3535RGB全彩led规格书
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Features :
*Low power consumption *Small efficiency.
V ersatile mounting on p.c board Unit :mm
dimensions are in millimeters (inches).
Tolerance is ±0.25mm (.010”)unless otherwise Specifications are subject to change without
2(+)G 3(+)R 1(+)B 5(-)4(-)6(-)5(-)4(-)6(-)2(+)G
3(+)R
1(+)B
Absolute Maximum Ratings at Ta=25℃
Parameter Rating Unit
Power Dissipation(Pd)70mW Peak Forward Current(1/10Duty Cycle0.1ms
pulse Width
100mA
Forward Current(IF)20mA
Reverse V oltage(VR)5V Operating Temperature Range-20℃~+80℃
Storage Temperature Range-30℃~+100℃
Lead Soldering Temperature210℃for5Seconds
Selection Guide`
Parameter Min Tvo Max Unit Test Condition
Luminous Intensity(IV)
Red750----Mcd If=20mA Green1600——Mcd If=20mA Blue350450Mcd If=20mA
The wavelength
Red620----630nm If=20mA Green517——
530nm If=20mA Blue460——475nm If=20mA
Forward V oltage(VF)
Red 1.8---- 2.4V If=20mA Green 3.0---- 3.4V If=20mA Blue 3.0 3.4V If=20mA
Reverse Current(IR)----5µA Vr=5V Selection Guide：
Lens color Chip
Water clear
Material Emittedcolorλp(nm) InGaN/GaN
Red620
Green525
Blue472
１９００
900
Typical Electrical/Optical Characteristics Curves (R):
：
Typical Electrical/Optical Characteristics Curves (G):
Labe
P/N:The product model IV:Luminous intensity rank VF:Forward voltage rank TC:Color temperature Q`T:number
QC:Production order
Moisture Resistant Packaging
Note:unless mentioned,tolerance of +/-0.1mm,unit
:
Lable
Aluminum moisture-proof bag
Desiccant
SMD
The produc ts take note
1；Graph one ：
Hands material taking ：
1.Hand have sweat ，Sweat on silicon surface existing optical pollution ，
Influence luminous 。2.Filling glue for silica gel ，Silica gel is relatively soft ，Hand hard squeeze will cause 、breakline Crushed wafbreak Cause death light products
2；Figure 2
Tweezers surface material taking ：
1.Product packaging glue for silica gel ，Silica gel is relatively soft ，Use tweezers
extrusionCan lead to break 、Broken wafer causing death light products 。2.Tweezers will scratch product surface,light Angle effect 。
3；FIG.3
SMT material taking:when the suction nozzle diameter less than products can lead to suction nozzle stamping silica gel ，Can cause gold thread breakage and chip extrusion,cause products die lamp and so on
。
4；Figure 4:
Blanking:product fell on the ground,can lead to foot a deformation,
can cause welding plate position is differ 。
5；Figure 5：
Welding plate after put ：
1.Welding plate after ，Directly after the welding of plate overlap ，Can damage the product surface ，Will affect light Angle very scratch the surface
2.Welding plate after ，Welding plate and product overlap there will be a
squeeze ，Extrusion can cause wafer and gold thread damage and fracture can lead to produce light
。