AO8801中文资料
Micro800 非隔离型单极模拟量输出功能性插件模块 产品目录号 2080-OF2说明书
接线图Micro800™ 非隔离型单极模拟量输出功能性插件模块产品目录号2080-OF2/idc/groups/literature/documents/wd/208 0-wd004_-mu-p.pdfFR Cette publication est disponible en français sous forme électronique (fichier PDF).Pour la télécharger, rendez-vous sur la page Internet indiquée ci-dessus.IT Questa pubblicazione è disponibile in Italiano in formato PDF. Per scaricarla collegarsi al sito Web indicato sopra.DE Diese Publikation ist als PDF auf Deutsch verfügbar. Gehen Sie auf die oben genannte Web-Adresse, um nach der Publikation zu suchen und sie herunterzuladen.ES Esta publicación está disponible en español como PDF. Diríjase a la dirección web indicada arriba para buscar y descarga esta publicación.PT Esta publicação está disponível em portugués como PDF. Vá ao endereço web que aparece acima para encontrar e fazer download da publicação.ZHZC2 Micro800™ 非隔离型单极模拟量输出功能性插件模块出版物 2080-WD004A-ZH-P - 2010年9 月环境和机柜防止静电放电本设备适用于在污染等级 2 工业环境、过电压 II 类应用中使用 (如 IEC 60664-1 所定义)，在海拔高达 2000 米 (6562 英尺) 时不降额。
EHP-AX08EL中文资料
EVERLIGHT ELECTRONICS CO.,LTD. Technical Data SheetHigh Power LED – 1WEverlight Electronics Co., Ltd. Rev. 1.0 Page: 1 of 9EHP-AX08EL/DT01-P01 DimensionsNotes: 1. Dimensions are in millimeters.2. Tolerances unless dimensions ±0.25mm.EHP-AX08EL/DT01-P01Relative Spectral Distribution, I F =350mA, T Ambient =25ºCForward Voltage vs Forward Current, T Ambient =25ºCRelative Luminous Intensity vs Forward Current, T Ambient =25ºCForward Current Derating Curve, Derating based on T j MAX =125°CTypical Electro-Optical Characteristics Curves4005006007008000.00.20.40.60.81.0R e l a t i v e L u m i n o u s I n t e n s t i yWavelength(nm)01002003004005002.62.83.03.23.43.63.8F o r w a r d V o l t a g e (V )Forward Current (mA)01002003004005000.00.20.40.60.81.01.21.4R e l a t i v e L u m i n o u s I n t e n s i t yForward Current (mA)020*********100150200250300350400F o r w a r d C u r r e n t (m A )Ambient Temperature (oC )EHP-AX08EL/DT01-P01-80-60-40-20204060800.00.10.20.30.40.50.60.70.80.91.0 R e l a t i v e L u m i n o u s I n t e n s i t yDegree(2θ)Typical Representative Spatial Radiation PatternEHP-AX08EL/DT01-P01 Label explanationCPN: Customer’s Production NumberP/N : Production NumberQTY: Packing QuantityCAT: RanksHUE: Dominant WavelengthREF: ReferenceLOT No: Lot NumberMADE IN TAIWAN: Production PlaceTube Packing Specifications1. Tube2. Inner Carton3. Outside Cartonz Packing Quantity1. 60 Pcs / Per Tube2. 20 Tubes / Inner Carton3. 12 Inner Cartons / Outside CartonEHP-AX08EL/DT01-P01 Precautions For Use1. Over-current-proofThough EHP-A08 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may causeenormous current change and burn out failure would happen.2. Storagei. Do not open moisture proof bag before the products are ready to use.ii. Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.iii. The LEDs should be used within a year.iv. After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.v. The LEDs should be used within 168 hours (7 days) after opening the package.vi. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.vii. Pre-curing treatment : 60±5℃ for 24 hours.3. Thermal Managementi. For maintaining the high flux output and achieving reliability, EHP-A08 series LED package shouldbe mounted on a metal core printed circuit board (MCPCB) with proper thermal connection todissipate approximately 1W of thermal energy under 350mA operation.ii. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.iii. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically.EHP-AX08EL/DT01-P014. Soldering Conditioni. Lead reflow soldering temperature profileii. Reflow soldering should not be done more than two times.iii. While soldering, do not put stress on the LEDs during heating.iv. After soldering, do not warp the circuit board5. Soldering Ironi. For prototype builds or small series production runs it is possible to place and solder the LED byhand.ii. Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate.iii. It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and moreintervals, and do soldering of each terminal.iv. Be careful because the damage of the product is often started at the time of the hand solder.。
AO4408中文资料
SymbolTyp Max 23404865R θJL 1216Maximum Junction-to-Lead CSteady-State°C/WThermal Characteristics ParameterUnits Maximum Junction-to-Ambient At ≤ 10s R θJA °C/W °C/W Maximum Junction-to-Ambient A Steady-State AO4408, AO4408L (Green Product)SymbolMin TypMaxUnits BV DSS 30V 0.0031T J =55°C5I GSS 100nA V GS(th)1 1.52.5V I D(ON)40A 10.514T J =125°C16211316.5m Ωg FS 3048S V SD 0.761V I S4.5A C iss 10201200pF C oss 320pF C rss 80pF R g0.250.5ΩQ g 10.312.5nC Q gs 2.1nC Q gd 3.9nC t D(on) 3.95.5ns t r 36ns t D(off)19.230ns t f 2.65ns t rr 2632ns Q rr1832nC100THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICEBody Diode Reverse Recovery TimeBody Diode Reverse Recovery Charge I F =12A, dI/dt=100A/µsDrain-Source Breakdown Voltage On state drain currentI D =250µA, V GS =0V V GS =4.5V, V DS =5V V GS =10V, I D =12AReverse Transfer Capacitance I F =12A, dI/dt=100A/µsElectrical Characteristics (T J =25°C unless otherwise noted)STATIC PARAMETERS ParameterConditions I DSS µA Gate Threshold Voltage V DS =V GS I D =250µA V DS =24V, V GS =0VV DS =0V, V GS = ±12V Zero Gate Voltage Drain Current Gate-Body leakage current R DS(ON)Static Drain-Source On-ResistanceForward TransconductanceDiode Forward Voltage m ΩV GS =4.5V, I D =10AI S =10A,V GS =0V V DS =5V, I D =10ATurn-On Rise Time Turn-Off DelayTime V GS =10V, V DS =15V, R L =1.2Ω, R GEN =3ΩGate resistanceV GS =0V, V DS =0V, f=1MHzTurn-Off Fall TimeSWITCHING PARAMETERS Total Gate Charge V GS =4.5V, V DS =15V, I D =12AGate Source Charge Maximum Body-Diode Continuous CurrentInput Capacitance Output Capacitance Turn-On DelayTime DYNAMIC PARAMETERS V GS =0V, V DS =15V, f=1MHz Gate Drain Charge A: The value of R θJA is measured with the device mounted on 1in 2FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.B: Repetitive rating, pulse width limited by junction temperature.C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.E. These tests are performed with the device mounted on 1 in 2FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The SOA curve provides a single pulse rating.。
5082-A801-KQ000中文资料
Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.Figure 1. Maximum AllowableAverage or DC Current vs. Ambient Temperature.Figure 2. Forward Current vs.Forward Voltage.AlGaAs RedFigure 4. Relative Efficiency (Luminous Intensity per UnitCurrent) vs. Peak Current.Figure 3. Relative Luminous Intensity vs. DC Forward Current.Figure 5. Maximum Allowable Average or DC Current vs. Ambient Temperature.Figure 6. Forward Current vs. Forward Voltage.HER, Yellow, GreenFigure 7. Relative Luminous Intensityvs. DC Forward Current.Figure 8. Relative Efficiency(Luminous Intensity per UnitCurrent) vs. Peak Current.Intensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。
xl9021 演示板手册说明书
页数：第1 页，共4 页描述XL9021提供的演示板，用于DC5V~36V输入，输出电流2.5A的降压恒压应用演示，最高转换效率可以达到95%。
XL9021是同步整流降压型DC-DC转换芯片，固定开关频率150KHz，可减小外部元器件尺寸，方便EMC设计。
芯片具有出色的线性调整率与负载调整率，输出电压支持1.25V~25V间任意调节。
芯片内部集成短路保护、过流保护、过温保护等可靠性模块。
XL9021为标准SOP8封装，集成度高，外围器件少，应用灵活。
DEMO原理图引脚介绍物料清单页数：第2 页，共4 页DEMO实物图实物图正面实物图反面PCB布局PCB顶层截图PCB底层截图页 数：第 3 页， 共 4 页典型性能参数E f f i c i e n c y (%)Output current(A)O u t p u t v o l t a g e (V )Output current(A)5.0V 输出效率曲线 5.0V 输出线性调整率与负载调整率曲线瞬态负载响应波形瞬态负载响应波形（VIN=12V ，VOUT=5.0V ，IOUT=0.1至1A ） （VIN=24V ，VOUT=5.0V ，IOUT=0.1至1A ）EN 引脚开关机波形 EN 引脚开关机波形（VIN=12V ，VOUT=5.0V ，IOUT=0.5A ） （VIN=24V ，VOUT=5.0V ，IOUT=0.5A ）页数：第4 页，共4 页应用信息输入电容选择在连续模式中，转换器的输入电流是一组占空比约为VOUT/VIN的方波。
为了防止大的瞬态电压，必须采用针对最大RMS电流要求而选择低ESR(等效串联电阻)输入电容器。
对于大多数的应用，1个100uF的输入电容器就足够了，它的放置位置尽可能靠近XL9021的位置上。
最大RMS电容器电流由下式给出：IRMS≈IMAX*√VOUT(VIN-VOUT)VIN其中，最大平均输出电流IMAX等于峰值电流与1/2 峰值纹波电流之差，即IMAX=ILIM-△IL/2。
MT8801规格书-中文_Rev1.00
芯片标记：
MT8801 YY WW xxxx
生产内部代码 生产周代码 生产年代码
管脚描述
Name Pin No.
COMP
1
DSEN
2
VDD
3
CS
4
DRAIN 5,6
NC
7
GND
8
Description 内部误差放大器的输出引脚。用一个电容将其与地串联实现频率补偿。 输出电压的反馈引脚。 供给电压引脚。 内部 MOSFET 的源极，同时用来检测源极电流。 内部 MOSFET 的漏极。 无连接。 芯片地。
应用
待机电源 智能调光电源 其他需要独立供电模块的应用
典型应用电路
L
XP1
N
BRG
C1 D2
R3
R4
C2
R1
MT8801 3 VDD Drain 5 7 NC Drain 6 1 COMP CS 4 2 DSEN GND 8
C3
R2 L1
Vo (16V)
D1
C4 R5
GND
MT8801 Rev. 1.00
第6页
Maximizing IC Performance
MT8801
高 PF、降压型开关电源驱动器
索取产品详细信息及样片申请，请联系:
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第1页
Maximizing IC Performance 极限参数
VDD 引脚电压 Drain 引脚电压 COMP/CS/DSEN 引脚电压 焊接温度 （10 秒） 存储温度
常用场管代换资料
AO6601 TSOP-6 一个N沟道一个P沟道 30
AO6604 TSOP-6 一个N沟道一个P沟道 20
AO6702 AO6801 AO3400 AO3402 AO3404 AO3406 AO3408 AO3414 AO3416 AO3401 AO3403 AO3407 AO3409
TSOP-6 TSOP-6 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23
N沟道 双P沟道 N沟道 N沟道 N沟道 N沟道 N沟道 N沟道 N沟道 P沟道 P沟道 P沟道 P沟道
30
8.5
2
30
8.5
2
8.5, 9,8
22
20
7
2
20
5
2
20
8
2
-30
-5
2
-30
-5
2
-30
-8
2
-30
-6
2
30
6.9
ቤተ መጻሕፍቲ ባይዱ
2
30
6.9
2
30
6.9
2
30
7
2
7, 8.5
22
30
8.5
2
30
8.5
代换型号 SI4800,SI4802,SI4412,SI4416,SI9410,SI9804,SI4410DY,FDS9412,FDS6612A,FDS6614A,FDS 6630A,IRF7910, SI4860,SI4892,SI4884,IRF7811A,IRF7811W SI4860,SI4892,SISI4884,SI7888,FDS6694,IRF7811A,IRF7811W,IRF7821 SI4362,SI7442,FDS7764,FDS6688,IRF7832 SI4802,SI4412,SI4416,SI9410 SI4800,SI4802,SI4412,SI4416,SI9410,FDS6612,NDS9410,IRF7201 SI4800,SI4802,SI4412,SI4416,SI9410,FDS6612,NDS9410,IRF7201 SI4420,SI4816,SI4820,SI4800,SI4482,SI4894,FDS6680,FDS6614,FDS6690,FDS6924,IRF741 SI4420,SI4816,SI4820,SI4800,SI4482,SI4894,FDS6680,FDS6614,FDS6690,FDS6924,IRF741 SI9433,SI9803,FDS8433,IRF7702,IRF7433,IRF7404,IRF7204,IRF7406,IRF7416 SI9435,SI4431,FDS9435,FDS4435,FDS6609A,IRF7702,IRF7433,IRF7404,IRF7204,IRF7406,I SI4835,SI4435,SI4425,SI4825,FDS8435,FDS4435,FDS6675 SI4425,SI4427,SI4429,SI4413,SI4411,FDS6670 SI4431,SI4435,FDS8435,FDS4435,FDS6609A SI4425,SI4427,SI4429,SI4413,SI4411 SI4835,SI4435A,SI4425,FDS8435,FDS4435,FDS6675 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4532,SI4539,SI4544,SI4558,SI4562,SI9928,SI9939,SI4500,SI4542,FDS8928A,FDS8958A ,NDS9952A,IRF7317,IRF7319,IRF9339 SI4810,SI4852,SI4736 SI4810,SI4852,SI4736 SI4833,SI4831 SI4833,SI4831 SI4833,SI4831 SI4833,SI4831 SI9926,SI9925,SI9956,SI4804,SI4936,SI9936,NDS9956A,FDS9926A,FDS6912,FDS6912A,FDS SI9926,SI9925,SI9956,SI4804,SI4936,SI9936,NDS9956A,FDS9926A,FDS6912,FDS6912A,FDS SI9926,SI9925,SI9956,SI4804,SI4936,SI9936,NDS9956A,FDS9926A,FDS6912,FDS6912A,FDS SI9926,SI9925,SI9956,SI4804,SI4936,SI9936,NDS9956A,FDS9926A,FDS6912,FDS6912A,FDS SI9926,SI9925,SI9956,SI4804,SI4936,SI9936,NDS9956A,FDS9926A,FDS6912,FDS6912A,FDS
EHP-AX08LS-UY01A-P01中文资料
EVERLIGHT ELECTRONICS CO.,LTD. Technical Data SheetHigh Power LED – 1WEverlight Electronics Co., Ltd. Rev. 1.0 Page: 1 of 9 Device No. : Prepared date: Mar 13, 2008 Prepared by: Jessie ChuehEHP-AX08LS/UY01A-P01 DimensionsNotes: 1. Dimensions are in millimeters.2. Tolerances unless dimensions ±0.25mm.EHP-AX08LS/UY01A-P01Relative Spectral Distribution, I F =350mA, T Ambient =25ºCForward Voltage vs Forward Current, T Ambient =25ºCRelative Luminous Intensity vs Forward Current, T Ambient =25ºCForward Current Derating Curve, Derating based on T j MAX =125°CTypical Electro-Optical Characteristics Curves4005006007008000.00.20.40.60.81.0R e l a t i v e L u m i n o u s I n t e n s t i yWavelength(nm)01002003004005001.82.02.22.42.6F o r w a r d V o l t a g e (V )Forward Current (mA)1002003004005000.00.20.40.60.81.01.21.41.6R e l a t i v e L u m i n o u s I n t e n s i t yForward Current (mA)020*********100150200250300350400F o r w a r d C u r r e n t (m A )Ambient Temperature (oC )EHP-AX08LS/UY01A-P01-80-60-40-20204060800.00.10.20.30.40.50.60.70.80.91.0R e l a t i v e L u m i n o u s I n t e n s i t yDegree (2θ)Typical Representative Spatial Radiation PatternEHP-AX08LS/UY01A-P01 Label explanationCPN: Customer’s Production NumberP/N : Production NumberQTY: Packing QuantityCAT: RanksHUE: Dominant WavelengthREF: ReferenceLOT No: Lot NumberMADE IN TAIWAN: Production PlaceTube Packing Specifications1. Tube2. Inner Carton3. Outside Cartonz Packing Quantity1. 60 Pcs / Per Tube2. 20 Tubes / Inner Carton3. 12 Inner Cartons / Outside CartonEHP-AX08LS/UY01A-P01 Precautions For Use1. Over-current-proofThough EHP-A08 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may causeenormous current change and burn out failure would happen.2. Storagei. Do not open moisture proof bag before the products are ready to use.ii. Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.iii. The LEDs should be used within a year.iv. After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.v. The LEDs should be used within 168 hours (7 days) after opening the package.vi. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.vii. Pre-curing treatment : 60±5℃ for 24 hours.3. Thermal Managementi. For maintaining the high flux output and achieving reliability, EHP-A08 series LED package shouldbe mounted on a metal core printed circuit board (MCPCB) with proper thermal connection todissipate approximately 1W of thermal energy under 350mA operation.ii. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.iii. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically.EHP-AX08LS/UY01A-P014. Soldering Conditioni. Lead reflow soldering temperature profileii. Reflow soldering should not be done more than two times.iii. While soldering, do not put stress on the LEDs during heating.iv. After soldering, do not warp the circuit board5. Soldering Ironi. For prototype builds or small series production runs it is possible to place and solder the LED byhand.ii. Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate.iii. It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and moreintervals, and do soldering of each terminal.iv. Be careful because the damage of the product is often started at the time of the hand solder.。
5082-A108-EK000中文资料
Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。
AD8801中文资料
0 0 2 25 25 2.4
VDD VDD
0.8 2.1 0.6 ±1 5 2.7 5.5 5 4 5 27.5 = 0 V VIH = 2.4 V or VIL = 0.8 V, VDD= +5.5 V SHDN = 0 VIH = VDD or VIL = 0 V, VDD = +5.5 V VDD = 5 V ± 10%, VREFH = +4.5 V VDD = 3 V ± 10%, VREFH = +2.7 V ± 1/2 LSB Error Band See Note 5, f = 100 kHz Clock Level High or Low 15 5 5 10 10 60 15 10
Min Typ1 Max Units
Parameter STATIC ACCURACY Specifications Apply to All DACs Resolution Integral Nonlinearity Error Differential Nonlinearity Full-Scale Error Zero-Code Error DAC Output Resistance Output Resistance Match REFERENCE INPUT Voltage Range2 Input Resistance Reference Input Capacitance 3 DIGITAL INPUTS Logic High Logic Low Logic High Logic Low Input Current Input Capacitance3 POWER SUPPLIES4 Power Supply Range Supply Current (CMOS) Supply Current (TTL) Shutdown Current Power Dissipation Power Supply Sensitivity Power Supply Sensitivity DYNAMIC PERFORMANCE 3 VOUT Settling Time (Positive or Negative) Crosstalk SWITCHING CHARACTERISTICS 3, 6 Input Clock Pulse Width Data Setup Time Data Hold Time CS Setup Time CS High Pulse Width Reset Pulse Width CLK Rise to CS Rise Hold Time CS Rise to Next Rising Clock
PD80F01x系列_中文资料_数据手册
Rev1.20
第1页
2020-7-27
Pdmicro Technology Ltd
PD80F01X
目录
特性..................................................................................................................................................................................1
2.1. 地址映射................................................................................................................................................................. 9 2.1.1. SFR，BANK0................................................................................................................................................. 9 2.1.2. SFR，BANK1............................................................................................................................................... 10 2.1.3. TMR0，地址 0x01........
液晶8脚贴片元器件参数大集合
液晶8脚贴片元器件参数大集合4532 内含P沟道、N沟道MOS管各一，高压板用（30V 4.7A；30V 4.5A）4532M 内含P沟道、N沟道MOS管各一，高压板用（30V 4.5A；30V 4.5A）9916H 18V 35A 50W 小贴片9960GM 8脚贴片，高压板用。
AF4502CS 内含P沟道、N沟道MOS管各一，高压板用（30V 8.4A；30V 6.8A） AO4403 30V 6.1A 单P沟道 8脚贴片AO4404 30V 8.5A 单N沟道 8脚贴片AO4405 30V 6A 3W 单P沟道8脚贴片AO4406 30V，11.5A，单N沟道，8脚贴片AO4407 30V 12A 3W 单P沟道，8脚贴片AO4407 30V 12A 3W 单P沟道，8脚贴片AO4408 30V 12A 单N沟道 8脚贴片AO4409(30V15A-P) 30V 15A P沟道场效应 8脚贴片AO4410 30V 18A 单N沟道 8脚贴片AO4411 30V 8A 3W P沟道场效应，8脚贴片AO4413 30V 15A 3W 单P沟道，8脚贴片AO4413 30V 15A 3W 单P沟道，8脚贴片AO4414 30V，8.5A，3W 单N沟道，8脚贴片AO4418 30V 11.5A N沟道 8脚贴片AO4422 30V 11A N沟道 8脚贴片AO4423 30V 15A 3.1W 单P沟道，8脚贴片AO4425 38V 14A P沟道8脚贴片AO4431 30V,8A P沟道。
高压板用MOS，贴片8脚AO4600 内含P沟道、N沟道MOS管各一，高压板用（30V 6.9A；30V 5A）AO4606 内含P沟道、N沟道MOS管各一，高压板用（30V 6.9A；30V 6A）AO4607 内含P沟道、N沟道MOS管各一，高压板用AO4828 60V 4.5A 双N沟道 8脚贴片AOD405 30V，18A，P 高压板MOS管贴片AOD408 30V，18A，N 高压板MOS管贴片AOD409 60V 26/18A P 高压板MOS管贴片AOD409 60V 26/18A P 高压板MOS管贴片AOD420 30V，10A，N 高压板MOS管贴片AOD442 60V，38/27A，N 高压板MOS管贴片AOD442 60V，38/27A，N 高压板MOS管贴片AOD444 60V，12A，N 高压板MOS管贴片AOP600 内含P、N沟道各1，30V 7.5A、30V 4.5A。
RX-8801SAUB3 PURE SN;中文规格书,Datasheet资料
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http://www.epsontoyocom.co.jp
“QMEMS” EPSON TOYOCOM
In order to meet customer needs in a rapidly advancing digital,
broadband and ubiquitous society, we are committed to offering products
Function * Use by the manufacture for testing. ( Do not connect externally.)
Serial clock input pin The pin outputs the refarence clock signal. ( CMOS output ) * Use by the manufacture for testing. ( Do not connect externally.)
that are one step ahead of the market and a rank above the rest in quality.
To achieve our goals, we follow a “3D (three device) strategy” designed to
drive both horizontal and vertical growth. We will to grow our three device
Stability
∆f /f
Current consumption (1)
IBK1
Current consumption (2)
IBK2
Condition Interface voltage
阿尔卡特OT-880(i880) 用户手册
多功能多媒体应用程序
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AD80081资料
REV.AInformation furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for itsuse, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 Fax: 781/326-8703© 2003 Analog Devices, Inc. All rights reserved.AD9882Dual Interface forFlat Panel DisplaysFEATURESAnalog Interface140 MSPS Maximum Conversion Rate Programmable Analog Bandwidth0.5 V to 1.0 V Analog Input Range500 ps p-p PLL Clock Jitter at 140 MSPS3.3 V Power SupplyFull Sync ProcessingMidscale Clamping4:2:2 Output Format ModeDigital InterfaceDVI 1.0 Compatible Interface112 MHz OperationHigh Skew Tolerance of 1 Full Input ClockSync Detect for “Hot Plugging”Supports High Bandwidth Digital Content Protection APPLICATIONSRGB Graphics ProcessingLCD Monitors and ProjectorsPlasma Display PanelsScan ConverterMicrodisplaysDigital TVFUNCTIONAL BLOCK DIAGRAMR AING AINB AINSOGINHSYNCFIL TVSYNCASSOUTOUTOUTT ACK SCLSDAA0R X0+R X0–R X1+R X1–R X2+R X2–R XC+R XC–R TERMDDCSCLDDCSDAMCLMDAGENERAL DESCRIPTIONThe AD9882 offers designers the flexibility of an analog interface and Digital Visual Interface (DVI) receiver integrated on a single chip. Also included is support for High bandwidth Digital Content Protection (HDCP).Analog InterfaceThe AD9882 is a complete 8-bit 140 MSPS monolithic analog interface optimized for capturing RGB graphics signals frompersonal computers and workstations. Its 140 MSPS encode rate capability and full power analog bandwidth of 300 MHz supports resolutions up to SXGA (1280 ¥ 1024 at 75 Hz).The analog interface includes a 140 MHz triple ADC with internal 1.25 V reference, a Phase Locked Loop (PLL), and programmable gain, offset, and clamp control. The user provides only a 3.3 V power supply, analog input, and Hsync. Three-state CMOS outputs may be powered from 2.2 V to 3.3V.The AD9882’s on-chip PLL generates a pixel clock from Hsync. Pixel clock output frequencies range from 12 MHz to 140 MHz. PLL clock jitter is typically 500 ps p-p at 140 MSPS. The AD9882 also offers full sync processing for composite sync and Sync-on-Green (SOG) applications.Digital InterfaceThe AD9882 contains a DVI 1.0 compatible receiver and supports display resolutions up to SXGA (1280 ¥ 1024 at 60 Hz). The receiver features an intra-pair skew tolerance of up to one full clock cycle.With the inclusion of HDCP, displays may now receive encrypted video content. The AD9882 allows for authentication of a video receiver, decryption of encoded data at the receiver, and renew-ability of that authentication during transmission as specified by the HDCP v1.0 protocol.Fabricated in an advanced CMOS process, the AD9882 is provided in a space-saving 100-lead LQFP surface-mount plastic package and is specified over the 0∞C to 70∞C temperature range.REV. AAD9882–SPECIFICATIONS–2–ANALOG INTERFACEELECTRICAL CHARACTERISTICSTestAD9882KST-100AD9882KST-140Parameter Temp LevelMin Typ MaxMin Typ Max Unit RESOLUTION88Bits DC ACCURACYDifferential Nonlinearity 25∞C I ±0.5+1.25/–1.0±0.5+1.35/–1.0LSB Full VI +1.35/–1.0+1.45/–1.0LSB Integral Nonlinearity 25∞C I ±0.5±1.85±0.5±2.0LSB Full VI ±2.0±2.3LSBNo Missing Codes FullVIGuaranteedGuaranteedANALOG INPUT Input Voltage Range Minimum Full VI 0.50.5V p-p Maximum Full VI 1.01.0V p-p Gain Tempco25∞C V 100100ppm/∞C Input Bias CurrentFull IV 11m A Input Full-Scale Matching Full VI 1.58.0 1.58.0% FS Offset Adjustment Range Full VI 464956464956% FS REFERENCE OUTPUT Output VoltageFull VI 1.201.25 1.321.20 1.25 1.32VTemperature Coefficient Full V ±50±50ppm/∞C SWITCHING PERFORMANCE 1Maximum Conversion Rate Full VI 100140MSPS Minimum Conversion Rate Full IV 1010MSPS Data to Clock Skew Full IV –0.5+2.0–0.5+2.0ns Serial Port Timing t BUFF Full VI 4.7 4.7m s t STAH Full VI 4.0 4.0m s t DHO Full VI 00m s t DAL Full VI 4.7 4.7m s t DAH Full VI 4.0 4.0m s t DSU Full VI 250250ns t STASU Full VI 4.7 4.7m s t STOSUFull VI 4.0 4.0m s Hsync Input Frequency Full IV 1511015110kHz Maximum PLL Clock Rate Full VI 100140MHz Minimum PLL Clock Rate Full IV 1212MHz PLL Jitter25∞C IV 50070025007002ps p-p Full IV 1000210002ps p-p Sampling Phase Tempco Full IV 1515ps/∞C DIGITAL INPUTSInput Voltage, High (V IH )Full VI 2.62.6V Input Voltage, Low (V IL )Full VI 0.80.8V Input Current, High (I IH )Full IV –1.0–1.0m A Input Current, Low (I IL )Full IV +1.0+1.0m A Input Capacitance25∞C V 33pF DIGITAL OUTPUTS 1Output Voltage, High (V OH )Full IV V DD –0.1V DD –0.1V Output Voltage, Low (V OL )Full IV 0.40.4V Duty Cycle, DATACK FullIV455055455055%Output CodingBinaryBinary(V D = 3.3 V, V DD = 3.3 V, ADC Clock = Maximum Conversion Rate, unless otherwise noted.)REV. A AD9882–3–TestAD9882KST-100AD9882KST-140ParameterTemp Level Min Typ Max Min Typ Max Unit POWER SUPPLY 1V D Supply Voltage Full IV 3.15 3.3 3.45 3.15 3.3 3.45V V DD Supply Voltage Full IV 2.2 3.3 3.6 2.20 3.3 3.6V PV D Supply Voltage Full IV 3.153.3 3.453.153.3 3.45V I D Supply Current (V D )25∞C V 162181mA I DD Supply Current (V DD )325∞C V 4763mA IPV D Supply Current (PV D )25∞C V 1921mA Total Supply CurrentFull VI 228237265274mA Power-Down Supply Current Full VI 30353035mA DYNAMIC PERFORMANCE Analog Bandwidth, Full Power 25∞C V 300300MHz Signal-to-Noise Ratio (SNR)25∞C V 4443dB f IN = 2.3 MHz CrosstalkFullV 5555dBc THERMAL CHARACTERISTICS JA Junction-to-Ambient 4V4343∞C/WNOTES 1Drive Strength = 11.2VCO Range = 10, Charge Pump Current = 110, PLL Divider = 1693.3DATACK Load = 15 pF, Data Load = 5 pF.4Simulated typical performance with package mounted to a four-layer board.Specifications subject to change without notice.AD9882DIGITAL INTERFACEELECTRICAL CHARACTERISTICS(V D = 3.3 V, V DD = 3.3 V, Clock = Maximum, unless otherwise noted.)Test AD9882KSTParameter Conditions Temp Level Min Typ Max Unit RESOLUTION8BitsDC DIGITAL I/O SpecificationsHigh Level Input Voltage (V IH)Full VI 2.6VLow Level Input Voltage (V IL)Full VI0.8VHigh Level Output Voltage (V OH)Full IV 2.4VLow Level Output Voltage (V OL)Full IV0.4VOutput Leakage Current (I OL)High Impedance Full IV–10+10m ADC SPECIFICATIONSOutput High Drive Output Drive = High Full V11mA(I OHD)(V OUT = V OH)Output Drive = Med Full V8mAOutput Drive = Low Full V5mA Output Low Drive Output Drive = High Full V–7mA(I OLD)(V OUT = V OL)Output Drive = Med Full V–6mAOutput Drive = Low Full V–5mA DATACK High Drive Output Drive = High Full V28mA (V OHC)(V OUT = V OH)Output Drive = Med Full V14mAOutput Drive = Low Full V7mA DATACK Low Drive Output Drive = High Full V–15mA (V OLC)(V OUT = V OL)Output Drive = Med Full V–9mAOutput Drive = Low Full V–7mA Differential Input VoltageSingle-Ended Amplitude Full IV75800mV POWER SUPPLYV D Supply Voltage Full IV 3.15 3.3 3.45VV DD Supply Voltage Full IV 2.2 3.3 3.6VPV D Supply Voltage Full IV 3.15 3.3 3.45VI D Supply Current (Typical Pattern)125∞C V269mAI DD Supply Current (Typical Pattern)1, 225∞C V32mAIPV D Supply Current (Typical Pattern)125∞C V54mATotal Supply Current with HDCP(Typical Pattern)1, 2Full IV355367mAI D Supply Current (Worst-Case Pattern)325∞C V276mAI DD Supply Current (Worst-Case Pattern)2, 325∞C V127mAIPV D Supply Current (Worst-Case Pattern)325∞C V54mATotal Supply Current with HDCP(Worst-Case Pattern)2, 3Full IV457468mA Power-Down Supply Current (I PD)Full VI3035mA–4–REV. AAD9882–5–Test AD9882KSTParameter Conditions Temp Level Min Typ Max Unit AC SPECIFICATIONSIntra-Pair (+ to –) DifferentialInput Skew (T DPS)Full IV360ps Channel-to-Channel Differential Full IV1Clock Input Skew (T CCS)Period Low-to-High Transition Timefor Data (D LHT)Output Drive = High,C L = 10 pF Full IV 2.2nsOutput Drive = Med,C L = 7 pF Full IV 2.5nsOutput Drive = Low,C L = 5 pF Full IV 3.2ns Low-to-High Transition Time forDATACK (D LHT)Output Drive = High,C L = 10 pF Full IV 1.0nsOutput Drive = Med,C L = 7 pF Full IV 1.6nsOutput Drive = Low,C L = 5 pF Full IV 2.1ns High-to-Low Transition Time forData (D HLT)Output Drive = High,C L = 10 pF Full IV 2.2nsOutput Drive = Med,C L = 7 pF Full IV 1.9nsOutput Drive = Low,C L = 5 pF Full IV 1.7ns High-to-Low Transition Time forDATACK (D HLT)Output Drive = High,C L = 10 pF Full IV 1.0nsOutput Drive = Med,C L = 7 pF Full IV 1.0nsOutput Drive = Low,C L = 5 pF Full IV 1.4ns Data-to-Clock Skew4Full IV–0.5+2.0ns Duty Cycle, DATACK4Full IV404650% DATACK Frequency (F CIP)Full VI25112MHz NOTES1The typical pattern contains a grayscale area, Output Drive = High.2DATACK Load = 10 pF, Data Load = 10 pF.3The worst-case pattern contains a black and white checkerboard pattern, Output Drive = High.4DRIVE STRENGTH = 11Specifications subject to change without notice.REV. AREV. A–6–AD9882CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9882 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommendedto avoid performance degradation or loss of functionality.ORDERING GUIDETemperature Package ModelRange OptionAD9882KST-1000∞C to 70∞C ST-100AD9882KST-1400∞C to 70∞C ST-100AD9882/PCB25∞CEvaluation BoardABSOLUTE MAXIMUM RATINGS *V D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 V V DD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 V Analog Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . V D to 0.0 V VREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V D to 0.0 V Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V to 0.0 V Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Operating Temperature . . . . . . . . . . . . . . . . –25∞C to +85∞C Storage Temperature . . . . . . . . . . . . . . . . . –65∞C to +150∞C Maximum Junction Temperature . . . . . . . . . . . . . . . . 175∞C Maximum Case Temperature . . . . . . . . . . . . . . . . . . . 150∞C*Stresses above those listed under Absolute Maximum Ratings may cause perma-nent damage to the device. This is a stress rating; functional operation of the device at these or any other conditions outside of those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.EXPLANATION OF TEST LEVELS Test LevelI.100% production tested.II.100% production tested at 25∞C and sample tested at specified temperatures.III.Sample tested only.IV.Parameter is guaranteed by design and characterizationtesting.V.Parameter is a typical value only.VI.100% production tested at 25∞C; guaranteed by designand characterization testing.REV. A AD9882–7–PIN CONFIGURATIONGNDGREEN<7>GREEN<6>GREEN<5>GREEN<4>GREEN<3>GREEN<2>GREEN<1>GREEN<0>V DD GND BLUE<7>BLUE<6>BLUE<5>BLUE<4>BLUE<3>BLUE<2>BLUE<1>BLUE<0>V DD GND CTL 0CTL 1CTL 2CTL 3G N D V D R T E R M V D V D G N D R X 0–R X 0+G N D R X 1–R X 1+G N D R X 2–R X 2+G N D R X C +R X C –V D P V D G N D P V D G N D F I L T P V DG N D GND MIDBYP ASS REFBYP ASS V D GND R AIN V D GND V D GNDG AIN SOGINV D GND V D GND B AIN V D GND V D GND DDCSDA DDCSCL P VD GNDD DE D <0>E D <1>E D <2>E D <3>E D <4>E D <5>E D <6>E D <7>N DO G O U TS O U TS O U TEA T A C KN DD AC LS Y N CS Y N CD AC LV D DD DAD9882Table plete Pinout ListPin PinType Mnemonic Function Value Number InterfaceAnalog R AIN Analog Input for Converter R0.0 V to 1.0 V70Analog Video Inputs G AIN Analog Input for Converter G0.0 V to 1.0 V65AnalogB AIN Analog Input for Converter B0.0 V to 1.0 V59AnalogExternal HSYNC Horizontal Sync Input 3.3 V CMOS79Analog Sync/Clock VSYNC Vertical Sync Input 3.3 V CMOS80Analog SOGIN Input for Sync-on-Green0.0 V to 1.0 V64AnalogSync HSOUT HSYNC Output Clock (Phase-Aligned with DATACK) 3.3 V CMOS88Both Outputs VSOUT VSYNC Output Clock 3.3 V CMOS87Both SOGOUT Sync-on-Green Slicer Output 3.3 V CMOS89Analog References REFBYPASS Internal Reference Bypass 1.25 V73Analog MIDBYPASS Internal Midscale Voltage Bypass74Analog PLL Filter FILT Connection for External Filter Components for48AnalogInternal PLLPower V D Analog Power Supply 3.15 V to 3.45 V Both Supply V DD Output Power Supply 2.2 V to 3.6 V Both PV D PLL Power Supply 3.15 V to 3.45 V BothGND Ground0 V BothSerial Port SDA Serial Port Data I/O 3.3 V CMOS78Both Control SCL Serial Port Data Clock (100 kHz Max) 3.3 V CMOS77Both A0Serial Port Address Input 3.3 V CMOS76Both Data Red [7:0]Outputs of Converter “Red”, Bit 7 is the MSB 3.3 V CMOS92–99Both Outputs Green [7:0]Outputs of Converter “Green”, Bit 7 is the MSB 3.3 V CMOS2–9Both Blue [7:0]Outputs of Converter “Blue”, Bit 7 is the MSB 3.3 V CMOS12–19Both Data ClockOutput DATACK Data Output Clock for the Analog and Digital Interface 3.3 V CMOS85BothDigital Video R X0+Digital Input Channel 0 True33Digital Data Inputs R X0–Digital Input Channel 0 Complement32Digital R X1+Digital Input Channel 1 True36DigitalR X1–Digital Input Channel 1 Complement35DigitalR X2+Digital Input Channel 2 True39DigitalR X2–Digital Input Channel 2 Complement38DigitalDigital Video R XC+Digital Data Clock True41Digital Clock Inputs R XC–Digital Data Clock Complement42Digital Data Enable DE Data Enable 3.3 V CMOS86Digital Control Bits CTL [0:3]Decoded Control Bits 3.3 V CMOS22–25DigitalR TERM R TERM Sets Internal Termination Resistance28DigitalHDCP DDCSCL HDCP Slave Serial Port Data Clock 3.3 V CMOS53Digital DDCSDA HDCP Slave Serial Port Data I/O 3.3 V CMOS54DigitalMCL HDCP Master Serial Port Data Clock 3.3 V CMOS81DigitalMDA HDCP Master Serial Port Data I/O 3.3 V CMOS82Digital–8–REV. AREV. A AD9882–9–PIN DESCRIPTIONS OF SHARED PINS BETWEEN ANALOG AND DIGITAL INTERFACES HSOUT Horizontal Sync OutputA reconstructed and phase-aligned version of thevideo Hsync. The polarity of this output can be controlled via a serial bus bit. In analog interface mode, the placement and duration are variable.In digital interface mode, the placement and duration are set by the graphics transmitter.VSOUTVertical Sync OutputThe separated Vsync from a composite signal or a direct pass-through of the Vsync input. The polarity of this output can be controlled via a serial bus bit. The placement and duration in all modes is set by the graphics transmitter.SERIAL PORT (2-WIRE)SDA Serial Port Data I/O SCL Serial Port Data Clock A0Serial Port Address InputFor a full description of the 2-wire serial register,refer to the Control Port section on 2-Wire Serial Control.DATA OUTPUTS RED Data Output, RED Channel GREEN Data Output, GREEN Channel BLUE Data Output, BLUE ChannelThe main data outputs. Bit 7 is the MSB. Theseoutputs are shared between the two interfaces and behave according to which interface is active.Refer to the sections on the two interfaces for more information on how these outputs behave.DATACKData Output ClockJust like the data outputs, the data clock output is shared between the two interfaces. It behaves differently depending on which interface is active.Refer to the sections on the two interfaces to determine how this pin behaves.Table II.Analog Interface Pin ListPinPin Type Mnemonic FunctionValue Number Analog Video R AIN Analog Input for Converter R 0.0 V to 1.0 V 70Inputs G AIN Analog Input for Converter G 0.0 V to 1.0 V 65B AIN Analog Input for Converter B 0.0 V to 1.0 V 59External HSYNC Horizontal SYNC Input 3.3 V CMOS 79Sync/Clock VSYNC Vertical SYNC Input 3.3 V CMOS 80SOGIN Sync-on-Green Input0.0 V to 1.0 V 64Sync OutputsHSOUT Hsync Output (Phase-Aligned with DATACK) 3.3 V CMOS 88VSOUT Vsync Output 3.3 V CMOS 87SOGOUT Composite SYNC3.3 V CMOS 89Voltage REFBYPASS Internal Reference Bypass1.25 V73ReferenceMIDBYPASS Internal Midscale Voltage Bypass74Clamp Voltages PLL Filter FILT Connection for External Filter Components for Internal PLL 48Power SupplyV D Main Power Supply3.15 V to 3.45 V PV D PLL Power Supply (Nominally 3.3 V) 3.15 V to 3.45 V V DD Output Power Supply 2.2 V to 3.6 V GNDGround0 VAD9882PIN FUNCTION DETAIL (ANALOG INTERFACE) INPUTSR AIN Analog Input for RED ChannelG AIN Analog Input for GREEN ChannelB AIN Analog Input for BLUE ChannelHigh impedance inputs that accept the RED,GREEN, and BLUE channel graphics signals,respectively. For RGB, the three channels areidentical and can be used for any colors, butcolors are assigned for convenient reference.For proper 4:2:2 formatting in a YPbPr application,the Y must be connected to the G AIN input, thePb must be connected to the B AIN input, and thePr must be connected to the R AIN input.They accommodate input signals ranging from0.5 V to 1.0 V full scale. Signals should beac-coupled to these pins to support clampoperation.HSYNC Horizontal Sync InputThis input receives a logic signal that establishesthe horizontal timing reference and provides thefrequency reference for pixel clock generation.The logic sense of this pin is controlled by SerialRegister Bit 10H, Bit 6 (Hsync Polarity). Onlythe leading edge of Hsync is active; the trailingedge is ignored. When Hsync Polarity = 0, thefalling edge of Hsync is used. When HsyncPolarity = 1, the rising edge is active.The input includes a Schmitt trigger for noiseimmunity, with a nominal input threshold of1.5 V.Electrostatic Discharge (ESD) protection diodeswill conduct heavily if this pin is driven morethan 0.5 V above the maximum tolerance voltage(3.3 V), or more than 0.5 V below ground. VSYNC Vertical Sync InputThis is the input for vertical sync.SOGIN Sync-on-Green InputThis input is provided to assist with processingsignals with embedded sync, typically on theGREEN channel. The pin is connected to ahigh speed comparator with an internally gener-ated threshold, which is set by the value ofregister 0FH, Bits 7–3.When connected to an ac-coupled graphicssignal with embedded sync, it will produce anoninverting digital output on SOGOUT.When not used, this input should be left uncon-nected. For more details on this function andhow it should be configured, refer to the Sync-on-Green section.SOGOUT Sync-on-Green Slicer OutputThis pin can be programmed to produce eitherthe output from the Sync-on-Green slicer com-parator or an unprocessed but delayed version ofthe Hsync input. See the Sync Processing BlockDiagram, Figure 18, to view how this pin isconnected.Note: The output from this pin is the compositeSYNC without additional processing from theAD9882.FILT External Filter ConnectionFor proper operation, the pixel clock generatorPLL requires an external filter. Connect thefilter shown in Figure 6 to this pin. For optimalperformance, minimize noise and parasitics onthis node.REFBYPASS Internal Reference BYPASSBypass for the internal 1.25 V band gap refer-ence. It should be connected to ground througha 0.1 m F capacitor.The absolute accuracy of this reference is ±4%,and the temperature coefficient is ±50 ppm,which is adequate for most AD9882 applica-tions. If higher accuracy is required, an externalreference may be employed instead. MIDBYPASS Midscale Voltage Reference BYPASSBypass for the internal midscale voltage refer-ence. It should be connected to ground througha 0.1 m F capacitor. The exact voltage varies withthe gain setting of the RED channel.HSOUT Horizontal Sync OutputA reconstructed and phase-aligned version ofthe Hsync input. The duration of Hsync canonly be programmed on the analog interface,not the digital.DATACK Data Output ClockThe data clock output signal is used to clock theoutput data and HSOUT into external logic.It is produced by the internal clock generatorand is synchronous with the internal pixelsampling clock.When the sampling time is changed by adjustingthe PHASE register, the output timing is shiftedas well. The Data, DATACK, and HSOUToutputs are all moved so the timing relationshipamong the signals is maintained.VSOUT Vertical Sync OutputThe separated Vsync from a composite signal ora direct pass-through of the Vsync input. Thepolarity of this output can be controlled viaRegister 10H, Bit 2. The placement and durationin all modes is set by the graphics transmitter.REV. A–10–RED Data Output, RED ChannelGREEN Data Output, GREEN ChannelBLUE Data Output, BLUE ChannelThese are the main data outputs. Bit 7 is the MSB.The delay from pixel sampling time to output isfixed. When the sampling time is changed byadjusting the PHASE register, the output timingis shifted as well. The DATACK and HSOUToutputs are also moved, so the timing relation-ship among the signals is maintained.Please refer to the timing diagrams for moreinformation.POWER SUPPLYV D Main Power SupplyThese pins supply power to the main elements ofthe circuit. They should be as quiet as possible.V DD Digital Output Power SupplyA large number of output pins (up to 25) switch-ing at high speed (up to 140 MHz) generates alot of power supply transients. These supplypins are identified separately from the V D pinsso special care can be taken to minimize out-put noise transferred into the sensitive analogcircuitry.If the AD9882 is interfacing with lower voltagelogic, V DD may be connected to a lower supplyvoltage (as low as 2.2 V) for compatibility.PV D Clock Generator Power SupplyThe most sensitive portion of the AD9882 is theclock generation circuitry. These pins providepower to the clock PLL and help the user designfor optimal performance. The designer shouldprovide noise-free power to these pins.GND GroundThe ground return for all circuitry on chip. It isrecommended that the AD9882 be assembled ona single solid ground plane, with careful attentionto ground current paths.Table III.Interface Selection ControlsAnalog DigitalAIO Interface Interface AIS Active(0FH Bit 2)Detect Detect(0FH Bit 1)Interface Description1X X0Analog Force the analog interface active.1Digital Force the digital interface active.00X None Neither interface was detected. Both interfaces arepowered down.01X Digital The digital interface was detected. Power down theanalog interface.10X Analog The analog interface was detected. Power down thedigital interface.110Analog Both interfaces were detected. The analog interfacegets priority.1Digital Both interfaces were detected. The digital interfacegets priority.Table IV.Power-Down Modes, 4:2:2 and 4:4:4 Format DescriptionsAnalog Digital Active ActivePower-Interface Interface Interface Interface4:2:2Mode Down1Detect2Detect3Override Select Formatting Data Sheet Signals Powered OnSoft Power-1000X X Serial bus, digital interface clock detect, Down (Seek analog interface clock detect, SOG Mode)Digital1010X X Serial bus; digital interface and analog Interface On interface activity detect; SOG, band gapreference; red, green, and blue outputsAnalog1100X0Serial bus; analog interface and digital Interface On interface clock detect; SOG, band gap 4:4:4 Format reference; red, green, and blue outputs Analog1100X1Serial bus; analog interface and digital Interface On interface clock detect; SOG, band gap 4:2:2 Format reference; red and green outputs only Serial Bus111100Same as Analog InterfaceArbitrated on 4:4:4 ModeInterfaceSerial Bus111101Same as Analog InterfaceArbitrated on 4:2:2 ModeInterfaceSerial Bus11111X Same as Digital Interface Mode ArbitratedInterfaceOverride to11X100Same as Analog InterfaceAnalog4:4:4 ModeInterfaceOverride to11X101Same as Analog InterfaceAnalog4:2:2 ModeInterfaceOverride to1X111X Same as Digital Interface ModeDigitalInterfaceAbsolute0X X X X X Serial BusPower-DownNOTES1Power-down is controlled via Bit 1 in Serial Bus Register 14H.2Analog Interface Detect is determined by OR-ing Bits 7, 6, and 5 in Serial Bus Register 15H.3Digital Interface Detect is determined by Bit 4 in Serial Bus Register 15H.THEORY OF OPERATION (INTERFACE DETECTION) Active Interface Detection and SelectionThe AD9882 includes circuitry to detect whether an interface is active or not. See Table III.For detecting the analog interface, the circuitry monitors the presence of Hsync, Vsync, and Sync-on-Green. The result of the detection circuitry can be read from the 2-wire serial inter-face bus at Address 15H, Bits 7, 5, and 6, respectively. If one of these sync signals disappears, the maximum time it takes for the circuitry to detect it is 100 ms.For detecting the digital interface, there are two stages of detection. The first stage searches for the presence of the digital interface clock. The circuitry for detecting the digital interface clock is active even when the digital interface is powered down. The result of this detection stage can be read from the 2-wire serial interface bus at Address 15H, Bit 4. If the clock disappears, the maximum time it takes for the circuitry to detect it is 100 ms. Once a digital interface clock is detected, the digital interface is powered up and the second stage of detection begins. During the second stage, the circuitry searches for 32 consecutive DEs. Once 32 DEs are found, the detection process is complete. There is an override for the automatic interface selection. It is the AIO (Active Interface Override) bit, Register 0FH, Bit 2. When the AIO bit is set to logic “0,” the automatic circuitry will be used. When the AIO bit is set to logic “1,” the AIS (Active Interface Select) bit (Register 0FH, Bit 1) will be used to determine the active interface rather than the automatic circuitry. Power ManagementThe AD9882 is a dual interface device with shared outputs. Only one interface can be used at a time. For this reason, the chip auto-matically powers down the unused interface. When the analog interface is being used, most of the digital interface circuitry is powered down, and vice versa. This helps to minimize the AD9882 total power dissipation. In addition, if neither interface has activity on it, then the chip powers down both interfaces. The AD9882 uses the activity detect circuits, the active interface bits in Serial Register 15H, the active interface override bits in Register 0FH, Bits 2 and 1, and the power-down bit in Register 14H, Bit 1, to determine the correct power state. In a given power mode, not all circuitry in the inactive interface is powered down completely. When the digital interface is active, the band gap reference Hsync, Vsync, and SOG detect circuitry remain powered up. When the analog interface is active, the digital interface clock detect circuit is not powered down. Table IV summarizes how the AD9882 determines what power mode to be in and what circuitry is powered on/off in each of these modes. The power-down command has priority, then the active interface override, and then the automatic circuitry.THEORY OF OPERATION AND DESIGN GUIDE (ANALOG INTERFACE)General DescriptionThe AD9882 is a fully integrated solution for capturing analog RGB signals and digitizing them for display on flat panel monitors or projectors. The device is ideal for implementing a computer interface for HDTV monitors or as the front end to high performance video scan converters.Implemented in a high performance CMOS process, the inter-face can capture signals with pixel rates of up to 140 MHz.The AD9882 includes all necessary input buffering, signal dc restoration (clamping), offset and gain (brightness and contrast) adjustment, pixel clock generation, sampling phase control, and output data formatting. All controls are programmable via a2-wire serial interface. Full integration of these sensitive analog functions makes the system design straightforward and less sensitive to the physical and electrical environment.With a typical power dissipation of only 875 mW and an operat-ing temperature range of 0∞C to 70∞C, the device requires no special environmental considerations.Input Signal HandlingThe AD9882 has three high impedance analog input pins for the RED, GREEN, and BLUE channels. They will accommodate signals ranging from 0.5 V to 1.0 V p-p.Signals are typically brought onto the interface board via aDVI-I connector, a 15-pin D connector, or BNC connectors. The AD9882 should be located as close as practical to the input connector. Signals should be routed via matched-impedance traces (normally 75 W) to the IC input pins.At that point, the signal should be resistively terminated (75W to the signal ground return) and capacitively coupled to the AD9882 inputs through 47 nF capacitors. These capacitors form part of the dc restoration circuit. See Figure 1.In an ideal world of perfectly matched impedances, the best performance can be obtained with the widest possible signal band-width. The wide bandwidth inputs of the AD9882 (300MHz) can track the input signal continuously as it moves from one pixel level to the next and digitize the pixel during a long, flat pixel time. In many systems, however, there are mismatches, reflections, and noise, which can result in excessive ringing and distortion of the input waveform. This makes it more difficult to establish a sampling phase that provides good image quality. It has been shown that a small inductor in series with the input is effective in rolling off the input bandwidth slightly and providing a high quality signal over a wider range of conditions. Using a Fair-Rite #2508051217Z0 High Speed Signal Chip Bead inductor in thecircuit of Figure 1 gives good results in most applications.AINAINAINFigure 1.Analog Input Interface Circuit。
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Symbol
Typ Max 739096125R θJL 6375Maximum Junction-to-Lead C
Steady-State
°C/W
Thermal Characteristics Parameter
Units Maximum Junction-to-Ambient A t ≤ 10s R θJA °C/W Maximum Junction-to-Ambient A Steady-State °C/W AO8801
Dual P-Channel Enhancement Mode Field Effect Transistor
AO8801
Symbol
Min Typ
Max
Units BV DSS -20
V -1T J =55°C
-5±1µA ±10µA
V GS(th)-0.3-0.55-1
I D(ON)-25
A
3542T J =125°C
475744
53m Ω5470m Ωg FS 8
16S V SD -0.78
-1V I S
-2.2
A C iss 1450
pF C oss 205pF C rss 160pF R g
6.5ΩQ g 1
7.2nC Q gs 1.3nC Q gd 4.5nC t D(on)9.5ns t r 17ns t D(off)94ns t f 35ns t rr 31ns Q rr 13.8
nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Gate-Body leakage current Gate resistance
V GS =0V, V DS =0V, f=1MHz
R DS(ON)
Static Drain-Source On-Resistance
Forward Transconductance Diode Forward Voltage Turn-Off Fall Time Maximum Body-Diode Continuous Current
Input Capacitance Output Capacitance Turn-On Delay Time DYNAMIC PARAMETERS I F =-4A, dI/dt=100A/µs V GS =0V, V DS =-10V, f=1MHz SWITCHING PARAMETERS Total Gate Charge V GS =-4.5V, V DS =-10V, I D =-4A
Gate Source Charge Gate Drain Charge Turn-On Rise Time Turn-Off Delay Time V GS =-4.5V, V DS =-10V, R L =2.5Ω, R GEN =3Ω
m ΩV GS =-2.5V, I D =-4A I S =-1A,V GS =0V V DS =-5V, I D =-4.7A
I DSS µA Gate Threshold Voltage
V DS =V GS I D =-250µA V DS =-16V, V GS =0V
V DS =0V, V GS =±8V Zero Gate Voltage Drain Current V DS =0V, V GS =±4.5V I GSS Electrical Characteristics (T J =25°C unless otherwise noted)STATIC PARAMETERS Parameter Conditions Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge
I F =-4A, dI/dt=100A/µs
Drain-Source Breakdown Voltage On state drain current
I D =-250µA, V GS =0V V GS =-1.8V, I D =-2A V GS =-4.5V, V DS =-5V V GS =-4.5V, I D =-4.7A
Reverse Transfer Capacitance A: The value of R θJA is measured with the device mounted on 1in 2
FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2
FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The SOA curve provides a single pulse rating. Rev2: August 2005
AO8801
AO8801。