2015 10D SCI Periodic Table
Edwards 同步指示器目录说明书
Page 1 of 6 D A T A S H E E TS85001-0341Not to be used for installation purposes. Issue 6.1Edwards Signaling Catalog u Strobes, Horns, Bells, ChimesStandard Features• UL 1971-listed synchronizing strobeIntegrity strobes synchronize to the latest UL 1971 require-ments when used with a synchronization source. • Adjustable Audible OutputSelect temporal or continuous tones, and High setting for 98 dBA output or Low setting for 94 dBA sound output.• Genesis-compatibleAll Genesis and Integrity strobes on the same circuit meet UL 1971 synchronization requirements when used with an external control module.• Approved for public and private mode applications UL 1971-listed as signaling devices for the hearing impaired and UL 1638-listed as protective visual signaling appliances.• Durable red or white Noryl front plateIdeal for outdoor, industrial or harsh environments.• Field changeable field markingsLens language or standard “FIRE” marking is easily changed with optional 2440KTW and 2440KTC series lens kits.• Easy InstallationFlush mount to standard North American 4” square or two-gang box. Integrity’s universal mounting plate allows it to be wired and then left hanging free for easy inspection and testing before it is fastened to the electrical box.OverviewIntegrity temporal horns and temporal horn-strobes are specially designed for use with compatible life safety communication and control equipment to alert occupants of a life safety event. The horn emits a piercing low frequency sound that is easily heard above moderate ambient noise levels. The flash from its strobe can be noticed from almost any position in the room, corridor, or large open space.Integrity’s rugged plastic housing is made from durable and fire retardant, high impact plastic with a slightly textured surface. Its ingenious mounting plate firmly holds the device in place with a single screw. A separate trim plate is not required. Terminals ac-cept up to #12 AWG (2.5mm²) wire for polarized connections.Strobes are shipped with standard wall mount style “FIRE” lens markings. Where ceiling orientation, other languages, or different lens markings are required, Edwards offers optional 2440KTW and 2440KTC series Lens Marking Kits. These optional lens markings simply snap on to the strobe. Consult Edwards for availability of special lens markings.Integrity horns and horn-strobes are designed for 16 to 33 Vdc operation and must be connected to signal circuits that output a constant (not pulsed) voltage. A diode is used to allow full signalcircuit supervision.Temporal Horns and Horn-strobes2400 SeriesMEAPatentedPage 2 of 6 D A T A S H E E TS85001-0341Not to be used for installation purposes. Issue 6.1Installation and MountingAll models fit to a standard flush mounted, North-American two-gang electrical box, 2¾ inch (69 mm) minimum. Optional flushtrims are not required. For surface mount, use Edwards Signal-ing’s custom indoor and outdoor surface boxes painted in color-matched red or white epoxy. Ed-wards recommends that fire alarm horn/strobes always be installed in accordance with the latest recog-nized edition of national and local fire alarm codes.ApplicationNOTE: The installation of visible and audible signals are subject to national and local standards, codes, and ordinances.Consult your Authority Having Jurisdiction for device installation requirements, application standards, and minimum performance specifications.HornsDuring installation, the horn is configured for steady or temporal tone signal and either low (94 dBA) or high (98 dBA) output. When temporal output is selected all horns on a common two-wire circuit are self-synchronized (see specifications). External control modules are not required for audible synchronization.Suggested sound pressure level for each signaling zone used with alert or alarm signals is at least 15dB above the average ambi-ent sound level, or 5dB above the maximum sound level having a duration of at least 60 seconds, whichever is greater, measured 5’ (1.5m) above the floor. The average ambient sound level is the RMS, A-weighted sound pressure measured over a 24-hour period.Doubling the distance from the signal to the ear will theoretically result in a 6 dB reduction of the received sound pressure level. The actual effect depends on the acoustic properties of materials in the space. A 3dBA difference represents a barely noticeable change in volume.Typical Sound Output DistributiondBA measured at 10 ft in anechoic chamber 2400 Series Temporal Horn (‘HIGH’ output)StrobesEdwards strobes are UL 1971-listed for use indoors as wall-mounted public-mode notification appliances for the hearing impaired. Prevail-ing codes require strobes to be used where ambient noise conditions exceed specified levels, where occupants use hearing protection, and in areas of public accommodation. Consult with your Authority Having Jurisdiction for details.As part of the Enhanced Integrity line of products, 2400 Series strobes exceed UL synchronization requirements (within 10 mil-liseconds other over a two-hour period) when used with a syn-chronization source. Synchronization is important in order to avoid epileptic sensitivity.Integrity strobes are fully compatible with Edwards Genesis sig-nals.NOTE: The flash intensity of some visible signals may not be adequate to alert or waken occupants in the protected area. Research indicates that the intensity of strobe needed to awaken 90% of sleeping persons is approximately 100 cd. Edwards recommends that strobes in sleeping rooms be rated at at least 110 cd.WARNING: These devices will not operate without electrical power. As fires frequently cause power interruptions, further safeguards such as backup power supplies may be required.Page 3 of 6D A T A S HE E TS85001-0341Not to be used for installation purposes. Issue 6.1Typical WiringThe strobe must be connected to signal circuits which output a constant (not pulsed) voltage. The horn can be connected to continuous voltage circuits.dBA OutputdBA Output Notes and Comments• All values shown are dBA measured at 10 feet (3.01m). • UL1480 values measured in reverberation room. • Average values are measured in anechoic chamber.Page 4 of 6 D A T A S H E E TS85001-0341Not to be used for installation purposes. Issue 6.1SpecificationsLight Output PatternsNote 1 - Measured at 10 ft (3m) @ 24 Vdc. Subtract 3 dBA for models with strobes. Note 2 - Temporal audible pattern is defined as: ½ sec ON, ½ sec OFF , ½ sec ON, ½ sec OFF , ½ sec ON, 1½ sec OFF , then repeat cycle. Integrity audible will not be affected by Genesis signal silence operation when on the same two wire circuit with Genesis horn strobes.Vertical Horizontal90°90°-90°-90°Vertical Horizontal 90°90°-90°-90°Page 5 of 6 D A T A S H E E TS85001-0341Not to be used for installation purposes. Issue 6.1Ordering Information0.1 (.05)2440KTC-01“FIRE”, Ceiling Orientation 2440KTW-07“EMERGENCY”, Wall Orientation 2440KTC-07“EMERGENCY”, Ceiling OrientationContact us...Phone: 1-800-336-4206Web: Edwards Signaling isan EDWARDS brand.3 Farm Glen BoulevardFarmington, CT 06032In Canada, contact Chubb Edwards...Email: **************************Web: © 2013 UTC Fire & Security AmericasCorporation, Inc. All rights reserved.Specifications subject to changewithout notice. Edwards is part of UTCClimate, Controls & Security, a unit ofUnited Technologies Corporation.06-27-13 Page 6 of 6D A T A S H E E T S85001-0341Not to be used for installation purposes. Issue 6.1。
Ovation I O Reference Manual
This publication adds the Eight Channel RTD module to the Ovation I/O Reference Manual. It should be placed between Sections 19 and 20.Date: 04/03IPU No.243Ovation ® Interim Publication UpdatePUBLICATION TITLEOvation I/O Reference ManualPublication No. R3-1150Revision 3, March 2003Section 19A. Eight Channel RTDModule19A-1. DescriptionThe Eight (8) channel RTD module is used to convert inputs from Resistance Temperature Detectors (RTDs) to digital data. The digitized data is transmitted to the Controller.19A-2. Module Groups19A-2.1. Electronics ModulesThere is one Electronics module group for the 8 channel RTD Module:n5X00119G01 converts inputs for all ranges and is compatible only with Personality module 5X00121G01 (not applicable for CE Mark certified systems).19A-2.2. Personality ModulesThere is one Personality module groups for the 8 channel RTD Module:n5X00121G01 converts inputs for all ranges and is compatible only with Electronics module 5x00119G01 (not applicable for CE Mark certified systems).19A-2.3. Module Block Diagram and Field Connection WiringDiagramThe Ovation 8 Channel RTD module consists of two modules an electronics module contains a logic printed circuit board (LIA) and a printed circuit board (FTD). The electronics module is used in conjunction with a personalty module, which contains a single printed circuit board (PTD). The block diagram for the 8 channel RTD moduleis shown in Figure 19A-1.Table 19A-1. 8 Channel RTD Module Subsystem ChannelsElectronic Module Personality Module85X00119G015X00121G01Figure 19A-1. 8 Channel RTD Module Block Diagram and Field Connection Wiring Diagram19A-3. SpecificationsElectronics Module (5X00119)Personality Module (5X00121)Table 19A-2. 8 Channel RTD Module SpecificationsDescription ValueNumber of channels8Sampling rate50 HZ mode: 16.67/sec. normally. In 3 wire mode, leadresistance measurement occurs once every 6.45 sec.during which the rate drops to 3/sec.60 HZ mode: 20/sec. normally. In 3 wire mode, leadresistance measurement occurs once every 6.45 sec.during which the rate drops to 2/sec.Self Calibration Mode: Occurs on demand only. The ratedrops to 1/sec. once during each self calibration cycle.RTD ranges Refer to Table 19A-3.Resolution12 bitsGuaranteed accuracy (@25°C)0.10% ±[0.045 (Rcold/Rspan)]% ± [((Rcold + Rspan)/4096 OHM)]% ± [0.5 OHM/Rspan]% ±10 m V ± 1/2LSBwhere:Rcold and Rspan are in Ohms.Temperature coefficient 10ppm/°CDielectric isolation:Channel to channel Channel to logic 200V AC/DC 1000 V AC/DCInput impedance100 M OHM50 K OHM in power downModule power 3.6 W typical; 4.2 W maximumOperating temperature range0 to 60°C (32°F to 140°F)Storage temperature range-40°C to 85°C (-40°F to 185°F)Humidity (non-condensing)0 to 95%Self Calibration On Demand by Ovation ControllerCommon Mode Rejection120 dB @ DC and nominal power line frequency+/- 1/2%Normal Mode Rejection100 dB @ DC and nominal power line frequency+/- 1/2%Table 19A-3. 8 Channel RTD RangesScale #(HEX)Wires Type Tempo FTempo CRcold(ohm)Rhot(ohm)Excitationcurrent(ma)Accuracy± ±countsAccuracy± ±% ofSPAN1310OhmPL0 to1200–18 t o6496106.3 1.090.222310OhmCU 0 to302–18 t o1508.516.5 1.0 130.32D350OhmCU 32 to2840 to1405080 1.0110.2711350OhmCU 32 to2300 to1105378 1.0120.30193100Ohm PL –4 to334–16 t o16892163.671.0110.27223100Ohm PL 32 to5200 to269100200 1.0100.25233100Ohm PL 32 to10400 to561100301 1.0100.25253120Ohm NI –12 t o464–11 t o240109360 1.0100.25263120Ohm NI 32 to1500 to70120170 1.0130.32283120Ohm NI 32 to2780 to122120225 1.0110.27804100Ohm PL 32 to5440 to290100 208 1.0100.25814100Ohm PL 356 t o446180 t o230168 186 1.0300.74824200Ohm PL 32 to6980 to370200 473 1.0120.30834200Ohm PL 514 t o648268 t o342402452 1.0290.71844100Ohm PL 32 to1240 to51100120 1.0190.47854100Ohm PL 32 to2170 to103100 140 1.0130.3286 4100Ohm PL 32 to4120 to211100 180 1.0110.27874100Ohm PL 32 to7140 to379100 240 1.0100.25884120Ohm PL 511 t o662266 t o350200230 1.0240.5919A-4. 8 Channel RTD Terminal Block Wiring Information19A-4.1. Systems Using Personality Module 5X00121G01 Each Personality module has a simplified wiring diagram label on its side, which appears above the terminal block. This diagram indicates how the wiring from the field is to beconnected to the terminal block in the base unit. The following table lists and defines the abbreviations used in this diagram.Table 19A-4. Abbreviations Used in the DiagramAbbreviation Definition+IN, -IN Positive and negative sense input connectionEarth ground terminal. Used for landing shields when the shield is to begrounded at the module.PS+, PS-Auxiliary power supply terminals.RTN Return for current source connection.SH Shield connector. used for landing shields when the shield is to begrounded at the RTD.SRC Current source connection.Note:PS+ and PS- are not used by this module.19A-5. 8 Channel RTD Module Address Locations19A-5.1. Configuration and Status RegisterWord address 13 (D in Hex) is used for both module configuration and module status. The Module Status Register has both status and diagnostic information. The bit information contained within these words is shown in Table 19A-5.Definitions for the Configuration/Module Status Register bits:Bit 0:This bit configures the module (write) or indicates the configuration state of the module (read). A “1” indicates that the module is configured. Note that until the module is configured, reading from addresses #0 through #11 (B in Hex) will produce an attention status.Bit 1:This bit (write “1”) forces the module into the error state, resulting in the error LED being lit. The read of bit “1” indicates that there is an internal module error,or the controller has forced the module into the error state. The state of this bit is always reflected by the module’s Internal Error LED. Whenever this bit is set,an attention status is returned to the controller when address #0 through #11(B in Hex) are read.Table 19A-5. 8 Channel RTD Configuration/Status Register (Address 13 0xD in Hex)Bit Data Description -Configuration Register (Write)Data Description -Status Register (Read)0Configure Module Module Configured(1 = configured; 0 = unconfigured)1Force errorInternal or forced error(1 = forced error; 0 = no forced error)250/60 Hz select (0 = 60Hz, 1 = 50Hz)50/60 Hz System (1 = 50Hz) d(read back)3SELF_CAL (Initiates Self Calibration)Warming bit (set during power up or configuration)40050060Module Not Calibrated 708CH.1 _ 3/4 Wire.CH.1 _ 3/4 Wire - Configuration (read back)9CH.2 _ 3/4 Wire.CH.2 _ 3/4 Wire - Configuration (read back)10CH.3 _ 3/4 Wire.CH.3 _ 3/4 Wire - Configuration (read back)11CH.4 _ 3/4 Wire.CH.4 _ 3/4 Wire - Configuration (read back)12CH.5 _ 3/4 Wire.CH.5 _ 3/4 Wire - Configuration (read back)13CH.6 _ 3/4 Wire.CH.6 _ 3/4 Wire - Configuration (read back)14CH.7 _ 3/4 Wire.CH.7 _ 3/4 Wire - Configuration (read back)15CH.8 _ 3/4 Wire.CH.8 _ 3/4 Wire - Configuration (read back)Bit 2:The status of this bit (read) indicates the conversion rate of the module, write to this bit configures the conversion rate of A/D converters as shown below.see Table 19A-6.Bit3:Write: This bit is used to initiate self-calibration. Read: This bit indicates that the module is in the “Warming” state. this state exists after power up and ter-minates after 8.16 seconds. the module will be in the error condition during the warm up period.Bit4 & 5:These bits are not used and read as “0” under normal operation.Bit 6:This bit (read) is the result of a checksum test of the EEPROM. A failure of this test can indicate a bad EEPROM, but it typically indicates that the module has not been calibrated. A “0” indicates that there is no error condition. If an error is present, the internal error LED is lit and attention status will be returned for all address offsets 0-11 (0x0 - 0xB). The “1” state of this bit indicates an unre-coverable error condition in the field.Bit 7:This bits is not used and read as “0” under normal operation.Bit 8 - 15:These bits are used to configure channels 1 - 8 respectively for 3 or 4 wire op-eration. A “0” indicates 3 wire and a “1” indicates 4 wire operation, see Table 19A-7 and Table 19A-8).Word address 12 (0xC) is used to configure the appropriate scales for Channels 1 - 4 (refer to Table 19A-7 and Table 19A-8).Table 19A-6. Conversion Rate Conversion Rate (1/sec.)Bit 260 (for 60Hz systems)050 (for 50Hz systems)1Table 19A-7. Data Format for the Channel Scale Configuration Register(0xC)Bit Data Description Configuration (Write)Data Description Status (Read)0 Configure Channel #1scale - Bit 0Channel #1 scale configuration (read back) - Bit 01Configure Channel #1scale - Bit 1Channel #1 scale configuration (read back) - Bit 12Configure Channel #1scale - Bit 2Channel #1 scale configuration (read back) - Bit 23Configure Channel #1scale - Bit 3Channel #1 scale configuration (read back) - Bit 34Configure Channel #2 scale - Bit 0Channel #2 scale configuration (read back) - Bit 05Configure Channel #2 scale - Bit 1Channel #2 scale configuration (read back) - Bit 16Configure Channel #2 scale - Bit 2Channel #2 scale configuration (read back) - Bit 27Configure Channel #2 scale - Bit 3Channel #2 scale configuration (read back) - Bit 38Configure Channel #3 scale - Bit 0Channel #3 scale configuration (read back) - Bit 09Configure Channel #3 scale - Bit 1Channel #3 scale configuration (read back) - Bit 1Caution:Configuring any or all channel scales while the system is running will cause all channels to return attention status for up to two seconds following the reconfiguration.Caution:Configuring any or all channel scales while the system is running will cause all channels to return attention status for up to two seconds following the reconfiguration.10Configure Channel #3 scale - Bit 2Channel #3 scale configuration (read back) - Bit 211Configure Channel #3 scale - Bit 3Channel #3 scale configuration (read back) - Bit 312Configure Channel #4 scale - Bit 0Channel #4 scale configuration (read back) - Bit 013Configure Channel #4 scale - Bit 1Channel #4 scale configuration (read back) - Bit 114Configure Channel #4 scale - Bit 2Channel #4 scale configuration (read back) - Bit 215Configure Channel #4 scale - Bit 3Channel #4 scale configuration (read back) - Bit 3Table 19A-8. Data Format for the Channel Scale Configuration Register(0xE)Bit Data Description Configuration (Write)Data Description Status (Read)0 Configure Channel #5 scale - Bit 0Channel #5 scale configuration (read back) - Bit 01Configure Channel #5 scale - Bit 1Channel #5 scale configuration (read back) - Bit 12Configure Channel #5 scale - Bit 2Channel #5 scale configuration (read back) - Bit 23Configure Channel #5 scale - Bit 3Channel #5 scale configuration (read back) - Bit 34Configure Channel #6 scale - Bit 0Channel #6 scale configuration (read back) - Bit 05Configure Channel #6 scale - Bit 1Channel #6 scale configuration (read back) - Bit 16Configure Channel #6 scale - Bit 2Channel #6 scale configuration (read back) - Bit 27Configure Channel #6 scale - Bit 3Channel #6 scale configuration (read back) - Bit 38Configure Channel #7 scale - Bit 0Channel #7 scale configuration (read back) - Bit 09Configure Channel #7 scale - Bit 1Channel #7 scale configuration (read back) - Bit 110Configure Channel #7 scale - Bit 2Channel #7 scale configuration (read back) - Bit 211Configure Channel #7 scale - Bit 3Channel #7 scale configuration (read back) - Bit 312Configure Channel #8 scale - Bit 0Channel #8 scale configuration (read back) - Bit 013Configure Channel #8 scale - Bit 1Channel #8 scale configuration (read back) - Bit 114Configure Channel #8 scale - Bit 2Channel #8 scale configuration (read back) - Bit 215Configure Channel #8 scale - Bit 3Channel #8 scale configuration (read back) - Bit 3Table 19A-7. Data Format for the Channel Scale Configuration Register(0xC)19A-6. Diagnostic LEDsTable 19A-9. 8 Channel RTD Diagnostic LEDsLED DescriptionP (Green)Power OK LED. Lit when the +5V power is OK.C (Green)Communications OK LED. Lit when the Controller is communicatingwith the module.I (Red)Internal Fault LED. Lit whenever there is any type of error with themodule except to a loss of power. Possible causes are:n - Module initialization is in progress.n - I/O Bus time-out has occurred.n - Register, static RAM, or FLASH checksum error.n - Module resetn - Module is uncalibrated.n - Forced error has been received from the Controllern - Communication between the Field and Logic boards failedCH1 - CH 8 (Red)Channel error. Lit whenever there is an error associated with a channel or channels. Possible causes are:n - Positive overrangen - Negative overrangen Communication with the channel has failed。
TenarisHydril Wedge 523 521 Connections Running Ma
I d M C o d e G d L 00384/4 / M a r c h 2020TenarisHydrilWedge 523® / 521® ConnectionsScopeThese guidelines apply specifically to the use of TenarisHydril Wedge 523® and Wedge 521® connections. This document should be used inconjunction with the TenarisHydril Running Manual, which is the main document applicable to the running of all TenarisHydril premium connections.Tenaris Field Service Representatives can modify these guidelines when circumstances dictate. Implementation will only occur if the representative deems themodification to be non-detrimental to product integrity. All modifications being explained and agreed with the client representative prior to implementation and fully documented in the running report.References.TenarisHydril Running Manual..Premium Connection Approved Thread Compounds FTD29356..Recommended guidelines for the field inspection of TenarisHydril connections, GDL31457..Wedge 521® Handling plugs TSH-BD-35.0002..Wedge 523®Handling Plugs TSH-BD-34.0002.1. Verify the appropriate thread compound is available.2. Refer to document FTD29356 for a list of compounds approved by Tenaris.3. Latest version of the specific Product Data Sheet can be obtained from the T enaris website. In case this is unavailable, request the data sheet from the local T echnical Sales representative or *********************************.Pre-Running1. Never move or handle pipe without the correct thread protectors securely in place.2. Ensure connections are clean and free of all debris and / or contaminants, cleaning methods employed should conform to the recommendations contained within the TenarisHydril Running Manual.3. Visually inspect threads and seal areas prior to running, ensuring no damage is evident.4. Verify the connections to be assembled are genuine TenarisHydril manufactured connections.5. Verify compatibility of the Wedge 523® / 521®connection with any accessories such as pup joints, cross overs, cement heads, etc.6. Verify material grade of all accessories ensuring compatibility with main string.7. On Dopeless® Technology connections check the condition of both pin and box coating ensuring no peeloff or degradation has occurred.I D M C o d e G D L 00384/4 / M a r c h 20208. Check availability of handling plugs, minimum of 3 to ensure efficiency of running process.9. Check the handling plugs are in good condition and fit correctly onto pipe.10. Check single joint elevators have sufficient clearance to slide over the box expanded area and seat against the handling plug.11. Check the handling plugs are genuine TenarisHydril threads.12. Verify handling plug number and maximum lift capacity.13. Never exceed the maximum lift capacity. 14. Ensure handling plug OD / weight is compatible with the pipe connections, Wedge 523® / 521® have limited same OD / weight interchange capability. 15. Refer to the TenarisHydril running manual for the care and use of handling / lift plugs.Inspection1. Inspection criteria for all Wedge Series 500™connections is as outlined in the Field Service Operative Guideline GDL31457.2. Pay particular attention to seal areas of Wedge 523® connection.3. Check box and pin for signs of mashes ordeformation caused during transportation / handling. 4. Ensure there are no gouges, tears or raised material on seal saver area of Wedge 523® connection.Wedge 523® ConfigurationNo make up band on Wedge 523®.I D M C o d e G D L 00384/4 / M a r c h 2020Wedge 521® ConfigurationNo metal to metal seal on Wedge 521®.BandThread Compound Application1. Apply a thin coating of thread compound on the full pin end only, threads, seal and pin nose, the thread form should be clearly visible.2. Do not apply running compound to the box end.3. Thread compound should be cleaned from the box if received ‘rig ready’.I D M C o d e G D L 00384/4 / M a r c h 2020Thread Lock ApplicationConnections must be clean and dry when applying thread lock.1. Thread lock should be applied to 50% of the threads at the back of the pin connection.2. Running compound should then be applied to the threads and seal at the back of the box connection.3. When assembling standard non Dopeless ®Technology connections with thread lock use standard non Dopeless ® Technology torque values.Wedge 523® / 521® Dopeless ® Technology1. Minor rust or discolouring of the pin connection can be removed with the use of a clean, dry rag ensuring the Dopeless ® Technology coating remains intact.2. Minor rust or discolouring of the box connection can be removed with the use of a non abrasiveplastic scouring pad and a clean, dry rag ensuring the Dopeless ® Technology coating remains intact.3. Dopeless ® Technology connections do not require the application of thread compound for make up.4. If for whatever reason dope has to be applied to Dopeless ® Technology connections, whether both pin and box are Dopeless ® Technology or when mixing a standard connection with Dopeless ® Technology, apply thread compound as below:I D M C o d e G D L 00384/4 / M a r c h2020non dopeleSS ® pin into dopeleSS ® Box.Apply a thin coating of thread compound on the full pin end, threads and pin nose. Also Dope the pin seal of Wedge 523®.dopeleSS ® pin into Standard Box.Apply a thin coating of thread compound on the pin end threads only..Do not dope pin seal or box connection.dopeleSS ® pin into dopeleSS ® Box.Apply a very thin layer of thread compound on the pin threads only.. Do not dope pin seal or box connection.Wedge 523® / 521® Dopeless®Technology Thread Lock1. Ideally when running a Dopeless® Technology string the connections to be thread locked should be the non Dopeless® Technology variant with the connections cleaned of thread compound and completely dried, then thread lock and dope applied as per page 7.2. When thread locking Dopeless® Technology connections remove the Dopeless® T echnology coating from the threads on the pin connection where the thread lock is to be applied prior to the application of thread lock.3. Use a hand or rotary brass wire wheel to remove the Dopeless® Technology coating from the threads, ensuring no contact is made with the seal.4. Leave the Dopeless® Technology coating on the pin seal and threads where no thread lock is to be applied.5. Dopeless® Technology boxes should be washed with hot water then dried prior to thread locking.6. Thread lock should be applied to 50% of the pin threads furthest from the pin nose as per the diagram on page7.7. The application of thread compound is not required.8. Do not apply thread lock to the seal area. Torque Application1. Set tong dump valve at optimum torque then test on pipe body.2. For Dopeless® T echnology connections apply the specified torques as indicated on the T enarisHydrilDopeless® T echnology data sheet.I D M C o d e G D L 00384/4 / M a r c h 20203. For doped connections, apply the specified torques indicated on the T enarisHydril standard variant data sheet.4. Do not apply thread compound manufacturer’s friction factor.5. Standard doped variant, first connection make up;.Once optimum torque has been attained relax the tong and re-apply optimum torque..If movement over ½” is witnessed re-apply optimum torque +20%..Repeat process, checking to ensure no other factors areabsorbing the applied torque..Often the issue is caused by excessive application of thread compound..Continue making up further joints applying higher torque if required..Refer to the TenarisHydril Running Manual torqueapplication section.6. Double bump, (as above) every connection with an OD of 10 ¾” or larger.7. For Dopeless ® Technology connections applying optimum torque twice (double bump) is not necessary.8. When any doped variant is made up to a Dopeless ® Technology connection apply the doped variant torque values. Double bump the connection as point 5. 9. When applying thread lock to standard doped connections, doped version torque values +20% should be used then double bump the connection.10. When applying thread lock to Dopeless ®Technology connections, Dopeless ® Technology torque values +20% should be used then double bump the connection.11. Computer make up equipment is not mandatory for Wedge 523® / 521® connections in carbon steel, but is recommended.12. Computer make up equipment is stronglyrecommended for Wedge 523® / 521® connections in chrome steel.13. Graph analysis for Wedge 523® / 521® connections is similar to that for all Wedge Series 500™, refer to the TenarisHydril Running Manual make up acceptance section for further explanation.14. When computer equipment is used to monitor connection make up, the graph profiles should be similar to the one below.15. Wedge 523® connection has limited same size /weight interchange capability, if mixing weight / grade ensure compatibility of design and apply the higher torque value of the two connections.I DM C o d e G D L 00384/4 / M a r c h 202016. Wedge 521® connection has limited same size / weight interchange capability, if mixing weight / grade ensure compatibility of design and apply the higher torque value of the two connections.17. Wedge 521® and Wedge 523® connections are not interchangeable.18. Wedge 523® and 513® connections arecompatible in the same size / weight combination. For other weight combinations check the TenarisHydril premium connections catalogue.19. When correctly assembled, Wedge 521®connection box face should finish within the make up band lines.Wedge 521® Make Up BandRunning1. The use of a stabbing guide is strongly recommended.2. The use of slip type elevators are recommended.3. The use of a safety clamp is strongly recommended when running Wedge 523® / 521® connections.4. The use of a weight compensator is stronglyrecommended for chrome, large OD or heavy weight pipe.5. To avoid cross threading, stab pipe in a smooth controlled fashion ensuring the pipe is vertical when doing so, continue to support and stabilise the pipe throughout the make up operation.6. Upon commencement of initial rotation use low RPM (5 RPM or below) in order to ensure the pipe has not cross threaded during stabbing.7. If cross threading is evident, immediately reverse rotate the pipe, completely disassemble, clean and inspect both connections.8. Maximum assembly speeds are indicated in the tables below. These are applicable for running in singles with tong or CRT and assuming ideal conditions.9. Conditions may dictate lower assembly speeds than the maximums indicated. High winds or excessive pipe movement among other variables will necessitate a lower RPM to be used.I D M C o d e G D L 00384/4 / M a r c h 202010. Do not exceed 15 RPM during spin in.11. Walk chrome pipe all the way in to hand tight, then apply tong only for final make up.12. Ensure the back up tong is located below the box upset to prevent damage.13. A factor which may preclude complete assembly is excessive thread compound applied to the connection, reduce the quantity applied if this is found to be the case.Pulling1. The use of a stabbing guide is strongly recommended to prevent hang up.2. The use of slip type elevators is strongly recommended.3. A single joint compensator is strongly recommended for chrome, large OD or heavy pipe.4. The use of a safety clamp is strongly recommended.5. Apply the back up tong jaw well below the box.6. Apply power tong in low RPM (3-5 RPM) to break out the connection, ensuring the pipe is stabilised during the break out process.7. Do not exceed 15 RPM during spin out.8. Walk chrome pipe all the way out by hand after initial break out.9. Visual inspection is recommended to classify the thread condition, any rejected connections should be clearly marked and segregated for further investigation.10. Apply clean, dry thread protectors after applying storage compound on clean, dry connections.11. Storage / thread compound should always be applied to connections post job, even rejects.12. Do not apply storage compound to Dopeless®Technology connections.13. For long term storage of Dopeless® Technology connections, refurbishment by qualified personnel is recommended.14. Ensure clean, dry, Dopeless® Technology protectors with seal rings correctly in place are installed.Tenaris has produced this manual for general information only. While every effort has been made to ensure the accuracy of the information contained within this publication, Tenaris does not assume any responsibility or liability for any loss, damage, injury resulting from the use of information and data herein. Tenaris products and services are only subject to the Company’s standard terms and Conditionsor otherwise to the terms resulting from the respective contracts of sale, services or license, as the case may be. The information in this publication is subject to change or modification without notice. For more complete information please contact a Tenaris’s representative or visit our website at .This manual supersedes Version 03 / March 2018. ©Tenaris 2020. all rights reserved.。
西门子技术问题总汇
文档标题
如何设置模拟量输入模板 SM 431-7KF00的温度补偿？ 如何解决 SIMATIC BATCH 的 IL43基本设备上 hotfix 安装的问题？ 如果通过 PCS7 V6.1 SP1 DVD 单独安装 SIMATIC BATCH Report 需要注意哪些设置？ 为什么冗余模拟量输出模块的每个通道只有一半电流输出？ 使用WinCC/Web Navigator V6.1 SP1需要什么样的操作系统和软件？ 是否 COM PROFIBUS 可以使用所有版本的 GSD 文件？ 如何在 WinCC flexible 中组态与S7 控制器的 Profinet 连接? 如何在操作面板上设定定时器时间， 同时如何输出定时器的剩余时间？ 数据块初始值与实际值的含义 如何通过窗口对象滚动条步进调节过程值参数？ 使用 SINAUT ST7 向电子邮箱接受方发送文本信息 SMS 需要做何设置？ 可以使用CPU317-2PN/DP替代在iMap中组态的CPU315-2PN/DP吗? 什么情况下插入C-PLUG卡或者C-PLUG有什么作用? 通过一台PC，可以使用哪种方式访问与IWLAN/PB link PNIO或IE/PB link PNIO连接的PROFIBUS设备? 当在SINAUT网络中使用4线变压器应该注意哪些设置？ 在 SINAUT 网络中，使用MD3拨号调制解调器作为专线调制解调器时，要进行哪些设置？ 如何安装 DCF77 天线, 当选择 DCF77 天线时需要注意什么？ 使用SINAUT ST7向传真机发送文本信息时，需要进行哪些设置？ 在 SINAUT 项目中发送短消息必须进行哪些特殊服务的设置? 如何在S7-300 PN CPU和CP343-1之间建立一个open TCP 通讯连接，以及如何进行数据交换？ 如何在两个S7-300 PN CPU之间建立一个open TCP 通讯连接，以及如何进行数据交换？ 哪些控制系统可以成功与SINAUT ST7一起使用? 使用“零－Modem”电缆连接 TIM 模块应该注意什么？ 当用 SINAUT 诊断工具的ST1协议进行诊断时，为什么TIM的状态不能显示？ TIM 3V-IE 和 TIM 3V-IE Advanced 模块在以太网上通信时使用哪个端口号？ 如何对没有接入网络的S7-200CPU编程？ 掉电后，LOGO！的程序会丢失吗？ 从 PCS7 V6.1 起，为什么没有分配任何 hierarchy (PH) 的 测量点(变量)通过编译不能在OS中自动创建相应的变量？ 在SFC中，如何实现从一个 Sequencer 跳出后回到另一个 Sequencer 的某个固定位置并继续执行？ 如何实现过程变量的平均值归档？ 存储文件的目标路径和备份可选路径有何作用？ WinCC变量归档中如何实现采集周期小于500ms的变量归档？ 为什么在 OS 上会显示如下信息“时间跳变通知－永久切换为从站模式”? 在西门子A&D产品支持网站是否可以下载关于ET200M的手册？ 在S7-400上怎样安装冗余电源？ UDT改变后怎样更新使用UDT产生的数据块。 为什么在FB块中使用OUT变量赋值被调用FB块的IN变量时出现错误信息34：4469？ 如何查看4-mation导入-导出错误 不能正确引导8212-1QU IBM/Lenovo M52 ThinkCentre 实时趋势更新缓慢的原因 如何保存变量名字典CSV文件的格式
VS1053B中文资料应用
• EarSpeaker 空间效果注 2 处理
• 低音和高音控制 • 只用一个单独的 12..13MHz 时钟运作 • 也可以使用一个 24..26MHz 时钟运作 • 内建 PLL 时钟乘法器 • 低功耗运作 • 芯片内建高质量和通道间无相位误差的立体声 DAC • 过零交叉注 3（Zero‐cross）侦测和平滑的音量调整 • 立体声耳机驱动器可以驱动一个 30Ω 的负载 • 安静的电源通断功能 • 可扩展外部 DAC 的 I2S 接口 • 分离的模拟、数字、IO 供电电源 • 供用户代码和数据使用的片内 RAM • 用于控制和数据的串行接口 • 可以作为从模式的辅助处理器使用 • 特殊应用可使用 SPI FLASH 存储器引导 • 可用于调试的 UART 接口 • 可用软件增加新功能和提供最多 8 个 GPIO • 符合 RoHS 无铅标准的封装（绿色）
4.2 推荐工作值 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3 模拟电路特性 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
peRiodiCS包的说明书
Package‘peRiodiCS’October14,2022Type PackageTitle Functions for Generating Periodic CurvesVersion0.5.0Date2018-07-02Description Functions for generating variants of curves:restricted cubic spline,periodic restricted cubic spline,periodic cubic spline.Periodic splines can be used to model datathat has periodic nature/seasonality.License GPL-3BugReports https:///crtahlin/peRiodiCS/issuesDepends R(>=2.10)Imports graphics,Hmisc,rmsSuggests testthatLazyData trueRoxygenNote6.0.1NeedsCompilation noAuthor Crt Ahlin[aut,cre],Lara Lusa[aut]Maintainer Crt Ahlin<*******************>Repository CRANDate/Publication2018-07-0509:20:07UTCR topics documented:b_rcs (2)b_rcs_prime (2)cs_per (3)plot_per_mod (3)rcs_per (4)viral_east_mediteranean (5)Index712b_rcs_prime b_rcs Basis for restricted cubic splinesDescriptionFunction that derives the restricted cubic splines for a value/vector of values,given the knots;ob-tains exactly the same results as the rcs function included in the rms package.Usageb_rcs(x,knots,inclx=FALSE)Argumentsx numerical vectorknots vector specifying the knot locationsinclx logical,if TRUE returns also the x vectorb_rcs_prime Derivefirst derivatives of RCSDescriptionfunction that derives thefirst derivative of the restricted cubic splines for a value/vector of values, given the knotsUsageb_rcs_prime(x,knots)Argumentsx vector of valuesknots vector of knot locationscs_per3 cs_per Generate design matrix for periodic cubic splinesDescriptionGenerate design matrix for periodic cubic splines.Usagecs_per(x,knots=NULL,nk=5,xmax=max(x,na.rm=TRUE),xmin=min(x,na.rm=TRUE))Argumentsx numerical x values to transform to new basisknots vector with locations of the knots of the splinenk number of knots,used only if the knots are not specified,overridden otherwise xmax value of the(theoretical)minimum of xxmin value of the(theoretical)maximum of xExamples#load example data;see help("viral_east_mediteranean")data("viral_east_mediteranean")#calculate location of knots to useKnots<-Hmisc::rcspline.eval(x=viral_east_mediteranean$EpiWeek,nk=5,knots.only=TRUE)#model viral infections vs weeksmodel<-glm(RSV~cs_per(EpiWeek,knots=Knots),data=viral_east_mediteranean)#plot model(with many points,to make it smooth)plot_per_mod(Model=model,XvarName="EpiWeek",Smooth=TRUE)plot_per_mod Plotting function for periodic curves modelDescriptionPlots graph of periodic curves with confidence intervals.Data should be included in the model.4rcs_perUsageplot_per_mod(Model,XvarName,Ylab="Response",Xlab="Covariate",Ylim=NULL,Xlim=NULL,Xmin=NULL,Xmax=NULL,Knots=NULL,Title=NULL,Vlines=NULL,Hlines=NULL,b=NULL,Cex.main=NULL,Cex.axis=NULL,Axes=TRUE,Add=FALSE,Col="black",PlotCI=TRUE,Smooth=FALSE,xLocation=2)ArgumentsModel The built modelXvarName Name of the x variable in the dataset(column name)Ylab Label on vertical(y)axisXlab Label on horizontal(x)axisYlim Limits of y axisXlim Limits of x axisXmin The min X of data to be predicted(if Smooth)Xmax The max X of data to be predicted(if Smooth)Knots Locations of knots of the splinesTitle Title of the plotVlines Where to plot vertical linesHlines Where to plot horizontal linesb Character expansion(aka"size of font")for the labelsCex.main Character expansion for main textCex.axis Character expansion for the axis textAxes Plot axesAdd Add to existing plotCol Color of the plotted linesPlotCI Plot confidence intervalsSmooth Make the Xaxis values equidistant(and the curve smoother)xLocation If smooth FALSE,the location of the x term in model$x[,xLocation]rcs_per Generate design matrix for periodic restricted cubic splineDescriptionGenerate design matrix for periodic restricted cubic spline.Usagercs_per(x,knots=NULL,nk=5,xmin=min(x,na.rm=TRUE),xmax=max(x,na.rm=TRUE))Argumentsx numerical x values to transform to new basisknots vector with locations of the knots of the splinenk number of knots,used only if the knots are not specified,overridden otherwisexmin value of the(theoretical)minimum of xxmax value of the(theoretical)maximum of x#’@examples#load example data;see help("viral_east_mediteranean")data("viral_east_mediteranean")#calculate location of knots to use Knots<-Hmisc::rcspline.eval(x=viral_east_mediteranean$EpiWeek,nk=5,knots.only=TRUE)#model viral infections vs weeks model<-glm(RSV~rcs_per(EpiWeek,knots=Knots),data=viral_east_mediteranean)#plot model(with many points,to make it smooth)plot_per_mod(Model=model,XvarName="EpiWeek",Smooth=TRUE)viral_east_mediteraneanViral etiology,seasonality and severity of hospitalized patients withsevere acute respiratory infections in the Eastern Mediterranean Re-gion,2007-2014DescriptionData about infections with different viruses across several years.For more information see Source and References section.Usageviral_east_mediteraneanFormatA data frame with variables:UniqueID record identification numberEnrolled Did the patient consent and enroll in the study?:1=Yes,0=NoCountry Country of enrollment:Egypt,Jordan,Oman,Qatar,YemenEpiYear Year of enrollment:Integers(2007-2014)EpiMonth Month of enrollment:Integers(1-12)EpiWeek Week of enrollment:Integers(1-53)Interval Number of days between onset of symptoms and hospitalization:IntegerStay Number of days between hospitalization and outcome:IntegerSex Sex:1=Female,0=MaleAgeGrp Age group:1=<1year,2=1-4years,3=5-49years,4=50+yearsChronicDis Does the patient have any pre-existing chronic disease?:1=Yes,0=NoOxTherapy Did the patient receive oxygen therapy during hospitalization?:1=Yes,0=NoVentilated Was the patient ventilated during hospitalization?:1=Yes,0=NoICU Was the patient admitted to an intensive care unit during hospitalization?:1=Yes,0=NoOutcome What was the patient"’"sfinal hospitalization outcome?:1=Discharge,2=Transfer,3=Death RSV Results for respiratory syncytial virus:1=Positive,0=NegativeAdV Results for adenovirus:1=Positive,0=NegativehMPV Results for human metapneumovirus:1=Positive,0=NegativehPIV1Results for human parainfluenzavirus type1:1=Positive,0=NegativehPIV2Results for human parainfluenzavirus type2:1=Positive,0=NegativehPIV3Results for human parainfluenzavirus type3:1=Positive,0=NegativeFlu Results for influenza:1=Positive,0=NegativeSource/plosone/article?id=10.1371/journal.pone.0180954ReferencesHorton,Katherine C.AND Dueger,Erica L.AND Kandeel,Amr AND Abdallat,Mohamed AND El-Kholy,Amani AND Al-Awaidy,Salah AND Kohlani,Abdul Hakim AND Amer,Hanaa AND El-Khal,Abel Latif AND Said,Mayar AND House,Brent AND Pimentel,Guillermo AND Talaat, Maha(2017).Viral etiology,seasonality and severity of hospitalized patients with severe acute respiratory infections in the Eastern Mediterranean Region,2007-2014.PLOS ONE,12,1-17.Index∗datasetsviral_east_mediteranean,5b_rcs,2b_rcs_prime,2cs_per,3plot_per_mod,3rcs_per,4viral_east_mediteranean,57。
浩康科技与Velosti发布USB3.0超高速硬件加密优盘方案说明书
设为主页 | 登录 | 现在注册 | 订阅电子快讯 | 杂志订阅首页新闻设计中心专题下载视频论坛博客小组微博在线研讨会热点搜索：Webench设计大赛谐振放大器PSoC4充电器网络分析仪尝试E源搜索，享受专业体验文章搜索高级搜索温馨提示：访问论坛和博客的设置方法[特刊] 新一期《分销与供应链特刊》订阅《EDN电子技术设计》杂志研发、品管、热分析全套红外解决方案作者: 浩康科技上网日期: 2013年05月27日打印版订阅存储器热点厂商方案推荐：加英特尔官方微博获得专业技术支持浩康科技联同Velosti发布USB3.0超高速硬件加密优盘关键字：USB3.0 硬件加密优盘浩康科技2013年5月21日，香港浩康科技（Crypton Tech）发布了USB3.0超高速AES / UCA硬件加密优盘方案。
在高速数据传输领域，数据传输速度和保密性是两个最重要的考察指标，该方案成功满足了这两个指标。
方案采用Velosti USB3.0 控制器 (以32位ARM架构为基础 )，内置AES /UCA 硬件加密机制，具有保密性好，极难破解的特点，而且速度比一般USB2.0优盘快 10 倍左右。
方案特点以ARM 32bits为基础，快速进行AES加密支持USB3.0并向下兼容 (有USB-IF USB3.0证书及FIPS加密证书 )密码输入错误10次时，优盘将自动格式化优盘采用AES硬件配合个人密码进行加密采用UCA 保密, 用户可选择只有在特定电脑上才能读取优盘资料，加强保密性，不怕密码外泄UCA 保密基于用户密码和电脑签名等信息，计算出保密信息，极难破解。
支持Mac/Windows XP/Vista/7/8系统方案内容方案采用四层沉金板，Velosti VLS5100 搭配32GB MLC ( 16GB x 2) 闪存芯片，外围元器件较少，布线简单。
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AURIX TC39x-B User's Manual
AURIX™ TC39x-BAbout this documentScope and purposeThe Appendix supplies information specific for the TC39x-B supplementing the family documentation.Table of ContentsAbout this document. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Preface-1Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TOC-11Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12Memory Maps (MEMMAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.2Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.2.1Segments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.3Bus Fabric SRI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.4Bus Instance SPB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11 2.5Bus Instance BBB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15 2.6Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-183TC39x-B Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.1Checker Software exit information for ALL CHECKS PASSED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.2Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 4On-Chip System Connectivity {and Bridges} . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 4.3.1sri slave interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 4.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 4.5Interconnection Matrices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 4.5.1Domain 0 Interconnection Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 4.5.2Domain 1 Interconnection Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 4.5.3Domain 2 Interconnection Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8 4.6Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9 4.7FPI Bus Control Units (SBCU, EBCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10 4.7.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10 4.7.2SBCU Control Unit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11 4.7.2.1SBCU Control Registers Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14 4.7.2.2SBCU OCDS Registers Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16 4.7.3EBCU Control Unit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27 4.7.3.1EBCU Control Registers Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30 4.7.3.2EBCU OCDS Registers Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32 4.7.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-39 4.7.4.1SBCU Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-39 4.7.4.2EBCU Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-39 4.7.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-39 5CPU Subsystem (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 5.1TC39x-B Specific Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 5.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 5.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-48 5.3.1SRI slave interface for SFR+CSFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-48 5.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-49 5.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-496.1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 6.2Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4 6.3Data Memory Unit (DMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5 6.3.1TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6 6.3.2TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12 6.3.3Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12 6.3.4Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12 6.4Non Volatile Memory (NVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-13 6.4.1TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14 6.4.2Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18 6.4.3Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18 7Local Memory Unit (LMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 7.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 7.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4 7.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4 7.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4 8Default Application Memory (DAM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-18.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 8.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 8.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-3 8.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-3 8.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-4 9System Control Unit (SCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-19.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 9.1.1LBIST considerations for TC39x-B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 9.1.1.1TC39x BA/BB/BC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 9.1.1.2TC39x BD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 9.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3 9.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-11 9.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-11 9.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-15 10Clocking System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1 11Power Management System(PMS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1 11.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1 11.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-2 11.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-6 11.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-7 11.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-7 12Power Management System for Low-End (PMSLE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1 13Memory Test Unit (MTU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1 13.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1 13.1.1Handling of Large DSPR SRAMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1 13.1.2SRAMs with Address ECC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1 13.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-213.3.2MEMMAP Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-12 13.3.3MEMSTAT Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-16 13.3.4MEMDONE Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-21 13.3.5MEMFDA Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-29 13.4SSH Instances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-37 13.4.1Ganging for SRAM test and initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-40 13.5Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-43 13.6Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-45 14General Purpose I/O Ports and Peripheral I/O Lines (Ports) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-1 14.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-1 14.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-1 14.3Pn Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-39 14.3.1SPB bus slave interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-39 14.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-162 14.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-163 15Safety Management Unit (SMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-1 15.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-1 15.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-1 15.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-3 15.3.1TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-4 15.3.1.1FPI slave interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-4 15.4TC39x-B Specific Alarm Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-18 15.4.1TC39x-B Specific Pre-Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-18 15.4.2TC39x-B Specific Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-27 15.5Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-50 15.6Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-50 16Interrupt Router (INT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-1 16.1TC39x-B Specific Interrupt Router Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-1 16.2TC39x-B Specific Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-2 16.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-4 16.4TC39x-B Specific Service Request Control (SRC) registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-5 16.5TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-11 16.5.1IR Service Request Control Registers (SRC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-11 16.6Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-36 17Flexible CRC Engine (FCE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-1 17.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-1 17.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-2 17.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-3 17.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-3 17.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-3 18Direct Memory Access (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-1 18.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-1 18.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-1 18.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-4 18.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-4 18.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-419.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19-1 19.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19-11 19.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19-11 19.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19-12 20SPU Lockstep Module (SPULCKSTP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-1 20.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-1 20.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-1 20.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-2 20.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-2 20.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-2 21Extended Memory (EMEM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-1 21.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-1 21.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-1 21.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-7 21.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-7 21.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-7 22Radar Interface (RIF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 22.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 22.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 22.2.1Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 22.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 22.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 22.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-3 23High Speed Pulse Density Modulation Module (HSPDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-1 23.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-1 23.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-1 23.2.1Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-1 23.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-1 23.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-1 23.4.1Connections Regarding Hardware Run Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-1 23.4.2Pinning and Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-2 23.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-2 24Camera and ADC Interface (CIF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24-1 25System Timer (STM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-1 25.1TC39x-B Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-1 25.2TC39x-B Specific Register Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-1 25.3TC39x-B Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-1 25.4Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-1 25.5Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-3 26Generic Timer Module (GTM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-1 26.1TC39x Specific IP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-1 26.2TC39x-B Specific Registers Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-6 26.3TC39x Specific Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-38 26.3.1GTM IP Registers Specific Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-38 26.3.2Port to GTM TIM Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-57。
DPS050A186A_Bipane_Specification_20150518_v4
(0.020)
(26.0) 60 fFLM x 2
Frame Frequency TP Frame Frequency
fFLM TPfFLM
-
Notes (1) VDDI=1.8V, AVDD=3.3V, VDDF-=2.5V, fFLM=60Hz, Column inversion mode, MIPI Video mode. (2) TP active mode. （No fingers) (3) The value is a frame frequency when the data of Item as follows is set to the register. When changing setting data, please contact us. (4) VDDF voltage level is depended on Flash IF spec. VDDF<AVDD Parameter
TCLK-PRE
300 8UI 38 60 50
95
105+12UI
Japan Display Inc.
Date
Feb. 26, 2015
Sh. No.
DPS050A186A
Page
5-1/1
6. OPTICAL CHARACTERISTICS
LCD (BACKLIGHT ON) Item Transmittance Viewing Angle Contrast Ratio Red Green Color Tone (Primary Color) Blue White NTSC Ratio Response Time Measurement Conditions Measurement environment Ambient temperature Power supply voltage Backlight Polarizer Symbol T φ1+φ2 CR x y x y x y x y tr+tf Condition φ=0°, θ=0° θ=0°, CR>10 θ=90°, CR>10 φ=0°, θ=0° Min (2.85) 700 (0.607) (0.301) (0.267) (0.565) (0.125) (0.028) (0.260) (0.282) 65 Typ 3.48 160 160 1000 (0.637) (0.331) (0.297) (0.595) (0.155) (0.058) (0.290) (0.312) 70 25 Max (0.667) (0.361) (0.327) (0.625) (0.185) (0.088) (0.320) (0.342) Unit % deg Note
英特尔Stratix10器件数据表说明书
• –E1V (最快) • –E2V • –E2L • –E3V • –E3X
• –I1V • –I2V • –I2L • –I3V • –I3X
支持的速度等级
速度等级的后缀表示 Intel Stratix 10 器件中提供的功耗选项。
• V—标准静态功耗的 SmartVID。对于“V”后缀器件，VCC 和 VCCP 必须共享同一个 SmartVID 调节器。VCCL_HPS 可以共享同一个 SmartVID 调节器，或者使用一个单独的固定电压调节器。
• L—低静态功耗的 0.85 V 固定电压
• X—最低静态功耗的 0.85 V 固定电压
英特尔公司。保留所有权利。英特尔、英特尔徽标和其他英特尔标志是英特尔公司或其子公司的商标。依照英特尔的标准保证条例，英特尔保证其 FPGA 和半导体产品的性能符合当前规
格，但保留随时更改任何产品和服务的权利，恕不另行通知。英特尔概不承担因应用或使用本文中描述的任何信息、产品或服务而产生的任何责任和义务，除非得到英特尔书面上的明确同 意。建议英特尔客户在信赖任何已发布的信息之前以及下单订购产品或服务之前，应先获取最新版本的器件规格。 *其他的名称和品牌可能是其他所有者的资产。
Intel® Stratix® 10 器件数据表........................................................................................................................................................ 3 电气特性.......................................................................
NA5TR1 PDF
Maxim_Integrated-DS32KHZ_DIP-datasheet.1.pdf - DS
DS32kHz32.768kHz Temperature-CompensatedCrystal OscillatorGENERAL DESCRIPTIONThe DS32kHz is a temperature-compensated crystal oscillator (TCXO) with an output frequency of 32.768kHz. This device addresses applications requiring better timekeeping accuracy, and can be used to drive the X1 input of most Dallas Semiconductor real-time clocks (RTCs), chipsets, and other ICs containing RTCs. This device is available in commercial (DS32kHz) and industrial (DS32kHz-N) temperature versions.APPLICATIONSGPS Receivers TelematicsNetwork Timing and Synchronization in Servers, Routers, Hubs, and Switches Automatic Power MetersFEATURESAccurate to ±4 Minutes/Year (-40°C to +85°C) Accurate to ±1 Minute/Year (0°C to +40°C) Battery Backup for Continuous Timekeeping V BAT Operating Voltage: 2.7V to 5.5V with V CCGroundedV CC Operating Voltage: 4.5V to 5.5V Operating Temperature Range:0°C to +70°C (Commercial) -40°C to +85°C (Industrial)No Calibration Required Low-Power ConsumptionSurface Mountable Using BGA Package UL RecognizedORDERING INFORMATIONPARTTEMP RANGEPIN-PACKAGETOP MARK*DS32KHZ/DIP 0ºC to +70ºC 14 DIP DS32KHZ DS32KHZN/DIP -40ºC to +85ºC 14 DIPDS32KHZ-N DS32KHZS 0ºC to +70ºC 16 SO (0.300”) DS32KHZS DS32KHZS# 0ºC to +70ºC 16 SO (0.300”) DS32KHZS DS32KHZSN -40ºC to +85ºC 16 SO (0.300”) DS32KHZSN DS32KHZSN# -40ºC to +85ºC 16 SO (0.300”) DS32KHZSN DS32KHZ/WBGA 0ºC to +70ºC 36 BGA DS32KHZ DS32KHZN/WBGA-40ºC to +85ºC36 BGADS32KHZ-N#Denotes a RoHS-compliant device that may include lead that is exempt under the RoHS requirements. The lead finish is JESD97 category e3, and is compatible with both lead-based and lead-free soldering processes.*A “#” anywhere on the top mark denotes a RoHS-compliant device. An “N” denotes an industrial device.PIN CONFIGURATIONSABSOLUTE MAXIMUM RATINGSVoltage Range on Any Pin Relative to Ground………………………………………………………………-3.0V to +7.0V Operating Temperature Range (Noncondensing)Commercial:…………………………………………………………………………………………………..0°C to +70°CIndustrial:……………………………………………………………………………………………………-40°C to +85°CStorage Temperature Range………………………………………………………………………………….-40°C to +85°C Soldering Temperature (BGA, SO)……………………….See the Handling, PC Board Layout, and Assembly section. Soldering Temperature, Leads (DIP)……………………………………………………..+260°C for 10 seconds (Note 1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications isnot implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.RECOMMENDED DC OPERATING CONDITIONS(T A = -40°C to +85°C) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITS Power-Supply Voltage V CC(Note2) 4.5 5.0 5.5 VBattery Voltage V BAT(Notes 2, 3) 2.7 3.0 3.5,5.5VDC ELECTRICAL CHARACTERISTICS(Over the operating range, unless otherwise specified.) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITSActive Supply Current I CC V BAT = 0V or2.7V ≤ V BAT≤3.5V(Notes 3, 4)150 220 μABattery Input-Leakage Current I BATLKG V CC MIN≤ V CC≤ V CC MAX -50 +50 nAHigh Output Voltage (V CC) V OH I OH = -1.0mA (Note 2) 2.4 VLow Output Voltage V OL I OL = 2.1mA (Note 2) 0.4 VHigh Output Voltage (V BAT) V OH I OH = -0.1mA (Note 2) 2.4 VBattery Switch Voltage V SW(Note 2) V BAT V(V CC = 0V, T A = -40°C to +85°C.) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITS Active Battery Current I BAT V BAT = 3.3V (Notes 4, 5, 6) 1 4 μABattery Current DuringTemperature MeasurementI BATCNV V BAT = 3.3V (Notes 4, 5, 7) 450 μANote 1:Limits at -40°C are guaranteed by design and are not production tested.Note 2:All voltages are referenced to ground.Note 3:V BAT must be no greater than 3.5V when the device is used in the dual-supply operating modes.Note 4:Typical values are at +25°C and 5.0V V CC, 3.0 V BAT, unless otherwise indicated.Note 5:These parameters are measured under no output load conditions.Note 6:This current is the active-mode current sourced from the backup supply/battery.Note 7: A temperature conversion lasts 122ms (typ) and occurs on power-up and then once every 64 seconds.AC TIMING CHARACTERISTICS(Over the operating range, unless otherwise specified.)PARAMETER SYMBOLCONDITIONSMINTYPMAXUNITSOutput Frequency f OUT32.768kHz0°C to +40°C -2.0 +2.0Frequency Stability vs. Temperature ∆f/f O-40°C to +85°C or0°C to +70°C-7.5 +7.5ppmDuty Cycle t W/t 45 50 55 % Cycle Time t CYC(Note 8) 30.518 μsHigh/Low Time t H/t L(Note8) 15.06 μsRise Time t R(Note 8) 200 nsFall Time t F(Note8) 60 ns Oscillator Startup Time t OSC(Note 8) 1 secondsFrequency Stability vs. Operating Voltage ∆f/VV CC = 5.0V orV BAT = 3.0V, V CC = 0V(Notes 4, 9)+2.5 ppm/VCrystal Aging (First Year) ∆f/f O(Notes 4, 10) ±1.0 ppmNote 8:These parameters are measured using a 15pF load.Note 9:Error is measured from the nominal supply voltage of whichever supply is powering the device.Note 10:After reflow.TYPICAL OPERATING CHARACTERISTICSPIN DESCRIPTIONPINSO BGA DIPNAME FUNCTION1 C4, C5, D4, D5 12 32kHz 32.768kHz Push-Pull Output2 C2, C3, D2, D3 13 V CC Primary Power Supply3–12, 15, 16 A7, A8, B7, B8,C7, C8, D7, D81, 6–11, 14 N.C. No Connection (Must be grounded)13 All remainingballs4 GNDGround14 A4, A5, B4, B5 5 V BAT +3V Nominal Supply Input. Used to operate the device when V CC is absent.Figure 2. Delta Time and Frequency vs. TemperatureFUNCTIONAL DESCRIPTIONThe DS32kHz is a temperature-compensated crystal oscillator (TCXO) that outputs a 32,768Hz square wave. While the DS32kHz is powered by either supply input, the device measures the temperature every 64 seconds and adjusts the output frequency. The device requires four pins for operation: V CC, GND, V BAT, and 32kHz. (See Figure 4 for connection schemes.) Power is applied through V CC and GND, while V BAT is used to maintain the 32kHz output in the absence of power. Once every 64 seconds, the DS32kHz measures the temperature and adjusts the output frequency. The output is accurate to ±2ppm (±1 min/yr) from 0°C to +40°C and to ±7.5ppm (±4 min/year) from -40°C to 0°C and from +40°C to +85°C.The DS32kHz is packaged in a 36-pin ball grid array (BGA). It also is available in a 16-pin 0.300” SO and a 14-pin encapsulated DIP (EDIP) module.The additional PC board space required to add the DS32kHz as an option for driving a RTC is negligible in many applications (see Figure 6) Therefore, adding the DS32kHz to new designs and future board revisions allows the use of the DS32kHz where applications require improved timekeeping accuracy.Figure 3. Block DiagramOPERATIONThe DS32kHz module contains a quartz tuning-fork crystal and an IC. When power is first applied, and when the device switches between supplies, the DS32kHz measures the temperature and adjusts the crystal load to compensate the frequency. The power supply must remain at a valid level whenever a temperature measurement is made, including when V CC is first applied. While powered, the DS32kHz measures the temperature once every 64 seconds and adjusts the crystal load.The DS32kHz is designed to operate in two modes. In the dual-supply mode, a comparator circuit, powered by V CC, monitors the relationship between the V CC and V BAT input levels. When V CC drops below a certain level compared to V BAT, the device switches over to V BAT (Figure 4A). This mode uses V CC to conserve the battery connected to V BAT while V CC is applied.In the single-supply mode, V CC is grounded and the unit is powered by V BAT. Current consumption is less than V CC, because the comparator circuit is unpowered (Figure 4B).Figure 4A shows how the DS32kHz should be connected when using two power supplies. V CC should be between 4.5V and 5.5V, and V BAT should be between 2.7V and 3.5V. Figure 4B shows how the DS32kHz can be used when only a single-supply system is available. V CC should be grounded and V BAT should then be held between 2.7V and 5.5V. The V BAT pin should be connected directly to a battery. Figure 4C shows a single-supply mode where V CC is held at +5V. See the frequency stability vs. operating voltage for information about frequency error vs. supply voltage.Figure 4. Power-Supply ConnectionsFigure 5 illustrates how a standard 32.768kHz crystal and the DS32kHz should be connected to address the interchangeable option. Using this connection scheme and the recommended layout provides a solution, which requires no hardware modifications. Only one device should be used at a time, and both layouts should be located very close together if the recommended layout is not used.The DS32kHz I CC and I BAT currents are specified with no output loads. Many RTC oscillator circuits use a quartz crystal or resonator. Driving the oscillator circuit with the rail-to-rail output of the DS32kHz can increase the I CC and I BAT currents significantly and increase the current consumption of the RTC as well. Figure 6 shows one circuit that can be used to reduce the current consumption of a DS32kHz and an RTC. The values of R1 and C1 may vary depending on the RTC used. However, values of 1.0MΩ and 100pF are recommended as a starting point. R2 is used to shift the input waveform to the proper level. The recommended value for R2 is 33kΩ.Figure 5. DS32kHz ConnectionsFigure 6. DS32kHz and RTC ConnectionsRELATED APPLICATION NOTES(Go to /RTCapps to find these application notes and more.)Application Note 58: Crystal Considerations with Dallas Real-Time ClocksApplication Note 701: Using the DS32kHz with Dallas RTCsHANDLING, PC BOARD LAYOUT, AND ASSEMBLYThese packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent damage to the crystal.Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line. All N.C. (no connect) pins must be connected to ground.The BGA package may be reflowed as long as the peak temperature does not exceed 240°C. Peak reflow temperature (≥230°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed 40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that the internal crystal is not exposed to temperatures above 150°C.Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package label must be followed to prevent damage during reflow. Refer to IPC/JEDEC J-STD-020 standard for moisture-sensitive device (MSD) classifications.PACKAGE INFORMATION(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package information,o to /DallasPackInfo.)gPACKAGE TYPE DOCUMENT NUMBER THETA-J A(°C/W)THETA-J C(°C/W)14-pin Encapsulated DIP 56-G0001-00216-pin SO (300 mils) 56-G4009-00173 23 36-pin BGA 56-G6023-00143.9 18.48 of 8Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product. No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time. Maxim In tegrated P roducts, 120 S an Gabriel D rive, Sun nyvale, CA94086 408-737-7600。
Fujikura FTS-B559 S124 Quick Reference Guide
S124 Quick Reference GuideFTS-B559Issue 1Safety InstructionsBefore operating this device, please consult the user manual for safety instructions. These guidelines will enable you to operate the product in a safe and correct manner in order to prevent harm to yourself and others.① Turn on power.< Fiber Preparation > Stripping of fiber coatingFiber CleaningFiber CleavingPlace fiber holder on the S326R cleaverHold the stripper tightly. Then move stripper into the direction indicated by the arrow mark.Splicing ProcedureEnd.⑫ Remove the fiber.⑪ Presskey or icon.⑩ Transfer fiber into heater. ⑨ Slide protection sleeve oversplice point. ⑧ Remove spliced fiber. ⑦ Presskey or icon.⑥ Set fibers in splicer. ⑤ Prepare the fibers. ④ Insert fiber in protection sleeve. ③ Perform Arc Check.※ Please see “Arc Check” fordetails. ② Select applicable program. Setting the fiber on the splicerPress lever.Lint-free tissue with FPF or ethanol alcoholS218R-Plus or S218R-200Select applicable heater program.< Fusion Program>Tap the fusion program area on the touchscreen or press key and select Fusion Program.< Heater Program>Select applicable fusion program.Open the windshield and set the fibers.Then enter “Arc Check”. Splicer automatically feeds the fibers and discharges an arc.The result is indicated. If the result is negative,please perform the arc check again.Procedure for Changing ProgramsArc CheckAn arc check is the function to adjust the arc power in order to ensure optimal splicing results. Electrode wear and environmental conditions such as temperature, humidity, and altitude, may affect the arc power.Please perform the Arc Check at the beginning of your working day.Tap the heater program area on the touchscreen, or press key and select Heater ProgramTo ensure optimal splicing results< Cleaning V-groove> < Cleaning Fiber Clamps> Maintenance< Cleaning Electrodes> < Cleaning Objective Lens > Clean V-groove by using the cleaning brushprovided or a cotton swab soaked with ethanol.Run fiber across V-groove to remove dust in V-groove.Clean Fiber Clamps byusing a cotton swab soaked with ethanol.Remove the electrode form the electrode holder. Then replace with a new electrode. After replacement, press the key 10 times, after closing the windshield to remove any dust.< Replacement of Electrodes>Stick the tip of the electrode into the electrode sharpener and turn/twist the electrode 3-4 times. Fiber ClampElectrode Sharpener Cleaning brushRemove both electrodes and V-groove. Then clean Objective Lens by using cotton swab soaked with ethanol.Objective LensAttach the electrode holder in order from the front side to the back side.Front SideBack SideFusion SplicerOperation KeysScreen IndicationStorage SpaceAccessory CasePower KeyTurn the power on/off.Start KeyStart/Pause/Restart the splicing processHeating KeyStart / Stop the heating processUp/Down KeysMove the cursor and change the valueEscape KeyCancel the current actionMenu KeyShow the menu.Enter KeySelect the menu item Determine the valuePower SupplyDo not use an inappropriate input voltage. Doing so may cause fire, electric shock or malfunction.Power PortPlease use supplied AC adapter or optional car cigarette cable.Selected Splice programSelected Heater program Splice ProcessFiber ViewTimeBattery Status Arc CountMenu IconStart IconHeater Start IconStatus IconView Selector。
My Oracle Support 帮助 发行版 15.3 E58521-04 2015 年 7 月
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计算机基础教程第一章2021推选
1812年差分机
由许多轮子组成的保存数据的存储库； 运算装置； 能对操作顺序进行控制，并选择所需处理 的数据以及输出结果的装置。
现代计算机体系结构 冯·诺依曼机：“存储程序”的 概念 五十多年来，计算机系统基本结 构没有变。
英国科学家艾兰.图 灵
•建立图灵机（Turing machine）模型， 奠定了可计算理论的基础；
1 现代信息技术基础知识
工作站：介于PC与小型机之间
高分辨率、大容量内外存，图形功能较强
网络计算机：基于Java技术的瘦客户机系统
1.1.5 未来新型计算机
1．光子计算机：利用光子作为信息的传输媒体。
2．生物计算机（分子计算机）：生物计算机在20世 纪80年代中期开始研制，其最大的特点是采用了生物 芯片。
1.1.3 计算机的分代
时代 年份
器件
软件
应用
一
46-58
电子管
机器语言汇编语言
科学计算
二
58-64
晶体管
高级语言
数据处理工业控制
三64-71集来自电路操作系统文字处理图形处理
四 71年迄今 大规模集成电路 数据库、网络等 社会的各个领域
1.1.4 计算机的分类
巨型机：速度最快、处理能力最强
例如：曙光4000L644GB内存，浮点运算达每秒3万亿次
冯·诺依曼机：“4存.储政程序府”的：概电念 子政府
娱乐：虚拟现实、电影特技
5. 6.
CAD/CAM/CIMS
娱乐：虚拟现实、电影特技
6.
2政现府代：信电息子技政术府的6内. 容科研：数据采集、计算分析
5. 7. 家庭：家庭信息化
计算机的应用类型
1. 科学计算 2. 数据处理 3. 电子商务 4. 过程控制 5. CAD/CAM/CIMS 6. 多媒体技术 7.虚拟现实 8. 人工智能
SCI串行通信寄存器说明
1、波特率控制寄存器（SCIBDH、SCIBDL)SCIBDH： SCI基地址+0SCIBDL： SCI基地址+1IREN:红外调制，解调子模块使能位1 使能0 禁止TNP[0..1]:窄脉冲发射位，红外调制，解调时，窄脉冲对应位0，无窄脉冲对应位111 窄脉冲宽度为位宽度的1/4 10 1/32 01 1/16 00 3/16SBR[0..12]:波特率设置位When IREN = 0 then,SCI 波特率= SCI bus clock / (16 x SBR[12:0])When IREN = 1 then,SCI baud rate = SCI bus clock / (32 x SBR[12:1])【说明】波特率发生器在复位后是禁止的，在设置TE、RE(在SCICR2寄存器中)后才会工作。
当(SBR[12:0] = 0 and IREN = 0) 或者(SBR[12:1] = 0 andIREN = 1)，波特率发生器不工作。
【注意】在未写入SCIBDL，写SCIBDH没有反应。
一般地，设置IREN=0，SR=52(总线频率8MHz)，波特率为9600波特率由MCU内部总线时钟BUSCLK分频而来，SCI模块需要的工作时钟频率为波特率的16倍，发送器和接收器应具有相同的波特率和数据格式。
波特率高位寄存器加波特率低位寄存器共16位，只有低13位为波特率分频因子（这13位数SBR可表示的值为0到8191，其中SBR[12:0]=0表示SCI停止工作，以便节省电能）2、数据寄存器(SCIDRH、SCIDRL)当使用8位数据模式是，只使用SCIDRL寄存器。
当使用9位数据格式时，两个寄存器都要使用，发送时，先写SCIDRH寄存器，在写SCIDRL寄存器。
当SCI配置为9位数据格式时，R8位收到的第九位数据，T8则用于存放要发送的第9位数据。
对SCIDRL读出时，为接收到的数据，写入时，为要发送的数据。
电表专业英语（中英文）
电表专业英语（中英文）集中器——concentrator采集器——acquisition unit有功电度表——watt-hour meter静止式有功电度表——static watt-hour meter 多费率电度表/仪表——multi-rate meter预付费电度表——prepayment watt-hour meter 电度表/仪表型式——meter type测量器件/元件——measuring element测试输出——test output工作指示器——operation indicator贮存器——memory非易失贮存器——non-volatile memory显示器——display计度器——register电流线路——current circuit电压线路——voltage circuit辅助线路——auxiliary circuit常数——constant室内仪表——indoor meter室外仪表——outdoor meter表底——base插座——socket表盖——meter cover表壳——meter case可触及导电部件——accessible conductive part 保护接地端——protective earth terminal端子座——terminal block端子盖——terminal cover间隙——clearance爬电距离——creepage distance基本绝缘——basic insulation附加绝缘——supplementary insulation双重绝缘——double insulation加强绝缘——reinforced insulationI类防护绝缘包封仪表——insulating encased meter of protective class III类防护绝缘包封仪表——insulating encased meter of protective class II参比电流——reference current基本电流*（Ib)——basic current （Ib)额定电流*（In)——rated current （In)最大电流*（Imax)——maximum current （Imax)参比电压*（Un)——reference voltage（Un)参比频率——reference frequency等级指数——class index百分数误差——percentage error影响量——influence quantity参比条件——reference conditions 由影响量引起的误差改变量——variation of error due to an influence quantity畸变因数——distortion factor电磁骚扰——electromagnetic disturbance参比温度——reference temperature平均温度系数——mean temperature coefficient额定工作条件——rated operating conditions规定的测量范围——specified measuring range规定的工作范围——specified operating range极限工作范围——limit range of operation贮存和运输条件——storage and transport conditions正常工作位置——normal working position热稳定性——thermal stability型式试验——type test标准表——reference meter无功功率（乏）——reactive power(var)无功电能（乏一小时）——reactive energy(var-hour) 单相电路中无功电能——reactive energy in a single-phase circuit 三相电路中无功电能——reactive energy in a three-phase circuit无功电度表——var-hour meter静止式无功电度表——static var-hour meter无功功率的方向和符号——directions and sign of reactive power输出装置——output devices感应式仪表——induction meter仪表转子——meter rotor仪表驱动元件——meter driving element仪表制动元件——meter braking element仪表计度器（计数机构）——register of a meter(counting mechanism)仪表底座——meter base仪表插座——meter socket仪表基架——meter frame接线端座——terminal block接线端盖——terminal cover基本转速——basic speed基本转矩——basic torque仪表常数——meter constant绝缘——insulation型式——type型式检验——type test型式验证程序——type approval procedure鉴定程序——qualification procedure影响量或影响因数——influence quantity or factor 垂直工作位置——vertical working position等级指数——class index测量单元——measuring unit数据处理单元——data processing unit多功能电能表——multifunction watt-hour meter 需要周期——demand interval最大需量——maximum demand滑差时间——sliding window time尖、峰、谷、平时段——（sharp、peak、shoulder、off—peak time consumption）额定最大脉冲频率——rated maximum impulse frequency最大需量复零装置——maximum demand reset zero unit辅助电源——auxiliary supply产品——item修理的产品——repaired item不修理的产品——non-repaired item服务——service规定功能——required function时刻——instant of time时间区间——time interval持续时间——time duration累积时间——accumulated time量度——measure工作——operation修改——modification(of an item)效能——effectiveness固有能力——capability耐久性——durability可靠性——reliability维修性——maintainability维修保障性——maintenance support performance 可用性——availability可信性——dependability失效——failure致命失效——critical failure非致命失效——non-critical failure误用失效——misuse failure误操作失效——mishandling failure弱质失效——weakness failure设计失效——design failure制造失效——manufacturing failure老化失效；耗损失效——ageing failure；wearout failure突然失效——sudden failure渐变失效；漂移失效——gradual failure；drift failure灾变失效——cataleptic failure 关联失效——relevant failure非关联失效——non-relevant failure独立失效——primary failure从属失效——secondary failure失效原因——failure cause失效机理——failure mechanism系统性失效；重复性失效——systematic failure；reproducible failure完全失效——complete failure退化失效——degradation failure部分失效——partial failure故障——fault致命故障——critical fault非致命故障——non-critical fault重要故障——major fault次要故障——minor fault误用故障——misuse fault误操作故障——mishandling fault弱质故障——weakness fault设计故障——design fault制造故障——manufacturing fault老化故障；耗损故障——ageing fault；wearout fault 程序－敏感故障——programme-sensitive fault数据－敏感故障——data-sensitive fault完全故障；功能阻碍故障——complete fault；function-preventing fault部分故障——partial fault持久故障——persistent fault间歇故障——intermittent fault确定性故障——determinate fault非确定性故障——indeterminate fault潜在故障——latent fault系统性故障——systematic fault故障模式——fault mode故障产品——faulty item差错——error失误——mistake工作状态——operating state不工作状态——non-operating state待命状态——standby state闲置状态；空闲状态——idle state；free state不能工作状态——disable state；outage处因不能工作状态——external disabled state不可用状态；内因不能工作状态——down state；internal disabled state可用状态——up state忙碌状态——busy state致使状态——critical state维修——maintenance维修准则——maintenance philosophy维修方针——maintenance policy维修作业线——maintenance echelon；line of maintenance 维修约定级——indenture level(for maintenance) 维修等级——level of maintenance预防性维修——preventive maintenance修复性维修——corrective maintenance受控维修——controlled maintenance计划性维修——scheduled maintenance非计划性维修——unscheduled maintenance现场维修——on-site maintenance；in sits maintenance；field maintenance非现场维修——off-site maintenance遥控维修——remote maintenance自动维修——automatic maintenance逾期维修——deferred maintenance基本的维修作业——elementary maintenance activity维修工作——maintenance action；maintenance task 修理——repair故障识别——fault recognition故障定位——fault localization故障诊断——fault diagnosis故障修复——fault correction功能核查——function check-out恢复——restoration；recovery监测——supervision；monitoring维修的实体——maintenance entity影响功能的维修——function-affecting maintenance 妨碍功能的维修——function-preventing maintenance减弱功能的维修——function-degrading maintenance 不影响功能的维修——function-permitting maintenance维修时间——maintenance time维修人时——MMH maintenance man-hours实际维修时间——active maintenance time预防性维修时间——preventive maintenance time修复性维修时间——corrective maintenance time实际的预防性维修时间——active preventive maintenance time实际的修复性维修时间——active corrective maintenance time 未检出故障时间——undetected fault time管理延迟（对于修复性维修）——andyistrative delay 后勤延迟——logistic delay 故障修复时间——fault correction time 技术延迟——technical delay核查时间——check－out time故障诊断时间——fault diagnosis time故障定位时间——fault localization time修理时间——repair time工作时间——operating time不工作时间——non—operating time需求时间——required time无需求时间——non-required time待命时间——stand-by time闲置时间——idle time；free time不能工作时间——disabled time不可用时间——down time累积不可用时间——accumulated down time外因不能工作时间——external disabled time；external loss time可用时间——up time首次失效前时间——time to first failure失效前时间——time to failure失效间隔时间——time between failures失效间工作时间——operating time between failures 恢复前时间——time to restoration；time to recovery使用寿命——useful life早期失效期——early failure period恒定失效密度期——constant failure intensity period恒定失效率期——constant failure rate period耗损失效期——wear－out failure period瞬时可用度——A(t) instantaneous availability 瞬时不可用度——U(t) instantaneous unavailability平均可用度——A(t1,t2)mean availability平均不可用度——U(t1，t2)mean unavailability渐近可用度——A asymptotic availability稳态可用度——steady－state availability渐近下可用度——U asymptotic unavailability稳态不可用度——steady-state unavailability渐近平均可用度——A asymptotic mean availability渐近平均不可用度——U asymptotic mean unavailability平均可用时间——MUT mean up time平均累积不可用时间——MADT mean accumulated down time 可靠度——R(t1，t2)reliability瞬时失效率——λ(t) instantaneous failure rate平均失效率——λ(t1,t2)mean failure rate瞬时失效密度——Z(t) instantaneous failure intensity平均失效密度——Z(tl，t2) mean failure intensity 平均首次失效前时间——MTTFF mean time to first failure平均失效前时间——MTTF mean time to failure平均失效间隔时间——MTBF mean time between failures平均失效间工作时间——MTBF mean operating time between failures失效率加速系数——failure rate acceleration factor失效密度加速系数——failure intensity acceleration factor维修度——maintainability瞬时修复率——μ(t)instantaneous repair rate平均修复率——μ(t1，t2)mean repair rate平均维修人时——mean maintenance man-hours平均不可用时间——MDT mean down time平均修理时间——MRT mean repair timeP—分位修理时间——p—fractile repair time平均实际修复性维修时间——mean active corrective maintenance time平均恢复前时间——MTTR mean time to restoration 故障识别比——fault coverage修复比——repair coverage平均管理延迟——MAD mean andyistrative delay p—分位管理延迟——p-fractile andyistrative delay平均后勤延迟——MLD mean logistic delayP—分位后勤延迟——P—fractile logistic delay试验——test验证试验——compliance test测定试验——determination test实验室试验——laboratory test现场试验——field test耐久性试验——endurance test加速试验——accelerated test步进应力试验——step stress test筛选试验——screening test时间加速系数——time acceleration factor维修性检验——maintainability verification维修性验证——maintainability demonstration观测数据——observed data试验数据——test data现场数据——field data基准数据——reference data 冗余——redundancy工作冗余——active redundancy备用冗余——standby redundancy失效安全——fail safe故障裕度/容错——fault tolerance故障掩盖——fault masking预计——prediction可靠性模型——reliability model可靠性预计——reliability prediction可靠性分配——reliability allocation；reliability apportionment故障模式与影响分析——FMEA fault modes and effects analysis故障模式、影响与危害度分析——FMECA fault modes，effects and criticality analysis故障树分析——FTA fault tree analysis应力分析——stress analysis可靠性框图——reliability block diagram故障树——fault tree状态转移图——state-transition diagram应力模式——stress model故障分析——fault analysis失效分析——failure analysis维修性模型——maintainability model维修性预计——maintainability prediction维修树——maintenance tree维修性分配——maintainability allocation；maintainability apportionment老练——burn in可靠性增长——reliability growth可靠性改进——reliability improvement可靠性和维修性管理——reliability and maintainability management可靠性和维修性保证——reliability and maintainability assurance可靠性和维修性控制——reliability and maintainability control 可靠性和维修性大纲——reliability and maintainability programme可靠性和维修性计划——reliability and maintainability plan可靠性和维修性审计——reliability and maintainability audit 可靠性和维修性监察——reliability and maintainability surveillance设计评审——design review真实的…——true…预计的…——predicted…外推的…——extrapolated…估计的…——estimated…固有的…——intrinsic…；inherent…使用的…——operational…平均的…——mean…P-分位…——P-fractile…瞬时的…——instantaneous…稳态的…——steady state未检出故障时间——undetected fault time 电子厂一些常用英语词汇镊子: TWEEZERS锯子: SAW尖嘴钳: NOSE PLIER扳手: SPANNER鎯头: HAMMER电烙铁: SOLDERING IRON剪钳: WIRE CUTTER老虎钳: PLIERS电批: TORQUE DRIVER夹子: CLAMP三角架: CROWFOOT钢网: STENCIL刮刀: SQUEEGEE刀片: BLADE放大镜: VISIONSCOPE、magnifier调压器: BOOSTER示波器: OSCILLOSCOPE测试针: TOGGLE PINS架子: RACK手推车：TROLLEY支架: BRACKETS锡条: SOLDER BAR锡膏: SOLDER PASTE锡炉: SOLDER-POT浸锡: DIG-SOLDER焊点: SOLDERING JOINTS焊盘: PAD/LAND焊接: WELDING超声波焊接: ULTRASONIC WELDING回流焊接: REFLOW SOLDERING波峰焊接: WAVE SOLDERING回焊前: PRE-REFLOW回焊后: POST-REFLOW回流炉: REFLOW OVEN虚焊: DEWETTING假焊: SHORT SOLDER少锡: INSUFFICIENT SOLDER偏位: MISALIGNMENT 阻焊剂: SOLDER-THIEF/MASK线路: TRACE回路: CIRCUIT短路: BRIGING/SHORT线路开路: BROKEN TRACE线路板; PCB(Printed Circuit Board)线路板装配: PCBA( PRINTED CIRCUIT BOARD ASSEMBLY)集成电路:IC( INTEGRATED CIRCUIT)ESD: ELECTROSTATIC DISCHARGE: 静电放电ESD PREVENTION&DAMAGE: 静电防护与损坏FMEA: FAILURE MODE AND EFFECT ANALYSIS(失效模式分析) SPC: STATISTIC PROCESS CONTROL(统计过程控制) IPC: INSTITUTE OF PACKING AND INTERCONNECTS(电子电路互连与封装协会)正极: ANODE END负极: CATHODE END硬化: CURING配线: WIRING冷却硬化: OVEN-CURING间距: PITCH周期: CIRCLE TIME测试: DEBUG模拟: SIMULATION毛细管现象: CAPILLARY ACTION导体: CONDUCTIVE PATTERN介质材料: DIELECTRIC MATERIAL镀通孔: PTH( PLATED THROUGH HOLE) 额定电源: RATED POWER氧化: OXIDE烘干: BAKE紫外线: ULTRAVIOLET线圈: WINDING涂层: COATING溶剂: SOLVENT溶液、溶解：SOLUTION隔热板: FELT不合格品: NON-CONFIRMING UNITS 原料: DIRECT MATERIAL辅料: INDIRECT MATERIAL试产: PILOT PRODUCTION量产: MASS PRODUCTIONX 光测试: X RAY TEST跌打测试: DROP TEST老化测试: BURN-IN TEST振动测试: VIBRATION TEST丝印: SPRAY-PAINTING/SILK-SCREEN烫金: METAL-STAMPING注塑: INJECTION MOLDING裂: CRACKED内翘: WARPED翘起: LIFT弯: BOW层分: DELAMINATION浮起: LIFTING静电防护: STATIC SHIELDING散静电: STATIC DISSIPATIVE防静电: ANTISTATIC顺时针方向: CLOCKWISE逆时针方向: CONTERCLOCKWISE松香: FLUX松香笔: FLUX PEN红胶水: EPOXY B ADHESIVE胶水: GLUE贴纸: STICKER透明胶纸: OPP TAPE卡板: PALLET电阻 Resistance/ RESISTOR热敏电阻 Thermistor/PTC(positive temperature coefficient) 压敏电阻 Piezoresistor压敏电阻、变阻器：MOV（metal oxide varistor）MOS：metal oxide semiconductor电容 Capacitance/Capacitor钽电容 AVX/Tantalum Cap独石电容 Multilayer ceramic capacitor安规电容 Y Cap/Safety CapacitorMLCC: multiplayer ceramic capacitor积层陶瓷晶片电容电解电容 Electrolytic Capacitor法拉电容Farad Cap/Super Cap/Double layer Cap 磁珠Magnetic bead/Bead core电感 Inductance/Inductor互感器 mutual inductor互耦电感 coupling inductor红外接收头 infrared receiver mould滤波器 filter继电器relay晶振 crystal oscillator /XTL液晶 LCD / liquid crystal display数码管 nixie tube/ digitron二极管 diode三极管 triode自攻螺丝 tapping screw螺母 nut 标牌 rating label光耦 optocoupler/optical coupler卡座 holder可恢复保险 restorable fuse发射管 launch tube整流桥堆 bridge rectifier稳压器 voltage stabilizer/regulator平垫 plate gasket/washer弹垫 spring gasket/washer平头螺丝/无头螺丝 Grub screw十字槽盘头机牙螺丝 cross recessed pan head screw 十字槽螺丝 Phillips screw一字槽 slotted米字槽螺丝 pozi screw复合槽 compound screw铅封 lead sealing到角 chamfer锐边 Sharp edge分流器 splitter密封线 potted line天线 AntennaSIM Subscriber identify module场效应管 field-effect tubeMCU Microprogrammed Control Unit：微程序控制器TVS: transient voltage suppressor瞬变电压抑制二极管Darlington：达林顿复合晶体管工字型：I-shape常用测试仪器设备英文名称目视仪器 visual instrument卷尺 tape measure/tapeline投影机 profile projector卡尺/测径器 caliper游标卡尺 vernier caliper千分尺 micrometer电子测试仪器 electronic measuring instrument量测设备/量具 gauge计量器/计量表 meter测试装置 tester功能测试仪 function tester米尺 meter stick千分卡尺 micrometer calipers块规 block gauge显微镜 microscope金相显微镜 metallography microscope工具显微镜 measuring microscope销规/栓规/测高计 height gauge厚度尺 thickness gauge放大镜 magnifier glass立体显微镜 stereomicroscope数字万用表 digital multimeter(DMM) 示波器 oscilloscope推拉力计 push-pull gauge可焊性测试仪solderability checker 能谱分析仪Energy Dispersive X-ray Detector(EDX) 测量用示波器measuring oscilloscope 高阻计 high resistance meter粘度计 viscosity meter硬度计 hardness scale火线 live line零线 null line/neutral line地线 earth line钢锉 steel file。
Look-Up Tables using S4 0.1 包的文档说明书
Package‘lookupTable’October13,2022Type PackageTitle Look-Up Tables using S4Version0.1Date2015-08-17Maintainer Enzo Jia<******************>Description Fits look-up tables byfilling entries with the mean or median values of observations fall in partitions of the feature space.Partitions can be determined by user of thepackage using input argument feature.boundaries,and dimensions of the feature spacecan be any combination of continuous and categorical features provided by the data set.A Predict function directly fetches corresponding entry value,and a default value isdefined as the mean or median of all available observations.The table and other components are represented using the S4class lookupTable.License MIT+file LICENSELazyData TRUEImports dplyr,methodsDepends data.tableSuggests testthatNeedsCompilation noAuthor Enzo Jia[aut,cre],Marc Maier[aut]Repository CRANDate/Publication2015-08-2801:21:23R topics documented:initialize,lookupTable-method (2)lookupTable-class (2)predict.lookupTable (3)Index412lookupTable-class initialize,lookupTable-methodInitialize and construct a lookupTable objectDescriptionInitialize and construct a lookupTable objectUsage##S4method for signature lookupTableinitialize(.Object,df.input,response,feature.boundaries,features.con=character(0),features.cat=character(0),fill.method="mean")Arguments.Object the prototype objectdf.input training data set containing columns with names found in features.con and fea-tures.cat vectorsresponse name of the response variablefeature.boundariesa list of thresholds for each continuous feature(names contained in feature.con)to construct bins.Should use-Inf and Inf as thefirst and last values,respectively.features.con a vector of continuous feature namesfeatures.cat a vector of categorical feature namesfill.method the method tofill entries of the table(’mean’or’median’)ValueA lookupTable object with a table trained with df.input datalookupTable-class An S4class that defines the look-up table and all other componentsrequired for prediction using this table.DescriptionAn S4class that defines the look-up table and all other components required for prediction using this table.predict.lookupTable3Slotstable the look-up table with entries to be retrieved as prediction resultsfeature.con a vector of continuous feature namesfeature.cat a vector of categorical feature namesfeature.boundaries a list of boundaries for each input feature(inferred during construction from input data)response the name of the response variable for the look-up tabledefault the default value for cells corresponding to a missing combination of input valuesresponse.categories sequence of all categories(order-dependent)for the response variable,if it’s categoricalpredict.lookupTable Predictions from a look-up tableDescriptionpredict method for lookupTable objectsUsage##S3method for class lookupTablepredict(object,newdata,newparams=NULL,...)Argumentsobject afitted lookupTable objectnewdata data.frame from which to evaluate predictionsnewparams new parameters to use in evaluating predictions...optional additional parameters.None are used at present.Valuea numeric vector of predicted valuesExamplesdf.input<-carsresponse<- distfeature.boundaries<-list(c(-Inf,5,10,15,20,25,Inf))features.con<-c( speed )dist.table<-lookupTable(df.input,response,feature.boundaries,features.con)df.test<-data.frame(speed=c(2,23,41,5,9,8))predict(dist.table,df.test)Indexinitialize,lookupTable-method,2 lookupTable,3lookupTable(lookupTable-class),2 lookupTable-class,2predict,3predict.lookupTable,34。
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A Z
X
Element symbol
Atomic number = number of protons
A 7 Z 3
Li X
Atomic structure
Helium
• • • •
is a Noble gas = happy atom!
What makes the periodic table so special?
• Compare the two different ways to organise elements (list of elements vs. periodic table):
– How are the two examples similar? – How are the two examples different? – What advantages, if any, does each method of organisation have?
Sub-atomic particles
• Protons
– Have a ________ charge – Found in the _____ of an atom
• Neutrons
– Have ________源自harge – Found in the ______of an atom
Example 1 – List of Elements
Full list found here
Example 2 – The Periodic Table
The development of the periodic table
Questions for video
1. Why is the periodic table called ‘the periodic table’? 2. How did Mendeleev organise his periodic table? 3. When Mendeleev proposed the periodic table, he went one step further. What else did he do and why is this significant? 4. Moseley changed the periodic law proposed by Medeleev by changing one word. What word was changed and how did this improve the periodic table? 5. Why do elements have repeating patterns in their chemical properties?
Valence electron
Group 1 (I) – Alkali metals
• The alkali metals are found in the first vertical column or group. • All the metals in this group have one electron in the outer shell and therefore a valency of 1+. • These metals (you-tube clip) are very reactive in water.
Group 1 (I) – Alkali metals
• Electrons
– Have a __________ charge – Are found moving in ‘shells’ around the nucleus – Shells are may also be called energy levels
Atomic shorthand
Questions
• Chapter 7.1 • P. 175 • Check: Q3, 7, 8
Valency
• The valence shell is the outermost shell • The valency number indicates the charge on an atom if it was to form a bond with another atom • Atoms form bonds to become stable • They do this either by gaining electrons to have a full valence shell or by getting rid of some electrons to drop down an energy level and have a full outer shell • A charged particle is formed when one atom is attracted to another atom, and electrons are either lost or gained (resulting in a bond) • A charged particle is called an ion eg. H+
Why do the group 1 elements react readily with water?
• The chemical behaviour can be explained in terms of their outer-shell electron or valence electrons. • 3Li has an electron configuration of 2,1 • 11Na has an electron configuration of 2,8,1 • 19K has an electron configuration of 2,8,8,1 • 37Rb has an electron configuration of 2,8,18,8,1 These atoms do not have a strong attraction for the single valence electron, and so it is easily lost to from a +1 ion. The group 1 elements are very reactive with water.
How to read The Periodic Table
Organised by atomic number
Organised into
and
What other information is found on The Periodic Table?
• Information about reactivity • Information about atomic structure (we will look at
• An arrangement of all the elements found on Earth • All matter (solids, liquids, gases) are made of… atoms! • Elements are atoms! (but we will get to this later)
(18) (32)
The valence shell is the outermost shell
The periodic table tells information about the Atomic structure
(shell)
• The Period number therefore tells you how many shells (or energy levels) there are in an element
Atomic number? Has two electrons Atomic mass? What other elements may have similar properties as Helium?
Atomic Structure – Electron shells (energy levels)
Lewis Dot Diagram
O
O
First 20 elements
• You have already drawn Bohr diagrams for the first 20 elements – previous lesson worksheet • On the same worksheet, draw Lewis diagrams for each
• Understand electronic configuration • Construct Bohr and Lewis Dot Diagrams • Explain how the electronic structure of an atom determines its
1. position in the periodic table 2. properties (chemical bonding)
this later on)
Reactivity
• For Groups I and II, more reactive going down a group
Chapter questions
• Read these sections on pages 172-173
• The periodic table • Mendeleev’s table • The modern periodic table
• Investigate the importance of the periodic table. • Learn how to extract information from the periodic table – how to ‘read’ the periodic table.