PCB工程英文确认常用词及常用语句

规格：spec

工程问题：engineering query（EQ）

生产文件：production gerber

电测成本：ET（electrical test）cost

通断测试：Open and short testing

IPC标准：IPC standard

IPC二级：IPC class 2

修改：revision

公差：tolerance

忽略：ignore(omit)

工具孔：tooling hole

安装孔：mounting hole

元件孔：component hole

槽孔：slot

邮票孔：snap off hole

导通孔：via

盲孔：blind via

埋孔：buried via

金属化孔：PTH(plating through hole)

非金属化孔：NPTH( no plating through hole)

孔位：hole location

附边：waste tab

铜条：copper strip

拼板强度：panel strong

板厚：board thickness

削铜：shave the copper

露铜：copper exposure

光标点：fiducial mark

内弧：inside radius

焊环：annular ring

单板尺寸：single size

拼板尺寸：panel size

铣：routing

铣刀：router

V-cut：scoring

哑光：matt

光亮的：glossy

锡珠：solder ball(solder plugs)

阻焊：solder mask(solder resist)

阻焊开窗：solder mask opening

单面开窗：single side mask opening

补油：touch up solder mask

补线：track welds

毛刺：burrs

去毛刺：deburr 镀层厚度：plating thickness

清洁度：cleanliness

离子污染：ionic contamination

阻燃性：flammability retardant

黑化：black oxidation

棕化：brown oxidation

红化：red oxidation

可焊性：solderability

焊料：solder

角标：corner mark

特性阻抗：characteristic impedance

正像：positive

负片：negative

镜像：mirror

线宽：conductor width

线距：conductor spacing

做样：build sample

成品：finished

下移：shift down

垂直地：vertically

水平的：horizontally

波峰焊：wave solder

钻孔数据：drilling date

Ul 标记：Ul Marking

蚀刻标记：etched marking

周期：date code

翘曲：bow and twist

外层：outer layer

内层：internal layer

顶层：top layer

底层：bottom layer

元件面：component side

焊接面：solder side

阻焊层：solder mask layer

丝印层：legend layer (silkscreen layer or

over layer)

兰胶层：peelable SM layer

贴片层：paste mask layer

碳油层：carbon layer

外形层：outline layer(profile layer)

白油：white ink

绿油：green ink

喷锡：hot air leveling (HAL)

水金：flash gold

插头镀金：plated gold edge-board contacts

金手指：Gold-finger

防氧化：Entek(OSP)

沉金：Immersion gold (chem. Gold)

沉锡：Immersion Tin(chem.Tin)

沉银：Immersion Silver (chem. silver)

单面板：single sided board

双面板：double sided board

多层板：multilayer board

刚性板：rigid board

挠性板：flexible board

刚挠板：flex-rigid board

铣：CNC (mill , routing)

冲：punching

倒角：beveling

倒斜角：chamfer

倒圆角：fillet

尺寸：dimension

介电常数：Dielectric constant

菲林：film

成像：Imaging

板镀：Panel Plating

图镀：Pattern Plating

后清洗：Final Cleaning

叠层：layup (stack-up)

污染焊盘：contaminate pad

分孔图：drill chart

标靶盘：target pad

外形公差：routing tolerance

芯板：core

常用语句

－、厚度

要求孔内铜厚0.001"太紧对我们的生产，

建议按IPC二级0.0008"。

The copper thickness of the wall of the

plated-through holes is specified 0.001".

It's too tight for our production. We

suggest as per IPC class 2.that's to say ,It's

0.0008" .

2.要求金手指镀金厚度为1.2-1.5um，我

们加工太困难，建议按我们常规0.45um。

The plating thickness of Au in edge

contact is specified 1.2-1.5um,it is too

tough for us, we suggest following our

normal standard ,that is to say 0.45um

instead.