type 2TAs are UL/UL-C listed as associated apparatus for supplying non-incendive field circuits Class I; Groups A-D; Division 2 hazardous locations when connected to specified DIN rail mounted FBMs and field circuits meeting entity parameter constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA). They are also CENELEC (DEMKO) certified as associated apparatus for supplying field circuits for Group IIC, Zone 2 potentially explosive atmospheres. Field circuits are also Class 2 limited energy (60 V dc, 30 V ac, 100 VA or less) if customer-supplied equipment meets Class 2 limits.Table 2. Cables Types and Part NumbersCable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)Cable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)0.5 (1.6)P0916DA P0916VA 10.0 (32.8) P0916DE P0916VE 1.0 (3.2) P0916DB P0916VB 15.0 (49.2) P0916DF P0916VF 2.0 (6.6)P0931RM P0931RR 20.0 (65.6) P0916DG P0916VG 3.0 (9.8) P0916DC P0916VC 25.0 (82.0) P0916DH P0916VH 5.0 (16.4)P0916DDP0916VD30.0 (98.4)P0916DJP0916VJ(a)P/PVC is polyurethane outer jacket and semi-rigid PVC primary conductor insulation.(b)H/XLPE is Hypalon outer jacket and XLPE (cross-linked polyethylene) primary conductor insulation.PSS 21H-2Z14 B4Page 10DIMENSIONS – NOMINALRELATED PRODUCT SPECIFICATION SHEETSCompression Termination AssemblyRing Lug Termination Assembly(a) Overall width – for determining DIN rail loading.(b) Height above DIN rail (add to DIN rail height for total).PSS NumberDescriptionPSS 21H-2W1 B3DIN Rail Mounted FBM Subsystem OverviewPSS 21H-2W2 B3DIN Rail Mounted FBM Equipment, Agency CertificationsPSS 21H-2Z14 B4Page 11PSS 21H-2Z14 B4 Page 12IPS Corporate Headquarters 5601 Granite Parkway Suite 1000 Plano, TX 75024United States of AmericaFoxboro Global Client Support Inside U.S.: 1-866-746-6477 Outside U.S.: 1-508-549-2424 or contact your local Foxboro representative.Facsimile: 1-508-549-4999Invensys, Foxboro, I/A Series and the IPS Logo are trademarks of Invensys plc, its subsidiaries, and affiliates. All other brand names may be trademarks of their respective owners.Copyright 2002-2010 Invensys Systems, Inc.All rights reservedMB 21A Printed in U.S.A. 0210。
BSP123中文资料
0.25
0.20
0.15
0.10
0.05 0.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 A 0.8 ID
Sep-12-1996
BSP 123
Drain-source on-resistance
RDS (on) = ƒ(Tj) parameter: ID = 0.38 A, VGS = 10 V
RDS(on)
VGS = 10 V, ID = 0.38 A
-
4
VGS = 4.5 V, ID = 0.38 A
-
6
-
2
1 100 10
50
6 10
Unit
V
µA nA nA Ω
Semiconductor Group
2
Sep-12-1996
BSP 123
Electrical Characteristics, at Tj = 25°C, unless otherwise specified
0.40 A
ID 0.32 0.28
0.24
0.20 0.16
0.12
0.08
0.04
0.00 0
20 40 60 80 100 120 °C 160
TA
Transient thermal impedance
Zth JA = ƒ(tp) parameter: D = tp / T
10 2 K/W
ZthJC
Symbol VDS VDGR
VGS Vgs ID
IDpuls
Ptot
Values
Unit
100
V
100 ± 14 ± 20
(整理)三字母单词到M.
alt [ælt] n.,adj. 高音(的)alp [ælp] n. 高山ail [eɪl] vi. 生病；感到不舒服；处境困难，境况不佳vt. 使受病痛，使疼痛，使烦恼；折磨n. 病痛；苦恼；烦恼ain D.J.[ein]- ain adj. 〈英方〉自己的- Ain adj. 自己的n. ①艾因河(位于法国东部)②一种压缩软件- AIN abbr.1． abducens internuclear neurons 外展核间神经元2． acute interstitial nephritis 急性间质性肾炎3． acute interstitial nephropathy 急性间质性肾病4． adriamycin-induced nephropathy 阿霉素诱发的肾病5． advanced intelligent network 高级智能网ala D.J.[ˈeilə]- ala n. (昆虫的)翼,翅- ALA abbr. American Library Association 美国图书馆协会丙氨酸- AlA abbr. allylamine 烯丙胺- aLA abbr. anti-leucocyte serum antibodies 抗白细胞血清抗体- aLa abbr. arterial lactates 动脉［血］乳酸alb [ælb] n. 白麻布圣职衣ale [eɪl] 欢乐，物质享受，生活中的好东西，世间乐事ait [eit] n. 〈英方〉河中的小岛abb [æb]- abb n. 横丝,纬纱,劣质羊毛双耳交替冷热试验- Abb abbr.1． Abbess 女修道院院长2． Abbey 阿比(姓氏)3． Abbildung (German=illustration) (德语)说明，例证，插图，图解axe [æks] n. 斧子ace [eis] n. 某些活动中的能手；(网球比赛中, 尤指发球)得分的一擅长做某事ade [eid]- ade n. 果汁饮料- ADE abbr. Automated Data Entry 自动数据输入- Ade n. [英格兰人姓氏] 埃德。
一例泰迪犬对乙酰氨基酚中毒的诊治
第43卷第3期2021年3月宜春学院学报Journal of Yichun UniversityVol.43(No.3Mar.2021一例泰迪犬对乙酰氨基酚中毒的诊治曹建文，余德勇，夏伦斌，左瑞华（皖西学院生物与制药工程学院，安徽六安237012）摘要：对乙酰氨基酚是一种解热镇痛消炎药物，内服给药吸收快、退热效果快，常用于人的感冒发烧治疗。
由于很多动物体内自身缺乏葡萄糖醛酸化合物无法代谢对乙酰氨基酚，很容易造成中毒现象。
笔者接诊了一例宠主过量饲喂对乙酰氨基酚导致中毒的患犬，临床表现为流涎、精神沉郁、呕吐、呼吸急促和贫血等症状，根据发病史、临床症状和实验室检测确诊本病。
通过口服给予乙酰半胱氨酸和静脉补液来减轻药物毒性及促进药品代谢，住院治疗9天后，痊愈出院。
此次诊治过程表明，人用药不一定适用于宠物疾病治疗，如过量饲喂可能造成严重后果，建议宠物生病时宠主及时去动物诊疗机构就诊。
关键词：泰迪犬；对乙酰氨基酚；中毒；诊断；治疗中图分类号：S954.5+3文献标识码：A文章编号：1671-390X（2021）03-0092-04Diagnosis and Treatment of Acetaminophen Poisoning in a PoodleCAO Jian一wen,SHE Dr-yong,XIA Lun一bin,ZUO Rut一hua(College of Biological and Pharmaceutical Engineering,West Anhui University,Lu(an.237012,China) Abstract:Acetaminophen i s a kind of antipyretic,analgesic and anti-inflammatoiy drug.A can be absorbed quickly and hao a rapid antipyretia effect.A is commonly used in the treatment of peoplet cold and fever.Due ta the lack of glucuronia acid compoundo in many animago,paracetamoo cannot be metabolized,which is easy to cause poisoning.A case of dog poisoned by acetaminophen way treated.T he clinicai manimstationy were salivation, depression,vomiting,shortne a of breeta and anemic.After9daya I hospitai,the patienta were cured and dia-chareed.The diaanosia and treatment process shows that human medication it not necessariiy suitabie for the treatment of pet diseses,such as excessive feeding may cause serious consequences.A is recommended that pet own-ts go to animai diaanosis and treatment institutions I time when pets are sick.Key worAt:Poodie;acetaminophen；poisoning；diaanosis;treatment最近几年来，随着我国社会经济的迅猛发展、城市化进程的步伐加快以及人民群众生活水平的要求越来越高，促使犬饲养的家庭越来越多[1],因宠主饲养不当或给药过量等其它原因导致犬中毒病的病例也越来越多，对乙酰氨基酚服用过量导致中毒病例在兽医临床上时有发生对乙酰氨基酚又名为扑热息痛是一种人常用的感冒药，对乙酰氨基酚有解热、镇痛与抗炎作用，解热作用类似于阿司匹林，但镇痛和抗炎作用较弱。
ALPS电子产品说明书
VF401
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4-Pin SIP (5,13 mm x 3,60 mm x 1,60 mm)
VM821Q1 —
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2-Pin SIP, Wide (5,13 mm x 3,60 mm x 1,60 mm)
VM721V1 VM721D1
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8-Pin SOIC (6,0 mm x 4,9 mm x 1,4 mm)
Magnetic Sensor IC Product Line Card
Package Style1, 2
SOT-23 (2,90 mm x 2,80 mm x 1,40 mm)
Flat T0-92-style
-LP
-T2
(4,06 mm x 3,0 mm x 1,57 mm)
Blank -L -S -SP
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APS00B
U-Pack (4,52 mm x 4,52 mm x 1,57 mm)
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2SS52M
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寻找股票收益率的临界变化点——基于股票市场的阈值非线性建模
按阈值将观 测数 据分类后 ，在每 个体 制内直接进行 最小二 乘回归即可 。其漂移项 ”
，
和 的估 计结果 ， 如表 ４ 所示 。
正如 Ｔ ａ（ ９ ９所 指出的 ， ｓ １８ ） ｙ 当利 用阈值变量将 观测数 据进 行重新排 序后 ， 那么阈值非线性就体现 为结构断 点问题 。
在得到阈值后 ， 对如 下阈值非 线性模型 的估 计比较 简单 ：
Ａｌ ‘＋ ‘ （ 果 ｑ ｎ ＝ ¨ ｇ¨ ｐ 如 ｓＰ）
１
明了前期的数据是将来变化 的指示 器。Ｐ， 为两个阈值 ， ： Ｐ 他们 将 时间 序列隔成 三个体 制 ， 并且 一 ＜ ，ｏ ｐ ＋ ， 得注意 ｐ ＜ 值 ＜ ＜ 的是 Ｐ小于 ０ Ｐ 大于 ０ 他们分别代表大跌之后再涨和大涨 。 而 ： ， 之后再跌 的临界 点。可以看到 ， 该模型在每个体 制内是线性的 ，
中间 体 制
０． ０ ８ ０ｏ ８ １
表 ４ 股 指 漂 移 项 的 估 计
下 体 制
＾
－
上 体 制
Ｏ．０ｌ ０ １
ｐ 一 ｅ一 ｌ（ｋ ｓ ）｝ ＝ （）Ｘ ２ Ｔ） ｛ ２ １ ｐｉ ＾ — （ ） ｛ － ｗ １
其 中 Ｔ为样 本观测数 ， ｋ为递归 回归的起 始期 ， ｗ） Ｓ（ 为从
也即在 用阈值变量将数据分成三个体制后 ， 在估计 方法上 ＯＬ Ｓ
即 可 满 足需 求 。
研 究股市条件均 值的非线性 也是十分重 要的。其一 ， 由于
股 市的一些特 有现象 ， 如噪 声交易和套 利交易 的存在 ， 易成 交
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yyy = Voltage = 12V AC/DC = 24V AC/DC = 48V AC/DC = 110V AC/DC = 230V AC = 230V DC
titel
CAT. NO. 2ALP1LB-yyy 2ALP3LB-yyy 2ALP4LB-yyy LED Illuminated Metal 1* 2ALP5LB-yyy Selector Switch 2ALP6LB-yyy 2ALP7LB-yyy 2ALP8LB-yyy 2* Mounting Bracket 2BRK 3* LED Bulb MCB9xzzz 4* Mounting Bracket Screws incl. in 2BRK 5* Blub Holder 2LHB 6 Panel 7 Maintained Action mechanisim 2PPM S1 S2 8** Switch Contacts S3 S4
元器件交易网
revision for dwg # 1PB-2ALPxLB-yyy
8 5 6
rev
-
ch.no.
-
description original design
date
11/1/2007 1
revised by Philipp E.
3
37 mm [1.5 in] 61 mm [2.4 in] 85 mm [3.4 in] 7
= = = =
±0.5 mm ±0.2 mm − mm
±1 mm
M E T R I C
35 Royal Road Flemington, NJ 06-9490
and is a confidential disclosurelent without consideration other than the borrower’s agreement that it shall not be reproduced, copied, lent or disposed of directly or indirectly nor used for any purpose other than that for which it is specifically furnished.
COLOR MIN. QTY. MAX. QTY. White 1 1 Green 1 1 Red 1 1 Amber 1 1 Blue 1 1 Clear 1 1 Yellow 1 1 1 1 1 1 2 2 1 1 Black 1 1 Green 1 4 Red 1 4 Green/Gray 1 4 Red/Gray 1 4
22 mm LED Illuminated Metal Projecting Operators 2ALPxLB-yyy (x=color, yyy=voltage)
11/1/2007 11/1/2007 11/1/2007
drawn by: Philipp Ernstberger checked by: Laszlo Gyorgypal released by: Laszlo Gyorgypal
max. 6 mm [.25 in]
Up to four switch contacts can be installed.
5 18 mm [.7 in] 4 2
ITEM DESCRIPTION
max. 6 mm [.25 in] 37 mm [1.5 in] 50 mm [2.0 in] 74 mm [2.9 in] 98 mm [3.9 in] For maintained action use Cat. No. 2PPM * = Selector Switch is supplied with mounting bracket, bulb holder and LED (ITEM 1,2,3,4 and 5) ** = Switch Contacts must be ordered separatly
drawing no.:
1PB-2ALPxLB-yyy
24.4 mm [1.0 in]
rev.:
-
scale:
-
sheet: 1
of: 1
unless otherwise specified: all dimensions are in millimeters third angle projection tolerance XX XX.X XX.XX ALL
This Drawing is the property of
R
012 024 048 110 230 230D