SMD灯珠 0603黄绿光LED规格书

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Connect with a power IF=20mA
5 Operating Life Test
Ta=Under room temperature Test time=1000HRS(-24HRS,+72HRS)
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6 Thermal Shock
-40±5 ℃→100±5℃ (15min，15min) 100 Cycles
Customer confirm Approved by Checked by
Issued by
Part No. Emitted Color Chip Material
XGS-PB1608AG-02
Green
Len's Color Water Clear
AlGaInP
--
--
◆ Features:
Test
Symbol Min Typ. Max. Unit Condition
IV
15
--
40 mcd IF =20mA
VF
1.8
--
2.4
V
IF =20mA
IR
--
--
10
uA
VR=5V
λd
566
--
576 nm IF=20mA
Δλ
--
25
--
nm IF=20mA
2θ1/2
--
120
--
Deg. IF =20mA
Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption and wide viewing angle This product doesn’t contain restriction Substance, comply ROHS standard.
李忠
Customer Confirmation 客户确认
采购部Pur Dept By 品质部QA Dept By 工程部E ng Dept By
深圳市鑫光硕科技有限公司
SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD
公司地址：广东省深圳市宝安区沙井万丰村前路31号8楼
VF
Reverse current
IR
Luminous IV
intensity
Wave length Appearance
λD/λP /
* U.S.L: Upper standard level
Test condition IF=Test Current
VR=5V IF=Test Current
IF=Test Current View check
Notes: 1.Tolerance of Luminous Intensity ±10% 2.Tolerance of Dominant Wavelength ±2nm 3. Tolerance of Forward Voltage ±0.05V 4. Luminous Intensity is measured by XGSLED’s equipment on bare chips
Unit:mm Electrodes: Ag Plating
Tolerence±0.1
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Parameter
Symbol
Max.
Unit
Power Dissipation
PM
60
Mw
Pulse Forward Current
IFP
100
mA
DC Forward Current
IF
25
50 25 0
0
Forward Current Vs Relative Luminosity
Ta=25℃
10 20 30 40 50 Forward Current (mA)
Relative Luminosity Vs Ambient Temperature
If=15mA 200
150
100
50
0 0 20 40 60 80 100 Ambient Temperature Ta (° C)
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① 80 ℃② 100 ℃③ 120 ℃④ 160 ℃⑤
7
170℃⑥235℃⑦270℃⑧255℃，
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IR-Reflow Pb-Free Process 60cm/min，2 times
(2)Criteria of judging the damage
Item
Symbol
Forward voltage
-20° -10° -30° -40°
-50°
-60°
0° 10° 20° 30° 40°
50°
60°
-70°
70°
-80°
80°
-90° 1.0
0.5
0
0.5
Radiation Angle
90° 1.0
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Relative Luminosity (%)
◆ Reliability
(1) Test Items and Conditions
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High Temperature And 3
High Humidity Working
Ta：85±5℃，RH:85±5%，IF=20mA Test time=500HRS(-24HRS,+72HRS)
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4
Low Temperature Storage
Ta：-40±5℃ Test time=1000HRS(-24HRS,+72HRS)
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◆ Soldering Pad Dimensions:
Temperature
0.8
0.8
0.7
◆ Soldering Conditions (Maximum allowable soldering conditions)
Reflow soldering profile <Pb-free solder>
L.S.L: Lower standard level
Criteria for judgement
Min.
Max.
/
U.S.L*1.1
/
15uA
L.S.L*0.7
/
/
U.S.L±2nm
No mechanical damage
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◆ Cautions
1、Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a
mA
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
-40℃～85℃
℃
Storage Temperature Range
Tstg
-40℃～100℃
℃
◆ Absolute Maximum Rating （Ta=25℃）
* IFP condition: pulse width ≤1ms ,duty cycle ≤1/10
承认书
SPECIFICATION FOR APPROVAL
客户 Customer：
客户品号 Customer P/N：
鑫光硕品号 Xgs Model：
规格 Specification :
XGS-PB1608AG-02 SMD0603黄绿光 20MA
制作 Prepared By：
审核 Checked By：
NO
Test Item
Test Conditions
Ac/ Sample
Re
1 Temperature Cycle
-40±5℃→25±5℃→100±5℃→25±5℃
(30min，5min，30min，5min) 100 Cycles
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2
High Temperature Storage
Ta：100±5℃ Test time=1000HRS(-24HRS,+72HRS)
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φ 180 φ 60 φ 13± 0.2
◆ Package Tape Specifications: ( 4000 pcs/Reel)
9.0± 0.1 12.0± 0.15
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◆ Typical Electro-Optical Characteristics Curves：
Contents
1.Features 2.Applications 3.Package dimensions 4.Absolute maximum rating 5.Electrical optical characteristics 6.BIN range 7.Package label 8.Soldering pad dimensions 9.Soldering conditions 10. Package tape specifications 11.Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions 14.Note
Before opening the package: The LEDs should be kept at 5~30°C and 60%RH or less. The LEDs should be used within a year.
After opening the package: The LED must be used within 24 hours, else should be kept at 5~30℃ and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.
一厂地址：广东省深圳市龙岗区嶂背创业二路18-1号
二厂地址：广东省东莞市石排镇庙边王村沙迳工业区
Tel: 13798585378
QQ:2373888283

Website：
E-mail:xz@
· Customer:
Technical Data Sheet PN: XGS-PB1608AG-02 For: IF=20mA
◆ Applications:
Automotive and Telecommunication Flat backlight for LCD ,switch and symbol in telephone and fax General use for indicators
◆ Package Dimensions:
3℃/sec.
210℃ Pre-heating 120~160℃
3℃/sec.
260℃ Max. 10sec.Max.
60~120sec.
-4℃/sec.
120se.c.Max.
Time
• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering. • After soldering,do not warp the circuit board.
possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2、Storage
◆ Electrical Optical Characteristics（Ta=25℃）
Parameter Luminous Intensity Forward Voltage Reverse Current Dominant Wavelength Spectral Line Half Width Viewing Angle
Forward Current(mA)
Forward Current Vs Ambient Temperature 50
40
30
20
10 0
0 20 40 60 80 100 Ambient Temperature Ta (° C)
Relative Luminosity(%)
200 175 150 125 100 75