1206贴片LED-1206双色贴片LED灯珠规格书
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Page 6 of 9
◆ Reliability
(1) Test Items and Conditions
NO
Test Item
Test Conditions
Ac/ Sample
Re
1
Temperature Cycle
-40±5℃→25±5℃→100±5℃→25±5℃ (30min,5min,30min,5min) 100 Cycles
承认书
SPECIFICATION FOR APPROVAL
客户 Customer:
客户品号 Customer P/N:
鑫光硕品号 Xgs Model:
XGS-PB3216UEUW-04
规格 Specification :
SMD 1206红白双色 20MA
制作 Prepared By:
审核 Checked By:
--
--
◆ Features:
Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption and wide viewing angle This product doesn’t contain restriction Substance, comply ROHS standard.
Reverse Current
White
--
IR
Red
--
--
10
uA
VR=5V
--
10
Dominant Wavelength λd Red 615 620 630 nm IF=20mA
X
--
0.28
--
Color Temperature
White
Y
--
0.29
--
IF=20mA
White
--
140
Electrodes: Au Plating Encapsulating Resin: Epoxy Resin Package: BT Resin
Page 1 of 9
◆ Absolute Maximum Rating (Ta=25℃)
Parameter
Value
Symbol
Unit
W
R
Power Dissipation
0/1
Test time=1000HRS(-24HRS,+72HRS)
6
Thermal Shock
-40±5℃→100±5℃ (15min,15min) 100 Cycles
20
0/1
①80℃②100℃③120℃④160℃⑤170
7 IR-Reflow Pb-Free Process ℃⑥235℃⑦270℃⑧255℃,
Customer confirm Approved by Checked by
Issued by
Part No. Emitted Color Chip Material
White InGaN
XGS-PB3216UEUW-04
Red
Len's Color Yellow Fluorescent
AlGaInP
--
Viewing Angle
2θ1/2
Deg. IF =20mA
Red
--
140
--
Notes: 1.Tolerance of Luminous Intensity ±10%
2.Tolerance of Dominant Wavelength ±2nm 3. Tolerance of Forward Voltage ±0.05V 4. Luminous Intensity is measured by XGS’s equipment on bare chips
Symbol
Test Min Typ. Max. Unit
Condition
来自百度文库
Luminous Intensity
White 350 750
IV
Red
60
130
-mcd IF =20mA
--
Forward Voltage
White 2.8
3.2
3.7
IF =20mA
VF
V
Red
1.7
2.0
2.5
IF =20mA
Page 2 of 9
◆ Soldering Pad Dimensions:
◆ Soldering Conditions (Maximum allowable soldering conditions)
Reflow soldering profile <Pb-free solder>
Temperature
李忠
Customer Confirmation 客户确认
采购部Pur Dept By 品质部QA Dept By 工程部Eng Dept By
深圳市鑫光硕科技有限公司
SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD
公司地址:广东省深圳市宝安区沙井万丰村前路31号8楼
Test condition IF=Test Current
VR=5V IF=Test Current
IF=Test Current View check
Criteria for judgement
Min.
Max.
/
U.S.L*1.1
/
15uA
L.S.L*0.7
/
/
U.S.L±2nm
No mechanical damage
-40℃~100℃
℃
Electrostatic Discharge
ESD
≧1000(HBM)
V
IFP condition: pulse width ≤1ms ,duty cycle ≤1/10
◆ Electrical Optical Characteristics(Ta=25℃)
Parameter
20
0/1
4
Low Temperature Storage
Ta:-40±5℃ Test time=1000HRS(-24HRS,+72HRS)
20
0/1
Connect with a power IF=20mA
5
Operating Life Test
Ta=Under room temperature
20
If the LEDs have exceeded the storage time, baking treatment should be performed more than 24hours at 60±5°C. 3、Soldering Iron Each terminal is to the tip of soldering iron temperature less than 300℃ for 3 seconds within once in less than the soldering iron capacity 25 W.Leave two seconds and more internals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 4、Repairing
Page 4 of 9
◆ Package Tape Specifications: (4000 pcs/Reel)
◆ Tape specifications (Unit:mm)
A
SEC.A-A
Polarity
A
Reel Lead Min,60mm No LEDs
Page 5 of 9
◆ Typical Electro-Optical Characteristics Curves:
3℃/sec.
210℃ Pre-heating 120~160℃
3℃/sec.
260℃ Max. 10sec.Max.
60~120sec.
-4℃/sec.
120se.c.Max.
Time
• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering. • After soldering,do not warp the circuit board.
20
0/1
60cm/min,2 times
(2)Criteria of judging the damage
Item
Forward voltage Reverse current
Luminous intensity
Wave length
Appearance
Symbol VF IR IV
λD/λP /
◆ Applications:
Automotive and Telecommunication Flat backlight for LCD ,switch and symbol in telephone and fax General use for indicators
◆ Package Dimensions:
* U.S.L: Upper standard level
L.S.L: Lower standard level
Page 7 of 9
◆ Cautions
1、Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2、Storage
Before opening the package: The LEDs should be kept at 5~30°C and 60%RH or less. The LEDs should be used within a year. After opening the package: The LED must be used within 24 hours, else should be kept at 5~30℃ and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.
一厂地址:广东省深圳市龙岗区嶂背创业二路18-1号
二厂地址:广东省东莞市石排镇庙边王村沙迳工业区
Tel: 13798585378
QQ:2373888283
Website :Http://www.xgsled.cn
E-mail:xz@xgsled.cn
· Customer:
Technical Data Sheet PN: XGS-PB3216UEUW-04 For: IF=20mA
Contents
1.Features 2.Applications 3.Package dimensions 4.Absolute maximum rating 5.Electrical optical characteristics 6.BIN range 7.Package label 8.Soldering pad dimensions 9.Soldering conditions 10. Package tape specifications 11.Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions 14.Note
20
0/1
2
High Temperature Storage Ta:100±5℃
Test time=1000HRS(-24HRS,+72HRS)
20
0/1
High Temperature And Ta:85±5℃,RH:85±5%,IF=20
3
High Humidity Working Test time=500HRS(-24HRS,+72HRS)
PD
100
60
Mw
Pulse Forward Current
IFP
100
mA
DC Forward Current
IF
20
mA
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
-40℃~85℃
℃
Storage Temperature Range
Tstg
◆ Reliability
(1) Test Items and Conditions
NO
Test Item
Test Conditions
Ac/ Sample
Re
1
Temperature Cycle
-40±5℃→25±5℃→100±5℃→25±5℃ (30min,5min,30min,5min) 100 Cycles
承认书
SPECIFICATION FOR APPROVAL
客户 Customer:
客户品号 Customer P/N:
鑫光硕品号 Xgs Model:
XGS-PB3216UEUW-04
规格 Specification :
SMD 1206红白双色 20MA
制作 Prepared By:
审核 Checked By:
--
--
◆ Features:
Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption and wide viewing angle This product doesn’t contain restriction Substance, comply ROHS standard.
Reverse Current
White
--
IR
Red
--
--
10
uA
VR=5V
--
10
Dominant Wavelength λd Red 615 620 630 nm IF=20mA
X
--
0.28
--
Color Temperature
White
Y
--
0.29
--
IF=20mA
White
--
140
Electrodes: Au Plating Encapsulating Resin: Epoxy Resin Package: BT Resin
Page 1 of 9
◆ Absolute Maximum Rating (Ta=25℃)
Parameter
Value
Symbol
Unit
W
R
Power Dissipation
0/1
Test time=1000HRS(-24HRS,+72HRS)
6
Thermal Shock
-40±5℃→100±5℃ (15min,15min) 100 Cycles
20
0/1
①80℃②100℃③120℃④160℃⑤170
7 IR-Reflow Pb-Free Process ℃⑥235℃⑦270℃⑧255℃,
Customer confirm Approved by Checked by
Issued by
Part No. Emitted Color Chip Material
White InGaN
XGS-PB3216UEUW-04
Red
Len's Color Yellow Fluorescent
AlGaInP
--
Viewing Angle
2θ1/2
Deg. IF =20mA
Red
--
140
--
Notes: 1.Tolerance of Luminous Intensity ±10%
2.Tolerance of Dominant Wavelength ±2nm 3. Tolerance of Forward Voltage ±0.05V 4. Luminous Intensity is measured by XGS’s equipment on bare chips
Symbol
Test Min Typ. Max. Unit
Condition
来自百度文库
Luminous Intensity
White 350 750
IV
Red
60
130
-mcd IF =20mA
--
Forward Voltage
White 2.8
3.2
3.7
IF =20mA
VF
V
Red
1.7
2.0
2.5
IF =20mA
Page 2 of 9
◆ Soldering Pad Dimensions:
◆ Soldering Conditions (Maximum allowable soldering conditions)
Reflow soldering profile <Pb-free solder>
Temperature
李忠
Customer Confirmation 客户确认
采购部Pur Dept By 品质部QA Dept By 工程部Eng Dept By
深圳市鑫光硕科技有限公司
SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD
公司地址:广东省深圳市宝安区沙井万丰村前路31号8楼
Test condition IF=Test Current
VR=5V IF=Test Current
IF=Test Current View check
Criteria for judgement
Min.
Max.
/
U.S.L*1.1
/
15uA
L.S.L*0.7
/
/
U.S.L±2nm
No mechanical damage
-40℃~100℃
℃
Electrostatic Discharge
ESD
≧1000(HBM)
V
IFP condition: pulse width ≤1ms ,duty cycle ≤1/10
◆ Electrical Optical Characteristics(Ta=25℃)
Parameter
20
0/1
4
Low Temperature Storage
Ta:-40±5℃ Test time=1000HRS(-24HRS,+72HRS)
20
0/1
Connect with a power IF=20mA
5
Operating Life Test
Ta=Under room temperature
20
If the LEDs have exceeded the storage time, baking treatment should be performed more than 24hours at 60±5°C. 3、Soldering Iron Each terminal is to the tip of soldering iron temperature less than 300℃ for 3 seconds within once in less than the soldering iron capacity 25 W.Leave two seconds and more internals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 4、Repairing
Page 4 of 9
◆ Package Tape Specifications: (4000 pcs/Reel)
◆ Tape specifications (Unit:mm)
A
SEC.A-A
Polarity
A
Reel Lead Min,60mm No LEDs
Page 5 of 9
◆ Typical Electro-Optical Characteristics Curves:
3℃/sec.
210℃ Pre-heating 120~160℃
3℃/sec.
260℃ Max. 10sec.Max.
60~120sec.
-4℃/sec.
120se.c.Max.
Time
• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering. • After soldering,do not warp the circuit board.
20
0/1
60cm/min,2 times
(2)Criteria of judging the damage
Item
Forward voltage Reverse current
Luminous intensity
Wave length
Appearance
Symbol VF IR IV
λD/λP /
◆ Applications:
Automotive and Telecommunication Flat backlight for LCD ,switch and symbol in telephone and fax General use for indicators
◆ Package Dimensions:
* U.S.L: Upper standard level
L.S.L: Lower standard level
Page 7 of 9
◆ Cautions
1、Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2、Storage
Before opening the package: The LEDs should be kept at 5~30°C and 60%RH or less. The LEDs should be used within a year. After opening the package: The LED must be used within 24 hours, else should be kept at 5~30℃ and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.
一厂地址:广东省深圳市龙岗区嶂背创业二路18-1号
二厂地址:广东省东莞市石排镇庙边王村沙迳工业区
Tel: 13798585378
QQ:2373888283
Website :Http://www.xgsled.cn
E-mail:xz@xgsled.cn
· Customer:
Technical Data Sheet PN: XGS-PB3216UEUW-04 For: IF=20mA
Contents
1.Features 2.Applications 3.Package dimensions 4.Absolute maximum rating 5.Electrical optical characteristics 6.BIN range 7.Package label 8.Soldering pad dimensions 9.Soldering conditions 10. Package tape specifications 11.Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions 14.Note
20
0/1
2
High Temperature Storage Ta:100±5℃
Test time=1000HRS(-24HRS,+72HRS)
20
0/1
High Temperature And Ta:85±5℃,RH:85±5%,IF=20
3
High Humidity Working Test time=500HRS(-24HRS,+72HRS)
PD
100
60
Mw
Pulse Forward Current
IFP
100
mA
DC Forward Current
IF
20
mA
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
-40℃~85℃
℃
Storage Temperature Range
Tstg