TFT基础知识培训资料

Inspection
Aging
Inspection
Packaging
TFT Cell 的制造流程(后段)
pressure
Re-gap Cut
product
SCRIBE & BREAKING
Cutting the combined glass into screen units
LIQUID CRYSTAL INJECTION
Automotive Multimedia
1.x " Camera
Digital Still
Digital Video Camera
VoIP Phone
Portable DVD
10.x "
TFT的生产线等级的知识
2代线
370 x 470 (2nd Gen)
Line
Cheonan 3代线 3.5代线 4.5代线 5代线
- No changes by gray level or by temperature
Fast Response Time - 30,000 times faster @ 77 F, 20,000 times faster @ 14 F
Fast Response No Shadows
Higher Contrast
Line 3, 4, 5, C/F line
550x 650 (3rd Gen)
6代线
7代线
1870 x 2200 (7th Gen)
Glass Size
[mm x mm]
600 x 720 730 x 920 1100 x 1250 1500 x 1800 (5th Gen) (3.5th Gen) (4.5th Gen) (5th Gen)
2.0mm
Source Gate IC IC
6mm 3.2mm
Source Source Gate IC IC IC
Conventional TFT-LCD Module
ASG 技术说明(高分辩率产品)
1. ASG structure has a merit in Driver IC chip size as well as cost efficiency as the gate driver function is eliminated out of the IC. 2. ASG is the core technology especially for Super-High Resolution, 4CR VGA, and etc.
AHale Waihona Puke BaiduOLED
Technology Roadmap
Strong Point
AMOLED优势
No Back Light Unit, No Cover Glass
- AMOLED: 0.37t Bendable / 0.52t Rigid
Thin Form Factor
True Color
110% Color Gamut (NTSC)
Transmissive
高透过率
TMR
STR
TMR
Transflective
~0.5%
<1%
2~3%
STR
高反射率
* STR : Super Transmissive with Reflectivity * TMR : Transmissive with Micro-Reflectivity
主场主要显示方式(全透带微反射)
ASG (Amorphous Silicon Gate) 技术
传统方式
22.89 mm
....
160 Gate Output Bump 2.3 3 mm
.... ....
....
720 Source Output Bump
....
....
160 Gate Output Bump
500 EA / 8” wafer D-IC Size : 53.3mm2 With Gate Driver
Twin 2ea 2ea 2ea
1-Set 1ea 1ea 1ea
Main LCD
Driver IC FPC
手机模组的厚度控制
2007
0.5t/0.5t
2008
0.3t/0.3t
2009
0.25t/0.25t
2.0mm
1.7mm
1.60mm
Module Thickness
=
0.5mm
A-Si Process Tech Glass
attachment
Polarize attachment
Plane Clean
Clean glass on panel
中小尺寸TFT的应用
New App!!
New App!! PMP
CNS Handheld PC
Mobile Phone Smart Phone
PDA New App!! MP3 Portable Video Game
Free Viewing Angle
True Black & Clear Image
- Contrast: AMOLED 100,000:1 vs.TFT-LCD 500:1 - 50~100cd/m2 higher perceived brightness
Same Color Gamut at Any Angle
Cell gap control
attachment
InnoLux
Display Corp.
Put TFT glass & C/F glass together
TFT Cell 的制造流程(前段)
TFT
Initial Clean PI coating Rubbing Post Rubbing Clean Spacer Dispenser
Driver IC 40% Shrinkage
ASG技术
.....
5 ASG Output Bump
.... ...
18.0 mm ....
.... ...
....
5 ASG Output Bump
800 EA / 8” wafer D-IC Size : 32.4mm2 With ASG Tech
Clean LC on panel
Module Factory FINAL INSPECTION
Inspecting the TFT panel while regular display signal is applied
light test
Inspection polarize particle
CF
Initial Clean PI Printing Rubbing Post Rubbing Clean Sealant Dispense Ag & UV glue
Assembly Hot Press
InnoLux
Display Corp.
LCD模组的制造流程
Cell TAB Attachment / COG Bonding PCB Attachment B/L Assembly
0.3mm
0.3mm
+
0.9mm 0.8mm 0.7mm
BLU Thickness
TFT的显示方式
Maps of LCD Mode
Enhanced Outdoor Visibility Enhanced Brightness with High Aperture Ratio Price Competitiveness
LCD panel分解图
TN 型 LCD 顯示原理
不工作状态
Twist 90
工作状态
液晶分子
TFT Cell 的制造流程(前段)
DISPENSER
Dispenser the seal with Seal Mask
INPUT CF
INITIAL CLEANING/exposing . coating PI layer
Note : Based on qVGA CPU I/F including memory
1.8 mm
720 Source Output Bump
...
TFT-LCD液晶的灌注方式
ODF (One Drop Filling) Tech
传统灌注方式(抽真空)
N2 Vacuum Chamber LCD Cell
Outdoors
Enhanced Visibility
TM
Indoors
Enhanced Brightness
STR
1. Price-Competitive Display Solution suitable for Bar/Slide-type Application 2. Optimum Sub Display Solution especially for Folder-type Application 3. Can effectively utilize low-power consumption on Stand-by mode
TFT-LCD培训资料
显示技术Roadmap Segment
Panel Evolution
PMOLED/ AMOLED LTPS
Premium
α- TFT
Mid Range
Basic
CSTN(彩屏)
TN/STN(黑白屏)
何謂 TFT-LCD
TFT----薄膜電晶體 Thin Film Transistor LCD----液晶顯示器 Liquid Crystal Display
on the glass
PI COATING
RUBBING
Rubbing the PI layer with rubbing roller.
SPACER
Spray the spacer to keep the cell gap
INPUT TFT
cut
product
structure
¼ cut
Hot press
+
FPC
+
B/L
Single Module
COG Bonding
FOG Bonding
Assembly
TFT模组的构成(双屏)
Sub LCD COF
Dual 1 Set Module
Main LCD
+
I/F FPC BLU
TFT模组的构成(双屏)
Sub LCD Driver IC FPC COF IC FPC & Comp. COF
ODF Technology
TAC Time 30% Down Capacity Improvement
No Injection Hole (End Seal) Robust Design
V
Vacuum Pump
V
LC
Contamination Free for Injection Decrease LC Contamination & Gap Un-uniformity
- TFT-LCD 46% @ zero degree 38% @ 70 degree
Main Product
Mobile
Mobile
Mobile
Mobile
Note PC Monitor TV
Monitor TV
TV
Glass Input Capa [Glass / Month]
(LTPS 3K)
40K
40K
90K
90K
120K
120K
120K
TFT模组的构成(单屏)
+
COG-IC
Seal the panel with sealant after inject L/C into the panel
Control cell gap uniform
heat
Beveling Cell test
Inspection defect on va area
LC alignment
LC Clean
驱动IC技术趋势(高集成度)
2005
SEC MD’s Solution
[Dual ASG]
[SOG Phase IV]
2006
2007
Source IC
4mm
1440Ch I Chip Source IC
DC/DC
Timing Generator Gamma Generator Data Driver (SR/DAC/AMP) Memory +Tcon
Conventional a-Si TFT ASG a-Si TFT
IC Cost Reduction Symmetric Design Narrow Bezel High Resolution Source IC Gate IC 6mm 4mm Source IC
3.2mm
2.0mm
ASG 技术成本优势