各种表面处理的无铅焊接润湿性测试PCB finish wetting balance test
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Immersion tin/化學錫
Immersion silver/化學銀
Specification/規格
1.2um, incl. anti-whisker additive/ 1.2um厚, 含防錫鬚添加劑
0.2um, commercially available silver/organic / 0.2um厚,市面上的含有机保 護膜的產品
Peak 最高溫度ቤተ መጻሕፍቲ ባይዱ60/ 60s秒>217oC
All profiles same duration of time 各种溫度曲線所經歷的時間
Copper based final finishes, investigated layers 研究的各种表面處理層
Surface finish/表面處理
Used reflow profile for subsequent aging and soldering/ 后續的老化實驗和 焊接的溫度曲線
Eutectic tin lead/錫鉛合金 Sn/Pb/錫鉛比 63/37/
Peak最高溫度210/ 46s秒>183oC
Lead free/ 無鉛焊料 SnAgCu/錫銀銅比307
What does it mean?/ 無鉛焊接意味著什么?
Higher temperature/longer times/different solder alloy/更高的焊接溫度/更長的熔錫時間/焊料合金 成份的變化
Stronger oxidation of solder paste and surface finish/ 焊膏和表面處理的氧化更嚴重 Thickness of IMC increased/合金層厚度更厚 Metallurgy of solder joints is different/焊接點金屬特性 的變化
No long term production experience/沒有長期的 量產經驗
Reflow equipment/回流焊設備
Reflow equipment for investigations/ 用于研究的回流焊設備
REHM Nitro 2100
N2 atmosphere with controlled O2 concentration/氮氣保護,控制 氧气含量 5 heating zones/５個加熱段 Convection reflow system/對流 傳熱回流焊系統
Wettability testing of copper based surface finishes for lead free assembly/各表面處理的無鉛焊接 焊錫性測試
Information provide by Atotech/ 資料由Atotech提供 2006.3.2
Training principle/培訓原則
Jeek claims/袁進 宣
Content/內容
General introduction/簡介 Reflow profiles/回流焊溫度曲線 Wettability testing &methods/潤濕性測試與方法 Discussion/討論 Conclusion/結論
Initial test to determine solder flux for subsequent testing/本實驗為初步 實驗,主要用于為后續試驗選取助焊劑 SnAg3.5Cu0.7 alloy at 260oC/ air atmosphere 條件:空气作業,錫銀銅合金, 260oC
No advertisement/拒絕做廣告 Focus on experimental methodology and conclusions/注重于實驗方法和結論 With the aim of learning and selfimprovement/本著學習和自我提升的思想 On the basis of discussion and communication/立足于交流與討論
What’s different in lead free soldering?/ 無鉛焊接到底不同在哪里?
Peak temperature is higher/最高焊接溫度 更高了 Time above liquidus is longer/ 焊料在熔化 狀態下的時間更長了 Solder composition is different/焊料的成 份有變化
After reflow ageing/ reflow老化實驗后
Nitrogen atmosphere during aging/ soldering improves wetting time 結論:在老化實驗和焊接時使用氮氣保護能夠改善潤濕時間
Wetting balance test -- Wetting time/潤濕平 衡測試—潤濕時間測試
Wetting balance test/ 潤濕平衡測試 (小結篇)
Impact of flux, alloy and atmosphere on Metronelec test/ 助焊劑,焊料成份和是否有氮氣保護的影響 (在Metronelec上測試)
Tested “moderate” activated flux showed no improvement/中等活性的助焊劑沒有改善作用 Tested “halogen” containing flux only improves for OSP/助焊劑是否含鹵素只對OSP表面處理有影響 Nitrogen atmosphere improved wetting time for all finishes/氮氣保護對所有表面處理的潤濕時間都有貢獻 Immersion tin – showed comparable wetting time for lead free in combination with nitrogen atmosphere to eutectic tin lead/對于化學錫表面處理來說,在氮氣保護下的無鉛焊接 與在空气環境中的錫鉛焊接潤濕時間相當
PT manager claims/生技經理宣
A few notes /几點說明
This is a genuine piracy/ 本報告純屬盜版 Feel free to ask/ 有問題盡管問 Prepare for my questions/ 請准備解答我的問 題 Correct any existing mistake/ 糾正所有存在的 錯誤 The accuracy of the data is reserved/ 本人不 負責數据的准确性
Varying/可變因素
Solder flux/ 不同的助焊劑 Solder alloys/eutectic tin-lead vs. lead-free/ 不同的焊料—錫鉛焊 料與無鉛焊料 Soldering atmosphere/ air vs. N2 /在空气中焊接與在氮氣保護下 焊接
Wettability testing/ 潤濕性測試
Solder spread(錫料延伸性測試)/ mis print(絲印錯位實驗)/ de-wetting(縮錫實驗) Solder alloys – pastes(錫膏)
Tin/lead(錫鉛) – Senju OZ AT-221CM-42-10(peak最高焊接溫度 210oC) / NC-SMQ 92H (peak最高焊接溫度 210oC) Lead-free(無鉛) – KOKI S3X58-M406 (Sn/Ag3.0/Cu0.5) (最高焊 接溫度 peak 260oC)/ Indium5.8 LS (Sn/Ag3.0/Cu0.5) (最高焊接 溫度 peak 260oC)\
Wetting balance test -- Wetting force/潤濕平衡測 試—潤濕力測試
Initial test to determine solder flux for subsequent testing/本實驗為初步 實驗,主要用于為后續試驗選取助焊劑 SnAg3.5Cu0.7 alloy at 260oC/ air atmosphere 條件:空气作業,錫銀銅合金, 260oC
Wetting balance潤濕平衡測試/Metronelec ST60(設備名稱)
Operator independent test method/采用無人員差异性的方法
Especially design coupon/特 別設計的coupon 10 coupons per surface/test 每面或測測試10 個coupon The tested samples are fluxed before immersed into the solder pot/測試樣 本在浸錫前需上助焊劑 Results are given for wetting force and wetting time/設備用于潤濕力測試 和潤濕時間測試 Sequence/mechanism similar to wave soldering/模擬波峰焊的步驟和机理
No wetting force using the litton kester flux/ 使用 litton kester 沒用潤濕力
Tested fluxes had minor impact to wetting force 結論:各种助焊劑對潤濕力影響不大
Wetting balance test -- Wetting time/潤濕平衡測 試—潤濕時間測試
Wetting balance -- tested solder fluxes/
潤濕平衡測試--測試用的助焊劑种類
Tested fluxes/測試用 Activity level of flux/ 的助焊劑种類 Flux residue 助焊劑 种類
IPC-flux *acc.to J-STD003A
Presence of halide/ 是否含鹵素
Low低 Moderate中等
Yes是 No否
Stannol 500-6 B
Litton Kester 950E3
Low低
No否
Using solder pot with SnAg3.5Cu0.7 alloy/錫爐采用SnAg3.5Cu0.7的合金 260oC Air atmosphere/空气中測試
No wetting force using the litton kester flux/ 使用 litton kester 沒用潤濕力
Choice of soldering flux strongly impacts wetting time 結論:助焊劑的選擇對潤濕時間的影響很大
Wetting balance test -- Wetting time/潤濕平 衡測試—潤濕時間測試
Immersion tin – Tin lead vs. lead free solder alloy 化學錫表面處理 – 錫鉛焊接與無鉛焊接的對比
Litton Kester 950 E3 助焊劑
Lead free using N2 atmosphere shows equivalent wetting time to eutectic 結論:使用氮氣保護的無鉛焊接與錫鉛焊接的潤濕時間相當
HASL/熱風整平(噴錫)
OSP/有机保護膜
SnCuNi, horizontally processed/水平線
Lead free compatible/無鉛焊接型
Wettability testing/潤濕性測試
Comparison of/對比性測試項目
Wetting balance/潤濕平衡性測試 Solder spread/錫料延伸性測試 Mis-print test/絲印錯位測試 De-wetting/縮錫測試
Immersion silver/化學銀
Specification/規格
1.2um, incl. anti-whisker additive/ 1.2um厚, 含防錫鬚添加劑
0.2um, commercially available silver/organic / 0.2um厚,市面上的含有机保 護膜的產品
Peak 最高溫度ቤተ መጻሕፍቲ ባይዱ60/ 60s秒>217oC
All profiles same duration of time 各种溫度曲線所經歷的時間
Copper based final finishes, investigated layers 研究的各种表面處理層
Surface finish/表面處理
Used reflow profile for subsequent aging and soldering/ 后續的老化實驗和 焊接的溫度曲線
Eutectic tin lead/錫鉛合金 Sn/Pb/錫鉛比 63/37/
Peak最高溫度210/ 46s秒>183oC
Lead free/ 無鉛焊料 SnAgCu/錫銀銅比307
What does it mean?/ 無鉛焊接意味著什么?
Higher temperature/longer times/different solder alloy/更高的焊接溫度/更長的熔錫時間/焊料合金 成份的變化
Stronger oxidation of solder paste and surface finish/ 焊膏和表面處理的氧化更嚴重 Thickness of IMC increased/合金層厚度更厚 Metallurgy of solder joints is different/焊接點金屬特性 的變化
No long term production experience/沒有長期的 量產經驗
Reflow equipment/回流焊設備
Reflow equipment for investigations/ 用于研究的回流焊設備
REHM Nitro 2100
N2 atmosphere with controlled O2 concentration/氮氣保護,控制 氧气含量 5 heating zones/５個加熱段 Convection reflow system/對流 傳熱回流焊系統
Wettability testing of copper based surface finishes for lead free assembly/各表面處理的無鉛焊接 焊錫性測試
Information provide by Atotech/ 資料由Atotech提供 2006.3.2
Training principle/培訓原則
Jeek claims/袁進 宣
Content/內容
General introduction/簡介 Reflow profiles/回流焊溫度曲線 Wettability testing &methods/潤濕性測試與方法 Discussion/討論 Conclusion/結論
Initial test to determine solder flux for subsequent testing/本實驗為初步 實驗,主要用于為后續試驗選取助焊劑 SnAg3.5Cu0.7 alloy at 260oC/ air atmosphere 條件:空气作業,錫銀銅合金, 260oC
No advertisement/拒絕做廣告 Focus on experimental methodology and conclusions/注重于實驗方法和結論 With the aim of learning and selfimprovement/本著學習和自我提升的思想 On the basis of discussion and communication/立足于交流與討論
What’s different in lead free soldering?/ 無鉛焊接到底不同在哪里?
Peak temperature is higher/最高焊接溫度 更高了 Time above liquidus is longer/ 焊料在熔化 狀態下的時間更長了 Solder composition is different/焊料的成 份有變化
After reflow ageing/ reflow老化實驗后
Nitrogen atmosphere during aging/ soldering improves wetting time 結論:在老化實驗和焊接時使用氮氣保護能夠改善潤濕時間
Wetting balance test -- Wetting time/潤濕平 衡測試—潤濕時間測試
Wetting balance test/ 潤濕平衡測試 (小結篇)
Impact of flux, alloy and atmosphere on Metronelec test/ 助焊劑,焊料成份和是否有氮氣保護的影響 (在Metronelec上測試)
Tested “moderate” activated flux showed no improvement/中等活性的助焊劑沒有改善作用 Tested “halogen” containing flux only improves for OSP/助焊劑是否含鹵素只對OSP表面處理有影響 Nitrogen atmosphere improved wetting time for all finishes/氮氣保護對所有表面處理的潤濕時間都有貢獻 Immersion tin – showed comparable wetting time for lead free in combination with nitrogen atmosphere to eutectic tin lead/對于化學錫表面處理來說,在氮氣保護下的無鉛焊接 與在空气環境中的錫鉛焊接潤濕時間相當
PT manager claims/生技經理宣
A few notes /几點說明
This is a genuine piracy/ 本報告純屬盜版 Feel free to ask/ 有問題盡管問 Prepare for my questions/ 請准備解答我的問 題 Correct any existing mistake/ 糾正所有存在的 錯誤 The accuracy of the data is reserved/ 本人不 負責數据的准确性
Varying/可變因素
Solder flux/ 不同的助焊劑 Solder alloys/eutectic tin-lead vs. lead-free/ 不同的焊料—錫鉛焊 料與無鉛焊料 Soldering atmosphere/ air vs. N2 /在空气中焊接與在氮氣保護下 焊接
Wettability testing/ 潤濕性測試
Solder spread(錫料延伸性測試)/ mis print(絲印錯位實驗)/ de-wetting(縮錫實驗) Solder alloys – pastes(錫膏)
Tin/lead(錫鉛) – Senju OZ AT-221CM-42-10(peak最高焊接溫度 210oC) / NC-SMQ 92H (peak最高焊接溫度 210oC) Lead-free(無鉛) – KOKI S3X58-M406 (Sn/Ag3.0/Cu0.5) (最高焊 接溫度 peak 260oC)/ Indium5.8 LS (Sn/Ag3.0/Cu0.5) (最高焊接 溫度 peak 260oC)\
Wetting balance test -- Wetting force/潤濕平衡測 試—潤濕力測試
Initial test to determine solder flux for subsequent testing/本實驗為初步 實驗,主要用于為后續試驗選取助焊劑 SnAg3.5Cu0.7 alloy at 260oC/ air atmosphere 條件:空气作業,錫銀銅合金, 260oC
Wetting balance潤濕平衡測試/Metronelec ST60(設備名稱)
Operator independent test method/采用無人員差异性的方法
Especially design coupon/特 別設計的coupon 10 coupons per surface/test 每面或測測試10 個coupon The tested samples are fluxed before immersed into the solder pot/測試樣 本在浸錫前需上助焊劑 Results are given for wetting force and wetting time/設備用于潤濕力測試 和潤濕時間測試 Sequence/mechanism similar to wave soldering/模擬波峰焊的步驟和机理
No wetting force using the litton kester flux/ 使用 litton kester 沒用潤濕力
Tested fluxes had minor impact to wetting force 結論:各种助焊劑對潤濕力影響不大
Wetting balance test -- Wetting time/潤濕平衡測 試—潤濕時間測試
Wetting balance -- tested solder fluxes/
潤濕平衡測試--測試用的助焊劑种類
Tested fluxes/測試用 Activity level of flux/ 的助焊劑种類 Flux residue 助焊劑 种類
IPC-flux *acc.to J-STD003A
Presence of halide/ 是否含鹵素
Low低 Moderate中等
Yes是 No否
Stannol 500-6 B
Litton Kester 950E3
Low低
No否
Using solder pot with SnAg3.5Cu0.7 alloy/錫爐采用SnAg3.5Cu0.7的合金 260oC Air atmosphere/空气中測試
No wetting force using the litton kester flux/ 使用 litton kester 沒用潤濕力
Choice of soldering flux strongly impacts wetting time 結論:助焊劑的選擇對潤濕時間的影響很大
Wetting balance test -- Wetting time/潤濕平 衡測試—潤濕時間測試
Immersion tin – Tin lead vs. lead free solder alloy 化學錫表面處理 – 錫鉛焊接與無鉛焊接的對比
Litton Kester 950 E3 助焊劑
Lead free using N2 atmosphere shows equivalent wetting time to eutectic 結論:使用氮氣保護的無鉛焊接與錫鉛焊接的潤濕時間相當
HASL/熱風整平(噴錫)
OSP/有机保護膜
SnCuNi, horizontally processed/水平線
Lead free compatible/無鉛焊接型
Wettability testing/潤濕性測試
Comparison of/對比性測試項目
Wetting balance/潤濕平衡性測試 Solder spread/錫料延伸性測試 Mis-print test/絲印錯位測試 De-wetting/縮錫測試