集成电路封装,产品塑封体裂纹产生的原因

集成电路封装,产品塑封体裂纹产生的原因
1.高封装温度和温度梯度会导致塑封体裂纹。

The high packaging temperature and temperature gradient can cause cracks in the encapsulation.
2.封装过程中的应力集中会导致塑封体裂纹的产生。

Stress concentration during packaging can lead to cracks in the encapsulation.
3.材料选择不当会使塑封体易产生裂纹。

Improper material selection can make the encapsulation prone to cracking.
4.温度变化频繁导致塑封体发生热应力而裂纹。

Frequent temperature changes cause thermal stress in the encapsulation leading to cracks.
5.封装材料内部存在缺陷会导致塑封体产生裂纹。

Defects in the packaging material can cause cracks in the encapsulation.
6.焊接过程中的应力不均匀也会导致塑封体裂纹。

Uneven stress during welding can also lead to cracks in
the encapsulation.
7.温度异常变化也是塑封体裂纹产生的原因之一。

Abnormal temperature changes are also one of the reasons for the generation of cracks in the encapsulation.
8.震动或冲击会导致塑封体裂纹的生成。

Vibration or impact can cause cracks in the encapsulation.
9.传热不均匀也会导致塑封体裂纹。

Uneven heat transfer can also cause cracks in the encapsulation.
10.封装过程中存在的气泡会使塑封体裂纹。

Bubbles present during the packaging process can cause cracks in the encapsulation.
11.封装材料的老化也会增加塑封体裂纹的风险。

Aging of the packaging material can also increase the
risk of cracks in the encapsulation.
12.硬件设计不当导致塑封体裂纹。

Improper hardware design causes cracks in the encapsulation.
13.塑封体材料的脆性会增加裂纹的产生。

The brittleness of the encapsulation material increases the generation of cracks.
14.制程控制不到位也会导致塑封体裂纹。

Inadequate process control can also lead to cracks in the encapsulation.
15.封装过程中的粘度异常也会导致塑封体裂纹。

Abnormal viscosity during the packaging process can also cause cracks in the encapsulation.
16.高温老化导致塑封体裂纹。

High-temperature aging causes cracks in the encapsulation.
17.加工过程中的机械损伤会使塑封体易产生裂纹。

Mechanical damage during processing makes the encapsulation prone to cracking.
18.传热不良导致塑封体裂纹。

Poor heat transfer causes cracks in the encapsulation.
19.封装材料不均匀导致塑封体裂纹。

Uneven distribution of packaging material causes cracks
in the encapsulation.
20.脉冲电流会导致塑封体裂纹的发生。

Pulse current can cause cracks in the encapsulation.
21.弯曲变形导致塑封体裂纹。

Bending deformation causes cracks in the encapsulation.
22.整体封装过程中的挤压会使塑封体裂纹。

Extrusion during the entire packaging process causes cracks in the encapsulation.
23.潮湿的环境会增加塑封体裂纹的风险。

Moisture in the environment increases the risk of cracks in the encapsulation.
24.封装材料的变形会导致塑封体裂纹。

Deformation of the packaging material causes cracks in the encapsulation.
25.防护措施不到位会使塑封体裂纹。

Inadequate protective measures make the encapsulation prone to cracking.
26.封装过程中的振动会导致塑封体裂纹。

Vibration during the packaging process causes cracks in the encapsulation.
27.封装材料的疏松会导致塑封体裂纹。

Looseness of the packaging material causes cracks in the encapsulation.
28.封装材料的变化会导致塑封体裂纹。

Changes in the packaging material cause cracks in the encapsulation.
29.氧化作用导致塑封体裂纹的发生。

Oxidation causes cracks in the encapsulation.
30.动态载荷导致塑封体裂纹。

Dynamic load causes cracks in the encapsulation.
31.封装材料的导热性差会导致塑封体裂纹。

Poor thermal conductivity of the packaging material causes cracks in the encapsulation.
32.封装过程中的高压力会导致塑封体裂纹的发生。

High pressure during the packaging process causes cracks in the encapsulation.
33.封装材料的化学反应会导致塑封体裂纹的产生。

Chemical reactions of the packaging material can cause cracks in the encapsulation.
34.电场作用导致塑封体裂纹。

Electric field causes cracks in the encapsulation.
35.封装材料的光照会导致塑封体裂纹。

Light exposure of the packaging material causes cracks in the encapsulation.
36.高湿度会导致塑封体裂纹的产生。

High humidity causes cracks in the encapsulation.
37.封装过程中的电磁场会导致塑封体裂纹。

Electromagnetic fields during the packaging process cause cracks in the encapsulation.
38.热膨胀系数不匹配导致塑封体裂纹。

Mismatched thermal expansion coefficients cause cracks in the encapsulation.
39.封装材料与封装底片的不相容性导致塑封体裂纹的产生。

Incompatibility between the packaging material and the package substrate causes cracks in the encapsulation.
40.静电放电会导致塑封体裂纹。

Electrostatic discharge causes cracks in the encapsulation.
41.封装底片的变形导致塑封体裂纹的产生。

Deformation of the package substrate causes cracks in the encapsulation.
42.封装过程中的横向力会导致塑封体裂纹。

Lateral forces during the packaging process cause cracks in the encapsulation.
43.封装材料的磁场作用会导致塑封体裂纹的产生。

Magnetic field effects of the packaging material cause cracks in the encapsulation.
44.硬件设计的材料选择不当导致塑封体裂纹的产生。

Improper material selection in hardware design causes cracks in the encapsulation.
45.封装过程中的液态金属渗入会导致塑封体裂纹。

Liquid metal infiltration during the packaging process causes cracks in the encapsulation.
46.高频振动会导致塑封体裂纹。

High-frequency vibration causes cracks in the encapsulation.
47.封装材料与附加元件的不兼容性导致塑封体裂纹的发生。

Incompatibility between the packaging material and additional components causes cracks in the encapsulation.
48.封装过程中的快速温度变化会导致塑封体裂纹。

Rapid temperature changes during the packaging process cause cracks in the encapsulation.
49.封装材料的晶体结构缺陷会导致塑封体裂纹。

Crystal structure defects in the packaging material cause cracks in the encapsulation.
50.塑封体的材料疏密不均会导致裂纹的产生。

Uneven density of the encapsulation material causes the generation of cracks.
51.不当的封装设计会导致塑封体裂纹。

Improper packaging design causes cracks in the encapsulation.。