传感器外文翻译文献
电容式传感器的外文文献翻译、中英文翻译、外文翻译
参考资料原文：Capacitive sensors and the main features of the basic concepts: The measured volume of the machinery, such as displacement, pressure change is converted to the sensor capacitance. It is the sensitive part of the capacitor with variable parameters. Its most common form is composed of two parallel electrodes, a very inter-air as the medium of the capacitor, if the neglect edge effects, the capacitance for the capacitor plate ε A / δ, where εis a very inter-medium dielectric constant, A two electrode effective area covered by each other, δ is the distance between two electrodes. δ, A, εone of the three parameters will lead to the change in capacitance changes can be used for measurement. Therefore capacitive sensors can be divided into polar distance change type, change type size, media type three types of changes.Most from the changes in small type generally used to measure the linear displacement, or as a result of force, pressure, vibration caused by changes in polar distance (see capacitive pressure sensors). Change type size generally used to measure the angular displacement or linear displacement larger. Changes in media type commonly used in level measurement and a variety of media, temperature, density, humidity measurement. The advantage of the sensor capacitor structure is simple, inexpensive, high sensitivity,过载能力strong, good dynamic response and high temperature, radiation, vibration and other adverse conditions of strong adaptability and strong. The disadvantage is that there are non-linear output, parasitic capacitance and the distributed capacitance on the sensitivity and accuracy the impact of larger and more complex circuits, such as connectivity. Since the late 70s, with the development of integrated circuit technology, a packaging and micro-measuring instrument with capacitive sensors.This new type of distributed capacitance sensors can greatly reduce the impact to overcome the inherent drawbacks. Capacitive sensor is a very wide use, a great potential for development of the sensor.Capacitive sensor working principle：Capacitive sensor surface of the induction of two coaxial metal electrode composition, much like "open" capacitor electrode, the two electrodes form a capacitor, in series with the RC oscillation circuit. Power when connected, RC oscillator is notoscillating, when a goal of moving around electrical capacitor, the capacitor capacity increased, the oscillator to start oscillation. Circuit after the passage of the deal, will be two kinds of vibration and vibration signals into switching signals, which played a detection purpose of the existence of any objects. The sensor can detect metal objects, but also to detect non-metallic objects, metal objects can move away from the largest, non-metallic objects on the decision to move away from the dielectric constant material, the greater the dielectric constant materials, the availability of action the greater distance.Application of capacitive sensors：Capacitive sensor can be used to measure linear displacement, angular displacement, vibration amplitude, especially suitable for measuring high-frequency vibration amplitude, precision rotary axis accuracy, acceleration and other mechanical parameters. Pole-changing type of application from a smaller displacement in the measurement range to several hundred microns in 0.01m, precision can reach 0.01m, a resolution of up to 0.001m. Change type size larger displacement can be measured, for the zero-range a few millimeters to a few hundred mm, 0.5 percent better than the linear resolution of 0.01 ~ 0.001m. Capacitive angular displacement sensor point of view and the dynamic range to a few degrees, a resolution of about 0.1 "up to the stability of the zero angle-second, widely used in precision angle measurement, such as for high-precision gyroscopes and accelerometers tilting . capacitive measurement sensor can measure the peak amplitude for the 0 ~ 50m, a frequency of 10 ~ 2kHz, sensitivity is higher than 0.01m, non-linear error of less than 0.05m.Capacitive sensor can also be used to measure pressure, differential pressure, level, surface, composition content (such as oil, the water content of food), non-metallic coating materials, such as film thickness, dielectric measurements of humidity, density, thickness, etc., in the automatic detection and control systems are also often used as a location signal generator. Capacitive differential pressure sensor measuring range up to 50MPa, an accuracy of ± 0.25% ~ ± 0.5%. Capacitive sensor for measuring range of the thickness of a few hundred microns, resolution of up to 0.01m. Capacitive Proximity Switches can not only detect metal, but also can detect plastic, wood,paper, and other dielectric liquids, but can not achieve the ultra-small, the movement distance of about 10 ~ 20mm. Electrostatic capacitive level switch is widely used in detection is stored in the tank, hopper, such as the location of containers in a variety of objects of a mature product. When the capacitive sensor measuring metal surface conditions, from the size, vibration amplitude is often used very variable from unilateral type, when the measured object is a capacitor electrode, and the other electrode in the sensor inside. This type of sensor is a non-contact measurement, dynamic range is relatively small, about a few millimeters is about the precision of more than 0.1m, a resolution of 0.01 ~ 0.001m.译文：电容式传感器的基本概念及主要特点:把被测的机械量，如位移、压力等转换为电容量变化的传感器。
红外传感器论文中英文资料对照外文翻译
中英文资料对照外文翻译外文资料Moving Object Counting with an Infrared Sensor NetworkBy KI, Chi KeungAbstractWireless Sensor Network (WSN) has become a hot research topic recently. Great benefit can be gained through the deployment of the WSN over a wide range of applications, covering the domains of commercial, military as well as residential. In this project, we design a counting system which tracks people who pass through a detecting zone as well as the corresponding moving directions. Such a system can be deployed in traffic control, resource management, and human flow control. Our design is based on our self-made cost-effective Infrared Sensing Module board which co-operates with a WSN. The design of our system includes Infrared Sensing Module design, sensor clustering, node communication, system architecture and deployment. We conduct a series of experiments to evaluate the system performance which demonstrates the efficiency of our Moving Object Counting system.Keywords:Infrared radiation，Wireless Sensor Node1.1 Introduction to InfraredInfrared radiation is a part of the electromagnetic radiation with a wavelength lying between visible light and radio waves. Infrared have be widely used nowadays including data communications, night vision, object tracking and so on. People commonly use infrared in data communication, since it is easily generated and only suffers little from electromagnetic interference. Take the TV remote control as an example, which can be found in everyone's home. The infrared remote control systems use infrared light-emitting diodes (LEDs) to send out an IR (infrared) signal when the button is pushed. A different pattern of pulses indicates the corresponding button being pushed. To allow the control of multiple appliances such as a TV, VCR, and cable box, without interference, systems generally have a preamble and an address to synchronize the receiver and identify the source and location of the infrared signal. To encode the data, systems generally vary the width of the pulses (pulse-width modulation) or the width of the spaces between the pulses (pulse space modulation). Another popular system, bi-phase encoding, uses signal transitions to convey information. Each pulse is actually a burst of IR at the carrier frequency. A 'high' means a burst of IR energy at the carrier frequency and a 'low' represents an absence of IR energy. There is no encoding standard. However, while a great many home entertainment devices use their own proprietary encoding schemes, somequasi-standards do exist. These include RC-5, RC-6, and REC-80. In addition, many manufacturers, such as NEC, have also established their own standards.Wireless Sensor Network (WSN) has become a hot research topic recently. Great benefit can be gained through the deployment of the WSN over a wide range of applications, covering the domains of commercial, military as well as residential. In this project, we design a counting system which tracks people who pass through a detecting zone as well as the corresponding moving directions. Such a system can be deployed in traffic control, resource management, and human flow control. Our design is based on our self-made cost-effective Infrared Sensing Module board which co-operates with a WSN. The design of our system includes Infrared Sensing Module design, sensor clustering, node communication, system architecture and deployment. We conduct a series of experiments to evaluate the system performance which demonstrates the efficiency of our Moving Object Counting system.1.2 Wireless sensor networkWireless sensor network (WSN) is a wireless network which consists of a vast number of autonomous sensor nodes using sensors to monitor physical or environmental conditions, such as temperature, acoustics, vibration, pressure, motion or pollutants, at different locations. Each node in a sensor network is typically equipped with a wireless communications device, a small microcontroller, one or more sensors, and an energy source, usually a battery. The size of a single sensor node can be as large as a shoebox and can be as small as the size of a grain of dust, depending on different applications. The cost of sensor nodes is similarly variable, ranging from hundreds of dollars to a few cents, depending on the size of the sensor network and the complexity requirement of the individual sensor nodes. The size and cost are constrained by sensor nodes, therefore, have result in corresponding limitations on available inputs such as energy, memory, computational speed and bandwidth. The development of wireless sensor networks (WSN) was originally motivated by military applications such as battlefield surveillance. Due to the advancement in micro-electronic mechanical system technology (MEMS), embedded microprocessors, and wireless networking, the WSN can be benefited in many civilian application areas, including habitat monitoring, healthcare applications, and home automation.1.3 Types of Wireless Sensor NetworksWireless sensor network nodes are typically less complex than general-purpose operating systems both because of the special requirements of sensor network applications and the resource constraints in sensor network hardware platforms. The operating system does not need to include support for user interfaces. Furthermore, the resource constraints in terms of memory and memory mapping hardware support make mechanisms such as virtual memory either unnecessary or impossible to implement. TinyOS [TinyOS] is possibly the first operating system specifically designed for wireless sensor networks. Unlike most other operating systems, TinyOS is based on an event-driven programming model instead of multithreading. TinyOS programs are composed into event handlers and tasks with run to completion-semantics. When an external event occurs, such as an incomingdata packet or a sensor reading, TinyOS calls the appropriate event handler to handle the event. The TinyOS system and programs are both written in a special programming language called nesC [nesC] which is an extension to the C programming language. NesC is designed to detect race conditions between tasks and event handlers. There are also operating systems that allow programming in C. Examples of such operating systems include Contiki [Contiki], and MANTIS. Contiki is designed to support loading modules over the network and supports run-time loading of standard ELF files. The Contiki kernel is event-driven, like TinyOS, but the system supports multithreading on a per-application basis. Unlike the event-driven Contiki kernel, the MANTIS kernel is based on preemptive multithreading. With preemptive multithreading, applications do not need to explicitly yield the microprocessor to other processes.1.4 Introduction to Wireless Sensor NodeA sensor node, also known as a mote, is a node in a wireless sensor network that is capable of performing processing, gathering sensory information and communicating with other connected nodes in the network. Sensor node should be in small size, consuming extremely low energy, autonomous and operate unattended, and adaptive to the environment. As wireless sensor nodes are micro-electronic sensor device, they can only be equipped with a limited power source. The main components of a sensor node include sensors, microcontroller, transceiver, and power source. Sensors are hardware devices that can produce measurable response to a change in a physical condition such as light density and sound density. The continuous analog signal collected by the sensors is digitized by Analog-to-Digital converter. The digitized signal is then passed to controllers for further processing. Most of the theoretical work on WSNs considers Passive and Omni directional sensors. Passive and Omni directional sensors sense the data without actually manipulating the environmen t with active probing, while no notion of “direction” involved in these measurements. Commonly people deploy sensor for detecting heat (e.g. thermal sensor), light (e.g. infrared sensor), ultra sound (e.g. ultrasonic sensor), or electromagnetism (e.g. magnetic sensor). In practice, a sensor node can equip with more than one sensor. Microcontroller performs tasks, processes data and controls the operations of other components in the sensor node. The sensor node is responsible for the signal processing upon the detection of the physical events as needed or on demand. It handles the interruption from the transceiver. In addition, it deals with the internal behavior, such as application-specific computation.The function of both transmitter and receiver are combined into a single device know as transceivers that are used in sensor nodes. Transceivers allow a sensor node to exchange information between the neighboring sensors and the sink node (a central receiver). The operational states of a transceiver are Transmit, Receive, Idle and Sleep. Power is stored either in the batteries or the capacitors. Batteries are the main source of power supply for the sensor nodes. Two types of batteries used are chargeable and non-rechargeable. They are also classified according to electrochemical material used for electrode such as NiCd(nickel-cadmium), NiZn(nickel-zinc), Nimh(nickel metal hydride), and Lithium-Ion. Current sensors are developed which are able to renewtheir energy from solar to vibration energy. Two major power saving policies used are Dynamic Power Management (DPM) and Dynamic V oltage Scaling (DVS). DPM takes care of shutting down parts of sensor node which are not currently used or active. DVS scheme varies the power levels depending on the non-deterministic workload. By varying the voltage along with the frequency, it is possible to obtain quadratic reduction in power consumption.1.5 ChallengesThe major challenges in the design and implementation of the wireless sensor network are mainly the energy limitation, hardware limitation and the area of coverage. Energy is the scarcest resource of WSN nodes, and it determines the lifetime of WSNs. WSNs are meant to be deployed in large numbers in various environments, including remote and hostile regions, with ad-hoc communications as key. For this reason, algorithms and protocols need to be lifetime maximization, robustness and fault tolerance and self-configuration. The challenge in hardware is to produce low cost and tiny sensor nodes. With respect to these objectives, current sensor nodes usually have limited computational capability and memory space. Consequently, the application software and algorithms in WSN should be well-optimized and condensed. In order to maximize the coverage area with a high stability and robustness of each signal node, multi-hop communication with low power consumption is preferred. Furthermore, to deal with the large network size, the designed protocol for a large scale WSN must be distributed.1.6 Research IssuesResearchers are interested in various areas of wireless sensor network, which include the design, implementation, and operation. These include hardware, software and middleware, which means primitives between the software and the hardware. As the WSNs are generally deployed in the resources-constrained environments with battery operated node, the researchers are mainly focus on the issues of energy optimization, coverage areas improvement, errors reduction, sensor network application, data security, sensor node mobility, and data packet routing algorithm among the sensors. In literature, a large group of researchers devoted a great amount of effort in the WSN. They focused in various areas, including physical property, sensor training, security through intelligent node cooperation, medium access, sensor coverage with random and deterministic placement, object locating and tracking, sensor location determination, addressing, energy efficient broadcasting and active scheduling, energy conserved routing, connectivity, data dissemination and gathering, sensor centric quality of routing, topology control and maintenance, etc.中文译文移动目标点数与红外传感器网络作者KI, Chi Keung摘要无线传感器网络(WSN)已成为最近的一个研究热点。
传感器技术论文中英文对照资料外文翻译文献
传感器技术论文中英文对照资料外文翻译文献Development of New Sensor TechnologiesSensors are devices that can convert physical。
chemical。
logical quantities。
etc。
into electrical signals。
The output signals can take different forms。
such as voltage。
current。
frequency。
pulse。
etc。
and can meet the requirements of n n。
processing。
recording。
display。
and control。
They are indispensable components in automatic n systems and automatic control systems。
If computers are compared to brains。
then sensors are like the five senses。
Sensors can correctly sense the measured quantity and convert it into a corresponding output。
playing a decisive role in the quality of the system。
The higher the degree of n。
the higher the requirements for sensors。
In today's n age。
the n industry includes three parts: sensing technology。
n technology。
and computer technology。
热电偶温度传感器中英文对照外文翻译文献
中英文对照外文翻译文献(文档含英文原文和中文翻译)外文翻译：Thermocouple Temperatur sensorIntroduction to ThermocouplesThe thermocouple is one of the simplest of all sensors. It consists of two wires of dissimilar metals joined near the measurement point. The output is a small voltage measured between the two wires.While appealingly simple in concept, the theory behind the thermocouple is subtle, the basics of which need to be understood for the most effective use of the sensor.Thermocouple theoryA thermocouple circuit has at least two junctions: the measurement junction and a reference junction. Typically, the reference junction is created where the two wires connect to the measuring device. This second junction it is really two junctions: one for each of the two wires, but because they are assumed to be at the same temperature (isothermal) they are considered as one (thermal) junction. It is the point where the metals change - from the thermocouple metals to what ever metals are used in the measuring device - typically copper.The output voltage is related to the temperature difference between the measurement and the reference junctions. This is phenomena is known as the Seebeck effect. (See the Thermocouple Calculator to get a feel for the magnitude of the Seebeck voltage). The Seebeck effect generates a small voltage along the length of a wire, and is greatest where the temperature gradient is greatest. If the circuit is of wire of identical material, then they will generate identical but opposite Seebeck voltages which will cancel. However, if the wire metals are different the Seebeck voltages will be different and will not cancel.In practice the Seebeck voltage is made up of two components: the Peltiervoltage generated at the junctions, plus the Thomson voltage generated in the wires by the temperature gradient.The Peltier voltage is proportional to the temperature of each junction while the Thomson voltage is proportional to the square of the temperature difference between the two junctions. It is the Thomson voltage that accounts for most of the observed voltage and non-linearity in thermocouple response.Each thermocouple type has its characteristic Seebeck voltage curve. The curve is dependent on the metals, their purity, their homogeneity and their crystal structure. In the case of alloys, the ratio of constituents and their distribution in the wire is also important. These potential inhomogeneous characteristics of metal are why thick wire thermocouples can be more accurate in high temperature applications, when the thermocouple metals and their impurities become more mobile by diffusion.The practical considerations of thermocouplesThe above theory of thermocouple operation has important practical implications that are well worth understanding:1. A third metal may be introduced into a thermocouple circuit and have no impact, provided that both ends are at the same temperature. This means that the thermocouple measurement junction may be soldered, brazed or welded without affecting the thermocouple's calibration, as long as there is no net temperature gradient along the third metal.Further, if the measuring circuit metal (usually copper) is different to that of the thermocouple, then provided the temperature of the two connecting terminals is the same and known, the reading will not be affected by the presence of copper.2. The thermocouple's output is generated by the temperature gradient along the wires and not at the junctions as is commonly believed. Therefore it is important that the quality of the wire be maintained where temperature gradients exists. Wire quality can be compromised by contamination from its operating environment and the insulating material. For temperatures below 400°C, contamination of insulated wires is generally not a problem. At temperatures above 1000°C, the choice of insulationand sheath materials, as well as the wire thickness, become critical to the calibration stability of the thermocouple.The fact that a thermocouple's output is not generated at the junction should redirect attention to other potential problem areas.3. The voltage generated by a thermocouple is a function of the temperature difference between the measurement and reference junctions. Traditionally the reference junction was held at 0°C by an ice bath:The ice bath is now considered impractical and is replace by a reference junction compensation arrangement. This can be accomplished by measuring the reference junction temperature with an alternate temperature sensor (typically an RTD or thermistor) and applying a correcting voltage to the measured thermocouple voltage before scaling to temperature.The correction can be done electrically in hardware or mathematically in software. The software method is preferred as it is universal to all thermocouple types (provided the characteristics are known) and it allows for the correction of the small non-linearity over the reference temperature range.4. The low-level output from thermocouples (typically 50mV full scale) requires that care be taken to avoid electrical interference from motors, power cable, transformers and radio signal pickup. Twisting the thermocouple wire pair (say 1 twist per 10 cm) can greatly reduce magnetic field pickup. Using shielded cable or running wires in metal conduit can reduce electric field pickup. The measuring device should provide signal filtering, either in hardware or by software, with strong rejection of the line frequency (50/60 Hz) and its harmonics.5. The operating environment of the thermocouple needs to be considered. Exposure to oxidizing or reducing atmospheres at high temperature can significantly degrade some thermocouples. Thermocouples containing rhodium (B,R and S types) are not suitable under neutron radiation.The advantages and disadvantages of thermocouplesBecause of their physical characteristics, thermocouples are the preferred methodof temperature measurement in many applications. They can be very rugged, are immune to shock and vibration, are useful over a wide temperature range, are simple to manufactured, require no excitation power, there is no self heating and they can be made very small. No other temperature sensor provides this degree of versatility.Thermocouples are wonderful sensors to experiment with because of their robustness, wide temperature range and unique properties.On the down side, the thermocouple produces a relative low output signal that is non-linear. These characteristics require a sensitive and stable measuring device that is able provide reference junction compensation and linearization.Also the low signal level demands that a higher level of care be taken when installing to minimise potential noise sources.The measuring hardware requires good noise rejection capability. Ground loops can be a problem with non-isolated systems, unless the common mode range and rejection is adequate.Types of thermocoupleAbout 13 'standard' thermocouple types are commonly used. Eight have been given an internationally recognised letter type designators. The letter type designator refers to the emf table, not the composition of the metals - so any thermocouple that matches the emf table within the defined tolerances may receive that table's letter designator.Some of the non-recognised thermocouples may excel in particular niche applications and have gained a degree of acceptance for this reason, as well as due to effective marketing by the alloy manufacturer. Some of these have been given letter type designators by their manufacturers that have been partially accepted by industry.Each thermocouple type has characteristics that can be matched to applications. Industry generally prefers K and N types because of their suitability to high temperatures, while others often prefer the T type due to its sensitivity, low cost and ease of use.A table of standard thermocouple types is presented below. The table also showsthe temperature range for extension grade wire in brackets.Accuracy of thermocouplesThermocouples will function over a wide temperature range - from near absolute zero to their melting point, however they are normally only characterized over their stable range. Thermocouple accuracy is a difficult subject due to a range of factors. In principal and in practice a thermocouple can achieve excellent results (that is, significantly better than the above table indicates) if calibrated, used well below its nominal upper temperature limit and if protected from harsh atmospheres. At higher temperatures it is often better to use a heavier gauge of wire in order to maintain stability (Wire Gauge below).As mentioned previously, the temperature and voltage scales were redefined in 1990. The eight main thermocouple types - B, E, J, K, N, R, S and T - were re-characterised in 1993 to reflect the scale changes. (See: NIST Monograph 175 for details). The remaining types: C, D, G, L, M, P and U appear to have been informally re-characterised.Try the thermocouple calculator. It allows you the determine the temperature by knowing the measured voltage and the reference junction temperature.Thermocouple wire gradesThere are different grades of thermocouple wire. The principal divisions are between measurement grades and extension grades. The measurement grade has the highest purity and should be used where the temperature gradient is significant. The standard measurement grade (Class 2) is most commonly used. Special measurement grades (Class 1) are available with accuracy about twice the standard measurement grades.The extension thermocouple wire grades are designed for connecting the thermocouple to the measuring device. The extension wire may be of different metals to the measurement grade, but are chosen to have a matching response over a much reduced temperature range - typically -40°C to 120°C. The reason for using extension wire is reduced cost - they can be 20% to 30% of the cost of equivalent measurementgrades. Further cost savings are possible by using thinnergauge extension wire and a lower temperature rated insulation.Note: When temperatures within the extension wire's rating are being measured, it is OK to use the extension wire for the entire circuit. This is frequently done with T type extension wire, which is accurate over the -60 to 100°C range.Thermocouple wire gaugeAt high temperatures, thermocouple wire can under go irreversible changes in the form of modified crystal structure, selective migration of alloy components and chemical changes originating from the surface metal reacting to the surrounding environment. With some types, mechanical stress and cycling can also induce changes.Increasing the diameter of the wire where it is exposed to the high temperatures can reduce the impact of these effects.The following table can be used as a very approximate guide to wire gauge:At these higher temperatures, the thermocouple wire should be protected as much as possible from hostile gases. Reducing or oxidizing gases can corrode some thermocouple wire very quickly. Remember, the purity of the thermocouple wire is most important where the temperature gradients are greatest. It is with this part of the thermocouple wiring where the most care must be taken.Other sources of wire contamination include the mineral packing material and the protective metal sheath. Metallic vapour diffusion can be significant problem at high temperatures. Platinum wires should only be used inside a nonmetallic sheath, such as high-purity alumna.Neutron radiation (as in a nuclear reactor) can have significant permanent impact on the thermocouple calibration. This is due to the transformation of metals to different elements.High temperature measurement is very difficult in some situations. In preference, use non-contact methods. However this is not always possible, as the site of temperature measurement is not always visible to these types of sensors.Colour coding of thermocouple wireThe colour coding of thermocouple wire is something of a nightmare! There are at least seven different standards. There are some inconsistencies between standards, which seem to have been designed to confuse. For example the colour red in the USA standard is always used for the negative lead, while in German and Japanese standards it is always the positive lead. The British, French and International standards avoid the use of red entirely!Thermocouple mountingThere are four common ways in which thermocouples are mounted with in a stainless steel or Inconel sheath and electrically insulated with mineral oxides. Each of the methods has its advantages and disadvantages.Sealed and Isolated from Sheath: Good relatively trouble-free arrangement. The principal reason for not using this arrangement for all applications is its sluggish response time - the typical time constant is 75 secondsSealed and Grounded to Sheath: Can cause ground loops and other noise injection, but provides a reasonable time constant (40 seconds) and a sealed enclosure.Exposed Bead: Faster response time constant (typically 15 seconds), but lacks mechanical and chemical protection, and electrical isolation from material being measured. The porous insulating mineral oxides must be sealedExposed Fast Response: Fastest response time constant, typically 2 seconds but with fine gauge of junction wire the time constant can be 10-100 ms. In addition to problems of the exposed bead type, the protruding and light construction makes the thermocouple more prone to physical damage.Thermocouple compensation and linearizationAs mentioned above, it is possible to provide reference junction compensation in hardware or in software. The principal is the same in both cases: adding a correction voltage to the thermocouple output voltage, proportional to the reference junction temperature. To this end, the connection point of the thermocouple wires to the measuring device (i.e. where the thermocouple materials change to the copper of thecircuit electronics) must be monitored by a sensor. This area must be design to be isothermal, so that the sensor accurately tracks both reference junction temperatures.The hardware solution is simple but not always as easy to implement as one might expect.The circuit needs to be designed for a specific thermocouple type and hence lacks the flexibility of the software approach.The software compensation technique simplifies the hardware requirement, by eliminating the reference sensor amplifier and summing circuit (although a multiplexer may be required).The software algorithm to process the signals needs to be carefully written. A sample algorithm details the process.A good resource for thermocouple emf tables and coefficients is at the US Commerce Dept's NIST web site. It covers the B, E, J, K, N, R, S and T types.The thermocouple as a heat pumpThe thermocouple can function in reverse. If a current is passed through a thermocouple circuit, one junction will cool and the other warm. This is known as the Peltier Effect and is used in small cooling systems. The effect can be demonstrated by alternately passing a current through a thermocouple circuit and then quickly measuring the circuit's Seebeck voltage. This process has been used, with very fine thermocouple wire (0.025 mm with about a 10 mA current), to measure humidity by ensuring the cooled junction drops below the air's dew point. This causes condensation to form on the cooled junction. The junction is allowed to return to ambient, with the temperature curve showing an inflection at the dew point caused by the latent heat of vaporization.Measuring temperature differencesThermocouples are excellent for measuring temperatures differences, such as the wet bulb depression in measuring humidity. Sensitivity can be enhanced by constructing a thermopile - a number of thermocouple circuits in series.In the above example, the thermopile output is proportional to the temperaturedifference T1 - T2, with a sensitivity three times that of a single junction pair. In practice, thermopiles with two to hundreds of junctions are used in radiometers, heat flux sensors, flow sensors and humidity sensors. The thermocouple materials can be in wire form, but also printed or etched as foils and even electroplated.An excellent example of the thermopile is in the heat flux sensors manufactured by Hukseflux Thermal Sensors. Also see RdF Corp. and Exergen Corp.The thermocouple is unique in its ability to directly measure a temperature difference. Other sensor types require a pair of closely matched sensors to ensure tracking over the entire operational temperature range.The thermoelectric generatorWhile the Seebeck voltage is very small (in the order of 10-70μV/°C), if the circuit's electrical resistance is low (thick, short wires), then large currents are possible (e.g. many amperes). An efficiency trade-off of electrical resistance (as small as possible) and thermal resistance (as large as possible) between the junctions is the major issue. Generally, electrical and thermal resistances trend together with different materials. The output voltage can be increased by wiring as a thermopile.The thermoelectric generator has found its best-known application as the power source in some spacecraft. A radioactive material, such as plutonium, generates heat and cooling is provided by heat radiation into space. Such an atomic power source can reliably provide many tens of watts of power for years. The fact that atomic generators are highly radioactive prevents their wider application.译文：热电偶温度传感器热电偶的定义热电偶是最简单的传感器之一。
湿度传感器系统中英文对照外文翻译文献
中英文资料外文翻译文献英文:The right design for a relative humidity sensor systemOptimizing the response characteristics and accuracy of a humidity sensor system1 OverviewTo make the right choice when selecting a relative humidity sensor for an application, it is important to know and to be able to judge the deciding factors. In addition to long-term stability, which is a measure on how much a sensor changes its properties over time, these factors also include the measurement accuracy and the response characteristics of the sensor. Capacitive humidity sensors are based on the principle that a humidity-sensitive polymer absorbs or releases moisture as a function of the relative ambient humidity. Because this method is only a spot measurement at the sensor location, and usually the humidity of the surroundings is the desired quantity, the sensor must be brought into moisture equilibrium with the surroundings to obtain a precise measurement value. This process is realized by various transport phenomena (cf. the section titled "The housing effect on the response time"), which exhibit a time constant. Accuracy and response time are thus closely dependent on each other, and the design of a humidity measurement system becomes a challenge.2Measurement accuracyThe term measurement accuracy of a humidity sensor is understood primarily to refer to the deviation of the value measured by the sensor from the actual humidity. To determine the measurement accuracy, references, such as chilled mirror hygrometers, whose own tolerance must be taken into account, are used. In addition to this trivial component, humidity sensors require a given time for reaching stable humidity and temperature equilibrium (the humidity is a function of temperature and decreases with increasing temperature; a difference between sensor and ambient temperature leads to measurement errors). This response time thus has a significant effect on the value measured by the sensor and thus on the determinedaccuracy.This time-dependent characteristic is explained in more detail in the following.3Response characteristics and response timeThe response characteristics are defined by various parameters. These are:●The actual response characteristics of the humidity sensor at constant temperature.(1) How quickly the sensitive polymer absorbs or releases moisture until equilibrium is reached (intrinsic response time)(2) How fast the entire system reaches humidity equilibrium (housing effect)●The thermal response characteristics of the humidity sensor at a non-constant temperature(3) The thermal mass of the sensor(4) The system's thermal mass, which is thermally coupled to the sensor (e.g. printed circuit board)(5) Heat sources in the direct surroundings of the sensor (electronic components)(1) and (3) are determined entirely by the sensor itself, (1) primarily by the characteristics of the sensitive polymer.(2) and (4) are primarily determined by the construction of the entire system (shape and size of housing andreadout circuitry).(5) is determined by heat-emitting electronic components.These points will be discussed in more detail in the following.The intrinsic response time (1)Qualitatively, the response characteristics of capacitive humidity sensors look like the following (Fig. 1).Fig. 1: Typical and idealized response characteristics of capacitive humidity sensors (schematic)Because these response characteristics are especially pronounced at high humidity values, an isothermal humidity jump from 40% to 100% was selected here for illustration. The desired ideal behavior of the sensor is indicated in blue. In practice, however, the sensor behaves according to the red line, approximately according to:RH-t=(E-S)*(1-e)+S（t）Here, the time span 1 is usually very short (typ. 1 – 30 min.), in contrast, the time span 2 is very long (typ. Many hours to days). Here the connection of measurement accuracy and response characteristics becomes clear (t until RH=100% is reached). The value at t4 (Fig. 1) is considered to be an exact measured value. However, this assumes that both the humidity and also the temperature remain stable during this entire time, and that the testing waits until this very long measurement time is completed. These conditions are both very hard to achieve and unusual in practice. For the calibration, there are the following two approaches, which both find use in practice (cf. Fig. 2):1.The measured value at t2 (Fig. 1) is used as a calibration reference.Advantage:●The required measurement time for reaching the end value (in the example 100%) isclearly shortened,corresponds to practice, and achieves an apparent short responsetime of the sensor (cf. Fig. 2).Disadvantage:●If the conditions are similar for a long time (e.g., wet periods in outdoor operation),the sensors exceed the correct end value (in the example 100%) undesirably by upto 10% (cf. Fig. 2).2. The measured value at t4 (Fig. 1) is used as a calibration reference.Advantage:●Even for similar conditions over a long time (e.g., wet periods in outdoor operation),an exact measurement result is obtained (cf. Fig. 2).Disadvantage:●For a humidity jump like in Fig. 1, the sensors very quickly deliver the measuredvalue at t2, but reaching a stable end value (about 3-6% higher) takes a long time(apparent longer response time)(cf. Fig. 2).In order to take into account both approaches optimally, the measured values at t3 (cf. Fig. 1) are used as the calibration reference by Sensirion AG.Fig. 2: Response characteristics of different humidity measurement systemsThe housing effect on the response time (2)Here, two types of transport phenomena play a deciding role:●Convection: For this very fast process, the air, whose humidity is to be determined,is transported to the sensor by means of ventilation.●Diffusion: This very slow process is determined by the thermal, molecularself-motion of the water molecules. It occurs even in "stationary" air (e.g., within ahousing), but leads to a long response time.In order to achieve favorable response characteristics in the humidity measurement system, the very fast convection process must be supported by large housing openings and the slow diffusion process must be supported by a small housing around the sensor (small "deadvolume") with "stationary" air reduced to a minimum. The following applies:Thermal effects (3), (4), and (5)Because the total thermal mass of the humidity measurement system (sensor + housing)has a significant effect on its response time, the total thermal mass must be kept as low aspossible. The greater the total thermal mass, the more inert the measurement system becomesthermally and its response time, which is temperature-dependent, increases. In order toprevent measurement errors, the sensor should not be mounted in the vicinity of heatgenerating components.4Summary –what should be taken into account when designing a humidity measurement systemIn order to achieve error-free operation of a humidity-measurement system with response times as short as possible, the following points should be taken into account especially for the selection of the sensor and for the design of the system.●The selection of the humidity sensor element. It should●be as small as possible,●have a thermal mass that is as low as possible,●work with a polymer, which exhibits minimal fluctuations in measured values duringthe time span 2(cf. Fig. 1); testing gives simple information on this condition,●provide calibration, which corresponds to the requirements (see above), e. g.,SHT11/SHT15 from Sensirion.●The housing design (cf. Formula 1). It should●have air openings that are as large as possible in the vicinity of the sensor or thesensor should be operated outside of the housing à good convection!●enclose a "dead volume" that is as small as possible around the sensor àlittlediffusion!●The sensor should be decoupled thermally as much as possible from other components,so that the response characteristics of the sensor are not negatively affected by the thermal inertia of the entire system.(e.g., its own printed circuit board for the humidity sensor, structurally partitioning the housing to create a small volume for the humidity sensor, see Fig. 3)Fig. 3: Mounting example for Sensirion sensors SHT11 and SHT15 with slits for thermal decoupling●The sensor should not be mounted in the vicinity of heat sources. If it was, measuredtemperature would increase and measured humidity decrease.5Design proposalThe challenge is to realize a system that operates cleanly by optimally taking into account all of the points in section 4. The already calibrated SMD humidity sensors SHT11 and SHT15 from Sensirion are the ideal solution. For optimum integration of the sensors in a measurement system, Sensirion AG has also developed a filter cap as an adapter aid, which takes into account as much as possible the points in section 4 and also protects the sensor against contaminants with a filter membrane. Fig. 4 shows schematically how the sensors can be ideally integrated into a housing wall by means of the filter cap SF1.Fig. 4: Filter cap for SHT11 and SHT15In addition to the advantages mentioned above, there is also the option of building an IP67-compatible humidity measurement device (with O-ring, cf. Fig. 4) with optimal performance. Detailed information is available on the Sensirion Web site.译文：相对湿度传感器系统的正确设计湿度传感器系统精度及响应特性的优化1.综述为了在相对湿度的应用方面对传感器做出正确的选择，了解和评估那些起决定作用的因素是非常重要的。
传感器外文文献
Photoelectric sensorKey word:photoeletric effect photoelectric element photoeletric sensor classification sensor application characteristics. Abstract:in the development of science and technology in the modern society,mankind has into rapidly changing information era,people in daily life,the production process,rely mainly on the detection of information technology by acquiring,screening and transmission,to achieve the brake control,automation adjustment,at present our country has put detection techniques listed in one of the priority to the development of science and technology.Because ofmicroelectronics technology,photoelectric semiconductor technology,optical fiber technology and grating technical development makes the application of the photoelectric sensor is growing .The sensor has simple structure, non-contact,high reliability,high precision,measurable parameters and quick response and more simple structure,form etc,and flexible in automatic detection technology,it has been widely applied in photoelectric effect as the theoretical basis,the device by photoelectric material composition.Text:First,theoretical foundation-photoelectric effect Photoelectric effect generally have the photoelectric effect ,optical effect,light born volts effect.The light shines in photoelectric material,according to the electronic absorption material surface energy,if absorbed energy large enough electronic will overcome bound from material and enter the outside space,which changes photoelectron materials ,this king of phenomenon become the conductivity of the photoelectric effect.According to Einstein’s photoelectron effect,photon is moving particles,each photon energy for hv(v for light frequency,h for Planck’s constant,h=6.63*10-34J/HZ),thus different frequency of photons have different energy,light,the higher the frequency,the photon energy is bigger.Assuming all the energy photons to photons,electronic energy will increase,increased energy part of the fetter,positive ions used to overcome another part of converted into electronic energy.According to the law of conservation of energy:1／2mv =hv-A2Type,m for electronic quality,v for electronic escaping the velocity,A microelectronics the work done.From the type that will make the optoelectronic cathode surface escape the necessary conditions are h>A.Due to the different materials have different escaping,so reactive to each kind ofcathode material,incident light has a certain frequency is restricted,when the frequency of incident light under this frequency limit,no matter how the light intensity,won’t produce photoelectron lauch,this frequency limit called“red limit”.The corresponding wavelength for type,c for the speed of light,A reactive for escaping.When is the sun,its electronic energy,absorb the resistivity reduce conductive phenomenon called optical effects.It belongs to the photoelectric effect within.When light is,if in semiconducter electronic energy big with semiconductor of forbidden band width,the electronic energy from the valence band jump into the conduction band,form,and at the same time,the valence band electronic left the corresponding cavities. Electronics,cavitation remained in semiconducter,and participate in electric conductive outside formed under the current role.In addition to metal outer,most insulators and semiconducter have photoelectric effect,particularly remarkable,semiconductor optical effect according to the optoelectronics manufacturing incident light inherent frequency,when light resistance in light,its conductivity increases,resistance drops.The light intensity is strong,its value,if the smaller,its resistance to stop light back to the original value.Semiconductor producted by light illuminate the phenomenon is called light emf,born volts effect on the effect of photoelectric devices have made si-based ones,photoelectric diode,control thyristor and optical couplers,etc.Second,optoelectronic components and characteristics According to the outside optoelectronics manufacturing optoelectronic devices have photoelectron,inflatable phototubes and photoelectric times once tube.1.Phototubes phototubes are various and typical products arevacuum phototubes and inflatable phototubes,light its appearance and structure as shown in figure 1 shows,made of cylindrical metal half cathodic K and is located in the wires cathodic axis of anode in A package of smoke into the vacuum,when incident light within glass shell in the cathode,illuminate A single photon took all of its energy transfer to the cathode materials A free electrons,so as to make the freedom electronic energy increase h.When electrons gain energy more than escape of cathode materials,it reactive A metal surface constraints can overcome escape,form electron emission.This kind of electronic called optoelectronics,optoelectronic escaping the metal surface for after initial kinetic energyPhototubes normal work,anode potential than the cathode, show in figure 2.In one shot more than “red light frequency is premise,escape from the optoelectronic cathode surface by positive potential attracted the anode in photoelectric tube forming space,called the current stream.Then if light intensity increases,the number of photons bombarded the cathode multiplied,unit of time to launch photoelectron number are also increasing,photo-current greatens.In figure 2 shows circuit,current so as to achieve a photoelectric conversion.When the LTT optoelectronic cathode K, electronic escape from the cathode surface,and was the photoelectric anode is an electric current,power plants absorb deoxidization device in the load resistance-I,the voltage. Phototubes photoelectric characteristics fig.03 shows,from the graph in flux knowable,not too big,photoelectric basis characteristics is a straight line.2.Photoelectric times had the sensitivity of vacuum tube duo tolow,so with people developed has magnified the photomultiplier tubes photo-current ability.Figure 4 isphotomultiplier tube structure schematic drawing.From the graph can see photomultiplier tubes also have A cathode K and an anode A,and phototubes different is in its between anode and cathode set up several secondary emission electrodes,D1,D2 and D3…Usually,double electrode for 10~15 levels.Photomultiplier tubes work between adjacent electrode,keeping a certain minimum,including the cathode potential potentials,each multiply electrode potential filtering increases, the anode potential supreme.When the incident light irradiation, cathodic K escape from the optoelectronic cathode multiplied by first accelerated,by high speed electrode D1 bombarded caused secondary electron emission,D1,an incident can generate multiple secondary electron photonics,D1 emit of secondary electron was D1,D2 asked electric field acceleration,converged on D2 and again produce secondary electron emission…So gradually produce secondary electron emission,make electronic increased rapidly,these electronic finally arrived at the anode, form a large anode current.If an level,multiply electrodes at alllevels for sigma,the multiplication of rate is the multiplication of photomultiplier tubes can be considered sigma n rate,therefore,photomultiplier tube has high sensitivity.In the output current is less than 1mA circumstances,it in a very wide photoelectric properties within the scope of the linear relationship with good.Photomultiplier tubes this characteristic, Make it more for light measurement.3.and photoconductive resistance photoconductive resistance within the working principle is based on the photoelectric effect. In semiconducter photosensitive material ends of mount electrode lead,it contains transparent window sealed in the tube and shell element photoconductive resistance.Photoconductive resistance properties and parameters are:1)dark resistance photoconductive resistance at roomtemperature,total dark conditions stable resistance called dark resistance,at the current flow resistance is called dark current.2)Light resistance photoconductive resistance at roomtemperature and certain lighting conditions stable resistance measured,right now is called light resistance of current flow resistance is called light current.4.V olt-ampere characteristics of both ends photoconductive resistance added voltage and current flows throughphotoconductive resistance of the relationship between called volt-ampere characteristics shown,as shown in figure 5.From the graph,the approximate linear volt-ampere characteristics that use should be limited,but when the voltage ends photoconductive resistance,lest than shown dotted lines of power consumption area.光敏电阻的伏安特性5.photoelectric characteristics photoconductive resistance between the poles,light when voltage fixed the relationship between with bright current photoelectric characteristics.Called photoconductive resistance photoelectric characteristics is nonlinear,this is one of the major drawback of photoconductive resistance.6.Spectral characteristics is not the same incident wavelength the sensitivity of photoconductive resistance is different also.Incidence wavelength and photodetector the relationship between relative sensitivity called spectral characteristics.When used according to the wavlength range by metering,choosedifferent material photoconductive resistance.7.Response time by photoconductive resistance after photo-current need light,over a period of time (time) rise to reach its steady value.Similarly,in stop light photo-current also need,over a period of time (down time) to restore the its dark current,this is photoconductive resistance delay characteristic . Photoconductive resistance rise response time and falling response time about 10-1~10-3s,namely the frequency response is 10Hz~1000Hz,visible photoconductive resistance cannot be used in demand quick response occasion,this is one of the main photoconductive resistance shortcoming.8、and temperature characteristic photoconductive resistance by temperature affects greatly,temperature rise,dark current increase,reduced sensitivity,which is another photoconductive resistance shortcoming.9、frequency characteristic frequency characteristics refers to an external voltage and incident light,strong must be photo-current I and incident light,modulation frequency,the relationship between the f,photoelectric diode is the freqency characteristic of the ptotoelectric triode frequency characteristics,this is because of the photoelectric triode shot “yankees there capacitance and carrier base-combed need time’s sake.By usingthe principle of the photoelectric effciency of optoelectronics manufacturing frequency characteristic of the worst,this is due to capture charge carriers and release charge need a certain time’s sake.Three,photoelectric sensorsPhotoelectric sensor is through the light intensity changes into electrical signal changes to achieve control,its basic structure,it first figure 6 by measuring the change of converting the light signal,and then using photoelectric element further will light signals into electrical signal by photoelectric sensor general. Illuminant,optical path and optoelectronics.Three components of photoelectric detection method has high precision,fast response,non-contact wait for an advantage,but measurable parameters of simple structure,sensors,form flexible,threefore, photoelectric sensor in the test and control is widely used.By photoelectric sensor generally is composed of three parts, they are divided into:transmitter and receiver and detection circuit shown,as shown in figure 7,transmitter aimed at the target launch beam,the launch of the beam from semiconductor illuminant,general light emitting diode(LED),laser diode and infrared emission diode.Beam uninterrupted lauch,or change the pulse width. Receivers have photoelectric diode,photoelectrictriode,composed si-based ones.In front of the receiver, equipped with optical components such as lens and aperture,etc.In its back is detection circuit,it can filter out effective signal and the application of the signal.In addition,the structural components in photoelectric switch and launch plate and optical fiber,triangle reflex plate is solid structure launch device.It consists of small triangle cone of reflective materials,can make a beam accurately reflected back from plate,with practical significance.It can be in with the scope of optical axis 0 to 25,make beams change launch Angle from a root almost after launch line,passes reflection or from the rotating polygon.some basic returns.Photoelectric sensor is a kind of depend on is analyte andoptoelectronics and light source,to achieve the relationship between the measured purpose,so the light source photoelectric sensor plays a very important role,photoelectric sensor power if a constant source,power is very important for design,the stability of power directly affect the accuracy of measurement,comonly used illuminant have the following kinds:1,leds is a change electric energy into light energy semiconductor devices.It has small volume,low power consumption,long life,fast response,the advantages of high mechanical strength,and can match and integrated circuits. Therefore,widely used in computer,instruments and automatic control equipment.2,Silk light bulb that is one of the most commomly used illuminant,it has rich infrare light.If chosen optoelectronics, constitutes of infrared sensor sensitive colour filter can be added to the visible tungsten lamps,but only filter with its infrared does illuminant,such,which can effectively prevent other light interference.3,compared with ordinary light laser with energy concentration, directional good,frequency pure,coherence as well as good,is very ideal light sources.The light source,optical path and photoelectric device composition photoelectric sensor used inphotoelectric detection,still must be equipped with appropriate measurement circuit.The photoelectric effect to the measurement circuit of photoelectric element of widerange caused changes needed to convert the voltage or current. Different photoelectric element,the measurement circuit required is not identical also.Several semiconductor introduces below optoelectronic devices commonly used measurement circuit.Figure 9(a)with temperature compensation given the photosensitive diode bridge type measuring circuit.When the incident light intensity slow change,the reverse resistance photosensitive diode is the slow change,the change of the temperature will cause the bridge output voltage,must compensate.Drift picture a photosensitive diode as the test components,another into windows,in neighboring bridge,the change of the temperature in the arms of the influence of two photosensitive diode,therefore,can eliminate the same output with tempereture bridge road drift.Light activated triode incident light in work under low illumination,or hope to get bigger output power,also can match with amplifying circuit,as shown in figure 9 shows.Because even in the glare photosensitive batteries,maximum output voltage also only 0.6V,still cannot make the next level 1 transistor have larger current output,so must add positive bias,as shown in figure 9(a)below.In order to reduce the transistor circuit impedance variations,base si-based ones to reduce as much as possible without light,when the reverse bias inherit in parallel a resistor si-based ones at both ends.Or like figure 9(b)as shown by the positive ge diode produces pressure drop and test the voltage produced when exposed to light,make silicon tube e stack,b the voltage between actuators than 0.7V,and conduction work.This kind of circumstance also can use silicon light batteries,as shown in figure 10(c)below.Semiconductor photoelectric element of photoelectric circuit can also use integrated operational amplifier.Silicon photosensitive diode can be obtained by integrating op-amp large output amplitude,as shown in figure 11(a)below.When light is produced,the optical output voltage in order to guarantee photosensitive diode is reverse biased,in its positive to add a load voltage.Figure 11.(b) give the photocell transform circuit,because the photoelectric si-based ones short-circuit current and illumination of a linear relationship between,so will it up in the op-amp is,inverse-phase input,using these two potential difference between the characteristics of close to zero,can get better effect.In the picture shows conditions,the output voltage U0=2IφR FThe photoelectric element by flux the role of different made from the principle of optical measurement and control system is varied,press the photoelectric element (optical measurement andcontrol system)output nature,namely,can be divided into second analog photoelectric sensor and pulse (switch)photoelectric sensor.Analog photoelectric sensors will be converted into continuous variation of the measure,it is measuered optical with a single value relations between analog photoelectric sensor. According to be measured (objects)method detection of target can be divided into transmission (absorption)type,diffuse type, shading type(beam resistance gears)three categories.So-called transmission style means the object to be tested in optical path in constant light source,the light energy through things,part of being measured by absorption,transmitted light onto photoelectric element,such as measured liquid,gas transparency and photoelectric BiSeJi etc;speed.gratifying the so-called diffuse style means the constant light by the light onto the analyte from the object to be tested,and projected onto surfaces reflect on after optoelectronic devices,such as photoelectric colorrimetric thermometer and light gauge etc;The so-called shading style means the when illuminant issued by the flux of light analyte covered by a part Jing optoelectronics,make projection on the flux change,change the object to be tested and extent of the position with the light path,such as vibration measurement,the size measurement;And in pulse photoelectricsensor in the sensors,photoelectric element in switch work of the state,the current output it is usually only two steady state of the signal,the pulse form used for photoelectric counting and photoelectric speed measurement and so on.And infrared photoelectric sensor classification and working way generally have the following kinds:1,groove photoelectric sensor put a light emitter and a receiver in a slot face-to-face outfit are on opposite sides of the photoelectric groove.Lighter emits infrared light or visible light, and in unimpeded cases light receptors can receive light.But when tested objects from slot zhongtong obsolete , light occluded ,photoelectric switches and action.Output a switch control signal,cut off or connect load current,thus completing a control movement.Groove switch is the overall of detection distance because general structure limits only a few centimeters. 2,DuiShe type optoelectronic sensor if you put lighter and receive light is separated,can make the detection distance increase.By a lighter and an inbox light sensor into a photoelectric switch is called DuiShe separate photoelectric switches,referred to DuiShe photoelectric switch.Its detection distance can reach a few meters and even a dozen meters.When using light-emitting device and recive light device are installedin test object through the path of the sides,test object by blocking light path,accept light implement action output a switch control signals.3,Reflex plate.it photoelectric switch light-emitting device type and receive light device into the same device inside,in its front pack a reflex plate.the using the reflection principle of complete photoelectric control function is called reflex plate.it reflex (or reflector reflx)photoelectric switch.Under normal circumstances, lighter the light reflected by reflex plate.it is received by accept light;Once the light path be test object to block,accept light,the light is not received photoelectric switch is action,output a switch control signals.4,Diffusion reflective photoelectric switches its detection head with a lighter and also an inbox light ware,but no reflex plate.it ahead.Normally lighter for the light collect light is not found. When test object by blocking the light,and the light reflected light,receive part implement received light signals,output a switch signals.Four,I’m the idea of photoelectric sensorWith the development of science and technology people on measuring accuracy had the higher request,this has prompted the pace with the times photoelectric sensor have updated,improvethe main means photoelectric sensor performance is the application of new materials,new technology manufacturing performance is more superior photoelectric element.For example,today the prototype of the photoelectric sensor is a small metal cylindrical equipment,with a calibration lens,transmitter into receiver focused light,the receiver out of cable to the device got to a vacuum tube amplifiers in metal cylinder on the incandescent light bulb inside a small as the light source a strong incandescent lamp sensor.Due to the sensor various defects existing in the fields,gradually faded.To appear, because of it of fiber of excellent performance,then appeared with sensors supporting the use of optical passive components, another fiber without any interference of electromagnetic signal, and can make the sensor of the electronic components and other electrical disturbance in isolation.Have a piece of plastic optical fiber core or plass light core,light outside a metallic core skins and bread this layer metal cortical density lower than light core, so low,the beam refraction in the two materials according to the border(incident Angle within a certain range,reflected),is all. Based on optical principle,all beams can be made by optical fiber to transmission.Two incident beam Angle in an Angle (along the fiber length direction within)by multiple reflectionsfrom the other end after injection,another incident angles than accept the incident light in metal skin,loss.This accept Angle within the biggest incident Angle than two times,this is because fiber slightly larger from air into density larger fiber materials hitting may have a slight refraction.In light of the optical fiber transmission from inside the influence of fiber bending(whether more than bending radius minimal bending radius).Most optical fiber is flexible,easy to install in the narrow space. Photoelectric sensor is a kind of non-contact measurement small electronic measurement equipment,rely on detect its receives the light intensity change,to achieve measurement purposes,and it’s also a vulnerable to external disturbance and lose the measurement accuracy of the device.When be being designed so besides the choice optoelectronic components,still must set GSCC signal and temperature compensating measures used to weaken or eliminate the impact of these factors.。
无线微传感器中英文对照外文翻译文献
无线微传感器中英文对照外文翻译文献(文档含英文原文和中文翻译)A Simple Energy Model for Wireless Microsensor TransceiversAbstract—This paper describes the modelling of shortrange transceivers for microsensor applications. A simple energy model is derived and used to analyze the transceiver battery life. This model takes into account energy dissipation during the start-up, receive, and transmit modes. It shows that there is a significant fixed cost in the transceiver energy consumption and this fixed cost can be driven down by increasing the data rate of the transceiver.I. IntroductionWireless microsensor networks can provide short-range connectivity with significant fault tolerances. These systems find usage in diverse areas such as environmental monitoring, industrial process automation, and field surveillance. As an example, Table I shows a detailed specification for a sensor system used in a factory machine monitoring environment.The major characteristics of a microsensor system are high sensor density, short range transmissions, and low data rate. Depending on the application, there can also be stringent BER and latency requirements. Due to the large density and the random distributed nature of these networks, battery replacement is a difficult task. In fact,a primary issue that prevents these networks to be used in many application areas is the short battery life. Therefore, maximizing the battery life time of the sensor nodes is important. Figure 1 shows the peak current consumption limit when a 950mAh battery is used as the energy source. As seen in the figure, battery life can vary by orders of magnitude depending on the duty cycle of each operation. To allow for higher maximum peak current, it is desirable to have the sensor remain in the off-state for as long as possible.However, the latency requirement of the system dictates how often the sensor needs to be active. For the industrial sensor application described above, the sensor needs to operate every 5ms to satisfy the latency requirement.Assuming that the sensor operates for 100µs every 5ms, the duty cycle is 2%. To achieve a one-year battery life, the peak current consumption must be kept under 5.4mA, which translates to approximately 10mW at 2V supply.This is a difficult target to achieve for sensors that communicate at giga-Hertz carrier frequencies.There has been active research in microsensor networks over the past years. Gupta [1] and Grossglauser [2] established information theoretic bounds on the capacity of ad-hoc networks. Chang [3] and Heinzelman [4] suggested algorithms to increase overall network life-time by spreading work loads evenly among all sensors. Much of the work in this area, especially those that deal with energy consumption of sensor networks, require an energy model [5]. This paper develops a realistic energy model based on the power consumption of a state of the art Bluetoothtransceiver [6]. This model provides insights into how to minimize the power consumption of sensor networks and can be easily incorporated into work that studies energy limited wireless sensor networks. The outline of this paper is as follows. Section II derives the transceiver model. Section III applies this model to analyzing the battery life time of the Bluetooth transceiver.Section IV investigates the dependencies in the model and shows how to modify the design of the Bluetooth transceiver to improve the battery life. Section V shows the battery life improvement realized by applying the results in Section IV. Section VI summarizes the paper.II. Microsensor Transceiver ModellingThis section derives a simple energy model for low power microsensors. Figure 2 shows the model of the sensor node.It includes a sensor/DSP unit for data processing, D/A and A/D for digital-to-analog and analog-to-digital conversion, and a wireless transceiver for data communication. The sensor/DSP, D/A, and A/D operate at low frequency and consume less than 1mW. This is over an order of magnitude less than the power consumption of the transceiver. Therefore, the energy model ignores the contributions from these components. The transceiver has three modes of operation: start-up, receive, and transmit. Each mode will be described and modelled.A. Start-up ModeWhen the transceiver is first turned on, it takes some time for the frequency synthesizer and the VCO to lock to the carrier frequency. The start-up energy can be modelled as follows:where P LO is the power consumption of the synthesizer and the VCO. The term t start is the required settling time. RF building blocks including PA, LNA, and mixer have negligible start-up time and therefore can remain in the off-state during the start-up mode.B. Receive ModeThe active components of the receiver includes the low noise amplifier (LNA), mixer, frequency synthesizer, VCO, intermediate-frequency (IF) amplifier (amp), and demodulator (Demod). The receiver energy consumption can be modelled as follows:where P RX includes the power consumption of the LNA,mixer, IF amplifier, and demodulator. The receiver power consumption is dictated by the carrier frequency and the noise and linearity requirements. Once these parameters are determined, to the first order the power consumption can be approximated as a constant, for data rates up to 10’s of Mb/s. In other words, the power consumption is dominated by the RF building blocks that operate at the carrier frequency. The IF demodulator power varies with data rate, but it can be made small by choosing a low IF.C. Transmit ModeThe transmitter includes the modulator (Mod), frequency synthesizer and VCO (shared with the receiver), and power amplifier (PA). The data modulates the VCO and produces a FSK signal at the desired data rate and carrier frequency. A simple transmitter energy model is shown in Equation (3). The modulator consumes very little energy and therefore can be neglected.P LO can be approximated as a constant. P PA depends on additional factors and needs to be modelled more carefully as follows:where η is the PA efficiency, r is the data rate, d is the transmission distance, and n is the path loss exponent. γPA is a factor that depends on E b /N O , noise factor F of the receiver, link margin L mar , wavelength of the carrier frequency λ, and th e transmit/receive antenna gains G T ,G R :From Equations (3) and (4), the transmitter power consumption can be written as a constant term plus a variable term. The energy model thus becomesIII. Bluetooth TransceiverHere we demonstrate how the above model can be used to calculate the battery life time of a Bluetooth transceiver [6]. This is one of the lowest power Bluetooth transceivers reported in literature. The energy consumption of the transceiver depends on how it operates. Assuming a 100-bit packet is received and a 100-bit packet is transmitted every 5ms, Figure 3 showsthe transceiver activity within one cycle of operation.The transceiver takes 120µs to start up. Operating at 1Mb/s, the receiver takes 100µs to receive the packet. The transceiver then switches to the transmit mode and transmits a same-length packet at the same rate. A 10µs interval, t switch , between the receive and the transmit mode is allowed to switch channel or to absorb any transient behavior. Therefore, the energy dissipated in one cycle of operation is simplyBoth the average power consumption and the duty cycle can be found From Figure 3. Knowing that the transceiver operates at 2V, the life time for a 950mAh battery is calculated to be approximately 2-months.IV. Energy OptimizationThe microsensor system described in Section I requires a battery life of one year or better. Although the Bluetooth transceiver described in the last section falls short of this requirement, it serves as a starting point for making improvements. This section examines E op in detail and suggests ways to increase the battery life by considering both circuit and system improvements. A.Start-up EnergyThe start-up energy can be a significant part of the total energy consumption, especially when the transceiver is used to send short packets in burst mode. For the Bluetooth transceiver, E start accounts for 20% of E op .The start-up energy becomes negligible if the following condition is held true:For the receive/transmit scheme shown in Figure 3, the right hand-side of Equation (8)is evaluated to be approximately 450µs. To keep E start an order of magnitude below E op , it is desirable to have a start-up time of less than 45µs. Cho has demonstrated a 5.8GHz frequency synthesizer im- plementation with a start-up time under 20µs [7].B. Power AmplifierThe PA power consumption is given bywhere η is the power efficiency and P out is the RF output power. P out can be determined by link-budget analysis. For a Bluetooth transceiver, the required P out is 1mW [8].This enables a maximum transmission distance of 10 meters, which is adequate for microsensor applications. Note that P out is small as compared to P LO . The Bluetooth transceiver discussed in Section II has a maximum RF output power of 1.6mW and a PA power consumption of 10mW, sothe efficiency is at 16%. At frequencies around 2GHz, the PA efficiency can vary from 10% [9] to 70% [10] depending on linearity, circuit topology, and technology. Since FSK signal has a constant envelope, nonlinea r PA’s can be used so that better efficiency can be achieved. As will be shown in the next section, PA efficiency has a significant impact on the battery life.C. Data RateAssuming a packet of length L pkt is transmitted at dat rate r, then the transmit time isThe transmitter energy consumption can be re-written asEquation (12) shows that the contribution of the fixed cost P LO can be reduced by increasing the data rate. The energy per bit, E bit , is defined as E op divided by the total number of bits received and sent during one cycle of operation. Assuming a packet of length L pkt is received and a packet of the same length is transmitted, E bit can be found by dividing Equation (7) by 2L pkt . Substituting the appropriate expressions for E start , E rx , and E tx and re-arranging the terms, we getThe first term in Equation (13) is the start-up energy cost. The second term is the PA energy cost. The third term is the cost of the rest of the transceiver electronics during the transmit and receive modes. Note that this term is divided by the data rate r. Figure 4 shows E bit as a function of data rate. The two solid curves have start-up time 120µs and PA efficiencies 10% and 70%, respectively. The two dotted curves have start-up time 20µs and efficiencies 10% and 70%, respectively. At low data rate, E bit is dominated by the fixed cost (the 3rd term in Equation (13)). At high data rate, the start-up energy and the PA energy dominates, so in order to increase battery life, good circuit design techniques need to be applied to minimize the start-up time and to maximize the PA efficiency.Figure 5 shows the impact of PA efficiency on the battery life at a data rate of 10Mb/s. At t start = 120µs, the startup energy is so large that the battery life is limited to 7month even if the PA reaches 100% efficiency. At t start =20µs, the battery life is much improved. The PA efficiency needs to be higher than about 30% to have a 1-year or better battery life. This is certainly achievable as discussed previously in the PA section.V. Performance ImprovementThere are three apparent results from the previous section. First, the data rate should be increased to reduce the fixed cost. Second, the start-up time should be minimized. Third, PA efficiency should be maximized. Figure 6 shows the transceiver activity for a transceiver that has 20µs start-up time and 10Mb/s data rate. The power consumption of the electronics are kept the same as in the Bluetooth transceiver except for the PA. The maximum RF output power is set at 10mW to accommodate the higher data rate, and the PA efficiency is assumed to be 50%. The switching time is kept at 10µs, although this is a conservative since the switching time is likely to be shorter for a faster frequency synthesizer. The E op of this transceiver is 8x lower than that of theBluetooth transceiver. The battery life-time extends from 2-months to approximately1.3 years.VI. ConclusionThis paper describes the modelling of short-range transceivers for wireless sensor applications. This model takes into account energy dissipation during the start-up, transmit, and receive modes. This model is first used to analyze the battery life of a state of the art Bluetooth transceiver, and then it is used to optimize E op . This paper shows that the battery life can be improved significantly by increasing the data rate, reducing the start-up time, and improving the PA efficiency. Increasing the data rate drives down the fixed energy cost of the transceiver. Reducing the start-up time decreases the start-up energy overhead. Improving the PA efficiency lowers the energy per bit cost of the PA.一个简单的能量无线微传感器的接收机模型摘要—本文描述了微传感器的近程的收发器的造型的应用程序。
传感器的基础知识中英文对照外文翻译文献
中英文对照外翻译Basic knowledge of transducersA transducer is a device which converts the quantity being measured into an optical, mechanical, or-more commonly-electrical signal. The energy-conversion process that takes place is referred to as transduction.Transducers are classified according to the transduction principle involved and the form of the measured. Thus a resistance transducer for measuring displacement is classified as a resistance displacement transducer. Other classification examples are pressure bellows, force diaphragm, pressure flapper-nozzle, and so on.1、Transducer ElementsAlthough there are exception ,most transducers consist of a sensing element and a conversion or control element. For example, diaphragms,bellows,strain tubes and rings, bourdon tubes, and cantilevers are sensing elements which respond to changes in pressure or force and convert these physical quantities into a displacement. This displacement may then be used to change an electrical parameter such as voltage, resistance, capacitance, or inductance. Such combination of mechanical and electrical elements form electromechanical transducing devices or transducers. Similar combination can be made for other energy input such as thermal. Photo, magnetic and chemical,giving thermoelectric, photoelectric,electromaanetic, and electrochemical transducers respectively.2、Transducer SensitivityThe relationship between the measured and the transducer output signal is usually obtained by calibration tests and is referred to as the transducer sensitivity K1= output-signal increment / measured increment . In practice, the transducer sensitivity is usually known, and, by measuring the output signal, the input quantity is determined from input= output-signal increment / K1.3、Characteristics of an Ideal TransducerThe high transducer should exhibit the following characteristicsa) high fidelity-the transducer output waveform shape be a faithful reproduction of the measured; there should be minimum distortion.b) There should be minimum interference with the quantity being measured; the presence of the transducer should not alter the measured in any way.c) Size. The transducer must be capable of being placed exactly where it is needed.d) There should be a linear relationship between the measured and the transducer signal.e) The transducer should have minimum sensitivity to external effects, pressure transducers,for example,are often subjected to external effects such vibration and temperature.f) The natural frequency of the transducer should be well separated from the frequency and harmonics of the measurand.4、Electrical TransducersElectrical transducers exhibit many of the ideal characteristics. In addition they offer high sensitivity as well as promoting the possible of remote indication or mesdurement. Electrical transducers can be divided into two distinct groups:a) variable-control-parameter types,which include:i)resistanceii) capacitanceiii) inductanceiv) mutual-inductance typesThese transducers all rely on external excitation voltage for their operation.b) self-generating types,which includei) electromagneticii)thermoelectriciii)photoemissiveiv)piezo-electric typesThese all themselves produce an output voltage in response to the measurand input and their effects are reversible. For example, a piezo-electric transducer normally produces an output voltage in response to the deformation of a crystalline material; however, if an alternating voltage is applied across the material, the transducer exhibits the reversible effect by deforming or vibrating at the frequency of the alternating voltage.5、Resistance TransducersResistance transducers may be divided into two groups, as follows:i) Those which experience a large resistance change, measured by using potential-divider methods. Potentiometers are in this group.ii)Those which experience a small resistance change, measured by bridge-circuit methods. Examples of this group include strain gauges and resistance thermometers.5.1 PotentiometersA linear wire-wound potentiometer consists of a number of turns resistance wire wound around a non-conducting former, together with a wiping contact which travels over the barwires. The construction principles are shown in figure which indicate that the wiperdisplacement can be rotary, translational, or a combination of both to give a helical-type motion. The excitation voltage may be either a.c. or d.c. and the output voltage is proportional to the input motion, provided the measuring device has a resistance which is much greater than the potentiometer resistance.Such potentiometers suffer from the linked problem of resolution and electrical noise. Resolution is defined as the smallest detectable change in input and is dependent on thecross-sectional area of the windings and the area of the sliding contact. The output voltage is thus a serials of steps as the contact moves from one wire to next.Electrical noise may be generated by variation in contact resistance, by mechanical wear due to contact friction, and by contact vibration transmitted from the sensing element. In addition, the motion being measured may experience significant mechanical loading by the inertia and friction of the moving parts of the potentiometer. The wear on the contacting surface limits the life of a potentiometer to a finite number of full strokes or rotations usually referred to in the manufacture’s specification as the ‘number of cycles of life expectancy’, a typical value being 20*1000000 cycles.The output voltage V0 of the unload potentiometer circuit is determined as follows. Let resistance R1= xi/xt *Rt where xi = input displacement, xt= maximum possible displacement, Rt total resistance of the potentiometer. Then output voltage V0= V*R1/(R1+( Rt-R1))=V*R1/Rt=V*xi/xt*Rt/Rt=V*xi/xt. This shows that there is a straight-line relationship between output voltage and input displacement for the unloaded potentiometer.It would seen that high sensitivity could be achieved simply by increasing the excitation voltage V. however, the maximum value of V is determined by the maximum power dissipation P of the fine wires of the potentiometer winding and is given by V=(PRt)1/2 .5.2 Resistance Strain GaugesResistance strain gauges are transducers which exhibit a change in electrical resistance in response to mechanical strain. They may be of the bonded or unbonded variety .a) bonded strain gaugesUsing an adhesive, these gauges are bonded, or cemented, directly on to the surface of the body or structure which is being examined.Examples of bonded gauges arei) fine wire gauges cemented to paper backingii) photo-etched grids of conducting foil on an epoxy-resin backingiii)a single semiconductor filament mounted on an epoxy-resin backing with copper or nickel leads.Resistance gauges can be made up as single elements to measuring strain in one direction only,or a combination of elements such as rosettes will permit simultaneous measurements in more than one direction.b) unbonded strain gaugesA typical unbonded-strain-gauge arrangement shows fine resistance wires stretched around supports in such a way that the deflection of the cantilever spring system changes the tension in the wires and thus alters the resistance of wire. Such an arrangement may be found in commercially available force, load, or pressure transducers.5.3 Resistance Temperature TransducersThe materials for these can be divided into two main groups:a) metals such as platinum, copper, tungsten, and nickel which exhibit and increase in resistance as the temperature rises; they have a positive temperature coefficient of resistance.b) semiconductors, such as thermistors which use oxides of manganese, cobalt, chromium, or nickel. These exhibit large non-linear resistance changes with temperature variation and normally have a negative temperature coefficient of resistance.a) metal resistance temperature transducersThese depend, for many practical purpose and within a narrow temperature range, upon the relationship R1=R0*[1+a*(b1-b2)] where a coefficient of resistance in ℃-1,and R0 resistance in ohms at the reference temperature b0=0℃ at the reference temperature range ℃.The international practical temperature scale is based on the platinum resistance thermometer, which covers the temperature range -259.35℃ to 630.5℃.b) thermistor resistance temperature transducersThermistors are temperature-sensitive resistors which exhibit large non-liner resistance changes with temperature variation. In general, they have a negative temperature coefficient. For small temperature increments the variation in resistance is reasonably linear; but, if large temperature changes are experienced, special linearizing techniques are used in the measuring circuits to produce a linear relationship of resistance against temperature.Thermistors are normally made in the form of semiconductor discs enclosed in glass vitreous enamel. Since they can be made as small as 1mm,quite rapid response times are possible.5.4 Photoconductive CellsThe photoconductive cell , uses a light-sensitive semiconductor material. The resistance between the metal electrodes decrease as the intensity of the light striking the semiconductor increases. Common semiconductor materials used for photo-conductive cells are cadmium sulphide, lead sulphide, and copper-doped germanium.The useful range of frequencies is determined by material used. Cadmium sulphide is mainly suitable for visible light, whereas lead sulphide has its peak response in the infra-red regionand is, therefore , most suitable for flame-failure detection and temperature measurement. 5.5 Photoemissive CellsWhen light strikes the cathode of the photoemissive cell are given sufficient energy to arrive the cathode. The positive anode attracts these electrons, producing a current which flows through resistor R and resulting in an output voltage V.Photoelectrically generated voltage V=Ip.RlWhere Ip=photoelectric current(A),and photoelectric current Ip=Kt.BWhere Kt=sensitivity (A/im),and B=illumination input (lumen)Although the output voltage does give a good indication of the magnitude of illumination, the cells are more often used for counting or control purpose, where the light striking the cathode can be interrupted.6、Capacitive TransducersThe capacitance can thus made to vary by changing either the relative permittivity, the effective area, or the distance separating the plates. The characteristic curves indicate that variations of area and relative permittivity give a linear relationship only over a small range of spacings. Thus the sensitivity is high for small values of d. Unlike the potentionmeter, the variable-distance capacitive transducer has an infinite resolution making it most suitable for measuring small increments of displacement or quantities which may be changed to produce a displacement.7、Inductive TransducersThe inductance can thus be made to vary by changing the reluctance of the inductive circuit. Measuring techniques used with capacitive and inductive transducers:a)A.C. excited bridges using differential capacitors inductors.b)A.C. potentiometer circuits for dynamic measurements.c) D.C. circuits to give a voltage proportional to velocity for a capacitor.d) Frequency-modulation methods, where the change of C or L varies the frequency of an oscillation circuit.Important features of capacitive and inductive transducers are as follows:i)resolution infiniteii) accuracy+- 0.1% of full scale is quotediii)displacement ranges 25*10-6 m to 10-3miv) rise time less than 50us possibleTypical measurands are displacement, pressure, vibration, sound, and liquid level.8、Linear Variable-differential Ttransformer9、Piezo-electric Transducers10、Electromagnetic Transducers11、Thermoelectric Transducers12、Photoelectric Cells13、Mechanical Transducers and Sensing Elements传感器的基础知识传感器是一种把被测量转换为光的、机械的或者更平常的电信号的装置。
温度传感器中英文对照外文翻译文献
中英文资料外文翻译文献原文：Temperature Sensor ICs Simplify DesignsWhen you set out to select a temperature sensor, you are no longer limited to either an analog output or a digital output device. There is now a broad selection of sensor types, one of which should match your system's needs.Until recently, all the temperature sensors on the market provided analog outputs. Thermistors, RTDs, and thermocouples were followed by another analog-output device, the silicon temperature sensor. In most applications, unfortunately, these analog-output devices require a comparator, an ADC, or an amplifier at their output to make them useful.Thus, when higher levels of integration became feasible, temperature sensors with digital interfaces became available. These ICs are sold in a variety of forms, from simple devices that signal when a specific temperature has been exceeded to those that report both remote and local temperatures while providing warnings at programmed temperature settings. The choice now isn't simply between analog-output and digital-output sensors; there is a broad range of sensor types from which to choose.Classes of Temperature SensorsFour temperature-sensor types are illustrated in Figure 1. An ideal analog sensor provides an output voltage that is a perfectly linear function of temperature (A). In the digital I/O class of sensor (B), temperature data in the form of multiple 1s and 0s are passed to the microcontroller, often via a serial bus. Along the same bus, data are sent to the temperature sensor from the microcontroller, usually to set the temperature limit at which the alert pin's digital output will trip. Alert interrupts the microcontroller when the temperature limit has been exceeded. This type of device can also provide fan control.Figure 1. Sensor and IC manufacturers currently offer four classes of temperature sensors."Analog-plus" sensors (C) are available with various types of digital outputs. The V OUT versus temperature curve is for an IC whose digital output switches when a specific temperature has been exceeded. In this case, the "plus" added to the analog temperature sensor is nothing more than a comparator and a voltage reference. Other types of "plus" parts ship temperature data in the form of the delay time after the part has been strobed, or in the form of the frequency or the period of a square wave, which will be discussed later.The system monitor (D) is the most complex IC of the four. In addition to the functions provided by the digital I/O type, this type of device commonly monitors the system supply voltages, providing an alarm when voltages rise above or sink below limits set via the I/O bus. Fan monitoring and/or control is sometimes included in this type of IC. In some cases, this class of device is used to determine whether or not a fan is working. More complex versions control the fan as a function of one or more measured temperatures. The system monitor sensor is not discussed here but is briefly mentioned to give a complete picture of the types of temperature sensors available.Analog-Output Temperature SensorsThermistors and silicon temperature sensors are widely used forms of analog-output temperature sensors. Figure 2 clearly shows that when a linear relationship between voltage and temperature is needed, a silicon temperature sensor is a far better choice than a thermistor. Over a narrow temperature range, however, thermistors can provide reasonable linearity and good sensitivity. Many circuits originally constructed with thermistors have over time been updated using silicon temperature sensors.Figure 2. The linearity of thermistors and silicon temperature sensors, two popular analog-output temperature detectors, is contrasted sharply.Silicon temperature sensors come with different output scales and offsets. Some, for example, are available with output transfer functions that are proportional to K, others to °C or °F. Some of the °C parts provide an offset so that negative temperatures can be monitored using a single-ended supply.In most applications, the output of these devices is fed into a comparator or a n A/D converterto convert the temperature data into a digital format. Despite the need for these additional devices, thermistors and silicon temperature sensors continue to enjoy popularity due to low cost and convenience of use in many situations.Digital I/O Temperature SensorsAbout five years ago, a new type of temperature sensor was introduced. These devices include a digital interface that permits communication with a microcontroller. The interface is usually an I²C or SMBus serial bus, but other serial interfaces such as SPI are common. In addition to reporting temperature readings to the microcontroller, the interface also receives instructions from the microcontroller. Those instructions are often temperature limits, which, if exceeded, activate a digital signal on the temperature sensor IC that interrupts the microcontroller. The microcontroller is then able to adjust fan speed or back off the speed of a microprocessor, for example, to keep temperature under control.This type of device is available with a wide variety of features, among them, remote temperature sensing. To enable remote sensing, most high-performance CPUs include an on-chip transistor that provides a voltage analog of the temperature. (Only one of the transistor's two p-n junctions is used.) Figure 3 shows a remote CPU being monitored using this technique. Other applications utilize a discrete transistor to perform the same function.Figure 3. A user-programmable temperature sensor monitors the temperature of a remote CPU's on-chip p-n junction.Another important feature found on some of these types of sensors (including the sensor shown in Figure 3) is the ability to interrupt a microcontroller when the measured temperature falls outside a range bounded by high and low limits. On other sensors, an interrupt is generated when the measured temperature exceeds either a high or a low temperature threshold (i.e., not both). For the sensor in Figure 3, those limits are transmitted to the temperature sensor via the SMBus interface. If the temperature moves above or below the circumscribed range, the alert signal interrupts the processor.Pictured in Figure 4 is a similar device. Instead of monitoring one p-n junction, however, it monitors four junctions and its own internal temperature. Because Maxim's MAX1668 consumes a small amount of power, its internal temperature is close to the ambient temperature. Measuring the ambient temperature gives an indication as to whether or not the system fan is operating properly.Figure 4. A user-programmable temperature sensor monitors its own local temperature and the temperatures of four remote p-n junctions.Controlling a fan while monitoring remote temperature is the chief function of the IC shown in Figure 5. Users of this part can choose between two different modes of fan control. In the PWM mode, the microcontroller controls the fan speed as a function of the measured temperature by changing the duty cycle of the signal sent to the fan. This permits the power consumption to be far less than that of the linear mode of control that this part also provides. Because some fans emit an audible sound at the frequency of the PWM signal controlling it, the linear mode can be advantageous, but at the price of higher power consumption and additional circuitry. The added power consumption is a small fraction of the power consumed by the entire system, though.Figure 5. A fan controller/temperature sensor IC uses either a PWM- or linear-mode control scheme.This IC provides the alert signal that interrupts the microcontroller when the temperature violates specified limits. A safety feature in the form of the signal called "overt" (an abbreviated version of "over temperature") is also provided. If the microcontroller or the software were to lock up while temperature is rising to a dangerous level, the alert signal would no longer be useful. However, overt, which goes active once the temperature rises above a level set via the SMBus, is typically used to control circuitry without the aid of the microcontroller. Thus, in thishigh-temperature scenario with the microcontroller not functioning, overt could be used to shut down the system power supplies directly, without the microcontroller, and prevent a potentially catastrophic failure.This digital I/O class of devices finds widespread use in servers, battery packs, and hard-disk drives. Temperature is monitored in numerous locations to increase a server's reliability: at the motherboard (which is essentially the ambient temperature inside the chassis), inside the CPU die, and at other heat-generating components such as graphics accelerators and hard-disk drives. Battery packs incorporate temperature sensors for safety reasons and to optimize charging profiles, which maximizes battery life.There are two good reasons for monitoring the temperature of a hard-disk drive, which depends primarily on the speed of the spindle motor and the ambient temperature: The read errors in a drive increase at temperature extremes, and a hard disk's MTBF is improved significantly through temperature control. By measuring the temperature within the system, you can control motor speed to optimize reliability and performance. The drive can also be shut down. In high-end systems, alerts can be generated for the system administrator to indicate temperature extremes or situations where data loss is possible.Analog-Plus Temperature Sensors"Analog-plus" sensors are generally suited to simpler measurement applications. These ICs generate a logic output derived from the measured temperature and are distinguished from digital I/O sensors primarily because they output data on a single line, as opposed to a serial bus.In the simplest instance of an analog-plus sensor, the logic output trips when a specific temperature is exceeded. Some of these devices are tripped when temperature rises above a preset threshold, others, when temperature drops below a threshold. Some of these sensors allow the temperature threshold to be adjusted with a resistor, whereas others have fixed thresholds.The devices shown in Figure 6 are purchased with a specific internal temperature threshold. The three circuits illustrate common uses for this type of device: providing a warning, shutting down a piece of equipment, or turning on a fan.Figure 6. ICs that signal when a temperature has been exceeded are well suited forover/undertemperature alarms and simple on/off fan control.When an actual temperature reading is needed, and a microcontroller is available, sensors that transmit the reading on a single line can be useful. With the microcontroller's internal counter measuring time, the signals from this type of temperature sensor are readily transformed to a measure of temperature. The sensor in Figure 7 outputs a square wave whose frequency is proportional to the ambient temperature in Kelvin. The device in Figure 8 is similar, but theperiod of the square wave is proportional to the ambient temperature in kelvins.Figure 7. A temperature sensor that transmits a square wave whose frequency is proportional tothe measured temperature in Kelvin forms part of a heater controller circuit.Figure 8. This temperature sensor transmits a square wave whose period is proportional to the measured temperature in Kelvin. Because only a single line is needed to send temperature information, just a single optoisolator is required to isolate the signal path.Figure 9, a truly novel approach, allows up to eight temperature sensors to be connected on this common line. The process of extracting temperature data from these sensors begins when the microcontroller's I/O port strobes all the sensors on the line simultaneously. The microcontroller is then quickly reconfigured as an input in order to receive data from each of the sensors. The data are encoded as the amount of time that transpires after the sensors are strobed. Each of the sensors encodes this time after the strobe pulse within a specific range of time. Collisions are avoided by assigning each sensor its own permissible time range.Figure 9. A microcontroller strobes up to eight temperature sensors connected on a common line and receives the temperature data transmitted from each sensor on the same line.The accuracy achieved by this method is surprisingly high: 0.8°C is typical at room temperature, precisely matching that of the IC that encodes temperature data in the form of the frequency of the transmitted square wave. The same is true of the device that uses the period of the square wave.These devices are outstanding in wire-limited applications. For example, when a temperature sensor must be isolated from the microcontroller, costs are kept to a minimum because only one optoisolator is needed. These sensors are also of great utility in automotive and HVAC applications, because they reduce the amount of copper running over distances.Anticipated Temperature Sensor DevelopmentsIC temperature sensors provide a varied array of functions and interfaces. As these devicescontinue to evolve, system designers will see more application-specific features as well as new ways of interfacing the sensors to the system. Finally, the ability of chip designers to integrate more electronics in the same die area ensures that temperature sensors will soon include new functions and special interfaces.翻译：温度传感器芯片简化设计当选择一个温度传感器时，将不再局限于模拟输出或数字输出设备。
【机械类文献翻译】传感器2
外文资料(英文)Sensor is one kind component which can tansform the physical quantity, chemistry quantity and the biomass into electrical signal. The output signal has the different forms like the voltage, the electric current, the frequency, the pulse and so on, which can satisfy the signal transmiss ion, processing, recording, demonstration and control demands. So it is the automatic detectio n system and in the automatic control industry. If automatic Technology is used wider, then se nsor is more important. In information age, the information industry includs information gatherin g, transmission, process three parts, namely sensor technology, communication, computer te chnology. Because of ultra large scale integrated circuit’s rapid development after having been developed ,Modern computer technology and communication, not only requests sensor preci sion, reliability, speed of response and gain information content request more and more high, b ut also requests its cost to be inexpensive. The obvious traditional sensor is eliminated gradual ly because of the function, the characteristic, the volume, the cost and so on. As world develo p many countries are speeding up to the sensor new technology’s research and the developm ent, and all has obtained the enormous breakthrough. Now the sensor new technology develop ment, mainly has following several aspects:Firstly, discovering and using.Using the physical phenomenon, the chemical reaction, the biological effect as the sensor p rinciple therefore the researches which discovered the new phenomenon and the new effect are the sensor technological improving ways .it is importantstudies to develope new sensor’s t he foundation. Japanese Sharp Corporation uses the superconductivity technology to develop successfully the high temperature superconductivity magnetic sensor and get the sensor techn ology significant breakthrough. Its sensitivity is so high and only inferior in the superconductivit y quantum interference component. Its manufacture craft is far simpler than the superconductiv ity quantum interference component. May use in magnetism image formation technology.So it has the widespread promoted value.Using the immune body and the antigen meets one another compound when the electrode surface.It can cause the electrode potential change and use this phenomenon to be possible to generate the immunity sensor. The immunity sensor makes with this kind of immune body ma y to some organism in whether has this kind of anti- original work inspection. Like may inspect somebody with the hepatitis virus immune body whether contracts the hepatitis, plays to is fast, the accurate role. The US UC sixth branch has developped this kind of sensor.Secondly, using the new material.The sensor material is the important foundation for sensor technology, because the materi als science is progressive and the people may make each kind of new sensor. For example ma king the temperature sensor with the high polymer thin film; The optical fiber can make the pre ssure, the current capacity, the temperature, the displacement and so on the many kinds of se nsors; Making the pressure transmitter with the ceramics. The high polymer can become the pr oportion adsorption and the release hydrone along with the environment relative humidity size. The high polymer electricity lies between the constant to be small, the hydrone can enhance the polymer the coefficient of dielectrical loss. Making the capacitor the high polymer dielectric m edium, determines the electric capacity capacity the change, then obtains the relative humidity. Making the plasma using this principle to gather the legitimate polystyrene film temperature se nsor below, it has the characteristic:Measured the wet scope is wide;The temperature range is wide, may reach -400 ℃ ~ +1,500 ℃;The speed of response is quick, is smaller than 1S;The size is small, may use in the small space measuring wet;The temperature coefficient is small.The ceramic electric capacity type pressure transmitter is one kind does not have the inter mediary fluid the dry type pressure transmitter. Uses the advanced ceramic technology, the he avy film electronic technology, its technical performance is stable, the year drifting quantity is s maller than 0.1%F.S, warm floats is smaller than ±0.15%/10K, anti- overloads strongly, may re ach the measuring range several hundred times. The survey scope may from 0 to 60mpa. German E+H Corporation and the American Kavlio Corporation product is at the leading positi on.The optical fiber application is send the material significant breakthrough, its uses in most e arly the optical communication techniques. In the optical communication use discovered works as environmental condition change and so on the temperature, pressure, electric field, magneti c field, causes the fiber optic transmission light wave intensity, the phase, the frequency, chang e and so on the polarization condition, the survey light wave quantity change, may know cause s these light wave physical quantity the and so on quantitative change temperature, pressure, electric field, magnetic field size, uses these principles to be possible to develop the optical fib er sensor. The optical fiber sensor and the traditional sensor compare has many characteristics : Sensitivity high, the structure simple, the volume small, anti-corrosive, the electric insulation g ood, the path of rays may be curving, be advantageous for the realization telemetering and so on. Optical fiber sensor Japan is in the advanced level. Like Idec Izumi Corporation and Sunx Corporation. The optical fiber send receiver and the integrated path of rays technology unify, a ccelerates the optical fiber sensor technology development. Will integrate the path of rays com ponent to replace the original optics part and the passive light component, enable the optical fi ber sensor to have the high band width, the low signal processing voltage, the reliability high, t he cost will be low.Third, micro machine-finishing technologyIn semiconductor technology processing method oxygenation, the photoetching, the prolifer ation, the deposition, the plane electron craft, various guides corrosion and steams plates, the sputtering thin film and so on, these have all introduced to the sensor manufacture. Thus has p roduced each kind of new sensor, like makes the silicon micro sensor using the semiconductor technology, makes the fast response using the thin film craft the gas to be sensitive, the wet s ensitive sensor, the use sputtering thin film craft system pressure transmitter and so on.The Japanese horizontal river company uses various guides corrosion technology to carry on the high accuracy three dimensional processing, the system helps the silicon resonance typ e pressure transmitter. The core partially presses two resonant Liang by the feeling which abov e the silicon diaphragm and the silicon diaphragm manufactures to form, two resonant Liang's f requency difference correspondence different pressure, measures the pressure with the frequency difference method, may eliminate the error which factor and so on ambient temperature bri ngs. When ambient temperature change, two resonant Liang frequency and the amplitude vari ation are same, after two frequency differences, its same change quantity can counterbalance mutually. Its survey most high accuracy may reach 0.01%FS.American Silicon Microstructure Inc.(SMI) the company develops a series of low ends, linea r in 0.1% to 0.In 65% scope silicon micro pressure transmitter, the lowest full measuring range is 0.15psi (1KPa), it makes take the silicon as the material, has the unique three dimensional st ructure, the light slight machine-finishing, makes the wheatstone bridge many times with the et ching on the silicon diaphragm, when above silicon chip stress, it has the distortion, the resista nce produces presses the anti- effect but to lose the bridge balance, the output and the pressu re becomes the proportion the electrical signalSuch silicon micro sensor is the front technology which now the sensor develops,Its essenti al feature is the sensitive unit volume is a micron magnitude,Is the traditional sensor several do zens, several 1%. In aspect and so on industry control, aerospace domain, biomedicine has th e vital role, like on the airplane the use may reduce the airplane weight, reduces the energy. A nother characteristic is can be sensitive is small surveyed, may make the blood pressure press ure transmitter.The Chinese aviation main corporation Beijing observation and control technical research i nstitute, the development CYJ series splashes thanks the membrane pressure transmitter is us es the ion sputtering craft to process the metal strain gauge, it has overcome the nonmetallic st rain gauge easily the temperature influence insufficiency, has the high stability, is suitable in ea ch kind of situation, is measured the medium scope widely, but also overcame the tradition lowl y to glue the precision which the type brought, sluggish big, shortcoming and so on slow chang e, had the precision high, the reliability is high, the volume small characteristic, widely used in domain and so on aviation, petroleum, chemical industry, medical service.Fourth, integrates the sensorIntegrates the sensor the superiority is the traditional sensor is unable to achieve, it is a sim ple sensor not merely, it in at the same time the auxiliary circuit part and send the part will integ rate on together the chip, will cause it to have the calibration, to compensate, from the diagnosi s and the network correspondence function, it might reduce the cost, the gain in yield, this kind of blood pressure sensor which American LUCAS, NOVASENSOR Corporation will develop, e ach week will be able to produce 10,000.Fifth, intellectualized sensorThe intellectualized sensor is one kind of belt microprocessor sensor, is achievement which the microcomputer and the sensor unifies, it has at the same time the examination, the judgm ent and the information processing function, compares with the traditional sensor has very man y characteristics:Has the judgment and the information processing function, can carry on the revision, the err or to the observed value compensates, thus enhancement measuring accuracy;May realize the multi-sensor multi parameters survey;Has from the diagnosis and from the calibration function, enhances the reliability;The survey data may deposit and withdraw, easy to operate;Has the data communication interface dci, can and the microcomputer direct communicatio n.The sensor, the signal adjustment electric circuit, the monolithic integrated circuit integratio n forms ultra large-scale integrated on a chip the senior intelligence sensor. American HONY WELL Corporation ST-3000 intelligence sensor, the chip size only then has 3×4×2mm3, uses t he semiconductor craft, makes CPU, EPROM, the static pressure, the differential pressure, the temperature on the identical chip and so on three kind of sensitive units.The intellectualized sensor research and the development, US is at the leading position. A merican Space Agency when development spaceship called this kind of sensor for the clever s ensor (Smart Sensor), on the spaceship this kind of sensor is extremely important. Our country in this aspect research and development also very backward, mainly is because our country s emiconductor integrated circuit technological level is limited.The sensor’s development is changing day after day since specially the 80's humanities ha ve entered into the high industrialization the information age, sensor technology to renewal, hig her technological development. US, Japan and so on developed country sensor technological development quickest, our country because the foundation is weak, the sensor technology co mpares with these developed countries has the big disparity. Therefore, we should enlarge to t he sensor engineering research, the development investment, causes our country sensor tech nology and the foreign disparity reduces, promotes our country instrument measuring applianc e industry and from the technical development.外文翻译(中文)传感器是一种能将物理量、化学量、生物量等转换成电信号的器件。
传感器 外文翻译 外文文献 英文文献 分布是温度传感器
Distributed Temperature SensorIn the human living environment, temperature playing an extremely important role。
No matter where you live, engaged in any work, ever-present dealt with temperature under. Since the 18th century, industry since the industrial revolution to whether can master send exhibition has the absolute temperature touch. In metallurgy, steel, petrochemical, cement, glass, medicine industry and so on, can say almost eighty percent of industrial departments have to consider the factors with temperature. Temperature for industrial so important, thus promoting the development of the temperature sensor.Major general through three sensor development phase: analog integrated temperature sensor. The sensor is taken with silicon semiconductor integrated workmanship, therefore also called silicon sensor or monolithic integrated temperature sensor. Such sensing instruments have single function (only measuring temperature), temperature measurement error is smaller, price low, fast response, the transmission distance, small volume, micro-consumption electronic etc, suitable for long distance measurement temperature, temperature control, do not need to undertake nonlinear calibration, peripheral circuit is simple. It is currently the most common application at home and abroad, an integrated sensor。
传感器相关英语文献
DiMo:Distributed Node Monitoring in WirelessSensor NetworksAndreas Meier†,Mehul Motani∗,Hu Siquan∗,and Simon Künzli‡†Computer Engineering and Networks Lab,ETH Zurich,Switzerland∗Electrical&Computer Engineering,National University of Singapore,Singapore‡Siemens Building T echnologies,Zug,SwitzerlandABSTRACTSafety-critical wireless sensor networks,such as a distributed fire-or burglar-alarm system,require that all sensor nodes are up and functional.If an event is triggered on a node, this information must be forwarded immediately to the sink, without setting up a route on demand or having tofind an alternate route in case of a node or link failure.Therefore, failures of nodes must be known at all times and in case of a detected failure,an immediate notification must be sent to the network operator.There is usually a bounded time limit,e.g.,five minutes,for the system to report network or node failure.This paper presents DiMo,a distributed and scalable solution for monitoring the nodes and the topology, along with a redundant topology for increased robustness. Compared to existing solutions,which traditionally assume a continuous data-flow from all nodes in the network,DiMo observes the nodes and the topology locally.DiMo only reports to the sink if a node is potentially failed,which greatly reduces the message overhead and energy consump-tion.DiMo timely reports failed nodes and minimizes the false-positive rate and energy consumption compared with other prominent solutions for node monitoring.Categories and Subject DescriptorsC.2.2[Network Protocols]:Wireless Sensor NetworkGeneral TermsAlgorithms,Design,Reliability,PerformanceKeywordsLow power,Node monitoring,Topology monitoring,WSN 1.INTRODUCTIONDriven by recent advances in low power platforms and protocols,wireless sensor networks are being deployed to-day to monitor the environment from wildlife habitats[1] Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on thefirst page.To copy otherwise,to republish,to post on servers or to redistribute to lists,requires prior specific permission and/or a fee.MSWiM’08,October27–31,2008,Vancouver,BC,Canada.Copyright2008ACM978-1-60558-235-1/08/10...$5.00.to mission-criticalfire-alarm systems[5].There are,how-ever,still some obstacles in the way for mass application of wireless sensor networks.One of the key challenges is the management of the wireless sensor network itself.With-out a practical management system,WSN maintenance will be very difficult for network administrators.Furthermore, without a solid management plan,WSNs are not likely to be accepted by industrial users.One of the key points in the management of a WSN is the health status monitoring of the network itself.Node failures should be captured by the system and reported to adminis-trators within a given delay constraint.Due to the resource constraints of WSN nodes,traditional network management protocols such as SNMP adopted by TCP/IP networks are not suitable for sensor networks.In this paper,we con-sider a light-weight network management approach tailored specifically for WSNs and their unique constraints. Currently,WSN deployments can be categorized by their application scenario:data-gathering applications and event-detection applications.For data-gathering systems,health status monitoring is quite straight forward.Monitoring in-formation can be forwarded to the sink by specific health status packets or embedded in the regular data packets.Ad-ministrators can usually diagnose the network with a helper program.NUCLEUS[6]is one of the network management systems for data-gathering application of WSN.Since event-detection deployments do not have regular traffic to send to the sink,the solutions for data-gathering deployments are not suitable.In this case,health status monitoring can be quite challenging and has not been discussed explicitly in the literature.In an event-detection WSN,there is no periodic data trans-fer,i.e.,nodes maintain radio silence until there is an event to report.While this is energy efficient,it does mean that there is no possibility for the sink to decide whether the net-work is still up and running(and waiting for an event to be detected)or if some nodes in the network have failed and are therefore silent.Furthermore,for certain military ap-plications or safety-critical systems,the specifications may include a hard time constraint for accomplishing the node health status monitoring task.In an event-detection WSN,the system maintains a net-work topology that allows for forwarding of data to a sink in the case of an event.Even though there is no regular data transfer in the network,the network should always be ready to forward a message to the sink immediately when-ever necessary.It is this urgency of data forwarding that makes it undesirable to set up a routing table and neighborlist after the event has been detected.The lack of regular data transfer in the network also leads to difficulty in de-tecting bad quality links,making it challenging to establish and maintain a stable robust network topology.While we have mentioned event-detection WSNs in gen-eral,we accentuate that the distributed node monitoring problem we are considering is inspired by a real-world ap-plication:a distributed indoor wireless alarm system which includes a sensor for detection of a specific alarm such as fire(as studied in[5]).To illustrate the reporting require-ments of such a system,we point out that regulatory speci-fications require afire to be reported to the control station within10seconds and a node failure to be reported within 5minutes[9].This highlights the importance of the node-monitoring problem.In this paper,we present a solution for distributed node monitoring called DiMo,which consists of two functions: (i)Network topology maintenance,introduced in Section2, and(ii)Node health status monitoring,introduced in Sec-tion3.We compare DiMo to existing state-of-the-art node monitoring solutions and evaluate DiMo via simulations in Section4.1.1Design GoalsDiMo is developed based on the following design goals:•In safety critical event monitoring systems,the statusof the nodes needs to be monitored continuously,allow-ing the detection and reporting of a failed node withina certain failure detection time T D,e.g.,T D=5min.•If a node is reported failed,a costly on-site inspectionis required.This makes it of paramount interest todecrease the false-positive rate,i.e.,wrongly assuminga node to have failed.•In the case of an event,the latency in forwarding theinformation to the sink is crucial,leaving no time toset up a route on demand.We require the system tomaintain a topology at all times.In order to be robustagainst possible link failures,the topology needs toprovide redundancy.•To increase efficiency and minimize energy consump-tion,the two tasks of topology maintenance(in par-ticular monitoring of the links)and node monitoringshould be combined.•Maximizing lifetime of the network does not necessar-ily translate to minimizing the average energy con-sumption in the network,but rather minimizing theenergy consumption of the node with the maximal loadin the network.In particular,the monitoring shouldnot significantly increase the load towards the sink.•We assume that the event detection WSN has no reg-ular data traffic,with possibly no messages for days,weeks or even months.Hence we do not attempt to op-timize routing or load balancing for regular data.Wealso note that approaches like estimating links’perfor-mance based on the ongoing dataflow are not possibleand do not take them into account.•Wireless communications in sensor networks(especially indoor deployments)is known for its erratic behav-ior[2,8],likely due to multi-path fading.We assumesuch an environment with unreliable and unpredictablecommunication links,and argue that message lossesmust be taken into account.1.2Related WorkNithya et al.discuss Sympathy in[3],a tool for detect-ing and debugging failures in pre-and post-deployment sen-sor networks,especially designed for data gathering appli-cations.The nodes send periodic heartbeats to the sink that combines this information with passively gathered data to detect failures.For the failure detection,the sink re-quires receiving at least one heartbeat from the node every so called sweep interval,i.e.,its lacking indicates a node fail-ure.Direct-Heartbeat performs poorly in practice without adaptation to wireless packet losses.To meet a desired false positive rate,the rate of heartbeats has to be increased also increasing the communication cost.NUCLEUS[6]follows a very similar approach to Sympathy,providing a manage-ment system to monitor the heath status of data-gathering applications.Rost et al.propose with Memento a failure detection sys-tem that also requires nodes to periodically send heartbeats to the so called observer node.Those heartbeats are not directly forwarded to the sink node,but are aggregated in form of a bitmask(i.e.,bitwise OR operation).The ob-server node is sweeping its bitmask every sweep interval and will forward the bitmask with the node missing during the next sweep interval if the node fails sending a heartbeat in between.Hence the information of the missing node is disseminated every sweep interval by one hop,eventually arriving at the sink.Memento is not making use of ac-knowledgements and proactively sends multiple heartbeats every sweep interval,whereas this number is estimated based on the link’s estimated worst-case performance and the tar-geted false positive rate.Hence Memento and Sympathy do both send several messages every sweep interval,most of them being redundant.In[5],Strasser et al.propose a ring based(hop count)gos-siping scheme that provides a latency bound for detecting failed nodes.The approach is based on a bitmask aggre-gation,beingfilled ring by ring based on a tight schedule requiring a global clock.Due to the tight schedule,retrans-missions are limited and contention/collisions likely,increas-ing the number of false positives.The approach is similar to Memento[4],i.e.,it does not scale,but provides latency bounds and uses the benefits of acknowledgements on the link layer.2.TOPOLOGY MAINTENANCEForwarding a detected event without any delay requires maintaining a redundant topology that is robust against link failures.The characteristics of such a redundant topology are discussed subsequently.The topology is based on so called relay nodes,a neighbor that can provide one or more routes towards the sink with a smaller cost metric than the node itself has.Loops are inherently ruled out if packets are always forwarded to relay nodes.For instance,in a simple tree topology,the parent is the relay node and the cost metric is the hop count.In order to provide redundancy,every node is connected with at least two relay nodes,and is called redundantly con-nected.Two neighboring nodes can be redundantly con-nected by being each others relay,although having the same cost metric,only if they are both connected to the sink. This exception allows the nodes neighboring the sink to be redundantly connected and avoids having a link to the sinkas a single point of failure.In a(redundantly)connected network,all deployed nodes are(redundantly)connected.A node’s level L represents the minimal hop count to the sink according to the level of its relay nodes;i.e.,the relay with the least hop count plus one.The level is infinity if the node is not connected.The maximal hop count H to the sink represents the longest path to the sink,i.e.,if at every hop the relay node with the highest maximal hop count is chosen.If the node is redundantly connected,the node’s H is the maximum hop count in the set of its relays plus one, if not,the maximal hop count is infinity.If and only if all nodes in the network have afinite maximal hop count,the network is redundantly connected.The topology management function aims to maintain a redundantly connected network whenever possible.This might not be possible for sparsely connected networks,where some nodes might only have one neighbor and therefore can-not be redundantly connected by definition.Sometimes it would be possible tofind alternative paths with a higher cost metric,which in turn would largely increase the overhead for topology maintenance(e.g.,for avoiding loops).For the cost metric,the tuple(L,H)is used.A node A has the smaller cost metric than node B ifL A<L B∨(L A=L B∧H A<H B).(1) During the operation of the network,DiMo continuously monitors the links(as described in Section3),which allows the detection of degrading links and allows triggering topol-ogy adaptation.Due to DiMo’s redundant structure,the node is still connected to the network,during this neighbor search,and hence in the case of an event,can forward the message without delay.3.MONITORING ALGORITHMThis section describes the main contribution of this paper, a distributed algorithm for topology,link and node monitor-ing.From the underlying MAC protocol,it is required that an acknowledged message transfer is supported.3.1AlgorithmA monitoring algorithm is required to detect failed nodes within a given failure detection time T D(e.g.,T D=5min).A node failure can occur for example due to hardware fail-ures,software errors or because a node runs out of energy. Furthermore,an operational node that gets disconnected from the network is also considered as failed.The monitoring is done by so called observer nodes that monitor whether the target node has checked in by sending a heartbeat within a certain monitoring time.If not,the ob-server sends a node missing message to the sink.The target node is monitored by one observer at any time.If there are multiple observer nodes available,they alternate amongst themselves.For instance,if there are three observers,each one observes the target node every third monitoring time. The observer node should not only check for the liveliness of the nodes,but also for the links that are being used for sending data packets to the sink in case of a detected event. These two tasks are combined by selecting the relay nodes as observers,greatly reducing the network load and maximiz-ing the network lifetime.In order to ensure that all nodes are up and running,every node is observed at all times. The specified failure detection time T D is an upper bound for the monitoring interval T M,i.e.,the interval within which the node has to send a heartbeat.Since failure detec-tion time is measured at the sink,the detection of a missing node at the relay needs to be forwarded,resulting in an ad-ditional maximal delay T L.Furthermore,the heartbeat can be delayed as well,either by message collisions or link fail-ures.Hence the node should send the heartbeat before the relay’s monitoring timer expires and leave room for retries and clock drift within the time window T R.So the monitor-ing interval has to be set toT M≤T D−T L−T R(2) and the node has to ensure that it is being monitored every T M by one of its observers.The schedule of reporting to an observer is only defined for the next monitoring time for each observer.Whenever the node checks in,the next monitoring time is announced with the same message.So for every heartbeat sent,the old monitoring timer at the observer can be cancelled and a new timer can be set according the new time.Whenever,a node is newly observed or not being observed by a particular observer,this is indicated to the sink.Hence the sink is always aware of which nodes are being observed in the network,and therefore always knows which nodes are up and running.This registration scheme at the sink is an optional feature of DiMo and depends on the user’s requirements.3.2Packet LossWireless communication always has to account for possi-ble message losses.Sudden changes in the link quality are always possible and even total link failures in the order of a few seconds are not uncommon[2].So the time T R for send-ing retries should be sufficiently long to cover such blanks. Though unlikely,it is possible that even after a duration of T R,the heartbeat could not have been successfully for-warded to the observer and thus was not acknowledged,in spite of multiple retries.The node has to assume that it will be reported miss-ing at the sink,despite the fact it is still up and running. Should the node be redundantly connected,a recovery mes-sage is sent to the sink via another relay announcing be-ing still alive.The sink receiving a recovery message and a node-missing message concerning the same node can neglect these messages as they cancel each other out.This recov-ery scheme is optional,but minimizes the false positives by orders of magnitudes as shown in Section4.3.3Topology ChangesIn the case of a new relay being announced from the topol-ogy management,a heartbeat is sent to the new relay,mark-ing it as an observer node.On the other hand,if a depre-cated relay is announced,this relay might still be acting as an observer,and the node has to check in as scheduled.How-ever,no new monitor time is announced with the heartbeat, which will release the deprecated relay of being an observer.3.4Queuing PolicyA monitoring buffer exclusively used for monitoring mes-sages is introduced,having the messages queued according to a priority level,in particular node-missing messagesfirst. Since the MAC protocol and routing engine usually have a queuing buffer also,it must be ensured that only one single monitoring message is being handled by the lower layers atthe time.Only if an ACK is received,the monitoring mes-sage can be removed from the queue(if a NACK is received, the message remains).DiMo only prioritizes between the different types of monitoring messages and does not require prioritized access to data traffic.4.EV ALUATIONIn literature,there are very few existing solutions for mon-itoring the health of the wireless sensor network deployment itself.DiMo is thefirst sensor network monitoring solution specifically designed for event detection applications.How-ever,the two prominent solutions of Sympathy[3]and Me-mento[4]for monitoring general WSNs can also be tailored for event gathering applications.We compare the three ap-proaches by looking at the rate at which they generate false positives,i.e.,wrongly inferring that a live node has failed. False positives tell us something about the monitoring pro-tocol since they normally result from packet losses during monitoring.It is crucial to prevent false positives since for every node that is reported missing,a costly on-site inspec-tion is required.DiMo uses the relay nodes for observation.Hence a pos-sible event message and the regular heartbeats both use the same path,except that the latter is a one hop message only. The false positive probability thus determines the reliability of forwarding an event.We point out that there are other performance metrics which might be of interest for evaluation.In addition to false positives,we have looked at latency,message overhead, and energy consumption.We present the evaluation of false positives below.4.1Analysis of False PositivesIn the following analysis,we assume r heartbeats in one sweep for Memento,whereas DiMo and Sympathy allow sending up to r−1retransmissions in the case of unac-knowledged messages.To compare the performance of the false positive rate,we assume the same sweep interval for three protocols which means that Memento’s and Sympa-thy’s sweep interval is equal to DiMo’s monitoring interval. In the analysis we assume all three protocols having the same packet-loss probability p l for each hop.For Sympathy,a false positive for a node occurs when the heartbeat from the node does not arrive at the sink in a sweep interval,assuming r−1retries on every hop.So a node will generate false positive with a possibility(1−(1−p r l)d)n,where d is the hop count to the sink and n the numbers of heartbeats per sweep.In Memento,the bitmask representing all nodes assumes them failed by default after the bitmap is reset at the beginning of each sweep interval. If a node doesn’t report to its parent successfully,i.e.,if all the r heartbeats are lost in a sweep interval,a false positive will occur with a probability of p l r.In DiMo the node is reported missing if it fails to check in at the observer having a probability of p l r.In this case,a recovery message is triggered.Consider the case that the recovery message is not kept in the monitoring queue like the node-missing messages, but dropped after r attempts,the false positive rate results in p l r(1−(1−p l r)d).Table1illustrates the false positive rates for the three protocols ranging the packet reception rate(PRR)between 80%and95%.For this example the observed node is in afive-hop distance(d=5)from the sink and a commonPRR80%85%90%95% Sympathy(n=1) 3.93e-2 1.68e-2 4.99e-3 6.25e-4 Sympathy(n=2) 1.55e-3 2.81e-4 2.50e-5 3.91e-7 Memento8.00e-3 3.38e-3 1.00e-3 1.25e-4 DiMo 3.15e-4 5.66e-5 4.99e-67.81e-8Table1:False positive rates for a node with hop count5and3transmissions under different packet success rates.number of r=3attempts for forwarding a message is as-sumed.Sympathy clearly suffers from a high packet loss, but its performance can be increased greatly sending two heartbeats every sweep interval(n=2).This however dou-bles the message load in the network,which is especially substantial as the messages are not aggregated,resulting in a largely increased load and energy consumption for nodes next to the paring DiMo with Memento,we ob-serve the paramount impact of the redundant relay on the false positive rate.DiMo offers a mechanism here that is not supported in Sympathy or Memento as it allows sending up to r−1retries for the observer and redundant relay.Due to this redundancy,the message can also be forwarded in the case of a total blackout of one link,a feature both Memento and Sympathy are lacking.4.2SimulationFor evaluation purposes we have implemented DiMo in Castalia1.3,a state of the art WSN simulator based on the OMNet++platform.Castalia allows evaluating DiMo with a realistic wireless channel(based on the empiricalfindings of Zuniga et al.[8])and radio model but also captures effects like the nodes’clock drift.Packet collisions are calculated based on the signal to interference ratio(SIR)and the radio model features transition times between the radio’s states (e.g.,sending after a carrier sense will be delayed).Speck-MAC[7],a packet based version of B-MAC,with acknowl-edgements and a low-power listening interval of100ms is used on the link layer.The characteristics of the Chipcon CC2420are used to model the radio.The simulations are performed for a network containing80 nodes,arranged in a grid with a small Gaussian distributed displacement,representing an event detection system where nodes are usually not randomly deployed but rather evenly spread over the observed area.500different topologies were analyzed.The topology management results in a redun-dantly connected network with up to5levels L and a max-imum hop count H of6to8.A false positive is triggered if the node fails to check in, which is primarily due to packet errors and losses on the wireless channel.In order to understand false positives,we set the available link’s packet reception rate(PRR)to0.8, allowing us to see the effects of the retransmission scheme. Furthermore,thisfixed PRR also allows a comparison with the results of the previous section’s analysis and is shown in Figure1(a).The plot shows on the one hand side the monitoring based on a tree structure that is comparable to the performance of Memento,i.e.,without DiMo’s possibil-ity of sending a recovery message using an alternate relay. On the other hand side,the plot shows the false positive rate of DiMo.The plot clearly shows the advantage of DiMo’s redundancy,yet allowing sending twice as many heartbeats than the tree approach.This might not seem necessarily fair atfirst;however,in a real deployment it is always possible(a)Varying number of retries;PRR =0.8.(b)Varying link quality.Figure 1:False positives:DiMo achieves the targeted false positive rate of 1e-7,also representing the reliability for successfully forwarding an event.that a link fails completely,allowing DiMo to still forward the heartbeat.The simulation and the analysis show a slight offset in the performance,which is explained by a simulation artifact of the SpeckMAC implementation that occurs when the receiver’s wake-up time coincides with the start time of a packet.This rare case allows receiving not only one but two packets out of the stream,which artificially increases the link quality by about three percent.The nodes are observed every T M =4min,resulting in being monitored 1.3e5times a year.A false positive rate of 1e-6would result in having a particular node being wrongly reported failed every 7.7years.Therefore,for a 77-node net-work,a false positive rate of 1e-7would result in one false alarm a year,being the targeted false-positive threshold for the monitoring system.DiMo achieves this rate by setting the numbers of retries for both the heartbeat and the recov-ery message to four.Hence the guard time T R for sending the retries need to be set sufficiently long to accommodate up to ten messages and back-offtimes.The impact of the link quality on DiMo’s performance is shown in Figure 1(b).The tree topology shows a similar performance than DiMo,if the same number of messages is sent.However,it does not show the benefit in the case of a sudden link failure,allowing DiMo to recover immedi-ately.Additionally,the surprising fact that false positives are not going to zero for perfect link quality is explained by collisions.This is also the reason why DiMo’s curve for two retries flattens for higher link qualities.Hence,leaving room for retries is as important as choosing good quality links.5.CONCLUSIONIn this paper,we presented DiMo,a distributed algorithm for node and topology monitoring,especially designed for use with event-triggered wireless sensor networks.As a de-tailed comparative study with two other well-known moni-toring algorithm shows,DiMo is the only one to reach the design target of having a maximum error reporting delay of 5minutes while keeping the false positive rate and the energy consumption competitive.The proposed algorithm can easily be implemented and also be enhanced with a topology management mechanism to provide a robust mechanism for WSNs.This enables its use in the area of safety-critical wireless sensor networks.AcknowledgmentThe work presented in this paper was supported by CTI grant number 8222.1and the National Competence Center in Research on Mobile Information and Communication Sys-tems (NCCR-MICS),a center supported by the Swiss Na-tional Science Foundation under grant number 5005-67322.This work was also supported in part by phase II of the Embedded and Hybrid System program (EHS-II)funded by the Agency for Science,Technology and Research (A*STAR)under grant 052-118-0054(NUS WBS:R-263-000-376-305).The authors thank Matthias Woehrle for revising a draft version of this paper.6.REFERENCES[1] A.Mainwaring et al.Wireless sensor networks for habitatmonitoring.In 1st ACM Int’l Workshop on Wireless Sensor Networks and Application (WSNA 2002),2002.[2] A.Meier,T.Rein,et al.Coping with unreliable channels:Efficient link estimation for low-power wireless sensor networks.In Proc.5th Int’l worked Sensing Systems (INSS 2008),2008.[3]N.Ramanathan,K.Chang,et al.Sympathy for the sensornetwork debugger.In Proc.3rd ACM Conf.Embedded Networked Sensor Systems (SenSys 2005),2005.[4]S.Rost and H.Balakrishnan.Memento:A health monitoringsystem for wireless sensor networks.In Proc.3rd IEEE Communications Society Conf.Sensor,Mesh and Ad Hoc Communications and Networks (IEEE SECON 2006),2006.[5]M.Strasser,A.Meier,et al.Dwarf:Delay-aware robustforwarding for energy-constrained wireless sensor networks.In Proceedings of the 3rd IEEE Int’l Conference onDistributed Computing in Sensor Systems (DCOSS 2007),2007.[6]G.Tolle and D.Culler.Design of an application-cooperativemanagement system for wireless sensor networks.In Proc.2nd European Workshop on Sensor Networks (EWSN 2005),2005.[7]K.-J.Wong et al.Speckmac:low-power decentralised MACprotocols for low data rate transmissions in specknets.In Proc.2nd Int’l workshop on Multi-hop ad hoc networks:from theory to reality (REALMAN ’06),2006.[8]M.Zuniga and B.Krishnamachari.Analyzing thetransitional region in low power wireless links.In IEEE SECON 2004,2004.[9]Fire detection and fire alarm systems –Part 25:Componentsusing radio links.European Norm (EN)54-25:2008-06,2008.。
传感器技术外文文献及中文翻译
Sensor technologyA sensor is a device which produces a signal in response to its detecting or measuring a property ,such as position , force , torque ，pressure , temperature ，humidity , speed ，acceleration ，or vibration 。
Traditionally ，sensors （such as actuators and switches )have been used to set limits on the performance of machines .Common examples are (a）stops on machine tools to restrict work table movements ,(b) pressure and temperature gages with automatics shut-off features ，and （c）governors on engines to prevent excessive speed of operation . Sensor technology has become an important aspect of manufacturing processes and systems 。
It is essential for proper data acquisition and for the monitoring ，communication ，and computer control of machines and systems 。
Because they convert one quantity to another , sensors often are referred to as transducers .Analog sensors produce a signal , such as voltage ,which is proportional to the measured quantity .Digital sensors have numeric or digital outputs that can be transferred to computers directly 。
传感器技术外文文献及中文翻译讲课讲稿
Sensor technologyA sensor is a device which produces a signal in response to its detecting or measuring a property ,such as position , force , torque , pressure , temperature , humidity , speed , acceleration , or vibration .Traditionally ,sensors (such as actuators and switches )have been used to set limits on the performance of machines .Common examples are (a) stops on machine tools to restrict work table movements ,(b) pressure and temperature gages with automatics shut-off features , and (c) governors on engines to prevent excessive speed of operation . Sensor technology has become an important aspect of manufacturing processes and systems .It is essential for proper data acquisition and for the monitoring , communication , and computer control of machines and systems .Because they convert one quantity to another , sensors often are referred to as transducers .Analog sensors produce a signal , such as voltage ,which is proportional to the measured quantity .Digital sensors have numeric or digital outputs that can be transferred to computers directly .Analog-to-coverter(ADC) is available for interfacing analog sensors with computers .Classifications of SensorsSensors that are of interest in manufacturing may be classified generally as follows:Machanical sensors measure such as quantities aspositions ,shape ,velocity ,force ,torque , pressure , vibration , strain , and mass .Electrical sensors measure voltage , current , charge , and conductivity .Magnetic sensors measure magnetic field ,flux , and permeablity .Thermal sensors measure temperature , flux ,conductivity , and special heat .Other types are acoustic , ultrasonic , chemical , optical , radiation , laser ,and fiber-optic .Depending on its application , a sensor may consist of metallic , nonmetallic , organic , or inorganic materials , as well as fluids ,gases ,plasmas , or semiconductors .Using the special characteristics of these materials , sensors covert the quantity or property measured to analog or digital output. The operation of an ordinary mercury thermometer , for example , is based on the difference between the thermal expansion of mercury and that of glass.Similarly , a machine part , a physical obstruction , or barrier in a space can be detected by breaking the beam of light when sensed by a photoelectric cell . A proximity sensor ( which senses and measures the distance between it and an object or a moving member of a machine ) can be based on acoustics , magnetism , capacitance , or optics . Other actuators contact the object and take appropriate action ( usually by electromechanical means ) . Sensors are essential to the conduct of intelligent robots , and are being developed with capabilities that resemble those of humans ( smart sensors , see the following ).This is America, the development of such a surgery Lin Bai an example, through the screen, through a remote control operator to control another manipulator, through the realization of the right abdominal surgery A few years ago our country theexhibition, the United States has been successful in achieving the right to the heart valve surgery and bypass surgery. This robot has in the area, caused a great sensation, but also, AESOP's surgical robot, In fact, it through some equipment to some of the lesions inspections, through a manipulator can be achieved on some parts of the operation Also including remotely operated manipulator, and many doctors are able to participate in the robot under surgery Robot doctor to include doctors with pliers, tweezers or a knife to replace the nurses, while lighting automatically to the doctor's movements linked, the doctor hands off, lighting went off, This is very good, a doctor's assistant.Tactile sensing is the continuous of variable contact forces , commonly by an array of sensors . Such a system is capable of performing within an arbitrarythree-dimensional space .has gradually shifted from manufacturing tonon-manufacturing and service industries, we are talking about the car manufacturer belonging to the manufacturing industry, However, the services sector including cleaning, refueling, rescue, rescue, relief, etc. These belong to the non-manufacturing industries and service industries, so here is compared with the industrial robot, it is a very important difference. It is primarily a mobile platform, it can move to sports, there are some arms operate, also installed some as a force sensor and visual sensors, ultrasonic ranging sensors, etc. It’s surrounding environment for the conduct of identification, to determine its campaign to complete some work, this is service robot’s one of the basic characteristicsIn visual sensing (machine vision , computer vision ) , cameral optically sense the presence and shape of the object . A microprocessor then processes the image ( usually in less than one second ) , the image is measured , and the measurements are digitized ( image recognition ) .Machine vision is suitable particularly for inaccessible parts , in hostile manufacturing environments , for measuring a large number of small features , and in situations where physics contact with the part may cause damage .Small sensors have the capability to perform a logic function , to conducttwo-way communication , and to make a decisions and take appropriate actions . The necessary input and the knowledge required to make a decision can be built into a smart sensor . For example , a computer chip with sensors can be programmed to turn a machine tool off when a cutting tool fails . Likewise , a smart sensor can stop a mobile robot or a robot arm from accidentally coming in contact with an object or people by using quantities such as distance , heat , and noise .Sensor fusion . Sensor fusion basically involves the integration of multiple sensors in such a manner where the individual data from each of the sensors ( such as force , vibration , temperature , and dimensions ) are combined to provide a higher level of information and reliability . A common application of sensor fusion occurs when someone drinks a cup of hot coffee . Although we take such a quotidian event for granted ,it readily can be seen that this process involves data input from the person's eyes , lips , tongue , and hands .Through our basic senses of sight , hearing , smell , taste , and touch , there is real-time monitoring of relative movements , positions , and temperatures . Thus if the coffee is too hot , the hand movement of the cup toward the lip is controlled and adjusted accordingly .The earliest applications of sensor fusion were in robot movement control , missile flight tracking , and similar military applications . Primarily because these activities involve movements that mimic human behavior . Another example of sensor fusion is a machine operation in which a set of different but integrated sensors monitors (a) the dimensions and surface finish of workpiece , (b) tool forces , vibrations ,and wear ,(c) the temperature in various regions of the tool-workpiece system , and (d) the spindle power .An important aspect in sensor fusion is sensor validation : the failure of one particular sensor is detected so that the control system maintains high reliability . For this application ,the receiving of redundant data from different sensors is essential . It can be seen that the receiving , integrating of all data from various sensors can be a complex problem .With advances in sensor size , quality , and technology and continued developments in computer-control systems , artificial neural networks , sensor fusion has become practical and available at low cost .Movement is relatively independent of the number of components, the equivalent of our body, waist is a rotary degree of freedom We have to be able to hold his arm, Arm can be bent, then this three degrees of freedom, Meanwhile there is a wrist posture adjustment to the use of the three autonomy, the general robot has six degrees of freedom. We will be able to space the three locations, three postures, the robot fully achieved, and of course we have less than six degrees of freedomFiber-optic sensors are being developed for gas-turbine engines . These sensors will be installed in critical locations and will monitor the conditions inside the engine , such as temperature , pressure , and flow of gas . Continuous monitoring of the signals from thes sensors will help detect possible engine problems and also provide the necessary data for improving the efficiency of the engines .传感器技术传感器一种通过检测某一参数而产生信号的装置。
最新传感器技术外文文献及中文翻译资料
Sensor technologyA sensor is a device which produces a signal in response to its detecting or measuring a property ,such as position , force , torque , pressure , temperature , humidity , speed , acceleration , or vibration .Traditionally ,sensors (such as actuators and switches )have been used to set limits on the performance of machines .Common examples are (a) stops on machine tools to restrict work table movements ,(b) pressure and temperature gages with automatics shut-off features , and (c) governors on engines to prevent excessive speed of operation . Sensor technology has become an important aspect of manufacturing processes and systems .It is essential for proper data acquisition and for the monitoring , communication , and computer control of machines and systems .Because they convert one quantity to another , sensors often are referred to as transducers .Analog sensors produce a signal , such as voltage ,which is proportional to the measured quantity .Digital sensors have numeric or digital outputs that can be transferred to computers directly .Analog-to-coverter(ADC) is available for interfacing analog sensors with computers .Classifications of SensorsSensors that are of interest in manufacturing may be classified generally as follows:Machanical sensors measure such as quantities aspositions ,shape ,velocity ,force ,torque , pressure , vibration , strain , and mass .Electrical sensors measure voltage , current , charge , and conductivity .Magnetic sensors measure magnetic field ,flux , and permeablity .Thermal sensors measure temperature , flux ,conductivity , and special heat .Other types are acoustic , ultrasonic , chemical , optical , radiation , laser ,and fiber-optic .Depending on its application , a sensor may consist of metallic , nonmetallic , organic , or inorganic materials , as well as fluids ,gases ,plasmas , or semiconductors .Using the special characteristics of these materials , sensors covert the quantity or property measured to analog or digital output. The operation of an ordinary mercury thermometer , for example , is based on the difference between the thermal expansion of mercury and that of glass.Similarly , a machine part , a physical obstruction , or barrier in a space can be detected by breaking the beam of light when sensed by a photoelectric cell . A proximity sensor ( which senses and measures the distance between it and an object or a moving member of a machine ) can be based on acoustics , magnetism , capacitance , or optics . Other actuators contact the object and take appropriate action ( usually by electromechanical means ) . Sensors are essential to the conduct of intelligent robots , and are being developed with capabilities that resemble those of humans ( smart sensors , see the following ).This is America, the development of such a surgery Lin Bai an example, through the screen, through a remote control operator to control another manipulator, through the realization of the right abdominal surgery A few years ago our country theexhibition, the United States has been successful in achieving the right to the heart valve surgery and bypass surgery. This robot has in the area, caused a great sensation, but also, AESOP's surgical robot, In fact, it through some equipment to some of the lesions inspections, through a manipulator can be achieved on some parts of the operation Also including remotely operated manipulator, and many doctors are able to participate in the robot under surgery Robot doctor to include doctors with pliers, tweezers or a knife to replace the nurses, while lighting automatically to the doctor's movements linked, the doctor hands off, lighting went off, This is very good, a doctor's assistant.Tactile sensing is the continuous of variable contact forces , commonly by an array of sensors . Such a system is capable of performing within an arbitrarythree-dimensional space .has gradually shifted from manufacturing tonon-manufacturing and service industries, we are talking about the car manufacturer belonging to the manufacturing industry, However, the services sector including cleaning, refueling, rescue, rescue, relief, etc. These belong to the non-manufacturing industries and service industries, so here is compared with the industrial robot, it is a very important difference. It is primarily a mobile platform, it can move to sports, there are some arms operate, also installed some as a force sensor and visual sensors, ultrasonic ranging sensors, etc. It’s surrounding environment for the conduct of identification, to determine its campaign to complete some work, this is service robot’s one of the basic characteristicsIn visual sensing (machine vision , computer vision ) , cameral optically sense the presence and shape of the object . A microprocessor then processes the image ( usually in less than one second ) , the image is measured , and the measurements are digitized ( image recognition ) .Machine vision is suitable particularly for inaccessible parts , in hostile manufacturing environments , for measuring a large number of small features , and in situations where physics contact with the part may cause damage .Small sensors have the capability to perform a logic function , to conducttwo-way communication , and to make a decisions and take appropriate actions . The necessary input and the knowledge required to make a decision can be built into a smart sensor . For example , a computer chip with sensors can be programmed to turn a machine tool off when a cutting tool fails . Likewise , a smart sensor can stop a mobile robot or a robot arm from accidentally coming in contact with an object or people by using quantities such as distance , heat , and noise .Sensor fusion . Sensor fusion basically involves the integration of multiple sensors in such a manner where the individual data from each of the sensors ( such as force , vibration , temperature , and dimensions ) are combined to provide a higher level of information and reliability . A common application of sensor fusion occurs when someone drinks a cup of hot coffee . Although we take such a quotidian event for granted ,it readily can be seen that this process involves data input from the person's eyes , lips , tongue , and hands .Through our basic senses of sight , hearing , smell , taste , and touch , there is real-time monitoring of relative movements , positions , and temperatures . Thus if the coffee is too hot , the hand movement of the cup toward the lip is controlled and adjusted accordingly .The earliest applications of sensor fusion were in robot movement control , missile flight tracking , and similar military applications . Primarily because these activities involve movements that mimic human behavior . Another example of sensor fusion is a machine operation in which a set of different but integrated sensors monitors (a) the dimensions and surface finish of workpiece , (b) tool forces , vibrations ,and wear ,(c) the temperature in various regions of the tool-workpiece system , and (d) the spindle power .An important aspect in sensor fusion is sensor validation : the failure of one particular sensor is detected so that the control system maintains high reliability . For this application ,the receiving of redundant data from different sensors is essential . It can be seen that the receiving , integrating of all data from various sensors can be a complex problem .With advances in sensor size , quality , and technology and continued developments in computer-control systems , artificial neural networks , sensor fusion has become practical and available at low cost .Movement is relatively independent of the number of components, the equivalent of our body, waist is a rotary degree of freedom We have to be able to hold his arm, Arm can be bent, then this three degrees of freedom, Meanwhile there is a wrist posture adjustment to the use of the three autonomy, the general robot has six degrees of freedom. We will be able to space the three locations, three postures, the robot fully achieved, and of course we have less than six degrees of freedomFiber-optic sensors are being developed for gas-turbine engines . These sensors will be installed in critical locations and will monitor the conditions inside the engine , such as temperature , pressure , and flow of gas . Continuous monitoring of the signals from thes sensors will help detect possible engine problems and also provide the necessary data for improving the efficiency of the engines .传感器技术传感器一种通过检测某一参数而产生信号的装置。
传感器技术论文中英文对照资料外文翻译文献
传感器技术论文中英文对照资料外文翻译文献中英文对照资料外文翻译文献附件1:外文资料翻译译文传感器新技术的发展传感器是一种能将物理量、化学量、生物量等转换成电信号的器件。
输出信号有不同形式，如电压、电流、频率、脉冲等，能满足信息传输、处理、记录、显示、控制要求，是自动检测系统和自动控制系统中不可缺少的元件。
如果把计算机比作大脑，那么传感器则相当于五官，传感器能正确感受被测量并转换成相应输出量，对系统的质量起决定性作用。
自动化程度越高，系统对传感器要求越高。
在今天的信息时代里，信息产业包括信息采集、传输、处理三部分，即传感技术、通信技术、计算机技术。
现代的计算机技术和通信技术由于超大规模集成电路的飞速发展，而已经充分发达后，不仅对传感器的精度、可靠性、响应速度、获取的信息量要求越来越高，还要求其成本低廉且使用方便。
显然传统传感器因功能、特性、体积、成本等已难以满足而逐渐被淘汰。
世界许多发达国家都在加快对传感器新技术的研究与开发，并且都已取得极大的突破。
如今传感器新技术的发展，主要有以下几个方面:利用物理现象、化学反应、生物效应作为传感器原理，所以研究发现新现象与新效应是传感器技术发展的重要工作，是研究开发新型传感器的基础。
日本夏普公司利用超导技术研制成功高温超导磁性传感器，是传感器技术的重大突破，其灵敏度高，仅次于超导量子干涉器件。
它的制造工艺远比超导量子干涉器件简单。
可用于磁成像技术，有广泛推广价值。
利用抗体和抗原在电极表面上相遇复合时，会引起电极电位的变化，利用这一现象可制出免疫传感器。
用这种抗体制成的免疫传感器可对某生物体内是否有这种抗原作检查。
如用肝炎病毒抗体可检查某人是否患有肝炎，起到快速、准确作用。
美国加州大学巳研制出这类传感器。
传感器材料是传感器技术的重要基础，由于材料科学进步，人们可制造出各种新型传感器。
例如用高分子聚合物薄膜制成温度传感器;光导纤维能制成压力、流量、温度、位移等多种传感器;用陶瓷制成压力传感器。
DS18B20数字式温度传感器中英文资料外文翻译文献
中英文资料外文翻译文献The introduction to The DS18B201. DESCRIPTIONThe DS18B20 digital thermometer provides 9-bit to 12-bit Celsius temperature measurements and has an alarm function with nonvolatile user programmable upper and lower trigger points. The DS18B20 communicates over a 1-Wire bus that by definition requires only one data line for communication with a central microprocessor. It has an operating temperature range of -55°C to +125°C and is accurate to ±0.5°C over the range of -10°C to +85°C. In addition, the DS18B20 can derive power directly from the data line (“parasite power”), eliminating the need for an external power supply.Each DS18B20 has a unique 64-bit serial code, which allows multiple DS18B20s to function on the same 1-Wire bus. Thus, it is simple to use one microprocessor to control many DS18B20s distributed over a large area. Applications that can benefit from this feature include HV AC environmental controls, temperature monitoring systems inside buildings, equipment, or machinery, and process monitoring and control systems.2.FEATURESUnique 1-Wire® Interface Requires Only One Port Pin for Communication1●Each Device has a Unique 64-Bit Serial Code Stored in an On-Board ROM●Multi-drop Capability Simplifies Distributed Temperature-Sensing Applications ●Requires No External Components●Can Be Powered from Data Line; Power Supply Range is 3.0V to 5.5V●Measures Temperatures from -55°C to +125°C (-67°F to +257°F)●±0.5°C Accuracy from -10°C to +85°C●Thermometer Resolution is User Selectable from 9 to 12 Bits●Converts Temperature to 12-Bit Digital Word in 750ms (Max)●User-Definable Nonvolatile (NV) Alarm Settings●Alarm Search Command Identifies and Addresses Devices Whose Temperature isOutside Programmed Limits●Software Compatible with the DS1822●Applications Include Thermostatic Controls, Industrial Systems, ConsumerProducts, Thermometers, or Any Thermally Sensitive System3.OVERVIEWFigure 1 shows a block diagram of the DS18B20, and pin descriptions are given in the Pin Description table. The 64-bit ROM stores the device’s unique serial code. The scratchpad memory contains the 2-byte temperature register that stores the digital output from the temperature sensor. In addition, the scratchpad provides access to the 1-byte upper and lower alarm trigger registers (TH and TL) and the 1-byte configuration register. The configuration register allows the user to set the resolution of the temperature to-digital conversion to 9, 10, 11, or 12 bits. The TH, TL, and configuration registers are nonvolatile (EEPROM), so they will retain data when the device is powered down.The DS18B20 uses Maxim’s exclusive 1-Wire bus protocol that implements bus communication using one control signal. The control line requires a weak pull up resistor since all devices are linked to the bus via a 3-state or open-drain port (the DQ2pin in the case of the DS18B20). In this bus system, the microprocessor (the master device) identifies and addresses devices on the bus using each device’s unique 64-bit code. Because each device has a unique code, the number of devices that can be addressed on one DS18B20 bus is virtually unlimited. The 1-Wire bus protocol, including detailed explanations of the commands and “time slots,” is covered in the 1-Wire Bus System section.Another feature of the DS18B20 is the ability to operate without an external power supply. Power is instead supplied through the 1-Wire pull up resistor via the DQ pin when the bus is high. The high bus signal also charges an internal capacitor (CPP), which then supplies power to the device when the bus is low. This method of deriving power from the 1-Wire bus is referred to as “parasite power.” As an alternative, the DS18B20 may also be powered by an external supply on VDD.Figure 1.DS18B20 Block Diagram4.OPERATION—MEASURING TEMPERATURThe core functionality of the DS18B20 is its direct-to-digital temperature sensor. The resolution of the temperature sensor is user-configurable to 9, 10, 11, or 12 bits, corresponding to increments of 0.5°C, 0.25°C, 0.125°C, and 0.0625°C, respectively. The default resolution at power-up is 12-bit. The DS18B20 powers up in a low-power idle state. To initiate a temperature measurement and A-to-D conversion, the master must issue a Convert T [44h] command. Following the conversion, the resulting3thermal data is stored in the 2-byte temperature register in the scratchpad memory and the DS18B20 returns to its idle state. If the DS18B20 is powered by an external supply, the master can issue “read time slots” (see the 1-Wire Bus System section) after the Convert T command and the DS18B20 will respond by transmitting 0 while the temperature conversion is in progress and 1 when the conversion is done. If the DS18B20 is powered with parasite power, this notification technique cannot be used since the bus must be pulled high by a strong pull up during the entire temperature conversion.The DS18B20 output temperature data is calibrated in degrees Celsius; for Fahrenheit applications, a lookup table or conversion routine must be used. The temperature data is stored as a 16-bit sign-extended two’s complement number in the temperature register (see Figure 2). The sign bits (S) indicate if the temperature is positive or negative: for positive numbers S = 0 and for negative numbers S = 1. If the DS18B20 is configured for 12-bit resolution, all bits in the temperature register will contain valid data. For 11-bit resolution, bit 0 is undefined. For 10-bit resolution, bits 1 and 0 are undefined, and for 9-bit resolution bits 2, 1, and 0 are undefined. Table 1 gives examples of digital output data and the corresponding temperature reading for 12-bit resolution conversions.4Table 1.Temperature/Data Relationship5.64-BIT LASERED ROM CODEEach DS18B20 contains a unique 64–bit code (see Figure 3) stored in ROM. The least significant 8 bits of the ROM code contain the DS18B20’s 1-Wire family code: 28h. The next 48 bits contain a unique serial number. The most significant 8 bits contain a cyclic redundancy check (CRC) byte that is calculated from the first 56 bits of the ROM code. The 64-bit ROM code and associated ROM function control logic allow the DS18B20 to operate as a 1-Wire device using the protocol detailed in the 1-Wire Bus System section.Figure 3.64-Bit Lasered ROM Code6.MEMORYThe DS18B20’s memory is organized as shown in Figure 4. The memory consists of an SRAM scratchpad with nonvolatile EEPROM storage for the high and low alarm trigger registers (TH and TL) and configuration register. Note that if the DS18B20 alarm function is not used, the TH and TL registers can serve as general-purpose memory.Byte 0 and byte 1 of the scratchpad contain the LSB and the MSB of the temperature register, respectively. These bytes are read-only. Bytes 2 and 3 provide access to TH and TL registers. Byte 4 contains the configuration register data. Bytes 5, 6, and 7 are reserved for internal use by the device and cannot be overwritten. Byte 8 of the scratchpad is read-only and contains the CRC code for bytes 0 through 7 of the scratchpad. The DS18B20 generates this CRC using the method described in the CRC Generation section.Data is written to bytes 2, 3, and 4 of the scratchpad using the Write Scratchpad [4Eh] command; the data must be transmitted to the DS18B20 starting with the least56significant bit of byte 2. To verify data integrity, the scratchpad can be read (using the Read Scratchpad [BEh] command) after the data is written. When reading the scratchpad, data is transferred over the 1-Wire bus starting with the least significant bit of byte 0. To transfer the TH, TL and configuration data from the scratchpad to EEPROM, the master must issue the Copy Scratchpad [48h] command.7.CONFIGURATION REGISTERByte 4 of the scratchpad memory contains the configuration register, which is organized as illustrated in Figure 5. The user can set the conversion resolution of the DS18B20 using the R0 and R1 bits in this register as shown in Table 2. The power-up default of these bits is R0 = 1 and R1 = 1 (12-bit resolution). Note that there is a direct tradeoff between resolution and conversion time. Bit 7 and bits 0 to 4 in the configuration register are reserved for internal useby the device and cannot be overwritten.8.1-WIRE BUS SYSTEMThe 1-Wire bus system uses a single bus master to control one or more slave devices. The DS18B20 is always a slave. When there is only one slave on the bus, the system is referred to as a “single-drop” system; the system is “multi-drop” if there are multiple slaves on the bus. All data and commands are transmitted least significant bit first over the 1-Wire bus. The following discussion of the 1-Wire bus system is broken down into three topics: hardware configuration, transaction sequence, and1-Wire signaling (signal types and timing).9.TRANSACTION SEQUENCEThe transaction sequence for accessing the DS18B20 is as follows:Step 1. InitializationStep 2. ROM Command (followed by any required data exchange)Step 3. DS18B20 Function Command (followed by any required data exchange)It is very important to follow this sequence every time the DS18B20 is accessed, as the DS18B20 will not respond if any steps in the sequence are missing or out of order. Exceptions to this rule are the Search ROM [F0h] and Alarm Search [ECh] commands. After issuing either of these ROM commands, the master must return to Step 1 in the sequence.（1）INITIALIZATIONAll transactions on the 1-Wire bus begin with an initialization sequence. The initialization sequence consists of a reset pulse transmitted by the bus master followed7by presence pulse(s) transmitted by the slave(s). The presence pulse lets the bus master know that slave devices (such as the DS18B20) are on the bus and are ready to operate.（2）ROM COMMANDSAfter the bus master has detected a presence pulse, it can issue a ROM command. These commands operate on the unique 64-bit ROM codes of each slave device and allow the master to single out a specific device if many are present on the 1-Wire bus. These commands also allow the master to determine how many and what types of devices are present on the bus or if any device has experienced an alarm condition. There are five ROM commands, and each command is 8 bits long. The master device must issue an appropriate ROM command before issuing a DS18B20 function command.1.SEARCH ROM [F0h]When a system is initially powered up, the master must identify the ROM codes of all slave devices on the bus, which allows the master to determine the number of slaves and their device types. The master learns the ROM codes through a process of elimination that requires the master to perform a Search ROM cycle (i.e., Search ROM command followed by data exchange) as many times as necessary to identify all of the slave devices. If there is only one slave on the bus, the simpler Read ROM command can be used in place of the Search ROM process.2.READ ROM [33h]This command can only be used when there is one slave on the bus. It allows the bus master to read the slave’s 64-bit ROM code without using the Search ROM procedure. If this command is used when there is more than one slave present on the bus, a data collision will occur when all the slaves attempt to respond at the same time.3.MATCH ROM [55h]The match ROM command followed by a 64-bit ROM code sequence allows8the bus master to address a specific slave device on a multi-drop or single-drop bus. Only the slave that exactly matches the 64-bit ROM code sequence will respond to the function command issued by the master; all other slaves on the bus will wait for a reset pulse.4.SKIP ROM [CCh]The master can use this command to address all devices on the bus simultaneously without sending out any ROM code information. For example, the master can make all DS18B20s on the bus perform simultaneous temperature conversions by issuing a Skip ROM command followed by a Convert T [44h] command. Note that the Read Scratchpad [BEh] command can follow the Skip ROM command only if there is a single slave device on the bus. In this case, time is saved by allowing the master to read from the slave without sending the device’s 64-bit ROM code. A Skip ROM command followed by a Read Scratchpad command will cause a data collision on the bus if there is more than one slave since multiple devices will attempt to transmit data simultaneously.5.ALARM SEARCH [ECh]The operation of this command is identical to the operation of the Search ROM command except that only slaves with a set alarm flag will respond. This command allows the master device to determine if any DS18B20s experienced an alarm condition during the most recent temperature conversion. After every Alarm Search cycle (i.e., Alarm Search command followed by data exchange), the bus master must return to Step 1 (Initialization) in the transaction sequence.（3）DS18B20 FUNCTION COMMANDSAfter the bus master has used a ROM command to address the DS18B20 with which it wishes to communicate, the master can issue one of the DS18B20 function commands. These commands allow the master to write to and read from the D S18B20’s scratchpad memory, initiate temperature conversions and determine the power supply mode.91.CONVERT T [44h]This command initiates a single temperature conversion. Following the conversion, the resulting thermal data is stored in the 2-byte temperature register in the scratchpad memory and the DS18B20 returns to its low-power idle state. If the device is being used in parasite power mode, within 10µs (max) after this command is issued the master must enable a strong pull up on the 1-Wire bus. If the DS18B20 is powered by an external supply, the master can issue read time slots after the Convert T command and the DS18B20 will respond by transmitting a 0 while the temperature conversion is in progress and a 1 when the conversion is done. In parasite power mode this notification technique cannot be used since the bus is pulled high by the strong pull up during the conversion.2.READ SCRATCHPAD [BEh]This command allows the master to read the contents of the scratchpad. The data transfer starts with the least significant bit of byte 0 and continues through the scratchpad until the 9th byte (byte 8 – CRC) is read. The master may issue a reset to terminate reading at any time if only part of the scratchpad data is needed.3.WRITE SCRATCHPAD [4Eh]This comm and allows the master to write 3 bytes of data to the DS18B20’s scratchpad. The first data byte is written into the TH register (byte 2 of the scratchpad), the second byte is written into the TL register (byte 3), and the third byte is written into the configuration register (byte 4). Data must be transmitted least significant bit first. All three bytes MUST be written before the master issues a reset, or the data may be corrupted.4.COPY SCRATCHPAD [48h]This command copies the contents of the scratchpad TH, TL and configuration registers (bytes 2, 3 and 4) to EEPROM. If the device is being used in parasite power mode, within 10µs (max) after this command is issued the master must enable a10strong pull-up on the 1-Wire bus.5.RECALL E2 [B8h]This command recalls the alarm trigger values (TH and TL) and configuration data from EEPROM and places the data in bytes 2, 3, and 4, respectively, in the scratchpad memory. The master device can issue read time slots following the Recall E2command and the DS18B20 will indicate the status of the recall by transmitting 0 while the recall is in progress and 1 when the recall is done. The recall operation happens automatically at power-up, so valid data is available in the scratchpad as soon as power is applied to the device.6．READ POWER SUPPL Y [B4h]The master device issues this command followed by a read time slot to determine if any DS18B20s on the bus are using parasite power. During the read time slot, parasite powered DS18B20s will pull the bus low, and externally powered DS18B20s will let the bus remain high.10.WIRE SIGNALINGThe DS18B20 uses a strict 1-Wire communication protocol to ensure data integrity. Several signal types are defined by this protocol: reset pulse, presence pulse, write 0, write 1, read 0, and read 1. The bus master initiates all these signals, with the exception of the presence pulse.（1）INITIALIZATION PROCEDURE—RESET AND PRESENCE PULSES All communication with the DS18B20 begins with an initialization sequence that consists of a reset pulse from the master followed by a presence pulse from the DS18B20. This is illustrated in Figure 6. When the DS18B20 sends the presence pulse in response to the reset, it is indicating to the master that it is on the bus and ready to operate.During the initialization sequence the bus master transmits (TX) the reset pulse by pulling the 1-Wire bus low for a minimum of 480µs. The bus master then releases11the bus and goes into receive mode (RX). When the bus is released, the 5kΩ pull-up resistor pulls the 1-Wire bus high. When the DS18B20 detects this rising edge, it waits 15µs to 60µs and then transmits a presence pulse by pulling the 1-Wire bus low for 60µs to 240µs.TimingBus master pulling lowDS18B20 pulling lowResistor pullupFigure 6.Initialization Timing（2）READ/WRITE TIME SLOTSThe bus master writes data to the DS18B20 during write time slots and reads data from the DS18B20 during read time slots. One bit of data is transmitted over the 1-Wire bus per time slot.1.WRITE TIME SLOTSThere are two types of write time slots: “Write 1” time slots and “Write 0” time slots. The bus master uses a Write 1 time slot to write a logic 1 to the DS18B20 and a Write 0 time slot to write a logic 0 to the DS18B20. All write time slots must be a minimum of 60µs in duration with a minimum of a 1µs recovery time between individual write slots. Both types of write time slots are initiated by the master pulling the 1-Wire bus low (see Figure 7).To generate a Write 1 time slot, after pulling the 1-Wire bus low, the bus master must release the 1-Wirebus within 15µs. When the bus is released, the 5kΩ pull-up resistor will pull the bus high. To generate a Write 0 time slot, after pulling the 1-Wire1213bus low, the bus master must continue to hold the bus low for the duration of the time slot (at least 60µs).The DS18B20 samples the 1-Wire bus during a window that lasts from 15µs to 60µs after the master initiates the write time slot. If the bus is high during the sampling window, a 1 is written to the DS18B20. If the line is low, a 0 is written to the DS18B20.DS18B20Write Time SlotSTART OF SLOTVccBus master pulling low Resistor pullupFigure 7.DS18B20 Write Time Slot2.READ TIME SLOTSThe DS18B20 can only transmit data to the master when the master issues read time slots. Therefore, the master must generate read time slots immediately after issuing a Read Scratchpad [BEh] or Read Power Supply [B4h] command, so that the DS18B20 can provide the requested data. In addition, the master can generate read time slots after issuing Convert T [44h] or Recall E 2 [B8h] commands to find out the status of the operation.All read time slots must be a minimum of 60µs in duration with a minimum of a 1µs recovery time between slots. A read time slot is initiated by the master device pulling the 1-Wire bus low for a minimum of 1µs and then releasing the bus (see Figure 8). After the master initiates the read time slot, the DS18B20 will begin transmitting a 1 or 0 on bus. The DS18B20 transmits a 1 by leaving the bus high andtransmits a 0 by pulling the bus low. When transmitting a 0, the DS18B20 will release the bus by the end of the time slot, and the bus will be pulled back to its high idle state by the pull up resister. Output data from the DS18B20 is valid for 15µs after the falling edge that initiated the read time slot. Therefore, the master must release the bus and then sample the bus state within 15µs from the start of the slot.VccBus master pulling lowResistor pullupDS18B20 pulling lowFigure 8.DS18B20 Read Time Slot1415DS18B20介绍1.说明DS18B20数字式温度传感器提供9位到12位的摄氏温度测量，并且有用户可编程的、非易失性温度上下限告警出发点。
传感器温湿度测量中英文资料外文翻译文献
中英文资料外文翻译文献SHT11/71传感器的温湿度测量Assist.Prof.Grish Spasov,PhD,BSc Nikolay KakanakovDepartment of Computer Systems,Technical University-branch Plovdiv,25,”Tzanko Djustabanov”Str.,4000Plovdiv,Bulgaria,+35932659576, E-mail:gvs@tu-plovdiv.bg,kakanak@tu-plovdiv.bg 关键词：温湿度测量，智能传感器，分布式自动测控这篇论文阐述了智能传感器的优点，介绍了SHT11/71温湿度传感器（产自盛世瑞公司）。
该传感器是一种理想的对嵌入式系统提供环境测量参数的传感器。
常规的应用时将SHT11/71放于实际的工作环境当中。
应用于分布式的温湿度监测系统。
使用单片机与集成网络服务器来实现对传感器的信息交流与关系。
这个应用是可实现与测试的。
1.介绍温湿度的测量控制对于电器在工业、科学、医疗保健、农业和工艺控制过程都有着显著地意义。
温湿度这两种环境参数互相影响，因为这至关重要的一点，在一些应用中他们是必须并联测量的。
SHT11/71是利用现代技术把温度、湿度测量元件、放大器、A/D转换器、数字接口、校验CRC计算逻辑记忆模块和核心芯片集成到一个非常小的尺寸上[1][3]。
采用这种智能传感器可以缩短产品开发时间和成本。
整合入传感器模数转换和放大器的芯片使开发人员能够优化传感器精度和长期问的的元素。
并不是全结合形式的数字逻辑接口连通性管理的传感器。
这些优点可以减少整体上市时间，甚至价格[1][3]。
本文以SHT11/71（产自盛世瑞公司）智能传感器为例，介绍他的优势和测量程序给出一个实用实例来说明该工作的实现条件。
这个应用时可行可测试的。
2.智能传感器——SHT11/71SHT11/71是一个继承了温度和湿度组建，以及一个多元化校准数字器的芯片。
传感器技术外文文献及中文翻译
传感器技术外文文献及中文翻译引言传感器是现代检测技术的重要组成部分，它能将物理量、化学量等非电信号转换为电信号，从而实现检测和控制。
传感器广泛应用于工业、医疗、军事等领域中，如温度、湿度、气压、光强度等参数检测。
随着科技的发展，传感器不断新型化、微型化和智能化，已经涵盖了人体所有的感官，开启了大规模的物联网与智能化时代。
本文将介绍几篇与传感器技术相关的外文文献，并对其中较为重要的内容进行中文翻译。
外文文献1标题“Flexible Sensors for Wearable Health: Why Materials Matter”作者Sarah O’Brien, Michal P. Mielczarek, and Fergal J. O’Brien文献概述本文主要介绍了柔性传感器在可穿戴健康监测中的应用，以及传感材料的选择对柔性传感器性能的影响。
文章先介绍了柔性传感器的基本工作原理和常见的柔性传感材料，然后重点探讨了传感材料对柔性传感器灵敏度、稳定性、响应速度等性能的影响。
最后，文章提出未来柔性传感器材料需满足的性能要求，并对可能的研究方向和应用进行了展望。
翻译摘要柔性传感器是可穿戴健康监测中重要的成分，通过将身体状态转化为电信号进行检测。
选择合适的传感材料对柔性传感器产品的成本、性能及标准化有着面向未来的影响。
本文对柔性材料的常见种类 (如: 聚合物、金属、碳复合材料等) 进行了介绍，并重点探讨了传感材料选择的影响因素，如对柔性传感器的灵敏度、特异性和响应时间等。
此外，文章还探讨了柔性传感器的性能要求和建议未来的技术方向。
外文文献2标题“Smart sensing system for precision agriculture”作者Olivier Strauss, Lucas van der Meer, and Benoit Figliuzzi文献概述本文主要介绍智能传感系统在精准农业中的应用。
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传感器外文翻译文献(文档含中英文对照即英文原文和中文翻译)译文：传感器的基础知识传感器是一种将能量转化为光的、机械的或者更为普遍的电信号，这种能量转换发生的过程称之为换能作用。
按照能量转换的复杂程度和控制方式，传感器被分为不同的等级，用来测量位移的电阻式传感器被分类为电阻式位移传感器，其他的分类诸如压力波纹管、压力膜和压力阀等。
1、传感器元件大多数的传感器是由感应元件，转换元件、控制元件、当然也有例外，例如：震动膜、.波纹管、应力管和应力环、低音管和悬臂都是敏感元件。
对物理量作出反应，将物理的压力和力转换为位移，这些转换量可以被用作电参数，如电压、电阻、电容或者感应系数。
机械式和电子式元件合并形成机电式传感设备或传感器。
相似量的结合可以作为能量输入例如：热的、光的、磁的、化学的相互结合产生的热电式、光电式、电磁式和电化学式传感器。
2、传感器灵敏度通过校正测量系统获得的被测物理量和传感器输出信号的关系叫做传感器灵敏度K1=输出信号增量∕被测量的增量，实际上，传感器的灵敏度是已知的通过测量输出信号，输入量由下式决定，输入量=输出信号的增量∕k1。
3、理想传感器的性能特点：a)高保真性：传感器的输出波形式对被测量的真实展现，并且失真很小。
b)被测量干扰最小，任何情况下传感器的精度不能改变。
c)尺寸：必须将传感器正确的放在所需要的场所。
d)被测量和传感器信号之间要有线性关系。
e)传感器对外部变换由很小的灵敏度,例如：压力传感器常常受到外部震动和环境温度的影响f)传感器的固有频率应能够避开被测量的频率和谐波。
4、电传感器电传感器由很多理想特性，它们不仅实现远程测量和显示，还能提供高灵敏度。
电传感器可分为如下两大类。
这些传感器依靠外界电压刺激来工作。
A、变参数型包括：ⅰ）电阻式ⅱ）电容式ⅲ）感应式ⅳ）自感应式ⅴ）互感应式B、自激型包括:ⅰ)电磁式；ⅱ）热电式ⅲ）光栅式；ⅳ）压电式。
这些传感器都是自己产生输出电压来反映被测量的输入并且这些过程是可逆的;例如，一般的电子传感器通常能产生出输出电压来反映晶体材料的性能，.然而，如果在材料上加一个自变电压，传感器可以通过变形或与变电压同频率的振动来体现可逆效应。
5、电阻式传感器分类：ⅰ）那些表现为大电阻变化的物理量可通过分压方式进行测量，电位器就属于此类。
ⅱ）那些表现为小电阻变化的物理量可以通过电桥电路的方式来测量，这一类包括应变仪和电阻温度计。
5.1、电位器绕线式电位器由许多绕在非导体骨架的电阻丝以及滑行在线圈上的触头组成。
结构原理如图，触头能够转动、直线式运动或者两运动合成的螺旋式运动。
如果测量设备的电阻比电位器的电阻大，那么电压既可以是交流也可以是直流，且输出电压与输入运动成正比。
这种电位器受到分辨率和电噪声的影响，电噪声被定义为能检测到的输入量的最小的变化，电噪声分辨率大小取决于线圈与滑动触头围成的面积因此，输出电压为触头从一端移到另一端时一系列阶跃。
电子噪声可以通过接触电阻的振动、触头摩擦形成的机械磨损以及从敏感元件传出的触头振动产生。
另外，测得的运动量可以通过惯性和电位器中移动元件的摩擦获得较大的机械载荷。
触头表面的磨损将电位器的寿命限制为多少转。
通常指的是生产商在说明书中提及的“寿命转数”，一个典型值为20*1000000转,空载电位器电路的输出电压V0由下式决定：设电阻R1= xi/at *Rat，其中xi为输入位移，at为最大可能位移，Rat为电位器的电阻。
那输入电压为V*R1/(R1+( Rt-R1))=V*R1/Rt=V*xi/at*Retort=V*xi/it 上式表明，对于空载电位器输出电压和输入位移呈直线关系,通过提高激励电压V可以获得高的灵敏度,但是，V的最大值由电位器线圈金属丝的功率损耗P决定，即V=(Part)1/2。
5.2、电阻应变仪电阻应变仪是由机械应变产生电阻变化的传感器。
它们是耦合或者非耦合的。
a）耦合应变仪运用黏合剂可将应变仪与被检测的结构或部件的表面粘合或粘牢。
耦合应变仪分为：ⅰ)粘合在绝缘纸背后的金属细丝仪ⅱ）在环氧树脂上粘贴导电箔片的光栅ⅲ）在环氧树脂上粘贴铜或镍的半导体丝电阻应变仪可作为单个元件仅在一个方向测量应力，或者几个元件的组合体可在几个方向同时进行测量。
b）非耦合应变仪：典型应变仪表明细电阻丝在悬臂弹簧偏差作用下改变电阻丝张力进而改变电阻丝的阻值。
商业上通常在力、负载、压力传感器上运用此方法。
5.3、电阻温度传感器分类：a)金属（如铂、铜、钨、镍）的阻值会随着温度的升高而增大，即有一个正温度电阻系数。
b)半导体，如用锰、钴、铬或镍的氧化物制成的电热调节器，其阻值变化与温度变化存在一个非线性关系，即通常有一个负温度电阻系数。
c)金属电阻温度传感,在窄温度变化范围内，此类传感器取决于以下关系：R1=R0[1+a(b1-b0)]，式中，a阻抗系数，R0为b0=0°时C的电阻。
d)电热调节器（半导体）电阻温度传感器。
电热调节器为感温电阻器，其阻值变化与温度变化呈非线性关系。
通常此类传感器有一负温度系数。
对于小的温度增量，阻值的变化大体呈线性，但是如果存在大的温差，测量电路需运用特定线性化技术生成电阻随温度变化的线性关系。
电热调节器通常被制成附有玻璃质釉的半导体圆盘形状，由于电热调节器可以小到1mn，所以响应的时间非常快。
5.4、光敏元件光敏元件采用光敏半导体材料做成。
当照射在半导体上的光强度增大，金属电极间的阻抗就会降低。
光敏元件常用的半导体材料有硫化镉、硫化铅和铜锗化合物。
频率的有效范围由所用材料决定。
硫化镉主要适用于可见光，硫化铅在红外线区有峰值响应，所以最适合于光故障检测以及温度测量。
5.5、放射性光元件当光照射到放射性光元件的阴极时，电子就会获取足够能量到达阴极。
阴极就会吸收这些电子产生一个通过电阻R的电流，从而形成一输出电压V。
产生的光电压V=I.R式中，I为光发射电流，I=K.B且为灵敏度，B输入照度（lm），尽管输出电压能够表示照明的强度，这类元件却更多的应用于计算或调节，这里照射到阴极的光可被中断。
6、电容式传感器电容量随着相对介电常数、截面面积、或者极板间的距离的变化而变化。
电容的特征曲线表明，在空间的一段范围内，截面面积和相对介电常数的变化与电容量变化成线性关系。
不象电位器，变极距型电容传感器有无限的分辨率，这最适合测量微小的位移增量的位移。
7、电感式传感器电感可以通过改变电感电路的阻抗来调节,电容式和电感式传感器的测量技术：a）用差分式电容或电感作为交流电桥。
b）用交流电位计电路做动态测量。
c）用直流电路为电容器提供正比于容值变化的电压。
d）采用调频法，C或者L随着振荡电路频率的变化而改变电容式和电感式传感器的一些重要特性如下：ⅰ)分辨率无限ⅱ）精确到满量程的+-0.1%ⅲ）位移范围从25*10-6m到10-3mⅳ）上升时间小于50us典型的被测量是位移、压力、振动量、声音和液位。
8、线性调压器9、压电式传感器10、电磁式传感器11、热电式传感器12、光电管13、机械式传感器及敏感元件Basic knowledge of transducersA transducer is a device which converts the quantity being measured into an optical, mechanical, or-more commonly-electrical signal. The energy-conversion process that takes place is referred to as transduction.Transducers are classified according to the transduction principle involved and the form of the measured. Thus a resistance transducer for measuring displacement is classified as a resistance displacement transducer. Other classification examples are pressure bellows, force diaphragm, pressure flapper-nozzle, and so on.1、Transducer ElementsAlthough there are exception ,most transducers consist of a sensing element and a conversion or control element. For example, diaphragms bellows strain tubes and rings, bourdon tubes, and cantilevers are sensing elements which respond to changes in pressure or force and convert these physical quantities into a displacement. This displacement may then be used to change an electrical parameter such as voltage, resistance, capacitance, or inductance. Such as combination of mechanical and electrical elements form electromechanical transduction devices or transducers. Similar combination can be made for other energy input such as thermal. Photo, magnetic and chemical giving thermoelectric, photoelectric electromagnetic and electrochemical transducers respectively.2、Transducer SensitivityThe relationship between the measured and the transducer output signal is usually obtained by calibration tests and is referred to as the transducer sensitivity K1= output-signal increment / measured increment . In practice, the transducer sensitivity is usually known, and, by measuring the output signal, the input quantity is determined from input= output-signal increment / K1.3、Characteristics of an Ideal TransducerThe high transducer should exhibit the following characteristicsa) high fidelity-the transducer output waveform shape be a faithful reproduction of the measured; there should be minimum distortion.b) There should be minimum interference with the quantity being measured; the presence ofthe transducer should not alter the measured in any way.c) Size. The transducer must be capable of being placed exactly where it is needed.d) There should be a linear relationship between the measured and the transducer signal.e) The transducer should have minimum sensitivity to external effects, pressure transducers for example are often subjected to external effects such vibration and temperature.f) The natural frequency of the transducer should be well separated from the frequency and harmonics of the measured.4、Electrical TransducersElectrical transducers exhibit many of the ideal characteristics. In addition they offer high sensitivity as well as promoting the possible of remote indication or measurements. Electrical transducers can be divided into two distinct groups:a) variable-control-parameter types, which include:I) resistanceii)capacitanceiii)inductanceiv) mutual-inductance typesThese transducers all rely on external excitation voltage for their operation.b) self-generating types, which includeI) electromagneticii) thermoelectriciii) photo emissiveIV)piano-electric typesthese all themselves produce an output voltage in response to the measured input and their effects are reversible. For example, a piano-electric transducer normally produces an output voltage in response to the deformation of a crystalline material; however, if an alternating voltage is applied across the material, the transducer exhibits the reversible effect by deforming or vibrating at the frequency of the alternating voltage.5、Resistance TransducersResistance transducers may be divided into two groups, as follows:I) Those which experience a large resistance change, measured by using potential-divider methods. Potentiometers are in this group.ii) Those which experience a small resistance change, measured by bridge-circuit methods. Examples of this group include strain gauges and resistance thermometers.5.1 Potentiometersa linear wire-wound potentiometer consists of a number of turns resistance wire wound around a non-conducting former, together with a wiping contact which travels over the barbwires. The construction principles are shown in figure which indicate that the wiper displacement can be rotary, translational or a combination of both to give a helical-type motion. The excitation voltage may be either act. Or deco. And the output voltage is proportional to the input motion, provided the measuring device has a resistance which is much greater than the potentiometer resistance.Such potentiometers suffer from the linked problem of resolution and electrical noise. Resolution is defined as the smallest detectable change in input and is dependent on the cross-sectional area of the windings and the area of the sliding contact. The output voltage is thus a serial of steps as the contact moves from one wire to next.Electrical noise may be generated by variation in contact resistance, by mechanical wear due to contact friction, and by contact vibration transmitted from the sensing element. In addition, the motion being measured may experience significant mechanical loading by the inertia and friction of the moving parts of the potentiometer. The wear on the contacting surface limits the life of a potentiometer to a finite number of full strokes or rotations usually referred to in the manufacture’s specification as the ‘number of cycles of life expectancy’, a typical value being 20*1000000 cycles.The output voltage V0 of the unload potentiometer circuit is determined as follows. Let resistance R1= xi/ox *Rat where xi = input displacement, at= maximum possible displacement, Rat total resistance of the potentiometer. Then output voltage V0= V* R1/ (R1+ (Rt-R1)) =V*R1/Rt=V*xi/at*Retort=V*xi/it. This shows that there is a straight-line relationship between output voltage and input displacement for the unloaded potentiometer.It would seen that high sensitivity could be achieved simply by increasing the excitation voltage V. however, the maximum value of V is determined by the maximum power dissipation P of the fine wires of the potentiometer winding and is given by V=(Part)1/2 .5.2 Resistance Strain GaugesResistance strain gauges are transducers which exhibit a change in electrical resistance in response to mechanical strain. They may be of the bonded or unbounded variety.a) Bonded strain gaugesusing an adhesive, these gauges are bonded, or cemented, directly on to the surface of the body or structure which is being examined.Examples of bonded gauges areI) fine wire gauges cemented to paper backingii) photo-etched grids of conducting foil on an epoxy-resin backingiii) a single semiconductor filament mounted on an epoxy-resin backing with copper or nickel leads.Resistance gauges can be made up as single elements to measuring strain in one direction only, or a combination of elements such as rosettes will permit simultaneous measurements in more than one direction.b) Unbounded strain gaugesa typical unbounded-strain-gauge arrangement shows fine resistance wires stretched around supports in such a way that the deflection of the cantilever spring system changes the tension in the wires and thus alters the resistance of wire. Such an arrangement may be found in commercially available force, load, or pressure transducers.5.3 Resistance Temperature TransducersThe materials for these can be divided into two main groups:a) metals such as platinum, copper, tungsten, and nickel which exhibit and increase in resistance as the temperature rises; they have a positive temperature coefficient of resistance.b) Semiconductors, such as thermostats which use oxides of manganese, cobalt, chromium, or nickel. These exhibit large non-linear resistance changes with temperature variation and normally have a negative temperature coefficient of resistance.a) Metal resistance temperature transducersthese depend, for many practical purpose and within a narrow temperature range, upon the relationship R1=R0*[1+a*(b1-b2)] where a coefficient of resistance in ℃-1, and R0 resistance in ohms at the reference temperature b0=0℃ at the reference temperature range ℃. The international practical temperature scale is based on the platinum resistance thermometer, which covers the temperature range -259.35℃ to 630.5℃.b) Thermostat resistance temperature transducersThermostats are temperature-sensitive resistors which exhibit large non-liner resistance changes with temperature variation. In general, they have a negative temperature coefficient. For small temperature increments the variation in resistance is reasonably linear; but, if large temperature changes are experienced, special linear zing techniques is used in the measuring circuits to produce a linear relationship of resistance against temperature.Thermostats are normally made in the form of semiconductor discs enclosed in glass vitreousenamel. Since they can be made as small as 1mm, quite rapid response times are possible.5.4 Photoconductive CellsThe photoconductive cell, uses a light-sensitive semiconductor material. The resistance between the metal electrodes decreases as the intensity of the light striking the semiconductor increases. Common semiconductor materials used for photo-conductive cells are cadmium supplied, lead supplied, and copper-doped germanium.The useful range of frequencies is determined by material used. Cadmium sapphire is mainly suitable for visible light, whereas lead supplied has its peak response in the infra-red region and is, therefore, most suitable for flame-failure detection and temperature measurement.5.5 Photo emissive CellsWhen light strikes the cathode of the photo emissive cell are given sufficient energy to arrive the cathode. The positive anode attracts these electrons, producing a current which flows through resistor R and resulting in an output voltage V.Photo electrically generated voltage V=PurlWhere Imp=photoelectric current(A),and photoelectric current Imp=Kat’sWhere Kt=sensitivity (A/imp),and B=illumination input (lumen)Although the output voltage does give a good indication of the magnitude of illumination, the cells are more often used for counting or control purpose, where the light striking the cathode can be interrupted.6、Capacitive TransducersThe capacitance can thus made to vary by changing either the relative permittivity, the effective area, or the distance separating the plates. The characteristic curves indicate that variations of area and relative permittivity give a linear relationship only over a small range of spacing’s. Thus the sensitivity is high for small values of d. Unlike the potentiometer, the variable-distance capacitive transducer has an infinite resolution making it most suitable for measuring small increments of displacement or quantities which may be changed to produce a displacement.7、Inductive TransducersThe inductance can thus be made to vary by changing the reluctance of the inductive circuit.Measuring techniques used with capacitive and inductive transducers:a) A.C. excited bridges using differential capacitors inductors.b）A.C. potentiometer circuits for dynamic measurements.c ) D.C. circuits to give a voltage proportional to velocity for a capacitor.d）Frequency-modulation methods, where the change of C or L varies the frequency of an oscillation circuit.Important features of capacitive and inductive transducers are as follows:I) resolution infiniteii)accuracy+- 0.1% of full scale is quotediii)displacement ranges 25*10-6 m to 10-3miv)rise time less than 50us possibleTypical misbrands are displacement, pressure, vibration, sound, and liquid level.8、Linear Variable-differential Transformer9、Pies-electric Transducers10、Electromagnetic Transducers11、Thermoelectric Transducers12、Photoelectric Cells13、Mechanical Transducers and Sensing Elements。