台湾大毅薄膜贴片保险丝CF系列选型手册

Rated Current 0.50A 0.80A 1.00A 1.25A 1.50A 2.00A 2.50A 3.00A 4.00A 5.00A 7.00A
*Resistance valve was measured with less than 10% of rated current
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4. Dimensions
Unit: mm
Type (Inch Size code) CF04 (0402) CF06 (0603) CF12 (1206) Dimensions (mm) L 1.0±0.1 1.6±0.1 3.1±0.1 W 0.52±0.05 0.80±0.10 1.55±0.10 C 0.2±0.1 0.3±0.2 0.5±0.3 d 0.25±0.1 0.35±0.2 0.50±0.2 t 0.35±0.05 0.45±0.10 0.60±0.10
2. Construction
Over Coat
Conductor
Sn Plating
Ceramic Substrate
Fuse Element
Cu / Ni Plating
3. Type Designation
CF 06 V5 T R50 2 Rated Voltage Size
V6:63V 04:0402(1005) 06:0603(1608) 12:1206(3216) V5:50V V3:32V T: Paper Tape (5K/10K)
*Resistance valve was measured with less than 10% of rated current ** CF04V3TR75 is still under UL application.
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Document No TCF-XXOS032J 2012/06/28 3/20
9.3 Peel –off force : Top cover tape 10〜15∘ carrier tape PULL 300 mm/min STANDARD : 0.1 ~ 0.7 N
10. Storage Conditions:
Temperature: 5℃~35℃,Humidity:40%~75%
Part Designation CF12V6TR50 CF12V6TR80 CF12V6T1R0 CF12V6T1R25 CF12V6T1R50 CF12V6T2R0 CF12V3T2R50 CF12V3T3R00 CF12V3T4R0 CF12V3T5R0 CF12V3T7R0
Marking F K L M P S T 3 W Y Z
5. Applications and ratings
Part Designation CF04V3TR315 CF04V3TR50 CF04V3TR75** CF04V3TR80 CF04V3T1R0 CF04V3T1R25 CF04V3T1R50 CF04V3T1R60 CF04V3T2R0 CF04V3T2R50 CF04V3T3R0 CF04V3T3R15 CF04V3T4R0 Rated Marking Current D F V K L M P N S T 3 U W Resistance Body Rated Breaking (mΩ) Temperature Voltage Capacity rising Tolerance±25% 0.315A 690 0.50A 340 0.75A 140 0.80A 100 1.00A 95 Open within 1.25A 57 1min.at DC32V <75℃at 100% 1.50A 45 200% DC 32V 35A rated current rated 1.60A 44 current 2.00A 33 2.50A 25 3.00A 19 3.15A 18 4.00A 12 Fusing Time
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Thin Film Chip Fuse
Issued date Page
6. Temperature Derating Curve 6.1 Normal Ambient Temperature: 25℃ 6.2 Operating Temperature: -20℃~105℃, whit proper Derating factor as below:
Type series
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Thin Film Chip Fuse
Issued date Page
9.2 Reel Specifications
Unit: mm
Series CF04 CF06 CF12 ψA 178 ±2.0 ψB 60.0±1.0 ψC 13.0±1.0 W 9.0±1.0 T 11.4±2.0
105
7. Reliability Tests
Parameter Carrying capacity Fusing Time Interrupting Ability Bending Test Resistance to solder Heat Solderability Temperature Rise Resistance to Dry Heat Resistance to Solvent Residual Resistance Thermal Shock Requirement No fusing Within 1 minute No mechanical damages No mechanical damages ±20% 95% coverage minimum <75℃ ±20% No evident damages on protective coating and marking 10kΩ and more △R< 10 % Test Method Rated current ,4hr 200% of its rated current After the fuse is interrupted ,rated voltage applied for 30sec again Distance between holding points: 90mm, Bending:3mm,1time ,30sec 260℃±5℃,10±1second 235℃±5℃, 2±0.5second 245℃±5℃, 2±0.5second (Lead Free) 100% of its rated current, Measure of surface temperature 105℃±5℃,1000 hrs 23℃±5℃of Isopropyl alcohol 90second Measure DC resistance after fusing -20℃/+25℃/+125℃/+25℃, 10 cycles
Thin Film Chip Fuse
Issued date Page
Part Designation CF06V5TR40 CF06V5TR50 CF06V3TR63 CF06V3TR80 CF06V3T1R0 CF06V3T1R25 CF06V3T1R50 CF06V3T1R60 CF06V3T2R0 CF06V3T2R50 CF06V3T3R00 CF06V3T3R15 CF06V3T4R0 CF06V3T5R0
A
0.7±0.05
B
1.2±0.05
W
8.0±0.2
F
3.5±0.05
E
1.75±0.1
P1
2.0±0.1
P2
2.0±0.05
P0
4.0±0.1
D0
+0.1 ψ1.5 0 +0.1 ψ1.5 -0 +0.1
T
0.45±0.1
1.1±0.1
1.9±0.1
8.0±0.2
3.5±0.05
1.75±0.1
4.0±0.1
2.0±0.05
4.0±0.1
0.64±0.1
2.0±0.15
3.6±0.2
8.0±0.2
3.5±0.05
1.75±0.1
4.0±0.1
2.0±0.05
4.0±0.1
ψ1.5 -0
0.84±0.1
Unit: mm
Paper Tape Type CF Size 04 2 mm pitch 180mm/R 10000 Paper Tape 4 mm pitch 180mm/R CF CF 06 12 5000 5000
Chip Fuse
Packaging
Rated Current
R50:0.5A 1R0:1A
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Thin Film Chip Fuse
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Marking E F I K L M P N S T 3 U W Y
Rated Current 0.4A 0.50A 0.63A 0.80A 1.00A 1.25A 1.50A 1.60A 2.00A 2.50A 3.00A 3.15A 4.00A 5.00A
Resistance Body Rated Breaking (mΩ) Temperature Voltage Capacity rising Tolerance±25% 496 DC 50V DC50V 50A 290 205 132 84 Open within DC32V 63 DC 32V <75℃at 1min.at 50A 50.5 200% 100% rated 45 rated current current 34 24.5 20 DC32V 19 DC 32V 50A 13 11 Fusing Time
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Thin Film Chip Fuse
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8. Marking
Symbol for Rating Current Symbol D E Rating Current(A) 0.315 0.4 F
0.5
I
0.63
K
0.8
L
1
M
1.25
P
1.5
N
1.6
S
2
T
2.5
3
3
U
3.15
W
4
Y
5
Z
7
9. Taping & Reel 9.1 Taping Dimensions 4mm pitch paper
Packing
Paper Tape Paper Tape Paper Tape
Type CF04 CF06 CF12
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Thin Film Chip Fuse
Issued date Page
1. Scope
This specification applies for the fuse series of thin film chip fuse made by TA-I.
*Resistance valve was measured with less than 10% of rated current Resistance Body Rated Breaking (mΩ) Temperature Voltage Capacity rising Tolerance±25% 517 211 132 DC63V DC 63V 50A 95 Open within 76 1min.at <75℃at 100% 200% 40.5 rated current rated 31.5 current 23.25 DC32V 16 DC 32V 50A 12 7.5 Fusing Time
11. Shelf Life:
2 years from manufacturing date