PCBA Manufacturing Introduction

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PCBA工艺可制造性的基本概念介绍ppt

《PCBA设计及可靠性》
THANK YOU.
静电防护
在PCBA制造过程中，静电是一个潜在的危害因素，可能导致元器件损坏或性能下降。
洁净度要求
PCBA制造过程中，对环境中的尘埃、颗粒物等污染物有严格的要求，以确保焊接质量和可靠性。
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总结
总结本次介绍的要点
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PCBA工艺可制造性是指在不同环境和条件下，通过选择合适的材料、设计合理的电路板结构、制定规范的制板流程和严格的质量控制体系，实现高效率、低成本、高质量的PCBA制作。
背景
近年来，随着电子产品的不断升级换代和技术进步，电子制造企业面临着日益激烈的市场竞争。为了提高生产效率和产品质量，降低制造成本，电子制造企业需要关注PCBA工艺的可制造性问题。通过对PCBA工艺可制造性的研究和改进，可以有效地解决生产过程中的瓶颈问题，提高生产效率和产品质量，增强企业的市场竞争力。
采用专业的EDA（电子设计自动化）软件，如Cadence、 Synopsys等。
设计优化
通过软件工具进行布局优化、布线优化、信号完整性仿真等，提高PCBA的可制造性。
数据分析
利用软件工具进行数据分析，识别出可能的制造问题和风险，提前进行规避和优化。
案例三：环境因素对可制造性的影响
温度和湿度
对于PCBA制造来说，温度和湿度是两个重要的环境因素，对制造过程中的元器件性能和焊接质量产生影响。
率。
软件模块化
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将软件程序划分为多个模块，以提高代码的可读性和可维护性
。
软件测试和验证
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对软件进行全面、细致的测试和验证，以确保其正确性和可靠
性。
环境优化
生产环境设置

华为终端_PCBA制造标准V2.2

DKBA华为技术有限公司技术规范DKBA终端 PCBA制造标准2013年8月15日发布 2013年8月30日实施华为技术有限公司Huawei Technologies Co., Ltd.版权所有侵权必究All rights reserved修订声明Revision declaration本规范拟制与解释部门：终端研发管理部产品工程与验证部本规范的相关系列规范或文件：《终端工艺材料选用规范（EMS版）》、《XXX单板工艺特殊说明文件》、《终端产品手工焊接工艺规范》相关国际规范或文件一致性：替代或作废的其它规范或文件：《华为终端辅料清单（EMS版）V300R001》《终端 PCBA装联通用工艺规范》相关规范或文件的相互关系：目录Table of Contents1生产与存储环境及工艺辅料选择通用要求................................ 错误!未定义书签。

概述 ............................................................ 错误!未定义书签。

PCBA工艺辅料清单及辅料变更申请管理要求........................... 错误!未定义书签。

物料规格及存储使用通用要求....................................... 错误!未定义书签。

通用物料存储及使用要求 ...................................... 错误!未定义书签。

PCB存储及使用要求 ........................................... 错误!未定义书签。

锡膏规格及存储使用要求 ...................................... 错误!未定义书签。

焊锡丝规格及存储使用要求..................................... 错误!未定义书签。

pcba压合工艺流程

pcba压合工艺流程英文文档内容：PCBA Pressing Process FlowThe PCBA pressing process flow is a critical step in the manufacturing of printed circuit boards (PCBs).It involves the assembly of electronic components onto the PCB substrate to create a functional electronic circuit.The process flow typically includes the following steps:1.Design and Planning: The first step in the PCBA pressing process is the design and planning of the circuit board.This involves creating a detailed layout of the electronic components and their interconnections on the PCB substrate.2.Material Preparation: Once the design is finalized, the next step is to prepare the necessary materials.This includes obtaining the PCB substrate, electronic components, solder paste, and other necessary materials.3.PCB Printing: The solder paste is printed onto the PCB substrate using a stencil and a printing machine.The stencil contains the required patterns for the electronic components and their interconnections.ponent Placement: The printed PCB is then placed on a pick and place machine, which accurately positions the electronic components onto the PCB substrate according to the printed solder paste patterns.5.Reflow Soldering: The PCB with the placed components is then subjected to a reflow soldering process.This involves heating the PCB to a specific temperature, causing the solder paste to melt and join the electronic components to the substrate.6.AOI (Automatic Optical Inspection): After the reflow soldering process, the PCB undergoes an AOI inspection to detect any defects or misalignments in the solder joints.7.Testing: The PCBA is then tested to ensure that the circuit functions correctly.This may involve functional testing, electrical testing, or other specialized tests depending on the requirements of the circuit.8.Pressing: In the final step of the PCBA pressing process flow, the components are securely pressed onto the PCB substrate to ensure stability and prevent any movement during subsequent use.Overall, the PCBA pressing process flow is a complex and precise process that requires careful planning, material preparation, and skilled operation of machinery.It is essential for the production of high-quality printed circuit boards.中文文档内容：PCBA压合工艺流程PCBA压合工艺流程是印刷电路板（PCB）制造过程中的关键步骤。

pcba压合工艺流程

pcba压合工艺流程English Answer:PCBA Lamination Process Flow.The PCBA lamination process is a critical step in the manufacturing of printed circuit boards (PCBs). It involves bonding multiple layers of conductive materials and insulating materials together to create a single, rigid structure. The process typically involves the following steps:1. Preparation: The first step is to prepare the individual layers of the PCB. This includes cleaning the surfaces of the layers to remove any contaminants, such as dust or oil.2. Alignment: The next step is to align the individual layers of the PCB. This is done using precision equipment to ensure that the layers are perfectly aligned with eachother.3. Lamination: The aligned layers are then laminated together using a heated press. The press applies pressure and heat to the layers, causing them to bond together.4. Cooling: After lamination, the PCB is cooled to allow the adhesive to set. This is typically done by placing the PCB in a cooling chamber.5. Curing: The final step is to cure the adhesive. This is typically done by heating the PCB in an oven.Chinese Answer:PCBA压合工艺流程。

质量管理体系中英文缩写与其解释

质量管理体系中英文缩写与其解释Engineering 工程/ Process 工序（制程）Man, Machine, Method, Material, 人，机器，方法，物料，环境- 可能导 4M&1E Environment 致或造成问题的根本原因 AI Automatic Insertion 自动插机ASSY Assembly 制品装配ATE Automatic Test Equipment 自动测试设备 BL Baseline 参照点 BM Benchmark 参照点BOM Bill of Material 生产产品所用的物料清单C&ED/C Cause and Effect Diagram 原因和效果图AED CA Corrective Action 解决问题所采取的措施电脑辅助设计.用于制图和设计3维物体 CAD Computer-aided Design 的软件对文件的要求进行评审，批准，和更改 CCB Change Control Board 的小组依照短期和长期改善的重要性来做持续CI Continuous Improvement 改善 COB Chip on Board 邦定-线焊芯片到PCB板的装配方法. CT Cycle Time 完成任务所须的时间 DFM Design for Manufacturability 产品的设计对装配的适合性设计失效模式与后果分析--在设计阶段 Design Failure Mode and Effect DFMEA 预测问题的发生的可能性并且对之采取Analysis 措施六西格玛(6-Sigma)设计 -- 设计阶段预 DFSS Design for Six Sigma 测问题的发生的可能性并且对之采取措施并提高设计对装配的适合性 DFT Design for Test 产品的设计对测试的适合性实验设计-- 用于证明某种情况是真实 DOE Design of Experiment 的根据一百万件所生产的产品来计算不良DPPM Defective Part Per Million 品的标准 Design Verification / Design DV 设计确认 Validation 客户要求的工程更改或内部所发出的工 ECN Engineering Change Notice 程更改文件 ECO Engineering Change Order 客户要求的工程更改静电发放-由两种不导电的物品一起摩 ESD Electrostatic Discharge 擦而产生的静电可以破坏ICs和电子设备在生产线上或操作中由生产操作员对产 FI Final Inspection 品作最后检查 F/T Functional Test 测试产品的功能是否与所设计的一样 FA First Article / Failure Analysis 首件产品或首件样板/ 产品不良分析功能测试-检查产品的功能是否与所设 FCT Functional Test 计的一样符合产品的装配，形状和外观及功能要 FFF Fit Form Function 求 FFT Final Functional Test 包装之前，在生产线上最后的功能测试失效模式与后果分析-- 预测问题的发 FMEA Failure Mode and Effect Analysis 生可能性并且对之采取措施 FPY First Pass Yield 首次检查合格率 FTY First Test Yield 首次测试合格率 FW Firmware 韧体（软件硬化）-控制产品功能的软件在波峰焊接之前，将PTH元件用手贴装 HL Handload 到PCB 上，和手插机相同 I/O Input / Output 输入 / 输出 iBOM Indented Bill of Material 内部发出的BOM（依照客户的BOM）线路测试-- 用电气和电子测试来检查 ICT In-circuit Test PCBA短路，开路，少件，多件和错件等等不良情报联络书-反馈信息所使用的一种表 IFF Information Feedback Form 格 IR Infra-red 红外线主要制程输入可变因素-在加工过程中， KPIV Key Process Input Variable 所有输入的参数/元素，将影响制成品的质量的可变因素主要制程输出可变因素-在加工过程中， KPOV Key Process Output Variable 所有输出的结果，所呈现的产品品质特征。

PCBA专业词汇

PCBA专业词汇综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、ER 制元件：printed component7、制接点：printed contact8、制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board一.、35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、外表层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠T^板：static flex board四、55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film 五、12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、力口成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氧胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树月旨：polyfunctional epoxy resin12、澳化环氧树月旨：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树月旨：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性^旨：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双鼠月堂:dicyandiamide29、粘结齐【J: binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 E 玻璃纤维：E-glass fibre43、 D 玻璃纤维：D-glass fibre44、S 玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保存率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔(剖面)轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机限制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化(设计)：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规那么检查：design rule checking53、走(布)线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线(通道)：conduction (track)2、导线(体)宽度：conductor width3、导线品巨离：conductor spacing4、导线层：conductor layer5、导线宽度 /间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形^^盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V 形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹(背)裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/ 盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准外表间镀覆孑L: quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孑L 图：drill drawing50、装配图：assembly drawing51、制板组装图：printed board assembly drawing52、参考基准：datum referan。

PCBA专有名词(By部门)

9
各部門專有名詞教材
NO. 34 35 CP 36 CCL 37 CAR 38 CIF 39 Cr 40 CPM 41 42 C.T. 43 44 45 46 DFM 47 DFT 48 DOE 49 50 DC 51 DCC 52 DNS 53 DIP 54 ES 55 ESD 56 EMS 57 ENG 58 ECN 59 EC 60 ECR 61 EVT 62 ERP 63 64 EXP 65 英文簡稱英文全稱 Continuous improvement Control Plan Copper Clad Laminate Corrective Action Report Cost Insurance &Freight Critical (Defect) Critical Path Method Crystal Cycle Time Cycle time reduction Data room/resource centre Debug Design For Manufacture Design For Testing Design Of Experiment DIODE Direct Current Document Control Center Domain Name Server Dual in-line package (Manual insertion) Electrical Specification Electro Static Discharge Electronics Manufacturing Services Engineering Engineering Change Notice Engineering Change Engineering Change Request Engineering Verification Test Enterprise Resource Planning Excessive solder Export Extra component 持續改進管制計劃銅箔基板矯正措施報告成本、保險加運費價嚴重 (缺點) 要徑法震盪器生產週期 (單片加工工時) 減少週期時間資料室除錯／調試量產最佳化設計測試最佳化設計實驗計畫法二極管直流電文管中心功能變數名稱(域名)服務器雙列直插封裝(引申為手插件作業) 電氣規格靜電釋放電子製造服務工程工程變更通知工程變更工程變更請求工程驗證測試企業資源規劃多錫 (外銷)出口多件失效模式與效應分析中譯 ADM B B B A B A C B B C B B C C C B B A C A C A A B A A A A A B A B B ENG B A B A B A B B B C C A C C C B B A C A B A A B A A A A A B A B B

PCBA介绍-PeterYu

显影--使用碳酸钠溶液洗去未硬化的感光干膜，让不需干膜保护的铜箔露出来蚀刻--使用蚀铜液对没有干膜保护的铜箔进行蚀刻去膜（脱膜）--将剩余感光干膜去除

检测--使用AOI进行基板检测

定位黑（棕）氧化，烘烤—其目的在于使内层线路板表面上形成一层高抗撕裂强度的黑（棕）氧化铜，以增加内层板在进行层压时的结合能力排版，压版
（Printed Circuit Board）

根据材质分： a. 有机材质酚醛树脂、玻璃纤维/环氧树脂、Polyimide、BT/Epoxy等皆属之。 b. 无机材质铝、Copper-invar-copper、ceramic等皆属之。主要取其散热功能根据电路层数分类：分为单面板SSB(见图1 ）、双面板DSB（见图2）和多层板MLB（见图3）。常见的多层板一般为4层板或6层板，复杂的多层板可达几十层根据软硬进行分类：分为刚性电路板RPC和柔性电路板FPC(见图4)、软硬结合板(见图5 ) 依用途分：通信/耗用性电子/军用/计算机/半导体/电测板…,（见图 6）BGA

将整个印刷电路板电镀一层铜先将线路板作适当的粗化处理再将感光绿漆涂覆于板面上预烘干燥冷却后送入紫外线曝光机中曝光以溶剂去除未曝光区域的绿漆高温烘烤使绿漆完全硬化将客户所需的文字，商标，零件标号以网版印刷方式印在版面上再用热烘（或紫外线照射)方式让文字漆墨硬化

常见的Finish有 1）喷锡--成本低，但是表面不平整，易造成制程问题，多用于电脑主机板 2）OSP（护铜剂）--成本低但是易氧化 3）镀金--品质稳定但成本高 4）化金--可焊性寿命比OSP更久，但有墨垫（Black Pad）问题 5）化银--可焊性寿命比OSP更久，但比化金较差 6）化锡—在化锡板的制程中必须加入硫脲（Thiourea）方能使锡离子逆向取代铜，但是硫脲却有致癌的危险性。此外，硫脲会攻击印刷电路板的防焊层（Solder mask），且铜与锡在室温下即会发生反应，因此化锡板也有保存性不佳的疑虑 7）选化（化金+OSP）--结合两者优点，制程较复杂且费时间

常用生管专用术语常用生管专用术语

常用生管专用术语常用生管专用术语1. A/M—action memo.备忘记录2. AVL—avail vendor list 合格供应商目录3. ASSY—assemble 组装，装配4. BOM—bill of material 物料清单5. BFM—buy from 采购方式6. BU—business unit 业务单位7. BIOS—basic input/output system 基本输入/输出系统8. CFM—consign from 付款方式9. CCB—change control board 控制板10. DOA—dead on arrival 到货即损，经销商收到厂家的货品后打开就是坏的，就可以退货，但是这是有个期限的,超过期限就是RMA 了11. RMA—return material authorization 退料审查12. DVT—design verification test BVT 是Build Verification Test，基本验证测试对完成的代码进行编译和连接，产生一个构造，以检查程序的主要功能是否会像预期一样进行工作。

13. BVT—Build Verification Test，基本验证测试，对完成的代码进行编译和连接，产生一个构造，以检查程序的主要功能是否会像预期一样进行工作。

14. PVT—Process Verification Test 意为小批量过程验证测试，硬件测试的一种，主要验证新机型的各功能实现状况并进行稳定性及可靠性测试15. EVT—Engineering Value Test 工程样品验证测试16. DC—document center 资料中心17. DIMM—sdram 内存18. ETA—estimate time of arrival 预计到货时间19. ETD—estimate time of deliver 预计发货时间20. ERP—enterprise resource plan 企业资源计划21. EBOM—engineering bill of material 试产物料清单22.MBOM—Manufacturebill of material 批量生产物料清单23. PCN —Process Change Notice 工序改动通知24. ECN —Engineering Change Notice 工程变更通知(供货商)25. ECO —Engineering Change Order 工程改动要求(客户)26. PCN —Process Change Notice 工序改动通知27. PMP—Product Management Plan 生产管制计划28. FIFO —First-in First-out, 先入先出29. F/T—function test 功能测试30. JIT—just in time 及时反应31. KC—key component 关键元件32. L/T—lead time 提前期33. TLT—Transport lead time 调拨提前期34. MLT—manufacture lead time 生产提前期35. PLT—purchase lead time36. MRP—material require plan 物料需求计划37. MPS—master production schedule 主生产计划38. MDS—master demand schedule 主需求计划39. MN—manufacturing notice 生产通知单40. MP—master production 主计划41. MO—manufacturing order 生产单号42. MFG—manufacturing 造模块43. MPI—manufacturing process instruction 生产流程说明书44. MTD —month till today 月产量45. MRB—Material Review Board 材料审查会议46. OPT—output till today 日产量47. OU—-operation unit 运营单位48. O/H—-overhead 间接费用49. O/T—work over time 误期50. ODM—original design manufacturing 贴牌生产51. OEM—original equipment manufacturing 代工生产52. PCBA—PWA 印刷线路板组装53. PMR—problem material review report 物料检验报告54. P/S—production and sales meeting 产销会55. QVL—qualified vendor list 合格厂商56. IQC—incoming quality contro 来料品质控制57. IPQC—InPut Process Quality Cortrol 过程品质控制58. FQC—Finish or Final Quality Control 成品质量检验59. OQC—Outgoing Quality Control 出货品质管制60. OQA—outgoing quality assurance 成品最终出货检查61. PQE—production quality engineer 产品质量工程师62. SMT—表面黏著技术63. SA—sales authorization 销售授权64. SI—sales instruction 销售演示65. SOP—standard operation procedure 标准作业程序66. T/S—trouble shooting 故障分析67. WIP—work in process 工作进度68. W/O—work order 工单69. W/H—warehouse 仓库70. STD—standard 标准71. I/S ratio—inventory amt / sales amt 周转率72. DPPM—defect percentage per million 百万分比的缺陷率73. OFD—order fulfill department 订单执行部门74. OP—order processor 订购点75. PD—purchase dep.采购部76. PC—production control 生产计划控制77. MC—material control 物料控制78. R&D—research and development 研发部79. LMD—logistic management dep.资材部80. ED—engineering department 工程部。

工厂中SMT制程段生产中常用英文

工厂中SMT制程段生产中常用英文In the manufacturing industry, Surface Mount Technology (SMT) is a popular method for electronic component assembly. It is widely used in factories around the world for its efficiency and accuracy. In this article, we will explore the commonly used English terms and phrases in SMT production.1. PCBA (Printed Circuit Board Assembly)PCBA refers to the process of assembling electronic components onto a printed circuit board (PCB). It includes soldering, solder paste printing, component placement, and reflow soldering.2. Solder Paste PrintingSolder paste is a mixture of solder alloy and flux. In the SMT process, solder paste is printed onto the PCB using a stencil. This is an important step to ensure proper alignment and solder joint quality.3. StencilA stencil is a metal or polymer sheet with openings that correspond to the positions of the components on the PCB. It is used to apply solder paste onto the board during the printing process.4. Pick and Place MachineA pick and place machine is used to place the electronic components onto the PCB accurately. It can handle different component sizes and shapes. This machine uses robotic arms and a vision system to ensure precise placement.5. Reflow SolderingReflow soldering is the process of melting the solder paste to create a permanent solder joint between the components and the PCB. The PCB with the components is passed through a furnace that heats it up to the soldering temperature.6. Soldering Temperature ProfileThe soldering temperature profile is a set of temperature values and durations that specify the heating and cooling process during reflow soldering. It ensures proper solder joint formation and prevents component and PCB thermal damage.7. SMD (Surface Mount Device)SMDs are electronic components that are designed to be mounted directly onto the surface of a PCB. They are small in size and have no lead wires. SMDs include resistors, capacitors, integrated circuits, and many other electronic devices.8. Moisture Sensitivity Level (MSL)MSL is a measure of how sensitive an SMD is to moisture absorption. Components with higher MSL ratings require special handling and storage conditions to avoid damage during soldering.9. InspectionInspection is an essential part of SMT production to ensure the quality of the assembly. It includes visual inspection for solder joint defects, automated optical inspection (AOI) to detect component placement errors, and X-ray inspection to check for hidden defects.10. Defect Detection and RepairIn SMT production, defects can occur during the printing, placement, or soldering processes. Defect detection systems are used to identify defective components or solder joints. Repairs are then made to correct the defects and ensure the functionality of the final product.11. ESD (Electrostatic Discharge) ProtectionESD is the sudden transfer of an electric charge between two objects. In the SMT production environment, ESD can damage sensitive electronic components. Therefore, proper ESD protection measures, such as the use of grounding straps and anti-static mats, are essential.12. Test and MeasurementAfter the PCBA is completed, it undergoes testing to ensure that it meets the required specifications. Testing may include functional testing, in-circuit testing (ICT), and boundary scan testing. Measurements are taken to verify the electrical characteristics and performance of the assembled board.In conclusion, SMT production in a factory involves various processes and techniques. This article has covered the commonly used English terms and phrases in SMT production, providing a basic understanding of the key stages and concepts. Having a good grasp of these terms will help both workers and managers communicate effectively and efficiently in an SMT production environment.SMT生产是电子制造业中常用的组装技术之一。

pcba板控制计划中英文描述

pcba板控制计划中英文描述PCBA Board Control Plan。

1. Introduction。

The PCBA (Printed Circuit Board Assembly) board control plan is a critical document that outlines the quality control measures and procedures for the manufacturing and assembly of printed circuit boards. This plan is essential for ensuring that the PCBA boards meet the required quality standards and specifications, and it serves as a guide for the production and inspection processes.2. Scope。

The PCBA board control plan covers the entire production process, from the receipt of materials and components to the final assembly and testing of the printed circuit boards. It includes the quality control measures for each stage of the production process, as well as the criteria for accepting or rejecting the boards based on their quality and performance.3. Incoming Material Inspection。

pcba工艺流程介绍大纲

pcba工艺流程介绍大纲英文回答：Introduction:PCBA (Printed Circuit Board Assembly) is a crucial process in the manufacturing of electronic devices. It involves the assembly of electronic components onto aprinted circuit board (PCB) to create a functionalelectronic system. The PCBA process consists of several steps, including component placement, soldering, inspection, and testing. In this article, I will provide an outline of the PCBA process.Component Placement:The first step in the PCBA process is component placement. This involves placing electronic components,such as resistors, capacitors, and integrated circuits,onto the PCB according to the design specifications. Thecomponents can be placed manually or by using automated pick-and-place machines. The goal is to ensure the accurate and precise placement of components on the PCB.Soldering:Once the components are placed on the PCB, the next step is soldering. Soldering is the process of joining the components to the PCB using solder. There are various soldering techniques, including wave soldering, reflow soldering, and hand soldering. Wave soldering is commonly used for through-hole components, while reflow soldering is used for surface mount components. Hand soldering is typically done for components that cannot be soldered using automated methods. The soldering process ensures a reliable electrical and mechanical connection between the components and the PCB.Inspection:After soldering, the PCB goes through an inspection process to check for any defects or errors. This is done toensure the quality and reliability of the assembled PCB. Various inspection techniques, such as visual inspection, automated optical inspection (AOI), and X-ray inspection, can be used to detect defects such as solder bridges, missing components, or misaligned components. Any defects found during the inspection process are rectified before proceeding to the next step.Testing:Once the PCB has passed the inspection process, it undergoes testing to ensure its functionality. Testing involves applying electrical signals to the PCB and checking if the desired output is obtained. Functional testing, boundary scan testing, and in-circuit testing are some of the commonly used testing methods. The goal is to verify that the assembled PCB meets the required performance specifications.Packaging and Shipping:After the PCB has been tested and verified, it is readyfor packaging and shipping. Packaging involves protecting the PCB from physical damage during transportation. This can be done by using anti-static bags, foam inserts, or custom packaging solutions. Once packaged, the PCB is ready to be shipped to the customer or the next stage of the manufacturing process.中文回答：简介：PCBA（Printed Circuit Board Assembly，印刷电路板组装）是电子设备制造过程中的关键环节。

pcba开发和设计流程

pcba开发和设计流程英文回答：PCBA (Printed Circuit Board Assembly) development and design process involves several steps and considerations. Here is a general overview of the process:1. Requirement Analysis: The first step is to understand the requirements and specifications of the PCBA. This includes determining the functionality, performance, and features required for the final product.2. Schematic Design: The next step is to create a schematic diagram that represents the circuit connections and components. This involves selecting the appropriate components and interconnections to achieve the desired functionality.3. PCB Layout Design: Once the schematic is finalized, the PCB layout design is created. This involves placing thecomponents on the PCB and routing the electrical connections between them. The layout design must consider factors like signal integrity, power distribution, and thermal management.4. Component Procurement: After the PCB layout is finalized, the components needed for the assembly are procured. This includes sourcing the required electronic components from suppliers.5. PCB Manufacturing: The PCB design files are sent toa manufacturer for fabrication. The manufacturer produces the PCBs according to the design specifications, including the number of layers, material, and surface finish.6. PCB Assembly: Once the PCBs are manufactured, the components are assembled onto the PCBs. This involves soldering the components onto the board using automated or manual assembly processes.7. Testing and Quality Control: After assembly, the PCBA undergoes testing to ensure its functionality andquality. Various tests, such as functional testing, electrical testing, and environmental testing, are conducted to validate the performance and reliability of the PCBA.8. Firmware Development: If the PCBA includes a microcontroller or programmable logic, firmware development is required. This involves writing the software code that controls the behavior and functionality of the PCBA.9. Final Product Integration: Once the PCBA is tested and validated, it is integrated into the final product. This may involve additional mechanical assembly, enclosure design, and integration with other subsystems.10. Mass Production: After successful integration, the PCBA design is ready for mass production. The manufacturing process is scaled up to produce a large quantity of PCBA units to meet market demand.中文回答：PCBA（印刷电路板组装）的开发和设计过程涉及多个步骤和考虑因素。

质量管理体系中英文缩写与其解释

质量管理体系中英文缩写与其解释Engineering 工程 / Process 工序（制程）Man, Machine, Method, Material,人，机器，方法，物料，环境- 可能导4M&1EEnvironment致或造成问题的根本原因AIAutomatic Insertion自动插机ASSYAssembly制品装配ATEAutomatic Test Equipment自动测试设备BLBaseline参照点BMBenchmark参照点BOMBill of Material生产产品所用的物料清单C&ED/CCause and Effect Diagram原因和效果图AEDCACorrective Action解决问题所采取的措施电脑辅助设计.用于制图和设计3维物体 CADComputer-aided Design的软件对文件的要求进行评审，批准，和更改 CCBChange Control Board的小组依照短期和长期改善的重要性来做持续 CIContinuous Improvement改善COBChip on Board邦定-线焊芯片到PCB板的装配方法. CTCycle Time完成任务所须的时间DFMDesign for Manufacturability产品的设计对装配的适合性设计失效模式与后果分析--在设计阶段 Design Failure Mode and EffectDFMEA预测问题的发生的可能性并且对之采取 Analysis措施六西格玛(6-Sigma)设计 -- 设计阶段预 DFSSDesign for Six Sigma测问题的发生的可能性并且对之采取措施并提高设计对装配的适合性DFTDesign for Test产品的设计对测试的适合性实验设计-- 用于证明某种情况是真实DOEDesign of Experiment的根据一百万件所生产的产品来计算不良DPPMDefective Part Per Million品的标准Design Verification / DesignDV设计确认Validation客户要求的工程更改或内部所发出的工ECNEngineering Change Notice程更改文件ECOEngineering Change Order客户要求的工程更改静电发放-由两种不导电的物品一起摩ESDElectrostatic Discharge擦而产生的静电可以破坏ICs和电子设备在生产线上或操作中由生产操作员对产FIFinal Inspection品作最后检查F/TFunctional Test测试产品的功能是否与所设计的一样FAFirst Article / Failure Analysis首件产品或首件样板/ 产品不良分析功能测试-检查产品的功能是否与所设FCTFunctional Test计的一样符合产品的装配，形状和外观及功能要FFFFit Form Function求FFTFinal Functional Test包装之前，在生产线上最后的功能测试失效模式与后果分析-- 预测问题的发FMEAFailure Mode and Effect Analysis生可能性并且对之采取措施FPYFirst Pass Yield首次检查合格率FTYFirst Test Yield首次测试合格率FWFirmware韧体（软件硬化）-控制产品功能的软件在波峰焊接之前，将PTH元件用手贴装HLHandload到PCB上，和手插机相同I/OInput / Output输入 / 输出iBOMIndented Bill of Material内部发出的BOM（依照客户的BOM）线路测试-- 用电气和电子测试来检查ICTIn-circuit TestPCBA短路，开路，少件，多件和错件等等不良情报联络书-反馈信息所使用的一种表IFFInformation Feedback Form格IRInfra-red红外线主要制程输入可变因素-在加工过程中，KPIVKey Process Input Variable所有输入的参数/元素，将影响制成品的质量的可变因素主要制程输出可变因素-在加工过程中，KPOVKey Process Output Variable所有输出的结果，所呈现的产品品质特征。

PCBA生产工艺介绍

1、贴片机程序制作：
贴片机程序是SMT生产最重要的资料。
贴片程序的质量直接影响着贴片生产的效率、质量以及产品资料的正确性。
贴片机种类：西门子富士。。。。公司现有产品种类： 5000多种公司现有贴片元件种类： 10000多公司现有贴片程序数量：每种机型10000多三种贴片元件库的数量：每种机型 5000多个贴片程序制作需要软件：EDA设计软件、数据处理软件、
• 是否有易产生不良的设计；
• 是否要制作专用托架；
。。。
• 元件方向是否插上后能看见；
• 元件是否好插入；
• PCB上有无标示流水方向；
。。。
• 元件焊盘方向是否跟流水方向垂直；
• 底部器件高度是否会碰到喷嘴，单板变形呢；
• 器件吸热是否太大不易上锡
• 太重、贴片多做托架；
钢网设计、制作
针对具体PCB单板的要求，需要对钢片的选择、钢网厚度确定，开口设计，还要全面考虑整个PCB的布局情况。
对焊接效果的影响
特殊器件的钢网设计
钢网开口工艺要求
钢网设计对印刷效果影响
钢网开口需要根据PCB的焊盘和元器件引脚形式进行设计，以达到焊料的合理分配。
钢网的管理
钢网数量多，钢网的存储、查找、使用、清洗、版本控制、报废等工作，对SMT生产影响很大。
产品复杂性越来越强，元件和工艺流程也越来越复杂，因此研发产品的产前评审工作非常重要，同时也需要熟练的生产工艺知识支持。
评审阶段（二）
根据研发提供的加工单板实物和PCB及相关资料，设计相关加工要求和流程，提前识别出生产中的各种问题并跟研发沟通处理确认。
PCB文件拼版图 PCB裸板测试文件写片程序背板衬板。。。

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