CY74FCT16646T_08中文资料
Keysight Technologies 电路测试产品说明书
Select the essential accessories to complete the testing system you need.
TriMode™ Long Reach Solder Tip
Order #: P75TLRST, Kit of 1 High performance solder tip. Up to 20 GHz bandwidth.
Precision Differential Probing Module
Order #: P75PDPM High performance handheld probing module. Up to 18 GHz bandwidth.
Tip Cable
Order #: P75TC, Kit of 1 Replacement cable for the P75PDPM.
Marker Bands
Order #: 016-0633-XX, Kit of 10 Five pairs of colored bands for marking probe cables to oscilloscope channels.
Adhesive Tape
Order #: 006-8237-XX, Strip of 10 Double sided foam tape for securing solder tips in place.
Copyright © 2008, Tektronix. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication
74LS08中文资料_数据手册_参数
5
PACKAGE OPTION ADDENDUM
PACKAGING INFORMATION
Orderable Device JM38510/08003BCA
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
CDIP
1
TBD
J
14
1
TBD
N
14
TBD
N
14
TBD
N
14
TBD
N
14
TBD
D
14
50 Green (RoHS
& no Sb/Br)
D
14
50 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
POST-PLATE
POST-PLATE
A42
A42
A42
A42
A42
A42
A42
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type
N / A for Pkg Type
74HCT08中文资料
2003 Jul 25
3
元器件交易网
Philips Semiconductors
Product specification
Quad 2-input AND gate
74HC08; 74HCT08
handbook, halfpage handbook, halfpage
1A 1
Pin configuration DIP14, SO14 and (T)SSOP14.
Fig.2 Pin configuration DHVQFN14.
handbook, halfpage handbook, halfpage
1 2
&
3
1 2 4 5 9 10 12 13
1A 1B 2A 2B 3A 3B 4A 4B
RECOMMENDED OPERATING CONDITIONS 74HC08 SYMBOL VCC VI VO Tamb tr, tf PARAMETER supply voltage input voltage output voltage ambient temperature input rise and fall times CONDITIONS MIN. 2.0 0 0 see DC and AC −40 characteristics per device VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V − − − TYP. 5.0 − − +25 − 6.0 − MAX. 6.0 VCC VCC +125 1000 500 400 MIN. 4.5 0 0 −40 − − − TYP. 5.0 − − +25 − 6.0 − MAX. 5.5 VCC VCC +125 − 500 − V V V °C ns ns ns 74HCT08 UNIT
超米特电子有限公司产品说明书
1US Headquarters TEL +(1) 781-935-4850FAX +(1) 781-933-4318 • Europe TEL +(44) 1628 404000FAX +(44) 1628 404090Asia Pacific TEL +(852) 2 428 8008FAX +(852) 2 423 8253South America TEL +(55) 11 3917 1099FAX +(55) 11 3917 0817Superior elongation and tensilestrength help to prevent tearing in use due to mishandling. Typical properties for CHO-SEAL 1310 and 1273 materi-al are shown on pages 33 and 32respectively.High Shielding PerformanceCHO-SEAL 1310 material provides more than 80 dB of shielding effectiv-ness from 100 MHz to 10 GHz, while CHO-SEAL 1273 material provides more than 100 dB.Low Volume ResistivityBoth materials have exceptionally low volume resistivity, which makes them well suited for grounding appli-cations in which a flexible electrical contact is needed.Low Compression GasketSpacer gaskets are typicallydesigned to function under low deflec-tion forces. Chomerics uses design tools such as Finite Element Analysis (FEA) to accurately predict compres-sion-deflection behavior of various cross section options. Refer to page16.LCP Plastic SpacerLiquid crystal polymer (LCP)spacers, including those made with Vectra A130 material, provide aCHO-SEAL ®1310 or 1273Conductive ElastomersWith EMI spacer gaskets, shielding and grounding are provided by Chomerics’CHO-SEAL 1310 and 1273 conductive elastomers, specifi-cally formulated for custom shape molded parts. They provide excellent shielding and isolation against electro-magnetic interference (EMI), or act as a low impedance ground path between PCB traces and shielding media. Physically tough, these elas-tomers minimize the risk of gasket damage, in contrast to thin-walled extrusions or unsupported molded gaskets.Silicone-based CHO-SEAL 1310and 1273 materials offer excellent resistance to compression set over a wide temperature range, resulting in years of continuous service. CHO-SEAL 1310 material is filled with silver-plated-glass particles, while 1273 utilizes silver-plated-copper filler to provide higher levels of EMI shielding effectiveness.EMI Spacer GasketsThe unique design of Chomerics’EMI spacer gaskets features a thin plastic retainer frame onto which a conductive elastomer is molded. The elastomer can be located inside or outside the retainer frame, as well as on its top and bottom surface. EMI spacer gaskets provide a newapproach to designing EMI gaskets into handheld electronics such as dig-ital cellular phones. Board-to-board spacing is custom designed to fit broad application needs. Customized cross sections and spacer shapes allow for very low closure forcerequirements and a perfect fit in any design or device.Robotic InstallationSpacer gaskets can be installed quickly by robotic application. Integral locater pins in the plastic spacer help ensure accuratepositioning in both manual and pick-and-place assembly. Benefits include faster assembly and lower labor costs.The integrated conductive elastomer/plastic spacer gasket is a low cost,easily installed system for providing EMI shielding and grounding in small electronic enclosures.Figure 1Single Piece EMI Gasket/Locator PinsCHO-SEAL 1310 or 1273 Conductive Elastomer (Inside)Plastic Spacer Around Outsideor InsideApplications for EMI Spacer GasketsThe spacer gasket concept is especially suited to digital and dual board telephone handsets or other handheld electronic devices. It provides a low impedance path between peripheral ground traces on printed circuit boards and components such as:•the conductive coating on a plastic housing•another printed circuit board •the keypad assemblyTypical applications for EMI spacer gaskets include:•Digital cellular, handyphone and personal communications services (PCS) handsets •PCMCIA cards•Global Positioning Systems (GPS)•Radio receivers•Other handheld electronics, e.g.,personal digital assistants (PDAs)•Replacements for metal EMI shield-ing “fences” on printedcircuit boards in wireless tele-communications devicesstable platform for direct, highprecision molding of conductive elas-tomers. The Vectra A130 material described in Table 1 has excellent heat deflection temperature character-istics (489°F, 254°C). For weight con-siderations, the LCP has aspecific gravity of only 1.61. This plas-tic is also 100% recyclable.Typical EMI Spacer Gasket Design ParametersThe EMI spacer gasket concept can be considered using the design parameters shown in Table 2. Some typical spacer gasket profiles are shown below.Figure 2Typical Spacer Gasket Profiles3US Headquarters TEL +(1) 781-935-4850FAX +(1) 781-933-4318 • Europe TEL +(44) 1628 404000FAX +(44) 1628 404090Asia Pacific TEL +(852) 2 428 8008FAX +(852) 2 423 8253South America TEL +(55) 11 3917 1099FAX +(55) 11 3917 0817Finite Element AnalysisChomerics, a division of the Parker Hannifin Corporation’s Seal Group, is the headquarters of Parker Seal’s Elastomer Simulation Group. This unit specializes in elastomer finite element analysis (FEA) using MARC K6 series software as a foundation for FEA capability.Benefits of FEA include:•Quickly optimizing elastomer gasket designs•Allowing accurate predictions of alternate elastomer design concepts •Eliminating extensive trial and error prototype evaluationTypical use of FEA in EMI spacer gasket designs is to evaluate the force vs. deflection requirements of alternate designs.For example, onespacer design features a continuous bead of con-ductive elastomer molded onto a plastic spacer. An alternative designemploys an “interrupted bead,” where the interrup-tions (gaps left on the plastic frame) are sized to maintain the requiredlevel of EMI shielding. Figure 4illustrates these alternative designs.Gasket DeflectionFigure 5 compares the effect of continuous and interrupted elastomer gasket designs in terms of the force required to deflect the conductive elastomer. This actual cellular handset application required a spacer gasket with interrupted bead to meet desired deflection forces.Chomerics Designand Application ServicesChomerics will custom design a spacer for your application. Advice,analysis and design assistance will be provided by Chomerics Applications and Design engineers at no additional fee. Contact Chomerics directlyat the locations listed at the bottom of the page.Figure 3FEA Example of an EMISpacer Gasket Cross SectionFigure 4Continuous (top) and InterruptedElastomer GasketsFigure 5Typical Spacer Gasket Deflection。
安捷倫科技 16800 系列 可攜式邏輯分析儀 说明书
協助您快速完成數位系統除錯、驗證及最佳化作業－價位又不會超出您的預算範圍特色與優點•解析度250 ps（4 GHz）的時序放大能力可迅速找出難纏的時序問題，不需要分兩次探量。
•配備15 吋的顯示幕，還可選配觸控式螢幕，能夠讓您觀察更多的資料，迅速進行瀏覽。
•View Scope －能以時間相互關聯的方式執行量測及顯示邏輯分析儀和示波器的資料，讓您有效地跨設計的類比和數位部份追查出問題所在。
•八款機種分別配備34/68/102/136/204 個頻道，記憶體的深度最大可達32 M，還有內建碼型產生器的機種，如此多樣化的選擇可提供任何預算所需的量測彈性。
•可支援今日複雜設計的各種應用需求－FPGA 動態探棒、數位VSA（向量信號分析），還可以廣泛地支援各種廠牌的處理器和匯流排。
安捷倫科技16800 系列可攜式邏輯分析儀規格資料目錄16800 系列可攜式邏輯分析儀的選購指南. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2可追蹤系統即時運作狀況的邏輯分析能力. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3安捷倫科技16800 系列邏輯分析儀的規格及特性. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5內建碼型產生器可在單一部儀器中提供數位激發和響應的量測能力. . . . . . . . . . . . . . . . . . . 10碼型產生器的規格及特性. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12充分發揮邏輯分析儀和示波器的互補能力. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23多種檢視與分析工具可讓您立即深入探量設計內部的狀況. . . . . . . . . . . . . . . . . . . . . . . . . . 24 16800 系列的儀器特性. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 16800 系列的介面. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 16800 系列的實體特性. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 16800 系列的配件.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31訂購資訊. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33支援、服務及協助. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36216800 系列可攜式邏輯分析儀的選購指南3468 102 136204484848N/AN/A4 GHz (250 ps)、 4 GHz (250 ps)、64 K 深64 K 深1.0 GHz (1.0 ns) / 1.0 GHz (1.0 ns) / 500 MHz (2.0 ns)500 MHz (2.0 ns)搭配選項250 為搭配選項500 為450 MHz 250 MHz 搭配選項250 為250 MHz 搭配選項250 為搭配選項500 為500 Mb/s 250 Mb/s搭配選項250 為250 Mb/s 搭配選項001 為1 M 搭配選項001 為1 M 搭配選項004 為4 M 搭配選項004 為4 M 搭配選項016 為16 M 搭配選項016 為16 M 搭配選項032 為32 M 搭配選項032 為32 M 單端式單端式有有40-pin 的纜線接頭40-pin 的纜線接頭1 16821A、16822A 及16823A 含碼型產生器。
74HC08中文资料_数据手册_参数
万联芯城-电子元器件采购网，提供一站式配套 ，解决物料烦恼，万联芯城-以良心做好良芯，专为终端工厂企业客 户提供电子元器件一站式配套报价服务，客户提交物料清单，商城即 可整单报价，整单下单有优惠，整单采购可节省成本，万联芯城完 善的产品供应链体系可以应对多种不同物料需求的报价， 点击进入万联芯城。
Quad 2输入和gate74HC08;74HCT08FEATURES•符合JEDEC标准no。 ESD保护:HBM EIA/ jesd22 - a114a超过2000 VMM EIA/JESD22A115-A超过200 V。•指定从- 40到+85℃和- 40到+125℃。描述:74HC/HCT08是高速硅栅CMOS器件，与低功耗肖特基晶体管(LSTTL)兼 容。它们是按照JEDECstandard no.指定的。7个。74HC/HCT08提供2-inputAND功能。快速参考数据agnd = 0 V;Tamb = 25°C;tr =tf = 6 ns.Notes1。CPD用于确定动态功耗µW (PD)。PD = CPD×VCC2×fi×N +Σ(CL×VCC2×fo)地点:fi =输入频率MHz; fo MHz =输出频 率;CL =输出负载电容在pF; VCC =供应电压伏;N =总负载切换输出;Σ(CL×VCC2×fo) = outputs.2之和。对于74HC08:条件是VI = GND 到VCC。对于74HCT08:条件是VI = GND到VCC - 1.5 V。TABLENote1函数。H =高压电平;L =低压电平Quad 2输入和 gate74HC08;74HCT08FEATURES•符合JEDEC标准no。 ESD保护:HBM EIA/ jesd22 - a114a超过2000 VMM EIA/JESD22-A115-A超过200 V。•指定从- 40到+85℃和- 40到+125℃。描述:74HC/HCT08是高速硅栅CMOS器件，与低功耗肖特基晶体管(LSTTL)兼容。它们是按照 JEDECstandard no.指定的。7个。74HC/HCT08提供2-inputAND功能。快速参考数据agnd = 0 V;Tamb = 25°C;tr =tf = 6 ns.Notes1。CPD用 于确定动态功耗µW (PD)。PD = CPD×VCC2×fi×N +Σ(CL×VCC2×fo)地点:fi =输入频率MHz; fo MHz =输出频率;CL =输出负载电容 在pF; VCC =供应电压伏;N =总负载切换输出;Σ(CL×VCC2×fo) = outputs.2之和。对于74HC08:条件是VI = GND到VCC。对于 74HCT08:条件是VI = GND到VCC - 1.5 V。TABLENote1函数。H =高压电平;L =低压电平。
Eaton 144866 Catalog 电路保护设备说明说明书
Eaton 144866Eaton Moeller series xPole - eRB6/M RCBO - residual-current circuit breaker with overcurrent protection. Electronic RCD/MCB, 8A, 30mA, MCB char. curve: C, 1p, RCCB trip char.: AC, UKGeneral specificationsEaton Moeller series xPole - eRB6/M RCBO - residual-current circuit breaker with overcurrent protection1448669008790290312216 mm 72 mm 17.5 mm 0.18 kg CE Marked RoHS conformCE eRBM-8/1/C/003-UKProduct NameCatalog Number EANProduct Length/Depth Product Height Product Width Product Weight Compliances Certifications Model Code8 AIs the panel builder's responsibility. The specifications for the switchgear must be observed.Meets the product standard's requirements.Is the panel builder's responsibility. The specifications for the switchgear must be observed.3Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.0 kA50/60 HzIs the panel builder's responsibility.10.03 A40 °C0 W69.5 mm1 mm²DA-DC-03_eRBIL019095ZUeaton-xpole-combined-mcb-rcd-device-rcbo-packaging-manual-multilingual.pdfMA120500735.pdfeaton-xpole-erb6-rcbo-catalog-ca019049en-en-us.pdfeaton-xpole-erb6-au-rcbo-catalog-ca019052en-en-us.pdfRated operational current for specified heat dissipation (In) 10.11 Short-circuit rating10.4 Clearances and creepage distances10.12 Electromagnetic compatibilityCurrent limiting class10.2.5 Lifting10.2.3.1 Verification of thermal stability of enclosures Rated short-circuit breaking capacity (EN 60947-2) Frequency rating10.8 Connections for external conductorsNumber of poles (total)Fault current ratingAmbient operating temperature - maxHeat dissipation per pole, current-dependentBuilt-in depthConnectable conductor cross section (solid-core) - min 10.9.3 Impulse withstand voltage Certifikater InstallationsvejledningKatalogerIs the panel builder's responsibility.Number of polesSingle-poleAmbient operating temperature - min-25 °C10.6 Incorporation of switching devices and componentsDoes not apply, since the entire switchgear needs to be evaluated.10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Equipment heat dissipation, current-dependent2 W10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.Static heat dissipation, non-current-dependent0 WApplicationSwitchgear for residential and commercial applications10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Voltage typeACNumber of poles (protected)1Leakage current typeACRated short-circuit breaking capacity (EN 61009-1)10 kAOperating ambient temperature - min-25 °CHeat dissipation capacity0 WRelease characteristicCWidth in number of modular spacings1Power loss2 W10.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Rated short-circuit breaking capacity (EN 61009)10 kAOperating ambient temperature - max40 °CVoltage rating240 V - 240 V10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Connectable conductor cross section (solid-core) - max25 mm²Degree of protectionIP20Overvoltage categoryIIIPollution degree210.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Connectable conductor cross section (multi-wired) - min1 mm²Rated impulse withstand voltage (Uimp)4 kV10.10 Temperature riseThe panel builder is responsible for the temperature risecalculation. Eaton will provide heat dissipation data for the devices.Basic functionCombined RCD/MCB devicesRated current8 AConnectable conductor cross section (multi-wired) - max25 mm²TypeRCBO10.2.2 Corrosion resistanceMeets the product standard's requirements.Surge current capacity0.25 kA10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Rated short-circuit breaking capacity (IEC 60947-2)0 kADisconnection characteristicUndelayedProduct applicationSwitchgear for industrial and advanced commercial applicationsRated operational voltage (Ue) - max240 VRated insulation voltage (Ui)500 VEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. Alle rettigheder forbeholdes. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia。
CY74FCT646TQSOP中文资料
SCCS031 - July 1994 - Revised March 2000Data sheet acquired from Cypress Semiconductor Corporation.Data sheet modified to remove devices not offered.Features•Function, pinout, and drive compatible with FCT and F logic•FCT-C speed at 5.4 ns max. (Com’l)FCT-A speed at 6.3 ns max. (Com’l)BUS AMaximum Ratings[4, 5](Above which the useful lifeguidelines, not tested.)Storage T emperature.................................–65 Ambient T emperature withPower Applied.............................................–65 Supply Voltage to Ground Potential............... DC Input Voltage............................................Power Supply Characteristics Parameter DescriptionI CC Quiescent Power Supply Current ∆I CC Quiescent Power(TTL inputs HIGH)I CCD Dynamic Power SupplyCurrent[11]Switching CharacteristicsParametert PLHt PHLPropagation Delay Bus to Bust PZH t Output Enable Time Enable to Bus and DIR to AOrdering InformationSpeed(ns)Ordering Code5.4CY74FCT646CTQCTCY74FCT646CTSOC/SOCT6.0CY54FCT646CTLMB6.3CY74FCT646ATQCTPackage Diagrams (continued)IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 2000, Texas Instruments Incorporated。
CD4066中文资料
CD4066中文资料：CD4066是四双向模拟开关，主要用作模拟或数字信号的多路传输。
引出端排列与CC4016一致，但具有比较低的导通阻抗。
另外，导通阻抗在整个输入信号范围内基本不变。
CD4066由四个相互独立的双向开关组成，每个开关有一个控制信号，开关中的p和n器件在控制信号作用下同时开关。
这种结构消除了开关晶体管阈值电压随输入信号的变化，因此在整个工作信号范围内导通阻抗比较低。
与单通道开关相比，具有输入信号峰值电压范围等于电源电压以及在输入信号范围内导通阻抗比较稳定等优点。
但若应用于采保电路，仍推荐CD4016。
当模拟开关的电源电压采用双电源时，例如=﹢5V，=﹣5V（均对地0V而言），则输入电压对称于0V的正、负信号电压（﹢5V～﹣5V）均能传输。
这时要求控制信号C=“1”为+5V，C=“0”为-5V，否则只能传输正极性的信号电压。
CD4066引脚功能图内部方框图Absolute Maximum Ratings 绝对最大额定值：Supply V oltage电源电压(VDD)−0.5V to +18VInput V oltage输入电压(VIN)−0.5V to VCC+0.5V Storage Temperature Range储存温度范围(TS)−65℃ to +150℃Power Dissipation功耗(PD)Dual-In-Line 普通双列封装700 mWSmall Outline 小外形封装500 mWLead Temperature 焊接温度(TL)Soldering, 10 seconds)（焊接10秒）300℃Recommended Operating Conditions 建议操作条件：Supply V oltage电源电压(VDD)3V to 15V Input V oltage输入电压(VIN)0V to VDD Operating Temperature Range工作温度范围(TA)−55℃ to +125℃DC Electrical Characteristics 直流电气特性：Sym bol 符号Parameter 参数Conditions 条件−55℃+25℃+125℃Units 单位最小最大最小典型最大最小最大IDD QuiescentDevice Current静态电流VDD = 5V0.250.010.257.5μA VDD = 10V0.50.010.515VDD = 15V1.0.011.030SIGNAL INPUTS AND OUTPUTSRON“ON” RL = 10 kΩ to (VDD − VSS/2) VC = VDD, VSS to VDDResistanceVDD = 5V 802701051300ΩVDD = 10V 31120400550VDD = 15V 2080240320ΔRO N Δ“ON”ResistanceBetween Any 2of 4 SwitchesRL = 10kΩ to (VDD − VSS/2) VCC = VDD, VIS = VSS to VDDVDD = 10V10ΩVDD = 15V5IIS Input or OutputLeakage Switch“OFF”VC = 0±5±0.1±50±500nACONTROL INPUTSVIL C LOW LevelInput V oltage输入低电平电压VIS = V SS and VDD VOS = V DD and VSS IIS = ± 10μAVDD = 5V1.52.251.5 1.5V VDD = 10V3.4.5 3.0 3.0VDD = 15V4.6.754.0 4.0VIH C HIGH LevelInput V oltage输入高电平电压VDD = 5V 3.5 3.52.753.5V VDD=10V (Note7)7.07.0 5.57.VDD = 15V11.11.8.2511.IIN Input Current输入电流VDD−VSS = 15VVDD≥VIS≥VSSVDD≥VC≥VSS−0.1−10−5−0.1−0.1μA0.110−50.10.1AC Electrical Characteristics 交流电气特性：Symbol 符号Parameter 参数Conditions 条件最小典型最大Units单位tPHL , tPLH Propagation DelayTime Signal Inputto Signal Output信号输入到信号输出传递延迟时间VC = VDD, CL = 50 pF, (Figure 1)RL = 200kVDD = 5V2555nsVDD = 10V1535VDD = 15V125tPZH , tPZL Propagation DelayTime Control Inputto Signal OutputHigh Impedance toLogical LevelRL = 1.0kΩ, CL = 50pF, (Figure 2, Figure 3)VDD = 5V125nsVDD = 10V6VDD = 15V5tPHZ , tPLZ Propagation DelayTime Control Inputto Signal OutputLogical Level toHigh ImpedanceSine WaveDistortionFrequencyResponse-Switch“ON” (Frequencyat −3 dB)RL = 1.0kΩ, CL = 50pFVDD = 5V125nsVDD = 10V6VDD = 15V5VC = VDD = 5V, VSS = −5V RL = 10 kΩ,VIS = 5Vp-p, f= 1 kHz, (Figure 4)0.1%VC = VDD = 5V, VSS = −5V, RL = 1 kΩ,VIS = 5Vp-p, 20 Log10 VOS/VOS (1kHz)−dB,(Figure 4)4MHzFeedthrough —Switch “OFF”(Frequency at −50dB) CrosstalkBetween Any TwoSwitches(Fre quency at −50dB) Crosstalk;Control Input toSignal OutputMaximum ControlInputVDD = 5.0V, VCC = VSS = −5.0V, RL = 1kΩ, VIS = 5.0Vp-p, 20 Log10, VOS/VIS =−50 dB, (Figure 4)1.25VDD=VC(A) =5.0V; VSS = VC(B) = 5.0V,RL1kΩ, VIS(A) = 5.0Vp-p, 20 Log10,VOS(B)/VIS(A) = −50dB (Figure 5)0.9MHzVDD =10V,RL=10kΩ,RIN=1.0kΩ,VCC=10V Square Wave, CL=50pF(Figure 6)15mVp-p RL=1.0kΩ, CL=50pF, (Figure 7)VOS(f) = ½ VOS(1.0 kHz)VDD = 5.0V6.MHzVDD = 10V8.VDD = 15V8.5CIS Signal InputCapacitance信号输入电容8.pFCOS Signal OutputCapacitance信号输出电容VDD = 10V8.pFCIO S FeedthroughCapacitance馈电容VC = 0V0.5pFCIN Control InputCapacitance控制输入电容5.7.5pF图1 CD4066是四双向模拟开关驱动继电器应用电路CD4066是四双向模拟开关，集成块SCR1～SCR4为控制端，用于控制四双向模拟开关的通断。
TI SN74CBTLV3257-EP 低电压4位2选1 FET多路复用器 多路信号分离器说明书
PW PACKAGE Product Folder Order Now Technical Documents Tools &SoftwareSupport &CommunitySN74CBTLV3257-EPZHCSJO7A –MAY 2008–REVISED MAY 2019SN74CBTLV3257-EP 低电压4位2选1FET 多路复用器/多路信号分离器(1)组件资质符合JEDEC 和行业标准，确保在更宽泛的工作温度范围内可靠运行。
这包括但不限于高加速应力测试(HAST)或偏压85/85、温度循环、热压器或无偏压HAST 、电迁移、金属间键合寿命和模塑化合物寿命。
这些资质测试不能作为在超出额定性能和环境限制的条件下使用此组件的依据。
1特性•受控基线–一个组装地点–一个测试地点–一个制造地点•更宽泛的工作温度范围-55°C 至125°C •为制造资源减少(DMS)提供增强型支持•改进了产品变更通知•资质谱系(1)•两个端口间使用5Ω开关连接•支持在数据I/O 端口进行轨至轨开关•I off 支持局部断电模式运行•闩锁性能超过100mA ，符合JESD 78II 类规范•ESD 保护性能超过JESD 22规范要求–2000V 人体模型(A114-A)–200V 机器模型(A115-A)2应用•支持国防、航天和医疗应用3说明SN74CBTLV3257是一款4位2选1高速FET 多路复用器/多路信号分离器。
此开关具有低通态电阻，可以在最短传播延迟情况下建立连接。
选择(S)输入控制数据流。
当输出使能(OE)输入为高电平时，FET 多路复用器/多路解复用器被禁用。
该器件完全适用于I off 为了部分断电的应用。
I off 特性可确保在关断时防止损坏电流通过器件回流。
该器件可在关断时提供隔离。
为了确保加电或断电期间的高阻抗状态，OE 应通过一个上拉电阻器被连接至V CC ；该电阻器的最小值由驱动器的电流吸入能力来决定。
LabVolt系列产品数据手册说明书
LabVolt SeriesDatasheet PLC Applications8075* The product images shown in this document are for illustration purposes; actual products may vary. Please refer to the Specifications section of each product/item for all details. Festo Didactic reserves the right to change product images and specifications at any time without notice.Festo Didactic en12/2023PLC Applications, LabVolt SeriesTable of ContentsGeneral Description_________________________________________________________________________________3 Courseware_______________________________________________________________________________________3 PLC Compatibility__________________________________________________________________________________3 PLC Requirements__________________________________________________________________________________4 Topic Coverage_____________________________________________________________________________________4 Features & Benefits_________________________________________________________________________________5 List of Available Training Systems_____________________________________________________________________5 Available Training Systems__________________________________________________________________________5 Equipment Description_____________________________________________________________________________10 Optional Equipment Description_____________________________________________________________________14PLC Applications, LabVolt SeriesGeneral DescriptionThe PLC Applications, Series 8075, aim to further develop student understanding of PLC programming that was acquired with the Programmable Logic Controller Training Systems, Series 3240. Basic principles are integrated with more advanced concepts in order to design small-scale systems typical of what can be found in the industry. Through practical examples, students gain a strong knowledge of PLCs and of the studied applications. Job sheets are provided with each application. The training capabilities of the systems are enhanced by their modularity and by the ability to use instructor-inserted faults.Fault switches are included on selected modules to enhance troubleshooting activities by simulating open coils and contacts, defective contacts, shorted connections, and crossed wires.The modules of the PLC Applications Series can be interconnected with those of other training systems for interdisciplinary training applications. Connections are made using flexible, PVC-insulated connecting leads terminated with 2 mm plugs. The control circuits operate at 24 V dc and are compatible with a variety of PLCs.The PLC Applications series is divided into seven systems, each system covering a specific topic related to PLC controls.CoursewareEach manual of the PLC Applications Series concentrates on a specific utilization of a PLC, starting with a familiarzation and evolving into more complex concepts and troubleshooting. With each manual, new components are introduced to create different learning opportunities.The PLC Applications series courseware consists of one student manual and one instructor guide per application. The student manuals are divided into job sheets detailing relevant information and providing clearly stated objectives and procedure steps. The instructor guides contain ladder programs and answer keys for all exercises and questions in the student manuals.Please refer to the Table of Contents of the Manual(s) section of this datasheet for a list of the topics covered in each manual.PLC CompatibilityPLC Applications, LabVolt Series•••••Topic CoverageTraffic LightsElectro-PneumaticsElectro-Mechanical – DC MotorElectro-Mechanical – Stepper Motor Wind TurbinePLC RequirementsPLC Applications, LabVolt Series••••••••••Level Process Control Bottling ProcessFeatures & BenefitsRealistic applications to help students understand PLC principles and concepts Safe equipmentApplications can be interconnected with other equipment for interdisciplinary training Tabletop, cost-effective applications integrating realistic components Comprehensive curriculum included with each applicationHighly modular systems – accessories are available for more complex applications Fault-insertion capability for troubleshootingPLC sold separately (customers can also use their own)List of Available Training SystemsQty Description Model number1Traffic Light Training System _______________________________________________________ 582532 (8075-10)1Electro-Pneumatic Training System _________________________________________________ 588682 (8075-20)1Wind Turbine Training System _____________________________________________________ 582542 (8075-50)Available Training SystemsTraffic Light Training System 582532 (8075-10)The Traffic Light Training System is a classic PLC training system allowing the implementation of vehicle and pedestrian traffic control at an intersection.•••••••••PLC CompatibilityListed below are the PLC compatibilities with the Traffic Light Training System, Model 8075-1.Advanced PLC Training System (Rockwell Automation), Models 3355-0Advanced PLC Training System (Siemens), Models 3355-APLC Allen-Bradley MicroLogix 1500, Model 3240-3: Full compatibility PLC Allen-Bradley MicroLogix 1200, Model 3240-4: Full compatibilityPLC Allen-Bradley MicroLogix 1100, Model 3240-A: Partial compatibility only PLC Siemens ET200S IM151-8, Model 3240-B: Full compatibilityPLC Siemens ET200S IM151-8 (with Case), Model 3240-C: Full compatibility PLC Siemens S7-222, Model 3270-6: Partial compatibility onlyPLC Allen-Bradley MicroLogix 1100, Model 3270-7: Partial compatibility onlyPLC Applications, LabVolt Series••••••••••••••Features & BenefitsA well-known classic training systemN-S/E-W traffic control with pedestrian crossingAnother unit can be added to create a full, four-directions traffic light Flow management with proximity detectors (optional)Traffic light synchronizationFault-insertion capability for troubleshooting LEDs (long life)Fitted with ten 24 V dc control inputs Includes job sheetsList of EquipmentQty Description Model number1PLC Applications (Job Sheets - Student) ____________________________________________ 580490 (85249-20)1PLC Applications (Job Sheets - Instructor) ___________________________________________ 580491 (85249-30)1Traffic Light Module ______________________________________________________________ 582185 (3291-00)List of ManualsDescriptionManual numberPLC Applications (Workbook) ________________________________________________________580490 (85249-20)PLC Applications (Workbook (Instructor)) ______________________________________________580491 (85249-30)Table of Contents of the Manual(s)PLC Applications (Workbook) (580490 (85249-20))1 Basic Traffic Light System2 Sequencer Operation3 Proximity Detector and Pushbutton4 Troubleshooting5 Optional ProjectSystem SpecificationsParameterValuePLC Requirements - Inputs 24 V dc3PLC Requirements - Outputs 24 V dc10Physical Characteristics Intended Location On a tableDimensions (H x W x D)480 x 730 x 390 mm (18.9 x 28.7 x 15.4 in)Net WeightTBEPLC Applications, LabVolt Series••••••••Electro-Pneumatic Training System 588682 (8075-20)The Electro-Pneumatic Training System uses a PLC to control a variety of pneumatic industrial applications.Features & BenefitsTwo double-acting cylindersTwo reed switches and mechanical limit switch for PLC feedback Perforated work surfaceControl valve station featuring single- and double-solenoid valves Applications: stamping, hold and punch, filling process, etc.Fault-insertion capability for troubleshootingAccepts three 24 V dc control signals from the PLC Includes job sheetsList of EquipmentQty Description Model number1PLC Applications (Job Sheets - Student) ____________________________________________ 585088 (85250-20)1PLC Applications (Job Sheets - Instructor) ___________________________________________ 585089 (85250-30)1Pressure Regulator ______________________________________________________________ 587527 (3216-00)1Electro-Pneumatic Valve Island ____________________________________________________ 587528 (3217-00)1Electro-Pneumatic Module ________________________________________________________ 587572 (3292-00)1Storage/Work Surface ___________________________________________________________ 582357 (6309-00)List of ManualsDescriptionManual numberPLC Applications (Workbook) _________________________________________________________585088 (85250-20)PLC Applications (Workbook (Instructor)) _______________________________________________585089 (85250-30)•••••••PLC CompatibilityListed below are the PLC compatibilities with the Electro-Pneumatic Training System, Model 8075-2.PLC Allen-Bradley MicroLogix 1500, Model 3240-3: Full compatibility PLC Allen-Bradley MicroLogix 1200, Model 3240-4: Full compatibility PLC Allen-Bradley MicroLogix 1100, Model 3240-A: Full compatibility PLC Siemens ET200S IM151-8, Model 3240-B: Full compatibilityPLC Siemens ET200S IM151-8 (with Case), Model 3240-C: Full compatibility PLC Siemens S7-222, Model 3270-6: Full compatibilityPLC Allen-Bradley MicroLogix 1100, Model 3270-7: Full compatibility1 60 l/minute.PLC Applications, LabVolt Series•••••Table of Contents of the Manual(s)PLC Applications (Workbook) (585088 (85250-20))1 Familiarization with the Electro-Pneumatic System2 Single Cylinder Control3 Clamp and Work Operation4 Troubleshooting5 Optional Project (Optimization)Additional Equipment Required to Perform the Exercises (Purchased separately)Qty Description Model number1Compressor ___________________________________________________________________ 588108 (6410-C0)11Conditioning Unit (Single Port) _____________________________________________________ 588111 (6411-A0)System SpecificationsParameterValuePLC Requirements - Inputs 24 V dc5PLC Requirements - Outputs 24 V dc4Physical Characteristics Intended Location On a tableDimensions (H x W x D)370 x 1160 x 590 mm (14.6 x 45.7 x 23.2 in)Net WeightTBE Wind Turbine Training System 582542 (8075-50)The Wind Turbine Training System uses a PLC to monitor the speed and direction of the wind and control the position of the wind turbine nacelle.PLC Applications, LabVolt Series•••••••••••••Features & BenefitsSystem comprised of a Nacelle Simulator, Model 3297, and a Wind Generator, Model 3213Small blower for generating air flowNacelle equipped with dc motor and mechanical clutch Two limit switches with NO and NC contactsAnalog position sensor for determining wind direction (0-10 V)Variable-frequency pulse-train signal for measuring wind speed (24 V dc)Requires an external 24 V power supplyAccepts two 24 V dc control signals from the PLC for motor operation Includes job sheetsList of EquipmentQty Description Model number1PLC Applications (Job Sheets - Student) ____________________________________________ 580499 (85303-20)1PLC Applications (Job Sheets - Instructor) ___________________________________________ 580501 (85303-30)1Wind Generator _________________________________________________________________ 582179 (3213-00)1Nacelle Simulator _______________________________________________________________ 582189 (3297-00)List of ManualsDescriptionManual numberPLC Applications (Workbook) _________________________________________________________580499 (85303-20)PLC Applications (Workbook (Instructor)) _______________________________________________580501 (85303-30)Table of Contents of the Manual(s)PLC Applications (Workbook) (580499 (85303-20))1 Familiarization with the Wind Turbine2 Wind Tracking3 Full Nacelle Operation4 Troubleshooting•••••••PLC CompatibilityListed below are the PLC compatibilities with the Wind Turbine Training System, Model 8075-5.PLC Allen-Bradley MicroLogix 1500, Model 3240-3: Full compatibility, but requires the Analog I/O Expansion Kit, Model 3244-3PLC Allen-Bradley MicroLogix 1200, Model 3240-4: Full compatibility, but requires the Analog I/O Expansion Kit, Model 3244-4PLC Allen-Bradley MicroLogix 1100, Model 3240-A: Full compatibilityPLC Siemens ET200S IM151-8, Model 3240-B: Full compatibility, but requires the Analog I/O Expansion Kit, Model 3244-BPLC Siemens ET200S IM151-8 (with Case), Model 3240-C: Full compatibility, but requires the Analog I/O Expansion Kit, Model 3244-CPLC Siemens S7-222, Model 3270-6: Not recommendedPLC Allen-Bradley MicroLogix 1100, Model 3270-7: Full compatibilityPLC Applications, LabVolt SeriesSystem SpecificationsParameter ValuePLC Requirements - Inputs24 V dc60-10 V dc / 4-20 mA1PLC Requirements - Outputs24 V dc2Physical CharacteristicsIntended Location On a tableDimensions (H x W x D)310 x 870 x 210 mm (12.2 x 34.3 x 8.3 in)Net Weight TBEEquipment DescriptionWind Generator582179 (3213-00)The Wind Generator includes a small blower producing aconstant air flow. This sturdy and reliable device is designed tobe used with the Wind Turbine Training System, Model 8075-5.SpecificationsParameter ValuePower Requirements24 V dc - 1.1 ANominal Speed2500 r/minMaximum Air Flow28.3 L/s (60 CFM)Physical CharacteristicsDimensions (H x W x D)207 x 186 x 230 mm (8.1 x 7.3 x 9.1 in)Net Weight 3.0 kg (6.6 lb)Pressure Regulator587527 (3216-00)The Pressure Regulator offers two different air flow paths: onenot regulated and one limited in pressure. A rotary knob and anair gauge make it simple to regulate the pressure to the desiredvalue, thus limiting the pressure sent to the Electro-PneumaticTraining System, Model 8075-2.SpecificationsParameter ValuePressure Range0-830 kPa (0-120 psi)Gauge Range0-1100 kPa (0-160 psi)Physical CharacteristicsDimensions (H x W x D)95 x 120 x 120 mm (3.7 x 4.7 x 4.7 in)Net Weight0.5 kg (1.1 lb)Electro-Pneumatic Valve Island587528 (3217-00)The Electro-Pneumatic Valve Island comprises two 4-way/2-position valves with common input and exhaust ports. One valveis operated by two solenoids and the other by a single solenoidand a spring return. The solenoids are actuated by 24 V dcsignals.SpecificationsParameter ValueValves1 double solenoid1 single solenoid with spring returnOperating Pressure Up to 830 kPa (120 psi)Piloting Pressure300-830 kPa (43-120 psi)Coil Voltage24 V dcFault Switches4Physical CharacteristicsDimensions (H x W x D)85 x 220 x 170 mm (3.3 x 8.7 x 6.7 in)Net Weight 1.7 kg (3.7 lb)Traffic Light Module582185 (3291-00)The Traffic Light Module reproduces a two-way traffic light,complete with pedestrian signals and the possibility to simulatebroken lights. Its realistic appearance and functionalities helpmake the Traffic Light Training System, Model 8075-1, vivid andcompelling to students. The addition of a second unit creates afull, four-direction traffic light.SpecificationsParameter ValueLightsNumber10 (2 green, 2 yellow, 2 red, 2 walk, 2 don’t walk)Type LEDVoltage24 V dcFault Switches8Physical CharacteristicsDimensions (H x W x D)495 x 370 x 326 mm (19.5 x 14.6 x 12.8 in)Net Weight 5.6 kg (12.4 lb)Electro-Pneumatic Module587572 (3292-00)The Electro-Pneumatic Module and the associated equipmentenable stamping, hold-and-punch, and filling operations. Themodule features two pneumatic cylinders arranged so as todistribute a programmed number of marbles from two tubes(feed lines) into a container. A second configuration allowsstudents to perform a clamp-and-work operation on a planematerial, such a sheet of paper. Two reed switches and one limitswitch are installed to provide feedback on the cylinders'positions.SpecificationsParameter ValueReed Switches (2)Contact Type NOParameter ValueContact Rating30 mA - 24 V dcLimit SwitchContact Type NOContact Rating 1 A - 24 V dcCylinders (2)Max Pressure1700 kPa (250 psi)Physical CharacteristicsDimensions (H x W x D)410 x 320 x 120 mm (16.1 x 12.6 x 4.7 in)Net Weight 3.1 kg (6.8 lb)Nacelle Simulator582189 (3297-00)The Nacelle Simulator replicates the main functionalities of a wind turbine. Itis designed to measure the speed and direction of the wind so that a PLC cancontrol the position of the nacelle to optimize its operation. Two limitswitches with NO and NC contacts allow monitoring of the number ofrotations of the nacelle.SpecificationsParameter ValuePower Requirements24 V dc - 0.6 AMotor RatingsPower 3.04 WMax Speed 4.2 r/minAnalog Wind Direction Output0-10 V dcWind Speed Output24 V dcTurn Counter Switch Ratings 2 A - 24 V dcTurn Limit Switch Ratings0.1 A - 24 V dcPhysical CharacteristicsDimensions (H x W x D)397 x 235 x 140 mm (15.6 x 9.3 x 5.5 in)Net Weight 2.9 kg (6.4 lb)Storage/Work Surface582357 (6309-00)The Storage/Work Surface is a perforated metal plate on whichthe equipment is placed. Two work surfaces can be joined usingSpacers.SpecificationsParameter ValuePhysical CharacteristicsDimensions (H x W x D)30 x 590 x 590 mm (1 x 23 x 23 in)Net Weight 5 kg (11 lb)Optional Equipment DescriptionCompressor (Optional)588108 (6410-C0)The Air Compressor is a quiet device well suited for classroom andschool laboratories. The Air Compressor can be used to providecompressed air to different components. A conditioning unit, Model6411-A, must be connected to the compressor for certainapplications.The Circulator Pump is available in different variants depending onac power network voltages and frequencies. Because of this, theactual module may vary from the one shown in the picture.Conditioning Unit (Single Port) (Optional)588111 (6411-A0)The Conditioning Unit (Single Port) conditions and regulates thepressure of the air supplied to the pneumatic circuits. It consists ofa main shutoff valve, filter, a pressure regulator, pressure gauge,sleeve valve, and a muffler. The Conditioning Unit (Single Port)requires compressed air from a central air supply or a portable unit.SpecificationsParameter ValueRecommended Compressed Air SupplyFlow Rate28 L/min (1 SCFM)Pressure207 kPa (30 psi)Filter RegulatorMaximum Air Flow Rate550 L/min (19 SCFM)Operating Pressure48-690 kPa (7-100 psi)Filtration 5 μm (0002 in)Pressure GaugeDiameter50 mm (2 in)Operating Pressure0-690 kPa (0-100 psi)Physical CharacteristicsDimensions (H x W x D)75 x 170 x 120 mm (3 x 6.7 x 4.7 in)Net Weight 1.6 kg (3.6 lb)Reflecting the commitment of Festo Didactic to high quality standards in product, design, development, production, installation, and service, our manufacturing and distribution facility has received the ISO 9001 certification.Festo Didactic reserves the right to make product improvements at any time and without notice and is not responsible for typographical errors. Festo Didactic recognizes all product names used herein as trademarks or registered trademarks of their respective holders. © Festo Didactic Inc. 2023. All rights reserved.Festo Didactic SERechbergstrasse 373770 DenkendorfGermanyP. +49(0)711/3467-0F. +49(0)711/347-54-88500Festo Didactic Inc.607 Industrial Way WestEatontown, NJ 07724United StatesP. +1-732-938-2000F. +1-732-774-8573Festo Didactic Ltée/Ltd675 rue du CarboneQuébec QC G2N 2K7CanadaP. +1-418-849-1000F. +1-418-849-1666。
CD74ACT08M96,CD74ACT08M96,CD74ACT08M,CD74ACT08M96,CD74ACT08M96,CD74ACT08M96, 规格书,Datasheet 资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)CD54ACT08F3A ACTIVE CDIP J 141TBD A42N /A for Pkg Type CD74ACT08E ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type CD74ACT08EE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type CD74ACT08M ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT08M96ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT08M96E4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT08M96G4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT08ME4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT08MG4ACTIVESOICD1450Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemptionfor either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and 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the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are 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柠檬酸裂解酶ELISA试剂盒使用说明书
柠檬酸裂解酶（CL）ELISA试剂盒使用说明书南京森贝伽现货供应，质量保证，价格优惠，试剂盒首选森贝伽。
本试剂仅供研究使用目的：本试剂盒用于测定微生物样本中柠檬酸裂解酶（CL）的活性。
实验原理：本试剂盒应用双抗体夹心法测定标本中柠檬酸裂解酶（CL）水平。
用纯化的柠檬酸裂解酶（CL）抗体包被微孔板，制成固相抗体，往包被单抗的微孔中依次加入柠檬酸裂解酶（CL），再与HRP标记的柠檬酸裂解酶（CL ）抗体结合，形成抗体-抗原-酶标抗体复合物，经过彻底洗涤后加底物TMB显色。
TMB在HRP酶的催化下转化成蓝色，并在酸的作用下转化成最终的黄色。
颜色的深浅和样品中的柠檬酸裂解酶（CL）呈正相关。
用酶标仪在450nm波长下测定吸光度（0D值），通过标准曲线计算样品中柠檬酸裂解酶（CL）活性浓度。
b5E2RGbCAP样本处理及要求：1•血清：室温血液自然凝固10-20分钟，离心20分钟左右（2000-3000转份）。
仔细收集上清，保存过程中如出现沉淀，应再次离心。
p1EanqFDPw2. 血浆：应根据标本的要求选择EDTA或柠檬酸钠作为抗凝剂，混合10-20分钟后，离心20分钟左右（2000-3000转/分）。
仔细收集上清，保存过程中如有沉淀形成，应该再次离心。
DXDiTa9E3d 3. 尿液：用无菌管收集，离心20分钟左右（2000-3000转份）。
仔细收集上清，保存过程中如有沉淀形成，应再次离心。
胸腹水、脑脊液参照实行。
RTCrpUDGiT4. 细胞培养上清：检测分泌性的成份时，用无菌管收集。
离心20分钟左右（2000-3000转/分）。
仔细收集上清。
检测细胞内的成份时，用PBS（PH7.2-7.4 ）稀释细胞悬液，细胞浓度达到100万/ml左右。
通过反复冻融，以使细胞破坏并放出细胞内成份。
离心20分钟左右（2000-3000 转/分）。
仔细收集上清。
保存过程中如有沉淀形成，应再次离心。
5PCzVD7HxA 5. 组织标本：切割标本后，称取重量。
7406芯片
Hitachi CodeJEDECEIAJWeight (reference value)DP-14ConformsConforms0.97 gUnit: mmHitachi CodeJEDECEIAJWeight (reference value)FP-14DA—Conforms0.23 gUnit: mm*Dimension including the plating thickness Base material dimension° – 8°Hitachi Code JEDEC EIAJ Weight (reference value)FP-14DN Conforms Conforms0.13 gUnit: mm°– 8°*Pd platingCautions 1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you havereceived the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularlyfor maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document withoutwritten approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi Tower Singapore 049318Tel: 535-2100Fax: 535-1533URL NorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham RoadMaidenheadBerkshire SL6 8YA, United KingdomTel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor(America) Inc.179 East Tasman Drive,San Jose,CA 95134Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。
SN74LS07 六路高电压开关集成电路数据手册说明书
AYCopyright © 2016Texas Instruments IncorporatedProductFolderSample &BuyTechnicalDocuments Tools &SoftwareSupport &CommunityAn IMPORTANT NOTICE at the end of this data sheet addresses availability,warranty,changes,use in safety-critical applications,intellectual property matters and other important disclaimers.PRODUCTION DATA.SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016SN74LS07Hex Buffers and Drivers With Open-Collector High-Voltage Outputs1Features•Convert TTL Voltage Levels to MOS Levels •High Sink-Current Capability •Input Clamping Diodes Simplify System Design•Open-Collector Driver for Indicator Lamps and Relays2Applications•AV Receivers•Audio Docks:Portable•Blu-ray Players and Home Theaters •MP3Players or Recorders•Personal Digital Assistants (PDA)•Power:Telecom/Server AC/DC Supply:Single Controller:Analog and Digital•Solid-State Drives (SSD):Client and Enterprise •TVs:LCD,Digital,and High-Definition (HDTV)•Tablets:Enterprise •Video Analytics:Server•Wireless Headsets,Keyboards,and Mice3DescriptionThese hex buffers and drivers feature high-voltage open-collector outputs to interface with high-level circuits or for driving high-current loads.They are also characterized for use as buffers for driving TTL inputs.The SN74LS07devices have a rated output voltage of 30V.The maximum sink current is 40mA.These circuits are compatible with most TTL families.Inputs are diode-clamped to minimize transmission-line effects,which simplifies design.Typical power dissipation is 140mW,and average propagation delay time is 12ns.Device Information (1)PART NUMBER PACKAGE (PINS)BODY SIZE (NOM)SN74LS07D SOIC (14)8.65mm ×3.90mm SN74LS07DB SSOP (14) 6.20mm ×5.30mm SN74LS07N PDIP (14)19.30mm ×6.35mm SN74LS07NSSO (14)10.30mm ×5.30mm(1)For all available packages,see the orderable addendum atthe end of the data sheet.Logic Diagram (Positive Logic)2SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments IncorporatedTable of Contents1Features ..................................................................12Applications ...........................................................13Description .............................................................14Revision History .....................................................25Pin Configuration and Functions . (36)Specifications .........................................................46.1Absolute Maximum Ratings......................................46.2ESD Ratings..............................................................46.3Recommended Operating Conditions.......................46.4Thermal Information..................................................46.5Electrical Characteristics...........................................56.6Switching Characteristics..........................................56.7Typical Characteristics..............................................57Parameter Measurement Information ..................68Detailed Description . (7)8.1Overview...................................................................78.2Functional Block Diagram.. (7)8.3Feature Description...................................................78.4Device Functional Modes (7)9Application and Implementation (8)9.1Application Information..............................................89.2Typical Application. (8)10Power Supply Recommendations .......................911Layout . (10)11.1Layout Guidelines.................................................1011.2Layout Example. (10)12Device and Documentation Support (11)12.1Documentation Support........................................1112.2Community Resource............................................1112.3Trademarks...........................................................1112.4Electrostatic Discharge Caution............................1112.5Glossary................................................................1113Mechanical,Packaging,and OrderableInformation (11)4Revision HistoryNOTE:Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision C (February 2004)to Revision D Page•Added Device Information table,ESD Ratings table,Feature Description section,Device Functional Modes ,Application and Implementation section,Power Supply Recommendations section,Layout section,Device andDocumentation Support section,and Mechanical,Packaging,and Orderable Information section .....................................1•Deleted SN54LS07and SN74LS17from the data sheet because they are obsolete and no longer supplied......................1•Deleted Ordering Information table (1)1A VCC1Y 6A 2A 6Y 2Y 5A 3A 5Y 3Y 4A GND4Y3SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated 5Pin Configuration and FunctionsD,DB,N,or NS Packages 14-Pin SOIC,SSOP,PDIP,SOTop ViewPin FunctionsPINI/O DESCRIPTION 11A I Input 121Y O Output 132A I Input 242Y O Output 253A I Input 363Y O Output 37GND —Ground pin 84Y O Output 494A I Input 4105Y O Output 5115A I Input 5126Y O Output 6136A I Input 614V CC—Power pin4SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions .Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to GND.(3)This is the maximum voltage that should be applied to any output when it is in the off state.6Specifications6.1Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)MINMAX UNIT V CC Supply voltage 7V V I Input voltage (2)7V V O Output voltage (2)(3)30V T J Operating virtual junction temperature 150°C T stg Storage temperature–65150°C(1)JEDEC document JEP155states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.2ESD RatingsVALUEUNIT V (ESD)Electrostatic dischargeHuman-body model (HBM),per ANSI/ESDA/JEDEC JS-001(1)±2000VCharged-device model (CDM),per JEDEC specification JESD22-C101(2)±1000(1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.See the TI application report,Implications of Slow or Floating CMOS Inputs ,SCBA004.6.3Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)(1)MINNOMMAX UNIT V CC Supply voltage 4.7555.25V V IH High-level input voltage 2V V IL Low-level input voltage 0.8V V OH High-level output voltage 30V I OL Low-level output current 40mA T A Operating free-air temperature070°C(1)For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics application report,SPRA953.6.4Thermal InformationTHERMAL METRIC (1)SN74LS07UNITD (SOIC)DB (SSOP)N (PDIP)NS (SO)14PINS14PINS 14PINS 14PINS R θJA Junction-to-ambient thermal resistance 85.297.450.282.8°C/W R θJC(top)Junction-to-case (top)thermal resistance 43.549.837.540.9°C/W R θJB Junction-to-board thermal resistance 39.744.53041.4°C/W ψJT Junction-to-top characterization parameter 10.916.522.312.4°C/W ψJB Junction-to-board characterization parameter39.44429.941.1°C/W12345678910010203040506070t P L H (n s )Temperature (ƒC)C0035SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated (1)For conditions shown as MIN or MAX,use the appropriate value specified under recommended operating conditions.(2)I OL =40mA6.5Electrical Characteristicsover recommended operating free-air temperature range (unless otherwise noted)PARAMETER TEST CONDITIONS (1)MINTYPMAX UNIT V IK V CC =MIN,I I =–12mA–1.5V I OH V CC =MIN,V IH =2V V OH =30V 0.25mA V OL V CC =MIN,V IL =0.8V I OL =16mA 0.4V I OL =MAX (2)0.7I I V CC =MAX,V I =7V 1mA I IH V CC =MAX,V I =2.4V 20µA I IL V CC =MAX,V I =0.4V –0.2mA I CCH V CC =MAX 14mA I CCL V CC =MAX45mA6.6Switching CharacteristicsV CC =5V,T A =25°C (see Figure 2)PARAMETER FROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH AYR L =110Ω,C L =15pF610nst PHL19306.7Typical CharacteristicsFigure 1.t PLH vs.Temperaturett LOAD CIRCUITFOR 3-STATE OUTPUTSHigh-LevelPulseLow-LevelPulseVOLTAGE WAVEFORMSPULSE DURATIONSInputOut-of-PhaseOutput (see Note D)3 V0 VV OLV OH V OH V OL In-Phase Output (see Note D)VOLTAGE WAVEFORMS PROPAGATION DELAY TIMESV Test PointFrom Output Under TestC (see Note LOAD CIRCUITFOR OPEN-COLLECTOR OUTPUTSLOAD CIRCUITFOR 2-STATE TOTEM-POLE OUTPUTS (see Note B)V LFrom Output Under TestTest (see Note B)V CCFrom Output Under Test (see Note S1S23 V3 V0 V 0 VVOLTAGE WAVEFORMS SETUP AND HOLD TIMESTiming InputData Input3 V0 VOutput Control (low-level enabling)Waveform 1(see Notes Cand D)Waveform 2(see Notes Cand D)≈1.5 V V OH −0.5 V V OL + 0.5 V≈1.5 V VOLTAGE WAVEFORMSENABLE AND DISABLE TIMES,3-STATE OUTPUTS6SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated7Parameter Measurement InformationA.C L includes probe and jig capacitance.B.All diodes are 1N3064or equivalent.C.Waveform 1is for an output with internal conditions such that the output is low,except when disabled by the output control.Waveform 2is for an output with internal conditions such that the output is high,except when disabled by the output control.D.S1and S2are closed for t PLH ,t PHL ,t PHZ ,and t PLZ ;S1is open and S2is closed for t PZH ;S1is closed and S2is open for t PZL .E.Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.F.All input pulses are supplied by generators having the following characteristics:PRR ≤1MHz,Z O ≈50Ω,t r ≤1.5ns,t f ≤2.6ns.G.The outputs are measured one at a time,with one input transition per measurement.Figure 2.Load Circuits and Voltage WaveformsAYCopyright © 2016Texas Instruments IncorporatedInputV CCOutputGNDCopyright © 2016,Texas Instruments Incorporated7SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated 8Detailed Description8.1OverviewThe outputs of the SN74LS07device are open-collector and can be connected to other open-collector outputs to implement active-low wired-OR or active-high wired-AND functions.The maximum sink current for the SN74LS07is 40mA.Inputs can be driven from 2.5-V,3.3-V (LVTTL),or 5-V (CMOS)devices.This feature allows the use of this device as translators in a mixed-system environment.Resistor values shown are nominal.Figure 3.Schematic (Gate)8.2Functional Block Diagram8.3Feature Description•Allows for up translation–Inputs accept voltages to 5.25V –Outputs accept voltages to 30V •High Sink-Current Capability –Up to 40mA8.4Device Functional ModesTable 1lists the functions of this device.Table 1.Function TableINPUT AOUTPUT YH Hi-Z LLCopyright © 2016, Texas Instruments Incorporated8SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated9Application and ImplementationNOTEInformation in the following applications sections is not part of the TI component specification,and TI does not warrant its accuracy or completeness.TI’s customers are responsible for determining suitability of components for their purposes.Customers should validate and test their design implementation to confirm system functionality.9.1Application InformationThe SN74LS07device is a high-drive,open-drain CMOS device that can be used for a multitude of buffer-type functions.It can produce 40mA of drive current at 5V.Therefore,this device is ideal for driving multiple inputs.The inputs are 5.25-V tolerant and outputs are 30-V tolerant.9.2Typical ApplicationMultiple channels of the SN74LS07device can be used to create a positive AND logic function,as shown in Figure 4.Additionally,the SN74LS07device can be used to drive an LED by sinking up to 40mA,which may be more than the previous stage can sink.Figure 4.Typical Application Diagram9.2.1Design RequirementsEnsure that the inputs are in a known state as defined by V IH and V IL noted in Recommended Operating Conditions ,or else the outputs may be in an unknown state.9.2.2Detailed Design Procedure 1.Recommended Input Conditions–For specified high and low level,see V IH and V IL in Recommended Operating Conditions .–Inputs are overvoltage tolerant allowing them to go as high as 5.25V.2.Recommend Output Conditions–Load currents must not exceed 40mA per output.–Outputs must not be pulled above 30V.1313.213.413.613.81414.214.414.614.815010203040506070t P H L (n s )Temperature (ƒC)C0049SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated Typical Application (continued)9.2.3Application CurveFigure 5.t PHL vs Temperature10Power Supply RecommendationsThe power supply can be any voltage between the minimum and maximum supply voltage rating indicated in Recommended Operating Conditions .Each V CC pin must have a good bypass capacitor to prevent power disturbance.For devices with a single supply,TI recommends a 0.1-µF capacitor;if there are multiple V CC pins,then TI recommends either a 0.01-µF or 0.022-µF capacitor for each power pin.It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise.A 0.1-µF and a 1-µF capacitor are commonly used in parallel.The bypass capacitor must be installed as close to the power pin as possible for best results.V ccInputOutputInputOutput10SN74LS07SDLS021D–MAY1990–REVISED Product Folder Links:SN74LS07Submit Documentation Feedback Copyright©1990–2016,Texas Instruments Incorporated 11Layout11.1Layout GuidelinesWhen using multiple bit logic devices,inputs must never float.In many cases,functions or parts of functions of digital logic devices are unused,for example,when only two inputs of a triple-input AND gate are used or only3of the4buffer gates are used.Such input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states.Figure6specifies the rules that must be observed under all circumstances.All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating.The logic level that must be applied to any particular unused input depends on the function of the device.Generally they are tied to GND or V CC,whichever makes more sense or is more convenient.It is generally acceptable to float outputs,unless the part is a transceiver.11.2Layout Exampleyout DiagramSN74LS07 SDLS021D–MAY1990–REVISED APRIL201612Device and Documentation Support12.1Documentation Support12.1.1Related DocumentationFor related documentation see the followign:Implications of Slow or Floating CMOS Inputs,SCBA00412.2Community ResourceThe following links connect to TI community resources.Linked contents are provided"AS IS"by the respective contributors.They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™Online Community TI's Engineer-to-Engineer(E2E)Community.Created to foster collaboration among engineers.At ,you can ask questions,share knowledge,explore ideas and helpsolve problems with fellow engineers.Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.12.3TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.12.4Electrostatic Discharge CautionThese devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.12.5GlossarySLYZ022—TI Glossary.This glossary lists and explains terms,acronyms,and definitions.13Mechanical,Packaging,and Orderable InformationThe following pages include mechanical,packaging,and orderable information.This information is the most current data available for the designated devices.This data is subject to change without notice and revision of this document.For browser-based versions of this data sheet,refer to the left-hand navigation.PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.Addendum-Page 1(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS07DR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)SN74LS07DR SOIC D142500367.0367.038.0MECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001DB (R-PDSO-G**)PLASTIC SMALL-OUTLINE4040065/E 12/0128 PINS SHOWNGage Plane8,207,400,550,950,253812,9012,302810,50248,50Seating Plane9,907,903010,509,900,385,605,00150,2214A 28120166,506,50140,05 MIN 5,905,90DIMA MAX A MIN PINS **2,00 MAX 6,907,500,65M 0,150°–ā8°0,100,090,25NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion not to exceed 0,15.D.Falls within JEDEC MO-150IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA(INCLUDING DATASHEETS),DESIGN RESOURCES(INCLUDING REFERENCE DESIGNS),APPLICATION OR OTHER DESIGN ADVICE,WEB TOOLS,SAFETY INFORMATION,AND OTHER RESOURCES“AS IS”AND WITH ALL FAULTS,AND DISCLAIMS ALL WARRANTIES,EXPRESS AND IMPLIED,INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products.You are solely responsible for(1)selecting the appropriate TI products for your application,(2)designing,validating and testing your application,and(3)ensuring your application meets applicable standards,and any other safety,security,or other requirements.These resources are subject to change without notice.TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource.Other reproduction and display of these resources is prohibited.No license is granted to any other TI intellectual property right or to any third party intellectual property right.TI disclaims responsibility for,and you will fully indemnify TI and its representatives against,any claims, damages,costs,losses,and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale(/legal/termsofsale.html)or other applicable terms available either on or provided in conjunction with such TI products.TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2019,Texas Instruments Incorporated。
CY6414
C YCOLOY™ Resin CY6414E urope-Africa-Middle East: COMMERCIALFlame retardant modified PC blend using non-brominated and non-chlorinated flame retardant systems, offering high heat for application in appliances, lighting and electrical market.TYPICAL PROPERTIES¹TYPICAL VALUE Unit StandardM ECHANICALT ensile Stress, yld, Type I, 50 mm/min650k gf/cm²A STM D 638T ensile Stress, brk, Type I, 50 mm/min 630k gf/cm²A STM D 638T ensile Strain, yld, Type I, 50 mm/min 6%A STM D 638T ensile Strain, brk, Type I, 50 mm/min 85%A STM D 638T ensile Modulus, 5 mm/min23700k gf/cm²A STM D 638T ensile Stress, yield, 50 mm/min 66M Pa I SO 527T ensile Stress, break, 50 mm/min 67M Pa I SO 527T ensile Strain, yield, 50 mm/min 5.7%I SO 527T ensile Strain, break, 50 mm/min >100%I SO 527T ensile Modulus, 1 mm/min 2420M Pa I SO 527F lexural Stress, yield, 2 mm/min 96M Pa I SO 178F lexural Modulus, 2 mm/min2470M Pa I SO 178I MPACTIzod Impact, unnotched 80*10*4 +23°CN Bk J/m²I SO 180/1U Izod Impact, notched 80*10*4 +23°C 50k J/m²I SO 180/1A Izod Impact, notched 80*10*4 0°C 14k J/m²I SO 180/1A Izod Impact, notched 80*10*4 -30°C12k J/m²I SO 180/1A Charpy 23°C, V-notch Edgew 80*10*3 sp=62mm 28k J/m²I SO 179/1eA Charpy 0°C, V-notch Edgew 80*10*3 sp=62mm 17k J/m²I SO 179/1eA Charpy -30°C, V-notch Edgew 80*10*3 sp=62mm12k J/m²I SO 179/1eAT HERMALH DT, 1.82 MPa, 6.4 mm, unannealed118°C A STM D 648 CTE, -40°C to 40°C, flow7.E-051/°CI SO 11359-2Source GMD, last updated:PLEASE CONTACT YOUR LOCAL SALES OFFICE FOR AVAILABILITY IN YOUR AREADISCLAIMER : THE MATERIALS, PRODUCTS AND SERVICES OF SAUDI BASIC INDUSTRIES CORPORATION (SABIC) OR ITS SUBSIDIARIES OR AFFILIATES ( S ELLER ) ARE SOLD SUBJECT TO SELLER S STANDARD CONDITIONS OF SALE, WHICH ARE AVAILABLE UPON REQUEST. INFORMATION AND RECOMMENDATIONS CONTAINED IN THIS DOCUMENT ARE GIVEN IN GOOD FAITH. HOWEVER, SELLER MAKES NO EXPRESS OR IMPLIED REPRESENTATION, WARRANTY OR GUARANTEE (i) THAT ANY RESULTS DESCRIBED IN THIS DOCUMENT WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN OR APPLICATION INCORPORATING SELLER S MATERIALS, PRODUCTS, SERVICES OR RECOMMENDATIONS. UNLESS OTHERWISE PROVIDED IN SELLER SSTANDARD CONDITIONS OF SALE, SELLER SHALL NOT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS, SERVICES OR RECOMMENDATIONS DESCRIBED IN THIS DOCUMENT.Each user is responsible for making its own determination as to the suitability of Seller s materials, products, services or recommendations for the user s particular use through appropriate end-use and other testing and analysis.Nothing in any document or oral statement shall be deemed to alter or waive any provision of Seller s Standard Conditions of Sale or this Disclaimer, unless it is specifically agreed to in a writing signed by Seller. Statements by Seller concerning a possible use of any material, product, service or design do not, are not intended to, and should not be construed to grant any license under any patent or other intellectual property right of Seller or as a (1) Typical values only. Variations within normal tolerances are possible for various colors. All values aremeasured after at least 48 hours storage at 23°C/50% relative humidity. All properties, except the melt volume and melt flow rates, are measured on injection molded samples. All samples tested under ISO test standards are prepared according to ISO 294.(2) Only typical data for selection purposes. Not to be used for part or tool design.(3) This rating is not intended to reflect hazards presented by this or any other material under actual fire conditions.(4) Internal measurements according to UL standards.(5) Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.(6) Needs hard coat to consistently pass 60 sec Vertical Burn.C YCOLOY™ Resin CY6414E urope-Africa-Middle East: COMMERCIALTYPICAL PROPERTIES¹TYPICAL VALUE Unit StandardT HERMALCTE, -40°C to 40°C, xflow7.E-051/°C I SO 11359-2 Ball Pressure Test, 125°C +/- 2°CP ass -I EC 60695-10-2 Ball Pressure Test, 125°C +/- 2°C, by VDE P ass -I EC 60695-10-2V icat Softening Temp, Rate B/50133°C I SO 306V icat Softening Temp, Rate B/120134°C I SO 306H DT/Af, 1.8 MPa Flatw 80*10*4 sp=64mm 116°C I SO 75/Af R elative Temp Index, Elec105°C U L 746B R elative Temp Index, Mech w/impact 95°C U L 746B R elative Temp Index, Mech w/o impact100°C U L 746BP HYSICALM old Shrinkage, flow, 3.2 mm (5)0.4 - 0.8%S ABIC Method D ensity1.18g /cm³I SO 1183 Water Absorption, (23°C/sat)0.3%I SO 62 Moisture Absorption (23°C / 50% RH)0.1%I SO 62 Melt Volume Rate, MVR at 260°C/5.0 kg13c m³/10 min I SO 1133E LECTRICALR elative Permittivity, 1 kHz3.01-A STM D 150R elative Permittivity, 1 MHz 2.95-A STM D 150D issipation Factor, 1 kHz 0.0017-A STM D 150D issipation Factor, 1 MHz 0.0088-A STM D 150H ot Wire Ignition {PLC)2P LC Code U L 746A H igh Ampere Arc Ign, surface {PLC}1P LC Code U L 746A C omparative Tracking Index (UL) {PLC}3P LC Code U L 746A V olume Resistivity1.E+15O hm-cm I EC 60093S urface Resistivity, ROA4.E+16O hmI EC 60093DISCLAIMER : THE MATERIALS, PRODUCTS AND SERVICES OF SAUDI BASIC INDUSTRIES CORPORATION (SABIC) OR ITS SUBSIDIARIES OR AFFILIATES ( Each user is responsible for making its own determination as to the suitability of Seller Source GMD, last updated:PLEASE CONTACT YOUR LOCAL SALES OFFICE FOR AVAILABILITY IN YOUR AREAS ELLER ) ARE SOLD SUBJECT TO SELLER S STANDARD CONDITIONS OF SALE, WHICH ARE AVAILABLE UPON REQUEST. INFORMATION AND RECOMMENDATIONS CONTAINED IN THIS DOCUMENT ARE GIVEN IN GOOD FAITH. HOWEVER, SELLER MAKES NO EXPRESS OR IMPLIED REPRESENTATION, WARRANTY OR GUARANTEE (i) THAT ANY RESULTS DESCRIBED IN THIS DOCUMENT WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN OR APPLICATION INCORPORATING SELLER S MATERIALS, PRODUCTS, SERVICES OR RECOMMENDATIONS. UNLESS OTHERWISE PROVIDED IN SELLER SSTANDARD CONDITIONS OF SALE, SELLER SHALL NOT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS, SERVICES OR RECOMMENDATIONS DESCRIBED IN THIS DOCUMENT.s materials, products, services or recommendations for the user s particular use through appropriate end-use and other testing and analysis.Nothing in any document or oral statement shall be deemed to alter or waive any provision of Seller s Standard Conditions of Sale or this Disclaimer, unless it is specifically agreed to in a writing signed by Seller. Statements by (1) Typical values only. Variations within normal tolerances are possible for various colors. All values aremeasured after at least 48 hours storage at 23°C/50% relative humidity. All properties, except the melt volume and melt flow rates, are measured on injection molded samples. All samples tested under ISO test standards are prepared according to ISO 294.(2) Only typical data for selection purposes. Not to be used for part or tool design.(3) This rating is not intended to reflect hazards presented by this or any other material under actual fire conditions.(4) Internal measurements according to UL standards.(5) Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.(6) Needs hard coat to consistently pass 60 sec Vertical Burn.C YCOLOY™ Resin CY6414E urope-Africa-Middle East: COMMERCIALTYPICAL PROPERTIES¹TYPICAL VALUE Unit StandardE LECTRICALD issipation Factor, 1 MHz0.008-I EC 60250F LAME CHARACTERISTICSU L Recognized, 94V-0 Flame Class Rating (3)1.2m m U L 94U L Recognized, 94-5VB Rating (3)2.5m m U L 94Glow Wire Flammability Index 960°C, passes at, by VDE 0.75m m I EC 60695-2-12G low Wire Ignitability Temperature, 0.75 mm, by VDE 775°C I EC 60695-2-13G low Wire Ignitability Temperature, 1.5 mm, by VDE 775°C I EC 60695-2-13G low Wire Ignitability Temperature, 3.0 mm, by VDE 775°C I EC 60695-2-13O xygen Index (LOI)32%I SO 4589Source GMD, last updated:PLEASE CONTACT YOUR LOCAL SALES OFFICE FOR AVAILABILITY IN YOUR AREADISCLAIMER : THE MATERIALS, PRODUCTS AND SERVICES OF SAUDI BASIC INDUSTRIES CORPORATION (SABIC) OR ITS SUBSIDIARIES OR AFFILIATES ( S ELLER ) ARE SOLD SUBJECT TO SELLER S STANDARD CONDITIONS OF SALE, WHICH ARE AVAILABLE UPON REQUEST. INFORMATION AND RECOMMENDATIONS CONTAINED IN THIS DOCUMENT ARE GIVEN IN GOOD FAITH. HOWEVER, SELLER MAKES NO EXPRESS OR IMPLIED REPRESENTATION, WARRANTY OR GUARANTEE (i) THAT ANY RESULTS DESCRIBED IN THIS DOCUMENT WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN OR APPLICATION INCORPORATING SELLER S MATERIALS, PRODUCTS, SERVICES OR RECOMMENDATIONS. UNLESS OTHERWISE PROVIDED IN SELLER SSTANDARD CONDITIONS OF SALE, SELLER SHALL NOT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS, SERVICES OR RECOMMENDATIONS DESCRIBED IN THIS DOCUMENT.Each user is responsible for making its own determination as to the suitability of Seller s materials, products, services or recommendations for the user s particular use through appropriate end-use and other testing and analysis.Nothing in any document or oral statement shall be deemed to alter or waive any provision of Seller s Standard Conditions of Sale or this Disclaimer, unless it is specifically agreed to in a writing signed by Seller. Statements by (1) Typical values only. Variations within normal tolerances are possible for various colors. All values aremeasured after at least 48 hours storage at 23°C/50% relative humidity. All properties, except the melt volume and melt flow rates, are measured on injection molded samples. All samples tested under ISO test standards are prepared according to ISO 294.(2) Only typical data for selection purposes. Not to be used for part or tool design.(3) This rating is not intended to reflect hazards presented by this or any other material under actual fire conditions.(4) Internal measurements according to UL standards.(5) Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.(6) Needs hard coat to consistently pass 60 sec Vertical Burn.C YCOLOY™ Resin CY6414E urope-Africa-Middle East: COMMERCIALPROCESSING PARAMETERSTYPICAL VALUE UnitI njection MoldingD rying Temperature 90 - 100°C D rying Time2 - 4h rs M aximum Moisture Content 0.02%M elt Temperature 250 - 300°C N ozzle Temperature230 - 290°C F ront - Zone 3 Temperature 240 - 300°C M iddle - Zone 2 Temperature 230 - 290°C R ear - Zone 1 Temperature 210 - 260°C H opper Temperature 60 - 80°C M old Temperature60 - 90°CSource GMD, last updated:PLEASE CONTACT YOUR LOCAL SALES OFFICE FOR AVAILABILITY IN YOUR AREADISCLAIMER : THE MATERIALS, PRODUCTS AND SERVICES OF SAUDI BASIC INDUSTRIES CORPORATION (SABIC) OR ITS SUBSIDIARIES OR AFFILIATES ( S ELLER ) ARE SOLD SUBJECT TO SELLER S STANDARD CONDITIONS OF SALE, WHICH ARE AVAILABLE UPON REQUEST. INFORMATION AND RECOMMENDATIONS CONTAINED IN THIS DOCUMENT ARE GIVEN IN GOOD FAITH. HOWEVER, SELLER MAKES NO EXPRESS OR IMPLIED REPRESENTATION, WARRANTY OR GUARANTEE (i) THAT ANY RESULTS DESCRIBED IN THIS DOCUMENT WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN OR APPLICATION INCORPORATING SELLER S MATERIALS, PRODUCTS, SERVICES OR RECOMMENDATIONS. UNLESS OTHERWISE PROVIDED IN SELLER SSTANDARD CONDITIONS OF SALE, SELLER SHALL NOT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS, SERVICES OR RECOMMENDATIONS DESCRIBED IN THIS DOCUMENT.Each user is responsible for making its own determination as to the suitability of Seller s materials, products, services or recommendations for the user s particular use through appropriate end-use and other testing and analysis.Nothing in any document or oral statement shall be deemed to alter or waive any provision of Seller s Standard Conditions of Sale or this Disclaimer, unless it is specifically agreed to in a writing signed by Seller. Statements by (1) Typical values only. Variations within normal tolerances are possible for various colors. All values aremeasured after at least 48 hours storage at 23°C/50% relative humidity. All properties, except the melt volume and melt flow rates, are measured on injection molded samples. All samples tested under ISO test standards are prepared according to ISO 294.(2) Only typical data for selection purposes. Not to be used for part or tool design.(3) This rating is not intended to reflect hazards presented by this or any other material under actual fire conditions.(4) Internal measurements according to UL standards.(5) Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.(6) Needs hard coat to consistently pass 60 sec Vertical Burn.。
74HC(T)5555
DATA SHEETProduct specificationFile under Integrated Circuits, IC06September 199374HC/HCT5555Programmable delay timer with oscillatorFor a complete data sheet, please also download:•The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications •The IC06 74HC/HCT/HCU/HCMOS Logic Package Information •The IC06 74HC/HCT/HCU/HCMOS Logic Package OutlinesFEATURES•Positive and negative edge triggered•Retriggerable or non-retriggerable •Programmable delayminimum: 100 nsmaximum: depends on input frequency and division ratio •Divide-by range of 2 to 224•Direct reset terminates output pulse•Very low power consumption in triggered start mode•3 oscillator operating modes:–RC oscillator–Crystal oscillator–External oscillator•Device is unaffected by variations in temperature and V CC when using an external oscillator •Automatic power-ON reset •Schmitt trigger action on both trigger inputs•Direct drive for a power transistor •Low power consumption in active mode with respect to TTL type timers•High precision due to digital timing •Output capability: 20 mA•I CC category: MSI.APPLICATIONS•Motor control•Attic fan timers•Delay circuits•Automotive applications •Precision timing•Domestic appliances.GENERAL DESCRIPTIONThe 74HC/HCT5555 are high-speedSi-gate CMOS devices and are pincompatible with low power SchottkyTTL (LSTTL). They are specified incompliance with JEDEC standardno.7A.The 74HC/HCT5555 are precisionprogrammable delay timers whichconsist of:•24-stage binary counter•integrated oscillator (using externaltiming components)•retriggerable/non-retriggerablemonostable•automatic power-ON reset•output control logic•oscillator control logic•overriding asynchronous masterreset (MR).QUICK REFERENCE DATAGND = 0 V; T amb = 25°C; t r = t f = 6 ns.Notes1.C PD is used to determine the dynamic power dissipation (P D inµW):P D = C PD x V CC2 x f i +Σ(C L x V CC2 x f o) where:f i = input frequency in MHzf o = output frequency in MHzΣ(C L x V CC2 x f o) = sum of outputs.C L = output load capacitance in pFV CC = supply voltage in V2.For HC the condition is V I = GND to V CCFor HCT the condition is V I=GND to V CC−1.5 V.ORDERING INFORMATIONSYMBOL PARAMETER CONDITIONS TYP.UNIT t PHL/t PLH propagation delay C L = 15 pF;V CC= 5 VA,B to Q/Q2424nsMR to Q/Q1920nsRS to Q/Q2628nsC I input capacitance 3.5 3.5pFC PD power dissipationcapacitance per buffernotes 1 and 22336pFEXTENDED TYPENUMBERPACKAGEPINS PIN POSITION MATERIAL CODE 74HC/HCT5555N16DIL plastic SOT38Z 74HC/HCT5555D16SO16plastic SOT109APINNING SYMBOL PIN DESCRIPTIONRS 1clock input/oscillator pin R TC 2external resistor connection C TC 3external capacitor connection A 4trigger input (positive-edge triggered)B 5trigger input (negative-edge triggered)RTR/RTR 6retriggerable/non-retriggerable input (active HIGH/active LOW)Q 7pulse output (active LOW)GND 8ground (0 V)Q 9pulse output (active HIGH)S 0−S 310, 11,12, 13programmable input OSC CON 14oscillator controlMR 15master reset input (active HIGH)V CC16positive supply voltageFig.1 Pin configuration.handbook, halfpage123456781615141312111095555GNDV CCMGA642R TC C TC QRS OSC CONMR A B RTR/RTRQ 0S 1S 2S S 3Fig.2 IEC logic diagram.handbook, halfpageMGA6431I = 0SR R&CT = 0CT = mRV16791716G17CX RX 1248X / Y CTRDIVm[T]Y = 0Y = 15! G+15101112132314164515Fig.3 Functional diagram.handbook, full pagewidthMGA644R TCC TCMONOSTABLE CIRCUITRYQ RS OSC CONMR A B 11415456972310111213POWER-ON RESETRTR/RTROUTPUT STAGEQ 24 - STAGE COUNTER CPCD12S S S S 3FUNCTIONAL DESCRIPTION The oscillator configuration allows the design of RC or crystal oscillator circuits. The device can operate from an external clock signal applied to the RS input (R TC and C TC must not be connected). The oscillator frequency is determined by the external timing components (R T and C T ), within the frequency range 1 Hz to 4 MHz (32kHz to 20 MHz with crystal oscillator).In the HCT version the MR input is TTL compatible but the RS input has CMOS input switching levels. The RS input can be driven by TTL input levels if RS is tied to V CC via a pull-up resistor.The counter divides the frequency to obtain a long pulse duration. The 24-stage is digitally programmed via the select inputs (S 0 to S 3). Pin S 3 can also be used to select the test mode,which is a convenient way of functionally testing the counter.The “5555” is triggered on either the positive-edge, negative-edge or both.•Trigger pulse applied to input A for positive-edge triggering •Trigger pulse applied input B for negative-edge triggering •Trigger pulse applied to inputs A and B (tied together) for both positive-edge and negative triggering.The Schmitt trigger action in the trigger inputs, transforms slowly changing input signals into sharply defined jitter-free output signals and provides the circuit with excellent noise immunity.The OSC CON input is used to select the oscillator mode, eithercontinuously running (OSC CON =HIGH) or triggered start mode (OSC CON = LOW). The continuously running mode is selected where a start-up delay is an undesirablefeature and the triggered start mode is selected where very low power consumption is the primary concern.The start of the programmed time delay occurs when output Q goes HIGH (in the triggered start mode, the previously disabled oscillator will start-up). After the programmed time delay, the flip-flop stages are reset and the output returns to its original state.An internal power-on reset is used to reset all flip-flop stages.The output pulse can be terminated by the asynchronous overriding master reset (MR), this results in all flip-flop stages being reset. The output signal is capable of driving a power transistor. The output time delay is calculated using the following formula (minimum time delay is 100ns):Once triggered, the output width may be extended by retriggering the gated, active HIGH-going input A or the active LOW-going input B. By repeating this process, the output pulse period (Q = HIGH,Q = LOW)can be made as long as desired. This mode is selected by RTR/RTR =HIGH. A LOW on RTR/RTR makes,once triggered, the outputs (Q,Q)independent of further transitions of inputs A and B.1f i --division ratio (s).×TEST MODESet S 3 to a logic LOW level, this will divide the 24 stage counter into three, parallel clocking, 8-stage counters. Set S 0,S 1 and S 2 to a logic HIGH level, this programs the counter to divide-by 28 (256). Apply a trigger pulse and clock in 255pulses, this sets all flip-flop stages to a logic HIGH level. Set S 3 to a logic HIGH level, this causes the counter to divide-by 224. Clock one more pulse into the RS input, this causes a logic 0 to ripple through the counter and output Q/Q goes from HIGH-to-LOW level. This method of testing the delay counter is faster than clocking in 224 (16777216) clock pulses.FUNCTION TABLENotes1.H = HIGH voltage levelL = LOW voltage level X = don't care↑ = LOW-to-HIGH transition ↓= HIGH-to-LOW transition.INPUTSOUTPUTSMR A B Q Q H X X LH L ↑X one HIGH level output pulse one LOW level output pulse LX↓one HIGH level output pulseone LOW level output pulseDELAY TIME SELECTIONSELECT INPUTSOUTPUT Q/Q (FREQUENCY DIVIDING)S 3S 2S 1S 0BINARYDECIMALL L L L 212L L L H 224L L H L 238L L H H 2416L H L L 2532L H L H 2664L H H L 27128L H H H 28256......H L L L 217131072H L L H 218262144H L H L 219524288H L H H 2201048576H H L L 2212097152H H L H 2224194304H H H L 2238388608HHHH22416777216Fig.5 Timing diagram.Timing example shown for S 3, S 2, S 1, S 0 = 0011 (binary 24, decimal 16).handbook, full pagewidth 12345678910111213141516RSMRAQMGA649DC CHARACTERISTICS FOR 74HCFor the DC characteristics see“74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: parallel outputs, bus driver; serial output, standard I CC category: MSI.DC CHARACTERISTICS FOR 74HCSYM-BOL PARAMETERT amb (°C)UNITTEST CONDITION+25−40to+85−40to+125VCC(V)V I OTHER MIN TYP MAX MIN MAX MIN MAXV OH HIGH leveloutput voltageQ and Qoutputs 1.94.45.924.56.0−−−1.94.45.9−−−1.94.45.9−−−VVV2.04.56.0I o =−20µAV OH HIGH leveloutput voltageQ and Qoutputs 3.985.484.325.81−−3.845.34−−3.75.2−−VV4.56.0I o =−6.0 mAI o =−7.8 mAV OH HIGH leveloutput voltageQ and Qoutputs 3.34.8−−−−34.5−−2.74.2−−VV4.56.0I o =−20 mAI o =−20 mAV OL LOW leveloutput voltageQ and Qoutputs −−−0.10.10.1−−−0.10.10.1−−−0.10.10.1VVV2.04.56.0I o = 20µAV OL LOW leveloutput voltageQ and Qoutputs −−0.150.150.260.26−−0.330.33−−0.400.40VV4.56.0I o = 6.0 mAI o= 7.8 mAV OL LOW leveloutput voltageQ and Qoutputs −−−−0.90.9−−1.141.14−−1.341.34VV4.56.0I o = 20 mAI o = 25 mAV IH HIGH levelinput voltageRS input 1.73.64.8−−−−−−1.73.64.8−−−1.73.64.8−−−VVV24.56.0V IL LOW levelinput voltageRS input −−−−−−0.30.91.2−−−0.30.91.2−−−0.30.91.2VVV2.04.56.0V OH HIGH leveloutput voltageR TC output 3.985.48−−−−3.845.34−−3.75.2−−VV4.56.0RS =GND;OSC CON= V CCI o =−2.6 mAI o =−3.3 mA3.985.48−−−−3.845.34−−3.75.2−−VV4.56.0RS = V CC;OSC CON= GND;untriggeredI o =−0.65 mAI o =−0.85 mA1.94.45.92.04.56−−−1.94.45.9−−−1.94.45.9−−−VVV2.04.56.0RS = V CC;OSC CON= V CCI o =−20µA1.94.45.92.04.56.0−−−1.94.45.9−−−1.94.45.9−−−VVV24.56.0RS = V CC;OSC CON= GND;untriggeredI o =−20µAV OH HIGH leveloutput voltageC TC output 3.985.48−−−−3.845.34−−3.75.2−−VV4.56.0RS = V IH;OSC CON= V IHI o =−3.2 mAI o =−4.2 mAV OL LOW leveloutput voltageR TC output −−−−0.260.26−−0.330.33−−0.40.4VV4.56RS = V CC;OSC CON= V CCI o = 2.6 mA I o= 3.3 mA−−−0.10.10.1−−−0.10.10.1−−−0.10.10.1VVV2.04.56RS = V CC;OSC CON= V CCI o = 20µAV OL LOW leveloutput voltageC TC output −−−−0.260.26−−0.330.33−−0.40.4VV4.56.0RS = V IL;OSC CON= V IL;untriggeredI o = 3.2 mA I o= 4.2 mASYM-BOL PARAMETERT amb (°C)UNITTEST CONDITION+25−40to+85−40to+125VCC(V)V I OTHER MIN TYP MAX MIN MAX MIN MAXAC CHARACTERISTICS FOR 74HC GND = 0 V;t r = t f = 6 ns;C L = 50 pF.SYMBOL PARAMETERT amb (°C)UNITTEST CONDITION+25−40to+85−40to+125VCC(V)WAVEFORMS MIN TYP MAX MIN MAX MIN MAXt PLH/t PHL propagationdelay A,B toQ,Q −−−7728222404841−−−3006051−−−3607261nsnsns2.04.56.0Fig.6t PLH/t PHL propagationdelay MR to Q,Q −−−6122181853731−−−2304639−−−2805648nsnsns2.04.56.0Fig.7t PLH/t PHL propagationdelay RS to Q,Q −−−8330242505043−−−3156354−−−3757564nsnsns2.04.56.0Fig.8; note 1t THL/t TLH outputtransition time −−−1976751513−−−951916−−−1102219nsnsns2.04.56.0Fig.6t W trigger pulsewidthA = HIGHB = LOW 7014121765−−−901815−−−1052118−−−nsnsns2.04.56.0Fig.6t W master resetpulse widthHIGH 7014121976−−−901815−1052118−−−nsnsns2.04.56.0Fig.7t W clock pulsewidth RS;HIGH or LOW 8016142597−−−1002017−−−1202420−−−nsnsns2.04.56.0Fig.8t W minimumoutput pulsewidthQ = HIGH,Q = LOW −−−27510080−−−−−−−−−−−−−−−nsnsns2.04.56.0Fig.6; note 1t rt retrigger timeA,B −−−−−−−−−−−−−−−−−−nsnsns2.04.56.0Fig.10; note 2R EXT external timingresistor 51−−10001000−−−−−−−−−−kΩkΩ2.05.0Fig.13C EXT external timingcapacitor 5050no limitspFpF2.05.0Fig.13t rem removal timeMR to A,B 1202420391411−−−1503026−−−1803631−−−nsnsns2.04.56.0Fig.7Notes1.One stage selected.2.It is possible to retrigger directly after the trigger pulse, however the pulse will only be extended, if the time periodexceeds the clock input cycle time divided by 2.3.One stage selected. The termination of the output pulse remains synchronized with respect to the falling edge of theRS clock input.4.One stage selected. The termination of the output pulse is no longer synchronized with respect to the falling edge ofthe RS clock input.f maxmaximum clock pulse frequency 21012 5.91821−−− 1.8810−−− 1.36.68−−−MHz MHz MHz 2.04.56.0Fig.8; note 3f maxmaximum clock pulse frequency6303524.87589−−−4.82428−−−42024−−−MHz MHz MHz 2.04.56.0Fig.9; note 4SYMBOLPARAMETERT amb (°C)UNITTEST CONDITION +25−40to +85−40to +125V CC (V)WAVEFORMS MINTYP MAX MIN MAX MIN MAXDC CHARACTERISTICS FOR 74HCTFor the DC characteristics see“74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: non-standard; bus driver with extended specification on V OH and V OL I CC category: MSI.SYMBOL PARAMETERT amb (°C)UNITTEST CONDITION+25−40to+85−0to+125VCC(V)V I OTHER MIN TYP MAX MIN MAX MIN MAXV OH HIGH leveloutput voltageQ and Qoutputs4.4 4.5− 4.4− 4.4−V 4.5I o =−20µAV OH HIGH leveloutput voltageQ and Qoutputs3.984.32− 3.84− 3.7−V 4.5I o =−6 mAV OH HIGH leveloutput voltageQ and Qoutputs3.3−−3− 2.7−V4.5I o =−20 mAV OL LOW leveloutput voltageQ and Qoutputs−00.1−0.1−0.1V 4.5I o = 20µAV OL LOW leveloutput voltageQ and Qoutputs−0.150.26−0.33−0.40V 4.5I o = 6 mAV OL LOW leveloutput voltageQ and Qoutputs−−0.9− 1.14− 1.34V 4.5−I o = 20 mANotes1.The RS input has CMOS input switching levels.2.The value of additional quiescent supply current (∆I CC ) for a unit load of 1 is given in the family specifications. Todetermine ∆I CC per input, multiply this value by the unit load coefficient shown in the following table.UNIT LOAD COEFFICIENTV OHHIGH level outputvoltage R TC output3.98−−3.84−3.7−V4.5RS = GND;OSC CON =V CC I o =−2.6 mA3.98−− 3.84− 3.7−V4.5RS = V CC ;OSC CON = GND;untriggered I o =−0.65 mA4.4 4.5− 4.4− 4.4−V 4.5RS = V CC ;OSC CON = V CC I o =−20µA4.4 4.5− 4.4− 4.4−V 4.5RS = V CC ;OSC CON = GND;untriggered I o =−20µAV OHHIGH level outputvoltage C TC output 3.98−− 3.84− 3.7−V 4.5RS = V IH ;OSC CON = V IH I o =−3.2 mAV OLLOW level outputvoltage R TC output −−0.26−0.33−0.4V 4.5RS = V CC ;OSC CON = V CC I o = 2.6 mA−00.1−0.1−0.1V 4.5RS = V CC ;OSC CON = V CC I o = 20µAV OL LOW level outputvoltage C TC output−−0.26−0.33−0.4V 4.5RS = V IL ;OSC CON = V IL ;untriggeredI o = 3.2 mAINPUT UNIT LOAD COEFFICIENTMR 0.35A 0.69B 0.50RTR/RTR 0.35OSC CON 1.20S 0 - S 20.65S 30.40SYMBOL PARAMETERT amb (°C)UNIT TEST CONDITION+25−40to +85−0to +125VCC (V)V IOTHER MIN TYP MAX MIN MAXMIN MAXAC CHARACTERISTICS FOR 74HCT GND = 0 V; t r = t f = 6 ns;C L = 50 pF.SYMBOL PARAMETERT amb (°C)UNITTEST CONDITION+25−40to+85−40to+125VCC(V)WAVEFORMS MIN TYP MAX MIN MAX MIN MAXt PLH/t PHL propagationdelay A,B toQ,Q−2848−60−72ns 4.5Fig.6t PHL/t PLH propagationdelay MR to Q,Q−2441−51−62ns 4.5Fig.7t PHL/t PLH propagationdelay RS to Q,Q−3254−68−81ns 4.5Fig.8; note 1t THL/t TLH outputtransition time−715−19−22ns 4.5Fig.6t W trigger pulsewidthA = HIGHB=LOW2112−26−32−ns 4.5Fig.6t W master resetpulse widthHIGH145−18−21−ns 4.5Fig.7t W clock pulsewidth RS;HIGH or LOW169−20−24−ns 4.5Fig.8t W minimumoutput pulsewidthQ = HIGH,Q = LOW−100−−−−−ns 4.5Fig.6t rt retrigger timeA,B−0−−−−−ns 4.5Fig.10; note 2R EXT external timingresistor1−1000−−−−kΩ 4.5Fig.13C EXT external timingcapacitor50no limits pF 4.5Fig.13t rem removal timeMR to A,B2414−30−36−ns 4.5Fig.7f max maximumclock pulsefrequency1018−8− 6.6−MHz 4.5Fig.8; note 3f max maximumclock pulsefrequency3075−24−20−MHz 4.5Fig.9; note 4Notes1.One stage selected.2.It is possible to retrigger directly after the trigger pulse, however the pulse will only be extended, if the time periodexceeds the clock input cycle time divided by 2.3.One stage selected. The termination of the output pulse remains synchronized with respect to the falling edge of theRS clock input.4.One stage selected. The termination of the output pulse is no longer synchronized with respect to the falling edge ofthe RS clock input.AC WAVEFORMSFig.6Waveforms showing the triggering of the delay timer by input A or B, the minimum pulse widths of the trigger inputs A and B, the output pulse width and output transition times.(1)HC : V M =50%; V I =GND to V CC .HCT: V M =1.3 V; V I =GND to 3 V.handbook, full pagewidtht WQ OUTPUTMGA653Q OUTPUT90%10%A INPUTB INPUTV M (1)V M (1)t TLHt THL90%10%t W GNDV M(1)90%10%t W90%10%t PHL t PLHV M (1)t TLHt THLFig.7Waveforms showing the master reset (MR) pulse width, the master reset to outputs (Q and Q) propagation delays and the master reset to trigger inputs (A and B) removal time.(1)HC : V M =50%; V I =GND to V CC .HCT: V M =1.3 V; V I =GND to 3 V.handbook, full pagewidtht PHLV M (1)t Wt PLHQ OUTPUTMR INPUTMGA652-1V M (1)Q OUTPUTt remA INPUTB INPUTV M (1)V M(1)V M (1)t remFig.8Waveforms showing the clock (RS) to outputs (Q and Q) propagation delays, the clock pulse width and the maximum clock frequency.(1)HC : V M =50%; V I =GND to V CC .HCT: V M =1.3 V; V I =GND to 3 V.handbook, full pagewidtht PHLV M (1)t Wt PLHQ OUTPUTRS INPUTMGA651V CC12V M (1)Q OUTPUT1/f maxFig.9Waveforms showing the clock (RS) to outputs (Q and Q) propagation delays, the clock pulse width and the maximum clock frequency (Output waveforms are not synchronized with respect to the RS waveform).(1)HC : V M =50%; V I =GND to V CC .HCT: V M =1.3 V; V I =GND to 3 V.handbook, full pagewidtht PHL V M (1)1/f maxt PLH Q OUTPUTRS INPUTMGA654V M (1)Q OUTPUTV M (1)Fig.10 Output pulse control using retrigger pulse (RTR/RTR = HIGH).(1)HC : V M =50%; V I =GND to V CC .HCT: V M =1.3 V; V I =GND to 3 V.handbook, full pagewidthA INPUTQ OUTPUTB INPUTt Wt r tt Wt Wt Wt WMGA650APPLICATION INFORMATIONFig.11Test set-up for measuring forwardtransconductance g fs = di o /dv i at v o is constant (see Fig.12) and MR = LOW.handbook, halfpageMGA645A output 100 FV CCinput0.47 F R = 560 k Ωbiasi o(f = 1 kHz)GNDv i µµFig.12Typical forward transconductance g fs as afunction of the supply voltage at V CC at T amb = 25°C.handbook, halfpage MBA33314121086420123456gfs(mA/V)CC V (V)max.min.typ.Fig.13 Application information.C t curve at R t = 100 k Ω; R2 = 200 k Ω.R t curve at C t = 1 nF; R2 = 2 x R t .RC oscillator frequency as a function of R t and C t at V CC = 2 to 6 V; T amb = 25°C.handbook, halfpage103MGA64710410510610105103104102f osc (Hz)R ( )t C ( F)t 10–410–310–210–1R tC tΩµFig.14 Example of an RC oscillator.Typical formula for oscillator frequency:f osc 12.5R t C t××-------------------------------=handbook, halfpageMGA6462RS1MR (from logic)R TC C TC 3R tC tC2R2Timing Component Limitations The oscillator frequency is mainly determined by R t C t, provided R2≈2R t and R2C2<<R t C t. The function of R2 is to minimize the influence of the forward voltage across the input protection diodes on the frequency. The stray capacitance C2 should be kept as small as possible. In consideration of accuracy, C t must be larger than the inherent stray capacitance. R t must be larger than the “ON” resistance in series with it, which typically is 280Ω atV CC=2V,130Ω at V CC = 4.5 V and 100Ω at V CC = 6 V. The recommended values for these components to maintain agreement with the typical oscillation formula are:C t> 50 pF, up to any practical value,10 kΩ< R t< 1 MΩ.In order to avoid start-up problems, R t>>1 kΩ.Typical Crystal OscillatorIn Fig.15, R2 is the power limiting resistor. For starting and maintaining oscillation a minimum transconductance is necessary, soR2 should not be too large. A practical value for R2 is 2.2 kΩ. Above 14 MHz it is recommended replacement of R2 by a capacitor with a typical value of 35 pF.AccuracyDevice accuracy is very precise for long time delays and has an accuracy of better than 1% for short time delays (1% applies to values≥400 ns). Tolerances are dependent on the external components used, either RC network or crystal oscillator.Start-up Using External ClockThe start of the timing pulse isinitiated directly by the trigger pulse(asynchronously with respect to theoscillator clock). Triggering on a clockHIGH or clock LOW results in thefollowing:•clock=HIGH; the timing pulse maybe lengthened by a maximum oft W/2 (t W = clock pulse width)•clock=LOW; the timing pulse maybe shortened by a maximum of t W/2(t W = clock pulse width).This effect can be minimized byselecting more delay stages. Whenusing only one or two delay stages, itis recommended to use an externaltime base that is synchronized withthe negative-edge of the clock.Start-up Using RC OscillatorThe first clock cycle is≈35% of a timeperiod too long. This effect can alsobe minimized by selecting more delaystages.Start-up Using Crystal OscillatorA crystal oscillator requires at leasttwo clock cycles to start-up plus anunspecified period (ms) before theamplitude of the clock signalincreases to its expected level.Although this device also operates atlower clock amplitudes, it isrecommended to select thecontinuously running mode(OSC CON = HIGH) to preventstart-up delays.Termination of the Timing PulseThe end of the timing pulse issynchronized with the falling edge ofthe oscillator clock. The timing pulsemay lose synchronization under thefollowing conditions:•high clock frequency and largenumber of stages are selected.This depends on the dynamicrelationship that exists between theclock frequency and the ripplethrough delay of the subsequentstages.SynchronizationWhen frequencies higher than thosespecified in the Table'Synchronization limits' are used, thetermination of timing pulse will losesynchronization with the falling edgeof the oscillator. The unsynchronizedtiming pulse introduces errors, whichcan be minimized by increasing thenumber of stages used e.g. a 20 MHzclock frequency using all 24 stageswill result in a frequency division of16777225 instead of 16777216, anerror of 0.0005%.The amount of error increases at highclock frequencies as the number ofstages decrease. A clock frequencyof 40 MHz and 4 stages selectedresults in a division of 18 instead of16, a 12.5% error. Applicationexample:•If a 400 ns timing pulse wasrequired it would be more accurateto utilize a 5 MHz clock frequencyusing 1 stage or a 10 MHz clockfrequency using 2 stages (due tosynchronization with falling edge ofthe oscillator) than a 40 MHz clockfrequency and 4 stages(synchronization is lost).Minimum Output Pulse WidthThe minimum output pulse width is determined by the minimum clock pulse width, plus the maximum propagation delay of A,B to Q. The rising edge of Q is dominated by the A,B to Q propagation delay, while the falling edge of Q is dominated by RS to Q propagation delay. These propagation delays are not equal. The RS to Q propagation delay is somewhat longer, resulting in inaccurateoutputs for extremely short pulses.The propagation delays are listed inthe section 'AC Characteristics'. Withthese numbers it is possible tocalculate the maximum deviation (anexample is shown in Fig.16).Figure16 is valid for an external clockwhere the trigger is synchronized tothe falling edge of the clock only. Thegraph shows that the minimumprogrammed pulse width of 100 ns is:•minimum of 4% too long•typically 7% too long•maximum of 10% too long.SYNCHRONIZATION LIMITSNUMBER OF STAGES SELECTED CLOCK FREQUENCY (TYPICAL) 118 MHz214 MHz311 MHz49.6 MHz58.3 MHz67.3 MHz7 6.6 MHz8 6 MHz..17 3.2 MHz18 3.0 MHz19 2.9 MHz20 2.8 MHz21 2.7 MHz22 2.6 MHz23 2.5 MHz24 2.4 MHz。
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16-Bit Registered TransceiversCY74FCT16646T CY74FCT162646TSCCS060B - August 1994 - Revised September 2001Data sheet acquired from Cypress Semiconductor Corporation.Data sheet modified to remove devices not offered.Features•I off supports partial-power-down mode operation •Edge-rate control circuitry for significantly improved noise characteristics•Typical output skew < 250 ps •ESD > 2000V•TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)packages•Industrial temperature range of −40˚C to +85˚C •V CC = 5V ± 10%CY74FCT16646T Features:•64 mA sink current, 32 mA source current•Typical V OLP (ground bounce) <1.0V at V CC = 5V,T A = 25˚C CY74FCT162646T Features:•Balanced 24 mA output drivers •Reduced system switching noise•Typical V OLP (ground bounce) <0.6V at V CC = 5V,T A = 25˚CFunctional DescriptionThe CY74FCT16646T and CY74FCT162646T 16-bit transceivers are three-state,D-type registers,and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers.Data on the A or B bus will be clocked into the registers as the appropriate clock pin goes to a HIGH logic level.Output Enable (OE)and direction pins (DIR)are provided to control the transceiver function.In the transceiver mode,data present at the high impedance port may be stored in either the A or B register,or in both.The select controls can multiplex stored and real-time (transparent mode)data.The direction control determines which bus will receive data when the Output Enable (OE)is Active LOW.In the isolation mode (Output Enable (OE)HIGH),A data may be stored in the B register and/or B data may be stored in the A register.This device is fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.The CY74FCT16646T is ideally suited for driving high-capacitance loads and low-impedance backplanes.The CY74FCT162646T has 24-mA balanced output drivers with current limiting resistors in the outputs.This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce.The CY74FCT162646T is ideal for driving transmission lines.Logic Block DiagramsFCT16646-1CD1B 1CD 1A 1TO 7OTHER CHANNELS1SAB1CLKAB 1CLKBA 1DIR 1SBA 1OE B REGA REG CD 2B 1CD 2A 12SAB2CLKAB 2CLKBA 2DIR 2SBA 2OE B REGFCT16646-2TO 7OTHER CHANNELSA REGGND 1DIR SSOP/TSSOP Top View1CLKAB 1SAB1A 11A 21CLKBA 1SBA 1B 11OE GND GND V CC 1A 3V CC GND 1A 41A 51A 61A 71A 82A 12A 22A 32A 4GND 2A 52A 6V CC 2A 72A 82SAB 2CLKAB1234567891011121314151617181920212223242526272856555453525150494847464544434241403938373635343332313029GND 2DIR1B 21B 31B 41B 51B 61B 71B 82B 12B 22B 3GND 2B 42B 52B 6V CC 2B 72B 8GND 2SBA 2CLKBA 2OEFCT16646-3Pin ConfigurationPin DescriptionPin Names DescriptionA Data Register A Inputs Data RegisterB Outputs BData Register B Inputs Data Register A Outputs CLKAB, CLKBA Clock Pulse InputsSAB, SBA Output Data Source Select Inputs DIR DirectionOEOutput Enable (Active LOW)Function Table [1]InputsData I/O [2]FunctionOE DIR CLKAB CLKBA SAB SBA A B H H X X H or L H or L X X X X Input Input IsolationStore A and B Data L L L L X X X H or L X X L H Output InputReal Time B Data to A Bus Stored B Data to A BusL LH HX H or LX XL HX XInputOutput Real Time A Data to BusStored A Data to B BusNotes:1.H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care= LOW-to-HIGH Transition 2.The data output functions may be enabled or disabled by various signals at the OE or DIR inputs.Data input functions are always enabled,i.e.,data at the bus pins will be stored on every LOW-to-HIGH transition on the clock inputs.3.Cannot transfer data to A-bus and B-bus simultaneously.BUS B BUS A DIR L OE L CLKAB X SAB X BUS B BUS A DIR H L X OE L L HCLKAB XSAB X X X SBA X X XBUS BBUS A DIR H OE L SAB L SBA XBUS ABUS A DIR L HOE L L SAB X H SBA H XReal-Time Transfer Bus B to BusA Real-Time Transfer BusA to Bus BStorage from A and/or BTransfer Stored Datato A and/or BCLKBA X CLKAB X CLKBA X SBA L CLKBA XCLKAB X H or L CLKBA H or L X [3]Maximum Ratings[4](Above which the useful life may be impaired.For user guide-lines, not tested.)Storage T ’l−55°C to +125°C Ambient T emperature withPower ’l−55°C to +125°C DC Input Voltage.................................................−0.5V to +7.0V DC Output Voltage..............................................−0.5V to +7.0V DC Output Current(Maximum Sink Current/Pin)...........................−60 to +120 mA Power Dissipation..........................................................1.0W Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015)Operating RangeRangeAmbientTemperature V CC Industrial−40°C to +85°C5V± 10%Electrical Characteristics Over the Operating RangeParameter Description Test Conditions Min.Typ.[5]Max.Unit V IH Input HIGH Voltage 2.0V V IL Input LOW Voltage0.8V V H Input Hysteresis[6]100mV V IK Input Clamp Diode Voltage V CC=Min., I IN=−18 mA−0.7−1.2V I IH Input HIGH Current V CC=Max., V I=V CC±1µA I IL Input LOW Current V CC=Max., V I=GND±1µA I OZH High Impedance Output Current(Three-State Output pins)V CC=Max., V OUT=2.7V±1µAI OZL High Impedance Output Current(Three-State Output pins)V CC=Max., V OUT=0.5V±1µA I OS Short Circuit Current[7]V CC=Max., V OUT=GND−80−140−200mA I O Output Drive Current[7]V CC=Max., V OUT=2.5V−50−180mA I OFF Power-Off Disable V CC=0V, V OUT≤4.5V[9]±1µA Output Drive Characteristics for CY74FCT16646TParameter Description Test Conditions Min.Typ.[5]Max.Unit V OH Output HIGH Voltage V CC=Min., I OH=−3 mA 2.5 3.5VV CC=Min., I OH=−15 mA 2.4 3.5VV CC=Min., I OH=−32 mA 2.0 3.0V V OL Output LOW Voltage V CC=Min., I OL=64 mA0.20.55V Output Drive Characteristics for CY74FCT162646TParameter Description Test Conditions Min.Typ.[5]Max.Unit I ODL Output LOW Current[7]V CC=5V, V IN=V IH or V IL, V OUT=1.5V60115150mA I ODH Output HIGH Current[7]V CC=5V, V IN=V IH or V IL, V OUT=1.5V−60−115−150mA V OH Output HIGH Voltage V CC=Min., I OH=−24 mA 2.4 3.3V V OL Output LOW Voltage V CC=Min., I OL=24 mA0.30.55V Notes:4.Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device.This is a stress rating only and functional operationof the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.5.Typical values are at V CC= 5.0V, T A= +25˚C ambient.6.This parameter is specified but not tested.7.Not more than one output should be shorted at a time.Duration of short should not exceed one second.The use of high-speed test apparatus and/or sampleand hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values.Otherwise prolonged shorting ofa high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametrics tests.In any sequence of parametertests, I OS tests should be performed last.8.This parameter is measured at characterization but not tested.9.Tested at +25˚C.Capacitance(T A = +25˚C, f = 1.0 MHz)Symbol Description[8]Conditions Typ.Max.Unit C IN Input Capacitance V IN = 0V 4.5 6.0pF C OUT Output Capacitance V OUT=0V 5.58.0pFPower Supply CharacteristicsParameter Description Test Conditions[10]Min.Typ.[5]Max.Unit I CC Quiescent Power Supply Current V CC=Max.V IN<0.2VV IN>V CC−0.2V—5500µA∆I CC Quiescent Power Supply CurrentTTL Inputs HIGH V CC = Max.V IN=3.4V[11]—0.5 1.5mAI CCD Dynamic Power SupplyCurrent[12]V CC=Max.Outputs OpenDIR=OE=GNDOne-Bit Toggling50% Duty CycleV IN=V CC orV IN=GND—75120µA/MHzI C Total Power Supply Current[13]V CC=Max.Outputs Openf o=10 MHz(CLKBA)50% Duty CycleDIR=OE=GNDOne-Bit Togglingf1=5 MHz50% Duty Cycle V IN=V CC orV IN=GND—0.8 1.7mAV IN=3.4V orV IN=GND— 1.3 3.2V CC=Max.Outputs Openf o=10 MHz (CLKBA) 50% Duty CycleDIR=OE=GND Sixteen-Bits Toggling f1=2.5 MHz50% Duty Cycle V IN=V CC orV IN=GND— 3.8 6.5[14]V IN=3.4V orV IN=GND—8.320.0[14]Notes:10.For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.11.Per TTL driven input (V IN=3.4V); all other inputs at V CC or GND.12.This parameter is not directly testable, but is derived for use in Total Power Supply calculations.13.I C=I QUIESCENT + I INPUTS+ I DYNAMICI C=I CC+∆I CC D H N T+I CCD(f0/2 + f1N1)I CC=Quiescent Current with CMOS input levels∆I CC=Power Supply Current for a TTL HIGH input (V IN=3.4V)D H=Duty Cycle for TTL inputs HIGHN T=Number of TTL inputs at D HI CCD=Dynamic Current caused by an input transition pair (HLH or LHL)f0=Clock frequency for registered devices, otherwise zerof1=Input signal frequencyN1=Number of inputs changing at f1All currents are in milliamps and all frequencies are in megahertz.14.Values for these conditions are examples of the ICC formula. These limits are specified but not tested.Switching Characteristics Over the Operating Range [15]Parameter DescriptionCY74FCT16646TCY74FCT16646AT CY74FCT162646AT Unit Min.Max.Min.Max.Fig. No.[16]t PLH t PHL Propagation Delay Bus to Bus1.59.0 1.5 6.3ns 1, 2t PZH t PZL Output Enable Time DIR or OE to Bus 1.514.0 1.59.8ns 1, 7, 8t PHZ t PLZ Output Disable Time DIR or OE to Bus 1.59.0 1.5 6.3ns 1, 7, 8t PLH t PHL Propagation Delay Clock to Bus 1.59.0 1.5 6.3ns 1, 5t PLH t PHL Propagation Delay SBA or SAB to Bus 1.511.0 1.57.7ns 1,5t SU Set-Up Time HIGH or LOW Bus to Clock2.0— 2.0—ns 4t H Hold Time HIGH or LOW Bus to Clock 1.5— 1.5—ns 4t W Clock Pulse Width HIGH or LOW 5.0— 5.0—ns 6t SK(O)Output Skew [17]—0.5—0.5ns—Parameter DescriptionCY74FCT16646CT CY74FCT162646CTUnit Min.Max.Fig. No.[16]t PLH t PHL Propagation Delay Bus to Bus1.5 5.4ns 1, 2t PZH t PZL Output Enable Time DIR or OE to Bus 1.57.8ns 1, 7, 8t PHZ t PLZ Output Disable Time DIR or OE to Bus 1.5 6.3ns 1, 7, 8t PLH t PHL Propagation Delay Clock to Bus 1.5 5.7ns 1, 5t PLH t PHL Propagation Delay SBA or SAB to Bus 1.5 6.2ns 1,5t SU Set-Up Time HIGH or LOW Bus to Clock2.0—ns 4t H Hold Time HIGH or LOW Bus to Clock 1.5—ns 4t W Clock Pulse Width HIGH or LOW 5.0—ns 6t SK(O)Output Skew [17]—0.5ns—Notes:15.Minimum limits are specified but not tested on Propagation Delays.16.See “Parameter Measurement Information” in the General Information section.17.Skew any two outputs of the same package switching in the same direction. This parameter is ensured by design.Ordering Information CY74FCT16646Speed(ns)Ordering Code PackageName Package TypeOperatingRange5.4CY74FCT16646CTPVC/PVCT O5656-Lead (300-Mil) SSOP Industrial6.3CY74FCT16646ATPVC/PVCT O5656-Lead (300-Mil) SSOP Industrial9.0CY74FCT16646TPVC/PVCT O5656-Lead (300-Mil) SSOP Industrial Ordering Information CY74FCT162646Speed(ns)Ordering Code PackageName Package TypeOperatingRange5.474FCT162646CTPACT Z5656-Lead (240-Mil) TSSOP IndustrialCY74FCT162646CTPVC O5656-Lead (300-Mil) SSOP74FCT162646CTPVCT O5656-Lead (300-Mil) SSOP6.374FCT162646ATP ACT Z5656-Lead (240-Mil) TSSOP IndustrialCY74FCT162646ATPVC O5656-Lead (300-Mil) SSOP74FCT162646ATPVCT O5656-Lead (300-Mil) SSOPPackage Diagrams56-Lead Shrunk Small Outline Package O5656-Lead Thin Shrunk Small Outline Package Z56PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)74FCT162646ATPACT ACTIVE TSSOP DGG562000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT162646ATPVCG4ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT162646ATPVCT ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT162646CTPACT ACTIVE TSSOP DGG562000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT162646CTPVCG4ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT162646CTPVCT ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74FCT162646ETPACT OBSOLETE TSSOP DGG56TBD Call TI Call TI74FCT162646ETPVCT OBSOLETE SSOP DL56TBD Call TI Call TI74FCT16646ATPVCG4ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT16646ATPVCTG4ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT16646CTPVCG4ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT16646CTPVCTG4ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT16646TPVCG4ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74FCT16646TPVCTG4ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCY74FCT162646ATPVC ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCY74FCT162646CTPVC ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CY74FCT162646ETPAC OBSOLETE TSSOP DGG56TBD Call TI Call TICY74FCT162646ETPVC OBSOLETE SSOP DL56TBD Call TI Call TICY74FCT16646ATPVC ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCY74FCT16646ATPVCT ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCY74FCT16646CTPVC ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCY74FCT16646CTPVCT ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CY74FCT16646ETPVC OBSOLETE SSOP DL56TBD Call TI Call TICY74FCT16646ETPVCT OBSOLETE SSOP DL56TBD Call TI Call TICY74FCT16646TPVC ACTIVE SSOP DL5620Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCY74FCT16646TPVCT ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMFCT162646ATPACTE4ACTIVE TSSOP DGG562000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)FCT162646ATPACTG4ACTIVE TSSOP DGG562000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMFCT162646ATPVCTG4ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMFCT162646CTPACTE4ACTIVE TSSOP DGG562000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMFCT162646CTPACTG4ACTIVE TSSOP DGG562000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMFCT162646CTPVCTG4ACTIVE SSOP DL561000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant 74FCT162646ATPACT TSSOP DGG 562000330.024.48.615.6 1.812.024.0Q174FCT162646ATPVCT SSOP DL 561000330.032.411.3518.67 3.116.032.0Q174FCT162646CTPACT TSSOP DGG 562000330.024.48.615.6 1.812.024.0Q174FCT162646CTPVCT SSOP DL 561000330.032.411.3518.67 3.116.032.0Q1CY74FCT16646ATPVCT SSOP DL 561000330.032.411.3518.67 3.116.032.0Q1CY74FCT16646CTPVCT SSOP DL 561000330.032.411.3518.67 3.116.032.0Q1CY74FCT16646TPVCTSSOPDL561000330.032.411.3518.673.116.032.0Q1*All dimensions are nominalDevice Package Type 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