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蔡勤科技 TDS 820 数字高速波形仪概述说明书

蔡勤科技 TDS 820 数字高速波形仪概述说明书

TDS 820FeaturesSpecs Ordering Information Digital Sampling Oscilloscopes TDS 820This product is discontinued.CharacteristicsSIGNALAcquisitionSystemTDS 820TDS 820 Opt. 1DChannels22Rise time58.3 ps43.8 ps Bandwidth(0.35/rise time)6 GHz8 GHzMax operatinginput voltage2 V p-p; ±3 V DC 1 V p-p; ±1.5 V DCSensitivity 2 m V/div to200 mV/div1 mV/div to100 mV/div Random noise 1.2 mV max, 600µV typical600 µV max, 300µV typicalDC Gain Accuracy - ±0.7% after user-initiated automatic vertical calibration.Vertical Resolution - 14-Bits (Approx. 16,384 levels over 10.24 vertical divisions).Input Impedance - 50 Ohm.Acquisition ModesNormal - One sample acquired with each trigger event. Envelope - Max/min values acquired over one or more acquisitions.Average - Waveform averages selectable from 2 to 10,000. Time Base SystemTime Bases - Main, Delayed.Time/Division Range - 20 ps/division to 5 ms/division in 1-2-5 steps or settable from the numeric keypad in 5 ps steps.Delta time measurement accuracy -Channel Deskew - Up to 100 ns (each channel).Record Length - 500, 1000, 2000, and 5000, and 15,000 samples per channel.Pre -Trigger View Time - 1.5 ns.Triggering SystemTrigger Sources - External input, internal rate generator, CH 1, CH 2.External Trigger Sensitivity - 40 mV p-p from DC to 200 MHz, increasing linearly to 200 mV p-p at 2 GHz.External Trigger Minimum Pulse Width - 0.25 ns.Internal Trigger Sensitivity - 80 mV p-p from DC to 200 MHz, increasing linearly to 400 mV p-p at 1 GHz.Trigger Delay Jitter - 3 ps RMS + 30 ppm of time base delay.Holdoff Range - 15 µs to 2 s.DisplayWaveform Style - Dots or vectors. Infinite and variable persistence from 250 ms to 10 s.Gray Scaling - With variable persistence selected, waveform points gradually decay through 16 levels of intensity, providing "z-axis" information about rapidly changing waveforms.Graticules - Full, grid, cross hair, frame.Format - YT and XY.CRT Type - 7 in. diagonal, magnetic deflection. Horizontal raster-scan. P4 White phosphor.CRT Resolution - 640 horizontal by 480 vertical displayed pixels.Measurement SystemAutomatic waveform measurements -Period FrequencyHigh Low+ Width- Width Maximum MinimumRise FallPeak to Peak Amplitude+ Duty Cycle- Duty Cycle+ Overshoot- Overshoot Propagation Delay Burst WidthMean Cycle MeanRMS Cycle RMSPhase Cycle Area+ Cross- CrossAreaContinuous update of up to four measurements on any combination of waveforms. Snapshot mode shows all measurements on the selected waveforms.Thresholds - Settable in percentage or voltage.Cursor Measurements - Absolute, Delta; Volts, Time, Frequency.Cursor Types - Horizontal bars (volts); Vertical bars (time); Paired (volts and time).Waveform ProcessingWaveform Functions - Interpolate-selectable sin(x)/x or linear, Average, FFT, integrate, and differentiate.Arithmetic Operators - Add, Subtract, Multiply, Invert. Autosetup - Single button, automatic setup on selected input signal for vertical, horizontal and trigger systems.Computer InterfaceGPIB (IEEE -488.2) Programmability - Full talk/listen modes. Control of all modes, settings, and measurements. Hard CopyFormats - HP ThinkJet, Epson, Postscript, Interleaf, DeskJet, LaserJet, EPS Monochrome, EPS Color, TIFF, PCX, BMP, HPGL.Optional Hardcopy Interface - Centronics and RS-232C. StorageWaveforms - Up to 15 K points.Setups - 10 front-panel setups.Power RequirementsLine Voltage Range - 90 to 250 V RMS.Line Frequency - 47 to 63 Hz.Power Consumption - 250 W max.Environment and SafetyTemperature - Operating: 0 to +50°C. non-operating: -40 to +75°C.Humidity - Operating and non-operating: Up to 95% relative humidity at or below +40°C; to 75% relative humidity from +41°C to 50°C.Altitude - Operating: 15,000 ft. non-operating: 40,000 ft. Electromagnetic Compatibility - Meets MIL-STD-461C, CE-03, Part 4, Curve # 1, RE-02, Part 7; meets VDE 0871, Category B, FCC rules and regulations, Part 15, Subpart B, Class A.Safety - UL3111-1, CSA1010.1, EN61010-1, IEC61010-1. Physical CharacteristicsDimensions mm in. Height1937.6 with acc. pouch2369.3 Width44517.5Depth with front cover43217Weightkglbs.Net 13.229.1Shipping 23.652Top of PageFeaturesSpecsOrdering Information The TDS Series complies with IEEE Standard 488.2-1987, and with Tektronix Standard Codes and Formats. Tektronix Measurement products are manufactured in ISO registered facilities.49A-10733-3p88, 06/1997, 09/01/1999© Copyright Tektronix, Inc | *****************| Privacy Policy。

Brainboxes ED-538 产品说明书

Brainboxes ED-538 产品说明书

ED-538 ETHERNET TO Digital IO RelayED-538• 8 Digital Inputs and 4 Form A Relays• Drives high current and high voltage loads - Ideal for inductive, capacitive & resistive loads• Factory floor process control and automation•Supports Modbus TCP protocol4 Form A RelaysNuDAM/ADAM ModuleconnectionEthernet port8 Digital InputsLED StatusIndication Integral DIN rail mount+5VDC to +30VDC Power Supply Easy to use Interface:Great features forremote monitoringEasy wire: removable, colourcoded terminal blocks-30ºC to +80ºC, -22ºF to +176ºFUsage Model for ED-538Gateway RS485Remote access formaintenance andmonitoringPower from laptopfor configurationDual redundant powersupplyMachines /LightMotorASCII softwarecommands - LabView,MATLAB, Agilent VEESpecificationInput Channels8 non-isolated input channelsLow Logic Level0V to +1.0VHigh Logic Level+2.0V to +30VNPN/PNP One jumper configures all inputs with either pull-up for NPN (contact closes to 0V) type sensors, or pull-down for PNP (close to V+) type sensorsInput counting User programmable – counts positive or negative transitionsUp to 250Hz count rate16-bit (65335 count) or 32-bit (4.2 billion count) countersCounter values persist over power-off periodsInput latching Triggered by user programmable positive or negative edges, stays true until acknowledgedDebouncing User programmable debouncing for noisy contact inputsRelay Type 4 Form A (SPST: Single Pole Single Throw) - Normally OpenWhen power is removed from the ED-538 the relay is OpenContact Rating 5 A @ 30 VDC, 5 A @ 250VAC, 5 A @ 110 VACInductive Load 2 AResistive Load 5 ABreakdown Voltage500 VACRelay On/Off Time1500 ms (Max)Initial InsulationResistance1G min @ 500 VDCExpected Life100,000 times (Typical)Initial Contact Re-sistance30 milli-ohms (Max)Pulse Output0.3 Hz at rated loadIP-20 rated non-conducting polyamide caseIntegrated DIN rail mount with functional earthconnectionSlim shape has a small foot print for when DIN rail spaceis a premiumRemovable screw terminal blocks make installationeasier and quickerColour coded blocks and ports prevents incorrectconnectionNumbered Pins simplifies wiring and removes confusionScrew Terminals 3.5mm pitch, #22 - #14, 0.5mm2-2.5mm2pin power supplyWire Thickness0.150 inch, 3.81mm, 20 pins, 12+8 screw terminals, #26 - #16 AWG,0.14mm2-1.3mm2Operating Temperature+30ºC to +80ºC, -22ºF to +176ºFStorage Temperature-40ºC to +85ºC, -40ºF to +185ºFAmbient Relative Humidity 5 to 95% (non-condensing)Monitor CPU temperature via the web interface or programmatically using ASCII commands. Redundant dual power input allows a second power supply to be fitted as a back-up to prevent down time should one power source fail.Can use a 5 Volt power from any computer USB port via optional accessory cable PW-650 - Useful for configuring the device from a laptop in the field.Power Consumption 2.5 Watt MaxPower Supply input Unregulated +5VDC to +30VDC, reverse polarity protectionIsolation1500 V RMS Magnetic isolation from EthernetEthernet Port 1 x RJ45 jack, 10/100Mhz autosensing, crossover auto sensing (AutoMDIX)Protection1,500 Volts magnetic isolation between I/O ports and networkNetwork Protocols ICMP, IP, TCP, DHCP, Telnet, HTTPConnection to Network Ethernet 10BaseT / 100BaseTXWebserver Interface Configure IP address, monitor state of I/O lines, set the Watchdog Timers Output Reset Value, Set Power on digital output valueProgramming Interface No device driver needed, just open a TCP connection and send simple ASCII or Modbus commands. Software drivers give local COM Port interface for communication.Utility Programs Find device, configure IP address, test communication with console Industry Standard Modbus TCP Protocol:Device works as a Modbus TCP server. Modbus TCP can be used on the input and output lines. Examples include:Modbus access type Supported Modbusfunction codesLogicaladdress984 styleaddressIEC 61131addressRead digital inputs Coil10x0020...00033...%M32…Read digital inputs Discrete input20x0000...10001...n/a Read digital inputs Input register40x002030033n/a Read DI counter values Input register40x0000...30001...n/a Read DI counter values Holding register30x0000...40001...%MW0…Clear DI counters Coil5, 150x0200...00513%M512…Familiar ASCII Command Protocol:When not using Modbus the ED range of devices can use the de facto industry standard ASCII command protocol implemented in the popular ADAM/NuDAM/EDAM modules. Examples include:$01M read the name of device address 01!01ED-588device 01 replies that its name is ED-588$01F read firmware version number of device address 01!012.54firmware version of device 01 is 2.54@01read digital input output status of device 01>1A45device 01 digital input data= 1A (=00011010) digital output data = 45(=01000101)$012read configuration of device 01!01400500device 01 40=typecode, 05 =gateway RS485 port is at 4800 Baud, 00=NochecksumCOM Port onWindowsOn a PC running the Microsoft Windows family of OS’s the ED Boost.IO Managerprovides a standard COM port interface so enabling thousands of proven legacyapplications to work straight out of the box.IndustryStandardPackagesThe COM port based driver means that ED-xxx devices are completely compatiblewith all popular packages such as: LabView, MATLAB, Agilent VEE.SoftwarePlatformsAPIs and sample program code for: Microsoft .NET, C#, Visual Basic, C++,JavaScript, PHP, Java, Objective-CDevicesSupportedThe ED sample codes running on Operating Systems such as Windows XP, Server2008, Server 2012, Windows 7, Windows 8, and Linux based systems such asAndroid and Raspberry Pi allow you to run your applications on Servers, Desktops,Laptops, Tablets, Phones or low cost embedded devices, almost any device youwish.ConfigurationOptionsWindows Utility, Web Interface: Boost.IO driver provides familiar Serial COM portinterfaceOSCompatibilityLegacy COM porty drivers for: Microsoft Windows 8 32 bit & 64 bit Editions /Microsoft Windows 7 32 bit & 64 bit Editions / Windows Server 2008 32 bit &64 bit Editions / Server 2012/ Windows Server 2008 & Windows Server 2000/Windows Vista 32 bit & 64 bit Editions / Windows Server 2003 32 bit & 64 bitEditions. TCP and web browser interface for other OS’s & Linux, e.g. Android,Raspberry PiIndustryApprovalsC-Tick, AEO (C-TPAT), WEEE, RoHSMicrosoft Approvals & Signed DriversMicrosoft Certified Gold Partner Windows 8 32 bit & 64 bit Editions Windows 7 32 bit & 64 bit EditionsWindows Server 2008 32 bit & 64 bit Editions Windows Server 2008 & Windows 2000Windows Vista 32 bit & 64 bit editionsOEM option Available for bulk buy OEMMade InManufactured in the UK by BrainboxesCustomisable Brainboxes operate a ‘Perfect Fit Custom Design’ policy for volume users. More info:********************Warranty Lifetime - online registration requiredSupport Lifetime Web, Email and Phone Support from fully qualified, friendly staff who work in and alongside the Product Development TeamPackagingInstallation CD (with manual, Microsoft signed drivers & utilities), Quick Start GuideDevice Ethernet 8 DI + 4 Form A Relays Packaged Weight0.215 kg, 0.47 poundsPackaged Dims 235(l) x 170(w) x 62(h) mm, 9.25(l) x 6.69(w) x 2.44(h) inches GTIN Universal Code8373240098283Optional AccessoriesGB AEOF 00031/11PW-650: USB connector fits any standard USB port, such as on a laptop or desktop PC, providing 5V power to a prewired screw terminal block useful for when you are configuring your ED devicePW-600: Power supply with connectors for UK, USA, EU and AUS mains socket. ‘Tails’ are suitable for connecting to screw terminal blocks。

兰星LX-2008系列智能型电子围栏说明书

兰星LX-2008系列智能型电子围栏说明书

目录前言 (2)安全注意事项 (3)一、功能与特点 (4)1.1系统功能 (4)1.2系统特点 (4)二、产品说明 (5)2.1产品设计依据: (5)2.2产品特性: (5)2.3产品技术参数: (5)2.4面板指示灯状态说明: (5)2.5单防区围栏主机面板及底部接线说明示意图: (6)2.6双防区围栏主机面板及底部接线说明示意图: (7)2.7六线制围栏主机面板及底部接线说明示意图: (8)2.8控制键盘及使用说明 (9)2.9联动控制器功能与使用说明 (10)2.10总线地址模块功能与使用说明 (11)2.11网络转换器功能及使用说明 (12)2.12计算机直接控制软件功能简介(详见软件帮助文档) (12)2.13局域网远程控制管理软件功能简介(详见软件帮助文档) (13)三、电子围栏设计要求 (13)3.1根据电子围栏前端不同线数及防区长度,通常分成三个标准的安全等级: (13)3.2安全性 (13)四、脉冲电子围栏系统实施细则 (14)4.1施工工具及材料准备 (14)4.2施工方案确定 (14)4.2.1防区分区与围栏主机位置确定 (14)4.2.2支撑杆使用数量确定 (14)4.2.3管线敷设方案确定 (14)4.2.4前端围栏安装方式确定 (14)4.2.5前端围栏安装角度确定: (16)4.3周界施工 (16)4.3.1组装前端支撑杆 (16)4.3.2支撑杆固定安装 (18)4.3.3布置围栏合金线 (18)4.3.4合金线之间的连接 (19)4.3.5紧线器安装 (19)4.3.6高压避雷器安装 (19)4.3.7警示牌的安装 (20)4.3.8U型槽的安装 (20)4.4信号线缆与电源线的铺设 (20)4.5围栏主机的安装 (20)4.6单个防区前端连接示意图 (21)4.7接地 (21)五、主机调试与报警试验 (21)5.1通电检查 (21)5.2报警试验 (22)六、施工安装规范及安全注意事项 (22)6.1施工安装规范 (22)6.2施工中应注意的其他问题 (23)6.3常见问题的排除方法(如下表): (23)6.4电子围栏周界配件 (23)附件一:LX-2008系列单防区围栏主机线路连接图 (28)附件二:LX-2008系列双防区围栏主机线路连接图 (29)附件三:LX-2008系列六线制围栏主机线路连接图 (30)前言深圳市兰星科技有限公司成立于2002年3月,专业从事“周界安全防范系统”的研发、生产、销售及服务。

E28-2G4M12S 产品规格书说明书

E28-2G4M12S 产品规格书说明书

E28-2G4M12S产品规格书SX1280 2.4GHz SPI贴片型高速LoRa模块目录第一章概述 (2)1.1 简介 (2)1.2 特点功能 (2)1.3 应用场景 (2)第二章规格参数 (3)2.1 极限参数 (3)2.2 工作参数 (3)第三章机械尺寸与引脚定义 (4)第四章基本操作 (5)4.1硬件设计 (5)4.2软件编写 (5)第五章基本应用 (6)5.1 基本电路 (6)第六章常见问题 (7)6.1 传输距离不理想 (7)6.2 模块易损坏 (7)6.3 误码率太高 (7)第七章焊接作业指导 (8)7.1 回流焊温度 (8)7.2 回流焊曲线图 (8)第八章相关型号 (9)第九章天线指南 (9)9.1 天线推荐 (9)9.2天线选择 (9)修订历史 (10)关于我们 (11)第一章概述1.1 简介E28-2G4M12S是亿佰特公司设计生产的2.4GHz射频收发模块,通信距离远;具有极低的低功耗模式流耗。

此模块为小体积贴片型(引脚间距1.27mm),模块自带高性能PCB板载天线与IPEX接口。

该系列采用52MHz工业级高精度低温漂有源晶振;保证其工业特性和其稳定性能。

采用Semtech公司的SX1280射频芯片,此芯片包含多样的物理层以及多种调制方式,如LORA,FLRC,GFSK。

特殊的调制和处理方式使得LoRa和FLRC调制的传输距离大大增加;是一款高性能物联网无线收发器,并可以兼容蓝牙协议。

出色的低功耗性能、片上DC-DC和Time-of-flight使得此芯片功功能强大,可用于智能家居、安全系统、定位追踪、无线测距、穿戴设备、智能手环与健康管理等等。

SX1280支持RSSI,用户可以根据需要实现深度的二次开发;SX1280亦集成飞行时间(time of flight),适用于测距功能。

由于该模块是纯射频收发模块,需要使用MCU驱动或使用专用的SPI调试工具。

1.2 特点功能⚫理想条件下,通信距离可达3km;⚫最大发射功率18mW,软件多级可调;⚫兼容 BLE 协议;⚫支持免许可ISM 2.4GHz频段;⚫支持0.476k~2Mbps的数据传输速率;⚫支持多种调制模式(GFSK Mode ,FLRC Mode,LoRa Mode);⚫支持1.8~3.6V供电,大于3.3V供电均可保证最佳性能;⚫工业级标准设计,支持-40~+85℃下长时间使用;⚫双天线可选(IPX/PCB),便于用户二次开发,利于集成;⚫速率可调,FLRC 调制方式下最高可达1.3Mbps;⚫卓越的抗阻塞特性;⚫测距,带有 Time-of-flight 功能。

聆思科技 听声 双麦离线语音交互芯片产品规格书说明书

聆思科技 听声 双麦离线语音交互芯片产品规格书说明书

双麦离线语音交互芯片 产品规格书 型号:C4203-L02C文档密级:对外公开 Version 1.2 2021.1.18L I S T E N A I _f o r _L I S T E NAI_for _LISTENAI_for_LISTE N A I _f o r _L I S T E N A I _f o r _LI S T E N A I _f o r _声明 本手册由聆思科技版权所有,未经许可,任何单位和个人都不得以电子的、机械的、磁性的、光学的、化学的、手工的等形式复制、传播、转录和保存该出版物,或翻译成其它语言版本。

一经发现,将追究其法律责任。

聆思科技保证本手册提供信息的准确性和可靠性。

聆思科技保留更改本手册的权利,如有修改,恕不相告。

请在订购时联系我们以获得产品最新信息。

对任何用户使用我们产品时侵犯第三方版权或其它权利的行为聆思科技概不负责。

另外,在聆思科技未明确表示产品有该项用途时,对于产品使用在极端条件下导致一些失灵或损毁而造成的损失概不负责。

L I S T E N A I _f o r _L IS T E NAI_for _LISTENAI_for_LISTE N A I _f o r _L I S T E N A I _f o r _L I S T E N A I _f o r _变更记录L I S T E N A I _f o r _L IS T E NAI_for _LISTENAI_for_LISTE N A I _f o r _r _目录 声明 ............................................................................................................................................................... 1 变更记录 ..................................................................................................................................................... 2 1产品简介 .................................................................................................................................................. 5 1.1 方案介绍 ......................................................................................................................................... 5 1.2 方案特性 ......................................................................................................................................... 5 2产品能力介绍 ......................................................................................................................................... 7 2.1 功能介绍 ......................................................................................................................................... 7 2.2 AI 技术特点 ..................................................................................................................................... 7 2.2.1双麦降噪 ....................................................................................................................................... 7 2.2.2 噪声抑制 ...................................................................................................................................... 8 2.2.3 语音唤醒 ...................................................................................................................................... 8 2.2.4 离线识别 .. (8)2.2.5 播报打断 (8)2.3 效果介绍 (9)3使用场景 (10)4 模组介绍 (11)4.1 模组配置 (11)4.2 系统框图 (12)4.3 芯片框图 (12)4.4 封装 ................................................................................................................................................ 13 L I S T E N A I _f o r _L IS T E NAI_for _L ISTENA I_for_L ISTE N A I _f o r _L I S T E N A I _f o r _L I S T E N A I _f o r _4.5 芯片引脚说明 .............................................................................................................................. 14 4.6 电气特性 ....................................................................................................................................... 15 5 开发流程 ............................................................................................................................................... 16 6 可靠性测试 .......................................................................................................................................... 18 6.1 外观 ................................................................................................................................................ 18 6.2 盐雾测试 ....................................................................................................................................... 18 6.3 高温高湿存储测试 ..................................................................................................................... 18 6.4 温度冲击测试 .............................................................................................................................. 18 6.5 低温存储测试 .............................................................................................................................. 19 6.6 85/85实验 ..................................................................................................................................... 19 6.7 有毒有害物质检测 ..................................................................................................................... 19 6.8 连接测试 ....................................................................................................................................... 19 6.9 振动测试 (19)6.10 高温运行测试 (19)6.11 低温运行测试 (20)6.12 开关机测试 (20)L I S T E N A I _f o r _L IS T E NAI_for _LISTENAI_for_L ISTE N A I _f o r _L I S T E N A I _f o r _L I S T E N A I _f o r _1产品简介 1.1 方案介绍 随着人工智能行业的迅猛发展,人工智能技术开始应用在各种用户场景,智能硬件产品开始逐步普及,走向千家万户。

DL-820T 用户手册

DL-820T 用户手册

DL-820T 用户手册标签打印机DL-820T用户手册DL-820T 用户手册目录手册信息 (1)安全须知 (2)第1章产品简介 (6)1.1 开箱清单 (6)1.2 打印机外观及组件 (7)1.3 产品尺寸 (9)第2章产品规格 (10)第3章使用方法 (12)3.1安装介质 (12)3.1.1安装纸卷 (12)3.1.2 安装碳带 (14)3.1.3安装折叠纸 (16)3.2 电源连接 (18)3.3 接口连接 (19)3.4 标签侦测 (20)3.5 操作面板 (21)3.6 基本功能使用 (23)3.6.1 开机/关机 (23)3.6.2 走纸 (23)3.6.3 暂停 (23)3.6.4 标签学习 (24)3.6.5 打印测试 (25)第4章接口 (26)第5章打印机日常维护及调校 (27)5.1 清洁打印头 (27)5.2 清洁传感器、胶辊和纸张路径 (28)附录1:电子信息产品污染控制的说明 (29)手册信息本用户手册包含产品使用、安装等基本信息。

※以下手册对各种技术问题和领域有更为详细的介绍。

1.Windows 驱动程序手册此手册提供了Windows 驱动程序安装说明。

2.打印机实用工具手册此手册提供了本产品功能选择软件的使用、操作条件的修改等方面的信息。

3.编程手册此手册提供了标签打印机指令方面的信息。

安全须知在操作使用打印机之前,请仔细阅读下面的注意事项:1.安全警告标志警告:打印头为发热部件,打印过程中和打印刚结束,不要触摸打印头以及周边部件。

警告:不要触摸打印头和连接插件,以免因静电损坏打印头。

2.安全注意事项警告:违反以下事项可能会导致严重的伤亡事故。

1)不要同时将几个插头插入一个多孔电源插座中。

•这会导致过热和火灾。

•如果插头潮湿或者肮脏,请在使用前烘干或者擦拭干净。

•如果插头与电源插座不配套,请不要插上电源。

•只能使用标准化的多孔电源插座。

2)您只能使用本包装中供应的适配器。

RTL8208

RTL8208

REALTEK SINGLE CHIPOCTAL 10/100 MBPS FAST ETHERNET TRANSCEIVERRTL82081. Features (2)2. General Description (2)3. Block Diagram (3)4. Pin Assignments (4)5. Pin Description (6)5.1 Media Connection Pins (6)5.2 Power and Ground Pins (6)5.3 Miscellaneous Pins (7)5.4 RMII/SMII/SS-SMII Pins (8)5.5 SMI (Serial Management Interface) Pins (9)5.6 LED Pins (9)5.7 Mode Control Pins (10)5.8 Reserved Pins (11)6. Register Descriptions (12)6.1 Register 0: Control (12)6.2 Register1: Status (14)6.3 Register2: PHY Identifier 1 Register (15)6.4 Register3: PHY Identifier 2 Register (15)6.5 Register4: Auto-Negotiation Advertisement (16)6.6 Register5: Auto-Negotiation Link Partner Ability (17)6.7 Register6: Auto-Negotiation Expansion (18)7. Functional Description (19)7.1 General (19)7.1.1 SMI (Serial Management Interface) (19)7.1.2 Port Pair Loop Back Mode (PP-LPBK) (19)7.1.3 PHY Address (20)7.1.4 Auto-Negotiation (20)7.1.5 Full-Duplex Flow Control (20)7.2 Initialization and Setup (20)7.2.1 Reset (20)7.2.2 Setup and configuration (20)7.3 10Base-T (20)7.3.1 Transmit Function (20)7.3.2 Receive Function (21)7.3.3 Link Monitor (21)7.3.4 Jabber (21)7.3.5 Loopback (21)7.4 100Base-TX (21)7.4.1 Transmit Function (21)7.4.2 Receive Function (21)7.4.3 Link Monitor (22)7.4.4 Baseline Wander Compensation (23)7.5 100Base-FX (23)7.5.1 Transmit Function (23)7.5.2 Receive Function (23)7.5.3 Link Monitor (24)7.5.4 Far-End-Fault-Indication (FEFI) (24)7.6 RMII/SMII/SS-SMII (24)7.6.1 RMII (Reduced MII) (25)7.6.2 SMII (Serial MII) (25)7.5.3 SS-SMII (Source Synchronous -Serial MII) (27)7.7 Power Saving and Power Down Mode (28)7.7.1 Power Saving Mode (28)7.7.2 Power Down Mode (28)7.8 LED Configuration (28)7.8.1 LED Blinking Time (28)7.8.2 Serial Stream Order (29)7.8.3 Bi-Color LED (30)7.9 2.5V Power Generation (31)8. Design and Layout Guide (32)8.1 General Guidelines (32)8.2 Differential Signal Layout Guidelines (32)8.3 Clock Circuit (32)8.4 2.5V power (32)8.5 Power Planes (32)8.6 Ground Planes (32)8.7 Transformer Options (32)9. Application information (33)9.1 10Base-T/100Base-TX Application (33)9.2 100Base-FX Application (34)10. Electrical Characteristics (35)10.1 Absolute Maximum Ratings (35)10.2 Operating Range (35)10.3 DC Characteristics (35)10.4 AC Characteristics (36)10.5 Digital Timing Characteristics (37)10.6 Thermal Data (38)11. Mechanical Dimensions (39)1. FeaturesSupports 8-port integrated physical layer andtransceiver for 10Base-T and 100Base-TXUp to 8 ports support of 100Base-FXReduced 100Base-FX interface (patented)Robust baseline wander correction for improved 100BASE-TX performanceFully compliant with IEEE 802.3/802.3uIEEE 802.3u compliant Auto-negotiation for 10/100 Mbps controlHardware controlled Flow control advertisement ability Supports RMII/SMII/SS-SMII interfacesMultiple driving capabilities of RMII/SMII/SS-SMII Supports 25MHz crystal as clock source for RMII with 50MHz REFCLK output for MAC Very low power consumptionSupports port-pair loop mode (PP-LPBK mode) Supports two Power reduction methods:1. Power saving mode (cable detection)2. Power down modePower-on auto reset function eliminates the need for external reset circuitsFlexible LED display modes through 2-wire serial LED control interface128-pin PQFP2.5V/3.3V power supply0.25µm, CMOS technology2. General DescriptionThe RTL8208 is a highly integrated 8 port, 10Base-T/100Base-TX/FX, Ethernet transceiver implemented in 0.25µm CMOS technology. It is currently the world’s smallest Octal-PHY chip package with many special patented features. Traditional SD pins in 100Base-FX are omitted by Realtek patent to obtain fewer pin-count. Flexible hardware settings are provided to configure the various operating modes of the chip. The RTL8208 consists of 8 separate and independent channels. Each channel consists of an RMII/SMII/SS-SMII interface to MAC controller, and hardware pins are used to configure the interface for RMII, or SMII, or SS-SMII mode. In RMII mode, another hardware pin is used to set port-pair loop mode (PP-LPBK mode), which can extend physical transmission length or perform physical media transport operations without any switch controller. In addition, the RTL8208 features very low power consumption, as low as 1.8 W (max.). Additionally, pin-outs are designed to provide optimized direct routing can be implemented, which simplifies the layout work and reduces EMI noise issues.3. Block Diagram4. Pin AssignmentsMDC MDIO VSS TX_EN[0]TXD0[0]TXD1[0]CRS_DV[0]RXD0[0]RXD1[0]VSS X1TXON[0]TXOP[0]VSSA RXIP[0]RXIN[0]VDDAL IBREF VDDAH VCTRL X2VDDAHTXOP[1]TXON[1]VDDAH VDDV S SV D DV D DR X D 1[3]T X _S Y N CV S SR X D 0[3]R X _S Y N CT X D 1[3]C R S _D V [3]T X D 0[3]T X _E N [3]T X _E N [1]T X D 0[1]R X D 1[2]T X D 0[2]R X D 0[2]T X D 1[2]T X _E N [2]C R S _D V [2]R X D 0[1]R X D 1[1]C R S _D V [1]T X D 1[1]T X _E N [4]T X D 0[4]C R S _D V [5]V D DT X D 1[5]T X _E N [5]V S ST X D 0[5]R X D 0[4]R X D 1[4]C R S _D V [4]T X D 1[4]R X D 0[5]R X D 1[5]V S S AV D D A HT X O N [2]T X O P [2]V S S AR X I P [2]R X I N [2]V D D A LV D D A LR X I N [1]R X I P [1]V D D A HV S S AR X I P [4]R X I N [4]V D D A LV D D A LR X I N [3]R X I P [3]V S S AT X O P [3]T X O N [3]T X O P [4]V D D A LV D D A LR X I N [5]R X I P [5]V S S AT X O P [5]T X O N [5]V D D A HV D D A HT X O N [4]R X I N [6]T X O N [6]T X O P [6]V S S AR X I P [6]VDDTXD0[7]RXD1[6]TX_EN[7]VSSRXD0[6]TXD1[6]CRS_DV[6]TXD0[6]TX_EN[6]TXD1[7]CRS_DV[7]RESET#REFCLKLED_CLK LED_DATARXD1[7]RXD0[7]VSSARXIP[7]VDDAL RXIN[7]VDDAHVDDAHTXOP[7]TXON[7]'I' stands for input; 'O' stands for output; 'A' stands for analog; ‘D’ stands for digitalPin Name Pin# Type Pin Name Pin# TypeVSSARXIP[1]RXIN[1]VDDALVDDALRXIN[2]RXIP[2]VSSATXOP[2]TXON[2]VDDAHVDDAHTXON[3]TXOP[3]VSSARXIP[3]RXIN[3]VDDALVDDALRXIN[4]RXIP[4]VSSATXOP[4]TXON[4]VDDAHVDDAHTXON[5]TXOP[5]VSSARXIP[5]RXIN[5]VDDALVDDALRXIN[6]RXIP[6]VSSATXOP[6]TXON[6]VDDAHVDDAHTXON[7]TXOP[7]VSSARXIP[7]RXIN[7]VDDALRESET#REFCLKLED_DATA/LEDMODE[1] LED_CLK/LEDMODE[0] RXD1[7]RXD0[7]/DRIVE[0]CRS_DV[7]/MODE[0] TXD1[7]TXD0[7]TX_EN[7]VDDVSSRXD1[6]/DISBLINK RXD0[6]/DRIVE[1]CRS_DV[6]/MODE[1] TXD1[6]TXD0[6]TX_EN[6] 12345678910111213141516171819202122232425262728293031323334353637383940414243444546474849505152535455565758596061626364AGNDAIAIA VDDA VDDAIAIAGNDAOAOA VDDA VDDAOAOAGNDAIAIA VDDA VDDAIAIAGNDAOAOA VDDA VDDAOAOAGNDAIAIA VDDA VDDAIAIAGNDAOAOA VDDA VDDAOAOAGNDAIAIA VDDII/OI/OI/OI/OI/OI/OIIIDVDDDGNDI/OI/OI/OIIIRXD1[5]/LED_BLNK_TIMERXD0[5]CRS_DV[5]/TP_PAUSETXD1[5]TXD0[5]TX_EN[5]VDDVSSRXD1[4]/PHY_ADDR[4]RXD0[4]CRS_DV[4]/RX_CLKTXD1[4]TXD0[4]TX_EN[4]/TX_CLKVDDSYNC/TX_SYNCRX_SYNC/RPT_MODEVSSRXD1[3]/PHY_ADDR[3]RXD0[3]CRS_DV[3]/FX_PAUSETXD1[3]TXD0[3]TX_EN[3]VDDVSSRXD1[2]/TESTRXD0[2]CRS_DV[2]/FX_DUPLEXTXD1[2]TXD0[2]TX_EN[2]RXD1[1]RXD0[1]CRS_DV[1]/SEL_TXFX[1]TXD1[1]TXD0[1]TX_EN[1]VDDVSSRXD1[0]RXD0[0]CRS_DV[0]/SEL_TXFX[0]TXD1[0]TXD0[0]TX_EN[0]VSSMDIOMDCX1X2VCTRLVDDAHIBREFVDDALRXIN[0]RXIP[0]VSSATXOP[0]TXON[0]VDDAHVDDAHTXON[1]TXOP[1]6566676869707172737475767778798081828384858687888990919293949596979899100101102103104105106107108109110111112113114115116117118119120121122123124125126127128I/OOI/OIIIDVDDDGNDI/OOOIIIDVDDIIDGNDI/OOI/OIIIDVDDDGNDI/OOI/OIIIOOI/OIIIDVDDDGNDOOI/OIIIDGNDI/OIIOI/OA VDDAOA VDDAIAIAGNDAOAOA VDDA VDDAOAO5. Pin DescriptionIn order to reduce pin count, and therefore size and cost, some pins have multiple functions. In those cases, the functions are separated with a “/” symbol. Refer to the Pin Assignment diagram for a graphical representation.'I' stands for input 'O' stands for output'A' stands for analog signal 'D' stands for digital signal 'P' stands for power 'G' stands for ground'Pu' stand for internal pull up (75K ohm) 'Pd' stand for internal pull down (75K ohm)5.1 Media Connection PinsPin Name Pin Type Description RXIP[7:0] 44,35,30,21,16,7,2,121 AI Receiver Input: Differential positive signal shared by 100Base-TX,100Base-FX, 10Base-T.RXIN[7:0] 45,34,31,20,17,6,3,120 AI Receiver Input: Differential negative signal shared by 100Base-TX,100Base-FX, 10Base-T.TXOP[7:0] 42,37,28,23,14,9,128,123 AO Transmitter Output: Differential positive signal shared by100Base-TX, 100Base-FX, 10Base-T.TXON[7:0] 41,38,27,24, 13,10,127,124 AO Transmitter Output: Differential negative signal shared by100Base-TX, 100Base-FX, 10Base-T.5.2 Power and Ground PinsPin Name Pin Type DescriptionVDDAH 117 P Power for IBREF VDDAH 11,12,25,26,39,40,125,126P 3.3V Power to analog: Used for transmitters and equalizers.VDDAL 119,4,5,18,19,32,33,46P 2.5V Power to analog: Used for PLL circuits.VSSA 122,18,15,22,29,36,43G Analog groundVDD 57,71,79,89, 103P Digital 2.5V power supplyVSS 58,72,82,90, 104,111G Digital ground5.3 Miscellaneous PinsPin Name Pin Type Description RESET# 47 I, (Pu) Reset: This is an active low input. To complete the reset function, thispin must be asserted low for at least 10ms.X1 114 I 25MHz Crystal X1 or 25MHz Oscillator clock input: When X1 ispulled low, X2 must be floating. REFCLK will then be the chip clock input.X2 115 O 25MHz Crystal X2 REFCLK 48 I/O Reference clock:If X1 is 25MHz active, REFCLK is a 50MHz output.If X1 is pulled-low (disabled), REFCLK is the clock input as below: 50MHz 100ppm clock input for RMII mode.125MHz 100ppm clock input for SMII/SS-SMII mode.IBREF 118 A Reference Bias Resistor: This pin must be tied to analog ground throughan external 1.96K Ω resistor when using a 1:1 transformer on Tx/Rx. VCTRL 116 O Voltage control: This pin controls a PNP transistor to generate the2.5V power supply for VDD and VDDAL pins.5.4 RMII/SMII/SS-SMII PinsPin Name PinType Description TXD0[7:0]55,63,69,77, 87,95,101,109I Transmit Data Input (bit 0):In RMII, TXD0 and TXD1 are the di-bits input transmitted and driven synchronously to REFCLK from MAC.In SMII, TXD0 inputs the data that is transmitted and is driven synchronously to REFCLK. In 100Mbps, TXD0 inputs a new 10-bit segment starting with SYNC. In 10Mbps, TXD0 must repeat each 10-bit segment 10 times.In SS-SMII, TXD0 behaves as SMII except synchronous to TX_CLK instead of REFCLK and 10-bit segment starting with TX_SYNC instead of SYNC.TXD1[7:0] 54,62,68,76, 86,94,100,108 I Transmit Data Input (bit 1):In RMII, TXD1 and TXD0 are the input di-bits synchronously toREFCLK.In SMII/SS-SMII, TXD1 is not used and should be tied either high or low.TX_EN [7:0] 56,64,70,78, 88,96,102,110 I Transmit Enable:In RMII , TX_EN indicates the di-bits on TXD is valid and issynchronous to REFCLK.In SMII/SS-SMII, TX_EN[7:0] are not used.RXD0[7:0] 52,60,66,74, 84,92,98,106 O Receive Data Input (bit 0):In RMII, RXD0 and RXD1 output di-bits synchronously to REFCLK.In SMII, RXD0 outputs data or inband management information synchronously to REFCLK. In 100Mbps, RXD0 outputs a new 10-bit segment starting with SYNC. In 10Mbps, RXD0 must repeat each 10-bit segment 10 times.In SS-SMII, RXD0 behaves as SMII except synchronous to RX_CLK instead of REFCLK and 10-bit segment starting with RX_SYNC instead of SYNC.RXD1[7:0] 51,59,65,73, 83,91,97,105 O Receive Data Input (bit 1):In RMII, RXD1 and RXD0 output di-bits synchronously to REFCLK.In SMII/SS-SMII, RXD1is not used and they are driven low.CRS_DV[7:0] 53,61,67,75, 85,93,99,107 O Carrier Sense and Data Valid:In RMII, CRS_DV is asynchronous to REFCLK and asserts when themedium is non-idle.In SMII/SS-SMII, CRS_DV[7:0] are not used and driven low.RX_CLK/ CRS_DV[4] 75 O Receive Clock: In SS-SMII, CRS_DV[4] of RMII is used as RX_CLK, which is a 125MHz clock output. RX_SYNC 81 I/O Receive Synchronous : In SS-SMII, RX_SYNC is a sync signal used to delimit the 10-bitsegment of RXD0 for all ports.SYNC/ TX_SYNC 80 I Sync/Transmit Synchronous: In SMII, SYNC is a sync signal used to delimit a 10-bit segment of RXD0 and TXD0 for all ports.In SS-SMII, TX_SYNC is a sync signal used to delimit the 10-bit segment of TXD0 for all ports.TX_CLK/ TX_EN[4] 78 I Transmit Clock/Transmit Enable: In SS-SMII, TX_EN[4] of RMII is used as TX_CLK, which is a 125MHz clock input from MAC.5.5 SMI (Serial Management Interface) Pins Pin Name Pin Type DescriptionMDIO 112 I/O,(Pu) Management Data I/O. Bi-directional data interface. A 1.5KΩpull-up resistor is required (as specified in IEEE802.3u).The MAC controller access of the MII registers should be delayed at least 700us after completion of the reset because of the internal reset operation of the RTL8208MDC 113 I,(Pd) Management Data Clock. 0 to 25MHz clock sourced by MAC to sample MDIO.The MAC controller access of the MII registers should be delayed at least 700us after completion of the reset because of the internal reset operation of the RTL82085.6 LED PinsPin Name Pin Type DescriptionLED_DATA/ LEDMODE[1] 49 I/O LED_DATA outputs serial status bits that can be shifted into a shiftregister to be displayed via LEDs. LED_DATA is outputsynchronously to LED_CLK.This pin is latched upon reset as LEDMODE[1]LEDMODE[1:0] controls the forms of serial LED statuses.See LED operation mode section.LED_CLK/ LEDMODE[0] 50 I/O LED_CLK outputs the reference clock for the serial LED signals. Thispin is latched upon reset as LEDMODE[0]5.7 Mode Control PinsPin Name Pin Type DescriptionSEL_TXFX[1:0]/ CRS_DV[1:0] 99,107 I/O,(Pd,Pd)Select 10/100BaseTX or 100BaseFX: (default = 2’b00)If RPT_MODE = 0:2’b00: All 8 ports (port0~port7) are 10Base-T/100Base-TX.2’b01: Port 7 is 100FX, other ports are 10Base-T/100Base-TX.2’b10: Ports 6 & 7 are 100FX, other ports are 10Base-T/100Base-TX.2’b11: All 8 ports are 100Base-FX.If RPT_MODE =1:2’b00: All 8 ports (port0~port7) are 10Base-T/100Base-TX.2’b01: Port 7 and 5 are 100FX, others are 10Base-T/100Base-TX.2’b10: Ports 1,3,5&7 are 100FX, others are 10Base-T/100Base-TX.2’b11: All 8 ports are 100Base-FX.PP-LPBK mode / RX_SYNC 81 I/O,(Pd)Port Pair Loop Back mode: (default =0)Upon power-on reset, this pin is input to assert PP-LPBK mode. Whenset, all eight ports are port-pair looped back, acting like a signalregeneration/transformation repeater.Refer to the section covering PP-LPBK mode.PHY_ADDR[4:3]/ RXD1[4:3] 73,83 I/O,(Pd,Pu)PHY Address: (default = 2’b01) These 2bits determine the highest2bits of 5-bit PHY address upon reset.MODE[1:0]/ CRS_DV[6:7] 61,53 I/O,(Pu,Pu)Select RMII/SMII/SS-SMII mode: (default = 2’b11)2’b1x: RMII2’b00: SMII2’b01: SS-SMIITP_PAUSE/ CRS_DV[5] 67 I/O,(Pu)Twisted Pair Pause capability: (default =1) Sets the Flow controlability of Reg.4.10 for UTP ports upon power-on reset.1: With flow control ability.0: Without flow control abilityFX_PAUSE/ CRS_DV[3] 85 I/O,(Pu)100Base-FX Flow control capability: (default =1)Forces the flowcontrol capability of Reg.4.10 and Reg.5.10 upon power-on reset.1: With flow control ability in 100Base-FX.0: Without flow control ability in 100Base-FX.FX_DUPLEX/ CRS_DV[2] 93 I/O,(Pu)FX_DUPLEX: Force 100Base-FX Full Duplex Mode: (default =1)This pin sets 100Base-FX duplex and affects those ports in100Base-FX mode.1=full duplex, 0=half duplex.Upon reset, this pin sets the default values of Reg.0.8 of those ports in100Base-FX.DISBLINK/ RXD1[6] 59 I/O,(Pd)Disable power-on reset LEDs blinking: (default = 0)1=Disable power-on LED blinking0=blink.LED_BLNK_TIME/ RXD1[5] 65 I/O,(Pu)LED blink time: (default =1) Used to control blinking speed ofactivity and collision LEDs.1= 43ms0= 120msLEDMODE[1:0] 49,50I,(Pd,Pd)LEDMODE[1:0]: (default = 00) Controls the forms of serial LED status.LEDMODE Mode Output2’b00 3-bit serial stream Col/Fulldup, Link/Act, Spd2’b01 2-bit serial stream Spd, Link/Act2’b10 3-bit for Bi-color LED Col/Fulldup, Link/Act, SpdSee LED operation mode section for more information.Pin Name Pin Type DescriptionDRIVE[0]/ RXD0[7] 52 I/O,(Pd)DRIVE[0]: Controls the output driving ability of SSMII RX_CLK.1’b0: 12mA (default)1’b1: 16mADRIVE[1]/ RXD0[6] 60 I/O,(Pd,Pd)DRIVE[1]: Controls the output driving abilities of theRMII/SMII/SS-SMII signals other than RX_CLK.Drive [1:0] Output driving ability2’b00 4mA (default)2’b01 8mA2’b10 12mA2’b11 16mA5.8 Reserved PinsPin Name Pin Type DescriptionENANAPAR/ RXD1[1] 97 I/O,(Pd)Reserved for internal use. Must be kept floating.TEST/ RXD1[2] 91 I/O,(Pd)TEST. Reserved for internal use. Must be kept floating.CPRST/ RXD1[0] 105 I/O,(Pd)Reserved for internal use. Must be kept floating.6. Register DescriptionsThe first six registers of the MII are defined by the MII specification. Other registers are defined by Realtek Semiconductor Corp. for internal use and are reserved for specific uses.Register Description Default0 Control Register 31001 Status Register 0F492 PHY Identifier 1 Register 001C3 PHY Identifier 2 Register C8834 Auto-Negotiation Advertisement Register 05E15 Auto-Negotiation Link Partner Ability Register 00016 Auto-Negotiation Expansion Register 0000RO: Read OnlyRW: R ead/WriteLL: Latch Low until clearedLH: L atch High until clearedSC: Self Clearing6.1 Register 0: ControlReg. bit Name Description Mode Default0.15 Reset 1=PHY reset. This bit is self-clearing. RW/SC 00.14 Loopback This will loopback TXD to RXD and ignore all the activitieson the cable media. Valid only for 10Base-T.1=Enable loopback.0=Normal operation.RW 00.13 Spd_Sel When Nway is enabled, this bit reflects the result ofAuto-negotiation. (Read only)When Nway is disabled, this bit can be set by SMI*.(Read/Write)When 100FX is enabled, this bit =1 (Read only)1=100Mbps.0=10Mbps.RW 10.12 Auto NegotiationEnable This bit can be set through SMI.(Read/Write)When 100FX is enabled, this bit =0 (Read only)1 = Enable Auto-negotiation process.0 = disable Auto-negotiation process.RW 1or0 for 100FX0.11 Power Down 1=Power down. All functions will be disabled exceptSMI.read/write function.0=Normal operation.RW 00.10 Isolate 1 = Electrically isolate the PHY from RMII/SMII/SS-SMII.PHY is still able to respond to MDC/MDIO.0 = Normal operationRW 00.9 Restart AutoNegotiation 1=Restart Auto-Negotiation process.0=Normal operation.RW/SC 00.8 Duplex Mode When Nway is enabled, this bit reflects the result ofAuto-negotiation. (Read only)When Nway is disabled, this bit can be set by SMI*.(Read/Write)When 100FX is enabled, this bit is determined by theFX_DUPLEX pin. (Read/Write)1=Full duplex operation.0=Half duplex operation.RW 10.[7:0] Reserved 0 *SMI: Serial Management Interface , which is composed of MDC,MDIO, allows MAC to manage PHY.Reset – In order to reset the RTL8208 by software control, a ‘1’ must be written to bit 15 using an SMI write operation. The bit clears itself after the reset process is complete, and does not need to be cleared using a second SMI write. Writes to other Control register bits will have no effect until the reset process is completed, which requires approximately 1us. Writing a ‘0’ to this bit has no effect. Because this bit is self clearing after a few cycles from a write operation, it will return a ‘0’ when read. Loopback – The RTL8208 may be placed into loopback mode by writing a ‘1’ to bit 14. Loopback mode may be cleared either by writing a ‘0’ to bit 14 or by resetting the chip. When this bit is read, it will return a ‘1’ when the chip is in software-controlled loopback mode, otherwise it will return a ‘0’.Speed Selection – If Auto-negotiation is enabled, this bit has no effect on the speed selection. However, if Auto-negotiation is disabled by software control, the operating speed of the RTL8208 can be forced by writing the appropriate value to bit 13. Writing a ‘1’ to this bit forces 100Base-X operation, while writing a ‘0’ forces 10Base-T operation. When this bit is read, it returns the value of the software controlled forced speed selection only.Auto Negotiation Enable – Default Auto Negotiation enable for all TP ports and disable for FX ports. Auto-negotiation can be disabled by either software control to set 0.12=0.Power Down – The RTL8208 supports a low power mode which is intended to decrease power consumption. Writing a ‘1’ will enable power down mode, and writing a ‘0’ will return the RTL8208 to normal operation. When read, this register will return a ‘1’ when in power down mode, and a ‘0’ during normal operation.Isolate – Each individual PHY may be isolated from its MII by writing a ‘1’ to bit 10. All MII outputs will be tri-stated and all MII inputs will be ignored. Since the MII management interface is still active, the isolate mode may be cleared either by writing a ‘0’ to bit 10 or by resetting the chip. When this bit is read, it will return a ‘1’ when the chip is in isolate mode, and a ‘0’ during normal operation.Restart Auto Negotiation – Bit 9 is a self-clearing bit that allows the Auto-negotiation process to be restarted, regardless of the current status of the Auto-negotiation state machine. In order for this bit to have an effect, Auto-negotiation must be enabled. Writing a ‘1’ to this bit restarts Auto-negotiation while writing a ‘0’ to this bit has no effect. When this bit is read, it will always return a ‘0’.Duplex Mode – By default, the RTL8208 powers up in half duplex mode. The chip can be forced into full duplex mode by writing a ‘1’ to bit 8 while Auto-negotiation is disabled. Half duplex mode can be resumed either by writing a ‘0’ to bit 8 or by resetting the chip. When Nway is enabled, this bit reflects the results of the Auto-negotiation, and is in a read only mode. When Nway is disabled, this bit can be set through the SMI, and is in a read/write mode. When 100FX is enabled, this bit can be set through the SMI or FX_DUPLEX pin and is in a read/write mode.Reserved Bits – All reserved MII register bits must be written as ‘0’ at all times. Ignore the RTL8208 output when these bits are read.6.2 Register1: StatusReg. bit Name Description Mode Default 1.15 100Base_T4 0 = no 100Base-T4 capability. RO 01.14 100Base_TX_FD 1=100Base-TX full duplex capable.0=Not 100Base-TX full duplex capable.RO 11.13 100Base_TX_HD 1=100Base-TX half duplex capable.0=Not 100Base-TX half duplex capable.RO 11.12 10Base_T_FD 1=10Base-TX full duplex capable.0=Not 10Base-TX full duplex capable.RO 11.11 10Base_T_HD 1=10Base-TX half duplex capable.0=Not 10Base-TX half duplex capable.RO 11.[10:7] Reserved RO 01.6 MF PreambleSuppression The RTL8208 will accept management frames withpreamble suppressed.RO 11.5 Auto-negotiateComplete 1=Auto-negotiation process completed. Reg.4,5 are valid ifthis bit is set.0=Auto-negotiation process not completed.RO 01.4 Remote Fault 1=Remote fault indication from link partner has beendetected.0=No remote fault indication detected.When in 100FX mode, this bit means in-band signalFar-End-Fault is detected. Refer to FX MODE section.RO/LH 01.3 Auto-NegotiationAbility 1=Nway Auto-negotiation capable. (permanently =1)0=Without Nway Auto-negotiation capability.RO 11.2 Link Status 1=Link has never failed since previous read.0=Link has failed since previous read.If link fails, this bit will be set to 0 until bit is read.RO/LL 01.1 Jabber Detect 1=Jabber detected.0=No Jabber detected.The jabber function is disabled in 100Base-X mode. Jabberis supported only in 10Base-T mode.RO/LH 01.0 Extended Capability 1=Extended register capable. (permanently =1)0=Not extended register capable.RO 1100Base_T4 – The RTL8208 does not support the T4 function. Any reads to this bit will return a ‘0’.100Base_TX_FD – The RTL8208 is capable of operating in 100Base-TX full duplex mode.100Base_TX_HD – The RTL8208 is capable of operating in 100Base-TX half duplex mode.10Base_T_FD – The RTL8208 is capable of operating in 10Base-T full duplex mode.10Base_T_HD – The RTL8208 is capable of operating in 10Base-T half duplex mode.Reserved – Ignore the output of the RTL8208 when these bits are read.MF Preamble Suppression – Management Frame Preamble Suppression is permanently set in the RTL8208, allowing subsequent MII management frames to be accepted with or without the standard preamble pattern. Only two preamble bits are required between successive management commands, instead of the normal 32, however, a minimum of 32 preamble bits are required for the first SMI read/write transaction after reset. One idle bit is required between any two management transactions (as defined in IEEE802.3u spec). Reads of this bit will always return a ‘1’.Auto-negotiate Complete – Bit 5 will return a ‘1’ if the Auto-negotiation process has been completed and the contents of registers 4 and 5 are valid.Remote Fault – When link partner detect far-end fault, it would send far-end indication stream pattern. When RTL8208 receive this pattern, set Reg1.4=1.Auto-Negotiation Ability – The RTL8208 is capable of performing IEEE Auto-negotiation, and will return a ‘1’ when bit 4 is read, regardless of whether or not the Auto-negotiation function has been disabled.Link Status – The RTL8208 will return a ‘1’ on bit 2 when the link state machine is in Link Pass, indicating that a valid link has been established. Otherwise, it will return ‘0’. When a link failure occurs after the link pass state has been entered, the Link。

nsc820系列电动机保护装置技术说明书

nsc820系列电动机保护装置技术说明书

nsc820系列电动机保护装置技术说明书标题:深度解读NSC820系列电动机保护装置技术说明书一、引言在工业生产中,电动机作为重要的动力设备,其保护装置的稳定性和可靠性对于生产安全和正常运行至关重要。

NSC820系列电动机保护装置作为当前市场上一款备受关注的技术产品,其技术说明书对于使用者来说具有重要的参考价值。

本文将对NSC820系列电动机保护装置技术说明书进行全面解读,深入探讨其技术特点和应用价值。

二、NSC820系列电动机保护装置的基本介绍NSC820系列电动机保护装置是一款针对工业电动机开发的智能保护产品,具有多种保护功能,包括过载保护、短路保护、欠压保护等。

其采用先进的微处理器技术和电子元件,能够对电动机进行全面监测和保护。

另外,NSC820系列还具有远程通讯功能,可与上位机进行数据交换和实时监控,具有很高的智能化水平。

三、NSC820系列电动机保护装置的技术特点1. 先进的保护算法NSC820系列电动机保护装置采用先进的保护算法,能够对电动机的各种工作状态进行精准判断,实时响应各种异常情况,并能够迅速切断电源,提高了电动机的安全性和可靠性。

2. 多种保护功能该系列产品集成了过载保护、短路保护、欠压保护、过压保护等多种保护功能,能够全面保护电动机的安全运行,减少了因操作失误或外部环境因素导致的损坏。

3. 远程通讯功能NSC820系列电动机保护装置支持远程通讯功能,可与上位机进行数据交换和实时监控。

这种智能化的设计,使得用户可以随时随地对电动机进行监控和管理。

4. 模块化设计产品采用模块化设计,易于安装和维护,同时也方便用户根据自身需求进行扩展和升级,具有很强的灵活性和可定制性。

四、NSC820系列电动机保护装置的应用价值NSC820系列电动机保护装置具有多种先进的技术特点,其应用价值主要体现在以下几个方面:1. 提高设备安全性通过多种保护功能的实时监测和及时切断电源,有效降低了电动机的运行风险,提高了设备的安全性,减少了因故障造成的损失。

瑞博华RBH8215 32 通道 USB 采集板使用手册说明书

瑞博华RBH8215 32 通道 USB 采集板使用手册说明书

USB接口100Ksps/12位32通道AD16通道数字输入/16通道数字输出 光电隔离全速实时连续采集板RBH8215使用说明书北京瑞博华控制技术有限公司北京瑞博华控制技术有限公司USB接口100Ksps/12位32通道AD /16路开入开出板RBH8215使用说明书一、概述RBH8215是32路AD,16路开入开出USB采集板。

其中AD有两种模式:准同步方式和异步方式。

32通道独立程控增益,用户可根据需要选择1、2、4、8或1、10、10、1000两种。

单通道或多通道采集时用户可以任意指定起始通道。

默认量程为±5V或0-10V也可根据用户特殊需求定制量程。

本板的采集精度12位,综合误差1LSB,因此,采样精度非常高。

本板外带总线扩展接口,可为用户提供多种扩展功能,提供总线有:CAN总线、RS-485总线、232总线、并行现场总线。

这样使用户无需深入了解USB的协议及底层控制方法,就像操作PC总线一样,通过USB接口实现对用户系统的控制。

准同步方式:两次采样的时间间隔由用户设定,而在一次采样中各个通道之间按最短时间采样,此时间为10us 。

异步方式:两次采样的时间间隔由用户设定,而在一次采样中各个通道采样时间间隔为平均时间。

选配的录波器软件可以直接与AD8215接口,软件与硬件搭配在一起,组成一套功能强大的数据采集系统,是现场信号检测的好帮手,实际通过的总采集速度100ksps(Sample Per Second:采样次数/秒),也就是采样频率可以达到100000次/秒。

因此,本采集系统可以代替示波器,盒磁带机,可以长时间记录并保存现场信号,而且可以现场实时看到信号波形等。

二、性能和技术指标2.1 性能与指标本板采用数字光电隔离技术,板上带DC-DC电源块,模拟信号地线和计算机地线分开,可防止有害信号通过采集卡串到计算机内,以避免由此引起计算机损坏,此外对降低环境噪声对信号的干扰也有益处。

新硬件820说明书v3.1最新资料

新硬件820说明书v3.1最新资料

尊敬的用户:欢迎使用本公司的产品。

在使用本产品前,请认真阅读随机附带的《说明书》。

本说明书重点介绍NHZK820型皮带秤仪表各项功能及操作,使用中遇到问题,请随时与本公司联系。

第一章概述1.1概述NHZK820型皮带秤控制仪表是专门针对皮带秤设计的一种高性能控制仪表,采用抗干扰措施和多项单片机最新研究成果,具有功能强大、体积小、可靠性高和适应性强等特点。

适合各种形式和各种量程的皮带秤的控制,用于绞刀秤、圆盘秤和转子秤等多种形式的动态秤的控制。

该仪表适用于以下的控制系统:1. 定量给料机通过控制给料机的皮带速度或预给料控制流量。

2. 皮带秤通过皮带速度控制皮带负荷,从而控制流量。

1.2功能特点1. 标准的RS-232和RS-485通讯功能,遵循标准MODBUS协议,通讯速度快,可靠性高。

(可选功能)2. 采用LCD显示器,128*64点阵,汉字提示信息,显示信息丰富、直观。

3. 输入输出接口采用多种硬件抗干扰技术。

4•可通过键盘、外部信号(端口)和上位机对仪表操作。

5•智能PID调节。

并且控制周期可以任意设定。

6. 可以通过仪表接口和通讯接口等方式与上位机、PLC或DCS连接。

7. 具有流量控制和定量控制两种控制方式。

&具有调速和恒速两种工作模式。

9. 设有累计脉冲输出,脉冲的宽度和当量(每个脉冲代表的物料量)可通过参数设定。

10. 仪表“流量设定方式”和“启动方式”可以分别通过对应的DI输入信号进行切换, 当DI有效时即为“外部接口”方式,否则为“仪表键盘”或“通讯”方式。

11•关键参数设定密码保护,以防止非专业人员误用。

12. 快捷参数备份、恢复功能。

可备份仪表内部所有参数,当仪表参数出现问题时重新恢复。

13. 具有容积工作方式。

当荷重传感器出现问题时仪表可切换到容积工作方式。

1.3技术参数1.工作电源: 85-265VAC /10W。

2.工作环境: -10-50 C /5-90%RH(无结露)。

欣芯电子蓝色COB光源说明书

欣芯电子蓝色COB光源说明书

DATA SHEETIntroduction Performance Characteristics Mechanical Dimensions Characteristic Curves ReliabilityPacking Specification PrecautionP 2P 3P 5P6P 9P 10P 11 CITILED COB SeriesBlue ModelCLU038-1210C4-B455-XX1. Introduction1-1. Product Description1-2. FeaturesCITIZEN ELECTRONICS was the first COB manufacturer. Our long-term advanced knowledge and packaging techniques have enabled us to provide products with excellent reliability and high quality. We succeeded in developing the high-power blue light COB, with in excess of 400W power, by adopting our specific heat-release technique.The blue-colored COB is intended for applications such as lighting for swimming pools, landscapes and security. This is also a product with as long a service life as conventional products. The outer dimensions and LES sizes are the same as those of the conventional products. The optical characteristics values were obtained at Tc=25C.CLU038-1210C4-B455-XX[1][2][3][4][5][1][2][3][4][5]Product NomenclatureWave length [nm]CLU0381210Blue 455Product shape Die count in series Die count in parallel Color2. Performance Characteristics2-1. Electro Optical Characteristics2-2. Absolute Maximum RatingsSymbol RatingPi 75.2*1If 1800*1Ir 1Top -40 ~ +100Tst -40 ~ +100Tc 105*2Tj140*3*1. Input power and forward current are the values when the LED is used within the range of the derating curve*2. Refer to 3. Outline drawing for Tc measurement point.ParameterInput Power (W)Forward Current (mA)Reverse Current (mA)*3. D.C. Current : Tj = Tc + Rj-c × PiStorage Temperature (C)Case Temperature (C)Junction Temperature (C)Operating Temperature (C)( Tc=25C )Min.Max Min.Max.Min.Typ.Max.CLU038-1210C4-B455-XX Blue132144546590032.935.838.70.42Notes :1. Citizen Electronics maintains forward voltage +/-3%, luminous flux +/-10%,Ra and R9 +/-1.*Values of Luminous flux at Tc=25C are provided as reference only.ThermalResistance Rj-c ( C / W )ColorVoltage ( V )Product code Radiant Flux ( W )Wave LengthDominant(nm)ForwardCurrent( mA )3. Mechanical Dimensions・Internal Circuit12 s 10 p Protection deviceLED deviceCathodeAnodeMarking 1 : Serial No.Marking 2 : CRI CCTDies count in parallel Dies count in series CLU038H 12 10 ** **4. Characteristic Curves4-1. Forward Current Characteristics / Temperature CharacteristicsForward Current vs. Forward VoltageForward Current vs. Relative Luminous FluxTc=25CTc=25CCase Temperature vs. Forward VoltageCase Temperature vs. Relative Luminous FluxIf=900mAIf=900mA32.033.034.035.036.037.038.039.00500100015002000V f [V ]If [mA]0%40%80%120%160%200%0500100015002000R e l a t i v e L u m i n o u s F l u x [a .u .]If [mA]33.534.034.535.035.536.036.537.00255075100V f [V ]Tc [C]0%20%40%60%80%100%120%0255075100R e l a t i v e L u m i n o u s F l u x [a .u .]Tc [C]4-2. Optical CharacteristicsSpectrumTc = 25℃If = 900 mA0%10%20%30%40%50%60%70%80%90%100%380430480530580630680730780R a d i a t i v e I n t e n s i t yWave length [nm]BlueRadiation Characteristic0%20%40%60%80%100%X Y80°70°60°50°40°30°20°10°-80°-70°-60°-50°-20°-30°-40°-10°90°-90°Case Temperaturevs. Allowable Forward Current02004006008001000120014001600180020000255075100125I f [m A ]Tc [C]4-2. Optical Characteristics (continued)4-3. Derating Characteristics5. Reliability5-1. Reliability Test5-2. Failure Criteria-40 C × 30 minutes – 100 C × 30 minutes, 100 cycle85 C, 85 %RH for 500 hoursThermal Shock TestContinuous Operation Test High Temperature Storage TestLow Temperature Storage Test Moisture-proof Test IF=900mA Tj=140C (with Al-fin) ×1000hrsTest Item100 C × 1000 hours -40 C × 1000 hours Test ConditionIF=900mA Ta=25C (with Al-fin) ×1000hrs ( Tc=25C )U defines the upper limit of the specified characteristics. S defines the initial value.-Note : Measurement shall be taken between 2 hours and 24 hours, and the test pieces should be return to the normal ambient conditions after the completion of each test.Total Luminous FluxΦvIf=900mA<S × 0.85Measuring Item Symbol Measuring ConditionFailure CriteriaForward Voltage Vf If=900mA >U × 1.11675001(2)-(1)(3)Example of indication label1. TYPE e.g. CLU038-1210C4-B455-XX2. P.No. ( Cutomer's P/N )3. Lot No.e.g. 4. Quantity(1) Last two digit of the year 16 : year 2016(2) Production month 7 : JuryNote: October, November and December are designated X,Y and Z.(3) CE's control number 6. Packing Specification6-1. PackingAn empty tray is placed on top of a 6-tier tray which contain 48 pieces each. (Smallest packing unit: 288 pieces)A label with product name, quantity and lot number is placed on the upper empty tray.Tray (Dimensions: 310 x 210 x 12 mm / Materials: Electrically conductive PS)CUSTOMERTYPE P.NO Lot No Q'ty: CLU***-******-*******: ******: *******: ***---( 1 )---( 2 )---( 3 )---( 4 )7. Precaution7-1. Handling with care for this product-Both the light emitting area and white rim around the light emitting area is composed of resin materials.Please avoid the resin area from being pressed, stressed, rubbed, come into contact with sharp metal nail(e.g. edge of reflector part) because the function, performance and reliability of this product are negatively impacted.-Please be aware that this product should not come into contact with any other parts while incorporating in your lighting apparatus or your other products.-Please be aware that careful handling is required after the attachment of lead wires to prevent the application of any load to the connections.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-2. Countermeasure against static electricity-Handling of this product needs countermeasures against static electricity because this is a semiconductor product.-Please take adequate measures to prevent any static electricity being produced such as the wearing of a wristband oranti-static gloves when handling this product.-Every manufacturing facility in regard to the product (plant, equipment, machine, carrier machine and conveyance unit) should be connected to ground and please avoid the product to be electric-charged.-ESD sensitivity of this product is over 1,000V (HBM, based on JEITA ED-4701/304).-After assembling the LEDs into your final product(s), it is recommended to check whether the assembled LEDs are damaged by static electricity (electrical leak phenomenon) or not.-It is easy to find static damaged LED dies by a light-on test with the minimum current value.7-3. Caution of product assembly-Regarding this product assembling on the heat sink, it is recommended to use M3 screw.It might be good for screw tightening on the heat sink to do temporary tightening and final tightening.In addition, please don’t press with excess stress on the product.-The condition of the product assembling on the heat sink and the control of screw tightening torque needs to be optimized according to the specification of the heat sink.-Roughness, unevenness and burr of surface negatively impact thermal bonding between the product and heat sink and increase heat thermal resistance between them.Confidence of thermally and mechanical coupling between the product and heat sink are confirmed by checkingthe mounting surface and measuring the case temperature of the product.-In order to reduce the thermal resistance at assembly, it might be good to use TIM (Thermal Interface Material) on whole contact surface of the product.In case of using thermal grease for the TIM, it might be good to apply uniformly on the contact surface of the product.In case of using thermal sheet for the TIM, it might be good to make sure that the product is NOT strained by stress when the screws are tightened for assembly.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-4. Thermal Design-The thermal design to draw heat away from the LED junction is most critical parameter for an LED illumination system. High operating temperatures at the LED junction adversely affect the performance of LED’s light output and lifetime. Therefore the LED junction temperature should not exceed the absolute maximum rating in LED illumination system.-The LED junction temperature while operation of LED illumination system depends upon thermal resistance of internal LED package (Rj-c), outer thermal resistances of LED package, power loss and ambient temperature. Please take both of the thermal design specifications and ambient temperature conditions into consideration for the setting of driving conditions.-For more information, please refer to application note "Thermal Management", "Instruction Manual(COB LED Package)".7-5. Driving Current-A constant current is recommended as an applying driving current to this product.In the case of constant voltage driving, please connect current-limiting resistor to each products in series and control the driving current to keep under the absolute maximum rating forward current value.-Electrical transient might apply excess voltage, excess current and reverse voltage to the product(s).They also affect negative impact on the product(s) therefore please make sure that no excess voltage, no excess current and no reverse voltage is applied to the product(s) when the LED driver is turn-on and/or turn-off.-For more information, please refer to application note "Driving", "Instruction Manual(COB LED Package)".7-6. Lighting at a minimum current value-A minimum current value of lighting of all dice is 15mA.When a minimum current is applied, LED dice may look different in their brightness due tothe individual difference of the LED element, and it is not a failed product.7-7. Electrical Safety-This product is designed and produced according to IEC 62031:2008(IEC 62031:2008 LED modules for general lighting. Safety specification)-Dielectric voltage withstand test has been conducted on this product to see any failure after applyingvoltage between active pads and aluminum section of the product, and to pass at least 500V.-Considering conformity assessment for IEC62031:2008, almost all items of the specification depend upon your final product of LED illumination system.Therefore, please confirm with your final product for electrical safety of your product.As well, the products comply with the criteria of IEC62031:2008 as single LED package.- A minimum current value of lighting of all dice is 50 mA. When a minimum current is applied, LED dice may look different in their brightness due to the individual difference of the LED element, and it is not a failed product.7-8. Recommended soldering Condition (This product is not adaptable to reflow process.) -For manual solderingPlease use lead-free soldering.Soldering shall be implemented using a soldering bit at a temperature lower than 350C, and shall befinished within 3.5 seconds for one land.No external force shall be applied to resin part while soldering is implemented.Next process of soldering should be carried out after the product has return to ambient temperature.Contacts number of soldering bit should be within twice for each terminal.* Citizen Electronics cannot guarantee if usage exceeds these recommended conditions.Please use it after sufficient verification is carried out on your own risk if absolutely necessary.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-9. Eye Safety-The International Electrical Commission (IEC) published in 2006 IEC 62471”2006 Photobiological safety of lamps and lamp systems ” which includes LEDs within its scope.When sorting single LEDs according to IEC 62471, almost all white LEDs can be classifiedas belonging to either Exempt Group (no hazard) or Risk Group 1 (low risk).-However, Optical characteristics of LEDs such as radiant flux, spectrum and light distribution are factorsthat affect the risk group determination of the LED, and especially a high-power LED, that emits lightcontaining blue wavelengths,might have properties equivalent to those of Risk Group 2 (moderate risk).-Great care should be taken when directly viewing an LED that is driven at high current, has multipleuses as a module or when focusing the light with optical instruments, as these actions might greatlyincrease the hazard to your eyes.-It is recommended to regard the evaluation of stand-alone LED packages as a referenceand to evaluate your final product.7-10. This product is not designed for usage under the following conditions.If the product might be used under the following conditions, you shall evaluate its effect and appropriate them. In places where the product might:-directly and indirectly get wet due to rain and/or at place with the fear.-be damage by seawater and/or at place with the fear-be exposed to corrosive gas (such as Cl2, H2S, NH3, SOx, NOx and so on) and/or at place with the fear.-be exposed to dust, fluid or oil and/or at place with the fear.Precautions with regard to product use(1) This document is provided for reference purposes only so that CITIZEN ELECTRONICS' products are used as intended. CITIZEN ELECTRONICS neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of CITIZEN ELECTRONICS or any third party with respect to the information in this document. (2) All information included in this document such as product data, diagrams, charts, is current as of the date this document is issued.Such information, however, is subject to change without any prior notice.Before purchasing or using any CITIZEN ELECTRONICS' products listed in this document, please confirm the latest product information with a CITIZEN ELECTRONICS' sales office, and formal specifications must be exchanged and signed by both parties prior to mass production.(3) CITIZEN ELECTRONICS has used reasonable care in compiling the information included in this document, but CITIZEN ELECTRONICS assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document.(4) Absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, CITIZEN ELECTRONICS assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness fora particular purpose, accuracy of information, or no infringement.(5) Though CITIZEN ELECTRONICS works continually to improve products' quality and reliability, products can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards to minimize risk and avoid situations in which a malfunction or failure of a product could cause loss of human life, bodily injury or damage to property, including data loss or corruption.In addition, customers are also responsible for determining the appropriateness of use of any information contained in this document such as application cases not only with evaluating by their own but also by the entire system.CITIZEN ELECTRONICS assumes no liability for customers' product design or applications.(6) Please contact CITIZEN ELECTRONICS' sales office if you have any questions regarding the information contained in this document, or if you have any other inquiries.CITIZEN Micro HumanTech is a registered trademark of Citizen Holding Co., Japan.CITILED is a registered trademark of CITIZEN ELECTRONICS CO., LTD. Japanand are trademarks or registered trademarks of CITIZEN HOLDINGS CO., LTD. JAPAN.is a trademark or a registered trademark of CITIZEN ELECTRONICS CO., LTD. JAPAN.。

TW810 系列 DTU 说明书

TW810 系列 DTU 说明书

1TW810系列使用说明书V3.0厦门计讯物联科技有限公司Xiamen Top-Iot Technology Co.,Ltd.TW810系列DTU 说明书文档编号产品版本密级V3.0低产品名称:TW810共23页文档修订记录日期版本说明作者2014.6.23V1.0第一次发布手册刘伟2014.7.11V2.0手册完善,正式发布林文浩2014.10.17V2.1增加PPP底层心跳配置增加TTL心跳配置林文浩2015.4.2V2.2技术参数修改刘伟2017.9.3V2.3技术参数修改刘伟2020.11.23V3.0细节完善卢惠铃2目录一、术语与定义 (4)二、产品介绍 (4)2.1、产品简介 (4)2.2、应用介绍 (5)三、安装说明 (5)3.1、安装条件 (5)3.2、安装步骤 (6)3.3、供电电源 (8)3.4、指示灯说明 (8)四、串口配置参数 (9)4.1、功能操作项 (9)4.2、基本配置 (11)4.3、GPRS/3G/4G工作模式设置 (13)4.4、短信设置 (16)4.5、MODBUS设置 (17)五、短信配置参数 (18)附件一、AT命令 (19)附件二、常见问题与解决 (21)1、Power灯不亮 (21)2、Online灯不亮 (21)3、设备无法进入配置状态 (21)34一、术语与定义DTU:(Data Transfer Unit),是专门用于将串口数据转换为IP 数据或将IP 数据转换为串口数据通过无线通信网络进行传送的无线终端设备。

SMS:短信2G:中国移动2G,中国联通2G(GPRS)和电信2G(CMDA 1X)。

3G:中国移动3G(TD-SCDMA),中国联通3G(WCDMA)和电信3G(EVDO)。

4G:中国移动4G,中国联通4G 和电信4G。

中心/服务器:接收DTU 通过SMS/2G/3G/4G 发送的数据,并通过SMS/2G/3G/4G 向DTU 发送数据的计算机设备。

12V断点续传GS8208规格书

12V断点续传GS8208规格书
Rth( j-a)(C /Watt)
PD(max)会随着环境温度上升而下降,因此需要根据封装 型式和环境温度小心的设计操作条件,下面的图表描述了 SOP8 封装在最大消耗功率和环境温度的关系。
Power Dissipation Pd(W)
Maximum Power Dissipation v.s.Ambient Temperature
2
SDO
3
6 SDI2 5 SDI 4 GND
脚位说明
Pin 名 VDH GND
OUTR、OUTG、OUTB SDI SDI2 SDO
类型 P P OUT IN IN OUT
功能 12V 芯片电源
芯片地 恒流输出,外接 LED
串行数据输入端 串行数据冗余输入端
串行数据输出端
第 2 页 共 11 页
输入输出等效电路
12bits PWM 产生器 (B)
12bits 数据 8bits->12bits GAMMA 校正
8bits 点数据
数字处理器
OSC
上电测试
POR
SDO
芯片脚位图内封灯珠脚位图
OUTR
1
OUTG
2
OUTB
3
SDO
4
GS8208 GS8208
8 VDH 7 SDI2 6 GND 5 SDI
VDH
1
NA
1
150 ±3% ±6%
单位 V V V V mA mA mW % %
12
V
ohm
uF
交流特性
特性 内置振荡器频率
画面刷新率 数据刷新率 画面更新延时 内置程序数据刷新率 通道输出迟滞时间 电流输出端电位爬升时间 电流输出端电位下降时间 电流输出最小脉宽 归零码数据频率

半导体传感器TMS320F2808PZA中文规格书

半导体传感器TMS320F2808PZA中文规格书

TMS320F2810, TMS320F2810-Q1, TMS320F2811, TMS320F2811-Q1TMS320F2812, TMS320F2812-Q1SPRS174V – APRIL 2001 – REVISED FEBRUARY 2021Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback17 Product Folder Links: TMS320F2810TMS320F2810-Q1TMS320F2811TMS320F2811-Q1TMS320F2812TMS320F2812-Q1TMS320F2810, TMS320F2810-Q1, TMS320F2811, TMS320F2811-Q1TMS320F2812, TMS320F2812-Q1SPRS174V – APRIL 2001 – REVISED FEBRUARY 20218.9 Thermal Resistance Characteristics for 176-Pin PGF Package(1)These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on aJEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:•JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)•JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages•JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages•JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements8.10 Thermal Resistance Characteristics for 128-Pin PBK Package(1)These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on aJEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:•JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)•JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages•JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages•JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements8.11 Thermal Design ConsiderationsBased on the end application design and operational profile, the I DD and I DDIO currents could vary. Systems that exceed the recommended maximum power dissipation in the end product may require additional thermal enhancements. Ambient temperature (T A) varies with the end application and product design. The critical factor that affects reliability and functionality is T J, the junction temperature, not the ambient temperature. Hence, care should be taken to keep T J within the specified limits. T case should be measured to estimate the operating junction temperature T J. T case is normally measured at the center of the package top-side surface. The thermal application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and definitions.26Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TMS320F2810TMS320F2810-Q1TMS320F2811TMS320F2811-Q1TMS320F2812TMS320F2812-Q1。

NXP LPC4088 -32 OEM 板级产品说明书

NXP LPC4088 -32 OEM 板级产品说明书

The Art of Embedded Systems Development – made Easy™LPC4088-32 OEM Board Feature HighlightsThe LPC4088-32 OEM Board provides a quick and easy solution for implementing a high-performance ARM Cortex-M4 based design around the LPC4088 from NXP.∙ Build around NXP's ARM Cortex-M4 LPC4088 microcontrollerwith 512Kbyte internal FLASH and 96Kbyte internal SRAM ∙ 32MByte external SDRAM, via 32-bit databus ∙ 128 Mbyte NAND FLASH ∙ 32 Mbit QSPI flash∙ 100/10Mbps Ethernet interface based on SMSC LAN8720 ∙ 12.000 MHz and 32.768 kHz crystals for LPC4088 ∙ Buffered 32-bit data bus ∙ +3.3V powering∙ 200 pos expansion connector(as defined in popular SO-DIMM industry standard), 0.6mm pitch ∙ Compact design with dimensions: 68 x 50 mmSupport Highlights∙ Access to Embedded Artists support page containingo Schematics o User’s Manualo Sample software applications o OEM Board Integration Guide∙ Supported by Developer’s Kit , see picture to right ∙ Volume discount available∙ Customization service available for optimized high-volume designBlock Diagram of LPC4088-32 OEM BoardNXP PartnerEmbedded Artists is a partner of NXP. Together we give engineers an excellent base to work from when creating advanced embedded systems. We have a close co-operation and knoweverything there is to know about the NXP processors. Take advantage of our unique knowledge! For further information, please contact: ***************************The Art of Embedded Systems Development – made Easy™[1] Extended temperature range can be supplied on request. Subject to minimum order volume. [2] Will be defined after a characterization process.Mechanical DimensionsBoard width according to SO-DIMM standard: 67.6 mm. Board height and depth according to picture below:ESD CAUTIONESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features ESD protection damages may occur on devices subjected to high energy ESD. Therefore, proper ESD precaution should be taken to avoid performance degradation or loss of functionality.50.0 mm 5.0 mmThe Art of Embedded Systems Development –made Easy™The Art of Embedded Systems Development –made Easy™O: outputI: inputB: Bidirectional P: PowerA: Analog GPIO: General purpose I/O GPI: General purpose input GPO: General purpose outputThe Art of Embedded Systems Development –made Easy™DisclaimersEmbedded Artists reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces allinformation supplied prior to the publication hereof.Customer is responsible for the design and operation of their applications and products using Embedded Artists’ products, and Embedded Artists accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Embedded Artists’ product is suitable and fit for the customer’s applications an d products planned, as well as for the planned application and use of customer’s third party customer(s). Customers shou ld provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.Embedded Artists does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third partycustomer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Embedded Artists’ products in or der to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Embedded Artists does not accept any liability in this respect.Embedded Artists does not accept any liability for erratas on individual components.All Embedded Artists’ products are sold pursuant to Embedded Artists’ terms and conditions of sale:/sites/default/files/docs/General_Terms_and_Conditions.pdfNo license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by Embedded Artists for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN EMBEDDE D ARTISTS’ TERMS AND CONDITIONS OF SALE EMBEDDEDARTISTS DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OFEMBEDDED ARTISTS PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OFMERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.UNLESS EXPRESSLY APPROVED IN WRITING BY THE CEO OF EMBEDDED ARTISTS, PRODUCTS ARE NOTRECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, NUCLEAR, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE ORMALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTALDAMAGE.Resale of Embedded Artists’ products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by Embedded Artists for the Embedded Artists’ product or service described herein and shall not create or extend in any manner whatsoever, any liability of Embedded Artists.This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.Definition of Document StatusPreliminary– The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Embedded Artists does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. The document is in this state until the product has passed Embedded Artists product qualification tests.Approved– The information and data provided define the specification of the product as agreed between Embedded Artists and its customer, unless Embedded Artists and customer have explicitly agreed otherwise in writing.。

E103-W08 产品规格书说明书

E103-W08 产品规格书说明书

E103-W08产品规格书2.4G串口WIFI BLE配网低功耗目录第一章概述 (1)1.1简介 (1)1.2功能特点 (1)1.3应用场景 (2)第二章规格参数 (2)2.1极限参数 (2)2.2工作参数 (2)第三章机械尺寸与引脚定义 (3)3.1E103-W08A引脚尺寸图 (3)3.2E103-W08A引脚尺寸图 (4)第四章推荐连线图 (5)第五章功能说明 (5)5.1工作模式 (5)5.1.1TCP通信 (6)5.1.2MQTT通信 (7)5.1.3HTTP通信 (7)5.2TCP心跳包 (7)5.3自动连接 (7)5.4手动连接 (8)5.5手动断开 (8)5.6BLE配网 (8)5.7状态指示 (8)5.8低功耗 (8)5.9注意事项 (9)第六章默认参数 (9)第七章AT指令及参数 (10)7.1错误码表 (11)7.2基本AT指令 (11)7.2.1AT测试指令 (11)7.2.2重启模块 (11)7.2.3恢复出厂参数 (12)7.2.4查询版本信息 (12)7.2.5查询、设置串口参数 (12)7.2.6查询、设置工作模式 (12)7.2.7查询、设置电源模式 (13)7.3WIFI相关AT指令 (13)7.3.1扫描可用AP (13)7.3.2连接到指定AP (13)7.3.3与AP断开连接 (14)7.3.4查询、设置连接模式 (14)7.3.5查询MAC地址 (14)7.3.6查询、设置主机名 (14)7.4TCP相关AT指令 (15)7.4.1查询网络连接状态 (15)7.4.2建立TCP传输 (15)7.4.3关闭TCP传输 (15)7.4.4查询本地IP (15)7.4.5查询、设置多连接 (15)7.4.6查询、设置TCP模式 (15)7.4.7查询、设置是否打印对端IP、端口 (16)7.4.8查询、设置远程目标参数 (16)7.4.9查询、设置心跳数据 (16)7.5MQTT相关AT指令 (17)7.5.1查询、设置MQTT远程目标 (17)7.5.2查询、设置MQTT发布主题 (17)7.5.3查询、设置MQTT订阅主题 (17)7.5.4查询、设置MQTT登录参数 (17)7.5.5查询、设置MQTT连接参数 (18)7.6HTTP相关参数 (18)7.6.1查询、设置远程目标 (18)7.6.2查询、设置URL (18)7.6.3查询、设置数据类型 (18)7.7BLE相关参数 (19)7.7.1查询、设置BLE广播名 (19)7.7.2查询、设置BLE广播间隙 (19)第八章使用教程 (20)8.1TCP通信 (20)8.1.1透传 (20)8.1.2协议传输 (21)8.2HTTP通信 (23)8.3MQTT通信 (23)8.4BLE配网 (24)第九章焊接作业指导 (27)9.1回流焊温度 (27)9.2回流焊曲线图 (27)修订历史 (28)关于我们 (28)免责申明和版权公告本文中的信息,包括供参考的URL地址,如有变更,恕不另行通知。

E18系列产品规格书说明书

E18系列产品规格书说明书

E18系列产品规格书CC25302.4GHz ZigBee3.0无线模块目录第一章产品概述 (3)1.1产品简介 (3)1.2特点功能 (4)1.3应用场景 (5)第二章规格参数 (6)2.1射频参数 (6)2.2电气参数 (6)2.3硬件参数 (6)2.4网络系统参数 (7)第三章机械尺寸与引脚定义 (8)第四章硬件设计 (11)第五章软件设计 (11)第六章常见问题 (13)6.1传输距离不理想 (13)6.2模块易损坏 (13)6.3误码率太高 (13)第七章焊接作业指导 (7)7.1回流焊温度 (7)7.2回流焊曲线图 (7)第八章相关型号 (8)第九章天线指南 (8)第十章产品包装图 (8)修订历史 (9)关于我们 (9)第一章产品概述1.1产品简介E18系列是亿佰特设计生产的2.4GHz频段的ZigBee通信协议转串口无线模块,贴片型,PCB板载天线或IPEX-1接口,引脚间距1.27mm,出厂自带自组网固件,到手即用,适用于多种应用场景(尤其智能家居)。

E18系列模块采用美国德州仪器公司原装进口CC2530射频芯片,芯片内部集成了8051单片机及无线收发器,部分模块型号内置PA功率放大器增加通信距离。

出厂自带固件基于ZigBee3.0协议实现的串口数据透传,支持ZigBee3.0协议下各种指令命令。

经实测,对市面上大多数ZigBee3.0产品有着非常良好的兼容性。

1.2ZigBee 3.0优势E18系列模块固件基于Z-Stack3.0.2协议栈(ZigBee 3.0),该版本为CC2530/CC2538系列芯片最优协议栈,因此我司也此基础上做了许多优化,确保系统长期稳定运行。

ZigBee3.0与早前版本的应用方式区别:1.组网方式发生变化:ZigBee 3.0取缔了一上电就组网的方式,而是根据实际需要进行组网。

任何设备在出厂状态下是无网络状态,协调器需要运行“formation”(调用bdb_StartCommissioning(BDB_COMMISSIONING_MODE_NWK_FORMATION))来新建网络,然后再运行"Steering"(调用bdb_StartCommissioning(BDB_COMMISSIONING_MODE_NWK_STEERING))打开网络,打开网络默认时间180秒,可通过广播"ZDP_MgmtPermitJoinReq"的方式将打开网络提前关闭。

N32WB03x系列蓝牙芯片 数据手册说明书

N32WB03x系列蓝牙芯片 数据手册说明书

N32WB03x系列蓝牙芯片数据手册N32WB03x系列采用32位ARM Cortex-M0内核,最高工作主频64MHz, 支持BLE 5.1,发射电流4.2mA, 接收电流3.8mA, 最大发射功率+6dBm,接收灵敏度-94dBm @BLE 1Mbps, 支持SIG Mesh关键特性●内核CPU32位ARM Cortex-M0内核最高主频64MHz●存储256K/512K字节Flash48K字节SRAM●功耗接收电流:**********发射电流:4.2mA @0dBm/3.3VSleep模式(48KB RAM保持):1.4μA@3VPD模式:130nA●射频规格BLE 1Mbps接收灵敏度:-94dBmBLE 2Mbps接收灵敏度:-91dBm可编程的发射机功率,最大+6dBm单端天线口●时钟HSE:32MHz外部高速晶体LSE:32.768KHz外部低速晶体HSI:内部高速RC64MHzLSI:内部低速RC32KHz支持1路时钟输出,可配置为不同的时钟,4分频后输出●复位支持上下电/外部引脚复位支持看门狗复位●通信接口2个USART接口,最高速率4 Mbps(可配置为ISO7816,IrDA,LIN)1个LPUART接口,支持低功耗特性,Sleep模式下最高通讯速率9600bps,支持低功耗唤醒2个SPI接口,最高速率16MHz,主从模式可配,可配置为I2S1个I2C接口,最高速率1 MHz,主从模式可配●定时计数器1个16位高级定时计数器,支持输入捕获、输出比较、PWM输出以及正交编码输入等功能;有4个独立的通道,其中3个通道支持6路互补PWM输出1个16位通用定时计数器,支持输入捕获、输出比较、PWM输出、单脉冲输出,有4个独立的通道1个16位基本定时计数器1个24位系统时间定时器1个7位窗口看门狗(WWDG)1个12位独立看门狗( IWDG)●模拟接口1个10位1.33Msps ADC(可配置为16位16Ksps),支持5路外部单端通道,1路差分MIC通道,2路内部通道 内置PGA,支持最大128倍放大MIC BIAS电压支持1.6V-2.3V可调●21个支持复用功能的GPIO●1个高速5通道DMA控制器●1个IR发送控制器,支持可配置红外遥控协议●1个KEYSCAN模块,支持8/10/13个GPIO可配置为44/65/104个按键功能●RTC实时时钟,支持闰年万年历,闹钟事件,周期性唤醒●支持硬件CRC16、CRC32运算●工作条件工作电压范围:1.8V/2.32V~3.6V工作温度范围:-40℃~85℃ESD:±2KV(HBM)●封装QFN32(4mm×4mm) ●订购型号目录1产品简介 (9)命名规则 (10)器件一览 (10)2功能简介 (12)处理器内核 (12)存储器 (12)Flash (12)SRAM (12)低功耗模式 (12)时钟系统 (13)通用输入输出接口(GPIO) (14)外部中断/事件控制器(EXTI) (15)直接存储器存取(DMA) (15)循环冗余校验计算单元(CRC) (15)定时器和看门狗 (16)基本定时器(TIM6) (16)通用定时器(TIM3) (16)高级控制定时器(TIM1) (17)系统时基定时器(Systick) (17)看门狗定时器(WDG) (18)模拟/数字转换器(ADC) (18)I2C总线接口(I2C) (19)通用同步异步收发器(USART) (20)串行外设接口(SPI) (22)串行音频接口(I2S) (23)实时时钟(RTC) (24)红外控制器(IRC) (24)按键自动扫描(KEYSCAN) (24)串行SWD调试口(SWD) (25)3定义和描述 (26)封装示意图 (26)QFN32 (26)引脚复用定义 (27)4电气特性 (30)测试条件 (30)最小和最大数值 (30)典型数值 (30)典型曲线 (30)负载电容 (30)引脚输入电压 (30)供电方案 (31)电流消耗测量 (32)绝对最大额定值 (33)工作条件 (34)通用工作条件 (34)上电和掉电时的工作条件 (34)内嵌复位和电源控制模块特性 (34)DCDC特性 (35)供电电流特性 (35)外部时钟源特性 (37)内部时钟源特性 (39)从低功耗模式唤醒的时间 (40)FLASH存储器特性 (40)绝对最大值(电气敏感性) (41)I/O端口特性 (41)RESET引脚特性 (44)TIM定时器特性 (45)I2C接口特性 (45)SPI接口特性 (47)温度传感器(TS)特性 (49)ADC特性 (50)PGA特性 (51)KEYSCAN特性 (51)BLE特性 (52)5封装尺寸 (54)QFN32 (54)6版本历史 (55)7声明 (56)表目录表1-1 N32WB03x系列资源配置 (10)表3-1 管脚定义 (27)表4-1 电压特性 (33)表4-2 电流特性 (33)表4-3 温度特性 (33)表4-4 通用工作条件 (34)表4-5 上电和掉电时的工作条件 (34)表4-6 内嵌复位和电源控制模块特性(1)(2) (34)表4-7 内嵌DCDC电源管理模块特性(1) (35)表4-8 睡眠模式下的典型电流消耗(1) (36)表4-9 运行模式下的典型电流消耗 (36)表4-10 BLE功耗 (36)表4-11 HSE 32MHz振荡器特性(1)(2) (37)表4-12 LSE振荡器特性(f LSE=32.768kHz)(1) (38)表4-13 HSI振荡器特性(1)(2) (39)表4-14 LSI振荡器特性(1) (39)表4-15 低功耗模式的唤醒时间 (40)表4-16 存储器特性 (40)表4-17 闪存存储器寿命和数据保存期限 (40)表4-18 ESD绝对最大值 (41)表4-19 电气敏感性 (41)表4-20 I/O静态特性(1)(2) (41)表4-21 I/O输出电压 (42)表4-22 输入输出交流特性(1) (43)表4-23 NRST引脚特性 (44)表4-24 TIMx(1)(2)特性 (45)表4-25 I2C接口特性(1) (46)表4-26 SPI特性(1) (47)表4-27 温度传感器特性 (50)表4-28 ADC特性 (50)表4-29 PGA特性 (51)表4-30 KEYSCAN特性 (51)表4-31 BLE接收特性(1) (52)表4-32 BLE发送特性(1) (52)图目录图1-1 N32WB03x系列框图 (9)图1-2 N32WB03x系列订货代码信息图示 (10)图2-1 存储器映射图 (12)图2-2 时钟树 (14)图3-1 N32WB03x系列QFN32引脚分布 (26)图4-1 引脚的负载条件 (30)图4-2 引脚输入电压 (30)图4-3 供电方案 (31)图4-4 电流消耗测量方案 (32)图4-5 使用32MHz晶体的典型应用 (37)图4-6 使用32.768kH晶体的典型应用 (39)图4-7 输入输出交流特性定义 (44)图4-8 建议的NRST引脚保护 (44)图4-9 I2C总线交流波形和测量电路(1) (46)图4-10 SPI时序图–从模式和CPHA=0 (48)图4-11 SPI时序图–从模式和CPHA=1(1) (49)图4-12 SPI时序图–主模式(1) (49)图5-1 QFN32封装尺寸 (54)1产品简介N32WB03x系列蓝牙芯片是国民技术新一代高性能、超低功耗的蓝牙5.1芯片,采用32位ARM Cortex®-M0内核,最高工作主频64MHz,片上集成48KB SRAM,256/512KB Flash。

昇润科技HY-264018蓝牙低功耗4.1版本模块规格书说明书

昇润科技HY-264018蓝牙低功耗4.1版本模块规格书说明书

HY-264018深圳昇润科技对本手册中可能出现的和/或规格书的权利,恕不另行通知用作生命支持设备或系统中的关键标是由美国蓝牙SIG公司所有.18蓝牙低功耗4.1版本 模块规格书(22 pin)文档版本:V1.02017年10月23日深圳市昇润科技有限公司版权所有现的错误不承担责任。

此外,昇润科技保留随时行通知,并不承诺更新此处所包含的信息。

昇润的关键组件。

以及不承担各种专利或知识产权的.密级:公开资料pin)留随时更改硬件,软件。

昇润的产品不被授权产权的授权使用;蓝牙商1.简述 (1)1-1应用: (1)1-2主要特征: (1)2. 产品型号 (2)2-1.(4 种天线形式可供选择)/( 可选: 带屏蔽罩或不带屏蔽罩) (2)3. 模块尺寸与图片 (2)3.1. HY-264018P / WMD400018SR6P0 (PCB 螺旋天线) (2)3-2.HY-264018I /WMD400018SR6I0 ( IPEX RF外接天线连接端子) (2)3-3. HY-264018W / MD400018SR6W0 金属线天线 (1/4波长偶极子天线) (3)3.4. HY-264018C/ WMD400018SR6C0 (陶瓷天线) (3)(4). 应用注意事项: (3)5.引脚分配和端口功能说明 (5)6. 电气特性 (6)6-1. 射频特性 及 电流功耗: (6)6-2. 绝对最大额定值 (6)6-3. ESD 额定值 (6)6-4. 建议工作条件 (6)6-5.GPIO DC特性 (7)6-6. 时序要求 (7)6-7. 动作状态切换时序特性 (7)7. 模块方块图 (8)8.IC功能方块图 (8)9. 工作模式架构图 (8)10. 回流焊曲线建议 (无铅锡膏: Sn 96.5%, Ag 3%, Cu 0.5%) (9)11.联系我们 (10)HY-264018提供蓝牙低功耗特性:无线电,蓝牙协议栈,配置文件和客户应用程序的所需空间。

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芯蓝科技GS8208的规格书*产品说明*
GS8208是一颗3通道,带断点续传及内控花样的LED恒流驱动芯片。

GS8208包括了3个漏极开路的恒流输出端,内建灰介脉冲调剂,输入电源9V-15V,可承受12v端口电压,芯片内置12bit的GAMMA校正模块PWM最高刷新频率达到8HZ,并且提供可降低电磁波干扰和电源杂波的输出通道电流错位处理方式。

GS8208,采用拓展式归零码作为信号传输,在无信号输入时,GS8208将显示内置程序,适合不带控制的场合,芯片内置上电保护及掉电保护动能,,增强芯片使用寿命,并且备上电自动测试功能,方便客户量产测试,GS8208提供SOP8的封装形式,工作环境
*产品规格*
产品名称:一米60段60灯
灯珠型号:5050RGB
内置IC灯珠型号:GS8208
工作电压:12V
功率:每颗灯珠:0.3W
灰度等级:256
数据传输数率:800K/S
工作温度:-40▁80
工作寿命:30kh
灯珠数量:60灯一米
IC数量:60个ic/米,60个像素点/米
发光颜色:全彩,通过控制器控制能实现任意颜色,任意效果
板宽:10MM
板底颜色:白板/黑板
防水等级:裸板﹣不防水
滴胶防水﹣IP65
套管防水﹣IP66
灌胶防水-IP68
包装:5米/卷卷盘固定防静电袋包装
*产品优势*
1,比传统的单色灯条更漂亮,色彩更绚丽。

;比传统的七彩
灯条效果更动态更“招财引客”。

;比传统的全彩灯条板面
更简洁,故障率更低
2,我们的灯条板面采用一灯一个像素点一个剪切段,焊盘均采用
长条形焊盘,方便客户随意剪切,连接。

3,我们的生产工艺采用固定式岗位模式,每个员工单独负责一道工
序,所谓熟能生巧,一个人长期负责一个岗位带来的效果就是产
品统一、卖相漂亮、质量可靠。

另经过多道工序检测、老化
确保产品万无一失
GS8208可做以下规格
裸板-不防水:两端出三并对插接头外加双色电源线;背面贴3M强力双面胶;5米/盘
固定卷盘防静电袋包装出货
滴胶防水-IP65:表面覆盖一层透明防护硅胶;两端出三并对插接头外加双色电源线;背
面贴3M强力双面胶,5米/卷卷盘固定防静电袋包装出货
套管防水-IP66:将灯条置入360度全方位保护的硅胶套管内部,两端堵头堵死,出三并对插接头外加双色电源线;5米/盘,卷盘固定防静电袋包装出货
灌胶防水-IP68:全方位保护的硅胶套管内部再注入透明硅胶,两端堵头堵死出三并对插接头外加双色电源线(也可出特制的防水对插接头);5米/盘,卷盘固定防静电袋包装出货
*接线方式*
电源+控制器+灯条
1,首先认准方向:每段灯条上都有一些小箭头,箭头所指的方向为输出端,表示信号往前传递;箭头尾部方向为输入端,为我们连接信号的接线方向
2,每卷灯条的输入端(也就是灯条上箭头尾部方向的最前面)都有一个三色(红绿白)对插接头和一个两色(红白)对插接头;
三色接头(红绿白)接控制器:
红- 正极空置不接(或接电源上12V电源正极)
绿-信号接控制器上面输出端口通常为:DATA
白- 地线接控制器上面接地端(也就是12V负极),通常为:GND或者COM
两色接头(红白)接电源
红-正极12V电源变压器上面的正极通常为:+V
白- 负极12v电源变压器上面的正极通常为:-v或者COM。

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