枕头效应测试(HIP)

HIP Test Flow Chart 测试流程示意图
HIP Testing Data HIP测试数据
CS009356, Time @ 260º C (s)
Soak time(s)
60 120 180 240
CS009340, Time @ 260º C (s)
0
C C C C
0Байду номын сангаас
C C C C
5
C C C C
20
C C C C
30
C C C C
60
C C HIP HIP
80
HIP HIP
5
C C C C
20
C C C C
30
C C C C
60
C C HIP HIP
80
HIP HIP
C: Coalescenced聚合
Copper coupon Test Process 铜片测试流程
• Procedure流程 -Heat copper coupon at 260º C for 15min for oxidization 加热铜片到260º C氧化15分钟 -Print paste on the copper coupon印刷锡膏到铜片上 -Check for wetting issue检查润湿效果
IPC TM-650 2.4.45 润湿性测试目的：保证锡膏在铜基材上有充分的润湿能力,测定锡膏在回流时飞 溅情况.（准备和流程：将锡膏印刷到干净的铜上回流,然后检查是否有不润湿和反润湿的况,同时看在 焊点的周围是否有飞溅的情况发生.）
Result for copper coupon test 铜片测试结果
Soldering Capability Test焊接性能测试 INDIUM CORPORATION
Purpose of Test 测试目的
• There are Head-in-pillow and copper coupon tests. These 2 tests are the important items to judge paste soldering capability 测试分为枕头效应测试（HIP)和铜片测试（Copper coupon).两项测试是 判断锡膏焊接性能的两个重要方面 -HIP test checks coalescence capability of solder paste to BGA ball. HIP确认锡膏与BGA球的聚合熔融能力 -Copper coupon test checks wetting capability of paste to substrate and part terminal. 铜片测试确认锡膏对基材和器件端子的焊接能力
HIP Test Process and Material Preparation 测试流程与材料准备
• Procedure 流程 - Print the paste on fresh Cu use a 90 mil stencil 使用90mil厚度的钢网将锡膏印刷到洁净的铜片上 - Soaking the paste @ 200ºC for the time intervals（60,120,180,240S) 将锡膏在200ºC 时以不同时间段做保温处理(60,120,180,240S) - Move the oxidized paste to 260ºC for melt 将氧化的锡膏放置到260ºC熔融 - Place ball on melted solder dome at time intervals以不同的时间间隔 将锡球放置到熔融了的焊锡上 - Inspect the HIP观察HIP的情况 • Solder Paste锡膏 – Indium 8.9 – BGA ball: 95.5Sn3.8Ag0.7Cu. 90 mil in dia. Ball is pre-oxidized @ 200oC for 25 min before use – BGA球： 95.5Sn3.8Ag0.7Cu. 球径90mil。球在使用前在200oC预先 氧化处理25min