导光板热压加工技术

B: Part solidifies at lower temp and lower pressure
△V :volume shrinkage
specific volume decreases
HighlyConf idential
Hot Embossing Machine Categories
HighlyConf idential
平面熱壓計劃之 目的/關鍵技術
目的
•暸解熱壓製程全貌 •評估熱壓之發展性 •建立產品開發及打樣能力
關鍵技術
• Optimized parameters in manufacturing process • Factors affect yield • Yield rat e • Cycle time or tact time • Pre-treatment and after process • Tool life
6.17mm
HighlyConf idential
Flow chart
板板材材切切割割 保保護護膜膜移移除除 模模仁仁//治治具具準準備備 HHoott EEmmbboosssiinngg
端端面面機機械械拋拋光光
刀刀具具加加工工 雷雷射射加加工工 沖沖壓壓
雙雙面面貼貼保保護護膜膜
加加熱熱 壓壓縮縮成成形形
冷冷卻卻 離離模模
HighlyConf idential
熱壓製程之顧慮點
板材品質 (厚度均勻性 ,異物,刮傷)要求高 加熱及冷卻之效率和耗能問題 需要前處理及後處理程序 高壓力下有高轉寫率,但模具模仁壽命縮短 良率問題 產能問題 : Cycle time of heating and cooling plus
material handling
HighlyConf idential
HE Technology Development Work
Targ et
Size
1
2
3
7.5”~15” 15”~2Baidu Nhomakorabea”
32”
Thickne ss 0.4mm,
0.6~0.9mm; 2~3mm
Patte rn on LGP
Double-sided (V-groove, dots,….)
HighlyConf idential
HE Development Work
Sponsored by BBG, the goals of HE Technology Development Work are to:
Identify optimized parameters in manufacturing process Identify factors affect yield Invest igate achievable yield rate Design optimized HE equipment and production layout for future operation Invest igate achievable cycle time or tact time Develop pre-treatment and after process Provide proto type manufacturing capacity Defi ne tool life and overall process economics
導光板熱壓加工技術
許建宏 (Roger Hsu)
轉印技術部
2010-03-24
HighlyConf idential
Outline
Introduction of HE Technology Scope of HE Technology Development at Nano Precision HE Examples Relevant Issues
HighlyConf idential
The Thinest Work Piece
吋 13 0.4t
PMM A
M atte stamp er
PMM A
V-C ut Stamp er
V -cut
S tamp er Center of plate Edge of plate
Dep th (u m)
12.14 11.42 11.20
•The amorphous regions : respond to Tg.
•The crystalline regions: usually in the form of spherulites melt at a specific temperature, the melting point (Tm)
HighlyConf idential
Mold (Stamper)
• ETCHING • SANDBLASTING • PRISM • LENTICULAR • MICROLENS • MIRRORSURFACE
32”STAMPERWITHMatteSurface 32”STAMPERWITHLENTICULARLENS
HighlyConf idential
高分子材料熱機械曲線
比 容
溫度
非晶態高聚物的溫度比容曲線
將一變度一恆隨形非定溫變外態度曲力的晶線高，變或聚記化熱物錄，機試試可械樣樣得曲的，到線形施溫
•玻璃態 •高彈態
形 變
•粘流態
•玻璃化轉變溫度，T g
•粘流溫度，T f
• T g是非晶態高聚物的主要熱轉變溫度
HighlyConf idential
The Largest Work Piece
32吋1.5t 擴散板
V- cu t
S tamp er Center of plate Edge of plate
Dep th (u m)
48.76 51.00 47.13
Trans fer Rate
104.60% 96.66%
μ μ Microstructure with a few 10 m~ m
range
HighlyConf idential
Outline
Introduction of HE Technology Scope of HE Technology Development at Nano Precision HE Examples Relevant Issues
玻璃態 高彈態 粘流態
Tg
Tf
溫度
非晶態高聚物的溫度形變曲線
HighlyConf idential
熱機械曲線
Tg for common amorphous polymers
° PS 100 C ° PC 150 C ° PMMA 105 C ° Rigid PVC 83 C
Tg HighlyConf idential
高分子材料特性
玻璃轉換溫度 Glass Transition Temperature (
)
Tg : glassy amorphous polymers become flexible as a result of the
onset of segmental motion.
熔化溫 度 Melting Point (
HighlyConf idential
高分子材料種類
Polymers
TThheermrmoosseetsts
TThheermrmoopplalasstitcicss
EElalasstotommeerrss
AAmmoorprphhoouuss
CCryrsytsatal llinlinee
Thermoplastics
HighlyConf idential
Experiment Object
建Pr立oce平ss板型NB LGP Hot Embossing SCTiyhzcilecek:ntes<imse15::吋0約.3 8–-11m0m minute 建立TV擴散板Hot Embossing Process (執行工業局多功能擴散板技術開發計畫) Size : = 32 吋 CTyhcilceknteismse::1約.5 ~152-mm18 minute
HighlyConf idential
HighlyConf idential
Introduction
Hot Embossing Process
Exam p l e:
M atte stam p er
PMM A
V-co re stam p er
Both sides of the work
μpiece can be molded with structure .
)
Tm : Temperature at which total chain mobility occurs (Tm>Tg) At Tg, the amorphous region changes from a hard and glass-like state
to a rubbery state.
Trans fer Rate
94.1% 92.3%
Width(um )
39.73 38.35 39.18
Trans fer Rate
96.50% 98.6%
Matte (da)
Light enter Center of plate
End of plate
LGP
2.436 2.006 1.568
Mat te
W i d th(u m)
101.07 100.57 100.57
Trans fer Rate
99.50% 99.50%
HighlyConf idential
白反射片微結構
的反射片尺寸 長： 寬： 厚： •CMO1081
: 228mm 135mm 0.15mm
LGP
Re flector
4.7 mm
LED
HighlyConf idential
Outline
Introduction of HE Technology Scope of HE Technology Development at Nano Precision HE Examples Relevant Issues
HighlyConf idential
HighlyConf idential
熱壓實驗機適用開發產品
產品種類 1. 平板型NB導光板
• Size :<15 “ ••TChyicclkenteimsse::0.約3 –8-11m0mminute 2. TV擴散板 • Size :<32“ ••TChyicclkenteimsse::11.55–- 182mmminute
2.353 1.837 1.457
Trans fer Rate
103.5%
109.2% 107.6%
HighlyConf idential
The Largest Work Piece
執行目的: 執行工業局多功能擴散板技術開發
32吋1.5t 擴散板
M atte stamp er PS
V-C ut Stamp er
St rengt h A c c ur a c y
Heat Conduct ion
HE M old
Va cuum
T em perat ureDurabilit y St amper
HighlyConf idential
熱壓製程之優點
製程參數較射出成型少 (壓縮壓力,溫度,時間) 轉寫率較射出成型為高 可達成較高之深寬比 薄板及薄膜可以熱壓成型 工件之殘留應力少 首件樣品開發時間較射出成型短
結晶) (Semi)Crystalline polymers (
e.g. PE, PP, ny lon, etc.
非結晶) Amorphous polymers(
e.g. PS, PMMA, PC, ABS, etc.
a m or phous
cr ysta ll ine
HighlyConf idential
熱機械曲線
PVT Characteristics for Amorphous Resins
Specific Volume
I nc re a si ng Pressu re
B
A
ΔV
P - Pressure V - SpecificVolume T - Temperature
Tem peratu re
A: Poly mer melt into the mold high temp and high pressure
HE Technology
熱傳導技術 最佳品質
高溫真空 模仁壽命
製造精度
治模
厚度公差
塑 料 材料
潔淨度
具 熱 Hot Embossing 製 Technology
程 參 數 統 系 壓 成型時間
加熱冷卻
壓縮控制
機台精度 真空設計/控制
10
HighlyConf idential
HE Technology