PPQ-L-XX(月)XX(日).2015(年)-001(序号)-XX(Ag,Au,Cu) Wire]
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35
DI Water Pressure
2-4
3.5
DI Water Flow
0.5-1.0
0.7
Drying Time
Max 100
50
The appearance of data & results
Items
S/S
Criteria
Data & Result
A/R
Remarks
Min
Max
AVG
CPK
No Defect
A
Chip backside
3EA
No Damage
No Defect
A
Epoxy Coverage
3EA
四面出胶且长度大于75%周长
No Defect
A
BLT
5EA
5-25um
8
13
8.8
0.41
A
DST
10EA
Min：30g
49
70
58.5
1.56
A
Die Tilt
5EA
＜25．4um
14Ball
0/1
10.9
17.8
14.0
----
A
BST
70EA
＞20g
38.4
58.9
47.8
3.16
A
Loop Height
14Wires
130-330um
164
183
174.9
2.39
A
BPT
70EA
＞5g
5.1
9.6
8.13
1.43
A
▣Molding
Machine Parameters
Items
150MIL
腾源
3.2 Machine List
Type
Model
Serial No
Maker
Machine No
Tape Mount
DM200
苏州斯尔特
WM01
Wafer Saw
DFD641
HL1311
DISCO
WS02
Die Attach
ESEC2008 hs Plus
ESEC
DA01
Wire Bond
Pick-up Weight
0.6-1
0.6
Cure Temp
175±5
175
Cure Time
1hrs
1hrs
The appearance of data &results
Items
S/S
Criteria
Data & Result
A/R
Remarks
Min
Max
AVG
CPK
Visual
140EA
0/1
2. Tested Package Information
PKG Type
Part No.
Wafer Size
Chip Size
Chip Thickness
SOP_14
150mil
IL324
4”
0.99*0.96
350㎛
Mark Code
Wafer(Run) #
Chip ID
MSL
IL324D
IKSLFWW
Criteria
Data&Result
A/R
Remarks
Min
Max
AVG
CPK
Visual
1 WafeMachine Parameter(s)
Items
Spec
Actual
Spindle RPM
40000±5000
40000
Feeding Speed
Max50
Visual
125EA
0/1
No Defect
Kerf width
10EA
---
36.5
46.5
41
---
A
SAWING TOPSAW BOTTOM
▣Die Attach & Cure Oven
Machine Parameter(s)
Items
Spec
Actual
Bond weight
0.6-1
0.8
Spec
Actual
Mold Die Temp
175±5
175
Transfer Pressure
50±10
47
Transfer Time
12±3
14.4
Cure Time
＞120s
120s
PMC Time
5hrs
5hrs
PMC Temp
175
175
The appearance of data &results
东莞华越
上海宏测
Handler24
Tester 18
4. PPQ Data & Summary
▣Tape Mount
Machine Parameter(s)
Items
Spec
Actual
Chuck Temp
40-70℃
45℃
The appearance of data &results
Items
S/S
Items
S/S
Criteria
Data &Results
A/R
Remarks
Min
Max
AVG
CPK
Visual
一条框架
0/1
No Defect
A
Ball Placement
一条框架
0/1
100% on pad
A
Ball Diameter
14Ball
40-80um
61
67
64
----
A
Ball Height
Mar05TH, 2015 ~ May05TH, 2015
1.Purpose
The purpose of this documentistoQualifyXXX(SOPXX_150mil) in Manufacturing Process and
Inform toXXXso that Process and Product is qualified with Gelite Qualification Spec.
Items
S/S
Criteria
Data&Results
A/R
Remarks
Min
Max
AVG
CPK
Visual
每批2片
0/1
No Defect
A
Thickness
10 points
7-15um
9.3
11.3
10.34
1.77
A
Pure Sn
6 Points
＞99.99%
100
100
100
---
A
▣Marking
Bent lead Rej 1pcs/Function Rej 1pcs
Process
SAW
D/A
W/B
M/D
TIN
M/K
T/F
E/T
In_put
560
560
560
560
560
560
560
559
Out_put
560
560
560
560
560
560
559
558
RejQty’s
0
0
0
0
0
0
1
1
Yield’s
Remarks
Min
Max
AVG
CPK
Visual
140EA
0/1
No Defect
A
▣Trim-Form
The appearance of data&results
Items
S/S
Criteria
Data & Results
A/R
Remarks
Min
Max
AVG
CPK
Visual
10EA
0/1
No Defect
Lead span
10EA
6±0.2
6.01
6.02
6.01
---
A
Stand off
10EA
0.1-0.25
0.16
0.17
0.17
---
A
Burr
10EA
＜0.2
0.04
0.07
0.05
---
A
5.Assembly Overall Yield Summary
Items
Summary & Yield
100%
100%
100%
100%
100%
100%
99.82%
99.82%
Note:
6.Conclusion of PPQ
6.1 All PPQ Conditions and Results are Qualified with correspond to PPQ Specifications.
6.2 Test Result will be reported after Test completed!
ASSY Yield
F/T Yield
CUM Yield
99.82% [In560pcs , Out559pcs ,Rej1pcs]
99.82% [In559pcs , Out558pcs ,Rej1pcs]
99.64% [In560pcs , Out559pcs ,Rej2pcs]
Reject Mode
Collet
RT-030-FT[Rubber]
Ø30mil
铭沣
Capillary
CE-FB-1351-G36
Normal/Ruby
库力索法 [K/S]
Cu wire
FG-A08-20-01
0.8mil
NICHE-TECH
Compound
EMEG630AY
14mm*4.2g
SUMITOMO
Tube
SOP
3. Material(BOM) and Machine Summary
3.1 Material List
Type
Model
Spec
Maker
Remark
Saw blade
27HDDC
------
DISCO
Lead frame
A194
80-80
LEAD
Ag Epoxy
833C-LW
---
Bonotec
6
10
6.8
3.11
A
▣Wire Bond
W/B Machine Parameters
Items
Spec
Actual
Pad
Lead
Pad
Lead
Time
SEG1:
SEG2:
SEG3:
SEG4:
14±2
SEG1:5
SEG2:5
SEG3:5
SEG4:16
13
Power
SEG1:
SEG2:
SEG3:
SEG4:
Document No.
PPQ-L-XXXX.2015-XXX
Resp. Team
Quality Team
Report Prsn.
XXX
Report Date
2015.XX.XX
Approval Prsn.
XXX
Docu Title
Pre Product Qualification Report
Exec. Period
140±30
SEG1:0
SEG2:15
SEG3:65
SEG4:58
135
Force
SEG1:
SEG2:
SEG3:
SEG4:
95±20
SEG1:160
SEG2:30
SEG3:15
SEG4:15
115
Temp
210-230
210-230
220
220
The appearance of data&results
Machine Parameters
Items
Spec
Actual
Marking Method
Laser Marking
Laser Marking
Power
35%-80%
65%
The appearance of data &results
Items
S/S
Criteria
Data&Results
A/R
Connx Plus
KS
WB05
Mold
FSTM250-7HS
FUSHISANJIA
MD02
Cure Oven
JH-841
吴江精华
PMC02
Laser Mark
K511A
King Tech
MK01
Trim-Form
YAMADA
SANJA YAMADA
TF02
Test
SHF3000
MTS737 FLEX
Items
S/S
Criteria
Data&Results
A/R
Remarks
Min
Max
AVG
CPK
External Visual
一模
0/1
No Defect
A
X-RAY
一模
0/1
No Defect
A
Wire Sweeping
10EA
＜15%
1.25%
5.23%
3.13%
---
A
▣Tin plating
7.Appendix
Items check Data.
THE END
DI Water Pressure
2-4
3.5
DI Water Flow
0.5-1.0
0.7
Drying Time
Max 100
50
The appearance of data & results
Items
S/S
Criteria
Data & Result
A/R
Remarks
Min
Max
AVG
CPK
No Defect
A
Chip backside
3EA
No Damage
No Defect
A
Epoxy Coverage
3EA
四面出胶且长度大于75%周长
No Defect
A
BLT
5EA
5-25um
8
13
8.8
0.41
A
DST
10EA
Min：30g
49
70
58.5
1.56
A
Die Tilt
5EA
＜25．4um
14Ball
0/1
10.9
17.8
14.0
----
A
BST
70EA
＞20g
38.4
58.9
47.8
3.16
A
Loop Height
14Wires
130-330um
164
183
174.9
2.39
A
BPT
70EA
＞5g
5.1
9.6
8.13
1.43
A
▣Molding
Machine Parameters
Items
150MIL
腾源
3.2 Machine List
Type
Model
Serial No
Maker
Machine No
Tape Mount
DM200
苏州斯尔特
WM01
Wafer Saw
DFD641
HL1311
DISCO
WS02
Die Attach
ESEC2008 hs Plus
ESEC
DA01
Wire Bond
Pick-up Weight
0.6-1
0.6
Cure Temp
175±5
175
Cure Time
1hrs
1hrs
The appearance of data &results
Items
S/S
Criteria
Data & Result
A/R
Remarks
Min
Max
AVG
CPK
Visual
140EA
0/1
2. Tested Package Information
PKG Type
Part No.
Wafer Size
Chip Size
Chip Thickness
SOP_14
150mil
IL324
4”
0.99*0.96
350㎛
Mark Code
Wafer(Run) #
Chip ID
MSL
IL324D
IKSLFWW
Criteria
Data&Result
A/R
Remarks
Min
Max
AVG
CPK
Visual
1 WafeMachine Parameter(s)
Items
Spec
Actual
Spindle RPM
40000±5000
40000
Feeding Speed
Max50
Visual
125EA
0/1
No Defect
Kerf width
10EA
---
36.5
46.5
41
---
A
SAWING TOPSAW BOTTOM
▣Die Attach & Cure Oven
Machine Parameter(s)
Items
Spec
Actual
Bond weight
0.6-1
0.8
Spec
Actual
Mold Die Temp
175±5
175
Transfer Pressure
50±10
47
Transfer Time
12±3
14.4
Cure Time
＞120s
120s
PMC Time
5hrs
5hrs
PMC Temp
175
175
The appearance of data &results
东莞华越
上海宏测
Handler24
Tester 18
4. PPQ Data & Summary
▣Tape Mount
Machine Parameter(s)
Items
Spec
Actual
Chuck Temp
40-70℃
45℃
The appearance of data &results
Items
S/S
Items
S/S
Criteria
Data &Results
A/R
Remarks
Min
Max
AVG
CPK
Visual
一条框架
0/1
No Defect
A
Ball Placement
一条框架
0/1
100% on pad
A
Ball Diameter
14Ball
40-80um
61
67
64
----
A
Ball Height
Mar05TH, 2015 ~ May05TH, 2015
1.Purpose
The purpose of this documentistoQualifyXXX(SOPXX_150mil) in Manufacturing Process and
Inform toXXXso that Process and Product is qualified with Gelite Qualification Spec.
Items
S/S
Criteria
Data&Results
A/R
Remarks
Min
Max
AVG
CPK
Visual
每批2片
0/1
No Defect
A
Thickness
10 points
7-15um
9.3
11.3
10.34
1.77
A
Pure Sn
6 Points
＞99.99%
100
100
100
---
A
▣Marking
Bent lead Rej 1pcs/Function Rej 1pcs
Process
SAW
D/A
W/B
M/D
TIN
M/K
T/F
E/T
In_put
560
560
560
560
560
560
560
559
Out_put
560
560
560
560
560
560
559
558
RejQty’s
0
0
0
0
0
0
1
1
Yield’s
Remarks
Min
Max
AVG
CPK
Visual
140EA
0/1
No Defect
A
▣Trim-Form
The appearance of data&results
Items
S/S
Criteria
Data & Results
A/R
Remarks
Min
Max
AVG
CPK
Visual
10EA
0/1
No Defect
Lead span
10EA
6±0.2
6.01
6.02
6.01
---
A
Stand off
10EA
0.1-0.25
0.16
0.17
0.17
---
A
Burr
10EA
＜0.2
0.04
0.07
0.05
---
A
5.Assembly Overall Yield Summary
Items
Summary & Yield
100%
100%
100%
100%
100%
100%
99.82%
99.82%
Note:
6.Conclusion of PPQ
6.1 All PPQ Conditions and Results are Qualified with correspond to PPQ Specifications.
6.2 Test Result will be reported after Test completed!
ASSY Yield
F/T Yield
CUM Yield
99.82% [In560pcs , Out559pcs ,Rej1pcs]
99.82% [In559pcs , Out558pcs ,Rej1pcs]
99.64% [In560pcs , Out559pcs ,Rej2pcs]
Reject Mode
Collet
RT-030-FT[Rubber]
Ø30mil
铭沣
Capillary
CE-FB-1351-G36
Normal/Ruby
库力索法 [K/S]
Cu wire
FG-A08-20-01
0.8mil
NICHE-TECH
Compound
EMEG630AY
14mm*4.2g
SUMITOMO
Tube
SOP
3. Material(BOM) and Machine Summary
3.1 Material List
Type
Model
Spec
Maker
Remark
Saw blade
27HDDC
------
DISCO
Lead frame
A194
80-80
LEAD
Ag Epoxy
833C-LW
---
Bonotec
6
10
6.8
3.11
A
▣Wire Bond
W/B Machine Parameters
Items
Spec
Actual
Pad
Lead
Pad
Lead
Time
SEG1:
SEG2:
SEG3:
SEG4:
14±2
SEG1:5
SEG2:5
SEG3:5
SEG4:16
13
Power
SEG1:
SEG2:
SEG3:
SEG4:
Document No.
PPQ-L-XXXX.2015-XXX
Resp. Team
Quality Team
Report Prsn.
XXX
Report Date
2015.XX.XX
Approval Prsn.
XXX
Docu Title
Pre Product Qualification Report
Exec. Period
140±30
SEG1:0
SEG2:15
SEG3:65
SEG4:58
135
Force
SEG1:
SEG2:
SEG3:
SEG4:
95±20
SEG1:160
SEG2:30
SEG3:15
SEG4:15
115
Temp
210-230
210-230
220
220
The appearance of data&results
Machine Parameters
Items
Spec
Actual
Marking Method
Laser Marking
Laser Marking
Power
35%-80%
65%
The appearance of data &results
Items
S/S
Criteria
Data&Results
A/R
Connx Plus
KS
WB05
Mold
FSTM250-7HS
FUSHISANJIA
MD02
Cure Oven
JH-841
吴江精华
PMC02
Laser Mark
K511A
King Tech
MK01
Trim-Form
YAMADA
SANJA YAMADA
TF02
Test
SHF3000
MTS737 FLEX
Items
S/S
Criteria
Data&Results
A/R
Remarks
Min
Max
AVG
CPK
External Visual
一模
0/1
No Defect
A
X-RAY
一模
0/1
No Defect
A
Wire Sweeping
10EA
＜15%
1.25%
5.23%
3.13%
---
A
▣Tin plating
7.Appendix
Items check Data.
THE END