M29F002BB90K1中文资料

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针打类新通用表

针打类新通用表
FP630PRO/TP-635/TP635PRO/TP635K/DP520/IDP-3000/IDP-3000PRO/PP-90D
映美FP630KII(JMR125)
FP680K/FP680KPRO
映美FP630K(JMR126)
TP632K
映美FP5400K/5800K加上FP660K+导带扣
映美FP5900KII/FP5900KIII/FP8400KIII/映美TP540K/联想DP8400Βιβλιοθήκη NX400/410NX200
DPK800
DPK880/810/8580
DPK900
DPK500/510/910/8680
EPSON LQ100
映美FP200K/龙润310B/凯丰310B色带票据打印机?
EPSON
LQ300/LQ800
映美LQ300K、EPSON LX300K+II(8750#)/LQ300K+II(#7753)/LQ300K+/305KT/305KTII/580K+
更新日期:2012-06-01
GW5370
联想DP8000
DS6400III
DS6400TX/DS3100/DS3100II/DS3100X/DS810/DS800/DS800H/DS7310/AR700
LQ590
原装编号SO15337
映美LQ200KII
无通用
RS11
ND98/DPK7000/DPK7010?
映美FP5400/FP 8400KIII
LQ1900KIII/FX980(原装编号SO15086)
CR3240
DS6400II//STAR CR3240/LC2410/CR3200/AR3200/AR3200II/AR5400/AR6400/AR2470NX350/MX600/NX650 AR970

各厂家中九接收机芯片IC资料大全(目前最完整的)部分附针脚定义

各厂家中九接收机芯片IC资料大全(目前最完整的)部分附针脚定义

各厂家中九接收机芯片IC资料大全(目前最完整的)部分附针脚定义最新刷机资料点下面的链接最新刷机资料1最新刷机资料24月3日BIN教程工具集中帖刷机教程大全刷机工具大全2.10-3.2刷机bin大全3月3日后刷机bin大全各厂家中九接收机顶盒芯片IC资料大全(目前最完整的),部分附针脚定义。

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品牌产品型号芯片配置海尔2晶10芯IC:HI2023E+1108+5812海尔高清OST-666 2晶6芯IC:M88VS2000+241674K.1+M88TS2020海尔高清OST-666 3晶12芯IC:High032E+His121+M88TS2020海尔3晶10芯(9针接口)IC:HI2023E+1108+5812+ESMTM12L64164A-GNR1T80AB 海尔高清OST-666 2晶6芯IC:Hi2023E+3160+TS2020欧视达ABS-209B 3晶10芯IC:GX3001+GX1121+LW37 欧视达ABS-209B 3晶11芯IC:GX3001+5037+8211欧视达ABS-309B 3晶11芯IC:GX3001+GX1121+MGCE5037欧视达AS-900S 1晶11芯IC:GX6121+25L80+LW37城市之宝BEX868 Y32S-93AT 2晶10芯IC:HTV903F+A VL1108+TS2020通达Y35S-8BAT/Y35S-8CAT 2晶10芯IC:HTV903+A VL1108+5812通达Y30S-01BT 2晶12芯IC:HTV903+A VL1108+2020 皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812小霸王TDX-668E ABS-S1 1晶6芯IC:Hi2023+Hi3102+FT8211+HT1117天地星小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810天地星小霸王TDX-668A (9针接口)IC:HI2023+1108+夏普头天地星小霸王TDX-668B 2晶振IC:HTV903+A VL1108EGA+RDA5812+25L8005天地星小霸王(三星数码王)TDX-668B 单晶6芯.针脚定义①-TXD ②-RXD ③VCC ④-GND ⑤-BL IC:Hi2023E+RDA5812+A VL1108E+MXT8211a+25L8005天地星(原大盒中星九号)3晶IC:Hi2023+1108+5037天地星TDX-668B 2晶10芯IC:Hi2023+A VL1108+5812天地星小霸王TDX-668C 2晶6芯IC:HTV903+A VL1108EGA+RDK5812+25F80小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810小霸王TDX-668B 6芯IC:Hi2023+RDA5812+A VL1108E 小霸王TDX-668B 2晶6芯IC:HTV903+1108+5812小霸王TDX-668E 1晶6芯IC:Hi2023EC+Hi3121+5812 小霸王TDX-668E 2晶6芯IC:HTV903+1108+5812小霰王XC-B298 1晶12芯IC:HTV903-RDA5812-A VL1108 小霸王ABS-1388 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC小霸王ABS-1688 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812小霸王GF902 IC:A VL1118a+A V2020+EN25F80索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi3102E+Hi2023EC+A V2020太阳红TYH-279ABS/289ABS/299ABS 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC松下科技星TDX-668B1/松下科技星-668EIC:Hi3102E+Hi2023EC+5812松下科技星TDX-668B 2晶6芯IC:HTV903FH42+A VL1108EGA+RGK5812松下科技星668B 2晶6芯Hi2023(E0908)+EVl1108EG2+5812松下科技星-668C 2晶6芯针脚定义①-RX .②-TX .③-GND .④VCC. ⑤-BLIC:A VL1108EG+HTV903F+5812松下科技星668E 2晶6芯IC:HV903+A VL1108E+5812松下科技星/海尔数码/海信数码单双晶6芯IC:Hi2023E+Hi3102(Hi3121)+5812松下科技星TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+A VL1108+5812+25L8005松下高清SX168 3晶6芯IC:HTV903F+A VL1108+A V2020 松下数码王P-269A 2晶6芯IC:Hi2023E+Hi3122+A V2020 松下高清OST168 2晶10芯IC:Hi2023E+Hi3121+A V2020 松下科技PS-228 11芯IC:Hi2023+Hi3122+5812松下科技PS-228 2晶6芯IC:M88VS2000+M88TS2020+ES261474K松下科技PS-228 1晶12芯N88VS2000+ES261344K+M88TS2020高频头+T25P80+S163816STS松下科技PS-228 2晶IC:HTV903+1108+2020松下科技PS-228 2晶10芯IC:GX3001+GX1211+5812松下数码王OST-266 10芯(4针)针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023E+Hi3106+2020松下数码王OST-266 2晶6芯IC:M88VS2000+M88TS2020+261414k+25F80松下数码王OST-266 2晶6芯IC:Hi2023E+Hi3102E+M88TS2020+MXT8211松下高清OST-466 2晶10芯IC:Hi2023e+Hi3121+MBBTS2020+MBDA80CG松下科技星3晶6芯IC:Hi2023+A VL1108+WGCE5037松下科技星.海尔数码.海信数码单双晶+6芯IC:Hi2023E+Hi3102(3121)+5812中星科技单晶14芯IC:Hi2023E+1108+5812+25L8单晶14芯中星科技ZG-N02 12芯IC:GX3001+A V2020中星科技2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023EC+Hi3102E+5812+M12L64164A中兴科技ABS-S323 2晶10芯IC:Hi2023EC+HI3102E+5812+M12L64164A村村通ABS-S323- 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023EC+Hi3122E+5812村村通2晶6芯IC:HN4+0001+5812村村通ZL5188 1晶13芯IC:HTV903+1108+SHARP高频头村村通ZL-5188A 2晶11芯IC:HTV903+A VL1108+RDK5812村村通ZL-5188B 2晶13芯IC:HTV903+A VL1108+RDK5812 村村通ZL-5188B 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL5188B 1晶13芯IC:HTV903+A V1108+SHARP6306村村通ZJ-11 IC:HTV903+1108+夏普头S7ZH6306村村通wx-666 3晶10芯IC:GX3001+GX1121+RDK5812村村通ZL-6188 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL-6188C 10芯IC:GX3001+GX1121+RDK5812村村通DTH(铁壳) 3晶12芯IC:A VL1108EG+HTV903F+A V2020村村通001 3晶10芯IC:GX3001+GX1121+RDK5812村村通ABS-S GD-1008 3晶10芯IC:Hi2023E+A VL1108E+ZL10037+F16-100HIP村村通ABS-S888AIC:Hi2023EC+Hi3121+ET8211+RDA5812+25X80视美人ABS-S PS-1288 2晶10芯IC:Hi3102E+Hi2023EC+A V2020视美人PS-1288 ICM88VS2000+ES256454K+M88TS2020 视美人2晶10芯IC:Hi2023+3106+A V2020太平鸟HJ321 3晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:GX3001+GX1121+TS2020太平鸟HJ321 3晶11芯IC:GX3001+GX1121+5812焦点yj5888 2晶10芯IC:HTV903+A VL1108+RDA5812幸运之星YJ5988 2晶10芯IC:HTV903F+A VL1108EGa+A V2020克莱尔HT701 1晶10芯IC:A VL1108EG+HTV903F+M88TS2000中电电子J-6288 ABS-S 3晶12芯IC:GX3001+GX1121+5812小福星3晶11芯针脚定义①-GND .②-(空) .③-RXD .④-TXD ()IC:GX3001+GX1121+5812东仕DIS-2000K 单晶10芯IC:HTV903F+A VL1108E+A V2020Souy Ericsson英文机2晶10芯IC:GX3001+GX1121+A V2020高斯贝尔/歌德威尔ABS-208F 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812高斯贝尔ABS-208 1晶14芯(5针).针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812歌德威尔ABS-208H/高斯贝尔208P 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:M3330E+A VL1108EG+A V2020+M12L64164高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EGi+Hi2023+5812高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:M3330E+A VL1108EG+A V2020+M12L64164A高斯贝尔ABS—208F IC:Hi2023+A VL1108EGA+M88TS2020高斯贝尔ABS—208 2晶14芯IC:HTV903+1108+5812吉祥ABS-208C IC:Hi2023+A VL1108EGa+GST GAIM-18R ABS-STUNER吉祥ABS-2009B 3晶14芯IC:GX3001+GX1121+RDK5812吉祥ABS-2009大铁壳2晶IC:GX3001+GX1121+夏普高频头ABS-2009 2晶12芯IC:HTV903+1108+GAIM-18R歌德威尔ABS-208 3晶6芯IC:D61216GJ+1108+5812歌德威尔ABS-208 3晶14芯(9针接口)IC:M3330+1108+5812高斯贝尔ABS-208 3晶(9针母串口)IC:A VL1108+Hi2023+GAIM-18RIC:D61216GJ100+A VL1108EG+S29AL016D70TF102+ISSI高斯贝尔ABS-208N 铁壳(9针母串口) IC42s16400F高斯贝尔ABS-208 IC:D61216GJ+A V1108+29AL016D+5812高斯贝尔ABS-208S 1晶IC:NECD61216GJ+A VL1108EGa+高频头高斯贝尔ABS-208Q 1晶14芯IC:A VL1108EGA+M3330E+M12L64164A+A V2020ABS-S LX-3688A 1晶12芯IC:GX3001+GX1121+5812现代V4、V5 3晶9芯IC:GX3001+GX1121+5812+EN25D80+HY57V641620ETP-6 集信科技V6铁壳(海尔机芯) 3晶9芯针脚定义①VCC .②-TXD .③-RXD .④-GNDIC:1108EG(Hi3121)+Hi2023+5812.集信科技V4.V6(铁壳) 2晶9芯( B型)针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:0001(GX3001)+HN4F74+5812集信科技V4 .V6(铁壳) 2晶10芯针脚定义①VCC. ②-RXD .③-TXD .④-GNDIC:00001(GX3001)+HN4LSW+S6416AHTA+5812集信科技V4.V6(铁壳)IC:HN4LSW+S6416AHTA-6BZH+EN25F80-1000CP+5812集信科技V4.V6(铁壳)IC:0002P1M43700ta06+5812+EN25F80+TM8211+POL4558 集信科技V4.V5 1晶10芯(A型)针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:0002(GX6121)+5812+M12L64164A艾雷特2晶10芯IC:M88VS2000+ES256454K+M88TS2020艾雷特V5IC:HN4F910931M2EE+0001G1K729-1TA060932+5812艾雷特ALT5812 IC:GX3001+GX1121+5812艾雷特ALT600A 2晶11芯IC:M3330E+A VL108的+夏普高频头艾雷特ALT600A/吉祥ABS-2009 2晶IC:GX3001+GX1121-ES29L160FB+SHARP高频头艾雷特ALT600GIC:HTV903+A VL1108+25L160+ST2020(Y32S-8BAT 081113)艾雷特ALT6812 1晶10芯IC:GX6121+RDA5812+ZB-1A艾雷特ALT6815 1晶10芯IC:GX6121-RDA5812-2B-1A艾雷特ALT7815 3晶10芯IC:GX3001+1121+TS2020艾雷特1000 黑珍珠V4.V5 1晶10芯IC:0002(GX6121)+EEPLDA+5812+M12L64164A艾雷特alt 7812 3晶10芯IC:GX3001+GX1121+5812艾雷特ALT7812 3晶11芯针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:GX3001+GX1121+5812艾雷特ALT600c 2晶10芯IC:GX3001+GX1121+5812艾雷特ALT600c 2晶11芯IC:GX3001+GX1121+5812艾雷特ALT600c 1晶11芯IC:CH216H+A VL1108+C6XS-8CA深圳亿通DVB-V5 10芯IC:HN4N46+EN25F80+G1N540-1TA06+IS42S16400-7T+581亿通电子WS-3688ZL 1晶10芯IC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 2晶10芯IC:Hi2023+A VL1108EG+夏普高频头皇视HSR-208A 2晶10芯IC:Hi2023E+A VL1108EG+A V2020皇视HSR-208B 2晶10芯IC:Hi2023+1108+2020皇视HSR-208B 单晶10芯IC:3330+1108+2020皇视HSR-208B 单晶10芯针脚定义①-GND ②-TXD ③-RXD ④-VCCIC:Hi2023EC+Hi3102+A V2020皇视HSR-2090 2晶11芯IC:Hi2023+1108EGa+夏普头++EN29LV160皇视HSR-210A 单晶6芯IC:Hi2023ec+Hi3122e+A V2020 皇视HSR-260A 铁盒2晶10芯IC:Hi+1108+SHARP夏普头皇视HRS-268 3晶10芯IC:Hi2023EC+Hi3102E+A V2020 皇视HRS-268 2晶10芯IC:Hi2023EC+Hi3121+5812皇视HSR-268 单晶10线IC:HTV903+A VL1108+5812皇视HSR-268 单晶10线IC:Hi2023+Hi3121+A V2020皇视HRS-268 3晶10芯IC:Hi2023EC+A VL1108+5812皇视HSR-260B 3晶10芯IC:Hi2023+1108+2020皇视HSR-260B/索尼高清258 1晶10芯IC:2023E+3121+A V2020皇视HSR-260B 3晶10芯IC:HI2023+1108+5812皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812凯恩斯KES-2066S 6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi3122E+Hi2023ECE+N25F80凯恩斯KES-2077Z 1晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+3122E+5812凯恩斯2077ABS 2晶10芯IC:M3330+A VL1108+5812凯恩斯2077ABS 2晶10芯IC:Hi2023+1108E+5812+25L800凯恩斯KES-2088S 2晶6芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶10芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3122E+RDA5812凯恩斯KES-2088Z (5针).针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2099S 2晶6芯IC:Hi2023EC+Hi3102E+5812+25L80凯恩斯KES-2188T 3晶10芯IC:Hi2023+1108+5812凯恩斯KES-2188T 3晶12芯IC:Hi2023+1108E+5037凯恩斯KES-2288S 3晶10芯IC:M3330E+A VL1108+RDA5812+M12L64164A凯恩斯KES-2688b 2晶10芯IC:Hi2023e+1108e+5812 凯恩斯KES-2688S 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2788S 3晶10芯IC:Hi2023E+A VL1108EGa+5812凯恩斯KES-2788S 2晶6芯IC:Hi2023EC+Hi3122E+5812凯恩斯KES-5188 11芯IC:HTV903+A VL1108EGA+A V2020凯恩斯KES-5188A铁盒2晶10芯IC:HTV903F+A VL1108+RDK5812+F80+PT8211凯恩斯KES-5188B 2晶13芯IC:HTV903+RDA5812+A VL1108+8211+F80美路3晶13芯IC:Hi2023E+1108+2119美路2晶12芯IC:GX3003+GX1121+5812美路MR-1809 IC:Hi2023E+A VL1108E+高频头MAX2119C 美路MR-5598铁壳3晶12芯IC:GX3003+GX1121+5812 美路MR-5598 3晶12芯针脚定义①VCC. ②-RXD .③-TXD .④-GNDIC:Hi2023E+1108+2119C美路-5798 IC:Hi2023E+1108+2119C美路-5598 IC:Hi2023+1108+GAIM-18R+29lv160ZY 5518A 2晶10芯IC:Hi2023E+3102E+5812万利达ZY-5518A 1晶6芯((5针))IC:Hi2023E+Hi3102E+5812万利达ZY-5518A 2晶10芯IC:CX3001+GX1121+5812万利达ZY-5518A 3晶10芯(9针接口)IC:Hi2023+1108+5812长虹新一代3晶10芯IC:HI2023E+1108E+FL016ALF长虹新一代,海尔数码、海信数码单双晶体6芯IC:HI2023E+3102(3121)+5812长虹数码CH930 3晶12芯IC:HTV903F+1108+A V2020+M80长虹精品TC-6688ABS 2晶10芯IC:HTV903+A VL1108EG+5812长虹精工YJ5978 1晶10芯IC:HTV903F+1108EGa+2000+F80-100+8211长虹KES-2099S 2晶5芯IC:Hi2023+Hi3102E+5812长虹KES 2晶6芯IC:Hi2023+Hi3102+5812长虹CH920 3晶6芯IC:HTV903F+1108EGa+A V2020+25L80航天天信WTD198J 2晶12芯(9针接口)IC:GX3001+GX1121+5812+ES29LV160FB-70TG航天珠江WTD-198J 2晶12芯IC:GX3001+GX1121+5812 航天珠江ABS-209B IC:GX3001+GX1121++WGSE5037航天数码ABS-3809 2晶12芯IC:GX3001+GX1121+5812航天直播HT-168 3晶12芯IC:Hi2023+1108+夏普头航天高清王-HS-166 2晶12芯IC:Hi2023EC+Hi3102E+RDA5812航天高清王HS-169 2晶12芯针脚定义①-GND .②-TX .③-RX .④-VCCIC:Hi2023EC+3122+5812天诚TCD-219ABS 2晶10芯IC:M3330E+A VL1108EGA+5812天诚TCD-299Z 2晶10芯IC:Hi2023+3206+5812天诚TD-299Z 2晶5芯IC:Hi2023+3206+5812天诚TD-2992 2晶6芯IC:Hi3122E+Hi2023E+5812+F80+MXT8211天诚539 2晶10芯IC:HTV903+A V1108+5812天诚519型2晶10芯IC:HTV903+1108E+5812天诚TCD-239ABS 3晶10芯IC:M3330+1108+5812 天诚TCD-239ABS 2晶10芯IC:Hi2023+1108E+5812 天诚TCD-239 2晶10芯IC:M3330E+1108E+5812天诚TCD-299ABS 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-319ABS 3晶10芯IC:Hi2023E0914+A VL1108EGa+RDA5812天诚TCD-319ABS 3晶12芯IC:Hi2302+A VL1108+5037 天诚TCD-369ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-369ABS 3晶10芯IC:M3330E+1108+5812天诚TCD-369ABS 3晶5芯IC:Hi2023+1108+WCGE5037天诚TCD-509ABS 3晶10芯IC:M3330E-A VL1108EGa-5812天诚TCD-509ABS 10芯(5针)IC:Hi2023+A VL1108+5812+M12L6416A天诚TCD-539ABS 2晶10芯(5针)针脚定义①-RX .②-TX .③VCC .④-GND .⑤-BLIC:M3330E+A VL1108+25L80+5812天诚TCD-579ABS 2晶10芯IC:Hi2023+Hi1108+5812天诚TCD-579ABS 3晶10芯IC:HiM3330+A VL1108EGa+RDA5812天诚TCD-589ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-689ABS铁壳机2晶12芯(9针接口)IC:Hi2023+A VL1108+夏普头天诚TC-ABS1108A 11芯IC:Hi2023EC+A VL1108+5812 TCD--239ABS 2晶10芯IC:M3330E+A VL1108E+5812 TCD-339ABS 3晶10芯(9针接口) IC:Hi2023+1108+5812TCD-509ABS 3晶10芯IC:Hi2023E0915+A VL1108EGa+RDA5812TCD-509ABS 2晶10芯(5针) IC:Hi2023EC+HI3121+5812TCD-519ABS 2晶10芯IC:Hi2023+A VL1108+5812TCD-599 2晶10芯IC:M3330+A VL1008+5812TCD-219ABS 2晶振10芯针脚定义①-TXD .②-RXD .③-VCC .④-GND .⑤-BLIC:Hi2023EC+Hi3121+5812爱普思DVB-2568 3晶10芯IC:HTV903+1121+2020卓异5518A 3晶10芯IC:Hi2023E+1108+5812卓异5518A(铁壳)3晶11芯IC:Hi2023E+1108+5812卓异5518A(铁壳)2晶11芯(9针接口) IC:Hi2023+1108+夏普独立高频头卓异5518A G 1晶10芯爱百信针脚定义①-GND .②-TXD .③-RXD .④VCCIC:HTV903+A VL1108+5812卓异ZY-5518A G 驰骋天下针脚定义①-GND .②-RXD .③-TXD .④VCCIC:HTV903+A VL1108+5812+F80卓异5518AG 2晶11芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL IC:Hi2023E+1108+5812卓异ZY-5518A H 春1晶6芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+5812+25L8005卓异ZY-5518A H 春2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BLIC:Hi2023E+HI3121+5812+F25L008A卓异ZY-5518A H 秋针脚定义①-GND .②-RXD .③-TXD .④VCC 升级接口在内部PCB上IC:GX6121+5812+F80卓异ZY-5518A H 秋1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BLIC:Hi2023EC+Hi3102E+5812+F80-100卓异ZY-5518A H至尊王牌2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+GX1121+5812+25L8005卓异ZY-5518A H 财富2晶6 芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BLIC:芯片掩磨+5812+80L100绿达PS-1288 3晶12芯IC:Hi2023E+ABS090520+M88TS2020绿达PS-1288 2晶12芯IC:Hi2023+Hi3021+A V2020绿达视美人\卓异1晶10芯IC:Hi2023EC+Hi3121+2020 绿达金统帅3晶10芯IC:M3330+1108+5812三星DQ88/DQ66 IC:HTV903F+A VL1108+A V2020三星高清王2晶12芯IC:GX3001+GX1121+5812三星高清DQ88 3晶12芯IC:HTV903F+A VL1108+A V2020 三星数码王TDX668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+1108+5812三星数码王TDX668B 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王668C 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王TDX668E 1晶6芯IC:Hi2023EC+3102C+5812三星HSR-208C 1晶10芯IC:Hi2023E+Hi3102+MXT8211+A V2020+F25L08pA三星小霸王ABS-S 2009 2晶10芯IC:CX3001+CX1121+5812三星小霸王2900 (9针接口)IC:Hi2023E+A VL1108+MAX2119三星王国-KL6350 1晶11芯IC:HTV903+A VL1108EGa+EDA5812开门红KSP638 2晶10芯IC:HTV903F+A VL1108E+A V2020开门红KSP638 1晶10芯IC:CT216H+A VL1108EGa+A V2020日立创新TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+A VL1108+5812志高之星HS166 2晶12芯IC:Hi3102+Hi2023+5812志高之星HS169 2晶12芯IC:Hi2023EC+Hi3012E+RDA5812A+EM638165TS-6G金牛ABS-1108 3晶10芯IC:Hi2023+1108+5812小灵通2晶6线IC:Hi2023+1108+5812福临门ABS-S 3晶9线IC:GX1121+GX3001+5812C60S-93AT 单晶10芯IC:CT216H+A VL1108EGa+A V2020 ABS-2301 单晶10芯针脚定义①-GND.②-TXD.③-RX .④VCCIC:Hi2023EC+Hi3211E+5812+25L8005其乐达CT216 2晶10芯IC:CT216+1108+A V2020科海6228 1晶11芯IC:HTV903+A VL1108EGa+RDa5812+25X16A VSIG科海6228-CT216H 1晶11芯IC:CT216H+1108EGa+M88TS2020科海C623S-91AT 单晶10芯IC:CT210H+A VL1108+2020 科海炫彩6888 IC:HTV903+A VL1108EGa+RDa5812科海2888(小天使)2晶10芯IC:HTV903+A VL1108EGa+RDa5812大旗920 3晶12芯IC:HTV903+A VL1108+A V2020大旗DQ920 3晶12芯IC:GX3001+GX1121+5812+25X16 大旗930 3晶12芯IC:HTV903+A VL1108+A V2020众昌电子ABS--2088 2晶10芯IC:Hi2023+A VL1108+5812众昌电子ABS-2087 2晶10芯IC:M3330+A VL1108+5812 创维S600 3晶IC:M3330E+A VL1108E+5812创维新一代3晶10芯IC:Hi2023E+1108+5037+FL016A 中广通XC-B188 3晶12芯IC:GX3001+GX1121+5812深圳知音ABSTAR KT-2309 3晶10芯IC:Hi2023+A VL1108E+5812知音科技ABSTAR KT1028H 2晶振10芯IC:Hi2023+A VL1108+GST GAIM-18R铁壳ABS-2009 2晶11芯IC:Hi2023+1108+夏普头王牌数码OST-366 2晶6芯针脚定义①-GND ②-RXD .③-TXD .④VCCIC:Hi3102+Hi2023EC+A V2020王牌数码王GM-ABS1108A 2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+GX1121+5812+25L8005王牌数码王GM-ABS1108A 10芯IC:Hi2023+A VL1108+5812JIXIANG ABS-208 2晶14芯(9针接口)IC:Hi2023+1108+GST GAIM-18R ABS TUNER 夏普头JIXIANG-ABS208 2晶IC:D6121+1108+GST高频头East Star 2晶10芯IC:M3330-1108-GST GAIM-18R高频头小福星abs 2008 3晶12芯IC:GX3001+GX1211+5812通达C60S-93AT/C62S-91AT 1晶10芯IC:CT216H+A VL1108E+2020威特斯ZL-5188A 2晶13芯IC:HTV903+A VL1108+RDK5812威特斯ZL-5188B 2晶11芯IC:GX3001+GX1121+5812迷你星3晶13芯IC:GX3001+GX1121+5812+F16-100HIP高星HS-312 3晶12芯IC:GX3001+GX1121+5812北大高科3晶9芯IC:GX3001+GX1211+5812思达科ABS-S 801型2晶10芯IC:GX3001+GX1121+5810思达科ABS-S 802G 2晶10芯IC:GX3001+GX1211+5812思达科ABS-S 803A 1晶10芯IC:A VL1118+A V2020+25D80V思达科ABS-S 803G IC:GX3001+GX1211+5812思达科ABS-S 806H IC:GX3001+GX1211+5812思达科ABS-S 806H IC:A VL1118+A V2020+DSD4M16G思达科ABS-S 806H IC:HN4J7G+G2A954+5812+25X80思达科ABS-S807 1晶5芯IC:A VL1118a+A V2020+806H金霸王JBW-6688 2晶11芯IC:HTV903F+A VL1108EGa+A V2020+8211金霸王JBW-6688 IC:GX3001+GX1211+5812阿德尔ADE-168 IC:HY903+A VL1108EG+A V2020阿德尔ADE131金刚IC:HTV903F+A VL1108E+M88TS2020 海西小霸王TD299Z 2晶6芯IC:Hi2023E+Hi3122+5812 同洲CY-668S 1晶12芯IC:HM1512+1108+5812喜旺ABS5398 IC:Hi2023+1108E+MAX2119C喜旺ABS-5798 12芯IC:GX3001+GX1211+5812喜旺ABS-3809 2晶12芯IC:GX3001+GX1121+RDA5812希旺598 2晶12芯(9针接口) IC:Hi2023+1108+SHRP 高频头彩虹视霸CY84 1晶10芯IC:HTV903F+A VL1108+M88TS2020彩虹视霸A10S-9AAT 1晶10芯IC:A VL1118+SM42S16400B1-7+F80九洲村村通DVS-398F IC:CT216H+ALV1108+SHRP高频头金星ABS-208 1晶14芯IC:Hi2023+A VL1108+铁壳高频头威克2晶6芯(5针) IC:HTV903+1108+5812华尔HR731A1 3晶12芯IC:CX3001+CX1121+SHARP高频头爱普斯3晶9芯IC:HTV903+A V2020+A VL1108EG爱普斯2568 3晶10芯IC:HTV903+A V2020+A VL1108EG 爱普斯IC:GX3001+GX1211+A V2020+2J10X未来视佳ADEI88 3晶9芯IC:HTV903F+A V2020+A VL1108EG黑金刚TRT006 1晶10芯IC:A VL1118+A V2020+4558+F80-100DX-668 2晶10芯针脚定义①-RXD .②-TXD .③VCC .④-GND .⑤-BLIC:Hi2023EC_Hi3102E+5812+F80-100傲天海-吉祥2晶12芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:GX3001+GX1121+RDA5812高频头+P8075火星漫步LJ6008 1晶10芯IC:HTV903F+A VL1108+M88TS2020+F80-100王牌新一代TD-299Z针脚定义①- . ②-TXD .③-RXD .④-GND ⑤-IC:Hi2023E+Hi3122+5812王牌HJ360 3晶10芯IC:GX1120+GX3001+TS2020TVWALKER ABS-2008 1晶6芯IC:D61216GJ+1108E+SHARP头吉祥988 (ZJ-111) 1晶11芯IC:HTV903 +1108+高频头北京北电科林3晶12芯IC:Hi2023+A VL1108EGa+SHARP高频头家家福BEX811 1晶10芯IC:24645K2+M88VS2000+M88TS2020家家福ADE158 IC:HTV903+A VL1108+M88TS2020华星科技2晶IC:Hi2023+A VL1108+5812亚视达ABR-S(H11) 2晶10芯IC:HTV903+1108E+A V2020HSTAR 3晶10芯IC:Hi2023+A VL1108EGa+M88IS2020长江电讯ABS-2008型铁壳(9针接口)IC:D61216GJ+A VL1108EG+夏普头全家福3晶IC:Hi2023E+A VL1108EG+M88TS2020 畅想BEX818 1晶10芯IC:HTV903+A VL1108+A V2020 必佳GF-901 2晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:HTV903+1108+A V2020KSP600G 飓风(华亚) 2晶10芯针脚定义①-GND ②-TXD ③-RXD ④VCCIC:HTV903+1108+M88TS2020+25D80万家乐TB002 (5针)IC:Hi2023EC+Hi3102E+M88TS2020+25X80A V万家乐2晶6芯IC:M3330+ALi1108+5812+F80-75奥伟科技ABS-800 3晶(9针接口)IC:GX3001+GX1121+5812奥伟科技ABS-900E 2晶12芯IC:CT216+A VL1108+独立高频头GAIR-08R天眼HSTER3晶10芯IC:Hi2023E+A VL1108+5812飞翔ADE351 2晶10芯IC:HTV903F+A VL1108EG+M88TS2000星视通XC-B268 1晶10芯IC:HTV903+A VL1108+5812星视通XC-C268 1晶11芯IC:HTV903 A VL1108 5812奥维科技ABS-600 3晶12芯IC:GX3001+GX1121+A V2020 超的个人论坛转载分享本资源。

P28F010-90资料

P28F010-90资料

元器件交易网
28F010/28F020
E
CONTENTS
PAGE PAGE 4.5 DC Characteristics—28F020—TTL/NMOS Compatible—Commercial Products .......... 22 4.6 DC Characteristics—28F010—CMOS Compatible—Commercial Products .......... 24 4.7 DC Characteristics—28F020—CMOS Compatible—Commercial Products .......... 25 4.8 DC Characteristics—28F010—TTL/NMO Compatible—Extended Temperature Products ................................................... 27 4.9 DC Characteristics—28F020—TTL/NMO Compatible—Extended Temperature Products ................................................... 29 4.10 DC Characteristics—28F010—CMOS Compatible—Extended Temperature Products ................................................... 31 4.11 DC Characteristics—28F020—CMOS Compatible—Extended Temperature Products ................................................... 32 4.12 AC Characteristics—28F010—Read-Only Operation—Commercial and Extended Temperature Products .............................. 35 4.13 AC Characteristics—28F020—Read Only Operations—Commercial and Extended Temperature Products .............................. 36 4.14 AC Characteristics—28F010— Write/Erase/Program Only Operation— Commercial and Extended Temperature Products ................................................... 38 4.15 AC Characteristics—28F020— Write/Erase/Program Only Operation— Commercial and Extended Temperature Products ................................................... 39 4.16 AC Characteristics—28F010—Alternative CE#-Controlled Write—Commercial and Extended Temperature ............................. 44 4.17 AC Characteristics—28F020—Alternate CE# Controlled Writes—Commercial and Extended Temperature Products .............. 45 4.18 Erase and Programming Performance ..... 46 5.0 ORDERING INFORMATION ......................... 47 6.0 ADDITIONAL INFORMATION....................... 47

CMX589A_datasheet(v4)

CMX589A_datasheet(v4)

CML MicrocircuitsCOMMUNICATION SEMICONDUCTORSCMX589AGMSK ModemD/589A/4 April 2002Features and Applications• Data Rates from 4kbps to 200kbps•Full or Half Duplex Gaussian Filter and Data Recovery for Minimum Shift Keying (GMSK) Designs• Selectable BT: (0.3 or 0.5) •Low Power3.0V, 20kbps, 1.5mA typ. 5.0V, 64kbps,4.0mA typ. • Low Current Non-DSP Solution•Small TSSOP Packs fit PCMCIA/PC Cards•Portable Wireless Data Applications Cellular Digital Packet Data (CDPD) Mobitex ™ Mobile Data System • Spread Spectrum Data Links • GPS/Differential GPS Wireless Links • Point-of-Sale Terminals•Low Power Wireless Data Link for PCs,Laptops, and PrintersContentsSection Page Features and Applications (1)Brief Description (1)Block Diagram (3)2 Signal List (4)3 External Components (6)4 General Description (8)4.1 Clock Oscillator Divider (8)4.2 Receive (8)4.2.1 Rx Signal Path Description (8)4.2.2 Rx Circuit Control Modes (9)4.2.3 Rx Clock Extraction (10)4.2.4 Rx Data Extraction (10)4.2.6 Rx Signal Quality (12)4.3 Transmit (12)4.3.1 Tx Signal Path Description (12)4.4 Data Formats (14)4.5 Acquisition and Hold Modes (14)5 Application (15)5.1 Radio Channel Requirements (15)5.1.1 Bit Rate, BT, and Bandwidth (15)5.1.2 FM Modulator, Demodulator and IF (15)5.1.3 Two-Point Modulation (16)5.2 AC Coupling of Tx and Rx Signals (17)6 Performance Specifications (18)6.1 Electrical Specifications (18)6.1.1 Absolute Maximum Limits (18)6.1.2 Operating Limits (19)6.1.3 Operating Characteristics (20)6.2 Packages (22)Block DiagramFigure 1: Block Diagram2 Signal ListTable 1: Signal List3 External ComponentsFigure 3: Recommended External ComponentsComponent Notes Value Tolerance Component Notes Value Tolerance R1 1 ±5% C4 0.1µF ±20%R2 1.0MΩ±10% C5 1.0µF ±20%R3 2 ±10% C6 5 ±20%R4 3 ±10% C7 6C1 1 ±10% C8 6C2 4 C9 7C3 4 X1 8Table 2: Recommended External ComponentsRecommended External Component Notes:1. The RC network formed by R1 and C1 is required between the Tx Out pin and the input to the modulator.This network, which can form part of any DC level shifting and gain adjustment circuitry, forms animportant part of the transmit signal filtering. The ground connection to the capacitor C1 should bepositioned to give maximum attenuation of high-frequency noise into the modulator.The component values should be chosen so that the product of the resistance and the capacitance is:For a BT of 0.3 R1.C1 = 0.34/bit rate (bps)For a BT of 0.5 R1.C1 = 0.22/bit rate (bps)Data Rates (kbps)BT = 0.3 BT = 0.5 R1 C1 R1 C1 4 120k Ω 680pF 120k Ω 470pF 4.8 100k Ω 680pF 100k Ω 470pF 8 91k Ω 470pF 120k Ω 220pF 9.6 91k Ω 390pF 47k Ω 470pF 16 47k Ω 470pF 91k Ω 150pF 19.2 100k Ω 180pF 91k Ω 120pF 32 47k Ω 220pF 47k Ω 150pF 38.4 * 47k Ω 180pF 47k Ω 120pF 64 * 56k Ω 100pF 51k Ω 68pF 80 * 39k Ω 68pF 128 * 82k Ω 22pF 144 * 68k Ω 22pF 160 * 62k Ω 22pF 176 * 56k Ω 22pF 192 *51k Ω22pF* V DD ≥ 4.5V, external clockTable 3: Data Rate vs. BT and Selected External Component Values2. R3, R4 and C6 form the gain components for the Rx Input signal. R3 should be chosen as required by thesignal input level. 3. For bit rate ≤ 64kbps, R4 = 100k Ω. For bit rate > 64kbps, R4 = 10k Ω.4. The values chosen for C2 and C3 (including stray capacitance), should be suitable for the applied V DDand the frequency of X1.As a guide: C2 = C3 = 33pF at 1.0MHz falling to 18pF at the maximum frequency.At 3.0V, C2 = C3 = 33pF falling to 18pF at 5.0MHz the equivalent series resistance of X1 should be less than 2.0K Ω falling to 150Ω at the maximum frequency. Stray capacitance on the Xtal/Clock circuit pins must be minimized. 5. For bit rate ≤ 64kbps, C6 = 22pF. For bit rate > 64kbps, C6 =Ω×π××10k 2 rate bit 31e.g. for 128kbps, C6 = 41.1pF.6. C7 and C8 should both be .015µF for a data rate of 8kbps, and inversely proportional to the data rate forother data rates, e.g. 0.030µF at 4kbps, 1800pF at 64kbps, 680pF at 192kbps. 7. The tolerance of C9 is not very critical because it primarily serves as a dc blocking capacitor.8. The CMX589A can operate correctly with the Xtal frequencies between 1.0MHz and 16.0MHz(V DD = 5.0V) and 1.0MHz to 5.0MHz (V DD = 3.0V). External clock frequencies up to 25.6MHz(V DD ≥ 4.5V) are also supported (See Table 4 for examples.) For best results, a crystal oscillator design should drive the clock inverter input with signal levels of at least 40% of V DD , peak to peak. Tuning fork crystals generally cannot meet this requirement. To obtain crystal oscillator design assistance, consult your crystal manufacturer. Operation of this device without a Xtal or Clock input may cause device damage.4 General Description4.1 Clock Oscillator DividerThe Tx and (nominal) Rx data rates are determined by division of the frequency present at the XTALN pin as generated by the on-chip Xtal oscillator, with external components, or supplied from an external source. The division ratio is controlled by the logic level inputs on ClkDivA and ClkDivB pins as shown in Table 4, together with an indication of how various standard data rates may be derived from common µP Xtal frequencies.A/B)(ClkDiv Ratio Division FrequencyXtal/ClkRate Data =* V DD ≥ 4.5V, external clockTable 4: Example Clock/Data RatesNote : The device operation is not guaranteed above 200kbps or below 4kbps at the relevant supply voltage.Figure 4: Minimum µController System Connections4.2 Receive4.2.1Rx Signal Path DescriptionThe function of the Rx circuitry is to: 1. Set the incoming signal to a usable level. 2. Clean the signal by filtering.3. Provide dc level thresholds for clock and data extraction.4. Provide clock timing information for data extraction and external circuits.5. Provide Rx data in a binary form.6. Assess signal quality and provide Signal-to-Noise information.The output of the radio receiver's Frequency Discriminator should be fed to the CMX589A's Rx Filter by a suitable gain and DC level adjusting circuit. This circuit can be built with external components around the on-chip Rx Input Amplifier. The gain should be set so that the signal level at the Rx Feedback pin is nominally 1V peak to peak (for V DD =5.0V) centered around V BIAS when receiving a continuous 1111000011110000.. data pattern.Positive going signal excursions at Rx Feedback pin will produce a logic ‘0’ at the Rx Data Output. Negative going excursions will produce a logic ‘1’.The received signal is fed through the lowpass Rx Filter, which has a -3dB corner frequency of 0.56 times the data bit-rate, before being applied to the Level Measure and Clock and Data extraction blocks.The Level Measuring block consists of two voltage detectors, one of which measures the amplitude of the positive parts of the received signal. The other measures the amplitude of the negative portions. (Positive levels are then used to establish the optimum DC level decision-thresholds for the Clock and Data extraction, depending upon the Rx signal amplitude and any DC offset. 4.2.2Rx Circuit Control ModesThe operating characteristics of the Rx Level Measurement and Clock Extraction circuits are controlled, as shown in Table 6, by logic level inputs applied to the PLLacq, Rx HOLDN and RxDCacq pins to suit a particular application, or to cope with changing reception conditions, reference Figure 5.In general, a data transmission will begin with a preamble, for example, 1100110011001100, to allow the receive modem to establish timing and level-lock as quickly as possible. After the Rx carrier has been detected, and during the time that the preamble is expected, the RxDCacq and PLLacq Inputs should be switched from a logic ‘0’ to a logic ‘1’ so that the Level Measuring and Clock Extraction modes are operated and sequenced as shown.The Rx HOLDN input should normally be held at a logic ‘1’ while data is being received, but may be driven to a logic ‘0’ to freeze the Level Measuring Clock Extraction circuits during a fade. If a fade lasts for less than 200 bit periods, normal operation can be resumed by returning the Rx HOLDN input to a logic ‘1’ at the end of the fade. For longer fades, it may be better to reset the Level Measuring circuits by placing the RxDCacq to a logic ‘1’ for 10 to 20 bit periods.Rx HOLDN has no effect on the Level Measuring circuits while RxDCacq is at a logic ‘1’, and has no effect on the PLL while PLLacq is at a logic ‘1’.A logic ‘0’ on Rx HOLDN does not disable the Rx Clock output, and the Rx Data Extraction and S/N Detector circuits will continue to operate.Figure 5: Rx Mode Control DiagramPLLacq RxHOLDNPLL Action1 1 Acquire Sets the PLL bandwidth wide enough to allow a lock to thereceived signal in less than 8 zero crossings. This mode willoperate as long as PLLacq is a logic “1”.1 to 0 1 MediumBandwidth The correction applied to the extracted clock is limited to a maximum of ±1/16th bit-period for every two received zero-crossings. The PLL operates in this mode for a period of about 30 bits immediately following a 1 to 0 transition of the PLLacq input, provided that the Rx HOLDN input is a logic ‘1’.0 1 NarrowBandwidth The correction applied to the extracted clock is limited to a maximum of ±1/64th bit-period for every two received zero-crossings. The PLL operates in this mode whenever the Rx HOLDN Input is a logic ‘1’ and PLLacq has been a logic ‘0’ for at least 30 bit periods (after Medium Bandwidth operation for instance).0 0 Hold The PLL feedback loop is broken, allowing the Rx Clock tofreewheel during signal fade periods.Table 5: PLL Action Measurement Operational ModesRxDCacq RxHOLDNRx Level Measure Action0 to 1 X Clamp Operates for one bit-time after a 0 to 1 transition of theRXDCacq input. The external capacitors are rapidly chargedtowards a voltage mid-way between the received signal inputlevel and V BIAS, with the charge time-constant being of theorder of 0.5 bit-time.1 X Fast Peak Detect The voltage detectors act as peak-detectors, one capacitor isused to capture the positive-going signal peaks of the RxFilter output signal and the other capturing the negative-going peaks. The detectors operate in this mode wheneverthe RXDCacq input is at a logic ‘1’, except for the initial 1-bitClamp-mode time.0 1 Averaging PeakDetect Provides a slower but more accurate measurement of the signal peak amplitudes.0 0 Hold The capacitor charging circuits are disabled so that theoutputs of the voltage detectors remain substantially at thelast readings (discharging very slowly [time-constant approx.2,000 bits] towards V BIAS).X = Do not careTable 6: Rx Level Measurement Operational Modes4.2.3 Rx Clock ExtractionSynchronized by a PLL circuit to zero-crossings of the incoming data, the Rx Clock Extraction circuitry controls the Rx Clock output. The Rx Clock is also used internally by the Data Extraction circuitry. The PLL parameters can be varied by the Rx Circuit Control inputs PLLacq and Rx HOLDN to operate in one of four PLL modes as described in Table 5 and Table 6.4.2.4 Rx Data ExtractionThe Rx Data Extraction circuit decides whether each received bit is a 1 or 0 by sampling the received signal, after filtering, and comparing the sample values to an adaptive threshold derived from the Level Measuring circuit. This threshold is adapted from bit to bit to compensate for intersymbol interference caused by the and limiting of the overall transmission path and the Gaussian premodulation filter. Extracted data is output from the Rx Data pin, and should be sampled externally on the rising edge of the Rx CLK.4.2.5 Rx S/N DetectionThe Rx S/N Detector system classifies the incoming zero-crossings as GOOD or BAD depending upon the time when each crossing actually occurs with respect to its expected time as determined by the Clock Extraction PLL. This information is then processed to provide a logic level output at the Rx S/N pin. A high level indicates a series of GOOD crossings; a low level indicates a BAD crossing.By averaging this output, it is possible to derive a measure of the Signal-to-Noise-Ratio and hence theBit-Error-Rate of the received signal.Figure 6: Typical Bit-Error-Rate Performance at V DD = 5.0VNote: Figure 6 indicates typical performance, independent of bit rate (although the applied noise bandwidth is considered to match the bit rate used), radio performance (e.g. IF filter distortion), supply voltage (higher bit rates require V DD≥ 4.5V), and other ‘real world’ factors.4.2.6 Rx Signal QualityThe effect of input Rx Signal quality on the Rx S/N output is shown in Figure 7.When power is subsequently restored to the Tx filter, its output will take several bit-times to settle. The Tx Enable input can be used to prevent these abnormal voltages from appearing at the Tx Out pin.Figure 9: Tx Filter ResponseFigure 11: Tx Output Spectrum (Random Data)4.4 Data FormatsThe receive section of the CMX589A works best with data which has a reasonably random structure --the data should contain approximately the same number of ‘ones’ as ‘zeroes’ with no long sequences (>100 bits) of consecutive ones or zeroes. Also, long sequences (>100 bits) of 10101010 ... patterns should be avoided. For this reason, it is recommended that data be made random in some manner before transmission, forexample by exclusive-ORing it with the output of a binary pseudo-random pattern generator.Where data is transmitted in bursts, each burst should be preceded by a preamble designed to allow the receive modem to establish timing and level lock as quickly as possible. This preamble for BT=0.3 should be at least 16 bits long, and should preferably consist of alternating pairs of ones and zeros i.e. 110011001100....; the eye of pattern 10101010 .... has the most gradual slope and will yield poor peak levels for the Rx circuits. For BT=0.5 the eye pattern of 10101010... has reduced intersymbol interference and may be used as the preamble (DC Acq pin should be held high during preamble). See Figure 5.4.5 Acquisition and Hold ModesThe RXDCacq and PLLacq inputs must be pulsed High for about 16 bits at the start of reception to ensure that the DC measurement and timing extraction circuits lock-on to the received signal correctly. Once lock has been achieved, the above inputs should be taken Low again.In most applications, there will be a DC step in the output voltage from the receiver FM discriminator due to carrier frequency offsets as channels are changed or when the remote transmitter is turned on.The CMX589A can tolerate DC offsets in the received signal of at least ±10% of V DD with respect to V BIAS, (measured at the Rx Feedback pin). However, to ensure that the DC offset compensation circuit operates correctly and with minimum delay, the Low to High transition of the RXDCacq and PLLacq inputs should occur after the mean input voltage to the CMX589A has settled to within about 0.1V of its final value.Note: This can place restrictions on the value of any series signal coupling capacitor.As well as using the Rx Hold input to freeze the Level Measuring and Clock Extraction circuits during a signal fade, it may also be used in systems which use a continuously transmitting control channel to freeze the Rx circuitry during transmission of a data packet, allowing reception to resume afterwards without losing bit synchronization. To achieve this, the CMX589A Xtal clock needs to be accurate enough that the derived RxClock output does not drift by more than about 0.1 bit time from the actual received data-rate during the time that the RxHold input is ‘Low’.However; the RXDCacq input may need to be pulsed High for 2 bit durations to re-establish the level measurements if the RxHold input is Low for more that a few hundred bit-times (exact number depends on system crystal tolerances).The voltages on the Doc1 and Doc2 pins reflect the average peak positive and negative excursions of the (filtered) receive signal, and could therefore be used to derive a measure of the data signal amplitude. Note: These pins are driven from very high-impedance circuits, so that the DC load presented by any external circuitry should exceed 10MΩ to V BIAS.5 Application5.1 Radio Channel RequirementsTo achieve legal adjacent channel performance at high bit-rates, a radio with an accurate carrier frequency and an accurate modulation index is required. For optimum channel utilization, (e.g. low BER and high data-rates) attention must be paid to the phase and frequency response of both the IF and baseband circuitry.5.1.1 Bit Rate, BT, and BandwidthThe maximum data rate that can be transmitted over a radio channel depends on the following: Channel spacingAllowable adjacent channel interferenceTx filter bandwidthPeak carrier deviation (Modulation Index)Tx and Rx carrier frequency accuraciesModulator and Demodulator linearityRx IF filter frequency and phase characteristicsUse of error correction techniquesAcceptable error-rateAs a guide to MOBITEX operation, a raw data-rate of 8kbps at 12.5kHz channel spacing may be achievable -depending on local regulatory requirements- using a ±2kHz maximum deviation, a BT of 0.3, and no more than 1.5kHz discrepancy between Tx and Rx carrier frequencies. Forward error correction (FEC) could then be used with interleaving to reduce the effect of burst errors.Reducing the data-rate to 4.8kbps would allow the BT to be increased to 0.5, improving the error-rate performance.5.1.2 FM Modulator, Demodulator and IFFor optimum performance, the eye pattern of the received signal (when receiving random data) applied to the CMX589A should be as close as possible to the Transmit eye pattern examples shown in Figure 10.Of particular importance are general symmetry, cleanliness of the zero-crossings, and for a BT of 0.3, the relative amplitude of the inner eye opening.To achieve this, attention must be paid to:Linearity and frequency/phase response of the Tx frequency modulator. Unless the transmit data is especially encoded to remove low frequency components, the modulator frequency response should extend down to a few hertz. This is because two-point modulation is necessary for synthesizedradios.Bandwidth and phase response of the Rx IF filters.Accuracy of the Tx and Rx carrier frequencies -any difference will shift the received signal towardsone of the skirts of the IF filter response.Ideally, the Rx demodulator should be DC coupled to the CMX589A Rx Signal In pin (with a DC bias added to center the signal at the Rx Feedback pin at V DD/2 [V BIAS]). However, AC coupling can be used provided that:The 3dB cut-off frequency is 20Hz or below (i.e. a 0.1µF capacitor in series with 100kΩ).The data does not contain long sequences of consecutive ones or zeroes.Sufficient time is allowed after a step change at the discriminator output (resulting from channelchanging or the appearance of a RF carrier) for the voltage into the CMX589A to settle before theRXDCacq line is strobed.5.1.3 Two-Point ModulationWhen designing the CMX589A into a radio that uses a frequency synthesizer, a two-point modulation technique is recommended. This is both to prevent the radio's PLL circuitry from counteracting the modulation process, and to provide a clean flat modulation response down to DC.Figure 12 shows a suggested basic configuration to provide a two-point modulation drive from the CMX589A Tx Output using the FX019 or MX019 Digitally Controlled Quad Amplifier Array. The FX019/MX019 elements provide individual set-up, calibration and dynamic control of modulation levels. Level setting control of the amplifiers/attenuators of the FX019/MX019 is via an 8-bit data word. Note that the FX019/MX019 frequency response only supports data rates as high as 8kbps.With reference to Figure 12:The buffer amplifier is required to prevent loading of the CMX589A external RC circuit.Stage B, with R1/R2, provides suitable signal and DC levels for the VCO varactor; C1 is RFdecoupling. The drive level should be adjusted (digitally) to provide the desired deviation.Stage C, with R3/R4, provides the Reference Oscillator drive (application dependent). Thisparameter is set by adjusting for minimum AC signal on the PLL control voltage with a low-frequency modulating signal (inside the PLL bandwidth) applied.Stage D could be used with the components shown if a negative reference drive is required.Stage A provides buffering and overall level control.Figure 12: An Example of Two-Point Modulation Drive with Individual Adjustment Using theFX019/MX0195.2 AC Coupling of Tx and Rx SignalsIn practical applications, it is possible to arrange AC coupling between the CMX589A Tx Output and the frequency modulator to cut-off at a very low frequency, such as 5.0Hz. AC coupling between the receive discriminator and the input of the CMX589A may need a shorter time-constant to avoid problems from voltage steps at the output of the discriminator when changing channels or when the distant transmitter turns on.For these reasons, as well as to maintain reasonable BER, the optimum –3dB cut-off frequencies are around 5.0Hz in the Tx path and 20.0Hz in the Rx path.Figure 13 shows the typical static Bit-Error-Rate performance of the CMX589A operating under nominal conditions for various degrees of AC coupling at the Rx input and the Tx output.Data Rate = 8kbps V DD = 5.0V T AMB = 25°C Tx BT = 0.36 Performance Specifications6.1 Electrical Specifications6.1.1 Absolute Maximum LimitsExceeding these maximum ratings can result in damage to the device.General Notes Min. Typ. Max. Units Supply (V DD-V SS) -0.3 7.0 VVoltage on any pin to V SS-0.3 V DD + 0.3 VCurrentV DD-30 30 mAV SS-30 30 mAAny other pin -20 20 mA D2 / P4 PackagesTotal allowable Power dissipation800 mW at T AMB = 25°CDerating above 25°C 13 mW/°C Operating Temperature -40 85 °C Storage Temperature -55 125 °C D5 Package550 mW Total allowable Power dissipationat T AMB = 25°CDerating above 25°C 9 mW/°C Operating Temperature -40 85 °C Storage Temperature -55 125 °C E2 PackageTotal allowable Power dissipationat T AMB = 25°C 320 mWDerating above 25°C 5.3 mW/°C Operating Temperature -40 85 °C Storage Temperature -55 125 °CTable 7: Absolute Maximum Ratings6.1.2 Operating LimitsCorrect Operation of the device outside these limits is not implied.Notes Min. Typ. Max. Units Supply (V DD-V SS) 3.0 3.3/5.0 5.5 VOperating Temperature -40 85 °CRx and Tx Data RateV DD≥ 3.0V 4 32 kbpsV DD≥ 4.5V 4 200 kbpsXtal FrequencyV DD≥ 3.0V 1.0 5.0 MHzV DD≥ 4.5V 1.0 16.0 MHzExternal Clock FrequencyV DD≥ 3.0V 1 1.0 5.0 MHzV DD≥ 4.5V 1 1.0 25.6 MHzHigh Pulse Width 1 15 nsLow Pulse Width 1 15 nsTable 8: Operating LimitsOperating Limits Notes1. Timing for an external clock input to the Xtal/Clock pin.6.1.3 Operating CharacteristicsFor the following conditions unless otherwise specified.V DD = 5.0V @ T AMB = 25°CXtal/Clock Frequency = 4.096MHz, Data Rate = 8kbps, Noise Bandwidth = Bit RateStatic Values Notes Min. Typ. Max. Units Supply Current Tx PS Rx PS 1I DD (V DD = 3.0V)1 1 - 0.5 - mA0 1 - 1.0 - mA1 0 - 1.0 - mA0 0 - 1.5 - mAI DD (V DD = 5.0V)1 1 - 1.0 - mA0 1 - 2.0 - mA1 0 - 3.0 - mA0 0 - 4.0 - mAInput Logic LevelLogic 1 Input Level 3.5 - - VLogic 0 Input Level - - 1.5 VLogic Input Current 2 -5.0 - 5.0 µA Output Logic LevelLogic 1 Output Level (I OH = 120µA) 4.6 - - VLogic 0 Output Level (I OL = -120µA) - - 0.4 V Transmit Parameters -Tx OUT pin DC bias shift caused by change from-85.0 - 85.0 mV Tx Enable = 0 to Tx Enable = 1 whileTx PSAVE = 0 at 25°CTx OUT, Output Impedance 3 - 1.0 - kΩTx Out, Level 4, 10 0.8 1.0 1.2 V P-P Output DC Offset 12 -0.125 - 0.125 V Tx Data DelayBT = 0.3 5 - 2.0 2.5 bit-periods BT = 0.5 5 - 1.5 2.0 bit-periods Tx PS to Output-Stable time 6 - 4.0 - bit-periods Receive ParametersRx AmplifierInput Impedance 1.0 - - MΩOutput Impedance 7 - 10.0 - KΩVoltage Gain - 50.0 - dB Rx Filter Signal Input Level 8, 10 0.7 1.0 1.3 V P-P Rx Time Delay 9 - - 3.0 bit-periodsStatic Values Notes Min. Typ. Max. Units On-Chip Xtal OscillatorR IN10.0 - - MΩR OUT11 - 50.0 - kΩVoltage Gain 11 - 25.0 - dBTable 9: Operating CharacteristicsOperating Characteristics Notes:1. Not including current drawn from the CMX589A pins by external circuitry. See Absolute MaximumRatings.2. For V IN in the range V SS to V DD.3. For a load of 10KΩ or greater. Tx PS input at logic ‘0’; Tx Enable = ‘1’.4. Data pattern of 1111000011110000…5. Measured between the rising edge of Tx Clock and the centre of the corresponding bit at Tx Out.6. Time between the falling edge of the TXPSAVE and the Tx Out voltage stabilizing to normal outputlevels.7. For a load of 10kΩ or greater. RXPSAVE input at logic ‘0’.8. For optimum performance, Measured at the Rx Feedback pin for an 1111000011110000… pattern.9. Measured between the center of bit at Rx Signal In and corresponding rising edge of the Rx Clock.10. Levels are proportional to applied V DD11. Small signal measurement at 1.0kHz with no load on Xtal output.12. (Tx OUT enabled DC level) – (Tx Out disabled DC level) when transmitting a repeating 11110000 bitpattern.6.2 PackagesFigure 16: 24-pin SSOP Mechanical Outline: Order as part no. CMX589AD5Handling precautions: This product includes input protection, however, precautions should be taken to prevent device damage from electro-static discharge. CML does not assume any responsibility for the use of any circuitry described. No IPR or circuit patent licences are implied. CML reserves the right at any time without notice to change the said circuitry and this product specification. CML has a policy of testing every product shipped using calibrated test equipment to ensure compliance with this product specification. Specific testing of all circuit parameters is not necessarily performed.CML Microcircuits (UK )Ltd4800 Bethania Station Road -Winston-Salem - NC 27105 - USA. Tel: +1 336 744 5050, 800 638 5577 Fax: +1 336 744 5054Sales: us.sales@ Technical Support:us.techsupport@CML Microcircuits (Singapore)P teLtd。

YASKAWA MP900 2000系列 说明书

YASKAWA MP900 2000系列 说明书

图标的说明为使读者了解说明内容的区分本书中设计了如下图标并在必要的地方使用这些图标以助读者理解表示需要熟记的重要事项同时也表示发生警报但还不至于造成装置损坏的注意事项表示具体程序举例操作实例表示补充事项或记住后会便于使用的功能表示对难于理解的用语进行解释以及对事先没有说明而后出现的用语进行说明Copyright 2004株式会社 安川电机未经本公司的书面许可禁止转载或复制本书的一部分或全部内容目录图标的说明- - - - - - - - - - - - - - - - - - - - - - - - - -iii本手册的简介- - - - - - - - - - - - - - - - - - - - - - - - viii本手册的资料构成- - - - - - - - - - - - - - - - - - - - - - viii相关手册- - - - - - - - - - - - - - - - - - - - - - - - - - - ix本手册的使用方法- - - - - - - - - - - - - - - - - - - - - - - xi关于软件- - - - - - - - - - - - - - - - - - - - - - - - - - - xi 1章 梯形图指令1.1 继电器电路指令 - - - - - - - - - - - - - - - - - - -1-41.1.1 A触点指令(NOC) - - - - - - - - - - - - - - - - - - - - - -1-41.1.2 B触点指令(NCC) - - - - - - - - - - - - - - - - - - - - - -1-51.1.3 接通延时定时器指令(TON[10ms]) - - - - - - - - - - - - - - -1-51.1.4 断开延时定时器指令(TOFF[10ms])- - - - - - - - - - - - - - -1-71.1.5 接通延时定时器指令(TON[1s]) - - - - - - - - - - - - - - - -1-81.1.6 断开延时定时器指令(TOFF[1s])- - - - - - - - - - - - - - - -1-91.1.7 上升脉冲指令(ON-PLS)- - - - - - - - - - - - - - - - - - - 1-101.1.8 下降脉冲指令(OFF-PLS) - - - - - - - - - - - - - - - - - - 1-121.1.9 线圈指令(COIL)- - - - - - - - - - - - - - - - - - - - - - 1-131.1.10 置位线圈指令(S-COIL)- - - - - - - - - - - - - - - - - - - 1-141.1.11 复位线圈指令(R-COIL)- - - - - - - - - - - - - - - - - - - 1-151.2 数值运算指令 - - - - - - - - - - - - - - - - - - - 1-161.2.1 存储指令(STORE) - - - - - - - - - - - - - - - - - - - - - 1-161.2.2 加法指令(ADD) - - - - - - - - - - - - - - - - - - - - - - 1-181.2.3 加法扩展指令(ADDX)- - - - - - - - - - - - - - - - - - - - 1-201.2.4 减法指令(SUB) - - - - - - - - - - - - - - - - - - - - - - 1-211.2.5 减法扩展指令(SUBX)- - - - - - - - - - - - - - - - - - - - 1-231.2.6 乘法指令(MUL) - - - - - - - - - - - - - - - - - - - - - - 1-241.2.7 除法指令(DIV) - - - - - - - - - - - - - - - - - - - - - - 1-271.2.8 整型余数指令(MOD) - - - - - - - - - - - - - - - - - - - - 1-291.2.9 实型余数指令(REM) - - - - - - - - - - - - - - - - - - - - 1-301.2.10 增量指令(INC) - - - - - - - - - - - - - - - - - - - - - - 1-311.2.11 减量指令(DEC) - - - - - - - - - - - - - - - - - - - - - - 1-321.2.12 时间加法指令(TMADD) - - - - - - - - - - - - - - - - - - - 1-331.2.13 时间减法指令(TMSUB) - - - - - - - - - - - - - - - - - - - 1-351.2.14 时间经过指令(SPEND) - - - - - - - - - - - - - - - - - - - 1-371.2.15 符号取反指令(INV) - - - - - - - - - - - - - - - - - - - - 1-391.2.16 1的补码指令(COM) - - - - - - - - - - - - - - - - - - - - 1-411.2.17 绝对值转换指令(ABS) - - - - - - - - - - - - - - - - - - - 1-421.2.18 2进制转换指令(BIN) - - - - - - - - - - - - - - - - - - - 1-441.2.19 BCD转换指令(BCD) - - - - - - - - - - - - - - - - - - - - 1-451.2.20 校验转换指令(PARITY)- - - - - - - - - - - - - - - - - - - 1-461.2.21 ASCII码转换1指令(ASCII) - - - - - - - - - - - - - - - - 1-471.2.22 ASCII码转换2指令(BINASC)- - - - - - - - - - - - - - - - 1-491.2.23 ASCII码转换3指令(ASCBIN)- - - - - - - - - - - - - - - - 1-501.3 逻辑运算/比较指令 - - - - - - - - - - - - - - - -1-511.3.1 逻辑与指令(AND)- - - - - - - - - - - - - - - - - - - - - -1-511.3.2 逻辑或指令(OR) - - - - - - - - - - - - - - - - - - - - - -1-521.3.3 逻辑异或指令(XOR)- - - - - - - - - - - - - - - - - - - - -1-531.3.4 比较指令()- - - - - - - - - - - - - - - - - - - - - - -1-541.3.5 比较指令(≦)- - - - - - - - - - - - - - - - - - - - - - -1-551.3.6 比较指令()- - - - - - - - - - - - - - - - - - - - - - -1-561.3.7 比较指令()- - - - - - - - - - - - - - - - - - - - - - -1-571.3.8 比较指令(≧)- - - - - - - - - - - - - - - - - - - - - - -1-581.3.9 比较指令()- - - - - - - - - - - - - - - - - - - - - - -1-591.3.10 范围检查指令(RCHK) - - - - - - - - - - - - - - - - - - - -1-60 1.4 程序控制指令 - - - - - - - - - - - - - - - - - - -1-631.4.1 图调用指令(SEE)- - - - - - - - - - - - - - - - - - - - - -1-631.4.2 运动程序调用指令(MSEE) - - - - - - - - - - - - - - - - - -1-641.4.3 函数调用指令(FUNC) - - - - - - - - - - - - - - - - - - - -1-651.4.4 连续执行型直接输入指令(INS)- - - - - - - - - - - - - - - -1-661.4.5 连续执行型直接输出指令(OUTS) - - - - - - - - - - - - - - -1-691.4.6 扩展程序执行指令(XCALL)- - - - - - - - - - - - - - - - - -1-711.4.7 WHILE指令(WHILE END_WHILE)- - - - - - - - - - - - - - - -1-721.4.8 IF指令(IF END_IF) - - - - - - - - - - - - - - - - - - - -1-741.4.9 IF指令(IF ELSE END_IF) - - - - - - - - - - - - - - - - -1-761.4.10 FOR指令(FOR END_FOR)- - - - - - - - - - - - - - - - - - -1-781.4.11 EXPRESSION指令(EXPRESSION) - - - - - - - - - - - - - - - -1-80 1.5 基本函数指令 - - - - - - - - - - - - - - - - - - -1-811.5.1 平方根指令(SQRT) - - - - - - - - - - - - - - - - - - - - -1-811.5.2 正弦指令(SIN)- - - - - - - - - - - - - - - - - - - - - - -1-831.5.3 余弦指令(COS)- - - - - - - - - - - - - - - - - - - - - - -1-851.5.4 正切指令(TAN)- - - - - - - - - - - - - - - - - - - - - - -1-871.5.5 反正弦指令(ASIN) - - - - - - - - - - - - - - - - - - - - -1-881.5.6 反余弦指令(ACOS) - - - - - - - - - - - - - - - - - - - - -1-891.5.7 反正切指令(ATAN) - - - - - - - - - - - - - - - - - - - - -1-901.5.8 指数指令(EXP)- - - - - - - - - - - - - - - - - - - - - - -1-921.5.9 自然对数指令(LN) - - - - - - - - - - - - - - - - - - - - -1-931.5.10 常用对数指令(LOG)- - - - - - - - - - - - - - - - - - - - -1-94 1.6 数据操作指令 - - - - - - - - - - - - - - - - - - -1-951.6.1 位循环左移指令(ROTL) - - - - - - - - - - - - - - - - - - -1-951.6.2 位循环右移指令(ROTR) - - - - - - - - - - - - - - - - - - -1-971.6.3 位传送指令(MOVB) - - - - - - - - - - - - - - - - - - - - -1-991.6.4 字传送指令(MOVW) - - - - - - - - - - - - - - - - - - - - 1-1011.6.5 替换传送指令(XCHG) - - - - - - - - - - - - - - - - - - - 1-1031.6.6 表初始化指令(SETW) - - - - - - - - - - - - - - - - - - - 1-1051.6.7 字节字展开指令(BEXTD)- - - - - - - - - - - - - - - - - 1-1071.6.8 字字节压缩指令(BPRESS) - - - - - - - - - - - - - - - - 1-1091.6.9 数据检索指令(BSRCH)- - - - - - - - - - - - - - - - - - - 1-1111.6.10 分类指令(SORT) - - - - - - - - - - - - - - - - - - - - - 1-1131.6.11 位左移指令(SHFTL)- - - - - - - - - - - - - - - - - - - - 1-1141.6.12 位右移指令(SHFTR)- - - - - - - - - - - - - - - - - - - - 1-1161.6.13 字复制指令(COPYW)- - - - - - - - - - - - - - - - - - - - 1-1171.6.14 字节交换指令(BSWAP)- - - - - - - - - - - - - - - - - - - 1-1191.7 DDC指令- - - - - - - - - - - - - - - - - - - - - -1-1211.7.1 死区A指令(DZA) - - - - - - - - - - - - - - - - - - - - -1-1211.7.2 死区B指令(DZB) - - - - - - - - - - - - - - - - - - - - -1-1231.7.3 上下限值指令(LIMIT) - - - - - - - - - - - - - - - - - - -1-1251.7.4 PI控制指令(PI) - - - - - - - - - - - - - - - - - - - - -1-1281.7.5 PD控制指令(PD) - - - - - - - - - - - - - - - - - - - - -1-1311.7.6 PID控制指令(PID) - - - - - - - - - - - - - - - - - - - -1-1341.7.7 一阶延迟指令(LAG) - - - - - - - - - - - - - - - - - - - -1-1381.7.8 相位超前滞后指令(LLAG)- - - - - - - - - - - - - - - - - -1-1411.7.9 函数发生器指令(FGN) - - - - - - - - - - - - - - - - - - -1-1441.7.10 反函数发生器指令(IFGN)- - - - - - - - - - - - - - - - - -1-1481.7.11 直线加减速器1指令(LAU) - - - - - - - - - - - - - - - - -1-1521.7.12 直线加减速器2指令(SLAU)- - - - - - - - - - - - - - - - -1-1561.7.13 脉宽调制指令(PWM) - - - - - - - - - - - - - - - - - - - -1-1631.8 表数据操作指令 - - - - - - - - - - - - - - - - - -1-1651.8.1 块调出指令(TBLBR) - - - - - - - - - - - - - - - - - - - -1-1651.8.2 块写入指令(TBLBW) - - - - - - - - - - - - - - - - - - - -1-1671.8.3 行检索指令纵向(TBLSRL)- - - - - - - - - - - - - - - - -1-1691.8.4 列检索指令横向(TBLSRC)- - - - - - - - - - - - - - - - -1-1711.8.5 块清除指令(TBLCL) - - - - - - - - - - - - - - - - - - - -1-1731.8.6 表间块传送指令(TBLMV) - - - - - - - - - - - - - - - - - -1-1751.8.7 Q表调出指令(QTBLR QTBLRI) - - - - - - - - - - - - - - -1-1771.8.8 Q表写入指令(QTBLW QTBLWI) - - - - - - - - - - - - - - -1-1791.8.9 Q指针清除指令(QTBLCL)- - - - - - - - - - - - - - - - - -1-181 2章 系统标准函数指令2.1 信息函数 - - - - - - - - - - - - - - - - - - - - - -2-22.1.1 信息发送函数(MSG-SND) - - - - - - - - - - - - - - - - - - -2-22.1.2 信息接收函数(MSG-RCV) - - - - - - - - - - - - - - - - - - 2-152.2 示踪函数 - - - - - - - - - - - - - - - - - - - - - 2-242.2.1 示踪函数(TRACE) - - - - - - - - - - - - - - - - - - - - - 2-242.2.2 数据示踪调出函数(DTRC-RD) - - - - - - - - - - - - - - - - 2-252.2.3 故障示踪调出函数(FTRC-RD) - - - - - - - - - - - - - - - - 2-282.2.4 变频器示踪调出函数(ITRC-RD) - - - - - - - - - - - - - - - 2-322.3 变频器函数 - - - - - - - - - - - - - - - - - - - - 2-352.3.1 变频器常数写入函数(ICNS-WR) - - - - - - - - - - - - - - - 2-352.3.2 变频器常数调出函数(ICNS-RD) - - - - - - - - - - - - - - - 2-402.4 其他的函数 - - - - - - - - - - - - - - - - - - - - 2-432.4.1 计数函数(COUNTER) - - - - - - - - - - - - - - - - - - - - 2-432.4.2 先进先出函数(FINFOUT) - - - - - - - - - - - - - - - - - - 2-45附录A EXPRESSIONA.1 数式 - - - - - - - - - - - - - - - - - - - - - - - A-2A.1.1 运算符- - - - - - - - - - - - - - - - - - - - - - - - - - - A-2A.1.2 运算对象- - - - - - - - - - - - - - - - - - - - - - - - - - A-4A.1.3 函数- - - - - - - - - - - - - - - - - - - - - - - - - - - - A-4A.2 可识别的表达式种类 - - - - - - - - - - - - - - - - A-5A.2.1 算术运算符- - - - - - - - - - - - - - - - - - - - - - - - - A-5A.2.2 比较运算符- - - - - - - - - - - - - - - - - - - - - - - - - A-5A.2.3 逻辑运算符- - - - - - - - - - - - - - - - - - - - - - - - - A-5A.2.4 赋值运算符- - - - - - - - - - - - - - - - - - - - - - - - - A-6A.2.5 函数- - - - - - - - - - - - - - - - - - - - - - - - - - - - A-6A.2.6 其他- - - - - - - - - - - - - - - - - - - - - - - - - - - - A-6A.3 在梯形图程序中的应用 - - - - - - - - - - - - - - - A-7A.3.1 IF指令句的条件表达式 - - - - - - - - - - - - - - - - - - - A-7A.3.2 WHILE指令句的条件表达式- - - - - - - - - - - - - - - - - - A-7A.3.3 EXPRESSION指令句的运算表达式 - - - - - - - - - - - - - - - A-7本手册的简介本手册详细地说明了支持MP900/MP2000系列(以下称MP系列)的设计与维护的新梯形图编辑器软件的操作方法本手册以充分理解Microsoft Windows 95/98/2000/NT的操作方法的人员为对象关于Windows的打开关闭及鼠标操作Windows应用程序的一般操作等请参阅计算机所附的说明书为了能正确使用新梯形图编辑器请仔细阅读本手册请妥善保管本手册以便需要时参阅本手册的资料构成MP900系列有MP910MP920MP930MP940四种MP2000系列有MP2100和MP2300两种资料构成根据上述产品构成修订相关手册在下一页有介绍敬请参阅相关手册机器控制器MP900/MP2000系列的相关手册包括下表所示的内容请根据需要进行阅读用户手册名资料编号适用机型MP910MP920MP930MP940MP2100MP2300机器控制器MP930用户手册设计与维护篇SI-C887-1.1{机器控制器MP900/MP2000系列用户手册梯形图程序篇SI-C887-1.2{{{{{{机器控制器MP900/MP2000系列用户手册运动程序篇SIZ-C887-1.3{{{{{{机器控制器MP900系列用户手册示教操作器篇SI-C887-1.6{{机器控制器MP920用户手册设计与维护篇SIZ-C887-2.1{机器控制器MP900系列编程装置用软件MPE720用户手册操作说明简易版SIZ-C887-2.3{{{{机器控制器MP920用户手册运动模块篇SIZ-C887-2.5{机器控制器MP920用户手册通讯模块篇SIZ-C887-2.6{机器控制器MP920设置手册EMC 指令用SIBZ-C887-2.50{机器控制器MP910用户手册设计与维护篇SIZ-C887-3.1{机器控制器MP940用户手册设计与维护篇SIZ-C887-4.1{机器控制器MP940设置手册EMC 指令用SIBZ-C887-4.50{机器控制器MP900系列用户手册MECHATROLINK 篇SIZ-C887-5.1{{{{机器控制器MP900系列用户手册260I/F DeviceNet 篇SIZ-C887-5.2{{机器控制器MP900系列MPPanel用户手册SIZ-C887-10.1{{{机器控制器MP900系列MPLogger用户手册SIZ-C887-11.1{{{机器控制器MP900系列MPLoader (Server)用户手册SIZ-C887-12.1{{{机器控制器MP900系列MPLoader (Client)用户手册SIZ-C887-12.2{{{机器控制器MP900/MP2000系列用户手册新梯形图编辑器程序指令篇SIZ-C887-13.1{{{{{{机器控制器MP900/MP2000系列用户手册新梯形图编辑器操作篇SIZ-C887-13.2{{{{{{机器控制器MP2300用户手册基本模块篇SIJPC88070003A{机器控制器MP2300用户手册通讯模块篇SIJPC88070004A{机器控制器MP900/MP2000系列编程装置用用户手册标准版SIJPC88070005A{{{{{{机器控制器MP2100用户手册设计与维护篇SIJPC88070001A{用户手册名资料编号适用机型MP910MP920MP930MP940MP2100MP2300xi本手册的使用方法本手册的使用对象本手册以下列人员为对象进行MP900/MP2000系列系统设计的人员进行MP900/MP2000系列运动程序编程的人员进行MP900/MP2000系列梯形图程序编程的人员缩略语及缩写符号本手册使用如下所示的缩略语及缩写符号PLC机器控制器的总称MPE720编程装置用软件的总称关于软件使用注意事项本软件请在1台特定的电脑上使用需要在其他电脑上使用时请另行购买严禁复制本软件并将其用于编程装置用之外的用途请妥善保管本软件的软盘严禁对本软件进行反编译反汇编未经本公司许可严禁将本软件的一部分或全部转让交换转借给第三者使用注册商标Windows Windows95/98/2000/NT 是美国Microsoft公司的注册商标Pentium 是美国Intel公司的注册商标以太网(Ethernet)是美国Xerox公司的注册商标1-111章梯形图指令本章对继电器电路指令数值运算指令逻辑运算/比较指令程序控制指令基本函数指令数据操作指令DDC 指令以及表数据操作指令进行了说明1章 梯形图指令1.1 继电器电路指令- - - - - - - - - - - - - - - - - - - 1-41.1.1 A 触点指令(NOC) - - - - - - - - - - - - - - - - - - - - - -1-41.1.2 B 触点指令(NCC) - - - - - - - - - - - - - - - - - - - - - -1-51.1.3 接通延时定时器指令(TON[10ms]) - - - - - - - - - - - - - - -1-51.1.4 断开延时定时器指令(TOFF[10ms])- - - - - - - - - - - - - - -1-71.1.5 接通延时定时器指令(TON[1s]) - - - - - - - - - - - - - - - -1-81.1.6 断开延时定时器指令(TOFF[1s])- - - - - - - - - - - - - - - -1-91.1.7 上升脉冲指令(ON-PLS)- - - - - - - - - - - - - - - - - - - 1-101.1.8 下降脉冲指令(OFF-PLS) - - - - - - - - - - - - - - - - - - 1-121.1.9 线圈指令(COIL)- - - - - - - - - - - - - - - - - - - - - - 1-131.1.10 置位线圈指令(S-COIL)- - - - - - - - - - - - - - - - - - - 1-141.1.11 复位线圈指令(R-COIL)- - - - - - - - - - - - - - - - - - - 1-151.2 数值运算指令- - - - - - - - - - - - - - - - - - - -1-161.2.1 存储指令(STORE) - - - - - - - - - - - - - - - - - - - - - 1-161.2.2 加法指令(ADD) - - - - - - - - - - - - - - - - - - - - - - 1-181.2.3 加法扩展指令(ADDX)- - - - - - - - - - - - - - - - - - - - 1-201.2.4 减法指令(SUB) - - - - - - - - - - - - - - - - - - - - - - 1-211.2.5 减法扩展指令(SUBX)- - - - - - - - - - - - - - - - - - - - 1-231.2.6 乘法指令(MUL) - - - - - - - - - - - - - - - - - - - - - - 1-241.2.7 除法指令(DIV) - - - - - - - - - - - - - - - - - - - - - - 1-271.2.8 整型余数指令(MOD) - - - - - - - - - - - - - - - - - - - - 1-291.2.9 实型余数指令(REM) - - - - - - - - - - - - - - - - - - - - 1-301.2.10 增量指令(INC) - - - - - - - - - - - - - - - - - - - - - - 1-311.2.11 减量指令(DEC) - - - - - - - - - - - - - - - - - - - - - - 1-321.2.12 时间加法指令(TMADD) - - - - - - - - - - - - - - - - - - - 1-331.2.13 时间减法指令(TMSUB) - - - - - - - - - - - - - - - - - - - 1-351.2.14 时间经过指令(SPEND) - - - - - - - - - - - - - - - - - - - 1-371.2.15 符号取反指令(INV) - - - - - - - - - - - - - - - - - - - - 1-391章 梯形图指令1-21.2.16 1的补码指令(COM) - - - - - - - - - - - - - - - - - - - - 1-411.2.17 绝对值转换指令(ABS) - - - - - - - - - - - - - - - - - - - 1-421.2.18 2进制转换指令(BIN) - - - - - - - - - - - - - - - - - - - 1-441.2.19 BCD 转换指令(BCD) - - - - - - - - - - - - - - - - - - - - 1-451.2.20 校验转换指令(PARITY)- - - - - - - - - - - - - - - - - - - 1-461.2.21 ASCII 码转换1指令(ASCII) - - - - - - - - - - - - - - - - 1-471.2.22 ASCII 码转换2指令(BINASC)- - - - - - - - - - - - - - - - 1-491.2.23 ASCII 码转换3指令(ASCBIN)- - - - - - - - - - - - - - - - 1-501.3 逻辑运算/比较指令 - - - - - - - - - - - - - - - - 1-511.3.1 逻辑与指令(AND) - - - - - - - - - - - - - - - - - - - - - 1-511.3.2 逻辑或指令(OR)- - - - - - - - - - - - - - - - - - - - - - 1-521.3.3 逻辑异或指令(XOR) - - - - - - - - - - - - - - - - - - - - 1-531.3.4 比较指令() - - - - - - - - - - - - - - - - - - - - - - 1-541.3.5 比较指令(≦) - - - - - - - - - - - - - - - - - - - - - - 1-551.3.6 比较指令() - - - - - - - - - - - - - - - - - - - - - - 1-561.3.7 比较指令() - - - - - - - - - - - - - - - - - - - - - - 1-571.3.8 比较指令(≧) - - - - - - - - - - - - - - - - - - - - - - 1-581.3.9 比较指令() - - - - - - - - - - - - - - - - - - - - - - 1-591.3.10 范围检查指令(RCHK)- - - - - - - - - - - - - - - - - - - - 1-601.4 程序控制指令 - - - - - - - - - - - - - - - - - - - 1-631.4.1 图调用指令(SEE) - - - - - - - - - - - - - - - - - - - - - 1-631.4.2 运动程序调用指令(MSEE)- - - - - - - - - - - - - - - - - - 1-641.4.3 函数调用指令(FUNC)- - - - - - - - - - - - - - - - - - - - 1-651.4.4 连续执行型直接输入指令(INS) - - - - - - - - - - - - - - - 1-661.4.5 连续执行型直接输出指令(OUTS)- - - - - - - - - - - - - - - 1-691.4.6 扩展程序执行指令(XCALL) - - - - - - - - - - - - - - - - - 1-711.4.7 WHILE 指令(WHILE END_WHILE)- - - - - - - - - - - - - - - 1-721.4.8 IF 指令(IFEND_IF) - - - - - - - - - - - - - - - - - - - 1-741.4.9 IF 指令(IF ELSE END_IF) - - - - - - - - - - - - - - - - 1-761.4.10 FOR 指令(FOR END_FOR)- - - - - - - - - - - - - - - - - - 1-781.4.11 EXPRESSION 指令(EXPRESSION) - - - - - - - - - - - - - - - 1-801.5 基本函数指令 - - - - - - - - - - - - - - - - - - - 1-811.5.1 平方根指令(SQRT)- - - - - - - - - - - - - - - - - - - - - 1-811.5.2 正弦指令(SIN) - - - - - - - - - - - - - - - - - - - - - - 1-831.5.3 余弦指令(COS) - - - - - - - - - - - - - - - - - - - - - - 1-851.5.4 正切指令(TAN) - - - - - - - - - - - - - - - - - - - - - - 1-871.5.5 反正弦指令(ASIN)- - - - - - - - - - - - - - - - - - - - - 1-881.5.6 反余弦指令(ACOS)- - - - - - - - - - - - - - - - - - - - - 1-891.5.7 反正切指令(ATAN)- - - - - - - - - - - - - - - - - - - - - 1-901.5.8 指数指令(EXP) - - - - - - - - - - - - - - - - - - - - - - 1-921.5.9 自然对数指令(LN)- - - - - - - - - - - - - - - - - - - - - 1-931.5.10 常用对数指令(LOG) - - - - - - - - - - - - - - - - - - - - 1-941.6 数据操作指令 - - - - - - - - - - - - - - - - - - - 1-951.6.1 位循环左移指令(ROTL)- - - - - - - - - - - - - - - - - - - 1-951.6.2 位循环右移指令(ROTR)- - - - - - - - - - - - - - - - - - - 1-971.6.3 位传送指令(MOVB)- - - - - - - - - - - - - - - - - - - - - 1-991.6.4 字传送指令(MOVW)- - - - - - - - - - - - - - - - - - - - -1-1011.6.5 替换传送指令(XCHG)- - - - - - - - - - - - - - - - - - - -1-1031.6.6 表初始化指令(SETW)- - - - - - - - - - - - - - - - - - - -1-1051-31 1.6.7 字节字展开指令(BEXTD)- - - - - - - - - - - - - - - - - 1-107 1.6.8 字字节压缩指令(BPRESS) - - - - - - - - - - - - - - - - 1-1091.6.9 数据检索指令(BSRCH)- - - - - - - - - - - - - - - - - - - 1-1111.6.10 分类指令(SORT) - - - - - - - - - - - - - - - - - - - - - 1-1131.6.11 位左移指令(SHFTL)- - - - - - - - - - - - - - - - - - - - 1-1141.6.12 位右移指令(SHFTR)- - - - - - - - - - - - - - - - - - - - 1-1161.6.13 字复制指令(COPYW)- - - - - - - - - - - - - - - - - - - - 1-1171.6.14 字节交换指令(BSWAP)- - - - - - - - - - - - - - - - - - - 1-1191.7 DDC 指令- - - - - - - - - - - - - - - - - - - - - 1-1211.7.1 死区A 指令(DZA)- - - - - - - - - - - - - - - - - - - - - 1-1211.7.2 死区B 指令(DZB)- - - - - - - - - - - - - - - - - - - - - 1-1231.7.3 上下限值指令(LIMIT)- - - - - - - - - - - - - - - - - - - 1-1251.7.4 PI 控制指令(PI) - - - - - - - - - - - - - - - - - - - - - 1-1281.7.5 PD 控制指令(PD) - - - - - - - - - - - - - - - - - - - - - 1-1311.7.6 PID 控制指令(PID) - - - - - - - - - - - - - - - - - - - - 1-1341.7.7 一阶延迟指令(LAG)- - - - - - - - - - - - - - - - - - - - 1-1381.7.8 相位超前滞后指令(LLAG) - - - - - - - - - - - - - - - - - 1-1411.7.9 函数发生器指令(FGN)- - - - - - - - - - - - - - - - - - - 1-1441.7.10 反函数发生器指令(IFGN) - - - - - - - - - - - - - - - - - 1-1481.7.11 直线加减速器1指令(LAU)- - - - - - - - - - - - - - - - - 1-1521.7.12 直线加减速器2指令(SLAU) - - - - - - - - - - - - - - - - 1-1561.7.13 脉宽调制指令(PWM)- - - - - - - - - - - - - - - - - - - - 1-1631.8 表数据操作指令 - - - - - - - - - - - - - - - - - 1-1651.8.1 块调出指令(TBLBR)- - - - - - - - - - - - - - - - - - - - 1-1651.8.2 块写入指令(TBLBW)- - - - - - - - - - - - - - - - - - - - 1-167 1.8.3 行检索指令纵向(TBLSRL) - - - - - - - - - - - - - - - - 1-169 1.8.4 列检索指令横向(TBLSRC) - - - - - - - - - - - - - - - - 1-1711.8.5 块清除指令(TBLCL)- - - - - - - - - - - - - - - - - - - - 1-1731.8.6 表间块传送指令(TBLMV)- - - - - - - - - - - - - - - - - - 1-1751.8.7 Q 表调出指令(QTBLR QTBLRI) - - - - - - - - - - - - - - - 1-1771.8.8 Q 表写入指令(QTBLW QTBLWI) - - - - - - - - - - - - - - - 1-1791.8.9 Q 指针清除指令(QTBLCL)- - - - - - - - - - - - - - - - - - 1-1811章 梯形图指令1.1.1 A 触点指令(NOC)1-41.1继电器电路指令1.1.1A 触点指令(NOC)概要映像寄存器的值为1(ON)时将位输出置为ON 反之映像寄存器的值为0(OFF)时将位输出置为OFF格式参数程序举例当MB000100 ON 时MB000101为ON 标记NOC 全称NO Contact 类别RELAY 图标参数名称设定继电器编号所有比特型寄存器同上带下标字母1.1 继电器电路指令1-511.1.2B 触点指令(NCC)概要映像寄存器的值为1(ON)时将位输出置为OFF反之映像寄存器的值为0(OFF)时将位输出置为ON格式参数程序举例当MB000100 ON时MB000101为OFF1.1.3接通延时定时器指令(TON[10ms])概要位输入为ON时进行计时当计数值设定值时位输出为ON计数中位输入为OFF时停止计时位输入再次为ON时从(0)开始计数同时计数用的寄存器中存储实际计数时间(以10ms 为单位)的值标记NCC 全称NC Contact 类别RELAY 图标参数名称设定继电器编号所有比特型寄存器同上带下标字母1章 梯形图指令1.1.3 接通延时定时器指令(TON[10ms])1-6格式参数程序举例MW00011作为计时器的计数用寄存器而工作为避免重复请务必设定未使用的寄存器标记TON[10ms]全称On-Delay Timer[10ms]类别RELAY 图标参数名称设定Set(设定值)所有整型寄存器同上带下标字母(065535(655.35s)10ms 刻度)常数Count(计数值)整型寄存器(#C 寄存器除外)同上带下标字母1.1 继电器电路指令1-711.1.4断开延时定时器指令(TOFF[10ms])概要位输入为OFF 时进行计时当计数值设定值时位输出为OFF计数中最近的位输入为ON 时停止计时位输入再次为OFF时从(0)开始计数同时计数用的寄存器中存储实际计数时间(以10ms 为单位)的值格式参数程序举例标记TOFF[10ms]全称Off-Delay Timer[10ms]类别RELAY 图标参数名称设定Set(设定值)所有整型寄存器同上带下标字母(065535(655.35s)10ms 刻度)常数Count(计数值)整型寄存器(#C 寄存器除外)同上带下标字母1章 梯形图指令1.1.5 接通延时定时器指令(TON[1s])1-8MW00011作为计时器的计数用寄存器而工作为避免重复请务必设定未使用的寄存器1.1.5接通延时定时器指令(TON[1s])概要位输入为ON 时进行计时当计数值设定值时,位输出为ON 计数中最近的位输入为OFF时停止计时位输入再次为ON时从(0)开始计数同时计数用的寄存器中存储实际计数时间(以1s 为单位)的值格式参数程序举例标记TON[1s]全称On-Delay Timer[1s]类别RELAY 图标参数名称设定Set(设定值)所有整型寄存器同上带下标字母(065535s 1s 刻度)常数Count(计数值)整型寄存器(#C 寄存器除外)同上带下标字母1.1 继电器电路指令1MW00011作为计时器的计数用寄存器而工作为避免重复请务必设定未使用的寄存器1.1.6断开延时定时器指令(TOFF[1s])概要位输入为OFF 时进行计时当计数值设定值时位输出为OFF 计数中位输入为OFF时停止计时位输入再次为ON时从(0)开始计数同时计数用的寄存器中存储实际计数时间(以1s 为单位)的值格式参数标记TOFF[1s]全称Off-Delay Timer[1s]类别RELAY图标参数名称设定Set(设定值)所有整型寄存器同上带下标字母(065535s1s 刻度)常数Count(计数值)整型寄存器(#C 寄存器除外)同上带下标字母1章 梯形图指令1.1.7 上升脉冲指令(ON-PLS)程序举例MW00011作为计时器的计数用寄存器而工作为避免重复请务必设定未使用的寄存器1.1.7上升脉冲指令(ON-PLS)概要位输入状态从OFF 变为ON时位输出在一个扫描周期内为ON指定的寄存器用于保存位输出上次的值格式参数标记ON-PLS 全称Rise Pulse 类别RELAY图标参数名称设定用于保存位输入上次值的寄存器编号比特型寄存器(#C 寄存器除外)同上带下标字母1.1 继电器电路指令1程序举例当IB00001从OFF 变为ON 时MB000101在一个扫描周期内为ON MB000100用于保存IB00001上次的值表1.1表示上升脉冲指令的寄存器状态(注)在该程序举例中检测出的并非MB000100的上升而是IB00001的上升MB000100仅用于保存IB00001上次的值表1.1 上升脉冲指令的寄存器状态输入结果IB00001MB000100(IB00001上次的值)MB000100(IB00001的保存)MB000100OFF OFF OFF OFF OFF ON OFF OFF ON OFF ON ON ONONONOFF1章 梯形图指令1.1.8 下降脉冲指令(OFF-PLS)1.1.8下降脉冲指令(OFF-PLS)概要位输入从ON 变为OFF时位输出在一个扫描周期内为ON指定的寄存器用于保存位输出上次的值格式参数程序举例当IB00001从ON 变为OFF 时MB000101在一个扫描周期内为ON MB000100用于保存IB00001上次的值标记OFF-PLS 全称Fall Pulse 类别RELAY图标参数名称设定用于保存位输入上次值的寄存器编号比特型寄存器(#C 寄存器除外)同上带下标字母1.1 继电器电路指令1表1.2表示下降脉冲指令的寄存器状态(注)在该程序举例中检测出的并非MB000100的下降而是IB00001的下降MB000100仅用于保存IB00001上次的值1.1.9线圈指令(COIL)概要位输入ON 时将映像寄存器的值置为1(ON)位输入OFF时置为0(OFF)格式参数程序举例MB000100为ON时MB000101为ON表1.2 下降脉冲指令的寄存器状态输入结果IB00001MB000100(IB00001上次的值)MB000100(IB00001的保存)MB000101OFF OFF OFFOFF OFF ONOFF ON ON OFF ON OFF ONONONOFF标记COIL 全称Coil 类别RELAY图标参数名称设定线圈编号比特型寄存器(#C 寄存器除外)同上带下标字母1章 梯形图指令1.1.10 置位线圈指令(S-COIL)1.1.10置位线圈指令(S-COIL)概要执行条件成立时将输出置为ON并保持ON的状态格式参数程序举例多次指定同一输出地点时上例将进行如下动作* OB00000为OFF 时在置位线圈指令下OB00000为ON 状态标记S-Coil 全称Set Coil 类别RELAY图标参数名称设定线圈编号比特型寄存器(#C 寄存器除外)同上带下标字母1.1 继电器电路指令11.1.11复位线圈指令(R-COIL)概要执行条件成立时将输出置为OFF并保持OFF的状态格式参数程序举例多次指定同一输出地点时上例将进行如下动作* OB00000为ON 时在复位线圈指令下OB00000为OFF 状态标记R-Coil 全称Reset Coil 类别RELAY图标参数名称设定线圈编号比特型寄存器(#C 寄存器除外)同上带下标字母1章 梯形图指令1.2.1 存储指令(STORE)1.2数值运算指令1.2.1存储指令(STORE)概要将Source 存储在Dest中格式参数标记STORE 全称Store 类别MATH图标参数名称设定Source所有整型长整型实型寄存器同上带下标字母下标寄存器常数Dest整型长整型实型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1.2 数值运算指令1程序将长整型的数据存储到整型寄存器中时直接保留低16位存储的数据即使超出整数范围(-3276832767)也不会发生运算错误敬请注意1章 梯形图指令1.2.2 加法指令(ADD)1.2.2加法指令(ADD)概要进行整型长整型实型数的加法运算给Source A 加上Source B将其结果存储在Dest中整型的运算结果大于32767时发生数据上溢的运算错误长整型的运算结果大于2147483647时发生数据上溢的运算错误格式参数标记ADD 全称Add 类别MATH图标参数名称设定Source A所有整型长整型实型寄存器同上带下标字母下标寄存器常数Source B 所有整型长整型实型寄存器同上带下标字母下标寄存器常数Dest整型长整型实型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1程序举例整型数的加法运算实型数的加法运算长整型的加减法指令(---)通常为32位但在余数补偿运算表达式(前一指令为乘法指令()后一指令为除法指令())中使用时为64位运算1.2.3 加法扩展指令(ADDX)1.2.3加法扩展指令(ADDX)概要进行整型长整型数的加法运算给Source A 加上Source B 将其结果存储在Dest中即使运算结果数据上溢也不会发生运算错误格式参数程序举例在整型数的加法运算中为避免发生运算错误而使用长整型的加减法指令(---)通常为32位但在余数补偿运算表达式(前一指令为乘法指令()后一指令为除法指令())中使用时为64位运算标记ADDX 全称Extended Add 类别MATH图标参数名称设定Source A所有整型长整型实型寄存器同上带下标字母下标寄存器常数Source B 所有整型长整型实型寄存器同上带下标字母下标寄存器常数Dest整型长整型实型寄存器(#C 寄存器除外)同上带下标字母下标寄存器11.2.4减法指令(SUB)概要进行整型长整型实型数的减法运算从Source A 减去Source B将其结果存储在Dest中整型的减法运算结果小于-32768时发生数据下溢的运算错误长整型的减法运算结果小于-2147483648时发生数据下溢的运算错误格式参数标记SUB 全称Subtract 类别MATH图标参数名称设定Source A所有整型长整型实型寄存器同上带下标字母下标寄存器常数Source B 所有整型长整型实型寄存器同上带下标字母下标寄存器常数Dest整型长整型实型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1.2.4 减法指令(SUB)程序举例整型数的减法运算实型数的减法运算长整型的加减法指令(---)通常为32位但在余数补偿运算表达式(前一指令为乘法指令()后一指令为除法指令())中使用时为64位运算11.2.5减法扩展指令(SUBX)概要进行整型长整型数的减法运算即使运算结果数据下溢也不会发生运算错误格式参数程序举例在整型数的减法运算中为避免发生运算错误而使用长整型的加减法指令(---)通常为32位但在余数补偿运算表达式(前一指令为乘法指令()后一指令为除法指令())中使用时为64位运算标记SUB 全称Subtract 类别MATH图标参数名称设定Source A所有整型长整型实型寄存器同上带下标字母下标寄存器常数Source B 所有整型长整型实型寄存器同上带下标字母下标寄存器常数Dest整型长整型实型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1.2.6 乘法指令(MUL)1.2.6乘法指令(MUL)概要进行整型长整型实型数的乘法运算Source A 乘以Source B将其结果存储在Dest中格式参数标记MUL 全称Multiply 类别MATH图标参数名称设定Source A所有整型长整型实型寄存器同上带下标字母下标寄存器常数Source B 所有整型长整型实型寄存器同上带下标字母下标寄存器常数Dest整型长整型实型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1程序举例整型数的乘法运算长整型数的乘法运算1.2.6 乘法指令(MUL)实型数的乘法运算长整型的加减法指令(---)通常为32位但在余数补偿运算表达式(前一指令为乘法指令()后一指令为除法指令())中使用时为64位运算11.2.7除法指令(DIV)概要进行整型长整型实型数的除法运算Source A 除以Source B将其结果存储在Dest中格式参数标记DIV 全称Divide 类别MATH图标参数名称设定Source A所有整型长整型实型寄存器同上带下标字母下标寄存器常数Source B 所有整型长整型实型寄存器同上带下标字母下标寄存器常数Dest整型长整型实型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1.2.7 除法指令(DIV)程序举例实型数的除法运算11.2.8整型余数指令(MOD)概要将整型长整型除法运算的余数存储在Dest中请在除法指令后立即执行若不在除法指令后立即执行其后到下次数值运算指令出现之间的运算结果将无法保证格式参数程序举例将整型除法运算的商存储在MW00101中余数存储在MW00102中标记MOD全称Integer Remainder 类别MATH图标参数名称设定Dest整型长整型实型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1.2.9 实型余数指令(REM)1.2.9实型余数指令(REM)概要将实型除法运算的余数存储在Dest中此时所谓的余数是指从Source 连续减去Base所得的剩余即假设连续减去的次数为n则得到如下结果DestSource(Basen)(0≦DestBase)格式参数程序举例求出MF00200除以常数1.5的余数将其结果存储在DF00202中标记REM全称Real Remainder 类别MATH图标参数名称设定Source所有实型寄存器同上带下标字母常数Base所有实型寄存器同上带下标字母常数Dest实型寄存器(#C 寄存器除外)同上带下标字母11.2.10增量指令(INC)概要给整型长整型寄存器加1整型时加法运算结果即使大于32767也不会发生数据上溢的运算错误同样长整型也不会发生数据上溢的运算错误格式参数程序举例整型标记INC 全称Increment 类别MATH图标参数名称设定Dest整型长整型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1.2.11 减量指令(DEC)长整型1.2.11减量指令(DEC)概要从整型长整型寄存器中减1整型时减法运算结果即使小于-32768也不会发生数据下溢的运算错误同样长整型也不会发生数据下溢的运算错误格式参数标记DEC 全称Decrement 类别MATH图标参数名称设定Dest整型长整型寄存器(#C 寄存器除外)同上带下标字母下标寄存器1程序举例整型长整型1.2.12时间加法指令(TMADD)概要进行两个时间数据(时/分/秒)的加法运算给Dest 加上Source(加时间)将其结果存储在Dest中Source 和Dest 的数据格式如下表1.3 数据格式寄存器偏置数据内容数据范围(BCD)0时/分高位字节(时)023低位字节(分)0591秒00000059。

DM9000中文手册

DM9000中文手册
(SA4~ 9:TXD0~2
,011)被选 中
访问类型 高电平
是访问数据 端口;低电平 是访问地址 端口
字命令标志, 默认低电平 有效
当访问 外部数据存 储器是字或 双字宽度时, 被置位
100
INT
O
中断请求信 号
高电平 有效,极性能 修改
37~53 56
SD31~16
I/O
双字模式,高 16 位数据引 脚
注意:以上介质无关端口都内部自带 60K 欧姆的下拉电阻 处理器接口引脚
1
IOR#
I
2
IOW#
I
3
AEN#
I
处理器读命 令
低电平 有效,极性能 够被 EEPRO M 修改,详细 请参考对 EE PROM 内容 的描述
处理器写命 令
低电平 有效,同样能 修改极性
芯片选择,低
4
IOWAIT
O
14
RST
外部介质无 关接口发送 时钟
外部介质无 关接口发送 数据低 4 位
输出
TXD[2: 0]决定内部 存储空间基 址:TXD [2: 0]) * 10H +
300H
54
MDIO
I/O
外部介质无
关接口串行
数据通信
57
MDC
O
外部介质无 关串行数据 通信口时钟, 且与中断引 脚有关
该引脚 高电平时候, 中断引脚低 电平有效;否 则高有效
0 0 16 位
0 1 32 位
108 位
11未 定义
66
EECK
I
时钟信号
67
EECS
I/O
片选
也做 LE D 模式选择 引脚

2SK2909中文资料

2SK2909中文资料

Switching Time Test Circuit
4V 0V VIN VDD=10V ID=400mA RL=25Ω D VOUT
VIN PW=10µs D.C.≤1%
G
2SK2909 P.G 50Ω S
1.0 0.9 0.8
ID - VDS
8.0V 6.0V 4.0V 3.0V
2.5 V 2.0 V
Package Dimensions
unit:mm 2091A
[2SK2909]
0.5
0.4 3 0.16
0 to 0.1
0.5
1
0.95 0.95 2 1.9 2.9
1.5
2.5
Specifications
Absolute Maximum Ratings at Ta = 25˚C
Parameter Drain-to-Source Voltage Gate-to-Source Voltage Drain Current (DC) Drain Current (Pulse) Allowable Power Dissipation Channel Temperature Storage Temperature Symbol VDSS VGSS ID I DP PD Tch Tstg PW≤10µs, duty cycle≤1% Conditions
op er at io n
Ta= 25˚C
2 3
1.0 7
0.1
2
3
5
7
Drain Current, ID – A
1.0
2
3
0.01 Single pulse 0.01 2 3 5 7 0.1
Drain-to-Source Voltage,VDS – V

OPPO_F29手机产品培训教材-PPT精品文档

OPPO_F29手机产品培训教材-PPT精品文档

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魅力卖点
OBS音效系统
OBS(OPPO Basic System)是OPPO特有音效 系统的简称,是F29音质出众的基本元素:
魅力卖点
日立高清液晶显示屏
2.8英寸TFT显示屏 日立IPS技术 QVGA 240*320分辨率 支持160°宽视角
魅力卖点
USE-EASY体验设计
“Use-Easy”体验设计是OPPO本着“以人 为本”的设计理念,贯穿音乐、拍照、商务三 大系列手机的核心特质,以用户感受为基础进 行的人性化体验设计,让您在操作使用时感受 到不一样的方便与快捷
目标客户
他们接近或者恰过而立之年; 他们热爱自己的事业, 同时也执着地追求高品质生活; 他们需要的不是繁琐的操作, 而是人性化的设计, 以及满足个人需求的功能应用。
双卡双待消费群体
他们是追求生活品质,希望让工作 和生活彻底分开的一群人。 他们是经常奔波于两地,需求同时使用 不用区域电话卡的一群人。 他们是生活在现代化的一小时城市圈,手 机号码归属地频繁变动的人士。

K-9可选配件,微维克斯硬度试验机剪子订单号型号及描述说明书

K-9可选配件,微维克斯硬度试验机剪子订单号型号及描述说明书

G
steel ball 1471N(150kgf) beryllium copper, phosphor bronze
H
1/8”
588.4N(60kgf) Bearing metal
E
diameter 980.7N(100kgf)
K
steel ball 1471N(150kgf)
L
1/4”
588.4N(60kgf) Plastics, lead
50x50mm travel stage
Dimensions: 4.92x4.92”(125x125mm) Minimum reading: 0.01mm 810-012
Clamping devices (Vises)
Vise Max. opening: 1.77”(45mm) Standard for the MH series. 810-016
Indenters
Order No. 19BAA061 19BAA058 19BAA062 19BAA059 19BAA060
Type Knoop Indenter Vickers Indenter Knoop Indenter Vickers Indenter Vickers Indenter
Model H, HM Standard Series H, HM Standard Series MVK-H2, H3, HM114 MVK-H2, H3, HM114 HV, AVK-C Series
Micro-Vickers/Vickers Hardness Testing Machine
Test Blocks
Order No. 64BAA173 64BAA174 64BAA175 64BAA176 64BAA177 64BAA178 64BAA179 64BAA180 64BAA181 64BAA182 64BAA183 64BAA184 64BAA185 64BAA186 64BAA187 64BAA188 64BAA189 64BAA190 64BAA191 64BAA192 64BAA193 64BAA194 64BAA195 64BAA196 64BAA197 64BAA198 64BAA199 64BAA200 64BAA201 64BAA202 64BAA203 64BAA204 64BAA205 64BAA206 64BAA207 64BAA208 64BAA209 64BAA210 64BAA211 64BAA212 64BAA213 64BAA214 64BAA215 64BAA216 64BAA217 64BAA218 64BAA219 64BAA220

步科K10无人机动力系统使用手册

步科K10无人机动力系统使用手册

最大允许电压
56V
最大允许电流(持续)
120A(有优良散热的情况下)
最大允许峰值电流(10秒) 140A(有优良散热的情况下)
PWM信号输入电平
3.3/5V(兼容)
工作脉宽
1100-1940μm
信号兼容频率
30-500Hz
螺旋桨 直径×螺距 重量
安装与连接
·整套动力系统出厂时已经组装完成,根据桨叶“CW”、“CCW”标记对应安装动力系统,带“CW”标记的动力系统安 装在需顺时针旋转的机臂上,带“CCW”标记的动力系统安装在需逆时针旋转的机臂上。 ·安装在外径为40mm的圆柱型机臂上。 ·并排摆放的三根黑线为电机信号输出线,白黑线为油⻔信号线,红黑线为电调电源输入线,多色排线为数据输出 和电调升级线。 ·电调油⻔固化为1100-1940μm,不支持油⻔校准。
3316 185g
信号线850±50 SignalWire850±50
2-M3
28.4
电源线 XT60(公头)
升级线 杜邦2.54-5P(⺟端)
信号线 杜邦2.54-3P(⺟端)
Ø40圆形管夹 Ø40RoundedJoinf
指示灯 PilofLamp
信号线850±50 UpgradeWire850±50
动力系统清单
① ③ ④ ⑤



⑧ ⑨
① 螺旋桨1pcs ② 电机1pc s ③ 电机座1pcs ④ 电源线1pcs ⑤ 电调数据线1pcs
⑥ 油 ⻔ 线1 p c s ⑦ 螺 钉若 干 ⑧ 航 灯 套 件 1 p c s ⑨ 电 调(内 置)1 p c s
拨码开关4 OFF OFF ON OFF ON ON ON OFF
LED颜色 绿色 红色 蓝色 ⻩色 紫色

MEMORY存储芯片M29W320EB70N6E中文规格书

MEMORY存储芯片M29W320EB70N6E中文规格书

32 Mbit (4Mbx8 or 2Mbx16, Uniform Parameter Blocks, Boot Block)3V supply Flash memoryFeaturesSupply voltage–V CC =2.7V to 3.6V for Program, Erase and Read–V PP =12V for Fast Program (optional)Access times: 70, 90nsProgramming time–10μs per byte/word typical–Double word/ Quadruple byte ProgramMemory Blocks–Memory Array: 63 Main Blocks–8 Parameter Blocks (T op or BottomLocation)Erase Suspend and Resume modes–Read and Program another Block during Erase SuspendUnlock Bypass Program command–Faster Production/Batch ProgrammingV PP/WP pin for fast Program and Write Protect Temporary Block Unprotection modeCommon Flash Interface–64 bit Security codeExtended memory Block–Extra block used as security block or to store additional informationLow power consumption–Standby and Automatic Standby100,000 Program/Erase cycles per blockElectronic signature–Manufacturer code: 0020h–Top Device code M29W320ET: 2256h–Bottom Device code M29W320EB: 2257h RoHS® packages availableCommon Flash Interface (CFI)M29W320ET, M29W320EB Appendix B Common Flash Interface (CFI)The Common Flash Interface is a JEDEC approved, standardized data structure that can be read from the Flash memory device. It allows a system software to query the device to determine various electrical and timing parameters, density information and functions supported by the memory. The system can interface easily with the device, enabling the software to upgrade itself when necessary. When the CFI Query Command is issued the device enters CFI Query mode and the data structure is read from the memory. Table23, Table24, Table25, Table26, Table27 and Table28 show the addresses used to retrieve the data.The CFI data structure also contains a security area where a 64 bit unique security number is written (see Table28: Security code area). This area can be accessed only in Read mode by the final user. It is impossible to change the security number after it has been written by Numonyx.Table 23.Query Structure Overview(1)AddressSub-section name Description x16x810h20h CFI Query Identification String Command set ID and algorithm data offset 1Bh36h System Interface Information Device timing & voltage information27h4Eh Device Geometry Definition Flash device layout40h80h Primary Algorithm-specific extendedQuery tableAdditional information specific to the PrimaryAlgorithm (optional)61h C2h Security code area64 bit unique device number1.Query data are always presented on the lowest order data outputs.Table 24.CFI Query Identification String(1)AddressData Description Value x16x810h20h0051h“Q”11h22h0052h Query unique ASCII string "QRY""R"12h24h0059h"Y"13h26h0002h Primary Algorithm Command Set and Control Interface ID code 16 bitID code defining a specific algorithmAMD Compatible14h28h0000h15h2Ah0040hAddress for Primary Algorithm extended query table (see Table27)P = 40h 16h2Ch0000h17h2Eh0000h Alternate Vendor Command Set and Control Interface ID code secondvendor - specified algorithm supported NA18h30h0000h19h32h0000hAddress for Alternate Algorithm extended Query table NA 1Ah34h0000h1.Query data are always presented on the lowest order data outputs (DQ7-DQ0) only. DQ8-DQ15 are ‘0’.M29W320ET, M29W320EB Common Flash Interface (CFI)Common Flash Interface (CFI)M29W320ET, M29W320EBTable 26. Device Geometry Definition(1)AddressData Description Value x16x827h4Eh0016h Device Size = 2n in number of bytes 4 Mbyte28h 29h 50h52h0002h0000hFlash Device Interface code descriptionx8, x16Async.2Ah 2Bh 54h56h0000h0000hMaximum number of bytes in multi-byte program or page = 2n NA2Ch58h0002h Number of Erase Block regions. It specifies the number ofregions containing contiguous Erase Blocks of the same size.22Dh 2Eh 5Ah5Ch0007h0000hRegion 1 informationNumber of Erase Blocks of identical size = 0007h+182Fh 30h 5Eh60h0020h0000hRegion 1 informationBlock size in Region 1 = 0020h * 256 byte8Kbyte31h 32h 62h64h003Eh0000hRegion 2 informationNumber of Erase Blocks of identical size = 003Eh+16333h 34h 66h68h0000h0001hRegion 2 informationBlock size in region 2 = 0100h * 256 byte64Kbyte1.For the M29W320EB, Region 1 corresponds to addresses 000000h to 007FFFh and Region 2 to addresses 008000h to1FFFFFh. For the M29W320ET, Region 1 corresponds to addresses 1F8000h to 1FFFFFh and Region 2 to addresses 000000h to 1F7FFFh.Table 27.Primary Algorithm-specific extended Query tableAddressData Description Value x16x840h80h0050hPrimary Algorithm extended Query table unique ASCII string “PRI”"P"41h82h0052h"R" 42h84h0049h"I" 43h86h0031h Major version number, ASCII"1" 44h88h0031h Minor version number, ASCII"1"45h8Ah0000h Address Sensitive Unlock (bits 1 to 0)00 = required, 01= not requiredSilicon Revision Number (bits 7 to 2)Yes46h8Ch0002h Erase Suspend00 = not supported, 01 = Read only, 02 = Read and Write247h8Eh0001h Block Protection00 = not supported, x = number of blocks in per group148h90h0001h Temporary Block Unprotect00 = not supported, 01 = supportedYes49h92h0004h Block Protect /Unprotect04 = M29W320E04M29W320ET, M29W320EB Common Flash Interface (CFI)4Ah 94h 0000h Simultaneous operations, 00 = not supported No 4Bh 96h 0000h Burst mode, 00 = not supported, 01 = supportedNo 4Ch 98h 0000h Page mode, 00 = not supported, 01 = 4 page word, 02 = 8 page word No 4Dh9Ah00B5hV PP Supply Minimum Program/Erase voltage bit 7 to 4 HEX value in volts bit 3 to 0 BCD value in 100 mV11.5V4Eh 9Ch 00C5h V PP Supply Maximum Program/Erase voltage bit 7 to 4 HEX value in volts bit 3 to 0 BCD value in 100 mV12.5V4Fh 9Eh0002h 0003hTop/Bottom Boot Block Flag02h = Bottom Boot device, 03h = Top Boot device–Table 27.Primary Algorithm-specific extended Query table (continued)Address DataDescriptionValue x16x8Table 28.Security code areaAddress DataDescriptionx16x861h C3h, C2h XXXX 64 bit: unique device number62h C5h, C4h XXXX 63h C7h, C6h XXXX 64hC9h, C8hXXXX。

K9F1208中文资料

K9F1208中文资料

NAND Flash芯片K9F1208资料一 NAND FlaSh和NOR Flash闪存(Flash Memory)由于其具有非易失性、电可擦除性、可重复编程以及高密度、低功耗等特点,被广泛地应用于手机、MP3、数码相机、笔记本电脑等数据存储设备中。

NAND Flash和NOR Flash是目前市场上两种主要的非易失闪存芯片。

与NOR Flash相比,NAND Flash 在容量、功耗、使用寿命等方面的优势使其成为高数据存储密度的理想解决方案。

NOR Flash的传输效率很高,但写入和擦除速度较低;而NAND Flash以容量大、写速度快、芯片面积小、单元密度高、擦除速度快、成本低等特点,在非易失性类存储设备中显现出强劲的市场竞争力。

结构:NOR Flash为并行,NAND Flash为串行。

总线:NOR Flash为分离的地址线和数据线,而NANDFlash为复用的。

尺寸:典型的NAND Flash尺寸为NOR Flash尺寸的1/8。

坏块:NAND器件中的坏块是随机分布的,需要对介质进行初始化扫描以发现坏块,并将坏块标记为不可用。

位交换:NAND Flash中发生的次数要比NOR Flash多,建议使用NAND闪存时,同时使用EDC/ECC算法。

使用方法:NOR Flash是可在芯片内执行(XIP,eXecute In Place),应用程序可以直接在FIash闪存内运行,不必再把代码读到系统RAM 中;而NAND Flash则需I/O接口,因此使用时需要写入驱动程序。

通过以上的分析和比较,NAND Flash更适合于大容量数据存储的嵌入式系统。

本设计选用Samsung公司生产的NAND Flash存储器芯片K9F1208作为存储介质,并应用在基于uPSD3234A增强型8051单片机的嵌入式系统中。

二K9F1208介绍K9F1208是Samsung公司生产的512 Mb(64M×8位)NAND Flash 存储器。

M220263MMJ资料

M220263MMJ资料

Revision: 02-26-07
元器件交易网

MtronPTI Lead Free Solder Profile
MtronPTI reserves the right to make changes to the product(s) and service(s) described herein without notice. No liability is assumed as a result of their use or application.
元器件交易网
M220x Series
QiK Chip™
9x14 mm, 3.3/2.5/1.8 Volt, PECL/LVDS/CML, Clock Oscillator
Featuring QiK ChipTM Technology Superior Jitter Performance (comparable to SAW based) Frequencies from 150 MHz to 1.4 GHz Designed for a short 2 week cycle time Applications: Telecommunications such as SONET / SDH / DWDM / FEC / SERDES / OC-3 thru OC-192 Wireless base stations / WLAN / Gigabit Ethernet Avionic flight controls and military communications
Output Waveform: LVDS/CML/PECL
MtronPTI reserves the right to make changes to the product(s) and service(s) described herein without notice. No liability is assumed as a result of their use or application.

K9F2G08U0M-PCB0中文资料

K9F2G08U0M-PCB0中文资料

2
元器件交易网
K9F2G08Q0M-YCB0,YIB0 K9F2G08U0M-YCB0,YIB0
K9F2G16Q0M-YCB0,YIB0 K9F2G16U0M-YCB0,YIB0
Advance FLASH MEMORY
PIN CONFIGURATION (TSOP1)
K9F2GXXX0M-YCB0/YIB0 X16
Draft Date
Sep. 19.2001 Nov. 22. 2002
Remark
Advance Advance
0.2
Mar. 6.2003
Advance
0.3
Few current value is changed. Before K9F2G08Q0M Typ. ISB2 ILI ILO After K9F2G08Q0M Typ. ISB2 ILI ILO 10 Max. 50 ±10 ±10 20 Max. 100 ±20 ±20
N.C N.C N.C N.C N.C N.C R/B RE CE N.C N.C Vcc Vss N.C N.C CLE ALE WE WP N.C N.C N.C N.C N.C
X8
N.C N.C N.C N.C N.C N.C R/B RE CE N.C N.C Vcc Vss N.C N.C CLE ALE WE WP N.C N.C N.C N.C N.C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
X8
N.C N.C N.C N.C I/O7 I/O6 I/O5 I/O4 N.C N.C PRE Vcc Vss N.C N.C N.C I/O3 I/O2 I/O1 I/O0 N.C N.C N.C N.C

欧诺克 直流无刷电机 产品说明书

欧诺克 直流无刷电机 产品说明书

深圳市欧诺克科技有限公司Shenzhen ONKE Technology Co., Ltd.座机:*************27381841电话:邓先生135****7106陈先生139****0920邮箱:***************网 址 : 地址:广东省深圳市宝安区福海街道怀德翠湖工业园13栋稳定的质量是我们赖以生存的根本优质的服务是我们继续发展的前提客户的满意是我们唯一追求的目标产品画册Product gallery专业生产伺服驱动器、伺服电机及自动化控制系统深圳市欧诺克科技有限公司直流无刷电机目录匠心制造精益求精“一、公司介绍01二、直流无刷电机021.电机介绍与型号说明032.电机应用领域043.电机规格参数表054.电机规格尺寸图06C O M P A N Y PROFILE以精密制造引领未来Leading the future with precision manufacturing公司简介Company Profile深圳市欧诺克科技有限公司成立于2010年,是一家专业研发生产伺服电机和驱动器的高新技术企业,公司技术力量雄厚,检测手段先进,欧诺克人本着不求最全,只求最精的信念,为生产出各类伺服电机、各类驱动器而不懈奋斗。

欧诺克人以鹰的精神,挑战尖端,研发生产出高性价比的各类伺服电机和驱动器,以鹰的敏锐洞察力洞察市场,与时俱进、创新来满足市场的需求。

深圳市欧诺克科技有限公司产品主要有:伺服驱动器、伺服电机、直流伺服驱动器,直流伺服电机,交流伺服驱动器,交流伺服电机,低压伺服驱动器,低压伺服电机,直线电机驱动器,DDR马达驱动器,音圈电机驱动器,直流无刷驱动器,直流无刷电机,CANopen总线、EtherCAT总线、电子凸轮伺服系统,大功率伺服驱动器、大电流伺服驱动器,专用运动控制伺服驱动器和自动化控制系统,十多年来凭借精湛的技术与国内国外众多知名企业公司建立了互利共赢的合作。

公司不断研究和开发满足行业需求的各类伺服电机和驱动器,帮助客户提升品质和生产效率。

MBM29F160TE-70PFTN中文资料

MBM29F160TE-70PFTN中文资料

DS05-20879-2EFUJITSU SEMICONDUCTORDATA SHEETFLASH MEMORYCMOS16M (2M × 8/1M × 16) BITMBM29F160TE/BE -55/-70/-90s GENERAL DESCRIPTIONThe MBM29F160TE/BE is a 16M-bit, 5.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29F160TE/BE is offered in a 48-pin TSOP (I) package. The device is designed to be programmed in-system with the standard system 5.0 V V CC supply. 12.0 V V PP is not required for write or erase operations. The device can also be reprogrammed in standard EPROM programmers.The standard MBM29F160TE/BE offers access times of 55 ns, 70 ns and 90 ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the device has separate chip enable (CE), write enable (WE), and output enable (OE) controls.The MBM29F160TE/BE is pin and command set compatible with JEDEC standard E 2PROMs. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0 V Flash or EPROM devices.(Continued)s PRODUCT LINE UPMBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90(Continued)The MBM29F160TE/BE is programmed by executing the program command sequence. This will invoke the Embedded Program TM* Algorithm which is an internal algorithm that automatically times the program pulse widths and verifies proper cell margins. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase TM* Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margins.Any individual sector is typically erased and verified in 1.0 second. (If already preprogrammed.)The device also features a sector erase architecture. The sector mode allows each sector to be erased and reprogrammed without affecting other sectors. The MBM29F160TE/BE is erased when shipped from the factory.The device features single 5.0 V power supply operation for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low V CC detector automatically inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7, by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been comleted, the device internally resets to the read mode.The MBM29F160TE/BE also has a hardware RESET pin. When this pin is driven low, execution of any Embedded Program Algorithm or Embedded Erase Algorithm is terminated. The internal state machine is then reset to the read mode. The RESET pin may be tied to the system reset circuitry. Therefore, if a system reset occurs during the Embedded Program Algorithm or Embedded Erase Algorithm, the device is automatically reset to the read mode and will have erroneous data stored in the address locations being programmed or erased. These locations need re-writing after the Reset. Resetting the device enables the system’s microprocessor to read the boot-up firmware from the Flash memory.Fujitsu’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability, and cost effectiveness. The MBM29F160TE/BE memory electrically erases all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed one byte/word at a time using the EPROM programming mechanism of hot electron injection.* : Embedded Erase TM and Embedded Program TM are trademarks of Advanced Micro Devices, Inc.2MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90s FEATURES•0.23 µm Process Technology•Single 5.0 V read, program and eraseMinimizes system level power requirements•Compatible with JEDEC-standard commandsUses same software commands as E2PROMs•Compatible with JEDEC-standard world-wide pinouts48-pin TSOP (I) (Package suffix: TN-Normal Bend Type, TR-Reversed Bend Type)•Minimum 100,000 program/erase cycles•High performance55 ns maximum access time•Sector erase architectureOne 8K word, two 4K words, one 16K word, and thirty-one 32K words sectors in word modeOne 16K byte, two 8K bytes, one 32K byte, and thirty-one 64K bytes sectors in byte modeAny combination of sectors can be concurrently erased. Also supports full chip erase•Boot Code Sector ArchitectureT = Top sectorB = Bottom sector•Embedded Erase AlgorithmsAutomatically pre-programs and erases the chip or any sector•Embedded Program AlgorithmsAutomatically programs and verifies data at specified address•Data Polling and Toggle Bit feature for detection of program or erase cycle completion•Ready/Busy output (RY/BY)Hardware method for detection of program or erase cycle completion•Low V CC write inhibit ≤ 4.2 V•Erase Suspend/ResumeSuspends the erase operation to allow a read data and/or program in another sector within the same devic •Hardware RESET pinResets internal state machine to the read mode•Sector protectionHardware method disables any combination of sectors from program or erase operations•Temporary sector unprotectionTemporary sector unprotection via the RESET pin•In accordance with CFI (Common Flash Memory Interface)•WP Input pin (Hardware Protect)At V IL, allows protection of boot sectors, regardless of sector protection/unprotection statusAt V IH, allows removal of boot sector protectionAt open, allows removal of boot sector protection (MBM29F160TE/BE)3MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90 s PIN ASSIGNMENT4MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90 s BLOCK DIAGRAM5MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90s FLEXIBLE SECTOR-ERASE ARCHITECTURE•One 8K word, two 4K words, one 16K word, and thirty-one 32K words sectors in word mode.•One 16K byte, two 8K bytes, one 32K byte, and thirty-one 64K bytes sectors in byte mode.•Individual-sector, multiple-sector, or bulk-erase capability.•Individual or multiple-sector protection is user definable.Sector Sector Size(× 8) Address Range(× 16) Address Range SA064 Kbytes or 32 Kwords00000H to 0FFFFH00000H to 07FFFH SA164 Kbytes or 32 Kwords10000H to 1FFFFH08000H to 0FFFFH SA264 Kbytes or 32 Kwords20000H to 2FFFFH10000H to 17FFFH SA364 Kbytes or 32 Kwords30000H to 3FFFFH18000H to 1FFFFH SA464 Kbytes or 32 Kwords40000H to 4FFFFH20000H to 27FFFH SA564 Kbytes or 32 Kwords50000H to 5FFFFH28000H to 2FFFFH SA664 Kbytes or 32 Kwords60000H to 6FFFFH30000H to 37FFFH SA764 Kbytes or 32 Kwords70000H to 7FFFFH38000H to 3FFFFH SA864 Kbytes or 32 Kwords80000H to 8FFFFH40000H to 47FFFH SA964 Kbytes or 32 Kwords90000H to 9FFFFH48000H to 4FFFFH SA1064 Kbytes or 32 Kwords A0000H to AFFFFH50000H to 57FFFH SA1164 Kbytes or 32 Kwords B0000H to BFFFFH58000H to 5FFFFH SA1264 Kbytes or 32 Kwords C0000H to CFFFFH60000H to 67FFFH SA1364 Kbytes or 32 Kwords D0000H to DFFFFH68000H to 6FFFFH SA1464 Kbytes or 32 Kwords E0000H to EFFFFH70000H to 77FFFH SA1564 Kbytes or 32 Kwords F0000H to FFFFFH78000H to 7FFFFH SA1664 Kbytes or 32 Kwords100000H to 10FFFFH80000H to 87FFFH SA1764 Kbytes or 32 Kwords110000H to 11FFFFH88000H to 8FFFFH SA1864 Kbytes or 32 Kwords120000H to 12FFFFH90000H to 97FFFH SA1964 Kbytes or 32 Kwords130000H to 13FFFFH98000H to 9FFFFH SA2064 Kbytes or 32 Kwords140000H to 14FFFFH A0000H to A7FFFH SA2164 Kbytes or 32 Kwords150000H to 15FFFFH A8000H to AFFFFH SA2264 Kbytes or 32 Kwords160000H to 16FFFFH B0000H to B7FFFH SA2364 Kbytes or 32 Kwords170000H to 17FFFFH B8000H to BFFFFH SA2464 Kbytes or 32 Kwords180000H to 18FFFFH C0000H to C7FFFH SA2564 Kbytes or 32 Kwords190000H to 19FFFFH C8000H to CFFFFH SA2664 Kbytes or 32 Kwords1A0000H to 1AFFFFH D0000H to D7FFFH SA2764 Kbytes or 32 Kwords1B0000H to 1BFFFFH D8000H to DFFFFH SA2864 Kbytes or 32 Kwords1C0000H to 1CFFFFH E0000H to E7FFFH SA2964 Kbytes or 32 Kwords1D0000H to 1DFFFFH E8000H to EFFFFH SA3064 Kbytes or 32 Kwords1E0000H to 1EFFFFH F0000H to F7FFFH SA3132 Kbytes or 16 Kwords1F0000H to 1F7FFFH F8000H to FBFFFH SA328 Kbytes or 4 Kwords1F8000H to 1F9FFFH FC000H to FCFFFH SA338 Kbytes or 4 Kwords1FA000H to 1FBFFFH FD000H to FDFFFH SA3416 Kbytes or 8 Kwords1FC000H to 1FFFFFH FE000H to FFFFFHMBM29F160TE Top Boot Sector Architecture6MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90Sector Sector Size(× 8) Address Range(× 16) Address RangeSA016 Kbytes or 8 Kwords00000H to 03FFFH00000H to 01FFFHSA18 Kbytes or 4 Kwords04000H to 05FFFH02000H to 02FFFHSA28 Kbytes or 4 Kwords06000H to 07FFFH03000H to 03FFFHSA332 Kbytes or 16 Kwords08000H to 0FFFFH04000H to 07FFFHSA464 Kbytes or 32 Kwords10000H to 1FFFFH08000H to 0FFFFHSA564 Kbytes or 32 Kwords20000H to 2FFFFH10000H to 17FFFHSA664 Kbytes or 32 Kwords30000H to 3FFFFH18000H to 1FFFFHSA764 Kbytes or 32 Kwords40000H to 4FFFFH20000H to 27FFFHSA864 Kbytes or 32 Kwords50000H to 5FFFFH28000H to 2FFFFHSA964 Kbytes or 32 Kwords60000H to 6FFFFH30000H to 37FFFHSA1064 Kbytes or 32 Kwords70000H to 7FFFFH38000H to 3FFFFHSA1164 Kbytes or 32 Kwords80000H to 8FFFFH40000H to 47FFFHSA1264 Kbytes or 32 Kwords90000H to 9FFFFH48000H to 4FFFFHSA1364 Kbytes or 32 Kwords A0000H to AFFFFH50000H to 57FFFHSA1464 Kbytes or 32 Kwords B0000H to BFFFFH58000H to 5FFFFHSA1564 Kbytes or 32 Kwords C0000H to CFFFFH60000H to 67FFFHSA1664 Kbytes or 32 Kwords D0000H to DFFFFH68000H to 6FFFFHSA1764 Kbytes or 32 Kwords E0000H to EFFFFH70000H to 77FFFHSA1864 Kbytes or 32 Kwords F0000H to FFFFFH78000H to 7FFFFHSA1964 Kbytes or 32 Kwords100000H to 10FFFFH80000H to 87FFFHSA2064 Kbytes or 32 Kwords110000H to 11FFFFH88000H to 8FFFFHSA2164 Kbytes or 32 Kwords120000H to 12FFFFH90000H to 97FFFHSA2264 Kbytes or 32 Kwords130000H to 13FFFFH98000H to 9FFFFHSA2364 Kbytes or 32 Kwords140000H to 14FFFFH A0000H to A7FFFHSA2464 Kbytes or 32 Kwords150000H to 15FFFFH A8000H to AFFFFHSA2564 Kbytes or 32 Kwords160000H to 16FFFFH B0000H to B7FFFHSA2664 Kbytes or 32 Kwords170000H to 17FFFFH B8000H to BFFFFHSA2764 Kbytes or 32 Kwords180000H to 18FFFFH C0000H to C7FFFHSA2864 Kbytes or 32 Kwords190000H to 19FFFFH C8000H to CFFFFHSA2964 Kbytes or 32 Kwords1A0000H to 1AFFFFH D0000H to D7FFFHSA3064 Kbytes or 32 Kwords1B0000H to 1BFFFFH D8000H to DFFFFHSA3164 Kbytes or 32 Kwords1C0000H to 1CFFFFH E0000H to E7FFFHSA3264 Kbytes or 32 Kwords1D0000H to 1DFFFFH E8000H to EFFFFHSA3364 Kbytes or 32 Kwords1E0000H to 1EFFFFH F0000H to F7FFFHSA3464 Kbytes or 32 Kwords1F0000H to 1FFFFFH F8000H to FFFFFHMBM29F160BE Bottom Boot Sector Architecture7MBM29F160TE -55/-70/-90/MBM29F160BE -55/-70/-908s LOGIC SYMBOLLTable 1 MBM29L V160TE/BE Pin Configuration PinFunctionA -1, A 0 to A 19Address Inputs DQ 0 to DQ 15Data Inputs/Outputs CE Chip Enable OE Output Enable WE Write Enable RY/BY Ready/Busy OutputRESET Hardware Reset Pin/T emporary Sector Unprotection BYTE Selects 8-bit or 16-bit mode N.C.Pin Not Connected Internally V SS Device GroundV CCDevice Power SupplyMBM29F160TE -55/-70/-90/MBM29F160BE -55/-70/-909s DEVICE BUS OPERATIONSLegend: L = V IL , H = V IH , X = V IL or V IH . = pulse input. See DC Characteristics for voltage levels.Notes:1.Manufacturer and device codes may also be accessed via a command register write sequence. SeeTable 7.2.Refer to the section on Sector Protection.3.WE can be V IL if OE is V IL , OE at V IH initiates the write operations.4.V CC =5.0 V ±10%Table 2 MBM29F160TE/BE User Bus Operation (BYTE = V IH )OperationCE OE WE A 0A 1A 6A 9DQ 0 to DQ 15RESET WP Auto-Select Manufacture Code (1)L L H L L L V ID Code H X Auto-Select Device Code (1)L L H H L L V ID Code H X Read (3)L L H A 0A 1A 6A 9D OUT H X Standby H X X X X X X HIGH-Z H X Output Disable L H H X X X X HIGH-Z H X Write (Program/Erase)L H LA 0A 1A 6A 9D IN H X Enable Sector Protection (2), (4)L V ID L H L V ID X H X Verify Sector Protection (2), (4)L L H L H L V ID Code H X Temporary Sector Unprotection X X X X X X X X V ID X Reset (Hardware)/Standby X X X X X X X HIGH-Z L X Boot Block Write ProtectionXXX XXXXXXLTable 3 MBM29F160TE/BE User Bus Operation (BYTE = V IL )OperationCE OE WE DQ 15/A -1A 0A 1A 6A 9DQ 0 to DQ 7RESET WP Auto-Select Manufacture Code (1)L L H L L L L V ID Code H X Auto-Select Device Code (1)L L H L H L L V ID Code H X Read (3)L L H A -1A 0A 1A 6A 9D OUT H X Standby H X X X X X X X HIGH-Z H X Output Disable L H H X X X X X HIGH-Z H X Write (Program/Erase)L H LA -1A 0A 1A 6A 9D IN H X Enable Sector Protection (2), (4)L V ID L L H L V ID X H X Verify Sector Protection (2), (4)L L H L L H L V ID Code H X Temporary Sector Unprotection X X X X X X X X X V ID X Reset (Hardware)/Standby X X X X X X X X HIGH-Z L X Boot Block Write ProtectionXXXXXXXXXXLMBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90s FUNCTIONAL DESCRIPTIONRead ModeThe MBM29F160TE/BE has two control functions which must be satisfied in order to obtain data at the outputs.CE is the power control and should be used for a device selection. OE is the output control and should be used to gate data to the output pins if a device is selected.Address access time (t ACC) is equal to the delay from stable addresses to valid output data. The chip enable access time (t CE) is the delay from stable addresses and stable CE to valid data at the output pins. The output enable access time is the delay from the falling edge of OE to valid data at the output pins. (Assuming the addresses have been stable for at least t ACC - t OE time.) When reading out a data without changing addresses after power-u, it is necessary to input hardware reset or change CE pin from "H" tp "L".Standby ModeThere are two ways to implement the standby mode on the MBM29F160TE/BE devices. One is by using both the CE and RESET pins; the other via the RESET pin only.When using both pins, a CMOS standby mode is achieved with CE and RESET inputs both held at V CC ±0.3 V.Under this condition the current consumed is less than 5 µA max. During Embedded Algorithm operation, V CC Active current (I CC2) is required even CE = “H”. The device can be read with standard access time (t CE) from either of these standby modes.When using the RESET pin only, a CMOS standby mode is achieved with the RESET input held at V SS ±0.3 V (CE = “H” or “L”). Under this condition the current consumed is less than 5 µA max. Once the RESET pin is taken high, the device requires t RH of wake up time before outputs are valid for read access.In the standby mode, the outputs are in the high-impedance state, independent of the OE input.Output DisableIf the OE input is at a logic high level (V IH), output from the device is disabled. This will cause the output pins to be in a high-impedance state.AutoselectThe Autoselect mode allows the reading out of a binary code from the device and will identify its manufacturer and type. The intent is to allow programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The Autoselect command may also be used to check the status of write-protected sectors. (See Tables 4.1 and 4.2.) This mode is functional over the entire temperature range of the device.To activate this mode, the programming equipment must force V ID (11.5 V to 12.5 V) on address pin A9. Two identifier bytes may then be sequenced from the devices outputs by toggling address A0 from V IL to V IH. All addresses are DON’T CARES except A0, A1, and A6 (A-1). (See Table 2 or Table 3.)The manufacturer and device codes may also be read via the command register, for instances when the MBM29F160TE/BE is erased or programmed in a system without access to high voltage on the A9 pin. The command sequence is illustrated in Table 6, Command Definitions.Byte 0 (A0 = V IL) represents the manufacture’s code (Fujitsu = 04H) and byte 1 (A0 = V IH) represents the device identifier code (MBM29F160TE = D2H and MBM29F160BE = D8H for x 8 mode; MBM29F160TE = 22D2H and MBM29F160BE = 22D8H for x 16 mode). These two bytes/words are given in the Table 4.1 and 4.2. All identifiers for manufactures and device will exhibit odd parity with DQ7 defined as the parity bit. In order to read the proper device codes when executing the Autoselect, A1 must be V IL. (See Tables 4.1 and 4.2.)10MBM29F160TE -55/-70/-90/MBM29F160BE -55/-70/-90*1:A -1 is for Byte mode.*2:Outputs 01H at protected sector addresses and outputs 00H at unprotected sector addresses.(B): Byte mode (W): Word modeTable 4.1 MBM29F160TE/BE Sector Protection Verify Autoselect Code TypeA 12 to A 19A 6A 1A 0A -1*1Code (HEX)Manufacture’s CodeXV IL V IL V IL V IL 04H Device CodeMBM29F160TEByte XV ILV ILV IHV IL D2H Word X 22D2H MBM29F160BEByte X V IL V IL V IH V IL D8H WordX 22D8H Sector Protection Sector AddressesV ILV IHV ILV IL01H*2Table 4.2 Expanded Autoselect Code TableTypeCode DQ 15DQ 14DQ 13DQ 12DQ 11DQ 10DQ 9DQ 8DQ 7DQ 6DQ 5DQ 4DQ 3DQ 2DQ 1DQ 0Manufacture’s Code04H A -1/0000000000000100Device CodeMBM29F160TE(B)D2H A -1HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 11010010(W)22D2H 01111010010MBM29F160BE(B)D8H A -1HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 11001000(W)22D8H010001011001000Sector Protection 01H A -1/01MBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90Table 5 Sector Address Tables (MBM29F160TE)SectorAddress A19A18A17A16A15A14A13A12(× 8) Address Range(× 16) Address Range SA000000X X X00000H to 0FFFFH00000H to 07FFFH SA100001X X X10000H to 1FFFFH08000H to 0FFFFH SA200010X X X20000H to 2FFFFH10000H to 17FFFH SA300011X X X30000H to 3FFFFH18000H to 1FFFFH SA400100X X X40000H to 4FFFFH20000H to 27FFFH SA500101X X X50000H to 5FFFFH28000H to 2FFFFH SA600110X X X60000H to 6FFFFH30000H to 37FFFH SA700111X X X70000H to 7FFFFH38000H to 3FFFFH SA801000X X X80000H to 8FFFFH40000H to 47FFFH SA901001X X X90000H to 9FFFFH48000H to 4FFFFH SA1001010X X X A0000H to AFFFFH50000H to 57FFFH SA1101011X X X B0000H to BFFFFH58000H to 5FFFFH SA1201100X X X C0000H to CFFFFH60000H to 67FFFH SA1301101X X X D0000H to DFFFFH68000H to 6FFFFH SA1401110X X X E0000H to EFFFFH70000H to 77FFFH SA1501111X X X F0000H to FFFFFH78000H to 7FFFFH SA1610000X X X100000H to 10FFFFH80000H to 87FFFH SA1710001X X X110000H to 11FFFFH88000H to 8FFFFH SA1810010X X X120000H to 12FFFFH90000H to 97FFFH SA1910011X X X130000H to 13FFFFH98000H to 9FFFFH SA2010100X X X140000H to 14FFFFH A0000H to A7FFFH SA2110101X X X150000H to 15FFFFH A8000H to AFFFFH SA2210110X X X160000H to 16FFFFH B0000H to B7FFFH SA2310111X X X170000H to 17FFFFH B8000H to BFFFFH SA2411000X X X180000H to 18FFFFH C0000H to C7FFFH SA2511001X X X190000H to 19FFFFH C8000H to CFFFFH SA2611010X X X1A0000H to 1AFFFFH D0000H to D7FFFH SA2711011X X X1B0000H to 1BFFFFH D8000H to DFFFFH SA2811100X X X1C0000H to 1CFFFFH E0000H to E7FFFH SA2911101X X X1D0000H to 1DFFFFH E8000H to EFFFFH SA3011110X X X1E0000H to 1EFFFFH F0000H to F7FFFH SA31111110X X1F0000H to1F7FFFH F8000H to FBFFFH SA32111111001F8000H to1F9FFFH FC000H to FCFFFH SA33111111011FA000H to1FBFFFH FD000H to FDFFFHMBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90Table 6 Sector Address Tables (MBM29F160BE)SectorAddress A19A18A17A16A15A14A13A12(× 8) Address Range(× 16) Address Range SA00000000X00000H to 03FFFH00000H to 01FFFH SA10000001004000H to 05FFFH02000H to 02FFFH SA20000001106000H to 07FFFH03000H to 03FFFH SA30000010X08000H to 0FFFFH04000H to 07FFFH SA400001X X X10000H to 1FFFFH08000H to 0FFFFH SA500010X X X20000H to 2FFFFH10000H to 17FFFH SA600011X X X30000H to 3FFFFH18000H to 1FFFFH SA700100X X X40000H to 4FFFFH20000H to 27FFFH SA800101X X X50000H to 5FFFFH28000H to 2FFFFH SA900110X X X60000H to 6FFFFH30000H to 37FFFH SA1000111X X X70000H to 7FFFFH38000H to 3FFFFH SA1101000X X X80000H to 8FFFFH40000H to 47FFFH SA1201001X X X90000H to 9FFFFH48000H to 4FFFFH SA1301010X X X A0000H to AFFFFH50000H to 57FFFH SA1401011X X X B0000H to BFFFFH58000H to 5FFFFH SA1501100X X X C0000H to CFFFFH60000H to 67FFFH SA1601101X X X D0000H to DFFFFH68000H to 6FFFFH SA1701110X X X E0000H to EFFFFH70000H to 77FFFH SA1801111X X X F0000H to FFFFFH78000H to 7FFFFH SA1910000X X X100000H to 1FFFFFH80000H to 87FFFH SA2010001X X X110000H to 11FFFFH88000H to 8FFFFH SA2110010X X X120000H to 12FFFFH90000H to 97FFFH SA2210011X X X130000H to 13FFFFH98000H to 9FFFFH SA2310100X X X140000H to 14FFFFH A0000H to A7FFFH SA2410101X X X150000H to 15FFFFH A8000H to 8FFFFH SA2510110X X X160000H to 16FFFFH B0000H to B7FFFH SA2610111X X X170000H to 17FFFFH B8000H to BFFFFH SA2711000X X X180000H to 18FFFFH C0000H to C7FFFH SA2811001X X X190000H to 19FFFFH C8000H to CFFFFH SA2911010X X X1A0000H to 1AFFFFH D0000H to D7FFFH SA3011011X X X1B0000H to 1BFFFFH D8000H to DFFFFH SA3111100X X X1C0000H to 1CFFFFH E0000H to E7FFFH SA3211101X X X1D0000H to 1DFFFFH E8000H to EFFFFH SA3311110X X X1E0000H to 1EFFFFH F0000H to F7FFFHMBM29F160TE-55/-70/-90/MBM29F160BE-55/-70/-90WriteDevice erasure and programming are accomplished via the command register. The command register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device.The command register itself does not occupy any addressable memory location. The register is latch used to store the commands, along with the address and data information needed to execute the command. The command register is written by bringing WE to V IL, while CE is at V IL and OE is at V IH. Addresses are latched on the falling edge of CE or WE, whichever occurs later, while data is latched on the rising edge of CE or WE pulse, whichever occurs first. Standard microprocessor write timings are used.Refer to AC Write Characteristics and the Erase/Programming Waveforms for specific timing parameters. Write Protect (WP)The write Protect function provides a hardware method of protecting certain boot sectors without using V ID.If the system asserts V IL on the WP pin, the device disables program and erase functions in the "outermost" 16K byte boot sectors independently of whether this sector was protected or unprotected using the method described in "Sector / Sector Block Protection and Unprotection". The outmost 16K byte boot sector is the sector containing the lowest addresses in a bottom-boot-configured devices, or the sector containing the highest addresses in a top-boot-configured device.If the system asserts V IH on the WP pin, the devices reverts to whether the outmost 16K byte boot sector was last set to be protected or unprotected. That is, sector protection or unprotection for this sector depends on whether it was last protected or unprotected using the method describe in "Sector / Sector Block Protection and Unprotection".Sector ProtectionThe MBM29F160TE/BE features hardware sector protection. This feature will disable both program and erase operations in any number of sectors (0 through 34). The sector protection feature is enabled using programming equipment at the user’s site. The device is shipped with all sectors unprotected.To activate this mode, the programming equipment must force V ID on address pin A9 and control pin OE, (suggest V ID = 11.5V), CE = V IL, and A6 = V IL. The sector addresses (A19, A18, A17, A16, A15, A14, A13, and A12) should be set to the sector to be protected. Tables 5 and 6 define the sector address for each of the thirty five (35) individual sectors. Programming of the protection circuitry begins on the falling edge of the WE pulse and is terminated with the rising edge of the same. Sector addresses must be held constant during the WE pulse. See figures 16 and 24 for sector protection waveforms and algorithm.To verify programming of the protection circuitry, the programming equipment must force V ID on address pin A9 with CE and OE at V IL and WE at V IH. Scanning the sector addresses (A19, A18, A17, A16, A15, A14, A13, and A12) while (A6, A1, A0) = (0, 1, 0) will produce a logical “1” code at device output DQ0 for a protected sector. Otherwise the devices will read 00H for unprotected sector. In this mode, the lower order addresses, except for A0, A1, and A6 are DON’T CARES. Address locations with A1 = V IL are reserved for Autoselect manufacturer and device codes. A-1 requires to apply to V IL in byte mode.It is also possible to determine if a sector is protected in the system by writing an Autoselect command. Performinga read operation at the address location XX02H, where the higher order addresses pins (A19, A18, A17, A16, A15,A14, A13, and A12) represents the sector address will produce a logical “1” at DQ0 for a protected sector. See Tables 4.1 and 4.2 for Autoselect codes.Temporary Sector UnprotectionThis feature allows temporary unprotection of previously protected sectors of the MBM29F160TE/BE devices in order to change data. The Sector Unprotection mode is activated by setting the RESET pin to high voltage(12 V). During this mode, formerly protected sectors can be programmed or erased by selecting the sectorMBM29F160TE -55/-70/-90/MBM29F160BE -55/-70/-90Notes:1.Address bits A 11 to A 19 = X = “H” or “L” for all address commands except or Program Address (PA) andSector Address (SA).2.Bus operations are defined in Tables 2 and3.3.RA =Address of the memory location to be read.PA =Address of the memory location to be programmed. Addresses are latched on the falling edge ofthe WE pulse.SA =Address of the sector to be erased. The combination of A 19, A 18, A 17, A 16, A 15, A 14, A 13, and A 12 willuniquely select any sector.4.RD =Data read from location RA during read operation.PD =Data to be programmed at location PA. Data is latched on the rising edge of WE.5.The system should generate the following address patterns:Word Mode: 555H or 2AAH to addresses A 0 to A 10Byte Mode: AAAH or 555H to addresses A -1 to A 106.Both Read/Reset commands are functionally equivalent, resetting the device to the read mode.Table 7 MBM29F160TE/BE Standard Command DefinitionsCommand Sequence (Notes 1, 2, 3, 5)Bus Write Cycles Req'dFirst Bus Write Cycle Second Bus Write Cycle Third Bus Write Cycle Fourth Bus Read/Write Cycle Fifth Bus Write Cycle Sixth Bus Write Cycle Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data Read/Reset (Note 6)Word/Byte 1XXXH F0H RA RD ————————Read/Reset (Note 6)Word 3555H AAH 2AAH 55H 555H F0H RA RD ————Byte AAAH 555H AAAH Autoselect Word 3555H AAH 2AAH 55H 555H 90H ——————Byte AAAH 555H AAAH Byte/Word Program (Notes 3, 4)Word 4555H AAH 2AAH 55H 555H A0H PA PD ————Byte AAAH 555H AAAH Chip EraseWord 6555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H 555H 10H Byte AAAH 555H AAAH AAAH 555H AAH Sector Erase (Note 3)Word 6555H AAH2AAH 55H555H 80H555H AAH2AAH 55HSA30HByte AAAH555HAAAHAAAH555HSector Erase Suspend Word /Byte 1Erase can be suspended during sector erase with addr. ("H" or "L"). Data (B0H)Sector Erase ResumeWord /Byte1Erase can be resumed after suspend with addr. ("H" or "L"). Data (30H)。

AM29F010B芯片资料

AM29F010B芯片资料

Publication# 16736Rev: G Amendment/+2Issue Date: March 1998Am29F0101 Megabit (128 K x 8-bit)CMOS 5.0 Volt-only, Uniform Sector Flash MemoryDISTINCTIVE CHARACTERISTICSs Single power supply operation—5.0 V ± 10% for read, erase, and program operations —Simplifies system-level power requirements s High performance—45 ns maximum access time s Low power consumption —30 mA max active read current —50 mA max program/erase current —<25 µA typical standby current s Flexible sector architecture —Eight uniform sectors—Any combination of sectors can be erased —Supports full chip erase s Sector protection—Hardware-based feature that disables/re-enables program and erase operations in any combination of sectors —Sector protection/unprotection can be implemented using standard PROM programming equipments Embedded Algorithms—Embedded Erase algorithm automatically pre-programs and erases the chip or any combination of designated sector —Embedded Program algorithm automatically programs and verifies data at specified address s Minimum 100,000 program/erase cycles guaranteed s Package options —32-pin PLCC —32-pin TSOP —32-pin PDIPs Compatible with JEDEC standards —Pinout and software compatible with single-power-supply flash —Superior inadvertent write protection s Data# Polling and Toggle Bits—Provides a software method of detecting program or erase cycle completionGENERAL DESCRIPTIONThe Am29F010 is a 1 Mbit, 5.0 Volt-only Flash memory organized as 131,072 bytes. The Am29F010 is offered in 32-pin PLCC, TSOP, and PDIP packages. The byte-wide data appears on DQ0-DQ7. The device is de-signed to be programmed in-system with the standard system 5.0 Volt V CC supply. A 12.0 volt V PP is not re-quired for program or erase operations. The device can also be programmed or erased in standard EPROM programmers.The standard device offers access times of 45, 55, 70, 90, and 120 ns, allowing high-speed microprocessors to operate without wait states. To eliminate bus con-tention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE) controls. The device requires only a single 5.0 volt power sup-ply for both read and write functions. Internally gener-ated and regulated voltages are provided for the program and erase operations.The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Com-mands are written to the command register using stan-dard microprocessor write timings. Register contents serve as input to an internal state machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the pro-gramming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.Device programming occurs by executing the program command sequence. This invokes the Embedded Program algorithm—an internal algorithm that auto-matically times the program pulse widths and verifies proper cell margin.Device erasure occurs by executing the erase com-mand sequence. This invokes the Embedded Erase algorithm—an internal algorithm that automatically pre-programs the array (if it is not already programmed) be-fore executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin.The host system can detect whether a program or erase operation is complete by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command.The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is erased when shipped from the factory.The hardware data protection measures include a low V CC detector automatically inhibits write operations during power transitions. The hardware sector pro-tection feature disables both program and erase oper-ations in any combination of the sectors of memory, and is implemented using standard EPROM program-mers.The system can place the device into the standby mode. Power consumption is greatly reduced in this mode. AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability, and cost effectiveness. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The bytes are programmed one byte at a time using the EPROM programming mechanism of hot electron injection.2Am29F010Am29F0103PRODUCT SELECTOR GUIDENote:See the AC Characteristics section for full specifications.BLOCK DIAGRAMFamily Part Number Am29F010Speed OptionV CC = 5.0 V ± 5%-45-55 (P)V CC = 5.0 V ± 10%-55 (J, E, F)-70-90-120Max Access Time (ns)45557090120CE# Access (ns)45557090120OE# Access (ns)2530303550Input/Output BuffersX-DecoderY-Decoder Chip Enable Output EnableLogicErase Voltage Generator PGM Voltage GeneratorTimerV CC DetectorState Control Command RegisterV CC V SSWE#CE#OE#STBSTBDQ0–DQ7Data LatchY-GatingCell Matrix16736G-1A d d r e s s L a t c hA0–A164Am29F010CONNECTION DIAGRAMS16736G-216736G-312345678910111213141516Standard TSOP16736G-4A11A9A8A13A14NC WE#V CC NC A16A15A12A7A6A5A432313029282726252423222120191817OE#A10CE#DQ7DQ6DQ5DQ4DQ3V SS DQ2DQ1DQ0A0A1A2A 316736G-512345678910111213141516A11A9A8A13A14NC WE#V CC NC A16A15A12A7A6A5A432313029282726252423222120191817OE#A10CE#DQ7DQ6DQ5DQ4DQ3V SS DQ2DQ1DQ0A0A1A2A 3Reverse TSOPPIN CONFIGURATIONA0–A16=17 AddressesDQ0–DQ7=8 Data Inputs/OutputsCE#=Chip EnableOE#=Output EnableWE#= Write EnableV CC=+5.0 Volt Single Power Supply(See Product Selector Guide for speedoptions and voltage supply tolerances) V SS=Device GroundNC=Pin Not Connected Internally LOGIC SYMBOL178DQ0–DQ7A0–A16CE#OE#WE#16736G-6Am29F01056Am29F010ORDERING INFORMATION Standard ProductsAMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below.Valid CombinationsValid Combinations list configurations planned to be sup-ported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations.DEVICE NUMBER/DESCRIPTION Am29F0101 Megabit (128 K x 8-Bit) CMOS Flash Memory 5.0 Volt-only Read, Program, and EraseAm29F010-70E C OPTIONAL PROCESSING Blank =Standard ProcessingB =Burn-In(Contact an AMD representative for more information.)TEMPERATURE RANGE C = Commercial (0°C to +70°C)I=Industrial (–40°C to +85°C)E =Extended (–55°C to +125°C)PACKAGE TYPEP =32-Pin Plastic DIP (PD 032)J=32-Pin Rectangular Plastic LeadedChip Carrier (PL 032)E =32-Pin Thin Small Outline Package(TSOP) Standard Pinout (TS 032)F =32-Pin Thin Small Outline Package(TSOP) Reverse Pinout (TSR032)SPEED OPTIONSee Product Selector Guide and Valid CombinationsBValid CombinationsAM29F010-45PC, PI, PE,JC, JI, JE,EC, EI, EE, FC, FI, FE AM29F010-55V CC = 5.0 V ± 5%PC5, PI5, PE5AM29F010-55V CC = 5.0 V ± 10%JC, JI, JE, EC, EI, EE, FC, FI, FEAM29F010-70AM29F010-90AM29F010-120PC, PI, PE,JC, JI, JE,EC, EI, EE, FC, FI, FEDEVICE BUS OPERATIONSThis section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory location. The register is composed of latches that store the com-mands, along with the address and data information needed to execute the command. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. The appropriate device bus operations table lists the inputs and control levels required, and the re-sulting output. The following subsections describe each of these operations in further detail.Table 1.Am29F010 Device Bus OperationsLegend:L = Logic Low = V IL, H = Logic High = V IH, V ID = 12.0 ± 0.5 V, X = Don’t Care, A IN = Addresses In, D IN = Data In, D OUT = Data Out Notes:1.Addresses are A16:A0.2.The sector protect and sector unprotect functions must be implemented via programming equipment. See the “Sector Pro-tection/Unprotection” section.Requirements for Reading Array DataTo read array data from the outputs, the system must drive the CE# and OE# pins to V IL. CE# is the power control and selects the device. OE# is the output control and gates array data to the output pins. WE# should re-main at V IH.The internal state machine is set for reading array data upon device power-up, or after a hardware re-set. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered.See “Reading Array Data” for more information. Refer to the AC Read Operations table for timing specifica-tions and to the Read Operations Timings diagram for the timing waveforms. I CC1 in the DC Characteristics table represents the active current specification for reading array data.Writing Commands/Command Sequences To write a command or command sequence (which in-cludes programming data to the device and erasing sectors of memory), the system must drive WE# and CE# to V IL, and OE# to V IH.An erase operation can erase one sector, multiple sec-tors, or the entire device. The Sector Address Tables indicate the address space that each sector occupies.A “sector address” consists of the address bits required to uniquely select a sector. See the “Command Defini-tions” section for details on erasing a sector or the en-tire chip.After the system writes the autoselect command se-quence, the device enters the autoselect mode. The system can then read autoselect codes from the inter-nal register (which is separate from the memory array) on DQ7–DQ0. Standard read cycle timings apply in this mode. Refer to the “Autoselect Mode” and “Autoselect Command Sequence” sections for more information.I CC2 in the DC Characteristics table represents the ac-tive current specification for the write mode. The “AC Characteristics” section contains timing specification tables and timing diagrams for write operations.Operation CE#OE#WE#Addresses(Note 1)DQ0–DQ7Read L L H A IN D OUT Write L H L A IN D IN Standby V CC ± 0.5 V X X X High-Z Output Disable L H H X High-Z Hardware Reset X X X X High-Z Temporary Sector Unprotect X X X A IN D INAm29F0107Program and Erase Operation Status During an erase or program operation, the system may check the status of the operation by reading the status bits on DQ7–DQ0. Standard read cycle timings and I CC read specifications apply. Refer to “Write Operation Status” for more information, and to each AC Charac-teristics section in the appropriate data sheet for timing diagrams.Standby ModeWhen the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, inde-pendent of the OE# input. The device enters the CMOS standby mode when the CE# pin is held at V CC ± 0.5 V. (Note that this is a more restricted voltage range than V IH.) The device enters the TTL standby mode when CE# is held at V IH. The device requires the standard access time (t CE) before it is ready to read data.If the device is deselected during erasure or program-ming, the device draws active current until the operation is completed.I CC3 in the DC Characteristics tables represents the standby current specification.Output Disable ModeWhen the OE# input is at V IH, output from the device is disabled. The output pins are placed in the high imped-ance state.Table 2.Am29F010 Sector Addresses Table Autoselect ModeThe autoselect mode provides manufacturer and de-vice identification, and sector protection verification, through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system through the command register.When using programming equipment, the autoselect mode requires V ID (11.5 V to 12.5 V) on address pin A9. Address pins A6, A1, and A0 must be as shown in Autoselect Codes (High Voltage Method) table. In ad-dition, when verifying sector protection, the sector ad-dress must appear on the appropriate highest order address bits. Refer to the corresponding Sector Ad-dress Tables. The Command Definitions table shows the remaining address bits that are don’t care. When all necessary bits have been set as required, the program-ming equipment may then read the corresponding identifier code on DQ7–DQ0.To access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in the Command Defini-tions table. This method does not require V ID. See “Command Definitions” for details on using the autose-lect mode.Sector A16A15A14Address Range SA000000000h-03FFFh SA100104000h-07FFFh SA201008000h-0BFFFh SA30110C000h-0FFFFh SA410010000h-13FFFh SA510114000h-17FFFh SA611018000h-1BFFFh SA71111C000h-1FFFFh8Am29F010Table 3.Am29F010 Autoselect Codes (High Voltage Method) L = Logic Low = V IL, H = Logic High = V IH, SA = Sector Address, X = Don’t care.Sector Protection/UnprotectionThe hardware sector protection feature disables both program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously pro-tected sectors.Sector protection/unprotection must be implemented using programming equipment. The procedure re-quires a high voltage (V ID) on address pin A9 and the control pins. Details on this method are provided in a supplement, publication number 20495. Contact an AMD representative to obtain a copy of the appropriate document.The device is shipped with all sectors unprotected. AMD offers the option of programming and protecting sectors at its factory prior to shipping the device through AMD’s ExpressFlash™ Service. Contact an AMD representative for details.It is possible to determine whether a sector is protected or unprotected. See “Autoselect Mode” for details. Hardware Data ProtectionThe command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to the Command Defi-nitions table). In addition, the following hardware data protection measures prevent accidental erasure or pro-gramming, which might otherwise be caused by spuri-ous system level signals during V CC power-up and power-down transitions, or from system noise.Low V CC Write InhibitWhen V CC is less than V LKO, the device does not ac-cept any write cycles. This protects data during V CC power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets. Subsequent writes are ignored until V CC is greater than V LKO. The system must provide the proper signals to the control pins to prevent uninten-tional writes when V CC is greater than V LKO.Write Pulse “Glitch” ProtectionNoise pulses of less than 5 ns (typical) on OE#, CE# or WE# do not initiate a write cycle.Logical InhibitWrite cycles are inhibited by holding any one of OE# = V IL, CE# = V IH or WE# = V IH. To initiate a write cy-cle, CE# and WE# must be a logical zero while OE# is a logical one.Power-Up Write InhibitIf WE# = CE# = V IL and OE# = V IH during power up, the device does not accept commands on the rising edge of WE#. The internal state machine is automatically reset to reading array data on power-up.Description CE#OE#WE#A16toA14A13toA10A9A8toA7A6A5toA2A1A0DQ7toDQ0Manufacturer ID: AMD L L H X X V ID X L X L L01h Device ID: Am29F010L L H X X V ID X L X L H20hSector Protection Verification L L H SA X V ID X L X H L01h (protected)00h (unprotected)Am29F0109COMMAND DEFINITIONSWriting specific address and data commands or se-quences into the command register initiates device op-erations. The Command Definitions table defines the valid register command sequences. Writing incorrect address and data values or writing them in the im-proper sequence resets the device to reading array data.All addresses are latched on the falling edge of WE# or CE#, whichever happens later. All data is latched on the rising edge of WE# or CE#, whichever happens first. Refer to the appropriate timing diagrams in the “AC Characteristics” section.Reading Array DataThe device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array data after completing an Embedded Program or Em-bedded Erase algorithm.The system must issue the reset command to re-en-able the device for reading array data if DQ5 goes high, or while in the autoselect mode. See the “Reset Com-mand” section, next.See also “Requirements for Reading Array Data” in the “Device Bus Operations” section for more information. The Read Operations table provides the read parame-ters, and Read Operation Timings diagram shows the timing diagram.Reset CommandWriting the reset command to the device resets the de-vice to reading array data. Address bits are don’t care for this command.The reset command may be written between the se-quence cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ig-nores reset commands until the operation is complete. The reset command may be written between the se-quence cycles in a program command sequence be-fore programming begins. This resets the device to reading array data. Once programming begins, how-ever, the device ignores reset commands until the op-eration is complete.The reset command may be written between the se-quence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to reading array data.If DQ5 goes high during a program or erase operation, writing the reset command returns the device to read-ing array data.Autoselect Command SequenceThe autoselect command sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. The Command Definitions table shows the address and data requirements. This method is an alternative to that shown in the Autoselect Codes (High Voltage Method) table, which is intended for PROM program-mers and requires V ID on address bit A9.The autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect command. The device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence.A read cycle at address XX00h or retrieves the manu-facturer code. A read cycle at address XX01h returns the device code. A read cycle containing a sector ad-dress (SA) and the address 02h in returns 01h if that sector is protected, or 00h if it is unprotected. Refer to the Sector Address tables for valid sector addresses. The system must write the reset command to exit the autoselect mode and return to reading array data. Byte Program Command Sequence Programming is a four-bus-cycle operation. The pro-gram command sequence is initiated by writing two un-lock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program al-gorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verify the pro-grammed cell margin. The Command Definitions take shows the address and data requirements for the byte program command sequence.When the Embedded Program algorithm is complete, the device then returns to reading array data and ad-dresses are no longer latched. The system can deter-mine the status of the program operation by using DQ7or DQ6. See “Write Operation Status” for informa-tion on these status bits.Any commands written to the device during the Em-bedded Program Algorithm are ignored. Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from a “0” back to a “1”. Attempting to do so may halt the operation and set DQ5 to “1”, or cause the Data# Polling algorithm to indicate the operation was suc-cessful. However, a succeeding read will show that the data is still “0”. Only erase operations can convert a “0”to a “1”.10Am29F010Note:See the appropriate Command Definitions table for program command sequence.Figure 1.Program Operation Chip Erase Command SequenceChip erase is a six-bus-cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algo-rithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any con-trols or timings during these operations. The Command Definitions table shows the address and data require-ments for the chip erase command sequence.Any commands written to the chip during the Embed-ded Erase algorithm are ignored.The system can determine the status of the erase operation by using DQ7 or DQ6. See “Write Opera-tion Status” for information on these status bits. When the Embedded Erase algorithm is complete, the device returns to reading array data and ad-dresses are no longer latched.Figure 2 illustrates the algorithm for the erase opera-tion. See the Erase/Program Operations tables in “AC Characteristics” for parameters, and to the Chip/Sector Erase Operation Timings for timing waveforms. Sector Erase Command SequenceSector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two ad-ditional unlock write cycles are then followed by the ad-dress of the sector to be erased, and the sector erase command. The Command Definitions table shows the address and data requirements for the sector erase command sequence.The device does not require the system to preprogram the memory prior to erase. The Embedded Erase algo-rithm automatically programs and verifies the sector for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or tim-ings during these operations.After the command sequence is written, a sector erase time-out of 50 µs begins. During the time-out period, additional sector addresses and sector erase com-mands may be written. Loading the sector erase buffer may be done in any sequence, and the number of sec-tors may be from one sector to all sectors. The time be-tween these additional cycles must be less than 50 µs, otherwise the last address and command might not be accepted, and erasure may begin. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase command is16736G-7written. If the time between additional sector erase commands can be assumed to be less than 50 µs, the system need not monitor DQ3. Any command during the time-out period resets the device to reading array data. The system must rewrite the command se-quence and any additional sector addresses and com-mands.The system can monitor DQ3 to determine if the sector erase timer has timed out. (See the “DQ3: Sector Erase Timer” section.) The time-out begins from the ris-ing edge of the final WE# pulse in the command se-quence.Once the sector erase operation has begun, all other commands are ignored.When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. The system can determine the sta-tus of the erase operation by using DQ7 or DQ6. Refer to “Write Operation Status” for information on these status bits.Figure 2 illustrates the algorithm for the erase opera-tion. Refer to the Erase/Program Operations tables inthe “AC Characteristics” section for parameters, and to the Sector Erase Operations Timing diagram for timing waveforms.Notes:1.See the appropriate Command Definitions table for erasecommand sequence.2.See “DQ3: Sector Erase Timer” for more information.Figure 2.Erase OperationTable 4.Am2F010 Command DefinitionsLegend:X = Don’t careRA = Address of the memory location to be read. RD = Data read from location RA during read operation.PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE# or CE# pulse, whichever happens later.PD = Data to be programmed at location PA. Data latches on the rising edge of WE# or CE# pulse, whichever happens first.SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A16–A14 uniquely select any sector.Notes:1.See Table 1 for description of bus operations.2.All values are in hexadecimal.3.Except when reading array or autoselect data, all commandbus cycles are write operations.4.No unlock or command cycles required when reading arraydata.5.The Reset command is required to return to reading arraydata when device is in the autoselect mode, or if DQ5 goes high (while the device is providing status data).6.The fourth cycle of the autoselect command sequence is aread operation.7.The data is 00h for an unprotected sector and 01h for aprotected sector. See “Autoselect Command Sequence” for more information.Command Sequence (Note 1)Bus Cycles (Notes 2-3)First Second Third Fourth Fifth Sixth Addr Data AddrDataAddrData AddrDataAddr DataAddrDataRead (Note 4)1RA RD Reset (Note 5)1XXXX F0Autoselect (Note 6)Manufacturer ID45555AA 2AAA 55555590XX0001Device ID45555AA 2AAA 55555590XX0120Sector Protect Verify (Note 7)45555AA 2AAA 55555590(SA)X020001Program 45555AA 2AAA 555555A0PA PD Chip Erase 65555AA 2AAA 555555805555AA 2AAA 55555510Sector Erase65555AA2AAA555555805555AA2AAA55SA30C y c l e sWRITE OPERATION STATUSThe device provides several bits to determine the sta-tus of a write operation: DQ3, DQ5, DQ6, and DQ7. Table 5 and the following subsections describe the functions of these bits. DQ7 and DQ6 each offer a method for determining whether a program or erase operation is complete or in progress. These three bits are discussed first.DQ7: Data# PollingThe Data# Polling bit, DQ7, indicates to the host system whether an Embedded Algorithm is in progress or completed. Data# Polling is valid after the rising edge of the final WE# pulse in the program or erase command sequence.During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum pro-grammed to DQ7. When the Embedded Program algo-rithm is complete, the device outputs the datum programmed to DQ7. The system must provide the program address to read valid status information on DQ7. If a program address falls within a protected sec-tor, Data# Polling on DQ7 is active for approximately 2µs, then the device returns to reading array data. During the Embedded Erase algorithm, Data# Polling produces a “0” on DQ7. When the Embedded Erase al-gorithm is complete, Data# Polling produces a “1” on DQ7. This is analogous to the complement/true datum output described for the Embedded Program algorithm: the erase function changes all the bits in a sector to “1”; prior to this, the device outputs the “complement,” or “0.” The system must provide an address within any of the sectors selected for erasure to read valid status in-formation on DQ7.After an erase command sequence is written, if all sec-tors selected for erasing are protected, Data# Polling on DQ7 is active for approximately 100 µs, then the de-vice returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the se-lected sectors that are protected.When the system detects DQ7 has changed from the complement to true data, it can read valid data at DQ7–DQ0 on the following read cycles. This is because DQ7 may change asynchronously with DQ0–DQ6 while Output Enable (OE#) is asserted low. The Data# Poll-ing Timings (During Embedded Algorithms) figure in the “AC Characteristics” section illustrates this.Table 5 shows the outputs for Data# Polling on DQ7. Figure 3 shows the Data# Polling algorithm.Notes:1.VA = Valid address for programming. During a sectorerase operation, a valid address is an address within any sector selected for erasure. During chip erase, a validaddress is any non-protected sector address.2.DQ7 should be rechecked even if DQ5 = “1” becauseDQ7 may change simultaneously with DQ5.16736G-9 Figure 3.Data# Polling Algorithm。

KS0090资料

KS0090资料

FEATURES
• Driver Outputs — Common output: 26 common — Segment output: 64 segment — Icons: 128 horizontal icons, 24 × 4 vertical icons, 5 static icons • Applicable Panel Size Display Size 2 line × 12 char 3 line × 12 char • Internal Memory — Character generator ROM (CGROM): 10,240 bits (256 characters × 5 × 8 dots) — Character generator RAM (CGRAM): 160 bits (4 characters × 5 × 8 dots) — Display data RAM (DDRAM): 288 bits (12 characters × 3 lines × 8 bits) — Segment icon RAM (ICONRAM): 224 bits (12 × 2 × 5 bits + 2 × 4 bits + 24 × 4 bits) • MPU Interface — No busy MPU interface (No busy check or no execution waiting time) — 8-bit parallel interface mode: 68-series and 80-series are available — 4-bit parallel interface mode: 68-series and 80-series are available — Serial interface mode: 4 pin clock synchronized serial interface • Function Set — Various instruction set: display control, power save, power control, function set... etc. — COM/SEG bidirectional function (4 type LCD application available) — Hardware reset (RES pin) • Built-in Analog Circuit — On-chip oscillator with an Internal resistor or external clock input — Electronic volume for contrast control (32 or 64 steps) — Voltage converter (2 or 3 times) / voltage regulator / voltage follower and bias circuit Duty 1/18 1/26 Output Content (12 characters + 4 segments for signal) × 2 + 128 icons + 5 static icons (12 characters + 4 segments for signal) × 3 + 128 icons + 5 static icons

E2K-X 中文资料

E2K-X 中文资料
警告
本产品不能以确保安全为目的,直接或间接用于人体 检测。 请勿将本产品用作人体保护检测装置。
使用注意事项
请不要在超过额定的使用范围和环境下使用。
● 设计时 周围环境 请尽量避免接触水、油、药品,或在结露状态下使用,否则会将上 述物品误认为检测物体而导致误动作。 E2K-X15M尤其对电介质体有高灵敏度,即使只是少量的水珠也 会受到影响。 周围金属的影响 嵌入金属时,请在离下表所示数值以上的距离处使用。同时、金属 以外的物体 (树脂等) 也会有影响,因此,使用时请参阅下表所 示数值,与金属同样,要在离该数值以上的距离处使用。
圆柱型
E2K-X
通用螺纹切削式静电容量型
• 备有M12、 M18、 M30型 • 检测距离固定的无调整型
请参见第5页上的 “注意事项”。
CSM_E2K-X_DS_C_7_1
种类
■ 本体 【外形尺寸图➜P.6】
形状
检测距离
䴲ሣ㬑
M12
4mm
M18
8mm
M30
15mm
■ 附件 (另售)
安装支架 详情请参见➜Y92□
动作模式
型号
E2K-X4MF1
NO
E2K-X8MF1
E2K-X15MF1
时序图
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E2K-X4MF2
NC
E2K-X8MF2
E2K-X15MF2
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M29F002BT, M29F002BNTM29F002BB, M29F002BNB 2 Mbit (256Kb x8, Boot Block) Single Supply Flash Memorys SINGLE 5V ± 10% SUPPLY VOLTAGE for PROGRAM, ERASE and READ OPERATIONSs ACCESS TIME: 45nss PROGRAMMING TIME–8µs by Byte typicals7 MEMORY BLOCKS–1 Boot Block (Top or Bottom Location)–2 Parameter and 4 Main Blockss PROGRAM/ERASE CONTROLLER–Embedded Byte Program algorithm–Embedded Multi-Block/Chip Erase algorithm –Status Register Polling and Toggle Bitss ERASE SUSPEND and RESUME MODES –Read and Program another Block during Erase Suspends UNLOCK BYPASS PROGRAM COMMAND –Faster Production/Batch Programmings TEMPORARY BLOCK UNPROTECTION MODEs LOW POWER CONSUMPTION–Standby and Automatic Standbys100,000 PROGRAM/ERASE CYCLES per BLOCKs20 YEARS DATA RETENTION–Defectivity below 1 ppm/years ELECTRONIC SIGNATURE–Manufacturer Code: 20h–Top Device Code M29F002BT: B0h–Top Device Code M29F002BNT: B0h–Bottom Device Code M29F002BB: 34h–Bottom Device Code M29F002BNB: 34h1/22April 2002M29F002BT, M29F002BB, M29F002BNT, M29F002BNB2/22Table 1. Signal NamesA0-A17Address Inputs DQ0-DQ7Data Inputs/Outputs E Chip Enable G Output Enable WWrite EnableRPM29F002BT, M29F002BB:Reset/Block Temporary UnprotectM29F002BNT, M29F002BNB:Not Connected InternallyV CC Supply Voltage V SSGround3/22M29F002BT, M29F002BB, M29F002BNT, M29F002BNBSUMMARY DESCRIPTIONThe M29F002B is a 2 Mbit (256Kb x8) non-volatile memory that can be read, erased and repro-grammed. These operations can be performed us-ing a single 5V supply. On power-up the memory defaults to its Read mode where it can be read in the same way as a ROM or EPROM. The M29F002B is fully backward compatible with the M29F002.The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased. Each block can be protected independently to prevent accidental Program or Erase commands from modifying the memory. Program and Erase commands are writ-ten to the Command Interface of the memory. An on-chip Program/Erase Controller simplifies the process of programming or erasing the memory by taking care of all of the special operations that are required to update the memory contents. The end Table 2. Absolute Maximum Ratings (1)Note: 1.Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" maycause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qual-ity documents.2.Minimum Voltage may undershoot to –2V during transition and for less than 20ns during transitions.SymbolParameterValue Unit T AAmbient Operating Temperature (Temperature Range Option 1)0 to 70°C Ambient Operating Temperature (Temperature Range Option 6)–40 to 85°C Ambient Operating Temperature (Temperature Range Option 3)–40 to 125°C T BIAS Temperature Under Bias –50 to 125°C T STG Storage Temperature –65 to 150°C V IO (2)Input or Output Voltage –0.6 to 6V V CC Supply Voltage –0.6 to 6V V IDIdentification Voltage–0.6 to 13.5VTable 4. Bottom Boot Block Addresses, M29F002BB#Size (Kbytes)Address Range 66430000h-3FFFFh 56420000h-2FFFFh 46410000h-1FFFFh 33208000h-0FFFFh 2806000h-07FFFh 1804000h-05FFFh 01600000h-03FFFhof a program or erase operation can be detected and any error conditions identified. The command set required to control the memory is consistent with JEDEC standards.The blocks in the memory are asymmetrically ar-ranged, see Tables 3A and 3B, Block Addresses.The first or last 64 Kbytes have been divided into four additional blocks. The 16 Kbyte Boot Block can be used for small initialization code to start the microprocessor, the two 8 Kbyte Parameter Blocks can be used for parameter storage and the remaining 32K is a small Main Block where the ap-plication may be stored.Chip Enable, Output Enable and Write Enable sig-nals control the bus operation of the memory.They allow simple connection to most micropro-cessors, often without additional logic.The memory is offered in TSOP32 (8 x 20mm),PLCC32 and PDIP packages and it is supplied with all the bits erased (set to ’1’).Table 3. Top Boot Block Addresses, M29F002BT, M29F002BNT#Size (Kbytes)Address Range 6163C000h-3FFFFh 583A000h-3BFFFh 4838000h-39FFFh 33230000h-37FFFh 26420000h-2FFFFh 16410000h-1FFFFh 06400000h-0FFFFhM29F002BT, M29F002BB, M29F002BNT, M29F002BNB4/22SIGNAL DESCRIPTIONSSee Figure 1, Logic Diagram, and Table 1, Signal Names, for a brief overview of the signals connect-ed to this device.Address Inputs (A0-A17).The Address Inputs select the cells in the memory array to access dur-ing Bus Read operations. During Bus Write opera-tions they control the commands sent to the Command Interface of the internal state machine.Data Inputs/Outputs (DQ0-DQ7).The Data In-puts/Outputs output the data stored at the selected address during a Bus Read operation. During Bus Write operations they represent the commands sent to the Command Interface of the internal state machine.the memory, allowing Bus Read and Bus Write op-erations to be performed. When Chip Enable is High, V IH , all other pins are ignored.trols the Bus Read operation of the memory.the Bus Write operation of the memory’s Com-mand Interface.The Re-set/Block Temporary Unprotect pin can be used to apply a Hardware Reset to the memory or to tem-porarily unprotect all blocks that have been pro-tected. On the M29F002BNT the pin is not connected internally and this feature is not avail-able.A Hardware Reset is achieved by holding Reset/Block Temporary Unprotect Low, V IL , for at least t PLPX . After Reset/Block Temporary Unprotect goes High, V IH , the memory will be ready for Bus Read and Bus Write operations after t PHEL or t PLYH , whichever occurs last. See Table 15 and Figure 12, Reset/Temporary Unprotect AC Char-acteristics for more details.Holding RP at V ID will temporarily unprotect the protected blocks in the memory. Program and Erase operations on all blocks will be possible.The transition from V IH to V ID must be slower than t PHPHH .Reset/Block Temporary Unprotect can be left un-connected. A weak internal pull-up resistor en-sures that the memory always operates correctly.V CC Supply Voltage.The V CC Supply Voltage supplies the power for all operations (Read, Pro-gram, Erase etc.).The Command Interface is disabled when the V CC Supply Voltage is less than the Lockout Voltage,V LKO . This prevents Bus Write operations from ac-cidentally damaging the data during power up,power down and power surges. If the Program/Erase Controller is programming or erasing during this time then the operation aborts and the memo-ry contents being altered will be invalid.A 0.1µF capacitor should be connected between the V CC Supply Voltage pin and the V SS Ground pin to decouple the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required during program and erase operations, I CC4.V SS Ground.The V SS Ground is the reference for all voltage measurements.5/22M29F002BT, M29F002BB, M29F002BNT, M29F002BNBTable 5. Bus OperationsNote:X = V IL or V IH .OperationE G W Address Inputs DataInputs/Outputs Bus Read V IL V IL V IH Cell Address Data Output Bus Write V IL V IH V IL Command Address Data Input Output Disable X V IH V IH X Hi-Z StandbyV IH X X XHi-Z Read Manufacturer CodeV ILV ILV IHA0 = V IL , A1 = V IL , A9 = V ID , Others V IL or V IH20hRead Device CodeV IL V IL V IHA0 = V IH , A1 = V IL , A9 = V ID , Others V IL or V IHB0h (M29F002BT)B0h (M29F002BNT)34h (M29F002BB)BUS OPERATIONSThere are five standard bus operations that control the device. These are Bus Read, Bus Write, Out-put Disable, Standby and Automatic Standby. See Table 5, Bus Operations, for a summary. Typically glitches of less than 5ns on Chip Enable or Write Enable are ignored by the memory and do not af-fect bus operations.Bus Read.Bus Read operations read from the memory cells, or specific registers in the Com-mand Interface. A valid Bus Read operation in-volves setting the desired address on the Address Inputs, applying a Low signal, V IL , to Chip Enable and Output Enable and keeping Write Enable High, V IH . The Data Inputs/Outputs will output the value, see Figure 9, Read Mode AC Waveforms,and Table 12, Read AC Characteristics, for details of when the output becomes valid.Bus Write.Bus Write operations write to the Command Interface. A valid Bus Write operation begins by setting the desired address on the Ad-dress Inputs. The Address Inputs are latched by the Command Interface on the falling edge of Chip Enable or Write Enable, whichever occurs last.The Data Inputs/Outputs are latched by the Com-mand Interface on the rising edge of Chip Enable or Write Enable, whichever occurs first. Output En-able must remain High, V IH , during the whole Bus Write operation. See Figures 10 and 11, Write AC Waveforms, and Tables 13 and 14, Write AC Characteristics, for details of the timing require-ments.Output Disable.The Data Inputs/Outputs are in the high impedance state when Output Enable is High, V IH .Standby.When Chip Enable is High, V IH , the Data Inputs/Outputs pins are placed in the high-impedance state and the Supply Current is re-duced to the Standby level. When Chip Enable is at V IH the Supply Current is reduced to the TTL Standby Supply Current, I CC2.To further reduce the Supply Current to the CMOS Standby Supply Current, I CC3, Chip Enable should be held within V CC ± 0.2V. For Standby current levels see Table 11, DC Characteristics.During program or erase operations the memory will continue to use the Program/Erase Supply Current, I CC4, for Program or Erase operations un-til the operation completes.Automatic Standby.If CMOS levels (V CC ± 0.2V)are used to drive the bus and the bus is inactive for 150ns or more the memory enters Automatic Standby where the internal Supply Current is re-duced to the CMOS Standby Supply Current, I CC3.The Data Inputs/Outputs will still output data if a Bus Read operation is in progress.Special Bus OperationsAdditional bus operations can be performed to read the Electronic Signature and also to apply and remove Block Protection. These bus opera-tions are intended for use by programming equip-ment and are not usually used in applications.They require V ID to be applied to some pins.Electronic Signature.The memory has two codes, the manufacturer code and the device code, that can be read to identify the memory.These codes can be read by applying the signals listed in Table 5, Bus Operations.Block Protection and Blocks Unprotection.Each block can be separately protected against acci-dental Program or Erase. Protected blocks can be unprotected to allow data to be changed.There are two methods available for protecting and unprotecting the blocks, one for use on pro-gramming equipment and the other for in-system use. For further information refer to Application Note AN1122, Applying Protection and Unprotec-tion to M29 Series Flash.M29F002BT, M29F002BB, M29F002BNT, M29F002BNB6/22COMMAND INTERFACEAll Bus Write operations to the memory are inter-preted by the Command Interface. Commands consist of one or more sequential Bus Write oper-ations. Failure to observe a valid sequence of Bus Write operations will result in the memory return-ing to Read mode. The long command sequences are imposed to maximize data security.The commands are summarized in Table 6, Com-mands. Refer to Table 6 in conjunction with the text descriptions below.Read/Reset Command.The Read/Reset com-mand returns the memory to its Read mode where it behaves like a ROM or EPROM. It also resets the errors in the Status Register. Either one or three Bus Write operations can be used to issue the Read/Reset command.If the Read/Reset command is issued during a Block Erase operation or following a Programming or Erase error then the memory will take upto 10µs to abort. During the abort period no valid data can be read from the memory. Issuing a Read/Reset command during a Block Erase operation will leave invalid data in the memory.Auto Select Command.The Auto Select com-mand is used to read the Manufacturer Code, the Device Code and the Block Protection Status.Three consecutive Bus Write operations are re-quired to issue the Auto Select command. Once the Auto Select command is issued the memory remains in Auto Select mode until another com-mand is issued.From the Auto Select mode the Manufacturer Code can be read using a Bus Read operation with A0 = V IL and A1 = V IL . The other address bits may be set to either V IL or V IH . The Manufacturer Code for STMicroelectronics is 20h.The Device Code can be read using a Bus Read operation with A0 = V IH and A1 = V IL . The other address bits may be set to either V IL or V IH . The Device Code for the M29F002BT is B0h, the M29F002BNT is B0h and the M29F002BB is 34h.The Block Protection Status of each block can be read using a Bus Read operation with A0 = V IL ,A1=V IH , and A13-A17 specifying the address of the block. The other address bits may be set to ei-ther V IL or V IH . If the addressed block is protected then 01h is output on the Data Inputs/Outputs, oth-erwise 00h is output.Program Command.The Program command can be used to program a value to one address in the memory array at a time. The command re-quires four Bus Write operations, the final write op-eration latches the address and data in the internalstate machine and starts the Program/Erase Con-troller.If the address falls in a protected block then the Program command is ignored, the data remains unchanged. The Status Register is never read and no error condition is given.During the program operation the memory will ig-nore all commands. It is not possible to issue any command to abort or pause the operation. Typical program times are given in Table 7. Bus Read op-erations during the program operation will output the Status Register on the Data Inputs/Outputs.See the section on the Status Register for more details.After the program operation has completed the memory will return to the Read mode, unless an error has occurred. When an error occurs the memory will continue to output the Status Regis-ter. A Read/Reset command must be issued to re-set the error condition and return to Read mode.Note that the Program command cannot change a bit set at ’0’ back to ’1’. One of the Erase Com-mands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’.Unlock Bypass Command.The Unlock Bypass command is used in conjunction with the Unlock Bypass Program command to program the memo-ry. When the access time to the device is long (as with some EPROM programmers) considerable time saving can be made by using these com-mands. Three Bus Write operations are required to issue the Unlock Bypass command.Once the Unlock Bypass command has been is-sued the memory will only accept the Unlock By-pass Program command and the Unlock Bypass Reset command. The memory can be read as if in Read mode.Unlock Bypass Program Command.The Un-lock Bypass Program command can be used to program one address in memory at a time. The command requires two Bus Write operations, the final write operation latches the address and data in the internal state machine and starts the Pro-gram/Erase Controller.The Program operation using the Unlock Bypass Program command behaves identically to the Pro-gram operation using the Program command. A protected block cannot be programmed; the oper-ation cannot be aborted and the Status Register is read. Errors must be reset using the Read/Reset command, which leaves the device in Unlock By-pass Mode. See the Program command for details on the behavior.7/22M29F002BT, M29F002BB, M29F002BNT, M29F002BNBTable 6. CommandsNote:X Don’t Care, PA Program Address, PD Program Data, BA Any address in the Block.All values in the table are in hexadecimal.The Command Interface only uses address bits A0-A10 to verify the commands, the upper address bits are Don’t Care.Read/Reset. After a Read/Reset command, read the memory as normal until another command is issued.Auto Select. After an Auto Select command, read Manufacturer ID, Device ID or Block Protection Status.Program, Unlock Bypass Program, Chip Erase, Block Erase. After these commands read the Status Register until the Program/Erase Controller completes and the memory returns to Read Mode. Add additional Blocks during Block Erase Command with additional Bus Write Operations until the Timeout Bit is set.Unlock Bypass. After the Unlock Bypass command issue Unlock Bypass Program or Unlock Bypass Reset commands.Unlock Bypass Reset. After the Unlock Bypass Reset command read the memory as normal until another command is issued.Erase Suspend. After the Erase Suspend command read non-erasing memory blocks as normal, issue Auto Select and Program commands on non-erasing blocks as normal.Erase Resume. After the Erase Resume command the suspended Erase operation resumes, read the Status Register until the Program/Erase Controller completes and the memory returns to Read Mode.CommandL e n g t hBus Write Operations1st 2nd 3rd 4th 5th 6th Addr Data AddrDataAddrDataAddrDataAddrDataAddrDataRead/Reset 1X F03555AA 2AA 55X F0Auto Select 3555AA 2AA 5555590Program 4555AA 2AA 55555A0P APDUnlock Bypass 3555AA 2AA 5555520Unlock Bypass Program2X A0PA PD Unlock Bypass Reset 2X 90X 00Chip Erase 6555AA 2AA 5555580555AA 2AA 5555510Block Erase 6+555AA 2AA5555580555AA2AA55BA30Erase Suspend 1X B0Erase Resume1X30Unlock Bypass Reset Command.The Unlock Bypass Reset command can be used to return to Read/Reset mode from Unlock Bypass Mode.Two Bus Write operations are required to issue the Unlock Bypass Reset command.Chip Erase Command.The Chip Erase com-mand can be used to erase the entire chip. Six Bus Write operations are required to issue the Chip Erase Command and start the Program/Erase Controller.If any blocks are protected then these are ignored and all the other blocks are erased. If all of the blocks are protected the Chip Erase operation ap-pears to start but will terminate within about 100µs,leaving the data unchanged. No error condition is given when protected blocks are ignored.During the erase operation the memory will ignore all commands. It is not possible to issue any com-mand to abort the operation. Typical chip erase times are given in Table 7. All Bus Read opera-tions during the Chip Erase operation will output the Status Register on the Data Inputs/Outputs.See the section on the Status Register for more details.After the Chip Erase operation has completed the memory will return to the Read Mode, unless an error has occurred. When an error occurs the memory will continue to output the Status Regis-ter. A Read/Reset command must be issued to re-set the error condition and return to Read Mode.The Chip Erase Command sets all of the bits in un-protected blocks of the memory to ’1’. All previous data is lost.M29F002BT, M29F002BB, M29F002BNT, M29F002BNB8/22Block Erase Command.The Block Erase com-mand can be used to erase a list of one or more blocks. Six Bus Write operations are required to select the first block in the list. Each additional block in the list can be selected by repeating the sixth Bus Write operation using the address of the additional block. The Block Erase operation starts the Program/Erase Controller about 50µs after the last Bus Write operation. Once the Program/Erase Controller starts it is not possible to select any more blocks. Each additional block must therefore be selected within 50µs of the last block. The 50µs timer restarts when an additional block is selected.The Status Register can be read after the sixth Bus Write operation. See the Status Register for details on how to identify if the Program/Erase Controller has started the Block Erase operation. If any selected blocks are protected then these are ignored and all the other selected blocks are erased. If all of the selected blocks are protected the Block Erase operation appears to start but will terminate within about 100µs, leaving the data un-changed. No error condition is given when protect-ed blocks are ignored.During the Block Erase operation the memory will ignore all commands except the Erase Suspend and Read/Reset commands. Typical block erase times are given in Table 7. All Bus Read opera-tions during the Block Erase operation will output the Status Register on the Data Inputs/Outputs.See the section on the Status Register for more details.After the Block Erase operation has completed the memory will return to the Read Mode, unless an error has occurred. When an error occurs the memory will continue to output the Status Regis-ter. A Read/Reset command must be issued to re-set the error condition and return to Read mode.The Block Erase Command sets all of the bits in the unprotected selected blocks to ’1’. All previous data in the selected blocks is lost.Erase Suspend Command.The Erase Suspend Command may be used to temporarily suspend a Block Erase operation and return the memory to Read mode. The command requires one Bus Write operation.The Program/Erase Controller will suspend within 15µs of the Erase Suspend Command being is-sued. Once the Program/Erase Controller has stopped the memory will be set to Read mode and the Erase will be suspended. If the Erase Suspend command is issued during the period when the memory is waiting for an additional block (before the Program/Erase Controller starts) then the Erase is suspended immediately and will start im-mediately when the Erase Resume Command is issued. It will not be possible to select any further blocks for erasure after the Erase Resume.During Erase Suspend it is possible to Read and Program cells in blocks that are not being erased;both Read and Program operations behave as normal on these blocks. Reading from blocks that are being erased will output the Status Register. It is also possible to enter the Auto Select mode: the memory will behave as in the Auto Select mode on all blocks until a Read/Reset command returns the memory to Erase Suspend mode.Erase Resume Command.The Erase Resume command must be used to restart the Program/Erase Controller from Erase Suspend. An erase can be suspended and resumed more than once.Table 7. Program, Erase Times and Program, Erase Endurance Cycles (T A = 0 to 70°C, –40 to 85°C or –40 to 125°C)Note: 1.T A = 25 °C, V CC = 5V.ParameterMin Typ (1)Typical after 100k W/E Cycles (1)Max Unit Chip Erase (All bits in the memory set to ‘0’)0.80.8secChip Erase2.5 2.510sec Block Erase (64 Kbytes)0.60.64sec Program 88150µs Chip Program2.32.39sec Program/Erase Cycles (per Block)100,000cycles9/22M29F002BT, M29F002BB, M29F002BNT, M29F002BNBSTATUS REGISTERBus Read operations from any address always read the Status Register during Program and Erase operations. It is also read during Erase Sus-pend when an address within a block being erased is accessed.The bits in the Status Register are summarized in Table 8, Status Register Bits.Data Polling Bit (DQ7).The Data Polling Bit can be used to identify whether the Program/Erase Controller has successfully completed its opera-tion or if it has responded to an Erase Suspend.The Data Polling Bit is output on DQ7 when the Status Register is read.During Program operations the Data Polling Bit outputs the complement of the bit being pro-grammed to DQ7. After successful completion of the Program operation the memory returns to Read mode and Bus Read operations from the ad-dress just programmed output DQ7, not its com-plement.During Erase operations the Data Polling Bit out-puts ’0’, the complement of the erased state of DQ7. After successful completion of the Erase op-eration the memory returns to Read Mode.In Erase Suspend mode the Data Polling Bit will output a ’1’ during a Bus Read operation within a block being erased. The Data Polling Bit will change from a ’0’ to a ’1’ when the Program/Erase Controller has suspended the Erase operation.Figure 5, Data Polling Flowchart, gives an exam-ple of how to use the Data Polling Bit. A Valid Ad-dress is the address being programmed or an address within the block being erased.Toggle Bit (DQ6).The Toggle Bit can be used to identify whether the Program/Erase Controller has successfully completed its operation or if it has re-sponded to an Erase Suspend. The Toggle Bit is output on DQ6 when the Status Register is read.During Program and Erase operations the Toggle Bit changes from ’0’ to ’1’ to ’0’, etc., with succes-sive Bus Read operations at any address. After successful completion of the operation the memo-ry returns to Read mode.During Erase Suspend mode the Toggle Bit will output when addressing a cell within a block being erased. The Toggle Bit will stop toggling when the Program/Erase Controller has suspended the Erase operation.Figure 6, Data Toggle Flowchart, gives an exam-ple of how to use the Data Toggle Bit.Error Bit (DQ5).The Error Bit can be used to identify errors detected by the Program/Erase Controller. The Error Bit is set to ’1’ when a Pro-gram, Block Erase or Chip Erase operation fails to write the correct data to the memory. If the Error Bit is set a Read/Reset command must be issued before other commands are issued. The Error bit is output on DQ5 when the Status Register is read.Note that the Program command cannot change a bit set at ’0’ back to ’1’ and attempting to do so may or may not set DQ5 at ’1’. In both cases, a succes-sive Bus Read operation will show the bit is still ’0’.One of the Erase commands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’.Table 8. Status Register BitsNote:Unspecified data bits should be ignored.OperationAddress DQ7DQ6DQ5DQ3DQ2ProgramAny Address DQ7T oggle 0––Program During Erase Suspend Any Address DQ7T oggle 0––Program Error Any Address DQ7T oggle 1––Chip EraseAny Address 0T oggle 01Toggle Block Erase before timeoutErasing Block 0T oggle 00Toggle Non-Erasing Block 0T oggle 00No T oggle Block EraseErasing Block 0T oggle 01Toggle Non-Erasing Block 0T oggle 01No T oggle Erase SuspendErasing Block 1No Toggle–ToggleNon-Erasing Block Data read as normal Erase ErrorGood Block Address 0T oggle 11No T oggle Faulty Block Address0T oggle11ToggleM29F002BT, M29F002BB, M29F002BNT, M29F002BNB10/22Erase Timer Bit (DQ3).The Erase Timer Bit can be used to identify the start of Program/Erase Controller operation during a Block Erase com-mand. Once the Program/Erase Controller starts erasing the Erase Timer Bit is set to ’1’. Before the Program/Erase Controller starts the Erase Timer Bit is set to ’0’ and additional blocks to be erased may be written to the Command Interface. The Erase Timer Bit is output on DQ3 when the Status Register is read.Alternative Toggle Bit (DQ2).The Alternative Toggle Bit can be used to monitor the Program/Erase controller during Erase operations. The Al-ternative Toggle Bit is output on DQ2 when the Status Register is read.During Chip Erase and Block Erase operations the Toggle Bit changes from ’0’ to ’1’ to ’0’, etc., with successive Bus Read operations from addresseswithin the blocks being erased. Once the operation completes the memory returns to Read mode.During Erase Suspend the Alternative Toggle Bit changes from ’0’ to ’1’ to ’0’, etc. with successive Bus Read operations from addresses within the blocks being erased. Bus Read operations to ad-dresses within blocks not being erased will output the memory cell data as if in Read mode.After an Erase operation that causes the Error Bit to be set the Alternative Toggle Bit can be used to identify which block or blocks have caused the er-ror. The Alternative Toggle Bit changes from ’0’ to ’1’ to ’0’, etc. with successive Bus Read Opera-tions from addresses within blocks that have not erased correctly. The Alternative Toggle Bit does not change if the addressed block has erased cor-rectly.。

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