BF6852AC 自电容多点触控芯片 Datasheet
PowerLite 685W for SMART Board 交互式白板呈现显示器说明书
EducationSPECIFICATION SHEETSpecification Sheet | Page 1 of 2PowerLite ®685W for SMART Board®Interactive WhiteboardsThe ultimate ultra short-throw presentation display for BYOD classrooms.Compatible — specially designed to work with SMART Board M685 and 885 interactive whiteboardsSeamless integration — connect and control your display via the SMART Extended Control Panel (ECP)1Remarkable color accuracy — 3LCD, 3-chip technology delivers high Color Brightness and a wide Color GamutBright display — 3,500 lumens color/white brightness 2 Long-life lamp — lasts up to 10,000 hours in ECO Mode 3Amazing, widescreen images — native WXGA resolution (1280 x 800) and 16:10 formatUltra short-throw presentation display — get an 87" image from 8" away with virtually no shadow interferenceManage your display and send announcements remotely — easy network connectivity; software includedWireless support — display Chromebook,™ iOS ®, Android,™Mac ® and PC screens 4Versatile connectivity — 3x HDMI ® supports multiple high-definition A/V devices, with MHL ® support 5/educationWXGA Resolution1280 x 800Shown with optional wall mount (sold separately)Specification Sheet | Page 2 of 2Epson America, Inc.3840 Kilroy Airport Way, Long Beach, CA 90806Epson Canada Limited185 Renfrew Drive, Markham, Ontario L3R 6G3 www.epson.caVertical: ±3 degrees Horizontal: ±3 degreesMac Connectivity Projector is Mac compatible via USB; DVI to HDMI or VGA adapter (not included); DP to HDMI or VGA adapter (not included)Contrast Ratio Up to 14,000:1Color Reproduction Up to 1.07 billion colorsProjection LensType Digital zoom/Manual focus F-number 1.6Focal Length 3.7 mmZoom Ratio Digital zoom: 1.0 – 1.35OtherDisplay Performance NTSC: 480 linesPAL: 576 lines (Depends on observation of the multi-burst pattern)Input Signal NTSC/NTSC4.43/PAL/M-PAL/N-PAL/PAL60/SECAMSpeaker 16 W (mono)Operating Temperature 41 ˚ to 104 ˚F (5 ˚ to 40 ˚C) Power Supply Voltage 100 – 240 V ±10%, 50/60 Hz Power Consumption 373 W (Normal Mode) 324 W (ECO Mode)2.2 W Standby (Communication On) 0.23 W Standby (Communication Off)Fan Noise35 dB (Normal Mode) 29 dB (ECO Mode)Security Kensington-style lock provision, padlock and security cable hole, Password-protect FunctionExcluding Feet 14.5" x 15.8" x 5.9"Weight 12.6 lbRemote ControlFeatures Source Search, HDMI/Video, LAN, Computer, USB, Power, Aspect, Color Mode, Volume, E-zoom, A/V Mute, Freeze, Menu, Page Up and Down, Home, Auto, Mouse Functions, User, Split Screen 6Operating Distance Front/rear: 19.7 ft (6 m)Eco FeaturesRoHS compliant Recyclable product 7Epson America, Inc. is a SmartWay ® Transport Partner 8SupportEpson Connection SM Pre-sales supportU.S. and Canada: 800-463-7766 Service Programs 2-year projector limited warranty, Epson Road Service program, PrivateLine ® dedicated toll-free support and 90-day limited lamp warrantyremote control, batteries, user manual CD, projector software CDs, Quick Setup Sheet, Installation Guide, template sheet, projector feetOrdering InformationPowerLite 685W for SMART V11H744620Genuine Epson Lamp V13H010L91Air Filter (ELPAF49)V13H134A49 PowerLite Pilot ™ 2 (ELPCB02) V12H614020Active Speakers (ELPSP02)V12H467020Wireless 802.11b/g/n LAN Unit (ELPAP10) V12H731P02Epson DC-21 Document Camera (ELPDC21) V12H758020100" WhiteboardV12H831000Ultra Short-throw Wall Mount (ELPMB46) V12H777020Adapter for SMARTUF55/65/70/75 series mountsV12H870001Specifications and terms are subject to change without notice. EPSON and PowerLite are registered trademarks, EPSON Exceed Your Vision is a registered logomark and Better Products for a Better Future and Epson iProjection are trademarks of Seiko Epson Corporation. PrivateLine is a registered trademark, Pilot is a trademark and Epson Connection is a service mark of Epson America, Inc. Mac is a trademark of Apple Inc., registered in the U.S. and other countries. Android and Chromebook are trademarks of Google Inc. SmartWay is a registered trademark of the U.S. Environmental Protection Agency. All other product and brand names are trademarks and/or registered trademarks of their respective companies. Epson disclaims any and all rights in these marks. Copyright 2019 Epson America, Inc. Com-SS-Oct-13 CPD-52820R1 1/19/educationContact:1 Existing SMART Board M685 and 885 installations require the SMART Cable Adapter Kit, sold separately. |2 Color brightness (color light output) and white brightness (white light output) will vary depending on usage conditions. Color light output measured in accordance with IDMS 15.4; white light output measured in accordance with ISO 21118. |3 Lamp life will vary depending upon mode selected, environmental conditions and usage. Lamp brightness decreases over time. |4 For wireless functionality, including via the Epson iProjection™ App, the projector must be configured on a network, either through the Ethernet port on the projector (check model specifications for availability) or via a wireless connection. Check your owner’s manual to determine if a wireless LAN module must be purchased separately to enable a wireless connection. Not all Epson projectors are able to be networked. The Epson iProjection App does not support all files and formats. See for details. |5 Includes one Mobile High-Definition Link ® (MHL) HDMI port. |6 Consult your user manual for input combinations. |7 For convenient and reasonable recycling options, visit /recycle |8 SmartWay is an innovative partnership of the U.S. Environmental Protection Agency that reduces greenhouse gases and other air pollutants and improves fuel efficiency.Learn more about how our products can empower your institution. Visit us at /foreducation。
LiteBeam 5AC Gen 2 蜂窝设备产品数据表说明书
D atasheetairMAX® ac CPE with Dedicated Management RadioModel: LBE-5AC-Gen2Lightweight, Low-Cost SolutionFull Adjustment FlexibilityQuick Assembly and InstallationD a t a s h e e tHardware OverviewFull Adjustment FlexibilityThe LiteBeam 5AC features a two-mount system that provides adjustment flexibility along both axes for versatile mounting options. The mounting system, coupled with the built-in bubble level, enables quick and easy alignment.Improved Mounting and Surge Protection Featuring enhanced protection against power surges, the LiteBeam 5AC Gen 2 offers a more robust mount with separate azimuth and elevation adjustments.Antenna FeedFeedReceiverElevation AzimuthMountLiteBeam 5ACBuilt-InU M obileThe LiteBeam 5AC Gen 2 integrates a separate Wi-Fi radio for fastand easy setup using your mobile device.Accessing airOS via Wi-FiThe U M obile App provides instant accessibility to the airOSconfiguration interface and can be downloaded from theApp Store (iOS) or Google Play™ (Android). U M obile allows you toset up, configure, and manage the LiteBeam 5AC Gen 2. It offersthe following options once you're connected or logged in to thedevice:Status Check link status information or the basic configurationsettings of the LiteBeam 5AC Gen 2.Configuration Change or update the existing configuration ofthe LiteBeam 5AC Gen 2.Tools Access tools for initial installation and configuration of theLiteBeam 5AC Gen 2.Actions Back up or update the configuration, upload newfirmware, reboot the device, reset the device to factory defaults,access the airOS UI in the web browser, or disconnect from theLiteBeam 5AC Gen 2.SpecificationsSpecifications are subject to change. Ubiquiti products are sold with a limited warranty described at: /support/warranty©2017 Ubiquiti Networks, Inc. All rights reserved. Ubiquiti, Ubiquiti Networks, the Ubiquiti U logo, the Ubiquiti beam logo, airMAX, airOS, airMagic, InnerFeed, and LiteBeam are trademarks or registered trademarks of Ubiquiti Networks, Inc. in the United States and in other countries. All other trademarks are the property of their respective owners.Vertical Azimuth Vertical ElevationHorizontal AzimuthHorizontal ElevationReturn Loss。
FM17522E 非接触读写器芯片技术手册说明书
FM17522E通用非接触读写器芯片技术手册2017.10本资料是为了让用户根据用途选择合适的上海复旦微电子集团股份有限公司（以下简称复旦微电子）的产品而提供的参考资料，不转让属于复旦微电子或者第三者所有的知识产权以及其他权利的许可。
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上海复旦微电子集团股份有限公司在中国发布，版权所有。
目录目录 (3)表目录 (6)图目录 (10)1产品综述 (11)1.1产品简介 (11)1.2产品特点 (11)1.3结构框图 (12)1.4封装引脚 (13)1.4.1FM17522E封装引脚 (13)2功能描述 (15)2.1总体描述 (15)2.2ISO/IEC14443A功能支持 (15)3FM17522E寄存器 (17)3.1FM17522E寄存器概述 (17)3.1.1寄存器总表 (17)3.1.2寄存器位行为 (18)3.2寄存器描述 (19)3.2.1Page 0：命令和状态 (19)3.2.2Page 1：通讯 (26)3.2.3Page 2：配置 (33)3.2.4Page 3：测试 (38)3.2.5扩展寄存器 (43)4HOST接口 (45)4.1H OST接口自动侦测 (45)4.2SPI接口 (45)4.2.1SPI读数据 (45)4.2.2SPI写数据 (45)4.2.3SPI地址字节 (46)4.3UART接口 (46)4.3.1UART传输速率可配 (46)4.3.2UART帧格式 (47)4.4I2C总线接口 (48)4.4.1数据有效性 (49)4.4.2START和STOP状态 (49)4.4.3字节格式 (49)4.4.4Acknowledge (49)4.4.57位地址 (50)4.4.6寄存器写入访问 (51)4.4.7寄存器读取访问 (51)4.4.8高速模式 (52)4.4.9高速传输 (52)4.4.10HS模式下的数据传输格式 (52)4.4.11F/S模式与HS模式间转换 (53)4.4.12低速模式 (53)4.5扩展寄存器的访问 (53)5模拟电路接口和非接触接口控制 (55)5.1概述 (55)5.2发射驱动 (55)5.3串行数据切换开关 (56)6CRC协处理器 (57)7FIFO缓冲 (58)7.1FIFO缓冲器的访问 (58)7.2FIFO缓冲器的控制 (58)7.3FIFO缓冲器的状态信息 (58)8中断请求系统 (59)8.1中断源概述 (59)9TIMER计时单元 (60)10低功耗模式 (61)10.1D EEP P OWER D OWN (61)10.2H ARD P OWER D OWN (61)10.2.1HPD下数据保存功能 (61)10.3S OFT P OWER D OWN (62)10.4射频关闭模式 (62)11低电压检测功能 (63)12振荡器电路 (64)13复位和晶振起振时序 (65)13.1复位信号要求 (65)13.2晶振起振时序 (65)14指令集 (66)14.1概述 (66)14.2指令的一般行为 (66)14.3FM17522E指令描述 (66)14.3.1IDLE (66)14.3.2Mem (66)14.3.3Generate RandomID (66)14.3.4CalcCRC (67)14.3.5Transmit (67)14.3.6NoCmdChange (67)14.3.7Receive (67)14.3.8Transceive (67)14.3.9Authent (67)14.3.10SoftReset (68)15测试信号 (69)15.1测试总线 (69)15.2引脚AUX1/AUX2上的测试信号 (70)15.3PRBS (70)16典型应用图 (71)17电气参数 (72)17.1极限额定参数 (72)17.2.2I2C交流参数 (73)18订货信息 (75)19封装信息 (76)19.1QFN32封装尺寸图 (76)版本信息 (77)上海复旦微电子集团股份有限公司销售及服务网点 (78)表目录表1-1FM17522E QFN32封装引脚说明 (14)表2-1FM17522E ISO/IEC A通讯简述 (15)表3-1寄存器总表 (18)表3-2扩展寄存器总表 (18)表3-3寄存器位行为及其描述 (18)表3-4RFU寄存器 (19)表3-5RFUR EG位描述 (19)表3-6C OMMAND R EG寄存器 (19)表3-7C OMMAND R EG位描述 (19)表3-8C OMM IE N R EG寄存器 (19)表3-9C OMM IE N R EG位描述 (20)表3-10D IV IE N R EG寄存器 (20)表3-11D IV IE N R EG位描述 (20)表3-12C OMM IR Q R EG寄存器 (20)表3-13C OMM IR Q R EG位描述 (21)表3-14D IV IR Q R EG寄存器 (21)表3-15D IV IR Q R EG位描述 (21)表3-16E RROR R EG寄存器 (21)表3-17E RROR R EG位描述 (22)表3-18S TATUS1R EG寄存器 (22)表3-19S TATUS1R EG位描述 (22)表3-20S TATUS2R EG寄存器 (22)表3-21S TATUS2R EG位描述 (23)表3-22FIFOD ATA R EG寄存器 (23)表3-23FIFOD ATA R EG寄存器位描述 (23)表3-24FIFOL EVEL R EG寄存器 (23)表3-25FIFOL EVEL R EG寄存器 (24)表3-26W ATER L EVEL R EG寄存器 (24)表3-27W ATER L EVEL R EG寄存器位描述 (24)表3-28C ONTROL R EG寄存器 (24)表3-29C ONTROL R EG寄存器位描述 (24)表3-30B IT F RAMING R EG寄存器 (25)表3-31B IT F RAMING R EG寄存器位描述 (25)表3-32C OLL R EG寄存器 (25)表3-33C OLL R EG寄存器位描述 (25)表3-34EXR EG寄存器 (26)表3-35EXR EG寄存器位描述 (26)表3-36RFU寄存器 (26)表3-37RFUR EG位描述 (26)表3-38M ODE R EG寄存器 (26)表3-39M ODE R EG位描述 (27)表3-40T X M ODE R EG寄存器 (27)表3-41T X M ODE R EG位描述 (27)表3-42R X M ODE R EG寄存器 (27)表3-43R X M ODE R EG位描述 (28)表3-44T X C ONTROL R EG寄存器 (28)表3-45T X C ONTROL R EG位描述 (28)表3-46T X ASKR EG寄存器 (29)表3-47T X ASKR EG位描述 (29)表3-48T X S EL R EG寄存器 (29)表3-52R X T HRESHOLD R EG寄存器 (30)表3-53R X T HRESHOLD R EG寄存器位描述 (30)表3-54D EMOD R EG寄存器 (30)表3-55D EMOD R EG位描述 (31)表3-56RFU寄存器 (31)表3-57RFUR EG位描述 (31)表3-58RFU寄存器 (31)表3-59RFUR EG位描述 (31)表3-60T X R EG寄存器 (31)表3-61T X R EG位描述 (32)表3-62R X R EG寄存器 (32)表3-63R X R EG位描述 (32)表3-64RFU寄存器 (32)表3-65RFUR EG位描述 (32)表3-66S ERIAL S PEED R EG寄存器 (32)表3-67S ERIAL S PEED R EG位描述 (32)表3-68RFU寄存器 (33)表3-69RFUR EG位描述 (33)表3-70CRCR ESULT R EG寄存器 (33)表3-71CRCR ESULT R EG位描述 (33)表3-72CRCR ESULT R EG寄存器 (33)表3-73CRCR ESULT R EG位描述 (33)表3-74RFU寄存器 (33)表3-75RFUR EG位描述 (34)表3-76M OD W IDTH R EG寄存器 (34)表3-77M OD W IDTH R EG位描述 (34)表3-78RFU寄存器 (34)表3-79RFUR EG位描述 (34)表3-80RFC FG R EG寄存器 (34)表3-81RFC FG R EG位描述 (35)表3-82G S NR EG寄存器 (35)表3-83G S NR EG位描述 (35)表3-84CWG S PR EG寄存器 (35)表3-85CWG S PR EG位描述 (35)表3-86M OD G S PR EG寄存器 (35)表3-87M OD G S PR EG位描述 (36)表3-88TM ODE R EG寄存器 (36)表3-89TM ODE R EG位描述 (36)表3-90TP RESCALER R EG寄存器 (37)表3-91TP RESCALER R EG位描述 (37)表3-92TR ELOAD H I R EG寄存器 (37)表3-93TR ELOAD H I R EG位描述 (37)表3-94TR ELOAD L O R EG寄存器 (37)表3-95TR ELOAD L O R EG位描述 (37)表3-96TC OUNTER V AL H I R EG寄存器 (37)表3-97TC OUNTER V AL H I R EG位描述 (38)表3-98TC OUNTER V AL L O R EG寄存器 (38)表3-99TC OUNTER V AL L O R EG位描述 (38)表3-100RFU寄存器 (38)表3-101RFUR EG位描述 (38)表3-102T EST S EL1R EG寄存器 (38)表3-103T EST S EL1R EG位描述 (38)表3-107T EST P IN E N R EG位描述 (39)表3-108T EST P IN V ALUE R EG寄存器 (39)表3-109T EST P IN V ALUE R EG位描述 (40)表3-110T EST B US R EG寄存器 (40)表3-111T EST B US R EG位描述 (40)表3-112T EST C TRL R EG寄存器 (40)表3-113T EST C TRL R EG位描述 (40)表3-114V ERSION R EG寄存器 (40)表3-115V ERSION R EG位描述 (41)表3-116A NOLOG T EST R EG寄存器 (41)表3-117A NOLOG T EST R EG位描述 (41)表3-118T EST DAC1R EG寄存器 (41)表3-119T EST DAC1R EG位描述 (42)表3-120T EST DAC2R EG寄存器 (42)表3-121T EST DAC2R EG位描述 (42)表3-122T EST ADCR EG寄存器 (42)表3-123T EST ADCR EG位描述 (42)表3-124RFTR EG寄存器 (42)表3-125RFTR EG位描述 (43)表3-126RFTR EG寄存器 (43)表3-127RFTR EG位描述 (43)表3-128RFTR EG寄存器 (43)表3-129RFTR EG位描述 (43)表3-130RFTR EG寄存器 (43)表3-131RFTR EG位描述 (43)表3-132H PD C TRL寄存器 (43)表3-133H PD C TRL位描述 (44)表3-134U SE R ET寄存器 (44)表3-135U SE R ET位描述 (44)表3-136LVD CTRL寄存器 (44)表3-137LVD CTRL位描述 (44)表4-1不同接口类型的连接标准 (45)表4-2MOSI和MISO的字节顺序 (45)表4-3MOSI和MISO字节顺序 (45)表4-4地址字节格式 (46)表4-5BR_T0和BR_T1设置 (46)表4-6UART传输波特率选择 (46)表4-7UART帧格式 (47)表4-8UART读数据字节顺序 (47)表4-9写入数据字节顺序 (47)表4-10地址字节 (48)表4-11I2C地址对应引脚 (51)表4-12扩展寄存器字节定义 (53)表5-1TX1引脚相关控制信号和设置 (55)表5-2TX2引脚相关控制信号和设置 (56)表6-1CRC协处理器参 (57)表8-1中断源 (59)表10-1HPD模式保持寄存器列表 (62)表14-1指令概述 (66)表15-1测试信号路径选择（T EST S EL2R EG =07H） (69)表15-2测试信号描述 (69)表15-3测试信号路径选择（T EST S EL2R EG =0D H） (69)表15-5测试信号路径选择（T EST S EL2R EG =19H） (69)表15-6测试信号描述 (69)表15-7测试信号描述 (70)表17-1FM17522E极限额定参数 (72)表17-2FM17522E推荐工作条件 (72)表17-3SPI交流参数 (73)表17-4I2C交流参数 (74)图目录图1-1FM17522E结构框图 (12)图1-2FM17522E QFN32封装引脚图（TOP VIEW） (13)图2-1FM17522E应用框图 (15)图2-2PCD标准帧格式 (15)图2-3PICC标准帧格式 (16)图4-1UART读取数据时序图 (47)图4-2UART写入数据时序图 (48)图4-3I2C总线接口 (48)图4-4I2C总线上的位传输 (49)图4-5START和STOP状态 (49)图4-6I2C总线上的ACKNOWLEDGE信号 (50)图4-7I2C总线上的数据传输 (50)图4-8START过程后的第一位字节 (50)图4-9寄存器读/写访问 (51)图4-10I2C总线HS模式协议转换 (52)图4-11I2C总线HS模式协议帧格式 (53)图4-12写扩展寄存器操作流程 (54)图4-13读扩展寄存器操作流程 (54)图5-1TX1和TX2间串行数据转换 (56)图12-1石英晶体连接 (64)图13-1振荡器启动时间 (65)图16-1典型应用图 (71)图17-1SPI时序图 (73)图17-2快速和标准模式下的I2C总线时序图 (74)图19-1FM17522E QFN32封装尺寸图 (76)1 产品综述1.1 产品简介FM17522E是一款高度集成的工作在13.56MHz下的非接触读写器芯片，支持符合ISO/IEC 14443TypeA协议的非接触读写器模式。
6832芯片参数
6832芯片参数6832芯片有两种，一种是FU6832，另一种是SD6832。
FU6832是一款双核芯片，包括8051内核和ME。
其指令周期大多为1T或2T，拥有16kB的Flash ROM，带CRC校验功能，支持程序自烧录和代码保护功能。
它还配备了256 bytes的IRAM和768 bytes的XRAM。
ME部分支持比例积分/微分器(PI/PID)、BLDC模块、FOC模块、MDU等计算功能。
此外，它还具有单周期1616位乘法器、16周期32 / 16位除法器、4级优先级中断、15个中断源等功能。
在GPIO方面，FU6832L有35个GPIO。
定时器方面，它有2个通用带抓捕功能可编程定时器、1个支持QEP解码编程定时器、1个BLDC电机专用定时器、1个通用定时器以及1个RTC定时器。
在通讯接口上，它有1个SPI、1个I2C、2个UART接口，其中UART2支持LIN Slave模式和Pin功能转移。
另外，它还有2通道DMA，支持用于I2C/SPI/UART数据传输。
在模拟外设方面，它有12位ADC，1uS转换时间，可选择内部VREF、外部VREF作参考电压。
ADC通道数为FU6832L的14通道，内置VREF参考，可配置3V、4V、、VDD5，内置VHALF(1/2 VREF)参考输出。
此外，它还有3个独立运算放大器，其中AMP0可配置为自动增益放大器。
SD6832是一款用于开关电源的内置高压MOSFET外置采样电阻的电流模式PWM+PFM控制器IC芯片。
其工作频率为25kHz\~67kHz，采用8脚双列直插式（8DIP）封装工艺。
请注意，不同型号的6832芯片可能具有不同的参数和特性。
如需了解更多信息，建议查阅芯片规格书或咨询芯片厂商。
CR6850中文版技术设计指导书
≅ 93mW ………………………………（1.4.2）
3
CR6850C 应用指导书
5、正常工作频率
CR6850C 允许设计者根据系统的使用环境需要自行调整系统的工作频率,其 PWM 频率为：50K－100K； CR6850C 的典型工作频率为 67KHz，其应用电路如图 1.6，RI 的取值决定了系统的工作频率，工作频率的设 定可分别由以下公式计算出来。
4、启动电阻RIN上最大损耗：
PRIN , MAX
(V =
DC , MAX
− VDD )
2
RIN
≅
2 VDC , MAX
RIN
……………………（1.4.1）
其中， VDC，MAX是最大输入整流后电压 对于一个通用输入（90Vac~264Vac），VDC，MAX=374V
PRIN , MAX =
3742 1.5 × 10
·AC/DC 电源适配器 ·电池充电器 ·开放式电源 ·备用开关电源 ·机顶盒开关电源 ·384X 代替 ·兼容：SG6848J&LD7535&OB2262&OB2263
芯片特征 芯片特征： 特征：
·低成本、极少的外围元件 ·PWM&PFM&CRM (周期复位模式)控制 ·低启动电流 (约 8µA)、低工作电流 (约 2mA) ·电流模式控制 ·欠压锁定(UVLO) ·内置同步斜坡补偿 ·PWM 频率外部可调 ·轻载工作无音频噪音 ·内置前沿消隐 ·在输入 90V~264V 的宽电压下可实现恒 ·定最大输出功率 ·周期电流限制 ·GATE 引脚驱动输出高电平钳位 16.8V
CR6850C 应用指导 应用指导书 指导书
摘要： 摘要：
本文主要介绍了 CR6850C 的特征和详细的工作 原理， 描述了一种采用 CR6850C 的反激式隔离 AC-DC 开关电源的简单而高效的设计方法。 VDD 引脚过压保护 25.5V SOT-23-6L，SOP8 ，DIP-8 无铅封装
BF6912AX规格书 SOP28
BYD Microelectronics Co., Ltd.
FDMF6820A;中文规格书,Datasheet资料
PHASE Switch node pin for bootstrap capacitor routing. Electrically shorted to VSWH pin. NC VIN
Switch node input. Provides return for high-side bootstrapped driver and acts as a sense point VSWH for the adaptive shoot-through protection. PGND GL THWN# DISB# PWM Power ground. Output stage ground. Source pin of the low-side MOSFET. For manufacturing test only. This pin must float; it must not be connected to any pin. Thermal warning flag, open collector output. When temperature exceeds the trip limit, the output is pulled LOW. THWN# does not disable the module. Output disable. When LOW, this pin disables the power MOSFET switching (GH and GL are held LOW). This pin has a 10µA internal pull-down current source. Do not add a noise filter capacitor. PWM signal input. This pin accepts a three-state 3.3V PWM signal from the controller.
CR6855 电源IC规格书
满足能源之星EPS 2.0版VI级能效标准
应用领域：
电池充电器 数码产品适配器
AC-DC电源适配器 PC、TV辅助电源 开放式电源
CR6855 电源管理 IC 深圳市振华凌云科技有限公司
一、芯片工作原理
1.功能概述：
CR6855是用于40W以内离线式开关电源IC，该IC具有优化的图腾驱动电路以及电流模式PWM控制器。PWM 控制器包含65KHz固定的频率振荡发生器以及各种保护。由振荡电路产生的频率抖动，可以改善EMI特性。 为了获得良好的效率和待机功耗，CR6855在重载或中等负载时，工作在PWM模式，频率为65KHz。当负载 逐渐减小时，振荡器的工作频率逐渐降低，最后稳定在22KHz左右。在空载和轻载时，电路采用间歇开关 模式，有效的降低了待机功耗，达到绿色节能的目的。CR6855具有很低的启动电流，若采用整流桥前启动， 可以使待机功耗降至100mW以内，满足能源之星EPS 2.0版VI级能效标准。为了提高系统的稳定性，防止 次谐波振荡，CR6855内置了同步斜坡补偿电路、内置恒定功率补偿电路,减小了在宽电压输入(85V~264V) 时最大输出功率的变化、内置的前沿消隐电路可以屏蔽开关管每次开启产生的干扰。CR6855内置了多种保 护功能：VDD 欠压保护(UVLO)、过压保护(OVP)及VDD电压钳位功能、过载保护（OLP）、外置可调过温保护 (OTP)、通过RT引脚实现可编程OVP功能，各种保护解除后均可自动恢复工作，以及输出驱动的高电平被嵌 位于12.5V以下。而驱动输出采用的图腾柱和软驱动,有效降低了开关噪声。 由于CR6855高度集成，使用外围元件较少。采用CR6855可简化反激式隔离AC-DC开关电源设计，从而使设 计者轻松的获得可靠的系统。
二、应用指导
28202;中文规格书,Datasheet资料
599 Menlo Drive, Suite 100Rocklin, California 95765, USAOffice: (916) 624-8333Fax: (916) 624-8003General: info@Technical: support@Web Site: Educational: Gripper Kit for the Boe-Bot® Robot (#28202)The Gripper KitThis kit allows your Parallax Boe-Bot® Robot to pick up objects. TheBoe-Bot robot (#28132 serial or #28832 USB) is sold separately.Before getting started, take an inventory of the parts in your kit. UseFig #1 to identify each part to the parts list. Once you haveinventoried your kit, proceed to Step #1.11423456791011121315161783Recommended Tools•Small needle nosed pliers•Phillips #2 point screwdriver•Small flat-blade screwdriver• A sharp-tipped hobby knife,such as an X-Acto® knife-OR-A hand drill with 5/64″ bitWARNING!DO NOT use electricscrewdrivers with this kit. Pleaseassemble using hand tools onlyto avoid damaging your Gripper.Step #1: SpacersItem Qty Description 4 (2) Gripper link 5 (2) #4 x 1" spacer• Insert spacers into plastic Gripper links. • Use Fig #2 as a guide to install the spacers. Whendone, the pieces will appear as shown in Fig #3.Fig #2Fig #3Step #2: Gripper LinksItem Qty Description6 (1) Gripper plate7 (2) 4-40 x 1.25" pan head screw8 (2) 4-40 Hex Nut•Be sure the angled portions on top of the plastic links match the angles on top of the Gripper as shown in Fig #5.• Move links and spacers into the Gripper plate, thensecure with 4-40 screws and nuts as shown in Fig #4. • Tighten securely.• Before continuing, double check your work to ensurethat the pieces are angled as in Fig #5.Fig #4 Fig #5Step #3: Foam TapeItem Qty Description14 (4) foam tape• Cut four pieces of foam tape, each 2 inches long. •Apply foam tape to the Gripper plate as shown in Fig #7.This completes the left-side Gripper sub-assembly.Fig #6Fig #7Step #4: Second Gripper Sub-assemblyItem Qty Description4 (2) Gripper link5 (2) #4 x 1" spacer6 (1) Gripper plate7 (2) 4-40 x 1.25" pan head screw8 (2) 4-40 hex nut 14 (4) foam tape• Repeat Steps #1 through #3 to build the right-sideGripper sub-assembly in a similar fashion.• Be sure the angled portions of the links match with theGrippers face to face. Position the pieces exactly as they appear in Fig #8.• Double check your work, then proceed to Step #5.Fig #8•Assemble the Gripper sub-assemblies to the upperand lower linkage plates as shown in Fig #9. In turn, insert each plastic link, a spacer, and secure with 4-40 screws and nuts.• When all four plastic links are installed, tighten securely.•Double check your work against Fig #10. Note that the hinge tabs on the bottom plate face up, while hinge tabs on top plate face down.Step #5: Linkage PlatesItem Qty Description3 (2) linkage plate 5 (4)#4 x 1" spacer 7(4) 4-40 x 1.25" pan head screw 8 (4) 4-40 hex nutStep #6: Control ArmsItem Qty Description 10 (2) control arm 15 (4) 4-40 x ¼" pan head screw• Attach control arms with 4-40 x ¼" screws as shown in Fig #11.•Final assembly must match Fig #12. Double check your work, then proceed to Step #7.Fig #11Fig #12Step #7: E-Z ConnectorsItem Qty Description 13 (2) Brass 0.072 E-Z Connector• Follow the directions on the package to install the E/Z Connector into the control arms. Use the nylon washers, but set the screws aside for now.• Check your work; your final assembly should match Fig #13.Fig #13Step #8: Install Gripper Hinge PlateItem Qty Description1 (1) hinge mount 15 (3) 4-40 x ¼" pan head screw 8 (3) 4-40 hex nutNote: It is recommended that the servos and tires on the Boe-Bot be installed with the wheels biased toward the front of the unit as shown below. This will prevent the Boe-Bot from tipping when it picks up objects.• Attach hinge mount to the Boe-Bot with the 4-40 x ¼" screws and nuts as shown in Fig #14 and Fig #15. • Double check your work against Fig #16.Fig #14 Top ViewFig #15 Bottom ViewFig #16Assembled ViewStep #9: Position Gripper on Boe-BotItem Qty Description(1) Gripper assembly (1) Boe-Bot robot• Remove one wheel to allow for dowel pin installation in the next step, Step #10.• Position the Gripper assembly onto the hinge mount as shown in Fig #17 below.•Place the top hinge tabs over the tabs on the hinge mount so the top of the Gripper stays on the hinge mount.Fig #17Step #10: Insert Dowel Pin Item Qty Description2 (1) dowelpin• Insert dowel pin.•If dowel pin slips in very easily, use needle nose pliers to slightly crimp the center of the hinge plate.• Replace wheel.Fig #18Fig #19Fig #21Step #12: Servo BracketsItem Qty Description16 (2) servo brackets 17 (4) 4-40 x 3/8" pan head screw 8 (4) 4-40 hex nut 11 (1) Parallax Standard Serv o• Attach servo brackets to servo with 4-40 screws and nuts. Make sure the metal brackets are placed below the plastic servo tabs as shown in Fig #22.•The final assembly should match Fig #23. Double check your work, then proceed to Step #13.Note: Only one arm of the servo horn is shown for clarity.Fig #22Fig #23Step #13: Bend Actuator RodItem Qty Description 12 (1) actuator rod•Using the needle nose pliers, bend actuator rod at mid-point. Then bend as shown in Fig #24.Fig #24Step #14: Install Actuator Rod Item Qty Description12 (1) actuatorrod11 (1) Parallax Standard Servo•Thread bent rod through servo horn as shown in Fig #25.Fig #25分销商库存信息: PARALLAX 28202。
双键电容式触控芯片XC2862 Datasheet
双通道电容式触摸键控制芯片XC2862目录1概述 (3)1.1 特性 (3)1.2 系统框图 (4)2管脚定义 (5)3功能描述 (6)4电气特性 (7)5关键特性 (8)5.1 环境自适应能力 (8)5.1.1环境漂移跟随 (8)5.1.2环境突变校准 (8)5.2 接近检测 (8)6用户设置 (9)灵敏度设置 (9)7应用指南 (10)7.1 触摸键 (10)7.2 接近检测 (11)8PCB设计 (12)8.1 触摸键设计 (12)8.1.1触摸键 (12)8.1.2触摸键的常用结构 (12)8.1.3触摸键设计 (13)8.2 PCB布线 (13)9封装 (14)1概述XC2862是一款支持宽工作电压范围的双输入双输出电容式触摸键控制芯片。
XC2862内部集成高分辨率触摸检测模块和专用信号处理电路，以保证芯片对环境变化具有灵敏的自动识别和跟踪功能，且内置特殊算法以实现防水、抗干扰等需求。
该芯片可满足用户在复杂应用中对稳定性、灵敏度、功耗、响应速度、防水、带水操作、抗震动、抗电磁干扰等方面的高体验要求。
XC2862为方便用户在应用中可对触摸键的灵敏度进行自主控制，特设置了灵敏度控制位。
用户只需在PCB设计中对这个管脚的逻辑电平值进行设置，就能自由选择在具体应用中芯片体现出的检测灵敏度。
XC2862还内置了上电复位及电源保护电路，在典型应用中可无需任何外部器件，也无需软件、程序或参数烧录。
芯片应用的开发过程非常简单，最大限度的降低了方案成本。
XC2862可广泛适用于遥控器、灯具调光、各类开关以及小家电和家用电器控制界面等应用中。
1.1特性工作电压：2.5V~5.5V两个高灵敏度的触摸检测通道无需进行参数烧录2级灵敏度可调（通过设置一位管脚的逻辑电平实现）响应速度快抗电磁干扰能力强防水及带水操作功能接近检测功能独特的环境跟踪和自适应能力低功耗（典型工作电流< 25uA）内置上电复位（POR）和电源保护电路CMOS电平输出1.2系统框图XC2862包含PMU和Touch Key Core两个部分，其系统框图如图1所示。
AD9952 Evaluation Board Datasheet说明书
功能框图图1.DC/PHASE CORRECTION DC/PHASE CORRECTIONC SS C L KS D I OSERIAL PORT INTERFACE15141323892325262838VPOS_3P3DECL1TO DECL4211119303136273340101VPOS_5VLDO VCOLDO 2.5VRFIN0RFIN12922POLYPHASE FILTERLOIN–REFINLOIN+I+I–Q–Q+QUAD DIVIDERPLL343935547611990-001Rev. ADocument FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However , no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Speci cations subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2013–2014 Analog Devices, Inc. All rights reserved. Technical Support 695 MHz 至2700 MHz 正交解调器，集成小数N 分频PLL 和VCOADRF6820产品特性集成小数N 分频PLL 的I/Q 解调器RF 输入频率范围：695 MHz 至2700 MHz 内部LO 频率范围：356.25 MHz 至2850 MHz 输入P1dB ：14.5 dBm (1900 MHz RF) 输入IP3：35 dBm (1900 MHz RF) 可编程HD3/IP3调整单刀双掷(SPDT) RF 输入开关RF 数字步进衰减范围：0 dB 至15 dB集成式RF 可调谐巴伦，支持单端50 Ω输入 多核集成式VCO解调1 dB 带宽：600 MHz 4个可选基带增益和带宽模式数字可编程LO 相位失调和直流零点可通过三线式串行端口接口(SPI)进行编程 40引脚、6 mm x 6 mm LFCSP 封装应用蜂窝W-CDMA/GSM/LTE 数字预失真(DPD)接收器 微波点对点无线电概述ADRF6820是一款高度集成的解调器和频率合成器，非常适合用于下一代通信系统中。
CR6850 英文全
TL
TSTG
RECOMMENDED OPERATION CONDITION
Symbol VDD RI TOA PO FPWM Parameter VDD Supply Voltage RI PIN Resistor Value Operation Ambient Temperature Output Power Frequency of PWM Min ~ Max 11~20 65~130 -20~85 0~60 50~100 Unit V K ohm ℃ W kHz
Jul, 2008
V2.0
2/12
Chengdu Chip-Rail Tech.Co.Ltd.
CR6850C
Block Diagram
Simplified Internal Circuit Architecture
Absolute Maximum Ratings
VDD Operation Current VS Temperature
PWM frequency VS Temperature
VDD (ON) VS Temperature Duty cycle VS Temperature
Jul, 2008 5/12
V2.0
Chengdu
Jul, 2008
V2.0
3/12
Chengdu Chip-Rail Tech.Co.Ltd.
CR6850C
Electrical Characteristics (Ta=25°C unless otherwise noted, VDD = 15V.)
Symbol Parameter Conditions Min. Typ. Max. Unit Supply Voltage (VDD Pin) IST Startup Current VFB=0V ISS Operating Current VFB=3V VFB=Open VDDON VDDOFF VDCLAMP Turn-on Threshold Voltage Turn-off Threshold Voltage VDD Clamp Voltage IVDD=20mA 8 2.9 1.9 1.44 15.3 9.8 25.5 µA mA mA mA V V V
DN6852-A资料
Note) This IC is not suitable for car electrical equipment.
■ Recommended Operating Range
Parameter Supply voltage Symbol VCC Range 3.6 to 16 Unit V
■ Electrical Characteristics at Ta = 25°C
Magnetic flux density B
2
SPC00006CEB
DN6852
■ Caution on Use of Hall ICs
The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix the package with adhesives or fix it on a dedicated case. 1. A case using an adhesive Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes the aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection. If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those manufacturers before using. We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive. 2. A case bending lead wire Bend the lead wire without stressing the package.
CR6850民展微低功耗电源IC
4 6
C7 C8
C9 D6
D4 D3 C1
FB
D5
U2
FB 4 3
J1 R5
8 7 6 5
U1
GND FB NC R I GATE VDD NC SENSE 1 2 3 4
R4 R6
R15 C10
12V+
Q1
R11
R16 R18 R19
1
R3
R10
C4
U3
2
R17
图 3.1 CR6850C 典型电路原理图（通用输入）
2 VMIN = 2 × VACMIN
1 2 × PO × − tC 2 × fL − η × CIN
； 其中，fL 为输入交流电压频率（50Hz/60Hz） tC 为桥式整流大额导通时间，如无数据可供参考，则取 3ms；
集成、绿色、创新、超越
-2-
©西安民展微电子有限公司
CR6850C 设计指南
表3.1 基于CR6850C的12V5A适配器元器件清单
Designator C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 CX1 CY1 B1 D1 D2 D3 D4 D5 D6 R1 R2 R3 R4 R5 R6
Description C/C;DIP;+/-10%;Pintch=100mil C/E;Ф18*32;105℃;+/-20%;nichicon C/C;DIP;+/-10%;Pintch=200mil; CBB C/E;Ф5*11;105℃;+/-20%;panasonic C/C;SMD;+/-10%;1206 C/C;SMD;+/-10%;1206 C/E;Ф10*20;105℃;+/-20%;Pintch=200mil;panasonic C/E;Ф10*20;105℃;+/-20%;Pintch=200mil;panasonic C/E;Ф10*20;105℃;+/-20%;Pintch=200mil;panasonic C/C;DIP;+/-10%;Pintch=200mil;63V C/X1;+/-20%;275V;Pintch=600mil;DAIN C/Y1;+/-20%;Pintch=400mil; BRIGE;4A;600V Schottky Barrier Rectifiers;20A;100V;TO220 Schottky Barrier Rectifiers;20A;100V;TO220 DIODE;150mA;100V;1206; Fast Recovery DIODE; 1A;1000V;Fast Recovery;DO-41 DIODE; Fast Recovery; 1A;>150V; DO-41 GREEN;Ф3mm RES;SMD;1206;+/-5% RES;SMD;1206;+/-5% RES;MOF;+/-3%,1/4W RES;SMD;1206;+/-5% RES;SMD;1206;+/-5% RES;SMD;1206;+/-5%
AU6850CE_datasheet_v01
Shanghai Mountain View Silicon Technology Co Ltd
ii
MVSILICON
AU6850CE USB HOST MP3 DECODER SOC
Revision History
Data Revision v1.0 Description initial
Shanghai Mountain View Silicon Technology Co Ltd
iv
MVSILICON
AU6850CE USB HOST MP3 DECODER SOC
Figures
Figure 1 AU6850CE Functional Block Diagram ............................................................. 2 Figure 2 Mini Audio System ............................................................................................. 3 Figure 3 Package Diagram (SOP28 / TOP View)............................................................ 5 Figure 4 SOP28 Package Dimension Parameter .............................................................. 6
Shanghai Mountain View Silicon Technology Co Ltd
rn6854规格书
RN6854规格书1. 项目背景RN6854是一份规格书，旨在详细说明某个产品的规格要求，以便开发团队能够根据这些要求进行产品的设计和开发工作。
本规格书的编写是为了确保产品能够满足客户的需求，并提供给相关利益相关者参考。
2. 产品概述RN6854是一款新型电子设备，主要用于解决特定问题。
该设备具有以下特点： -高性能处理器：采用先进的处理器技术，能够快速运行复杂的算法和应用程序。
- 大容量存储：内置大容量存储器，可以存储大量数据和文件。
- 高清显示屏：配备高清显示屏，能够提供清晰、逼真的图像和视频显示效果。
- 多功能接口：支持多种数据接口，方便用户连接外部设备和传输数据。
- 长续航时间：采用高效能源管理技术，能够提供较长的续航时间。
- 安全可靠：具备完善的安全机制，保护用户的隐私和数据安全。
3. 技术规格3.1 处理器RN6854采用先进的处理器技术，具备以下性能特点： - 主频：2.5 GHz - 核心数：8核 - 缓存：12 MB - 架构：64位3.2 存储RN6854内置大容量存储器，提供以下存储选项： - 内存容量：8 GB / 16 GB /32 GB - 存储类型：固态存储器（SSD） - 扩展存储：支持MicroSD卡，最大支持128 GB3.3 显示屏RN6854配备高清显示屏，具备以下特性： - 尺寸：15.6英寸 - 分辨率：1920 x 1080 - 屏幕比例：16:9 - 技术：LED背光 - 触控：支持多点触控3.4 接口RN6854提供多种接口，方便用户连接外部设备和传输数据： - USB接口：2个USB 3.0接口，1个USB 2.0接口 - HDMI接口：1个HDMI输出接口 - 以太网接口：1个千兆以太网接口 - 无线接口：802.11ac Wi-Fi，蓝牙5.03.5 电池RN6854采用高效能源管理技术，能够提供较长的续航时间： - 电池容量：60 Wh- 续航时间：最长可达8小时3.6 安全性RN6854具备完善的安全机制，保护用户的隐私和数据安全： - 生物识别：支持指纹识别技术，确保只有授权用户可以访问设备。
6842 DATASHEET
EDP-05标题CR6842控制12V/36W 输出反激式开关电源工程测试报告规格输入电压：85－265VAC ；输出电压：12VDC ；功率：36W应用笔记本电源适配器，开放式开关电源。
文件编号EDP-05 日期 2008-11 版本1.0特点：◆ 绿色模式控制 ◆低启动电流（8uA ） ◆低工作电流 （4mA ）◆带抖动消除的可编程PWM 频率 ◆恒功率输出限制（在输入AC 变化） ◆过温 过压锁死保护功能 ◆ 低待机功耗，≤ 0.7W ◆ 空载输入功耗低 ◆ 效率高，≥%80Tel:852 - 2348 8233 Fax: 852 - 2348 8030 E-mail: sales@目 录1 概述...................................................3 2 规格说明...............................................4 3 原理图及说明...........................................4 4 PCB 布局图..............................................7 5 器件清单...............................................7 6 变压器说...............................................9 6.1 原理图及结构图 (9)6.2 材料说明.........................................10 6.3 绕线方法.........................................10 7 测试结果..............................................11 8 性能曲线. (11)8.1 )(O P η曲线.........................................11 8.2 空载输入功率曲线.................................12 9 测试波形. (13)9.1 漏极电压、电流波形...............................13 9.2 输出纹波波形.....................................15 9.3 启动/关闭输出电压波形............................16 10 测试设备 (18)1 概述CR6842是一款高性能的电流模式PWM控制芯片，被广泛应用于功率低于60W宽范围输入（85－265VAC）的单端反激式开关电源。
OB2268C_DataSheet
OB2268CCurrent Mode PWM ControllerGENERAL DESCRIPTIONOB2268C is a highly integrated current mode PWM control IC optimized for high performance, low standby power and cost effective offline flyback converter applications.PWM switching frequency at normal operation is externally programmable and trimmed to tight range. At no load or light load condition, the IC operates in extended ‘burst mode’ to minimize switching loss. Lower standby power and higher conversion efficiency is thus achieved. VDD low startup current and low operating current contribute to a reliable power on startup design with OB2268C. A large value resistor could thus be usedin the startup circuit to minimize the standby power.The internal slope compensation improves systemlarge signal stability and reduces the possible sub-harmonic oscillation at high PWM duty cycle output.Leading-edge blanking on current sense inputremoves the signal glitch due to snubber circuit diodereverse recovery. This greatly helps to reduce theexternal component count and system cost inapplication.OB2268C offers complete protection coverage withautomatic self-recovery feature including Cycle-by-Cycle current limiting (OCP), over load protection(OLP), over temperature protection (OTP), VDDover voltage protection (OVP) and under voltagelockout (UVLO). The Gate-drive output is clampedat 18V to protect the power MOSFET.In OB2268C, OCP threshold slope is internally optimized to reach constant output power limit over universal AC input range. Excellent EMI performance is achieved with soft switching control at the totem pole gate drive output. The tone energy at below 20KHZ is minimized in operation. Consequently, audio noise performance is greatly improved.OB2268C is offered in both SOP-8 and DIP-8 packages.FEATURES■ Extended Burst Mode Control For Improved Efficiency and Minimum Standby Power Design ■ Audio Noise Free Operation■ External Programmable PWM Switching Frequency■ Internal Synchronized Slope Compensation■ Low VIN/VDD Startup Current(6.5uA) and LowOperating Current (2.3mA) ■ Leading Edge Blanking on Current Sense Input ■ Complete Protection Coverage With Auto Self-Recovery o External Programmable Over Temperature Protection (OTP) o With or Without Built in VDD OVP for System OVP o Under Voltage Lockout with Hysteresis (UVLO) o Gate Output Maximum Voltage Clamp (18V) o Line Compensated Cycle-by-Cycle Over-current Threshold Setting For Constant Output Current Limiting Over Universal Input Voltage Range (OCP) o Over Load Protection. (OLP) APPLICATIONSOffline AC/DC flyback converter for ■ Laptop Power Adaptor■ PC/TV/Set-Top Box Power Supplies ■ Open-frame SMPS■ Battery ChargerTYPICAL APPLICATIONO n -B ri gh tCo nf id en ti alt oBo na F i d e (贝纳化电)OB2268CCurrent Mode PWM ControllerGENERAL INFORMATIONPin ConfigurationThe OB2268C is offered in DIP and SOP packages shown as below.Ordering InformationPart Number Description OB2268CAP DIP8, Pb-freeOB2268CAPV DIP8, Pb-free and No OVP OB2268CCP SOP8, Pb-freeOB2268CCPV SOP8, Pb-free and No OVPPackage Dissipation RatingPackageR θJA (°C/W) DIP8 90SOP8150Absolute Maximum RatingsParameter Value VDD/VIN DC Supply Voltage 30 V VDD Clamp Voltage 35 V VDD Clamp Continuous Current10 mA V FB Input Voltage -0.3 to 7V V SENSE Input Voltage to Sense Pin-0.3 to 7V V RT Input Voltage to RT Pin -0.3 to 7V V RI Input Voltage to RI Pin -0.3 to 7V Min/Max Operating Junction Temperature T J-20 to 150 o C Min/Max Storage Temperature T stg-55 to 150 o C Lead Temperature (Soldering, 10secs)260 o C Note: Stresses beyond those listed under “absolute maximumratings” may cause permanent damage to the device. These are stress ratings only, functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.O n -B ri gh tCo nf id en ti alt oBo na F i d e (贝纳化电)OB2268CCurrent Mode PWM ControllerMarking InformationTERMINAL ASSIGNMENTSPin Num Pin Name I/O Description 1 GND P Ground 2 FB I Feedback input pin. PWM duty cycle is determined by voltage level into thispin and current-sense signal level at Pin 6.3 VIN I Connected through a large value resistor to rectified line input for Startup ICsupply and line voltage sensing.4 RI I Internal Oscillator frequency setting pin. A resistor connected between RIand GND sets the PWM frequency.5 RT I Temperature sensing input pin. Connected through a NTC resistor to GND.6 SENSE I Current sense input pin. Connected to MOSFET current sensing resistornode.7 VDD P DC power supply pin. 8 GATE O Totem-pole gate drive output for power MOSFET.O n -B ri gh tCo nf id en ti alt oBo naF i d e (贝纳化电)BLOCK DIAGRAMRECOMMENDED OPERATING CONDITIONSymbol Parameter ValueUnit VDD VDD Supply Voltage 12 to 23 V RI RI Resistor Value 24Kohm T A Operating Ambient Temperature-20 to 85o CO n -B r i gh tCo nf id en ti alt oBo na F i d e (贝纳化电)ESD INFORMATIONSymbol Parameter Test Conditions Min Typ Max Unit HBM Note Human Body Modelon All Pins Except VIN and VDDMIL-STD 3 KV MM Machine Model onAll PinsJEDEC-STD250 VNote: HBM all pins pass 3KV except High Voltage Input pin. The details are VIN passes 1kV, VDD passes 1.5KV, all other I/Os pass 3KV.In system application, High Voltage Input pin is either a high impedance input or connected to a cap. The lower rating has minimum impacts on system ESD performance.ELECTRICAL CHARACTERISTICS(T A = 25O C, VDD=16V, RI=24Kohm if not otherwise noted)Symbol Parameter Test Conditions Min Typ Max Unit Supply Voltage (VDD) I_VDD_Startup VDD Start up Current VDD =15V, Measure current into VDD6.5 20 uAI_VDD_Operation Operation Current V FB =3V 2.3 mAUVLO(Enter) VDD Under Voltage Lockout Enter9.510.5 11.5 V UVLO(Exit) VDD Under Voltage Lockout Exit (Startup)15.5 16.5 17.5 VOVP(ON)*OptionalVDD Over Voltage Protection Enter23.5 25 26.5 VOVP(OFF)*OptionalVDD Over Voltage Protection Exit (Recovery)21.5 23 24.5 VOVP_Hys *OptionalOVP Hysteresis OVP(ON)-OVP(OFF) 2 V T D _OVP VDD OVP Debounce time80 uSecV DD _Clamp V DD Zener Clamp VoltageI(V DD ) = 5 mA 35 VFeedback Input Section(FB Pin)A VCS PWM Input Gain ΔV FB /ΔV cs2.8 V/V V FB_Open V FB Open Voltage 5.9VI FB _Short FB pin short circuit current Short FB pin to GND, measure current0.80 mAV TH _0D Zero Duty Cycle FB Threshold Voltage0.95 VV TH _BM Burst Mode FB Threshold Voltage1.7 VV TH _PL Power Limiting FB Threshold Voltage4.4 VT D _PL Power limiting Debounce Time80 mSecZ FB _IN Input Impedance 7.2 Kohm Current Sense Input(Sense Pin) T_blanking Sense Input 250 nS O n -B ri gh tCo nf id en ti alt oBo na F i d e (贝纳化电)Leading Edge Blanking TimeZ SENSE _IN Sense Input Impedance30 KohmT D _OC Over Current Detection and Control DelayCL=1nf at GATE, 120 nSecV TH _OC_0 Current Limiting Threshold at NoCompensationI(VIN) = 0uA 0.85 0.90 0.95 V V TH _OC_1 Current LimitingThreshold atCompensationI(VIN) = 150uA 0.81 V Oscillator F OSC Normal Oscillation Frequency61 65 69 KHZ∆f_TempFrequency Temperature Stability-20o C to 100 o C 2 % ∆f_VDDFrequency Voltage StabilityVDD = 12-25V 2 % RI_range Operating RI Range 12 24 60 Kohm V_RI_open RI open voltage 2.0 V F_BM Burst Mode Base Frequency22 KHZDC_max Maxmum Duty Cycle75 80 85 %DC_min Minimum Duty Cycle- - 0 %Gate Drive Output VOL Output Low Level Io = -20 mA 0.3 V VOH Output High Level Io = +20 mA 11 V VG_Clamp Output Clamp Voltage LevelVDD =20V 18 VT_r Output Rising Time CL = 1nf 120 nSec T_f Output Falling TimeCL = 1nf 50 nSecOver Temperature Protection I_RT Output Current of RT pin70 uAV TH _OTP OTP Threshold Voltage1.015 1.065 1.115 VV TH _OTP_off OTP Recovery Threshold Voltage1.165 VT D _OTP OTP De-bounce Time100 uSecV_RT_Open RT Pin Open Voltage3.5 VO n -B ri gh tCo nf id en ti alt oBo na F i d e (贝纳化电)CHARACTERIZATION PLOTSOn-idFi)O n -B ri gh tCo nf id en ti a()OPERATION DESCRIPTIONThe OB2268C is a highly integrated PWM controller IC optimized for offline flyback converter applications. The extended burst mode control greatly reduces the standby power consumption and helps the design easily meet the international power conservation requirements.z Startup Current and Start up ControlStartup current of OB2268C is designed to be very low so that VDD could be charged up above UVLO(exit) threshold level and device starts up quickly. A large value startup resistor can therefore be used to minimize the power loss yet reliable startup in application. For a typical AC/DC adaptor with universal input range design, a 2 M Ω, 1/8 W startup resistor could be used together with a VDD capacitor to provide a fast startup and yet low power dissipation design solution.z Operating CurrentThe Operating current of OB2268C is low at 2.3mA. Good efficiency is achieved with OB2268C low operating current together with extended burst mode control schemes.z Burst Mode OperationAt zero load or light load condition, most of the power dissipation in a switching mode power supply is from switching loss on the MOSFET transistor, the core loss of the transformer and the loss on the snubber circuit. The magnitude of power loss is in proportion to the number of switching events within a fixed period of time. Reducing switching events leads to the reduction on the power loss and thus conserves the energy. OB2268C self adjusts the switching mode according to the loading condition. At from no load to light/medium load condition, the FB input drops below burst mode threshold level (1.8V). Device enters Burst Mode control. The Gate drive output switches only when VDD voltage drops below a preset level and FB input is active to output an on state. Otherwise the gate drive remains at off state to minimize the switching loss thus reduce the standby power consumption to the greatest extend. The nature of high frequency switching also reduces the audio noise at any loading conditions.z Oscillator OperationA resistor connected between RI and GND sets the constant current source to charge/discharge the internal cap and thus the PWM oscillator frequency is determined. The relationship between RI and switching frequency follows the below equationwithin the specified RI in Kohm range at nominal loading operational condition.)()(1560Khz Kohm RI F OSC =z Current Sensing and Leading EdgeBlankingCycle-by-Cycle current limiting is offered in OB2268C current mode PWM controller. The switch current is detected by a sense resistor into the sense pin. An internal leading edge blanking circuit chops off the sense voltage spike at initial MOSFET on state due to snubber diode reverse recovery so that the external RC filtering on sense input is no longer required. The current limit comparator is disabled and thus cannot turn off the external MOSFET during the blanking period. PWM duty cycle is determined by the current sense input voltage and the FB input voltage.z Internal Synchronized Slope Compensation Built-in slope compensation circuit adds voltage ramp onto the current sense input voltage for PWM generation. This greatly improves the close loop stability at CCM and prevents the sub-harmonic oscillation and thus reduces the output ripple voltage.z Over Temperature ProtectionA NTC resistor in series with a regular resistor should connect between RT and GND for temperature sensing and protection. NTC resistor value becomes lower when the ambient temperature rises. With the fixed internal current I RT flowing through the resistors, the voltage at RT pin becomes lower at high temperature. The internal OTP circuit is triggered and shutdown the MOSFET when the sensed input voltage is lower than V TH _OTP.z Gate DriveOB2268C Gate is connected to the Gate of an external MOSFET for power switch control. Too weak the gate drive strength results in higher conduction and switch loss of MOSFET while too strong gate drive output compromises the EMI.Good tradeoff is achieved through the built-in totem pole gate drive design with right output strength and dead time control. The low idle loss and good EMI system design is easier to achieve with this dedicated control scheme. An internal 18V clamp is added for MOSFET gate protection at higher than expected VDD input.O n -B ri gh tCo nf id en ti alt oBo na F i d e (贝纳化电)z Protection ControlsGood system reliability is achieved with OB2268C’s rich protection features including Cycle-by-Cycle current limiting (OCP), Over Load Protection (OLP), over temperature protection (OTP), on-chip VDD over voltage protection (OVP, optional) and under voltage lockout (UVLO).The OCP threshold value is self adjusted lower at higher current into VIN pin. This OCP threshold slope adjustment helps to compensate the increased output power limit at higher AC voltage caused by inherent Over-Current sensing and control delay. A constant output power limit is achieved withrecommended OCP compensation scheme on OB2268C.At output overload condition, FB voltage is biased higher. When FB input exceeds power limit threshold value for more than 80mS, control circuit reacts to turnoff the power MOSFET.Similarly, control circuit shutdowns the power MOSFET when an Over Temperature condition is detected. OB2268C resumes the operation when temperature drops below the hysteresis value.VDD is supplied with transformer auxiliary winding output. It is clamped when VDD is higher than 35V. MOSFET is shut down when VDD drops below UVLO(enter) limit and device enters power on start-up sequence thereafter.O n -B ri gh tCo nf id en ti alt oBo na F i d e (贝纳化电)PACKAGE MECHANICAL DATA8-Pin Plastic DIPO n -B ri gh tCo nf id en ti alt oBo na F i d e (贝纳化电)8-Pin Plastic SOPO n -B r i g h tC o n f i d e n t i a l t o B o na F i d e (贝纳化电)IMPORTANT NOTICERIGHT TO MAKE CHANGESOn-Bright Electronics Corp. reserves the right to make corrections, modifications, enhancements, improvements and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.WARRANTY INFORMATIONOn-Bright Electronics Corp. warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with its standard warranty. Testing and other quality control techniques are used to the extent it deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.On-Bright Electronics Corp. assumes no liability for application assistance or customer product design. Customers are responsible for their products and applications using On-Bright’s components, data sheet and application notes. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.LIFE SUPPORTOn-Bright Electronics Corp.’s products are not designed to be used as components in devices intended to support or sustain human life. On-bright Electronics Corp. will not be held liable for any damages or claims resulting from the use of its products in medical applications.MILITARYOn-Bright Electronics Corp.’s products are not designed for use in military applications. On-Bright Electronics Corp. will not be held liable for any damages or claims resulting from the use of its products in military applications.O n -B ri gh tCo nf id en ti alt oBo na F i d e (贝纳化电)。
8F5E2 Datasheet说明书
8F5E2 DatasheetDocument HistoryContentsDocument History (2)Preface (4)Disclaimer (4)Customer Support Overview (4)ESD Warning (5)Precautions (6)Limited Product Warranty (6)Introduction (7)Product Features and Specifications (8)Interface function description (11)Typical Installation (13)Recovery Mode (13)Order Information (14)Mechanical Dimensions (15)PrefaceDisclaimerThe information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.Plink assumes no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for discrepancies between the product and the user’s guide.Customer Support OverviewIf you experience any difficulties after using the product, please freely contact us directly. Our tech can help you with product installation and difficulties.Our support section is available 24 hours a day, 7 days a week on our website at: /en/Jetson.html. Our technical support is always free.ESD WarningElectronic components and circuits are very sensitive to electrostatic discharge. Although the company will do anti-static protection design for the main interface on the circuit board when designing circuit board products, it is difficult to do anti-static safety protection for all components and circuits. Therefore, it is recommended to follow ESD safety precautions when handling any circuit board component.ESD protection measures include but are not limited to the following:- During transportation or storage, place the card in an ESD bag and do not take it out until installation.- Release the static electricity before touching the board. Using a discharge grounding wrist strap.- Operate the circuit board only in electrostatic discharge safety area.- Avoiding move circuit boards in carpeted areas.- Avoiding contact with components, try to handle the board by the edges.Precautions- Before using the product, please read this manual carefully and keep it properly for future reference- Please pay attention to and follow all warnings and guidelines marked on the product- Please use the matching power adapter to ensure the stability of current and voltage - Please use this product in a cool, dry and clean place- Do not use this product in the environment of alternating cold and heat to avoid condensation and damage to internal components- Do not splash any liquid on the product. It is forbidden to use organic solvent or corrosive liquid to clean the product- Do not use this product in dusty and messy environment. If it is not used for a long time, please pack the product- Do not use it in an environment with excessive vibration. Any falling or knocking may damage the lines and components- Do not plug and unplug the core board and peripheral modules when the power is on- Do not repair or disassemble the product by yourself. If the product fails, contact the company for repair in time- Do not modify or use unauthorized accessories by yourself, and the resulting damage will not be covered by warrantyLimited Product Warranty- Warranty period -Bottom plate and core plate: 3 years (non-human damage)- Contact informationContacts: RMAAddress: Room 718, Jinrongkemao Plaza, No. 15 Shangdi Xinxi Road, Haidian District, Beijing, ChinaE-mail: sales@Telephone:+86-010-********- Mailing instructions: Please contact the sale staff of the company in advance, then arrange technicians to verify and eliminate the errors caused by misoperation as soon as possible. After verification, please mail the equipment to the company.Please attach a list of items and the reason for failure when mailing for easy verification, so as to avoid loss and damage in the process of express delivery.Introduction8F5E2 is a IPC with NVIDIA® Jetson™ AGX Xavier and AGX ORIN 32GB core modules. The main interface is designed for electrostatic safety protection, and a high-reliability power supply application scheme is adopted. The input power supply has over voltage and reverse polarity protection functions, and has a wealth of external interfaces. The internal interface devices are all wide-temperature models.8F5E2 provides multiple independent Gigabit network ports through internal M.2 ports, miniPCIe ports, which is suitable for multi-network port scenarios.8F5E2 is designed based on worse environmental conditions and has good characteristics such as anti-seismic and dust-proof, and is suitable for V2X and other fields.Product Features and Specifications- Product size：198mm×197mm×45 mm- Power requirements：+12V- Working temperature：-25~+70℃- Weight：1340g- Optional expansion:32GB ~ 1TB SSD storage- Maximum scalability 512g TF card memory- 4G and WIFI module can be extended- The initial setting can be reset and restored*Remark：when this model is equipped with AGX Xavier module, only one USB Type A supports USB3.0, Supports only one M.2Key M connector and one miniPCIe connectorPanel and interface IDSFigure 1 Ports on the front panelFigure 2 Ports on the rear panel*There is no interface on the rear panel of the standard machine. The four network interfaces on the rear panel are optional. If you need to use them, please contact the sales staff in advance.Interface function descriptionTypical Installation- Ensure power off of all external system- Install the necessary external cables.(e.g. display cable connected to HDMI monitor, power input cable supplying power to the system, USB cable connecting keyboard and mouse...)- Connect the power cord to the power supply- 8F5E2 could be set as default automatic power on or switch on. Please consult the sales and technical staff of our company for specific methods.Recovery ModeJetson core module can work in normal mode and recovery mode. It can be operated in recovery mode to file system update, kernel update, boot loader update, BCT update and other operationsStep in Recovery mode:- Turn off the system power supply- Use a Micro-USB cable to connect OTG port of the 8F5E2 with USB of the Jetson developing host- Press and hold on Recovery button (REC) to supply system power. Keep REC button for 3seconds above, then release the recovery buttonThe system enters the Recovery mode, and you can perform subsequent operations.Order InformationE-commerce direct purchaseTaobao：https:///Jingdong：https:///index-11467104.html?from=pc Alibaba：https:///Mechanical Dimensions。
TCH685-v2
TCH685八触摸按键红外码输出概述：电容式触摸感应检测按键是近年来迅速发展起来一种新型按键。
它可以穿透绝缘材料外壳（玻璃、塑料等等），通过检测人体手指带来的电荷移动，而判断出人体手指触摸动作，从而实现按键功能。
电容式触摸按键不需要传统按键的机械触点，也不再使用传统金属触摸的人体直接接触金属片而带来的安全隐患以及应用局限。
电容式感应按键做出来的产品可靠耐用，美观时尚，材料用料少，便于生产安装以及维护，取代传统机械按钮键以及金属触摸。
TCH685是TCH68系列中的8键应用，其输出信号为通用NEC格式红外遥控信号，外带背光指示，用户可以调灵敏度，方便各种影音数码产品中的应用。
特点：y超强抗EMC干扰，除能够防止手机等一般EMC干扰外，还能防止功率大到5W的对讲机发射天线靠近和接触干扰。
y极简单外围电路，最简单的应用只需要一颗参考电容，无需要复杂外围元件。
（视客户要求如需要提高ESD和EMC则需每个按键接1颗电阻）y超宽工作电压2.2V - 5.5V ，使用范围非常广泛，能应用在目前广泛应用的3.3V系统和3.0V电池系统。
（3.0V以下工作需要注明低压版本）。
y环境温度湿度变化自动适应，环境缓慢适应技术的应用，使得芯片无限长时间连续工作不会出现灵敏度差异。
y可调灵敏度，可以通过多种方式来调整灵敏度。
y提供兼容通用NEC码红外遥控输出模式，用户可以直接并联在红外接收头上。
y上电快速初始化，在0.2S左右内芯片就可以检测好环境参数包括自动适应，按键检测功能开始工作。
y灵敏度自动适应，各按键引线如果因为长短不一造成寄生电容大小不同，能够自动检测并适应，不同按键灵敏度做到几乎完全一致。
y抗电源电压跌落，当系统电源突然降低，芯片自动检测并停止输出，有效防止误动作。
y TSSOP-20L超小超薄封装功能规格：y工作电压： 3.2V—5.5V（普通版本），2.2V—5.5V（低压版本）y工作电流：1—2mAy按键通道： 8通道y输出模式： OUT输出红外遥控兼容码y多键抑制： 2键同时按下时间优先，3键同时按抑制y灵敏度调节：Cs电容和输入选项2种方式y上电初始化时间：电源稳定后200ms左右y按键去抖动时间：60mSy按键最长时间限制： 14-16Sy背光输出延时： 2-4Sy低电压自动复位（LVR）： 2.5-3.2V （低压版本无此功能）y封装 ： TSSOP20L应用示例图：※ 请按照I0、I1、I2…I7的顺序来选用按键输入，不用的按键输入口直接接地。
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BF6852A/C 自电容多点触控芯片Datasheet1概述1.1 特点●自电容感应技术●最多支持28个检测通道●支持单点触摸和两点手势●最大可以支持5.3寸屏●低功耗模式——睡眠模式和等待模式●标准的IIC接口——IIC从机模式：支持100Kbps和400Kbps●电源电压范围：2.7~3.6V●IO电压范围：1.65~3.6V●环境自适应●具有防水功能●支持单层三角形屏●FPS：高达100Hz，反应时间<10ms●工作模式——中断模式&& 查询模式●ESD HBM：±4KV●工作温度：-40°C ~ +85°C●封装形式：QFN401.2 典型应用●手机●手持/移动终端2简介BF6852A/C是一款内置MCU的自电容触摸控制IC，其采用了自电容检测技术，支持全ITO单层三角形屏的应用方案；支持真实单点触摸和两点手势，最大可支持5.3寸屏。
该触控IC包含了一个MCU和一些其他的外围设备，通过检测及运算识别有效的触摸信息，然后把手指的触摸位置转换成坐标，通过IIC接口把信息传送给上位机。
3 IC 描述3.1 BF6852A/C 封装SN3SN4SN5SN6SN7SN8SN11SN12SN13SN14S N 15S N 16S N 17S N 18S N 19S N 21S N 22S N 23S N 24S N 25SN26SN27SN29SN30SN31SN32SN33SN34NCV S SS D AS C KD A VV D 2I O V C CV C CV DC O U T C O U T 2图1 BF6852A/C QFN40 5mm ×5mm 封装3.2 BF6852A/C pin脚描述4传感器设计请参考《三角形触摸屏设计规则及量产注意事项》。
5 IIC 通信BF6852A/C 提供标准的IIC 通信接口，由SCL 和SDA 与主机进行通信，在系统中BF6852A/C 始终作为从机设备，所有通信都是由主机发起，通信速度有400Kbps 和100Kbps ，二者可选。
BF6852A/C 芯片对触控屏检测通道上的电容值进行采样，通过比较电容值的变化值来判断触摸状态，并通过算法实现触摸点的定位。
5.1 IIC 总线时序图SCLSDA图2 IIC 总线时序图IIC 时序参数如下表所示：5.2 IIC读写流程5.2.1 IIC写流程主机可以根据寄存器列表对相关寄存器进行写操作，时序图如下图所示：S:启动信号Device address_W:带写控制位的从设备地址Register_Address:待写入的8位寄存器地址A:应答信号Data_1~Data_n:数据字节1~nP:停止信号5.2.2 IIC读流程主机可以根据寄存器列表对相关寄存器进行读操作，时序图如下图所示：S:启动信号Device address_W:带写控制位的从设备地址Device address_R:带读控制位的从设备地址Register_Address:待读取的8位寄存器地址A:应答信号Data_1~Data_n:数据字节1~nP:停止信号5.3寄存器列表及说明5.3.1 寄存器列表5.3.2 寄存器说明1、D_SN0~D_SN5●程序版本号读取：主机需连续读取字节，操作如下START->（设备地址+写）->寄存器地址0x00->RESTART->（设备地址+读）->连续读取版本号6个byte ->STOP2、Operation mode：配置该寄存器可实现以下功能●休眠模式：当对寄存器（0x07）写入0x00时TP进入休眠模式，芯片将停止工作，以降低功耗。
START->（设备地址+写）->寄存器地址0x07->0x00->STOP●唤醒：对寄存器（0x07）写入0x01，将TP唤醒。
START->（设备地址+写）->寄存器地址0x07->0x01->STOP●使能缩放手势：对TP的寄存器（0x07）写入0x11使能缩放功能，而写入0x10则关闭缩放功能。
START->（设备地址+写）->寄存器地址0x07->0x11->STOP3、RESOX_H~RESOX_L、RESOY_H~RESOY_L：X，Y坐标分辨率●主机读取操作如下：START->（设备地址+写）->寄存器地址0x08->RESTART->（设备地址+读）-> 连续读4个byte->STOP4、TOUCH：包含触摸按键和手指触摸个数的信息，高4位为1000b，代表发送手指触摸个数信息；高4位为1001b，代表发送按键信息，如表2所示：5、X1_H~X2_H、X1_L~X2_L、Y1_H~Y2_H、Y1_L~Y2_L坐标X，Y的高低8位，其中包含了触摸ID号和触摸状态的信息。
●Touch state：包含三种手指触摸状态，第一次触摸，保持触摸，抬起。
如表3所示：●Touch ID按如下规则定义：●最先按下的触摸点ID为1，后依次增加，最大到2。
当有触摸点抬起时，不影响其他触摸点ID。
同一个触摸点的数据并不是固定在同一个寄存器中，靠后的触摸点在其他触摸点抬起时，在寄存器中的位置会往前移动。
例如：当有2个手指触摸时，第一个手指触摸点ID为1，数据放在0x5d~0x60寄存器中，第二个手指触摸点ID为2，数据放在0x61~0x64寄存器中。
当第一个手指抬起后，第二个手指仍然触摸，此时第二个手指触摸点ID依然是2，触摸点数T ouchnum仍为2，寄存器0x5d~0x60仍保留第一个手指的ID号为1，Touchstate为抬起，主机读完这帧数据后下一帧数据的触摸点数即变成1，第二个手指触摸数据位置相应往前移动到0x5d~0x60寄存器中，原先存放位置0x61~0x64寄存器清零。
这时如果再有一个手指触摸，数据放置在0x61~0x64寄存器中。
●触摸坐标数据格式如表4所示：无触摸Data1为0x80，单点触摸为0x81，两点触摸为0x82；Data1为0x80时，Data2~Data9都为0。
根据手指触摸个数可以决定后面读取坐标的长度。
●触摸按键数据格式如表5所示：按键触摸后抬起为0x90。
●主机读取坐标信息，操作如下：START->（设备地址+写）->寄存器地址0x5c->RESTART->（设备地址+读）-> 连续读坐标信息->STOP●主机读取按键信息，操作如下：START->（设备地址+写）->寄存器地址0x5c->RESTART->（设备地址+读）-> 连续读5个byte->STOP 6、手势缩放手势判断功能底层默认屏蔽，如需要此功能请联系FAE工程师，否则主机写命令也无效。
当主机向0x07寄存器中写入0x11指令时，启动手势缩放判断功能，此时从寄存器地址0x5c开始存放缩放手势的信息，数据格式是6个字节，如表6所示：Ges表示放大或缩小的手势，Ges = 0xff表示缩小，Ges=0x01表示放大。
●主机需连续读取手势数据，操作如下：START->（设备地址+写）->寄存器地址0x5c->RESTART->（设备地址+读）-> 连续读取手势信息（6个字节）->STOP放大缩小手势如图3、4所示：图3 放大图4 缩小主机读坐标、按键、手势信息可以都为9个字节，对按键判断就解析前5个字节，对手势判断就解析前6个字节。
5.4 注意事项1、BF6852坐标默认分辨率为2048*2048。
2、BF6852上电初始化需要200ms，由休眠唤醒到稳定工作需要20ms，建议主机操作过程中请预留足够的时间。
3、上电时主机可根据需要读取版本号，读数据操作都是连续读取，请按所标明的主机操作方式读取。
4、上升沿或下降沿触发方式建议主机检测到DAV信号时能立即读取数据，如果延时太长，BF6852已经更新坐标信息，就会造成主机读到的数据有误或丢失数据。
5、当主机进入图片、浏览器等需要使用放大缩小手势功能的界面，建议主机立即发送放大缩小使能命令，退出后也应立即发送关闭使能命令。
6工作模式● 在正常工作状态下，坐标刷新的周期大约是12ms （此时间和配置有关）。
● 在正常工作模式下可通过IIC 发送指令进入SLEEP 模式。
● BF6852A/C可通过IIC 中断唤醒SLEEP ，进入到正常工作模式。
其中，中断发出后需等待2ms 才能进行正常通信。
以从机地址0x58，0x59为例，主机具体操作见下图5。
Sleep 模式Normal 模式图5 IIC 中断唤醒SLEEP 图7应用电路图7.1 应用说明1：若上位机提供IOVCC电源端口或者IOVCC = VCC，请用BF6852A产品型号；2：若上位机不提供IOVCC电源，并且IOVCC = 1.8V，请用BF6852C产品型号。
7.2双电源应用方案（此种方案用BF6852A）7.3 单电源并且IOVCC = VCC应用方案（此种方案用BF6852A）7.4 单电源并且IOVCC = 1.8V应用方案（此种方案用BF6852C）备注：此方案只用在当上位机不提供IOVCC电源并且IOVCC=1.8V时，另外无IIC的上拉电阻。
8 电气特性8.1 DC特性下表列出了我们的产品能保证的电压以及温度的最大值到最小值的范围：2.7V~3.6V，-40℃~85℃，典型值在25℃，2.8V的条件下。
8.2 极限电气参数注：1、焊接温度最高不能超过260℃，在255℃~260℃之间不能超过30s。
2、在应用过程中，如果超出了极限参数的最大值，可能会导致芯片损坏，继而不能正常工作。
9产品封装图6 QFN-40封装（5mm*5mm*0.8mm）BF6852A/C DataSheetDatasheetPage 21 of 21 BYD Microelectronics Co., Ltd.免责声明。